WO2022101468A3 - Vakuumprozesssystem, stützstruktur und verfahren zum transportieren eines substrats - Google Patents

Vakuumprozesssystem, stützstruktur und verfahren zum transportieren eines substrats Download PDF

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Publication number
WO2022101468A3
WO2022101468A3 PCT/EP2021/081669 EP2021081669W WO2022101468A3 WO 2022101468 A3 WO2022101468 A3 WO 2022101468A3 EP 2021081669 W EP2021081669 W EP 2021081669W WO 2022101468 A3 WO2022101468 A3 WO 2022101468A3
Authority
WO
WIPO (PCT)
Prior art keywords
vacuum chamber
substrate
process system
transporting
support structure
Prior art date
Application number
PCT/EP2021/081669
Other languages
English (en)
French (fr)
Other versions
WO2022101468A2 (de
Inventor
Thomas Gebele
Wolfgang Buschbeck
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020237020056A priority Critical patent/KR20230107847A/ko
Priority to CN202180076621.6A priority patent/CN116635993A/zh
Publication of WO2022101468A2 publication Critical patent/WO2022101468A2/de
Publication of WO2022101468A3 publication Critical patent/WO2022101468A3/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4409—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber characterised by sealing means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Vakuumprozesssystem (100) zum Prozessieren eines Substrats, umfassend eine erste Vakuumkammer (105) mit einem ersten Gasdruck, eine zweite Vakuumkammer (106) mit einem zweiten Gasdruck und eine Gastrenneinheit (120) zwischen der ersten Vakuumkammer (105) und der zweiten Vakuumkammer (106). Die Gastrenneinheit stellt eine Verbindung zwischen der ersten Vakuumkammer und der zweiten Vakuumkammer bereit. Die Gastrenneinheit (120) ist angepasst, mit einer oder mehreren Stützstrukturen (110) zusammenzuwirken, um einen Gasfluss von der ersten Vakuumkammer (105) zur zweiten Vakuumkammer (106) und/oder umgekehrt zu minimieren.
PCT/EP2021/081669 2020-11-16 2021-11-15 Vakuumprozesssystem, stützstruktur und verfahren zum transportieren eines substrats WO2022101468A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020237020056A KR20230107847A (ko) 2020-11-16 2021-11-15 진공 프로세스 시스템, 지지 구조물, 및 기판을 운반하기 위한 방법
CN202180076621.6A CN116635993A (zh) 2020-11-16 2021-11-15 真空处理系统、支撑结构和用于运输基板的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020130209.6A DE102020130209A1 (de) 2020-11-16 2020-11-16 Vakuumprozesssystem, Stützstruktur und Verfahren zum Transportieren eines Substrats
DE102020130209.6 2020-11-16

Publications (2)

Publication Number Publication Date
WO2022101468A2 WO2022101468A2 (de) 2022-05-19
WO2022101468A3 true WO2022101468A3 (de) 2022-07-07

Family

ID=78725485

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2021/081669 WO2022101468A2 (de) 2020-11-16 2021-11-15 Vakuumprozesssystem, stützstruktur und verfahren zum transportieren eines substrats

Country Status (4)

Country Link
KR (1) KR20230107847A (de)
CN (1) CN116635993A (de)
DE (1) DE102020130209A1 (de)
WO (1) WO2022101468A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN218089795U (zh) * 2022-06-23 2022-12-20 拉普拉斯(无锡)半导体科技有限公司 一种真空腔体的变距结构

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143910A (en) * 1983-07-21 1985-02-20 Balzers Hochvakuum A vacuum lock
DE4303462A1 (de) * 1992-03-30 1993-10-14 Leybold Ag Mehrkammerbeschichtungsanlage
WO2004042111A2 (de) * 2002-11-08 2004-05-21 Applied Films Gmbh & Co. Kg Schleusenanordnung für eine substratbeschichtungsanlage
DE102015105911A1 (de) * 2015-04-17 2016-10-20 Von Ardenne Gmbh Prozessieranordnung
WO2019081045A1 (en) * 2017-10-27 2019-05-02 Applied Materials, Inc. NON-CONTACT TRANSPORT APPARATUS FOR SUPPORT IN DEPOSITION SYSTEM, CONTACTLESS TRANSPORT SYSTEM FOR SUPPORT, CARRIER FOR NON-CONTACT TRANSPORT IN DEPOSITION SYSTEM, AND METHOD FOR NON-CONTACT CARRYING OF SUPPORT IN A CARGO SYSTEM DEPOSIT
EP3495535A1 (de) * 2017-12-06 2019-06-12 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Beschichtungsvorrichtung
WO2020200443A1 (en) * 2019-04-03 2020-10-08 Applied Materials, Inc. Carrier transport system, vacuum deposition system, and method of transporting a carrier in a vacuum chamber

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2143910A (en) * 1983-07-21 1985-02-20 Balzers Hochvakuum A vacuum lock
DE4303462A1 (de) * 1992-03-30 1993-10-14 Leybold Ag Mehrkammerbeschichtungsanlage
WO2004042111A2 (de) * 2002-11-08 2004-05-21 Applied Films Gmbh & Co. Kg Schleusenanordnung für eine substratbeschichtungsanlage
DE102015105911A1 (de) * 2015-04-17 2016-10-20 Von Ardenne Gmbh Prozessieranordnung
WO2019081045A1 (en) * 2017-10-27 2019-05-02 Applied Materials, Inc. NON-CONTACT TRANSPORT APPARATUS FOR SUPPORT IN DEPOSITION SYSTEM, CONTACTLESS TRANSPORT SYSTEM FOR SUPPORT, CARRIER FOR NON-CONTACT TRANSPORT IN DEPOSITION SYSTEM, AND METHOD FOR NON-CONTACT CARRYING OF SUPPORT IN A CARGO SYSTEM DEPOSIT
EP3495535A1 (de) * 2017-12-06 2019-06-12 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Beschichtungsvorrichtung
WO2020200443A1 (en) * 2019-04-03 2020-10-08 Applied Materials, Inc. Carrier transport system, vacuum deposition system, and method of transporting a carrier in a vacuum chamber

Also Published As

Publication number Publication date
DE102020130209A1 (de) 2022-05-19
KR20230107847A (ko) 2023-07-18
CN116635993A (zh) 2023-08-22
WO2022101468A2 (de) 2022-05-19

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