WO2022099507A1 - Procédé de fabrication de panneau d'affichage et substrat d'affichage - Google Patents

Procédé de fabrication de panneau d'affichage et substrat d'affichage Download PDF

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Publication number
WO2022099507A1
WO2022099507A1 PCT/CN2020/128112 CN2020128112W WO2022099507A1 WO 2022099507 A1 WO2022099507 A1 WO 2022099507A1 CN 2020128112 W CN2020128112 W CN 2020128112W WO 2022099507 A1 WO2022099507 A1 WO 2022099507A1
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WIPO (PCT)
Prior art keywords
layer
area
display
cut
panel
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PCT/CN2020/128112
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English (en)
Chinese (zh)
Inventor
杨富强
何晖
罗广顺
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202080002711.6A priority Critical patent/CN114793472A/zh
Priority to PCT/CN2020/128112 priority patent/WO2022099507A1/fr
Publication of WO2022099507A1 publication Critical patent/WO2022099507A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a manufacturing method of a display panel and a display substrate.
  • OLED Organic Light-Emitting Diode
  • FMLOC Flexible Multi-Layer On Cell
  • the mother board includes: a plurality of panel areas corresponding to each of the display panels respectively, and a to-be-cut area located between the adjacent panel areas;
  • forming a motherboard including a plurality of display panels includes:
  • a pattern of a pixel definition layer is formed on the base substrate; the pattern of the pixel definition layer is located in each of the panel areas and extends to the to-be-cut area;
  • a touch blocking layer is formed on the organic adhesive layer; the touch blocking layer is located in each of the panel areas and extends to the to-be-cut area.
  • the forming an organic adhesive layer on the pixel defining layer in the to-be-cut area includes:
  • an organic adhesive layer is formed on the pixel defining layer in the area to be cut.
  • the method further includes:
  • a pattern of an encapsulation layer is formed on the film layer of the light-emitting device; the pattern of the encapsulation layer is located in each of the panel regions; the encapsulation layer includes: an organic film layer and an inorganic film layer arranged in layers;
  • the forming an organic adhesive layer on the pixel defining layer in the to-be-cut area includes:
  • the organic film layer in the encapsulation layer is formed on the film layer of each of the light-emitting devices, and the organic adhesive layer is formed on the pixel definition layer.
  • the to-be-cut area includes: sub-cut areas located between the adjacent panel areas, and a plurality of sub-cut areas respectively located between each of the panel areas and the sub-cut areas a detection area, and an edge area respectively located between each of the detection areas and the sub-cut areas;
  • the cutting is performed at the to-be-cut area of the motherboard to obtain a plurality of the display panels, including:
  • the display substrate includes: the panel area, the detection area, the edge area and part of the sub-cutting area;
  • cutting is performed at the detection area of the display substrate to obtain a display panel.
  • the pixel defining layer extends to an outer edge of the edge region;
  • the touch barrier layer extends to an outer edge of the edge region;
  • the forming an organic adhesive layer on the pixel defining layer in the to-be-cut area includes:
  • An organic adhesive layer is formed on the detection area and the edge area.
  • the forming an organic adhesive layer on the pixel defining layer in the to-be-cut area includes:
  • the organic adhesive layer extends to the sub-cut area, and the organic adhesive layer covers the side edges at the outer edges of the pixel definition layer.
  • the motherboard further includes: a gate insulating layer located between the base substrate and the pixel defining layer, a gate insulating layer located between the gate insulating layer and the pixel defining layer an interlayer insulating layer between layers, and a planarization layer between the interlayer insulating layer and the pixel defining layer; the gate insulating layer, the interlayer insulating layer, and the planarization layer extend to the the outer edge of the edge region;
  • the forming an organic adhesive layer on the pixel defining layer in the to-be-cut area includes:
  • the organic adhesive layer covers the gate insulating layer, the interlayer insulating layer and the side edges at the outer edges of the flat layer.
  • an embodiment of the present disclosure further provides a display substrate, which includes: a panel area, a to-be-cut area located around the panel area;
  • the display substrate includes:
  • a pixel defining layer located on the base substrate, for defining the regions of each of the light-emitting devices; the pixel defining layer is located in the panel region and extends to the to-be-cut region;
  • a touch blocking layer located on the side of the pixel defining layer away from the base substrate; the touch blocking layer is located in the panel area and extends to the to-be-cut area;
  • An organic adhesive layer is located between the pixel defining layer and the touch blocking layer, the organic adhesive layer is located in the to-be-cut area; the organic adhesive layer includes an organic material.
  • it further includes: an encapsulation layer covering each of the light emitting devices in the panel area; the encapsulation layer is located on a part of the touch barrier layer close to the base substrate side;
  • the encapsulation layer includes: at least two inorganic film layers and at least one organic film layer arranged in layers;
  • the organic film layer is located between two adjacent inorganic film layers
  • the organic adhesive layer and the organic film layer are arranged in the same layer.
  • the organic adhesive layer includes an epoxy resin material.
  • the organic adhesive layer is a strip-shaped structure extending along the edge of the display substrate.
  • the area to be cut includes: a detection area, an edge area located on a side of the detection area away from the panel area, and an edge area located in the edge area away from the panel area side sub-cut area;
  • the detection area includes: a first detection area, a second detection area and a third detection area respectively located on different sides of the display area;
  • the organic adhesive layer is located in at least one of the first detection area, the second detection area, and the third detection area.
  • the detection area includes: a test circuit, and a test electrode coupled to the test circuit;
  • test circuit and the test electrode are located in a film layer between the base substrate and the organic adhesive layer.
  • the panel area includes: a display area and a peripheral area;
  • the display substrate further includes: a touch electrode layer on a side of the touch barrier layer located in the display area away from the base substrate.
  • the touch electrode layer includes: a first touch electrode, and a second touch electrode located in a different film layer from the first touch electrode;
  • the display substrate further includes: an insulating layer located between the first touch electrodes and the second touch electrodes; the insulating layer is located in the display area and extends to the to-be-cut area.
  • the base substrate includes at least one layer of a flexible substrate.
  • FIG. 1 is a flowchart of a manufacturing method of a display panel provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic plan view of a motherboard in an embodiment of the disclosure
  • FIG. 3 is a schematic diagram of a manufacturing process of a motherboard in an embodiment of the present disclosure
  • FIG. 4 is a schematic diagram of a film layer structure of a motherboard in a panel area in an embodiment of the disclosure
  • FIG. 5 is a schematic diagram of a film layer structure of a motherboard in an area to be cut in an embodiment of the present disclosure
  • FIG. 6 is a schematic plan view of a display substrate obtained by cutting at a sub-cutting area of a motherboard;
  • FIG. 7 is a schematic plan view of the display panel obtained by cutting in the detection area of the display substrate
  • FIG. 8 is a schematic cross-sectional view at the dotted line L1 in FIG. 6;
  • FIG. 9 is a schematic plan view of a detection area in an embodiment of the present disclosure.
  • FIG. 10 is a schematic structural diagram of a touch electrode layer in an embodiment of the disclosure.
  • the touch electrode layer is arranged on the encapsulation layer, and a touch barrier layer is arranged between the touch electrode layer and the encapsulation layer.
  • the touch barrier layer is made of inorganic materials, and the OLED
  • the touch barrier layer is prone to uneven stress. For example, the stress at the bending point is large, which causes the touch barrier layer to bulge and be easily invaded by water vapor, which in turn leads to The touch barrier layer and the underlying film are cracked.
  • embodiments of the present disclosure provide a method for fabricating a display panel and a display substrate.
  • An embodiment of the present disclosure provides a method for manufacturing a display panel, as shown in FIG. 1 , which may include:
  • FIG. 2 is a schematic plan view of the motherboard in an embodiment of the disclosure.
  • the motherboard 100 may include: a plurality of panel regions corresponding to each display panel respectively M, and the to-be-cut area N between the adjacent panel areas M;
  • each film layer corresponding to the multiple display panels is fabricated in the motherboard, and then the display motherboard is cut to obtain multiple display panels, thereby improving the efficiency of manufacturing the display panels.
  • FIG. 3 is a schematic diagram of a manufacturing process of a motherboard in an embodiment of the present disclosure
  • FIG. 4 is a schematic diagram of a film layer structure of a motherboard in a panel area in an embodiment of the disclosure
  • FIG. 5 is a schematic diagram of the motherboard in an area to be cut in an embodiment of the disclosure Schematic diagram of the film layer structure;
  • step S21 may include:
  • a pattern of the pixel definition layer 12 is formed on the base substrate 10; the pattern of the pixel definition layer 12 is located in each panel area M and extends to the area N to be cut;
  • the touch barrier layer 14 is located in each panel area M and extends to the area N to be cut.
  • the adhesion between the touch barrier layer and the pixel defining layer can be increased, and the The function of releasing the stress, therefore, can prevent the problem of film cracking between the touch barrier layer and the pixel defining layer, and improve the product yield.
  • the pixel defining layer 12 may include a plurality of openings in the pattern of the panel area M.
  • the first electrode 111 in the light-emitting device 11 may be formed before the pixel-defining layer 12 is formed, and the light-emitting layer 112 and the second electrode 113 in the light-emitting device 11 may be formed after the pixel-defining layer 12 is formed, and the pixel-defining layer is not used here. 12 and the manufacturing order of the light-emitting device 11 are limited.
  • the position of the first electrode 111 corresponds to the position of the opening in the pixel defining layer 12
  • the light emitting layer 112 may be coupled to the first electrode 111 through the opening in the pixel defining layer 12 .
  • the method may further include: forming each film layer in the driving circuit on the base substrate, and each light-emitting device can be controlled to emit light through the driving circuit, so as to realize picture display.
  • the above-mentioned driving circuit may include components such as thin film transistors TFT and capacitor structures, wherein the thin film transistor TFT may include: an active layer Ac, an input end S, an output end D, and a gate Ga1 , the output end D of the thin film transistor TFT is coupled to the first electrode 111 through the conductive connection part LB, and the gate Ga1 and the third electrode Ga2 form a capacitance structure.
  • an organic material may be used to form an organic adhesive layer 15 on the pixel defining layer 12 in the area N to be cut, and the organic adhesive layer 15 has a certain viscosity.
  • the touch barrier layer 14 is formed on the organic adhesive layer 15, the organic adhesive layer 15 can increase the adhesion between the touch barrier layer 14 and the pixel definition layer 12, and the display substrate is bent At this time, the organic adhesive layer 15 can play the role of stress release, alleviate the phenomenon of uneven stress in the touch barrier layer, and thus avoid film cracking between the touch barrier layer 14 and the pixel defining layer 12 .
  • the to-be-cut area N may include: sub-cut areas K located between adjacent panel areas M, respectively located between each panel area M and the sub-cut areas K A plurality of detection regions C between the detection regions C and the edge regions E respectively located between the detection regions C and the sub-cut regions K.
  • the above step S22 may include:
  • the display substrate may include: a panel area, a detection area, an edge area and some sub-cutting areas;
  • the cutting area is cut to obtain a schematic diagram of the plane structure of the display substrate.
  • the panel area may include the display area A and the peripheral area B, and the detection area may include the first detection area C1, the second detection area C2, the first detection area C2, the first detection area Three detection areas C3, in order to clearly illustrate the structure of the display substrate, the edge area and some sub-cut areas left after cutting are omitted in FIG. 6 .
  • the detection area C may include: a test circuit W, and a test electrode (not shown in the figure) coupled with the test circuit W; the test electrode may be located at the side of the test circuit W away from the base substrate 10, and the test It is convenient to connect with external test devices during the process.
  • the test circuit W and the test electrodes are located in the film layer between the base substrate 10 and the organic adhesive layer 15 . In this way, in the actual process, the test circuit W in the detection area can test the driving circuit, and then the organic adhesive layer can be formed, which will not affect the function of the detection area.
  • FIG. 7 is a schematic diagram of the plane structure of the display panel obtained by cutting at the detection area of the display substrate.
  • the display panel may include: a display area A and a peripheral area B.
  • the display panel may also include a small portion of the detection area left after cutting. Due to the presence of the organic adhesive layer in the detection area, at the outer edge of the display panel, the gap between the touch barrier layer and the underlying film is not easy to appear cracking phenomenon.
  • the pixel defining layer 12 extends to the outer edge of the edge region E;
  • the above-mentioned step S213 may include: forming the organic adhesive layer 15 in the detection area C and the edge area E to ensure a better adhesion effect of the organic adhesive layer 15, and the organic adhesive layer 15 may be set to extend to the edge area. at the outer edge of E.
  • the above-mentioned step S213 may include: referring to FIG. side at the edge, thereby further increasing the adhesion between the pixel definition layer 12 and the touch barrier layer 14 .
  • the above-mentioned motherboard may further include: a gate insulating layer GI located between the base substrate 10 and the pixel defining layer 12 , the interlayer insulating layer ILD between the gate insulating layer GI and the pixel defining layer 12, and the flat layer PLN between the interlayer insulating layer ILD and the pixel defining layer 12; the gate insulating layer GI, the interlayer insulating layer The ILD and the planarization layer PLN extend to the outer edge of the edge region E.
  • the above step S213 may include:
  • the organic adhesive layer 15 covers the gate insulating layer GI, the interlayer insulating layer ILD, and the sides at the outer edges of the flat layer PLN.
  • the organic adhesive layer 15 extends to the sub-cut area K, and wraps the outer edge of the pixel definition layer 12, the pixel definition layer 12 and the side edges of the underlying film layer, thereby increasing the size of the organic adhesive layer 15 and the underlying film.
  • the adhesion between the layers ensures the stability of the organic adhesive layer 15 , thereby ensuring that the adhesion between the pixel defining layer 12 and the touch barrier layer 14 is large.
  • the above-mentioned step S213 may include:
  • an organic adhesive layer is formed over the pixel-defining layer in the area to be cut.
  • the organic adhesive layer is located in the detection area, and there are multiple test electrodes in the detection area.
  • the multiple test electrodes in the detection area form an uneven surface, which is more conducive to the inkjet printing process. Therefore, the use of inkjet printing
  • the process of fabricating the organic adhesive layer can more reasonably utilize the structure of the detection area, which is beneficial to simplifying the fabrication process.
  • the method may further include:
  • FIG. 8 is a schematic cross-sectional view at the dotted line L1 in FIG. 6 .
  • the pattern of the encapsulation layer 13 is located in each panel area.
  • the encapsulation layer can display In the area A and the peripheral area B; the encapsulation layer 13 may include: an organic film layer 132 and an inorganic film layer 131 arranged in layers, wherein the organic film layer 132 may be located between two adjacent inorganic film layers 131 .
  • the above step S213 may include:
  • the organic film layer in the encapsulation layer is formed on the film layer of each light-emitting device, and the organic adhesive layer is formed on the pixel definition layer. In this way, one production step can be reduced, and the production cost can be saved.
  • an embodiment of the present disclosure also provides a display substrate. Since the principle of solving the problem of the display substrate is similar to the above-mentioned manufacturing method, the implementation of the display substrate can refer to the implementation of the above-mentioned manufacturing method, and the repetition will not be repeated. Repeat.
  • An embodiment of the present disclosure provides a display substrate, which may include: a panel area and a to-be-cut area around the panel area; as shown in FIG. 6 , the panel area may include a display area A and a peripheral area B; wherein the display area A It can include multiple sub-pixels of at least two colors; the area to be cut can include a detection area, an edge area and some sub-cut areas, and the detection area in the area to be cut can include: the first detection area C1, the second detection area C2, the first detection area C1, the second detection area C2, the Three detection areas C3, in order to clearly illustrate the structure of the display substrate, the edge area and some sub-cut areas in the area to be cut are omitted in FIG. 6 .
  • the film layer structure of the display substrate in the panel area can refer to FIG. 4
  • the film layer structure of the display substrate in the area to be cut can refer to FIG. 5
  • the display substrate may include :
  • the pixel defining layer 12 is located on the base substrate 10 and is used to define the area of each light emitting device 11; the pixel defining layer 12 is located in the panel area M and extends to the area N to be cut;
  • the touch blocking layer 14 is located on the side of the pixel defining layer 12 away from the base substrate 10; the touch blocking layer 14 is located in the panel area M and extends to the area N to be cut;
  • the organic adhesive layer 15 is located between the pixel defining layer 12 and the touch blocking layer 14 , and the organic adhesive layer 15 is located in the area N to be cut; the organic adhesive layer 15 includes an organic material.
  • the adhesion between the touch barrier layer and the pixel definition layer can be increased, and the The function of releasing the stress, therefore, can prevent the problem of film cracking between the touch barrier layer and the pixel defining layer, and improve the product yield.
  • the display area A may include a plurality of light-emitting devices 11, and the light-emitting devices 11 may be organic electroluminescent diodes.
  • the light-emitting device 11 may include: a first electrode 111, a light-emitting layer 112, and The second electrode 113 and the light emitting layer 112 are located between the first electrode 111 and the second electrode 113 .
  • the pixel defining layer 12 may include a plurality of openings, the light emitting layer 112 in the light emitting device 11 is formed in the openings, and the light emitting layer 112 is coupled with the first electrode 111 through the openings.
  • a driving circuit may also be provided between the light-emitting device 11 and the base substrate 10, and each light-emitting device 11 can be controlled to emit light through the driving circuit, thereby realizing screen display.
  • the display substrate further includes an encapsulation layer 13 covering the light-emitting devices 11 .
  • Layer 13 extends to peripheral area B.
  • the organic adhesive layer 15 includes an organic material, and the organic adhesive layer 15 has a certain viscosity, thus, the organic adhesive layer 15 can increase the adhesion between the touch barrier layer 14 and the pixel defining layer 12 Moreover, when the display substrate is bent, the organic adhesive layer 15 can play the role of stress release, alleviate the phenomenon of uneven stress in the touch barrier layer 14, thereby avoiding the touch barrier layer 14 and the pixel definition layer. Film cracking occurred between 12.
  • the orthographic projection of the organic adhesive layer 15 on the base substrate 10 and the orthographic projection of the encapsulation layer 13 on the base substrate 10 do not overlap each other, that is, the organic adhesive layer 15 is disposed in the area other than the encapsulation layer 13, It can be avoided that the organic adhesive layer 15 affects the sealing performance of the encapsulation layer 13 to prevent the light emitting device 11 from being corroded by water vapor and oxygen.
  • the area N to be cut may include a detection area C, an edge area E located on the side of the detection area C away from the panel area M, and an edge area E located on the side of the detection area C away from the panel area M.
  • the organic adhesive layer 15 extends beyond the outer edge of the edge region E and wraps the outer edge and side edge of the pixel definition layer 12 , thereby further increasing the adhesion between the pixel definition layer 12 and the touch barrier layer 14 .
  • the organic adhesive layer 15 bonds the edge between the pixel definition layer 12 and the touch barrier layer 14, which can prevent the touch barrier layer 14 and the pixel definition layer 12 from cracking at the edge and prevent the crack from extending to the panel area M .
  • the above-mentioned display substrate provided in the embodiment of the present disclosure may further include: a gate insulating layer GI located between the base substrate 10 and the pixel defining layer 12 , a gate insulating layer GI located between the gate an interlayer insulating layer ILD between the insulating layer GI and the pixel defining layer 12, and a flat layer PLN between the interlayer insulating layer ILD and the pixel defining layer 12;
  • the gate insulating layer GI, the interlayer insulating layer ILD and the flat layer PLN extend to the outer edge of the edge region E;
  • the organic adhesive layer 15 covers the side edges at the outer edges of the gate insulating layer GI, the interlayer insulating layer ILD and the flat layer PLN.
  • the organic adhesive layer 15 extends to the sub-cut area K, and wraps the outer edge of the pixel definition layer 12, the pixel definition layer 12 and the side edges of the underlying film layer, thereby increasing the size of the organic adhesive layer 15 and the underlying film.
  • the adhesion between the layers ensures the stability of the organic adhesive layer 15 , thereby ensuring that the adhesion between the pixel defining layer 12 and the touch barrier layer 14 is large.
  • the above-mentioned driving circuit may include components such as thin film transistors TFT and capacitor structures, wherein the thin film transistor TFT may include: an active layer Ac, an input end S, an output end D, and a gate Ga1.
  • the output terminal D is coupled to the first electrode 111 through the conductive connection part LB, and the gate Ga1 and the third electrode Ga2 form a capacitance structure.
  • the above-mentioned display substrate may further include: a first gate insulating layer GI1 between the active layer Ac and the gate Ga1, a second gate insulating layer GI2 between the gate Ga1 and the third electrode Ga2, and a third gate insulating layer GI2 between the gate Ga1 and the third electrode Ga2.
  • the above-mentioned gate insulating layer GI includes a first gate insulating layer GI1 and a second gate insulating layer GI2, that is, the gate insulating layer GI shown in FIG. 5 is formed by the panel area
  • the first gate insulating layer GI1 and the second gate insulating layer GI2 in M extend to the peripheral region.
  • the above-mentioned flat layer PLN includes a first flat layer PLN1 and a second flat layer PLN2, that is, the flat layer PLN shown in FIG. 5 is extended from the first flat layer PLN1 and the second flat layer PLN2 in the panel region M to obtained from the surrounding area.
  • the above-mentioned display substrate provided by the embodiments of the present disclosure may further include: an encapsulation layer 13 located in the panel area M and covering each light-emitting device 11 ;
  • the control barrier layer 14 is close to the side of the base substrate 10;
  • the encapsulation layer 13 may include: at least two layers of inorganic film layers 131 and at least one layer of organic film layers 132 arranged in layers;
  • the organic film layer 132 is located between two adjacent inorganic film layers 131;
  • the organic adhesive layer 15 is provided in the same layer as the organic film layer 132 .
  • the above-mentioned inorganic film layer 131 includes inorganic materials, and the inorganic film layer 131 has a good function of blocking water vapor and oxygen.
  • the organic film layer 132 is located between two adjacent inorganic film layers 131 and can play a role in releasing stress.
  • the encapsulation layer 13 includes two inorganic membrane layers 131 and one organic membrane layer 132 as an example for illustration. In specific implementation, the encapsulation layer 13 may also include more inorganic membrane layers 131 and more layers.
  • the organic film layer 132 is not limited here.
  • the organic adhesive layer 15 and the organic film layer 132 are arranged in the same layer, and the same manufacturing process can be used to form the organic adhesive layer 15 and the organic film layer 132 during the manufacturing process, which can reduce one manufacturing step and save manufacturing costs.
  • the above-mentioned organic adhesive layer 15 and the organic film layer 132 may be fabricated by an inkjet printing process, and other fabrication processes may also be used, which are not limited herein.
  • the above-mentioned organic adhesive layer 15 may include epoxy resin material, or other organic materials may be used to make the organic adhesive layer 15, which is not limited herein.
  • the above-mentioned display substrate provided by the embodiment of the present disclosure may further include: a retaining wall 17 located on the base substrate 10 and surrounding the display area A;
  • the organic adhesive layer 15 is located on the side of the barrier wall 17 away from the display area A.
  • each film layer corresponding to the multiple display panels is fabricated in the motherboard, and then the display motherboard is cut to obtain multiple display panels, thereby improving the efficiency of manufacturing the display panels.
  • a retaining wall 17 surrounding the display area A is set in the peripheral area B.
  • the retaining wall 17 can be set as a ring structure .
  • the surrounding area B includes a retaining wall 17 as an example for illustration.
  • the number of the retaining walls 17 may be set according to actual needs, which is not limited here. Disposing the organic adhesive layer 15 on the side of the retaining wall 17 away from the display area A can make the organic adhesive layer 15 relatively flat to ensure the adhesion of the organic adhesive layer 15 to the pixel defining layer 12 and the touch barrier layer 14 The effect is better.
  • the inorganic film layer 131 in the encapsulation layer 13 can be arranged to extend to the outside of the retaining wall 17 , thereby extending the path of the inorganic film layer 131 for blocking water vapor and oxygen, and improving the encapsulation effect of the encapsulation layer 13 .
  • the organic adhesive layer may be a strip-shaped structure extending along the edge of the display substrate.
  • the organic adhesive layer is located outside the peripheral area B. Therefore, the organic adhesive layer is arranged in a strip-like structure, and the organic adhesive layer extends along the edge of the display substrate, so that the peripheral area B can be more reasonably utilized. space, so that the coverage area of the organic adhesive layer is large, and the adhesion between the pixel definition layer and the touch barrier layer is guaranteed to be large.
  • the detection area may include: a first detection area C1 , a second detection area C2 and a first detection area C2 located on different sides of the display area A, respectively.
  • the organic adhesive layer is located in at least one of the first detection area C1, the second detection area C2, and the third detection area C3.
  • the display area A may include four sides, and a binding area may be set in the peripheral area B on one side of the display area A, and the binding area includes a plurality of binding electrodes,
  • the display substrate can be coupled with the driver chip through the binding electrodes, so that the display substrate can be controlled by the driver chip to display the screen. Because the outer edge of the binding area is far away from the interior of the display area A, and other structures in the binding area are far away
  • the touch barrier layer and the underlying film layer can be prevented from cracking, so the organic adhesive layer may not be disposed in the binding area.
  • the width of the peripheral area B on the other side of the display area A is relatively narrow, and the touch barrier layer is likely to be cracked with the underlying film layer.
  • the touch barrier layer and the underlying film layer can be prevented from cracking.
  • the detection area is only used to detect the function of the driving circuit. It will affect other structures of the display panel, and will not affect the display effect of the display panel.
  • the detection area C may include: a test circuit W, and a test electrode (not shown in the figure) coupled to the test circuit W ;
  • the test electrode can be located on the side of the test circuit W away from the base substrate 10, which is convenient for connection with the external test device during the detection process.
  • test circuit W and the test electrodes are located in the film layer between the base substrate 10 and the organic adhesive layer 15 . In this way, in the actual process, the test circuit W in the detection area can test the driving circuit, and then the organic adhesive layer can be formed, which will not affect the function of the detection area.
  • FIG. 9 is a schematic plan view of the detection area (taking the second detection area C2 as an example) in an embodiment of the present disclosure.
  • a plurality of test electrodes Q can be set in the detection area.
  • the ink printing process forms an organic adhesive layer, and the uneven surface formed by the plurality of test electrodes Q in the detection area is more beneficial to the inkjet printing process.
  • the ink droplets can be dropped into the detection area. Because the ink droplets have fluidity, the ink droplets can flow to the edge area E , even into the sub-cut area K to form the organic adhesive layer 15 covering the sides of the pixel defining layer 12, or to form the organic adhesive layer 15 covering the sides of the gate insulating layer GI, the interlayer insulating layer ILD and the flat layer PLN Adhesive layer 15 .
  • the above-mentioned display substrate provided by the embodiment of the present disclosure may further include: a touch electrode layer 16 on the side of the touch barrier layer 14 located in the display area away from the base substrate 10 .
  • a touch electrode layer 16 on the side of the touch barrier layer 14 located in the display area away from the base substrate 10 .
  • the touch barrier layer 14 By disposing the touch electrode layer 16 inside the display substrate, the touch function of the display substrate is realized, the integration degree of the display panel is improved, and the thickness of the display substrate is reduced.
  • metal atoms in the touch electrode layer 16 can be prevented from entering the encapsulation layer 13 .
  • FIG. 10 is a schematic structural diagram of a touch electrode layer in an embodiment of the disclosure.
  • the touch electrode layer may include: a first touch electrode 161 and a first touch electrode 161 located in a different film layer. two touch electrodes 162;
  • the display substrate further includes: an insulating layer 163 located between the first touch electrodes 161 and the second touch electrodes 162 ; referring to FIG. 5 , the insulating layer 163 is located in the display area and extends to the area to be cut.
  • the insulating layer 163 generally includes an inorganic material, for example, can include a silicon nitride material.
  • the insulating layer 163 is arranged to extend to the outer edge of the peripheral area, which can block water vapor and oxygen, and further prevent the display area from being corroded by water vapor and oxygen. .
  • the touch electrode layer 16 includes a first touch electrode 161 and a second touch electrode 162 located in different film layers, and the first touch electrode 161 and the second touch electrode 162 are formed
  • the mutual capacitance structure is used to realize the detection of the touch position.
  • the self-capacitance detection principle can also be used, and the touch electrode layer is set to include a plurality of self-capacitance electrodes to realize the detection of the touch position.
  • the specific structure of the touch electrode layer is limited.
  • the display substrate provided by the embodiment of the present disclosure may be a flexible display substrate.
  • the above-mentioned substrate substrate 10 may include at least one layer of flexible substrate 101 .
  • the display substrate can be made flexible to a certain extent, or can be bent.
  • the substrate substrate 10 includes two layers of flexible substrates 101 as an example for illustration.
  • the number of layers of the flexible substrates 101 can be set according to actual needs, which is not limited here.
  • a buffer layer 102 may also be provided on the side of each flexible substrate 101 close to the light emitting device 11.
  • a flexible protective cover plate (not shown in the figure) may also be provided on the side of the touch electrode layer 16 away from the base substrate 10 .
  • the area to be cut in the display substrate includes the detection area, the edge area and part of the sub-cut area as an example for illustration, that is, the display substrate is obtained by cutting the motherboard at the sub-cut area. display substrate.
  • the display substrate may also be a display substrate obtained by cutting the display substrate at the detection area, that is, the to-be-cut area in the display substrate may only include a part of the detection area, and the display substrate is not The specific components of the cutting area are defined.
  • the adhesion between the touch barrier layer and the pixel definition layer can be increased, In addition, it can play the role of releasing stress, thus, it can prevent the problem of film cracking between the touch barrier layer and the pixel defining layer, and improve the product yield.

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Procédé de fabrication de panneau d'affichage et substrat d'affichage. Le procédé de fabrication de panneau d'affichage consiste à : former une carte mère (100) comprenant une pluralité de panneaux d'affichage, la carte mère (100) comprenant : une pluralité de régions de panneau (M) correspondant respectivement aux panneaux d'affichage, et des régions à découper (N) situées entre des régions de panneau (M) adjacentes ; et réaliser une découpe au niveau des régions à découper (N) de la carte mère (100) afin d'obtenir la pluralité de panneaux d'affichage. La formation d'une carte mère (100) comprenant une pluralité de panneaux d'affichage consiste à : former un motif d'une couche de définition de pixels (12) sur un substrat (10), le motif de la couche de définition de pixels (12) étant situé dans chaque région de panneau (M) et s'étendant jusqu'aux régions à découper (N) ; former une pluralité de dispositifs électroluminescents (11) dans les régions délimitées par la couche de définition de pixels (12) dans les régions de panneau (M) ; former une couche adhésive organique (15) sur la couche de définition de pixels (12) dans les zones à découper (N) ; et former une couche de barrière tactile (14) sur la couche adhésive organique (15), la couche de barrière tactile (14) étant située dans chaque région de panneau (M) et s'étendant jusqu'aux régions à couper (N).
PCT/CN2020/128112 2020-11-11 2020-11-11 Procédé de fabrication de panneau d'affichage et substrat d'affichage WO2022099507A1 (fr)

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PCT/CN2020/128112 WO2022099507A1 (fr) 2020-11-11 2020-11-11 Procédé de fabrication de panneau d'affichage et substrat d'affichage

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US20190341567A1 (en) * 2018-05-02 2019-11-07 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate motherboard, display substrate and display device
CN110867471A (zh) * 2019-11-22 2020-03-06 京东方科技集团股份有限公司 显示基板母板及其切割方法
CN111106156A (zh) * 2020-01-07 2020-05-05 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
CN211125656U (zh) * 2020-02-27 2020-07-28 京东方科技集团股份有限公司 显示母板、显示基板和显示装置
CN111524908A (zh) * 2020-04-28 2020-08-11 京东方科技集团股份有限公司 显示面板及显示装置

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US20190341567A1 (en) * 2018-05-02 2019-11-07 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate motherboard, display substrate and display device
CN110867471A (zh) * 2019-11-22 2020-03-06 京东方科技集团股份有限公司 显示基板母板及其切割方法
CN111106156A (zh) * 2020-01-07 2020-05-05 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
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CN115064064A (zh) * 2022-06-06 2022-09-16 昆山国显光电有限公司 显示母版和显示面板
CN115064064B (zh) * 2022-06-06 2023-12-22 昆山国显光电有限公司 显示母版和显示面板

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