WO2022095065A1 - 电路板组件、电池套件及电子设备 - Google Patents

电路板组件、电池套件及电子设备 Download PDF

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Publication number
WO2022095065A1
WO2022095065A1 PCT/CN2020/127632 CN2020127632W WO2022095065A1 WO 2022095065 A1 WO2022095065 A1 WO 2022095065A1 CN 2020127632 W CN2020127632 W CN 2020127632W WO 2022095065 A1 WO2022095065 A1 WO 2022095065A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
battery
wall
heat
board assembly
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Application number
PCT/CN2020/127632
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English (en)
French (fr)
Inventor
张瑞强
李日照
农贵升
张彩辉
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2020/127632 priority Critical patent/WO2022095065A1/zh
Publication of WO2022095065A1 publication Critical patent/WO2022095065A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Definitions

  • the present application relates to the technical field of electronic devices, and in particular, to a circuit board assembly, a battery kit and an electronic device.
  • a battery typically includes a housing and a circuit board disposed within the housing.
  • the battery of the existing electric equipment is used outdoors, if the part where the battery is placed is splashed with water or exposed to rain, water will easily enter, which will cause water or moisture to enter the circuit board, thereby causing Damage to the battery will affect the normal use of electric equipment.
  • the present application provides a circuit board assembly, a battery kit and an electronic device, which aim to seal both sides of the circuit board to prevent the circuit board from being damaged by moisture.
  • an embodiment of the present application provides a circuit board assembly, including:
  • circuit board arranged in the receiving space, comprising a first surface and a second surface opposite to each other, and at least one of the first surface and the second surface is provided with a component;
  • an enclosure structure is provided on the casing, and the circuit board cooperates with the enclosure structure to divide the accommodation space into a first subspace and a second subspace, so that the second subspace is a sealed space; the second surface and the guard are located in the first subspace; the first surface is located in the second subspace.
  • an embodiment of the present application provides a circuit board assembly, including:
  • circuit board which is arranged in the casing, and includes a first surface and a second surface opposite to each other, and at least one of the first surface and the second surface is provided with components;
  • the casing is provided with an enclosure structure, and the circuit board cooperates with the enclosure structure to form a sealed space; the first surface of the circuit board is located in the sealed space.
  • an embodiment of the present application provides a battery kit, including:
  • a battery is arranged in the casing.
  • an electronic device including:
  • the battery kit according to the third aspect of the embodiment of the present application is provided on the body.
  • an embodiment of the present application provides a battery kit, including:
  • a casing comprising a first heat dissipation opening, the casing is formed with a receiving cavity, and the first heat dissipation opening is communicated with the receiving cavity;
  • a battery located in the receiving cavity
  • a heat-conducting member arranged between the casing and the battery; the heat on the battery can be conducted to the heat-conducting member and dissipated through the first heat dissipation opening;
  • the battery kit further includes a first sealing member disposed at the first heat dissipation opening, for preventing liquid from entering the receiving cavity through the first heat dissipation opening.
  • an electronic device including:
  • the battery kit of the fifth aspect of the present application is provided on the body.
  • the embodiments of the present application provide a circuit board assembly, a battery kit, and an electronic device.
  • the double-sided sealing of the circuit board is realized by the protective member and the sealing space formed by the cooperation of the circuit board and the enclosure structure, so as to prevent the circuit board from being damaged by moisture. damage, thereby effectively protecting the circuit board, enhancing the reliability of the circuit board, and reducing the maintenance cost of the circuit board assembly.
  • FIG. 1 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of an angle of a circuit board assembly provided by an embodiment of the present application
  • FIG. 3 is a schematic structural diagram of another angle of a circuit board assembly provided by an embodiment of the present application.
  • FIG. 4 is an exploded schematic diagram of a circuit board assembly provided by an embodiment of the present application.
  • FIG. 5 is a cross-sectional view of a circuit board assembly provided by an embodiment of the present application.
  • Fig. 6 is the partial enlarged schematic diagram of Fig. 5 at A;
  • FIG. 7 is a partial structural schematic diagram of a circuit board assembly provided by an embodiment of the present application.
  • Fig. 8 is a partial enlarged schematic view of Fig. 7 at B;
  • FIG. 9 is a partial structural schematic diagram of a circuit board assembly provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a battery provided by an embodiment of the present application.
  • FIG. 12 is a partial structural schematic diagram of a circuit board assembly provided by an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of a thermally conductive member provided in an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 15 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • 100 battery kit; 101, circuit board assembly; 102, battery; 1021, first side wall; 1022, second side wall; 1023, third side wall; 1024, fourth side wall;
  • circuit board 21, first surface; 22, second surface; 23, side wall; 24, screw hole;
  • 60 heat conducting member; 61, first heat conducting body; 611, first heat conducting wall; 612, second heat conducting wall; 62, second heat conducting body; 621, third heat conducting wall; 622, fourth heat conducting wall; 63, hollow space;
  • the plant protection drone needs to be set up with a battery to power the plant protection drone.
  • the working environment of plant protection drones is generally humid and easy to contact with some corrosive liquids such as pesticides.
  • pesticides or other liquids enter the inside of the battery, the circuit board or cell of the battery will be corroded, resulting in the failure of the battery function.
  • the inventor proposes a circuit board assembly, a battery kit and an electronic device, which aim to seal both sides of the circuit board to prevent the circuit board from being damaged by moisture.
  • a circuit board assembly 101 provided by an embodiment of the present application includes a casing 10 , a circuit board 20 and a protective member 30 .
  • the housing 10 is formed with an accommodation space 11 .
  • the circuit board 20 is disposed in the receiving space 11 .
  • the circuit board 20 includes opposing first surfaces 21 and second surfaces 22 . At least one of the first surface 21 and the second surface 22 is provided with components.
  • the guard 30 is used to seal at least a portion of the second surface 22.
  • the housing 10 is provided with an enclosure structure 40 , and the circuit board 20 cooperates with the enclosure structure 40 to divide the accommodation space 11 into a first subspace 111 and a second subspace 112 , so that the second subspace 112 is sealed Space 113.
  • the second surface 22 and the guard 30 are located within the first subspace 111 .
  • the first surface 21 is located within the second subspace 112 .
  • the circuit board 20 cooperates with the enclosure structure 40 to form a sealed space 113, thereby realizing the sealing of the first surface 21 of the circuit board 20, thereby preventing liquids such as dust or pesticides from entering the second subspace 112 to corrode the first surface 21 of the circuit board 20 , thereby protecting the first surface 21 of the circuit board 20 .
  • the first surface 21 of the circuit board 20 in the embodiment of the present application is located in the sealing space 113 , there is no need to provide additional potting glue to seal the first surface 21 , thereby reducing the weight of the circuit board assembly 101 , which is beneficial to the lightening of the electronic device 1000 including the circuit board assembly 101 .
  • this sealing and waterproofing method can be applied in multiple areas, and different circuit boards can be modularly sealed, so that different shapes of enclosure structures can be adaptively adopted according to the device distribution of different circuit boards to save materials. Optimize the space layout.
  • the protective member 30 can seal at least a partial area of the second surface 22 of the circuit board 20 , thereby preventing liquids such as dust or pesticides from reaching at least a partial area of the second surface 22 of the circuit board 20 , thereby causing damage to the second surface 22 of the circuit board 20 .
  • At least a partial area of the two surfaces 22 plays a protective role. Therefore, the circuit board assembly 101 achieves double-sided sealing of the circuit board 20 through the protective member 30 and the sealing space 113 formed by the circuit board 20 and the enclosure structure 40 , preventing the circuit board 20 from being damaged by moisture, thereby effectively protecting the circuit board 20 . Enhance the reliability of the circuit board 20 and reduce the maintenance cost of the circuit board assembly 101 .
  • one of the first surface 21 and the second surface 22 is provided with components, and the other of the first surface 21 and the second surface 22 is not provided with components.
  • the first surface 21 is provided with components, and the second surface 22 is not provided with components.
  • the second surface 22 is provided with components, and the first surface 21 is not provided with components.
  • both the first surface 21 and the second surface 22 are provided with components.
  • first surface 21 and/or the second surface 22 can be designed according to actual requirements, which are not limited herein.
  • the circuit board 20 is hermetically connected to the enclosure structure 40 , so that the second subspace 112 is the sealed space 113 .
  • the circuit board 20 and the enclosure structure 40 are adhered and sealed.
  • the connection between the circuit board 20 and the enclosure structure 40 is provided with a sealing member such as a sealant layer to achieve a sealed connection between the two.
  • the circuit board 20 is detachably connected to the enclosure structure 40 .
  • the circuit board 20 is connected to the enclosure structure 40 by a snap-fit connection or a screw-locked connection or the like.
  • the second surface 22 is provided with components. At least part of the area includes the area on the second surface 22 where the components are located. It can be understood that at least part of the area may be all areas of the second surface 22 , or may be areas where components on the second surface 22 are located.
  • guard 30 covers second surface 22 and/or components of second surface 22 .
  • the guard 30 may cover at least part of the second surface 22 .
  • the protective member 30 covers at least part of the second surface 22 and the components on the second surface 22 , so as to protect the second surface 22 of the circuit board 20 .
  • the guard 30 includes: a potting glue layer. Specifically, after the circuit board 20 and the enclosure structure 40 are fixed, a layer of potting glue can be applied on the second surface 22 of the circuit board 20 , and the potting glue is cured to form the protective member 30 , so as to prevent the circuit board 20 from being damaged. The components of the second surface 22 are protected.
  • the enclosure structure 40 includes an enclosure wall 41 and a bearing portion 42 .
  • the bearing portion 42 is protruded from the enclosing wall 41 .
  • the circuit board 20 is carried on the bearing portion 42 .
  • the bearing portion 42 , the enclosing wall 41 and the circuit board 20 cooperate to form the second subspace 112 .
  • the first surface 21 of the circuit board 20 is provided with components, and the first surface 21 of the circuit board 20 is spaced from the enclosing wall 41 by a predetermined distance. The preset distance is greater than or equal to the maximum protruding dimension of the components on the first surface 21 .
  • the bearing portion 42 cooperates with the enclosing wall 41 to form an annular groove 43 .
  • the annular groove 43 cooperates with the circuit board 20 to form the second subspace 112 .
  • the enclosing wall 41 and the bearing portion 42 are the groove bottom wall and the groove side wall of the annular groove 43 , respectively.
  • the first surface 21 of the circuit board 20 blocks the opening of the annular groove 43 , thereby forming a closed second subspace 112 .
  • the bearing portion 42 and the enclosing wall 41 are manufactured by integral molding.
  • the circuit board 20 further includes a side wall portion 23 connected to the first surface 21 and the second surface 22 .
  • the bearing portion 42 includes a bearing body 421 and a rib 422 .
  • the carrier 421 is protruded from the enclosing wall 41 .
  • the baffle 422 is disposed at one end of the carrier body 421 away from the enclosing wall 41 .
  • the rib 422 cooperates with the carrier 421 to form a step 423 .
  • the first surface 21 of the circuit board 20 is mounted on the first stepped surface 4231 of the step 423 .
  • the side wall portion 23 of the circuit board 20 is disposed opposite to the second step surface 4232 of the step 423 .
  • a potting glue is applied on the second surface 22 of the circuit board 20 , and the protective member 30 is formed after the potting glue is cured.
  • the ribs 422 can prevent the potting glue from overflowing, and ensure that all the components on the second surface 22 can be covered by the guard 30 .
  • the protective member 30 can prevent the liquid and/or solid in the first subspace 111 from entering the first subspace 111 through the gap between the circuit board 20 and the enclosure structure 40 . Second subspace 112 .
  • the first surface 21 of the circuit board 20 is sealed with the first stepped surface 4231 , so that the second subspace 112 is a sealed space 113 to prevent liquid or dust from passing through the first step surface 4231 .
  • the gap between the surface 21 and the first stepped surface 4231 enters the second subspace 112 to corrode the first surface 21 or the components of the first surface 21 .
  • the shape of the first stepped surface 4231 is adapted to the edge of the first surface 21 .
  • the first surface 21 of the circuit board 20 is parallel or substantially parallel to the first stepped surface 4231 .
  • the first surface 21 of the circuit board 20 is attached to the first stepped surface 4231 , so as to achieve a sealed connection between the first surface 21 of the circuit board 20 and the first stepped surface 4231 .
  • the first surface 21 of the circuit board 20 and the first stepped surface 4231 may be surface-bonded or line-bonded.
  • a sealing ring may also be provided at the connection between the first surface 21 of the circuit board 20 and the first stepped surface 4231 , so as to achieve a sealed connection between the first surface 21 of the circuit board 20 and the first stepped surface 4231 .
  • the side wall portion 23 of the circuit board 20 is sealed with the second stepped surface 4232 to ensure that liquid or dust will not pass between the side wall portion 23 and the second stepped surface 4232 .
  • the gap between them enters the second subspace 112 to corrode the first surface 21 or the components of the first surface 21 .
  • the shape of the second stepped surface 4232 is adapted to the shape of the side wall portion 23 of the circuit board 20 .
  • the side wall portion 23 of the circuit board 20 is parallel or substantially parallel to the second stepped surface 4232 .
  • the side wall portion 23 of the circuit board 20 is attached to the second stepped surface 4232 .
  • the side wall portion 23 and the second stepped surface 4232 may be surface-bonded or line-bonded.
  • the first stepped surface 4231 is perpendicular to the second stepped surface 4232 .
  • the first stepped surface 4231 and the second stepped surface 4232 may also have an acute angle or an obtuse angle, as long as the second subspace 112 formed by the circuit board 20 and the enclosure structure 40 is a sealed space 113 .
  • the distance between the first stepped surface 4231 and the enclosing wall 41 is greater than or equal to the maximum protruding dimension of the components on the first surface 21 . In this way, it can be ensured that the second subspace 112 formed by the cooperation of the circuit board 20 and the enclosure structure 40 is the sealed space 113 , and the components on the first surface 21 will not be damaged.
  • the rib 422 is protruded from one end of the carrier 421 away from the enclosing wall 41 .
  • the carrier 421 is protruded from the periphery of the enclosing wall 41 .
  • the rib 422 and the enclosing wall 41 are respectively disposed at opposite ends of the carrier 421 , and the rib 422 is protruded from the carrier 421 .
  • the protruding direction of the ribs 422 is the same as the protruding direction of the carrier 421 .
  • the rib 422 and the carrier 421 can form a step 423 .
  • the first preset distance is d1
  • the second preset distance is d2
  • d1 is greater than d2.
  • the first predetermined distance is greater than the third predetermined distance.
  • the first preset distance is d1
  • the third preset distance is d3
  • d1 is greater than d3.
  • the difference between the first preset distance d1 and the third preset distance d3 is too small.
  • the guard 30 cannot completely cover the components on the second surface 22 of the circuit board 20 .
  • the difference between the first preset distance d1 and the third preset distance d3 is too large.
  • the thickness of the protective member 30 will be relatively thick, which increases the weight of the circuit board assembly 101 , on the other hand
  • the increase in the size of the rib 422 itself will also increase the weight of the circuit board assembly 101 , which is not conducive to the lightweight of the electronic device 1000 .
  • the difference between the first preset distance and the third preset distance is 1.5mm-2.5mm.
  • the difference between the first preset distance and the third preset distance may be 1.5mm, 2mm, 2.5mm, and any other suitable value between 1.5mm-2.5mm.
  • it can not only ensure that the components on the second surface 22 of the circuit board 20 can be covered by the protective member 30 , but also avoid aggravating the damage of the circuit board assembly 101 due to the excessive difference between the first preset distance and the third preset distance. Therefore, it is convenient to realize the lightweight of the electronic device 1000 .
  • the first preset distance d1 is subtracted from the third preset distance d3 , and the resulting difference is in the range of 1.5mm-2.5mm.
  • the housing 10 is provided with a fixing portion 14 for connecting with the circuit board 20 .
  • the fixing portion 14 is protruded from the enclosing wall 41 .
  • the fixing portion 14 and the enclosing wall 41 are integrally formed.
  • the number of the fixing parts 14 can be designed according to actual requirements, such as one or more. Referring to FIG. 7 , the number of the fixing parts 14 is plural. At least part of the plurality of fixing parts 14 is connected to the bearing part 42 .
  • the number of fixing parts 14 is n, wherein m fixing parts 14 are connected to the carrier body 421 . n is greater than or equal to m, and both n and m are positive integers.
  • the circuit board 20 is detachably connected to the fixing portion 14 through the locking member 50 .
  • the locking member 50 is a quick-release part such as a screw.
  • the fixing portion 14 is a stud
  • the circuit board 20 is formed with a threaded hole 24
  • the locking member 50 passes through the threaded hole 24 and the stud, so as to realize the circuit board 20 and the enclosure structure 40 fixed connection.
  • the fixing portion 14 may also be other detachable connection structures such as a snap-fit structure.
  • one end of the fixing portion 14 facing the circuit board 20 is flush with the first stepped surface 4231 of the bearing portion 42 .
  • One end of the fixing portion 14 facing the circuit board 20 is lower than the first stepped surface 4231 of the bearing portion 42 . In this way, after the circuit board 20 is fixed on the enclosure structure 40 , the circuit board 20 cooperates with the enclosure structure 40 to form the sealed space 113 .
  • the housing 10 includes a cover 12 .
  • the circuit board 20 and the enclosure structure 40 are disposed on the cover body 12 .
  • the enclosure structure 40 is an integral structure with other parts of the cover body 12 .
  • the enclosure structure 40 can be regarded as a part of the cover body 12 , and the enclosure structure 40 and other parts of the cover body 12 are manufactured by integral molding.
  • the circuit board 20 is detachably connected to the cover body 12 .
  • the housing 10 further includes a housing 13 .
  • the housing 13 cooperates with the cover body 12 to form a receiving space 11 .
  • the casing 13 is used for accommodating the battery 102 , and the battery 102 is electrically connected to the circuit board 20 .
  • the battery 102 includes a plurality of cells. The plurality of cells may be connected in parallel, may also be connected in series, and may also be connected in multiple serials and parallels.
  • the electronic device 1000 Take the electronic device 1000 as an example of a plant protection drone. Since the battery 102 of the plant protection drone is generally discharged at a high rate, the battery cell will generate a lot of heat when the battery 102 is discharged, and the temperature rise of the battery cell will be very high, and the battery cell will shorten the service life when it works under high temperature conditions for a long time . Therefore, the heat generated by the battery cells needs to be dissipated in time. On the other hand, most of the plant protection drones work in a humid and watery environment, so the battery 102 needs to have high waterproof performance.
  • the case 10 includes a first heat dissipation opening 15 .
  • the housing 10 is formed with an accommodation cavity 16 for accommodating the battery 102 .
  • the first heat dissipation opening 15 communicates with the receiving cavity 16 .
  • the circuit board assembly 101 also includes a thermally conductive member 60 .
  • the heat conducting member 60 is disposed between the casing 10 and the battery 102 . The heat on the battery 102 can be conducted to the heat conducting member 60 and dissipated through the first heat dissipation opening 15 .
  • the heat generated by the battery 102 can be conducted to the heat conducting member 60 .
  • the heat on the heat conducting member 60 can be dissipated through the first heat dissipation opening 15 . Therefore, compared with the circuit board assembly 101 without the first heat dissipation opening 15, the heat generated by the battery 102 during operation can be dissipated in time through the heat conducting member 60 and the first heat dissipation opening 15, thereby improving the heat dissipation efficiency of the battery 102. , to meet the heat dissipation requirement of the battery 102 .
  • the accommodating cavity 16 and the first heat dissipation opening 15 are provided on the housing 13 .
  • the housing 13 is thermally conductive.
  • the heat of the accommodating cavity 16 or the heat of the heat conducting member 60 can be conducted to the casing 13 and dissipated.
  • the housing 13 is a plastic part, so as to reduce the weight of the circuit board assembly 101 and reduce the cost of the circuit board assembly 101 .
  • the number of the first heat dissipation openings 15 can be designed according to actual requirements, such as one or more. Exemplarily, the number of the first heat dissipation openings 15 is one.
  • the number of the first heat dissipation openings 15 is multiple.
  • the plurality of first heat dissipation openings 15 may be arranged regularly or irregularly.
  • the first heat dissipation openings 15 are arranged in an array.
  • the first heat dissipation openings 15 are arranged at intervals along the height direction of the casing 13 .
  • the thermally conductive member 60 is in thermally conductive contact with the battery 102 . In this way, the heat generated by the battery 102 can be conducted to the heat conducting member 60 in time.
  • the thermally conductive member 60 is in surface contact with the battery 102 to ensure sufficient thermally conductive contact area between the thermally conductive member 60 and the battery 102 . In other embodiments, the thermally conductive member 60 and the battery 102 may also be in point contact or line contact.
  • the thermally conductive member 60 is disposed around the side of the battery 102 . In this way, different parts of the battery 102 can conduct heat exchange with the heat-conducting member 60 , so that the heat generated during the operation of the battery 102 is transferred to the heat-conducting member 60 , and the heat dissipation efficiency of the battery 102 is improved.
  • At least part of the heat conducting member 60 is disposed opposite to the first heat dissipation opening 15 .
  • the air outside the casing 13 can flow to the heat-conducting member 60 through the first heat dissipation opening 15 , so that the heat-conducting member 60 can be in contact with the air outside the casing 13 , thereby improving the heat dissipation capability and heat dissipation efficiency of the battery 102 .
  • the portion of the heat conducting member 60 opposite to the first heat dissipation opening 15 is exposed to the air. In this way, the portion of the heat-conducting member 60 disposed opposite to the first heat dissipation opening 15 can be in contact with the air outside the casing 13, so that the heat on the heat-conducting member 60 can be dissipated in time.
  • the thermally conductive member 60 is sandwiched between the housing 13 and the battery 102 .
  • the heat conducting member 60 may also be fixedly connected to the battery 102 or the casing 13 through an intermediate member.
  • the thermal conductor 60 includes a first thermal conductor 61 and a second thermal conductor 62 . Both the first thermal conductor 61 and the second thermal conductor 62 have thermal conductivity. At least part of the first heat conductor 61 is disposed corresponding to the first heat dissipation opening 15 . The first heat conductor 61 and the second heat conductor 62 are respectively in contact with different parts of the battery 102 to increase the contact area between the battery 102 and the heat conducting member 60 and improve the heat dissipation efficiency of the battery 102 .
  • both the first thermal conductor 61 and the second thermal conductor 62 are sandwiched between the casing 13 and the battery 102 .
  • the first thermal conductor 61 and the second thermal conductor 62 may or may not be in contact.
  • one of the first thermal conductor 61 and the second thermal conductor 62 may be omitted.
  • the first thermal conductor 61 cooperates with the second thermal conductor 62 to form a hollow space 63 . At least a portion of the battery 102 is located within the hollow space 63 .
  • the hollow space 63 comprises an annular space.
  • the annular space may be a square annular space or a substantially square annular space. It can be understood that, the cooperation of the first heat conductor 61 and the second heat conductor 62 can form a closed-loop structure or a non-closed-loop structure, which is not limited herein.
  • the first thermal conductor 61 and the second thermal conductor 62 are disposed separately.
  • the first heat conducting body 61 and the second heat conducting body 62 are two independent components, which reduces the difficulty of processing the heat conducting member 60 and the difficulty of assembling the circuit board assembly 101 .
  • the housing 10 further includes a second heat dissipation opening 17 that communicates with the receiving cavity 16 .
  • At least part of the second heat conductor 62 is disposed corresponding to the second heat dissipation opening 17 , and the heat on the battery 102 can be conducted to the second heat conductor 62 and dissipated through the second heat dissipation opening 17 .
  • the portion of the second heat conductor 62 corresponding to the second heat dissipation opening 17 can be in contact with the air outside the casing 13 to dissipate heat, thereby further improving the heat dissipation efficiency of the battery 102 .
  • the second heat conductor 62 is disposed opposite to the second heat dissipation opening 17 .
  • the first heat dissipation opening 15 is disposed opposite to the second heat dissipation opening 17 . In other embodiments, the first heat dissipation openings 15 and the second heat dissipation openings 17 may also be disposed in a staggered position.
  • the number of the second heat dissipation openings 17 can be designed according to actual requirements, such as one or more. Exemplarily, the number of the second heat dissipation openings 17 is plural.
  • the plurality of second heat dissipation openings 17 may be arranged regularly or irregularly.
  • the second heat dissipation openings 17 are arranged in an array. Specifically, the second heat dissipation openings 17 are arranged at intervals along the height direction of the housing 13 .
  • the battery 102 includes a first side wall 1021 , a second side wall 1022 , a third side wall 1023 and a fourth side wall 1024 which are connected in sequence.
  • the first heat conducting body 61 includes a first heat conducting wall 611 and a second heat conducting wall 612 .
  • the first thermally conductive wall 611 is thermally connected to the first side wall 1021 of the battery 102 .
  • the second heat-conducting wall 612 is connected to the first heat-conducting wall 611 .
  • the second thermally conductive wall 612 is thermally connected to the second side wall 1022 of the battery 102 .
  • the first heat conducting wall 611 is sandwiched between the casing 13 and the first side wall 1021 of the battery 102 , and the first heat conducting wall 611 is in thermal contact with the first side wall 1021 of the battery 102 .
  • the second heat conducting wall 612 is sandwiched between the casing 13 and the second side wall 1022 of the battery 102 , and the second heat conducting wall 612 is in thermal contact with the second side wall 1022 of the battery 102 , thereby accelerating the heat dissipation of the battery 102 .
  • the first thermally conductive wall 611 intersects the second thermally conductive wall 612 to ensure that the first thermally conductive wall 611 can be in thermally conductive contact with the first sidewall 1021 of the battery 102 and the second thermally conductive wall 612 can be in contact with the battery 102 The second sidewall 1022 of the thermally conductive contact.
  • the first thermally conductive wall 611 is perpendicular to the second thermally conductive wall 612 . In this way, better contact and cooperation between the first heat conducting wall 611 and the first side wall 1021 of the battery 102 and between the second heat conducting wall 612 and the second side wall 1022 of the battery 102 can be achieved, and the first heat conducting body 61 can be enlarged. Contact area with battery 102 .
  • the included angle between the first heat-conducting wall 611 and the second heat-conducting wall 612 may also be an acute angle or an obtuse angle, as long as the first heat-conducting wall 611 can be thermally connected to the first side wall 1021 of the battery 102, the first heat-conducting wall 611 can The two thermally conductive walls 612 may be thermally connected to the second side wall 1022 of the battery 102 .
  • the first thermally conductive wall 611 is thermally connected to the second thermally conductive wall 612 .
  • the heat of the second heat-conducting wall 612 can be conducted to the first heat-conducting wall 611 . Therefore, the heat on the battery 102 can be dissipated through the second heat conduction wall 612 , the first heat conduction wall 611 and the first heat dissipation opening 15 , thereby improving the heat dissipation capability and heat dissipation efficiency of the battery 102 .
  • first heat-conducting wall 611 and the second heat-conducting wall 612 are integral structures.
  • first thermally conductive wall 611 may also be mechanically connected and thermally connected to the second thermally conductive wall 612 through thermally conductive connectors.
  • the thermally conductive connector may be a thermally conductive adhesive layer or the like.
  • the dimension of the first thermally conductive wall 611 along the first direction is larger than the dimension of the second thermally conductive wall 612 along the second direction, and the first direction intersects the second direction.
  • the first direction is shown as the X direction in FIG. 13
  • the second direction is shown as the Y direction in FIG. 13 .
  • At least part of the first heat conducting wall 611 is disposed opposite to the first heat dissipation opening 15 .
  • the area of the first heat-conducting wall 611 is larger than the area of the first heat-dissipating opening 15 , and the first heat-conducting wall 611 is opposite to the first heat-dissipating opening 15 .
  • the structure of the second thermal conductor 62 is the same as that of the first thermal conductor 61 . In other embodiments, the structure of the second thermal conductor 62 may also be different from that of the first thermal conductor 61 .
  • the first thermal conductor 61 is in thermally conductive contact with the second thermal conductor 62 .
  • the heat of the battery 102 can be dissipated through the first heat conductor 61 and the first heat dissipation opening 15 .
  • the heat of the battery 102 can also be dissipated through the second heat conductor 62 , the first heat conductor 61 and the first heat dissipation opening 15 .
  • the heat of the battery 102 can also be dissipated through the second heat conductor 62 and the second heat dissipation opening 17 .
  • the heat of the battery 102 can be dissipated through the first heat conductor 61 , the second heat conductor 62 and the second heat dissipation opening 17 .
  • the second thermal conductor 62 includes a third thermal conduction wall 621 and a fourth thermal conduction wall 622 .
  • the third thermally conductive wall 621 is thermally connected to the third side wall 1023 of the battery 102 .
  • the fourth heat-conducting wall 622 is connected to the third heat-conducting wall 621 .
  • the fourth thermally conductive wall 622 is thermally connected to the fourth side wall 1024 of the battery 102 .
  • the third heat conducting wall 621 is sandwiched between the casing 13 and the third side wall 1023 of the battery 102 , and the third heat conducting wall 621 is in thermal contact with the third side wall 1023 of the battery 102 .
  • the fourth heat-conducting wall 622 is sandwiched between the casing 13 and the fourth side wall 1024 of the battery 102 , and the fourth heat-conducting wall 622 is in thermal contact with the fourth side wall 1024 of the battery 102 , thereby accelerating the heat dissipation of the battery 102 .
  • the dimension of the third thermally conductive wall 621 along the first direction is larger than the dimension of the fourth thermally conductive wall 622 along the second direction.
  • the first direction intersects the second direction.
  • the first direction is shown as the X direction in FIG. 13
  • the second direction is shown as the Y direction in FIG. 13 .
  • At least part of the third heat conducting wall 621 is disposed opposite to the second heat dissipation opening 17 .
  • the area of the third heat-conducting wall 621 is larger than that of the second heat-dissipating opening 17 , and the third heat-conducting wall 621 is opposite to the second heat-dissipating opening 17 .
  • the first thermally conductive wall 611 is disposed opposite to the third thermally conductive wall 621 .
  • the first thermally conductive wall 611 is parallel to the third thermally conductive wall 621 .
  • the second thermally conductive wall 612 is disposed opposite to the fourth thermally conductive wall 622 .
  • the second thermally conductive wall 612 is parallel to the fourth thermally conductive wall 622 .
  • a side of the first thermally conductive wall 611 away from the second thermally conductive wall 612 is disposed adjacent to a side of the fourth thermally conductive wall 622 away from the third thermally conductive wall 621 .
  • the side of the first thermally conductive wall 611 away from the second thermally conductive wall 612 is in contact with the side of the fourth thermally conductive wall 622 away from the third thermally conductive wall 621 .
  • the side of the first thermally conductive wall 611 away from the second thermally conductive wall 612 is adjacent to and not in contact with the side of the fourth thermally conductive wall 622 away from the third thermally conductive wall 621 .
  • the circuit board assembly 101 further includes a first sealing member 71 .
  • the first sealing member 71 is disposed at the first heat dissipation opening 15 .
  • the first sealing member 71 can prevent liquid from entering the receiving cavity 16 through the first heat dissipation opening 15 , so that the circuit board assembly 101 can achieve both heat dissipation performance and waterproof performance.
  • the first sealing member 71 is disposed between the heat conducting member 60 and the housing 10 .
  • the heat conducting member 60 and the housing 10 are respectively abutted on opposite sides of the first sealing member 71 .
  • the heat-conducting member 60 is hermetically connected to the first sealing member 71
  • the heat-conducting member 60 is hermetically connected to the housing 10 .
  • the shape of the first seal 71 is adapted to the shape of the first heat dissipation opening 15 .
  • the first sealing member 71 is annular.
  • the first sealing member 71 is disposed around the periphery of the first heat dissipation opening 15 .
  • the first sealing member 71 is annular, and the annular size of the first sealing member 71 is larger than the diameter of the first heat dissipation opening 15 to ensure that the first sealing member 71 can prevent liquid from entering the receiving cavity through the first heat dissipation opening 15 within 16.
  • the first sealing member 71 includes at least one of a sealant layer, a sealant ring, and the like.
  • the housing 13 is provided with a glue groove, and at least part of the first sealing member 71 is disposed in the glue groove.
  • the housing 10 is further provided with a second heat dissipation opening 17 communicating with the receiving cavity 16 .
  • the circuit board assembly 101 further includes a second sealing member 72 disposed at the second heat dissipation opening 17 .
  • the second sealing member 72 is used to prevent liquid from entering the receiving cavity 16 through the second heat dissipation opening 17 , so as to meet the waterproof requirement of the circuit board assembly 101 .
  • the structure of the second sealing member 72 is the same as that of the first sealing member 71 . In other embodiments, the structure of the second sealing member 72 is different from that of the first sealing member 71 .
  • the vertical in the embodiment of the present application includes the case where the included angle between the two is 90 degrees or approximately 90 degrees.
  • the parallel in the embodiment of the present application includes the case where the included angle between the two is 0 degrees or approximately 0 degrees.
  • an embodiment of the present application further provides a circuit board assembly 101 , which includes a casing 10 and a circuit board 20 .
  • the circuit board 20 is arranged in the casing 10 .
  • the circuit board 20 includes opposing first surfaces 21 and second surfaces 22 . At least one of the first surface 21 and the second surface 22 is provided with components.
  • the casing 10 is provided with an enclosure structure 40 , and the circuit board 20 cooperates with the enclosure structure 40 to form a sealed space 113 .
  • the first surface 21 of the circuit board 20 is located in the sealed space 113 .
  • the circuit board 20 cooperates with the enclosure structure 40 to form a sealed space 113, thereby realizing the sealing of the first surface 21 of the circuit board 20, thereby preventing liquids such as dust or pesticides from entering the sealed space 113.
  • the first surface 21 of the circuit board 20 is corroded, thereby protecting the first surface 21 of the circuit board 20 to prevent the first surface 21 of the circuit board 20 from being damaged by moisture, thereby effectively protecting the circuit board 20 and enhancing the circuit board 20
  • the reliability of the circuit board assembly 101 is reduced, and the maintenance cost of the circuit board assembly 101 is reduced.
  • the first surface 21 of the circuit board 20 in the embodiment of the present application is located in the sealing space 113 , there is no need to provide additional potting glue to seal the first surface 21 , thereby reducing the weight of the circuit board assembly 101 , which is beneficial to the lightening of the electronic device 1000 including the circuit board assembly 101 .
  • the circuit board assembly 101 includes the circuit board assembly 101 in any one of the above embodiments.
  • an embodiment of the present application further provides a battery kit 100 including a circuit board assembly 101 and a battery 102 .
  • the battery 102 is provided in the casing 10 .
  • the battery 102 is provided in the casing 13 .
  • the circuit board assembly 101 includes the circuit board assembly 101 in any one of the above embodiments.
  • the battery 102 is electrically connected to the circuit board 20 .
  • the battery 102 includes a plurality of cells.
  • the plurality of cells may be connected in parallel, may also be connected in series, and may also be connected in multiple serials and parallels.
  • an embodiment of the present application provides an electronic device 1000 including a body 200 and a battery pack 100 .
  • the battery pack 100 is installed on the body 200 .
  • the battery pack 100 includes the battery pack 100 in any one of the above embodiments.
  • the electronic device 1000 includes at least one of the following: an unmanned aerial vehicle, an unmanned vehicle, an unmanned boat, a robot, a gimbal, and the like.
  • the electronic device 1000 Take the electronic device 1000 as an example of a plant protection drone. Since the battery 102 of the plant protection drone is generally discharged at a high rate, the battery cell will generate a lot of heat when the battery 102 is discharged, and the temperature rise of the battery cell will be very high, and the battery cell will shorten the service life when it works under high temperature conditions for a long time . Therefore, the heat generated by the cell needs to be dissipated in time. In addition, most of the plant protection drones work in humid and watery environments, so the battery 102 needs to have high waterproof performance.
  • the present application provides a battery kit 100 , which includes a housing 10 , a battery 102 , a heat conducting member 60 and a first sealing member 71 .
  • the housing 10 includes a first heat dissipation opening 15 .
  • the housing 10 is formed with a receiving cavity 16 .
  • the first heat dissipation opening 15 communicates with the receiving cavity 16 .
  • the battery 102 is located in the receiving cavity 16 .
  • the heat conducting member 60 is disposed between the casing 10 and the battery 102 .
  • the heat on the battery 102 can be conducted to the heat conducting member 60 and dissipated through the first heat dissipation opening 15 .
  • the battery kit 100 further includes a first sealing member 71 disposed at the first heat dissipation opening 15 to prevent liquid from entering the receiving cavity 16 through the first heat dissipation opening 15 .
  • the heat of the battery 102 can be dissipated through the heat conducting member 60 and the first heat dissipation opening 15 , thereby improving the heat dissipation efficiency of the battery 102 .
  • the first sealing member 71 can prevent liquid from entering the receiving cavity 16 through the first heat dissipation opening 15 , so as to take into account the heat dissipation performance and the waterproof performance of the circuit board assembly 101 .
  • the battery kit 100 may refer to the circuit board assembly 101 of any of the above embodiments.
  • the thermally conductive member 60 is in thermally conductive contact with the battery 102 .
  • the thermally conductive member 60 is in surface contact with the battery 102 .
  • the thermally conductive members 60 are disposed around the sides of the battery 102 .
  • At least part of the heat conducting member 60 is disposed opposite to the first heat dissipation opening 15 .
  • the portion of the heat conducting member 60 opposite to the first heat dissipation opening 15 is exposed to the air.
  • the thermally conductive member 60 includes a first thermally conductive body 61 and a second thermally conductive body 62 .
  • the first thermal conductor 61 has thermal conductivity; at least part of the first thermal conductor 61 is arranged corresponding to the first heat dissipation opening 15; the second thermal conductor 62 has thermal conductivity; the first thermal conductor 61 and the second thermal conductor 62 are respectively in contact with each other. Different parts of the battery 102 .
  • the first thermal conductor 61 cooperates with the second thermal conductor 62 to form a hollow space 63 , and at least part of the battery 102 is located in the hollow space 63 .
  • the hollow space 63 includes an annular space.
  • the first thermal conductor 61 and the second thermal conductor 62 are provided separately.
  • the housing 10 further includes a second heat dissipation opening 17 that communicates with the receiving cavity 16 , at least part of the second heat conductor 62 is disposed corresponding to the second heat dissipation opening 17 , and the heat on the battery 102 can be conducted to the second heat dissipation on the body 62 and dissipated through the second heat dissipation opening 17 .
  • the first heat dissipation opening 15 is disposed opposite to the second heat dissipation opening 17 .
  • the first heat conducting body 61 includes: a first heat conducting wall 611 thermally connected to the first side wall 1021 of the battery 102 ; a second heat conducting wall 612 connected to the first heat conducting wall 611 and connected to the battery 102 The second sidewall 1022 of the thermally conductive connection.
  • the first thermally conductive wall 611 intersects the second thermally conductive wall 612 .
  • the first thermally conductive wall 611 is perpendicular to the second thermally conductive wall 612 .
  • the first thermally conductive wall 611 is thermally connected to the second thermally conductive wall 612 .
  • the first heat-conducting wall 611 and the second heat-conducting wall 612 are integral structures.
  • the dimension of the first thermally conductive wall 611 along the first direction is larger than the dimension of the second thermally conductive wall 612 along the second direction, and the first direction intersects the second direction.
  • At least part of the first heat conducting wall 611 is disposed opposite to the first heat dissipation opening 15 .
  • the structure of the second thermal conductor 62 is the same as that of the first thermal conductor 61 .
  • the first thermal conductor 61 is in thermally conductive contact with the second thermal conductor 62 .
  • the second heat conducting body 62 includes: a third heat conducting wall 621 thermally connected to the third side wall 1023 of the battery 102 ; a fourth heat conducting wall 622 connected to the third heat conducting wall 621 and connected to the battery 102 The fourth sidewall 1024 of the thermally conductive connection.
  • the dimension of the third thermally conductive wall 621 along the first direction is larger than the dimension of the fourth thermally conductive wall 622 along the second direction, the first direction intersecting the second direction.
  • At least part of the third heat conducting wall 621 is disposed opposite to the second heat dissipation opening 17 .
  • the first thermally conductive wall 611 is disposed opposite to the third thermally conductive wall 621 .
  • the first thermally conductive wall 611 is parallel to the third thermally conductive wall 621 .
  • the second thermally conductive wall 612 is disposed opposite to the fourth thermally conductive wall 622 .
  • the second thermally conductive wall 612 is parallel to the fourth thermally conductive wall 622 .
  • a side of the first thermally conductive wall 611 away from the second thermally conductive wall 612 is disposed adjacent to a side of the fourth thermally conductive wall 622 away from the third thermally conductive wall 621 .
  • the battery pack 100 further includes a second sealing member 72 disposed at the second heat dissipation opening 17 for preventing liquid from entering the receiving cavity 16 through the second heat dissipation opening 17 .
  • the structure of the second sealing member 72 is the same as that of the first sealing member 71 .
  • the first sealing member 71 is provided between the heat conducting member 60 and the housing 10 .
  • the shape of the first seal 71 is adapted to the shape of the first heat dissipation opening 15 .
  • the first sealing member 71 is disposed around the periphery of the first heat dissipation opening 15 .
  • the first sealing member 71 is annular, and the annular size of the first sealing member 71 is larger than the diameter of the first heat dissipation opening 15 .
  • the first sealing member 71 includes: a sealant layer and a sealant ring.
  • the housing 10 includes: a housing 13 , a receiving cavity 16 and a first heat dissipation opening 15 are provided on the housing 13 .
  • the housing 10 further includes: a cover 12 connected to the housing 13 .
  • a circuit board 20 disposed in the housing 10 is further included, the circuit board 20 includes opposite first surfaces 21 and second surfaces 22, at least one of the first surfaces 21 and the second surfaces 22 is provided with Components; the casing 10 is provided with an enclosure structure 40 , and the enclosure structure 40 cooperates with the circuit board 20 to form a sealed space 113 ; the first surface 21 of the circuit board 20 is located in the sealed space 113 .
  • one of the first surface 21 and the second surface 22 is provided with components, and the other of the first surface 21 and the second surface 22 is not provided with components.
  • both the first surface 21 and the second surface 22 are provided with components.
  • the circuit board 20 is hermetically connected to the enclosure structure 40 .
  • the circuit board 20 is detachably connected to the enclosure structure 40 .
  • the enclosure structure 40 includes: an enclosure wall 41 ; a bearing portion 42 protruding from the enclosure wall 41 , the circuit board 20 is supported on the bearing portion 42 , the bearing portion 42 , the enclosure wall 41 and the circuit The plates 20 cooperate to form a sealed space 113 .
  • the bearing portion 42 cooperates with the enclosing wall 41 to form an annular groove 43
  • the annular groove 43 cooperates with the circuit board 20 to form a sealed space 113 .
  • the circuit board 20 further includes a side wall portion 23 connected to the first surface 21 ;
  • the bearing portion 42 includes: a bearing body 421 protruding from the enclosing wall 41 ; a rib 422 , arranged on the bearing body 421
  • One end away from the enclosing wall 41 cooperates with the carrier 421 to form a step 423 , the first surface 21 of the circuit board 20 is mounted on the first step surface 4231 of the step 423 , the side wall 23 of the circuit board 20 and the first step 423
  • the two stepped surfaces 4232 are arranged opposite to each other.
  • the first surface 21 of the circuit board 20 is hermetically connected to the first stepped surface 4231 .
  • the first surface 21 of the circuit board 20 is in contact with the first stepped surface 4231 .
  • the side wall portion 23 of the circuit board 20 is hermetically connected to the second stepped surface 4232 .
  • the sidewall portion 23 of the circuit board 20 is in contact with the second stepped surface 4232 .
  • the first stepped surface 4231 is perpendicular to the second stepped surface 4232 .
  • the distance between the first stepped surface 4231 and the enclosing wall 41 is greater than or equal to the maximum protruding dimension of the components on the first surface 21 .
  • the rib 422 is protruded from one end of the carrier 421 away from the enclosing wall 41 .
  • the protruding direction of the ribs 422 is the same as the protruding direction of the carrier 421 .
  • one end of the rib 422 away from the enclosing wall 41 has a first preset distance from the enclosing wall 41 , there is a second preset distance between the first surface 21 and the enclosing wall 41 , and the first The preset distance is greater than the second preset distance.
  • the difference between the first preset distance and the third preset distance is 1.5mm-2.5mm.
  • the housing 10 is provided with a fixing portion 14 for connecting with the circuit board 20 .
  • the fixing portion 14 is protruded from the enclosing wall 41 .
  • the number of the fixing parts 14 is multiple, and at least part of the multiple fixing parts 14 is connected to the bearing part 42 .
  • the circuit board 20 is detachably connected to the fixing portion 14 through the locking member 50 .
  • the end of the fixing portion 14 facing the circuit board 20 is flush with the first stepped surface 4231 of the bearing portion 42 ; or, the end of the fixing portion 14 facing the circuit board 20 is lower than the first stepped surface 4231 of the bearing portion 42 . .
  • the housing 10 is formed with a receiving space 11
  • the circuit board 20 cooperates with the enclosure structure 40 to divide the receiving space 11 into the first subspace 111 and the sealing space 113 , the second surface 22 and the guard 30 . is located in the first subspace 111 .
  • the battery kit 100 further includes: a protective member 30 located in the first subspace 111 for sealing at least a partial area of the second surface 22 .
  • guard 30 covers second surface 22 and/or components of second surface 22 .
  • the guard 30 includes: a potting glue layer.
  • the second surface 22 is provided with components, and at least a part of the area includes the area on the second surface 22 where the components are located.
  • the housing 10 includes a cover body 12 , and the circuit board 20 and the enclosure structure 40 are disposed on the cover body 12 .
  • the enclosure structure 40 is integral with other parts of the cover body 12 .
  • the housing 10 further includes: a housing 13 that cooperates with the cover 12 to form a receiving space 11 .
  • an embodiment of the present application further provides an electronic device 1000 , which includes a body 200 and the battery kit 100 of any one of the foregoing embodiments.
  • the battery pack 100 is installed on the body 200 .
  • the electronic device 1000 includes at least one of the following: an unmanned aerial vehicle, an unmanned vehicle, an unmanned boat, a robot, or a PTZ.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

一种电路板组件(101)、电池套件(100)及电子设备(1000)，电路板组件(101)包括壳体(10)、电路板(20)和防护件(30)；电路板(20)设于壳体(10)的收容空间(11)内，电路板(20)的第一表面(21)和第二表面(22)中的至少一个设有元器件；防护件(30)用于对第二表面(22)的至少部分区域进行密封；壳体(10)上设有围挡结构(40)，电路板(20)与围挡结构(40)配合以将收容空间(11)分隔为第一子空间(111)和第二子空间(112)，以使第二子空间(112)为密封空间；第二表面(22)和防护件(30)位于第一子空间(111)内；第一表面(21)位于第二子空间(112)内。

Description

电路板组件、电池套件及电子设备 技术领域
本申请涉及电子设备技术领域，尤其涉及一种电路板组件、电池套件及电子设备。
背景技术
无人机等电动设备的应用日益广泛，电动设备的本体上均需要设置电池，从而为电动设备供电。电池通常包括壳体和设于壳体内的电路板。然而，现有的电动设备的电池，当在户外使用该电动设备时，如果放置电池的部位被水溅到或被雨淋，很容易进水，进而会导致电路板进水或受潮，从而造成电池的损坏，影响电动设备的正常使用。
发明内容
本申请提供了一种电路板组件、电池套件及电子设备，旨在对电路板的双面密封，防止电路板受潮而损坏。
第一方面，本申请实施例提供了一种电路板组件，包括：
壳体，形成有收容空间；
电路板，设于所述收容空间内，包括相对的第一表面和第二表面，所述第一表面和所述第二表面中的至少一个设有元器件；
防护件，用于对所述第二表面的至少部分区域进行密封；
其中，所述壳体上设有围挡结构，所述电路板与所述围挡结构配合以将所述收容空间分隔为第一子空间和第二子空间，以使所述第二子空间为密封空间；所述第二表面和所述防护件位于所述第一子空间内；所述第一表面位于所述第二子空间内。
第二方面，本申请实施例提供了一种电路板组件，包括：
壳体；
电路板，设于所述壳体内，包括相对的第一表面和第二表面，所述第一表面和所述第二表面中的至少一个设有元器件；
其中，所述壳体上设有围挡结构，所述电路板与所述围挡结构配合形成密封空间；所述电路板的第一表面位于所述密封空间内。
第三方面，本申请实施例提供了一种电池套件，包括：
本申请实施例第一方面或者第二方面的电路板组件；以及
电池，设于所述壳体内。
第四方面，本申请实施例提供了一种电子设备，包括：
机体；
本申请实施例第三方面的电池套件，设于所述机体上。
第五方面，本申请实施例提供了一种电池套件，包括：
壳体，包括第一散热开口，所述壳体形成有收容腔，所述第一散热开口与所述收容腔相连通；
电池，位于所述收容腔内；
导热件，设于所述壳体与所述电池之间；所述电池上的热量能够传导至所述导热件上并经所述第一散热开口散出；
其中，所述电池套件还包括设于所述第一散热开口处的第一密封件，用于防止液体经所述第一散热开口进入所述收容腔内。
第六方面，本申请实施例提供了一种电子设备，包括：
机体；
本申请第五方面的电池套件，设于所述机体上。
本申请实施例提供了一种电路板组件、电池套件及电子设备，通过防护件以及电路板与所述围挡结构配合形成的密封空间实现了对电路板的双面密封，防止电路板受潮而损坏，从而有效保护电路板、增强电路板的可靠性，降低了电路板组件的维修成本。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本申请实施例的公开内容。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种电路板组件的结构示意图；
图2是本申请实施例提供的一种电路板组件一角度的结构示意图；
图3是本申请实施例提供的一种电路板组件另一角度的结构示意图；
图4是本申请实施例提供的一种电路板组件的分解示意图；
图5是本申请实施例提供的一种电路板组件的剖视图；
图6是图5在A处的局部放大示意图；
图7是本申请实施例提供的一种电路板组件的部分结构示意图；
图8是图7在B处的局部放大示意图；
图9是本申请实施例提供的一种电路板组件的部分结构示意图；
图10是本申请实施例提供的一种电路板组件的结构示意图；
图11是本申请实施例提供的一种电池的结构示意图；
图12是本申请实施例提供的一种电路板组件的部分结构示意图；
图13是本申请实施例提供的一种导热件的结构示意图；
图14是本申请实施例提供的一种电子设备的结构示意图；
图15是本申请实施例提供的一种电子设备的结构示意图。
附图标记说明：
1000、电子设备；
100、电池套件；101、电路板组件；102、电池；1021、第一侧壁；1022、第二侧壁；1023、第三侧壁；1024、第四侧壁；
10、壳体；11、收容空间；111、第一子空间；112、第二子空间；113、密封空间；12、盖体；13、外壳；14、固定部；15、第一散热开口；16、收容腔；17、第二散热开口；
20、电路板；21、第一表面；22、第二表面；23、侧壁部；24、螺孔；
30、防护件；
40、围挡结构；41、围合壁；42、承载部；421、承载体；422、挡边；423、台阶；4231、第一台阶面；4232、第二台阶面；43、环形凹槽；
50、锁固件；
60、导热件；61、第一导热体；611、第一导热壁；612、第二导热壁；62、第二导热体；621、第三导热壁；622、第四导热壁；63、中空空间；
71、第一密封件；72、第二密封件；
200、机体。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
还应当理解，在本申请说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本申请。如在本申请说明书和所附权利要求书中所使用的那样，除非上下文清楚地指明其它情况，否则单数形式的“一”、“一个”及“该”意在包括复数形式。
还应当进一步理解，在本申请说明书和所附权利要求书中使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。
植保无人机需要设置电池以为植保无人机供电。然而植保无人机的工作环境一般较潮湿且容易接触一些农药等具有腐蚀性的液体。当电池内部进入农药或其他液体时，电池的电路板或者电芯会被腐蚀，致使电池功能会失效。
基于上述考虑，发明人提出了一种电路板组件、电池套件及电子设备，旨在对电路板的双面密封，防止电路板受潮而损坏。
下面结合附图，对本申请的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1至图6，本申请实施例提供的一种电路板组件101，包括壳体10、电路板20和防护件30。壳体10形成有收容空间11。电路板20设于收容空间11内。电路板20包括相对的第一表面21和第二表面22。第一表面21和第二表面22中的至少一个设有元器件。防护件30用于对第二表面22的至少部 分区域进行密封。
其中，壳体10上设有围挡结构40，电路板20与围挡结构40配合以将收容空间11分隔为第一子空间111和第二子空间112，从而使第二子空间112为密封空间113。第二表面22和防护件30位于第一子空间111内。第一表面21位于第二子空间112内。
上述实施例的电路板组件101，电路板20与围挡结构40配合形成密封空间113，由此实现对电路板20的第一表面21进行密封，从而防止粉尘或者农药等液体进入第二子空间112而腐蚀电路板20的第一表面21，进而对电路板20的第一表面21起到防护的作用。此外，与在电路板20的第一表面21所在侧进行灌胶而对电路板20的第一表面21进行密封相比，本申请实施例的电路板20的第一表面21位于密封空间113内，无需额外设置灌封胶对第一表面21进行密封，由此减轻了电路板组件101的重量，有利于包括电路板组件101的电子设备1000的轻量化。可以理解，这种密封防水方式可以应用在多个区域，对不同的电路板进行模块化密封，从而可以针对不同电路板的器件分布情况，适应性的采用不同形状的围挡结构，节约物料，优化空间布局。
另外，防护件30能够对电路板20的第二表面22的至少部分区域进行密封，从而防止粉尘或者农药等液体到达电路板20的第二表面22的至少部分区域，进而对电路板20的第二表面22的至少部分区域起到防护的作用。因而，电路板组件101通过防护件30以及电路板20与围挡结构40配合形成的密封空间113实现了对电路板20的双面密封，防止电路板20受潮而损坏，从而有效保护电路板20、增强电路板20的可靠性，降低了电路板组件101的维修成本。
在一些实施例中，第一表面21和第二表面22中的其中一者设有元器件，第一表面21和第二表面22中的另一者未设元器件。比如，第一表面21设有元器件，第二表面22未设元器件。又如，第二表面22设有元器件，第一表面21未设元器件。
在一些实施例中，第一表面21和第二表面22均设有元器件。
可以理解地，第一表面21和/或第二表面22上设置的元器件，其种类、数量可以根据实际需求进行设计，在此不作限制。
在一些实施例中，电路板20与围挡结构40密封连接，从而使得第二子空间112为密封空间113。比如，电路板20与围挡结构40贴合密封。又如，电 路板20与围挡结构40的连接处设有密封胶层等密封件实现二者密封连接。
在一些实施例中，电路板20与围挡结构40可拆卸连接。具体地，电路板20与围挡结构40卡合固定连接或者螺丝锁固连接等。
在一些实施例中，第二表面22设有元器件。至少部分区域包括第二表面22上的元器件所在的区域。可以理解地，至少部分区域可以是第二表面22的所有区域，也可以是第二表面22上的元器件所在的区域。
在一些实施例中，防护件30覆盖第二表面22和/或第二表面22的元器件。比如，第二表面22未设元器件时，防护件30可以覆盖至少部分第二表面22。又如，第二表面22设有元器件时，防护件30覆盖至少部分第二表面22和第二表面22的元器件，从而对电路板20的第二表面22进行防护。
在一些实施例中，防护件30包括：灌封胶层。具体地，在电路板20与围挡结构40固定后，可以在电路板20的第二表面22涂布一层灌封胶，该灌封胶固化后形成防护件30，从而对电路板20的第二表面22的元器件进行防护。
请参阅图1、图6、图7和图8，在一些实施例中，围挡结构40包括围合壁41和承载部42。承载部42凸设于围合壁41上。电路板20承载于承载部42上。承载部42、围合壁41和电路板20配合形成第二子空间112。示例性地，电路板20的第一表面21设有元器件，电路板20的第一表面21与围合壁41间隔预设距离。该预设距离大于或者等于第一表面21的元器件的最大凸出尺寸。
请参阅图8，在一些实施例中，承载部42与围合壁41配合形成环形凹槽43。环形凹槽43与电路板20配合形成第二子空间112。具体地，围合壁41和承载部42分别为环形凹槽43的槽底壁和槽侧壁。电路板20的第一表面21封堵环形凹槽43的开口，从而形成密闭的第二子空间112。
示例性地，承载部42与围合壁41通过一体成型加工制得。
请参阅图1和图6，在一些实施例中，电路板20还包括连接于第一表面21和第二表面22的侧壁部23。承载部42包括承载体421和挡边422。承载体421凸设于围合壁41上。挡边422设于承载体421远离围合壁41的一端。挡边422与承载体421配合形成台阶423。电路板20的第一表面21搭载于台阶423的第一台阶面4231上。电路板20的侧壁部23与台阶423的第二台阶面4232相对设置。
具体地，当电路板20与围挡结构40固定连接后，在电路板20的第二表面22涂布灌封胶，该灌封胶固化后形成防护件30。在涂布灌封胶的过程中，挡边422能够防止灌封胶溢出，保证第二表面22的元器件均能够被防护件30覆盖。此外，在一些实施方式中，灌封胶固化形成防护件30后，防护件30能够防止第一子空间111处的液体和/或固体经电路板20与围挡结构40之间的间隙进入第二子空间112。
请参阅图1和图6，在一些实施例中，电路板20的第一表面21与第一台阶面4231密封连接，以使得第二子空间112为密封空间113，避免液体或者粉尘经第一表面21和第一台阶面4231之间的间隙进入第二子空间112而腐蚀第一表面21或者第一表面21的元器件。第一台阶面4231的形状与第一表面21的边缘适配。示例性地，电路板20的第一表面21与第一台阶面4231平行或者大致平行。
请参阅图1和图6，在一些实施方式中，电路板20的第一表面21与第一台阶面4231贴合，从而实现电路板20的第一表面21与第一台阶面4231的密封连接。可以理解地，电路板20的第一表面21与第一台阶面4231可以面贴合，也可以线贴合。
在其他实施方式中，电路板20的第一表面21与第一台阶面4231的连接处也可以设置密封圈，从而实现电路板20的第一表面21与第一台阶面4231的密封连接。
请参阅图1和图6，在一些实施例中，电路板20的侧壁部23与第二台阶面4232密封连接，以保证液体或者粉尘不会经侧壁部23与第二台阶面4232之间的间隙进入第二子空间112而腐蚀第一表面21或者第一表面21的元器件。第二台阶面4232的形状与电路板20的侧壁部23的形状适配。示例性地，电路板20的侧壁部23与第二台阶面4232平行或者大致平行。
请参阅图1和图6，在一些实施例中，电路板20的侧壁部23与第二台阶面4232贴合。侧壁部23与第二台阶面4232可以面贴合，也可以线贴合。
请参阅图1和图6，在一些实施例中，第一台阶面4231与第二台阶面4232垂直。在其他实施例中第一台阶面4231与第二台阶面4232也可以为锐角或者钝角，只要电路板20与围挡结构40配合形成的第二子空间112为密封空间113即可。
请参阅图6，在一些实施例中，第一台阶面4231与围合壁41之间的距离大于或者等于第一表面21的元器件的最大凸出尺寸。如此，既能够保证电路板20与围挡结构40配合所形成的第二子空间112为密封空间113，又不会损坏第一表面21的元器件。
请参阅图1和图6，在一些实施例中，挡边422凸设于承载体421远离围合壁41的一端。具体地，承载体421凸设于围合壁41的周缘。挡边422和围合壁41分别设于承载体421的相对两端，且挡边422凸设在承载体421上。
示例性地，挡边422的凸设方向与承载体421的凸设方向相同。
请参阅图1、图6和图9，在一些实施例中，挡边422远离围合壁41的一端与围合壁41之间具有第一预设距离。第一表面21与围合壁41之间具有第二预设距离，第一预设距离大于第二预设距离。如此，挡边422与承载体421能够形成台阶423。示例性地，请参阅图9，第一预设距离为d1，第二预设距离为d2，d1大于d2。
请参阅图1、图6和图9，在一些实施例中，第二表面22与围合壁41之间具有第三预设距离，第一预设距离大于第三预设距离。如此，当电路板20与围挡结构40固定连接后，在电路板20的第二表面22涂布灌封胶的过程中，由于第一预设距离大于第三预设距离，因而挡边422能够防止灌封胶溢出，保证了第二表面22的元器件均能够被灌封胶覆盖。
示例性地，请参阅图9，第一预设距离为d1，第三预设距离为d3，d1大于d3。
可以理解地，第一预设距离d1与第三预设距离d3之差太小，灌封胶层形成防护件30后，防护件30不能完全覆盖电路板20的第二表面22的元器件。第一预设距离d1与第三预设距离d3之差太大，一方面灌封胶层形成防护件30后，防护件30的厚度会比较厚而加重电路板组件101的重量，另一方面挡边422本身的尺寸增大也会加重电路板组件101的重量，不利于电子设备1000的轻量化。
在一些实施例中，第一预设距离与第三预设距离之差为1.5mm-2.5mm。具体地，第一预设距离与第三预设距离之差可以为1.5mm、2mm、2.5mm以及1.5mm-2.5mm之间的任意其他合适数值。如此，既能够保证电路板20的第二表面22的元器件均能够被防护件30覆盖，又能够避免由于第一预设距离与第三 预设距离之差过大而加重电路板组件101的重量，从而便于实现电子设备1000的轻量化。示例性地，请参阅图9，第一预设距离d1减去第三预设距离d3，所得的差值的范围在1.5mm-2.5mm之间。
请参阅图7和图8，在一些实施例中，壳体10上设有用于与电路板20连接的固定部14。固定部14凸设于围合壁41上。具体地，固定部14与围合壁41为一体结构。
固定部14的数量可以根据实际需求进行设计，比如为一个或者多个。请参阅图7，固定部14的数量为多个。多个固定部14中的至少部分与承载部42连接。比如，固定部14的数量为n个，其中m个固定部14与承载体421连接。n大于或者等于m，n、m均为正整数。
在一些实施例，电路板20通过锁固件50与固定部14可拆卸连接。锁固件50为螺丝等快拆件。具体地，请参阅图4和图8，固定部14为螺柱，电路板20上形成有螺孔24，锁固件50穿设螺孔24和螺柱，从而实现电路板20与围挡结构40的固定连接。
在其他实施例中，固定部14也可以是卡合结构等其他可拆卸连接结构。
在一些实施例中，固定部14朝向电路板20的一端与承载部42的第一台阶面4231平齐。固定部14朝向电路板20的一端低于承载部42的第一台阶面4231。如此，电路板20固定于围挡结构40上后电路板20与围挡结构40配合能够形成密封空间113。
请参阅图1、图3、图4和图10，在一些实施例中，壳体10包括盖体12。电路板20和围挡结构40设于盖体12上。围挡结构40与盖体12的其他部位为一体结构。具体地，围挡结构40可以看作盖体12的一部分，围挡结构40与盖体12的其他部位通过一体成型加工制得。电路板20与盖体12可拆卸连接。
请参阅图1、图10和图11，在一些实施例中，壳体10还包括外壳13。外壳13与盖体12配合形成收容空间11。外壳13用于容置电池102，该电池102与电路板20电连接。电池102包括多个电芯。该多个电芯可以并联，也可以串联，还可以多串并。
以电子设备1000为植保无人机为例。由于植保无人机的电池102一般都是高倍率放电，所以电池102放电时电芯会产生很多热量，电芯的温升会很高，电芯长时间在高温条件下工作时会缩短使用寿命。因而电芯工作时所产生的热 量需要及时散出。另一方面，植保无人机工作时多为潮湿多水的环境，因而电池102需要有较高的防水性能。
为了将电池102的热量及时散出，请参阅图11和图12，在一些实施例中，壳体10包括第一散热开口15。壳体10形成有用于收容电池102的收容腔16。第一散热开口15与收容腔16连通。电路板组件101还包括导热件60。导热件60设于壳体10与电池102之间。电池102上的热量能够传导至导热件60上并经第一散热开口15散出。
上述实施例的电路板组件101，电池102所产生的热量能够传导至导热件60。导热件60上的热量能够经第一散热开口15散出。因而与未设置第一散热开口15相比，本申请实施例的电路板组件101，电池102工作时产生的热量能够经导热件60和第一散热开口15及时散出，提高电池102的散热效率，满足电池102的散热需求。
具体地，收容腔16和第一散热开口15设于外壳13上。
在一些实施例中，外壳13具有导热性。收容腔16的热量或者导热件60的热量能够传导至外壳13上而散出。
示例性地，外壳13为塑胶件，以减轻电路板组件101的重量，降低电路板组件101的成本。
第一散热开口15的数量可以根据实际需求进行设计，比如为一个或者多个。示例性地，第一散热开口15的数量为一个。
请参阅图10，示例性地，第一散热开口15的数量为多个。多个第一散热开口15可以呈规则排列或者不规则排列。比如，第一散热开口15呈阵列设置。具体地，请参阅图10，第一散热开口15沿外壳13的高度方向间隔排列设置。
在一些实施例中，导热件60与电池102导热性接触。如此，电池102工作时所产生的热量能够及时传导至导热件60上。
在一些实施例中，导热件60与电池102面接触，以保证导热件60与电池102之间具有充足的导热接触面积。在其他实施例中，导热件60与电池102也可以点接触或者线接触。
请参阅图11至图13，在一些实施例中，导热件60环绕电池102的侧部设置。如此，电池102不同部位可以与导热件60进行热交换，加快电池102工作时所产生的热量传导至导热件60，提高电池102的散热效率。
请参阅图12，至少部分导热件60与第一散热开口15相对设置。如此，外壳13外部的空气能够经第一散热开口15流动至导热件60，因而导热件60能够与外壳13外部的空气接触，提高了电池102的散热能力和散热效率。
在一些实施例中，导热件60中与第一散热开口15相对设置的部位暴露于空气中。如此，导热件60中与第一散热开口15相对设置的部位能够与外壳13外部的空气接触，从而使得导热件60上的热量能够及时散出。
示例性地，导热件60夹设于外壳13和电池102之间。当然，在其他实施例中，导热件60也可以通过中间件与电池102或者外壳13固定连接。
请参阅图12和图13，在一些实施例中，导热件60包括第一导热体61和第二导热体62。第一导热体61和第二导热体62均具有导热性。至少部分第一导热体61与第一散热开口15对应设置。第一导热体61和第二导热体62分别接触于电池102的不同部位，以增大电池102与导热件60的接触面积，提高电池102的散热效率。
具体地，第一导热体61和第二导热体62均夹设于外壳13和电池102之间。
第一导热体61与第二导热体62可以接触，也可以不接触。
在其他实施例中，第一导热体61和第二导热体62也可以省略其中一者。
请参阅图12和图13，在一些实施例中，第一导热体61与第二导热体62配合形成中空空间63。至少部分电池102位于中空空间63内。
请参阅图13，在一些实施例中，中空空间63包括环形空间。环形空间可以是方形环空间或者大致为方形环空间。可以理解地，第一导热体61与第二导热体62配合可以形成闭环结构，也可以形成非闭环结构，在此不作限制。
请参阅图13，在一些实施例中，第一导热体61与第二导热体62分体设置。具体地，第一导热体61和第二导热体62为相互独立的两个部件，如此降低了导热件60的加工难度和电路板组件101的组装难度。
请参阅图12和图13，在一些实施例中，壳体10还包括与收容腔16连通的第二散热开口17。至少部分第二导热体62与第二散热开口17对应设置，电池102上的热量能够传导至第二导热体62上并经第二散热开口17散出。第二导热体62中与第二散热开口17对应设置的部位能够与外壳13外部的空气接触而散热，从而进一步提高电池102的散热效率。
具体地，至少部分第二导热体62与第二散热开口17相对设置。
在一些实施例中，第一散热开口15与第二散热开口17相对设置。在其他实施例中，第一散热开口15与第二散热开口17也可以错位设置。
第二散热开口17的数量可以根据实际需求进行设计，比如为一个或者多个。示例性地，第二散热开口17的数量为多个。多个第二散热开口17可以呈规则排列或者不规则排列。比如，第二散热开口17呈阵列设置。具体地，第二散热开口17沿外壳13的高度方向间隔排列设置。
请参阅图11，电池102包括依次连接的第一侧壁1021、第二侧壁1022、第三侧壁1023和第四侧壁1024。
请参阅图11和图13，在一些实施例中，第一导热体61包括第一导热壁611和第二导热壁612。第一导热壁611与电池102的第一侧壁1021导热性连接。第二导热壁612与第一导热壁611连接。第二导热壁612与电池102的第二侧壁1022导热性连接。
具体地，第一导热壁611夹设于外壳13和电池102的第一侧壁1021之间，且第一导热壁611与电池102的第一侧壁1021导热性接触。第二导热壁612夹设于外壳13和电池102的第二侧壁1022之间，且第二导热壁612与电池102的第二侧壁1022导热性接触，从而加快电池102热量的散出。
在一些实施例中，第一导热壁611与第二导热壁612相交，以保证第一导热壁611能够与电池102的第一侧壁1021导热性接触，且第二导热壁612能够与电池102的第二侧壁1022导热性接触。
在一些实施例中，第一导热壁611与第二导热壁612垂直。如此，能够使得第一导热壁611与电池102的第一侧壁1021之间、第二导热壁612与电池102的第二侧壁1022之间更好地接触配合，增大第一导热体61与电池102的接触面积。
在其他实施例中，第一导热壁611与第二导热壁612之间的夹角也可以为锐角或者钝角，只要第一导热壁611能够与电池102的第一侧壁1021导热性连接，第二导热壁612与电池102的第二侧壁1022导热性连接即可。
在一些实施例中，第一导热壁611与第二导热壁612导热性连接。如此，第二导热壁612的热量能够传导至第一导热壁611。因而，电池102上的热量能够经第二导热壁612、第一导热壁611和第一散热开口15散出，提高电池102的散热能力和散热效率。
在一些实施例中，第一导热壁611与第二导热壁612为一体结构。在其他实施例中，第一导热壁611也可以通过导热连接件实现与第二导热壁612的机械连接以及导热连接。导热连接件可以是导热胶层等。
在一些实施例中，第一导热壁611沿第一方向的尺寸大于第二导热壁612沿第二方向的尺寸，第一方向与第二方向相交。示例性地，第一方向如图13中X方向所示，第二方向如图13中Y方向所示。
在一些实施例中，至少部分第一导热壁611与第一散热开口15相对设置。具体地，第一导热壁611的面积大于第一散热开口15的面积，第一导热壁611与第一散热开口15相对。
请参阅图13，在一些实施例中，第二导热体62的结构与第一导热体61的结构相同。在另一些实施例中，第二导热体62的结构也可以与第一导热体61的结构不同。
在一些实施例中，第一导热体61与第二导热体62导热性接触。因而，电池102的热量能够经第一导热体61和第一散热开口15而散出。电池102的热量也能够经第二导热体62、第一导热体61和第一散热开口15而散出。当然，在一些实施方式中，电池102的热量还能够经第二导热体62和第二散热开口17而散出。且电池102的热量能够经第一导热体61、第二导热体62和第二散热开口17而散出。
请参阅图11和图13，在一些实施例中，第二导热体62包括第三导热壁621和第四导热壁622。第三导热壁621与电池102的第三侧壁1023导热性连接。第四导热壁622与第三导热壁621连接。第四导热壁622与电池102的第四侧壁1024导热性连接。
具体地，第三导热壁621夹设与外壳13与电池102的第三侧壁1023之间，且第三导热壁621与电池102的第三侧壁1023导热性接触。第四导热壁622夹设于外壳13与电池102的第四侧壁1024之间，且第四导热壁622与电池102的第四侧壁1024导热性接触，从而加快电池102热量的散出。
在一些实施例中，第三导热壁621沿第一方向的尺寸大于第四导热壁622沿第二方向的尺寸。第一方向与第二方向相交。示例性地，第一方向如图13中X方向所示，第二方向如图13中Y方向所示。
在一些实施例中，至少部分第三导热壁621与第二散热开口17相对设置。 具体地，第三导热壁621的面积大于第二散热开口17，第三导热壁621与第二散热开口17相对。
在一些实施例中，第一导热壁611与第三导热壁621相对设置。
在一些实施例中，第一导热壁611与第三导热壁621平行。
在一些实施例中，第二导热壁612与第四导热壁622相对设置。
在一些实施例中，第二导热壁612与第四导热壁622平行。
在一些实施例中，第一导热壁611远离第二导热壁612的一侧与第四导热壁622远离第三导热壁621的一侧邻近设置。比如，第一导热壁611远离第二导热壁612的一侧与第四导热壁622远离第三导热壁621的一侧接触。又如，第一导热壁611远离第二导热壁612的一侧与第四导热壁622远离第三导热壁621的一侧邻近且不接触。
请参阅图12，在一些实施例中，电路板组件101还包括第一密封件71。第一密封件71设于第一散热开口15处。第一密封件71能够防止液体经第一散热开口15进入收容腔16内，从而使得电路板组件101能够兼顾散热性能和防水性能。
请参阅图12，在一些实施例中，第一密封件71设于导热件60与壳体10之间。具体地，导热件60和壳体10分别抵接于第一密封件71的相对两侧。导热件60与第一密封件71密封连接，导热件60与壳体10密封连接。
在一些实施例中，第一密封件71的形状与第一散热开口15的形状适配。比如第一密封件71为环形。
请参阅图12，第一密封件71环设于第一散热开口15的周缘。
在一些实施例中，第一密封件71呈环形，第一密封件71的环形大小大于第一散热开口15的口径，以保证第一密封件71能够防止液体经第一散热开口15进入收容腔16内。
在一些实施例中，第一密封件71包括：密封胶层、密封胶圈等中的至少一者。
在一些实施例中，外壳13上设有胶槽，至少部分第一密封件71设于该胶槽内。
请参阅图12，在一些实施例中，壳体10上还设有与收容腔16连通的第二散热开口17。电路板组件101还包括设于第二散热开口17处的第二密封件72。 第二密封件72用于防止液体经第二散热开口17进入收容腔16内，从而满足电路板组件101的防水性要求。
在一些实施例中，第二密封件72的结构与第一密封件71的结构相同。在另一些实施例中，第二密封件72的结构与第一密封件71的结构不同。
可以理解地，本申请实施例的垂直包括两者之间的夹角为90度或者大致90度的情形。本申请实施例的平行包括两者之间的夹角为0度或者大致0度的情形。
请参阅图1至图12，本申请实施例还提供一种电路板组件101，包括壳体10和电路板20。电路板20设于壳体10内。电路板20包括相对的第一表面21和第二表面22。第一表面21和第二表面22中的至少一个设有元器件。其中，壳体10上设有围挡结构40，电路板20与围挡结构40配合形成密封空间113。电路板20的第一表面21位于密封空间113内。
上述实施例的电路板组件101，电路板20与围挡结构40配合形成密封空间113，由此实现对电路板20的第一表面21进行密封，从而防止粉尘或者农药等液体进入密封空间113而腐蚀电路板20的第一表面21，进而对电路板20的第一表面21起到防护的作用，防止电路板20的第一表面21受潮而损坏，从而有效保护电路板20、增强电路板20的可靠性，降低了电路板组件101的维修成本。此外，与在电路板20的第一表面21所在侧进行灌胶以对电路板20的第一表面21进行密封相比，本申请实施例的电路板20的第一表面21位于密封空间113内，无需额外设置灌封胶对第一表面21进行密封，由此减轻了电路板组件101的重量，有利于包括电路板组件101的电子设备1000的轻量化。
示例性地，电路板组件101包括上述任意一个实施例中的电路板组件101。
请参阅图1至图13，本申请实施例还提供一种电池套件100，包括电路板组件101以及电池102。电池102设于壳体10内。具体地，电池102设于外壳13内。
示例性地，电路板组件101包括上述任意一个实施例中的电路板组件101。
示例性地，电池102与电路板20电连接。电池102包括多个电芯。该多个电芯可以并联，也可以串联，还可以多串并。
请参阅图1至图13，本申请实施例提供一种电子设备1000，包括机体200和电池套件100。电池套件100设于机体200上。
示例性地，电池套件100包括上述任意一个实施例中的电池套件100。
电子设备1000包括以下至少一种：无人飞行器、无人驾驶车、无人驾驶船、机器人或者云台等。
以电子设备1000为植保无人机为例。由于植保无人机的电池102一般都是高倍率放电，所以电池102放电时电芯会产生很多热量，电芯的温升会很高，电芯长时间在高温条件下工作时会缩短使用寿命。因而电芯工作时所产生的热量需要及时散出。此外，植保无人机工作时多为潮湿多水的环境，所以电池102需要有较高的防水性能。
为此，请参阅图1至图13，本申请提供了一种电池套件100，包括壳体10、电池102、导热件60和第一密封件71。壳体10包括第一散热开口15。壳体10形成有收容腔16。第一散热开口15与收容腔16相连通。电池102位于收容腔16内。导热件60设于壳体10与电池102之间。电池102上的热量能够传导至导热件60上并经第一散热开口15散出。其中，电池套件100还包括设于第一散热开口15处的第一密封件71，用于防止液体经第一散热开口15进入收容腔16内。
上述实施例提供的电池套件100，电池102的热量能够经导热件60和第一散热开口15散出，从而提高电池102的散热效率。第一密封件71能够防止液体经第一散热开口15进入收容腔16内，从而兼顾电路板组件101的散热性能和防水性能。
示例性地，该电池套件100可以参考上述任意实施例的电路板组件101。
在一些实施例中，导热件60与电池102导热性接触。
在一些实施例中，导热件60与电池102面接触。
在一些实施例中，导热件60环绕电池102的侧部设置。
在一些实施例中，至少部分导热件60与第一散热开口15相对设置。
在一些实施例中，导热件60中与第一散热开口15相对设置的部位暴露于空气中。
在一些实施例中，导热件60包括第一导热体61和第二导热体62。第一导热体61，具有导热性；至少部分第一导热体61与第一散热开口15对应设置；第二导热体62，具有导热性；第一导热体61和第二导热体62分别接触于电池 102的不同部位。
在一些实施例中，第一导热体61与第二导热体62配合形成中空空间63，至少部分电池102位于中空空间63内。
在一些实施例中，中空空间63包括环形空间。
在一些实施例中，第一导热体61与第二导热体62分体设置。
在一些实施例中，壳体10还包括与收容腔16连通的第二散热开口17，至少部分第二导热体62与第二散热开口17对应设置，电池102上的热量能够传导至第二导热体62上并经第二散热开口17散出。
在一些实施例中，第一散热开口15与第二散热开口17相对设置。
在一些实施例中，第一导热体61包括：第一导热壁611，与电池102的第一侧壁1021导热性连接；第二导热壁612，与第一导热壁611连接，并与电池102的第二侧壁1022导热性连接。
在一些实施例中，第一导热壁611与第二导热壁612相交。
在一些实施例中，第一导热壁611与第二导热壁612垂直。
在一些实施例中，第一导热壁611与第二导热壁612导热性连接。
在一些实施例中，第一导热壁611与第二导热壁612为一体结构。
在一些实施例中，第一导热壁611沿第一方向的尺寸大于第二导热壁612沿第二方向的尺寸，第一方向与第二方向相交。
在一些实施例中，至少部分第一导热壁611与第一散热开口15相对设置。
在一些实施例中，第二导热体62的结构与第一导热体61的结构相同。
在一些实施例中，第一导热体61与第二导热体62导热性接触。
在一些实施例中，第二导热体62包括：第三导热壁621，与电池102的第三侧壁1023导热性连接；第四导热壁622，与第三导热壁621连接，并与电池102的第四侧壁1024导热性连接。
在一些实施例中，第三导热壁621沿第一方向的尺寸大于第四导热壁622沿第二方向的尺寸，第一方向与第二方向相交。
在一些实施例中，至少部分第三导热壁621与第二散热开口17相对设置。
在一些实施例中，第一导热壁611与第三导热壁621相对设置。
在一些实施例中，第一导热壁611与第三导热壁621平行。
在一些实施例中，第二导热壁612与第四导热壁622相对设置。
在一些实施例中，第二导热壁612与第四导热壁622平行。
在一些实施例中，第一导热壁611远离第二导热壁612的一侧与第四导热壁622远离第三导热壁621的一侧邻近设置。
在一些实施例中，电池套件100还包括设于第二散热开口17处的第二密封件72，用于防止液体经第二散热开口17进入收容腔16内。
在一些实施例中，第二密封件72的结构与第一密封件71的结构相同。
在一些实施例中，第一密封件71设于导热件60与壳体10之间。
在一些实施例中，第一密封件71的形状与第一散热开口15的形状适配。
在一些实施例中，第一密封件71环设于第一散热开口15的周缘。
在一些实施例中，第一密封件71呈环形，第一密封件71的环形大小大于第一散热开口15的口径。
在一些实施例中，第一密封件71包括：密封胶层、密封胶圈。
在一些实施例中，壳体10包括：外壳13，收容腔16和第一散热开口15设于外壳13上。
在一些实施例中，壳体10还包括：盖体12，与外壳13连接。
在一些实施例中，还包括设于壳体10内的电路板20，电路板20包括相对的第一表面21和第二表面22，第一表面21和第二表面22中的至少一个设有元器件；壳体10上设有围挡结构40，围挡结构40与电路板20配合形成密封空间113；电路板20的第一表面21位于密封空间113内。
在一些实施例中，第一表面21和第二表面22中的其中一者设有元器件，第一表面21和第二表面22中的另一者未设元器件。
在一些实施例中，第一表面21和第二表面22均设有元器件。
在一些实施例中，电路板20与围挡结构40密封连接。
在一些实施例中，电路板20与围挡结构40可拆卸连接。
在一些实施例中，围挡结构40包括：围合壁41；承载部42，凸设于围合壁41上，电路板20承载于承载部42上，承载部42、围合壁41和电路板20配合形成密封空间113。
在一些实施例中，承载部42与围合壁41配合形成环形凹槽43，环形凹槽43与电路板20配合形成密封空间113。
在一些实施例中，电路板20还包括连接于第一表面21的侧壁部23；承载 部42包括：承载体421，凸设于围合壁41上；挡边422，设于承载体421远离围合壁41的一端，与承载体421配合形成台阶423，电路板20的第一表面21搭载于台阶423的第一台阶面4231上，电路板20的侧壁部23与台阶423的第二台阶面4232相对设置。
在一些实施例中，电路板20的第一表面21与第一台阶面4231密封连接。
在一些实施例中，电路板20的第一表面21与第一台阶面4231贴合。
在一些实施例中，电路板20的侧壁部23与第二台阶面4232密封连接。
在一些实施例中，电路板20的侧壁部23与第二台阶面4232贴合。
在一些实施例中，第一台阶面4231与第二台阶面4232垂直。
在一些实施例中，第一台阶面4231与围合壁41之间的距离大于或者等于第一表面21的元器件的最大凸出尺寸。
在一些实施例中，述挡边422凸设于承载体421远离围合壁41的一端。
在一些实施例中，挡边422的凸设方向与承载体421的凸设方向相同。
在一些实施例中，挡边422远离围合壁41的一端与围合壁41之间具有第一预设距离，第一表面21与围合壁41之间具有第二预设距离，第一预设距离大于第二预设距离。
在一些实施例中，第二表面22与围合壁41之间具有第三预设距离，第一预设距离大于第三预设距离。
在一些实施例中，第一预设距离与第三预设距离之差为1.5mm-2.5mm。
在一些实施例中，壳体10上设有用于与电路板20连接的固定部14。
在一些实施例中，固定部14凸设于围合壁41上。
在一些实施例中，固定部14的数量为多个，多个固定部14中的至少部分与承载部42连接。
在一些实施例中，电路板20通过锁固件50与固定部14可拆卸连接。
在一些实施例中，固定部14朝向电路板20的一端与承载部42的第一台阶面4231平齐；或者，固定部14朝向电路板20的一端低于承载部42的第一台阶面4231。
在一些实施例中，壳体10上形成有收容空间11，电路板20与围挡结构40配合以将收容空间11分隔为第一子空间111和密封空间113，第二表面22和防护件30位于第一子空间111内。
在一些实施例中，电池套件100还包括：防护件30，位于第一子空间111内，用于对第二表面22的至少部分区域进行密封。
在一些实施例中，防护件30覆盖第二表面22和/或第二表面22的元器件。
在一些实施例中，防护件30包括：灌封胶层。
在一些实施例中，第二表面22设有元器件，至少部分区域包括第二表面22上的元器件所在的区域。
在一些实施例中，壳体10包括：盖体12，电路板20和围挡结构40设于盖体12上。
在一些实施例中，围挡结构40与盖体12的其他部位为一体结构。
在一些实施例中，壳体10还包括：外壳13，与盖体12配合形成收容空间11。
请参阅图15，本申请实施例还提供一种电子设备1000，包括机体200和上述任意一个实施例的电池套件100。电池套件100设于机体200上。
示例性地，电子设备1000包括以下至少一种：无人飞行器、无人驾驶车、无人驾驶船、机器人或者云台。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (143)

  1. 一种电路板组件，其特征在于，包括：
    壳体，形成有收容空间；
    电路板，设于所述收容空间内，包括相对的第一表面和第二表面，所述第一表面和所述第二表面中的至少一个设有元器件；
    防护件，用于对所述第二表面的至少部分区域进行密封；
    其中，所述壳体上设有围挡结构，所述电路板与所述围挡结构配合以将所述收容空间分隔为第一子空间和第二子空间，以使所述第二子空间为密封空间；所述第二表面和所述防护件位于所述第一子空间内；所述第一表面位于所述第二子空间内。
  2. 根据权利要求1所述的电路板组件，其特征在于，所述第一表面和所述第二表面中的其中一者设有元器件，所述第一表面和所述第二表面中的另一者未设元器件。
  3. 根据权利要求1所述的电路板组件，其特征在于，所述第一表面和所述第二表面均设有元器件。
  4. 根据权利要求1所述的电路板组件，其特征在于，所述电路板与所述围挡结构密封连接；和/或，所述电路板与所述围挡结构可拆卸连接。
  5. 根据权利要求1所述的电路板组件，其特征在于，所述第二表面设有元器件，所述至少部分区域包括所述第二表面上的所述元器件所在的区域。
  6. 根据权利要求1所述的电路板组件，其特征在于，所述围挡结构包括：
    围合壁；
    承载部，凸设于所述围合壁上，所述电路板承载于所述承载部上，所述承载部、所述围合壁和所述电路板配合形成所述第二子空间。
  7. 根据权利要求6所述的电路板组件，其特征在于，所述承载部与所述围合壁配合形成环形凹槽，所述环形凹槽与所述电路板配合形成所述第二子空间。
  8. 根据权利要求6所述的电路板组件，其特征在于，所述电路板还包括连接于所述第一表面和第二表面的侧壁部；所述承载部包括：
    承载体，凸设于所述围合壁上；
    挡边，设于所述承载体远离所述围合壁的一端，与所述承载体配合形成台阶，所述电路板的第一表面搭载于所述台阶的第一台阶面上，所述电路板的侧壁部与所述台阶的第二台阶面相对设置。
  9. 根据权利要求8所述的电路板组件，其特征在于，所述电路板的第一表面与所述第一台阶面密封连接。
  10. 根据权利要求8所述的电路板组件，其特征在于，所述电路板的第一表面与所述第一台阶面贴合。
  11. 根据权利要求8所述的电路板组件，其特征在于，所述电路板的侧壁部与所述第二台阶面密封连接。
  12. 根据权利要求8所述的电路板组件，其特征在于，所述电路板的侧壁部与所述第二台阶面贴合。
  13. 根据权利要求8所述的电路板组件，其特征在于，所述第一台阶面与所述第二台阶面垂直。
  14. 根据权利要求8所述的电路板组件，其特征在于，所述第一台阶面与所述围合壁之间的距离大于或者等于所述第一表面的元器件的最大凸出尺寸。
  15. 根据权利要求8所述的电路板组件，其特征在于，所述挡边凸设于所述承载体远离所述围合壁的一端。
  16. 根据权利要求15所述的电路板组件，其特征在于，所述挡边的凸设方向与所述承载体的凸设方向相同。
  17. 根据权利要求8所述的电路板组件，其特征在于，所述挡边远离所述围合壁的一端与所述围合壁之间具有第一预设距离，所述第一表面与所述围合壁之间具有第二预设距离，所述第一预设距离大于所述第二预设距离。
  18. 根据权利要求17所述的电路板组件，其特征在于，所述第二表面与所述围合壁之间具有第三预设距离，所述第一预设距离大于所述第三预设距离。
  19. 根据权利要求18所述的电路板组件，其特征在于，所述第一预设距离与所述第三预设距离之差为1.5mm-2.5mm。
  20. 根据权利要求8所述的电路板组件，其特征在于，所述壳体上设有用于与所述电路板连接的固定部。
  21. 根据权利要求20所述的电路板组件，其特征在于，所述固定部凸设于所述围合壁上。
  22. 根据权利要求20所述的电路板组件，其特征在于，所述固定部的数量为多个，多个所述固定部中的至少部分与所述承载部连接。
  23. 根据权利要求20所述的电路板组件，其特征在于，所述电路板通过锁固件与所述固定部可拆卸连接。
  24. 根据权利要求20所述的电路板组件，其特征在于，所述固定部朝向所述电路板的一端与所述承载部的第一台阶面平齐；或者，所述固定部朝向所述电路板的一端低于所述承载部的第一台阶面。
  25. 根据权利要求1-24任一项所述的电路板组件，其特征在于，所述防护件覆盖所述第二表面和/或所述第二表面的元器件。
  26. 根据权利要求1-24任一项所述的电路板组件，其特征在于，所述防护件包括：灌封胶层。
  27. 根据权利要求1-26任一项所述的电路板组件，其特征在于，所述壳体包括：
    盖体，所述电路板和所述围挡结构设于所述盖体上。
  28. 根据权利要求27所述的电路板组件，其特征在于，所述围挡结构与所述盖体的其他部位为一体结构。
  29. 根据权利要求27所述的电路板组件，其特征在于，所述壳体还包括：
    外壳，与所述盖体配合形成所述收容空间。
  30. 根据权利要求1-29任一项所述的电路板组件，其特征在于，所述壳体包括第一散热开口，所述壳体形成有用于收容电池的收容腔，所述第一散热开口与所述收容腔连通；所述电路板组件还包括：
    导热件，设于所述壳体与所述电池之间；所述电池上的热量能够传导至所述导热件上并经所述第一散热开口散出。
  31. 根据权利要求30所述的电路板组件，其特征在于，所述导热件与所述电池导热性接触。
  32. 根据权利要求31所述的电路板组件，其特征在于，所述导热件与所述电池面接触。
  33. 根据权利要求30所述的电路板组件，其特征在于，所述导热件环绕所述电池的侧部设置。
  34. 根据权利要求30所述的电路板组件，其特征在于，至少部分所述导热 件与所述第一散热开口相对设置。
  35. 根据权利要求34所述的电路板组件，其特征在于，所述导热件中与所述第一散热开口相对设置的部位暴露于空气中。
  36. 根据权利要求30所述的电路板组件，其特征在于，所述导热件包括：
    第一导热体，具有导热性；至少部分所述第一导热体与所述第一散热开口对应设置；
    第二导热体，具有导热性；所述第一导热体和所述第二导热体分别接触于所述电池的不同部位。
  37. 根据权利要求36所述的电路板组件，其特征在于，所述第一导热体与所述第二导热体配合形成中空空间，至少部分所述电池位于所述中空空间内。
  38. 根据权利要求37所述的电路板组件，其特征在于，所述中空空间包括环形空间。
  39. 根据权利要求36所述的电路板组件，其特征在于，所述第一导热体与所述第二导热体分体设置。
  40. 根据权利要求36所述的电路板组件，其特征在于，所述壳体还包括与所述收容腔连通的第二散热开口，至少部分所述第二导热体与所述第二散热开口对应设置，所述电池上的热量能够传导至所述第二导热体上并经所述第二散热开口散出。
  41. 根据权利要求40所述的电路板组件，其特征在于，所述第一散热开口与所述第二散热开口相对设置。
  42. 根据权利要求40所述的电路板组件，其特征在于，所述第一导热体包括：
    第一导热壁，与所述电池的第一侧壁导热性连接；
    第二导热壁，与所述第一导热壁连接，并与所述电池的第二侧壁导热性连接。
  43. 根据权利要求42所述的电路板组件，其特征在于，所述第一导热壁与所述第二导热壁相交。
  44. 根据权利要求42所述的电路板组件，其特征在于，所述第一导热壁与所述第二导热壁垂直。
  45. 根据权利要求42所述的电路板组件，其特征在于，所述第一导热壁与 所述第二导热壁导热性连接。
  46. 根据权利要求42所述的电路板组件，其特征在于，所述第一导热壁与所述第二导热壁为一体结构。
  47. 根据权利要求42所述的电路板组件，其特征在于，所述第一导热壁沿第一方向的尺寸大于所述第二导热壁沿第二方向的尺寸，所述第一方向与所述第二方向相交。
  48. 根据权利要求42所述的电路板组件，其特征在于，至少部分所述第一导热壁与所述第一散热开口相对设置。
  49. 根据权利要求36所述的电路板组件，其特征在于，所述第二导热体的结构与所述第一导热体的结构相同。
  50. 根据权利要求36所述的电路板组件，其特征在于，所述第一导热体与所述第二导热体导热性接触。
  51. 根据权利要求42所述的电路板组件，其特征在于，所述第二导热体包括：
    第三导热壁，与所述电池的第三侧壁导热性连接；
    第四导热壁，与所述第三导热壁连接，并与所述电池的第四侧壁导热性连接。
  52. 根据权利要求51所述的电路板组件，其特征在于，所述第三导热壁沿第一方向的尺寸大于所述第四导热壁沿第二方向的尺寸，所述第一方向与所述第二方向相交。
  53. 根据权利要求51所述的电路板组件，其特征在于，至少部分所述第三导热壁与所述第二散热开口相对设置。
  54. 根据权利要求51所述的电路板组件，其特征在于，所述第一导热壁与所述第三导热壁相对设置。
  55. 根据权利要求51所述的电路板组件，其特征在于，所述第一导热壁与所述第三导热壁平行。
  56. 根据权利要求51所述的电路板组件，其特征在于，所述第二导热壁与所述第四导热壁相对设置。
  57. 根据权利要求51所述的电路板组件，其特征在于，所述第二导热壁与所述第四导热壁平行。
  58. 根据权利要求51所述的电路板组件，其特征在于，所述第一导热壁远离所述第二导热壁的一侧与所述第四导热壁远离所述第三导热壁的一侧邻近设置。
  59. 根据权利要求30-58任一项所述的电路板组件，其特征在于，所述电路板组件还包括：
    第一密封件，设于所述第一散热开口处的第一密封件，用于防止液体经所述第一散热开口进入所述收容腔内。
  60. 根据权利要求59所述的电路板组件，其特征在于，所述第一密封件设于所述导热件与所述壳体之间。
  61. 根据权利要求59所述的电路板组件，其特征在于，所述第一密封件的形状与所述第一散热开口的形状适配。
  62. 根据权利要求59所述的电路板组件，其特征在于，所述第一密封件环设于所述第一散热开口的周缘。
  63. 根据权利要求62所述的电路板组件，其特征在于，所述第一密封件呈环形，所述第一密封件的环形大小大于所述第一散热开口的口径。
  64. 根据权利要求62所述的电路板组件，其特征在于，所述第一密封件包括：密封胶层、密封胶圈。
  65. 根据权利要求59所述的电路板组件，其特征在于，所述壳体上还设有与所述收容腔连通的第二散热开口；所述电路板组件还包括设于所述第二散热开口处的第二密封件，用于防止液体经所述第二散热开口进入所述收容腔内。
  66. 根据权利要求65所述的电路板组件，其特征在于，所述第二密封件的结构与所述第一密封件的结构相同。
  67. 根据权利要求30-66任一项所述的电路板组件，其特征在于，所述壳体包括：
    外壳，所述收容腔和所述第一散热开口设于所述外壳上。
  68. 一种电路板组件，其特征在于，包括：
    壳体；
    电路板，设于所述壳体内，包括相对的第一表面和第二表面，所述第一表面和所述第二表面中的至少一个设有元器件；
    其中，所述壳体上设有围挡结构，所述电路板与所述围挡结构配合形成密 封空间；所述电路板的第一表面位于所述密封空间内。
  69. 一种电池套件，其特征在于，包括：
    权利要求1-68任一项所述的电路板组件；以及
    电池，设于所述壳体内。
  70. 一种电子设备，其特征在于，包括：
    机体；
    权利要求69所述的电池套件，设于所述机体上。
  71. 根据权利要求70所述的电子设备，其特征在于，所述电子设备包括以下至少一种：无人飞行器、无人驾驶车、无人驾驶船、机器人或者云台。
  72. 一种电池套件，其特征在于，包括：
    壳体，包括第一散热开口，所述壳体形成有收容腔，所述第一散热开口与所述收容腔相连通；
    电池，位于所述收容腔内；
    导热件，设于所述壳体与所述电池之间；所述电池上的热量能够传导至所述导热件上并经所述第一散热开口散出；
    其中，所述电池套件还包括设于所述第一散热开口处的第一密封件，用于防止液体经所述第一散热开口进入所述收容腔内。
  73. 根据权利要求72所述的电池套件，其特征在于，所述导热件与所述电池导热性接触。
  74. 根据权利要求73所述的电池套件，其特征在于，所述导热件与所述电池面接触。
  75. 根据权利要求72所述的电池套件，其特征在于，所述导热件环绕所述电池的侧部设置。
  76. 根据权利要求72所述的电池套件，其特征在于，至少部分所述导热件与所述第一散热开口相对设置。
  77. 根据权利要求76所述的电池套件，其特征在于，所述导热件中与所述第一散热开口相对设置的部位暴露于空气中。
  78. 根据权利要求72所述的电池套件，其特征在于，所述导热件包括：
    第一导热体，具有导热性；至少部分所述第一导热体与所述第一散热开口对应设置；
    第二导热体，具有导热性；所述第一导热体和所述第二导热体分别接触于所述电池的不同部位。
  79. 根据权利要求78所述的电池套件，其特征在于，所述第一导热体与所述第二导热体配合形成中空空间，至少部分所述电池位于所述中空空间内。
  80. 根据权利要求79所述的电池套件，其特征在于，所述中空空间包括环形空间。
  81. 根据权利要求78所述的电池套件，其特征在于，所述第一导热体与所述第二导热体分体设置。
  82. 根据权利要求78所述的电池套件，其特征在于，所述壳体还包括与所述收容腔连通的第二散热开口，至少部分所述第二导热体与所述第二散热开口对应设置，所述电池上的热量能够传导至所述第二导热体上并经所述第二散热开口散出。
  83. 根据权利要求82所述的电池套件，其特征在于，所述第一散热开口与所述第二散热开口相对设置。
  84. 根据权利要求82所述的电池套件，其特征在于，所述第一导热体包括：
    第一导热壁，与所述电池的第一侧壁导热性连接；
    第二导热壁，与所述第一导热壁连接，并与所述电池的第二侧壁导热性连接。
  85. 根据权利要求84所述的电池套件，其特征在于，所述第一导热壁与所述第二导热壁相交。
  86. 根据权利要求84所述的电池套件，其特征在于，所述第一导热壁与所述第二导热壁垂直。
  87. 根据权利要求84所述的电池套件，其特征在于，所述第一导热壁与所述第二导热壁导热性连接。
  88. 根据权利要求84所述的电池套件，其特征在于，所述第一导热壁与所述第二导热壁为一体结构。
  89. 根据权利要求84所述的电池套件，其特征在于，所述第一导热壁沿第一方向的尺寸大于所述第二导热壁沿第二方向的尺寸，所述第一方向与所述第二方向相交。
  90. 根据权利要求84所述的电池套件，其特征在于，至少部分所述第一导 热壁与所述第一散热开口相对设置。
  91. 根据权利要求78所述的电池套件，其特征在于，所述第二导热体的结构与所述第一导热体的结构相同。
  92. 根据权利要求78所述的电池套件，其特征在于，所述第一导热体与所述第二导热体导热性接触。
  93. 根据权利要求84所述的电池套件，其特征在于，所述第二导热体包括：
    第三导热壁，与所述电池的第三侧壁导热性连接；
    第四导热壁，与所述第三导热壁连接，并与所述电池的第四侧壁导热性连接。
  94. 根据权利要求93所述的电池套件，其特征在于，所述第三导热壁沿第一方向的尺寸大于所述第四导热壁沿第二方向的尺寸，所述第一方向与所述第二方向相交。
  95. 根据权利要求93所述的电池套件，其特征在于，至少部分所述第三导热壁与所述第二散热开口相对设置。
  96. 根据权利要求93所述的电池套件，其特征在于，所述第一导热壁与所述第三导热壁相对设置。
  97. 根据权利要求93所述的电池套件，其特征在于，所述第一导热壁与所述第三导热壁平行。
  98. 根据权利要求93所述的电池套件，其特征在于，所述第二导热壁与所述第四导热壁相对设置。
  99. 根据权利要求93所述的电池套件，其特征在于，所述第二导热壁与所述第四导热壁平行。
  100. 根据权利要求93所述的电池套件，其特征在于，所述第一导热壁远离所述第二导热壁的一侧与所述第四导热壁远离所述第三导热壁的一侧邻近设置。
  101. 根据权利要求82所述的电池套件，其特征在于，所述电池套件还包括设于所述第二散热开口处的第二密封件，用于防止液体经所述第二散热开口进入所述收容腔内。
  102. 根据权利要求101所述的电池套件，其特征在于，所述第二密封件的结构与所述第一密封件的结构相同。
  103. 根据权利要求72-102任一项所述的电池套件，其特征在于，所述第一密封件设于所述导热件与所述壳体之间。
  104. 根据权利要求103所述的电池套件，其特征在于，所述第一密封件的形状与所述第一散热开口的形状适配。
  105. 根据权利要求103所述的电池套件，其特征在于，所述第一密封件环设于所述第一散热开口的周缘。
  106. 根据权利要求103所述的电池套件，其特征在于，所述第一密封件呈环形，所述第一密封件的环形大小大于所述第一散热开口的口径。
  107. 根据权利要求103所述的电池套件，其特征在于，所述第一密封件包括：密封胶层、密封胶圈。
  108. 根据权利要求72-107任一项所述的电池套件，其特征在于，所述壳体包括：
    外壳，所述收容腔和所述第一散热开口设于所述外壳上。
  109. 根据权利要求108所述的电池套件，其特征在于，所述壳体还包括：盖体，与所述外壳连接。
  110. 根据权利要求72-109任一项所述的电池套件，其特征在于，还包括设于所述壳体内的电路板，所述电路板包括相对的第一表面和第二表面，所述第一表面和所述第二表面中的至少一个设有元器件；所述壳体上设有围挡结构，所述围挡结构与所述电路板配合形成密封空间；所述电路板的第一表面位于所述密封空间内。
  111. 根据权利要求110所述的电池套件，其特征在于，所述第一表面和所述第二表面中的其中一者设有元器件，所述第一表面和所述第二表面中的另一者未设元器件。
  112. 根据权利要求110所述的电池套件，其特征在于，所述第一表面和所述第二表面均设有元器件。
  113. 根据权利要求110所述的电池套件，其特征在于，所述电路板与所述围挡结构密封连接。
  114. 根据权利要求110所述的电池套件，其特征在于，所述电路板与所述围挡结构可拆卸连接。
  115. 根据权利要求110所述的电池套件，其特征在于，所述围挡结构包括：
    围合壁；
    承载部，凸设于所述围合壁上，所述电路板承载于所述承载部上，所述承载部、所述围合壁和所述电路板配合形成所述密封空间。
  116. 根据权利要求115所述的电池套件，其特征在于，所述承载部与所述围合壁配合形成环形凹槽，所述环形凹槽与所述电路板配合形成所述密封空间。
  117. 根据权利要求115所述的电池套件，其特征在于，所述电路板还包括连接于所述第一表面的侧壁部；所述承载部包括：
    承载体，凸设于所述围合壁上；
    挡边，设于所述承载体远离所述围合壁的一端，与所述承载体配合形成台阶，所述电路板的第一表面搭载于所述台阶的第一台阶面上，所述电路板的侧壁部与所述台阶的第二台阶面相对设置。
  118. 根据权利要求117所述的电池套件，其特征在于，所述电路板的第一表面与所述第一台阶面密封连接。
  119. 根据权利要求117所述的电池套件，其特征在于，所述电路板的第一表面与所述第一台阶面贴合。
  120. 根据权利要求117所述的电池套件，其特征在于，所述电路板的侧壁部与所述第二台阶面密封连接。
  121. 根据权利要求117所述的电池套件，其特征在于，所述电路板的侧壁部与所述第二台阶面贴合。
  122. 根据权利要求117所述的电池套件，其特征在于，所述第一台阶面与所述第二台阶面垂直。
  123. 根据权利要求117所述的电池套件，其特征在于，所述第一台阶面与所述围合壁之间的距离大于或者等于所述第一表面的元器件的最大凸出尺寸。
  124. 根据权利要求117所述的电池套件，其特征在于，所述挡边凸设于所述承载体远离所述围合壁的一端。
  125. 根据权利要求124所述的电池套件，其特征在于，所述挡边的凸设方向与所述承载体的凸设方向相同。
  126. 根据权利要求117所述的电池套件，其特征在于，所述挡边远离所述围合壁的一端与所述围合壁之间具有第一预设距离，所述第一表面与所述围合壁之间具有第二预设距离，所述第一预设距离大于所述第二预设距离。
  127. 根据权利要求126所述的电池套件，其特征在于，所述第二表面与所述围合壁之间具有第三预设距离，所述第一预设距离大于所述第三预设距离。
  128. 根据权利要求127所述的电池套件，其特征在于，所述第一预设距离与所述第三预设距离之差为1.5mm-2.5mm。
  129. 根据权利要求117所述的电池套件，其特征在于，所述壳体上设有用于与所述电路板连接的固定部。
  130. 根据权利要求129所述的电池套件，其特征在于，所述固定部凸设于所述围合壁上。
  131. 根据权利要求129所述的电池套件，其特征在于，所述固定部的数量为多个，多个所述固定部中的至少部分与所述承载部连接。
  132. 根据权利要求129所述的电池套件，其特征在于，所述电路板通过锁固件与所述固定部可拆卸连接。
  133. 根据权利要求129所述的电池套件，其特征在于，所述固定部朝向所述电路板的一端与所述承载部的第一台阶面平齐；或者，所述固定部朝向所述电路板的一端低于所述承载部的第一台阶面。
  134. 根据权利要求110-133任一项所述的电池套件，其特征在于，所述壳体上形成有收容空间，所述电路板与所述围挡结构配合以将所述收容空间分隔为第一子空间和所述密封空间，所述第二表面和所述防护件位于所述第一子空间内。
  135. 根据权利要134所述的电池套件，其特征在于，所述电池套件还包括：
    防护件，位于所述第一子空间内，用于对所述第二表面的至少部分区域进行密封。
  136. 根据权利要求135所述的电池套件，其特征在于，所述防护件覆盖所述第二表面和/或所述第二表面的元器件。
  137. 根据权利要求135所述的电池套件，其特征在于，所述防护件包括：灌封胶层。
  138. 根据权利要求135所述的电池套件，其特征在于，所述第二表面设有元器件，所述至少部分区域包括所述第二表面上的所述元器件所在的区域。
  139. 根据权利要求110所述的电池套件，其特征在于，所述壳体包括：
    盖体，所述电路板和所述围挡结构设于所述盖体上。
  140. 根据权利要求139所述的电池套件，其特征在于，所述围挡结构与所述盖体的其他部位为一体结构。
  141. 根据权利要求139所述的电池套件，其特征在于，所述壳体还包括：
    外壳，与所述盖体配合形成所述收容空间。
  142. 一种电子设备，其特征在于，包括：
    机体；
    权利要求72-141任一项所述的电池套件，设于所述机体上。
  143. 根据权利要求142所述的电子设备，其特征在于，所述电子设备包括以下至少一种：无人飞行器、无人驾驶车、无人驾驶船、机器人或者云台。
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CN206533651U (zh) * 2016-11-04 2017-09-29 广东欧珀移动通信有限公司 防水组件及移动终端
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