WO2022091600A1 - Machine de communication - Google Patents

Machine de communication Download PDF

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Publication number
WO2022091600A1
WO2022091600A1 PCT/JP2021/033441 JP2021033441W WO2022091600A1 WO 2022091600 A1 WO2022091600 A1 WO 2022091600A1 JP 2021033441 W JP2021033441 W JP 2021033441W WO 2022091600 A1 WO2022091600 A1 WO 2022091600A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conductor
antenna
communication module
communication device
Prior art date
Application number
PCT/JP2021/033441
Other languages
English (en)
Japanese (ja)
Inventor
拓也 山下
士朗 小出
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Publication of WO2022091600A1 publication Critical patent/WO2022091600A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • This disclosure relates to communication equipment.
  • Patent Document 1 a communication device in which an antenna is housed in a housing is known. Further, as a communication device, a communication device in which an antenna and a communication module for processing a signal received by the antenna are arranged on the same circuit board is known.
  • the space where the electronic components other than the antenna and the communication module can be arranged becomes narrow.
  • the pattern line connecting the communication module and the antenna must be wired avoiding the electronic components arranged on this circuit board. Will occur.
  • noise from these electronic components easily enters the pattern line and the antenna, which causes a problem.
  • One purpose of this disclosure is to facilitate the wiring connecting the communication module and the antenna, to make the space where the electronic components can be placed on the circuit board on which the communication module is placed wider, and to make the signal received by the antenna wider. And to provide a communicator that makes it possible for the antenna to be less susceptible to noise from this electronic component.
  • the communication device of the present disclosure is a communication device provided with a communication module for processing a signal received by an antenna, and is a first board which is a circuit board provided with the communication module and a first board.
  • An antenna provided on a board other than the first board, a second board which is a circuit board provided apart from the first board on the surface side of the surface of the first board on which the communication module is arranged, and a second board.
  • the pattern line used for supplying power to the antenna is provided on the second board different from the first board on which the communication module is provided, the electronic components on the circuit board on which the communication module is arranged are arranged. It becomes possible to make the space that can be created wider. Further, since this pattern line is provided on a second board different from the first board on which the communication module is provided, it is less likely to be affected by noise from electronic components on the circuit board on which the communication module is arranged. Since the antenna is also provided in a place other than the first substrate, it is less likely to be affected by noise from this electronic component. Therefore, the signal received by the antenna and the antenna are less likely to be affected by the noise from this electronic component.
  • the communication module since power is supplied to the antenna by contact between the power supply port provided on the first board and wired from the communication module and the first conductor provided on the second board and connected to the pattern line, the communication module is supplied. Power can be supplied even if the wiring from the power supply port to the power supply port is shortened. Therefore, it is possible to reduce the troublesomeness of wiring while avoiding the electronic components on the circuit board on which the communication module is arranged. As a result, the wiring connecting the communication module and the antenna is facilitated, the space where the electronic component can be placed on the circuit board on which the communication module is placed is widened, and the signal received by the antenna is sent from this electronic component. It becomes possible to make it difficult for the noise of the antenna to affect.
  • the communication device 1 includes a housing 2, a first board 3, and a second board 4.
  • This communication device 1 corresponds to a communication device.
  • the communication device 1 is schematically shown by increasing the distance between the members that are actually in contact with each other. The members indicated by the dotted arrows in FIG. 1 are actually in contact with each other.
  • a case where the communication device 1 is used in a vehicle will be described as an example.
  • the communication device 1 is used, for example, inside or below the dashboard of a vehicle.
  • the housing 2 covers the first substrate 3 and the second substrate 4 together.
  • a resin may be used.
  • the housing 2 has a bottomless box shape.
  • the first substrate 3 may be the bottom of the box, and the housing 2 may cover the first substrate 3 and the second substrate 4.
  • the first board 3, and the second board 4 in the example of FIG. 1 when the direction corresponding to the bottom of the box is downward, the housing 2, the second board 4, as the upper lid, are arranged from above.
  • the first substrate 3 as the bottom is arranged in this order.
  • the upper part is toward the ceiling of the vehicle and the lower part is toward the floor of the vehicle.
  • the antenna 21 is provided in the housing 2. That is, the communication device 1 also includes an antenna 21.
  • the antenna 21 is provided on the surface (hereinafter, the upper surface of the housing) 2U of the housing 2 located in the ceiling direction of the vehicle. More specifically, the antenna 21 may be configured to be provided on the inner surface of the housing 2 of the housing upper surface 2U.
  • the antenna 21 may be configured to be integrally configured with the housing 2.
  • the antenna 21 is integrally configured with the housing 2 by insert molding.
  • the antenna 21 includes an antenna 21a, an antenna 21b, an antenna 21c, and an antenna 21d.
  • the communication device 1 in the example of FIG. 1 is an integrated communication device that centrally manages a plurality of antennas. Examples of these antennas 21 include GNSS (Global Navigation Satellite System) antennas, telephone antennas, Wi-Fi (registered trademark) antennas, and the like.
  • the antenna 21 may include a plurality of telephone antennas that transmit and receive radio waves of different frequencies.
  • the first substrate 3 is a circuit board.
  • the first substrate 3 has a planar shape having a substantially rectangular shape, for example.
  • a predetermined wiring pattern is formed on the surface of the base material having an insulating property.
  • the first substrate 3 is fixed to the housing 2 with a fixing member such as a screw.
  • the first substrate 3 is arranged below the second substrate 4 in the communication device 1.
  • the height from the surface of the first substrate 3 to the upper surface 2U of the housing may be, for example, about 20 mm.
  • the first board 3 is provided with a communication module 31 and a power supply port 32. That is, the communication device 1 also includes a communication module 31 and a power supply port 32. The communication module 31 and the power supply port 32 are provided on the upper surface (hereinafter referred to as the surface) of the surface of the first substrate 3.
  • the communication module 31 processes the signal received by the antenna 21.
  • the communication module 31 is a module composed of a plurality of electronic components.
  • the communication module 31 also includes a heat generating element that generates heat when energized.
  • the power supply port 32 is wired from the communication module 31.
  • the power supply port 32 is connected to the communication module 31 by a pattern line provided on the surface of the first substrate 3.
  • the pattern line is a signal line formed of copper foil or the like and through which an electric signal flows.
  • the power supply port 32 uses a conductor as a material.
  • the power feeding port 32 may be a pattern of a metal conductor including foil, or may be a metal conductor provided around a through hole provided in the first substrate 3.
  • the feeding port 32 can be rephrased as a feeding point.
  • the power supply port 32 is electrically connected to the ground (hereinafter referred to as GND). This GND may be provided on the lower surface (hereinafter, the back surface) of the surfaces of the first substrate 3, or may be provided on the front surface.
  • feeding ports 32a to 32d are provided corresponding to a plurality of antennas 21a to 21d.
  • the power supply port 32 is preferably provided in the vicinity of the communication module 31 so that wiring from the communication module 31 can be facilitated.
  • the second board 4 is also a circuit board.
  • the second substrate 4 also has a planar shape having a substantially rectangular shape, for example.
  • a predetermined wiring pattern is formed on the surface of the base material having an insulating property.
  • the second substrate 4 is also fixed to the housing 2 with a fixing member such as a screw.
  • the second substrate 4 is arranged above the first substrate 3 in the communication device 1. That is, the second substrate 4 is provided on the surface side of the surface of the first substrate 3 on which the communication module 31 is arranged, apart from the first substrate 3.
  • the height from the surface of the second substrate 4 to the upper surface 2U of the housing may be, for example, about 5 mm.
  • the first substrate 3 and the second substrate 4 are arranged so that their surfaces are parallel to each other. If the first substrate 3 and the second substrate 4 have a positional relationship in which the first conductor 41 and the feeding port 32, which will be described later, can be in contact with each other, one surface of the first substrate 3 and the second substrate 4 are arranged so as to be inclined with respect to the other surface. It doesn't matter.
  • the second substrate 4 is preferably arranged between the antenna 21 and the first substrate 3 so as to block the antenna 21 when viewed from the first substrate 3 side.
  • the second substrate 4 is provided with the first conductor 41, the second conductor 42, and the pattern line 43. That is, the communication device 1 also includes a first conductor 41, a second conductor 42, and a pattern line 43.
  • the second conductor 42 and the pattern line 43 are provided on the upper surface (hereinafter referred to as the surface) of the surfaces of the second substrate 4.
  • the surface of the second substrate 4 corresponds to a non-opposing surface.
  • the first conductor 41 will be described later.
  • GND is provided on the lower surface (hereinafter referred to as the back surface) of the surface of the second substrate 4.
  • the back surface of the second substrate 4 corresponds to the facing surface.
  • the GND is preferably a metal conductor on a flat plate containing foil.
  • this GND is provided on the entire back surface of the second substrate 4.
  • the second substrate 4 is arranged so as to block the antenna 21 when viewed from the first substrate 3 side, and a metal conductor on a flat plate functioning as GND is provided on the back surface thereof, so that the first substrate with respect to the antenna 21 is provided. It becomes possible to shield the influence of noise from the electronic component provided in 3.
  • the first conductor 41 is a conductor connected to the pattern wire 43.
  • the first conductor 41 is arranged in the communication device 1 so as to be in contact with the power feeding port 32.
  • the first conductor 41 is arranged so as to come into contact with the feeding port 32 provided on the first substrate 3 in a state where the first substrate 3 and the second substrate 4 are assembled to the housing 2.
  • the power feeding port 32 is arranged so as to be in contact with the first conductor 41 in the communication device 1.
  • the first conductor 41 is provided so as to penetrate the second substrate 4 from the front surface side to the back surface side of the second substrate 4 connected to the pattern wire 43.
  • the portion of the first conductor 41 protruding toward the back surface side is arranged so that the feeding port 32 is in contact with the feeding port 32.
  • a gasket composed of a conductor, a spring contact, a pin, a press-fit terminal, or the like can be used.
  • the first conductor 41 is a pin.
  • the first conductors 41a to 41d are provided corresponding to the plurality of antennas 21a to 21d.
  • the first conductor 41a comes into contact with the feeding port 32a.
  • the first conductor 41b comes into contact with the feeding port 32b.
  • the first conductor 41c comes into contact with the feeding port 32c.
  • the first conductor 41d comes into contact with the feeding port 32d.
  • the second conductor 42 is also a conductor connected to the pattern wire 43.
  • the second conductor 42 is in contact with an end point of the pattern line 43 different from the end point in contact with the first conductor 41.
  • the second conductor 42 is arranged in the communication device 1 so as to be in contact with the antenna 21.
  • the second conductor 42 is arranged so as to come into contact with the antenna 21 provided in the housing 2 in a state where the second substrate 4 is assembled to the housing 2.
  • the antenna 21 is arranged so as to be in contact with the second conductor 42.
  • a gasket made of a conductor, a spring contact, or the like can be used.
  • the second conductor 42 is a spring contact.
  • the second conductors 42a to 42d are provided corresponding to the plurality of antennas 21a to 21d.
  • the second conductor 42a comes into contact with the antenna 21a.
  • the second conductor 42b comes into contact with the antenna 21b.
  • the second conductor 42c comes into contact with the antenna 21c.
  • the second conductor 42d comes into contact with the antenna 21d.
  • the pattern wire 43 is used to supply power to the antenna 21.
  • the pattern wire 43 is used for indirect feeding to the antenna 21 via the second conductor 42.
  • the pattern line is a signal line formed of copper foil or the like and through which an electric signal flows.
  • the pattern line 43 can be rephrased as an RF line.
  • the pattern lines 43a to 43d are provided corresponding to the plurality of antennas 21a to 21d.
  • the pattern line 43a contacts the first conductor 41a at one end point and contacts the second conductor 42a at the other end point.
  • the pattern line 43b contacts the first conductor 41b at one end point and contacts the second conductor 42b at the other end point.
  • the pattern line 43c contacts the first conductor 41c at one end point and contacts the second conductor 42c at the other end point.
  • the pattern line 43d contacts the first conductor 41d at one end point and contacts the second conductor 42d at the other end point.
  • the communication device 1 is electrically connected as follows when the first board 3 and the second board 4 are assembled to the housing 2.
  • the antenna 21a is electrically connected to the communication module 31 via the second conductor 42a, the pattern line 43a, the first conductor 41a, and the feeding port 32a.
  • the antenna 21b will be electrically connected to the communication module 31 via the second conductor 42b, the pattern line 43b, the first conductor 41b, and the feeding port 32b.
  • the antenna 21c will be electrically connected to the communication module 31 via the second conductor 42c, the pattern line 43c, the first conductor 41c, and the feeding port 32c.
  • the antenna 21d is electrically connected to the communication module 31 via the second conductor 42d, the pattern line 43a, the first conductor 41d, and the feeding port 32d.
  • the pattern line 43 used for supplying power to the antenna 21 is provided on the second board 4 different from the first board 3 on which the communication module 31 is provided, so that the communication module 31 is arranged. It is possible to increase the space in which electronic components can be placed on the circuit board. Further, since the pattern line 43 is provided on the second board 4 different from the first board 3 on which the communication module 31 is provided, it is affected by noise from electronic components on the circuit board on which the communication module 31 is arranged. It becomes difficult. Since the antenna 21 is also provided in the housing 2 other than the first substrate, it is less likely to be affected by noise from the electronic components.
  • the signal received by the antenna 21 and the antenna 21 are less likely to be affected by the noise from the electronic component. Therefore, the signal received by the antenna 21 is less likely to be affected by the noise from this electronic component. Further, power is supplied to the antenna 21 by contact between the power supply port 32 provided on the first board 3 and wired from the communication module 31 and the first conductor 41 connected to the pattern line 43 provided on the second board 4. Therefore, power can be supplied even if the wiring from the communication module 31 to the power supply port is shortened. Therefore, it is possible to reduce the troublesomeness of wiring while avoiding the electronic components on the circuit board on which the communication module 31 is arranged.
  • the wiring connecting the communication module 31 and the antenna 21 is facilitated, the space where the electronic components can be arranged on the circuit board on which the communication module 31 is arranged is widened, and the signal received by the antenna 21 is used. It is possible to reduce the influence of noise from this electronic component.
  • the above-mentioned effect becomes more remarkable as the number of antennas 21 provided in the communication device 1 increases.
  • the heat generated by the electronic components provided on the first substrate 3 such as the communication module 31 can be easily transferred to the GND of the second substrate 4 through, for example, the first conductor 41. , It becomes easier to dissipate heat.
  • the antenna 21 is provided on the upper surface 2U of the housing 2, but the present invention is not limited to this.
  • the antenna 21 may be provided on the side surface of the housing 2.
  • the antenna 21 may be provided on the second substrate 4.
  • the antenna 21 may be provided integrally with the second conductor 42, or the antenna 21 and the pattern wire 43 may be directly connected without providing the second conductor 42.
  • the pattern line 43 is provided on the surface of the second substrate 4 that does not face the communication module 31 of the first substrate 3, but the present invention is not limited to this.
  • the first conductor 41 and the pattern line 43 may be provided on the back surface of the second substrate 4 facing the communication module 31 of the first substrate 3.
  • the second conductor 42 may be configured to be connected to the pattern line 43 by being provided so as to penetrate from the front surface to the back surface of the second substrate 4.
  • the configuration in which the flat plate-shaped metal conductor functioning as a GND is provided on the second substrate 4, but the present invention is not necessarily limited to this.
  • the GND provided on the second substrate 4 may be a metal conductor having a shape other than the flat plate shape. Further, the configuration may be such that the GND is not provided on the second substrate 4.
  • the configuration in which the communication device 1 is used in a vehicle is shown, but the configuration is not necessarily limited to this.
  • the communication device 1 may be used in a moving body other than the vehicle.
  • the communication device 1 may be used in a configuration other than the mobile body.

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  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)
  • Telephone Set Structure (AREA)
  • Transceivers (AREA)

Abstract

L'invention concerne une machine de communication comprenant : des antennes (21) disposées sur une partie autre qu'un premier substrat (3) ; un second substrat (4) disposé sur le côté d'une surface du premier substrat (3) où un module de communication (31) est disposé, de façon à être espacé du premier substrat (3) ; des lignes de motif (43) qui sont disposées sur le second substrat et qui sont utilisées pour fournir de l'énergie aux antennes (21) ; des premiers conducteurs (41) qui sont disposés sur le second substrat (4) et qui sont connectés aux lignes de motif (43) ; et des ports d'alimentation électrique (32) qui sont disposés sur le premier substrat (3) et auxquels des fils sont fournis à partir du module de communication (31). Les premiers conducteurs (41) et les ports d'alimentation électrique (32) sont agencés de manière à être mis en contact l'un avec l'autre.
PCT/JP2021/033441 2020-10-28 2021-09-13 Machine de communication WO2022091600A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-180825 2020-10-28
JP2020180825A JP2022071718A (ja) 2020-10-28 2020-10-28 通信機

Publications (1)

Publication Number Publication Date
WO2022091600A1 true WO2022091600A1 (fr) 2022-05-05

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ID=81382291

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/033441 WO2022091600A1 (fr) 2020-10-28 2021-09-13 Machine de communication

Country Status (2)

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JP (1) JP2022071718A (fr)
WO (1) WO2022091600A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007243448A (ja) * 2006-03-07 2007-09-20 Toshiba Corp 半導体モジュール及び半導体モジュールの製造方法
US20130292808A1 (en) * 2012-05-04 2013-11-07 Advanced Semiconductor Engineering, Inc. Semiconductor package integrated with conformal shield and antenna
US20160049723A1 (en) * 2014-08-13 2016-02-18 International Business Machines Corporation Wireless communications package with integrated antennas and air cavity
WO2019069546A1 (fr) * 2017-10-03 2019-04-11 株式会社村田製作所 Module d'antenne et son procédé d'inspection
JP6590132B1 (ja) * 2018-07-20 2019-10-16 株式会社村田製作所 アンテナ装置、アンテナモジュール、およびそれに用いられる回路基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007243448A (ja) * 2006-03-07 2007-09-20 Toshiba Corp 半導体モジュール及び半導体モジュールの製造方法
US20130292808A1 (en) * 2012-05-04 2013-11-07 Advanced Semiconductor Engineering, Inc. Semiconductor package integrated with conformal shield and antenna
US20160049723A1 (en) * 2014-08-13 2016-02-18 International Business Machines Corporation Wireless communications package with integrated antennas and air cavity
WO2019069546A1 (fr) * 2017-10-03 2019-04-11 株式会社村田製作所 Module d'antenne et son procédé d'inspection
JP6590132B1 (ja) * 2018-07-20 2019-10-16 株式会社村田製作所 アンテナ装置、アンテナモジュール、およびそれに用いられる回路基板

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