WO2022089596A1 - 多工器和改善多工器隔离度的方法以及通信设备 - Google Patents

多工器和改善多工器隔离度的方法以及通信设备 Download PDF

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WO2022089596A1
WO2022089596A1 PCT/CN2021/127484 CN2021127484W WO2022089596A1 WO 2022089596 A1 WO2022089596 A1 WO 2022089596A1 CN 2021127484 W CN2021127484 W CN 2021127484W WO 2022089596 A1 WO2022089596 A1 WO 2022089596A1
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ground
inductance
stage
multiplexer
package substrate
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PCT/CN2021/127484
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English (en)
French (fr)
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蔡华林
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诺思(天津)微系统有限责任公司
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks

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  • the present invention relates to the field of filtering technology, and in particular, to a multiplexer, a method for improving the isolation of the multiplexer, and a communication device.
  • FIG. 1 is a schematic diagram of a structure of an acoustic wave filter according to the prior art.
  • this filter 10 there are inductors 121, 122 and a plurality of resonators (usually called series resonators) 101 to 104 between the input terminal 131 and the output terminal 132, and the connection point of each series resonator is connected to the ground terminal.
  • Resonators 111 to 113 (usually referred to as parallel resonators) and inductors 123 to 125 are respectively provided on the multiple branches (usually referred to as parallel branches) of the .
  • FIG. 2 is a schematic diagram of the main components of a multiplexer according to the prior art.
  • the multiplexer includes filters 21 to 24, and input matching inductors Lant, Lm, Lin1, Lin2, Lin3, and Lin4.
  • a matching inductor is a type of matching circuit used to match the filters of multiple frequency bands to a specified port resistance value, such as 50 ohms.
  • Mutual inductive coupling will be formed between the above-mentioned various inductances, and the mutual inductive coupling will affect the isolation inside the device and reduce the roll-off performance of the filter.
  • the present invention proposes a multiplexer, a method for improving the isolation of the multiplexer, and a communication device, which help to improve the isolation inside the multiplexer and improve the roll-off of each filter in the multiplexer performance.
  • a multiplexer includes a plurality of bulk acoustic wave filters, each of the filters includes at least two ground-to-ground inductances, and a front-stage ground-to-ground inductance of the at least two ground-to-ground inductances is located on a package substrate of the multiplexer The middle of the backstage ground inductor is located on both sides of the package substrate.
  • the multiplexer further includes an input matching inductor and an output matching inductor; the input matching inductor is located in the middle of the package substrate, and the output matching inductor is located on both sides of the package substrate.
  • the width of the middle portion is 25% to 75% of the width of the package substrate.
  • the front-stage-to-ground inductor and the rear-stage-to-ground inductor are respectively integrated on different layers of the package substrate.
  • the multiplexer includes 4 filters, which are located in the inductors on both sides of the package substrate; the inductors in different filters are respectively located in four corner regions of the package substrate, and the length of each corner region accounts for 30% to 80% of the package substrate length.
  • the inductance value of the front-stage inductance to ground is smaller than the inductance value of the rear-stage inductance to ground.
  • the inductance value of the previous stage to ground inductance is 0% to 60% of the inductance value of the subsequent stage to ground inductance.
  • the inductance value of the previous stage to ground inductance is 0% to 40% of the inductance value of the subsequent stage to ground inductance.
  • a method for improving the isolation of a multiplexer includes a plurality of bulk acoustic wave filters, each of the filters includes at least 2 ground inductances, the method comprises: connecting the ground in each of the filters to the ground The inductance is divided into the front-stage-to-ground inductance and the rear-stage-to-ground inductance, wherein the front-stage-to-ground inductance is close to the input end of the filter, and the rear-stage-to-ground inductance is close to the output end of the filter; set the front-stage-to-ground inductance at the In the middle of the package substrate of the multiplexer, the back-stage grounding inductance is arranged on both sides of the package substrate.
  • the multiplexer further includes an input matching inductor and an output matching inductor; the input matching inductor is arranged in the middle of the package substrate, and the output matching inductor is arranged on both sides of the package substrate.
  • the selection of the inductance value of the front-stage inductance is reduced, so as to reduce the mutual inductive coupling between the front-stage inductance and the rear-stage inductance and/or the output inductance.
  • the width of the middle portion is 25% to 75% of the width of the package substrate.
  • the multiplexer includes 4 filters, which are located in the inductors on both sides of the package substrate, the inductors in different filters are respectively located in four corner regions of the package substrate, and the length of each corner region accounts for 30% to 80% of the package substrate length.
  • the front-stage-to-ground inductor and the rear-stage-to-ground inductor are respectively integrated on different layers of the package substrate.
  • a communication device includes the multiplexer of the present invention.
  • FIG. 1 is a schematic diagram of a structure according to an acoustic wave filter in the prior art
  • Fig. 2 is a schematic diagram of the main components of a multiplexer according to the prior art
  • FIG. 3 is a schematic diagram of inductance grouping in a multiplexer according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a circuit structure of a filter related to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the arrangement position of the device in the multiplexer in the package substrate according to the embodiment of the present invention.
  • 6A and 6B are schematic diagrams of the effect of the arrangement of inductors on a package substrate according to an embodiment of the present invention.
  • FIGS. 7A to 7D are schematic diagrams illustrating the effect of roll-off improvement after reducing the front-stage inductance according to an embodiment of the present invention.
  • FIGS. 8A and 8B are schematic diagrams illustrating the effect of improving isolation after reducing the inductance of the previous stage according to an embodiment of the present invention.
  • these ground inductances are grouped, and different groups are arranged at different specific positions on the package substrate. Specifically, it is divided into two groups: the front-stage-to-ground inductance and the rear-stage-to-ground inductance.
  • the front-stage-to-ground inductance is close to the input end of the filter, and the rear-stage-to-ground inductance is close to the output end of the filter.
  • the front-stage grounding inductance is arranged in the middle of the packaging substrate of the multiplexer, and the rear-stage grounding inductance is arranged on both sides of the packaging substrate.
  • the input matching inductance is included in the first group where the front-stage grounding inductance is located, and the output matching inductance is included in the second stage where the grounding inductance is located.
  • the matching circuit can be a pure inductance, or it can be composed of a capacitor and an inductor. In the multiplexer device, it can also be a part of the matching circuit that includes a capacitor. As long as it is located in any matching circuit in the multiplexer device, it can be included in the above grouping. Taking the case of a multiplexer including 4 filters and each filter including 3 inductors to ground as an example, the above division is shown in FIG. Schematic diagram of inductor grouping.
  • the multiplexer includes 4 paths, and the structures of the filter 31 to the filter 34 are simply represented as blocks, each of which includes 3 ground inductances G1, G2, and G3.
  • the specific structure is shown in Fig. 4.
  • Fig. 4 is a schematic diagram of the circuit structure of a filter related to the embodiment of the present invention, there are series branches and three parallel branches between the input terminal IN and the output terminal, and the three parallel branches respectively have ground inductance G1, G2, G3.
  • G1 and G2 can be classified into the ground-to-ground inductance of the previous stage, and correspondingly G3 is used as the ground-to-ground inductance of the subsequent stage, as shown in blocks 41 and 42 in FIG. 4 .
  • G2 and G3 can also be classified into the ground inductance of the rear stage, and only G1 is left as the ground inductance of the previous stage.
  • the division of the ground inductance in each filter does not have to be consistent, that is to say, for example, G1 and G2 in the filter 31 are classified as the front-stage ground inductance, then other filters can be G1 as the front-stage pair.
  • Ground inductance, G2 and G3 are classified as the ground inductance of the latter stage.
  • the input matching inductances Lant, Lm, Lin1, Lin2, Lin3, and Lin4 are classified into the first group, as shown in block 35 in the figure; the output matching inductances Lout1, Lout2, Lout3, and Lout4 are classified into the second group. group, as indicated by block 36 in the figure.
  • FIG. 5 is a schematic diagram of the arrangement positions of the components in the multiplexer in the package substrate according to an embodiment of the present invention.
  • the devices in the first group are located in the middle of the package substrate 5, that is, the range within the block 51, and are specifically provided with the ground inductances G1 and G2 of each filter, and the matching inductances Lant, Lm, Lin1, Lin2 , Lin3.
  • the width D51 of the block 51 is approximately 25% to 75% of the width 5D of the package substrate 5 .
  • the second group of inductors are located on both sides. Because there are 4 filters, the inductors of the second group form the upper and lower arrangement in the figure, and are located in blocks 52 to 55 respectively.
  • the up and down direction of the 1 is the length direction, for example, the length L52 of the block 52 is shown in the figure, the others are similar) accounting for 30% to 80% of the length 5L of the package substrate.
  • the figure also shows the positions of the five output pins of ANT, F1 to F4.
  • FIG. 6A and 6B are schematic diagrams of the effect of the arrangement of inductors on a package substrate according to embodiments of the present invention.
  • the thick line in the figure corresponds to the embodiment of the present invention, and the thin line corresponds to the prior art.
  • FIG. 6A shows the isolation between the transmitter and receiver of B3, and
  • FIG. 6B shows the isolation between the transmitter and receiver of B1. .
  • the improvement in isolation can be seen from Figures 6A and 6B.
  • FIG. 7A to 7D are schematic diagrams illustrating the effect of roll-off improvement after reducing the front-stage inductance according to an embodiment of the present invention.
  • the thick line in the figure corresponds to the embodiment of the present invention
  • the thin line corresponds to the prior art
  • FIG. 7A corresponds to the B3 transmitter
  • FIG. 7B corresponds to the B3 receiver
  • FIG. 7C corresponds to the B1 transmitter
  • FIG. 7D corresponds to the B1 receiver. It can be seen from FIG. 7A to FIG.
  • FIG. 8A and 8B are schematic diagrams illustrating the effect of improving isolation after reducing the inductance of the previous stage according to an embodiment of the present invention.
  • the thick line in the figure corresponds to the embodiment of the present invention, and the thin line corresponds to the prior art. It can be seen from FIG. 8A to FIG. 8B that the isolation of the multiplexer is improved when the inductance of the previous stage is set to be smaller.

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Abstract

本发明提出了一种调整滤波器电路的方法和滤波器、多工器、通信设备，有助于提高多工器内部的隔离度，以及改善多工器内各滤波器的滚降性能。该多工器包含多个体声波滤波器，各所述滤波器包含至少2个对地电感，所述至少2个对地电感中的前级对地电感位于所述多工器的封装基板的中部，后级对地电感位于该封装基板的两侧。多个滤波器的输入匹配电感位于封装基板的中部，输出匹配电感位于该封装基板的两侧。

Description

多工器和改善多工器隔离度的方法以及通信设备 技术领域
本发明涉及滤波技术领域，特别地涉及一种多工器和改善多工器隔离度的方法以及通信设备。
背景技术
近年来的通信设备小型化和高性能趋势的加快，给射频前端提出了更高的挑战。普通的滤波器的一种典型结构如图1所示，图1是根据现有技术中的声波滤波器的一种结构的示意图。这种滤波器10中，输入端131和输出端132之间有电感121、122以及多个谐振器(通常称作串联谐振器)101～104，各串联谐振器的连接点与接地端之间的多个支路(通常称作并联支路)上分别设置有谐振器111～113(通常称作并联谐振器)，以及电感123～125。
图2是根据现有技术中的一种多工器的主要组成部分的示意图，如图2所示，多工器中包含滤波器21至24，以及输入匹配电感Lant、Lm、Lin1、Lin2、Lin3、以及Lin4。匹配电感是匹配电路的一种，用来将多个频段的滤波器都匹配到指定的端口电阻值，例如50欧姆。
上述各类电感之间会形成互感耦合，互感耦合影响了器件内部的隔离度，以及降低了滤波器的滚降性能。
发明内容
有鉴于此，本发明提出了一种多工器和改善多工器隔离度的方法以及通信设备，有助于提高多工器内部的隔离度，以及改善多工器内各滤波器的滚降性能。
本发明提供如下技术方案：
一种多工器，包含多个体声波滤波器，各所述滤波器包含至少2个对地电感，所述至少2个对地电感中的前级对地电感位于所述多工器的封装基板的中部，后级对地电感位于该封装基板的两侧。
可选地，所述多工器还包括输入匹配电感和输出匹配电感；输入匹配电感位于所述封装基板的中部，输出匹配电感位于所述封装基板的两侧。
可选地，所述中部的宽度为所述封装基板宽度的25％至75％。
可选地，所述前级对地电感和所述后级对地电感分别集成在封装基板的不同层。
可选地，所述多工器包含4个滤波器，位于封装基板两侧的电感中；不同的滤波器中的电感分别位于封装基板的四个角部区域，且各角部区域的长度占封装基板长度的30％至80％。
可选地，所述前级对地电感的电感值小于所述后级对地电感的电感值。
可选地，前级对地电感的电感值为后级对地电感的电感值的0％～60％。
可选地，前级对地电感的电感值为后级对地电感的电感值的0％～40％。
一种改善多工器隔离度的方法，所述多工器包含多个体声波滤波器，各所述滤波器包含至少2个对地电感，该方法包括：将各所述滤波器中的对地电感分为前级对地电感和后级对地电感，其中前级对地电感靠近滤波器的输入端，后级对地电感靠近滤波器的输出端；将前级对地电感设置在所述多工器的封装基板的中部，后级对地电感设置在该封装基板的两侧。
可选地，所述多工器还包括输入匹配电感和输出匹配电感；将输入匹配电感设置在所述封装基板的中部，输出匹配电感设置在所述封装基板的两侧。
可选地，降低对于前级电感的电感值的选择，以减小前级电感与后级电感和/或输出电感之间的互感耦合。
可选地，所述中部的宽度为所述封装基板宽度的25％至75％。
可选地，所述多工器包含4个滤波器，位于封装基板两侧的电感中，不同的滤波器中的电感分别位于封装基板的四个角部区域，且各角部区域的长度占封装基板长度的30％至80％。
可选地，所述前级对地电感和所述后级对地电感分别集成在封装基板的不同层。
一种通信设备，包括本发明所述的多工器。
附图说明
为了说明而非限制的目的，现在将根据本发明的优选实施例、特别是参考附图来描述本发明，其中：
图1是根据现有技术中的声波滤波器的一种结构的示意图；
图2是根据现有技术中的一种多工器的主要组成部分的示意图；
图3是根据本发明实施方式的一种多工器内的电感分组的示意图；
图4是与本发明实施方式有关的一种滤波器的电路结构的示意图；
图5是根据本发明实施方式的多工器中的器件在封装基板中的设置位置的示意图；
图6A和图6B是根据本发明实施方式的电感在封装基板上的布置方式的效果的示意图；
图7A至图7D是根据本发明实施方式的减小前级电感之后滚降改善 的效果的示意图；
图8A和图8B是根据本发明实施方式的减小前级电感之后隔离度改善的效果的示意图。
具体实施方式
本发明实施方式中，对于至少包含2个对地电感的滤波器，将这些对地电感进行分组，不同组设置在封装基板的不同特定位置。具体是分为前级对地电感和后级对地电感这两组，其中前级对地电感靠近滤波器的输入端，后级对地电感靠近滤波器的输出端，并且在多工器的封装结构中，将前级对地电感设置在多工器的封装基板的中部，后级对地电感设置在该封装基板的两侧。
对于多工器器件中的匹配电路中的匹配电感，也将其纳入上述的分组，输入匹配电感纳入前级对地电感所在的第一组，输出匹配电感纳入后级对地电感所在的第二组。匹配电路可以是纯电感，也可以由电容和电感构成，在多工器器件中，也可以是部分匹配电路中包含电容。只要是位于多工器器件中的任一匹配电路中的电感，都可以将其纳入上述的分组。以包含4个滤波器的多工器、并且各滤波器包含3个对地电感的情形为例，上述划分如图3所示，图3是根据本发明实施方式的一种多工器内的电感分组的示意图。
图3中，多工器包含4个通路，滤波器31至滤波器34的结构简略表示为方框，其中各包含3个对地电感G1、G2、G3，具体结构如图4所示，图4是与本发明实施方式有关的一种滤波器的电路结构的示意图，其输入端IN和输出端之间具有串联支路和3个并联支路，3个并联支路中分别具有对地电感G1、G2、G3。本发明实施方式中，可把G1和G2划入前级对地电感，相应地G3作为后级对地电感，如图4中的方框41、42所示。也可以将G2和G3划入后级对地电感，仅留G1作为前级对地电感。另外，各个滤波器中的对地电感的划分可不必一致化，也就是说，例如滤波器31中的G1和G2划为前级对地电感，那么其他滤波器可以是G1划为前级对 地电感，G2和G3划为后级对地电感。
本实施方式中，将输入匹配电感Lant、Lm、Lin1、Lin2、Lin3、以及Lin4划入第一组，如图中方框35所示；将输出匹配电感Lout1、Lout2、Lout3、Lout4划入第二组，如图中方框36所示。根据上述的封装基板中的设置，该多工器中的器件位置如图5所示，图5是根据本发明实施方式的多工器中的器件在封装基板中的设置位置的示意图。按图中视角，第一组中的器件位于封装基板5的中部，即方框51内的范围，具体设置有各滤波器的对地电感G1和G2，以及匹配电感Lant、Lm、Lin1、Lin2、Lin3。方框51的宽度D51约占封装基板5的宽度5D的25％至75％。第二组电感位于两边，因为是4个滤波器，所以第二组的各电感又形成图中的上下布置，分别位于方框52～55中，方框52～55的长度(按图中视角的上下方向为长度方向，例如图中示出方框52的长度L52，其他类似)占封装基板长度5L的30％至80％。此外图中还示出了ANT、F1～F4这五个输出管脚的位置。
图6A和图6B是根据本发明实施方式的电感在封装基板上的布置方式的效果的示意图。图中粗线对应本发明实施方式，细线对应现有技术，图6A示出了B3发射端和接收端之间的隔离度，图6B示出了B1发射端和接收端之间的隔离度。从图6A和图6B可以看出隔离度的改善。
在本发明实施方式中，与现有技术中的各对地电感一致化的做法的区别还包括前级电感更小，以改善滚降和隔离度。图7A至图7D是根据本发明实施方式的减小前级电感之后滚降改善的效果的示意图。图中粗线对应本发明实施方式，细线对应现有技术，图7A对应B3发射端，图7B对应B3接收端，图7C对应B1发射端，图7D对应B1接收端。从图7A至图7D可以看出，当设置前级电感变小后，各个滤波器的滚降都有不同程度的改善。图8A和图8B是根据本发明实施方式的减小前级电感之后隔离度改善的效果的示意图。图中粗线对应本发明实施方式，细线对应现有技术，图8A为B3发射端和接收端之间的隔离度对比，图8B为B1发射 端和接收端之间的隔离度对比。从图8A至图8B可以看出，当设置前级电感变小后，多工器的隔离度有所改善。
上述具体实施方式，并不构成对本发明保护范围的限制。本领域技术人员应该明白的是，取决于设计要求和其他因素，可以发生各种各样的修改、组合、子组合和替代。任何在本发明的精神和原则之内所作的修改、等同替换和改进等，均应包含在本发明保护范围之内。

Claims (15)

  1. 一种多工器，包含多个体声波滤波器，各所述滤波器包含至少2个对地电感，其特征在于，
    对于各所述滤波器，所述至少2个对地电感中的前级对地电感位于所述多工器的封装基板的中部，后级对地电感位于该封装基板的两侧。
  2. 根据权利要求1所述的多工器，其特征在于，
    所述多工器还包括输入匹配电感和输出匹配电感；
    输入匹配电感位于所述封装基板的中部，输出匹配电感位于所述封装基板的两侧。
  3. 根据权利要求1或2所述的多工器，其特征在于，所述中部的宽度为所述封装基板宽度的25％至75％。
  4. 根据权利要求1或2所述的多工器，其特征在于，所述前级对地电感和所述后级对地电感分别集成在封装基板的不同层。
  5. 根据权利要求1或2所述的多工器，其特征在于，
    所述多工器包含4个滤波器；
    位于封装基板两侧的电感中，不同的滤波器中的电感分别位于封装基板的四个角部区域，且各角部区域的长度占封装基板长度的30％至80％。
  6. 根据权利要求1或2所述的多工器，其特征在于，所述前级对地电感的电感值小于所述后级对地电感的电感值。
  7. 根据权利要求6所述的多工器，其特征在于，前级对地电感的电感值为后级对地电感的电感值的0％～60％。
  8. 根据权利要求6所述的多工器，其特征在于，前级对地电感的电 感值为后级对地电感的电感值的0％～40％。
  9. 一种改善多工器隔离度的方法，所述多工器包含多个体声波滤波器，各所述滤波器包含至少2个对地电感，其特征在于，该方法包括：
    将各所述滤波器中的对地电感分为前级对地电感和后级对地电感，其中前级对地电感靠近滤波器的输入端，后级对地电感靠近滤波器的输出端；
    将前级对地电感设置在所述多工器的封装基板的中部，后级对地电感设置在该封装基板的两侧。
  10. 根据权利要求9所述的方法，其特征在于，所述多工器还包括输入匹配电感和输出匹配电感；将输入匹配电感设置在所述封装基板的中部，输出匹配电感设置在所述封装基板的两侧。
  11. 根据权利要求9或10所述的方法，其特征在于，降低对于前级电感的电感值的选择，以减小前级电感与后级电感和/或输出电感之间的互感耦合。
  12. 根据权利要求9或10所述的方法，其特征在于，所述中部的宽度为所述封装基板宽度的25％至75％。
  13. 根据权利要求9或10所述的方法，其特征在于，所述多工器包含4个滤波器，位于封装基板两侧的电感中，不同的滤波器中的电感分别位于封装基板的四个角部区域，且各角部区域的长度占封装基板长度的30％至80％。
  14. 根据权利要求9或10所述的方法，其特征在于，所述前级对地电感和所述后级对地电感分别集成在封装基板的不同层。
  15. 一种通信设备，其特征在于，包括权利要求1至8中任一项所述的多工器。
PCT/CN2021/127484 2020-10-30 2021-10-29 多工器和改善多工器隔离度的方法以及通信设备 WO2022089596A1 (zh)

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