WO2022089394A1 - 射频基板和同轴微带转换结构 - Google Patents

射频基板和同轴微带转换结构 Download PDF

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Publication number
WO2022089394A1
WO2022089394A1 PCT/CN2021/126287 CN2021126287W WO2022089394A1 WO 2022089394 A1 WO2022089394 A1 WO 2022089394A1 CN 2021126287 W CN2021126287 W CN 2021126287W WO 2022089394 A1 WO2022089394 A1 WO 2022089394A1
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conductor
dielectric substrate
coaxial connector
coaxial
substrate
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PCT/CN2021/126287
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English (en)
French (fr)
Inventor
雷传球
倪建兴
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锐石创芯(深圳)科技股份有限公司
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Publication of WO2022089394A1 publication Critical patent/WO2022089394A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions

Definitions

  • the present application relates to the technical field of radio frequency circuits, and in particular, to a radio frequency substrate and a coaxial microstrip conversion structure.
  • coaxial lines and microstrip lines are common microwave transmission lines in microwave systems.
  • Coaxial cables are often used as transmission lines for connection between modules or systems due to their wide bandwidth, good shielding, simple structure and flexibility.
  • Microstrip line is the most used planar transmission line in Hybrid Microwave Integrated Circuit (HMIC) and Monolithic Microwave Integrated Circuit (MMIC). Circuit device integration.
  • HMIC Hybrid Microwave Integrated Circuit
  • MMIC Monolithic Microwave Integrated Circuit
  • a coaxial connector includes an outer conductor and an inner conductor arranged in the outer conductor.
  • the inner conductor of the coaxial connector is connected to the microstrip line, and the outer conductor of the coaxial connector is corresponding to the microstrip line.
  • a typical microstrip coaxial conversion transition structure can be formed. From the perspective of the electromagnetic wave mode propagated by the transmission line, the coaxial line transmits transverse electromagnetic waves (TEM), while the microstrip line transmits quasi transverse electromagnetic waves (Quasi TEM). There will be discontinuities at the connection between the shaft connector and the microstrip line, which will affect its standing wave ratio, and the insertion loss and return loss will be large, and as the frequency gradually increases, this effect will become more. for obvious.
  • Embodiments of the present application provide a radio frequency substrate and a coaxial microstrip conversion structure, so as to solve the problems of disconnection and large return loss in the existing microstrip coaxial conversion process.
  • the present application provides a radio frequency substrate, comprising a dielectric substrate, a ground plate disposed on one side of the dielectric substrate, and a microstrip line disposed on the other side of the dielectric substrate, and the dielectric substrate is provided with a coaxial connection for assembling the conductor connection hole of the inner conductor of the device;
  • the radio frequency substrate further includes a conductor connection piece and an adjustment metal piece;
  • the conductor connection piece is connected with the microstrip line and is arranged on the periphery of the conductor connection hole;
  • the adjustment metal piece A piece is connected to the microstrip line, and is arranged on the periphery of the conductor connection piece, forming a gap with the conductor connection piece.
  • the width of the gap between the adjusting metal piece and the conductor connecting piece is configured to be inversely proportional to the thickness of the dielectric substrate.
  • the width of the adjusting metal member is configured to be inversely proportional to the thickness of the dielectric substrate, and/or the length of the adjusting metal member is configured to be proportional to the thickness of the dielectric substrate.
  • the conductor connecting piece is an annular metal piece; the adjusting metal piece is a closed annular piece or a non-closed annular piece.
  • the adjustment metal piece is circular or rectangular.
  • the dielectric substrate is further provided with at least two conductor fixing holes for fixing the outer conductor of the coaxial connector, and the adjusting metal piece is located between the conductor connecting holes and the conductor fixing holes.
  • the dielectric substrate is further provided with at least two conductor fixing grooves for fixing the outer conductor of the coaxial connector, and the conductor fixing grooves are arranged on the side of the dielectric substrate where the ground plate is located.
  • the present application further provides a coaxial microstrip conversion structure, including a coaxial connector and the above-mentioned radio frequency substrate, the coaxial connector includes an outer conductor and an inner conductor arranged in the outer conductor, and the inner conductor is assembled on the The conductor connection hole is electrically connected to the conductor connection piece; the outer conductor is connected to the ground plate.
  • the dielectric substrate is further provided with at least two conductor fixing holes for fixing the outer conductor of the coaxial connector, and the adjusting metal piece is located between the conductor connecting holes and the conductor fixing holes;
  • a connecting pin extends from the outer conductor in the axial direction, and the connecting pin is assembled in the conductor fixing hole and fixed with the dielectric substrate.
  • the dielectric substrate is further provided with at least two conductor fixing grooves for fixing the outer conductor of the coaxial connector, and the conductor fixing grooves are arranged on the side of the dielectric substrate where the grounding plate is located;
  • the outer conductor extends out of the connecting part in the radial direction, and the connecting part is provided with fixed connecting holes matching the number of the conductor fixing slots;
  • the coaxial microstrip conversion structure further includes a fixed connection piece, and the fixed connection piece passes through the fixed connection hole and is assembled in the conductor fixing slot.
  • the embodiment of the present application provides a radio frequency substrate and a coaxial microstrip conversion structure.
  • the coaxial connector and the microstrip line are equivalent to an equivalent capacitor in parallel.
  • the susceptance of the capacitor becomes larger and larger. Part of the transmission signal begins to be reflected, resulting in a significant increase in the standing wave ratio and insertion loss of the coaxial connector and the microstrip line during the connection conversion.
  • the adjustment metal piece connected with the strip line a gap is formed between the adjustment metal piece and the conductor connection piece, which is equivalent to introducing an equivalent inductance, thereby reducing the capacitance of the equivalent capacitance formed by the coaxial connector and the microstrip line when the connection is converted. value, and then improve the standing wave ratio of coaxial connectors and microstrip lines during connection conversion, and reduce return loss and insertion loss.
  • FIG. 1 is a schematic diagram of a coaxial microstrip conversion structure in an embodiment of the present application
  • FIG. 2 is a schematic diagram of a radio frequency substrate in an embodiment of the present application.
  • FIG. 3 is another schematic diagram of a radio frequency substrate in an embodiment of the present application.
  • radio frequency substrate 11, dielectric substrate; 12, microstrip line; 13, grounding plate; 14, conductor connection hole; 15, conductor connection piece; 16, adjustment metal piece; 17, conductor fixing hole; 20, Coaxial connector; 21, inner conductor; 22, outer conductor; 23, connecting pin.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • the radio frequency substrate 10 includes a dielectric substrate 11 , a ground plate 13 disposed on one side of the dielectric substrate 11 , and a microchip disposed on the other side of the dielectric substrate 11 .
  • the strip line 12, the dielectric substrate 11 is provided with a conductor connection hole 14 for assembling the inner conductor 21 of the coaxial connector 20;
  • the radio frequency substrate 10 also includes a conductor connection piece 15 and an adjustment metal piece 16;
  • the conductor connection piece 15 and the microstrip line 12 is connected to the conductor connection hole 14 and is arranged on the periphery of the conductor connection hole 14 ;
  • the adjustment metal piece 16 is connected to the microstrip line 12 and is arranged on the periphery of the conductor connection piece 15 to form a gap with the conductor connection piece 15 .
  • the coaxial connector 20 includes an outer conductor 22 and an inner conductor 21 arranged in the outer conductor 22.
  • the inner conductor 21 of the coaxial connector 20 is connected to the microstrip line 12, and the outer conductor 22 is used to connect to the coaxial line.
  • the outer conductor 22 is connected to the ground plate 13 provided on the dielectric substrate 11 to realize signal transmission between the microstrip line 12 and the coaxial line.
  • the dielectric substrate 11 is provided with a conductor connection hole 14 for assembling the inner conductor 21 of the coaxial connector 20, and the conductor connection hole 14 is provided with a conductor connection piece 15 connected to the microstrip line 12 at the periphery;
  • the inner conductor 21 of the coaxial connector 20 needs to be assembled in the conductor connecting hole 14, so that the outer conductor 22 of the coaxial connector 20 is connected to the ground plate 13; at this time,
  • the conductor connector 15 is arranged on the periphery of the inner conductor 21 , and the inner conductor 21 and the conductor connector 15 can be connected by a soldering process, so as to realize the connection between the inner conductor 21 and the microstrip line 12 .
  • the width of the gap between the adjustment metal member 16 and the conductor connection member 15 is configured to be inversely proportional to the thickness of the dielectric substrate 11 .
  • an adjustment metal piece 16 connected to the microstrip line 12 is provided on the periphery of the conductor connection piece 15 .
  • the adjustment metal piece 16 is connected to the A gap is formed between the conductor connectors 15, which is equivalent to introducing an equivalent inductance L, thereby reducing the capacitance value of the equivalent capacitance C formed by the coaxial connector 20 and the microstrip line 12 during connection conversion.
  • the equivalent capacitance C formed by the dielectric substrate 11 is equivalent to introduce an equivalent inductance L, thereby reducing the capacitance value of the equivalent capacitance C formed by the coaxial connector 20 and the microstrip line 12 during connection conversion.
  • the width of the adjusting metal member 16 is configured to be inversely proportional to the thickness of the dielectric substrate 11 , and/or the length of the adjusting metal member 16 is configured to be proportional to the thickness of the dielectric substrate 11 .
  • an adjustment metal piece 16 connected to the microstrip line 12 is provided on the periphery of the conductor connection piece 15 .
  • the adjustment metal piece 16 is connected to the A gap is formed between the conductor connectors 15, which is equivalent to introducing an equivalent inductance L, thereby reducing the capacitance value of the equivalent capacitance C formed by the coaxial connector 20 and the microstrip line 12 during connection conversion. Therefore, configuration adjustment is required.
  • the inductance value of the equivalent inductance L presented by the metal piece 16 corresponds to the capacitance value of the equivalent capacitance C formed by the coaxial connector 20 and the microstrip line 12 during connection conversion. Since the inductance value of the equivalent inductance L exhibited by the adjustment metal piece 16 is related to the width and length of the adjustment metal piece 16 , the width and/or length of the adjustment metal piece 16 needs to be configured according to the thickness H of the dielectric substrate 11 . .
  • the width of the adjustment metal member 16 is configured to be inversely proportional to the thickness of the dielectric substrate 11 .
  • the equivalent capacitance C generated by the line 12 during the connection conversion needs to make the width of the adjustment metal piece 16 smaller, so as to further improve the standing wave ratio of the coaxial connector 20 and the microstrip line 12 during the connection conversion, and Reduce return loss and insertion loss.
  • the coaxial connector 20 is a 50 ⁇ SMA coaxial connector 20; the radius of the inner conductor 21 of the coaxial connector 20 is 0.15mm, the radius of the outer conductor 22 is 0.81mm, and the relative permittivity between the inner and outer conductors 22 is 2.65;
  • the material of the dielectric substrate 11 is polytetrafluoroethylene, the thickness of the dielectric substrate 11 is 0.50mm, the width of the microstrip line 12 is 1.38mm, and the corresponding characteristic impedance of the microstrip line 12 is 50 ⁇ .
  • Width X if the thickness of the dielectric substrate 11 is greater than 0.50mm, the width X of the adjustment metal piece 16 decreases; if the thickness of the dielectric substrate 11 is less than 0.50mm, the width X of the adjustment metal piece 16 increases.
  • the length of the adjustment metal piece 16 is configured to be proportional to the thickness of the dielectric substrate 11 .
  • the equivalent capacitance C generated when the line 12 is connected and converted needs to be adjusted to make the length of the metal piece 16 larger, thereby improving and reducing the standing wave ratio of the coaxial connector 20 and the microstrip line 12 when connecting and converting. return loss and insertion loss.
  • the coaxial connector 20 is a 50 ⁇ SMA coaxial connector 20; the radius of the inner conductor 21 of the coaxial connector 20 is 0.15mm, the radius of the outer conductor 22 is 0.81mm, and the relative permittivity between the inner and outer conductors 22 is 2.65;
  • the material of the dielectric substrate 11 is polytetrafluoroethylene, the thickness of the dielectric substrate 11 is 0.50mm, the width of the microstrip line 12 is 1.38mm, and the corresponding characteristic impedance of the microstrip line 12 is 50 ⁇ .
  • Length Y if the thickness of the dielectric substrate 11 is greater than 0.50 mm, the length Y of the adjusting metal piece 16 increases; if the thickness of the dielectric substrate 11 is less than 0.50 mm, the length Y of the adjusting metal piece 16 decreases.
  • the width of the adjustment metal member 16 is configured to be inversely proportional to the thickness of the dielectric substrate 11
  • the length of the adjustment metal member 16 is configured to be proportional to the thickness of the dielectric substrate 11 . That is, the greater the thickness H of the dielectric substrate 11, the greater the capacitance value of the equivalent capacitance C formed by the coaxial connector 20 and the microstrip line 12 during the connection conversion, and accordingly, the width of the adjustment metal piece 16 can be made smaller and The longer the length of the adjustment metal piece 16 is, the greater the inductance value of the equivalent inductance L presented by the adjustment metal piece 16 is, so as to cancel the equivalent capacitance generated by the coaxial connector 20 and the microstrip line 12 during connection conversion. C, thereby improving the standing wave ratio and insertion loss of the coaxial connector 20 and the microstrip line 12 during connection conversion.
  • the conductor connection member 15 is a ring-shaped metal member; the adjusting metal member 16 is a closed ring member or a non-closed ring member.
  • the equivalent capacitance C generated by the coaxial connector 20 is related to the length Y of the adjusting metal piece 16 .
  • the adjusting metal piece 16 can be configured as a closed ring, or a Close the ring.
  • the adjustment metal piece 16 is circular or rectangular.
  • the adjustment metal piece 16 can be designed in a circle, that is, the adjustment metal piece 16 can be a closed annular piece or a non-closed annular piece. Whether the adjustment metal piece 16 is closed or not is formed by the adjustment metal piece 16 . The length of the equivalent inductance L is determined.
  • the adjusting metal piece 16 may be of a rectangular design, that is, the adjusting metal piece 16 may be a closed rectangular annular piece or a non-closed annular piece. Whether the adjusting metal piece 16 is closed or not depends on the equivalent inductance L required by the adjusting metal piece 16 length is determined.
  • the dielectric substrate 11 is further provided with at least two conductor fixing holes 17 for fixing the outer conductor 22 of the coaxial connector 20 , and the adjusting metal piece 16 is located between the conductor connecting holes 14 and the conductor fixing holes 17 .
  • the dielectric substrate 11 is further provided with at least two conductor fixing holes 17 for fixing the outer conductor 22 of the coaxial connector 20 , and the conductor fixing holes 17 penetrate through the dielectric substrate 11 so as to be assembled to the ground plate in the dielectric substrate 11
  • a connecting pin 23 extends along the axial direction from the outer conductor 22 on one side of 13, which can be assembled in the conductor fixing hole 17, and the connecting pin 23 is fixed on the dielectric substrate 11 by a soldering process, so as to realize the coaxial connection between the RF substrate 10 and the conductor.
  • the device 20 is fixedly connected.
  • the adjustment metal piece 16 is located between the conductor connecting hole 14 and the conductor fixing hole 17 , which can not only facilitate the installation between the RF substrate 10 and the coaxial connector 20 , but also prevent the conductor fixing hole 17 from being located in the conductor connecting piece 15 .
  • the gap formed with the adjustment metal piece 16 makes the joint between the outer conductor 22 of the coaxial connector 20 and the radio frequency substrate 10 interfere with the equivalent inductance formed by the adjustment metal piece 16 .
  • At least two conductor fixing holes 17 are arranged symmetrically along the conductor connecting hole 14 , for example, two or three conductor fixing holes 17 may be used that are axisymmetric based on the conductor connecting hole 14 ; Four conductor fixing holes 17 symmetrical to the center.
  • the dielectric substrate 11 is further provided with at least two conductor fixing grooves (not shown in the figure) for fixing the outer conductor 22 of the coaxial connector 20, and the conductor fixing grooves are provided on the dielectric substrate 11 to the ground plate. 13 is on the side.
  • the dielectric substrate 11 is further provided with at least two conductor fixing grooves for fixing the outer conductor 22 of the coaxial connector 20 .
  • the conductor fixing grooves are arranged on the side of the ground plate 13 , and the conductor fixing grooves do not penetrate through the dielectric substrate. 11;
  • the connecting part is provided with fixed connection holes (not shown in the figure) matching the number of the conductor fixing slots, bolts or The other fixed connectors are assembled in the conductor fixing grooves through the fixed connection holes, so as to realize the fixed connection between the radio frequency substrate 10 and the coaxial connector 20 .
  • the adjusting metal piece 16 is arranged on the side of the dielectric substrate 11 where the microstrip line 12 is arranged, and the conductor fixing groove is arranged on the side where the grounding plate 13 is arranged on the dielectric substrate 11, which not only facilitates the RF substrate 10 and the same
  • the installation between the coaxial connectors 20 can also prevent the joint between the outer conductor 22 of the coaxial connector 20 and the radio frequency substrate 10 from interfering with the equivalent inductance formed by the adjustment metal piece 16 .
  • At least two conductor fixing grooves are arranged symmetrically along the conductor connection hole 14 , for example, two or three conductor fixing grooves based on the axis symmetry of the conductor connection hole 14 may be used;
  • the four symmetrical conductor fixing slots help to ensure the firmness of the connection between the radio frequency substrate 10 and the coaxial connector 20 .
  • the embodiment of the present application further provides a coaxial microstrip conversion structure.
  • the coaxial microstrip conversion structure includes a coaxial connector 20 and the above-mentioned radio frequency substrate 10 .
  • the coaxial connector 20 includes an outer conductor 22 and an inner conductor disposed in the outer conductor 22 .
  • the conductor 21, the inner conductor 21 is assembled in the conductor connecting hole 14 and is electrically connected with the conductor connecting piece 15; the outer conductor 22 is connected with the grounding plate 13.
  • the dielectric substrate 11 is provided with a conductor connection hole 14 for assembling the inner conductor 21 of the coaxial connector 20, and the conductor connection hole 14 is provided with a conductor connection piece 15 connected to the microstrip line 12 at the periphery;
  • the inner conductor 21 of the coaxial connector 20 needs to be assembled in the conductor connecting hole 14, so that the outer conductor 22 of the coaxial connector 20 is connected to the ground plate 13; at this time,
  • the conductor connector 15 is arranged on the periphery of the inner conductor 21 , and the inner conductor 21 and the conductor connector 15 can be connected by a soldering process, so as to realize the connection between the inner conductor 21 and the microstrip line 12 .
  • an equivalent capacitor C is connected in parallel between the coaxial connector 20 and the microstrip line 12 during connection conversion.
  • the susceptance of the capacitor becomes larger and larger, and part of the transmission signal begins to be reflected. , resulting in a significant increase in the standing wave ratio, return loss and insertion loss formed when the coaxial connector 20 and the microstrip line 12 are connected and converted.
  • a The adjustment metal piece 16 connected to the microstrip line 12 a gap is formed between the adjustment metal piece 16 and the conductor connecting piece 15, which is equivalent to introducing an equivalent inductance L, thereby reducing the effect of the equivalent capacitance C formed by the coaxial connector 20.
  • the capacitance value is improved, thereby improving the standing wave ratio of the coaxial connector 20 and reducing the return loss and insertion loss.
  • the dielectric substrate 11 is further provided with at least two conductor fixing holes 17 for fixing the outer conductor 22 of the coaxial connector 20, and the adjusting metal piece 16 is located between the conductor connecting hole 14 and the conductor fixing hole 17;
  • the outer conductor 22 extends out of the connecting pin 23 in the axial direction, and the connecting pin 23 is fitted in the conductor fixing hole 17 and fixed to the dielectric substrate 11 .
  • the dielectric substrate 11 is further provided with at least two conductor fixing grooves for fixing the outer conductor 22 of the coaxial connector 20 .
  • the conductor fixing grooves are arranged on the side of the ground plate 13 , and the conductor fixing grooves do not penetrate through the dielectric substrate. 11;
  • the connecting part is provided with fixed connecting holes matching the number of the conductor fixing slots, bolts or other fixed connecting pieces can be used to pass through the fixed connecting holes and be assembled in the conductor fixing slot. inside, so as to realize the fixed connection between the radio frequency substrate 10 and the coaxial connector 20 .
  • the adjusting metal piece 16 is arranged on the side of the dielectric substrate 11 where the microstrip line 12 is arranged, and the conductor fixing groove is arranged on the side where the grounding plate 13 is arranged on the dielectric substrate 11, which not only facilitates the RF substrate 10 and the same
  • the installation between the coaxial connectors 20 can also prevent the joint between the outer conductor 22 of the coaxial connector 20 and the radio frequency substrate 10 from interfering with the equivalent inductance formed by the adjustment metal piece 16 .
  • At least two conductor fixing grooves are arranged symmetrically along the conductor connection hole 14 , for example, two or three conductor fixing grooves based on the axis symmetry of the conductor connection hole 14 may be used;
  • the four symmetrical conductor fixing slots help to ensure the firmness of the connection between the radio frequency substrate 10 and the coaxial connector 20 .
  • the dielectric substrate 11 is further provided with at least two conductor fixing grooves for fixing the outer conductor 22 of the coaxial connector 20, and the conductor fixing grooves are arranged on the side of the dielectric substrate 11 where the ground plate 13 is located; the outer conductor 22
  • the connecting part extends along the radial direction, and the connecting part is provided with fixed connecting holes matching the number of the conductor fixing slots;
  • the coaxial microstrip conversion structure also includes a fixed connecting piece, and the fixed connecting piece passes through the fixed connecting hole and is assembled on the conductor fixing hole. in the slot.
  • the dielectric substrate 11 is further provided with at least two conductor fixing grooves for fixing the outer conductor 22 of the coaxial connector 20 .
  • the conductor fixing grooves are arranged on the side of the ground plate 13 , and the conductor fixing grooves do not penetrate through the dielectric substrate. 11;
  • the connecting part is provided with fixed connecting holes matching the number of the conductor fixing slots, bolts or other fixed connecting pieces can be used to pass through the fixed connecting holes and be assembled in the conductor fixing slot. inside, so as to realize the fixed connection between the radio frequency substrate 10 and the coaxial connector 20 .
  • the adjusting metal piece 16 is arranged on the side of the dielectric substrate 11 where the microstrip line 12 is arranged, and the conductor fixing groove is arranged on the side where the grounding plate 13 is arranged on the dielectric substrate 11, which not only facilitates the RF substrate 10 and the same
  • the installation between the coaxial connectors 20 can also prevent the joint between the outer conductor 22 of the coaxial connector 20 and the radio frequency substrate 10 from interfering with the equivalent inductance formed by the adjustment metal piece 16 .
  • At least two conductor fixing grooves are arranged symmetrically along the conductor connection hole 14 , for example, two or three conductor fixing grooves based on the axis symmetry of the conductor connection hole 14 may be used;
  • the four symmetrical conductor fixing slots help to ensure the firmness of the connection between the radio frequency substrate 10 and the coaxial connector 20 .

Abstract

本申请公开一种射频基板和同轴微带转换结构。该射频基板包括介质基板、设置在介质基板一侧面的接地板和设置在介质基板另一侧面的微带线，介质基板上设有用于装配同轴连接器的内导体的导体连接孔；射频基板还包括导体连接件和调整金属件；导体连接件与微带线相连，并设置在导体连接孔外围；调整金属件与微带线相连，并设置在导体连接件外围，与导体连接件之间形成间隙。本申请中，调整金属件与导体连接件之间形成有间隙，相当于引入一等效电感，从而降低同轴连接器和微带线之间连接转换时形成的等效电容的电容值，进而对同轴连接器和微带线在连接转换时形成的的驻波比进行改善，并降低回波损耗和插入损耗。

Description

射频基板和同轴微带转换结构
本申请要求以2020年10月30日提交的申请号为202011197670.9，名称为“射频基板和同轴微带转换结构”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及射频电路技术领域，尤其涉及一种射频基板和同轴微带转换结构。
背景技术
在微波电路中，同轴线和微带线是微波系统中常见的微波传输线。同轴线以其频带宽、屏蔽性好、结构简单和可弯曲性等特性，常被用作模块或者系统之间连接的传输线。微带线是混合微波集成电路(Hybrid Microwave Integrated Circuit，简称HMIC)和单片微波集成系统(Monolithic Microwave Integrated Circuit，简称MMIC)使用最多的一种平面传输线，且容易其他无源微波电路和有源电路器件集成。为了实现微带线和同轴线之间信号传输，在微波系统中不可避免地采用同轴连接器连接微带线和同轴线，实现微带同轴转换。
一般来说，同轴连接器包括外导体和设置在所述外导体内的内导体，将同轴连接器的内导体与微带线连接，将同轴连接器的外导体与微带线对应的接地板连接，即可形成一个典型微带同轴转换的过渡结构。从传输线所传播的电磁波模式来看，同轴线传输的是横电磁波(TEM)，而微带线传输的是准横电磁波(Quasi TEM)，两种不同的传输线形式在连接时，即在同轴连接器与微带线的连接处，将会产生不连续，影响其驻波比，且插入损耗和回波损耗较大，并且，随着频率的逐渐增高，这一影响将会变得更为明显。
发明内容
本申请实施例提供一种射频基板和同轴微带转换结构，以解决现有微带同轴转换过程中存在不连线和回波损耗较大的问题。
本申请提供一种射频基板，包括介质基板、设置在所述介质基板一侧面的接地板和设置在所述介质基板另一侧面的微带线，所述介质基板上设有用于装配同轴连接器的内导体 的导体连接孔；所述射频基板还包括导体连接件和调整金属件；所述导体连接件与所述微带线相连，并设置在所述导体连接孔外围；所述调整金属件与所述微带线相连，并设置在所述导体连接件外围，与所述导体连接件之间形成间隙。
优选地，所述调整金属件与所述导体连接件之间的间隙宽度，被配置为与所述介质基板的厚度成反比。
优选地，所述调整金属件的宽度被配置为与所述介质基板的厚度成反比，和/或所述调整金属件的长度被配置为与所述介质基板的厚度成正比。
优选地，所述导体连接件为环形金属件；所述调整金属件为闭合环形件或者非闭合环形件。
优选地，所述调整金属件呈圆形或者矩形。
优选地，所述介质基板上还设有用于固定同轴连接器的外导体的至少两个导体固定孔，所述调整金属件位于所述导体连接孔与所述导体固定孔之间。
优选地，所述介质基板上还设有用于固定同轴连接器的外导体的至少两个导体固定槽，所述导体固定槽设置在所述介质基板上所述接地板所在侧面。
本申请还提供一种同轴微带转换结构，包括同轴连接器和上述射频基板，所述同轴连接器包括外导体和设置在所述外导体内的内导体，所述内导体装配在所述导体连接孔内并与所述导体连接件电连接；所述外导体与所述接地板相连。
优选地，所述介质基板上还设有用于固定同轴连接器的外导体的至少两个导体固定孔，所述调整金属件位于所述导体连接孔与所述导体固定孔之间；
所述外导体沿轴向方向延伸出连接销，所述连接销装配在所述导体固定孔内并与所述介质基板固定。
优选地，所述介质基板上还设有用于固定同轴连接器的外导体的至少两个导体固定槽，所述导体固定槽设置在所述介质基板上所述接地板所在侧面；
所述外导体沿径向方向延伸出连接部件，所述连接部件上设有与所述导体固定槽数量相匹配的固定连接孔；
所述同轴微带转换结构还包括固定连接件，所述固定连接件穿过所述固定连接孔装配在所述导体固定槽内。
本申请实施例提供一种射频基板和同轴微带转换结构，同轴连接器和微带线之间相当于并联一个等效电容，随着频率的增加，电容的电纳越来越大，部分传输信号开始被反射，造成同轴连接器和微带线在连接转换时形成的驻波比和插入损耗明显增大，为了克服这一 问题，在射频基板的导体连接件外围设置有与微带线相连的调整金属件，调整金属件与导体连接件之间形成有间隙，相当于引入一等效电感，从而降低同轴连接器和微带线在连接转换时形成的等效电容的电容值，进而对同轴连接器和微带线在连接转换时的驻波比进行改善，并降低回波损耗和插入损耗。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一实施例中同轴微带转换结构的一示意图；
图2是本申请一实施例中射频基板的一示意图；
图3是本申请一实施例中射频基板的另一示意图。
图中：10、射频基板；11、介质基板；12、微带线；13、接地板；14、导体连接孔；15、导体连接件；16、调整金属件；17、导体固定孔；20、同轴连接器；21、内导体；22、外导体；23、连接销。
具体实施方式
为了使本申请所解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
在本申请的描述中，需要理解的是，术语“纵向”、“径向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相 连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
本申请实施例提供一种射频基板10，如图1-图3所示，射频基板10包括介质基板11、设置在介质基板11一侧面的接地板13和设置在介质基板11另一侧面的微带线12，介质基板11上设有用于装配同轴连接器20的内导体21的导体连接孔14；射频基板10还包括导体连接件15和调整金属件16；导体连接件15与微带线12相连，并设置在导体连接孔14外围；调整金属件16与微带线12相连，并设置在导体连接件15外围，与导体连接件15之间形成间隙。
一般来说，同轴连接器20包括外导体22和设置在外导体22内的内导体21，同轴连接器20的内导体21与微带线12相连，外导体22用于与同轴线相连，且外导体22与介质基板11上设置的接地板13相连，以实现微带线12和同轴线之间信号传输。
本示例中，介质基板11上设有用于装配同轴连接器20的内导体21的导体连接孔14，且导体连接孔14外围设置有与微带线12相连的导体连接件15；在将同轴连接器20装配到射频基板10过程中，需将同轴连接器20的内导体21装配在导体连接孔14内，使同轴连接器20的外导体22与接地板13相连；此时，导体连接件15设置在内导体21的外围，可采用焊锡工艺实现内导体21和导体连接件15连接，从而实现内导体21与微带线12相连。从电路理论分析，同轴连接器20和射频基板10上的微带线12之间连接转换时，相当于并联一个等效电容C，随着频率的增加，电容的电纳越来越大，部分传输信号开始被反射，造成同轴连接器20和微带线12在连接转换时的驻波比、回波损耗和插入损耗都明显增大，为了克服这一问题，在导体连接件15外围设置有与微带线12相连的调整金属件16，该调整金属件16与导体连接件15之间形成有间隙，相当于引入一等效电感L，从而降低同轴连接器20和微带线12之间连接转换时形成的等效电容C的电容值，进而对同轴连接器20和微带线12在连接转换时形成的的驻波比进行改善，并降低回波损耗和插入损耗。
在一实施例中，调整金属件16与导体连接件15之间的间隙宽度，被配置为与介质基板11的厚度成反比。
本示例中，介质基板11的厚度H越大，同轴连接器20所形成的等效电容C的电容值越大；反之，介质基板11的厚度H越小，同轴连接器20和射频基板10上的微带线12在连接转换时所形成的等效电容C的电容值越小。为了克服同轴连接器20和微带线12在连接转换时所形成的等效电容C，在导体连接件15外围设置有与微带线12相连的调整金属 件16，该调整金属件16与导体连接件15之间形成有间隙，相当于引入一等效电感L，从而降低同轴连接器20和微带线12在连接转换时形成的等效电容C的电容值。一般来说，调整金属件16与导体连接件15之间的间隙宽度越小，其等效电感L的电感值越大，其所能抵消的等效电容C越大，即可抵消厚度越大的介质基板11所形成的等效电容C。
在一实施例中，调整金属件16的宽度被配置为与介质基板11的厚度成反比，和/或调整金属件16的长度被配置为与介质基板11的厚度成正比。
本示例中，介质基板11的厚度H越大，同轴连接器20和微带线12在连接转换时所形成的等效电容C的电容值越大；反之，介质基板11的厚度H越小，同轴连接器20和微带线12在连接转换时所形成的等效电容C的电容值越小。为了克服同轴连接器20和微带线12在连接转换时所形成的等效电容C，在导体连接件15外围设置有与微带线12相连的调整金属件16，该调整金属件16与导体连接件15之间形成有间隙，相当于引入一等效电感L，从而降低同轴连接器20和微带线12在连接转换时形成的等效电容C的电容值，因此，需配置调整金属件16所呈现出等效电感L的电感值与同轴连接器20和微带线12在连接转换时所形成的等效电容C的电容值相对应。由于调整金属件16所呈现出等效电感L的电感值与调整金属件16的宽度和长度相关，因此，需根据介质基板11的厚度H，对调整金属件16的宽度和/或长度进行配置。
作为一示例，调整金属件16的宽度被配置为与介质基板11的厚度成反比。调整金属件16的宽度越大，调整金属件16所呈现出等效电感L的电感值越小；反之，调整金属件16的宽度越小，使调整金属件16所呈现出等效电感L的电感值越大。可理解地，介质基板11的厚度H越大，同轴连接器20和微带线12在连接转换时所形成的等效电容C的电容值越大，为抵消同轴连接器20和微带线12在连接转换时所产生的等效电容C，需使调整金属件16的宽度越小，以进而对同轴连接器20和微带线12在连接转换时的驻波比进行改善，并降低回波损耗和插入损耗。
例如，同轴连接器20为50ΩSMA同轴连接器20；同轴连接器20的内导体21半径为0.15mm，外导体22半径为0.81mm，内外导体22之间的相对介电常数为2.65；介质基板11的材料为聚四氟乙烯，介质基板11的厚度为0.50mm，微带线12的宽度为1.38mm，所对应的微带线12特性阻抗为50Ω，此时，调整金属件16的宽度X；若介质基板11的厚度大于0.50mm，则调整金属件16的宽度X减小；若介质基板11的厚度小于0.50mm，则调整金属件16的宽度X增大。
作为另一示例，调整金属件16的长度被配置为与介质基板11的厚度成正比。调整金 属件16的长度越大，调整金属件16所呈现出等效电感L的电感值越大；相应地，调整金属件16的长度越小，调整金属件16所呈现出等效电感L的电感值越小。可理解地，介质基板11的厚度H越大，同轴连接器20和微带线12在连接转换时所形成的等效电容C的电容值越大，为抵消同轴连接器20和微带线12在连接转换时所产生的等效电容C，需使调整金属件16的长度越大，进而对同轴连接器20和微带线12在连接转换时的驻波比进行改善，并降低回波损耗和插入损耗。
例如，同轴连接器20为50ΩSMA同轴连接器20；同轴连接器20的内导体21半径为0.15mm，外导体22半径为0.81mm，内外导体22之间的相对介电常数为2.65；介质基板11的材料为聚四氟乙烯，介质基板11的厚度为0.50mm，微带线12的宽度为1.38mm，所对应的微带线12特性阻抗为50Ω，此时，调整金属件16的长度Y；若介质基板11的厚度大于0.50mm，则调整金属件16的长度Y增大；若介质基板11的厚度小于0.50mm，则调整金属件16的长度Y减小。
作为又一示例，调整金属件16的宽度被配置为与介质基板11的厚度成反比，且调整金属件16的长度被配置为与介质基板11的厚度成正比。即介质基板11的厚度H越大，同轴连接器20和微带线12在连接转换时形成的等效电容C的电容值越大，相应地，可使调整金属件16的宽度越小且调整金属件16的长度越大，以使调整金属件16所呈现出等效电感L的电感值越大，以抵消同轴连接器20和微带线12在连接转换时所产生的等效电容C，进而对同轴连接器20和微带线12在连接转换时的驻波比和插入损耗进行改善。
在一实施例中，导体连接件15为环形金属件；调整金属件16为闭合环形件或者非闭合环形件。
本实施例中，同轴连接器20所产生的等效电容C与调整金属件16的长度Y相关，可根据调整金属件16的长度Y，将调整金属件16配置为闭合环形件，或者非闭合环形件。
在一实施例中，调整金属件16呈圆形或者矩形。
作为一示例，调整金属件16可以呈圆形设计，即调整金属件16可以为闭合圆环形件或者非闭合圆环形件，该调整金属件16是否闭合，由调整金属件16所需形成等效电感L的长度确定。
作为一示例，调整金属件16可以呈矩形设计，即调整金属件16可以为闭合矩形环形件或者非闭合环形件，该调整金属件16是否闭合，由调整金属件16所需形成等效电感L的长度确定。
在一实施例中，介质基板11上还设有用于固定同轴连接器20的外导体22的至少两 个导体固定孔17，调整金属件16位于导体连接孔14与导体固定孔17之间。
本实施例中，介质基板11上还设有用于固定同轴连接器20的外导体22的至少两个导体固定孔17，导体固定孔17贯穿介质基板11，以便装配在介质基板11中接地板13一侧的外导体22上沿轴向方向延伸出连接销23，可装配在导体固定孔17内，采用焊锡工艺将连接销23固定在介质基板11上，以实现射频基板10与同轴连接器20固定连接。可理解地，调整金属件16位于导体连接孔14与导体固定孔17之间，既可以方便射频基板10和同轴连接器20之间的安装，又可以避免导体固定孔17位于导体连接件15与调整金属件16所形成的间隙，使得同轴连接器20的外导体22与射频基板10之间接合点，对调整金属件16所形成的等效电感造成干扰。
作为一示例，至少两个导体固定孔17沿导体连接孔14对称设置，例如，可采用基于导体连接孔14轴对称的两个或三个导体固定孔17；或者采用基于导体连接孔14轴对称和中心对称的四个导体固定孔17。
在一实施例中，介质基板11上还设有用于固定同轴连接器20的外导体22的至少两个导体固定槽(图中未示出)，导体固定槽设置在介质基板11上接地板13所在侧面。
本实施例中，介质基板11上还设有用于固定同轴连接器20的外导体22的至少两个导体固定槽，导体固定槽设置在接地板13所在侧面，且导体固定槽不贯穿介质基板11；在外导体22沿径向方向延伸出连接部件(图中未示出)，连接部件上设有与导体固定槽数量相匹配的固定连接孔(图中未示出)时，可采用螺栓或者其他固定连接件穿过固定连接孔装配在导体固定槽内，以实现射频基板10与同轴连接器20固定连接。可理解地，调整金属件16设置在介质基板11上设置微带线12的一侧，而导体固定槽设置在介质基板11上设有接地板13的一侧，既可以方便射频基板10和同轴连接器20之间的安装，又可以避免同轴连接器20的外导体22与射频基板10之间接合点，对调整金属件16所形成的等效电感造成干扰。
作为一示例，至少两个导体固定槽沿导体连接孔14对称设置，例如，可采用基于导体连接孔14轴对称的两个或三个导体固定槽；或者采用基于导体连接孔14轴对称和中心对称的四个导体固定槽，有助于保障射频基板10与同轴连接器20连接的牢固性。
本申请实施例还提供一种同轴微带转换结构，同轴微带转换结构包括同轴连接器20和上述射频基板10，同轴连接器20包括外导体22和设置在外导体22内的内导体21，内导体21装配在导体连接孔14内并与导体连接件15电连接；外导体22与接地板13相连。
本示例中，介质基板11上设有用于装配同轴连接器20的内导体21的导体连接孔14， 且导体连接孔14外围设置有与微带线12相连的导体连接件15；在将同轴连接器20装配到射频基板10过程中，需将同轴连接器20的内导体21装配在导体连接孔14内，使同轴连接器20的外导体22与接地板13相连；此时，导体连接件15设置在内导体21的外围，可采用焊锡工艺实现内导体21和导体连接件15连接，从而实现内导体21与微带线12相连。从电路理论分析，同轴连接器20和微带线12在进行连接转换时之间并联一个等效电容C，随着频率的增加，电容的电纳越来越大，部分传输信号开始被反射，造成同轴连接器20和微带线12在进行连接转换时所形成的驻波比、回波损耗和插入损耗都明显增大，为了克服这一问题，在导体连接件15外围设置有与微带线12相连的调整金属件16，该调整金属件16与导体连接件15之间形成有间隙，相当于引入一等效电感L，从而降低同轴连接器20形成的等效电容C的电容值，进而对同轴连接器20的驻波比进行改善，并降低回波损耗和插入损耗。
在一实施例中，介质基板11上还设有用于固定同轴连接器20的外导体22的至少两个导体固定孔17，调整金属件16位于导体连接孔14与导体固定孔17之间；外导体22沿轴向方向延伸出连接销23，连接销23装配在导体固定孔17内并与介质基板11固定。
本实施例中，介质基板11上还设有用于固定同轴连接器20的外导体22的至少两个导体固定槽，导体固定槽设置在接地板13所在侧面，且导体固定槽不贯穿介质基板11；在外导体22沿径向方向延伸出连接部件，连接部件上设有与导体固定槽数量相匹配的固定连接孔时，可采用螺栓或者其他固定连接件穿过固定连接孔装配在导体固定槽内，以实现射频基板10与同轴连接器20固定连接。可理解地，调整金属件16设置在介质基板11上设置微带线12的一侧，而导体固定槽设置在介质基板11上设有接地板13的一侧，既可以方便射频基板10和同轴连接器20之间的安装，又可以避免同轴连接器20的外导体22与射频基板10之间接合点，对调整金属件16所形成的等效电感造成干扰。
作为一示例，至少两个导体固定槽沿导体连接孔14对称设置，例如，可采用基于导体连接孔14轴对称的两个或三个导体固定槽；或者采用基于导体连接孔14轴对称和中心对称的四个导体固定槽，有助于保障射频基板10与同轴连接器20连接的牢固性。
在一实施例中，介质基板11上还设有用于固定同轴连接器20的外导体22的至少两个导体固定槽，导体固定槽设置在介质基板11上接地板13所在侧面；外导体22沿径向方向延伸出连接部件，连接部件上设有与导体固定槽数量相匹配的固定连接孔；同轴微带转换结构还包括固定连接件，固定连接件穿过固定连接孔装配在导体固定槽内。
本实施例中，介质基板11上还设有用于固定同轴连接器20的外导体22的至少两个 导体固定槽，导体固定槽设置在接地板13所在侧面，且导体固定槽不贯穿介质基板11；在外导体22沿径向方向延伸出连接部件，连接部件上设有与导体固定槽数量相匹配的固定连接孔时，可采用螺栓或者其他固定连接件穿过固定连接孔装配在导体固定槽内，以实现射频基板10与同轴连接器20固定连接。可理解地，调整金属件16设置在介质基板11上设置微带线12的一侧，而导体固定槽设置在介质基板11上设有接地板13的一侧，既可以方便射频基板10和同轴连接器20之间的安装，又可以避免同轴连接器20的外导体22与射频基板10之间接合点，对调整金属件16所形成的等效电感造成干扰。
作为一示例，至少两个导体固定槽沿导体连接孔14对称设置，例如，可采用基于导体连接孔14轴对称的两个或三个导体固定槽；或者采用基于导体连接孔14轴对称和中心对称的四个导体固定槽，有助于保障射频基板10与同轴连接器20连接的牢固性。
以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围，均应包含在本申请的保护范围之内。

Claims (14)

  1. 一种射频基板，包括介质基板、设置在所述介质基板一侧面的接地板和设置在所述介质基板另一侧面的微带线，所述介质基板上设有用于装配同轴连接器的内导体的导体连接孔；其特征在于，所述射频基板还包括导体连接件和调整金属件；所述导体连接件与所述微带线相连，并设置在所述导体连接孔外围；所述调整金属件与所述微带线相连，并设置在所述导体连接件外围，与所述导体连接件之间形成间隙。
  2. 如权利要求1所述的射频基板，其特征在于，所述调整金属件与所述导体连接件之间的间隙宽度，被配置为与所述介质基板的厚度成反比。
  3. 如权利要求1所述的射频基板，其特征在于，所述调整金属件的宽度被配置为与所述介质基板的厚度成反比，和/或所述调整金属件的长度被配置为与所述介质基板的厚度成正比。
  4. 如权利要求1所述的射频基板，其特征在于，所述导体连接件为环形金属件；所述调整金属件为闭合环形件或者非闭合环形件。
  5. 如权利要求4所述的射频基板，其特征在于，所述调整金属件呈圆形或者矩形。
  6. 如权利要求1所述的射频基板，其特征在于，所述介质基板上还设有用于固定同轴连接器的外导体的至少两个导体固定孔，所述调整金属件位于所述导体连接孔与所述导体固定孔之间。
  7. 如权利要求1所述的射频基板，其特征在于，所述介质基板上还设有用于固定同轴连接器的外导体的至少两个导体固定槽，所述导体固定槽设置在所述介质基板上所述接地板所在侧面。
  8. 一种同轴微带转换结构，其特征在于，包括同轴连接器和射频基板，所述射频基板包括介质基板、设置在所述介质基板一侧面的接地板和设置在所述介质基板另一侧面的微带线，所述介质基板上设有用于装配同轴连接器的内导体的导体连接孔；所述射频基板还包括导体连接件和调整金属件；所述导体连接件与所述微带线相连，并设置在所述导体连接孔外围；所述调整金属件与所述微带线相连，并设置在所述导体连接件外围，与所述导体连接件之间形成间隙；所述同轴连接器包括外导体和设置在所述外导体内的内导体，所述内导体装配在所述导体连接孔内并与所述导体连接件电连接；所述外导体与所述接地板相连。
  9. 如权利要求8所述的同轴微带转换结构，其特征在于，所述调整金属件与所述导 体连接件之间的间隙宽度，被配置为与所述介质基板的厚度成反比。
  10. 如权利要求8所述的同轴微带转换结构，其特征在于，所述调整金属件的宽度被配置为与所述介质基板的厚度成反比，和/或所述调整金属件的长度被配置为与所述介质基板的厚度成正比。
  11. 如权利要求8所述的同轴微带转换结构，其特征在于，所述导体连接件为环形金属件；所述调整金属件为闭合环形件或者非闭合环形件。
  12. 如权利要求11所述的同轴微带转换结构，其特征在于，所述调整金属件呈圆形或者矩形。
  13. 如权利要求8所述的同轴微带转换结构，其特征在于，所述介质基板上还设有用于固定同轴连接器的外导体的至少两个导体固定孔，所述调整金属件位于所述导体连接孔与所述导体固定孔之间；
    所述外导体沿轴向方向延伸出连接销，所述连接销装配在所述导体固定孔内并与所述介质基板固定。
  14. 如权利要求8所述的同轴微带转换结构，其特征在于，所述介质基板上还设有用于固定同轴连接器的外导体的至少两个导体固定槽，所述导体固定槽设置在所述介质基板上所述接地板所在侧面；
    所述外导体沿径向方向延伸出连接部件，所述连接部件上设有与所述导体固定槽数量相匹配的固定连接孔；
    所述同轴微带转换结构还包括固定连接件，所述固定连接件穿过所述固定连接孔装配在所述导体固定槽内。
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