WO2022073235A1 - 显示装置和显示装置的制作方法 - Google Patents

显示装置和显示装置的制作方法 Download PDF

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Publication number
WO2022073235A1
WO2022073235A1 PCT/CN2020/120204 CN2020120204W WO2022073235A1 WO 2022073235 A1 WO2022073235 A1 WO 2022073235A1 CN 2020120204 W CN2020120204 W CN 2020120204W WO 2022073235 A1 WO2022073235 A1 WO 2022073235A1
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WIPO (PCT)
Prior art keywords
fingerprint identification
film
flexible
heat dissipation
display device
Prior art date
Application number
PCT/CN2020/120204
Other languages
English (en)
French (fr)
Inventor
阮益平
郝东佳
李中华
王世鹏
郭少飞
Original Assignee
京东方科技集团股份有限公司
北京京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 京东方科技集团股份有限公司, 北京京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US18/031,004 priority Critical patent/US20230380252A1/en
Priority to PCT/CN2020/120204 priority patent/WO2022073235A1/zh
Priority to CN202080002268.2A priority patent/CN114762023B/zh
Publication of WO2022073235A1 publication Critical patent/WO2022073235A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/30—Collimators
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/878—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present disclosure relates to the field of semiconductor technology, and in particular, to a display device and a manufacturing method of the display device.
  • Fingerprint recognition utilizes the unique characteristics of each person's fingerprints, which are unique in skin texture and details. By comparing the fingerprint of the collected object with the pre-stored fingerprint data, it can confirm whether the fingerprint collection object is the target object.
  • Single-finger fingerprint recognition in a fixed area has been widely used in mobile phones, and this fingerprint module is generally a rigid fingerprint recognition module.
  • this fingerprint module is generally a rigid fingerprint recognition module.
  • the use of rigid fingerprint modules is limited due to the curvature.
  • fingerprint modules are required to cooperate with organic display screens to achieve large-area fingerprint recognition in flexible and non-fixed areas.
  • Embodiments of the present disclosure provide a display device, including:
  • a display panel having a display surface, and a back surface opposite to the display surface
  • a heat dissipation film attached to the back of the display panel, and the heat dissipation film has a window area
  • a flexible fingerprint identification member located on the side of the heat dissipation film away from the display panel, the flexible fingerprint identification member includes: a fingerprint identification part located in the window area, and a fingerprint identification part located away from the display panel
  • the heat dissipation film is overlapped.
  • the thickness of the flexible fingerprint identification member at the windowed region is greater than the thickness of the heat dissipation film, and the first portion and the The second part is connected in a Z shape at the overlapping position with the heat dissipation film.
  • the flexible heat dissipation component includes: copper foil, and a nano-carbon layer coated on the side of the copper foil facing the fingerprint identification component.
  • the fingerprint identification component includes: a flexible substrate, and a functional layer on a side of the flexible substrate away from the flexible heat dissipation component;
  • the fingerprint identification component further includes: a filter film located on the side of the functional layer away from the flexible substrate.
  • the filter film is an infrared cut-off film, and the infrared cut-off film blocks light with a wavelength greater than 530 nanometers.
  • the fingerprint identification component further includes: a collimation structure located on a side of the filter film away from the functional layer.
  • the collimation structure includes a plurality of convex lenses distributed in an array, and a reflective layer with a plurality of via holes distributed in an array on the side of the convex lens facing the functional layer, so The via holes are in one-to-one correspondence with the convex lenses, and the via holes and the centers of the convex lenses are located on the same straight line.
  • the via hole is located at the focal point of the corresponding convex lens.
  • the projection of the convex lens on the flexible substrate is a hexagon.
  • the fingerprint identification component further includes: an optical glue located between the collimation structure and the filter film.
  • the fingerprint identification component has a fingerprint identification area, and a frame area located on the periphery of the fingerprint identification area;
  • the fingerprint identification component further includes: a sealant on the side of the alignment structure facing the display panel, the sealant is located in the frame area.
  • the fingerprint identification component further includes: a double-sided adhesive tape located between the flexible heat dissipation component and the fingerprint identification component, the flexible heat dissipation component and the fingerprint identification component pass through the flexible heat dissipation component and the fingerprint identification component. Double-sided adhesive bonding.
  • the projection of the first portion on the display surface is a rectangle, having opposite first and second sides, and opposite third and fourth sides;
  • the first side is bound with a first chip on film, and the fourth side is bound with a second chip on film;
  • the second portion includes a first sub-radiation portion extending from the second side, and a second sub-scattering portion extending from the third side.
  • the first chip on film is provided with a fingerprint identification chip;
  • the second chip on film is provided with a gate driving chip;
  • the second chip on film is also bound with a flexible circuit board.
  • the area of the flexible fingerprint identification member accounts for 40% to 70% of the area of the display panel.
  • Embodiments of the present disclosure further provide a method for fabricating the display device provided by the embodiments of the present disclosure, including:
  • forming a flexible fingerprint identification member includes:
  • a flexible heat dissipation member is attached to the side of the fingerprint identification member away from the display panel.
  • the forming the fingerprint identification component on the rigid substrate includes:
  • the bonding structure includes a rigid substrate and a flexible substrate bonded to the rigid substrate;
  • a collimating structure is attached to the side of the filter film away from the flexible substrate by optical glue
  • FIG. 1 is a schematic top-view structural diagram of a display device according to an embodiment of the present disclosure
  • Fig. 2 is a schematic cross-sectional view at the position shown along the dotted line of Fig. 1;
  • FIG. 3 is a schematic top-view structural diagram of a flexible fingerprint identification member according to an embodiment of the present disclosure
  • FIG. 4 is a schematic top-view structure diagram of a fingerprint identification component according to an embodiment of the present disclosure
  • FIG. 5 is a schematic diagram of light transmission of a fingerprint identification component provided with a filter film according to an embodiment of the present disclosure
  • FIG. 6 is a schematic diagram of a collimation structure provided by an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of the divergence angle of light after a collimation structure provided by an embodiment of the present disclosure
  • FIG. 8 is a schematic diagram of a manufacturing process of a display device according to an embodiment of the present disclosure.
  • FIG. 2 is a schematic cross-sectional view taken along the dotted line AB in FIG. 1
  • FIG. 3 is a schematic structural diagram of a flexible identification member
  • the display panel 1 has a display surface 11 and a back surface 12 opposite to the display surface 11;
  • the heat dissipation film 2 is attached to the back surface 12 of the display panel 1, and the heat dissipation film 2 has a window area K;
  • the flexible fingerprint identification member 3 is located on the side of the heat dissipation film 2 away from the display panel 1, and the flexible fingerprint identification member 3 includes: a fingerprint identification component 31 located in the window area K, and a flexible fingerprint identification component 31 located on the side away from the display panel 1.
  • the heat dissipation member 32; the flexible heat dissipation member 32 has a first part 321 covering the fingerprint identification part 31, and a second part 322 extending from the first part 321, and the second part 322 overlaps with the heat dissipation film 2 at the edge of the window area K .
  • a flexible fingerprint identification member is disposed on the back of the display panel, and the flexible fingerprint identification member includes a first part covering the fingerprint identification part, and a second part extending from the first part, wherein the second part is connected to the opening
  • the heat dissipation part at the edge of the window area is overlapped.
  • the flexible fingerprint identification member is easy to bend. Using the soft-to-hard bonding technology, it can be pasted and bent with the curved display panel, improving the rigid fingerprint of the prior art.
  • the use of the identification member is limited, and the fingerprint identification problem of a large area in a flexible and non-fixed area cannot be realized;
  • the heat generated by the fingerprint identification member is diffused to the heat dissipation film in time, which can further improve the problem of high temperature and poor heat dissipation due to long-term use when a large-area fingerprint identification area is realized.
  • the display panel in the embodiment of the present disclosure is a curved display panel as shown in FIG. 2
  • the curved display panel may be a curved display panel with a curved edge, or a curved display panel with a curved overall shape.
  • the display panel may specifically be an organic light-emitting display panel, and the organic light-emitting display panel may specifically include a substrate substrate, and a driving layer, a light-emitting device, and an encapsulation layer sequentially located on one side of the substrate substrate, wherein the driving layer may include a driving layer for driving the light-emitting device to emit light.
  • the driving circuit; the light-emitting device may specifically include an anode, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, and a cathode layer arranged in sequence.
  • the thickness of the flexible fingerprint identification member 3 at the window area K is greater than the thickness of the heat dissipation film 2 , and the first portion 321 and the The second portion 322 is connected in a Z shape at the overlapping position with the heat dissipation film 2 .
  • the first part 321 and the second part 322 are connected in a Z shape at the overlapping position with the heat dissipation film 2 .
  • the heat generated by the fingerprint identification component 31 can be dissipated through the
  • the flexible heat dissipation member 32 conducts to the heat dissipation film 2 to prevent overheating of the area where the fingerprint identification member 31 is located (the area indicated by the dotted frame CC in FIG. 1 or FIG. 4 ), which affects the performance of the display panel and the fingerprint identification member.
  • the flexible heat dissipation component 32 includes: copper foil, and a nano-carbon layer coated on the side of the copper foil facing the fingerprint identification component 31 to form a nano-carbon-copper layer.
  • the thermal conductivity can be 400W/m.K
  • the nano-carbon layer can be radiated and dissipated.
  • the flexible heat dissipation component 32 includes: copper foil, and a nano-carbon layer coated on the copper foil on the side facing the fingerprint identification component 31 , the nano-carbon-copper layer itself has a certain hardness and can be bent, and the fingerprint identification
  • the flexible substrate (such as PI film) of the component is attached to the nano-carbon copper layer and the strength is improved.
  • the nano-carbon copper layer can play the role of protecting the functional layer of the fingerprint recognition component.
  • the nano-carbon copper layer can also collect the fingerprint recognition component.
  • the area acts as a heat sink.
  • the flexible substrate (eg, PI film) of the fingerprint identification component and the nano-carbon copper layer can be bonded together by double-sided tape.
  • the thickness of the nano-carbon copper layer can be 80um-120um; specifically, it can also be 90um-110um; specifically, it can also be 95um-105um; specifically, it can also be 96um; specifically, it can also be 98um; specifically , can also be 100um.
  • FIG. 4 is an enlarged partial schematic diagram of the fingerprint identification component at the position of the dotted frame T in FIG. 1 .
  • the fingerprint identification component 31 includes: a flexible substrate 310 , which is located on the flexible substrate 310 The functional layer 311 on the side away from the flexible heat dissipation member 32 ; the fingerprint identification member 31 further includes: a filter film 312 on the side of the functional layer 311 away from the flexible substrate 310 .
  • the filter film 312 is an infrared cut-off film, and the infrared cut-off film blocks light with a wavelength greater than 530 nanometers.
  • the fingerprint identification component 31 is coated with an infrared cut-off film on the functional layer 311, which can prevent light with a wavelength greater than 530 nm from being incident on the functional layer 311, and the infrared cut-off film can reduce a large amount of light entering the functional layer 311.
  • the infrared cut-off film can reduce a large amount of light entering the functional layer 311.
  • the collected fingerprint image will explode.
  • Infrared light rays with larger wavelengths cannot enter the functional layer 311, which can avoid over-exposure of the fingerprint image and significantly improve the contrast of the fingerprint image.
  • the functional layer 311 in the fingerprint identification component 31 may specifically include a plurality of identification units distributed in an array, and each identification unit may include: a first electrode and a second electrode disposed opposite to each other, and a first electrode and a second electrode located in the first electrode and the second electrode.
  • Photosensitive film layer that can perform photoelectric conversion between electrodes.
  • the fingerprint identification component 3 further includes: a collimation structure 314 located on the side of the filter film 312 away from the functional layer 311 .
  • the collimation structure 314 includes a plurality of convex lenses 3141 distributed in an array, and a reflective layer located on the side of the convex lens 3141 facing the functional layer 311 with a plurality of via holes 3142 distributed in an array, the via holes 3142 and the convex lenses 3141 are one by one
  • the center of the via hole 3142 and the convex lens 3141 are located on the same straight line.
  • the via hole 3142 is located at the focal point of the corresponding convex lens 3141 .
  • the position of the via hole 3142 is at the focus of the micro-convex lens 3141 , and the light emitted by the display panel 1 passes through the micro-convex lens 3141 on the collimating structure 314 , and the light is refracted , make the angle of the light smaller, and constrain the divergent viewing angle of the light to be less than 8° (as shown in FIG. 7 ).
  • the small-angle light passes through the transparent via 3142 and is received by the photoelectric conversion functional layer in the functional layer 311, and the light passes through the collimating structure 314. After the collimation, the resolution of fingerprint identification can be improved.
  • the large-angle light cannot pass through the tiny transparent holes 3142 on the collimation structure 314, and is reflected back by the reflective layer, which can enhance the brightness of the display panel 1 in the area where the fingerprint identification part 31 is located. There is no obvious difference in brightness between the fingerprint identification area and the non-fingerprint identification area of the display panel 1 .
  • the projection of the convex lens 3141 on the flexible substrate 310 is a hexagon, which is a hexagonal convex lens structure.
  • the fingerprint identification component 31 further includes: an optical glue 313 located between the collimation structure 314 and the filter film 312 , so as to realize the lamination of the collimation structure 314 .
  • the thickness of the optical adhesive 313 may be 10um ⁇ 30um; specifically, for example, it may be 15um; specifically, for example, it may be 25um.
  • the fingerprint identification component 31 has a fingerprint identification area and a frame area located at the periphery of the fingerprint identification area; as shown in FIG.
  • the sealant 315 is located in the frame area, so as to realize the adhesion of the fingerprint identification component 31 to the display panel 1 .
  • the sealant can be in the shape of a circle surrounding the fingerprint identification area.
  • the fingerprint identification component 31 further includes: a double-sided adhesive tape between the flexible heat dissipation component 32 and the fingerprint identification component 31 , and the flexible heat dissipation component 32 and the fingerprint identification component 31 are bonded together by the double-sided adhesive tape.
  • the projection of the first portion 321 on the display surface is a rectangle, with opposite first side S1 and second side S2 , and opposite third side S3 and fourth side Side S4; the first side S1 is bound with the first chip on film 41, and the fourth side S4 is bound with the second chip on film 42; the second portion 322 includes a first sub-film extending from the second side S2 The heat dissipation portion 3221, and the second sub-scattering portion 3222 extending from the third side S3.
  • the first sub-radiating portion 3221 may be rectangular, and the area of the first sub-radiating portion 3221 may be one-seventh to one-third of the area of the first sub-radiating portion 321 ; specifically, the area of the first sub-radiating portion 3221 It can be a quarter of the area of the first part 321 .
  • the second sub-radiating portion 3222 may be rectangular, and the area of the second sub-radiating portion 3222 may be one-seventh to one-third of the area of the first portion 321 ; specifically, the area of the second sub-radiating portion 3222 It can be a quarter of the area of the first part 321 .
  • the area of the flexible fingerprint identification member 3 accounts for 40% to 70% of the area of the display panel 1 .
  • the flexible fingerprint identification member 3 can be bent and bent when it is attached to the display panel 1. At the edge of the curved display panel, the flexible fingerprint identification member 3 can be attached to the curved area according to the curved surface of the display panel 1. The fingerprint identification member 3 is not affected by the bonding plane, and the fingerprint identification area can be extended to the edge curved surface of the display panel 1, thereby increasing the area of the fingerprint identification module, thereby realizing a large-area fingerprint identification on a half screen.
  • the first chip on film 41 is provided with a fingerprint identification chip 411 ; the second chip on film 42 is provided with a gate driver chip 421 ; the second chip on film 42 is also bound with a flexible circuit plate 5.
  • Components 51 may also be specifically provided on the flexible circuit board 5 .
  • the constituent materials of the fingerprint identification component 31 are all flexible materials except for the peripheral fingerprint identification chip 411 , the gate driving chip 421 and the components 51 .
  • the functional layer 311 in the fingerprint identification component 31 may be a flexible film layer.
  • an embodiment of the present disclosure further provides a manufacturing method of a display device provided by an embodiment of the present disclosure, as shown in FIG. 8 , including:
  • Step S100 forming a flexible fingerprint identification member
  • Step S200 attaching the flexible fingerprint identification member to the window area of the heat dissipation film on the back of the display panel;
  • forming a flexible fingerprint identification member includes:
  • Step S110 forming a fingerprint identification component on the rigid substrate
  • Step S120 peeling off the rigid substrate
  • Step S130 attaching a flexible heat dissipation member to the side of the fingerprint identification member away from the display panel.
  • forming the fingerprint identification component on the rigid substrate includes:
  • Step S111 forming a functional layer on the bonding structure, wherein the bonding structure includes a rigid substrate and a flexible substrate bonded to the rigid substrate;
  • Step S112 forming a filter film on the side of the functional layer away from the flexible substrate;
  • Step S113 attaching the collimation structure on the side of the filter film away from the flexible substrate by optical glue
  • Step S114 bonding the first chip on film and the second chip on film.
  • the functional layer 311 of the fingerprint identification component 31 is fabricated on the bonding structure of a flexible substrate (PI film) and a rigid substrate (such as a glass substrate) using a thin film transistor process.
  • the PI film can be on top and the glass substrate can be on top.
  • the glass substrate protects the PI film during the manufacturing process, and the functional layer 311 is routed on the flexible PI film surface.
  • the glass substrate plays the role of protecting the wiring on the PI film, preventing the PI film from bending or expanding during the production process.
  • the thickness of the PI film can be 15um or 38um, preferably 15um
  • the thickness of the protective glass substrate is generally 0.5mm or 0.7mm, preferably 0.7mm.
  • Step 2 After the large piece of functional layer 311 is fabricated, it is cut into small pieces of fingerprint identification element sensor.
  • Step 3 Coating an infrared cut-off film on a small piece of fingerprint identification element sensor, light with a wavelength greater than 530 nm is blocked and cannot be incident on the sensor functional layer.
  • Step 4 Use optical glue 313 (OCA) to fit the alignment structure 314 on the fingerprint identification element sensor, and the optical glue 313 between the alignment structure 314 and the fingerprint identification element sensor is a surface sticker; the thickness of the alignment structure 314 is generally 56um, the thickness of the optical glue 313 is generally 25um, 75um or 100um, etc., preferably 25um; the optical glue 313 is a multi-layer film, the upper layer has a hexagonal convex lens 3141, and the lower layer is a reflective layer with an array of transparent vias 3142.
  • OCA optical glue 313
  • Step 5 Bind the first chip on film 41 , the second chip on film 42 and the flexible circuit board 5 on the fingerprint identification element sensor.
  • Step 6 After the semi-finished module of the above fingerprint identification element sensor is fabricated, the protective glass substrate needs to be peeled off.
  • Step 7 After peeling off the protective layer glass substrate, the flexible heat dissipation component 32 (nano carbon copper layer) needs to be pasted on the PI film.
  • the nano carbon copper layer plays the role of dissipating heat and protecting the PI film functional layer.
  • the PI film layer and the nano carbon copper layer The layers are bonded together by double-sided tape.
  • the thickness of the nano-carbon copper layer is generally 50um or 100um, preferably 100um.
  • each layer of film material has the above various thicknesses to choose from. Selecting the thinnest thickness can make the optical fingerprint module ultra-thin.
  • the thickness of each layer can be as follows: the sealant 315 can be 25um, the collimation structure 314 can be 56um, and the optical adhesive 313 (OCA) can be 25um , the thickness of the flexible substrate 310 and the functional layer 311 can be 15um, the filter film 312 (infrared cut-off film) can be 5um, the flexible heat dissipation component 32 (nano carbon copper layer) can be 100um, and the total thickness of the flexible fingerprint identification member 3 Thickness can be 226um.
  • a flexible fingerprint identification member is disposed on the back of the display panel, and the flexible fingerprint identification member includes a first part covering the fingerprint identification part, and a second part extending from the first part. The second part is overlapped with the heat dissipation part at the edge of the window area.
  • the flexible fingerprint identification member is easy to bend, and can be attached to the curved display panel by using the soft-to-hard bonding technology.
  • the problem of the limited use of the rigid fingerprint identification member in the prior art and the inability to realize the large-area fingerprint identification in the flexible non-fixed area is improved; on the other hand, the second part of the flexible heat dissipation member in the embodiment of the present disclosure is connected to the edge of the window area.
  • the heat dissipation film is overlapped, so that the heat generated by the flexible fingerprint identification member can be diffused to the heat dissipation film in time, which can further improve the problem of high temperature and poor heat dissipation when used for a long time when a large-area fingerprint identification area is realized.

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Abstract

一种显示装置和显示装置的制作方法，其中显示装置包括：显示面板（1），具有显示面（11），以及与显示面（11）相对的背面（12）；散热膜（2），贴附于显示面板（1）的背面（12），散热膜（2）具有开窗区域（K）；柔性指纹识别构件（3），位于散热膜（2）背离显示面板（1）的一侧，柔性指纹识别构件（3）包括位于开窗区域（K）的指纹识别部件（31），以及位于指纹识别部件（31）背离显示面板（1）一侧的柔性散热部件（32）；柔性散热部件（32）具有覆盖指纹识别部件（31）的第一部（321），以及由第一部（321）延伸出的第二部（322），第二部（322）与开窗区域（K）边缘的散热膜（2）搭接。

Description

显示装置和显示装置的制作方法 技术领域
本公开涉及半导体技术领域，尤其涉及一种显示装置和显示装置的制作方法。
背景技术
指纹识别利用每个人的指纹皮肤纹路、细节特征各不相同，具有唯一性的特点，通过将采集对象的指纹和预先保存的指纹数据进行比较，来确认指纹采集对象是否为目标对象。固定区域单指指纹识别在手机上已广泛应用，这种指纹模组一般为刚性指纹识别模组。对于有机显示屏，由于带有弧度，刚性指纹模组的使用受到限制，为了更好的用户体验，需要指纹模组配合有机显示屏，实现柔性无固定区域大面积的指纹识别。
发明内容
本公开实施例提供一种显示装置，其中，包括：
显示面板，具有显示面，以及与所述显示面相对的背面；
散热膜，贴附于所述显示面板的所述背面，所述散热膜具有开窗区域；
柔性指纹识别构件，位于所述散热膜背离所述显示面板的一侧，所述柔性指纹识别构件包括：位于所述开窗区域的指纹识别部件，以及位于所述指纹识别部件背离所述显示面板一侧的柔性散热部件；所述柔性散热部件具有覆盖所述指纹识别部件的第一部，以及由所述第一部延伸出的第二部，所述第二部与所述开窗区域边缘的所述散热膜搭接。
在一种可能的实施方式中，在垂直于所述显示面的方向上，所述柔性指纹识别构件在所述开窗区域处的厚度大于所述散热膜的厚度，所述第一部和所述第二部在与所述散热膜搭接位置处呈Z形衔接。
在一种可能的实施方式中，所述柔性散热部件包括：铜箔，以及涂布于 所述铜箔的面向所述指纹识别部件一侧的纳米碳层。
在一种可能的实施方式中，所述指纹识别部件包括：柔性衬底，位于所述柔性衬底背离所述柔性散热部件一侧的功能层；
所述指纹识别部件还包括：位于所述功能层的背离所述柔性衬底一侧的滤光膜。
在一种可能的实施方式中，所述滤光膜为红外截止膜，所述红外截止膜阻挡波长大于530纳米的光线。
在一种可能的实施方式中，所述指纹识别部件还包括：位于所述滤光膜的背离所述功能层一侧的准直结构。
在一种可能的实施方式中，所述准直结构包括多个呈阵列分布的凸透镜，以及位于所述凸透镜的面向所述功能层一侧的具有多个呈阵列分布过孔的反射层，所述过孔与所述凸透镜一一对应，所述过孔与所述凸透镜的中心位于同一条直线。
在一种可能的实施方式中，所述过孔位于对应的所述凸透镜的焦点。
在一种可能的实施方式中，所述凸透镜在所述柔性衬底的投影为六边形。
在一种可能的实施方式中，所述指纹识别部件还包括：位于所述准直结构与所述滤光膜之间的光学胶。
在一种可能的实施方式中，所述指纹识别部件具有指纹识别区，以及位于所述指纹识别区外围的边框区；
所述指纹识别部件还包括：位于所述准直结构的面向所述显示面板一侧的框胶，所述框胶位于所述边框区。
在一种可能的实施方式中，所述指纹识别部件还包括：位于所述柔性散热部件与所述指纹识别部件之间的双面胶，所述柔性散热部件和所述指纹识别部件通过所述双面胶贴合。
在一种可能的实施方式中，所述第一部在所述显示面的投影为矩形，具有相对的第一侧边和第二侧边，以及相对的第三侧边和第四侧边；所述第一侧边绑定有第一覆晶膜，所述第四侧边绑定有第二覆晶膜；
所述第二部包括由所述第二侧边延伸出的第一子散热部，以及由所述第三侧边延伸出的第二子散射部。
在一种可能的实施方式中，所述第一覆晶膜设置有指纹识别芯片；所述第二覆晶膜设置有栅极驱动芯片；
所述第二覆晶膜还绑定有柔性电路板。
在一种可能的实施方式中，所述柔性指纹识别构件的面积占所述显示面板面积的40％～70％。
本公开实施例还提供一种如本公开实施例提供的所述显示装置的制作方法，其中，包括：
形成柔性指纹识别构件；
将所述柔性指纹识别构件贴附于显示面板背面散热膜的开窗区域；
其中，所述形成柔性指纹识别构件，包括：
在刚性基板上形成指纹识别部件；
将所述刚性基板剥离；
在所述指纹识别部件的背离所述显示面板的一侧贴附柔性散热部件。
在一种可能的实施方式中，所述在刚性基板上形成指纹识别部件包括：
在贴合结构上形成功能层，其中，所述贴合结构包括刚性基板，以及贴合于所述刚性基板的柔性衬底；
在所述功能层的背离所述柔性衬底的一侧形成滤光膜；
在所述滤光膜的背离所述柔性衬底的一侧通过光学胶贴合准直结构；
绑定第一覆晶膜和第二覆晶膜。
附图说明
图1为本公开实施例提供的一种显示装置的俯视结构示意图；
图2为沿图1的虚线所示位置处的截面示意图；
图3为本公开实施例提供的一种柔性指纹识别构件的俯视结构示意图；
图4为本公开实施例提供的一种指纹识别部件的俯视结构示意图；
图5为本公开实施例提供的设置有滤光膜的指纹识别部件的透光示意图；
图6为本公开实施例提供的一种准直结构的示意图；
图7为本公开实施例提供的经准直结构后的光线发散角度示意图；
图8为本公开实施例提供的一种显示装置的制作流程示意图。
具体实施方式
为了使得本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
为了保持本公开实施例的以下说明清楚且简明，本公开省略了已知功能和已知部件的详细说明。
参见图1、图2和图3所示，其中，图2为图1沿虚线AB处的截面示意图，图3为柔性识别构件的结构示意图，本公开实施例提供一种显示装置，其中，包括：
显示面板1，具有显示面11，以及与显示面11相对的背面12；
散热膜2，贴附于显示面板1的背面12，散热膜2具有开窗区域K；
柔性指纹识别构件3，位于散热膜2背离显示面板1的一侧，柔性指纹识别构件3包括：位于开窗区域K的指纹识别部件31，以及位于指纹识别部件31背离显示面板1一侧的柔性散热部件32；柔性散热部件32具有覆盖指纹识别部件31的第一部321，以及由第一部321延伸出的第二部322，第二部322与开窗区域K边缘的散热膜2搭接。
本公开实施例中，显示面板的背面设置有柔性指纹识别构件，柔性指纹识别构件包括覆盖指纹识别部件的第一部，以及由第一部延伸出的第二部，其中，第二部与开窗区域边缘的散热部搭接，一方面，柔性指纹识别构件，易于弯曲，利用软对硬贴合技术，可以与曲面的显示面板面贴及折弯贴合在一起，改善现有技术刚性指纹识别构件使用受限，无法实现柔性无固定区域大面积的指纹识别问题；另一方面，本公开实施例中的柔性散热部件的第二部与开窗区域边缘的散热膜搭接，可以使柔性指纹识别构件产生的热量及时扩散到散热膜，可以进一步改善实现大面积指纹识别区域时，存在长时间使用会温度过高，散热不佳的问题。
在具体实施时，本公开实施例中的显示面板为如图2所示的曲面显示面板，该曲面显示面板可以是边缘为弯曲状的曲面显示面板，也可以为整体呈弯曲形的曲面显示面板。显示面板具体可以为有机发光显示面板，有机发光显示面板具体可以包括衬底基板，以及依次位于衬底基板一侧的驱动层，发光器件，以及封装层，其中驱动层可以包括驱动发光器件发光的驱动电路；发光器件具体可以包括依次设置的阳极、空穴注入层、空穴传输层、有机发光层、电子传输层、电子注入层、阴极层。
在具体实施时，在垂直于显示面11的方向上(如图2中虚线CD所在方向)，柔性指纹识别构件3在开窗区域K处的厚度大于散热膜2的厚度，第一部321和第二部322在与散热膜2搭接位置处呈Z形衔接。本公开实施例中，为了更好的散热，第一部321和第二部322在与散热膜2搭接位置处呈Z形衔接，采用此结构设计，可以将指纹识别部件31产生的热量经柔性散热部件32传导到散热膜2，防止指纹识别部件31所在区域(如图1或图4中虚线框 CC所示区域)过热，影响显示面板以及指纹识别部件的性能。
在具体实施时，柔性散热部件32包括：铜箔，以及涂布于铜箔的面向指纹识别部件31一侧的纳米碳层，形成纳米碳铜层。利用铜箔进行导热，把指纹识别部件所在区域的热量传导到散热膜2上，导热系数可以为400W/m.K，纳米碳层可以进行辐射散热。本公开实施例中，柔性散热部件32包括：铜箔，以及涂布于铜箔的面向指纹识别部件31一侧的纳米碳层，纳米碳铜层自身有一定的硬度且还可以弯曲，指纹识别部件的柔性衬底(如PI膜)贴合纳米碳铜层后强度提高，纳米碳铜层可以起到保护指纹识别部件的功能层的作用，同时，纳米碳铜层还可以对指纹识别部件采集区起散热的作用。具体的，指纹识别部件的柔性衬底(如PI膜)与纳米碳铜层可以通过双面胶贴合在一起。纳米碳铜层的厚度可以为80um～120um；具体的，还可以为90um～110um；具体的，还可以为95um～105um；具体的，还可以为96um；具体的，还可以为98um；具体的，还可以为100um。
在具体实施时，结合图1和图4所示，图4为图1中在虚线框T位置处指纹识别部件的放大局部示意图，指纹识别部件31包括：柔性衬底310，位于柔性衬底310背离柔性散热部件32一侧的功能层311；指纹识别部件31还包括：位于功能层311的背离柔性衬底310一侧的滤光膜312。具体的，滤光膜312为红外截止膜，红外截止膜阻挡波长大于530纳米的光线。本公开实施例中，指纹识别部件31在功能层311上镀一层红外截止膜，可以使波长大于530nm光线被阻止，不能入射到功能层311上，红外截止膜可以减少大量的光线进入到功能层311上，防止功能层311接收到的光线太多导致采集到的指纹图像过爆，经过测试，如图5所示，在100K LUX照度以下的强光状态下，增加了红外截止膜后，波长较大的红外光光线不能进入到功能层311上，可以避免指纹图像过曝、明显提高指纹图像的对比度。
具体的，指纹识别部件31中的功能层311具体可以包括多个呈阵列分布的识别单元，每一识别单元可以包括：相对设置的第一电极和第二电极，以及位于第一电极和第二电极之间可以进行光电转换的光敏膜层。
在具体实施时，结合图4和图6所示，指纹识别部件3还包括：位于滤光膜312的背离功能层311一侧的准直结构314。具体的，准直结构314包括多个呈阵列分布的凸透镜3141，以及位于凸透镜3141的面向功能层311一侧的具有多个呈阵列分布过孔3142的反射层，过孔3142与凸透镜3141一一对应，过孔3142与凸透镜3141的中心位于同一条直线。具体的，过孔3142位于对应的凸透镜3141的焦点。本公开实施例中，通过调整准直结构314的总厚度，使过孔3142的位置处于微型凸透镜3141的焦点上，显示面板1发出的光线经准直结构314上的微型凸透镜3141，光线发生折射，使光线的角度变小，约束光线发散视角小于8°(图7所示)，小角度光线穿过透明过孔3142后被功能层311中的光电转换功能层接收，光线经准直结构314准直后，可以提高指纹识别的分辨率，大角度光线不能穿过准直结构314上的微小透明过孔3142，经反射层反射回去，可以加强指纹识别部件31所在区域显示面板1的亮度，使显示面板1的指纹识别区与非指纹识别区的亮度不会有明显的差异。
具体的，凸透镜3141在柔性衬底310的投影为六边形，为六边形的凸透镜结构。
在具体实施时，结合图4所示，指纹识别部件31还包括：位于准直结构314与滤光膜312之间的光学胶313，以实现准直结构314的贴合。具体的，光学胶313的厚度可以为10um～30um；具体的，例如，可以为15um；具体的，例如可以为25um。
在具体实施时，指纹识别部件31具有指纹识别区，以及位于指纹识别区外围的边框区；结合图4所示，指纹识别部件31还包括：位于准直结构314的面向显示面板1一侧的框胶315，框胶315位于边框区，以实现将指纹识别部件31与显示面板1的贴合。具体的，框胶可以为环绕指纹识别区的回形状。
在具体实施时，指纹识别部件31还包括：位于柔性散热部件32与指纹识别部件31之间的双面胶，柔性散热部件32和指纹识别部件31通过双面胶贴合。
在具体实施时，结合图1所示，第一部321在显示面的投影为矩形，具有相对的第一侧边S1和第二侧边S2，以及相对的第三侧边S3和第四侧边S4；第一侧边S1绑定有第一覆晶膜41，第四侧边S4绑定有第二覆晶膜42；第二部322包括由第二侧边S2延伸出的第一子散热部3221，以及由第三侧边S3延伸出的第二子散射部3222。具体的，第一子散热部3221可以为矩形，第一子散热部3221的面积可以为第一部321面积的七分之一至三分之一；具体的，第一子散热部3221的面积可以为第一部321面积的四分之一。具体的，第二子散热部3222可以为矩形，第二子散热部3222的面积可以为第一部321面积的七分之一至三分之一；具体的，第二子散热部3222的面积可以为第一部321面积的四分之一。
在具体实施时，柔性指纹识别构件3的面积占显示面板1面积的40％～70％。本公开实施例中，柔性指纹识别构件3与显示面板1贴合可以弯曲及折弯，在曲面显示面板的边缘位置，柔性指纹识别构件3可以按显示面板1的曲面进行弯区贴合，柔性指纹识别构件3不受贴合平面的影响，可以将指纹识别区扩展到显示面板1的边缘曲面处，加大了指纹识别模组的面积，从而可以实现半屏大面积指纹识别。
在具体实施时，结合图1所示，第一覆晶膜41设置有指纹识别芯片411；第二覆晶膜42设置有栅极驱动芯片421；第二覆晶膜42还绑定有柔性电路板5。柔性电路板5上具体还可以设置有元器件51。
在具体实施时，指纹识别部件31的组成材料除外围的指纹识别芯片411、栅极驱动芯片421、元器件51外，都为柔性材料。具体的，指纹识别部件31中的功能层311可以为柔性膜层。
基于同一公开构思，本公开实施例还提供一种如本公开实施例提供的显示装置的制作方法，参见图8所示，包括：
步骤S100、形成柔性指纹识别构件；
步骤S200、将柔性指纹识别构件贴附于显示面板背面散热膜的开窗区域；
其中，对于步骤S100，形成柔性指纹识别构件，包括：
步骤S110、在刚性基板上形成指纹识别部件；
步骤S120、将刚性基板剥离；
步骤S130、在指纹识别部件的背离显示面板的一侧贴附柔性散热部件。
在具体实施时，对于步骤S110，在刚性基板上形成指纹识别部件包括：
步骤S111、在贴合结构上形成功能层，其中，贴合结构包括刚性基板，以及贴合于刚性基板的柔性衬底；
步骤S112、在功能层的背离柔性衬底的一侧形成滤光膜；
步骤S113、在滤光膜的背离柔性衬底的一侧通过光学胶贴合准直结构；
步骤S114、绑定第一覆晶膜和第二覆晶膜。
为了更清楚地理解本公开实施例提供的显示装置的制作方法，以下进行进一步详细说明如下：
步骤一、指纹识别部件31的功能层311采用薄膜晶体管工艺制作在柔性衬底(PI膜)和刚性基板(如玻璃基板)的贴合结构上，具体的，可以是PI膜在上，玻璃基板在下，玻璃基板在制程过程中保护PI膜，功能层311走线在柔性的PI膜面上，玻璃基板起保护PI膜上走线的作用，防止生产制程中PI膜弯曲或膨胀导致走线断裂，PI膜的厚度可以为15um或38um，优选15um，保护玻璃基板的厚度一般为0.5mm或0.7mm，优选0.7mm。
步骤二、将大片功能层311制作好后，切割成小片指纹识别元件sensor。
步骤三、在小片指纹识别元件sensor上镀一层红外截止膜，波长大于530nm光线被阻止，不能入射到sensor功能层上。
步骤四、在指纹识别元件sensor上采用光学胶313(OCA)贴合准直结构314，准直结构314与指纹识别元件sensor之间的光学胶313为面贴；准直结构314的厚度一般为56um，光学胶313的厚度一般为25um、75um或100um等，优选25um；光学胶313为多层膜，上层阵列有六边形的凸透镜3141，下层为阵列有透明过孔3142的反射层。
步骤五、在指纹识别元件sensor上绑定第一覆晶膜41，及第二覆晶膜42、柔性电路板5。
步骤六、以上指纹识别元件sensor半成品模组制作完成后，需剥离保护层玻璃基板。
步骤七、剥离保护层玻璃基板后，需在PI膜上贴覆柔性散热部件32(纳米碳铜层)，纳米碳铜层起散热及保护PI膜功能层的作用，PI膜层与纳米碳铜层通过双面胶贴合在一起。纳米碳铜层的厚度一般为50um或100um，优选100um。
以上为柔性超薄光学柔性指纹识别构件的制作过程，各层膜材有以上多种厚度可供选择，选择最薄的厚度可以使光学式指纹模组做到超薄。为使柔性指纹识别构件采集到的图像对比度比较高且做到超薄，各层的厚度可以为：框胶315可以为25um、准直结构314可以为56um、光学胶313(OCA)可以为25um、柔性衬底310与功能层311的厚度和可以为15um、滤光膜312(红外截止膜)可以为5um，柔性散热部件32(纳米碳铜层)可以为100um，柔性指纹识别构件3的总厚度可以为226um。
本公开实施例的有益效果如下：本公开实施例中，显示面板的背面设置有柔性指纹识别构件，柔性指纹识别构件包括覆盖指纹识别部件的第一部，以及由第一部延伸出的第二部，其中，第二部与开窗区域边缘的散热部搭接，一方面，柔性指纹识别构件，易于弯曲，利用软对硬贴合技术，可以与曲面的显示面板面贴及折弯贴合在一起，改善现有技术刚性指纹识别构件使用受限，无法实现柔性无固定区域大面积的指纹识别问题；另一方面，本公开实施例中的柔性散热部件的第二部与开窗区域边缘的散热膜搭接，可以使柔性指纹识别构件产生的热量及时扩散到散热膜，可以进一步改善实现大面积指纹识别区域时，存在长时间使用会温度过高，散热不佳的问题。
尽管已描述了本公开的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本公开范围的所有变更和修改。
显然，本领域的技术人员可以对本公开实施例进行各种改动和变型而不脱离本公开实施例的精神和范围。这样，倘若本公开实施例的这些修改和变 型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (17)

  1. 一种显示装置，其中，包括：
    显示面板，具有显示面，以及与所述显示面相对的背面；
    散热膜，贴附于所述显示面板的所述背面，所述散热膜具有开窗区域；
    柔性指纹识别构件，位于所述散热膜背离所述显示面板的一侧，所述柔性指纹识别构件包括：位于所述开窗区域的指纹识别部件，以及位于所述指纹识别部件背离所述显示面板一侧的柔性散热部件；所述柔性散热部件具有覆盖所述指纹识别部件的第一部，以及由所述第一部延伸出的第二部，所述第二部与所述开窗区域边缘的所述散热膜搭接。
  2. 如权利要求1所述的显示装置，其中，在垂直于所述显示面的方向上，所述柔性指纹识别构件在所述开窗区域处的厚度大于所述散热膜的厚度，所述第一部和所述第二部在与所述散热膜搭接位置处呈Z形衔接。
  3. 如权利要求1或2所述的显示装置，其中，所述柔性散热部件包括：铜箔，以及涂布于所述铜箔的面向所述指纹识别部件一侧的纳米碳层。
  4. 如权利要求3所述的显示装置，其中，所述指纹识别部件包括：柔性衬底，位于所述柔性衬底背离所述柔性散热部件一侧的功能层；
    所述指纹识别部件还包括：位于所述功能层的背离所述柔性衬底一侧的滤光膜。
  5. 如权利要求4所述的显示装置，其中，所述滤光膜为红外截止膜，所述红外截止膜阻挡波长大于530纳米的光线。
  6. 如权利要求4所述的显示装置，其中，所述指纹识别部件还包括：位于所述滤光膜的背离所述功能层一侧的准直结构。
  7. 如权利要求6所述的显示装置，其中，所述准直结构包括多个呈阵列分布的凸透镜，以及位于所述凸透镜的面向所述功能层一侧的具有多个呈阵列分布过孔的反射层，所述过孔与所述凸透镜一一对应，所述过孔与所述凸透镜的中心位于同一条直线。
  8. 如权利要求7所述的显示装置，其中，所述过孔位于对应的所述凸透镜的焦点。
  9. 如权利要求7所述的显示装置，其中，所述凸透镜在所述柔性衬底的投影为六边形。
  10. 如权利要求6所述的显示装置，其中，所述指纹识别部件还包括：位于所述准直结构与所述滤光膜之间的光学胶。
  11. 如权利要求6所述的显示装置，其中，所述指纹识别部件具有指纹识别区，以及位于所述指纹识别区外围的边框区；
    所述指纹识别部件还包括：位于所述准直结构的面向所述显示面板一侧的框胶，所述框胶位于所述边框区。
  12. 如权利要求1所述的显示装置，其中，所述指纹识别部件还包括：位于所述柔性散热部件与所述指纹识别部件之间的双面胶，所述柔性散热部件和所述指纹识别部件通过所述双面胶贴合。
  13. 如权利要求1所述的显示装置，其中，所述第一部在所述显示面的投影为矩形，具有相对的第一侧边和第二侧边，以及相对的第三侧边和第四侧边；所述第一侧边绑定有第一覆晶膜，所述第四侧边绑定有第二覆晶膜；
    所述第二部包括由所述第二侧边延伸出的第一子散热部，以及由所述第三侧边延伸出的第二子散射部。
  14. 如权利要求13所述的显示装置，其中，所述第一覆晶膜设置有指纹识别芯片；所述第二覆晶膜设置有栅极驱动芯片；
    所述第二覆晶膜还绑定有柔性电路板。
  15. 如权利要求1所述的显示装置，其中，所述柔性指纹识别构件的面积占所述显示面板面积的40％～70％。
  16. 一种如权利要求1-15任一项所述的显示装置的制作方法，其中，包括：
    形成柔性指纹识别构件；
    将所述柔性指纹识别构件贴附于显示面板背面散热膜的开窗区域；
    其中，所述形成柔性指纹识别构件，包括：
    在刚性基板上形成指纹识别部件；
    将所述刚性基板剥离；
    在所述指纹识别部件的背离所述显示面板的一侧贴附柔性散热部件。
  17. 如权利要求16所述的制作方法，其中，所述在刚性基板上形成指纹识别部件包括：
    在贴合结构上形成功能层，其中，所述贴合结构包括刚性基板，以及贴合于所述刚性基板的柔性衬底；
    在所述功能层的背离所述柔性衬底的一侧形成滤光膜；
    在所述滤光膜的背离所述柔性衬底的一侧通过光学胶贴合准直结构；
    绑定第一覆晶膜和第二覆晶膜。
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