WO2022062408A1

WO2022062408A1 - High-power power amplification module and method for assembling high-power power amplification module

Info

Publication number: WO2022062408A1
Application number: PCT/CN2021/091265
Authority: WO
Inventors: 李华鸿; 龚昌荣; 龚丽萍
Original assignee: 浙江三维利普维网络有限公司; 三维通信股份有限公司
Priority date: 2020-09-28
Filing date: 2021-04-30
Publication date: 2022-03-31
Also published as: CN112399711B; CN112399711A

Abstract

A high-power power amplification module, a remote radio unit, and a method for assembling the high-power power amplification module. The high-power power amplification module comprises a circuit board (101) and an isolator assembly (10), the isolator assembly (10) comprises an isolator (11) and a bracket assembly (12), and the isolator (11) is fixed to the circuit board (101) by means of the bracket assembly (12).

Description

High-power power amplifier module and assembly method of high-power power amplifier module

Related applications

This application claims the priority of the Chinese patent application filed on September 28, 2020, the application number is 202011039516.9, and the invention title is "High-power power amplifier module and high-power power amplifier module assembly method", the entire content of which is incorporated into this application by reference middle.

technical field

The present application relates to the technical field of wireless devices, and in particular, to a high-power power amplifier module and a method for assembling the high-power power amplifier module.

Background technique

The high-power amplifier module is an important part of various RF remote units to obtain sufficient RF output power. In the high-power power amplifier module, an embedded isolator is usually used as the last stage of the signal output end. The isolator can not only improve the standing wave ratio of the output port, but also prevent the reverse intermodulation caused by the spatial interference signal entering the power tube. And cause the self-excitation problem of the signal. Therefore, embedded isolators are an indispensable component in the production of high-power power amplifier modules.

In the assembly process of the existing high-power power amplifier module, the embedded isolator is usually in the stage of testing the circuit board produced by the high-power power amplifier module due to the problem of large size and weight. The circuit board and the isolator need to be welded first. Test the circuit board with the isolator; after the test is completed, the circuit board with the isolator needs to be re-stocked; and then in the next stage of the production of the high-power amplifier module, the above-mentioned circuit board and the isolator are removed from the warehouse again. Take out and assemble. In fact, during the turnover process of warehousing and warehousing, this operation can easily cause the isolator to pull on the circuit board due to its own weight problem, damage the copper skin of the solder joints between the two, and lead to a serious accident of scrapping the circuit board.

Therefore, the usual improvement at present is to remove the circuit board with the isolator, separate the isolator and the circuit board, and store them separately after completing the test of the circuit board with the isolator; when assembling the high-power amplifier module , it is necessary to separate the isolator and the circuit board out of the warehouse, re-solder the isolator to the circuit board, and install it to the power amplifier bottom plate to assemble a complete high-power power amplifier module. Although this method can solve the problem of circuit board scrapping caused by the self-weight pulling of the embedded isolator, it will seriously affect the assembly fluency of the high-power power amplifier module, thereby affecting the production efficiency.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide an improved high-power power amplifier module and a method for assembling the high-power power amplifier module in response to the above problems. The high-power power amplifier module fixes the isolator to the circuit board through the characteristic method by setting the bracket assembly, so that the isolator can be stably connected to the circuit board through the bracket assembly, and the circuit board will not be pulled or damaged in the subsequent production process. , while ensuring the smoothness of assembly of high-power power amplifier modules.

A high-power power amplifier module, the high-power power amplifier module includes a circuit board and an isolator assembly, the isolator assembly includes an isolator and a bracket assembly, and the isolator is fixed to the circuit board through the bracket assembly.

In one embodiment, the bracket assembly and the isolator are fixed to each other, and the bracket assembly is fixed to the circuit board by welding.

In one embodiment, the bracket assembly surrounds the isolator and is fixed to the isolator by threaded fasteners.

In one of the embodiments, a side of the bracket assembly facing the circuit board is plated with an electroplating layer.

In one embodiment, the circuit board is provided with a mounting groove, and the mounting groove is used for embedding the isolator.

In one embodiment, the bracket assembly includes a first bracket and a second bracket, and the first bracket and the second bracket are respectively disposed on opposite sides of the isolator.

In one embodiment, the bracket assembly is soldered to the circuit board by surface contact.

The present application also provides a remote radio unit, including a high-power power amplifier module, wherein the high-power power amplifier module is the high-power power amplifier module described in any one of the above.

The present application also provides a method for assembling a high-power power amplifier module, and the method for assembling a high-power power amplifier module includes:

pre-fixing the isolator assembly to the circuit board to form a pre-circuit board assembly;

Putting the obtained pre-circuit board assembly through the oven to fix the isolator assembly on the circuit board to form a circuit board assembly;

The circuit board assembly is installed on the power amplifier bottom plate to form a high-power power amplifier module.

In one embodiment, the isolator assembly includes an isolator and a bracket assembly; the step of pre-fixing the isolator assembly to the circuit board to form the pre-circuit board assembly further includes:

securing the bracket assembly to the isolator and forming an isolator assembly;

The isolator assembly is secured to the circuit board by a positioning tool to form a pre-circuit board assembly.

In one embodiment, the step of pre-fixing the isolator assembly to the circuit board to form the pre-circuit board assembly further comprises:

Brush the circuit board with solder.

In one embodiment, the step of pasting the obtained pre-circuit board assembly through an oven includes:

The circuit board is welded with the bracket assembly through a patch furnace to fix the bracket assembly on the circuit board and form a circuit board assembly;

Among them, the soldering method is tin soldering; the soldering temperature is 200℃～280℃.

Description of drawings

FIG. 1 is a schematic structural diagram of a circuit board assembly in an embodiment of the present application.

FIG. 2 is a schematic structural diagram of the isolator in the circuit board assembly shown in FIG. 1 .

FIG. 3 is a schematic structural diagram of a bracket assembly in the circuit board assembly shown in FIG. 1 .

FIG. 4 is a schematic flowchart of a method for assembling a high-power power amplifier module according to an embodiment of the present application.

FIG. 5 is a schematic diagram of the temperature and time curve during soldering of the pre-circuit board assembly.

100, circuit board assembly; 101, circuit board; 10, isolator assembly; 11, isolator; 111, first component; 112, fixing part; 1121, threaded hole; 113, connecting wire; 12, bracket assembly; 121, 1211, the first escape groove; 1212, the first welding part; 122, the second support; 1221, the second welding part; 123, the fixing part; 1231, the fixing hole; 20, the threaded fastener.

The above description of the main element symbols will further describe the present application in detail with reference to the accompanying drawings and specific embodiments.

detailed description

In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and do not limit the protection scope of the present application.

It should be noted that when a component is referred to as being "mounted on" another component, it can be directly on the other component or there may also be an intervening component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a co-existing centered component. When a component is said to be "fixed" to another component, it may be directly fixed to the other component or there may also be an intervening component. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only and do not represent the only embodiment.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the present application are for the purpose of describing particular embodiments only, and are not intended to limit the present application. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

An embodiment of the present application provides a high-power power amplifier module (not numbered), which is used in a remote radio unit to amplify radio frequency output power. Of course, the high-power power amplifier module can also be used in other equipment that needs to amplify signals or power, such as medical radiotherapy equipment.

Wherein, in this embodiment, the high-power power amplifier module refers to a power amplifier module with a power of more than 10W. Of course, in other embodiments, the high-power power amplifier module may also be applied to a power amplifier module of less than 10W.

In the assembly process of the existing high-power power amplifier module, the embedded isolator is usually in the stage of testing the circuit board produced by the high-power power amplifier module due to the problem of large size and weight. The circuit board and the isolator need to be welded first. Test the circuit board with the isolator; after the test is completed, the circuit board with the isolator needs to be restocked; and then in the next stage of the production of the high-power amplifier module, the circuit board and the isolator are removed from the warehouse. Take out and assemble. In fact, during the turnover process of warehousing and warehousing, this operation can easily cause the isolator to pull on the circuit board due to its own weight problem, damage the copper skin of the solder joints between the two, and lead to a serious accident of scrapping the circuit board.

Therefore, the usual improvement at present is to remove the circuit board with the isolator, separate the isolator and the circuit board after completing the test of the circuit board with the isolator, and store the isolator and the circuit board separately, so as to prepare for the assembly of the high-power amplifier. module is used. However, if the isolator and the circuit board are removed, the smoothness of the assembly of the high-power amplifier module will be seriously affected, thereby affecting the production efficiency.

In order to avoid the above problems, an embodiment of the present application provides a high-power power amplifier module. The high-power power amplifier module fixes the isolator 11 on the circuit board 101 by setting the bracket assembly 12, so that the isolator 11 can be stably connected to the circuit board 101 through the bracket assembly 12, and the circuit board 101 will not be pulled or damaged. At the same time, it can ensure the smoothness of the assembly of the high-power power amplifier module.

Please refer to FIG. 1 , which is a schematic structural diagram of a circuit board assembly 100 according to an embodiment of the present application.

Specifically, the high-power power amplifier module includes a circuit board 101 and an isolator assembly 10 . The isolator assembly 10 is fixed on the circuit board 101 for testing and assembly. The circuit board 101 is used for carrying the isolator assembly 10 and can be used for programming software and testing; the isolator assembly 10 is used for mounting on the circuit board 101 and improving the interference signal in the high-power power amplifier module.

The isolator assembly 10 includes an isolator 11 and a bracket assembly 12 . The isolator 11 is fixed to the circuit board 101 through the bracket assembly 12 . The isolator 11 is used to improve the interference signal in the high-power power amplifier module; the bracket assembly 12 is used to fix the isolator 11 to the circuit board 101 and prevent the circuit board 101 from being torn by the isolator 11 . In this embodiment, the isolator 11 and the bracket assembly 12 are fixed to each other first, and then the isolator assembly 10 formed by the two is fixed to the circuit board 101 . It can be understood that in other embodiments, the isolator 11 may be placed on the circuit board 101 first, and then fixed to each other through the bracket assembly 12 and the circuit board 101 .

In this embodiment, the bracket assembly 12 and the isolator 11 are provided separately. It can be understood that, in other embodiments, when the isolator 11 is designed, the bracket assembly 12 and the appearance structure of the isolator 11 are integrated into consideration, that is, the appearance structure of the isolator 11 has already satisfied the functions of all bracket assemblies 12 when the isolator 11 leaves the factory. . It should be explained that, compared with the original isolator 11 fixed to the circuit board 101 by spot welding, the contact area between the bracket assembly 12 and the circuit board 101 is increased, so that the isolator 11 can be prevented from passing through the bracket assembly 12. Tear problems from plate 101.

Please refer to FIG. 2 , which is a schematic structural diagram of the isolator 11 in the circuit board assembly 100 shown in FIG. 1 .

The isolator 11 generally includes a flat cylindrical first element 111 and a block-shaped fixing member 112, and the two are fixed to each other. The circuit board 101 is provided with a mounting slot. The fixing member 112 of the isolator 11 is embedded in the installation groove. When the isolator 11 is embedded in the circuit board 101 , the surface of the fixing member 112 is flush with the surface of the circuit board 101 , so that the bracket assembly 12 can surround the isolator 11 and adhere to the circuit board 101 . It can be understood that, in other embodiments, the shape of the isolator 11 can be correspondingly set according to actual requirements, which is not specifically limited herein.

In one of the embodiments, a connecting wire 113 is provided on the annular peripheral side of the first element 111 in the isolator 11 . The connecting wire 113 is used for connecting with the circuit board 101 or other components connected to the circuit board 101 .

Please refer to FIG. 3 . FIG. 3 is a schematic structural diagram of the bracket assembly 12 in the circuit board assembly 100 shown in FIG. 1 .

In one embodiment, in order to facilitate the bracket assembly 12 to surround the outer periphery of the annular isolator 11 and to allow the bracket assembly 12 to avoid the connecting wire 113 , the bracket assembly 12 includes a first bracket 121 and a second bracket 122 that are provided separately. The first bracket 121 and the second bracket 122 are surrounded by a square frame, and form a substantially square accommodating space. The first element 111 of the isolator 11 is disposed in the accommodating space. The bracket assembly 12 provided separately is not only convenient for processing, but also for alignment and installation during production.

It can be understood that, in other embodiments, the bracket assembly 12 can also be an integral square or annular frame-like structure, or composed of three or more separate brackets, as long as it can be used to fix the isolator to the circuit The plate 101 is sufficient; the cross section of the accommodating space enclosed by the bracket assembly 12 may be a square or a circle, which is not specifically limited here.

In one embodiment, the first bracket 121 and the second bracket 122 are substantially plate-shaped. Four angles of the first bracket 121 and the second bracket 122 extend toward the accommodating space and form the fixing portion 123 . The fixing portion 123 abuts against the annular outer periphery of the isolator 11 , and the fixing portion 123 defines a fixing hole 1231 . Correspondingly, four corners of the fixing member 112 in the isolator 11 are respectively provided with threaded holes 1121 . The first bracket 121 and the second bracket 122 are respectively fixed to the isolator 11 by threaded fasteners through the fixing holes 1231 and the threaded holes 1121 to form the isolator assembly 10 . In this way, the position between the bracket assembly 12 and the isolator 11 is relatively fixed, so as to be aligned with the preset position of the circuit board 101 and fixed to the circuit board 101 .

It can be understood that in other embodiments, the shapes and structures of the first bracket 121 and the second bracket 122 can be set according to actual needs, which are not specifically limited here; relative position between the devices 11.

In this embodiment, the threaded fasteners used to fix the isolator 11 and the bracket assembly 12 are M2 screws. Originally, the isolator 11 also needs to be positioned between other components of the high-power amplifier module through through holes. In this embodiment, the inner wall of the original through hole only needs to be processed into a threaded inner wall matched with the M2 screw, which can become a threaded hole 1121 for fixing the bracket assembly 12 to each other, which is very convenient for processing operations.

In one embodiment, the bracket assembly 12 provided separately avoids the connecting wires 113 on opposite sides of the isolator 11 , and the third connecting wire 113 is difficult to avoid, so the middle of the first bracket 121 faces away from the circuit board 101 . A first escape groove 1211 is formed between it and the circuit board 101 . The first escape groove 1211 is used for passing the connecting wire 113 therethrough. It can be understood that, in other embodiments, the avoidance groove may also be provided between the second bracket 122 and the circuit board 101 , as long as the corresponding connecting wire 113 can be avoided.

In one embodiment, the first bracket 121 and the second bracket 122 are fixed to the circuit board 101 by welding, and the welding process is synchronized with the patching process for forming the circuit board 101 , so that the circuit board 101 and the isolator assembly are arranged in this way The fixation between 10 is not only firm and reliable, but also can correspondingly simplify the overall production process of the high-power amplifier module. It can be understood that in other embodiments, the circuit board 101 and the isolator assembly 10 may also be fixed by other means, such as gluing, as long as the circuit board 101 and the isolator 11 can be fixed.

In one embodiment, the sides of the first bracket 121 and the second bracket 122 facing the circuit board 101 are the first welding portion 1212 and the second welding portion 1221 , respectively. The first soldering portion 1212 and the second soldering portion 1221 are used for soldering with the circuit board 101 . The first soldering portion 1212 and the second soldering portion 1221 are both soldered to the circuit board 101 through surface contact. This arrangement not only increases the connection strength between the bracket assembly 12 and the circuit board 101; and the bracket assembly 12 is welded with the circuit board 101 through surface contact, which is not easy to cause tearing and damage to the circuit board 101, so that the isolator can be The assembly 10 and the circuit board 101 are fixed to each other and then stored in the warehouse, which also avoids the problem of tearing the circuit board 101 caused by the isolator 11 .

In one of the embodiments, the stent assembly 12 is made of materials that are easy to process, such as iron or alloys. When the bracket assembly 12 and the circuit board 101 are soldered, the temperature cannot be too high to affect the performance of the circuit board 101 . Therefore, in order to facilitate the welding of the bracket assembly 12 and the circuit board 101 , the side of the bracket assembly 12 facing the circuit board 101 is covered with an electroplating layer. Wherein, the electroplating layer includes one of silver plating, gold plating and nickel plating. It can be understood that other materials that are convenient for electroplating can also be used to coat the bracket assembly 12, as long as the purpose of facilitating welding can be achieved; if the processing convenience and processing cost are not considered, the bracket assembly 12 can also be made of other metal materials. It can be made of materials such as stainless steel or alloy copper, as long as the isolator 11 can be fixed.

After the bracket assembly 12 and the isolator 11 are fixed by threaded fasteners, the formed whole is favorable for mutual positioning and fixed connection with the circuit board.

The circuit board assembly 100 is formed after the circuit board 101 and the isolator assembly 10 are fixed. After passing the test, the circuit board assembly 100 can be normally put into stock for use in the next stage of high-power amplifier module production.

An embodiment of the present application provides a high-power power amplifier module. By setting a bracket assembly, the isolator is fixed to the circuit board, so that the isolator can be stably connected to the circuit board through the bracket assembly, and the circuit board will not be pulled and damaged. damage, while ensuring the smoothness of the assembly of the high-power power amplifier module.

An embodiment of the present application also provides a remote radio unit (not shown in the figure), which includes the above-mentioned high-power power amplifier module.

Please refer to FIG. 4 and FIG. 5 together. FIG. 4 is a schematic flowchart of a method for assembling a high-power amplifier module according to an embodiment of the present application; FIG.

An embodiment of the present application also provides a method for assembling a high-power power amplifier module.

The assembly method of the high-power amplifier module includes the following steps:

Step S10, pre-fixing the isolator assembly on the circuit board to form a pre-circuit board assembly;

Step S20, pasting the obtained pre-circuit board assembly through a furnace to fix the isolator assembly on the circuit board to form a circuit board assembly;

In step S30, the circuit board assembly is installed on the power amplifier bottom plate to form a high-power power amplifier module.

Existing isolators are usually fixed and soldered to the circuit board after the circuit board placement is completed. In step S20 of an embodiment of the present application, the isolator assembly is first placed in a preset position of the circuit board; then the isolator assembly and the circuit board are put into the SMT furnace together, and the SMD is heated through the furnace, so that the The placement process of the circuit board is performed simultaneously with the process of fixing the isolator assembly to the circuit board. Originally, in the production of circuit boards, patching and passing through the oven is a necessary process to form circuit boards with functions that meet the requirements. In this embodiment, the necessary pasting process and the soldering process for fixing the isolator assembly to the circuit board are combined into one, so that the overall processing process of the circuit board assembly is simplified, and the isolator assembly can be very firm. fixed to the circuit board. This arrangement simplifies the processing of the circuit board assembly.

In addition, the existing isolator is used for performance testing of the circuit board after being soldered to the circuit board. After the circuit board test is completed, in order to avoid the isolator pulling the circuit board and damaging the circuit board due to gravity, the isolator and the circuit board need to be removed and stored separately. In this embodiment, the isolator assembly includes an isolator and a bracket assembly; the isolator is fixed to the circuit board through the bracket assembly, which can effectively avoid the problem that the isolator is directly pulled to damage the circuit board, so that the isolator assembly and the circuit board are fixed. The formed circuit board assembly can normally carry out the turnover process of components such as warehousing and warehousing, without causing the isolator to pull the solder joints of the circuit board due to gravity, damage the copper skin of the solder joints, and cause serious accidents in which the circuit board is scrapped.

Further, in the production process of connecting the circuit board assembly to the power amplifier bottom plate, the module assembly and testing of the new circuit board assembly can be carried out directly, and the embedded isolator/circulator does not need to be repeatedly welded, and the isolator is well protected. and circuit boards, and at the same time avoid the tedious and repeated steps of disassembling and assembling the isolator.

At the same time, the circuit board assembly can be directly used for the connection with the power amplifier bottom plate in step S30, so that the overall installation process of the high-power power amplifier module can be smoother, and the situation of frequently entering and leaving the isolator and the circuit board in and out of the warehouse is avoided.

In one of the embodiments, the isolator assembly includes an isolator and a bracket assembly; the step S10 of pre-fixing the isolator assembly to the circuit board to form the pre-circuit board assembly further includes:

Step S11, the bracket assembly is fixed to the isolator, and the isolator assembly is formed;

In step S12, the isolator assembly is fixed to the circuit board through a positioning tool to form a pre-circuit board assembly.

In step S11 and step S12, after the bracket assembly and the isolator are relatively fixed, the isolator assembly is pre-fixed to the circuit board by using a positioning tool, so as to prepare for patching. When the power amplifier circuit board is pasted through the oven, the isolator with the bracket assembly and the power amplifier circuit board are loaded into the positioning tool at the same time, which not only enables the isolator to be accurately positioned at the preset position of the circuit board. This arrangement facilitates installation and fixation between the isolator component and the circuit board, which is beneficial to assembly line production.

It can be understood that in other embodiments, the isolator assembly can also be pre-fixed to the circuit board through the following steps: after the isolator is pre-fixed to the circuit board; and the bracket assembly is mounted on the isolator to form a pre-circuit board assembly.

The isolator and the bracket assembly are fixed to each other by threaded fasteners. It can be understood that, in other embodiments, the isolator can also be fixed to each other by means of a snap, which is equivalent to a direct assembly.

In one of the embodiments, before the step S10 of pre-fixing the isolator assembly to the circuit board to form the pre-circuit board assembly, it further includes:

Step S01, brushing solder for the circuit board.

Specifically, in step S11 , the circuit board and the bracket assembly are fixedly connected by welding, so a layer of solder needs to be laid on a preset position of the circuit board, so that the bracket assembly and the circuit board can be directly welded to each other when they pass through the oven. Wherein, the solder is tin-based solder, so that the temperature range of the soldering just falls within the temperature range of the circuit board passing through the patch furnace, so that the welding of the circuit board and the isolator assembly and the circuit board patching are performed synchronously. It can be understood that, in other embodiments, the solder can also be other materials that can be soldered below 280°C.

In addition, the use of tin-based solder facilitates the mutual welding of the circuit board with the bracket assembly having the electroplating layer, and the connection strength is good, so that the isolator will not cause pulling and damage to the circuit board through the bracket assembly.

In one embodiment, the isolator assembly in step S20 includes an isolator and a bracket assembly step including:

Step S21, welding the circuit board to the bracket assembly through the patch furnace, so as to fix the bracket assembly to the circuit board, and form the circuit board assembly;

Among them, the soldering method is tin soldering; the soldering temperature is between 200°C and 280°C.

Specifically, the circuit board and the bracket assembly are connected by welding, so that the two can be firmly connected, and the bracket assembly is not easily pulled and damaged to the circuit board. As shown in Figure 5, the curve shown in the figure is the relationship between the soldering time and the soldering temperature when the circuit board and the bracket assembly are pasted through the furnace. The figure shows that the optimal temperature for the solder to melt and solder is 220℃ ~260°C. In this temperature range, the best soldering effect between the circuit board and the bracket assembly.

An embodiment of the present application also provides a method for assembling a high-power power amplifier module, and the method for assembling a high-power power amplifier module fixes the isolator component on the circuit board, which can effectively avoid the problem that the isolator is directly pulled to damage the circuit board, thereby The circuit board assembly formed after the isolator assembly and the circuit board are fixed can be directly stored in stock, avoiding the tedious and repeated steps of disassembling and assembling the isolator.

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the patent of the present application should be determined by the appended claims.

Claims

A high-power power amplifier module, characterized in that the high-power power amplifier module includes a circuit board and an isolator assembly, the isolator assembly includes an isolator and a bracket assembly, and the isolator is fixed to the circuit board.
The high-power amplifier module according to claim 1, wherein the bracket assembly and the isolator are fixed to each other, and the bracket assembly is fixed to the circuit board by welding.
The high-power amplifier module according to claim 2, wherein the bracket assembly surrounds the isolator and is fixed to the isolator by threaded fasteners.
The high-power amplifier module according to claim 2, wherein a side of the bracket assembly facing the circuit board is plated with an electroplating layer.
The high-power power amplifier module according to claim 1, wherein the circuit board is provided with an installation groove, and the installation groove is used for embedding the isolator.
The high-power amplifier module according to claim 1, wherein the bracket assembly comprises a first bracket and a second bracket, and the first bracket and the second bracket are respectively disposed on opposite sides of the isolator.
The high-power amplifier module according to claim 1, wherein the bracket assembly is welded to the circuit board by surface contact.
A remote radio unit, comprising a high-power power amplifier module, characterized in that, the high-power power amplifier module is the high-power power amplifier module according to any one of claims 1 to 7.
A method for assembling a high-power power amplifier module, characterized in that the method for assembling a high-power power amplifier module comprises:

pre-fixing the isolator assembly to the circuit board to form a pre-circuit board assembly;

The obtained pre-circuit board assembly is patched through an oven to fix the isolator assembly on the circuit board to form a circuit board assembly;

The circuit board assembly is installed on the power amplifier bottom plate to form a high-power power amplifier module.
The method for assembling a high-power power amplifier module according to claim 9, wherein the isolator assembly comprises an isolator and a bracket assembly; the step of pre-fixing the isolator assembly to a circuit board to form a pre-circuit board assembly further comprises:

securing the bracket assembly to the isolator and forming an isolator assembly;

The isolator assembly is secured to the circuit board by a positioning tool to form a pre-circuit board assembly.
The method for assembling a high-power amplifier module according to claim 10, wherein before the step of pre-fixing the isolator assembly to the circuit board to form the pre-circuit board assembly, it further comprises:

Brush the circuit board with solder.
The method for assembling a high-power amplifier module according to claim 11, wherein the step of passing the obtained pre-circuit board assembly through a patch oven comprises:

Welding the circuit board with the bracket assembly through a patch furnace to fix the bracket assembly on the circuit board and form a circuit board assembly;

Among them, the soldering method is tin soldering; the soldering temperature is 200℃～280℃.