WO2022061991A1 - Piezoelectric microphone - Google Patents

Piezoelectric microphone Download PDF

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Publication number
WO2022061991A1
WO2022061991A1 PCT/CN2020/121160 CN2020121160W WO2022061991A1 WO 2022061991 A1 WO2022061991 A1 WO 2022061991A1 CN 2020121160 W CN2020121160 W CN 2020121160W WO 2022061991 A1 WO2022061991 A1 WO 2022061991A1
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WO
WIPO (PCT)
Prior art keywords
piezoelectric
segment
back cavity
vibrating
vibration
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PCT/CN2020/121160
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French (fr)
Chinese (zh)
Inventor
石正雨
童贝
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瑞声声学科技(深圳)有限公司
瑞声科技(南京)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(南京)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022061991A1 publication Critical patent/WO2022061991A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02Microphones

Definitions

  • the utility model relates to the technical field of sound-electric conversion devices, in particular to a piezoelectric microphone.
  • the piezoelectric diaphragm of the existing piezoelectric microphone is arranged on a substrate 1 having a back cavity 3 , which is composed of a plurality of diaphragms 2 , and a diaphragm is connected to the opposite ends of the back cavity 3 respectively.
  • the other end of the diaphragm 2 extends toward the center of the back cavity 3 to form a cantilever beam structure, the diaphragm bends under the action of sound pressure, and the piezoelectric film at the bending part is stressed to generate an electrical signal.
  • the diaphragm adopts a cantilever beam structure with the edge of the back cavity fixed, which limits the length of the diaphragm to at least half of the size of the back cavity.
  • the edge of the back cavity is fixed.
  • the structure will limit the shape of the diaphragm, and the optimal signal-to-noise ratio cannot be obtained under the same chip area.
  • the purpose of the utility model is to provide a piezoelectric microphone, which improves the signal-to-noise ratio of the microphone by improving the structure of the piezoelectric vibrating film.
  • the present invention provides a piezoelectric microphone. It includes a base with a back cavity and a piezoelectric vibrating film arranged on the base, and also includes at least one fixed beam connected with the base and located in the back cavity for supporting the piezoelectric vibrating film.
  • the at least one fixed beam divides the upper end of the back cavity into at least two vibration regions
  • the piezoelectric vibrating film is provided with a slit in each of the vibration regions, and the slit
  • the part of the piezoelectric vibrating film located in the area is divided into at least one vibrating part, the vibrating part comprises a fixed end connected with the base or the fixed beam, a vibrating end suspended on the vibrating area, and A connecting portion connecting the fixed end and the vibrating end.
  • the fixing beam is an elongated structure and is disposed on the centerline of the back cavity or parallel to the centerline.
  • each of the slits includes a first-segment slot, a second-segment slot and a third-segment slot, and the first-segment slot and the second-segment slot are spaced apart from each other and are perpendicular to the center line, so The third-segment slot is parallel to the center line and communicates with the first-segment slot and the second-segment slot, respectively.
  • both ends of the third-segment slit are connected to the centers of the first-segment slot and the second-segment slot, respectively.
  • both ends of the third segment of the slit are respectively connected to the ends of the first segment of the slit and the second segment of the slit.
  • the piezoelectric vibrating film is composed of at least two electrode layers and at least one piezoelectric layer, the electrode layers are provided on the outermost two layers, and the piezoelectric diaphragm is formed between the two adjacent electrode layers. electrical separation.
  • the present invention divides the back cavity into a plurality of vibration areas by arranging at least one fixed beam for supporting and fixing the piezoelectric vibrating film in the back cavity, so that the piezoelectric vibrating film can One or two vibrating parts are formed in the vibrating area, so that the length of the vibrating part can be adjusted by adjusting the position and number of the fixed beams, so that the microphone can reach the maximum signal-to-noise ratio under the same chip area, which solves the problem in the prior art.
  • the chip size is large, an excessively long diaphragm will result in a technical problem that affects the resonant frequency, which in turn affects the signal-to-noise ratio performance of the microphone.
  • FIG. 1 is a schematic structural diagram of a piezoelectric microphone in the prior art
  • FIG. 2 is a schematic three-dimensional structural diagram of a piezoelectric microphone according to an embodiment of the present invention
  • FIG. 3 is a bottom view of a piezoelectric microphone according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view taken along the direction A-A in FIG. 3 .
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
  • “plurality” means two or more, unless otherwise expressly and specifically defined.
  • an embodiment of the present invention provides a piezoelectric microphone, including a substrate 10 having a back cavity 11 , a piezoelectric diaphragm 20 disposed on the substrate 10 , and a piezoelectric microphone 20 and the substrate 10 .
  • At least one fixed beam 30 connected to and located in the back cavity 11 for supporting the piezoelectric vibrating film 20;
  • the base 10 is an annular structure so as to enclose the back cavity 11, and the annular structure can be circular, square,
  • the base 10 adopts a square structure for illustration; the fixing beam 30 is formed when the back cavity 11 is etched on the base 10, so that the fixing beam 30 is located at the back
  • the cavity 11 is integrally formed with the base 10 .
  • the fixed beam 30 divides the upper end of the back cavity 11 into at least two vibration areas 12
  • the piezoelectric diaphragm 20 is formed with at least one vibration part 22 in each vibration area 12
  • the vibration part 22 includes a fixed end 221 connected to the base or the fixed beam 30 , a vibration end 222 suspended on the vibration area 12 , and a connecting portion 223 connecting the fixed end 221 and the vibration end 222 .
  • the number of the fixed beams 30 is one and is a long strip structure, and is arranged on the center line of the back cavity 11, so as to be divided into two vibration areas 12 of equal shape; of course, the fixed beams 30 are also It can be arranged on the non-center line of the back cavity 11, and the fixed beam 30 and the center line are parallel to each other, so as to be divided into two vibration areas 12 with unequal shapes; it should be understood that in other embodiments, the fixed beam 30 The number can also be two or more, and the plurality of fixed beams 30 are evenly spaced and parallel to the center line, so that the upper end of the back cavity 11 is divided into two or more vibration areas 12 by the plurality of fixed beams 30 .
  • the piezoelectric vibrating film 20 is provided with a slit 21 in each of the vibration regions 12 , and the slit divides the portion of the piezoelectric vibrating film 20 in the region into at least one vibrating portion 22 .
  • each of the slits 21 includes a first segment 211, a second segment 212 and a third segment 213.
  • the first segment 211 and the second segment 212 are spaced apart from each other and are perpendicular to the centerline.
  • the third slot 213 is parallel to the center line and communicates with the first slot 211 and the second slot 212 respectively. That is to say, the piezoelectric vibrating film 20 further includes a peripheral portion surrounding the back cavity 11, and the peripheral portion is stacked and fixed on the substrate. formed by etching.
  • both ends of the third-segment slit 213 are connected to the centers of the first-segment slot 211 and the second-segment slot 212 respectively. That is, the gap 21 adopts an I-shaped structure, so that two vibrating parts 22 are formed in each vibration area 12, the vibrating ends 222 of the two vibrating parts 22 are arranged oppositely, and a third segment gap is between the two vibrating ends 222 213; In this way, the piezoelectric vibrating film 20 of this embodiment has four vibrating parts 22, and on the basis of the same chip area, the length of the vibrating parts 22 is reduced, so that the microphone has a higher resonant frequency.
  • the vibration area 12 on the left side of the fixed beam 30 is equal to half of the right vibration area 12, and at this time the left vibration area
  • the two ends of the third-stage slit 213 of The slits are arranged in an I-shaped structure to form two vibrating parts 22 , so that the piezoelectric vibrating film 20 is formed with three vibrating parts 22 , which reduces the length of the vibrating parts 22 and enables the microphone to have a higher resonant frequency.
  • the piezoelectric vibrating film 20 is composed of at least two electrode layers and at least one piezoelectric layer, the outermost two layers are provided with the electrode layers, and the two adjacent electrode layers are separated by the piezoelectric layers.
  • the piezoelectric vibrating film 20 is provided with a first electrode layer 24 , a first piezoelectric layer 25 , a second electrode layer 26 , and a second piezoelectric layer 27 in order from top to bottom. and the structure of the third piezoelectric layer 28; of course, in other embodiments, the piezoelectric vibrating film 20 may also adopt a three-layer structure in which electrode layers are respectively provided on the upper and lower surfaces of the piezoelectric layer.
  • the piezoelectric microphone further includes a signal sensing element electrically connected to the electrode layer, and the signal sensing element is arranged on the fixed beam 30 , that is, the signal input end of the signal sensing element and the piezoelectric vibrating film 20 are connected.
  • the electrode layers of the piezoelectric diaphragm 20 are electrically connected to sense and output the potential difference of the electrode layers of the piezoelectric vibrating film 20 .
  • the piezoelectric microphone provided by the present invention divides the back cavity 11 into a plurality of vibration areas 12 by disposing at least one fixing beam 30 in the back cavity 11 for supporting and fixing the piezoelectric vibrating membrane 20 .
  • the piezoelectric vibrating film 20 can be formed with one or two vibrating parts 22 in each vibrating area 12, so that the length of the vibrating parts 22 can be adjusted by adjusting the position and number of the fixed beams 30, and the same chip area
  • the microphone achieves the maximum signal-to-noise ratio, which solves the technical problem in the prior art that the resonant frequency is affected by the generation of an excessively long diaphragm when the chip size is large, thereby affecting the signal-to-noise ratio performance of the microphone.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

Provided is a piezoelectric microphone. The piezoelectric microphone comprises a substrate having a back cavity and a piezoelectric vibrating diaphragm arranged on the substrate, and further comprises at least one fixing beam which is connected to the substrate, located in the back cavity, and used for supporting the piezoelectric vibrating diaphragm. The at least one fixing beam used for supporting and fixing the piezoelectric vibrating diaphragm is arranged in the back cavity, such that the back cavity is divided into a plurality of vibration areas, and one or two vibration portions can be formed in each vibration area of the piezoelectric vibrating diaphragm, thereby adjusting the length of the vibration portions by adjusting the position and the number of the fixing beam, achieving the maximum signal-to-noise ratio of a microphone with the same chip area, and solving the technical problems whereby in the prior art, due to the fact that an overlong diaphragm is generated when the size of a chip is large, the resonant frequency is affected, and consequently, the signal-to-noise ratio performance of a microphone is affected.

Description

一种压电式麦克风A piezoelectric microphone 技术领域technical field
本实用新型涉及声电转换装置技术领域,具体涉及一种压电式麦克风。The utility model relates to the technical field of sound-electric conversion devices, in particular to a piezoelectric microphone.
背景技术Background technique
如图1所示,现有压电式麦克风的压电振膜设置在具有背腔3的基底1上,其由多个膜片2组成,在背腔3的相对两端分别连接有一膜片2的固定端,膜片2另一端朝背腔3中心延伸形成悬臂梁结构,在声压作用下膜片弯曲,弯曲部位的压电薄膜受力产生电信号。As shown in FIG. 1 , the piezoelectric diaphragm of the existing piezoelectric microphone is arranged on a substrate 1 having a back cavity 3 , which is composed of a plurality of diaphragms 2 , and a diaphragm is connected to the opposite ends of the back cavity 3 respectively. 2, the other end of the diaphragm 2 extends toward the center of the back cavity 3 to form a cantilever beam structure, the diaphragm bends under the action of sound pressure, and the piezoelectric film at the bending part is stressed to generate an electrical signal.
但是,膜片采用背腔边缘固定的悬臂梁结构限制了膜片的长度至少为背腔大小的一半,在芯片尺寸较大时将产生过长的膜片,从而影响谐振频率,背腔边缘固定的结构将限制膜片的形状,在同样芯片面积下不能得到最优化的信噪比。However, the diaphragm adopts a cantilever beam structure with the edge of the back cavity fixed, which limits the length of the diaphragm to at least half of the size of the back cavity. When the chip size is large, an excessively long diaphragm will be generated, which will affect the resonance frequency, and the edge of the back cavity is fixed. The structure will limit the shape of the diaphragm, and the optimal signal-to-noise ratio cannot be obtained under the same chip area.
因此,为了提升压电式麦克风的信噪比,有必要对结构进行改进以提升信噪比。Therefore, in order to improve the signal-to-noise ratio of the piezoelectric microphone, it is necessary to improve the structure to improve the signal-to-noise ratio.
技术问题technical problem
本实用新型的目的在于提供一种压电式麦克风,通过改进压电振膜的结构,提升麦克风的信噪比。The purpose of the utility model is to provide a piezoelectric microphone, which improves the signal-to-noise ratio of the microphone by improving the structure of the piezoelectric vibrating film.
技术解决方案technical solutions
为实现上述目的,本实用新型提供了一种压电式麦克风。包括具有背腔的基底和设置在基底上的压电振膜,还包括与所述基底连接并位于所述背腔内用于支撑所述压电振膜的至少一个固定梁。To achieve the above purpose, the present invention provides a piezoelectric microphone. It includes a base with a back cavity and a piezoelectric vibrating film arranged on the base, and also includes at least one fixed beam connected with the base and located in the back cavity for supporting the piezoelectric vibrating film.
在一个实施例中,所述至少一个固定梁将所述背腔的上端分隔成至少两个振动区域,所述压电振膜于每个所述振动区域内均设有一个缝隙,所述缝隙将所述压电振膜位于该区域内的部分分割成至少一个振动部,所述振动部包括与所述基底或固定梁连接的固定端、悬置于所述振动区域上的振动端、以及连接所述固定端和振动端的连接部。In one embodiment, the at least one fixed beam divides the upper end of the back cavity into at least two vibration regions, the piezoelectric vibrating film is provided with a slit in each of the vibration regions, and the slit The part of the piezoelectric vibrating film located in the area is divided into at least one vibrating part, the vibrating part comprises a fixed end connected with the base or the fixed beam, a vibrating end suspended on the vibrating area, and A connecting portion connecting the fixed end and the vibrating end.
在一个实施例中,所述固定梁为长条状结构,并设置于所述背腔的中心线或与所述中心线平行。In one embodiment, the fixing beam is an elongated structure and is disposed on the centerline of the back cavity or parallel to the centerline.
在一个实施例中,每一所述缝隙包括第一段缝隙、第二段缝隙以及第三段缝隙,所述第一段缝隙和第二段缝隙相互间隔设置并与所述中心线垂直,所述第三段缝隙与所述中心线平行并分别与所述第一段缝隙和第二段缝隙连通。In one embodiment, each of the slits includes a first-segment slot, a second-segment slot and a third-segment slot, and the first-segment slot and the second-segment slot are spaced apart from each other and are perpendicular to the center line, so The third-segment slot is parallel to the center line and communicates with the first-segment slot and the second-segment slot, respectively.
在一个实施例中,所述第三段缝隙的两端分别连通于所述第一段缝隙和第二段缝隙的中心。In one embodiment, both ends of the third-segment slit are connected to the centers of the first-segment slot and the second-segment slot, respectively.
在一个实施例中,所述第三段缝隙的两端分别连通于所述第一段缝隙和第二段缝隙的端部。In one embodiment, both ends of the third segment of the slit are respectively connected to the ends of the first segment of the slit and the second segment of the slit.
在一个实施例中,所述压电振膜由至少两层电极层和至少一层压电层组成,最外两层设置所述电极层,相邻的两层电极层之间由所述压电层隔开。In one embodiment, the piezoelectric vibrating film is composed of at least two electrode layers and at least one piezoelectric layer, the electrode layers are provided on the outermost two layers, and the piezoelectric diaphragm is formed between the two adjacent electrode layers. electrical separation.
有益效果beneficial effect
与现有技术相比,本实用新型通过在背腔中设置用于支撑固定压电振膜的至少一个固定梁,从而将背腔分隔成多个振动区域,使压电振膜可在每个振动区域内形成有一个或两个振动部,从而可通过调整固定梁的位置以及数量可以调整振动部的长度,在相同芯片面积下使麦克风达到最大信噪比,解决了现有技术中由于在芯片尺寸较大时产生过长膜片导致影响谐振频率,进而影响麦克风的信噪比性能的技术问题。Compared with the prior art, the present invention divides the back cavity into a plurality of vibration areas by arranging at least one fixed beam for supporting and fixing the piezoelectric vibrating film in the back cavity, so that the piezoelectric vibrating film can One or two vibrating parts are formed in the vibrating area, so that the length of the vibrating part can be adjusted by adjusting the position and number of the fixed beams, so that the microphone can reach the maximum signal-to-noise ratio under the same chip area, which solves the problem in the prior art. When the chip size is large, an excessively long diaphragm will result in a technical problem that affects the resonant frequency, which in turn affects the signal-to-noise ratio performance of the microphone.
附图说明Description of drawings
为了更清楚地说明本实用新型实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those skilled in the art, other drawings can also be obtained from these drawings without any creative effort.
图1为现有技术中压电麦克风的结构示意图; 1 is a schematic structural diagram of a piezoelectric microphone in the prior art;
图2为本实用新型实施例压电式麦克风的立体结构示意图;2 is a schematic three-dimensional structural diagram of a piezoelectric microphone according to an embodiment of the present invention;
图3为本实用新型实施例压电式麦克风的仰视图;3 is a bottom view of a piezoelectric microphone according to an embodiment of the present invention;
图4为图3中A-A方向的剖视图。FIG. 4 is a cross-sectional view taken along the direction A-A in FIG. 3 .
本发明的实施方式Embodiments of the present invention
在本实用新型的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本实用新型和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本实用新型的限制。In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", The orientation or positional relationship indicated by "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that The device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本实用新型的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.
下面结合附图和实施方式对本实用新型作进一步说明。The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.
如图2至图4所示,本实用新型实施例提供了一种压电式麦克风,包括具有背腔11的基底10、设置在基底10上的压电振膜20、以及与所述基底10连接并位于所述背腔11内用于支撑所述压电振膜20的至少一个固定梁30;基底10为环形结构从而围成所述背腔11,该环形结构可以为圆形、方形、椭圆形、跑道型或正多边形等,在本实施例中,基底10采用方形结构进行举例说明;固定梁30是在对基底10进行背腔11刻蚀时形成的,从而使固定梁30位于背腔11中并与基底10一体成型。As shown in FIG. 2 to FIG. 4 , an embodiment of the present invention provides a piezoelectric microphone, including a substrate 10 having a back cavity 11 , a piezoelectric diaphragm 20 disposed on the substrate 10 , and a piezoelectric microphone 20 and the substrate 10 . At least one fixed beam 30 connected to and located in the back cavity 11 for supporting the piezoelectric vibrating film 20; the base 10 is an annular structure so as to enclose the back cavity 11, and the annular structure can be circular, square, In the present embodiment, the base 10 adopts a square structure for illustration; the fixing beam 30 is formed when the back cavity 11 is etched on the base 10, so that the fixing beam 30 is located at the back The cavity 11 is integrally formed with the base 10 .
在一个实施例中,固定梁30将所述背腔11的上端分隔成至少两个振动区域12,压电振膜20于每个振动区域12内形成有至少一个振动部22,所述振动部22包括与所述基底或固定梁30连接的固定端221、悬置于所述振动区域12上的振动端222、以及连接所述固定端221和振动端222的连接部223。In one embodiment, the fixed beam 30 divides the upper end of the back cavity 11 into at least two vibration areas 12 , and the piezoelectric diaphragm 20 is formed with at least one vibration part 22 in each vibration area 12 , and the vibration part 22 includes a fixed end 221 connected to the base or the fixed beam 30 , a vibration end 222 suspended on the vibration area 12 , and a connecting portion 223 connecting the fixed end 221 and the vibration end 222 .
在本实施例中,固定梁30的数量为一个且为长条状结构,并设置于所述背腔11的中心线上,从而分隔成两个形状相等的振动区域12;当然固定梁30也可设置在背腔11的非中心线上,且固定梁30与中心线相互平行,从而分隔成两个形状不相等的振动区域12;需要理解的是,在其他实施例中,固定梁30的数量也可以为两个或两个以上,多个固定梁30均匀间隔设置并与中心线相互平行,从而通过多个固定梁30将背腔11上端分隔成两个以上的振动区域12。In this embodiment, the number of the fixed beams 30 is one and is a long strip structure, and is arranged on the center line of the back cavity 11, so as to be divided into two vibration areas 12 of equal shape; of course, the fixed beams 30 are also It can be arranged on the non-center line of the back cavity 11, and the fixed beam 30 and the center line are parallel to each other, so as to be divided into two vibration areas 12 with unequal shapes; it should be understood that in other embodiments, the fixed beam 30 The number can also be two or more, and the plurality of fixed beams 30 are evenly spaced and parallel to the center line, so that the upper end of the back cavity 11 is divided into two or more vibration areas 12 by the plurality of fixed beams 30 .
具体地,所述压电振膜20于每个所述振动区域12内均设有一个缝隙21,所述缝隙将所述压电振膜20位于该区域内的部分分割成至少一个振动部22,每一所述缝隙21包括第一段缝隙211、第二段缝隙212以及第三段缝隙213,所述第一段缝隙211和第二段缝隙212相互间隔设置并与所述中心线垂直,所述第三段缝隙213与所述中心线平行并分别与所述第一段缝隙211和第二段缝隙212连通。也就是说,压电振膜20还包括有环绕所述背腔11的周缘部,所述周缘部叠设固定于所述基底上,该缝隙是在沉积形成压电振膜20时,通过刻蚀的方式形成。Specifically, the piezoelectric vibrating film 20 is provided with a slit 21 in each of the vibration regions 12 , and the slit divides the portion of the piezoelectric vibrating film 20 in the region into at least one vibrating portion 22 . , each of the slits 21 includes a first segment 211, a second segment 212 and a third segment 213. The first segment 211 and the second segment 212 are spaced apart from each other and are perpendicular to the centerline. The third slot 213 is parallel to the center line and communicates with the first slot 211 and the second slot 212 respectively. That is to say, the piezoelectric vibrating film 20 further includes a peripheral portion surrounding the back cavity 11, and the peripheral portion is stacked and fixed on the substrate. formed by etching.
在本实施例中,所述第三段缝隙213的两端分别连通于所述第一段缝隙211和第二段缝隙212的中心。即缝隙21采用工字形的结构,从而在每个振动区域12内形成有两个振动部22,两个振动部22的振动端222相对设置,且两个振动端222之间为第三段缝隙213;如此,本实施例的压电振膜20具有四个振动部22,在相同芯片面积的基础上,减少了振动部22的长度,从而使麦克风具有更高的谐振频率。In this embodiment, both ends of the third-segment slit 213 are connected to the centers of the first-segment slot 211 and the second-segment slot 212 respectively. That is, the gap 21 adopts an I-shaped structure, so that two vibrating parts 22 are formed in each vibration area 12, the vibrating ends 222 of the two vibrating parts 22 are arranged oppositely, and a third segment gap is between the two vibrating ends 222 213; In this way, the piezoelectric vibrating film 20 of this embodiment has four vibrating parts 22, and on the basis of the same chip area, the length of the vibrating parts 22 is reduced, so that the microphone has a higher resonant frequency.
需要理解的是,在其他实施例中,当固定梁30位于背腔11的三分之一位置处时,位于固定梁30左边的振动区域12等于右边振动区域12的一半,此时左边振动区域12的第三段缝隙213的两端分别连通于第一段缝隙211和第二段缝隙212的端部,从而在该左边振动区域12内只形成一个振动部22,而右边振动区域12内的缝隙采用工字型的结构设置从而形成有两个振动部22,如此使压电振膜20形成有三个振动部22,减少了振动部22的长度,从而使麦克风具有更高的谐振频率。It should be understood that, in other embodiments, when the fixed beam 30 is located at a third position of the back cavity 11, the vibration area 12 on the left side of the fixed beam 30 is equal to half of the right vibration area 12, and at this time the left vibration area The two ends of the third-stage slit 213 of The slits are arranged in an I-shaped structure to form two vibrating parts 22 , so that the piezoelectric vibrating film 20 is formed with three vibrating parts 22 , which reduces the length of the vibrating parts 22 and enables the microphone to have a higher resonant frequency.
压电振膜20由至少两层电极层和至少一层压电层组成,最外两层设置所述电极层,相邻的两层电极层之间由所述压电层隔开。在本实施例中,具体参阅图4所示,压电振膜20为由上至下依次设置第一电极层24、第一压电层25、第二电极层26、第二压电层27以及第三压电层28的结构;当然,在其他实施例中,压电振膜20也可以采用在压电层上下表面分别设置电极层的三层结构。The piezoelectric vibrating film 20 is composed of at least two electrode layers and at least one piezoelectric layer, the outermost two layers are provided with the electrode layers, and the two adjacent electrode layers are separated by the piezoelectric layers. In this embodiment, referring specifically to FIG. 4 , the piezoelectric vibrating film 20 is provided with a first electrode layer 24 , a first piezoelectric layer 25 , a second electrode layer 26 , and a second piezoelectric layer 27 in order from top to bottom. and the structure of the third piezoelectric layer 28; of course, in other embodiments, the piezoelectric vibrating film 20 may also adopt a three-layer structure in which electrode layers are respectively provided on the upper and lower surfaces of the piezoelectric layer.
进一步地,压电式麦克风还包括与所述电极层电性连接的信号感知元件,所述信号感知元件设于所述固定梁30上,即信号感知元件的信号输入端与压电振膜20的电极层电连接,用于对所述压电振膜20的电极层的电位差进行感知并输出。Further, the piezoelectric microphone further includes a signal sensing element electrically connected to the electrode layer, and the signal sensing element is arranged on the fixed beam 30 , that is, the signal input end of the signal sensing element and the piezoelectric vibrating film 20 are connected. The electrode layers of the piezoelectric diaphragm 20 are electrically connected to sense and output the potential difference of the electrode layers of the piezoelectric vibrating film 20 .
与相关技术相比,本实用新型提供的压电式麦克风通过在背腔11中设置用于支撑固定压电振膜20的至少一个固定梁30,从而将背腔11分隔成多个振动区域12,使压电振膜20可在每个振动区域12内形成有一个或两个振动部22,从而可通过调整固定梁30的位置以及数量可以调整振动部22的长度,在相同芯片面积下使麦克风达到最大信噪比,解决了现有技术中由于在芯片尺寸较大时产生过长膜片导致影响谐振频率,进而影响麦克风的信噪比性能的技术问题。Compared with the related art, the piezoelectric microphone provided by the present invention divides the back cavity 11 into a plurality of vibration areas 12 by disposing at least one fixing beam 30 in the back cavity 11 for supporting and fixing the piezoelectric vibrating membrane 20 . , so that the piezoelectric vibrating film 20 can be formed with one or two vibrating parts 22 in each vibrating area 12, so that the length of the vibrating parts 22 can be adjusted by adjusting the position and number of the fixed beams 30, and the same chip area The microphone achieves the maximum signal-to-noise ratio, which solves the technical problem in the prior art that the resonant frequency is affected by the generation of an excessively long diaphragm when the chip size is large, thereby affecting the signal-to-noise ratio performance of the microphone.
以上所述的仅是本实用新型的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本实用新型创造构思的前提下,还可以做出改进,但这些均属于本实用新型的保护范围。The above are only the embodiments of the present utility model. It should be pointed out that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present utility model, but these belong to The scope of protection of the utility model.

Claims (7)

  1. 一种压电式麦克风,包括具有背腔的基底和设置在基底上的压电振膜,其特征在于,还包括与所述基底连接并位于所述背腔内用于支撑所述压电振膜的至少一个固定梁。A piezoelectric microphone, comprising a base with a back cavity and a piezoelectric vibrating film arranged on the base, characterized in that it further comprises a base connected to the base and located in the back cavity for supporting the piezoelectric vibration At least one fixed beam of the membrane.
  2. 根据权利要求1所述的压电式麦克风,其特征在于:所述至少一个固定梁将所述背腔的上端分隔成至少两个振动区域,所述压电振膜于每个所述振动区域内均设有一个缝隙,所述缝隙将所述压电振膜位于该区域内的部分分割成至少一个振动部,所述振动部包括与所述基底或固定梁连接的固定端、悬置于所述振动区域上的振动端、以及连接所述固定端和振动端的连接部。The piezoelectric microphone of claim 1, wherein the at least one fixed beam divides the upper end of the back cavity into at least two vibration areas, and the piezoelectric diaphragm is located in each of the vibration areas There is a gap inside, and the gap divides the part of the piezoelectric vibrating film in this area into at least one vibrating part, and the vibrating part includes a fixed end connected with the base or the fixed beam, suspended in the A vibrating end on the vibrating area, and a connecting portion connecting the fixed end and the vibrating end.
  3. 根据权利要求2所述的压电式麦克风,其特征在于,所述固定梁为长条状结构,并设置于所述背腔的中心线或与所述中心线平行。The piezoelectric microphone according to claim 2, wherein the fixing beam is a long strip structure and is arranged on the center line of the back cavity or is parallel to the center line.
  4. 根据权利要求3所述的压电式麦克风,其特征在于,每一所述缝隙包括第一段缝隙、第二段缝隙以及第三段缝隙,所述第一段缝隙和第二段缝隙相互间隔设置并与所述中心线垂直,所述第三段缝隙与所述中心线平行并分别与所述第一段缝隙和第二段缝隙连通。The piezoelectric microphone according to claim 3, wherein each of the slits comprises a first-segment slot, a second-segment slot and a third-segment slot, and the first-segment slot and the second-segment slot are spaced apart from each other The slits of the third segment are parallel to the center line and communicate with the slits of the first segment and the slit of the second segment respectively.
  5. 根据权利要求4所述的压电式麦克风,其特征在于,所述第三段缝隙的两端分别连通于所述第一段缝隙和第二段缝隙的中心。The piezoelectric microphone according to claim 4, wherein two ends of the third-segment slit are respectively connected to the centers of the first-segment slit and the second-segment slit.
  6. 根据权利要求4所述的压电式麦克风,其特征在于,所述第三段缝隙的两端分别连通于所述第一段缝隙和第二段缝隙的端部。The piezoelectric microphone according to claim 4, wherein two ends of the third-segment slot are respectively connected to the ends of the first-segment slot and the second-segment slot.
  7. 根据权利要求1所述的压电式麦克风,其特征在于,所述压电振膜由至少两层电极层和至少一层压电层组成,最外两层设置所述电极层,相邻的两层电极层之间由所述压电层隔开。The piezoelectric microphone according to claim 1, wherein the piezoelectric vibrating film is composed of at least two electrode layers and at least one piezoelectric layer, the outermost two layers are provided with the electrode layers, and the adjacent two layers are provided with the electrode layers. The two electrode layers are separated by the piezoelectric layer.
PCT/CN2020/121160 2020-09-27 2020-10-15 Piezoelectric microphone WO2022061991A1 (en)

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