CN217546292U - Micro-electromechanical structure, microphone and terminal - Google Patents
Micro-electromechanical structure, microphone and terminal Download PDFInfo
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- CN217546292U CN217546292U CN202220823049.7U CN202220823049U CN217546292U CN 217546292 U CN217546292 U CN 217546292U CN 202220823049 U CN202220823049 U CN 202220823049U CN 217546292 U CN217546292 U CN 217546292U
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Abstract
Disclosed are a micro-electromechanical structure, a microphone and a terminal, the micro-electromechanical structure including: a back plate having sound holes therein; and a diaphragm opposite to the back plate; a gap is formed between the back plate and the vibrating diaphragm; the back plate is connected with reinforcing ribs, and the reinforcing ribs are symmetrical about the center of the back plate. The micro-electromechanical structure, the microphone and the terminal provided by the disclosure have the advantages that the reinforcing ribs are arranged on the back plate, so that the strength of the back plate is increased, and the mechanical strength of the back plate is improved. Furthermore, the thickness of the back plate can be reduced, so that the hole depth of the sound hole is reduced, the damping of the sound hole on the back plate is reduced, the noise is reduced, and the signal to noise ratio is improved.
Description
Technical Field
The present application relates to the field of semiconductor technologies, and in particular, to a micro electromechanical structure, a microphone, and a terminal.
Background
Microphones manufactured based on Micro Electro Mechanical Systems (MEMS) are called MEMS microphones, and generally include a MEMS structure and an Application Specific Integrated Circuit (ASIC) chip electrically connected to the MEMS structure.
In a traditional MEMS microphone, a microphone chip comprises a substrate, and a vibrating diaphragm and a back plate which are sequentially arranged on the substrate, wherein the vibrating diaphragm and the back plate form a variable capacitor; the diaphragm is vibrated by the acoustic vibration, and a change in electrostatic capacitance between the backplate and the diaphragm at that time is output.
The back plate is usually provided with sound holes, the strength of the back plate is reduced due to the arrangement of the sound holes, and in order to increase the strength of the back plate, the thickness of the back plate is usually required to be increased so as to compensate the strength of the back plate. However, the thickness of the back plate which is too thick can increase the hole depth of the sound hole, so that the damping of the sound hole on the back plate is increased, and the noise of the micro-electromechanical structure is increased.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, an object of the present invention is to provide a micro electromechanical structure, a microphone and a terminal, which can improve the strength of a backplate while reducing the thickness of the backplate.
The utility model provides a micro-electromechanical structure, include:
a back plate having a sound hole therein; and
a diaphragm opposite to the back plate;
a gap is formed between the back plate and the vibrating diaphragm;
the back plate is connected with reinforcing ribs, and the reinforcing ribs are symmetrical about the center of the back plate.
In some embodiments, the reinforcing ribs are symmetrical about a first direction and a second direction perpendicular to each other, and a symmetry axis of the reinforcing ribs in the first direction and a symmetry axis of the reinforcing ribs in the second direction intersect at the center of the back plate.
In some embodiments, at least one of the ribs is linear, and both ends of the linear rib extend to the edge of the back plate.
In some embodiments, the reinforcing bar comprises:
a plurality of first reinforcing ribs of a straight line type, the plurality of first reinforcing ribs being arranged in parallel in a first direction and being arranged symmetrically with respect to the first direction; and
a plurality of second reinforcing ribs of a straight line type, the plurality of second reinforcing ribs being arranged in parallel in a second direction and being arranged symmetrically with respect to the second direction;
both ends of each reinforcing rib extend to the edge of the back plate.
In some embodiments, the reinforcing ribs include a plurality of linear third reinforcing ribs, the plurality of third reinforcing ribs intersect at the center of the back plate, and both ends of each third reinforcing rib extend to the edge of the back plate.
In some embodiments, the reinforcing bar comprises:
a plurality of circular fourth reinforcing ribs, the center of each fourth reinforcing rib being coincident with the center of the back plate; and
the back plate comprises at least one linear fifth strengthening rib, the fifth strengthening rib penetrates through the center of the back plate, and two ends of the fifth strengthening rib extend to the edge of the back plate.
In some embodiments, the cross-sectional shape of the reinforcing rib is one or more of rectangular, semicircular, triangular, trapezoidal or irregular.
In some embodiments, the thickness of the backing plate is 0.3um to 0.8um.
In some embodiments, the thickness of the reinforcing ribs is 0.5um to 2um.
In some embodiments, the reinforcing ribs are made of insulating materials.
In some embodiments, the method comprises:
a substrate having a cavity;
a first support part on the substrate;
the vibrating diaphragm is positioned on the first supporting part;
the second supporting part is positioned on the vibrating diaphragm; and
the back plate is positioned on the second supporting part.
In some embodiments, the stiffener is located on a surface of the backplate remote from the substrate.
A microphone comprises the micro-electromechanical structure.
A terminal comprising a microphone as described above.
The micro-electromechanical structure, the microphone and the terminal are connected with the reinforcing ribs on the back plate, so that the strength of the back plate is increased, and the mechanical strength of the back plate is improved. Furthermore, the thickness of the back plate can be reduced, the hole depth of the sound hole is reduced, the damping of the sound hole on the back plate is reduced, the noise is reduced, and the signal to noise ratio is improved.
In some embodiments, the reinforcing ribs are symmetrical about a first direction and a second direction perpendicular to each other, so that the strength of the entire back plate is uniformly increased, the strength of the back plate is prevented from being different due to the uneven distribution of the reinforcing ribs on the back plate, and the back plate is prevented from being partially torn due to the different strengths.
In some embodiments, at least one of the stiffeners is linear, and both ends of the linear stiffener extend to the edge of the back plate such that the stiffener spans the width of the back plate in at least one direction, thereby acting as a support beam for the back plate.
In some embodiments, the thickness of the back plate is 0.3um to 0.8um, and the thickness of the reinforcing ribs is 0.5um to 2um, by increasing the thickness of the reinforcing ribs, the thickness of the back plate is reduced at the same time, so that the back plate has greater mechanical strength under the condition of having lower thickness.
In some embodiments, the ribs are located on the surface of the backplate away from the substrate, making the processing of the ribs easier and more convenient.
In some embodiments, the reinforcing rib is located on a surface of the back plate away from the diaphragm, so that when the reinforcing rib is too thick and is located on a surface of the back plate opposite to the diaphragm (i.e., located in the oscillation acoustic cavity), the reinforcing rib may obstruct the vibration of the diaphragm, and thus the amplitude of the diaphragm may be affected.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIG. 1 illustrates a schematic perspective view of a micro-electromechanical structure of a first embodiment of the present disclosure;
FIG. 2 shows a schematic diagram of a micro-electromechanical structure of a first embodiment of the present disclosure;
FIG. 3 shows a schematic top view of a back plate of a first embodiment of the present disclosure;
FIG. 4 shows a schematic top view of a back plate of a second embodiment of the present disclosure;
FIG. 5 shows a schematic top view of a back plate of a third embodiment of the present disclosure;
fig. 6 shows a schematic perspective view of a microelectromechanical structure according to a fourth embodiment of the disclosure.
Detailed Description
The present disclosure is described in further detail below with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the disclosure and are not limiting of the disclosure. It should be further noted that, for the convenience of description, only some of the structures relevant to the present disclosure are shown in the drawings, not all of them.
In the description of the present disclosure, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present disclosure can be understood in specific instances by those of ordinary skill in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are based on the orientations or positional relationships shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present disclosure. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
FIG. 1 illustrates a perspective view of a micro-electromechanical structure of a first embodiment of the present disclosure; fig. 2 is a cross-sectional view of a microelectromechanical structure of a first embodiment of the disclosure. As shown in fig. 1 and fig. 2, a micro-electromechanical structure according to an embodiment of the disclosure includes a substrate 100, and a first supporting portion 110, a diaphragm 200, a second supporting portion 120, and a back plate 300 sequentially disposed on the substrate 100. The substrate 100 has a cavity 101 penetrating through the front and back surfaces thereof, and both a sound pressure load during normal operation and a blowing load during abnormal operation are loaded to the diaphragm 200 through the cavity 101; the first supporting portion 110 is supported between the diaphragm 200 and the substrate 100, and is used for electrically isolating the diaphragm 200 from the substrate 100 and providing support for the diaphragm 200; the second supporting portion 120 is located between the backplate 300 and the diaphragm 200, and is used for electrically isolating the backplate 300 from the diaphragm 200, so that the backplate 300 and the diaphragm 200 are disposed opposite to each other and spaced apart from each other, and an oscillating acoustic cavity 400 for the diaphragm 200 to vibrate is formed between the backplate 300 and the diaphragm 200.
When the acoustic vibration enters the oscillating acoustic chamber 400 through the chamber body 101, the diaphragm 200 resonates with the acoustic vibration and vibrates. When the diaphragm 200 vibrates and the gap distance between the diaphragm 200 and the backplate 300 changes, the electrostatic capacitance between the diaphragm 200 and the backplate 300 changes; the acoustic vibration (change in sound pressure) induced by the diaphragm 200 is converted into a change in electrostatic capacitance between the diaphragm 200 and the backplate 300, and is output as an electrical signal.
The substrate 100 is a single crystal silicon substrate, but may be a polycrystalline silicon substrate. The second support 120 and the first support 110 are generally formed by depositing and etching an easily corrodible insulating material, preferably silicon oxide, but polyethylene oxide or the like may be used. The diaphragm 200 is made of a conductive material, such as polysilicon.
The diaphragm 200 further includes a relief hole 201 on the diaphragm 200. The hole 201 that loses heart intercommunication cavity 101 and oscillation sound chamber 400 to reduce the atmospheric pressure that the vibrating diaphragm 200 vibration in-process received and strike, make the vibrating diaphragm 200 vibration in-process, outside the high-pressure draught part that produces discharges oscillation sound chamber 400 through losing heart 201 in oscillation sound chamber 400, effective balanced atmospheric pressure improves acoustic effect, and can prevent the vibration in-process, because the vibration that the vibrating diaphragm 200 both sides pressure differential leads to is inhomogeneous and the problem of damage.
In this embodiment, the diaphragm 200 includes a relief hole 201, and since the center of the diaphragm 200 bears the largest sound pressure, the relief hole 201 is located at the center of the diaphragm 200. It is understood that, in other embodiments, the air release hole 201 may also be disposed at the edge of the diaphragm 200 in order to prevent the excessive sound pressure from tearing the air release hole 201. A plurality of air-release holes 201 may also be provided, and the plurality of air-release holes 201 are uniformly distributed on the diaphragm 200, and a person skilled in the art may specifically select the positions and the number of the air-release holes 201 according to needs, which is not limited in this embodiment.
The backplane 300 comprises an insulating layer 310 and a conductive layer 320 arranged in a stack. In some embodiments, the insulating layer 310 is formed by depositing silicon nitride, and the periphery of the insulating layer is bonded on the second supporting portion 120, and the silicon nitride has high hardness and high melting point, so that the rigidity of the backplate 300 can be ensured. The conductive layer 320 is located on a side of the insulating layer 310 away from the second supporting portion 120; the conductive layer 320 is formed by depositing polysilicon, for example, and has good conductivity. However, the embodiments of the present disclosure are not limited thereto, and those skilled in the art may make other arrangements for the structure and material of the backplate 300 as needed.
The area of the conductive layer 320 is smaller than that of the insulating layer 310, and the sensitivity of the plate capacitor formed by the backplate 300 and the diaphragm 200 is improved by appropriately reducing the area of the conductive layer 320 contributing to capacitance, thereby further improving the signal-to-noise ratio of the microphone chip. The backplate 300 has a plurality of sound holes 330, and each sound hole 330 penetrates the thickness direction of the backplate 300. The shape and aperture of each acoustic hole 330 may be the same or different.
In this embodiment, the conductive layer 320 is located on a side of the insulating layer 310 away from the second supporting portion 120 to prevent the conductive layer 120 from contacting with the vibrating diaphragm 200 during vibration, which may cause short circuit.
The surface of the backplate 300 away from the substrate 100 is connected with a stiffener 340 to improve the strength of the backplate 300.
Since the back plate 300 is provided with the plurality of sound holes 330, the strength of the back plate 300 is reduced, and in order to increase the strength of the back plate 300, the thickness of the back plate 300 is generally required to be increased to compensate for the strength of the back plate 300, but the excessively thick thickness of the back plate 300 increases the damping of the sound holes 330 on the back plate 300, thereby increasing the noise of the mems. In this embodiment, the back plate 300 is connected with a reinforcing rib to increase the strength of the back plate 300 and improve the mechanical strength of the back plate 300. Further, the thickness of the backplate 300 can be reduced, and the hole depth of the sound holes 330 on the backplate 300 is further reduced, so that the damping of the sound holes 330 on the backplate 300 is reduced, the noise is reduced, and the signal-to-noise ratio is improved.
In this embodiment, the stiffener 340 is located on the surface of the backplate 300 away from the substrate 100. In the process of forming the micro-electromechanical structure, the substrate 100, the first supporting portion 110, the diaphragm 200, the second supporting portion 120, and the backplate 300 are sequentially formed, and in the process of forming the backplate 300, the insulating layer 310 of the whole backplate 300 needs to be formed first to provide a support carrier for the conductive layer 320 and the reinforcing ribs 340 formed subsequently, so in this embodiment, the reinforcing ribs 340 are located on the surface of the backplate 300 away from the diaphragm 200, so that the processing of the reinforcing ribs is easier and more convenient; on the other hand, when the reinforcing rib 340 is disposed on the surface of the backplate 300 opposite to the diaphragm 200 (i.e., located in the oscillating acoustic cavity 400), the vibration of the diaphragm 200 is hindered, and the amplitude of the diaphragm 200 is affected.
The material of the reinforcing rib 340 is an insulating material such as silicon oxide, polyethylene oxide, and silicon nitride, and in a preferred embodiment, the reinforcing rib 340 is made of silicon nitride with high hardness and high rigidity. The reinforcing ribs 340 are fixed to the surface of the back plate 300 (specifically, the conductive layer 320) by, for example, an insulating adhesive.
The reinforcing ribs 340 are symmetrically distributed on the back plate 300 with respect to the center of the back plate 300; fig. 3 is a top view of a back plate according to a first embodiment of the present disclosure, and as shown in fig. 3, in this embodiment, the reinforcing ribs 340 include two linear first reinforcing ribs 341 and two linear second reinforcing ribs 342, wherein the two first reinforcing ribs 341 are distributed in parallel in a first direction and symmetrically distributed about the first direction, and specifically, the two first reinforcing ribs 341 extend from one side edge of the conductive layer 320 to the other side edge; two second reinforcing ribs 342 are distributed in parallel in the second direction and symmetrically distributed about the second direction, specifically, the two second reinforcing ribs 342 extend from one side edge of the conductive layer 320 to the other side edge; the first direction and the second direction are perpendicular to each other, and the symmetry axis of the reinforcing rib 340 in the first direction and the symmetry axis in the second direction intersect at the center of the back plate. That is, the two first reinforcing ribs 341 and the two second reinforcing ribs 342 are distributed on the surface of the conductive layer 320 in a cross shape, and the centers of the first reinforcing ribs 341 and the second reinforcing ribs 342 distributed in a cross shape are overlapped with the center of the back plate 200.
In this embodiment, both ends of the first reinforcing rib and the second reinforcing rib extend to the edge of the back plate, so that the reinforcing ribs can be used as the supporting beams of the back plate in both the first direction and the second direction.
The reinforcing ribs 340 of the embodiment are symmetrical about the first direction and the second direction perpendicular to each other, so that the strength of the entire back plate 300 is uniformly increased, the situation that the strength of the back plate 300 in a certain direction is smaller due to the uneven distribution of the reinforcing ribs 340 on the back plate 300 is prevented, and the tearing of the back plate 300 due to the different strengths of the back plate 300 is prevented.
In other embodiments, any number of ribs may be provided in the first and second directions, with the ribs provided in the first and second directions being staggered with respect to each other.
In this embodiment, the cross-sectional shape of the reinforcing rib is a rectangle, it is understood that in other embodiments, the cross-sectional shape of the reinforcing rib may also be a semicircle, a triangle, a trapezoid, an irregular shape, and the like, which is not limited in this embodiment.
In a specific embodiment, the thickness of the back plate 300 (the sum of the thicknesses of the insulating layer 310 and the conductive layer 320) is 0.3um to 0.8um, and the thickness of the reinforcing ribs 340 is 0.5um to 2um, so that the back plate 300 has greater mechanical strength with a lower thickness by increasing the thickness of the reinforcing ribs 340 and simultaneously decreasing the thickness of the back plate 300.
Fig. 4 shows a top view of a back plate according to a second embodiment of the present disclosure, as shown in fig. 4, unlike the first embodiment, in this embodiment, the reinforcing ribs 340 comprise a plurality of linear third reinforcing ribs 343, each of the third reinforcing ribs 343 passes through the center of the back plate 300, that is, the plurality of third reinforcing ribs 343 intersect at the center of the back plate 300, and both ends of each of the third reinforcing ribs 343 extend to the edge of the back plate 300. Each of the third reinforcing ribs 343 passes through the center of the back plate 300, so that the distribution of the third reinforcing ribs 343 is symmetrical with respect to the center of the back plate 300.
In this embodiment, each reinforcing rib passes through the center of the back plate, and both ends of each reinforcing rib extend to the edge of the back plate, so that the reinforcing ribs can be used as the supporting beams of the back plate in any direction.
The plurality of straight reinforcing ribs are symmetrical with respect to a first direction and a second direction perpendicular to each other, wherein the third reinforcing ribs 343 intersect at the center of the rear plate 300 with respect to the symmetry axes of the first direction and the second direction.
Fig. 5 shows a top view of a back plate according to a third embodiment of the present disclosure, and as shown in fig. 5, unlike the first embodiment, in this embodiment, the reinforcing ribs 340 include a plurality of fourth reinforcing ribs 344 having a circular shape and at least one fifth reinforcing rib 345 having a straight line shape. The center of each fourth reinforcing rib 344 coincides with the center of the back plate 300 such that the distribution of the fourth reinforcing ribs 344 is symmetrical about the center of the back plate 300 and symmetrical about the first and second directions perpendicular to each other, and at least one straight fifth reinforcing rib 345 passes through the center of the back plate 300 and both ends thereof extend to the edges of the back plate 300. The reinforcing ribs 340 intersect at the center of the back plate 300 with respect to the symmetry axes of the first and second directions.
Fig. 6 is a perspective view illustrating a micro-electromechanical structure according to a fourth embodiment of the disclosure, and as shown in fig. 6, unlike the first embodiment, in this embodiment, the micro-electromechanical structure includes a substrate 100, and a first supporting portion 110, a back plate 300, a second supporting portion 120, and a diaphragm 200, which are sequentially disposed on the substrate 100, where the diaphragm 200 is located above the back plate 300.
The reinforcing ribs 340 on the backplate 300 are located on the surface of the backplate 300 away from the substrate 100, that is, in the oscillating acoustic cavity 400 between the backplate 300 and the diaphragm 200, and the thicknesses of the reinforcing ribs 340 and the backplate 300 are reasonably adjusted at this time, so that the reinforcing ribs 340 do not obstruct the vibration of the diaphragm 200.
It should be noted that two back plates 300 or two diaphragms 200 may also be provided.
When two back plates 300 are arranged, the two back plates 300 are respectively located at two sides of the vibrating diaphragm 200, and the two back plates 300 are both arranged opposite to the vibrating diaphragm 200 through a second supporting portion, so that a gap is formed between each back plate 300 and the vibrating diaphragm 200; reinforcing ribs 340 are connected to both of the back plates 300, wherein the reinforcing ribs 340 are located on the surface of the back plate 300 where the reinforcing ribs 340 are located, which is far away from the substrate 100.
When two diaphragms 200 are arranged, the two diaphragms 200 are respectively located at two sides of the backplate 300, and the two diaphragms 200 are both arranged opposite to the backplate 300 through a second support part, so that a gap is formed between the backplate 300 and each diaphragm 200; the back plate 300 is provided with a stiffener 340, wherein the stiffener 340 is located on the surface of the back plate 300 away from the substrate 100.
The utility model also provides a microphone, include as above the micro-electromechanical structure.
The utility model also provides a terminal, include as above the microphone.
The micro-electromechanical structure, the microphone and the terminal are provided by the disclosure, the reinforcing ribs are connected to the back plate, so that the strength of the back plate is increased, and the mechanical strength of the back plate is improved. Furthermore, the thickness of the back plate can be reduced, the hole depth of the sound hole is further reduced, the damping of the sound hole on the back plate is reduced, the noise is reduced, and the signal to noise ratio is improved.
The reinforcing rib of the embodiment of the disclosure is symmetrical about the first direction and the second direction which are perpendicular to each other, so that the strength of the whole backboard is uniformly increased, the strength of the backboard is prevented from being different due to the fact that the reinforcing rib is unevenly distributed on the backboard, and the backboard is prevented from being partially torn due to the fact that the strength of the backboard is different.
In some embodiments, at least one of the stiffeners is linear, and both ends of the linear stiffener extend to the edge of the back plate such that the stiffener spans the width of the back plate in at least one direction, thereby acting as a support beam for the back plate.
In some embodiments, the thickness of the back plate is 0.3um to 0.8um, and the thickness of the reinforcing ribs is 0.5um to 2um, by increasing the thickness of the reinforcing ribs, the thickness of the back plate is reduced at the same time, so that the back plate has greater mechanical strength under the condition of having lower thickness.
In some embodiments, the ribs are located on the surface of the backplate away from the substrate, making the processing of the ribs easier and more convenient.
In some embodiments, the reinforcing rib is located on a surface of the back plate away from the diaphragm, so that when the excessively thick reinforcing rib is disposed on a surface of the back plate opposite to the diaphragm (i.e., located in the oscillating acoustic cavity), the reinforcing rib may obstruct vibration of the diaphragm, thereby affecting amplitude of the diaphragm.
In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.
Claims (14)
1. A microelectromechanical structure, comprising:
a back plate having sound holes therein; and
a diaphragm opposite to the back plate;
a gap is formed between the back plate and the vibrating diaphragm;
the back plate is connected with reinforcing ribs, and the reinforcing ribs are symmetrical about the center of the back plate.
2. The microelectromechanical structure of claim 1, characterized in that the stiffener is symmetrical about a first direction and a second direction perpendicular to each other, and the axis of symmetry of the stiffener in the first direction and the axis of symmetry in the second direction intersect at the center of the back plate.
3. The microelectromechanical structure of claim 2, wherein at least one of the ribs is linear, and wherein the linear rib has two ends that extend to the edge of the back plate.
4. The microelectromechanical structure of claim 3, characterized in that the stiffener comprises:
a plurality of first reinforcing ribs of a straight line type, the plurality of first reinforcing ribs being arranged in parallel in a first direction and being arranged symmetrically with respect to the first direction; and
a plurality of second reinforcing ribs of a straight line type, the plurality of second reinforcing ribs being arranged in parallel in a second direction and being arranged symmetrically with respect to the second direction;
both ends of each reinforcing rib extend to the edge of the back plate.
5. The microelectromechanical structure of claim 3, characterized in that the ribs comprise a plurality of linear third ribs, the plurality of third ribs intersect at the center of the back plate, and both ends of each third rib extend to the edge of the back plate.
6. The microelectromechanical structure of claim 3, characterized in that the stiffener comprises:
a plurality of circular fourth reinforcing ribs, the center of each fourth reinforcing rib being coincident with the center of the back plate; and
the back plate comprises at least one linear fifth strengthening rib, the fifth strengthening rib penetrates through the center of the back plate, and two ends of the fifth strengthening rib extend to the edge of the back plate.
7. The microelectromechanical structure of claim 1, characterized in that the cross-sectional shape of the stiffener is one or more of rectangular, semicircular, triangular, trapezoidal, or irregular.
8. The microelectromechanical structure of claim 1, characterized in that the thickness of the back plate is 0.3um to 0.8um.
9. The microelectromechanical structure of claim 1, characterized in that the thickness of the stiffener is 0.5um to 2um.
10. The microelectromechanical structure of claim 1, characterized in that the stiffener is made of an insulating material.
11. The microelectromechanical structure of claim 1, comprising:
a substrate having a cavity;
a first support part on the substrate;
the vibrating diaphragm is positioned on the first supporting part;
the second supporting part is positioned on the vibrating diaphragm; and
the back plate is positioned on the second supporting part.
12. The microelectromechanical structure of claim 11, characterized in that the stiffener is located on a surface of the back-plate remote from the substrate.
13. A microphone comprising a microelectromechanical structure of any of claims 1 to 12.
14. A terminal, characterized in that it comprises a microphone according to claim 13.
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| CN202220823049.7U CN217546292U (en) | 2022-04-11 | 2022-04-11 | Micro-electromechanical structure, microphone and terminal |
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| CN202220823049.7U CN217546292U (en) | 2022-04-11 | 2022-04-11 | Micro-electromechanical structure, microphone and terminal |
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