WO2022061601A1 - Shielding device for an coil of transformer - Google Patents

Shielding device for an coil of transformer Download PDF

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Publication number
WO2022061601A1
WO2022061601A1 PCT/CN2020/117190 CN2020117190W WO2022061601A1 WO 2022061601 A1 WO2022061601 A1 WO 2022061601A1 CN 2020117190 W CN2020117190 W CN 2020117190W WO 2022061601 A1 WO2022061601 A1 WO 2022061601A1
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Prior art keywords
layer
paperboard
shielding
shielding device
paperboard layer
Prior art date
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PCT/CN2020/117190
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French (fr)
Inventor
Zhusheng CHI
Ruibin Yang
Chengang Feng
Linda LI
Hong Liu
Jiaqi Wu
Yong Xia
Ren Wang
Original Assignee
Siemens Gas And Power Gmbh & Co. Kg
Siemens Energy Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Siemens Gas And Power Gmbh & Co. Kg, Siemens Energy Co., Ltd filed Critical Siemens Gas And Power Gmbh & Co. Kg
Priority to CN202080105441.1A priority Critical patent/CN116250053A/en
Priority to PCT/CN2020/117190 priority patent/WO2022061601A1/en
Publication of WO2022061601A1 publication Critical patent/WO2022061601A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/36—Electric or magnetic shields or screens
    • H01F27/363—Electric or magnetic shields or screens made of electrically conductive material

Definitions

  • the present application relates generally to the field of transformers, and more particularly, to a shielding device for an coil of a transformer.
  • a plurality of coils are provided side by side in a transformer, and a shielding layer is provided between the adjacent coils for isolating high-frequency noise and achieving electrical isolation between them.
  • a shielding layer made of aluminum foil or copper foil, but the aluminum foil and the copper foil are difficult to manufacture due to their very thin thicknesses (usually about 0.02 mm) .
  • the intensity of the electric field at top sharp edges of the shielding layer is relatively high, and difficult to be handeled by a conventional shielding device.
  • the shielding layer made of aluminum foil and copper foil may have an overlapped portion when rolled up to be a cylinder in use, and the overlapped portion may bring an additional thickness, which may adversely affect the shielding effect and is undesirable.
  • the present application provides a shielding device for an coil of a transformer, wherein the shielding device may comprise a first paperboard layer having a hollow cylinder shape and being formed by benting a first sheet-like paperboard having opposing first and second vertical edges and connecting the first and second vertical edges thereof together, wherein the first paperboard layer surrounds and is spaced apart from the coil by a distance; a second paperboard layer having a hollow cylinder shape and being formed by benting a second sheet-like paperboard having opposing first and second vertical edges and connecting the first and second vertical edges thereof together, wherein the second paperboard layer is arranged outside and surrounds the first paperboard layer; and a shielding layer connected between the first paperboard layer and the second paperboard layer, wherein the shielding layer comprises a first semiconductor paper layer connected to an outer side of the first paperboard layer, a second semiconductor paper layer connected to an inner side of the second paperboard layer, and a metal layer connected between the first semiconductor paper layer and the second semiconductor paper layer.
  • the shielding device of the present application can be prepared easily without having to attach a very thin aluminum foil or copper foil uniformly as compared with a conventional shielding layer made of an aluminum foil or copper foil. Moreover, the use of the semiconductor paper to replace most of the aluminum foil or the copper foil reduces the manufacturing cost.
  • the metal layer may be composed of a plurality of copper strips spaced apart.
  • the plurality of copper strips may be oriented in a horizontal direction.
  • the plurality of copper strips may be oriented in a vertical direction.
  • the shielding device may furtehr comprises a flat copper conductor oriented in a horizontal direction, the flat copper conductor being connected between the first semiconductor paper layer and the second semiconductor paper layer, and located above the shielding layer.
  • the flat copper conductor may be aligned with a top end of the coil surrounded by the first paperboard layer.
  • the flat copper conductor may have a thickness greater than that of the shielding layer, such that the shielding device has a thickened portion at a position where the flat copper conductor is located.
  • the shielding layer forms a thickened portion by the flat copper conductor, thereby the shielding layer has a larger radius of curvature at this position to provide a better protection on a top sharp edge of the shielding layer with higher electric field intensity.
  • the first paperboard layer may have a first chamfer at the first vertical edge thereof and a second chamfer matched with the first chamfer at the second vertical edge thereof, such that the first and the second chamfers are connected together to form the first paperboard layer having an uniform thickness.
  • the present application also provides a method of manufacturing a shielding device for an coil of a transformer.
  • the method may comprise the steps of: benting a first sheet-like paperboard having opposing first and second vertical edges and connecting the first and second vertical edges together to form a first paperboard layer having a hollow cylinder shape, wherein the first paperboard layer surrounds and is spaced apart from the coil by a distance; connecting the shielding layer to an outer side of the first paperboard layer; connecting a flat copper conductor oriented in a horizontal direction to the outer side of the first paperboard layer, wherein the flat copper conductor is located above the shielding layer and aligned with the top end of the coil surrounded by the first paperboard layer, and the flat copper conductor has a thickness greater than that of the shielding layer; and benting a second sheet-like paperboard having opposing first and second vertical edges and connecting the first and second vertical edges together to form a second paperboard layer having a hollow cylinder shape, and connecting the second paperboard layer to the outer sides of the shielding layer and the
  • the shielding layer may comprise a first semiconductor paper layer connected to the outer side of the first paperboard layer, a second semiconductor paper layer connected to the inner side of the second paperboard layer, and a metal layer connected between the first semiconductor paper layer and the second semiconductor paper layer, wherein the metal layer is composed of a plurality of copper strips spaced apart.
  • Fig. 1 is a perspective view showing a shielding device according to an embodiment of the present application
  • Fig. 2 is a side view showing the shielding device of Fig. 1;
  • Fig. 3 is an exploded side view showing the shielding device of Fig. 2;
  • Fig. 4 is an exploded side view showing the shielding device according to another embodiment of the present application.
  • Fig. 5 is a top view showing a first paperboard layer of the shielding device according to an embodiment of the present application.
  • Fig. 6 is a top view showing a second paperboard layer of the shielding device according to an embodiment of the present application.
  • the present application provides a shielding device for an coil of a transformer, and the shielding device may comprise a first paperboard layer 11, a second paperboard layer 15, and a shielding layer 10.
  • the first paperboard layer 11 has a hollow cylinder shape and is formed by benting a first sheet-like paperboard having opposing first and second vertical edges 111 and 112 and connecting the first and second vertical edges 111 and 112 together, wherein the first paperboard layer 11 surrounds and is spaced apart from the coil by a distance.
  • the second paperboard layer 15 may have a hollow cylinder shape and is formed by benting a second sheet-like paperboard having opposing first and second vertical edges 151 and 152 and connecting the first and second vertical edges 151 and 152 together, wherein the second paperboard layer 15 is arranged outside and surrounds the first paperboard layer 11.
  • the shielding layer 10 is connected between the first paperboard layer 11 and the second paperboard layer 15, wherein the shielding layer 10 may comprise a first semiconductor paper layer 12A connected to an outer side of the first paperboard layer 11, a second semiconductor paper layer 12B connected to an inner side of the second paperboard layer 15, and a metal layer 13 connected between the first semiconductor paper layer 12A and the second semiconductor paper layer 12B.
  • the first paperboard layer 11 may have opposing first and second vertical edges 111 and 112 and opposing first and second horizontal edges (not shown) in an unfolded state.
  • the first paperboard layer 11 may form a cylinder shape by connecting the first and second vertical edges 111 and 112 together in use.
  • the second paperboard layer 15 may have opposing first and second vertical edges 151 and 152 and opposing first and second horizontal edges (not shown) in an unfolded state.
  • the second paperboard layer 15 may form a cylinder shape by connecting the first and second vertical edges 151 and 152 together in use.
  • the first and second vertical edges 151 and 152 may be connected together by overlapping with each other.
  • a shielding device is provided outside one of the coils, i.e., the shielding device surrounds and is spaced from this coil by a distance, while it is unnecessary to provide a shielding device for the other coil, wherein, for example, the two adjacent coils and the shielding device surrounding one of the coils are provided on a substrate of the transformer.
  • a good shielding effect can be provided for two adjacent coils by one shielding device of the present application.
  • the first paperboard layer 11 and the second paperboard layer 15 form two opposite outer surfaces of the shielding device 1, and the shielding device 1 comprises a plurality of layers stacked in the following order: the first paperboard layer 11, the first semiconductor paper layer 12A, the metal layer 13, the second semiconductor paper layer 12B, and the second paperboard layer 15.
  • the first paperboard layer 11 and the second paperboard layer 15 may be identical or symmetrical.
  • the first paperboard layer 11 may have a thickness greater than that of the second paperboard layer 15, preferably, the thickness of the second paperboard layer 15 is 1 mm, and the thickness of the first paperboard layer 11 is 3 mm, but the thicknesses of the first paperboard layer 11 and the second paperboard layer 15 are not limited thereto.
  • the shielding device of the present application can be easily prepared without having to attach a very thin aluminum foil or copper foil uniformly as compared with a conventional shielding layer 10 made of an aluminum foil or copper foil. Moreover, the use of the semiconductor paper to replace most of the aluminum foil or the copper foil reduces the manufacturing cost.
  • first paperboard layer 11 and the second paperboard layer 15 are made of paperboard.
  • the first semiconductor paper layer 12A and the second semiconductor paper layer 12B are made of semiconductor paper.
  • the metal layer 13 is made of any one or combination of metals such as aluminum, copper, and the like, but the arrangement of the metal layer 13 is not limited thereto.
  • the metal layer 13 may be composed of a plurality of copper strips 131 spaced apart.
  • the plurality of copper strips 131 may be oriented in a horizontal direction.
  • a length of each of the plurality of copper strips 131 may be equal to a length of the first or second horizontal edges of the first paperboard layer 11, such that the cylinder shaped shielding device 1 can shield the coil well at any circumferential position.
  • the plurality of copper strips 131 may be oriented in a vertical direction.
  • the shielding device 1 may also comprise a flat copper conductor 14 oriented in a horizontal direction.
  • the flat copper conductor 14 may also be connected between the first semiconductor paper layer 12A and the second semiconductor paper layer 12B and located above the shielding layer 10.
  • the flat copper conductor 14 may be adjacent to the top end of the shielding layer 10 or located above the shielding layer 10 by a distance, preferably 5 mm.
  • the flat copper conductor 14 has a height of 10 mm.
  • the flat copper conductor 14 may be aligned with a top end of the coil surrounded by the first paperboard layer 11 of the shielding device 1.
  • the flat copper conductor 14 may have a thickness greater than that of the shielding layer 10, such that the shielding device 1 has a thickened portion 150 at the position where the flat copper conductor 14 is located.
  • the shielding device 1 forms a thickened portion 150 by the flat copper conductor 14, thereby the shielding device 1 has a larger radius of curvature at this position so as to provide a better protection on a top sharp edge of the shielding layer with higher electric field intensity.
  • the flat copper conductor 14 may have a length equal to that of the first or second horizontal edges of the first paperboard layer 11, such that the shielding device 1 in a cylinder shape can provides good shielding effects for the coil at any circumferential position.
  • the first paperboard layer 11 may have a first chamfer at the first vertical edge 111 and a second chamfer matched with the first chamfer at the second vertical edge 112, such that the first chamfer and the second chamfer are connected together to form the first paperboard layer 11 having an uniform thickness.
  • the first vertical edge 111 and the second vertical edge 112 may further incorporate other means (such as adhesive or the like) to enhance the connection therebetween thereby the first paperboard layer 11 has a stable cylinder shape. As such, it is possible to eliminate an additional thickness of the conventional shielding layer due to the overlapped portion generated when benting the shielding layer into a cylinder shape, thereby improving the shielding effect.
  • the first vertical edge 151 and the second vertical edge 152 of the second paperboard layer 15 are connected together, wherein the first vertical edge 151 and the second vertical edge 152 can be connected by overlapping with each other, thereby an overlapped portion is formed at the connection.
  • This connection is relatively simple, and this overlapped portion will not significantly affect the shielding effect of the shielding device since the thickness of the second paperboard layer 15 is thin (such as 1 mm) .
  • the present application also provides a method of manufacturing the shielding device for an coil of the transformer, comprising the steps of:
  • first sheet-like paperboard having opposing first and second vertical edges 111 and 112 and connecting the first and second vertical edges 111 and 112 thereof together to form a first paperboard layer 11 having a hollow cylinder shape, wherein the first paperboard layer 11 surrounds and is spaced apart from the coil by a distance;
  • the shielding layer 10 may comprise a first semiconductor paper layer 12A connected to the outer side of the first paperboard layer 11, a second semiconductor paper layer 12B connected to the inner side of the second paperboard layer 15, and a metal layer 13 connected between the first semiconductor paper layer 12A and the second semiconductor paper layer 12B, wherein the metal layer 13 is composed of a plurality of copper strips 131 spaced apart.

Abstract

The present application discloses a shielding device for an coil of a transformer, comprising a first paperboard layer having a hollow cylinder shape, a second paperboard layer having a hollow cylinder shape, and a shielding layer. The first paperboard layer surrounds and is spaced apart from the coil by a distance, the second paperboard layer is arranged outside and surrounds the first paperboard layer, and the shielding layer is connected between the first paperboard layer and the second paperboard layer, wherein the shielding layer comprises a first semiconductor paper layer connected to an outer side of the first paperboard layer, a second semiconductor paper layer connected to an inner side of the second paperboard layer, and a metal layer connected between the first semiconductor paper layer and the second semiconductor paper layer. The present application also discloses a method of manufacturing the shielding device for an coil of the transformer. The shielding device of the present application can provide a good shielding effect between adjacent coils.

Description

Shielding Device for an Coil of Transformer Technical Field
The present application relates generally to the field of transformers, and more particularly, to a shielding device for an coil of a transformer.
Background
Generally, a plurality of coils are provided side by side in a transformer, and a shielding layer is provided between the adjacent coils for isolating high-frequency noise and achieving electrical isolation between them. So far, in a conventional transformer, interposed between the coils is a shielding layer made of aluminum foil or copper foil, but the aluminum foil and the copper foil are difficult to manufacture due to their very thin thicknesses (usually about 0.02 mm) . Moreover, the intensity of the electric field at top sharp edges of the shielding layer is relatively high, and difficult to be handeled by a conventional shielding device. Furthermore, the shielding layer made of aluminum foil and copper foil may have an overlapped portion when rolled up to be a cylinder in use, and the overlapped portion may bring an additional thickness, which may adversely affect the shielding effect and is undesirable.
Summary
To overcome the above defects in the prior art, the present application provides a shielding device for an coil of a transformer, wherein the shielding device may comprise a first paperboard layer having a hollow cylinder shape and being formed by benting a first sheet-like paperboard having opposing first and second vertical edges and connecting the first and second vertical edges thereof together, wherein the first paperboard layer surrounds and is spaced apart from the coil by a distance; a second paperboard layer having a hollow cylinder shape and being formed by benting a second sheet-like paperboard having opposing first and second vertical edges and connecting the first and second vertical edges thereof together, wherein the second paperboard layer is arranged outside and surrounds the first paperboard layer; and a shielding layer connected between the first paperboard layer and the second paperboard layer, wherein the shielding layer comprises a first semiconductor paper layer connected to an outer side of the first paperboard layer, a second  semiconductor paper layer connected to an inner side of the second paperboard layer, and a metal layer connected between the first semiconductor paper layer and the second semiconductor paper layer.
By such an arrangement, the shielding device of the present application can be prepared easily without having to attach a very thin aluminum foil or copper foil uniformly as compared with a conventional shielding layer made of an aluminum foil or copper foil. Moreover, the use of the semiconductor paper to replace most of the aluminum foil or the copper foil reduces the manufacturing cost.
Further, the metal layer may be composed of a plurality of copper strips spaced apart.
Further, the plurality of copper strips may be oriented in a horizontal direction.
Further, the plurality of copper strips may be oriented in a vertical direction.
Further, the shielding device may furtehr comprises a flat copper conductor oriented in a horizontal direction, the flat copper conductor being connected between the first semiconductor paper layer and the second semiconductor paper layer, and located above the shielding layer.
Further, the flat copper conductor may be aligned with a top end of the coil surrounded by the first paperboard layer.
Further, the flat copper conductor may have a thickness greater than that of the shielding layer, such that the shielding device has a thickened portion at a position where the flat copper conductor is located.
By such an arrangement, at the position corresponding to the top of the coil, the shielding layer forms a thickened portion by the flat copper conductor, thereby the shielding layer has a larger radius of curvature at this position to provide a better protection on a top sharp edge of the shielding layer with higher electric field intensity.
Further, the first paperboard layer may have a first chamfer at the first vertical edge thereof and a second chamfer matched with the first chamfer at the second vertical edge thereof, such that the first and the second chamfers are connected together to form the first paperboard layer having an uniform thickness.
By such an arrangement, it is possible to eliminate an additional thickness of the conventional shielding layer due to an overlapped portion generated when benting into a cylinder shape, thereby improving the shielding effect.
Therefore, a good shielding effect can be provided between adjacent coils by the  shielding device of the present application.
In addition, the present application also provides a method of manufacturing a shielding device for an coil of a transformer. the method may comprise the steps of: benting a first sheet-like paperboard having opposing first and second vertical edges and connecting the first and second vertical edges together to form a first paperboard layer having a hollow cylinder shape, wherein the first paperboard layer surrounds and is spaced apart from the coil by a distance; connecting the shielding layer to an outer side of the first paperboard layer; connecting a flat copper conductor oriented in a horizontal direction to the outer side of the first paperboard layer, wherein the flat copper conductor is located above the shielding layer and aligned with the top end of the coil surrounded by the first paperboard layer, and the flat copper conductor has a thickness greater than that of the shielding layer; and benting a second sheet-like paperboard having opposing first and second vertical edges and connecting the first and second vertical edges together to form a second paperboard layer having a hollow cylinder shape, and connecting the second paperboard layer to the outer sides of the shielding layer and the flat copper conductor.
Further, the shielding layer may comprise a first semiconductor paper layer connected to the outer side of the first paperboard layer, a second semiconductor paper layer connected to the inner side of the second paperboard layer, and a metal layer connected between the first semiconductor paper layer and the second semiconductor paper layer, wherein the metal layer is composed of a plurality of copper strips spaced apart.
Brief Description of the Drawings
The accompanying drawings of the description are used for providing a further understanding of the present application, and constitute a part of the present application. The schematic embodiments of the present application and the description thereof are used to illustrate the present application, but not to limit the present invention improperly. Wherein
Fig. 1 is a perspective view showing a shielding device according to an embodiment of the present application;
Fig. 2 is a side view showing the shielding device of Fig. 1;
Fig. 3 is an exploded side view showing the shielding device of Fig. 2;
Fig. 4 is an exploded side view showing the shielding device according to  another embodiment of the present application;
Fig. 5 is a top view showing a first paperboard layer of the shielding device according to an embodiment of the present application; and
Fig. 6 is a top view showing a second paperboard layer of the shielding device according to an embodiment of the present application.
List of reference numerals
1     Shielding device
10    Shielding layer
11    First paperboard layer
12A   First semiconductor paper layer
12B   Second semiconductor paper layer
13    Metal layer
14    Flat copper conductor
15    Second paperboard layer
150   Thickened portion
111   First vertical edge of the first paperboard layer
112   Second vertical edge of the first paperboard layer
131   Copper strip
151   First vertical edge of the second paperboard layer
152   Second vertical edge of the second paperboard layer
Detailed Description of the Embodiments
Hereinafter, the technical solutions in the embodiments of the present application are described in detail in combination with the drawings in the embodiments of the present application. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflicts.
The present application provides a shielding device for an coil of a transformer, and the shielding device may comprise a first paperboard layer 11, a second paperboard layer 15, and a shielding layer 10. As shown in connection with Figs. 1, 5 and 6, the first paperboard layer 11 has a hollow cylinder shape and is formed by benting a first sheet-like paperboard having opposing first and second  vertical edges  111 and 112 and connecting the first and second  vertical edges  111 and 112 together, wherein the first paperboard layer 11 surrounds and is spaced apart from the coil by a  distance. The second paperboard layer 15 may have a hollow cylinder shape and is formed by benting a second sheet-like paperboard having opposing first and second  vertical edges  151 and 152 and connecting the first and second  vertical edges  151 and 152 together, wherein the second paperboard layer 15 is arranged outside and surrounds the first paperboard layer 11. The shielding layer 10 is connected between the first paperboard layer 11 and the second paperboard layer 15, wherein the shielding layer 10 may comprise a first semiconductor paper layer 12A connected to an outer side of the first paperboard layer 11, a second semiconductor paper layer 12B connected to an inner side of the second paperboard layer 15, and a metal layer 13 connected between the first semiconductor paper layer 12A and the second semiconductor paper layer 12B.
In particular, the first paperboard layer 11 may have opposing first and second  vertical edges  111 and 112 and opposing first and second horizontal edges (not shown) in an unfolded state. As shown in Fig. 5, the first paperboard layer 11 may form a cylinder shape by connecting the first and second  vertical edges  111 and 112 together in use. In particular, the second paperboard layer 15 may have opposing first and second  vertical edges  151 and 152 and opposing first and second horizontal edges (not shown) in an unfolded state. As shown in Fig. 6, the second paperboard layer 15 may form a cylinder shape by connecting the first and second  vertical edges  151 and 152 together in use. For example, the first and second  vertical edges  151 and 152 may be connected together by overlapping with each other.
In particular, in a transformer, for example, provided with two adjacent coils side by side, a shielding device is provided outside one of the coils, i.e., the shielding device surrounds and is spaced from this coil by a distance, while it is unnecessary to provide a shielding device for the other coil, wherein, for example, the two adjacent coils and the shielding device surrounding one of the coils are provided on a substrate of the transformer. In other words, a good shielding effect can be provided for two adjacent coils by one shielding device of the present application.
As shown in Figs. 1 to 3, the first paperboard layer 11 and the second paperboard layer 15 form two opposite outer surfaces of the shielding device 1, and the shielding device 1 comprises a plurality of layers stacked in the following order: the first paperboard layer 11, the first semiconductor paper layer 12A, the metal layer 13, the second semiconductor paper layer 12B, and the second paperboard layer 15. In particular, the first paperboard layer 11 and the second paperboard layer 15 may  be identical or symmetrical. In particular, the first paperboard layer 11 may have a thickness greater than that of the second paperboard layer 15, preferably, the thickness of the second paperboard layer 15 is 1 mm, and the thickness of the first paperboard layer 11 is 3 mm, but the thicknesses of the first paperboard layer 11 and the second paperboard layer 15 are not limited thereto.
By such an arrangement, the shielding device of the present application can be easily prepared without having to attach a very thin aluminum foil or copper foil uniformly as compared with a conventional shielding layer 10 made of an aluminum foil or copper foil. Moreover, the use of the semiconductor paper to replace most of the aluminum foil or the copper foil reduces the manufacturing cost.
In particular, the first paperboard layer 11 and the second paperboard layer 15 are made of paperboard. The first semiconductor paper layer 12A and the second semiconductor paper layer 12B are made of semiconductor paper. Moreover, the metal layer 13 is made of any one or combination of metals such as aluminum, copper, and the like, but the arrangement of the metal layer 13 is not limited thereto.
In the present application, the metal layer 13 may be composed of a plurality of copper strips 131 spaced apart. In the embodiment shown in Fig. 4, the plurality of copper strips 131 may be oriented in a horizontal direction. In particular, a length of each of the plurality of copper strips 131 may be equal to a length of the first or second horizontal edges of the first paperboard layer 11, such that the cylinder shaped shielding device 1 can shield the coil well at any circumferential position. In yet another embodiment (not shown) , the plurality of copper strips 131 may be oriented in a vertical direction.
As shown in Figs. 1 to 4, the shielding device 1 may also comprise a flat copper conductor 14 oriented in a horizontal direction. The flat copper conductor 14 may also be connected between the first semiconductor paper layer 12A and the second semiconductor paper layer 12B and located above the shielding layer 10. In particular, the flat copper conductor 14 may be adjacent to the top end of the shielding layer 10 or located above the shielding layer 10 by a distance, preferably 5 mm. In a preferred embodiment, the flat copper conductor 14 has a height of 10 mm.
In particular, the flat copper conductor 14 may be aligned with a top end of the coil surrounded by the first paperboard layer 11 of the shielding device 1. As shown in Figs. 2 to 4, the flat copper conductor 14 may have a thickness greater than that of the shielding layer 10, such that the shielding device 1 has a thickened portion 150 at  the position where the flat copper conductor 14 is located. As such, at a position corresponding to the top of the coil, the shielding device 1 forms a thickened portion 150 by the flat copper conductor 14, thereby the shielding device 1 has a larger radius of curvature at this position so as to provide a better protection on a top sharp edge of the shielding layer with higher electric field intensity.
In a preferred embodiment, the flat copper conductor 14 may have a length equal to that of the first or second horizontal edges of the first paperboard layer 11, such that the shielding device 1 in a cylinder shape can provides good shielding effects for the coil at any circumferential position.
As shown in Fig. 5, the first paperboard layer 11 may have a first chamfer at the first vertical edge 111 and a second chamfer matched with the first chamfer at the second vertical edge 112, such that the first chamfer and the second chamfer are connected together to form the first paperboard layer 11 having an uniform thickness. Moreover, the first vertical edge 111 and the second vertical edge 112 may further incorporate other means (such as adhesive or the like) to enhance the connection therebetween thereby the first paperboard layer 11 has a stable cylinder shape. As such, it is possible to eliminate an additional thickness of the conventional shielding layer due to the overlapped portion generated when benting the shielding layer into a cylinder shape, thereby improving the shielding effect. As shown in Fig. 6, the first vertical edge 151 and the second vertical edge 152 of the second paperboard layer 15 are connected together, wherein the first vertical edge 151 and the second vertical edge 152 can be connected by overlapping with each other, thereby an overlapped portion is formed at the connection. This connection is relatively simple, and this overlapped portion will not significantly affect the shielding effect of the shielding device since the thickness of the second paperboard layer 15 is thin (such as 1 mm) .
In addition, the present application also provides a method of manufacturing the shielding device for an coil of the transformer, comprising the steps of:
benting a first sheet-like paperboard having opposing first and second  vertical edges  111 and 112 and connecting the first and second  vertical edges  111 and 112 thereof together to form a first paperboard layer 11 having a hollow cylinder shape, wherein the first paperboard layer 11 surrounds and is spaced apart from the coil by a distance;
connecting the shielding layer 10 to an outer side of the first paperboard layer 11;
connecting the flat copper conductor 14 oriented in a horizontal direction to the outer side of the first paperboard layer 11, wherein the flat copper conductor 14 is located above the shielding layer 10 and aligned with the top end of the coil surrounded by the first paperboard layer 11, and the flat copper conductor 14 has the a thickness greater than that of the shielding layer 10; and
benting a second sheet-like paperboard having opposing first and second  vertical edges  151 and 152 and connecting the first and second  vertical edges  151 and 152 thereof together to form a second paperboard layer 15 having a hollow cylinder shape, and connecting the second paperboard layer 15 to the outer sides of the shielding layer 10 and the flat copper conductor 14.
In particular, the shielding layer 10 may comprise a first semiconductor paper layer 12A connected to the outer side of the first paperboard layer 11, a second semiconductor paper layer 12B connected to the inner side of the second paperboard layer 15, and a metal layer 13 connected between the first semiconductor paper layer 12A and the second semiconductor paper layer 12B, wherein the metal layer 13 is composed of a plurality of copper strips 131 spaced apart.
The foregoing contents are merely preferred embodiments of the present application, and are not intended to limit the present application. For a person skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be comprised in the scope of protection of the present application.

Claims (10)

  1. A shielding device (1) for an coil of a transformer, wherein the shielding device (1) comprises:
    a first paperboard layer (11) having a hollow cylinder shape and being formed by benting a first sheet-like paperboard having opposing first and second vertical edges (111, 112) and connecting the first and second vertical edges (111, 112) thereof together, wherein the first paperboard layer (11) surrounds and is spaced apart from the coil by a distance;
    a second paperboard layer (15) having a hollow cylinder shape and being formed by benting a second sheet-like paperboard having opposing first and second vertical edges (151, 152) and connecting the first and second vertical edges (151, 152) thereof together, wherein the second paperboard layer (15) is arranged outside and surrounds the first paperboard layer (11) ; and
    a shielding layer (10) connected between the first paperboard layer (11) and the second paperboard layer (15) , wherein the shielding layer (10) comprises:
    a first semiconductor paper layer (12A) connected to an outer side of the first paperboard layer (11) and a second semiconductor paper layer (12B) connected to an inner side of the second paperboard layer (15) ; and
    a metal layer (13) connected between the first semiconductor paper layer (12A) and the second semiconductor paper layer (12B) .
  2. The shielding device of claim 1, wherein the metal layer (13) is composed of a plurality of copper strips (131) spaced apart.
  3. The shielding device of claim 2, wherein the plurality of copper strips (131) are oriented in a horizontal direction.
  4. The shielding device of claim 2, wherein the plurality of copper strips (131) are oriented in a vertical direction.
  5. The shielding device of claim 1, wherein the shielding device (1) further comprises a fat copper conductor (14) oriented in a horizontal direction, the flat copper conductor (14) being connected between the first semiconductor paper layer (12A) and the second semiconductor paper layer (12B) and located above the shielding layer (10) .
  6. The shielding device of claim 5, wherein the flat copper conductor (14) is aligned with a top end of the coil surrounded by the first paperboard layer (11) .
  7. The shielding device of claim 6, wherein the flat copper conductor (14) has a  thickness greater than that of the shielding layer (10) , such that the shielding device (1) has a thickened portion (15) at a position where the flat copper conductor (14) is located.
  8. The shielding device of claim 1, wherein the first paperboard layer (11) has a first chamfer at the first vertical edge (111) thereof and a second chamfer matched with the first chamfer at the second vertical edge (112) thereof, such that the first and second chamfers are connected together to form the first paperboard layer (11) having an uniform thickness.
  9. A method of manufacturing a shielding device for an coil of a transformer, comprising the steps of:
    benting a first sheet-like paperboard having opposing first and second vertical edges (111, 112) and connecting the first and second vertical edges (111, 112) thereof together to form a first paperboard layer (11) having a hollow cylinder shape, wherein the first paperboard layer (11) surrounds and is spaced apart from the coil by a distance;
    connecting the shielding layer (10) to an outer side of the first paperboard layer (11) ;
    connecting a flat copper conductor (14) oriented in a horizontal direction to the outer side of the first paperboard layer (11) , wherein the flat copper conductor (14) is located above the shielding layer (10) and aligned with the top end of the coil surrounded by the first paperboard layer (11) , and the flat copper conductor (14) has a thickness greater than that of the shielding layer (10) ; and
    benting a second sheet-like paperboard having opposing first and second vertical edges (151, 152) and connecting the first and second vertical edges (151, 152) thereof together to form a second paperboard layer (15) having a hollow cylinder shape, and connecting the second paperboard layer (15) to the outer sides of the shielding layer (10) and the flat copper conductor (14) .
  10. The method of claim 9, wherein the shielding layer (10) comprises a first semiconductor paper layer (12A) connected to the outer side of the first paperboard layer (11) , a second semiconductor paper layer (12B) connected to the inner side of the second paperboard layer (15) , and a metal layer (13) connected between the first semiconductor paper layer (12A) and the second semiconductor paper layer (12B) , wherein the metal layer (13) is composed of a plurality of copper strips (131) spaced apart.
PCT/CN2020/117190 2020-09-23 2020-09-23 Shielding device for an coil of transformer WO2022061601A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0061521A1 (en) * 1981-03-20 1982-10-06 Transformatoren Union Aktiengesellschaft Shielding element for yokes of iron cores in transformers and in inductance coils
CN201252718Y (en) * 2008-08-27 2009-06-03 保定天威集团有限公司 Semi-conducting paper shield plate
CN204011007U (en) * 2014-06-10 2014-12-10 常州市英中电气有限公司 For the ground screen of superhigh pressure or extra-high voltage transformer
CN206432126U (en) * 2017-01-18 2017-08-22 特变电工股份有限公司 A kind of transformer land used screen structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0061521A1 (en) * 1981-03-20 1982-10-06 Transformatoren Union Aktiengesellschaft Shielding element for yokes of iron cores in transformers and in inductance coils
CN201252718Y (en) * 2008-08-27 2009-06-03 保定天威集团有限公司 Semi-conducting paper shield plate
CN204011007U (en) * 2014-06-10 2014-12-10 常州市英中电气有限公司 For the ground screen of superhigh pressure or extra-high voltage transformer
CN206432126U (en) * 2017-01-18 2017-08-22 特变电工股份有限公司 A kind of transformer land used screen structure

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