TWI423278B - In-line positioning structure of conductive sheet for planar - Google Patents

Description

Conductive sheet series positioning structure of planar electromagnetic induction element

The present invention relates to a series arrangement of conductive sheets of a planar electromagnetic induction element capable of preventing the conductive sheet from being bent and lifted.

Electromagnetic induction components, such as inductors or transformers, are conventionally practiced by winding a primary side coil and a secondary side coil on a magnetic core, and utilizing changes in current and voltage in the primary side coil to cause changes on the magnetic core. The magnetic field, in turn, excites the secondary side coil to produce varying currents and voltages; however, the above-described prior art electromagnetic induction elements are bulky and difficult to further shrink, and today various electronic devices strive to be light, thin, short, and small. Obstruction, in addition, the step of coil winding is difficult to perform by machine automation, which leads to inconvenience in manufacturing and high cost.

Therefore, a planar electromagnetic induction element is designed, which uses a plurality of stacked arc-shaped conductive sheets to be connected in parallel or in series, and then a magnetic core is axially inserted between the conductive sheets. This forms the effect of coil winding, which achieves the purpose of reducing the volume of the electromagnetic induction element and simplifying the manner in which the electronic sensing element is fabricated.

Referring to the third figure, a prior art planar electromagnetic induction component (taking a transformer as an example) includes a multilayer circuit board (50), two conductive sheets (60) and two magnetic cores (80);

Referring further to the fourth figure, a multi-layer circuit board (50) is formed with a through hole (51) therethrough, and includes a plurality of layers of insulating layers (52) and a conductive layer (53), each conductive layer (53). Having a curved body surrounding the perforation (51) and having a first end (531) and a second end (532), wherein the first end (531) of the two adjacent conductive layers (53) When the corresponding ends are connected and the second ends (532) are correspondingly connected, the two conductive layers (53) are connected in parallel, and when the first end (531) of one conductive layer (53) is connected to another conductive layer When the second end (532) of (53) is correspondingly connected, the two conductive layers (53) are connected in series;

The conductive sheet (60) also has a curved body and has a first end (61) and a second end (62) respectively disposed on opposite sides of the multilayer circuit board (50). Wherein, when the conductive sheet (60) and the conductive layer (53) of the multilayer circuit board (50) are connected in parallel, the two are attached to each other by soldering, and when the conductive When the sheet (60) and the conductive layer (53) of the multilayer circuit board (50) are connected in series (as shown in the fourth figure), an insulating film (70) is interposed therebetween, and The second end (62) of the conductive sheet (60) is soldered to the first end (531) of the conductive layer (53), and the first end (61) of the conductive sheet (60) is connected to the multilayer circuit A solder pad (54) disposed on the board (50) is soldered, and electrically connected to the circuit in the multilayer circuit board (50) through the solder pad (54);

The magnetic core (80) is protruded from a bottom plate (81) by a magnetic column (82), and the two magnetic cores (80) are respectively disposed on opposite sides of the multilayer circuit board (50) to make the magnetic column (82) The axial direction is disposed between the through holes (51) of the multilayer circuit board (50), and the multi-layer circuit board (50), the insulating film (70) and the conductive sheet (60) are sandwiched and positioned by the bottom plate (82) , combined into a planar transformer.

However, when the conductive sheets (60) are arranged in series on the multilayer circuit board (50), only the two ends (61) (62) are soldered, and the conductive sheets (60) are subjected to stress concentration. The result of the two end portions (61) (62) will cause other portions of the conductive sheet (60) to be bent and lifted, thereby being damaged by deformation, so that the positioning method of the conductive sheets in the prior art tandem planar electromagnetic induction element is There are areas for further improvement.

In view of the above-mentioned deficiencies of the prior art, the present invention provides a series arrangement structure of conductive sheets of a planar electromagnetic induction element, which is designed to solve the prior art planar electromagnetic induction elements, wherein a conductive sheet is arranged in series in one more When the layer is on the circuit board, the stress is concentrated on the end portion thereof, which causes the other portion of the conductive sheet to be bent and lifted.

In order to achieve the above object, the technical means utilized by the present invention is to add a positioning mechanism to a planar electromagnetic induction component, which is disposed between a multilayer circuit board and a ring portion of a conductive sheet. The inner portion of the conductive sheet is fixedly coupled to the multi-layer circuit board. The specific structure of the positioning mechanism includes at least one auxiliary pad disposed on the multilayer circuit board, and at least one positioning protrusion protrudingly formed on the conductive sheet. Department, the two are correspondingly connected.

By designing the positioning convex portion of the conductive sheet to be in contact with the auxiliary soldering pad on the circuit board, the portions of the conductive sheet can be uniformly applied to the multilayer circuit board, thereby effectively avoiding the conductive sheet. Bending and lifting to prevent deformation and damage of the conductive sheet.

Referring to the first embodiment of the planar electromagnetic induction component (taking a transformer as an example), the conductive sheet series positioning structure comprises a multilayer circuit board (10), at least one insulating film (20), and at least one conductive sheet (30). And a positioning mechanism (40), wherein:

A multi-layer circuit board (10) is formed with a through hole (11), and comprises a plurality of layers of insulating layers (12) and a conductive layer (13), and a pad (14) is disposed on at least one side thereof. The conductive layer (13) has an arc-shaped body and has a ring portion (133), a first end (131) and a second end (132), and the first end is respectively disposed between the conductive layers (13) (131) and the second end (132) are correspondingly connected, the annular portion (133) is disposed around the through hole (11) of the multilayer circuit board (10), and the solder pad (14) is correspondingly formed on the conductive layer (13) a side of the first end (131) and electrically connected to the circuit in the multilayer circuit board (10);

An insulating film (20) is disposed on the annular portion (133) of the conductive layer (13) of the multilayer circuit board (10);

The conductive sheet (30) is disposed on the insulating film (20) and has an arc-shaped sheet body having an annular portion (33), a first end (31) and a second end (32). The portion (33) is disposed on the insulating film (20) to insulate between the annular portion (33) of the conductive sheet (30) and the annular portion (133) of the conductive layer (13) of the multilayer circuit board (10). The first end (31) of the conductive sheet (30) is correspondingly connected to the solder pad (14) of the multilayer circuit board (10), and the second end (32) of the conductive sheet (30) and the multilayer circuit board (10) The first end (131) of the conductive layer (13) corresponds to each other;

The positioning mechanism (40) is disposed between the multilayer circuit board (10) and the annular portion (33) of the conductive sheet (30), thereby combining the annular portion (33) of the conductive sheet (30) with the multilayer circuit board (10) Fixed, the positioning mechanism (40) includes at least one auxiliary pad (41) and at least one positioning protrusion (42) disposed on at least one side of the multilayer circuit board (10), and Formed on the side of the annular portion (133) of the conductive layer (13), the positioning protrusion (42) is formed on the annular portion (33) of the conductive sheet (30), and the multilayer circuit board (10) The auxiliary pad (41) on the substrate is correspondingly connected. In the preferred embodiment of the present invention, the auxiliary pad (41) may not be electrically connected to the circuit in the multilayer circuit board (10), but only And the positioning convex portion (42) on the conductive sheet (30) is fixed to each other, and the auxiliary soldering pad (41) can also be electrically connected to the circuit in the multilayer circuit board (10) to further have a grounding. Efficacy

Further, the positioning protrusion (42) and the auxiliary pad (41) are coupled to each other, and the preferred arrangement is located at a central position of the annular portion (33) of the conductive sheet (30), and the central position is respectively The distance between the first end (31) and the second end (32) of the conductive sheet (30) is equal.

In the above design, the conductive sheet (30) is connected to the pad (14) of the multilayer circuit board (10) with the first end (31), and the second end (32) and the multilayer circuit board ( 10) The first end (131) of the conductive layer (13) is connected to achieve the effect of series connection, and further the auxiliary protrusion (34) and the auxiliary pad (15) on the multilayer circuit board (10) Therefore, the respective portions of the conductive sheet (30) are force-averaged to be stably disposed on the multilayer circuit board (10), thereby effectively preventing the conductive sheet (30) from being bent and lifted due to uneven force. Further, the effect of the conductive sheet (30) being damaged by deformation is prevented.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention A person skilled in the art can make some modifications or modifications to the equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. It is still within the scope of the technical solution of the present invention to make any simple modifications, equivalent changes and modifications to the above embodiments.

(10). . . Multi-layer circuit board

(11). . . perforation

(12). . . Insulation

(13). . . Conductive layer

(131). . . First end

(132). . . Second end

(133). . . Ring

(14). . . Solder pad

(20). . . Insulating film

(30). . . Conductive sheet

(31). . . First end

(32). . . Second end

(33). . . Ring

(40). . . Positioning mechanism

(41). . . Auxiliary pad

(42). . . Positioning convex

(50). . . Multi-layer circuit board

(51). . . perforation

(52). . . Insulation

(53). . . Conductive layer

(531). . . First end

(532). . . Second end

(54). . . Solder pad

(60). . . Conductive sheet

(61). . . First end

(62). . . Second end

(70). . . Insulating film

(80). . . Magnetic core

(81). . . Bottom plate

(82). . . Magnetic column

The first figure is an exploded perspective view of the present invention.

The second figure is a perspective view of the present invention.

The third figure is a three-dimensional exploded view of the limited technology.

The fourth figure is another perspective exploded view of the prior art.

(10). . . Multi-layer circuit board

(11). . . perforation

(12). . . Insulation

(13). . . Conductive layer

(131). . . First end

(132). . . Second end

(133). . . Ring

(14). . . Solder pad

(20). . . Insulating film

(30). . . Conductive sheet

(31). . . First end

(32). . . Second end

(33). . . Ring

(41). . . Auxiliary pad

(42). . . Positioning convex

Claims (5)

A conductive sheet series positioning structure of a planar electromagnetic induction component, comprising a multi-layer circuit board, at least one insulating film and at least one conductive sheet, wherein the multi-layer circuit board is formed with a perforation therethrough, and comprises a plurality of layers of staggered insulation And a conductive layer on at least one side of the conductive layer, the conductive layer having an annular portion, a first end and a second end, wherein each of the conductive layers is respectively One end and the second end are correspondingly connected, and the annular portion is disposed around the through hole of the multilayer circuit board, and the solder pad is formed on the side of the first end of the conductive layer, and is electrically connected to the circuit in the multilayer circuit board. The insulating film is disposed on the annular portion of the conductive layer of the multi-layer circuit board. The conductive sheet is disposed on the insulating film, and has an arc-shaped body and has an annular portion, a first end and a second end. The annular portion is correspondingly disposed on the insulating film, and the first end of the conductive sheet is correspondingly connected to the solder pad of the multilayer circuit board, and the second end of the conductive sheet corresponds to the first end of the conductive layer of the multilayer circuit board Connected, which is characterized by: A positioning mechanism disposed between the annular portion of the multilayer circuit board and the conductive sheet, the conductive sheet positioning mechanism whereby the annular portion bonded to each other and fixed to the multilayer circuit board. The conductive sheet series positioning structure of the planar electromagnetic induction element according to claim 1, wherein the positioning mechanism has at least one positioning convex portion and an auxiliary welding pad disposed relative to the positioning convex portion, and the specific configuration thereof; the auxiliary welding The pad is disposed on at least one side of the multilayer circuit board, the auxiliary pad is formed on a side of the annular portion of the conductive layer; the positioning protrusion is formed on the annular portion of the conductive sheet, and is on the multilayer circuit board The auxiliary pads are connected to each other. The conductive sheet series positioning structure of the planar electromagnetic induction element according to claim 2, wherein the positioning protrusion is disposed at a central position of the annular portion of the conductive sheet, the central position being respectively opposite to the first end and the second The distances at the ends are equal. The conductive sheet series positioning structure of the planar electromagnetic induction element according to claim 2 or 3, wherein the auxiliary pad is not electrically connected to the circuit in the multilayer circuit board. The conductive sheet series positioning structure of the planar electromagnetic induction element according to claim 2 or 3, wherein the auxiliary pad is electrically connected to a circuit in the multilayer circuit board.