CN116250053A - Shielding device for a coil of a transformer - Google Patents
Shielding device for a coil of a transformer Download PDFInfo
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- CN116250053A CN116250053A CN202080105441.1A CN202080105441A CN116250053A CN 116250053 A CN116250053 A CN 116250053A CN 202080105441 A CN202080105441 A CN 202080105441A CN 116250053 A CN116250053 A CN 116250053A
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- layer
- cardboard
- shielding
- paperboard
- shielding device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
The application discloses a shielding device for a transformer coil, comprising a first paperboard layer with a hollow cylinder shape, a second paperboard layer with a hollow cylinder shape, and a shielding layer. The first cardboard layer surrounds the coil and is spaced apart from the coil, the second cardboard layer is arranged outside and around the first cardboard layer, and the shielding layer is connected between the first cardboard layer and the second cardboard layer, wherein the shielding layer comprises a first semiconductor paper layer connected to the outside of the first cardboard layer, a second semiconductor paper layer connected to the inside of the second cardboard layer, and a metal layer connected between the first semiconductor paper layer and the second semiconductor paper layer. The application also discloses a method of manufacturing a shielding device for a transformer coil. The shielding device can provide good shielding effect between adjacent coils.
Description
Technical Field
The present application relates generally to the field of transformers, and more particularly to shielding devices for coils of transformers.
Background
Typically, a plurality of coils are arranged side by side in a transformer, and a shielding layer is provided between adjacent coils for isolating high frequency noise and achieving electrical insulation therebetween. Hitherto, in a conventional transformer, interposed between coils is a shielding layer made of aluminum foil or copper foil, but aluminum foil and copper foil are difficult to manufacture due to their very thin thickness (typically about 0.02 mm). Furthermore, the electric field strength at the top sharp edge of the shielding layer is relatively high and difficult to handle by conventional shielding devices. Furthermore, the shielding layer made of aluminum foil and copper foil can have an overlapping portion when rolled into a cylinder in use, and the overlapping portion can bring about an additional thickness, which can adversely affect the shielding effect and which is undesirable.
Disclosure of Invention
To overcome the above-mentioned drawbacks of the prior art, the present application provides a shielding device for a transformer coil, wherein the shielding device can comprise: a first paperboard layer having a hollow cylinder shape and formed by bending a first sheet of paperboard having opposed first and second vertical edges and joining the first and second vertical edges together, wherein the first paperboard layer surrounds and is spaced apart from the coil; a second paperboard layer having a hollow cylinder shape and formed by bending a second sheet of paperboard having opposed first and second vertical edges and joining the first and second vertical edges together, wherein the second paperboard layer is arranged outside of and around the first paperboard layer; and a shielding layer connected between the first paperboard layer and the second paperboard layer, wherein the shielding layer includes a first semiconductor paper layer connected to an outer side of the first paperboard layer, a second semiconductor paper layer connected to an inner side of the second paperboard layer, and a metal layer connected between the first semiconductor paper layer and the second semiconductor paper layer.
With this arrangement, the shielding device of the present application can be easily prepared without uniformly attaching a very thin aluminum foil or copper foil, as compared with a conventional shielding layer made of an aluminum foil or copper foil. In addition, the use of semi-conductor paper instead of most aluminum or copper foil reduces manufacturing costs.
Furthermore, the metal layer can consist of a plurality of spaced-apart copper strips.
Furthermore, a plurality of copper strips can be oriented in the horizontal direction.
Furthermore, a plurality of copper strips can be oriented in the vertical direction.
Furthermore, the shielding device can comprise a flat copper conductor oriented in the horizontal direction, which is connected between the first semiconductor paper layer and the second semiconductor paper layer and is located above the shielding layer.
Furthermore, the flat copper conductor can be aligned with the top end of the coil surrounded by the first cardboard layer.
Furthermore, the thickness of the flat copper conductor can be greater than the thickness of the shielding layer, so that the shielding device has a thickened portion at the location of the flat copper conductor.
With such an arrangement, the shield layer is formed with a thickened portion from a flat copper conductor at a position corresponding to the top of the coil, whereby the shield layer has a larger radius of curvature at that position to provide better protection on the top sharp edge of the shield layer with higher electric field strength.
Further, the first paperboard layer can have a first chamfer at a first vertical edge thereof and a second chamfer matching the first chamfer at a second vertical edge thereof such that the first chamfer and the second chamfer are joined together to form the first paperboard layer having a uniform thickness.
With this arrangement, the additional thickness of the conventional shielding layer due to the overlapping portion generated when bending into the cylindrical shape can be eliminated, thereby improving the shielding effect.
Therefore, the shielding device can provide good shielding effect between adjacent coils.
Furthermore, a method of manufacturing a shielding device for a coil of a transformer is provided. The method can include the steps of: bending a first sheet of paperboard having opposed first and second vertical edges and joining the first and second vertical edges together to form a first paperboard layer having a hollow cylindrical shape, wherein the first paperboard layer surrounds and is spaced apart from the coil; attaching a shielding layer to an outer side of the first paperboard layer; connecting a flat copper conductor oriented in a horizontal direction to the outside of the first paperboard layer, wherein the flat copper conductor is located above the shielding layer and aligned with the top end of the coil surrounded by the first paperboard layer, and wherein the thickness of the flat copper conductor is greater than the thickness of the shielding layer; and bending a second sheet of paperboard having opposed first and second vertical edges and joining the first and second vertical edges together to form a second paperboard layer having a hollow cylindrical shape and joining the second paperboard layer to the outside of the shield layer and the flat copper conductors.
Furthermore, the shielding layer can include a first semiconductor paper layer connected to an outer side of the first paperboard layer, a second semiconductor paper layer connected to an inner side of the second paperboard layer, and a metal layer connected between the first semiconductor paper layer and the second semiconductor paper layer, wherein the metal layer is comprised of a plurality of spaced apart copper strips.
Drawings
The accompanying drawings are included to provide a further understanding of the application and are incorporated in and constitute a part of this application. The illustrative embodiments of the present application and their description are intended to be illustrative of the application and not to be unduly limiting of the invention. Wherein the method comprises the steps of
Fig. 1 shows a perspective view of a shielding device according to an embodiment of the present application;
fig. 2 shows a side view of the shielding device of fig. 1;
fig. 3 shows an exploded side view of the shielding device of fig. 2;
fig. 4 shows an exploded side view of a shielding device according to another embodiment of the present application;
fig. 5 shows a top view of a first paperboard layer of a shielding device according to an embodiment of the application; and
fig. 6 shows a top view of a second cardboard layer of a shielding device according to an embodiment of the present application.
List of reference numerals
1. Shielding device
10. Shielding layer
11. A first paperboard layer
12A first semiconductor paper layer
12B second semiconductor paper layer
13. Metal layer
14. Flat copper conductor
15. A second paperboard layer
150. Thickened portion
111 first vertical edge of first paperboard layer
112 second vertical edge of the first paperboard layer
131 copper strip
151 first vertical edge of second cardboard layer
152 a second vertical edge of a second paperboard layer
Detailed Description
The following describes the technical solutions in the embodiments of the present application in detail with reference to the drawings in the embodiments of the present application. It should be noted that embodiments of the invention and features in the embodiments can be combined with each other without conflict.
The present application provides a shielding device for a coil of a transformer, which can include a first paperboard layer 11, a second paperboard layer 15, and a shielding layer 10. As shown in connection with fig. 1, 5 and 6, the first paperboard layer 11 has a hollow cylindrical shape and is formed by bending a first sheet of paperboard having opposed first and second vertical edges 111, 112 and joining the first and second vertical edges 111, 112 together, wherein the first paperboard layer 11 surrounds and is spaced apart from the coil. The second paperboard layer 15 can have a hollow cylindrical shape and is formed by bending a second sheet of paperboard having opposed first and second vertical edges 151, 152 and joining the first and second vertical edges 151, 152 together, wherein the second paperboard layer 15 is disposed outside the first paperboard layer 11 and surrounds the first paperboard layer 11. The shielding layer 10 is connected between the first paperboard layer 11 and the second paperboard layer 15, wherein the shielding layer 10 can comprise a first semiconductor paper layer 12A connected to the outside of the first paperboard layer 11, a second semiconductor paper layer 12B connected to the inside of the second paperboard layer 15, and a metal layer 13 connected between the first semiconductor paper layer 12A and the second semiconductor paper layer 12B.
In particular, the first paperboard layer 11 can have opposing first and second vertical edges 111, 112 and opposing first and second horizontal edges (not shown) in an unfolded state. As shown in fig. 5, the first paperboard layer 11 can be formed into a cylindrical shape by joining together, in use, a first vertical edge 111 and a second vertical edge 112. In particular, the second paperboard layer 15 can have opposing first and second vertical edges 151, 152 and opposing first and second horizontal edges (not shown) in an unfolded state. As shown in fig. 6, the second paperboard layer 15 can be formed into a cylindrical shape by joining together, in use, a first vertical edge 151 and a second vertical edge 152. For example, the first vertical edge 151 and the second vertical edge 152 can be connected together by overlapping each other.
In particular, in a transformer, for example, in which two adjacent coils are arranged side by side, the shielding device is arranged outside one of the coils, i.e. the shielding device surrounds and is spaced apart from the coil, without the need to arrange the shielding device for the other coil, wherein, for example, the two adjacent coils and the shielding device surrounding one of the coils are arranged on the base of the transformer. In other words, by means of one shielding device of the present application, a good shielding effect can be provided for two adjacent coils.
As shown in fig. 1-3, the first and second paperboard layers 11, 15 form two opposite outer surfaces of the shielding device 1, and the shielding device 1 comprises a plurality of layers stacked in the following order: a first paperboard layer 11, a first semiconductor paper layer 12A, a metal layer 13, a second semiconductor paper layer 12B, and a second paperboard layer 15. In particular, the first and second cardboard layers 11, 15 can be identical or symmetrical. In particular, the thickness of the first paperboard layer 11 can be greater than the thickness of the second paperboard layer 15, preferably, the thickness of the second paperboard layer 15 is 1mm, and the thickness of the first paperboard layer 11 is 3mm, but the thicknesses of the first paperboard layer 11 and the second paperboard layer 15 are not limited thereto.
With this arrangement, the shielding device of the present application can be easily prepared without uniformly attaching a very thin aluminum foil or copper foil, as compared with the conventional shielding layer 10 made of aluminum foil or copper foil. In addition, the use of semi-conductor paper instead of most aluminum or copper foil reduces manufacturing costs.
In particular, the first cardboard layer 11 and the second cardboard layer 15 are made of cardboard. The first semiconductor paper layer 12A and the second semiconductor paper layer 12B are made of semiconductor paper. Further, the metal layer 13 is made of any one metal or a combination of metals such as aluminum, copper, or the like, but the arrangement of the metal layer 13 is not limited thereto.
In this application, the metal layer 13 can be composed of a plurality of spaced apart copper strips 131. In the embodiment shown in fig. 4, a plurality of copper strips 131 can be oriented in a horizontal direction. In particular, the length of each of the plurality of copper strips 131 can be equal to the length of the first horizontal edge or the second horizontal edge of the first paperboard layer 11, so that the cylindrical shaped shielding device 1 can shield the coil slot at any circumferential position. In yet another embodiment (not shown), the plurality of copper strips 131 can be oriented in a vertical direction.
As shown in fig. 1-4, the shielding device 1 can also comprise a flat copper conductor 14 oriented in a horizontal direction. A flat copper conductor 14 can also be connected between the first semiconductor paper layer 12A and the second semiconductor paper layer 12B and over the shielding layer 10. In particular, the flat copper conductor 14 can be adjacent to the top end of the shielding layer 10 or located a distance above the shielding layer 10, preferably 5mm. In a preferred embodiment, the flat copper conductor 14 has a height of 10 mm.
In particular, the flat copper conductor 14 can be aligned with the top end of the coil surrounded by the first cardboard layer 11 of the shielding device 1. As shown in fig. 2-4, the thickness of the flat copper conductor 14 can be greater than the thickness of the shielding layer 10, so that the shielding device 1 has a thickened portion 150 at the location of the flat copper conductor 14. In this way, the shielding device 1 forms a thickened portion 150 by the flat copper conductor 14 at a position corresponding to the top of the coil, whereby the shielding device 1 has a larger radius of curvature at this position in order to provide better protection on the top sharp edge of the shielding layer with higher electric field strength.
In a preferred embodiment, the length of the flat copper conductor 14 can be equal to the length of the first horizontal edge or the second horizontal edge of the first cardboard layer 11, so that the cylindrical shaped shielding device 1 can provide a good shielding effect for the coil at any circumferential position.
As shown in fig. 5, the first paperboard layer 11 can have a first chamfer at the first vertical edge 111 and a second chamfer matching the first chamfer at the second vertical edge 112 such that the first chamfer and the second chamfer join together to form the first paperboard layer 11 having a uniform thickness. In addition, the first vertical edge 111 and the second vertical edge 112 can further incorporate other means (e.g., an adhesive or the like) to enhance the connection therebetween, whereby the first paperboard layer 11 has a stable cylindrical shape. In this way, the additional thickness of the conventional shielding layer can be eliminated due to the overlapping portion generated when the shielding layer is bent into a cylindrical shape, thereby improving the shielding effect. As shown in fig. 6, the first vertical edge 151 and the second vertical edge 152 of the second paperboard layer 15 are connected together, wherein the first vertical edge 151 and the second vertical edge 152 can be connected by overlapping each other, thereby forming an overlapping portion at the connection. The connection is relatively simple and, due to the thinner thickness of the second paperboard layer 15 (e.g. 1 mm), the overlap does not significantly affect the shielding effect of the shielding device.
In addition, the application also provides a manufacturing method of the shielding device of the coil of the transformer, which comprises the following steps:
bending a first sheet-like cardboard having opposite first and second vertical edges 111, 112 and joining together its first and second vertical edges 111, 112 to form a first cardboard layer 11 having a hollow cylinder shape, wherein the first cardboard layer 11 surrounds the coil and is spaced apart from the coil by a distance;
connecting the shielding layer 10 to the outside of the first paperboard layer 11;
connecting a flat copper conductor 14 oriented in a horizontal direction to the outside of the first paperboard layer 11, wherein the flat copper conductor 14 is located above the shielding layer 10 and aligned with the top end of the coil surrounded by the first paperboard layer 11, and the thickness of the flat copper conductor 14 is greater than the thickness of the shielding layer 10; and
a second sheet of paperboard having opposed first and second vertical edges 151, 152 is bent and the first and second vertical edges 151, 152 are joined together to form a second paperboard layer 15 having a hollow cylindrical shape and the second paperboard layer 15 is joined to the outside of the shield layer 10 and the flat copper conductors 14.
In particular, the shielding layer 10 can include a first semiconductor paper layer 12A connected to an outer side of the first paperboard layer 11, a second semiconductor paper layer 12B connected to an inner side of the second paperboard layer 15, and a metal layer 13 connected between the first semiconductor paper layer 12A and the second semiconductor paper layer 12B, wherein the metal layer 13 is composed of a plurality of spaced apart copper strips 131.
The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations will be apparent to those skilled in the art. Any modifications, equivalent substitutions, improvements, or the like, which are within the subject and principles of the present application, are intended to be included within the scope of the present application.
Claims (10)
1. A shielding device (1) for a coil of a transformer, wherein the shielding device (1) comprises:
-a first cardboard layer (11) having a hollow cylinder shape and being formed by bending a first sheet-like cardboard having opposite first and second vertical edges (111, 112) and joining the first and second vertical edges (111, 112) of the first sheet-like cardboard together, wherein the first cardboard layer (11) surrounds the coil and is spaced apart from the coil by a distance;
-a second cardboard layer (15) having a hollow cylinder shape and being formed by bending a second sheet-like cardboard having opposite first and second vertical edges (151, 152) and joining the first and second vertical edges (151, 152) of the second sheet-like cardboard together, wherein the second cardboard layer (15) is arranged outside the first cardboard layer (11) and surrounds the first cardboard layer; and
-a shielding layer (10) connected between the first (11) and the second (15) cardboard layer, wherein the shielding layer (10) comprises:
a first semiconductor paper layer (12A) connected to the outside of the first cardboard layer (11) and a second semiconductor paper layer (12B) connected to the inside of the second cardboard layer (15); and
and a metal layer (13) connected between the first semiconductor paper layer (12A) and the second semiconductor paper layer (12B).
2. Shielding device according to claim 1, wherein the metal layer (13) consists of a plurality of spaced copper strips (131).
3. The shielding device according to claim 2, wherein a plurality of the copper strips (131) are oriented in a horizontal direction.
4. The shielding device according to claim 2, wherein a plurality of the copper strips (131) are oriented in a vertical direction.
5. Shielding device according to claim 1, wherein the shielding device (1) further comprises a flat copper conductor (14) oriented in a horizontal direction, the flat copper conductor (14) being connected between the first semiconductor paper layer (12A) and the second semiconductor paper layer (12B) and being located above the shielding layer (10).
6. Shielding device according to claim 5, wherein the flat copper conductor (14) is aligned with the top end of the coil surrounded by the first cardboard layer (11).
7. Shielding device according to claim 6, wherein the thickness of the flat copper conductor (14) is greater than the thickness of the shielding layer (10), such that the shielding device (1) has a thickened portion (15) at the location of the flat copper conductor (14).
8. Shielding device according to claim 1, wherein the first cardboard layer (11) has a first chamfer at the first vertical edge (111) and a second chamfer matching the first chamfer at the second vertical edge (112), such that the first chamfer and the second chamfer are connected together to form the first cardboard layer (11) with a uniform thickness.
9. A method of manufacturing a shielding device for a coil of a transformer, the method comprising the steps of:
bending a first sheet-like cardboard having opposite first and second vertical edges (111, 112) and joining the first and second vertical edges (111, 112) of the first sheet-like cardboard together to form a first cardboard layer (11) having a hollow cylinder shape, wherein the first cardboard layer (11) surrounds the coil and is spaced apart from the coil by a distance;
-attaching a shielding layer (10) to the outside of the first cardboard layer (11);
-connecting a flat copper conductor (14) oriented in a horizontal direction to the outside of the first cardboard layer (11), wherein the flat copper conductor (14) is located above the shielding layer (10) and is aligned with the top end of the coil surrounded by the first cardboard layer (11), and the thickness of the flat copper conductor (14) is greater than the thickness of the shielding layer (10); and
-bending a second sheet of paperboard having opposite first and second vertical edges (151, 152) and joining the first and second vertical edges (151, 152) of the second sheet of paperboard together to form a second paperboard layer (15) having a hollow cylindrical shape, and joining the second paperboard layer (15) to the shielding layer (10) and to the outside of the flat copper conductor (14).
10. The method according to claim 9, wherein the shielding layer (10) comprises a first semiconductor paper layer (12A) connected to the outer side of the first paperboard layer (11), a second semiconductor paper layer (12B) connected to the inner side of the second paperboard layer (15), and a metal layer (13) connected between the first semiconductor paper layer (12A) and the second semiconductor paper layer (12B), wherein the metal layer (13) is composed of a plurality of spaced apart copper strips (131).
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/117190 WO2022061601A1 (en) | 2020-09-23 | 2020-09-23 | Shielding device for an coil of transformer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116250053A true CN116250053A (en) | 2023-06-09 |
Family
ID=80844731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080105441.1A Pending CN116250053A (en) | 2020-09-23 | 2020-09-23 | Shielding device for a coil of a transformer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN116250053A (en) |
| WO (1) | WO2022061601A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3111100A1 (en) * | 1981-03-20 | 1982-09-30 | Transformatoren Union Ag, 7000 Stuttgart | UMBRELLA BODY FOR JOCHE OF IRON CORES OF TRANSFORMERS AND THROTTLE COILS |
| CN201252718Y (en) * | 2008-08-27 | 2009-06-03 | 保定天威集团有限公司 | Semi-conducting paper shield plate |
| CN204011007U (en) * | 2014-06-10 | 2014-12-10 | 常州市英中电气有限公司 | For the ground screen of superhigh pressure or extra-high voltage transformer |
| CN206432126U (en) * | 2017-01-18 | 2017-08-22 | 特变电工股份有限公司 | A kind of transformer land used screen structure |
-
2020
- 2020-09-23 WO PCT/CN2020/117190 patent/WO2022061601A1/en active Application Filing
- 2020-09-23 CN CN202080105441.1A patent/CN116250053A/en active Pending
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| Publication number | Publication date |
|---|---|
| WO2022061601A1 (en) | 2022-03-31 |
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