WO2022057080A1 - 一种可交互的cob显示模组及led显示屏 - Google Patents

一种可交互的cob显示模组及led显示屏 Download PDF

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Publication number
WO2022057080A1
WO2022057080A1 PCT/CN2020/130497 CN2020130497W WO2022057080A1 WO 2022057080 A1 WO2022057080 A1 WO 2022057080A1 CN 2020130497 W CN2020130497 W CN 2020130497W WO 2022057080 A1 WO2022057080 A1 WO 2022057080A1
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Prior art keywords
sensing
led lamp
touch
module
signal
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PCT/CN2020/130497
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English (en)
French (fr)
Inventor
吴涵渠
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深圳市奥拓电子股份有限公司
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Publication of WO2022057080A1 publication Critical patent/WO2022057080A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Definitions

  • the present application relates to the technical field of LED display screens, and in particular, to an interactive COB display module and an LED display screen.
  • LED displays have been applied in more and more scenarios. People have higher and higher requirements for the color, resolution, and fine-grainedness of the display screen.
  • the LED display industry in the initial period, mainly achieved by reducing the size of surface mount LEDs, and gradually realized a dot pitch of 3mm.
  • COB chip on board
  • the LED chips are directly packaged on the PCB board to form a COB module, and then the COB modules are used to form LEDs. display.
  • the touch technology on the LED display is mainly based on infrared or ultrasonic technology, and it is necessary to install infrared equipment or ultrasonic equipment on the surrounding frame of the LED display.
  • the existing LED display screen with touch function has a large frame structure; using a separate infrared device or ultrasonic device, the installation is complicated and the cost is high.
  • An embodiment of the present application discloses an interactive COB display module, including a circuit board, a plurality of LED lamp beads, a packaging layer, at least one display driver chip, at least one touch scan driver module, and a sensing signal collection module;
  • Each LED lamp bead is provided with a photoelectric sensor chip; one end surface of the circuit board is provided with the LED lamp beads in an array, and the other end surface is arranged with the display driver chip, the touch scan drive module, and the sensing signal collection module;
  • the display driving chip is electrically connected with the LED lamp beads through the circuit in the circuit board, and controls the working state of the LED lamp beads;
  • the encapsulation layer is arranged to cover the LED lamp beads and the photoelectric induction chip, so as to provide protection for the LED lamp beads and the photoelectric induction chip;
  • a plurality of photoelectric sensing chips are connected together to form touch sensing pixels, each touch sensing pixel has a first end and a second end; all touch sensing pixels are arranged in an array on the circuit board; The first end of the touch sensing pixel is connected to the sensing signal collection module through the circuit in the circuit board; the second end of the touch sensing pixel in each column is connected through the circuit in the circuit board. connected with the touch scan drive module;
  • the touch scanning driving module provides touch scanning signals; the photoelectric sensing chip senses external light to generate an electric signal, which is output to the sensing signal collection module through the first end of the touch sensing pixel.
  • the sensing signal collection module receives the sensing electrical signals output by the touch sensing pixels.
  • the sensed electrical signal is current
  • a plurality of the photoelectric sensing chips are connected in parallel to form touch sensing pixels.
  • the sensed electrical signal is voltage or charge
  • a plurality of the photoelectric sensing chips are connected in series to form touch sensing pixels.
  • the LED lamp bead is a single-color LED lamp bead
  • the COB display module includes three-color LED lamp beads of red LED lamp bead, green LED lamp bead, and blue LED lamp bead;
  • the LED lamp beads are composite LED lamp beads, and the LED lamp beads include red LED chips, green LED chips, and blue LED chips.
  • a signal amplifier is further included for amplifying the induced electrical signal received by the induced signal collection module.
  • a signal processor is further included for analyzing the amplified induced electrical signal to determine the position of the interaction.
  • the signal processor generates a synchronization signal and outputs it to the touch-scanning driving module and the sensing signal collecting module, and the touch-scanning driving module synchronously outputs the touch-scanning signal according to the synchronization signal;
  • the induction signal collection module synchronously receives the induction electric signal according to the synchronization signal;
  • the signal processor determines the position of the interactive operation according to the received induction electric signal and the synchronization signal.
  • Another embodiment of the present application further provides an LED display screen, which includes several COB display modules, and a plurality of COB display modules are spliced to form an LED display screen; the COB display module is the one described in the previous embodiment. Interactive COB display module.
  • a touch control chip is also included, which is used to receive the induced electrical signals output by all the COB display modules, and analyze and determine the position of the interactive operation.
  • a support frame is further included, the COB display module is mounted on the support frame, and the support frame provides structural support for the COB display module.
  • a photoelectric sensor chip is integrated in the LED lamp bead, and a plurality of photoelectric sensor chips are connected together to form a touch-sensing pixel point, thereby obtaining a touch-sensing pixel point array ;
  • the photoelectric sensor chip uses the photoelectric sensor chip to sense the external input light to generate the inductive electrical signal, using the touch scanning drive module and the inductive signal collection module, the inductive electrical signal can be scanned, and then the position of the interactive action that causes the light change can be analyzed and obtained.
  • the touch sensing pixels are formed by connecting a plurality of photoelectric sensing chips, which can enhance the electrical signals generated by the photoelectric sensing chips, which can significantly improve the sensitivity of interactive sensing signals and improve the experience of interactive operations.
  • FIG. 1 is a schematic structural diagram of a COB display module according to an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of a COB display module according to another embodiment of the application.
  • FIG. 3 is a schematic structural diagram of a COB display module from a front view angle according to an embodiment of the application;
  • FIG. 4 is a schematic diagram of a circuit structure of a COB display module according to an embodiment of the application.
  • FIG. 5 is a schematic diagram of a circuit structure of a COB display module according to another embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a COB display module in use in an embodiment of the application.
  • FIG. 7 is a schematic structural diagram of an LED display screen according to an embodiment of the present application.
  • an embodiment of the present application discloses an interactive COB display module 10 , including a circuit board 100 , a plurality of LED lamp beads 200 , an encapsulation layer 300 , and at least one display driver chip 700 and at least one touch scanning driving module 520 and a sensing signal collecting module 540;
  • Each LED lamp bead 200 is provided with a photoelectric sensor chip 801 ; one end surface of the circuit board 100 is arranged in an array with LED lamp beads 200 , and the other end surface is provided with a display driving chip 700 , a touch scanning driving module 520 , and a sensing signal collecting module 540 ;
  • the display driver chip 700 is electrically connected to the LED lamp bead 200 through the circuit in the circuit board 100, and controls the working state of the LED lamp bead 200;
  • the encapsulation layer 300 is disposed to cover the LED lamp bead 200 and the photoelectric sensor chip 801 to provide protection for the LED lamp bead 200 and the photoelectric sensor chip 801 ;
  • a plurality of photoelectric sensing chips 801 are connected together to form touch sensing pixels 810 , each touch sensing pixel 810 has a first end and a second end; all touch sensing pixels 810 are arranged in an array on the circuit board 100 ; The first end of the touch sensing pixels 810 in each row is connected to the sensing signal collection module 540 through the circuit in the circuit board 100 ; circuit, connected to the touch scan driving module 520;
  • the touch scanning driving module 520 provides touch scanning signals; the photoelectric sensing chip 801 senses external light and generates electric sensing signals, which are output to the sensing signal collecting module 540 through the first end of the touch sensing pixels 810, and the sensing signal collecting module 540 receives the sensing electrical signal output by the touch sensing pixel 810 .
  • the touch scanning driving module 520 may be provided with a plurality of scanning channels, and each scanning channel is correspondingly connected to the second end of a row of touch sensing pixels 810 .
  • the touch scan drive module 520 outputs touch scan signals through each scan channel, and at the same time, only one scan channel is turned on—that is, only the second end of one column of touch sensing pixels 810 is turned on and driven Voltage.
  • the photoelectric sensor chip 801 will generate an induced electrical signal according to the received external light.
  • a plurality of photoelectric sensing chips 801 form a touch sensing pixel 810 , and each touch sensing pixel 810 summarizes the sensed electrical signals generated therein, and outputs it to the sensing signal collecting module 540 from the first end.
  • the sensing signal collecting module 540 may be provided with a plurality of signal receiving channels corresponding to the first ends of the touch sensing pixels 810 in each row respectively. Combined with the position of the signal receiving channel of the received sensing electrical signal and the touch scanning signal, the position of the sensing electrical signal in the array of touch sensing pixels 810 can be determined. By analyzing the induced electrical signal, the position where the external input light changes can be identified, that is, the position of the interactive action, and then the interactive operation can be performed in combination with the display content at that position in the display screen.
  • a photoelectric sensor chip is integrated in the LED lamp bead, and a plurality of photoelectric sensor chips are connected together to form a touch-sensing pixel point, thereby obtaining a touch-sensing pixel point array ;
  • the photoelectric sensor chip uses the photoelectric sensor chip to sense the external input light to generate the inductive electrical signal, using the touch scanning drive module and the inductive signal collection module, the inductive electrical signal can be scanned, and then the position of the interactive action that causes the light change can be analyzed and obtained.
  • the touch sensing pixels are formed by connecting a plurality of photoelectric sensing chips, which can enhance the electrical signals generated by the photoelectric sensing chips, which can significantly improve the sensitivity of interactive sensing signals and improve the experience of interactive operations.
  • the LED lamp bead 200 may be a single-color LED lamp bead, such as one of a red LED lamp bead, a green LED lamp bead, and a blue LED lamp bead.
  • the COB display module can simultaneously include three-color LED lamp beads of red LED lamp beads, green LED lamp beads, and blue LED lamp beads to provide full-color display.
  • the LED lamp beads 200 can also be composite LED lamp beads. As shown in FIG. 2 , inside the LED lamp bead 200 , a red LED chip R, a green LED chip G, and a blue LED chip B may be included at the same time. It can be understood that the LED lamp beads 200 may also include LED chips of other colors, such as yellow LED chips, cyan LED chips, white LED chips, and the like.
  • the photoelectric sensing chip 801 is used for sensing incident light to generate an induced electrical signal.
  • the photoelectric sensor chip 801 can use an existing photoelectric conversion device. Different types of photoelectric sensor chips 801 can generate different types of induced electrical signals.
  • the photoelectric sensing chip 801 may be one of photoelectric conversion devices such as MOS capacitors, avalanche photodiodes, photoresistors, and triode photodiodes.
  • the induced electrical signal can be one of electrical signals such as charge, current, and voltage. When the photoelectric sensing chip 801 adopts a MOS capacitor, the induced electrical signal may be electric charge.
  • the induced electrical signal may be a current.
  • the input light affects the resistance value of the photoresistor.
  • the change in the resistance value can be converted into an electrical signal in the form of a current.
  • each touch sensing pixel 810 is formed by connecting a plurality of photo sensing chips 801 together, which can enhance the intensity of the output sensing electrical signal.
  • each touch sensing pixel 810 can correspond to a certain area, and a plurality of photoelectric sensing chips 801 are evenly distributed in the area, which can effectively improve the sensitivity of touch sensing.
  • a single photoelectric sensing chip 801 does not need to generate a large value of the induced electrical signals, and a low-power photoelectric sensing chip can be used to reduce interaction Operational power consumption.
  • the connection mode of the photoelectric sensing chip 801 inside the touch sensing pixel 810 may be one of parallel connection and series connection.
  • the sensed electrical signal is current
  • the photoelectric sensor chip 801 uses an avalanche photodiode, a photoresistor, or a triode photodiode
  • the photoelectric sensor chip 801 can be connected in parallel to form the touch-sensing pixels 810, such as shown in Figure 4.
  • the sensed electrical signal is charge or voltage
  • the photoelectric sensor chip 801 uses a MOS capacitor, and the photoelectric sensor chip 801 can be connected in series to form touch sensing pixels 810 , as shown in FIG. 5 .
  • the COB display module 10 may further be provided with a signal amplifier 560 for amplifying the induced electrical signal received by the inductive signal collection module 540 , so that subsequent circuits can directly Process the amplified induced electrical signal.
  • the COB display module 10 may further be provided with a signal processor 900 for analyzing the amplified induced electrical signal to determine the position of the interactive operation.
  • the induced electrical signal of the photoelectric sensor chip 801 is in the first state value; when there is an interactive operation, when the incident light at the location of the interactive operation changes, the induced electrical signal of the photoelectric sensor chip 801 in the second state value.
  • the signal processor 900 can determine whether the interactive operation is not performed; in combination with the touch scan signal and the position of the signal receiving channel where the induced electrical signal is received by the inductive signal collection module 540, the signal processor 900 can determine the The location of the interaction.
  • the user's interactive operation can be performed by objects such as fingers and stylus that can block light, or by objects such as laser pointers that can emit strong light.
  • objects such as fingers and stylus that can block light
  • objects such as laser pointers that can emit strong light.
  • the second state value of the induced electrical signal exhibits a decreasing trend.
  • the second state value of the induced electrical signal exhibits an increasing trend of change.
  • the signal processor 900 may not be disposed inside the COB display module 10 , but may be an external module independent of the COB display module 10 .
  • a signal processor 900 may be set on the LED display screen to analyze the amplified induced electrical signal and determine the position of the interactive operation.
  • the signal processor 900 can generate a synchronization signal, and output it to the touch scanning driving module 520 and the sensing signal collecting module 540, and the touch scanning driving module 520 synchronously outputs the touch scanning signal according to the synchronization signal; the sensing signal The collection module 540 synchronously receives the induced electrical signal according to the synchronization signal; the signal processor 900 determines the position of the interactive operation according to the received induced electrical signal and the synchronization signal.
  • a photoelectric sensor chip is integrated in the LED lamp bead, and a plurality of photoelectric sensor chips are connected together to form a touch-sensing pixel point, thereby obtaining a touch-sensing pixel point array ;
  • the photoelectric sensor chip uses the photoelectric sensor chip to sense the external input light to generate the inductive electrical signal, using the touch scanning drive module and the inductive signal collection module, the inductive electrical signal can be scanned, and then the position of the interactive action that causes the light change can be analyzed and obtained.
  • the touch sensing pixels are formed by connecting multiple photoelectric sensing chips, which can enhance the sensed electrical signals generated by the photoelectric sensing chips, which can significantly improve the sensitivity of interactive sensing signals and improve the experience of interactive operations.
  • FIG. 8 Another embodiment of the present application also discloses an LED display screen, as shown in FIG. 8 , comprising several COB display modules 10 , and the multiple COB display modules 10 are spliced to form an LED display screen; the COB display modules 10 are The COB display module with touch function according to any one of the foregoing embodiments.
  • the LED display screen formed by splicing also has a touch function, and it is not necessary to design a wide frame. Compared with the overall size, there is no need to design an additional installation structure, and the structure is simple. ,user-friendly.
  • the LED display screen may further include a touch control chip for receiving the induced electrical signals output by all the COB display modules, and analyzing and determining the position of the interactive operation.
  • the signal processor 900 may not be provided on the COB display module 10 .
  • the touch control chip can also generate a synchronization signal and output it to the touch scan drive module 520 and the sensing signal collection module 540 on all the COB display modules 10.
  • the touch scan drive module 520 synchronously outputs the touch signal according to the synchronization signal.
  • the induction signal collection module 540 synchronously receives the induction electric signal according to the synchronization signal; the signal processor 900 determines the position of the interactive operation according to the received induction electric signal and synchronization signal.
  • the LED display further includes a support frame 20, the COB display module 10 is mounted on the support frame 20, and the support frame 20 provides structural support for the COB display module 10 to enhance the structural strength of the LED display and ensure The splicing effect of the COB display module 10 ensures the display quality.
  • the LED display screen may also include a power supply unit for receiving the input external power supply and converting it into the working voltage required by the COB display module 10 .
  • the external power supply can be alternating current, such as 220V alternating current, 110V alternating current, 100V alternating current, 48V alternating current, etc.; it can also be direct current, such as 12V direct current, 5V direct current and so on.
  • the LED display screen can also include a number of receiving cards, each receiving card corresponding to at least one COB display module setting; the receiving card is used to receive externally input video data, intercept the picture data of the corresponding area of the connected COB display module, and output Display it to the corresponding COB display module.

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  • Theoretical Computer Science (AREA)
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Abstract

一种可交互的COB显示模组（10）及LED显示屏，电路板（100）的一面阵列设置LED灯珠（200），每个LED灯珠（200）上设置有光电感应芯片（801）；另一面设置显示驱动芯片（700）以及触控扫描驱动模块（520）、感应信号收集模块（540）；封装层（300）覆盖LED灯珠（200）；多个光电感应芯片（801）组成触控感应像素点（810）；每一行的触控感应像素点（810）的第一端连接感应信号收集模块（540）；每一列的触控感应像素点（810）的第二端连接触控扫描驱动模块（520）；触控扫描驱动模块（520）提供触控扫描信号；光电感应芯片（801）感应外部光线，产生感应电信号，可以实现交互操作。

Description

一种可交互的COB显示模组及LED显示屏
本申请要求于2020年9月15日在中国专利局提交的、申请号为202010969141.X的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及LED显示屏技术领域，特别是涉及一种可交互的COB显示模组及LED显示屏。
 背景技术
随着LED显示技术的不断发展，LED显示屏在越来越多的场景中得到了应用。人们对显示画面的色彩、分辨率、细粒度要求越来越高，LED显示屏日益朝着小点间距、更加自然的色彩还原效果等高分辨率的方向发展。
为了实现更加小的点间距，LED显示行业，在最初的时期，主要是通过减小表面贴装LED尺寸的方式来实现的，逐步实现了3mm的点间距。为了实现小于1mm的点间距，行业内产生了COB（chip on board，即板上芯片）技术，将LED芯片直接封装在PCB板上，以形成一个COB模组，然后利用COB模组拼接形成LED显示屏。
同时，随着LED显示屏在室内场景下的使用逐渐增多，人们对于LED显示屏的交互操作的需求，也变得越来越高。其中，最为突出的就是触控操作。目前，LED显示屏上的触控技术，主要是基于红外或者超声波技术，需要在LED显示屏的四周边框上安装红外设备或者超声波设备。由此导致，现有带有触摸功能的LED显示屏，具有较大的边框结构；采用单独的红外设备或者超声波设备，安装复杂，成本较高。
 技术问题
基于此，有必要针对现有LED显示屏的触控方案，存在设备尺寸较大、安装复杂的问题，提供一种可交互的COB显示模组及LED显示屏。
 技术解决方案
本申请一实施例公开了一种可交互的COB显示模组，包括电路板、多个LED灯珠、封装层、至少一个显示驱动芯片以及至少一个触控扫描驱动模块、感应信号收集模块；
每个LED灯珠上设置有光电感应芯片；所述电路板的一个端面上阵列设置所述LED灯珠，另一个端面上布设所述显示驱动芯片以及触控扫描驱动模块、感应信号收集模块；所述显示驱动芯片，通过所述电路板中的线路，与所述LED灯珠电连接，并控制所述LED灯珠的工作状态；
所述封装层覆盖所述LED灯珠、光电感应芯片设置，以对所述LED灯珠、光电感应芯片提供防护；
多个光电感应芯片连接在一起，组成触控感应像素点，每个触控感应像素点具有第一端和第二端；所有触控感应像素点在所述电路板上阵列设置；每一行的触控感应像素点的第一端，通过所述电路板中的线路，与所述感应信号收集模块连接；每一列的触控感应像素点的第二端，通过所述电路板中的线路，与所述触控扫描驱动模块连接；
所述触控扫描驱动模块提供触控扫描信号；所述光电感应芯片，感应外部光线，产生感应电信号，通过所述触控感应像素点的第一端，输出给所述感应信号收集模块，所述感应信号收集模块接收所述触控感应像素点输出的感应电信号。
在一些实施例中，所述感应电信号为电流，多个所述光电感应芯片并联连接，形成触控感应像素点。
在一些实施例中，所述感应电信号为电压或电荷，多个所述光电感应芯片串联连接，形成触控感应像素点。
在一些实施例中，所述LED灯珠为单色LED灯珠，所述COB显示模组包括红色LED灯珠、绿色LED灯珠、蓝色LED灯珠三种颜色的LED灯珠；
或者，所述LED灯珠为复合LED灯珠，所述LED灯珠包含有红色LED芯片、绿色LED芯片、蓝色LED芯片。
在一些实施例中，还包括信号放大器，用于对所述感应信号收集模块接收到的感应电信号进行放大处理。
在一些实施例中，还包括信号处理器，用于对放大处理后的感应电信号进行分析，确定交互操作的位置。
在一些实施例中，所述信号处理器产生同步信号，并输出给所述触控扫描驱动模块、感应信号收集模块，所述触控扫描驱动模块根据同步信号，同步输出触控扫描信号；所述感应信号收集模块根据同步信号，同步接收感应电信号；所述信号处理器根据接收到的感应电信号和同步信号，确定交互操作的位置。
本申请另一实施例还提供了一种LED显示屏，包括若干COB显示模组，多个COB显示模组拼接形成LED显示屏；所述COB显示模组为前述一项实施例所述的可交互的COB显示模组。
在一些实施例中，还包括触摸控制芯片，用于接收所有COB显示模组输出的感应电信号，分析确定交互操作的位置。
在一些实施例中，还包括支撑框架，所述COB显示模组安装在所述支撑框架上，所述支撑框架给所述COB显示模组提供结构支撑。
 有益效果
本申请实施例提供的可交互的COB显示模组，通过在LED灯珠中集成光电感应芯片，并将多个光电感应芯片连接在一起形成触控感应像素点，进而得到触控感应像素点阵列；利用光电感应芯片对外部输入光线进行感应，产生感应电信号，利用触控扫描驱动模块以及感应信号收集模块，可以扫描到感应电信号，进而可以分析得到引起光线变化的交互动作所在的位置，实现交互操作。同时，触控感应像素点由多个光电感应芯片连接形成，可以对光电感应芯片产生的感应电信号进行信号增强，可以显著提高交互感应信号的灵敏度，提升交互操作的体验。
 附图说明
图1为本申请一实施例的COB显示模组的结构示意图；
图2为本申请另一实施例的COB显示模组的结构示意图；
图3为本申请一实施例的COB显示模组正面视角下的结构示意图；
图4为本申请一实施例的COB显示模组的电路结构示意图；
图5为本申请另一实施例的COB显示模组的电路结构示意图；
图6为本申请一实施例中COB显示模组在使用时的结构示意图；
图7为本申请一实施例的LED显示屏的结构示意图。
 本发明的实施方式
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳实施方式。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本申请的公开内容理解的更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本申请。本文所使用的术语“及／或”包括一个或多个相关的所列项目的任意的和所有的组合。
如图1、3及4所示，本申请一实施例公开了一种可交互的COB显示模组10，包括电路板100、多个LED灯珠200、封装层300、至少一个显示驱动芯片700以及至少一个触控扫描驱动模块520、感应信号收集模块540；
每个LED灯珠200上设置有光电感应芯片801；电路板100的一个端面上阵列设置LED灯珠200，另一个端面上布设显示驱动芯片700以及触控扫描驱动模块520、感应信号收集模块540；显示驱动芯片700，通过电路板100中的线路，与LED灯珠200电连接，并控制LED灯珠200的工作状态；
封装层300覆盖LED灯珠200、光电感应芯片801设置，以对LED灯珠200、光电感应芯片801提供防护；
多个光电感应芯片801连接在一起，组成触控感应像素点810，每个触控感应像素点810具有第一端和第二端；所有触控感应像素点810在电路板100上阵列设置；每一行的触控感应像素点810的第一端，通过电路板100中的线路，与感应信号收集模块540连接；每一列的触控感应像素点810的第二端，通过电路板100中的线路，与触控扫描驱动模块520连接；
触控扫描驱动模块520提供触控扫描信号；光电感应芯片801，感应外部光线，产生感应电信号，通过触控感应像素点810的第一端，输出给感应信号收集模块540，感应信号收集模块540接收触控感应像素点810输出的感应电信号。
触控扫描驱动模块520可以设置有多个扫描通道，每个扫描通道对应连接一列触控感应像素点810的第二端。触控扫描驱动模块520通过每个扫描通道，输出触控扫描信号，同一个时刻下，仅有一个扫描通道被接通——即仅有一列触控感应像素点810的第二端接通驱动电压。光电感应芯片801，会根据接收到的外部光线，感应产生感应电信号。多个光电感应芯片801组成一个触控感应像素点810，每个触控感应像素点810汇总其内部产生的感应电信号，从第一端输出给感应信号收集模块540。
感应信号收集模块540可以设置有多个信号接收通道，分别对应每一行的触控感应像素点810的第一端。结合接收到的感应电信号的信号接收通道位置以及触控扫描信号，即可确定出感应电信号在触控感应像素点810阵列中的位置。通过对感应电信号进行分析，即可识别出外部输入光线产生变化的位置——即交互动作所在位置，进而可以结合显示画面中在该位置的显示内容，执行交互操作。
本申请实施例提供的可交互的COB显示模组，通过在LED灯珠中集成光电感应芯片，并将多个光电感应芯片连接在一起形成触控感应像素点，进而得到触控感应像素点阵列；利用光电感应芯片对外部输入光线进行感应，产生感应电信号，利用触控扫描驱动模块以及感应信号收集模块，可以扫描到感应电信号，进而可以分析得到引起光线变化的交互动作所在的位置，实现交互操作。同时，触控感应像素点由多个光电感应芯片连接形成，可以对光电感应芯片产生的感应电信号进行信号增强，可以显著提高交互感应信号的灵敏度，提升交互操作的体验。
如图1所示，LED灯珠200，可以为单色LED灯珠，比如红色LED灯珠、绿色LED灯珠、蓝色LED灯珠中的一种。此时，COB显示模组中，可以同时包含红色LED灯珠、绿色LED灯珠、蓝色LED灯珠三种颜色的LED灯珠，以提供全彩显示。
LED灯珠200也可以为复合LED灯珠。如图2所示，在LED灯珠200内部，可以同时包含红色LED芯片R、绿色LED芯片G、蓝色LED芯片B。可以理解的是，LED灯珠200还可以包含其他颜色的LED芯片，比如黄色LED芯片、青色LED芯片、白色LED芯片等。
光电感应芯片801，用于感应入射光线，产生感应电信号。光电感应芯片801可以使用现有的光电转换器件。不同种类的光电感应芯片801，可以产生不同类型的感应电信号。示例的，光电感应芯片801，可以是MOS电容、雪崩光电二极管、光敏电阻、三极光电管等光电转换器件中的一种。感应电信号，可以是电荷、电流、电压等电信号中的一种。当光电感应芯片801采用MOS电容时，感应电信号可以是电荷。当光电感应芯片801采用雪崩光电二极管、光敏电阻、三极光电管时，感应电信号可以是电流。对于光敏电阻而言，输入的光线影响光敏电阻的电阻值，通过对光敏电阻两端施加预设值的电压，即可将电阻值的变化转换为电流形式的电信号。
COB显示模组中，LED灯珠200之间的距离越来越小。当用户进行交互操作时，比如用手指触摸COB显示模组，如图6所示，手指会覆盖多个LED灯珠200。因此，每个触控感应像素点810由多个光电感应芯片801连接在一起而形成，可以增强输出的感应电信号的强度。同时，每个触控感应像素点810可以对应一定区域，并在区域内均匀布设有多个光电感应芯片801，可以有效提升触控感应的灵敏度。并且，通过汇总多个光电感应芯片801产生的感应电信号，作为输出的感应电信号，单个光电感应芯片801无需产生较大数值的感应电信号，可以使用低功耗的光电感应芯片，降低交互操作方面的功耗。
根据感应电信号的类型，触控感应像素点810内部的光电感应芯片801的连接方式，可以为并联、串联中的一种。示例的，当感应电信号为电流时，比如光电感应芯片801采用雪崩光电二极管、光敏电阻或三极光电管时，光电感应芯片801可以采用并联的方式，连接形成触控感应像素点810，如图4所示。示例的，当感应电信号为电荷或者电压时，比如光电感应芯片801采用MOS电容，光电感应芯片801可以采用串联的方式，连接形成触控感应像素点810，如图5所示。
在一些实施例中，如图4所示，COB显示模组10，还可以设置有信号放大器560，用于对感应信号收集模块540接收到的感应电信号进行放大处理，以方便后续电路可以直接处理放大后的感应电信号。
在一些实施例中，COB显示模组10，还可以设置有信号处理器900，用于对放大处理后的感应电信号进行分析，确定交互操作的位置。一般的，在正常入射光线下，光电感应芯片801的感应电信号处于第一状态值；当有交互操作时，交互操作所在位置处的入射光线会产生变化时，光电感应芯片801的感应电信号处于第二状态值。通过比较感应电信号的变化情况，信号处理器900就可以判断出是否交互操作；结合触控扫描信号以及感应信号收集模块540接收感应电信号的信号接收通道位置，信号处理器900即可确定出交互操作的位置。
用户的交互操作，既可以是通过手指、触控笔等可以遮挡光线的物体进行，也可以是激光笔等可以发出强光的物体进行。在前一种情形下，相对于感应电信号的第一状态值，感应电信号的第二状态值呈变小的变化趋势。在后一种情形下，感应电信号的第二状态值呈增大的变化趋势。
可以理解的是，信号处理器900，也可以不设置在COB显示模组10内部，而可以成为独立于COB显示模组10的外部模块。示例的，当多个COB显示模组10拼接形成LED显示屏时，可以在LED显示屏上设置一个信号处理器900，用于对放大处理后的感应电信号进行分析，确定交互操作的位置。
在一些实施例中，信号处理器900可以产生同步信号，并输出给触控扫描驱动模块520、感应信号收集模块540，触控扫描驱动模块520根据同步信号，同步输出触控扫描信号；感应信号收集模块540根据同步信号，同步接收感应电信号；信号处理器900根据接收到的感应电信号和同步信号，确定交互操作的位置。
本申请实施例提供的可交互的COB显示模组，通过在LED灯珠中集成光电感应芯片，并将多个光电感应芯片连接在一起形成触控感应像素点，进而得到触控感应像素点阵列；利用光电感应芯片对外部输入光线进行感应，产生感应电信号，利用触控扫描驱动模块以及感应信号收集模块，可以扫描到感应电信号，进而可以分析得到引起光线变化的交互动作所在的位置，实现交互操作。同时，触控感应像素点由多个光电感应芯片连接形成，可以对光电感应芯片产生的感应电信号进行信号增强，可以显著提高交互感应信号的灵敏度，提升交互操作的体验。
本申请另一实施例还公开了一种LED显示屏，如图8所示，包括若干COB显示模组10，多个COB显示模组10拼接形成LED显示屏；所述COB显示模组10为前述任一项实施例所述的具有触摸功能的COB显示模组。
因为采用了前面实施例中的COB显示模组，因此，拼接形成的LED显示屏也具有触摸功能，并且不需要设计宽大的边框，整体尺寸比较下，也不需要设计额外的安装结构，结构简单，容易使用。
在一些实施例中，LED显示屏还可以包括触摸控制芯片，用于接收所有COB显示模组输出的感应电信号，分析确定交互操作的位置。此时，在COB显示模组10上，可以不设置信号处理器900。触摸控制芯片的工作方式，可以参见前面对信号处理器900的描述。
进一步的，触摸控制芯片，还可以产生同步信号，并输出给所有COB显示模组10上的触控扫描驱动模块520、感应信号收集模块540，触控扫描驱动模块520根据同步信号，同步输出触控扫描信号；感应信号收集模块540根据同步信号，同步接收感应电信号；信号处理器900根据接收到的感应电信号和同步信号，确定交互操作的位置。
在一些实施例中，LED显示屏还包括支撑框架20，COB显示模组10安装在支撑框架20上，支撑框架20给COB显示模组10提供结构支撑，以增强LED显示屏的结构强度，保障COB显示模组10的拼接效果，保障显示质量。
LED显示屏，还可以包括电源单元，用于接收输入的外部电源，转换为COB显示模组10所需的工作电压。示例的，外部电源可以是交流电，比如220V的交流电、110V交流电、100V交流电、48V交流电等；也可以是直流电，比如12V直流电、5V直流电等。
LED显示屏，还可以包括若干接收卡，每个接收卡对应至少一个COB显示模组设置；接收卡，用于接收外部输入的视频数据，截取连接的COB显示模组对应区域的画面数据，输出给对应的COB显示模组进行显示。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种可交互的COB显示模组，其特征在于，包括电路板、多个LED灯珠、封装层、至少一个显示驱动芯片以及至少一个触控扫描驱动模块、感应信号收集模块；
    每个LED灯珠上设置有光电感应芯片；所述电路板的一个端面上阵列设置所述LED灯珠，另一个端面上布设所述显示驱动芯片以及触控扫描驱动模块、感应信号收集模块；所述显示驱动芯片，通过所述电路板中的线路，与所述LED灯珠电连接，并控制所述LED灯珠的工作状态；
    所述封装层覆盖所述LED灯珠、光电感应芯片设置，以对所述LED灯珠、光电感应芯片提供防护；
    多个光电感应芯片连接在一起，组成触控感应像素点，每个触控感应像素点具有第一端和第二端；所有触控感应像素点在所述电路板上阵列设置；每一行的触控感应像素点的第一端，通过所述电路板中的线路，与所述感应信号收集模块连接；每一列的触控感应像素点的第二端，通过所述电路板中的线路，与所述触控扫描驱动模块连接；
    所述触控扫描驱动模块提供触控扫描信号；所述光电感应芯片，感应外部光线，产生感应电信号，通过所述触控感应像素点的第一端，输出给所述感应信号收集模块，所述感应信号收集模块接收所述触控感应像素点输出的感应电信号。
  2. 根据权利要求1所述的可交互的COB显示模组，其特征在于，所述感应电信号为电流，多个所述光电感应芯片并联连接，形成触控感应像素点。
  3. 根据权利要求1所述的可交互的COB显示模组，其特征在于，所述感应电信号为电压或电荷，多个所述光电感应芯片串联连接，形成触控感应像素点。
  4. 根据权利要求1所述的可交互的COB显示模组，其特征在于，所述LED灯珠为单色LED灯珠，所述COB显示模组包括红色LED灯珠、绿色LED灯珠、蓝色LED灯珠三种颜色的LED灯珠；
    或者，所述LED灯珠为复合LED灯珠，所述LED灯珠包含有红色LED芯片、绿色LED芯片、蓝色LED芯片。
  5. 根据权利要求1-4任一项所述的可交互的COB显示模组，其特征在于，还包括信号放大器，用于对所述感应信号收集模块接收到的感应电信号进行放大处理。
  6. 根据权利要求5所述的可交互的COB显示模组，其特征在于，还包括信号处理器，用于对放大处理后的感应电信号进行分析，确定交互操作的位置。
  7. 根据权利要求6所述的可交互的COB显示模组，其特征在于，所述信号处理器产生同步信号，并输出给所述触控扫描驱动模块、感应信号收集模块，所述触控扫描驱动模块根据同步信号，同步输出触控扫描信号；所述感应信号收集模块根据同步信号，同步接收感应电信号；所述信号处理器根据接收到的感应电信号和同步信号，确定交互操作的位置。
  8. 一种LED显示屏，包括若干COB显示模组，多个COB显示模组拼接形成LED显示屏；其特征在于，所述COB显示模组为权利要求1-5任一项所述的可交互的COB显示模组。
  9. 根据权利要求8所述的LED显示屏，其特征在于，还包括触摸控制芯片，用于接收所有COB显示模组输出的感应电信号，分析确定交互操作的位置。
  10. 根据权利要求8所述的LED显示屏，其特征在于，还包括支撑框架，所述COB显示模组安装在所述支撑框架上，所述支撑框架给所述COB显示模组提供结构支撑。
PCT/CN2020/130497 2020-09-15 2020-11-20 一种可交互的cob显示模组及led显示屏 WO2022057080A1 (zh)

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