WO2022054599A1 - Matériau de transfert photosensible, procédé de fabrication de motif de résine et procédé de fabrication de dispositif électronique - Google Patents

Matériau de transfert photosensible, procédé de fabrication de motif de résine et procédé de fabrication de dispositif électronique Download PDF

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Publication number
WO2022054599A1
WO2022054599A1 PCT/JP2021/031365 JP2021031365W WO2022054599A1 WO 2022054599 A1 WO2022054599 A1 WO 2022054599A1 JP 2021031365 W JP2021031365 W JP 2021031365W WO 2022054599 A1 WO2022054599 A1 WO 2022054599A1
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Prior art keywords
resin layer
mass
meth
preferable
compound
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PCT/JP2021/031365
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English (en)
Japanese (ja)
Inventor
洋行 海鉾
隆志 有冨
一真 両角
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富士フイルム株式会社
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Priority to JP2022547495A priority Critical patent/JP7479487B2/ja
Priority to CN202180053678.4A priority patent/CN116018262A/zh
Publication of WO2022054599A1 publication Critical patent/WO2022054599A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Definitions

  • the present disclosure relates to a photosensitive transfer material, a method for manufacturing a resin pattern, an etching method, and a method for manufacturing an electronic device.
  • the electrode pattern corresponding to the sensor of the visual recognition part, the peripheral wiring part, and the wiring of the take-out wiring part are wired.
  • the conductive layer pattern such as is provided inside the touch panel.
  • the number of steps for obtaining the required pattern shape is small, so a layer of a photosensitive resin composition provided on an arbitrary substrate using a photosensitive transfer material is used.
  • a method of developing after exposure through a mask having a desired pattern is widely used.
  • Patent Document 1 has a photosensitive layer, an adhesive layer, and a temporary support in this order on a protective film, the photosensitive layer contains particles, and the photosensitive layer and the adhesive layer come into contact with each other. The photosensitive layer and the adhesive layer can be peeled off, and the surface of the photosensitive layer after peeling the photosensitive layer and the adhesive layer has irregularities formed by the particles.
  • the transfer material is described.
  • An object to be solved by one embodiment of the present disclosure is to provide a photosensitive transfer material capable of obtaining a resin pattern with few defects even when the photosensitive resin layer is exposed via a temporary support. be. Further, an object to be solved by another embodiment of the present disclosure is to provide a method for producing a resin pattern using the above-mentioned photosensitive transfer material, an etching method, and a method for producing an electronic device.
  • the disclosure includes the following aspects: ⁇ 1>
  • the temporary support, the photosensitive resin layer, and the protective film are provided in this order, and the surface energy of the surface of the temporary support opposite to the photosensitive resin layer side is ⁇ b (mN / m).
  • ⁇ 2> The photosensitive transfer material according to ⁇ 1>, wherein the temporary support has a thickness of 20 ⁇ m or less.
  • ⁇ 3> The photosensitive transfer material according to ⁇ 1> or ⁇ 2>, wherein the thickness of the photosensitive resin layer is 10 ⁇ m or less.
  • ⁇ 4> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 3>, which further has another layer between the temporary support and the photosensitive resin layer.
  • ⁇ 5> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 4>, wherein the haze value of the temporary support is less than 1.0%.
  • ⁇ 6> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 5>, wherein the temporary support has a peeling force of 0.5 mN / mm or more.
  • ⁇ 7> The photosensitive according to any one of ⁇ 1> to ⁇ 6>, wherein the arithmetic average roughness Ra value of the surface of the temporary support opposite to the photosensitive resin layer side is 50 nm or less. Sex transfer material.
  • ⁇ 8> The photosensitive property according to any one of ⁇ 1> to ⁇ 7>, wherein the arithmetic average roughness Ra value of the surface of the protective film opposite to the photosensitive resin layer side is 50 nm or less.
  • Transfer material ⁇ 9> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 8>, wherein the value of ⁇ b- ⁇ c is more than 0 mN / m and 50 mN / m or less.
  • ⁇ 10> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 9>, wherein the value of ⁇ b- ⁇ c is 2 mN / m or more and 30 mN / m or less.
  • ⁇ 11> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 10>, wherein the value of ⁇ b- ⁇ c is 7 mN / m or more and 20 mN / m or less.
  • ⁇ 12> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 11>, which is a roll-shaped photosensitive transfer material.
  • ⁇ 13> With respect to the step of peeling the protective film from the photosensitive transfer material according to any one of ⁇ 1> to ⁇ 12> and the temporary support in the photosensitive transfer material from which the protective film has been peeled off.
  • a method for producing a resin pattern which comprises a step of developing the photosensitive resin layer to form a resin pattern and the process of forming the resin pattern in this order.
  • the etching method including the step of etching the said conductive layer in.
  • ⁇ 15> With respect to the step of peeling the protective film from the photosensitive transfer material according to any one of ⁇ 1> to ⁇ 12> and the temporary support in the photosensitive transfer material from which the protective film has been peeled off.
  • the outermost layer on the side having the photosensitive resin layer was brought into contact with the substrate having the conductive layer and bonded to each other, and the photosensitive resin layer was exposed to a pattern through the temporary support.
  • a method for manufacturing an electronic device having the resin pattern comprising the steps of developing the photosensitive resin layer to form a resin pattern in this order.
  • a photosensitive transfer material that can obtain a resin pattern with few defects even when the photosensitive resin layer is exposed via a temporary support. Further, according to another embodiment of the present disclosure, it is possible to provide a method for manufacturing a resin pattern using the above-mentioned photosensitive transfer material, an etching method, and a method for manufacturing an electronic device.
  • FIG. 1 is a schematic view showing an example of the configuration of the photosensitive transfer material of the first embodiment.
  • FIG. 2 is a schematic view showing an example of the configuration of the photosensitive transfer material of the second embodiment.
  • FIG. 3 is a schematic plan view showing the pattern A.
  • FIG. 4 is a schematic plan view showing the pattern B.
  • the amount of each component in the composition is the sum of the plurality of applicable substances present in the composition when a plurality of the substances corresponding to each component are present in the composition, unless otherwise specified. Means quantity.
  • the term "process” is included in this term not only as an independent process but also as long as the intended purpose of the process is achieved even if it cannot be clearly distinguished from other processes.
  • the notation not describing substitution and non-substitution includes those having no substituent as well as those having a substituent.
  • the "alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
  • exposure includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams, unless otherwise specified.
  • particle beams such as electron beams and ion beams, unless otherwise specified.
  • the light used for exposure generally, the emission line spectrum of a mercury lamp, far ultraviolet rays typified by excimer laser, extreme ultraviolet rays (EUV light), X-rays, active rays such as electron beams (active energy rays) are used. Can be mentioned.
  • the chemical structural formula in the present specification may be described by a simplified structural formula in which a hydrogen atom is omitted.
  • “% by mass” and “% by weight” are synonymous, and “parts by mass” and “parts by weight” are synonymous.
  • a combination of two or more preferred embodiments is a more preferred embodiment.
  • the weight average molecular weight (Mw) and the number average molecular weight (Mn) in the present specification are columns of TSKgel GMHxL, TSKgel G4000HxL, and TSKgel G2000HxL (all are trade names manufactured by Toso Co., Ltd.).
  • total solid content refers to the total mass of the components excluding the solvent from the total composition of the composition.
  • solid content is a component excluding the solvent as described above, and may be, for example, a solid or a liquid at 25 ° C.
  • the photosensitive transfer material according to the present disclosure has a temporary support, a photosensitive resin layer, and a protective film in this order, and the surface energy of the surface of the temporary support opposite to the photosensitive resin layer side. Is ⁇ b (mN / m), and ⁇ b ⁇ ⁇ c is satisfied when the surface energy of the surface of the protective film opposite to the photosensitive resin layer side is ⁇ c (mN / m).
  • the surface energy of the surface of the temporary support opposite to the photosensitive resin layer side is ⁇ b (mN / m), and the surface energy of the temporary support is the same as that of the photosensitive resin layer side of the protective film. Satisfies ⁇ b ⁇ ⁇ c when the surface energy of the opposite surface is ⁇ c (mN / m).
  • the temporary support and the protective film come into contact with each other by laminating the photosensitive transfer material or winding the photosensitive transfer material in a roll shape, and the temporary support is described above.
  • the "defect" of the resin pattern in the present disclosure is a defective shape of the resin pattern.
  • the wiring due to the defect is broken (open) or the wiring is connected to each other (short circuit).
  • the higher the definition of the pattern the greater the effect.
  • the photosensitive transfer material according to the present disclosure has a surface energy of ⁇ b (mN / m) on the surface of the temporary support opposite to the photosensitive resin layer side, and is different from the photosensitive resin layer side of the protective film. Satisfies ⁇ b ⁇ ⁇ c when the surface energy of the opposite surface is ⁇ c (mN / m).
  • the method for adjusting the surface energy of the temporary support and the protective film is not particularly limited, but the type of resin used, the composition of additives and the like, the surface treatment, the stretching treatment, the formation of a particle-containing layer and the like described later, etc. Method can be mentioned.
  • the surface energy (unit: mN / m) of the temporary support or the protective film is calculated by the following method.
  • the contact angles of two types of liquids, pure water and methylene iodide were measured in an atmosphere of room temperature of 23 ° C and relative humidity of 50% to 60%. Measure 3 points by (Kyowa Interface Science Co., Ltd.). The average value of the measured values obtained for each liquid is taken as the contact angle of each of the two types of liquids.
  • the value of ⁇ b- ⁇ c is the defect suppressing property of the resin pattern and the resolution property (hereinafter, simply “resin pattern defect suppressing property” when exposed via a temporary support. From the viewpoint of "resolvability"), it is preferably more than 0 mN / m and 50 mN / m or less, more preferably 2 mN / m or more and 30 mN / m or less, and 7 mN / m or more and 20 mN. It is particularly preferable that it is / m or less.
  • the value of the surface energy ⁇ b on the surface of the temporary support opposite to the photosensitive resin layer side is determined from the viewpoint of defect suppression and resolvability of the resin pattern. , 30 mN / m to 70 mN / m, more preferably 40 mN / m to 65 mN / m, and particularly preferably 45 mN / m to 60 mN / m.
  • the value of the surface energy ⁇ c on the surface of the protective film opposite to the photosensitive resin layer side is determined from the viewpoint of defect suppression property and resolution property of the resin pattern. It is preferably 20 mN / m to 65 mN / m, more preferably 25 mN / m to 55 mN / m, and particularly preferably 30 mN / m to 45 mN / m.
  • the photosensitive transfer material according to the present disclosure has a temporary support, a photosensitive resin layer, and a protective film in this order. Further, the photosensitive transfer material according to the present disclosure may have another layer between the temporary support and the photosensitive resin layer, between the photosensitive resin layer and the protective film, and the like.
  • the photosensitive transfer material according to the present disclosure is preferably a roll-shaped photosensitive transfer material from the viewpoint of further exerting the effect in the present disclosure.
  • the photosensitive transfer material is shown below, but the present invention is not limited thereto.
  • the photosensitive resin layer is preferably a negative photosensitive resin layer. It is also preferable that the photosensitive resin layer is a colored resin layer.
  • the photosensitive transfer material according to the present disclosure may be used as a photosensitive transfer material for a wiring protective film or as a photosensitive transfer material for an etching resist, as will be described later.
  • the configuration of the photosensitive transfer material is preferably, for example, the configuration of (1) or (2) described above.
  • the composition of the photosensitive transfer material is preferably, for example, the above-mentioned configurations (2) to (4).
  • the thickness is preferably 0.1% to 30%, more preferably 0.1% to 20%, based on the thickness of the photosensitive resin layer.
  • the photosensitive transfer material of the first embodiment below has a configuration that can be suitably used as a photosensitive transfer material for an etching resist, and the photosensitive transfer material of the second embodiment below is photosensitive for a wiring protective film. It is a configuration that can be suitably used for a transfer material.
  • the photosensitive transfer material 20 shown in FIG. 1 includes a temporary support 11, a transfer layer 12 including a thermoplastic resin layer 13, a water-soluble resin layer 15, and a photosensitive resin layer 17, and a protective film 19. Have in order. Further, the photosensitive transfer material 20 shown in FIG. 1 has a form in which the thermoplastic resin layer 13 and the water-soluble resin layer 15 are arranged, but the thermoplastic resin layer 13 and the water-soluble resin layer 15 may not be arranged. ..
  • each element constituting the photosensitive transfer material of the first embodiment will be described.
  • the photosensitive transfer material used in the present disclosure has a temporary support.
  • the temporary support is a support that supports a photosensitive resin layer or a laminate containing the photosensitive resin layer and is removable.
  • the temporary support preferably has light transmittance from the viewpoint that the photosensitive resin layer can be exposed through the temporary support when the photosensitive resin layer is exposed to a pattern.
  • “having light transmittance” means that the transmittance of light of the wavelength used for pattern exposure is 50% or more.
  • the temporary support preferably has a light transmittance of 60% or more, preferably 70% or more, at a wavelength (more preferably 365 nm) used for pattern exposure. Is more preferable.
  • the transmittance of the layer included in the photosensitive transfer material means that when light is incident in a direction perpendicular to the main surface of the layer (that is, in the thickness direction), the light is emitted through the layer with respect to the intensity of the incident light. It is a ratio of the intensity of the emitted light, and is measured using MCPD Series manufactured by Otsuka Electronics Co., Ltd.
  • Examples of the material constituting the temporary support include a glass substrate, a resin film and paper, and a resin film is preferable from the viewpoint of strength, flexibility and light transmission.
  • Examples of the resin film include polyethylene terephthalate (PET) film, cellulose triacetate film, polystyrene film and polycarbonate film. Among them, PET film is preferable, and biaxially stretched PET film is more preferable.
  • the thickness (layer thickness) of the temporary support is not particularly limited, and the strength as the support, the flexibility required for bonding to the circuit wiring forming substrate, and the light required in the first exposure step are not particularly limited. From the viewpoint of transparency, it may be selected according to the material.
  • the thickness of the temporary support is preferably in the range of 5 ⁇ m to 100 ⁇ m, more preferably in the range of 10 ⁇ m to 50 ⁇ m, further preferably in the range of 10 ⁇ m to 20 ⁇ m, and in the range of 10 ⁇ m to 16 ⁇ m from the viewpoint of ease of handling and versatility. Especially preferable.
  • the thickness of the temporary support is preferably 50 ⁇ m or less, more preferably 25 ⁇ m or less, and more preferably 20 ⁇ m or less, from the viewpoint of defect suppression, resolution, and linearity of the resin pattern. Especially preferable.
  • the film used as the temporary support is free from deformation such as wrinkles, scratches, defects and the like.
  • the number of fine particles, foreign substances, defects, precipitates, etc. contained in the temporary support is small.
  • the number of fine particles, foreign substances and defects having a diameter of 1 ⁇ m or more is preferably 50 pieces / 10 mm 2 or less, more preferably 10 pieces / 10 mm 2 or less, and further preferably 3 pieces / 10 mm 2 or less. , 0 pieces / 10 mm 2 is particularly preferable.
  • the haze of the temporary support is small.
  • the haze value of the temporary support is preferably 2% or less, more preferably 1.5% or less, further preferably less than 1.0%, and particularly preferably 0.5% or less.
  • the haze value in the present disclosure is measured by a haze meter (NDH-2000, manufactured by Nippon Denshoku Kogyo Co., Ltd.) by a method according to JIS K 7105: 1981.
  • a layer (lubricant layer) containing fine particles may be provided on the surface of the temporary support from the viewpoint of imparting handleability.
  • the lubricant layer may be provided on one side of the temporary support or on both sides.
  • the diameter of the particles contained in the lubricant layer can be, for example, 0.05 ⁇ m to 0.8 ⁇ m.
  • the thickness of the lubricant layer can be, for example, 0.05 ⁇ m to 1.0 ⁇ m.
  • the arithmetic average roughness Ra of the surface of the temporary support opposite to the photosensitive resin layer side is the photosensitive of the temporary support from the viewpoints of transportability, defect suppression of the resin pattern, and resolution. It is preferable that the surface has an arithmetic average roughness Ra or more on the resin layer side.
  • the arithmetic average roughness Ra of the surface of the temporary support opposite to the photosensitive resin layer side is preferably 100 nm or less from the viewpoints of transportability, defect suppression of the resin pattern, and resolution. , 50 nm or less, more preferably 20 nm or less, and particularly preferably 10 nm or less.
  • the arithmetic average roughness Ra of the surface of the temporary support on the photosensitive resin layer side is preferably 100 nm or less from the viewpoint of peelability of the temporary support, defect suppression of the resin pattern, and resolution. , 50 nm or less, more preferably 20 nm or less, and particularly preferably 10 nm or less. Further, the value of the arithmetic average roughness Ra of the surface of the temporary support on the side opposite to the photosensitive resin layer side was subtracted from the value of the arithmetic average roughness Ra of the surface of the temporary support on the side of the photosensitive resin layer. The value is preferably 0 nm to 10 nm, and more preferably 0 nm to 5 nm, from the viewpoints of transportability, defect suppression property of the resin pattern, and resolution.
  • the arithmetic average roughness Ra of the surface of the temporary support or the protective film in the present disclosure shall be measured by the following method. Using a three-dimensional optical profiler (New View7300, manufactured by Zygo), the surface of the temporary support or the protective film is measured under the following conditions to obtain the surface profile of the film. As the measurement / analysis software, Microscope Application of MetroPro ver8.3.2 is used. Next, the Surface Map screen is displayed by the above analysis software, and the histogram data is obtained in the Surface Map screen. From the obtained histogram data, the arithmetic mean roughness is calculated, and the Ra value of the surface of the temporary support or the protective film is obtained. When the temporary support or the protective film is attached to the photosensitive resin layer or the like, the temporary support or the protective film may be peeled off from the photosensitive resin layer, and the Ra value of the surface on the peeled side may be measured.
  • a three-dimensional optical profiler New View7300, manufactured by Zygo
  • the peeling force of the temporary support is when the wound laminate is transported again by the roll-to-roll method. From the viewpoint of suppressing the peeling of the temporary support due to the adhesion between the vertically stacked laminates and the laminate, it is preferably 0.5 mN / mm or more, preferably 0.5 mN / mm to 2.0 mN / mm. Is more preferable.
  • the peeling force of the temporary support in the present disclosure shall be measured as follows.
  • a copper layer having a thickness of 200 nm is produced on a polyethylene terephthalate (PET) film having a thickness of 100 ⁇ m by a sputtering method, and a PET substrate with a copper layer is produced.
  • the protective film is peeled off from the produced photosensitive transfer material, and laminated on the PET substrate with a copper layer under laminating conditions of a laminating roll temperature of 100 ° C., a linear pressure of 0.6 MPa, and a linear velocity (laminating rate) of 1.0 m / min.
  • a laminate having at least the temporary support and the photosensitive resin layer on a PET substrate with a copper layer is 70 mm ⁇ 10 mm. Cut to make a sample.
  • the PET substrate side of the sample is fixed on the sample table.
  • a tensile compression tester (SV-55, manufactured by Imada Seisakusho Co., Ltd.) pull the tape in the direction of 180 degrees at 5.5 mm / sec to obtain a photosensitive resin layer or a thermoplastic resin layer and a temporary support.
  • peeling force is measured.
  • Preferred embodiments of the provisional support include, for example, paragraphs 0017 to 0018 of JP-A-2014-85643, paragraphs 0019 to 0026 of JP-A-2016-27363, and paragraphs 0041 to 0057 of International Publication No. 2012/081680. , Paragraphs 0029 to 0040 of International Publication No. 2018/179370, paragraphs 0012 to paragraph 0032 of JP-A-2019-101405, and the contents of these publications are incorporated in the present specification.
  • the photosensitive transfer material has a protective film. It is preferable that the photosensitive resin layer and the protective film are in direct contact with each other.
  • Examples of the material constituting the protective film include a resin film and paper, and a resin film is preferable from the viewpoint of strength and flexibility.
  • Examples of the resin film include a polyethylene film, a polypropylene film, a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film. Of these, polyethylene film, polypropylene film, or polyethylene terephthalate film is preferable.
  • the thickness (layer thickness) of the protective film is not particularly limited, but is preferably 5 ⁇ m to 100 ⁇ m, more preferably 10 ⁇ m to 50 ⁇ m.
  • the arithmetic mean roughness Ra of the surface of the protective film opposite to the surface opposite to the photosensitive resin layer side is the photosensitive resin layer of the protective film from the viewpoints of transportability, defect suppression of the resin pattern, and resolution. It is preferably equal to or less than the arithmetic mean roughness Ra of the side surface, and more preferably smaller than the arithmetic average roughness Ra of the surface on the photosensitive resin layer side of the protective film.
  • the arithmetic average roughness Ra of the surface of the protective film opposite to the photosensitive resin layer side is preferably 300 nm or less, more preferably 100 nm or less, still more preferably 70 nm or less, from the viewpoint of transportability and winding property. It is particularly preferably 50 nm or less.
  • the arithmetic average roughness Ra of the surface of the protective film on the photosensitive resin layer side is preferably 300 nm or less, more preferably 100 nm or less, further preferably 70 nm or less, and further preferably 50 nm or less, from the viewpoint of excellent resolution. Is particularly preferred.
  • the Ra value on the surface of the protective film is in the above range to improve the uniformity of the layer thickness of the photosensitive resin layer and the formed resin pattern.
  • the lower limit of the Ra value on the surface of the protective film is not particularly limited, but it is preferably 1 nm or more, more preferably 10 nm or more, and particularly preferably 20 nm or more on both sides.
  • the peeling force of the protective film is preferably smaller than the peeling force of the temporary support.
  • the photosensitive transfer material according to the present disclosure has a photosensitive resin layer.
  • the photosensitive resin layer may be a negative type photosensitive resin layer or a positive type photosensitive resin layer, but the solubility of the exposed part in the developing solution is lowered by the exposure, and the non-exposed part is developed by the development. It is preferably a negative photosensitive resin layer to be removed.
  • the photosensitive resin layer preferably contains an alkali-soluble resin, a polymerizable compound (preferably an ethylenically unsaturated compound), and a photopolymerization initiator. Based on the total mass of the photosensitive resin layer, the alkali-soluble resin: 10 mass. %-90% by mass; Ethylene unsaturated compound: 5% by mass-70% by mass; and photopolymerization initiator: 0.01% by mass to 20% by mass.
  • each component will be described in order.
  • the photosensitive resin layer preferably contains an alkali-soluble resin.
  • alkali-soluble means that the solubility of sodium carbonate in 100 g of a 1% by mass aqueous solution at 22 ° C. is 0.1 g or more.
  • the alkali-soluble resin is not particularly limited, and examples thereof include known alkali-soluble resins used for etching resists.
  • the alkali-soluble resin is preferably a binder polymer.
  • the alkali-soluble resin is preferably an alkali-soluble resin having an acid group. Among them, the alkali-soluble resin is preferably polymer A, which will be described later.
  • the alkali-soluble resin preferably contains the polymer A.
  • the acid value of the polymer A is preferably 220 mgKOH / g or less, more preferably less than 200 mgKOH / g, and more preferably 190 mgKOH / g, from the viewpoint of better resolution by suppressing the swelling of the photosensitive resin layer by the developing solution. Less than is more preferred.
  • the lower limit of the acid value of the polymer A is not particularly limited, but from the viewpoint of better developability, 60 mgKOH / g or more is preferable, 120 mgKOH / g or more is more preferable, 150 mgKOH / g or more is further preferable, and 170 mgKOH / g or more is more preferable. Especially preferable.
  • the acid value is the mass [mg] of potassium hydroxide required to neutralize 1 g of the sample.
  • the unit is described as mgKOH / g.
  • the acid value can be calculated, for example, from the average content of acid groups in the compound.
  • the acid value of the polymer A may be adjusted according to the type of the structural unit constituting the polymer A and the content of the structural unit containing the acid group.
  • the weight average molecular weight of the polymer A is preferably 5,000 to 500,000. It is preferable that the weight average molecular weight is 500,000 or less from the viewpoint of improving the resolvability and the developability.
  • the weight average molecular weight is more preferably 100,000 or less, further preferably 60,000 or less, and particularly preferably 50,000 or less.
  • setting the weight average molecular weight of the polymer A to 5,000 or more is the property of the developed aggregate and the properties of the unexposed film such as edge fuse property and cut chip property in the case of a photosensitive resin laminate. It is preferable from the viewpoint of controlling.
  • the weight average molecular weight of the polymer A is more preferably 10,000 or more, further preferably 20,000 or more, and particularly preferably 30,000 or more.
  • the edge fuse property refers to the degree of ease with which the photosensitive resin layer protrudes from the end face of the roll when the photosensitive transfer material is wound into a roll.
  • the cut chip property refers to the degree of ease of chip flying when the unexposed film is cut with a cutter. If this chip adheres to the upper surface of the photosensitive resin laminate or the like, it will be transferred to the mask in a later exposure step or the like, causing a defective product.
  • the dispersity of the polymer A is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, and even more preferably 1.0 to 4.0. It is more preferably 0.0 to 3.0.
  • the molecular weight is a value measured using gel permeation chromatography.
  • the degree of dispersion is the ratio of the weight average molecular weight to the number average molecular weight (weight average molecular weight / number average molecular weight).
  • the photosensitive resin layer may contain a monomer component having an aromatic hydrocarbon group as the polymer A from the viewpoint of suppressing line width thickening or deterioration of resolution when the focal position is deviated during exposure.
  • aromatic hydrocarbon groups include substituted or unsubstituted phenyl groups and substituted or unsubstituted aralkyl groups.
  • the content ratio of the monomer component having an aromatic hydrocarbon group in the polymer A is preferably 20% by mass or more, preferably 30% by mass or more, based on the total mass of all the monomer components. More preferably, it is more preferably 40% by mass or more, particularly preferably 45% by mass or more, and most preferably 50% by mass or more.
  • the upper limit is not particularly limited, but is preferably 95% by mass or less, and more preferably 85% by mass or less.
  • the content ratio of the monomer component having an aromatic hydrocarbon group was determined as a weight average value.
  • Examples of the monomer having an aromatic hydrocarbon group include a monomer having an aralkyl group, styrene, and a polymerizable styrene derivative (for example, methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, 4-vinyl). Benzoic acid, styrene dimer, styrene trimmer, etc.). Of these, a monomer having an aralkyl group or styrene is preferable.
  • the content ratio of the styrene monomer component is 20% by mass based on the total mass of all the monomer components. It is preferably ⁇ 50% by mass, more preferably 25% by mass to 45% by mass, further preferably 30% by mass to 40% by mass, and particularly preferably 30% by mass to 35% by mass. preferable.
  • aralkyl group examples include a substituted or unsubstituted phenylalkyl group (excluding a benzyl group), a substituted or unsubstituted benzyl group and the like, and a substituted or unsubstituted benzyl group is preferable.
  • Examples of the monomer having a phenylalkyl group include phenylethyl (meth) acrylate and the like.
  • Examples of the monomer having a benzyl group include (meth) acrylate having a benzyl group, for example, benzyl (meth) acrylate, chlorobenzyl (meth) acrylate and the like; vinyl monomers having a benzyl group, for example, vinylbenzyl chloride and vinylbenzyl. Examples include alcohol. Of these, benzyl (meth) acrylate is preferable.
  • the content ratio of the benzyl (meth) acrylate monomer component is the total of all the monomer components. Based on the mass, it is preferably 50% by mass to 95% by mass, more preferably 60% by mass to 90% by mass, further preferably 70% by mass to 90% by mass, and 75% by mass to 90% by mass. It is particularly preferably 90% by mass.
  • the polymer A containing a monomer component having an aromatic hydrocarbon group includes a monomer having an aromatic hydrocarbon group, at least one of the first monomers described below, and / or a second described below. It is preferably obtained by polymerizing with at least one of the monomers of.
  • the polymer A containing no monomer component having an aromatic hydrocarbon group is preferably obtained by polymerizing at least one of the first monomers described later, and at least the first monomer. It is more preferable to obtain it by copolymerizing one kind with at least one kind of the second monomer described later.
  • the first monomer is a monomer having a carboxy group in the molecule.
  • the first monomer include (meth) acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, maleic acid anhydride, maleic acid semi-ester and the like.
  • (meth) acrylic acid is preferable.
  • the content ratio of the first monomer in the polymer A is preferably 5% by mass to 50% by mass, preferably 10% by mass to 40% by mass, based on the total mass of all the monomer components. Is more preferable, and 15% by mass to 30% by mass is further preferable.
  • the copolymerization ratio of the first monomer is preferably 10% by mass to 50% by mass based on the total mass of all the monomer components.
  • the copolymerization ratio of 10% by mass or more is preferable from the viewpoint of exhibiting good developability and controlling edge fuseability, more preferably 15% by mass or more, still more preferably 20% by mass or more. .. It is preferable to set the copolymerization ratio to 50% by mass or less from the viewpoint of high resolution and the shape of the resist pattern, and further from the viewpoint of chemical resistance of the resist pattern, and from these viewpoints, 35% by mass.
  • the following is more preferable, 30% by mass or less is further preferable, and 27% by mass or less is particularly preferable.
  • the second monomer is a monomer that is non-acidic and has at least one polymerizable unsaturated group in the molecule.
  • Examples of the second monomer include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, and isobutyl (meth) acrylate.
  • methyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and n-butyl (meth) acrylate are preferable, and methyl (meth) acrylate is particularly preferable.
  • the content ratio of the second monomer in the polymer A is preferably 5% by mass to 60% by mass, preferably 15% by mass to 50% by mass, based on the total mass of all the monomer components. Is more preferable, and 20% by mass to 45% by mass is further preferable.
  • the polymer A contains 25% by mass to 40% by mass of a monomer component having an aromatic hydrocarbon group, 20% by mass to 35% by mass of the first monomer component, and a second unit amount.
  • the polymer preferably contains 30% by mass to 45% by mass of a body component.
  • the polymer preferably contains 70% by mass to 90% by mass of a monomer component having an aromatic hydrocarbon group and 10% by mass to 25% by mass of the first monomer component. ..
  • the polymer A may have a branched structure or an alicyclic structure in the side chain. Further, the polymer A may have a linear structure in the side chain. Introducing a branched structure or an alicyclic structure into the side chain of polymer A by using a monomer containing a group having a branched structure in the side chain or a monomer containing a group having an alicyclic structure in the side chain. Can be done.
  • the group having an alicyclic structure may be monocyclic or polycyclic. Specific examples of the monomer containing a group having a branched structure in the side chain include i-propyl (meth) acrylic acid and (meth) acrylic acid.
  • i-propyl (meth) acrylate, i-butyl (meth) acrylate, or t-butyl methacrylate are preferable, and i-propyl methacrylate or t-butyl methacrylate is more preferable.
  • the monomer containing a group having an alicyclic structure in the side chain include a monomer having a monocyclic alicyclic hydrocarbon group and a monomer having a polycyclic alicyclic hydrocarbon group, and the number of carbon atoms (number of carbon atoms) can be mentioned.
  • examples thereof include (meth) acrylates having 5 to 20 alicyclic hydrocarbon groups.
  • More specific examples include, for example, (meth) acrylic acid (bicyclo [2.2.1] heptyl-2), (meth) acrylic acid-1-adamantyl, (meth) acrylic acid-2-adamantyl, (meth). ) Acrylic acid-3-methyl-1-adamantyl, (meth) acrylate-3,5-dimethyl-1-adamantyl, (meth) acrylate-3-ethyladamantyl, (meth) acrylate-3-methyl-5 -Ethyl-1-adamantyl, (meth) acrylic acid-3,5,8-triethyl-1-adamantyl, (meth) acrylic acid-3,5-dimethyl-8-ethyl-1-adamantyl, (meth) acrylic acid 2-Methyl-2-adamantyl, 2-ethyl-2-adamantyl (meth) acrylate, 3-hydroxy-1-adamantyl (meth) acrylate, octahydr
  • (meth) acrylic acid esters (meth) acrylic acid cyclohexyl, (meth) acrylic acid (nor) boronyl, (meth) acrylic acid isobornyl, (meth) acrylic acid-1-adamantyl, (meth) acrylic acid- 2-adamantyl, fentyl (meth) acrylate, 1-mentyl (meth) acrylate, or tricyclodecane (meth) acrylate is preferred, cyclohexyl (meth) acrylate, (nor) bornyl, (meth) acrylate, Isobornyl (meth) acrylate, -2-adamantyl (meth) acrylate, or tricyclodecane (meth) acrylate are particularly preferred.
  • the polymer A can be used alone or in combination of two or more.
  • two kinds of polymer A containing a monomer component having an aromatic hydrocarbon group may be mixed and used, or a monomer component having an aromatic hydrocarbon group may be used.
  • the ratio of the polymer A containing the monomer component having an aromatic hydrocarbon group to the total amount of the polymer A is preferably 50% by mass or more, preferably 70% by mass or more. It is more preferably 80% by mass or more, and more preferably 90% by mass or more.
  • a radical polymerization initiator such as benzoyl peroxide and azoisobutyronitrile is added to a solution obtained by diluting the one or more monomers described above with a solvent such as acetone, methyl ethyl ketone and isopropanol. Is preferably added in an appropriate amount and heated and stirred. In some cases, a part of the mixture is added dropwise to the reaction solution for synthesis. After completion of the reaction, a solvent may be further added to adjust the concentration to a desired level.
  • a radical polymerization initiator such as benzoyl peroxide and azoisobutyronitrile is added to a solution obtained by diluting the one or more monomers described above with a solvent such as acetone, methyl ethyl ketone and isopropanol. Is preferably added in an appropriate amount and heated and stirred. In some cases, a part of the mixture is added dropwise to the reaction solution for synthesis. After completion of the reaction,
  • the glass transition temperature Tg of the polymer A is preferably 30 ° C. or higher and 135 ° C. or lower.
  • the Tg of the polymer A is more preferably 130 ° C. or lower, further preferably 120 ° C. or lower, and particularly preferably 110 ° C. or lower.
  • the polymer A having a Tg of 30 ° C. or higher from the viewpoint of improving the edge fuse resistance.
  • the Tg of the polymer A is more preferably 40 ° C. or higher, further preferably 50 ° C. or higher, particularly preferably 60 ° C. or higher, and most preferably 70 ° C. or higher. ..
  • the photosensitive resin layer may contain a resin other than the alkali-soluble resin.
  • Resins other than the alkali-soluble resin include acrylic resin, styrene-acrylic copolymer (however, the styrene content is 40% by mass or less), polyurethane resin, polyvinyl alcohol, polyvinyl formal, polyamide resin, polyester resin, and polyamide. Examples thereof include resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimines, polyallylamines, and polyalkylene glycols.
  • the alkali-soluble resin may be used alone or in combination of two or more.
  • the ratio of the alkali-soluble resin to the total mass of the photosensitive resin layer is preferably in the range of 10% by mass to 90% by mass, more preferably 30% by mass to 70% by mass, and further preferably 40% by mass to 40% by mass. It is 60% by mass. It is preferable that the ratio of the alkali-soluble resin to the photosensitive resin layer is 90% by mass or less from the viewpoint of controlling the developing time. On the other hand, it is preferable to set the ratio of the alkali-soluble resin to the photosensitive resin layer to 10% by mass or more from the viewpoint of improving the edge fuse resistance.
  • the photosensitive resin layer preferably contains a polymerizable compound.
  • the "polymerizable compound” means a compound that polymerizes under the action of a polymerization initiator described later, and is different from the above-mentioned alkali-soluble resin.
  • the polymerizable group of the polymerizable compound is not particularly limited as long as it is a group involved in the polymerization reaction, and has, for example, an ethylenically unsaturated group such as a vinyl group, an acryloyl group, a methacryloyl group, a styryl group and a maleimide group. Groups; and groups having a cationically polymerizable group such as an epoxy group and an oxetane group can be mentioned.
  • a group having an ethylenically unsaturated group is preferable, and an acryloyl group or a methacryloyl group is more preferable.
  • the polymerizable compound preferably contains an ethylenically unsaturated compound, and more preferably contains a (meth) acrylate compound.
  • An ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups.
  • the photosensitive resin layer preferably contains a bifunctional or higher functional ethylenically unsaturated compound as the ethylenically unsaturated compound.
  • the bifunctional or higher functional ethylenically unsaturated compound means a compound having two or more ethylenically unsaturated groups in one molecule.
  • a (meth) acryloyl group is more preferable.
  • As the ethylenically unsaturated compound a (meth) acrylate compound is preferable.
  • the ethylenically unsaturated compound may contain a compound having two or more ethylenically unsaturated groups (polyfunctional ethylenically unsaturated compound) in one molecule because the photosensitive resin layer has better photosensitivity. preferable. Further, the number of ethylenically unsaturated groups contained in one molecule of the ethylenically unsaturated compound is preferably 6 or less, more preferably 3 or less, and 2 or less in terms of excellent resolution and peelability. More preferred.
  • the photosensitive resin layer is bifunctional or trifunctional having two or three ethylenically unsaturated groups in one molecule in that the photosensitive resin layer has a better balance between photosensitivity, resolution and peelability. It is preferable to contain an ethylenically unsaturated compound, and more preferably to contain a bifunctional ethylenically unsaturated compound having two ethylenically unsaturated groups in one molecule.
  • the content of the bifunctional ethylenically unsaturated compound in the photosensitive resin layer with respect to the content of the ethylenically unsaturated compound is preferably 60% by mass or more, more preferably more than 70% by mass, and more preferably 90, from the viewpoint of excellent peelability. More preferably by mass% or more.
  • the upper limit is not particularly limited and may be 100% by mass. That is, all the ethylenically unsaturated compounds contained in the photosensitive resin layer may be bifunctional ethylenically unsaturated compounds. Further, as the ethylenically unsaturated compound, a (meth) acrylate compound having a (meth) acryloyl group as a polymerizable group is preferable.
  • the photosensitive resin layer preferably contains an aromatic ring and an ethylenically unsaturated compound B1 having two ethylenically unsaturated groups.
  • the ethylenically unsaturated compound B1 is a bifunctional ethylenically unsaturated compound having one or more aromatic rings in one molecule among the above-mentioned ethylenically unsaturated compounds.
  • the mass ratio of the content of the ethylenically unsaturated compound B1 to the content of the ethylenically unsaturated compound in the photosensitive resin layer is preferably 40% by mass or more, preferably 50% by mass, from the viewpoint of better resolution. % Or more, more preferably 55% by mass or more, and particularly preferably 60% by mass or more.
  • the upper limit is not particularly limited, but from the viewpoint of peelability, 99% by mass or less is preferable, 95% by mass or less is more preferable, 90% by mass or less is further preferable, and 85% by mass or less is particularly preferable.
  • Examples of the aromatic ring contained in the ethylenically unsaturated compound B1 include an aromatic hydrocarbon ring such as a benzene ring, a naphthalene ring and an anthracene ring, a thiophene ring, a furan ring, a pyrrole ring, an imidazole ring, a triazole ring and a pyridine ring.
  • Aromatic heterocycles and fused rings thereof are mentioned, and aromatic hydrocarbon rings are preferable, and benzene rings are more preferable.
  • the aromatic ring may have a substituent.
  • the ethylenically unsaturated compound B1 may have only one aromatic ring or may have two or more aromatic rings.
  • the ethylenically unsaturated compound B1 preferably has a bisphenol structure from the viewpoint of improving the resolution by suppressing the swelling of the photosensitive resin layer by the developing solution.
  • the bisphenol structure include a bisphenol A structure derived from bisphenol A (2,2-bis (4-hydroxyphenyl) propane) and a bisphenol derived from bisphenol F (2,2-bis (4-hydroxyphenyl) methane).
  • examples thereof include an F structure and a bisphenol B structure derived from bisphenol B (2,2-bis (4-hydroxyphenyl) butane), and a bisphenol A structure is preferable.
  • Examples of the ethylenically unsaturated compound B1 having a bisphenol structure include a compound having a bisphenol structure and two polymerizable groups (preferably (meth) acryloyl groups) bonded to both ends of the bisphenol structure. Both ends of the bisphenol structure and the two polymerizable groups may be directly bonded or may be bonded via one or more alkyleneoxy groups. As the alkyleneoxy group added to both ends of the bisphenol structure, an ethyleneoxy group or a propyleneoxy group is preferable, and an ethyleneoxy group is more preferable.
  • the number of alkyleneoxy groups added to the bisphenol structure is not particularly limited, but is preferably 4 to 16 per molecule, more preferably 6 to 14.
  • the ethylenically unsaturated compound B1 having a bisphenol structure is described in paragraphs 0072 to 0080 of JP-A-2016-224162, and the contents described in this publication are incorporated in the present specification.
  • ethylenically unsaturated compound B1 a bifunctional ethylenically unsaturated compound having a bisphenol A structure is preferable, and 2,2-bis (4-((meth) acryloxypolyalkoxy) phenyl) propane is more preferable.
  • 2,2-bis (4-((meth) acryloxypolyalkoxy) phenyl) propane examples include 2,2-bis (4- (methacryloxydiethoxy) phenyl) propane (FA-324M, Hitachi Chemical Co., Ltd.).
  • ethylenically unsaturated compound B1 a compound represented by the following formula (Bis) can be used.
  • R 1 and R 2 independently represent a hydrogen atom or a methyl group
  • A is C 2 H 4
  • B is C 3 H 6
  • n 1 and n 3 are independent, respectively.
  • n 1 + n 3 is an integer of 1 to 39
  • n 1 + n 3 is an integer of 2 to 40
  • n 2 and n 4 are independently integers of 0 to 29, and n 2 + n 4 is an integer of 0 to 40.
  • n 1 + n 2 + n 3 + n 4 is preferably an integer of 2 to 20, more preferably an integer of 2 to 16, and even more preferably an integer of 4 to 12. Further, n 2 + n 4 is preferably an integer of 0 to 10, more preferably an integer of 0 to 4, further preferably an integer of 0 to 2, and particularly preferably 0.
  • the ethylenically unsaturated compound B1 may be used alone or in combination of two or more.
  • the content of the ethylenically unsaturated compound B1 in the photosensitive resin layer is preferably 10% by mass or more, more preferably 20% by mass or more, based on the total mass of the photosensitive resin layer, from the viewpoint of better resolution.
  • the upper limit is not particularly limited, but is preferably 70% by mass or less, more preferably 60% by mass or less, from the viewpoint of transferability and edge fusion (a phenomenon in which the components in the photosensitive resin layer exude from the edges of the photosensitive transfer material). preferable.
  • the photosensitive resin layer may contain an ethylenically unsaturated compound other than the above-mentioned ethylenically unsaturated compound B1.
  • the ethylenically unsaturated compound other than the ethylenically unsaturated compound B1 is not particularly limited and can be appropriately selected from known compounds.
  • a compound having one ethylenically unsaturated group in one molecule (monofunctional ethylenically unsaturated compound), a bifunctional ethylenically unsaturated compound having no aromatic ring, and a trifunctional or higher ethylenically unsaturated compound. Examples include compounds.
  • Examples of the monofunctional ethylenically unsaturated compound include ethyl (meth) acrylate, ethylhexyl (meth) acrylate, 2- (meth) acryloyloxyethyl succinate, polyethylene glycol mono (meth) acrylate, and polypropylene glycol mono (meth) acrylate. , And phenoxyethyl (meth) acrylate.
  • Examples of the bifunctional ethylenically unsaturated compound having no aromatic ring include alkylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, urethane di (meth) acrylate, and trimethylolpropane diacrylate. Be done.
  • Examples of the alkylene glycol di (meth) acrylate include tricyclodecanedimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and tricyclodecanedimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.).
  • 1,9-Nonandiol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.)
  • Ethylene glycol dimethacrylate 1,10-decanediol diacrylate
  • neopentyl glycol di (meth) acrylate examples of the polyalkylene glycol di (meth) acrylate include polyethylene glycol di (meth) acrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, and polypropylene glycol di (meth) acrylate.
  • Examples of the urethane di (meth) acrylate include propylene oxide-modified urethane di (meth) acrylate, and ethylene oxide and propylene oxide-modified urethane di (meth) acrylate.
  • Examples of commercially available products include 8UX-015A (manufactured by Taisei Fine Chemical Industry Co., Ltd.), UA-32P (manufactured by Shin Nakamura Chemical Industry Co., Ltd.), and UA-1100H (manufactured by Shin Nakamura Chemical Industry Co., Ltd.). Can be mentioned.
  • Examples of the trifunctional or higher functional ethylenically unsaturated compound include dipentaerythritol (tri / tetra / penta / hexa) (meth) acrylate, pentaerythritol (tri / tetra) (meth) acrylate, and trimethylolpropane tri (meth).
  • Examples thereof include acrylates, trimethylolpropane tetra (meth) acrylates, trimethylolethanetri (meth) acrylates, isocyanuric acid tri (meth) acrylates, glycerintri (meth) acrylates, and alkylene oxide modifications thereof.
  • (tri / tetra / penta / hexa) (meth) acrylate) is a concept including tri (meth) acrylate, tetra (meth) acrylate, penta (meth) acrylate, and hexa (meth) acrylate.
  • (Tri / tetra) (meth) acrylate” is a concept that includes tri (meth) acrylate and tetra (meth) acrylate.
  • the photosensitive resin layer preferably contains the above-mentioned ethylenically unsaturated compound B1 and a trifunctional or higher ethylenically unsaturated compound, and the above-mentioned ethylenically unsaturated compound B1 and two or more trifunctional or higher. It is more preferable to contain the ethylenically unsaturated compound of.
  • the mass ratio of the ethylenically unsaturated compound B1 to the trifunctional or higher ethylenically unsaturated compound is (total mass of the ethylenically unsaturated compound B1): (total mass of the trifunctional or higher ethylenically unsaturated compound).
  • the photosensitive resin layer preferably contains the above-mentioned ethylenically unsaturated compound B1 and two or more trifunctional ethylenically unsaturated compounds.
  • alkylene oxide-modified product of the trifunctional or higher ethylenically unsaturated compound examples include caprolactone-modified (meth) acrylate compound (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd. and A manufactured by Shin Nakamura Chemical Industry Co., Ltd. -9300-1CL, etc.), alkylene oxide-modified (meth) acrylate compound (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin Nakamura Chemical Industry Co., Ltd., EBECRYL manufactured by Daicel Ornex Co., Ltd.
  • KAYARAD registered trademark
  • DPCA-20 manufactured by Nippon Kayaku Co., Ltd. and A manufactured by Shin Nakamura Chemical Industry Co., Ltd. -9300-1CL, etc.
  • alkylene oxide-modified (meth) acrylate compound alkylene oxide-modified (meth) acrylate compound (KA
  • the ethylenically unsaturated compound other than the ethylenically unsaturated compound B1 the ethylenically unsaturated compound having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942 may be used.
  • the value of the ratio Mm / Mb of the content Mm of the ethylenically unsaturated compound and the content Mb of the alkali-soluble resin in the photosensitive resin layer may be 1.0 or less from the viewpoint of resolution and linearity. It is more preferably 0.9 or less, and particularly preferably 0.5 or more and 0.9 or less.
  • the ethylenically unsaturated compound in the photosensitive resin layer preferably contains a (meth) acrylic compound from the viewpoint of curability and resolvability.
  • the ethylenically unsaturated compound in the photosensitive resin layer contains a (meth) acrylic compound from the viewpoint of curability, resolution and linearity, and the (meth) acrylic compound contained in the photosensitive resin layer. It is more preferable that the content of the acrylic compound with respect to the total mass is 60% by mass or less.
  • the molecular weight (weight average molecular weight (Mw) when having a distribution) of the ethylenically unsaturated compound containing the ethylenically unsaturated compound B1 is preferably 200 to 3,000, more preferably 280 to 2,200, and 300. -2,200 is more preferable.
  • the polymerizable compound (particularly, the ethylenically unsaturated compound) may be used alone or in combination of two or more.
  • the content of the polymerizable compound (particularly, the ethylenically unsaturated compound) in the photosensitive resin layer is preferably 10% by mass to 70% by mass, preferably 20% by mass to 60% by mass, based on the total mass of the photosensitive resin layer. More preferably, 20% by mass to 50% by mass is further preferable.
  • the photosensitive resin layer preferably contains a photopolymerization initiator.
  • the photopolymerization initiator is a compound that initiates the polymerization of an ethylenically unsaturated compound by receiving active light such as ultraviolet rays, visible light and X-rays.
  • the photopolymerization initiator is not particularly limited, and a known photopolymerization initiator can be used. Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferable.
  • Examples of the photoradical polymerization initiator include a photopolymerization initiator having an oxime ester structure, a photopolymerization initiator having an ⁇ -aminoalkylphenone structure, a photopolymerization initiator having an ⁇ -hydroxyalkylphenone structure, and an acylphosphine oxide. Examples thereof include a photopolymerization initiator having a structure, a photopolymerization initiator having an N-phenylglycine structure, and a biimidazole compound.
  • the photoradical polymerization initiator for example, the polymerization initiator described in paragraphs 0031 to 0042 of JP-A-2011-95716 and paragraphs 0064-0081 of JP-A-2015-14783 may be used.
  • photoradical polymerization initiator examples include ethyl dimethylaminobenzoate (DBE, CAS No. 10287-53-3), benzoin methyl ether, anisyl (p, p'-dimethoxybenzyl), and TAZ-110 (trade name:).
  • photoradical polymerization initiators examples include 1- [4- (phenylthio) phenyl] -1,2-octanedione-2- (O-benzoyloxime) (trade name: IRGACURE (registered trademark) OXE-.
  • the photocationic polymerization initiator is a compound that generates an acid by receiving active light rays.
  • a compound that is sensitive to active light having a wavelength of 300 nm or more, preferably a wavelength of 300 to 450 nm and generates an acid is preferable, but its chemical structure is not limited.
  • a photocationic polymerization initiator that is not directly sensitive to active light with a wavelength of 300 nm or more is also a sensitizer if it is a compound that is sensitive to active light with a wavelength of 300 nm or more and generates an acid when used in combination with a sensitizer. Can be preferably used in combination with.
  • a photocationic polymerization initiator that generates an acid having a pKa of 4 or less is preferable, a photocationic polymerization initiator that generates an acid having a pKa of 3 or less is more preferable, and an acid having a pKa of 2 or less is used.
  • the generated photocationic polymerization initiator is particularly preferred.
  • the lower limit of pKa is not particularly defined, but is preferably -10.0 or higher, for example.
  • Examples of the photocationic polymerization initiator include an ionic photocationic polymerization initiator and a nonionic photocationic polymerization initiator.
  • Examples of the ionic photocationic polymerization initiator include onium salt compounds such as diaryliodonium salts and triarylsulfonium salts, and quaternary ammonium salts.
  • the ionic photocationic polymerization initiator described in paragraphs 0114 to 0133 of JP-A-2014-85643 may be used.
  • nonionic photocationic polymerization initiator examples include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds.
  • trichloromethyl-s-triazines the diazomethane compound and the imide sulfonate compound
  • the compounds described in paragraphs 0083 to 886 of JP-A-2011-22149 may be used.
  • the oxime sulfonate compound the compound described in paragraphs 0084 to 0088 of International Publication No. 2018/179640 may be used.
  • the photosensitive resin layer may contain one type of photopolymerization initiator alone or two or more types.
  • the content of the photopolymerization initiator in the photosensitive resin layer is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, based on the total mass of the photosensitive resin layer. 0% by mass or more is more preferable.
  • the upper limit is not particularly limited, but is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the photosensitive resin layer.
  • the photosensitive resin layer preferably contains a dye from the viewpoints of visibility of the exposed and non-exposed areas, pattern visibility after development, and resolution, and the maximum in the wavelength range of 400 nm to 780 nm at the time of color development. It is more preferable to contain a dye having an absorption wavelength of 450 nm or more and whose maximum absorption wavelength is changed by an acid, a base, or a radical (also referred to simply as “dye N”). When the dye N is contained, the detailed mechanism is unknown, but the adhesion to the adjacent layer (for example, the temporary support and other adjacent layers) is improved, and the resolution is more excellent.
  • the term "the maximum absorption wavelength is changed by an acid, a base or a radical” means that the dye in a color-developing state is decolorized by an acid, a base or a radical, and the dye in a decolorized state is an acid. It may mean any aspect of a mode in which a color is developed by a base or a radical, or a mode in which a dye in a color-developing state changes to a color-developing state of another hue.
  • the dye N may be a compound that changes its color from the decolorized state by exposure and may be a compound that changes its color from the decolorized state by exposure.
  • it may be a dye whose color development or decolorization state is changed by the acid, base or radical generated and acted on in the photosensitive resin layer by exposure, and the state in the photosensitive resin layer by the acid, base or radical. It may be a dye whose color development or decolorization state changes by changing (for example, pH). Further, it may be a dye that changes its color development or decolorization state by directly receiving an acid, a base or a radical as a stimulus without going through exposure.
  • the dye N is preferably a dye whose maximum absorption wavelength is changed by an acid or a radical, and more preferably a dye whose maximum absorption wavelength is changed by a radical, from the viewpoint of visibility and resolution of an exposed portion and a non-exposed portion.
  • the photosensitive resin layer may contain both a dye whose maximum absorption wavelength is changed by radicals as dye N and a photoradical polymerization initiator from the viewpoint of visibility and resolution of exposed and unexposed parts. preferable.
  • the dye N is preferably a dye that develops color by an acid, a base, or a radical.
  • a photoradical polymerization initiator, a photocationic polymerization initiator (photoacid generator) or a photobase generator is added to the photosensitive resin layer, and photoradical polymerization is performed after exposure.
  • a radical-reactive dye, an acid-reactive dye or a base-reactive dye for example, a leuco dye
  • a radical-reactive dye, an acid-reactive dye or a base-reactive dye for example, a leuco dye
  • the dye N preferably has a maximum absorption wavelength of 550 nm or more in the wavelength range of 400 nm to 780 nm at the time of color development, more preferably 550 nm to 700 nm. It is more preferably ⁇ 650 nm. Further, the dye N may have only one maximum absorption wavelength in the wavelength range of 400 nm to 780 nm at the time of color development, or may have two or more. When the dye N has two or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm at the time of color development, the maximum absorption wavelength having the highest absorbance among the two or more maximum absorption wavelengths may be 450 nm or more.
  • the maximum absorption wavelength of the dye N is transmitted through a solution containing the dye N (liquid temperature 25 ° C.) in the range of 400 nm to 780 nm using a spectrophotometer: UV3100 (manufactured by Shimadzu Corporation) in an atmospheric atmosphere. It is obtained by measuring the spectrum and detecting the wavelength at which the light intensity becomes the minimum (maximum absorption wavelength).
  • Examples of the dye that develops or decolorizes by exposure include leuco compounds.
  • Examples of the dye to be decolorized by exposure include leuco compounds, diarylmethane dyes, oxadin dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes and anthraquinone dyes.
  • As the dye N a leuco compound is preferable from the viewpoint of visibility of the exposed portion and the non-exposed portion.
  • the leuco compound examples include a leuco compound having a triarylmethane skeleton (triarylmethane dye), a leuco compound having a spiropyran skeleton (spiropylan dye), a leuco compound having a fluorane skeleton (fluorane dye), and a diarylmethane skeleton.
  • leuco compounds leuco auramine-based dyes
  • triarylmethane-based dyes or fluorane-based dyes are preferable, and leuco compounds (triphenylmethane-based dyes) or fluorane-based dyes having a triphenylmethane skeleton are more preferable.
  • the leuco compound preferably has a lactone ring, a surujin ring, or a sultone ring from the viewpoint of visibility of the exposed portion and the non-exposed portion.
  • the lactone ring, sultin ring, or sulton ring of the leuco compound is reacted with the radical generated from the photoradical polymerization initiator or the acid generated from the photocationic polymerization initiator to change the leuco compound into a closed ring state.
  • the color can be decolorized or the leuco compound can be changed to an open ring state to develop a color.
  • the leuco compound has a lactone ring, a sultone ring or a sultone ring, and a compound in which the lactone ring, the sultone ring or the sultone ring is opened by a radical or an acid to develop color is preferable, and the compound has a lactone ring and is formed by a radical or an acid.
  • a compound in which the lactone ring is opened to develop color is more preferable.
  • dye N examples include the following dyes and leuco compounds. Specific examples of dyes among dyes N include Brilliant Green, Ethyl Violet, Methyl Green, Crystal Violet, Basic Fuxin, Methyl Violet 2B, Kinaldine Red, Rose Bengal, Metanyl Yellow, Timor Sulfophthalein, Xylenol Blue, and Methyl.
  • leuco compound among the dyes N include p, p', p "-hexamethyltriaminotriphenylmethane (leucocrystal violet), Pergascript Blue SRB (manufactured by Ciba Geigy), crystal violet lactone, and malakite green lactone.
  • the dye N is preferably a dye whose maximum absorption wavelength is changed by radicals from the viewpoints of visibility of exposed and unexposed areas, pattern visibility after development, and resolution, and is a dye that develops color by radicals. Is more preferable.
  • As the dye N leuco crystal violet, crystal violet lactone, brilliant green, or Victoria pure blue-naphthalene sulfonate is preferable.
  • the dye may be used alone or in combination of two or more.
  • the content of the dye is preferably 0.1% by mass or more with respect to the total mass of the photosensitive resin layer from the viewpoints of visibility of the exposed and non-exposed areas, pattern visibility after development, and resolution. , 0.1% by mass to 10% by mass, more preferably 0.1% by mass to 5% by mass, and particularly preferably 0.1% by mass to 1% by mass.
  • the content of the dye N is 0.1% by mass with respect to the total mass of the photosensitive resin layer from the viewpoints of visibility of the exposed portion and the non-exposed portion, pattern visibility after development, and resolution.
  • the above is preferable, 0.1% by mass to 10% by mass is more preferable, 0.1% by mass to 5% by mass is further preferable, and 0.1% by mass to 1% by mass is particularly preferable.
  • the content of the dye N means the content of the dye when all of the dye N contained in the photosensitive resin layer is in a colored state.
  • a method for quantifying the content of dye N will be described by taking a dye that develops color by radicals as an example. Two kinds of solutions in which 0.001 g or 0.01 g of the dye is dissolved in 100 mL of methyl ethyl ketone are prepared. Irgacure OXE01 (trade name, BASF Japan, Inc.), a photoradical polymerization initiator, is added to each of the obtained solutions, and radicals are generated by irradiating with light of 365 nm to bring all the dyes into a colored state.
  • the absorbance of each solution having a liquid temperature of 25 ° C. is measured using a spectrophotometer (UV3100, manufactured by Shimadzu Corporation), and a calibration curve is prepared.
  • UV3100 UV3100, manufactured by Shimadzu Corporation
  • the absorbance of the solution in which all the dyes are developed is measured by the same method as above except that 3 g of the photosensitive resin layer is dissolved in methyl ethyl ketone instead of the dye. From the absorbance of the obtained solution containing the photosensitive resin layer, the content of the dye contained in the photosensitive resin layer is calculated based on the calibration curve.
  • the photosensitive resin layer preferably contains a heat-crosslinkable compound from the viewpoint of the strength of the obtained cured film and the adhesiveness of the obtained uncured film.
  • the thermally crosslinkable compound having an ethylenically unsaturated group described later is not treated as a polymerizable compound, but is treated as a thermally crosslinkable compound.
  • the heat-crosslinkable compound include a methylol compound and a blocked isocyanate compound. Of these, a blocked isocyanate compound is preferable from the viewpoint of the strength of the obtained cured film and the adhesiveness of the obtained uncured film.
  • the blocked isocyanate compound reacts with a hydroxy group and a carboxy group, for example, when the resin and / or the polymerizable compound has at least one of the hydroxy group and the carboxy group, the hydrophilicity of the formed film decreases.
  • the blocked isocyanate compound refers to "a compound having a structure in which the isocyanate group of isocyanate is protected (so-called masked) with a blocking agent".
  • the dissociation temperature of the blocked isocyanate compound is not particularly limited, but is preferably 100 ° C to 160 ° C, more preferably 130 ° C to 150 ° C.
  • the dissociation temperature of the blocked isocyanate means "the temperature of the endothermic peak associated with the deprotection reaction of the blocked isocyanate when measured by DSC (Differential scanning calorimetry) analysis using a differential scanning calorimeter".
  • DSC Different scanning calorimeter
  • a differential scanning calorimeter model: DSC6200 manufactured by Seiko Instruments, Inc. can be preferably used.
  • the differential scanning calorimeter is not limited to this.
  • the blocking agent having a dissociation temperature of 100 ° C. to 160 ° C. examples include active methylene compounds [malonic acid diester (dimethyl malonate, diethyl malonate, din-butyl malonate, di2-ethylhexyl malonic acid, etc.)] and oxime compounds.
  • the blocking agent having a dissociation temperature of 100 ° C. to 160 ° C. preferably contains, for example, an oxime compound from the viewpoint of storage stability.
  • the blocked isocyanate compound preferably has an isocyanurate structure, for example, from the viewpoint of improving the brittleness of the membrane and improving the adhesion to the transferred body.
  • the blocked isocyanate compound having an isocyanurate structure can be obtained, for example, by subjecting hexamethylene diisocyanate to isocyanurate to protect it.
  • the compound having an oxime structure using an oxime compound as a blocking agent is easier to set the dissociation temperature in a preferable range and reduces the development residue than the compound having no oxime structure. It is preferable from the viewpoint of ease.
  • the blocked isocyanate compound may have a polymerizable group.
  • the polymerizable group is not particularly limited, and a known polymerizable group can be used, and a radically polymerizable group is preferable.
  • the polymerizable group include an ethylenically unsaturated group such as a (meth) acryloxy group, a (meth) acrylamide group and a styryl group, and a group having an epoxy group such as a glycidyl group.
  • an ethylenically unsaturated group is preferable, a (meth) acryloxy group is more preferable, and an acryloxy group is further preferable.
  • blocked isocyanate compound a commercially available product can be used.
  • examples of commercially available blocked isocyanate compounds include Karenz (registered trademark) AOI-BM, Karenz (registered trademark) MOI-BM, Karenz (registered trademark) MOI-BP (all manufactured by Showa Denko KK), and blocks.
  • examples thereof include the Duranate series of molds (for example, Duranate (registered trademark) TPA-B80E, Duranate (registered trademark) WT32-B75P, etc., manufactured by Asahi Kasei Chemicals Co., Ltd.).
  • the blocked isocyanate compound a compound having the following structure can also be used.
  • the heat-crosslinkable compound may be used alone or in combination of two or more.
  • the content of the heat-crosslinkable compound is preferably 1% by mass to 50% by mass, preferably 5% by mass to 30% by mass, based on the total mass of the photosensitive resin layer. Is more preferable.
  • the photosensitive resin layer may contain components other than the above-mentioned alkali-soluble resin, ethylenically unsaturated compound, photopolymerization initiator, dye, and heat-crosslinkable compound.
  • the photosensitive resin layer preferably contains a surfactant from the viewpoint of thickness uniformity.
  • the surfactant include anionic surfactants, cationic surfactants, nonionic (nonionic) surfactants, and amphoteric surfactants, and nonionic surfactants are preferable.
  • the surfactant include paragraphs 0017 of Japanese Patent No. 4502784 and paragraphs 0060 to 0071 of Japanese Patent Application Laid-Open No. 2009-237362.
  • a fluorine-based surfactant or a silicone-based surfactant is preferable.
  • Commercially available products of fluorine-based surfactants include, for example, Megafuck (trade names) F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143.
  • the fluorine-based surfactant has a molecular structure having a functional group containing a fluorine atom, and an acrylic compound in which a portion of the functional group containing a fluorine atom is cut off and the fluorine atom volatilizes when heat is applied. Can be suitably used.
  • Megafuck (trade name) DS series manufactured by DIC Corporation (The Chemical Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016))
  • Megafuck (trade name) DS-21 can be mentioned.
  • the fluorine-based surfactant it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound.
  • a block polymer can also be used.
  • the fluorine-based surfactant has a structural unit derived from a (meth) acrylate compound having a fluorine atom and 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy groups and propyleneoxy groups) (meth).
  • a fluorine-containing polymer compound containing a structural unit derived from an acrylate compound can also be preferably used.
  • fluorine-based surfactant a fluorine-containing polymer having an ethylenically unsaturated group in the side chain can also be used. Megafuck (trade name) RS-101, RS-102, RS-718K, RS-72-K (all manufactured by DIC Corporation) and the like can be mentioned.
  • Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (eg, glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ethers, polyoxyethylene stearyl ethers, etc.
  • fluorine-based surfactant from the viewpoint of improving environmental suitability, compounds having a linear perfluoroalkyl group having 7 or more carbon atoms, such as perfluorooctanoic acid (PFOA) and perfluorooctanesulfonic acid (PFOS), may be used. It is preferably a surfactant derived from an alternative material.
  • PFOA perfluorooctanoic acid
  • PFOS perfluorooctanesulfonic acid
  • silicone-based surfactant examples include a linear polymer composed of a siloxane bond and a modified siloxane polymer having an organic group introduced into a side chain or a terminal.
  • Specific examples of the silicone-based surfactant include EXP. S-309-2, EXP. S-315, EXP. S-503-2, EXP.
  • the photosensitive resin layer may contain one type of surfactant alone or two or more types.
  • the content of the surfactant is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass, based on the total mass of the photosensitive resin layer.
  • the photosensitive resin layer may contain known additives, if necessary.
  • the additive include a polymerization inhibitor, a sensitizer, a plasticizer, a heterocyclic compound, benzotriazoles, carboxybenzotriazoles, pyridines (isonicotinamide, etc.), purine bases (adenine, etc.), and a solvent.
  • the photosensitive resin layer may contain one type of each additive alone, or may contain two or more types of each additive.
  • the photosensitive resin layer may contain a polymerization inhibitor.
  • a radical polymerization inhibitor is preferable.
  • the polymerization inhibitor include the thermal polymerization inhibitor described in paragraph 0018 of Japanese Patent No. 4502784. Of these, phenothiazine, phenoxazine or 4-methoxyphenol is preferable.
  • other polymerization inhibitors include naphthylamine, cuprous chloride, nitrosophenylhydroxyamine aluminum salt, diphenylnitrosamine and the like. It is preferable to use a nitrosophenylhydroxyamine aluminum salt as a polymerization inhibitor so as not to impair the sensitivity of the photosensitive resin composition.
  • benzotriazoles include 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, bis (N-2-ethylhexyl) aminomethylene-1,2,3-benzotriazole, and the like. Examples thereof include bis (N-2-ethylhexyl) aminomethylene-1,2,3-triltriazole, bis (N-2-hydroxyethyl) aminomethylene-1,2,3-benzotriazole and the like.
  • carboxybenzotriazoles examples include 4-carboxy-1,2,3-benzotriazole, 5-carboxy-1,2,3-benzotriazole, and N- (N, N-di-2-ethylhexyl) aminomethylene. Examples thereof include carboxybenzotriazole, N- (N, N-di-2-hydroxyethyl) aminomethylenecarboxybenzotriazole, N- (N, N-di-2-ethylhexyl) aminoethylenecarboxybenzotriazole and the like.
  • a commercially available product such as CBT-1 (manufactured by Johoku Chemical Industry Co., Ltd., trade name) can be used.
  • the total content of the polymerization inhibitor, benzotriazols, and carboxybenzotriazols is preferably 0.01% by mass to 3% by mass, based on the total mass of the photosensitive resin layer. It is more preferably 05% by mass to 1% by mass. It is preferable that the content is 0.01% by mass or more from the viewpoint of imparting storage stability to the photosensitive resin composition. On the other hand, it is preferable to set the content to 3% by mass or less from the viewpoint of maintaining the sensitivity and suppressing the decolorization of the dye.
  • the photosensitive resin layer may contain a sensitizer.
  • the sensitizer is not particularly limited, and known sensitizers, dyes and pigments can be used.
  • Examples of the sensitizer include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, and triazole compounds (for example,). 1,2,4-triazole), stylben compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridin compounds.
  • the photosensitive resin layer may contain one type of sensitizer alone, or may contain two or more types of sensitizer.
  • the content of the sensitizer can be appropriately selected depending on the purpose, but from the viewpoint of improving the sensitivity to the light source and improving the curing rate by balancing the polymerization rate and the chain transfer. Therefore, 0.01% by mass to 5% by mass is preferable, and 0.05% by mass to 1% by mass is more preferable with respect to the total mass of the photosensitive resin layer.
  • the photosensitive resin layer may contain at least one selected from the group consisting of a plasticizer and a heterocyclic compound.
  • a plasticizer and a heterocyclic compound include the compounds described in paragraphs 097 to 0103 and 0111 to 0118 of International Publication No. 2018/179640.
  • the photosensitive resin layer may contain a solvent.
  • the solvent may remain in the photosensitive resin layer.
  • the photosensitive resin layer includes metal oxide particles, antioxidants, dispersants, acid growth agents, development accelerators, conductive fibers, thermal radical polymerization initiators, thermal acid generators, ultraviolet absorbers, and thickeners. , Cross-linking agents, and known additives such as organic or inorganic anti-precipitation agents may be further contained. Additives contained in the photosensitive resin layer are described in paragraphs 0165 to 0184 of JP-A-2014-85643, and the contents of this publication are incorporated in the present specification.
  • the photosensitive resin layer may contain a predetermined amount of impurities.
  • impurities include sodium, potassium, magnesium, calcium, iron, manganese, copper, aluminum, titanium, chromium, cobalt, nickel, zinc, tin, halogen and ions thereof.
  • halide ions, sodium ions, and potassium ions are likely to be mixed as impurities, so the following content is preferable.
  • the content of impurities in the photosensitive resin layer is preferably 80 ppm or less, more preferably 10 ppm or less, still more preferably 2 ppm or less on a mass basis.
  • the content of impurities may be 1 ppb or more, or 0.1 ppm or more, on a mass basis.
  • Examples of the method for keeping impurities within the above range include selecting a raw material for the composition having a low content of impurities, preventing contamination of the photosensitive resin layer at the time of producing the photosensitive resin layer, and cleaning and removing the impurities. Be done. By such a method, the amount of impurities can be kept within the above range.
  • Impurities can be quantified by known methods such as ICP (Inductively Coupled Plasma) emission spectroscopy, atomic absorption spectroscopy, and ion chromatography.
  • ICP Inductively Coupled Plasma
  • the content of compounds such as benzene, formaldehyde, trichlorethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N, N-dimethylformamide, N, N-dimethylacetamide, and hexane in the photosensitive resin layer may be low. preferable.
  • the content of these compounds with respect to the total mass of the photosensitive resin layer is preferably 100 ppm or less, more preferably 20 ppm or less, still more preferably 4 ppm or less on a mass basis.
  • the lower limit can be 10 ppb or more and 100 ppb or more with respect to the total mass of the photosensitive resin layer on a mass basis.
  • the content of these compounds can be suppressed in the same manner as the above-mentioned metal impurities. Further, it can be quantified by a known measurement method.
  • the water content in the photosensitive resin layer is preferably 0.01% by mass to 1.0% by mass, more preferably 0.05% by mass to 0.5% by mass, from the viewpoint of improving reliability and laminating property. ..
  • the photosensitive resin layer may contain a residual monomer corresponding to each structural unit of the alkali-soluble resin described above.
  • the content of the residual monomer is preferably 5,000 mass ppm or less, more preferably 2,000 mass ppm or less, and 500 mass ppm or less with respect to the total mass of the alkali-soluble resin from the viewpoint of patterning property and reliability. Is more preferable.
  • the lower limit is not particularly limited, but 1 mass ppm or more is preferable, and 10 mass ppm or more is more preferable.
  • the residual monomer of each structural unit of the alkali-soluble resin is preferably 3,000 mass ppm or less, more preferably 600 mass ppm or less, based on the total mass of the photosensitive resin layer from the viewpoint of patterning property and reliability. , 100 mass ppm or less is more preferable.
  • the lower limit is not particularly limited, but is preferably 0.1 mass ppm or more, and more preferably 1 mass ppm or more.
  • the amount of residual monomer of the monomer when synthesizing the alkali-soluble resin by the polymer reaction is also preferably in the above range.
  • the content of glycidyl acrylate is preferably in the above range.
  • the amount of the residual monomer can be measured by a known method such as liquid chromatography and gas chromatography.
  • the thickness of the photosensitive resin layer is preferably 0.1 ⁇ m to 300 ⁇ m, more preferably 0.2 ⁇ m to 100 ⁇ m, further preferably 0.5 ⁇ m to 50 ⁇ m, further preferably 0.5 ⁇ m to 15 ⁇ m, and even more preferably 0.5 ⁇ m to 10 ⁇ m. Is particularly preferable, and 0.5 ⁇ m to 8 ⁇ m is most preferable. As a result, the developability of the photosensitive resin layer is improved, and the resolvability can be improved. Further, in one embodiment, 0.5 ⁇ m to 5 ⁇ m is preferable, 0.5 ⁇ m to 4 ⁇ m is more preferable, and 0.5 ⁇ m to 3 ⁇ m is further preferable.
  • the layer thickness of the photosensitive resin layer is preferably 10 ⁇ m or less, more preferably 8 ⁇ m or less, from the viewpoint of resolvability.
  • the layer thickness of each layer of the photosensitive transfer material is based on the observation image obtained by observing the cross section in the direction perpendicular to the main surface of the photosensitive transfer material with a scanning electron microscope (SEM). It is measured by measuring the thickness of each layer at 10 points or more and calculating the average value thereof.
  • the transmittance of light having a wavelength of 365 nm in the photosensitive resin layer is preferably 10% or more, preferably 30% or more, and more preferably 50% or more.
  • the upper limit is not particularly limited, but is preferably 99.9% or less.
  • the method for forming the photosensitive resin layer is not particularly limited as long as it is a method capable of forming a layer containing the above components.
  • a method for forming the photosensitive resin layer for example, a photosensitive resin composition containing an alkali-soluble resin, an ethylenically unsaturated compound, a photopolymerization initiator, a solvent and the like is prepared, and the surface of the temporary support or the like is photosensitive. Examples thereof include a method of applying the resin composition and drying the coating film of the photosensitive resin composition to form the resin composition.
  • Examples of the photosensitive resin composition used for forming the photosensitive resin layer include a composition containing an alkali-soluble resin, an ethylenically unsaturated compound, a photopolymerization initiator, the above-mentioned optional components and a solvent.
  • the photosensitive resin composition preferably contains a solvent in order to adjust the viscosity of the photosensitive resin composition and facilitate the formation of the photosensitive resin layer.
  • the solvent contained in the photosensitive resin composition is not particularly limited as long as it can dissolve or disperse an alkali-soluble resin, an ethylenically unsaturated compound, a photopolymerization initiator and the above optional components, and a known solvent is used. can.
  • the solvent include an alkylene glycol ether solvent, an alkylene glycol ether acetate solvent, an alcohol solvent (methanol, ethanol, etc.), a ketone solvent (acetone, methyl ethyl ketone, etc.), an aromatic hydrocarbon solvent (toluene, etc.), and an aprotonic polar solvent.
  • the photosensitive resin composition is prepared from an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. It is preferable to contain at least one selected from the group.
  • a mixed solvent containing at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent and at least one selected from the group consisting of a ketone solvent and a cyclic ether solvent is more preferable.
  • a mixed solvent containing at least one selected from the group consisting of a glycol ether solvent and an alkylene glycol ether acetate solvent, a ketone solvent, and at least three types of a cyclic ether solvent is more preferable.
  • alkylene glycol ether solvent examples include ethylene glycol monoalkyl ether, ethylene glycol dialkyl ether, propylene glycol monoalkyl ether, propylene glycol dialkyl ether, diethylene glycol dialkyl ether, dipropylene glycol monoalkyl ether and dipropylene glycol dialkyl ether. ..
  • alkylene glycol ether acetate solvent examples include ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate and dipropylene glycol monoalkyl ether acetate.
  • the solvent described in paragraphs 0092 to 0094 of International Publication No. 2018/179640 and the solvent described in paragraph 0014 of JP-A-2018-177789 may be used, and the contents thereof are described in the present specification. Incorporated into the book.
  • the photosensitive resin composition may contain one type of solvent alone, or may contain two or more types of solvent.
  • the content of the solvent when the photosensitive resin composition is applied is preferably 50 parts by mass to 1,900 parts by mass, preferably 100 parts by mass to 900 parts by mass with respect to 100 parts by mass of the total solid content in the photosensitive resin composition. The part is more preferable.
  • the method for preparing the photosensitive resin composition is not particularly limited. For example, a solution in which each component is dissolved in the above solvent is prepared in advance, and the obtained solution is mixed at a predetermined ratio to prepare the photosensitive resin composition. There is a method of preparing.
  • the photosensitive resin composition is preferably filtered using a filter having a pore size of 0.2 ⁇ m to 30 ⁇ m before forming the photosensitive resin layer.
  • the method for applying the photosensitive resin composition is not particularly limited, and the photosensitive resin composition may be applied by a known method. Examples of the coating method include slit coating, spin coating, curtain coating and inkjet coating. Further, the photosensitive resin layer may be formed by applying the photosensitive resin composition on a protective film described later and drying it.
  • the photosensitive transfer material in the present disclosure preferably has another layer between the temporary support and the photosensitive resin layer from the viewpoint of resolution and peelability of the temporary support. ..
  • a thermoplastic resin layer, a water-soluble resin layer and the like are preferably mentioned. Above all, it is preferable to have a thermoplastic resin layer and a water-soluble resin layer as the other layers.
  • the photosensitive transfer material according to the present disclosure may have a thermoplastic resin layer.
  • the photosensitive transfer material preferably has a thermoplastic resin layer between the temporary support and the photosensitive resin layer.
  • the photosensitive transfer material has improved followability to the adherend, and bubbles between the adherend and the photosensitive transfer material are improved. This is because the adhesion between the layers is improved as a result of suppressing the mixing.
  • the thermoplastic resin layer preferably contains an alkali-soluble resin as the thermoplastic resin.
  • alkali-soluble resin examples include acrylic resin, polystyrene resin, styrene-acrylic copolymer, polyurethane resin, polyvinyl alcohol, polyvinyl formal, polyamide resin, polyester resin, polyamide resin, epoxy resin, polyacetal resin, and polyhydroxystyrene resin.
  • alkali-soluble resin examples include acrylic resin, polystyrene resin, styrene-acrylic copolymer, polyurethane resin, polyvinyl alcohol, polyvinyl formal, polyamide resin, polyester resin, polyamide resin, epoxy resin, polyacetal resin, and polyhydroxystyrene resin.
  • examples thereof include polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimines, polyallylamines, and polyalkylene glycols.
  • the alkali-soluble resin is preferably an acrylic resin from the viewpoint of developability and adhesion to the layer adjacent to the thermoplastic resin layer.
  • the "acrylic resin” is selected from the group consisting of a structural unit derived from (meth) acrylic acid, a structural unit derived from (meth) acrylic acid ester, and a structural unit derived from (meth) acrylic acid amide. It means a resin having at least one kind.
  • the ratio of the total content of the structural unit derived from (meth) acrylic acid, the structural unit derived from (meth) acrylic acid ester, and the structural unit derived from (meth) acrylic acid amide is the ratio of the total content of the acrylic resin. It is preferably 50% by mass or more with respect to the total mass.
  • the ratio of the total content of the structural unit derived from (meth) acrylic acid and the structural unit derived from (meth) acrylic acid ester is 30% by mass to 100% by mass with respect to the total mass of the acrylic resin. %, More preferably 50% by mass to 100% by mass.
  • the alkali-soluble resin is preferably a polymer having an acid group.
  • the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group, and a carboxy group is preferable.
  • the alkali-soluble resin is preferably an alkali-soluble resin having an acid value of 60 mgKOH / g or more, and more preferably a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more.
  • the upper limit of acid value is not limited.
  • the acid value of the alkali-soluble resin is preferably 200 mgKOH / g or less, and more preferably 150 mgKOH / g or less.
  • the carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more is not limited and can be appropriately selected from known resins and used.
  • Examples of the carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more include a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more among the polymers described in paragraph 0025 of JP-A-2011-95716.
  • a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more can be mentioned.
  • the content ratio of the structural unit having a carboxy group in the carboxy group-containing acrylic resin is preferably 5% by mass to 50% by mass, preferably 10% by mass to 40% by mass, based on the total mass of the carboxy group-containing acrylic resin. It is more preferable to have it, and it is particularly preferable that it is 12% by mass to 30% by mass.
  • the alkali-soluble resin is particularly preferably an acrylic resin having a structural unit derived from (meth) acrylic acid from the viewpoint of developability and adhesion to a layer adjacent to the thermoplastic resin layer.
  • the alkali-soluble resin may have a reactive group.
  • the reactive group may be, for example, a group capable of addition polymerization.
  • examples of the reactive group include an ethylenically unsaturated group, a polycondensable group (for example, a hydroxy group and a carboxy group), and a polyaddition reactive group (for example, an epoxy group and a (block) isocyanate group). Be done.
  • the weight average molecular weight (Mw) of the alkali-soluble resin is preferably 1,000 or more, more preferably 10,000 to 100,000, and particularly preferably 20,000 to 50,000.
  • the thermoplastic resin layer may contain one kind alone or two or more kinds of alkali-soluble resins.
  • the content ratio of the alkali-soluble resin may be 10% by mass to 99% by mass with respect to the total mass of the thermoplastic resin layer from the viewpoint of developability and adhesion to the layer adjacent to the thermoplastic resin layer. It is preferably 20% by mass to 90% by mass, more preferably 40% by mass to 80% by mass, and particularly preferably 50% by mass to 70% by mass.
  • the thermoplastic resin layer has a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 nm to 780 nm at the time of color development, and the maximum absorption wavelength is changed by an acid, a base, or a radical (hereinafter referred to as “dye B”). In some cases), it is preferable to include.
  • the preferred embodiment of the dye B is the same as the preferred embodiment of the dye N described above, except for the points described later.
  • the dye B is preferably a dye whose maximum absorption wavelength is changed by an acid or a radical from the viewpoints of visibility of the exposed portion, visibility of the unexposed portion, and resolution, and the maximum absorption wavelength is changed by the acid. It is more preferable that the dye is a radical.
  • the thermoplastic resin layer is a dye whose maximum absorption wavelength is changed by an acid as the dye B and a compound which generates an acid by light, which will be described later, from the viewpoints of the visibility of the exposed part, the visibility of the non-exposed part, and the resolution. And, preferably.
  • the thermoplastic resin layer may contain one type alone or two or more types of dye B.
  • the content ratio of the dye B is preferably 0.2% by mass or more, preferably 0.2% by mass, based on the total mass of the thermoplastic resin layer from the viewpoint of the visibility of the exposed portion and the visibility of the non-exposed portion. It is more preferably% to 6% by mass, further preferably 0.2% by mass to 5% by mass, and particularly preferably 0.25% by mass to 3.0% by mass.
  • the content ratio of the dye B means the content ratio of the dye when all of the dye B contained in the thermoplastic resin layer is in a colored state.
  • a method for quantifying the content ratio of the dye B will be described by taking a dye that develops color by radicals as an example. Two solutions are prepared by dissolving the dye (0.001 g) and the dye (0.01 g) in methyl ethyl ketone (100 mL). IRGACURE OXE-01 (BASF) is added to each of the obtained solutions as a photoradical polymerization initiator, and then radicals are generated by irradiating with light of 365 nm to bring all the dyes into a colored state.
  • IRGACURE OXE-01 BASF
  • the absorbance of each solution having a liquid temperature of 25 ° C. is measured using a spectrophotometer (UV3100, Shimadzu Corporation) to prepare a calibration curve.
  • the absorbance of the solution in which all the dyes are colored is measured by the same method as above except that the thermoplastic resin layer (0.1 g) is dissolved in methyl ethyl ketone instead of the dye. From the absorbance of the obtained solution containing the thermoplastic resin layer, the amount of the dye contained in the thermoplastic resin layer is calculated based on the calibration curve.
  • the thermoplastic resin layer may contain a compound that generates an acid, a base, or a radical by light (hereinafter, may be referred to as "compound C").
  • Compound C is preferably a compound that receives active light rays (for example, ultraviolet rays and visible light rays) to generate an acid, a base, or a radical.
  • active light rays for example, ultraviolet rays and visible light rays
  • Examples of the compound C include known photoacid generators, photobase generators, and photoradical polymerization initiators (photoradical generators).
  • Compound C is preferably a photoacid generator.
  • the thermoplastic resin layer preferably contains a photoacid generator from the viewpoint of resolution.
  • the photoacid generator include a photocationic polymerization initiator that may be contained in the negative-type photosensitive resin layer described above, and the same preferred embodiments are used except for the points described below.
  • the photoacid generator preferably contains at least one selected from the group consisting of onium salt compounds and oxime sulfonate compounds, and has sensitivity, resolution and adhesion. From the viewpoint, it is more preferable to contain an oxime sulfonate compound.
  • the photoacid generator is a photoacid generator having the following structure.
  • the thermoplastic resin layer may contain a photobase generator.
  • the photobase generator include 2-nitrobenzylcyclohexylcarbamate, triphenylmethanol, O-carbamoylhydroxylamide, O-carbamoyloxime, [[(2,6-dinitrobenzyl) oxy] carbonyl] cyclohexylamine, and bis [ [(2-Nitrobenzyl) Oxy] carbonyl] Hexane 1,6-diamine, 4- (methylthiobenzoyl) -1-methyl-1-morpholinoetan, (4-morpholinobenzoyl) -1-benzyl-1-dimethylaminopropane , N- (2-nitrobenzyloxycarbonyl) pyrrolidine, hexaammine cobalt (III) tris (triphenylmethylborate), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2,6 -Dimethyl-3
  • the thermoplastic resin layer may contain a photoradical polymerization initiator.
  • the photoradical polymerization initiator include a photoradical polymerization initiator that may be contained in the above-mentioned negative photosensitive resin layer, and the preferred embodiment is also the same.
  • the thermoplastic resin layer may contain one kind alone or two or more kinds of compound C.
  • the content ratio of the compound C is 0.1% by mass to 10% by mass with respect to the total mass of the thermoplastic resin layer from the viewpoint of the visibility of the exposed portion, the visibility of the non-exposed portion, and the resolution. It is preferably 0.5% by mass to 5% by mass, and more preferably 0.5% by mass.
  • the thermoplastic resin layer preferably contains a plasticizer from the viewpoints of resolution, adhesion to a layer adjacent to the thermoplastic resin layer, and developability.
  • the molecular weight of the plasticizer (the molecular weight of the oligomer or polymer is the weight average molecular weight (Mw); the same applies hereinafter in this paragraph) is preferably smaller than the molecular weight of the alkali-soluble resin.
  • the molecular weight of the plasticizer is preferably 200 to 2,000.
  • the plasticizer is not limited as long as it is a compound that develops plasticity by being compatible with an alkali-soluble resin. From the viewpoint of imparting plasticity, the plasticizer is preferably a compound having an alkyleneoxy group in the molecule, and more preferably a polyalkylene glycol compound.
  • the alkyleneoxy group contained in the plasticizer preferably has a polyethyleneoxy structure or a polypropyleneoxy structure.
  • the plasticizer preferably contains a (meth) acrylate compound from the viewpoint of resolution and storage stability. From the viewpoint of compatibility, resolution, and adhesion to the layer adjacent to the thermoplastic resin layer, it is more preferable that the alkali-soluble resin is an acrylic resin and the plasticizer contains a (meth) acrylate compound.
  • thermoplastic resin layer and the negative type photosensitive resin layer are arranged in direct contact with each other, the thermoplastic resin layer and the negative type photosensitive resin layer are each the same (meth) acrylate compound. It is preferable to include. This is because the thermoplastic resin layer and the negative photosensitive resin layer each contain the same (meth) acrylate compound, so that the diffusion of components between the layers is suppressed and the storage stability is improved.
  • the thermoplastic resin layer contains a (meth) acrylate compound as a plasticizer
  • the (meth) acrylate compound may not polymerize even in the exposed portion after exposure from the viewpoint of adhesion to the layer adjacent to the thermoplastic resin layer. preferable.
  • the (meth) acrylate compound used as a plasticizer has two or more (meth) acrylate compounds in one molecule from the viewpoints of resolution, adhesion to a layer adjacent to the thermoplastic resin layer, and developability. It is preferably a (meth) acrylate compound having a (meth) acryloyl group.
  • the (meth) acrylate compound used as a plasticizer is preferably a (meth) acrylate compound having an acid group or a urethane (meth) acrylate compound.
  • thermoplastic resin layer may contain one type alone or two or more types of plasticizer.
  • the content ratio of the plasticizer is 1% by mass to 70% by mass with respect to the total mass of the thermoplastic resin layer from the viewpoints of resolution, adhesion to the layer adjacent to the thermoplastic resin layer, and developability. It is preferably present, more preferably 10% by mass to 60% by mass, and particularly preferably 20% by mass to 50% by mass.
  • the thermoplastic resin layer preferably contains a surfactant from the viewpoint of thickness uniformity.
  • the surfactant include a surfactant that may be contained in the negative photosensitive resin layer described above, and the preferred embodiment is also the same.
  • thermoplastic resin layer may contain one type alone or two or more types of surfactants.
  • the content ratio of the surfactant is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass, based on the total mass of the thermoplastic resin layer.
  • the thermoplastic resin layer may contain a sensitizer.
  • the sensitizer include the sensitizer that may be contained in the negative photosensitive resin layer described above.
  • thermoplastic resin layer may contain one type alone or two or more types of sensitizers.
  • the content ratio of the sensitizer is 0.01% by mass to 5% by mass with respect to the total mass of the thermoplastic resin layer from the viewpoint of improving the sensitivity to the light source, the visibility of the exposed portion, and the visibility of the non-exposed portion. %, More preferably 0.05% by mass to 1% by mass.
  • thermoplastic resin layer may contain known additives in addition to the above components, if necessary.
  • thermoplastic resin layer is described in paragraphs 0189 to 0193 of JP-A-2014-85643. The contents of the above gazette are incorporated herein by reference.
  • the thickness of the thermoplastic resin layer is not limited.
  • the average thickness of the thermoplastic resin layer is preferably 1 ⁇ m or more, and more preferably 2 ⁇ m or more, from the viewpoint of adhesion to the layer adjacent to the thermoplastic resin layer.
  • the upper limit of the average thickness of the thermoplastic resin layer is not limited. From the viewpoint of developability and resolvability, the average thickness of the thermoplastic resin layer is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, and particularly preferably 5 ⁇ m or less.
  • the method for forming the thermoplastic resin layer is not limited as long as it is a method capable of forming a layer containing the above components.
  • Examples of the method for forming the thermoplastic resin layer include a method in which the thermoplastic resin composition is applied to the surface of the temporary support and the coating film of the thermoplastic resin composition is dried.
  • thermoplastic resin composition examples include compositions containing the above components.
  • the thermoplastic resin composition preferably contains a solvent in order to adjust the viscosity of the thermoplastic resin composition and facilitate the formation of the thermoplastic resin layer.
  • the solvent contained in the thermoplastic resin composition is not limited as long as it is a solvent capable of dissolving or dispersing the components contained in the thermoplastic resin layer.
  • the solvent include a solvent that may be contained in the above-mentioned photosensitive resin composition, and the preferred embodiment is also the same.
  • thermoplastic resin composition may contain one kind alone or two or more kinds of solvents.
  • the content ratio of the solvent in the thermoplastic resin composition is preferably 50 parts by mass to 1,900 parts by mass, and 100 parts by mass to 900 parts by mass with respect to 100 parts by mass of the total solid content in the thermoplastic resin composition. It is more preferable that it is a part.
  • thermoplastic resin composition The preparation of the thermoplastic resin composition and the formation of the thermoplastic resin layer may be carried out according to the above-mentioned method for preparing the photosensitive resin composition and the method for forming the photosensitive resin layer.
  • a thermoplastic resin composition was prepared by preparing a solution in which each component contained in the thermoplastic resin layer was dissolved in a solvent in advance and mixing the obtained solutions in a predetermined ratio, and then obtained.
  • the thermoplastic resin layer can be formed by applying the thermoplastic resin composition to the surface of the temporary support and drying the coating film of the thermoplastic resin composition. Further, after forming the photosensitive resin layer on the protective film, the thermoplastic resin layer may be formed on the surface of the photosensitive resin layer.
  • the photosensitive transfer material preferably has a water-soluble resin layer between the thermoplastic resin layer and the photosensitive resin layer. According to the water-soluble resin layer, it is possible to suppress the mixing of components when forming a plurality of layers and during storage.
  • the water-soluble resin layer is preferably a water-soluble layer from the viewpoint of developability and suppressing mixing of components during application of a plurality of layers and storage after application.
  • water-soluble means that the solubility in 100 g of water having a liquid temperature of 22 ° C. and a pH of 7.0 is 0.1 g or more.
  • the water-soluble resin layer examples include an oxygen blocking layer having an oxygen blocking function, which is described as a “separation layer” in JP-A-5-72724. Since the water-soluble resin layer is an oxygen blocking layer, the sensitivity at the time of exposure is improved, the time load of the exposure machine is reduced, and as a result, the productivity is improved.
  • the oxygen blocking layer used as the water-soluble resin layer may be appropriately selected from known layers.
  • the oxygen blocking layer used as the water-soluble resin layer is preferably an oxygen blocking layer that exhibits low oxygen permeability and is dispersed or dissolved in water or an alkaline aqueous solution (1% by mass aqueous solution of sodium carbonate at 22 ° C.). ..
  • the water-soluble resin layer preferably contains a resin.
  • the resin contained in the water-soluble resin layer include polyvinyl alcohol-based resin, polyvinylpyrrolidone-based resin, cellulose-based resin, acrylamide-based resin, polyethylene oxide-based resin, gelatin, vinyl ether-based resin, polyamide resin, and their co-weight. Coalescence is mentioned.
  • the resin contained in the water-soluble resin layer is preferably a water-soluble resin.
  • the resin contained in the water-soluble resin layer is the polymer A contained in the negative photosensitive resin layer and the thermoplastic resin (alkali soluble) contained in the thermoplastic resin layer from the viewpoint of suppressing the mixing of the components between the plurality of layers. It is preferable that the resin is different from any of the resins).
  • the water-soluble resin layer preferably contains polyvinyl alcohol, and contains polyvinyl alcohol and polyvinylpyrrolidone, from the viewpoint of oxygen blocking property and suppressing mixing of components during application and storage after application. It is more preferable to include it.
  • the water-soluble resin layer may contain one kind of resin alone or two or more kinds of resins.
  • the content ratio of the resin in the water-soluble resin layer is based on the total mass of the water-soluble resin layer from the viewpoint of oxygen blocking property and suppressing mixing of components during application of a plurality of layers and storage after application. , 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, further preferably 80% by mass to 100% by mass, and 90% by mass to 100% by mass. It is particularly preferable to have.
  • the water-soluble resin layer may contain an additive if necessary.
  • the additive include a surfactant.
  • the thickness of the water-soluble resin layer is not limited.
  • the average thickness of the water-soluble resin layer is preferably 0.1 ⁇ m to 5 ⁇ m, more preferably 0.5 ⁇ m to 3 ⁇ m.
  • the oxygen barrier property is not deteriorated, the mixing of components during formation of a plurality of layers and storage can be suppressed, and the mixing of components during development can be suppressed. It is possible to suppress an increase in the removal time of the water-soluble resin layer.
  • the method for forming the water-soluble resin layer is not limited as long as it is a method capable of forming a layer containing the above components.
  • a method for forming the water-soluble resin layer for example, the composition for the water-soluble resin layer is applied to the surface of the thermoplastic resin layer or the negative photosensitive resin layer, and then the coating film of the composition for the water-soluble resin layer is applied. There is a method of drying.
  • compositions for the water-soluble resin layer include a resin and a composition containing any additive.
  • the composition for the water-soluble resin layer preferably contains a solvent in order to adjust the viscosity of the composition for the water-soluble resin layer and facilitate the formation of the water-soluble resin layer.
  • the solvent is not limited as long as it is a solvent that can dissolve or disperse the resin.
  • the solvent is preferably at least one selected from the group consisting of water and a water-miscible organic solvent, and more preferably water or a mixed solvent of water and a water-miscible organic solvent.
  • water-miscible organic solvent examples include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin.
  • the water-miscible organic solvent is preferably an alcohol having 1 to 3 carbon atoms, and more preferably methanol or ethanol.
  • the photosensitive transfer material may include a layer other than the above-mentioned layer (hereinafter, also referred to as “other layer”).
  • other layers include a contrast enhancement layer.
  • the contrast enhancement layer is described in paragraph 0134 of WO 2018/179640. Further, the other layers are described in paragraphs 0194 to 0196 of JP-A-2014-85643. The contents of these publications are incorporated herein.
  • the total thickness of the photosensitive transfer material is preferably 5 ⁇ m to 55 ⁇ m, more preferably 10 ⁇ m to 50 ⁇ m, and particularly preferably 20 ⁇ m to 40 ⁇ m.
  • the total thickness of the photosensitive transfer material is measured by a method according to the above-mentioned method for measuring the thickness of each layer.
  • the total thickness of each layer of the photosensitive transfer material excluding the temporary support and the protective film is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, and 8 ⁇ m or less from the viewpoint of further exerting the effect in the present disclosure. It is more preferably 2 ⁇ m or more and 8 ⁇ m or less.
  • the total thickness of the photosensitive resin layer, the water-soluble resin layer and the thermoplastic resin layer in the photosensitive transfer material is preferably 20 ⁇ m or less, preferably 10 ⁇ m or less, from the viewpoint of further exerting the effect in the present disclosure. Is more preferable, and it is more preferably 8 ⁇ m or less, and particularly preferably 2 ⁇ m or more and 8 ⁇ m or less.
  • the method for producing the photosensitive transfer material according to the present disclosure is not particularly limited, and a known production method, for example, a known method for forming each layer can be used.
  • a method for producing a photosensitive transfer material according to the present disclosure will be described with reference to FIG. 1.
  • the photosensitive transfer material according to the present disclosure is not limited to the one having the structure shown in FIG.
  • FIG. 1 is a schematic cross-sectional view showing an example of a layer structure in one embodiment of the photosensitive transfer material according to the present disclosure.
  • a temporary support 11 a transfer layer 12 including a thermoplastic resin layer 13, a water-soluble resin layer 15, and a photosensitive resin layer 17 and a protective film 19 are laminated in this order.
  • thermoplastic resin composition is applied to the surface of the temporary support 11 and then the coating film of the thermoplastic resin composition is dried to obtain a thermoplastic resin layer.
  • a step of applying a photosensitive resin composition containing a binder polymer and an ethylenically unsaturated compound to the surface of the water-soluble resin layer 15 and then drying the coating film of the photosensitive resin composition to form the photosensitive resin layer 16.
  • thermoplastic resin composition containing at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, and a water- and water-miscible organic solvent.
  • a photosensitive resin layer composition containing at least one of the above, and at least one selected from the group consisting of a binder polymer, an ethylenically unsaturated compound, and an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. It is preferable to use a sex resin composition.
  • the water-soluble resin layer composition is applied to the surface of the thermoplastic resin layer 13 and / or is contained in the thermoplastic resin layer 13 during the storage period of the laminate having the coating film of the water-soluble resin layer composition.
  • Mixing of the component to be made and the component contained in the water-soluble resin layer 15 can be suppressed, and the photosensitive resin composition can be applied to the surface of the water-soluble resin layer 15 and / or the photosensitive resin composition. It is possible to suppress the mixing of the component contained in the water-soluble resin layer 15 and the component contained in the photosensitive resin layer 16 during the storage period of the laminate having the coating film.
  • the photosensitive transfer material 20 is manufactured by pressing the protective film 19 onto the photosensitive resin layer 17 of the laminate manufactured by the above manufacturing method.
  • the method for producing the photosensitive transfer material used in the present disclosure includes a step of providing a protective film 19 so as to be in contact with the second surface of the photosensitive resin layer 17, whereby the temporary support 11 and the thermoplastic resin layer 13 are provided. It is preferable to manufacture the photosensitive transfer material 20 including the transfer layer 12 including the water-soluble resin layer 15 and the photosensitive resin layer 17, and the protective film 19.
  • the photosensitive transfer material 20 may be wound up to prepare and store the photosensitive transfer material in the form of a roll.
  • the photosensitive transfer material in roll form can be provided as it is in the bonding process with the substrate in the roll-to-roll method described later.
  • the photosensitive transfer material according to the present disclosure can be suitably used for various applications requiring precision microfabrication by photolithography.
  • the photosensitive resin layer may be used as a coating for etching, or electroforming may be performed mainly by electroplating.
  • the cured film obtained by patterning may be used as a permanent film, or may be used, for example, as an interlayer insulating film, a wiring protective film, a wiring protective film having an index matching layer, or the like.
  • the photosensitive transfer material according to the present disclosure is used in the fields of semiconductor packages, printed circuit boards, various wiring forming applications for sensor boards, touch panels, electromagnetic wave shielding materials, conductive films such as film heaters, liquid crystal sealing materials, micromachines or microelectronics. It can be suitably used for applications such as formation of a structure in.
  • the photosensitive transfer material of the first embodiment an embodiment in which the photosensitive resin layer is a colored resin layer containing a pigment is also preferably mentioned.
  • the colored resin layer is used for, for example, a liquid crystal display (LCD) and a color used for a solid-state image sensor [for example, a CCD (charge-coupled device) and a CMOS (complementary metal oxide semiconductor)]. It is suitable for forming colored pixels such as filters or a black matrix.
  • the embodiments other than the pigment in the colored resin layer are the same as those described above.
  • the photosensitive resin layer may be a colored resin layer containing a pigment.
  • liquid crystal display windows of electronic devices may be provided with a cover glass having a black frame-shaped light-shielding layer formed on the peripheral edge of the back surface of a transparent glass substrate or the like in order to protect the liquid crystal display window. be.
  • a colored resin layer can be used to form such a light-shielding layer.
  • the pigment may be appropriately selected according to the desired hue, and can be selected from black pigments, white pigments, and chromatic pigments other than black and white. Above all, when forming a black pattern, a black pigment is preferably selected as the pigment.
  • the black pigment a known black pigment (organic pigment, inorganic pigment, etc.) can be appropriately selected as long as the effect in the present disclosure is not impaired.
  • examples of the black pigment include carbon black, titanium oxide, titanium carbide, iron oxide, titanium oxide, graphite and the like, and carbon black is particularly preferable.
  • carbon black from the viewpoint of surface resistance, carbon black having at least a part of the surface coated with a resin is preferable.
  • the particle size of the black pigment is preferably 0.001 ⁇ m to 0.1 ⁇ m, more preferably 0.01 ⁇ m to 0.08 ⁇ m in terms of number average particle size.
  • the particle size refers to the diameter of the circle when the area of the pigment particles is obtained from the photographic image of the pigment particles taken with an electronic microscope and the circle having the same area as the area of the pigment particles is considered, and the number average particle size. Is an average value obtained by obtaining the above particle size for any 100 particles and averaging the obtained 100 particle sizes.
  • the white pigment described in paragraphs 0015 and 0114 of JP-A-2005-007765 can be used as the white pigment.
  • the white pigments as the inorganic pigment, titanium oxide, zinc oxide, lithopone, light calcium carbonate, white carbon, aluminum oxide, aluminum hydroxide, or barium sulfate is preferable, and titanium oxide or zinc oxide is more preferable. Titanium oxide is preferable, and titanium oxide is more preferable.
  • rutile-type or anatase-type titanium oxide is more preferable, and rutile-type titanium oxide is particularly preferable.
  • the surface of titanium oxide may be treated with silica, alumina, titania, zirconia, or an organic substance, or may be subjected to two or more treatments.
  • the catalytic activity of titanium oxide is suppressed, and heat resistance, fading and the like are improved.
  • at least one of alumina treatment and zirconia treatment is preferable as the surface treatment of the surface of titanium oxide, and both alumina treatment and zirconia treatment are particularly preferable.
  • the photosensitive resin layer is a colored resin layer
  • the photosensitive resin layer further contains a chromatic pigment other than the black pigment and the white pigment from the viewpoint of transferability.
  • a chromatic pigment is contained, the particle size of the chromatic pigment is preferably 0.1 ⁇ m or less, more preferably 0.08 ⁇ m or less, in that the dispersibility is more excellent.
  • chromatic pigments include Victoria Pure Blue BO (Color Index (hereinafter CI) 42595), Auramine (CI41000), Fat Black HB (CI26150), and Monolite.
  • Pigment Red 180 C.I. I. Pigment Red 192, C.I. I. Pigment Red 215, C.I. I. Pigment Green 7, C.I. I. Pigment Blue 15: 1, C.I. I. Pigment Blue 15: 4, C.I. I. Pigment Blue 22, C.I. I. Pigment Blue 60, C.I. I. Pigment Blue 64, and C.I. I. Pigment Violet 23 and the like. Above all, C.I. I. Pigment Red 177 is preferred.
  • the content of the pigment is preferably more than 3% by mass and 40% by mass or less, more preferably more than 3% by mass and 35% by mass or less, based on the total mass of the photosensitive resin layer. It is more preferably more than 5% by mass and 35% by mass or less, and particularly preferably 10% by mass or more and 35% by mass or less.
  • the content of the pigment other than the black pigment is preferably 30% by mass or less, preferably 1% by mass or more, based on the black pigment. 20% by mass is more preferable, and 3% by mass to 15% by mass is further preferable.
  • the black pigment preferably carbon black
  • the dispersion liquid may be prepared by adding a mixture obtained by premixing a black pigment and a pigment dispersant to an organic solvent (or vehicle) and dispersing it with a disperser.
  • the pigment dispersant may be selected depending on the pigment and the solvent, and for example, a commercially available dispersant can be used.
  • the vehicle refers to a portion of the medium in which the pigment is dispersed when the pigment is dispersed, and is a liquid, a binder component that holds the black pigment in a dispersed state, and a solvent component that dissolves and dilutes the binder component. (Organic solvent) and.
  • the disperser is not particularly limited, and examples thereof include known dispersers such as a kneader, a roll mill, an attritor, a super mill, a dissolver, a homomixer, and a sand mill. Further, it may be finely pulverized by mechanical grinding using frictional force.
  • disperser and fine pulverization the description of "Encyclopedia of Pigments" (Kunizo Asakura, First Edition, Asakura Shoten, 2000, 438, 310) can be referred to.
  • the photosensitive transfer material 10 shown in FIG. 2 has a temporary support 1, a transfer layer 2 including a photosensitive resin layer 3 and a refractive index adjusting layer 5, and a protective film 7 in this order. Further, the photosensitive transfer material 10 shown in FIG. 2 has a form in which the refractive index adjusting layer 5 is arranged, but the refractive index adjusting layer 5 may not be arranged.
  • each element constituting the photosensitive transfer material of the second embodiment will be described.
  • the temporary support and protective film used in the photosensitive transfer material of the second embodiment are the same as those of the temporary support and protective film in the photosensitive transfer material of the first embodiment, and the preferred embodiments are also the same.
  • the photosensitive transfer material has a photosensitive resin layer.
  • a pattern can be formed on the transferred object by transferring the photosensitive resin layer onto the transferred object and then exposing and developing the photosensitive resin layer.
  • the components that can be contained in the photosensitive resin layer will be described in detail.
  • the photosensitive resin layer may contain a binder polymer.
  • the binder polymer include (meth) acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin, ester resin, urethane resin, and the reaction of epoxy resin with (meth) acrylic acid.
  • examples thereof include the obtained epoxy acrylate resin and the acid-modified epoxy acrylate resin obtained by reacting the epoxy acrylate resin with the acid anhydride.
  • the binder polymer is a (meth) acrylic resin in that it is excellent in alkali developability and film forming property.
  • the (meth) acrylic resin means a resin having a structural unit derived from the (meth) acrylic compound.
  • the content of the structural unit derived from the (meth) acrylic compound is preferably 50% by mass or more, more preferably 70% by mass or more, still more preferably 90% by mass or more, based on all the structural units of the (meth) acrylic resin. ..
  • the (meth) acrylic resin may be composed of only a structural unit derived from the (meth) acrylic compound, or may have a structural unit derived from a polymerizable monomer other than the (meth) acrylic compound. .. That is, the upper limit of the content of the structural unit derived from the (meth) acrylic compound is 100% by mass or less with respect to all the structural units of the (meth) acrylic resin.
  • Examples of the (meth) acrylic compound include (meth) acrylic acid, (meth) acrylic acid ester, (meth) acrylamide, and (meth) acrylonitrile.
  • Examples of the (meth) acrylic acid ester include (meth) acrylic acid alkyl ester, (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic acid diethylaminoethyl ester, and (meth) acrylic acid ester.
  • Acrylic acid glycidyl ester (meth) acrylic acid benzyl ester, 2,2,2-trifluoroethyl (meth) acrylate, and 2,2,3,3-tetrafluoropropyl (meth) acrylate.
  • Meta) Acrylic acid alkyl esters are preferred.
  • the (meth) acrylamide include acrylamide such as diacetone acrylamide.
  • Examples of the (meth) acrylic acid alkyl ester include (meth) methyl acrylate, (meth) ethyl acrylate, (meth) propyl acrylate, (meth) butyl acrylate, (meth) pentyl (meth) acrylate, and (meth).
  • (meth) acrylic acid ester a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 4 carbon atoms is preferable, and methyl (meth) acrylate or ethyl (meth) acrylate is more preferable.
  • the (meth) acrylic resin may have a structural unit other than the structural unit derived from the (meth) acrylic compound.
  • the polymerizable monomer forming the structural unit is not particularly limited as long as it is a compound other than the (meth) acrylic compound that can be copolymerized with the (meth) acrylic compound, and is, for example, styrene, vinyltoluene, and ⁇ . -Styrene compounds such as methylstyrene which may have a substituent on the ⁇ -position or aromatic ring, vinyl alcohol esters such as acrylonitrile and vinyl-n-butyl ether, maleic acid, maleic acid anhydride, monomethyl maleate, maleic acid.
  • maleic acid monoesters such as monoethyl and monoisopropyl maleic acid, fumaric acid, silicic acid, ⁇ -cyanosilicic acid, itaconic acid, and crotonic acid. These polymerizable monomers may be used alone or in combination of two or more.
  • the (meth) acrylic resin preferably has a structural unit having an acid group from the viewpoint of improving the alkali developability.
  • the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group.
  • the (meth) acrylic resin more preferably has a structural unit having a carboxy group, and further preferably has a structural unit derived from the above-mentioned (meth) acrylic acid.
  • the content of the structural unit having an acid group (preferably the structural unit derived from (meth) acrylic acid) in the (meth) acrylic resin is excellent in developability, and is based on the total mass of the (meth) acrylic resin. 10% by mass or more is preferable.
  • the upper limit is not particularly limited, but is preferably 50% by mass or less, more preferably 40% by mass or less, in terms of excellent alkali resistance.
  • the (meth) acrylic resin has a structural unit derived from the above-mentioned (meth) acrylic acid alkyl ester.
  • the content of the structural unit derived from the (meth) acrylic acid alkyl ester in the (meth) acrylic resin is preferably 50% by mass to 90% by mass, preferably 60% by mass or more, based on all the structural units of the (meth) acrylic resin. 90% by mass is more preferable, and 65% by mass to 90% by mass is further preferable.
  • the (meth) acrylic resin a resin having both a structural unit derived from (meth) acrylic acid and a structural unit derived from (meth) acrylic acid alkyl ester is preferable, and the structural unit derived from (meth) acrylic acid and the structural unit derived from (meth) acrylic acid are preferable.
  • a resin composed only of structural units derived from the (meth) acrylic acid alkyl ester is more preferable.
  • an acrylic resin having a structural unit derived from methacrylic acid, a structural unit derived from methyl methacrylate, and a structural unit derived from ethyl acrylate is also preferable.
  • the (meth) acrylic resin may have at least one selected from the group consisting of a structural unit derived from methacrylic acid and a structural unit derived from a methacrylic acid alkyl ester because the effect in the present disclosure is more excellent. It is preferable to have both a structural unit derived from methacrylic acid and a structural unit derived from an alkyl methacrylate ester.
  • the total content of the constituent units derived from methacrylic acid and the constituent units derived from methacrylic acid alkyl ester in the (meth) acrylic resin is higher than that of all the constituent units of the (meth) acrylic resin because the effect in the present disclosure is more excellent. 40% by mass or more is preferable, and 60% by mass or more is more preferable.
  • the upper limit is not particularly limited, and may be 100% by mass or less, preferably 80% by mass or less.
  • the (meth) acrylic resin is at least one selected from the group consisting of a structural unit derived from methacrylic acid and a structural unit derived from methacrylic acid alkyl ester, and acrylic acid, because the effect in the present disclosure is more excellent. It is also preferable to have at least one selected from the group consisting of the structural unit derived from the acrylic acid alkyl ester and the structural unit derived from the acrylic acid alkyl ester. From the viewpoint of the superior effect in the present disclosure, the total content of the structural unit derived from methacrylic acid and the structural unit derived from methacrylic acid alkyl ester is the structural unit derived from acrylic acid and the structural unit derived from acrylic acid alkyl ester. The mass ratio is preferably 60/40 to 80/20 with respect to the total content of the ester.
  • the (meth) acrylic resin preferably has an ester group at the terminal in that the photosensitive resin layer after transfer is excellent in developability.
  • the terminal portion of the (meth) acrylic resin is composed of a site derived from the polymerization initiator used in the synthesis.
  • a (meth) acrylic resin having an ester group at the terminal can be synthesized by using a polymerization initiator that generates a radical having an ester group.
  • the binder polymer is preferably, for example, a binder polymer having an acid value of 60 mgKOH / g or more from the viewpoint of developability.
  • the binder polymer is, for example, a resin having a carboxy group having an acid value of 60 mgKOH / g or more (so-called carboxy group-containing resin) from the viewpoint that it is easily crosslinked with the crosslinked component by heating to form a strong film. More preferably, it is a (meth) acrylic resin having a carboxy group having an acid value of 60 mgKOH / g or more (so-called carboxy group-containing (meth) acrylic resin).
  • the binder polymer is a resin having a carboxy group
  • the three-dimensional crosslink density can be increased by adding a thermally crosslinkable compound such as a blocked isocyanate compound and thermally crosslinking the binder polymer.
  • a thermally crosslinkable compound such as a blocked isocyanate compound
  • the carboxy group of the resin having a carboxy group is dehydrated and made hydrophobic, the wet heat resistance can be improved.
  • the carboxy group-containing (meth) acrylic resin having an acid value of 60 mgKOH / g or more is not particularly limited as long as the above acid value conditions are satisfied, and can be appropriately selected from known (meth) acrylic resins.
  • a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more among the polymers described in paragraphs 0025 of JP-A-2011-095716, among the polymers described in paragraphs 0033 to 0052 of JP-A-2010-237589, a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more.
  • Acrylic resin containing a carboxy group having an acid value of 60 mgKOH / g or more can be preferably used.
  • the binder polymer is a styrene-acrylic copolymer.
  • the styrene-acrylic copolymer refers to a resin having a structural unit derived from a styrene compound and a structural unit derived from a (meth) acrylic compound, and is a structural unit derived from the styrene compound.
  • the total content of the structural units derived from the (meth) acrylic compound is preferably 30% by mass or more, more preferably 50% by mass or more, based on all the structural units of the copolymer.
  • the content of the structural unit derived from the styrene compound is preferably 1% by mass or more, more preferably 5% by mass or more, and further preferably 5% by mass to 80% by mass, based on all the structural units of the copolymer. preferable.
  • the content of the structural unit derived from the (meth) acrylic compound is preferably 5% by mass or more, more preferably 10% by mass or more, and 20% by mass to 95% by mass, based on all the structural units of the copolymer. Mass% is more preferred.
  • the binder polymer preferably has an aromatic ring structure, and more preferably has a structural unit having an aromatic ring structure, because the effect in the present disclosure is more excellent.
  • the monomer forming a structural unit having an aromatic ring structure include styrene compounds such as styrene, tert-butoxystyrene, methylstyrene, and ⁇ -methylstyrene, and benzyl (meth) acrylate. Of these, styrene compounds are preferable, and styrene is more preferable. Further, it is more preferable that the binder polymer has a structural unit (constituent unit derived from styrene) represented by the following formula (S) from the viewpoint that the effect in the present disclosure is more excellent.
  • the content of the structural unit having an aromatic ring structure is 5% by mass or more with respect to all the structural units of the binder polymer from the viewpoint of more excellent effect in the present disclosure. 90% by mass is preferable, 10% by mass to 70% by mass is preferable, and 20% by mass to 60% by mass is further preferable. Further, the content of the structural unit having an aromatic ring structure in the binder polymer is preferably 5 mol% to 70 mol%, preferably 10 mol%, based on all the structural units of the binder polymer, because the effect in the present disclosure is more excellent. It is more preferably from 60 mol%, still more preferably from 20 mol% to 60 mol%.
  • the content of the structural unit represented by the above formula (S) in the binder polymer is preferably 5 mol% to 70 mol% with respect to all the structural units of the binder polymer from the viewpoint of further excellent effects in the present disclosure. 10 mol% to 60 mol% is more preferable, 20 mol% to 60 mol% is further preferable, and 20 mol% to 50 mol% is particularly preferable.
  • the above “constituent unit” shall be synonymous with the "monomer unit”.
  • the above-mentioned "monomer unit” may be modified after polymerization by a polymer reaction or the like. The same applies to the following.
  • the binder polymer preferably has an aliphatic hydrocarbon ring structure because the effect in the present disclosure is more excellent. That is, the binder polymer preferably has a structural unit having an aliphatic hydrocarbon ring structure.
  • the structural unit having an aliphatic hydrocarbon ring structure either a monocyclic aliphatic hydrocarbon structure or a polycyclic aliphatic hydrocarbon structure can be used. Above all, it is more preferable that the binder polymer has a ring structure in which two or more aliphatic hydrocarbon rings are fused.
  • Examples of the ring constituting the aliphatic hydrocarbon ring structure in the structural unit having the aliphatic hydrocarbon ring structure include a tricyclodecane ring, a cyclohexane ring, a cyclopentane ring, a norbornane ring, and an isoborone ring.
  • a ring in which two or more aliphatic hydrocarbon rings are fused is preferable because the effect in the present disclosure is more excellent, and a tetrahydrodicyclopentadiene ring (tricyclo [5.2.1.0 2,6 ] decane ring) is preferable. ) Is more preferable.
  • the monomer forming a structural unit having an aliphatic hydrocarbon ring structure examples include dicyclopentanyl (meth) acrylate, cyclohexyl (meth) acrylate, and isobornyl (meth) acrylate.
  • the binder polymer more preferably has a structural unit represented by the following formula (Cy), and the structural unit represented by the above formula (S) and the following formula. It is more preferable to have a structural unit represented by (Cy).
  • RM represents a hydrogen atom or a methyl group
  • RCy represents a monovalent group having an aliphatic hydrocarbon ring structure.
  • the RM in the formula ( Cy ) is preferably a methyl group.
  • the RCy in the formula ( Cy ) is preferably a monovalent group having an aliphatic hydrocarbon ring structure having 5 to 20 carbon atoms, and a fat having 6 to 16 carbon atoms, because the effect in the present disclosure is more excellent. It is more preferably a monovalent group having a group hydrocarbon ring structure, and even more preferably a monovalent group having an aliphatic hydrocarbon ring structure having 8 to 14 carbon atoms.
  • the aliphatic hydrocarbon ring structure in RCy of the formula ( Cy ) has a cyclopentane ring structure, a cyclohexane ring structure, a tetrahydrodicyclopentadiene ring structure, a norbornane ring structure, or a norbornane ring structure, because the effect in the present disclosure is more excellent. It is preferably an isoborone ring structure, more preferably a cyclohexane ring structure or a tetrahydrodicyclopentadiene ring structure, and even more preferably a tetrahydrodicyclopentadiene ring structure.
  • the aliphatic hydrocarbon ring structure in RCy of the formula ( Cy ) is preferably a ring structure in which two or more aliphatic hydrocarbon rings are fused, from the viewpoint of further excellent effect in the present disclosure. It is more preferable that the ring is a condensed ring of ⁇ 4 aliphatic hydrocarbon rings.
  • the binder polymer may have one type of structural unit having an aliphatic hydrocarbon ring structure alone, or may have two or more types.
  • the content of the structural unit having an aliphatic hydrocarbon ring structure is higher than that of all the structural units of the binder polymer because the effect in the present disclosure is more excellent.
  • 5% by mass to 90% by mass is preferable, 10% by mass to 80% by mass is more preferable, and 20% by mass to 70% by mass is further preferable.
  • the content of the structural unit having an aliphatic hydrocarbon ring structure in the binder polymer is preferably 5 mol% to 70 mol% with respect to all the structural units of the binder polymer from the viewpoint of further excellent effects in the present disclosure. 10 mol% to 60 mol% is more preferable, and 20 mol% to 50 mol% is further preferable. Further, the content of the structural unit represented by the above formula (Cy) in the binder polymer is preferably 5 mol% to 70 mol% with respect to all the structural units of the binder polymer from the viewpoint of further excellent effects in the present disclosure. 10 mol% to 60 mol% is more preferable, and 20 mol% to 50 mol% is further preferable.
  • the binder polymer has a structural unit having an aromatic ring structure and a structural unit having an aliphatic hydrocarbon ring structure
  • the total content of the structural unit having an aromatic ring structure and the structural unit having an aliphatic hydrocarbon ring structure is the present. From the viewpoint of more excellent effect in the disclosure, 10% by mass to 90% by mass is preferable, 20% by mass to 80% by mass is more preferable, and 40% by mass to 75% by mass is further preferable, based on all the constituent units of the binder polymer. ..
  • the total content of the structural unit having an aromatic ring structure and the structural unit having an aliphatic hydrocarbon ring structure in the binder polymer is 10 with respect to all the structural units of the binder polymer because the effect in the present disclosure is more excellent. It is preferably mol% to 80 mol%, more preferably 20 mol% to 70 mol%, still more preferably 40 mol% to 60 mol%. Further, the total contents of the structural unit represented by the above formula (S) and the structural unit represented by the above formula (Cy) in the binder polymer are all the structural units of the binder polymer from the viewpoint that the effect in the present disclosure is more excellent.
  • nS of the structural unit represented by the above formula (S) and the molar amount nCy of the structural unit represented by the above formula (Cy) in the binder polymer are more effective in the present disclosure. It is preferable to satisfy the relationship shown in the following formula (SCy), more preferably to satisfy the following formula (SCy-1), and further preferably to satisfy the following formula (SCy-2).
  • the binder polymer preferably has a structural unit having an acid group because the effect in the present disclosure is more excellent.
  • the acid group include a carboxy group, a sulfo group, a phosphonic acid group, and a phosphoric acid group, and a carboxy group is preferable.
  • the structural unit having the acid group the structural unit derived from (meth) acrylic acid shown below is preferable, and the structural unit derived from methacrylic acid is more preferable.
  • the binder polymer may have one type of structural unit having an acid group alone or two or more types.
  • the content of the structural unit having an acid group is 5% by mass to 50% by mass with respect to all the structural units of the binder polymer because the effect in the present disclosure is more excellent.
  • % Is preferable 5% by mass to 40% by mass is more preferable, and 10% by mass to 30% by mass is further preferable.
  • the content of the constituent unit having an acid group in the binder polymer is preferably 5 mol% to 70 mol%, preferably 10 mol% to 10 mol%, based on all the constituent units of the binder polymer, from the viewpoint of further excellent effect in the present disclosure.
  • the content of the constituent unit derived from (meth) acrylic acid in the binder polymer is preferably 5 mol% to 70 mol% with respect to all the constituent units of the binder polymer from the viewpoint of further excellent effects in the present disclosure. More preferably, mol% to 50 mol%, still more preferably 20 mol% to 40 mol%.
  • the binder polymer preferably has a reactive group, and more preferably has a structural unit having a reactive group, because the effect in the present disclosure is more excellent.
  • a reactive group a radically polymerizable group is preferable, and an ethylenically unsaturated group is more preferable.
  • the binder polymer preferably has a structural unit having an ethylenically unsaturated group in the side chain.
  • the "main chain” represents a relatively longest bond chain among the molecules of the polymer compound constituting the resin, and the "side chain” refers to an atomic group branched from the main chain. show.
  • an ethylenically unsaturated group an allyl group or a (meth) acryloxy group is more preferable.
  • structural units having a reactive group include, but are not limited to, those shown below.
  • the binder polymer may have one type of structural unit having a reactive group alone or two or more types.
  • the content of the structural unit having a reactive group is from 5% by mass to 5% by mass with respect to all the structural units of the binder polymer from the viewpoint of better effect in the present disclosure. 70% by mass is preferable, 10% by mass to 50% by mass is more preferable, and 20% by mass to 40% by mass is further preferable.
  • the content of the structural unit having a reactive group in the binder polymer is preferably 5 mol% to 70 mol%, preferably 10 mol%, based on all the structural units of the binder polymer, because the effect in the present disclosure is more excellent. It is more preferably from 60 mol%, still more preferably from 20 mol% to 50 mol%.
  • a functional group such as a hydroxy group, a carboxy group, a primary amino group, a secondary amino group, an acetoacetyl group, and a sulfo group, an epoxy compound, and a blocked isocyanate are used.
  • a functional group such as a hydroxy group, a carboxy group, a primary amino group, a secondary amino group, an acetoacetyl group, and a sulfo group, an epoxy compound, and a blocked isocyanate.
  • examples thereof include a method of reacting a compound such as a compound, an isocyanate compound, a vinyl sulfone compound, an aldehyde compound, a methylol compound, and a carboxylic acid anhydride.
  • a preferred example of a means for introducing a reactive group into a binder polymer is that a polymer having a carboxy group is synthesized by a polymerization reaction and then glycidyl (meth) acrylate is added to a part of the carboxy group of the obtained polymer by the polymer reaction.
  • a means for introducing a (meth) acryloxy group into a polymer by reacting with the polymer By this means, a binder polymer having a (meth) acryloxy group in the side chain can be obtained.
  • the polymerization reaction is preferably carried out under a temperature condition of 70 ° C. to 100 ° C., and more preferably carried out under a temperature condition of 80 ° C.
  • the polymerization initiator used in the above polymerization reaction an azo-based initiator is preferable, and for example, V-601 (trade name) or V-65 (trade name) manufactured by Wako Pure Chemical Industries, Ltd. is more preferable.
  • the polymer reaction is preferably carried out under temperature conditions of 80 ° C to 110 ° C. In the above polymer reaction, it is preferable to use a catalyst such as an ammonium salt.
  • the binder polymer the polymers shown below are preferable because the effects in the present disclosure are more excellent.
  • the content ratios (a to d) and the weight average molecular weight Mw of each structural unit shown below can be appropriately changed according to the purpose.
  • the binder polymer may contain a polymer having a structural unit having a carboxylic acid anhydride structure (hereinafter, also referred to as “polymer X”).
  • the carboxylic acid anhydride structure may be either a chain carboxylic acid anhydride structure or a cyclic carboxylic acid anhydride structure, but a cyclic carboxylic acid anhydride structure is preferable.
  • a cyclic carboxylic acid anhydride structure As the ring having a cyclic carboxylic acid anhydride structure, a 5-membered ring to a 7-membered ring is preferable, a 5-membered ring or a 6-membered ring is more preferable, and a 5-membered ring is further preferable.
  • the structural unit having a carboxylic acid anhydride structure is a structural unit containing a divalent group obtained by removing two hydrogen atoms from the compound represented by the following formula P-1 in the main chain, or the following formula P-1. It is preferable that the monovalent group obtained by removing one hydrogen atom from the represented compound is a structural unit bonded to the main chain directly or via a divalent linking group.
  • RA1a represents a substituent
  • n1a RA1a may be the same or different
  • Examples of the substituent represented by RA1a include an alkyl group.
  • Z 1a an alkylene group having 2 to 4 carbon atoms is preferable, an alkylene group having 2 or 3 carbon atoms is more preferable, and an alkylene group having 2 carbon atoms is further preferable.
  • n 1a represents an integer of 0 or more.
  • Z 1a represents an alkylene group having 2 to 4 carbon atoms
  • n 1a is preferably an integer of 0 to 4, more preferably an integer of 0 to 2, and even more preferably 0.
  • a plurality of RA1a may be the same or different. Further, although a plurality of RA1a may be bonded to each other to form a ring, it is preferable that the RA1a are not bonded to each other to form a ring.
  • a structural unit derived from an unsaturated carboxylic acid anhydride is preferable, a structural unit derived from an unsaturated cyclic carboxylic acid anhydride is more preferable, and an unsaturated aliphatic cyclic carboxylic acid is preferable.
  • a structural unit derived from an acid anhydride is more preferable, a structural unit derived from maleic anhydride or an itaconic acid anhydride is particularly preferable, and a structural unit derived from maleic anhydride is most preferable.
  • Rx represents a hydrogen atom, a methyl group, a CH 2 OH group, or CF 3 groups
  • Me represents a methyl group.
  • the structural unit having a carboxylic acid anhydride structure in the polymer X may be one kind alone or two or more kinds.
  • the total content of the structural units having a carboxylic acid anhydride structure is preferably 0 mol% to 60 mol%, more preferably 5 mol% to 40 mol%, and 10 mol% with respect to all the structural units of the polymer X. It is more preferably ⁇ 35 mol%.
  • the photosensitive resin layer may contain only one type of polymer X, or may contain two or more types of polymer X.
  • the content of the polymer X is 0.1% by mass to 30% by mass with respect to the total mass of the photosensitive resin layer because the effect in the present disclosure is more excellent. Is preferable, 0.2% by mass to 20% by mass is more preferable, 0.5% by mass to 20% by mass is further preferable, and 1% by mass to 20% by mass is further preferable.
  • the weight average molecular weight (Mw) of the binder polymer is preferably 5,000 or more, more preferably 10,000 or more, still more preferably 10,000 to 50,000, and even more preferably 20,000, because the effect in the present disclosure is more excellent. ⁇ 30,000 is particularly preferable.
  • the acid value of the binder polymer is preferably 10 mgKOH / g to 200 mgKOH / g, more preferably 60 mgKOH / g to 200 mgKOH / g, further preferably 60 mgKOH / g to 150 mgKOH / g, and particularly preferably 60 mgKOH / g to 110 mgKOH / g.
  • the acid value of the binder polymer is a value measured according to the method described in JIS K0070: 1992.
  • the photosensitive resin layer may contain only one kind of binder polymer, or may contain two or more kinds of binder polymers.
  • the content of the binder polymer is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, more preferably 30% by mass, based on the total mass of the photosensitive resin layer, because the effect in the present disclosure is more excellent. More preferably, it is by mass to 70% by mass.
  • the photosensitive resin layer preferably contains a polymerizable compound.
  • the polymerizable compound is a compound having a polymerizable group. Examples of the polymerizable group include a radically polymerizable group and a cationically polymerizable group, and a radically polymerizable group is preferable.
  • the polymerizable compound preferably contains a radically polymerizable compound having an ethylenically unsaturated group (hereinafter, also simply referred to as “ethylenically unsaturated compound”).
  • ethylenically unsaturated compound a (meth) acryloxy group is preferable.
  • the ethylenically unsaturated compound in the present specification is a compound other than the binder polymer, and preferably has a molecular weight of less than 5,000.
  • a compound represented by the following formula (M) (simply referred to as “Compound M”) can be mentioned.
  • Q2 - R1 - Q1 formula (M) Q 1 and Q 2 each independently represent a (meth) acryloyloxy group, and R 1 represents a divalent linking group having a chain structure.
  • Q 1 and Q 2 in the formula (M) have the same group as Q 1 and Q 2 from the viewpoint of ease of synthesis. Further, Q 1 and Q 2 in the formula (M) are preferably acryloyloxy groups from the viewpoint of reactivity.
  • R1 in the formula (M) an alkylene group, an alkyleneoxyalkylene group (-L 1 -OL 1- ), or a polyalkylene oxyalkylene group (-(L)" is used because the effect in the present disclosure is more excellent.
  • a hydrocarbon group having 2 to 20 carbon atoms or a polyalkyleneoxyalkylene group is more preferable, an alkylene group having 4 to 20 carbon atoms is further preferable, and an alkylene group having 6 to 20 carbon atoms is more preferable. Eighteen linear alkylene groups are particularly preferred.
  • the hydrocarbon group may have a chain structure at least partially, and the portion other than the chain structure is not particularly limited, and is, for example, a branched chain, cyclic, or having 1 to 1 to carbon atoms.
  • the alkylene group is more preferable, and the linear alkylene group is further preferable.
  • the above L 1 independently represents an alkylene group, and an ethylene group, a propylene group, or a butylene group is preferable, and an ethylene group or a 1,2-propylene group is more preferable.
  • p represents an integer of 2 or more, and is preferably an integer of 2 to 10.
  • the number of atoms of the shortest connecting chain connecting Q1 and Q2 in the compound M is preferably 3 to 50, more preferably 4 to 40, because the effect in the present disclosure is more excellent. It is preferable, 6 to 20 pieces are more preferable, and 8 pieces to 12 pieces are particularly preferable.
  • "the number of atoms in the shortest connecting chain connecting between Q1 and Q2" means the atoms in R1 connected to Q1 to the atoms in R1 connected to Q2 . The shortest number of atoms.
  • the compound M examples include 1,3-butanediol di (meth) acrylate, tetramethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and 1,6-hexanediol di (meth) acrylate.
  • the ester monomer can also be used as a mixture.
  • 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, and 1,10-decanediol di (meth) acrylate are more effective in the present disclosure.
  • a compound and at least one compound selected from the group consisting of 1,10-decanediol di (meth) acrylate, more preferably 1,9-nonanediol di (meth) acrylate, and 1 , 10-Decandiol di (meth) acrylate is more preferably at least one compound selected from the group consisting of acrylates.
  • a bifunctional or higher functional ethylenically unsaturated compound can be mentioned.
  • the term "bifunctional or higher functional ethylenically unsaturated compound” means a compound having two or more ethylenically unsaturated groups in one molecule.
  • a (meth) acryloyl group is preferable.
  • a (meth) acrylate compound is preferable.
  • the bifunctional ethylenically unsaturated compound is not particularly limited and may be appropriately selected from known compounds.
  • Examples of the bifunctional ethylenically unsaturated compound other than the compound M include tricyclodecanedimethanol di (meth) acrylate and tricyclodecanedimenanol di (meth) acrylate.
  • NK ester A-DCP tricyclodecanedimethanol diacrylate
  • NK ester A-DCP tricyclodecanedimenanol dimethacrylate
  • NK ester DCP manufactured by Shin Nakamura Chemical Industry Co., Ltd.
  • 1,9-nonanediol diacrylate (trade name: NK ester A-NOD-N, manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
  • 1,6 -Hexanediol diacrylate (trade name: NK ester A-HD-N, manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
  • the trifunctional or higher functional ethylenically unsaturated compound is not particularly limited and may be appropriately selected from known compounds.
  • Examples of the trifunctional or higher functional ethylenically unsaturated compound include dipentaerythritol (tri / tetra / penta / hexa) (meth) acrylate, pentaerythritol (tri / tetra) (meth) acrylate, and trimethylolpropane tri (meth) acrylate.
  • Examples thereof include ditrimethylolpropane tetra (meth) acrylate, isocyanuric acid (meth) acrylate, and (meth) acrylate compound having a glycerintri (meth) acrylate skeleton.
  • (tri / tetra / penta / hexa) (meth) acrylate is a concept including tri (meth) acrylate, tetra (meth) acrylate, penta (meth) acrylate, and hexa (meth) acrylate.
  • (tri / tetra) (meth) acrylate” is a concept that includes tri (meth) acrylate and tetra (meth) acrylate.
  • Examples of the polymerizable compound include caprolactone-modified compounds of (meth) acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Industry Co., Ltd., etc.), (Meta). ) Alkylene oxide-modified compound of acrylate compound (KAYARAD (registered trademark) RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin-Nakamura Chemical Industry Co., Ltd., EBECRYL (registered trademark) manufactured by Daicel Ornex Co., Ltd. ) 135, etc.), ethoxylated glycerin triacrylate (NK ester A-GLY-9E, etc. manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) can also be mentioned.
  • KAYARAD registered trademark
  • DPCA-20 Alkylene oxide-modified compound of acrylate compound
  • Examples of the polymerizable compound include urethane (meth) acrylate compounds.
  • Examples of the urethane (meth) acrylate include urethane di (meth) acrylate, and examples thereof include propylene oxide-modified urethane di (meth) acrylate, and ethylene oxide and propylene oxide-modified urethane di (meth) acrylate.
  • a urethane (meth) acrylate having trifunctionality or higher can also be mentioned.
  • As the lower limit of the number of functional groups 6-functionality or more is more preferable, and 8-functionality or more is further preferable.
  • the upper limit of the number of functional groups is preferably 20 or less.
  • trifunctional or higher functional urethane (meth) acrylates examples include 8UX-015A (manufactured by Taisei Fine Chemical Industry Co., Ltd.), UA-32P (manufactured by Shin Nakamura Chemical Industry Co., Ltd.), and U-15HA (manufactured by Shin Nakamura Chemical Industry Co., Ltd.). ), UA-1100H (manufactured by Shin Nakamura Chemical Industry Co., Ltd.), AH-600 (trade name) manufactured by Kyoeisha Chemical Co., Ltd., and UA-306H, UA-306T, UA-306I, UA-510H. , And UX-5000 (both manufactured by Nippon Kayaku Co., Ltd.) and the like.
  • One of the preferred embodiments of the polymerizable compound is an ethylenically unsaturated compound having an acid group.
  • the acid group include a phosphoric acid group, a sulfo group, and a carboxy group.
  • the carboxy group is preferable as the acid group.
  • a trifunctional to tetrafunctional ethylenically unsaturated compound having an acid group [pentaerythritol tri and a tetraacrylate (PETA) skeleton introduced with a carboxy group (acid value: 80 mgKOH).
  • a pentafunctional to hexafunctional ethylenically unsaturated compound having an acid group dipentaerythritol penta and hexaacrylate (DPHA) with a carboxy group introduced into the skeleton [acid value: 25 mgKOH / g] ⁇ 70 mgKOH / g)] and the like.
  • DPHA dipentaerythritol penta and hexaacrylate
  • These trifunctional or higher functional ethylenically unsaturated compounds having an acid group may be used in combination with a bifunctional ethylenically unsaturated compound having an acid group, if necessary.
  • the ethylenically unsaturated compound having an acid group at least one selected from the group consisting of a bifunctional or higher functional ethylenically unsaturated compound having a carboxy group and a carboxylic acid anhydride thereof is preferable.
  • the ethylenically unsaturated compound having an acid group is at least one selected from the group consisting of a bifunctional or higher functional ethylenically unsaturated compound having a carboxy group and a carboxylic acid anhydride thereof, the developability and film strength are higher. It will increase.
  • the bifunctional or higher functional unsaturated compound having a carboxy group is not particularly limited and can be appropriately selected from known compounds.
  • Examples of the bifunctional or higher functional unsaturated compound having a carboxy group include Aronix (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), Aronix (registered trademark) M-520 (manufactured by Toagosei Co., Ltd.), and the like.
  • Aronix (registered trademark) M-510 manufactured by Toagosei Co., Ltd. can be mentioned.
  • the polymerizable compound having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942 is preferable, and the contents described in this publication are incorporated in the present specification. Will be.
  • Examples of the polymerizable compound include a compound obtained by reacting a polyhydric alcohol with an ⁇ , ⁇ -unsaturated carboxylic acid, a compound obtained by reacting a glycidyl group-containing compound with an ⁇ , ⁇ -unsaturated carboxylic acid, and a urethane.
  • Urethane monomers such as (meth) acrylate compounds having a bond, ⁇ -chloro- ⁇ -hydroxypropyl- ⁇ '-(meth) acryloyloxyethyl-o-phthalate, ⁇ -hydroxyethyl- ⁇ '-(meth) acryloyloxyethyl Examples thereof include phthalic acid compounds such as -o-phthalate and ⁇ -hydroxypropyl- ⁇ '-(meth) acryloyloxyethyl-o-phthalate, and (meth) acrylic acid alkyl esters. These may be used alone or in combination of two or more.
  • Examples of the compound obtained by reacting a polyvalent alcohol with an ⁇ , ⁇ -unsaturated carboxylic acid include 2,2-bis (4-((meth) acrylamide polyethoxy) phenyl) propane and 2,2-bis.
  • Bisphenol A-based (meth) acrylate compounds such as (4-((meth) acryloxypolypropoxy) phenyl) propane and 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane , Polyethylene glycol di (meth) acrylate having 2 to 14 ethylene oxide groups, polypropylene glycol di (meth) acrylate having 2 to 14 propylene oxide groups, and 2 to 14 ethylene oxide groups.
  • an ethylene unsaturated compound having a tetramethylolmethane structure or a trimethylolpropane structure is preferable, and tetramethylolmethanetri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, trimethylolpropanetri (meth) acrylate, or dimethylolpropanetri (meth) acrylate, or di (Trimethylolpropane) Tetraacrylate is more preferred.
  • Examples of the polymerizable compound include caprolactone-modified compounds of ethylenically unsaturated compounds (for example, KAYARAD® DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin Nakamura Chemical Industry Co., Ltd., etc.).
  • An alkylene oxide-modified compound of an ethylenically unsaturated compound for example, KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin Nakamura Chemical Industry Co., Ltd., EBECRYL manufactured by Daicel Ornex Co., Ltd. (registered trademark). ) 135, etc.), ethoxylated glycerin triacrylate (A-GLY-9E, etc. manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and the like.
  • a compound containing an ester bond is preferable in that the photosensitive resin layer after transfer is excellent in developability.
  • the ethylenically unsaturated compound containing an ester bond is not particularly limited as long as it contains an ester bond in the molecule, but is not ethylene-free having a tetramethylolmethane structure or a trimethylolpropane structure in that the effect in the present disclosure is excellent.
  • the ethylenically unsaturated compound includes an ethylenically unsaturated compound having an aliphatic group having 6 to 20 carbon atoms and the above-mentioned ethylene unsaturated compound having a tetramethylol methane structure or a trimethylol propane structure. It is preferable to contain a compound.
  • Examples of the ethylenically unsaturated compound having an aliphatic structure having 6 or more carbon atoms include 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, and tricyclodecanedimethanoldi. Examples include (meth) acrylate.
  • One of the preferred embodiments of the polymerizable compound is a polymerizable compound having an aliphatic hydrocarbon ring structure (preferably a bifunctional ethylenically unsaturated compound).
  • a polymerizable compound having a ring structure in which two or more aliphatic hydrocarbon rings are condensed preferably a structure selected from the group consisting of a tricyclodecane structure and a tricyclodecene structure
  • a bifunctional ethylenically unsaturated compound having a ring structure in which two or more aliphatic hydrocarbon rings are fused is more preferable, and tricyclodecanedimethanol di (meth) acrylate is further preferable.
  • a cyclopentane structure, a cyclohexane structure, a tricyclodecane structure, a tricyclodecene structure, a norbornane structure, or an isoborone structure is preferable because the effect in the present disclosure is more excellent.
  • the molecular weight of the polymerizable compound is preferably 200 to 3,000, more preferably 250 to 2,600, still more preferably 280 to 2,200, and particularly preferably 300 to 2,200.
  • the proportion of the content of the polymerizable compound having a molecular weight of 300 or less among the polymerizable compounds contained in the photosensitive resin layer is 30% by mass or less with respect to the content of all the polymerizable compounds contained in the photosensitive resin layer. Is preferable, 25% by mass or less is more preferable, and 20% by mass or less is further preferable.
  • the photosensitive resin layer preferably contains a bifunctional or higher functional ethylenically unsaturated compound, and more preferably contains a trifunctional or higher functional ethylenically unsaturated compound. More preferably, it contains a functional or tetrafunctional ethylenically unsaturated compound.
  • the photosensitive resin layer is a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure and a binder polymer having a structural unit having an aliphatic hydrocarbon ring. And are preferably included.
  • the photosensitive resin layer preferably contains a compound represented by the formula (M) (compound M) and an ethylenically unsaturated compound having an acid group.
  • M compound M
  • 1,9-Nonandiol diacrylate, tricyclodecanedimethanol diacrylate, and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group are more preferable, and 1,9-nonandiol diacrylate and More preferably, it contains a tricyclodecanedimethanol diacrylate and a succinic acid-modified form of dipentaerythritol pentaacrylate.
  • the photosensitive resin layer preferably contains compound M, an ethylenically unsaturated compound having an acid group, and a thermally crosslinkable compound described later, and the compound M is preferable. It is more preferable to contain an ethylenically unsaturated compound having an acid group and a blocked isocyanate compound described later.
  • the photosensitive resin layer has a bifunctional ethylenically unsaturated compound (preferably a bifunctional (meth) acrylate compound) and a trifunctional or higher functional ethylenically unsaturated compound. It preferably contains a saturated compound (preferably a trifunctional or higher functional (meth) acrylate compound).
  • the photosensitive resin layer contains compound M and a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure from the viewpoint of rust prevention. Is preferable. Further, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer is not ethylenically having compound M and an acid group from the viewpoints of substrate adhesion, development residue inhibitory property, and rust resistance.
  • a saturated compound more preferably compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, and an ethylenically unsaturated compound having an acid group, and more preferably compound M, an aliphatic compound. It is more preferable to contain a bifunctional ethylenically unsaturated compound having a hydrocarbon ring structure, a trifunctional or higher functional ethylenically unsaturated compound, and an ethylenically unsaturated compound having an acid group, more preferably compound M, an aliphatic hydrocarbon ring.
  • the photosensitive resin layer is a 1,9-nonanediol from the viewpoints of substrate adhesion, development residue inhibitory property, and rust resistance.
  • It preferably contains a diacrylate and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, and preferably contains 1,9-nonanediol diacrylate, tricyclodecanedimethanol diacrylate, and polyfunctional ethylene having a carboxylic acid group. It preferably contains a sex-unsaturated compound, further including 1,9-nonanediol diacrylate, tricyclodecanedimethanol diacrylate, dipentaerythritol hexaacrylate, and an ethylenically unsaturated compound having a carboxylic acid group.
  • it contains 1,9-nonanediol diacrylate, tricyclodecanedimethanol diacrylate, an ethylenically unsaturated compound having a carboxylic acid group, and a urethane acrylate compound.
  • the photosensitive resin layer may contain a monofunctional ethylenically unsaturated compound as the ethylenically unsaturated compound.
  • the content of the bifunctional or higher functional ethylenically unsaturated compound in the ethylenically unsaturated compound is 60% by mass to 100% by mass with respect to the total content of all the ethylenically unsaturated compounds contained in the photosensitive resin layer. It is preferably 80% by mass to 100% by mass, more preferably 90% by mass to 100% by mass.
  • the polymerizable compound (particularly, the ethylenically unsaturated compound) may be used alone or in combination of two or more.
  • the content of the polymerizable compound (particularly, the ethylenically unsaturated compound) in the photosensitive resin layer is preferably 1% by mass to 70% by mass, preferably 5% by mass to 70% by mass, based on the total mass of the photosensitive resin layer. Is more preferable, 5% by mass to 60% by mass is further preferable, and 5% by mass to 50% by mass is particularly preferable.
  • the photosensitive resin layer preferably contains a photopolymerization initiator.
  • the photopolymerization initiator is not particularly limited, and a known photopolymerization initiator can be used.
  • Examples of the photopolymerization initiator include a photopolymerization initiator having an oxime ester structure (hereinafter, also referred to as “oxym-based photopolymerization initiator”) and a photopolymerization initiator having an ⁇ -aminoalkylphenone structure (hereinafter, “ ⁇ -”.
  • Photopolymerization initiator hereinafter, also referred to as “acylphosphine oxide-based photopolymerization initiator”
  • photopolymerization initiator having an N-phenylglycine structure hereinafter, “N-phenylglycine-based photopolymerization initiator”. Also referred to as "agent").
  • the photopolymerization initiator is selected from the group consisting of an oxime-based photopolymerization initiator, an ⁇ -aminoalkylphenone-based photopolymerization initiator, an ⁇ -hydroxyalkylphenone-based polymerization initiator, and an N-phenylglycine-based photopolymerization initiator. It is preferable to contain at least one selected from the group consisting of an oxime-based photopolymerization initiator, an ⁇ -aminoalkylphenone-based photopolymerization initiator, and an N-phenylglycine-based photopolymerization initiator. Is more preferable.
  • the photopolymerization initiator for example, the polymerization initiator described in paragraphs 0031 to 0042 of JP-A-2011-95716 and paragraphs 0064-0081 of JP-A-2015-014783 may be used. ..
  • photopolymerization initiators include 1- [4- (phenylthio) phenyl] -1,2-octanedione-2- (O-benzoyloxime) [trade name: IRGACURE (registered trademark) OXE-01, BASF.
  • the photopolymerization initiator may be used alone or in combination of two or more.
  • the content of the photopolymerization initiator is preferably 0.1% by mass or more, preferably 0.5% by mass, based on the total mass of the photosensitive resin layer.
  • the above is more preferable, and 1.0% by mass or more is further preferable.
  • the upper limit thereof is preferably 10% by mass or less, and more preferably 5% by mass or less, based on the total mass of the photosensitive resin layer.
  • the photosensitive resin layer may contain a heterocyclic compound.
  • the heterocycle contained in the heterocyclic compound may be either a monocyclic or polycyclic complex.
  • Examples of the hetero atom contained in the heterocyclic compound include a nitrogen atom, an oxygen atom and a sulfur atom.
  • the heterocyclic compound preferably has at least one atom selected from the group consisting of a nitrogen atom, an oxygen atom and a sulfur atom, and more preferably has a nitrogen atom.
  • heterocyclic compound examples include a triazole compound, a benzotriazole compound, a tetrazole compound, a thiadiazol compound, a triazine compound, a rhonin compound, a thiazole compound, a benzothiazole compound, a benzoimidazole compound, a benzoxazole compound, and a pyrimidine compound.
  • the heterocyclic compound is at least one selected from the group consisting of a triazole compound, a benzotriazole compound, a tetrazole compound, a thiadiazol compound, a triazine compound, a rhonin compound, a thiazole compound, a benzoimidazole compound, and a benzoxazole compound.
  • the above-mentioned compound is preferable, and at least one compound selected from the group consisting of a triazole compound, a benzotriazole compound, a tetrazole compound, a thiadiazol compound, a thiazole compound, a benzothiazole compound, a benzoimidazole compound, and a benzoxazole compound is more preferable.
  • heterocyclic compound A preferable specific example of the heterocyclic compound is shown below.
  • examples of the triazole compound and the benzotriazole compound include the following compounds.
  • Examples of the tetrazole compound include the following compounds.
  • Examples of the thiadiazole compound include the following compounds.
  • Examples of the triazine compound include the following compounds.
  • Examples of the loadonine compound include the following compounds.
  • Examples of the thiazole compound include the following compounds.
  • benzothiazole compound examples include the following compounds.
  • Examples of the benzimidazole compound include the following compounds.
  • benzoxazole compound examples include the following compounds.
  • the heterocyclic compound may be used alone or in combination of two or more.
  • the content of the heterocyclic compound is preferably 0.01% by mass to 20.0% by mass, preferably 0.10% by mass, based on the total mass of the photosensitive resin layer. It is more preferably ⁇ 10.0% by mass, further preferably 0.30% by mass to 8.0% by mass, and particularly preferably 0.50% by mass to 5.0% by mass.
  • the photosensitive resin layer may contain an aliphatic thiol compound.
  • the photosensitive resin layer contains an aliphatic thiol compound, the aliphatic thiol compound undergoes an en-thiol reaction with a radically polymerizable compound having an ethylenically unsaturated group, so that the film formed is cured and shrunk. It is suppressed and the stress is relieved.
  • aliphatic thiol compound a monofunctional aliphatic thiol compound or a polyfunctional aliphatic thiol compound (that is, a bifunctional or higher functional aliphatic thiol compound) is preferable.
  • a polyfunctional aliphatic thiol compound is more preferable from the viewpoint of adhesion of the formed pattern (particularly, adhesion after exposure).
  • the term "polyfunctional aliphatic thiol compound” means an aliphatic compound having two or more thiol groups (also referred to as "mercapto groups”) in the molecule.
  • the polyfunctional aliphatic thiol compound a low molecular weight compound having a molecular weight of 100 or more is preferable. Specifically, the molecular weight of the polyfunctional aliphatic thiol compound is more preferably 100 to 1,500, and even more preferably 150 to 1,000.
  • the number of functional groups of the polyfunctional aliphatic thiol compound for example, bifunctional to 10 functional is preferable, bifunctional to 8 functional is more preferable, and bifunctional to 6 functional is further preferable, from the viewpoint of adhesion of the formed pattern. preferable.
  • polyfunctional aliphatic thiol compound examples include trimethylolpropanetris (3-mercaptobutylate), 1,4-bis (3-mercaptobutylyloxy) butane, pentaerythritol tetrakis (3-mercaptobutyrate), and the like.
  • the polyfunctional aliphatic thiol compounds include trimethylolpropane tris (3-mercaptobutyrate), 1,4-bis (3-mercaptobutylyloxy) butane, and 1,3,5-tris. At least one compound selected from the group consisting of (3-mercaptobutylyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione is preferred.
  • Examples of the monofunctional aliphatic thiol compound include 1-octanethiol, 1-dodecanethiol, ⁇ -mercaptopropionic acid, methyl-3-mercaptopropionate, 2-ethylhexyl-3-mercaptopropionate, and n-. Examples thereof include octyl-3-mercaptopropionate, methoxybutyl-3-mercaptopropionate, and stearyl-3-mercaptopropionate.
  • the photosensitive resin layer may contain one kind of aliphatic thiol compound alone, or may contain two or more kinds of aliphatic thiol compounds.
  • the content of the aliphatic thiol compound is preferably 5% by mass or more, more preferably 5% by mass to 50% by mass, based on the total mass of the photosensitive resin layer. 5, 5% by mass to 30% by mass is more preferable, and 8% by mass to 20% by mass is particularly preferable.
  • the photosensitive resin layer preferably contains a heat-crosslinkable compound from the viewpoint of the strength of the obtained cured film and the adhesiveness of the obtained uncured film.
  • the heat-crosslinkable compound used in the photosensitive resin layer of the second embodiment the above-mentioned heat-crosslinkable compound is preferably used in the photosensitive resin layer of the first embodiment.
  • the heat-crosslinkable compound may be used alone or in combination of two or more.
  • the content of the heat-crosslinkable compound is preferably 1% by mass to 50% by mass, preferably 5% by mass to 30% by mass, based on the total mass of the photosensitive resin layer. Is more preferable.
  • the photosensitive resin layer may contain a surfactant.
  • the surfactant used in the photosensitive resin layer of the second embodiment the above-mentioned surfactant is preferably used in the photosensitive resin layer of the first embodiment.
  • the surfactant may be used alone or in combination of two or more.
  • the content of the surfactant is preferably 0.01% by mass to 3.0% by mass, preferably 0.01% by mass, based on the total mass of the photosensitive resin layer. -1.0% by mass is more preferable, and 0.05% by mass to 0.80% by mass is further preferable.
  • the photosensitive resin layer may contain a polymerization inhibitor.
  • the polymerization inhibitor means a compound having a function of delaying or prohibiting a polymerization reaction.
  • a known compound used as a polymerization inhibitor can be used.
  • polymerization inhibitor examples include phenothiazine compounds such as phenothiazine, bis- (1-dimethylbenzyl) phenothiazine, and 3,7-dioctylphenothiazine; bis [3- (3-tert-butyl-4-hydroxy-5-.
  • Methylphenyl) propionic acid [ethylene bis (oxyethylene)] 2,4-bis [(laurylthio) methyl] -o-cresol, 1,3,5-tris (3,5-di-t-butyl-4-) Hydroxybenzyl), 1,3,5-tris (4-t-butyl-3-hydroxy-2,6-dimethylbenzyl), 2,4-bis- (n-octylthio) -6- (4-hydroxy-3) , 5-Di-t-butylanilino) -1,3,5-triazine, and hindered phenol compounds such as pentaerythritol tetrakis 3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate; 4 -Nitroso compounds such as nitrosophenol, N-nitrosodiphenylamine, N-nitrosocyclohexylhydroxylamine, and N-nitrosophenylhydroxylamine or salts thereof;
  • quinone compounds such as 4-benzoquinone; phenolic compounds such as 4-methoxyphenol, 4-methoxy-1-naphthol, and t-butylcatechol; copper dibutyldithiocarbamate, copper diethyldithiocarbamate, manganese diethyldithiocarbamate, And a metal salt compound such as manganese diphenyldithiocarbamate can be mentioned.
  • At least one selected from the group consisting of a phenylothiazine compound, a nitroso compound or a salt thereof, and a hindered phenol compound is preferable as the polymerization inhibitor because the effect in the present disclosure is more excellent, and phenylothiazine and bis [3].
  • a phenylothiazine compound, a nitroso compound or a salt thereof, and a hindered phenol compound is preferable as the polymerization inhibitor because the effect in the present disclosure is more excellent, and phenylothiazine and bis [3].
  • -(3-tert-Butyl-4-hydroxy-5-methylphenyl) propionic acid] [ethylenebis (oxyethylene)] 2,4-bis [(laurylthio) methyl] -o-cresol, 1,3,5- Tris (3,5-di-t-butyl-4-hydroxybenzyl) and N-nitrosophenylhydroxylamine aluminum salt are more preferred.
  • the polymerization inhibitor may be used alone or in combination of two or more.
  • the content of the polymerization inhibitor is preferably 0.01% by mass to 10.0% by mass, preferably 0.01% by mass, based on the total mass of the photosensitive resin layer. -5.0% by mass is more preferable, and 0.04% by mass to 3.0% by mass is further preferable.
  • the photosensitive resin layer may contain a hydrogen donating compound.
  • the hydrogen donating compound has an action of further improving the sensitivity of the photopolymerization initiator to active light rays and suppressing the inhibition of the polymerization of the polymerizable compound by oxygen.
  • Examples of the hydrogen donating compound include amines and amino acid compounds.
  • Examples of amines include M.I. R. Sander et al., "Journal of Polymer Society", Vol. 10, pp. 3173 (1972), Japanese Patent Application Laid-Open No. 44-020189, Japanese Patent Application Laid-Open No. 51-082102, Japanese Patent Application Laid-Open No. 52-134692, Japanese Patent Application Laid-Open No. 59-138205. Examples thereof include the compounds described in Japanese Patent Application Laid-Open No. 60-0843305, Japanese Patent Application Laid-Open No. 62-018537, Japanese Patent Application Laid-Open No. 64-033104, and Research Disclosure No. 33825.
  • examples thereof include dimethylaniline and p-methylthiodimethylaniline.
  • at least one selected from the group consisting of 4,4'-bis (diethylamino) benzophenone and tris (4-dimethylaminophenyl) methane is preferable as the amines in that the effect in the present disclosure is more excellent. ..
  • amino acid compound examples include N-phenylglycine, N-methyl-N-phenylglycine, and N-ethyl-N-phenylglycine.
  • N-phenylglycine is preferable as the amino acid compound in that the effect in the present disclosure is more excellent.
  • Examples of the hydrogen donor compound include an organometallic compound (tributyltin acetate, etc.) described in JP-A-48-042965, a hydrogen donor described in JP-A-55-0344414, and JP-A-6.
  • a sulfur compound (Trithian and the like) described in JP-A-308727 can also be mentioned.
  • the hydrogen donating compound may be used alone or in combination of two or more.
  • the content of the hydrogen donating compound is based on the total mass of the photosensitive resin layer in terms of improving the curing rate due to the balance between the polymerization growth rate and the chain transfer. , 0.01% by mass to 10.0% by mass, more preferably 0.01% by mass to 8.0% by mass, still more preferably 0.03% by mass to 5.0% by mass.
  • the photosensitive resin layer may contain a predetermined amount of impurities.
  • the impurities in the photosensitive resin layer of the second embodiment are the same as in the preferred embodiment of the impurities described above in the photosensitive resin layer of the first embodiment.
  • the photosensitive resin layer may contain a residual monomer corresponding to each structural unit of the binder polymer described above.
  • the residual monomer corresponding to each structural unit of the binder polymer in the photosensitive resin layer of the second embodiment the residual monomer corresponding to each structural unit of the alkali-soluble resin described above in the photosensitive resin layer of the first embodiment. It is the same as the preferable aspect of.
  • the photosensitive resin layer may contain components other than the components described above (hereinafter, also referred to as “other components”).
  • Other components include, for example, colorants, antioxidants, and particles (eg, metal oxide particles).
  • other additives described in paragraphs 0058 to 0071 of JP-A-2000-310706 can also be mentioned.
  • metal oxide particles are preferable.
  • the metal in the metal oxide particles also includes metalloids such as B, Si, Ge, As, Sb, and Te.
  • the average primary particle diameter of the particles is preferably 1 nm to 200 nm, more preferably 3 nm to 80 nm, for example, from the viewpoint of transparency of the cured film.
  • the average primary particle size of the particles is calculated by measuring the particle size of 200 arbitrary particles using an electron microscope and arithmetically averaging the measurement results. If the shape of the particle is not spherical, the longest side is the particle diameter.
  • the photosensitive resin layer may contain only one kind of particles having different metal types and sizes, or may contain two or more kinds of particles.
  • the photosensitive resin layer does not contain particles, or when the photosensitive resin layer contains particles, the content of the particles is more than 0% by mass and 35% by mass or less with respect to the total mass of the photosensitive resin layer. It is preferable that the particles are not contained, or the content of the particles is more than 0% by mass and 10% by mass or less based on the total mass of the photosensitive resin layer, and the particles are not contained or the particles are contained.
  • the amount is more preferably more than 0% by mass and 5% by mass or less with respect to the total mass of the photosensitive resin layer, and either does not contain particles or the content of particles is 0% by mass with respect to the total mass of the photosensitive resin layer. Ultra 1% by mass or less is more preferable, and it is particularly preferable that particles are not contained.
  • the photosensitive resin layer may contain a colorant (pigment, dye, etc.), but for example, from the viewpoint of transparency, it is preferable that the photosensitive resin layer contains substantially no colorant.
  • the content of the colorant is preferably less than 1% by mass, more preferably less than 0.1% by mass, based on the total mass of the photosensitive resin layer.
  • the antioxidant examples include 1-phenyl-3-pyrazolidone (also known as phenidone), 1-phenyl-4,4-dimethyl-3-pyrazolidone, and 1-phenyl-4-methyl-4-hydroxymethyl-.
  • 3-Pyrazoridones such as 3-pyrazolidone; polyhydroxybenzenes such as hydroquinone, catechol, pyrogallol, methylhydroquinone, and chlorhydroquinone; paramethylaminophenol, paraaminophenol, parahydroxyphenylglycine, and paraphenylenediamine. Be done.
  • 3-pyrazolidones are preferable as the antioxidant, and 1-phenyl-3-pyrazolidone is more preferable as the antioxidant in that the effect in the present disclosure is more excellent.
  • the content of the antioxidant is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, based on the total mass of the photosensitive resin layer. 0.01% by mass or more is more preferable.
  • the upper limit is not particularly limited, but is preferably 1% by mass or less.
  • the thickness of the photosensitive resin layer is not particularly limited, but is often 30 ⁇ m or less, and is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, still more preferably 10 ⁇ m or less, and further preferably 5.0 ⁇ m in that the effect in the present disclosure is more excellent.
  • the following are particularly preferred.
  • As the lower limit 0.60 ⁇ m or more is preferable, and 1.5 ⁇ m or more is more preferable, because the strength of the film obtained by curing the photosensitive resin layer is excellent.
  • the thickness of the photosensitive resin layer can be calculated as, for example, an average value of any five points measured by cross-sectional observation with a scanning electron microscope (SEM).
  • the refractive index of the photosensitive resin layer is preferably 1.47 to 1.56, more preferably 1.49 to 1.54.
  • the photosensitive resin layer is preferably achromatic. Specifically, the total reflection (incident angle 8 °, light source: D-65 (2 ° field of view)) has an L * value of 10 to 90 in the CIE1976 (L * , a * , b * ) color space.
  • the a * value is preferably ⁇ 1.0 to 1.0
  • the b * value is preferably ⁇ 1.0 to 1.0.
  • the pattern (cured film of the photosensitive resin layer) obtained by curing the photosensitive resin layer is preferably achromatic.
  • the total reflection (incident angle 8 °, light source: D-65 (2 ° field of view)) has a pattern L * value of 10 to 90 in the CIE1976 (L * , a * , b * ) color space.
  • the a * value of the pattern is preferably ⁇ 1.0 to 1.0
  • the b * value of the pattern is preferably ⁇ 1.0 to 1.0.
  • the photosensitive transfer material preferably has a refractive index adjusting layer.
  • a known refractive index adjusting layer can be applied.
  • the material contained in the refractive index adjusting layer include a binder polymer, a polymerizable compound, a metal salt, and particles.
  • the method for controlling the refractive index of the refractive index adjusting layer is not particularly limited, and for example, a method using a resin having a predetermined refractive index alone, a method using a resin and particles, and a composite of a metal salt and a resin are used. Is mentioned.
  • binder polymer and the polymerizable compound examples include the binder polymer and the polymerizable compound described in the above section “Photosensitive resin layer”.
  • the particles include metal oxide particles and metal particles.
  • the type of the metal oxide particles is not particularly limited, and examples thereof include known metal oxide particles.
  • the metal in the metal oxide particles also includes metalloids such as B, Si, Ge, As, Sb, and Te.
  • the average primary particle diameter of the particles is preferably 1 nm to 200 nm, more preferably 3 nm to 80 nm, for example, from the viewpoint of transparency of the cured film.
  • the average primary particle size of the particles is calculated by measuring the particle size of 200 arbitrary particles using an electron microscope and arithmetically averaging the measurement results. If the shape of the particle is not spherical, the longest side is the particle diameter.
  • the metal oxide particles include zirconium oxide particles (ZrO 2 particles), Nb 2 O 5 particles, titanium oxide particles (TIO 2 particles), silicon dioxide particles (SiO 2 particles), and a composite thereof. At least one selected from the group consisting of particles is preferable. Among these, as the metal oxide particles, for example, at least one selected from the group consisting of zirconium oxide particles and titanium oxide particles is more preferable because the refractive index can be easily adjusted.
  • metal oxide particles include fired zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT% -F04) and fired zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT% -F74).
  • Fired zirconium oxide particles (CIK Nanotech Co., Ltd., product name: ZRPGM15WT% -F75), fired zirconium oxide particles (CIK Nanotech Co., Ltd., product name: ZRPGM15WT% -F76), zirconium oxide particles (Nano Teen OZ) -S30M, manufactured by Nissan Chemical Industry Co., Ltd.) and zirconium oxide particles (Nano Teen OZ-S30K, manufactured by Nissan Chemical Industry Co., Ltd.).
  • the particles may be used alone or in combination of two or more.
  • the content of the particles in the refractive index adjusting layer is preferably 1% by mass to 95% by mass, more preferably 20% by mass to 90% by mass, and 40% by mass to 85% by mass with respect to the total mass of the refractive index adjusting layer. More preferred.
  • the content of the titanium oxide particles is preferably 1% by mass to 95% by mass, more preferably 20% by mass to 90% by mass, based on the total mass of the refractive index adjusting layer. , 40% by mass to 85% by mass is more preferable.
  • the refractive index of the refractive index adjusting layer is preferably higher than that of the photosensitive resin layer.
  • the refractive index of the refractive index adjusting layer is preferably 1.50 or more, more preferably 1.55 or more, further preferably 1.60 or more, and particularly preferably 1.65 or more.
  • the upper limit of the refractive index of the refractive index adjusting layer is preferably 2.10 or less, more preferably 1.85 or less, further preferably 1.78 or less, and particularly preferably 1.74 or less.
  • the thickness of the refractive index adjusting layer is preferably 50 nm to 500 nm, more preferably 55 nm to 110 nm, and even more preferably 60 nm to 100 nm.
  • the method for producing the photosensitive transfer material of the second embodiment is not particularly limited, and a known method can be used.
  • a method for producing the photosensitive transfer material 10 shown in FIG. 2 for example, a photosensitive resin composition is applied to the surface of the temporary support 1 to form a coating film, and the coating film is further dried to form a photosensitive resin.
  • the step of forming the layer 3 and the composition for forming the refractive index adjusting layer are applied to the surface of the photosensitive resin layer 3 to form a coating film, and the coating film is further dried to form the refractive index adjusting layer 5. Examples include steps and methods including.
  • the photosensitive transfer material 10 is manufactured by crimping the protective film 7 onto the refractive index adjusting layer 5 of the laminate manufactured by the above-mentioned manufacturing method.
  • the method for producing the photosensitive transfer material of the first embodiment temporarily includes a step of providing a protective film 7 so as to be in contact with the surface of the refractive index adjusting layer 5 opposite to the side having the temporary support 1. It is preferable to manufacture the photosensitive transfer material 10 including the support 1, the transfer layer 2 including the photosensitive resin layer 3 and the refractive index adjusting layer 5, and the protective film 7.
  • the photosensitive transfer material 10 in the form of a roll may be manufactured and stored by winding the photosensitive transfer material 10.
  • the photosensitive transfer material in the form of a roll can be provided as it is in the bonding process with the substrate by the roll-to-roll method described later.
  • the method for producing the photosensitive transfer material 10 is a method in which the refractive index adjusting layer 5 is formed on the protective film 7 and then the photosensitive resin layer 3 is formed on the surface of the refractive index adjusting layer 5. You may. Further, as a method for producing the photosensitive transfer material 10, the photosensitive resin layer 3 is formed on the temporary support 1, and the refractive index adjusting layer 5 is separately formed on the protective film 7, and the photosensitive resin layer is formed. A method may be used in which the refractive index adjusting layer 5 is bonded to the 3 and the refractive index adjusting layer 5.
  • the method for forming the photosensitive resin composition and the photosensitive resin layer in the second embodiment is the same as the method for forming the photosensitive resin composition and the photosensitive resin layer described above in the first embodiment, which is a preferred embodiment. Is the same.
  • composition for forming a refractive index adjusting layer and a method for forming the refractive index adjusting layer preferably contains various components forming the above-mentioned refractive index adjusting layer and a solvent.
  • the preferable range of the content of each component with respect to the total solid content of the composition is the same as the preferable range of the content of each component with respect to the total mass of the refractive index adjusting layer described above. be.
  • the solvent is not particularly limited as long as it can dissolve or disperse the components contained in the refractive index adjusting layer, and at least one selected from the group consisting of water and a water-miscible organic solvent is preferable, with water or water.
  • a mixed solvent with a water-miscible organic solvent is more preferable.
  • the water-miscible organic solvent include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin, and alcohols having 1 to 3 carbon atoms are preferable, and methanol or ethanol is more preferable.
  • the solvent may be used alone or in combination of two or more.
  • the content of the solvent is preferably 50 parts by mass to 2,500 parts by mass, more preferably 50 parts by mass to 1,900 parts by mass, and 100 parts by mass to 900 parts by mass with respect to 100 parts by mass of the total solid content of the composition.
  • the unit is more preferable.
  • the method for forming the refractive index adjusting layer is not particularly limited as long as it can form a layer containing the above components, and examples thereof include known coating methods (slit coating, spin coating, curtain coating, inkjet coating, etc.). Be done.
  • the photosensitive transfer material of the second embodiment can be manufactured.
  • the method of attaching the protective film to the refractive index adjusting layer is not particularly limited, and known methods can be mentioned.
  • Examples of the device for adhering the protective film to the refractive index adjusting layer include a vacuum laminator and a known laminator such as an auto-cut laminator. It is preferable that the laminator is provided with an arbitrary heatable roller such as a rubber roller and can be pressurized and heated.
  • the method for producing a resin pattern according to the present disclosure is a method for producing a resin pattern for forming a resin pattern on a substrate by using the photosensitive transfer material according to the present disclosure.
  • the method for producing the resin pattern includes a step of peeling the protective film from the photosensitive transfer material according to the present disclosure (hereinafter, also referred to as “protective film peeling step”), and the above-mentioned photosensitive transfer material from which the protective film has been peeled off.
  • a step of bringing the outermost layer on the side having the photosensitive resin layer to the temporary support in contact with a substrate (preferably a substrate having a conductive layer) and bonding them (hereinafter, also referred to as “bonding step”).
  • a step of pattern-exposing the photosensitive resin layer via the temporary support (hereinafter, also referred to as “exposure step”) and a step of developing the exposed photosensitive resin layer to form a resin pattern (hereinafter, “exposed step”). It is also referred to as "development step”), and a method including the above in this order is preferable.
  • the method for producing a laminate according to the present disclosure is a method for producing a laminate having a resin pattern on a substrate using the photosensitive transfer material according to the present disclosure.
  • a method for producing the laminate a method including the protective film peeling step, the bonding step, the exposure step, and the developing step in this order is preferable.
  • the etching method according to the present disclosure is not particularly limited as long as it is a method using the photosensitive transfer material according to the present disclosure.
  • the resin pattern is arranged in a laminate in which the substrate, the conductive layer, and the resin pattern manufactured by the method for manufacturing the resin pattern according to the present disclosure are laminated in this order.
  • a method including a step of etching the conductive layer in a region not provided is preferable.
  • each step included in the resin pattern manufacturing method, the laminated body manufacturing method, and the etching method will be described, but unless otherwise specified, each step included in the resin pattern manufacturing method or the laminated body manufacturing method will be described. The contents of the above shall also be applied to each step included in the etching method.
  • the method for producing the resin pattern or the method for producing the laminate preferably includes a step of peeling the protective film from the photosensitive transfer material according to the present disclosure.
  • the method of peeling the protective film is not limited, and a known method can be applied.
  • the method for producing the resin pattern or the method for producing the laminate includes a bonding step.
  • the substrate or the conductive layer if the conductive layer is provided on the surface of the substrate
  • the substrate is brought into contact with the outermost layer on the side having the photosensitive resin layer with respect to the temporary support of the photosensitive transfer material.
  • the pattern-formed photosensitive after exposure and development is improved.
  • the resin layer can be suitably used as an etching resist when etching the conductive layer.
  • a layer other than the protective film (for example, a high refractive index layer and / or a low refractive index layer) is further formed on the surface of the photosensitive resin layer on the side where the photosensitive transfer material does not face the temporary support.
  • the surface of the photosensitive resin layer on the side that does not have the temporary support and the substrate are bonded to each other via the layer.
  • the method of crimping the substrate and the photosensitive transfer material is not particularly limited, and a known transfer method or laminating method can be used.
  • the photosensitive transfer material is bonded to the substrate by superimposing the outermost layer on the side having the photosensitive resin layer on the temporary support of the photosensitive transfer material on the substrate, and pressurizing and heating by means such as a roll. It is preferable that this is done by applying.
  • a known laminator such as a laminator, a vacuum laminator, and an auto-cut laminator capable of further increasing productivity can be used.
  • the laminating temperature is not particularly limited, but is preferably 70 ° C to 130 ° C, for example.
  • the resin pattern manufacturing method and the etching method including the bonding step are performed by a roll-to-roll method.
  • the roll-to-roll method uses a substrate that can be wound and unwound as a substrate, and winds the substrate or a structure containing the substrate before any of the steps included in the resin pattern manufacturing method or the etching method.
  • the unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and a known method may be used in the manufacturing method to which the roll-to-roll method is applied.
  • a known substrate may be used, but a substrate having a conductive layer is preferable, and it is more preferable to have a conductive layer on the surface of the substrate.
  • the substrate may have any layer other than the conductive layer, if necessary.
  • the substrate include a resin substrate, a glass substrate, and a semiconductor substrate.
  • Preferred embodiments of the substrate include, for example, description in paragraph 0140 of WO 2018/155193, the contents of which are incorporated herein.
  • the base material constituting the substrate examples include glass, silicon and a film.
  • the substrate constituting the substrate is preferably transparent.
  • transparent means that the transmittance of light having a wavelength of 400 nm to 700 nm is 80% or more.
  • the refractive index of the substrate constituting the substrate is preferably 1.50 to 1.52.
  • the transparent glass substrate examples include tempered glass represented by Corning's gorilla glass. Further, as the transparent glass substrate, the materials used in JP-A-2010-86684, JP-A-2010-152809 and JP-A-2010-257492 can be used.
  • a film substrate When a film substrate is used as the substrate, it is preferable to use a film substrate with low optical distortion and / or high transparency.
  • film substrates include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, triacetyl cellulose and cycloolefin polymers.
  • a film substrate is preferable when it is manufactured by the roll-to-roll method. Further, when the circuit wiring for the touch panel is manufactured by the roll-to-roll method, it is preferable that the substrate is a sheet-like resin composition.
  • the conductive layer included in the substrate examples include a conductive layer used for general circuit wiring or touch panel wiring.
  • the conductive layer at least one layer selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer and a conductive polymer layer is preferable from the viewpoint of conductivity and fine wire forming property.
  • a metal layer is more preferable, and a copper layer or a silver layer is further preferable.
  • the substrate may have one conductive layer alone, or may have two or more conductive layers. When having two or more conductive layers, it is preferable to have conductive layers made of different materials.
  • Examples of the material of the conductive layer include metals and conductive metal oxides.
  • Examples of the metal include Al, Zn, Cu, Fe, Ni, Cr, Mo, Ag and Au.
  • Examples of the conductive metal oxide include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) and SiO 2 .
  • conductivity means that the volume resistivity is less than 1 ⁇ 106 ⁇ cm.
  • the volume resistivity of the conductive metal oxide is preferably less than 1 ⁇ 10 4 ⁇ cm.
  • a resin pattern is produced using a substrate having a plurality of conductive layers
  • the conductive layer an electrode pattern corresponding to the sensor of the visual recognition portion used in the capacitive touch panel or wiring of the peripheral extraction portion is preferable.
  • Preferred embodiments of the conductive layer include, for example, description in paragraph 0141 of WO 2018/155193, the contents of which are incorporated herein.
  • a substrate having at least one of a transparent electrode and a routing wire is preferable.
  • the above-mentioned substrate can be suitably used as a touch panel substrate.
  • the transparent electrode may function suitably as a touch panel electrode.
  • the transparent electrode is preferably composed of a metal oxide film such as ITO (indium tin oxide) and IZO (indium zinc oxide), a metal mesh, and a fine metal wire such as silver nanowire.
  • the thin metal wire include thin wires such as silver and copper. Of these, silver conductive materials such as silver mesh and silver nanowires are preferable.
  • Metal is preferable as the material of the routing wiring.
  • the metal that is the material of the routing wiring include gold, silver, copper, molybdenum, aluminum, titanium, chromium, zinc, and manganese, and alloys composed of two or more of these metal elements.
  • copper, molybdenum, aluminum, or titanium is preferable, and copper is particularly preferable.
  • the electrode protective film for a touch panel formed by using the photosensitive transfer material according to the present disclosure directly or other electrodes for the purpose of protecting the electrodes and the like (that is, at least one of the electrodes for the touch panel and the wiring for the touch panel). It is preferably provided so as to cover the layers.
  • the method for manufacturing the resin pattern or the method for manufacturing the laminate includes a step (exposure step) of pattern-exposing the photosensitive resin layer after the above-mentioned bonding step.
  • the "pattern exposure” refers to an exposure in a form of exposure in a pattern, that is, a form in which an exposed portion and a non-exposed portion are present.
  • the positional relationship between the exposed area and the unexposed area in the pattern exposure is not particularly limited and is appropriately adjusted.
  • the detailed arrangement and specific size of the pattern in the pattern exposure are not particularly limited.
  • at least a part (preferably) of the pattern so as to improve the display quality of a display device (for example, a touch panel) having an input device having circuit wiring manufactured by an etching method and to reduce the area occupied by the take-out wiring.
  • the electrode pattern and / or the portion of the take-out wiring of the touch panel preferably contains a thin wire having a width of 20 ⁇ m or less, and more preferably contains a thin wire having a width of 10 ⁇ m or less.
  • the light source used for exposure can be appropriately selected and used as long as it is a light source that irradiates the photosensitive resin layer with light having a wavelength that allows exposure (for example, 365 nm or 405 nm). Specific examples thereof include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps and LEDs (Light Emitting Diodes).
  • the exposure amount is preferably 5 mJ / cm 2 to 200 mJ / cm 2 , more preferably 10 mJ / cm 2 to 100 mJ / cm 2 .
  • Preferred embodiments of the light source, exposure amount and exposure method used for exposure include, for example, paragraphs 0146 to 0147 of International Publication No. 2018/155193, the contents of which are incorporated herein.
  • the temporary support may be peeled off from the photosensitive resin layer and then the pattern exposure may be performed. Before the temporary support is peeled off, the pattern is exposed through the temporary support, and then the temporary support is peeled off. You may.
  • the mask When the temporary support is peeled off before exposure, the mask may be exposed in contact with the photosensitive resin layer, or may be exposed in close proximity without contact.
  • the temporary support When the temporary support is exposed without being peeled off, the mask may be exposed in contact with the temporary support, or may be exposed in close contact with the temporary support without contact. In order to prevent mask contamination due to contact between the photosensitive resin layer and the mask and to avoid the influence of foreign matter adhering to the mask on the exposure, it is preferable to perform pattern exposure without peeling the temporary support.
  • the exposure method may be a contact exposure method in the case of contact exposure, a proximity exposure method in the case of a non-contact exposure method, a lens-based or mirror-based projection exposure method, or a direct exposure method using an exposure laser or the like. It can be selected and used.
  • an exposure machine having an appropriate numerical aperture (NA) of the lens can be used according to the required resolving power and depth of focus.
  • drawing may be performed directly on the photosensitive resin layer, or reduced projection exposure may be performed on the photosensitive resin layer via a lens. Further, the exposure may be performed not only in the atmosphere but also under reduced pressure or vacuum, or may be exposed by interposing a liquid such as water between the light source and the photosensitive resin layer.
  • the resin pattern manufacturing method, the laminated body manufacturing method, or the etching method includes a peeling step of peeling off the temporary support between the bonding step and the exposure step, or between the exposure step and the developing step. May be good.
  • the method for peeling the temporary support is not particularly limited, and a mechanism similar to the cover film peeling mechanism described in paragraphs 0161 to 0162 of JP2010-072589 can be used.
  • the method for producing a resin pattern or the method for producing a laminate preferably includes, after the above-mentioned exposure step, a step (development step) of developing the exposed photosensitive resin layer to form a resin pattern.
  • a step (development step) of developing the exposed photosensitive resin layer to form a resin pattern In the developing process, the photosensitive resin layer in the non-image area and other layers in the non-image area are removed. Further, in the developing step, other layers located on the photosensitive resin layer after exposure in the exposed portion may also be removed in a form of being dissolved or dispersed in the developing solution.
  • the exposed photosensitive resin layer can be developed by using a developing solution in the developing step.
  • the developing solution is not particularly limited as long as it can remove the non-image portion of the photosensitive resin layer, and for example, a known developing solution such as the developing solution described in JP-A-5-72724 can be used.
  • the developer may contain a water-soluble organic solvent and / or a surfactant.
  • the developer the developer described in paragraph 0194 of International Publication No. 2015/093271 is also preferably mentioned.
  • Preferred development methods include, for example, the development method described in paragraph 0195 of International Publication No. 2015/093271.
  • the development method is not particularly limited, and may be any of paddle development, shower development, shower and spin development, and dip development.
  • Shower development is a development process for removing non-image areas by spraying a developer onto the photosensitive resin layer after exposure with a shower. After the developing step, it is preferable to spray the cleaning agent with a shower and rub with a brush to remove the developing residue.
  • the liquid temperature of the developing solution is not particularly limited, but is preferably 20 ° C to 40 ° C.
  • the method for producing a resin pattern or the method for producing a laminate includes a step of exposing the resin pattern obtained by the above developing step (post-exposure step) and / or a step of heating (post-baking step). May be good. When both the post-exposure step and the post-baking step are included, it is preferable to carry out post-baking after post-exposure.
  • the etching method preferably includes a step (etching step) of etching the substrate in a region where the resin pattern is not arranged.
  • the resin pattern formed from the photosensitive resin layer is used as an etching resist, and the conductive layer is etched.
  • a method of etching treatment a known method can be applied, and for example, the method described in paragraphs 0209 to 0210 of JP-A-2017-120435 and paragraph 0048-paragraph 0054 of JP-A-2010-152155. Examples thereof include a wet etching method in which the material is immersed in an etching solution, and a dry etching method such as plasma etching.
  • an acidic or alkaline etching solution may be appropriately selected according to the etching target.
  • the acidic etching solution include an aqueous solution of an acidic component alone selected from hydrochloric acid, sulfuric acid, nitric acid, acetic acid, hydrofluoric acid, oxalic acid and phosphoric acid, and the acidic component, ferric chloride, ammonium fluoride and Examples thereof include a mixed aqueous solution with a salt selected from potassium permanganate.
  • the acidic component may be a component in which a plurality of acidic components are combined.
  • the alkaline etching solution includes an aqueous solution of an alkaline component alone selected from sodium hydroxide, potassium hydroxide, ammonia, an organic amine, and a salt of an organic amine (tetramethylammonium hydroxide, etc.), and an alkaline component and a salt. Examples thereof include a mixed aqueous solution with (potassium permanganate, etc.).
  • the alkaline component may be a component in which a plurality of alkaline components are combined.
  • etching method it is preferable to perform a step (removal step) of removing the remaining resin pattern.
  • the removing step is not particularly limited and can be performed as needed, but it is preferably performed after the etching step.
  • the method for removing the remaining resin pattern is not particularly limited, and examples thereof include a method for removing by chemical treatment, and a method for removing with a removing liquid is preferable.
  • a method for removing the photosensitive resin layer a substrate having a residual resin pattern is placed in a stirring liquid having a liquid temperature of preferably 30 ° C. to 80 ° C., more preferably 50 ° C. to 80 ° C. for 1 minute. A method of immersing for 30 minutes can be mentioned.
  • the removing liquid examples include a removing liquid in which an inorganic alkaline component or an organic alkaline component is dissolved in water, dimethyl sulfoxide, N-methylpyrrolidone, or a mixed solution thereof.
  • examples of the inorganic alkaline component include sodium hydroxide and potassium hydroxide.
  • examples of the organic alkali component include a primary amine compound, a secondary amine compound, a tertiary amine compound and a quaternary ammonium salt compound.
  • the removing liquid may be used and removed by a known method such as a spray method, a shower method and a paddle method.
  • the resin pattern manufacturing method, the laminated body manufacturing method, and the etching method may include any steps (other steps) other than the above-mentioned steps.
  • the following steps can be mentioned, but the steps are not limited to these steps.
  • examples of the exposure step, the developing step, and other steps applicable to the etching method include the steps described in paragraphs 0035 to 0051 of JP-A-2006-23696.
  • a step of reducing the visible light reflectance described in paragraph 0172 of International Publication No. 2019/022089 a new step on the insulating film described in paragraph 0172 of International Publication No. 2019/022089. Examples thereof include a step of forming a conductive layer, but the process is not limited to these steps.
  • the etching method may include a step of reducing the visible light reflectance of a part or all of the plurality of conductive layers of the substrate.
  • the treatment for reducing the visible light reflectance include an oxidation treatment.
  • the visible light reflectance of the conductive layer can be lowered by oxidizing copper to obtain copper oxide and blackening the conductive layer.
  • the treatment for reducing the visible light reflectance is described in paragraphs 0017 to 0025 of JP-A-2014-150118 and paragraphs 0041, 0042, 0048 and 0058 of JP-2013-206315. , The contents of these publications are incorporated herein.
  • the etching method preferably includes a step of forming an insulating film on the surface of the circuit wiring and a step of forming a new conductive layer on the surface of the insulating film.
  • a second electrode pattern insulated from the first electrode pattern can be formed.
  • the step of forming the insulating film is not particularly limited, and examples thereof include a known method of forming a permanent film.
  • an insulating film having a desired pattern may be formed by photolithography using a photosensitive material having an insulating property.
  • the step of forming the new conductive layer on the insulating film is not particularly limited, and for example, a new conductive layer having a desired pattern may be formed by photolithography using a photosensitive material having conductivity.
  • the etching method uses a substrate having a plurality of conductive layers on both surfaces of the substrate, and sequentially or simultaneously forms a circuit on the conductive layers formed on both surfaces of the substrate.
  • a circuit wiring for a touch panel in which a first conductive pattern is formed on one surface of a substrate and a second conductive pattern is formed on the other surface. It is also preferable to form the touch panel circuit wiring having such a configuration from both sides of the substrate by roll-to-roll.
  • the resin pattern manufactured by the method for manufacturing the resin pattern according to the present disclosure, the laminate manufactured by the method for manufacturing the laminate according to the present disclosure, and the circuit wiring manufactured by the etching method according to the present disclosure are various. It can be applied to the device. Examples of the device provided with the laminated body include an input device and the like, and a touch panel is preferable, and a capacitive touch panel is more preferable. Further, the input device can be applied to a display device such as an organic electroluminescence display device and a liquid crystal display device. When the laminate is applied to a touch panel, the formed resin pattern is preferably used as a protective film for a touch panel electrode or a touch panel wiring. That is, it is preferable that the photosensitive transfer material according to the present disclosure is used for forming an electrode protective film for a touch panel or wiring for a touch panel.
  • the method for manufacturing the electronic device according to the present disclosure is not particularly limited as long as it is a method using the photosensitive transfer material according to the present disclosure.
  • the method for manufacturing the electronic device according to the present disclosure includes a step of peeling the protective film from the photosensitive transfer material according to the present disclosure, and the photosensitive transfer material from which the protective film has been peeled off. The step of bringing the outermost layer on the side having the sex resin layer into contact with the substrate having the conductive layer and adhering them, the step of pattern-exposing the photosensitive resin layer via the temporary support, and the exposure of the photosensitive resin layer.
  • the manufactured electronic device has the above-mentioned resin pattern, including the steps of developing the sex resin layer to form a resin pattern in this order.
  • the electronic device manufactured by the method for manufacturing an electronic device according to the present disclosure preferably has the above resin pattern as a permanent film.
  • each step in the method of manufacturing an electronic device and the embodiment of the order in which each step is performed are as described in the above-mentioned sections of "Manufacturing method of resin pattern" and "Etching method”. Yes, and the preferred embodiment is the same.
  • the method for manufacturing the electronic device a known method for manufacturing the electronic device may be referred to, except that the wiring for the electronic device is formed by the above method. Further, the method for manufacturing an electronic device may include any process (other process) other than those described above.
  • the electronic device is not particularly limited, but is used in the fields of semiconductor packages, printed circuit boards, various wiring forming applications for sensor boards, touch panels, electromagnetic wave shielding materials, conductive films such as film heaters, liquid crystal sealing materials, micromachines or microelectronics. Structures are preferred.
  • the resin pattern is preferably used as a permanent film, for example, an interlayer insulating film, a wiring protective film, a wiring protective film having an index matching layer, or the like in the electronic device.
  • a touch panel is particularly preferable.
  • FIG. 3 and 4 show an example of a mask pattern used for manufacturing a touch panel.
  • GR is a non-image part (light-shielding part)
  • EX is an image part (exposure part)
  • DL virtualizes a frame for alignment. It is shown as a target.
  • a touch panel having a circuit wiring having the pattern A corresponding to EX can be manufactured. .. Specifically, it can be produced by the method shown in FIG. 1 of International Publication No. 2016/190405.
  • the central portion (pattern portion where the qualifications are connected) of the exposed portion EX is the portion where the transparent electrode (touch panel electrode) is formed, and the peripheral portion (thin line portion) of the exposed portion EX is. This is the part where the wiring of the peripheral extraction part is formed.
  • an electronic device having at least wiring for an electronic device is manufactured, and preferably, for example, a touch panel having at least wiring for a touch panel is manufactured.
  • the touch panel preferably has a transparent substrate, electrodes, and an insulating layer or a protective layer.
  • Examples of the detection method on the touch panel include known methods such as a resistance film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method. Above all, the capacitance method is preferable.
  • the touch panel type includes a so-called in-cell type (for example, those shown in FIGS. 5, 6, 7, and 8 of JP-A-2012-51751), and a so-called on-cell type (for example, JP-A-2013-168125).
  • 2013-54727A (described in FIG. 2), various outsell types (so-called GG, G1 / G2, GFF, GF2, GF1, G1F, etc.) and other configurations (for example, Japanese Patent Application Laid-Open No. 2013-164871).
  • Examples of the touch panel include those described in paragraph 0229 of JP-A-2017-120435.
  • the temporary support 1 was produced by the following method.
  • the film thickness of the particle-containing layer was 40 nm as measured from a cross-sectional TEM photograph.
  • the average particle size of the particles contained in the particle-containing layer was measured by the above method using an HT-7700 type transmission electron microscope (TEM) manufactured by Hitachi High-Technologies Corporation, and found to be 50 nm.
  • photosensitive resin compositions 1 to 5 After mixing so as to have the composition shown in Table 1 below, photosensitive resin compositions 1 to 5 (solid content concentration: 25% by mass) were prepared by adding methyl ethyl ketone.
  • BPE-500 2,2-bis (4- (methacryloxypentethoxy) phenyl) propane, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.
  • BPE-200 2,2-bis (4- (methacryloxydiethoxy) phenyl) Propane, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.
  • M-270 Polypropylene glycol diacrylate, manufactured by Toa Synthetic Co., Ltd.
  • A-TMPT Trimethylol propantriacrylate, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.
  • SR-454 ethoxylated ( 3) Trimethylol propantriacrylate, Sartmer SR-502: ethoxylated (9) Trimethylol propantriacrylate, Sartmer A-9300-CL1: ⁇ -caprolactone-modified tris- (2-acryloxyethyl) isocyanurate , Shin-Nakamura Chemical Industry Co., Ltd.
  • B-CIM Photoradical generator (photopolymerization initiator), Hampford, 2- (2-chlorophenyl) -4,5-diphenylimidazole dimer SB-PI 701: Sensitizer, 4,4'-bis (diethylamino) benzophenone, obtained from Sanyo Trading Co., Ltd.
  • CBT-1 rust preventive, carboxybenzotriazole, TDP-G manufactured by Johoku Chemical Industry Co., Ltd .: polymerization inhibitor, phenothiazine , Kawaguchi Chemical Industry Co., Ltd.
  • Irganox245 Hindered phenol polymerizer, BASF F-552: Fluorosurfactant, Megafuck F552, DIC Co., Ltd.
  • ⁇ Preparation of water-soluble resin composition The following components were mixed to prepare a water-soluble resin composition (composition for a water-soluble resin layer). The unit of the amount of each component is a mass part.
  • Ion-exchanged water 38.12 parts Methanol (manufactured by Mitsubishi Gas Chemical Company, Inc.): 57.17 parts Clarepoval 4-88LA (polyvinyl alcohol, manufactured by Kuraray Co., Ltd.): 3.22 parts Polyvinylpyrrolidone K-30 (Japan) Catalyst Co., Ltd.): 1.49 parts Megafuck F-444 (fluorine-based surfactant, manufactured by DIC Co., Ltd.): 0.0035 parts
  • thermoplastic resin composition The following components were mixed to prepare a thermoplastic resin composition.
  • Dye B-1 (the following compound): 0.1 part
  • Photoacid generator C-1 (the following compound): 0.1 part Plastic agent D-3 (NK ester A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) : 2.2 parts
  • Polymer D-4 (8UX-015A, manufactured by Taisei Fine Chemicals Co., Ltd.): 1.1 parts Polymer D-5 (Aronix TO-2349, manufactured by Toa Synthetic Co., Ltd.): 0.5 parts Megafuck F-551 (Fluorine-based surfactant, manufactured by DIC Co., Ltd.): 0.02 part Phenothiazine: 0.03 part C
  • the dye B-1 is shown below.
  • the photoacid generator C-1 is shown below.
  • thermoplastic resin composition shown in Table 6 is applied onto the temporary support shown in Table 5 using a slit-shaped nozzle so that the coating layer is configured as shown in Tables 5 and 6, and the coating width is 1. It was applied so as to have a layer thickness of 0.0 m and the layer thickness shown in Table 6, and passed through a drying zone at 80 ° C. for 40 seconds to form a thermoplastic resin layer. Then, the water-soluble resin composition shown in Table 6 is applied onto the thermoplastic resin layer using a slit-shaped nozzle so that the coating width is 1.0 m and the layer thickness shown in Table 6 is 80 ° C.
  • the water-soluble resin layer was formed by passing through the drying zone of the above for 40 seconds. Further, the photosensitive resin composition shown in Table 6 is applied onto the water-soluble resin layer using a slit-shaped nozzle so that the coating width is 1.0 m and the layer thickness is as shown in Table 6, and the temperature is 80 ° C. A photosensitive resin layer was formed by passing through the drying zone for 40 seconds. The protective film shown in Table 5 was crimped onto this to prepare a photosensitive transfer material, which was wound into a roll form.
  • the dropping liquid (1) As the preparation of the dropping liquid (1), 107.1 g of methacrylic acid (manufactured by Mitsubishi Rayon Co., Ltd., trade name Acryester M), methyl methacrylate (manufactured by Mitsubishi Gas Chemical Company, trade name MMA) (5.46 g). , And cyclohexyl methacrylate (manufactured by Mitsubishi Gas Chemical Company, Inc., trade name CHMA) (231.42 g) were mixed and diluted with PGM-Ac (60 g) to obtain a dropping liquid (1).
  • methacrylic acid manufactured by Mitsubishi Rayon Co., Ltd., trade name Acryester M
  • methyl methacrylate manufactured by Mitsubishi Gas Chemical Company, trade name MMA
  • CHMA cyclohexyl methacrylate
  • dimethyl 2,2'-azobis (2-methylpropionate) (manufactured by Wako Pure Chemical Industries, Ltd., trade name V-601) (9.637 g) was added to PGM-Ac.
  • a dropping liquid (2) was obtained.
  • the dropping liquid (1) and the dropping liquid (2) are simultaneously added dropwise to the above-mentioned 2,000 mL flask (specifically, a 2,000 mL flask containing a liquid heated to 90 ° C.) over 3 hours. did.
  • the container of the dropping liquid (1) was washed with PGM-Ac (12 g), and the washing liquid was dropped into the 2,000 mL flask.
  • the container of the dropping liquid (2) was washed with PGM-Ac (6 g), and the washing liquid was dropped into the 2000 mL flask.
  • the reaction solution in the 2,000 mL flask was kept at 90 ° C. and stirred at a stirring speed of 250 rpm. Further, as a post-reaction, the mixture was stirred at 90 ° C. for 1 hour.
  • V-601 (2.401 g) was added to the reaction solution after the post-reaction as the first additional addition of the initiator. Further, the container of V-601 was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction liquid. Then, the mixture was stirred at 90 ° C. for 1 hour.
  • V-601 (2.401 g) was added to the reaction solution as the second additional addition of the initiator. Further, the container of V-601 was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction liquid. Then, the mixture was stirred at 90 ° C. for 1 hour. Next, V-601 (2.401 g) was added to the reaction solution as the third additional addition of the initiator. Further, the container of V-601 was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction liquid. Then, the mixture was stirred at 90 ° C. for 3 hours.
  • glycidyl methacrylate manufactured by NOF CORPORATION, trade name Blemmer G (76.03 g) was added dropwise to the reaction solution over 1 hour.
  • the container of Blemmer G was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction liquid. Then, as an addition reaction, the mixture was stirred at 100 ° C. for 6 hours.
  • the reaction solution was cooled and filtered through a mesh filter (100 mesh) for removing dust to obtain a solution of polymer D (1,158 g) (solid content concentration: 36.3% by mass).
  • the obtained polymer P-1 had a weight average molecular weight of 27,000, a number average molecular weight of 15,000, and an acid value of 95 mgKOH / g.
  • V-601 was added 3 times every 1 hour. After that, it was reacted for another 3 hours. Then, it was diluted with 58.4 g of propylene glycol monomethyl ether acetate and 11.7 g of propylene glycol monomethyl ether. The temperature of the reaction solution was raised to 100 ° C. under an air flow, and 0.53 g of tetraethylammonium bromide and 0.26 g of p-methoxyphenol were added. To this, 25.5 g of glycidyl methacrylate (NOF Corporation Blemmer GH) was added dropwise over 20 minutes. This was reacted at 100 ° C.
  • NOF Corporation Blemmer GH glycidyl methacrylate
  • the solid content concentration of the obtained solution was 36.5% by mass.
  • the weight average molecular weight in terms of standard polystyrene in GPC was 17,000, the dispersity was 2.7, and the acid value of the polymer was 95 mgKOH / g.
  • the amount of residual monomer measured by gas chromatography was less than 0.1% by mass with respect to the polymer solid content in any of the monomers.
  • V-601 was added 3 times every 1 hour. After that, it was reacted for another 3 hours. Then, it was diluted with 160.7 g of propylene glycol monomethyl ether acetate and 233.3 g of propylene glycol monomethyl ether. The temperature of the reaction solution was raised to 100 ° C. under an air flow, and 1.8 g of tetraethylammonium bromide and 0.86 g of p-methoxyphenol were added. 71.9 g of glycidyl methacrylate (Blemmer G manufactured by NOF CORPORATION) was added dropwise to this over 20 minutes. This was reacted at 100 ° C.
  • the solid content concentration of the obtained solution was 36.2%.
  • the weight average molecular weight in terms of standard polystyrene in GPC was 18,000, the dispersity was 2.3, and the acid value of the polymer was 124 mgKOH / g.
  • the amount of residual monomer measured by gas chromatography was less than 0.1% by mass with respect to the polymer solid content in any of the monomers.
  • compositions B-1 to B-4 for forming the refractive index adjusting layer were prepared with the compositions shown in Table 3 below.
  • the numerical value of each component in Table 3 represents "part by mass”.
  • Polymer A in Table 3 was synthesized and prepared as follows.
  • 1-Methylpropanol manufactured by Tokyo Chemical Industry Co., Ltd.
  • 270.0 g was introduced into a 1 L three-necked flask, and the temperature was raised to 70 ° C. under a nitrogen stream while stirring.
  • allyl methacrylate (45.6 g) (manufactured by Wako Pure Chemical Industries, Ltd.) and methacrylic acid (14.4 g) (manufactured by Wako Pure Chemical Industries, Ltd.) 1-methoxypropanol (Tokyo Chemical Industry Co., Ltd.) Dissolve in (270.0 g) (manufactured by Fuji Film Co., Ltd.), and further dissolve 3.94 g of V-65 (manufactured by Wako Pure Chemical Industries, Ltd.) to prepare a dropping solution, and put it in a flask for 2.5 hours. The dropping liquid was dropped over. The reaction was carried out while maintaining the stirred state for 2.0 hours.
  • the coating amount was adjusted to an amount such that the film thickness after drying becomes the film thickness shown in Table 4, apply it on the photosensitive resin layer layer, and then dry it at a drying temperature of 80 ° C.
  • the refractive index adjustment layer was formed.
  • a protective film (Lumirror 16QS62, manufactured by Toray Industries, Inc.) was pressure-bonded onto the refractive index adjusting layer to prepare coating layers 11 to 26.
  • a copper layer having a thickness of 200 nm was prepared on a polyethylene terephthalate (PET) film having a thickness of 100 ⁇ m by a sputtering method, and a PET substrate with a copper layer was prepared.
  • PET polyethylene terephthalate
  • the surface energy (unit: mN / m) of the temporary support or the protective film is calculated by the following method.
  • the contact angles of the two liquids, pure water and methylene iodide were measured in an atmosphere of room temperature of 23 ° C and relative humidity of 50% to 60%. Three points were measured by (Kyowa Interface Science Co., Ltd.). The average value of the measured values obtained for each liquid was taken as the contact angle of each of the two types of liquids.
  • the protective film was peeled off from the prepared photosensitive transfer material, and laminated on a PET substrate with a copper layer under laminating conditions of a laminating roll temperature of 100 ° C., a linear pressure of 0.6 MPa, and a linear velocity (laminating rate) of 4.0 m / min.
  • the line-and-space pattern (Duty ratio 1: 1) mask and temporary support were brought into contact with each other, exposed to an ultra-high pressure mercury lamp, left at 23 ° C. for 3 hours, and then developed. Development was carried out by shower development for 40 seconds using a 1.0 mass% sodium carbonate aqueous solution at 28 ° C.
  • a line-and-space pattern having a line width of 9 ⁇ m was formed by the above method, and the exposure amount at which the ratio of the line width to the space width was 1: 1 was determined. Then, shower etching was performed for 60 seconds using MEC Bright (MEC) to prepare a copper pattern wiring. The obtained copper pattern wiring was observed with an optical microscope. A total of 10 shots were observed, with an observation area of 0.26 mm ⁇ 0.20 mm as one shot. If there is a disconnection (open) or a connection (short circuit) between wirings even at one point in one shot, the number of defective shots in 10 shots is defined as a wiring defect and evaluated. Wiring defects in the copper pattern are based on defects in the resin pattern. It is preferably A or B.
  • ⁇ Resolution evaluation> The resolution was evaluated using the copper pattern wiring produced in the defect evaluation. Using a mask in which the width of the line-and-space pattern was changed, the minimum width at which the resist pattern after development could be formed was defined as the minimum resolution and evaluated. Tables 5 and 6 show the minimum resolution ( ⁇ m) as the evaluation result of the resolution.
  • the protective film was peeled off from the produced photosensitive transfer material, and laminated on the PET substrate with a copper layer under laminating conditions of a laminating roll temperature of 100 ° C., a linear pressure of 0.6 MPa, and a linear velocity (laminating rate) of 1.0 m / min.
  • a laminate having at least the temporary support and the photosensitive resin layer on a PET substrate with a copper layer is 70 mm ⁇ 10 mm.
  • a sample was prepared by cutting into. The PET substrate side of the above sample was fixed on the reference table.
  • peeling force was measured.
  • ⁇ Measurement of haze value> The haze value was measured using a haze meter (NDH-2000, manufactured by Nippon Denshoku Kogyo Co., Ltd.) by a method according to JIS K 7105: 1981.
  • Temporary support 3 Biaxially stretched polyethylene terephthalate film, thickness 16 ⁇ m, Toray Industries, Inc. Lumirror 16QS62
  • Temporary support 4 Biaxially stretched polypropylene film, thickness 12 ⁇ m, Alfan E501 manufactured by Oji F-Tex Co., Ltd.
  • Temporary support 5 Biaxially stretched polyethylene terephthalate film, thickness 16 ⁇ m, Toray Industries, Inc. Lumirror P60
  • the transport surface (outside) in Table 8 is the surface opposite to the photosensitive resin layer side of the temporary support or the protective film, and the coated surface (inside) is the photosensitive resin in the temporary support or the protective film. This is the surface on the layer side.
  • the photosensitive transfer materials of Examples 1 to 28 were compared with the photosensitive transfer materials of Comparative Examples 1 to 3, and the photosensitive resin layer was exposed via a temporary support. Even so, a resin pattern with few defects can be obtained. Further, the photosensitive transfer materials of Examples 1 to 28 are also excellent in resolution and adhesion between the photosensitive resin layer or the thermoplastic resin layer and the temporary support.
  • Example 101 On a 100 ⁇ m thick PET substrate, ITO is formed into a film with a thickness of 150 nm by sputtering as a second conductive layer, and copper is formed into a film with a thickness of 200 nm as a conductive layer of the first layer by a vacuum vapor deposition method. This was used as a circuit forming substrate.
  • the photosensitive transfer material obtained in Example 10 was laminated on the copper layer (laminol temperature 120 ° C., linear pressure 0.8 MPa, linear velocity 1.0 m / min.). The laminated laminate was exposed to a contact pattern using a photomask provided with the pattern A shown in FIG.
  • pattern A The remaining photosensitive resin layer (pattern A) was peeled off using a stripping solution (KP-301 manufactured by Kanto Chemical Co., Ltd.), and the photosensitive transfer material obtained in Example 10 was again laminated on the copper layer (Kanto Kagaku Co., Ltd. KP-301). Lamilol temperature 120 ° C., linear pressure 0.8 MPa, linear velocity 1.0 m / min.). Next, the pattern was exposed using the photomask of pattern B shown in FIG. 4 in a state of alignment, and was developed and washed with water.
  • a stripping solution KP-301 manufactured by Kanto Chemical Co., Ltd.
  • Lamilol temperature 120 ° C., linear pressure 0.8 MPa, linear velocity 1.0 m / min.
  • the copper layer was etched with Cu-02, and the remaining photosensitive resin layer (pattern B) was peeled off with a stripping solution (KP-301 manufactured by Kanto Chemical Co., Ltd.) to obtain a circuit wiring board. ..
  • a stripping solution KP-301 manufactured by Kanto Chemical Co., Ltd.
  • the pattern was clean.
  • GR which is a gray part
  • EX is an exposed part
  • DL which is a dotted line part
  • GR which is a gray portion
  • EX is an exposed portion
  • DL which is a dotted line portion

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Abstract

L'invention concerne un matériau de transfert photosensible comportant un corps de support temporaire, une couche de résine photosensible et un film protecteur, dans cet ordre. γb ≥ γc est respectée, lorsque : l'énergie de surface d'une surface du corps de support temporaire faisant face au côté de la couche de résine photosensible est γb (mN/m) ; et que l'énergie de surface d'une surface du film protecteur faisant face au côté de la couche de résine photosensible est γc (mN/m). L'invention concerne également : un procédé de production d'un motif de résine au moyen du matériau de transfert photosensible ; un procédé de gravure ; et un procédé de fabrication d'un dispositif électronique.
PCT/JP2021/031365 2020-09-14 2021-08-26 Matériau de transfert photosensible, procédé de fabrication de motif de résine et procédé de fabrication de dispositif électronique WO2022054599A1 (fr)

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CN202180053678.4A CN116018262A (zh) 2020-09-14 2021-08-26 感光性转印材料、树脂图案的制造方法、蚀刻方法及电子器件的制造方法

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Publication number Priority date Publication date Assignee Title
WO2023238299A1 (fr) * 2022-06-08 2023-12-14 株式会社レゾナック Résine soluble dans les alcalis, composition de résine photosensible, élément photosensible, procédé de formation de motif de réserve, et procédé de production de carte de circuit imprimé

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011043854A (ja) * 2010-11-15 2011-03-03 Asahi Kasei E-Materials Corp 感光性樹脂積層体
WO2020054660A1 (fr) * 2018-09-12 2020-03-19 富士フイルム株式会社 Matériau de transfert photosensible, procédé de production de ligne de câblage de circuit, procédé de production de panneau tactile, procédé de production de motif de résine, et film
JP2020098244A (ja) * 2018-12-17 2020-06-25 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法

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JP2004317725A (ja) 2003-04-15 2004-11-11 Kanegafuchi Chem Ind Co Ltd 水系現像が可能な感光性樹脂組成物および感光性ドライフィルムレジスト、並びにその利用

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2011043854A (ja) * 2010-11-15 2011-03-03 Asahi Kasei E-Materials Corp 感光性樹脂積層体
WO2020054660A1 (fr) * 2018-09-12 2020-03-19 富士フイルム株式会社 Matériau de transfert photosensible, procédé de production de ligne de câblage de circuit, procédé de production de panneau tactile, procédé de production de motif de résine, et film
JP2020098244A (ja) * 2018-12-17 2020-06-25 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023238299A1 (fr) * 2022-06-08 2023-12-14 株式会社レゾナック Résine soluble dans les alcalis, composition de résine photosensible, élément photosensible, procédé de formation de motif de réserve, et procédé de production de carte de circuit imprimé

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