WO2022053349A2

WO2022053349A2 - Optoelectronic semiconductor component, optoelectronic semiconductor device and lidar system

Info

Publication number: WO2022053349A2
Application number: PCT/EP2021/073957
Authority: WO
Inventors: Hubert Halbritter
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2020-09-09
Filing date: 2021-08-31
Publication date: 2022-03-17
Also published as: DE102020123558A1; WO2022053349A3

Abstract

An optoelectronic semiconductor component (10) comprises a semiconductor layer stack (109), in which a surface-emitting laser diode (103) is arranged, and a modulating device (140) having a current source (149). The modulating device (140) is suitable for modifying a current strength injected into the surface-emitting laser diode (103), thereby making it possible to modify an emission wavelength.

Description

OPTOELECTRONIC SEMICONDUCTOR COMPONENT, OPTOELECTRONIC

SEMICONDUCTOR DEVICE AND LIDAR SYSTEM

LIDAR (“Light Detection and Ranging”) systems, in particular FMCW LIDAR systems (“frequency modulated continuous wave”- modulated continuous wave LIDAR systems) are being used to an increasing extent in vehicles, for example for autonomous driving. For example, they are used to measure distances or to recognize objects In order to be able to reliably recognize obj ects at greater distances, laser light sources with correspondingly high power are required.

In general, attempts are made to improve existing LIDAR systems.

The object of the present invention is to provide an improved optoelectronic semiconductor component, an improved optoelectronic semiconductor device and an improved LIDAR system.

According to embodiments, the object is achieved by the subject matter of the independent patent claims. Advantageous further developments are defined in the dependent patent claims.

An optoelectronic semiconductor component comprises a semiconductor layer stack, in which a surface-emitting laser diode is arranged, and a modulation device, which has a current source. The modulation device is suitable for changing a current intensity impressed into the surface-emitting laser diode, as a result of which an emission wavelength can be changed. For example, the surface-emitting laser diode can have a large number of laser elements stacked vertically one on top of the other.

The optoelectronic semiconductor component can also include a waveguide that is suitable for absorbing electromagnetic radiation emitted by the surface-emitting laser diode. The waveguide can be a single-mode waveguide.

For example, the waveguide can be integrated into a carrier.

According to embodiments, the waveguide can be part of an integrated optical circuit.

The optoelectronic semiconductor component can also contain an optical isolator between the surface-emitting laser diode and the waveguide.

An optoelectronic semiconductor device has a multiplicity of optoelectronic semiconductor components as described above. Components of the optoelectronic semiconductor components are arranged on a common carrier. The optoelectronic semiconductor components are stacked one on top of the other, for example in a direction perpendicular to an emission direction of the optoelectronic semiconductor components.

A LIDAR system has the optoelectronic semiconductor component as described above, a beam splitter device and a detector.

According to further embodiments, a LIDAR system has the optoelectronic semiconductor device as described above. wrote, a beam splitter and a detector.

For example, the photodetector can be a Ge detector. An emission wavelength of the optoelectronic semiconductor component can be greater than 1100 nm.

According to embodiments, the LIDAR system can be implemented at least partially as an integrated optical circuit. The beam splitter device can be a beam splitter, for example, or else a fiber-optic component that causes the beam to be split, for example a splitter.

The accompanying drawings are provided for understanding of embodiments of the invention. The drawings illustrate exemplary embodiments and, together with the description, serve to explain them. Further exemplary embodiments and numerous of the intended advantages result directly from the following detailed description. The elements and structures shown in the drawings are not necessarily drawn to scale with respect to one another. The same reference symbols refer to the same or corresponding elements and structures.

Fig. 1 shows a schematic cross-sectional view of an optoelectronic semiconductor component in accordance with embodiments.

Fig. 2 shows a cross-sectional view of an optoelectronic semiconductor component in accordance with further embodiments.

Fig. FIG. 3A shows a schematic view of an optoelectronic semiconductor component in accordance with further embodiments. Fig. FIG. 3B shows a schematic view of an optoelectronic semiconductor component in accordance with further embodiments.

Fig. 4 shows a LIDAR system according to embodiments.

Fig. FIG. 5A shows a schematic view of an optoelectronic semiconductor component in accordance with embodiments.

Fig. 5B shows a schematic structure of a LIDAR system according to further embodiments.

In the following detailed description, reference is made to the accompanying drawings which form a part of the disclosure, and in which specific exemplary embodiments are shown for purposes of illustration. In this context, directional terminology such as "top", "bottom", "front", "back", "over", "on", "in front", "behind", "front", "back", etc. related to the orientation of the figures just described. Because the components of the exemplary embodiments can be positioned in different orientations, the directional terminology is used for purposes of explanation and is in no way limiting.

The description of the exemplary embodiments is not restrictive, since other exemplary embodiments also exist and structural or logical changes can be made without departing from the scope defined by the patent claims. In particular, elements of the exemplary embodiments described below can be combined with elements of other exemplary embodiments described, unless the context indicates otherwise.

The terms "wafer" or "semiconductor substrate" used in the following description may include any Include semiconductor-based structure that has a semiconductor surface. Wafer and structure are understood to include doped and undoped semiconductors, epitaxial semiconductor layers optionally supported by a base substrate 12, and other semiconductor structures 13. For example, a layer of a first semiconductor material may be grown on a growth substrate of a second semiconductor material, such as a GaAs substrate, a GaN substrate, or a Si substrate, or of an insulating material, such as a sapphire substrate.

Depending on the application, the semiconductor can be based on a direct or an indirect semiconductor material. Examples of semiconductor materials that are particularly suitable for generating electromagnetic radiation include, in particular, nitride semiconductor compounds through which, for example, ultraviolet, blue or longer-wave light can be generated, such as GaN, InGaN, AlN, AlGaN, AlGaInN, AlGaInBN, phosphide semiconductor compounds through which For example, green or longer-wave light can be generated, such as GaAsP, AlGalnP, GaP, AlGaP, and other semiconductor materials such as GaAs, AlGaAs, InGaAs, Al InGaAs, SiC, ZnSe, ZnO, Ga2Ü3, diamond, hexagonal BN and combinations of the materials mentioned. The stoichiometric ratio of the compound semiconductor materials can vary. Other examples of semiconductor materials may include silicon, silicon-germanium, and germanium. In the context of the present description, the term "semiconductor" also includes organic semiconductor materials.

The term "substrate" generally includes insulating, conductive, or semiconductor substrates. The term "vertical" as used in this specification is intended to describe an orientation that is essentially perpendicular to the first surface of a substrate or semiconductor body. The vertical direction can correspond to a growth direction when layers are grown, for example.

The terms “lateral” and “horizontal” as used in this specification are intended to describe an orientation or alignment that is substantially parallel to a first surface of a substrate or semiconductor body. This can be the surface of a wafer or a chip (die), for example.

The horizontal direction can, for example, lie in a plane perpendicular to a growth direction when layers are grown.

In the context of this description, the term “electrically connected” means a low-impedance electrical connection between the connected elements. The electrically connected elements do not necessarily have to be directly connected to one another. Further elements can be arranged between electrically connected elements.

The term "electrically connected" also includes tunnel contacts between the connected elements.

Fig. 1 shows a schematic cross-sectional view of an optoelectronic semiconductor component in accordance with embodiments. The optoelectronic semiconductor component 10 comprises a semiconductor layer stack 109 in which a surface-emitting laser diode 103 is arranged. The surface-emitting laser diode 103 represents, for example, a VCSEL (“Vertical Cavity Surface Emitting Laser”). This comprises a first resonator mirror 110, a second resonator mirror 120 and an active zone 125 for beam generation. The surface emitting laser diode 103 has an optical cavity formed between the first and second cavity mirrors 110 , 120 . The optical resonator extends in a vertical direction.

The first and the second resonator mirror 110, 120 can each be designed as a DBR layer stack ("distributed Bragg reflector") and have a large number of alternating thin layers of different refractive indices. The thin layers can each be made of a semiconductor material or of a For example, the layers can alternately have a high refractive index (n>3.1 when using semiconductor materials, n>1.7 when using dielectric materials) and a low refractive index (n<3.1 when using semiconductor materials, n<1.7 when using dielectric materials).For example, the layer thickness can be X/4 or a multiple of X/4, where X indicates the wavelength of the light to be reflected in the corresponding medium.The first or the second A resonator mirror can have, for example, 2 to 50 individual layers ke of the individual layers can be about 30 to 150 nm, for example 50 nm. The layer stack can also contain one or two or more layers that are thicker than about 180 nm, for example thicker than 200 nm.

The first resonator mirror 110 can contain semiconductor layers of the first conductivity type, for example p-type. The second resonator mirror 120 can have semiconductor layers of two th conductivity type, for example n-type included. According to further embodiments, the first and/or the second resonator mirror 110 , 120 can be constructed from dielectric layers. In this case, semiconductor layers of the first conductivity type can be arranged between the first resonator mirror 110 and the active zone 125 . Furthermore, semiconductor layers of the second conductivity type can be arranged between the second resonator mirror 120 and the active zone 125 .

The active zone 125 can have, for example, a pn junction, a double heterostructure, a single quantum well structure (SQW, single quantum well) or a multiple quantum well structure (MQW, multi quantum well) for generating radiation. The term "quantum well structure" has no meaning here with regard to the dimensionality of the quantization. It thus includes, among other things, quantum wells, quantum wires and quantum dots as well as any combination of these layers. For example, the materials of the active zone can contain 125 GaAs. According to further embodiments Active zone materials may include GaN or InP.

The surface emitting laser diode 103 can further have an aperture stop 115 arranged in the semiconductor layer stack 109 . For example, the aperture stop 115 may be positioned adjacent to the active zone 125 . The aperture stop 115 is, for example, insulating and limits the flow of current and thus the injection of charge carriers in the area between the bordering parts of the aperture stop 115 . For example, the aperture stop can be round or elliptical. A symmetrical and direction-independent beam formation takes place through a round aperture diaphragm. When using an elliptical aperture stop, an emitted Light beam have a preferred direction that corresponds, for example, to the longitudinal direction of the ellipse.

The first resonator mirror 110 is formed over a substrate 100 , for example. The first resonator mirror 110 can be contacted, for example, via a first contact element 130 and optionally via the substrate 100 . For example, the first contact element 130 can be arranged on that side of the substrate 100 which is remote from the first resonator mirror 110 . A laser emission can be brought about by impressing a current via the first contact element 130 and a second contact element 135 . The second contact element can be formed in electrical contact with the second resonator mirror 120 .

The optoelectronic semiconductor component 10 also has a modulation device 140 . The modulation device 140 has a current source 149 which injects a current into the surface-emitting laser diode 103, as has been described above. The modulation device 140 can be suitable for modulating the impressed current, for example in the range of a few pA. Due to the modulation of the applied current, there is a modulation of the charge carrier density, which leads to a change in the refractive index in the optical resonator. As a result, the wavelength is shifted. Furthermore, an increased charge carrier density causes an increase in temperature, which also leads to a change in the emission wavelength. Accordingly, the emission wavelength can be modulated in the MHz to GHz range.

For example, the one shown in FIG. 1 have a line width of 5 MHz and emit a power of 10 mW. Fig. FIG. 2 shows a schematic cross-sectional view of an optoelectronic semiconductor component, in which the surface-emitting laser diode 103 comprises a multiplicity of laser elements 122 .

A large number of individual laser elements 122 are arranged between a first resonator mirror 110 and a second resonator mirror 120 . The individual laser elements 122 are connected to one another via tunnel junctions.

The semiconductor layer stack 109 thus has a large number of active zones 125 which are connected to one another, for example via tunnel junctions 127 . In this way, the semiconductor layer stack 109 can have more than three, for example about six or more than six laser elements 122 . The laser elements 122 can furthermore have suitable semiconductor layers of the first and second conductivity type, each of which is adjacent to the active zone 125 and connected to it.

The tunnel junctions 127 can each have sequences of p ⁺⁺ -doped layers and n ⁺⁺ -doped layers, via which the individual laser elements 122 can be connected to one another. The p ⁺⁺ and n ⁺⁺ doped layers are reverse connected to the associated laser elements 122 . According to embodiments, the layer thicknesses of the individual semiconductor layers of the laser elements 122 are dimensioned in such a way that the tunnel junctions 127 are arranged, for example, at nodes of the standing wave that forms. In this way, the emission wavelength of the surface-emitting laser diode 103 can be stabilized. By stacking several laser elements 122 one on top of the other, higher power densities and still lower line widths of the emit oriented laser beam can be achieved. The sequence of very highly doped layers of the first and second conductivity type and optionally intermediate layers represents a tunnel diode or a tunnel junction. Using these tunnel diodes, the respective laser elements 122 can be connected in series.

The ones shown in Fig. The surface-emitting laser diode shown in FIG. 2 with a stack of several, for example more than five, for example eight, laser elements 122 can emit, for example, electromagnetic radiation with a line width of 500 kHz. The radiated power can be up to 80 mW. By selecting an appropriate number of laser elements 122, the radiated power can be scaled.

For example, in Figs. 1 and 2 can be realized surface-emitting laser diodes shown in the GaAs material system. In this case, for example, wavelengths greater than 900 or 1100 nm can be realized. According to other embodiments, the surface-emitting laser diodes can also be based on the InP material system. In this case, for example, wavelengths greater than 1550 nm can be emitted.

Fig. 3A shows an optoelectronic semiconductor device 10 according to further embodiments. In Fig. 3A is the surface emitting laser diode 103 shown, for example, in FIG. 1 or 2 is combined with a waveguide 102 . As described above, the surface-emitting laser diode 103 is formed in a semiconductor layer stack 109 . In addition, as shown in FIGS. 1 and 2, a modulation device 140 (not shown in FIG. 3A) is provided. The emitted light beam 16 is in the waveguide 102 coupled . For example, the waveguide 102 is designed as a single-mode or single-mode waveguide. In this way, the wavefronts of the electromagnetic radiation emitted by the surface-emitting laser diode 103 can be aligned particularly effectively.

For example, an optical isolator 104 between the waveguide 102 and the surface emitting laser diode

103 can be arranged. For example, the optical I solator

104 prevent electromagnetic radiation from being reflected from the waveguide 102 into the surface-emitting laser diode 103 .

Fig. 3B shows an optoelectronic semiconductor component 10 in which the beam 16 emitted by the surface-emitting laser diode 103 is coupled into the waveguide 102 via a deflection device 105 . For example, the deflection device can be a prism or a grating. For example, the semiconductor layer stack 109 in which the surface-emitting laser diode 103 is arranged can also include a substrate 100 , for example a growth substrate for the layers of the semiconductor layer stack 109 .

According to embodiments, the components of the semiconductor device can be integrated into a common carrier 107 .

For example, the waveguide 102, optionally the optical isolator 104 and optionally the deflection device

105 may be formed on a common carrier 107 . According to embodiments, further optical components can be integrated into the carrier 107 .

For example, the waveguide 102 can be part of an integrated optical circuit, through which different functionalities can be provided. If, for example, the surface-emitting laser diode 103 emits electromagnetic radiation with a wavelength greater than 1100 nm, for example, in cases where the surface-emitting laser diode 103 is realized in the GaAs or InP material system, Si waveguides can be used, for example. In general, if the energy of the emitted wavelength is less than the bandgap energy of silicon, Si waveguides can be used. Alternatively, the waveguides can also be made of SiN or SiO. For example, the waveguides can be implemented using glass fiber cables.

For example, if a Ge-based photodetector is used in an optical measurement system, wavelengths of up to 1800 nm can be detected. In this case, for example, the optoelectronic semiconductor component 10 described here can be used as a radiation source, which emits electromagnetic radiation with a wavelength greater than 1000 nm. In this case, eyes can be prevented from being damaged, for example, by the emitted electromagnetic laser radiation.

Fig. 4 shows a schematic view of a LIDAR system 150 . The one in Fig. The LIDAR system 150 shown in FIG. 4 is an FMCW LIDAR system. The laser radiation emitted by the optoelectronic semiconductor component 10 has a changing wavelength due to the modulation by the modulation device 140 . The emitted radiation is divided into a reference beam 18 and an object beam 19 by a beam splitter 157 . The object beam 19 is radiated onto an object 156 . The reflected beam 17 is produced in the process. The reflected beam 17 is suitably shaped and transposed by receiving optics 152 and collimator 153 Mirror 158 and another optics 155 fed to a detector 160, for example a photodetector. The reference beam 18 is fed directly to the detector 160 via the mirror 158 and the optics 155 . When the reflected beam 17 is superimposed on the reference beam 18, which are mutually coherent, a mixed signal is produced at the detector 160, from which, for example, the distance and other information about the detected object can be evaluated.

At the detector 160, a composite signal of the formula

proven. In this case, f _L o corresponds to the frequency of the object beam 19 or the reference beam 18 and f _a corresponds to the frequency of the reflected beam 17. The frequency of the reflected beam 17 is delayed due to the transit time difference that results from reflection on the object 156. The difference between f _a and f _L o is a measure of the movement and the distance of the object 156. The difference frequency of the reference beam 18 and the reflected beam 16 is determined by the detector 160. For example, the detector can detect wavelengths greater than 1000 nm and be designed as a Ge detector.

The object beam 19 is moved by the scanning or deflection unit 154 in order to scan a larger-area object 156 . According to further embodiments, the deflection or scanning unit 154 can be implemented as a mirror. According to further embodiments, the deflection or scanning unit can also be an optical phase array ("Optical Phase Array"), in which the

Waveguide is divided into different waveguides of different path lengths and thus result in laser beams of different phase. In this way the scanning surface of the object beam 19 can be enlarged without requiring a movable scanning mirror.

For example, components of the LIDAR system can be implemented using suitable fiber optic components. For example, the LIDAR system or part of the LIDAR system can be implemented as an integrated optical circuit.

According to embodiments, the optoelectronic semiconductor component can be provided as a so-called single-channel device, which comprises an optoelectronic semiconductor component as described above with an associated waveguide. According to further embodiments, these individual optoelectronic semiconductor components 10 can be combined to form an optoelectronic semiconductor device 20 .

Fig. FIG. 5A shows a view of an optoelectronic semiconductor device according to embodiments. The optoelectronic semiconductor device 20 has a plurality of optoelectronic semiconductor components 10 as described above. The optoelectronic semiconductor components 10 can be stacked one above the other in a z-direction perpendicular to the emission direction of the electromagnetic radiation. For example, each of the optoelectronic semiconductor components 10 additionally includes a waveguide 102 and optical components 106 which are arranged, for example, on a common carrier 107 . Using this optoelectronic semiconductor device 20, an object 156 having a specific size can be detected. For example, the one shown in FIG. 4 illustrated sampling and scanning unit 154 are dispensed with. Since the individual surface-emitting laser diodes 103 are very inexpensive, such an optoelectronic semiconductor device 20 can be implemented at low cost. For example, the LIDAR system or a part of the LIDAR system as an integrated optical circuit with the in Fig. 5A can be realized.

As has been described, the emission wavelength of the optoelectronic semiconductor component can be shifted continuously by impressing a variable current intensity. According to embodiments, a control device 121 can also be provided, which controls the current to a value such that a desired wavelength range is emitted. In this way, for example, the emission wavelength can be stabilized when temperatures rise.

Fig. 5B shows a schematic view of a LIDAR system according to further embodiments. As illustrated, the illustrated LIDAR system 150 has an optoelectronic semiconductor component 10 with a modulation device 140 . If necessary, an optical isolator 104 can be provided. A reflection of electromagnetic radiation into the surface-emitting laser diode can be prevented or suppressed by the optical isolator 104 .

As in Fig. 5B, a portion of the emitted laser radiation 16 can be branched off as a measurement beam 15 using a first beam splitter 108 . The measuring beam 15 is fed to a control device 121 which is suitable for determining a control signal 14 from the frequency of the measuring beam. The control signal 14 is supplied to the modulation device 140 and is used to control the current intensity impressed into the surface-emitting laser diode 103 .

A second beam splitter 111 splits part of the emitted beam 16, as previously shown in FIG. 4 shown , partitioned and radiated onto an object 156 as the first object beam 191 .

The first partial beam 171 then reflected by the object 156 is combined with the reference beam 18 or the first reference partial beam 181, similar to that in FIG. 4 previously described, coherently superimposed and mixed. This can be done via a coupling device 114 . The mixed signal can be fed to different photodetectors 116 , 117 in each case. For example, what is known as a “balanced receiver structure” can result in this way. In this case, for example, the phase fronts between the photodetectors 116 , 117 can be shifted by 180°. In this way, for example, DC components can be eliminated from equation (1) described above. In particular, the (i _a +i _L o ) ^> term from equation (1) can be eliminated.

According to embodiments, part of the reference beam 18 can additionally be split off by a third beam splitter 112 . According to embodiments, a polarization direction of this divided second partial reference beam 182 can be shifted by 90° by a polarization-changing element 113 . The second reference partial beam 182 is coherently superimposed and mixed with a second reflected partial beam 172 in the coupling device 114 . This mixed signal is detected by the third and, if necessary, the fourth photodetector 118 and 119 when using the "balanced receiver" structure.

By using two photodetectors in each case, the DC component from equation (1) above can be compensated for when the phase fronts are shifted. Furthermore, when using the second partial reference beam 182 with, for example, a polarization direction rotated by 90°, polarization-changing effects can be taken into account in the reflection at the object 156 . According to embodiments, the polari- sation changing element 113 can also be omitted. Likewise, the third and fourth photodetectors 118, 119 are optional.

According to embodiments, the control device 121 can include a demodulator, which determines a changing current signal from a changing emission frequency. At a selected point, a small change in frequency causes a small change in current. Using this small current change, the current intensity impressed on the surface emitting laser diode 103 can be modulated.

In a manner corresponding to that described above, that shown in FIG. 5B described system or parts of the system can be realized as an integrated optical circuit. In particular, components of the system can be implemented as fiber optic elements.

Although specific embodiments have been illustrated and described herein, those skilled in the art will recognize that a variety of alternative and/or equivalent designs may be substituted for the specific embodiments shown and described without departing from the scope of the invention. The application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, the invention is to be limited only by the claims and their equivalents. LIST OF REFERENCE NUMBERS optoelectronic semiconductor component control signal measurement beam emitted beam reflected beam reference beam object beam optoelectronic semiconductor device substrate waveguide surface-emitting laser diode optical isolator deflection device optical component common carrier first beam splitter semiconductor layer stack first resonator mirror second beam splitter second beam splitter polarization-changing element coupling device aperture stop first photodetector second photodetector third photodetector fourth photodetector second resonator mirror control device Laser element active zone tunnel junction first contact element second contact element

Module at ion setup

power source

LIDAR system

beam splitter

receiving optics

Ob j ect beam

deflection/scanning unit

optics

Ob j ect

beam splitter

mirror

Detector first reflected partial beam second reflected partial beam first reference partial beam second reference partial beam first object beam second object beam

Claims

PATENT CLAIMS

1. Optoelectronic semiconductor component (10) with: a semiconductor layer stack (109) in which a surface-emitting laser diode (103) is arranged, and a modulation device (140) which has a current source (149) and is suitable for inserting a laser diode into the surface-emitting diode ( 103) to change the applied current, whereby an emission wavelength can be changed.

2. Optoelectronic semiconductor component (10) according to claim 1, in which the surface-emitting laser diode (103) has a multiplicity of laser elements (122) stacked vertically one on top of the other.

3. Optoelectronic semiconductor component (10) according to claim 1 or 2, further comprising a waveguide (102) which is suitable for receiving electromagnetic radiation (16) emitted by the surface-emitting laser diode (103).

4. Optoelectronic semiconductor component (10) according to claim 3, wherein the waveguide (102) is a single-mode waveguide.

5. Optoelectronic semiconductor component (10) according to claim 3 or 4, in which the waveguide (102) is integrated in a carrier (107).

6. Optoelectronic semiconductor component according to one of claims 3 to 5, in which the waveguide (102) is part of an integrated optical circuit.

7. Optoelectronic semiconductor component (10) according to any one of claims 3 to 6, further comprising an optical isolator (104) between surface emitting laser diode (103) and

Waveguide (102) .

8. Optoelectronic semiconductor device (20) having a multiplicity of optoelectronic semiconductor components (10) according to one of claims 3 to 7, in which the components of the optoelectronic semiconductor components (10) are arranged on a common carrier (107).

9. LIDAR system (150), which the optoelectronic semiconductor component (10) according to any one of claims 1 to 7, a beam splitter device (108, 111, 112, 151) and a detector (116, 117, 118, 119, 160) having.

10. LIDAR system (150), which has the optoelectronic semiconductor device (20) according to claim 8, a beam splitter device (108, 111, 112, 151) and a detector (116, 117, 118, 119, 160).

The LIDAR system (150) of claim 9 or 10, wherein the detector is a Ge detector (116, 117, 118, 119, 160).

12. LIDAR system (150) according to claim 11, in which an emission wavelength of the optoelectronic semiconductor component (10) is greater than 1100 nm.

13. LIDAR system (150) according to any one of claims 9 to 12, which is at least partially implemented as an integrated optical circuit.