WO2022042771A3 - 显示面板及其制造方法、显示屏和电子设备 - Google Patents

显示面板及其制造方法、显示屏和电子设备 Download PDF

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Publication number
WO2022042771A3
WO2022042771A3 PCT/CN2021/125897 CN2021125897W WO2022042771A3 WO 2022042771 A3 WO2022042771 A3 WO 2022042771A3 CN 2021125897 W CN2021125897 W CN 2021125897W WO 2022042771 A3 WO2022042771 A3 WO 2022042771A3
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WO
WIPO (PCT)
Prior art keywords
organic layer
display panel
display
display area
manufacturing
Prior art date
Application number
PCT/CN2021/125897
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English (en)
French (fr)
Other versions
WO2022042771A2 (zh
Inventor
龙浩晖
魏山山
方建平
李小龙
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP21860603.6A priority Critical patent/EP4184551A4/en
Priority to US18/022,392 priority patent/US20230329070A1/en
Publication of WO2022042771A2 publication Critical patent/WO2022042771A2/zh
Publication of WO2022042771A3 publication Critical patent/WO2022042771A3/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请提供了一种显示面板、包括该显示面板的显示屏，以及包括该显示屏的电子设备。该显示面板包括依次层叠的薄膜晶体管背板、有机层和封装层；显示面板具有通孔，通孔贯穿薄膜晶体管背板、有机层和封装层；显示面板包括非显示区和显示区，非显示区围绕通孔设置，显示区围绕非显示区设置；有机层包括第一有机层和第二有机层，第一有机层是位于显示区的部分，第二有机层是位于非显示区的部分，其中，第一有机层包括多个显示单元，第二有机层设置有第一槽，第一槽贯穿第二有机层，且第一槽围绕通孔设置；封装层覆盖有机层，并填充第一槽。本申请还提供了一种显示面板的制造方法，用于制造该显示面板。本申请的方案能够降低制造成本。
PCT/CN2021/125897 2020-08-31 2021-10-22 显示面板及其制造方法、显示屏和电子设备 WO2022042771A2 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP21860603.6A EP4184551A4 (en) 2020-08-31 2021-10-22 DISPLAY PANEL AND METHOD OF PRODUCTION THEREOF, DISPLAY SCREEN AND ELECTRONIC DEVICE
US18/022,392 US20230329070A1 (en) 2020-08-31 2021-10-22 Display panel and manufacturing method therefor, display screen, and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010899632.1 2020-08-31
CN202010899632.1A CN114122279B (zh) 2020-08-31 2020-08-31 显示面板及其制造方法、显示屏和电子设备

Publications (2)

Publication Number Publication Date
WO2022042771A2 WO2022042771A2 (zh) 2022-03-03
WO2022042771A3 true WO2022042771A3 (zh) 2022-04-14

Family

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PCT/CN2021/125897 WO2022042771A2 (zh) 2020-08-31 2021-10-22 显示面板及其制造方法、显示屏和电子设备

Country Status (4)

Country Link
US (1) US20230329070A1 (zh)
EP (1) EP4184551A4 (zh)
CN (3) CN115835694A (zh)
WO (1) WO2022042771A2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220063794A (ko) * 2020-11-09 2022-05-18 삼성디스플레이 주식회사 표시 패널, 표시 장치, 및 표시 장치의 제조방법
CN114694508B (zh) * 2022-03-29 2023-12-01 武汉华星光电半导体显示技术有限公司 显示面板和显示装置
CN114898666B (zh) * 2022-06-13 2023-10-13 武汉天马微电子有限公司 一种贴合组件

Citations (5)

* Cited by examiner, † Cited by third party
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CN110600511A (zh) * 2019-08-26 2019-12-20 武汉华星光电半导体显示技术有限公司 有机发光显示面板及其制备方法
CN111081732A (zh) * 2018-10-19 2020-04-28 乐金显示有限公司 显示装置
CN111162195A (zh) * 2020-01-02 2020-05-15 合肥维信诺科技有限公司 显示面板和显示装置
CN111326553A (zh) * 2018-12-14 2020-06-23 乐金显示有限公司 显示装置
CN111403624A (zh) * 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 阵列基板、阵列基板的制备方法及显示面板

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KR102407869B1 (ko) * 2016-02-16 2022-06-13 삼성디스플레이 주식회사 유기 발광 디스플레이 장치와, 이의 제조 방법
KR102587878B1 (ko) * 2018-08-31 2023-10-11 엘지디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR102659189B1 (ko) * 2018-11-27 2024-04-19 삼성디스플레이 주식회사 표시장치
KR102621016B1 (ko) * 2018-12-28 2024-01-05 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
CN110444576B (zh) * 2019-08-14 2022-01-18 京东方科技集团股份有限公司 显示装置、显示面板及其制造方法
CN111129351B (zh) * 2020-01-02 2022-10-28 武汉天马微电子有限公司 一种显示面板及显示装置
CN111443774A (zh) * 2020-03-26 2020-07-24 武汉华星光电半导体显示技术有限公司 一种显示模组及显示装置

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
CN111081732A (zh) * 2018-10-19 2020-04-28 乐金显示有限公司 显示装置
CN111326553A (zh) * 2018-12-14 2020-06-23 乐金显示有限公司 显示装置
CN110600511A (zh) * 2019-08-26 2019-12-20 武汉华星光电半导体显示技术有限公司 有机发光显示面板及其制备方法
CN111162195A (zh) * 2020-01-02 2020-05-15 合肥维信诺科技有限公司 显示面板和显示装置
CN111403624A (zh) * 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 阵列基板、阵列基板的制备方法及显示面板

Also Published As

Publication number Publication date
CN114122279B (zh) 2022-12-16
CN114122279A (zh) 2022-03-01
EP4184551A2 (en) 2023-05-24
CN115966573A (zh) 2023-04-14
EP4184551A4 (en) 2024-01-17
CN115835694A (zh) 2023-03-21
WO2022042771A2 (zh) 2022-03-03
US20230329070A1 (en) 2023-10-12

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