WO2022041630A1 - 光纤线路板组件以及光电混合线路板 - Google Patents

光纤线路板组件以及光电混合线路板 Download PDF

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Publication number
WO2022041630A1
WO2022041630A1 PCT/CN2020/142441 CN2020142441W WO2022041630A1 WO 2022041630 A1 WO2022041630 A1 WO 2022041630A1 CN 2020142441 W CN2020142441 W CN 2020142441W WO 2022041630 A1 WO2022041630 A1 WO 2022041630A1
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WO
WIPO (PCT)
Prior art keywords
optical fiber
circuit board
optical
base plate
window
Prior art date
Application number
PCT/CN2020/142441
Other languages
English (en)
French (fr)
Inventor
王国栋
缪桦
刘晓锋
罗昊
Original Assignee
深南电路股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Priority to EP20951296.1A priority Critical patent/EP4206765A4/en
Publication of WO2022041630A1 publication Critical patent/WO2022041630A1/zh
Priority to US18/154,855 priority patent/US20230152540A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Definitions

  • the present application relates to the technical field of circuit boards, and in particular, to an optical fiber circuit board assembly and an optoelectronic hybrid circuit board.
  • Electrical interconnection refers to the use of metal lines (usually copper) to realize the signal connection between circuit boards and chips.
  • Optical interconnection refers to the use of light-conducting media (optical fibers, optical waveguides, etc.) to realize the signal connection between circuit boards and chips.
  • Optical interconnection can be combined with electrical interconnection, but at present, the number of optical fibers in optical interconnection is usually relatively large, which easily leads to problems of disorder and difficult assembly.
  • the embodiments of the present application provide an optical fiber circuit board assembly and an optoelectronic hybrid circuit board, so as to solve the technical problem that the optical interconnection can be assembled with the electrical interconnection in the prior art.
  • an optical fiber circuit board assembly comprising: a base plate, including a base plate body, at least a first window is opened on the base plate body; a plurality of optical fiber units are arranged on the base plate , each end of the plurality of optical fiber units extends to the first window for coupling to a plurality of optical devices, and the other end of each extends to the outside of the substrate; wherein, the optical device is a photoelectric conversion device.
  • an optical fiber circuit board assembly comprising: a base plate, including a base plate body, at least a first opening window is opened on the base plate body; A base plate, each end of the plurality of optical fiber units extends to the first window for coupling a plurality of optical devices, and the other end of each extends to the outside of the base plate.
  • an optoelectronic hybrid circuit board includes: the optical fiber circuit board assembly as described above; a printed circuit board, which is stacked with the optical fiber circuit board assembly and arranged at intervals; the first electronic component is arranged on the printed circuit board, and the first electronic component is arranged corresponding to the first window area; a plurality of optical devices are arranged on the printed circuit board and are surrounded by the first In addition to the electronic components, the optical device is coupled to the first electronic component through the printed circuit board.
  • the optical fiber circuit board assembly in the present application is provided with at least a first opening window on the substrate body, and each end of the plurality of optical fiber units extends to the first opening window
  • the chip and the optical device coupled with the optical fiber unit can be arranged in the first window, and the optical fiber unit is integrated in the substrate, so that there will be no disorder, and each end of the optical fiber unit is fixed in the first window.
  • the sequence and position are fixed, and it is no longer necessary to reposition and connect the optical devices one by one, thereby greatly simplifying the assembly of optical interconnection and electrical interconnection, and greatly improving the efficiency.
  • FIG. 1 is a schematic structural diagram of an embodiment of an optical fiber circuit board assembly of the present application.
  • FIG. 2 is a schematic structural diagram of another embodiment of the optical fiber circuit board assembly of the present application.
  • FIG. 3 is a schematic partial structure diagram of another embodiment of the optical fiber circuit board assembly of the present application.
  • FIG. 4 is a schematic structural diagram of another embodiment of the optical fiber circuit board assembly of the present application.
  • FIG. 5 is a schematic structural diagram of the first embodiment of the optoelectronic hybrid circuit board of the present application.
  • FIG. 6 is another schematic structural diagram of the first embodiment of the optoelectronic hybrid circuit board of the present application.
  • FIG. 7 is a schematic structural diagram of the second embodiment of the optoelectronic hybrid circuit board of the present application.
  • FIG. 9 is a schematic structural diagram of a third embodiment of the optoelectronic hybrid circuit board of the present application.
  • FIG. 10 is a schematic structural diagram of a substrate body in an optical fiber circuit board assembly of the present application.
  • the optical fiber circuit board assembly 10 may include a circuit board that transmits only optical signals, or may include a circuit board that transmits mixed signals including optical signals.
  • the optical fiber circuit board assembly 10 includes: a substrate 11 and a plurality of optical fiber units 12 .
  • the substrate 11 includes a substrate body 111 , and at least a first window 101 is opened on the substrate body 11 .
  • the plurality of optical fiber units 12 are disposed on the substrate 11 , each end of the plurality of optical fiber units 12 extends to the first window 101 , the plurality of optical fiber units 12 are used for coupling the plurality of optical devices 20 , and the other One end extends to the outside of the substrate 11 .
  • a pattern transfer process can be used to open the first window 101 in the central area or edge area of the substrate body 111 , that is, the substrate body 111 in the central area or the edge area is removed to facilitate subsequent processing Among them, electronic components and optical devices 20 are correspondingly arranged in the first window 101 .
  • the optical fiber units 12 are arranged in the substrate 11 in a certain manner, wherein the arrangement manner of each optical fiber unit 12 in the substrate 11 may also be the same or different.
  • Each optical fiber unit 12 includes at least one optical fiber, which may specifically be one or more optical fibers, one or more groups of optical fibers, and the like.
  • the number of optical fibers in each group of optical fibers can be set according to actual requirements, such as the type of connectors to be connected, for example, 1, 4, 8, 12, 24, and the like.
  • the number of groups of optical fibers can also be set as required, which is not limited here.
  • the optical fibers in the optical fiber unit 12 may be high-temperature optical fibers or ordinary optical fibers.
  • the difference between high-temperature optical fiber and ordinary optical fiber is that the material of the coating layer on the surface of high-temperature optical fiber is high-temperature resistant material, so that the high-temperature optical fiber can meet the application in high temperature and harsh environment.
  • the coating layer will lose its function of protecting the optical fiber at high temperature, and the optical fiber will be easily damaged.
  • the designer can select the optical fiber unit 12 as a high-temperature optical fiber or an ordinary optical fiber according to the application environment of the optical fiber circuit board assembly 10 . For example, when the optical fiber circuit board assembly 10 is required to work at a high temperature above 100° C.
  • the optical fiber unit 12 can be selected as a high-temperature optical fiber. It is worth noting that setting the optical fiber unit 12 as a high-temperature optical fiber can not only widen the working temperature of the optical fiber circuit board assembly 10, but also enable the optical fiber circuit board assembly 10 to be processed by lamination in the process of processing, thereby widening the The processing method of the optical fiber circuit board assembly 10 .
  • the optical fiber circuit board assembly in the present application is provided with at least a first opening window on the substrate body, and each end of the plurality of optical fiber units extends to the first opening window.
  • the chip and the optical device coupled with the optical fiber unit are arranged in the first window, and the optical fiber unit is integrated in the substrate, so that there will be no disorder, and each end of the optical fiber unit is fixed on the inside of the first window, and the order and position Fixing, it is no longer necessary to reposition and connect the optical devices one by one, so that the assembly of optical interconnection and electrical interconnection is greatly simplified, and the efficiency is greatly improved.
  • the substrate 11 further includes a first fiber outlet 112 .
  • a plurality of first fiber outlets 112 are protruded from the substrate body 111 at the inner side of the first window 101 toward the center of the first window 101 .
  • the fiber opening 112 extends out.
  • the outer edge of the first fiber outlet 112 is flush with the inner edge of the first window 101 .
  • each first fiber outlet 112 is arranged at intervals, each first fiber outlet 112 can be bent and arranged according to actual requirements, so that the first fiber outlet 112 can be set as a different fiber outlet direction.
  • the optical fiber circuit board assembly 10 includes a first optical fiber interface 14, and one end of the optical fiber unit 12 extends out from the first optical fiber port, reaches the first window 101 and is connected to the first optical fiber interface 14.
  • the first optical fiber interface 14 is used for For connecting the optical device 20 .
  • the first optical fiber interface 14 may include an optical connector and an optical fiber unit 12 extending from the first optical fiber port.
  • the optical connector is provided with a positioning structure, which may be specifically arranged in the inner cavity of the optical connector.
  • the optical connector can be used The optical fiber unit 12 extending from the first optical fiber port in the optical fiber circuit board assembly 10 is received, and the optical fiber unit 12 is positioned by the positioning structure.
  • the first optical fiber interface 14 may include a single-way optical connector and/or a multi-way optical connector, and the optical fiber unit 12 extending from the first optical fiber port.
  • the single-channel optical connector is provided with a positioning structure for positioning one optical fiber unit 12 for receiving and positioning one optical fiber unit 12 extending from the substrate 11 .
  • the multi-channel optical connector is provided with a positioning structure for positioning the multi-channel optical fiber unit 12 for receiving and positioning the multi-channel optical fiber unit 12 extending from the substrate 11 .
  • the corresponding optical fiber unit 12 needs to be inserted into the cavity of the optical connector first, and then the optical fiber can be fixed with glue, and the redundant optical fiber is cut off. Then, grinding and polishing are performed to manufacture the first optical fiber interface 14 that meets the requirements.
  • the plurality of first fiber outlets 112 are disposed at least half of the inner side of the first window 101 at intervals, and are distributed in a semi-enclosed or enclosed manner.
  • the first opening 101 is a quadrangular opening, and the plurality of first fiber outlets 112 are arranged on two inner sides, three inner sides or four inner sides of the first opening 101 at intervals. Wherein, when the plurality of first fiber outlets 112 are arranged at four inner sides of the first window 101 at intervals, the plurality of first fiber outlets 112 are arranged around the inner side of the first window 101 .
  • the optical fiber circuit board in the prior art fixes the optical fiber on the surface or the base material of the optical fiber circuit board through an adhesive.
  • the length of the signal line between the optical device and the first electronic component is too long, the chip is easily affected by the surrounding electromagnetic environment during operation. The influence of electromagnetic interference is generated, and it is difficult to ensure the normal operation of the chip.
  • the optical device is enclosed outside the first electronic element, thereby minimizing the length of the signal line between the optical device and the first electronic element, and avoiding parallel wiring, so as to solve the problem of existing problems. Defects caused by too long signal lines between the optical device and the first electronic element in the technology.
  • the first opening 101 is a circular or elliptical opening, and the plurality of first fiber outlets 112 are arranged at intervals of one-half, three-quarters or the inside of the entire circumference of the first opening 101 . Wherein, when the plurality of first fiber outlets 112 are arranged at intervals inside the entire circumference of the first window 101 , the plurality of first fiber outlets 112 are arranged around the inner side of the first window 101 .
  • the distances between the ends of the adjacent first fiber outlets 112 from the center of the first window 101 are different, and the difference is at least greater than or equal to the size of the optical device 20 .
  • the gap between the ends of the adjacent first fiber outlets 112 is at least greater than or equal to the size of the optical device 20 , thereby ensuring that two adjacent first fiber ports 14 are respectively connected to two adjacent first fiber ports 14 in subsequent processing.
  • the optical devices 20 are arranged at sufficient locations and spaced apart to facilitate heat dissipation.
  • the distance between the ends of adjacent first fiber outlets 112 is at least greater than or equal to the diagonal distance of the optical device 20 .
  • the ends of the plurality of first fiber outlets 112 are divided into at least two groups with different distances from the center of the first window 101 , and the ends of the two groups of first fiber outlets 112 are alternately arranged.
  • the two groups of first fiber outlets 112 can be arranged in a semi-circular array, a symmetrical arrangement, or a double-circular array.
  • the first optical fiber interface 14 can be arranged in a symmetrical arrangement or a double-circular array.
  • the optical devices 20 coupled to the first optical fiber interface 14 can be arranged in a symmetrical arrangement or a double-ring array, so as to increase the arrangement density of the optical devices 20 and increase the integration degree of the circuit board.
  • the fiber optic circuit board assembly 10 includes a second fiber optic interface 15 .
  • the substrate 11 further includes a second fiber outlet 113 .
  • a plurality of second fiber outlets 113 protrude outward from the outer side of the base plate 11 , a plurality of optical fiber units 12 are embedded in the base plate 11 , and the optical fiber units 12 extend out from the second fiber outlets 113 and are connected to the second fiber outlet 113 .
  • the plurality of second fiber outlets 113 are arranged at intervals from each other, and are all arranged on one side of the substrate 11 . Specifically, the outer edge of the second fiber outlet 113 may be flush with the outer side of the substrate 11 .
  • the second optical fiber interface 15 may include an optical connector and an optical fiber unit 12 extending from the second optical fiber port.
  • the optical connector is provided with a positioning structure, which can be specifically arranged in the inner cavity of the optical connector.
  • the optical connector can be used The optical fiber unit 12 extending from the second optical fiber port in the optical fiber circuit board assembly 10 is received, and the optical fiber unit 12 is positioned by the positioning structure.
  • the second optical fiber interface 15 may include a single-way optical connector and/or a multi-way optical connector, and an optical fiber unit 12 extending from the second optical fiber port.
  • the single-channel optical connector is provided with a positioning structure for positioning one optical fiber unit 12 for receiving and positioning one optical fiber unit 12 extending from the substrate 11 .
  • the multi-channel optical connector is provided with a positioning structure for positioning the multi-channel optical fiber unit 12 for receiving and positioning the multi-channel optical fiber unit 12 extending from the substrate 11 .
  • the corresponding optical fiber unit 12 needs to be inserted into the cavity of the optical connector first, and then the optical fiber can be fixed with glue, and the redundant optical fiber is cut off. Then, grinding and polishing are carried out to manufacture the second optical fiber interface 15 that meets the requirements.
  • the substrate body 111 includes: a first film layer 1111 , a second film layer 1112 and a bonding layer 1113 .
  • the first film layer 1111 and the second film layer 1112 are stacked and spaced apart, and the optical fiber unit 12 is at least partially disposed between the first film layer 1111 and the second film layer 1112 .
  • the bonding layer 1113 is filled in the remaining space between the first film layer 1111 and the second film layer 1112 except for the optical fiber unit 12, so that the optical fiber unit 12 is fixed relative to the first film layer 1111.
  • the first film layer 1111 is a flexible material
  • the second film layer 1112 and the bonding layer 1113 are a thermosetting material or a thermoplastic material
  • the bonding layer 1113 includes two layers of adhesive layers 1114 arranged in layers
  • the optical fiber unit 12 is at least partially disposed between the two layers of adhesive layers 1114 or in one of the adhesive layers 1114 .
  • first film layer 1111 and the second film layer 1112 are flexible materials.
  • the bonding layer 1113 includes two layers of adhesive layers 1114 stacked on top of each other, and the optical fiber unit 12 is at least partially disposed between the two layers of adhesive layers 1114 or in one of the adhesive layers 1114, and the adhesive layer 1114 is a thermosetting material or a thermoplastic material.
  • the flexible material may be a flexible composite material, for example, polyimide, polyethylene terephthalate, polydimethylsiloxane, and the like.
  • the first film layer 1111 is made of a flexible material, and a flexible substrate 11 can be obtained, so as to be able to withstand repeated bending to meet the actual position requirements.
  • the thickness of the first film layer 1111 may not be greater than 100 ⁇ m, for example, 20 ⁇ m-100 ⁇ m, specifically 20 ⁇ m, 25 ⁇ m, 45 ⁇ m, 65 ⁇ m, 85 ⁇ m, 100 ⁇ m, etc., which are not specifically limited here.
  • a bonding layer 1113 is provided between the adjacent first film layer 1111 and the second film layer 1112, so as to be connected together by the bonding layer 1113, and a corresponding optical fiber unit 12 is fixed by the bonding layer 1113 Between the two adjacent first film layers 1111 and the second film layers 1112, and the bonding layer 1113 is filled in the fiber removing fibers between the corresponding adjacent two first film layers 1111 and the second film layers 1112 In the remaining space outside of unit 12.
  • the thickness refers to the thickness of the bonding layer 1113 in the direction perpendicular to the plate surfaces of the first film layer 1111 and the second film layer 1112 .
  • the thickness of the thinnest region of the bonding layer 1113 between the two adjacent first film layers 1111 and the second film layers 1112 is greater than one tenth of the diameter of the optical fiber unit 12 and smaller than the thickness of the optical fiber unit 12 10 times the diameter of the optical fiber unit 12, or more than half the diameter of the optical fiber unit 12 and less than 2 times the diameter of the optical fiber unit 12, such as the bonding layer between two adjacent first film layers 1111 and second film layers 1112
  • the thickness of the thinnest region of 1113 is one-fifth, one-half, 1 times, 2 times, 5 times, etc. of the diameter of the optical fiber, which is not specifically limited here.
  • the thickness of the bonding layer 1113 is not less than 50 ⁇ m, and can be 50 ⁇ m, 60 ⁇ m, 70 ⁇ m, etc.
  • the peel strength between the adjacent first film layers 1111 and the second film layers 1112 is not less than 15N/ cm 3 .
  • the adhesive layer 1114 is solid and flexible in the first temperature range and/or the first pressure range, and has fluidity in the second temperature range and/or the second pressure range, wherein the first temperature range and/or the second pressure range are fluid. Any temperature value in one temperature range is not greater than any temperature value in the second temperature range.
  • the adhesive layer 1114 under normal temperature and normal pressure, or close to normal temperature and normal pressure, the adhesive layer 1114 is solid and flexible, and has a certain fluidity when heated to a certain temperature and/or a certain pressure is applied.
  • the adhesive layer 1114 may be a thermoplastic material or a thermosetting material.
  • the adhesive layer 1114 of different materials can be selected according to the actual use environment of the optical fiber circuit board assembly 10 .
  • the optical fiber of the optical fiber unit 12 adopts a high temperature optical fiber
  • the material of the adhesive layer 1114 can be at least one of epoxy resin system, acrylic system, and silica gel system.
  • the optical fiber of the optical fiber unit 12 is an ordinary optical fiber
  • the material of the adhesive layer 1114 can be at least one of acrylic system and silicone system.
  • the adhesive layer 1114 made of the above material, when the substrate 11 is heated and/or pressurized, the adhesive layer 1114 can flow and cover the periphery of the optical fiber unit 12 and fill the adjacent first film layer 1111 and the second film layer 1112 in the space other than the optical fiber, so that the optical fiber is more firmly fixed, so as to reduce the looseness and displacement of the optical fiber due to unreliable fixing during long-term use, thereby improving the reliability of the substrate 11 and the optical fiber circuit board assembly 10. sex.
  • the optoelectronic hybrid circuit board 100 includes: an optical fiber circuit board assembly 10 , a printed circuit board 30 , a first electronic component 40 and a plurality of optical devices 20 .
  • the printed circuit board 30 is stacked and spaced apart from the optical fiber circuit board assembly 10 .
  • the first electronic component 40 and the plurality of optical components 20 are arranged on the printed circuit board 30 , the first electronic component 40 is arranged corresponding to the area of the first opening 101 , and the plurality of optical components 20 are arranged outside the first electronic component 40 , the optical device 20 is coupled to the first electronic component 40 through the printed circuit board 30 .
  • optical fiber circuit board assembly 10 in this embodiment is the same as the optical fiber circuit board assembly 10 in the above-mentioned embodiments of the optical fiber circuit board assembly 10 of the present application.
  • optical fiber circuit board assembly 10 of the present application please refer to the above-mentioned embodiments, which will not be repeated here. .
  • the first optical fiber interface 14 is used to connect the optical fiber unit 12 to the optical device 20 for optical signal transmission, wherein the optical device 20 is specifically an optical energy converter or an optical transmission medium.
  • the photoelectric converter is further a photoelectric conversion device.
  • the first electronic component 40 is specifically a chip, such as a router chip.
  • the optical device 20 includes an optical port (not shown in the figure), and the optical port is used for connecting with the first optical fiber interface 14 for optical signal transmission, wherein the angle of the optical port when connecting the first optical fiber interface 14 is adjustable, so that the The optical port of the optical device 20 may face the access direction of the first optical fiber unit. For example, if the optical fiber unit 12 is connected from the left side of the optoelectronic hybrid circuit board 100 , the optical port of the optical device 20 may be disposed toward the access direction of the optical fiber unit 12 .
  • the optical fiber circuit board in the prior art fixes the optical fiber on the surface or the base material of the optical fiber circuit board through an adhesive.
  • the length of the signal line between the optical device and the first electronic component is too long, the chip is easily affected by the surrounding electromagnetic environment during operation. The influence of electromagnetic interference is generated, and it is difficult to ensure the normal operation of the chip.
  • the optical device is enclosed outside the first electronic element, thereby minimizing the length of the signal line between the optical device and the first electronic element, and avoiding parallel wiring, so as to solve the problem of existing problems. Defects caused by too long signal lines between the optical device and the first electronic element in the technology.
  • a support member 60 is provided between the printed circuit board 30 and the optical fiber circuit board assembly 10.
  • mounting holes may be provided on the printed circuit board 30 and the optical fiber circuit board assembly 10.
  • the support member 60 can be a screw, a rivet, a pin, etc. to be inserted into the mounting hole to fix the connection between the printed circuit board 30 and the optical fiber circuit board assembly 10 . In this way, the fixing between the printed circuit board 30 and the optical fiber circuit board assembly 10 can be made more reliable, and the disassembly is also more convenient.
  • the plurality of optical devices 20 connected to the plurality of first optical fiber interfaces 14 are spaced apart from each other, and the plurality of optical devices 20 are distributed in a semi-surrounding or surrounding manner. Further, the plurality of optical devices 20 are arranged in a single annular array or in a double annular array, so as to increase the arrangement density of the optical devices 20 and increase the integration degree of the optoelectronic hybrid circuit board 100 .
  • the substrate body 11 is further provided with a second opening 102 , and the second opening 102 is spaced apart from the area of the first opening 101 .
  • the optoelectronic hybrid circuit board 100 further includes a second electronic component 50, the second electronic component 50 is arranged on the printed circuit board 30, and the second electronic component 50 is arranged corresponding to the second window 102 of the optical fiber circuit board assembly 10, wherein, The second opening 102 is used to expose the second electronic component 50 .
  • the second electronic element 50 is specifically a high-capacitance electronic element.
  • the optical device 20 , the first electronic component 40 and the second electronic component 50 may share the same heat sink 70, and the heat sink 70 may be disposed on the side of the optical device 20, the first electronic component 40 and the second electronic component 50 away from the printed circuit board 30, wherein the heat sink 70 may be It is a water-cooled radiator or other types of radiators, which are not limited here.

Abstract

本申请涉及线路板技术领域，具体公开了一种光纤线路板组件以及光电混合线路板，该光纤线路板组件包括：基板，包括基板本体，基板本体上至少开设有第一开窗；多个光纤单元，设置于基板，多个光纤单元的各一端均延伸至第一开窗，用于耦接多个光器件，各另一端延伸至基板外侧。通过上述方式，本申请能够简化光互联和电互联的组装，效率大幅提高。

Description

光纤线路板组件以及光电混合线路板 【技术领域】
本申请涉及线路板技术领域，特别是涉及一种光纤线路板组件以及光电混合线路板。
【背景技术】
电互联是指使用金属线条(一般为铜)实现电路板、芯片之间的信号连接。光互连是指使用导光介质(光纤、光波导等)实现电路板、芯片之间的信号连接。
光互联可以与电互联组合，但目前光互联中光纤数量通常比较多，容易导致杂乱无章、组装不易的问题。
【发明内容】
本申请实施例提供了一种光纤线路板组件以及光电混合线路板，以解决现有技术中光互联可以与电互联组装不易的技术问题。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种光纤线路板组件，包括：基板，包括基板本体，基板本体上至少开设有第一开窗；多个光纤单元，设置于基板，多个光纤单元的各一端均延伸至第一开窗，用于耦接多个光器件，各另一端延伸至基板外侧；其中，光器件为光电转换器件。
为解决上述技术问题，本申请采用的另一个技术方案是：提供一种光纤线路板组件，包括：基板，包括基板本体，基板本体上至少开设有第一开窗；多个光纤单元，设置于基板，多个光纤单元的各一端均延伸至第一开窗，用于耦接多个光器件，各另一端延伸至基板外侧。
为解决上述技术问题，本申请采用的又一个技术方案是：提供一种光电混合线路板，该光电混合线路板包括：如前述的光纤线路板组件；印制电路板，与光纤线路板组件层叠且间隔设置；第一电子元件，设置在印制电路板上，且第一电子元件与第一开窗区域对应设置；多个光器件，设置在印制电路板上，且围设在第一电子元件之外，光器件通过印 制电路板耦接第一电子元件。
本申请的有益效果是：区别于现有技术的情况，本申请中的光纤线路板组件在基板本体上至少开设有第一开窗，且多个光纤单元的各一端均延伸至第一开窗，如此一来，可以将芯片、与光纤单元耦接的光器件设置在第一开窗内，而光纤单元集成于基板中，进而不会杂乱无章的情况，且光纤单元的各一端固定在第一开窗内侧，顺序、位置固定，不再需要一个个来重新定位连接光器件，进而光互联和电互联的组装大幅简化，效率大幅提高。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是本申请光纤线路板组件一实施方式的结构示意图；
图2是本申请光纤线路板组件另一实施方式的结构示意图；
图3是本申请光纤线路板组件另一实施方式的局部结构示意图；
图4是本申请光纤线路板组件又一实施方式的结构示意图；
图5是本申请光电混合线路板第一实施方式的结构示意图；
图6是本申请光电混合线路板第一实施方式的另一结构示意图；
图7是本申请光电混合线路板第二实施方式的结构示意图；
图8是本申请光电混合线路板第二实施方式的另一结构示意图；
图9是本申请光电混合线路板第三实施方式的结构示意图；
图10是本申请光纤线路板组件中基板本体的结构示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本 申请保护的范围。
参阅图1，在本实施方式中，光纤线路板组件10可以包括仅传输光信号的线路板，也可以包括传输包括光信号在内的混合信号的线路板。
该光纤线路板组件10包括：基板11以及多个光纤单元12。基板11包括基板本体111，基板本体11上至少开设有第一开窗101。多个光纤单元12设置于基板11，多个光纤单元12的各一端均延伸至第一开窗101，多个光纤单元12用于耦接多个光器件20，多个光纤单元12的各另一端延伸至基板11外侧。
具体而言，本实施方式中可以采用图形转移工艺在所述基板本体111的中央区域或边缘区域开设第一开窗101，即，将中央区域或边缘区域的基板本体111去除，以便于后续加工中，在第一开窗101中对应设置电子元件和光器件20。
光纤单元12通过一定的方式排布于基板11中，其中，各个光纤单元12在基板11中的排布方式也可以相同或者不同。每一光纤单元12包括至少一条光纤，具体可以为一条或多条光纤、一组或多组光纤等。其中，每组光纤中光纤的数量可以根据实际需求，如根据需要连接的连接器的型号等进行设置，例如可以为1条、4条、8条、12条、24条等。光纤的组数也可根据需求设置，此处不做限定。
光纤单元12中的光纤可以是高温光纤，也可以是普通光纤。高温光纤与普通光纤的区别在于：高温光纤表面涂覆层的材料为耐高温材料，使高温光纤能够满足高温恶劣环境下的应用，而普通光纤虽然表面也设有涂覆层，但是普通光纤表面的涂覆层在高温下会丧失保护光纤的作用，进而光纤容易受损。其中设计人员可根据光纤线路板组件10的应用环境将光纤单元12选择为高温光纤或普通光纤。例如：当要求光纤线路板组件10能够在100℃以上高温下工作，且能够被反复弯折时，可将光纤单元12选择为高温光纤。其中值得注意的是，将光纤单元12设置为高温光纤，除了能够拓宽光纤线路板组件10的工作温度外，还能够使光纤线路板组件10在加工的过程中采用层压的方式加工，进而拓宽光纤线路板组件10的加工方式。
区别于现有技术的情况，本申请中的光纤线路板组件在基板本体上至少开设有第一开窗，且多个光纤单元的各一端均延伸至第一开窗，如此一来，可以将芯片、与光纤单元耦接的光器件设置在第一开窗内，而光纤单元集成于基板中，进而不会杂乱无章的情况，且光纤单元的各一端固定在第一开窗内侧，顺序、位置固定，不再需要一个个来重新定位连接光器件，进而光互联和电互联的组装大幅简化，效率大幅提高。
继续参阅图1，在一实施方式中，基板11还包括第一出纤口112。由基板本体111位于第一开窗101内侧处向第一开窗101中心凸伸出多个第一出纤口112，多个光纤单元12埋设于基板11内，且光纤单元12由第一出纤口112延伸而出。在其他实施方式中，第一出纤口112的外边缘与第一开窗101的内边缘平齐设置。
需要说明的是，在光纤的延伸方向上，光纤单元12的长度大于基板11的长度，以便进一步与光学连接器连接。此外，由于每个第一出纤口112间隔设置，因此，可以根据实际需求而对每个第一出纤口112进行弯折设置，从而可以将第一出纤口112设置为不同的出纤方向。
进一步地，光纤线路板组件10包括第一光纤接口14，光纤单元12的一端从第一光纤口延伸而出，到达第一开窗101内且连接第一光纤接口14，第一光纤接口14用于连接光器件20。
其中，第一光纤接口14可包括光学连接器及从第一光纤口延伸而出的光纤单元12，光学连接器设有定位结构，具体可设置于光学连接器的内腔当中，光学连接器可用于接收光纤线路板组件10中从第一光纤口延伸而出的光纤单元12，并通过定位结构对光纤单元12进行定位。
具体地，第一光纤接口14可以包括单路光学连接器和/或多路光学连接器，以及从第一光纤口延伸而出的光纤单元12。其中，单路光学连接器设有用于定位一路光纤单元12的定位结构，用于接收并定位由基板11延伸而出的一路光纤单元12。而多路光学连接器设有用于定位多路光纤单元12的定位结构，用于接收并定位由基板11延伸而出的多路光纤单元12。
在实际制作过程中，无论是单路光学连接器还是多路光学连接器， 需先将对应的光纤单元12穿入光学连接器的内腔，然后可用胶水对光纤进行固定，并切除多余光纤，然后进行研磨抛光，进而制成满足要求的第一光纤接口14。
参阅图2-3，在一实施方式中，多个第一出纤口112彼此间隔设置于第一开窗101的至少一半内侧，且呈半包围或包围分布。
具体而言，第一开窗101为四边形开窗，多个第一出纤口112彼此间隔设置于第一开窗101的两内侧边、三内侧边或四内侧边。其中，多个第一出纤口112彼此间隔设置在第一开窗101的四内侧边时，多个第一出纤口112环绕包围设于第一开窗101的内侧。
现有技术的光纤线路板是通过胶粘剂将光纤固定于光纤线路板表面或基材上，但是，由于光器件与第一电子元件之间的信号线长度过长，芯片工作时易受到周围电磁环境的影响产生电磁干扰，难以保证芯片的正常工作。区别于现有技术，本申请中的将光器件围设在第一电子元件之外，进而使光器件与第一电子元件之间的信号线长度最小，并避免平行走线，以解决现有技术中光器件与第一电子元件之间的信号线长度过长带来的缺陷。
第一开窗101为圆形或椭圆形开窗，多个第一出纤口112彼此间隔设置于第一开窗101的圆周内侧的二分之一、四分之三或整个圆周内侧。其中，多个第一出纤口112彼此间隔设置在第一开窗101的整个圆周内侧时，多个第一出纤口112环绕包围设于第一开窗101的内侧。
在一实施方式中，相邻第一出纤口112的末端离第一开窗101中心距离不同，差距至少大于或等于光器件20尺寸。
具体而言，相邻第一出纤口112的末端之间的差距至少大于或等于光器件20尺寸，进而可以保证在后续加工中，分别与相邻两个第一光纤接口14连接的两个光器件20有足够位置分开布置，且间隔分布，以便于散热。优选地，相邻第一出纤口112的末端之间的差距至少大于或等于光器件20的对角线距离。
在一实施方式中，多个第一出纤口112的末端以离第一开窗101中心距离不同至少分为两组，两组第一出纤口112的末端交替设置。
具体而言，两组第一出纤口112可呈半环形阵列排布、对称排布或双环形阵列排布，如此一来，通过第一光纤接口14可呈对称排布或双环形阵列排布，耦接于第一光纤接口14的光器件20可呈对称排布或双环形阵列排布，以增加光器件20的排布密度，增加线路板的集成度。
参阅图4，在一实施方式中，光纤线路板组件10包括第二光纤接口15。基板11还包括第二出纤口113。由基板11位于外侧处向外凸伸出多个第二出纤口113，多个光纤单元12埋设于基板11内，且光纤单元12由第二出纤口113延伸而出，且连接第二光纤接口15。
在一实施方式中，多个第二出纤口113彼此间隔设置，且均设置于基板11一侧。具体而言，第二出纤口113的外边缘可以与基板11外侧平齐设置。
其中，第二光纤接口15可包括光学连接器及从第二光纤口延伸而出的光纤单元12，光学连接器设有定位结构，具体可设置于光学连接器的内腔当中，光学连接器可用于接收光纤线路板组件10中从第二光纤口延伸而出的光纤单元12，并通过定位结构对光纤单元12进行定位。
具体地，第二光纤接口15可以包括单路光学连接器和/或多路光学连接器，以及从第二光纤口延伸而出的光纤单元12。其中，单路光学连接器设有用于定位一路光纤单元12的定位结构，用于接收并定位由基板11延伸而出的一路光纤单元12。而多路光学连接器设有用于定位多路光纤单元12的定位结构，用于接收并定位由基板11延伸而出的多路光纤单元12。
在实际制作过程中，无论是单路光学连接器还是多路光学连接器，需先将对应的光纤单元12穿入光学连接器的内腔，然后可用胶水对光纤进行固定，并切除多余光纤，然后进行研磨抛光，进而制成满足要求的第二光纤接口15。
参阅图10，在某些实施方式中，基板本体111包括：第一膜层1111、第二膜层1112以及结合层1113。第一膜层1111和第二膜层1112层叠间隔设置，光纤单元12至少部分设置于第一膜层1111和第二膜层1112之间。结合层1113填充于第一膜层1111和第二膜层1112之间的除光纤单 元12之外的剩余空间内，以使光纤单元12相对于第一膜层1111固定。
在一实施方式中，第一膜层1111为柔性材料，第二膜层1112、结合层1113为热固性材料或热塑性材料。其中，结合层1113包括层叠设置的两层黏结层1114，光纤单元12至少部分设置于两层黏结层1114之间或其中一层黏结层1114内。
在另一实施方式中，第一膜层1111、第二膜层1112为柔性材料。其中，结合层1113包括层叠设置的两层黏结层1114，光纤单元12至少部分设置于两层黏结层1114之间或其中一层黏结层1114内，黏结层1114为热固性材料或热塑性材料。
具体而言，柔性材料具体可以为柔性复合材料，例如可以为：聚酰亚胺、聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷等。第一膜层1111采用柔性材料，可以获得柔性的基板11，以能够经受反复的弯折，以适应实际的位置需求。第一膜层1111的厚度可不大于100μm，例如20μm-100μm，具体如20μm、25μm、45μm、65μm、85μm、100μm等，此处不做具体限定。
其中，相邻设置的第一膜层1111、第二膜层1112之间设置有结合层1113，以通过该结合层1113而连接在一起，并通过结合层1113而将一个对应的光纤单元12固定在相邻的两个第一膜层1111、第二膜层1112之间，且结合层1113填充于对应的相邻设置的两个第一膜层1111、第二膜层1112之间的除光纤单元12之外的剩余空间内。
需要指出的是，结合层1113厚度过小时难以固定光纤，而厚度过大时又难以保持基板11的柔性。其中，此处的厚度是指结合层1113在垂直于第一膜层1111、第二膜层1112的板面的方向上的厚度。本实施方式中，相邻的两个第一膜层1111、第二膜层1112之间的结合层1113的最薄区域的厚度大于光纤单元12的直径的十分之一且小于光纤单元12的直径的10倍，或者大于光纤单元12的直径的二分之一且小于光纤单元12的直径的2倍，例如相邻的两个第一膜层1111、第二膜层1112之间的结合层1113的最薄区域的厚度为光纤直径的五分之一、二分之一、1倍、2倍、5倍等，此处不做具体限定。
具体地，结合层1113的厚度不小于50μm，可以为50μm、60μm、70μm等，使用结合层1113之后，相邻第一膜层1111、第二膜层1112之间的抗剥强度不小于15N/cm 3。
具体地，在一个应用场景中，黏结层1114在第一温度范围和/或第一压力范围内为固态且为柔性，在第二温度范围和/或第二压力范围内具有流动性，其中第一温度范围中的任意温度值不大于第二温度范围中的任意温度值。具体地，在常温常压下，或者接近常温常压时，黏结层1114为固态且具有柔性，而在将其加热到一定的温度和/或施加一定的压力时，具有一定的流动性。具体地，黏结层1114可以为热塑性材料或热固性材料。
其中，可以根据光纤线路板组件10的实际使用环境选用不同材质的黏结层1114。具体地，在需适应高温环境时，如上所述，光纤单元12的光纤采用高温光纤，黏结层1114的材质可以为环氧树脂体系、丙烯酸体系、硅胶体系中的至少一种。而在仅需在普通常温环境下作业时，如上所述，光纤单元12的光纤采用普通光纤，则黏结层1114的材质为丙烯酸体系、硅胶体系中的至少一种即可。
采用上述材质的黏结层1114，在对基板11加热和/或加压时，黏结层1114能够产生流动并包覆于光纤单元12的外围，并填充相邻第一膜层1111、第二膜层1112之间除光纤之外的空间内，从而将光纤固定地更加牢靠，以减少长期使用时光纤由于固定不牢靠而出现松动、发生位移的情况，从而提高基板11以及光纤线路板组件10的可靠性。
参阅图5-8，在本实施方式中，光电混合线路板100包括：光纤线路板组件10、印制电路板30、第一电子元件40以及多个光器件20。
印制电路板30与光纤线路板组件10层叠且间隔设置。第一电子元件40、多个光器件20设置在印制电路板30上，第一电子元件40与第一开窗101区域对应设置，多个光器件20围设在第一电子元件40之外，光器件20通过印制电路板30耦接第一电子元件40。
需要指出的是，本实施方式中的光纤线路板组件10与上述本申请光纤线路板组件10实施方式中的光纤线路板组件10相同，相关详细内 容请参见上述各实施方式，此处不再赘述。
第一光纤接口14用于连接光纤单元12与光器件20连接，以进行光信号传输，其中，光器件20具体为光能转化器或光传介质。光能转化器进一步为光电转换器件。第一电子元件40具体为芯片，例如路由器芯片。
光器件20包括光学端口(图未示出)，光学端口用于与第一光纤接口14连接，以进行光信号传输，其中，光学端口在连接第一光纤接口14时的角度可调，以使光器件20的光学端口可以朝向第一光纤单元的接入方向。例如，若光纤单元12是从光电混合线路板100的左侧接入，则光器件20的光学端口可以朝向光纤单元12的接入方向设置。
现有技术的光纤线路板是通过胶粘剂将光纤固定于光纤线路板表面或基材上，但是，由于光器件与第一电子元件之间的信号线长度过长，芯片工作时易受到周围电磁环境的影响产生电磁干扰，难以保证芯片的正常工作。区别于现有技术，本申请中的将光器件围设在第一电子元件之外，进而使光器件与第一电子元件之间的信号线长度最小，并避免平行走线，以解决现有技术中光器件与第一电子元件之间的信号线长度过长带来的缺陷。
在一实施方式中，印制电路板30与光纤线路板组件10之间设置有支撑件60，具体而言，可以在印制电路板30、光纤线路板组件10上设置安装孔(图未示出)，此时，支撑件60则可以为螺丝、铆钉、销钉等通过插置于安装孔内而将印制电路板30与光纤线路板组件10固定连接。通过这种方式，能够使得印制电路板30与光纤线路板组件10之间的固定更加牢靠、拆卸也更方便。
在一实施方式中，连接于多个第一光纤接口14的多个光器件20彼此间隔设置，且多个光器件20呈半包围或包围分布。进一步地，多个光器件20呈单环形阵列排布或呈双环形阵列排布，以增加光器件20的排布密度，增加光电混合线路板100的集成度。
继续参阅图4，在一实施方式中，基板本体11上还开设有第二开窗102，第二开窗102与第一开窗101区域间隔设置。
光电混合线路板100还包括第二电子元件50，第二电子元件50设置在印制电路板30上，且第二电子元件50与光纤线路板组件10的第二开窗102对应设置，其中，第二开窗102用于暴露第二电子元件50。其中，第二电子元件50具体为高电容电子元件。
参阅图9，进一步地，由于光器件20、第一电子元件40以及第二电子元件50均暴露在基板11的开窗区域，因此，在后续加工中，光器件20、第一电子元件40以及第二电子元件50可以共用同一个散热器70，散热器70设置在光器件20、第一电子元件40以及第二电子元件50的远离印制电路板30的一侧，其中，散热器70可以为水冷散热器或其他类型的散热器，在此不做限定。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种光纤线路板组件，其特征在于，包括：
    基板，包括基板本体，所述基板本体上至少开设有第一开窗；
    多个光纤单元，设置于所述基板，多个所述光纤单元的各一端均延伸至所述第一开窗，用于耦接多个光器件，各另一端延伸至所述基板外侧；
    其中，所述光器件为光电转换器件。
  2. 一种光纤线路板组件，其特征在于，包括：
    基板，包括基板本体，所述基板本体上至少开设有第一开窗；
    多个光纤单元，设置于所述基板，多个所述光纤单元的各一端均延伸至所述第一开窗，用于耦接多个光器件，各另一端延伸至所述基板外侧。
  3. 根据权利要求2所述的光纤线路板组件，其特征在于，
    所述基板还包括：多个第一出纤口，由所述基板本体位于所述第一开窗内侧处向所述第一开窗中心凸伸出多个所述第一出纤口，所述多个光纤单元埋设于所述基板内；
    所述光纤线路板组件包括第一光纤接口，所述光纤单元的所述一端从所述第一光纤口延伸而出，到达所述第一开窗内且连接所述第一光纤接口，所述第一光纤接口用于连接所述光器件。
  4. 根据权利要求3所述的光纤线路板组件，其特征在于，
    多个所述第一出纤口彼此间隔设置于所述第一出纤口所述内侧，且呈半包围或包围分布。
  5. 根据权利要求4所述的光纤线路板，其特征在于，
    相邻所述第一出纤口的末端离所述第一开窗中心距离不同，差距至少大于或等于所述光器件尺寸。
  6. 根据权利要求5所述的光纤线路板组件，其特征在于，
    多个所述第一出纤口的末端以离所述第一开窗中心距离不同至少分为两组，两组所述第一出纤口的末端交替设置。
  7. 根据权利要求2所述的光纤线路板组件，其特征在于，
    所述基板还包括：多个第二出纤口，由所述基板位于外侧处向外凸伸出多个所述第二出纤口；
    所述光纤线路板组件包括第二光纤接口，所述光纤单元的所述另一端从所述第二光纤口延伸而出，且连接所述第二光纤接口。
  8. 根据权利要求7所述的光纤线路板组件，其特征在于，
    多个所述第二出纤口彼此间隔设置，且均设置于所述基板一侧。
  9. 根据权利要求2所述的光纤线路板组件，其特征在于，所述基板本体包括：
    层叠间隔设置的第一膜层和第二膜层，所述光纤单元至少部分设置于所述第一膜层和所述第二膜层之间；
    结合层，填充于所述第一膜层和所述第二膜层之间的除所述光纤单元之外的剩余空间内，以使所述光纤单元相对于所述第一膜层固定。
  10. 根据权利要求9所述的光纤线路板组件，其特征在于，
    所述第一膜层为柔性材料；
    所述第二膜层、所述结合层为热固性材料或热塑性材料；
    其中，所述结合层包括层叠设置的两层黏结层，所述光纤单元至少部分设置于两层所述黏结层之间或其中一层所述黏结层内。
  11. 根据权利要求9所述的光纤线路板组件，其特征在于，
    所述第一膜层、所述第二膜层为柔性材料；
    其中，所述结合层包括层叠设置的两层黏结层，所述光纤单元至少部分设置于两层所述黏结层之间或其中一层所述黏结层内，所述黏结层为热固性材料或热塑性材料。
  12. 一种光电混合线路板，其特征在于，所述光电混合线路板包括：
    光纤线路板组件，所述光纤线路板组件包括基板和设置于所述基板的多个光纤单元，所述基板包括基板本体，所述基板本体上至少开设有第一开窗，多个所述光纤单元的各一端均延伸至所述第一开窗，多个所述光纤单元用于耦接多个光器件，各另一端延伸至所述基板外侧；
    印制电路板，与所述光纤线路板组件层叠且间隔设置；
    第一电子元件，设置在所述印制电路板上，且所述第一电子元件与 所述第一开窗区域对应设置；
    多个所述光器件，设置在所述印制电路板上，且围设在所述第一电子元件之外，所述光器件通过所述印制电路板耦接所述第一电子元件。
  13. 根据权利要求12所述的光电混合线路板，其特征在于，
    多个所述光器件彼此间隔设置，且多个所述光器件呈半包围或包围分布。
  14. 根据权利要求13所述的光电混合线路板，其特征在于，
    多个所述光器件呈半环形阵列排布、单环形阵列排布或呈双环形阵列排布。
  15. 根据权利要求12所述的光电混合线路板，其特征在于，
    所述光器件包括光学端口，所述光学端口用于与所述第一光纤接口连接，以进行光信号传输；
    其中，所述光学端口在连接所述第一光纤接口时的角度可调。
  16. 根据权利要求12所述的光电混合线路板，其特征在于，所述基板本体上还开设有第二开窗，所述第二开窗与所述第一开窗区域间隔设置；
    所述光电混合线路板还包括：
    第二电子元件，设置在所述印制电路板上，且所述第二电子元件与所述光纤线路板的第二开窗对应设置，其中，所述第二开窗用于暴露所述第二电子元件。
  17. 根据权利要求12所述的光电混合线路板，其特征在于，所述光电混合线路板包括：
    支撑件，设置于所述印制电路板与所述光纤线路板组件之间。
  18. 根据权利要求12所述的光电混合线路板，其特征在于，
    所述基板还包括：多个第一出纤口，由所述基板本体位于所述第一开窗内侧处向所述第一开窗中心凸伸出多个所述第一出纤口，所述多个光纤单元埋设于所述基板内；
    所述光纤线路板组件包括第一光纤接口，所述光纤单元的所述一端从所述第一光纤口延伸而出，到达所述第一开窗内且连接所述第一光纤 接口，所述第一光纤接口用于连接所述光器件。
  19. 根据权利要求12所述的光电混合线路板，其特征在于，
    所述基板还包括：多个第二出纤口，由所述基板位于外侧处向外凸伸出多个所述第二出纤口；
    所述光纤线路板组件包括第二光纤接口，所述光纤单元的所述另一端从所述第二光纤口延伸而出，且连接所述第二光纤接口。
  20. 根据权利要求12所述的光电混合线路板，其特征在于，
    所述基板本体包括：
    层叠间隔设置的第一膜层和第二膜层，所述光纤单元至少部分设置于所述第一膜层和所述第二膜层之间；
    结合层，填充于所述第一膜层和所述第二膜层之间的除所述光纤单元之外的剩余空间内，以使所述光纤单元相对于所述第一膜层固定。
PCT/CN2020/142441 2020-08-28 2020-12-31 光纤线路板组件以及光电混合线路板 WO2022041630A1 (zh)

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