WO2022041098A1

WO2022041098A1 - Controller device

Info

Publication number: WO2022041098A1
Application number: PCT/CN2020/112011
Authority: WO
Inventors: 林继谦; 阎柏均; 姚成福
Original assignee: 威刚科技股份有限公司
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2022-03-03
Also published as: DE112020007556T5

Abstract

A controller device, comprising a heat dissipation assembly (1), a first control module (2), a first conductive structure (4), a second conductive structure (5), a housing assembly (7), and a wire group (8). The first control module (2) is provided on the heat dissipation assembly (1). The first conductive structure (4) is provided on the first control module (2) and electrically connected to the first control module (2). The second conductive structure (5) is provided on the first control module (2) and electrically connected to the first control module (2). The housing assembly (7) is provided on the heat dissipation assembly (1), and covers the first control module (2), the first conductive structure (4), and the second conductive structure (5). The housing assembly (7) comprises a housing structure (71) and a cover structure (72). The housing structure comprises a housing body (710), a first wire passing hole (711B), and a second wire passing hole (712B). The wire group (8) comprises a first wire (81) passing through the first wire passing hole (711B) and electrically connected to the first conductive structure (4), and a second wire (82) passing through the second wire passing hole (712B) and electrically connected to the second conductive structure (5). In this way, the effect of preventing the controller device from being affected by a liquid in an external environment is achieved.

Description

Controller device

technical field

The present invention relates to a controller device, in particular to a controller device that can be applied to an electric vehicle.

Background technique

First of all, with the global issue of energy saving and carbon reduction, various countries have higher and higher requirements for the quality and performance of new energy vehicles. In order to meet the needs of different regulations and different customer groups, the specifications of various parts and components are also becoming more and more demanding. Come higher. Therefore, how to make highly integrated and modular drives to meet different specifications has become increasingly important.

Next, the driver of the electric vehicle in the prior art generally disposes the driver's control circuit, power transistor and capacitor on the same printed circuit board, and has no concept of modular design. Therefore, the non-modular design will make it difficult to cope with different customer specifications, and if the power demand of the design structure increases, the number of power transistors and capacitors will increase, and finally the printed circuit board area will become larger. In addition, the power transistors and the capacitors in the prior art are stacked on the printed circuit board facing the same direction, but this design will cause the overall structure of the driver to become thicker, and the capacitors are not easy to dissipate heat. In addition, the driver of the electric vehicle in the prior art cannot effectively block the infiltration of liquid, and the driver is likely to fail due to infiltration of the liquid.

Therefore, how to avoid increasing the heat dissipation efficiency of the controller device of the electric vehicle and improve the water blocking effect of the controller device through the improvement of the structure design to overcome the above-mentioned defects has become one of the important issues to be solved by this technology.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a controller device aiming at the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a controller device, which includes a heat dissipation component, a first control module, a first conductive structure, a second conductive structure, and a casing body assembly and a lead set. The first control module is arranged on the heat dissipation assembly. The first conductive structure is disposed on the first control module and is electrically connected to the first control module, wherein the first conductive structure includes a first position disposed on the first control module a board and a first conductive column connected to the first positioning board. The second conductive structure is disposed on the first control module and is electrically connected to the first control module, wherein the second conductive structure includes a second position disposed on the first control module a board and a second conductive column connected to the second positioning board. The housing component is disposed on the heat dissipation component and covers the first control module, the first conductive structure and the second conductive structure, wherein the housing component includes a housing structure and a a cover structure arranged on the casing structure, the casing structure includes a casing body, a first hole arranged on the casing body and corresponding to the first conductive structure, a The casing body corresponds to the second hole of the second conductive structure, a first wire through hole arranged on the casing body, and a second wire through hole arranged on the casing body. The wire set includes a first wire that passes through the first wire and is electrically connected to the first conductive structure, and a second wire that passes through the second wire and is electrically connected to the second conductive structure. Two wires.

Further, the controller device further includes: a first gasket, the first gasket is disposed between the housing structure and the heat dissipation assembly.

Further, the controller device further includes: a second gasket, the second gasket is disposed between the casing structure and the cover structure.

Further, the controller device further comprises: a plurality of water blocking jackets, wherein one of the plurality of the water blocking jackets is disposed in the first wire through hole and located in the between the casing body and the first wire, and one of the plurality of water blocking jackets abuts against the casing body and the first wire; wherein, a plurality of the water blocking jackets The other one of the water blocking jackets is arranged in the second wire through hole and between the shell body and the second wire, and the other one of the plurality of the water blocking jackets is the water blocking jacket The sleeve abuts against the shell body and the second wire.

Further, each of the water blocking jackets includes a body portion, a first abutting portion disposed at one end of the body portion, a second abutting portion disposed at the other end of the body portion, and A plurality of water blocking parts are arranged on the main body part and are protrudingly arranged relative to the main body part.

Further, the controller device further includes: a first locking member and a second locking member, and the first conductive structure further includes a first locking hole disposed on the first positioning plate , the second conductive structure further includes a second locking hole arranged on the second positioning plate, the first control module includes a first opening corresponding to the first locking hole and a second opening corresponding to the second locking hole; wherein, the first locking member is fitted with the heat dissipation component through the first opening and the first locking hole in sequence, so as to The first conductive structure and the first control module are fixed on the heat dissipation assembly, and the second fastener passes through the second opening and the second locking hole and the heat dissipation assembly in sequence fitting, so as to fix the second conductive structure and the first control module on the heat dissipation component.

Further, the first control module further includes a circuit board, a first conductive element disposed on the circuit board, a second conductive element disposed on the circuit board, and a circuit board disposed on the circuit board. The third conductive element on the circuit board.

Further, the heat dissipation component includes a heat dissipation structure and a accommodating space located on the heat dissipation structure and recessed relative to the heat dissipation structure.

Further, the first control module includes a circuit board, a chip and a capacitor, the circuit board includes a first surface facing away from the heat dissipation component and a second surface facing the heat dissipation component, wherein , the chip is arranged on the first surface, and the capacitor is arranged on the second surface; wherein a part of the second surface of the circuit board abuts on the heat dissipation structure, and The capacitor provided on the second surface is located in the accommodating space.

Further, the circuit board includes a first circuit board and a second circuit board, the first circuit board includes a first substrate, the second circuit board includes a second substrate, and the chip is disposed on On the first substrate, the capacitor is disposed on the second substrate.

Further, the materials of the first substrate and the second substrate are different, and the thermal conductivity of the first substrate is greater than the thermal conductivity of the second substrate.

Further, the first substrate is electrically connected to the second substrate, the first substrate is disposed on the heat dissipation component, the second substrate is disposed on the first substrate, and the first substrate The vertical projection of a substrate relative to the heat dissipation component at least partially overlaps the vertical projection of the second substrate relative to the heat dissipation component.

Further, the controller device further includes: a second control module, wherein the second control module is arranged on the heat dissipation component, and the first control module and the second control module are located along the They are stacked and arranged in a direction away from the heat dissipation component.

Furthermore, the second control module includes a third circuit board, and the third circuit board includes a first through hole corresponding to the first conductive column of the first conductive structure and a first through hole corresponding to the first conductive column of the first conductive structure. A second through hole of the second conductive column of the second conductive structure, the first conductive column passes through the first through hole, and the second conductive column passes through the second through hole.

Further, the controller device further includes: a current sensing module, and the current sensing module is disposed on the second control module.

One of the beneficial effects of the present invention is that, in the controller device provided by the present invention, the housing component can be disposed on the heat dissipation component and cover the first control module and the first conductive structure. and the second conductive structure", "the casing assembly includes a casing structure and a cover structure disposed on the casing structure, the casing structure includes a casing body, a casing disposed on the casing a first hole on the shell body and corresponding to the first conductive structure, a second hole on the shell body and corresponding to the second conductive structure, a first hole on the shell body Wire through hole and a second wire through hole disposed on the shell body” and “The wire set includes a first wire passing through the first wire through hole and electrically connected to the first conductive structure and a wire passing through the first conductive structure. The technical solution of the second wire is through holes and is electrically connected to the second wire of the second conductive structure, so that the electrical connection between the first wire and the first conductive structure is the same as the second wire and the second conductive structure. The electrical connection is enclosed in the housing assembly to prevent liquid or moisture from the external environment from affecting its electrical connection.

For further understanding of the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are only for reference and description, not for limiting the present invention.

Description of drawings

FIG. 1 is a three-dimensional combined schematic diagram of a controller device according to an embodiment of the present invention.

FIG. 2 is another three-dimensional combined schematic diagram of the controller device according to the embodiment of the present invention.

FIG. 3 is a schematic exploded perspective view of a controller device according to an embodiment of the present invention.

FIG. 4 is another perspective exploded schematic diagram of the controller device according to the embodiment of the present invention.

5 is an exploded perspective view of one of the heat dissipation components, the first control module, the second control module, the first conductive structure, the second conductive structure and the current sensing module of the controller device according to the embodiment of the present invention.

6 is another perspective exploded schematic diagram of a heat dissipation component, a first control module, a second control module, a first conductive structure, a second conductive structure, and a current sensing module of the controller device according to an embodiment of the present invention.

7 is a perspective exploded schematic diagram of a heat dissipation component, a first control module and a second control module of a controller device according to an embodiment of the present invention.

8 is an exploded perspective view of one of the heat dissipation components, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.

9 is another perspective exploded schematic diagram of the heat dissipation component, the first control module, the first conductive structure and the second conductive structure of the controller device according to the embodiment of the present invention.

FIG. 10 is a three-dimensional combined schematic diagram of a housing component, a wire set and a water blocking jacket of a controller device according to an embodiment of the present invention.

FIG. 11 is a perspective exploded schematic diagram of a housing assembly, a wire set and a water blocking jacket of a controller device according to an embodiment of the present invention.

FIG. 12 is a schematic cross-sectional view of the XII-XII section of FIG. 10 .

detailed description

The following are specific embodiments to illustrate the implementation of the “controller device” disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that, although the terms "first", "second", "third" and the like may be used herein to describe various elements, these elements should not be limited by these terms. These terms are primarily used to distinguish one element from another. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

Example

Referring to FIG. 1 to FIG. 7 , FIG. 1 and FIG. 2 are respectively schematic assembled perspective views of the controller device according to the embodiment of the present invention, and FIG. 3 and FIG. 5 and FIG. 6 are respectively three-dimensional exploded schematic views of the heat dissipation component, the first control module, the second control module, the first conductive structure, the second conductive structure, and the current sensing module of the controller device according to the embodiment of the present invention, and FIG. 7 is A perspective exploded schematic diagram of a heat dissipation component, a first control module, and a second control module of the controller device according to the embodiment of the present invention. An embodiment of the present invention provides a controller device U, which includes a heat dissipation component 1 , a first control module 2 , a first conductive structure 4 , a second conductive structure 5 , a housing component 7 and a wire set 8 . Preferably, the controller device U may further include a second control module 3 and a current sensing module 6 . For example, the controller device U provided by the embodiment of the present invention may preferably be applied to a drive of an electric vehicle, but the present invention is not limited thereto. In addition, the controller device U provided by the embodiment of the present invention can also be applied to a system that requires high heat dissipation efficiency.

As mentioned above, the first control module 2 is disposed on the heat dissipation assembly 1 , and the first control module 2 can abut on the heat dissipation assembly 1 . The second control module 3 may be disposed on the heat dissipation assembly 1 , and the first control module 2 and the second control module 3 may be sequentially stacked along a direction (Y direction) away from the heat dissipation assembly 1 . In addition, for example, the second control module 3 can be elevated by a copper column C, so that the first control module 2 is located between the heat dissipation component 1 and the second control module 3, but the present invention does not use the second control module The way 3 is arranged above the first control module 2 is a limitation. In addition, the current sensing module 6 can be disposed on the second control module 3, and the current sensing module 6 can be used to sense the current value.

As mentioned above, the first conductive structure 4 is disposed on the first control module 2 and is electrically connected to the first control module 2 , and the second conductive structure 5 is disposed on the first control module 2 and is electrically connected to the first control module 2 . In addition, the first control module 2 may include a circuit board 21 , a chip 22 , a capacitor 23 , a first conductive element 24 , a second conductive element 25 and a third conductive element 26 . The first conductive structure 4 , the second conductive structure 5 , the chip 22 , the capacitor 23 , the first conductive element 24 , the second conductive element 25 and the third conductive element 26 can be disposed on the circuit board 21 and electrically connected to the circuit board 21 . In addition, the first conductive element 24, the second conductive element 25 and the third conductive element 26 of the controller device U can be connected to the motor respectively, and the first conductive structure 4 and the second conductive structure 5 can be used as the positive and negative electrodes of the direct current, respectively , but the present invention is not limited to this. In addition, it should be noted that although the above content takes the first control module 2 including the chip 22 and the capacitor 23 as an example, in other embodiments, the first control module 2 may also include other electronic components.

Based on the above, the current sensing module 6 can be disposed on the second control module 3, and the current sensing module 6 can be used to sense the flow through the first conductive structure 4, the second conductive structure 5, the first conductive element 24, the second conductive The current value of the conductive element 25 and/or the third conductive element 26 . However, it should be noted that the present invention is not limited by whether the current sensing modules 6 are provided or not, and also is not limited by the form and quantity of the current sensing modules 6 .

Next, please refer to FIG. 3 and FIG. 4 again, and also refer to FIG. 10 and FIG. 11 . FIG. 10 and FIG. 11 are respectively the housing component, the wire set and the resistance of the controller device according to the embodiment of the present invention. Schematic diagram of the three-dimensional combination and three-dimensional decomposition of the water jacket. According to the present invention, the housing component 7 can be disposed on the heat dissipation component 1 and cover the first control module 2 , the second control module 3 , the first conductive structure 4 , the second conductive structure 5 and the current sensing module 6 . For example, the housing assembly 7 includes a housing structure 71 and a cover structure 72 disposed on the housing structure 71 . The casing structure 71 includes a casing body 710 , a first hole 711A disposed on the casing body 710 and corresponding to the first conductive structure 4 , and a second hole disposed on the casing body 710 and corresponding to the second conductive structure 5 . 712A, a first wire through hole 711B disposed on the casing body 710 and a second wire through hole 712B disposed on the casing body 710 . Preferably, the case structure 71 may further include a third hole 713A disposed on the case body 710 and corresponding to the first conductive element 24 , a fourth hole 713A disposed on the case body 710 and corresponding to the second conductive element 25 . The hole 714A and a fifth hole 715A disposed on the case body 710 and corresponding to the third conductive element 26 . In addition, the casing structure 71 may further include a third wire through hole 713B disposed on the casing body 710 , a fourth wire through hole 714B disposed on the casing body 710 , and a fifth wire through hole disposed on the casing body 710 715B.

As mentioned above, the wire set 8 includes a first wire 81 passing through the first wire through hole 711B and electrically connected to the first conductive structure 4 , and a second wire passing through the second wire through hole 712B and electrically connected to the second conductive structure 5 . Wire 82. Preferably, the wire set 8 may further include a third wire 83 passing through the third wire through hole 713B and electrically connected to the first conductive element 24 , and a fourth wire through hole 714B and electrically connected to the second conductive element 25 . The fourth wire 84 and a fifth wire 85 passing through the fifth wire through hole 715B and electrically connected to the third conductive element 26 .

Thereby, the first conductive structure 4 , the second conductive structure 5 , the first conductive element 24 , the second conductive element 25 and the third conductive element 26 can pass through the first hole 711A, the second hole 712A and the third hole 713A, respectively. , the fourth hole 714A and the fifth hole 715A are exposed relative to the case body 710 , so that the first wire 81 , the second wire 82 , the third wire 83 , the fourth wire 84 and the fifth wire 85 can pass through the first wire respectively. The wire vias 711B, the second wire vias 712B, the third wire vias 713B, the fourth wire vias 714B, and the fifth wire vias 715B are respectively electrically connected to the first conductive structure 4 , the second conductive structure 5 , and the first conductive element 24 . The second conductive element 25 and the third conductive element 26 .

Next, please refer to FIG. 3 and FIG. 4 again, the controller device U may further include a first gasket E1, and the first gasket E1 is disposed between the shell body 710 of the shell structure 71 and the heat dissipation component 1, so as to improve the The tightness between the housing body 710 and the heat dissipation component 1 prevents liquid or moisture from the external environment from infiltrating into the controller device U. In addition, since the casing assembly 7 is composed of the casing structure 71 and the cover structure 72 , the controller device U may further include a second gasket E2 , and the second gasket E2 is disposed on the casing body of the casing structure 71 . 710 and the cover structure 72 to improve the tightness between the case body 710 and the cover structure 72 , thereby preventing liquid or moisture from the external environment from penetrating into the controller device U.

Next, please refer to FIG. 3 to FIG. 7 again, and also refer to FIG. 8 and FIG. 9 . FIG. 8 and FIG. 9 are respectively the heat dissipation component, the first control module and the A schematic exploded perspective view of the first conductive structure and the second conductive structure. The configuration of the heat dissipation component 1 , the first control module 2 , the first conductive structure 4 and the second conductive structure 5 will be further illustrated below. In detail, the first conductive structure 4 may include a first positioning plate 41 disposed on the first control module 2 and a first conductive column 42 connected to the first positioning plate 41 . The length direction of the first positioning plate 41 (X direction) and the length direction (Y direction) of the first conductive pillars 42 are perpendicular to each other. The second conductive structure 5 includes a second positioning plate 51 disposed on the first control module 2 and a second conductive column 52 connected to the second positioning plate 51 . The length direction (X direction) of the second positioning plate 51 is the same as that of the second positioning plate 51 . The length directions (Y directions) of the second conductive pillars 52 are perpendicular to each other. Thereby, the first conductive structure 4 and the second conductive structure 5 can form a structure similar to an inverted T type.

Based on the above, the first conductive post 42 can be disposed between the center (not numbered in the figure) of the first positioning plate 41 and a first end portion 411 of the first positioning plate 41 , that is, the first conductive post The distance from 42 to the first end portion 411 of the first positioning plate 41 is different from the distance from the first conductive post 42 to a second end portion 412 of the first positioning plate 41 . In addition, the second conductive column 52 may be disposed between the center (not numbered in the figure) of the second positioning plate 51 and a third end portion 511 of the second positioning plate 51 , that is, the second conductive column 52 The distance to a third end portion 511 of the second positioning plate 51 is different from the distance from the second conductive post 52 to a fourth end portion 512 of the second positioning plate 51 . In addition, it should be noted that the position of the center of the first positioning plate 41 refers to the intermediate position between the first end portion 411 and the second end portion 412 of the first positioning plate 41 , and the center of the second positioning plate 51 The position refers to the middle position between the third end portion 511 and the fourth end portion 512 of the second positioning plate 51 . In addition, for example, the length of the first positioning plate 41 may be greater than that of the first conductive column 42 , and the length of the second positioning plate 51 may be greater than that of the second conductive column 52 , although the invention is not limited thereto.

Based on the above, for example, the shape of the first positioning plate 41 and the second positioning plate 51 can be elongated, the length of the first positioning plate 41 can be greater than the length of the first conductive column 42, and the length of the second positioning plate 51 can be larger than the second conductive column 52, but the present invention is not limited to this. Further, when the first conductive structure 4 and the second conductive structure 5 are disposed on the first control module 2, the first positioning plate 41 and the second positioning plate 51 can be parallel to each other and arranged side by side, and the first conductive structure The pillars 42 and the second conductive pillars 52 may be arranged in a staggered manner. Therefore, since the first conductive pillars 42 are asymmetrically arranged relative to the installation positions of the first positioning plates 41, and the second conductive pillars 52 are arranged asymmetrically relative to the installation positions of the second positioning plates 51, this The invention can utilize the positions of the first conductive structure 4 and the second conductive structure 5 arranged on the first control module 2, so that when the first conductive structure 4 and the second conductive structure 5 are fabricated, the first conductive structure 4 and the second conductive structure The shape and structure of the conductive structure 5 may be completely the same.

Based on the above, preferably, according to the present invention, the controller device U may further include a first locking member S1 and a second locking member S2, that is, the first conductive structure 4 and the second conductive structure 5 can be respectively used The first locking member S1 and a second locking member S2 are disposed on the first control module 2 and the heat dissipation component 1 and are electrically connected to the first control module 2 . Further, the first conductive structure 4 may further include a first locking hole 43 disposed on the first positioning plate 41 , and the second conductive structure 5 may further include a first locking hole 43 disposed on the second positioning plate 51 . With two locking holes 53 , the first control module 2 may include a first opening 212A corresponding to the first locking hole 43 and a second opening 212B corresponding to the second locking hole 53 . The first locking member S1 can be engaged with the heat dissipation component 1 through the first opening 212A and the first locking hole 43 in sequence, so as to fix the first conductive structure 4 and the first control module 2 on the heat dissipation component 1 . The second locking member S2 can be engaged with the heat dissipation component 1 through the second opening 212B and the second locking hole 53 in sequence, so as to fix the second conductive structure 5 and the first control module 2 on the heat dissipation component 1 . In addition, it should be noted that, in a preferred embodiment, the controller device U may include a plurality of first locking members S1 and second locking members S2, so that the plurality of first locking members S1 and the second locking members S2 are respectively Locked on the plurality of first locking holes 43, the plurality of second locking holes 53, the plurality of first openings 212A and the plurality of second openings 212B, and the first conductive structure 4, the second conductive structure 5 and the first control module 2 are fixed on the heat dissipation assembly 1 . In addition, it should be noted that the controller device U may further include one or more insulating pads R, the insulating pads R may correspond to the first locking member S1 and/or the second locking member S2 respectively, and the insulating pads R are arranged on the first locking member S1 and/or the second locking member S2. Between a locking member S1 and the first conductive structure 4, and an insulating pad R is disposed between the second locking member S2 and the second conductive structure 5, but the present invention is not limited to this.

Next, referring to FIGS. 5 to 9 again, the heat dissipation assembly 1 may include a heat dissipation structure 11 , and the circuit board 21 of the second control module 3 may be disposed on a bearing surface 110 of the heat dissipation structure 11 and abut against the heat dissipation structure 11 of the bearing surface 110. In addition, the circuit board 21 can include a first surface 2101 facing away from the heat dissipation component 1 and a second surface 2102 facing the heat dissipation component 1 , the chip 22 can be disposed on the first surface 2101 , and the capacitor 23 can be disposed on the second surface 2102 superior. In other words, the height direction (positive Y direction) of the chip 22 provided on the circuit board 21 and the height direction (negative Y direction) of the capacitor 23 provided on the circuit board 21 are opposite to each other. That is, the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation assembly 1 , and the height direction (negative Y direction) of the capacitor 23 is a direction close to the heat dissipation assembly 1 . Further, since the height direction (negative Y direction) of the capacitor 23 is toward the direction close to the heat dissipation component 1 , the heat dissipation component 1 preferably further includes a heat dissipation structure 11 and a recess disposed relative to the heat dissipation structure 11 . accommodating space 12 . Therefore, a part of the second surface 2102 of the circuit board 21 can abut on the heat dissipation structure 11 , and the capacitor 23 disposed on the second surface 2102 can be located in the accommodating space 12 . In this way, the capacitor 23 can be arranged in an inverted manner relative to the chip 22 , so as to reduce the volume of the controller device U. As shown in FIG. In addition, it should be noted that a part of the second surface 2102 of the circuit board 21 may directly abut on the heat dissipation structure 11 , or a thermally conductive adhesive may be disposed between the second surface 2102 of the circuit board 21 and the heat dissipation structure 11 . so that a part of the second surface 2102 of the circuit board 21 can indirectly abut on the heat dissipation structure 11 .

Based on the above, further, the controller device U may further include a thermally conductive material T, the thermally conductive material T may be disposed in the accommodating space 12 , and the capacitor 23 disposed on the circuit board 21 may be disposed in the accommodating space 12 And embedded in the thermal conductive material T. In this way, the heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 by using the thermally conductive material T, thereby increasing the heat dissipation efficiency of the capacitor 23 . In addition, by embedding the capacitor 23 in the thermally conductive material T, the effect of shock absorption can also be achieved. For example, the thermally conductive material T can be a thermally conductive colloid, but the present invention is not limited to this.

Next, please refer to FIG. 5 to FIG. 9 again, according to the present invention, the circuit board 21 may be composed of a first circuit board 21A and a second circuit board 21B, that is, the first control module 2 may include a first circuit board 21A and a second circuit board 21B. A circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23 . The first circuit board 21A may include a first substrate 211A, the second circuit board 21B may include a second substrate 211B, the first substrate 211A may be coupled to the second substrate 211B, and the first conductive structures 4 and the second conductive structures 5 It can be coupled to the first substrate 211A and the second substrate 211B. Further, the first substrate 211A can be disposed on the heat dissipation assembly 1, the second substrate 211B can be disposed on the first substrate 211A, and the vertical projection of the first substrate 211A relative to the heat dissipation assembly 1 and the second substrate 211B relative to the heat dissipation The vertical projections of component 1 overlap at least partially. In other words, the first substrate 211A and the second substrate 211B are at least partially overlapped. In addition, one or more conductive pads (not shown in the figure) may be respectively disposed on the first substrate 211A and the second substrate 211B, so as to couple the first substrate 211A and the second substrate 211B with each other by the conductive pads. For example, in one embodiment, the conductive pads of the first substrate 211A and the second substrate 211B can be disposed at the overlapping position of the first substrate 211A and the second substrate 211B, so that the first substrate 211A and the second substrate 211B are overlapped. The substrates 211B are coupled to each other by being stacked.

As mentioned above, the first substrate 211A of the first circuit board 21A may include a first surface 2101A facing away from the heat dissipation component 1 and a second surface 2102A facing the heat dissipation component 1 , and the second substrate 211B of the second circuit board 21B may include It includes a first surface 2101B facing away from the heat dissipation component 1 and a second surface 2102B facing the accommodating space 12 of the heat dissipation component 1 . The chip 22 may be disposed on the first surface 2101A of the first substrate 211A, and the capacitor 23 may be disposed on the second surface 2102B of the second substrate 211B. Therefore, the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation assembly 1 , and the height direction (negative Y direction) of the capacitor 23 is a direction close to the heat dissipation assembly 1 .

Based on the above, the second surface 2102A of the first substrate 211A can be disposed on a bearing surface 110 of the heat dissipation structure 11 and abut against the bearing surface 110 of the heat dissipation structure 11 , whereby the heat generated by the chip 22 can directly pass through the first surface 110 of the heat dissipation structure 11 . The substrate 211A is transferred to the heat dissipation structure 11 to increase the heat dissipation efficiency of the chip 22 .

As mentioned above, the first conductive element 24 , the second conductive element 25 and the third conductive element 26 may be disposed on the first surface 2101A of the first substrate 211A and coupled to the first substrate 211A. In addition, the first conductive element 24 , the second conductive element 25 and the third conductive element 26 can also be respectively disposed on the first substrate 211A and the heat dissipation component 1 by means of fasteners (not numbered in the figure) and electrically connected to the first substrate 211A. Substrate 211A.

Based on the above, preferably, according to the present invention, the materials of the first substrate 211A and the second substrate 211B may be different from each other, and more preferably, the thermal conductivity of the first substrate 211A may be greater than that of the second substrate 211B. For example, the first substrate 211A can be an aluminum substrate, the second substrate 211B can be an FR4 substrate, and the chip 22 can be a power transistor (such as, but not limited to, a MOS field effect power transistor), so as to To control the electrical signal transmitted to the motor through the first conductive element 24, the second conductive element 25 and the third conductive element 26, the capacitor 23 can be used for voltage regulation of the power supply and provision of instantaneous current, but the present invention is not limited to this . Thereby, the heat energy generated by the power transistor is conducted to the heat dissipation structure 11 through the first substrate 211A (aluminum substrate), thereby greatly improving the heat dissipation efficiency of the chip 22 . The heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 through the conduction of the thermally conductive material T. In addition, for example, the heat dissipation structure 11 can also be a metal with good thermal conductivity, such as but not limited to aluminum.

Next, please refer to FIGS. 3 to 9 , for example, the second control module 3 may include a third circuit board 31 and an electronic component 32 disposed on the third circuit board 31 , for example, an electronic The element 32 can be a chip, a capacitor, a microprocessor or a signal connection port, and the invention is not limited thereto. In addition, the third circuit board 31 may further include a first through hole 311 corresponding to the first conductive pillar 42 of the first conductive structure 4 , and a second through hole 311 corresponding to the second conductive pillar 52 of the second conductive structure 5 . The through hole 312 , a third through hole 313 corresponding to the first conductive element 24 , a fourth through hole 314 corresponding to the second conductive element 25 , and a fifth through hole 315 corresponding to the third conductive element 26 . The first conductive pillars 42 may pass through the first through holes 311 , and the second conductive pillars 52 may pass through the second through holes 312 . In addition, the first conductive element 24 can pass through the third through hole 313 , the second conductive element 25 can pass through the fourth through hole 314 , and the third conductive element 26 can pass through the fifth through hole 315 . Thereby, the first conductive pillars 42 of the first conductive structure 4 , the second conductive pillars 52 of the second conductive structure 5 , the first conductive elements 24 , the second conductive elements 25 and the third conductive elements 26 can be relative to the third circuit The plate 31 is provided in a protruding shape.

As mentioned above, the current sensing module 6 can be disposed on the third circuit board 31 of the second control module 3 and coupled to the third circuit board 31 . For example, the current sensing module 6 can be a Hall Current Sensor. In addition, it should be noted that the current sensing module 6 in the drawings of the present invention is only a schematic representation. Further, the current sensing module 6 may correspond to at least one of the first conductive element 24 , the second conductive element 25 and the third conductive element 26 , and the first conductive element 24 , the second conductive element 25 and the At least one of the third conductive elements 26 may pass through the current sensing module 6 to detect the current value through the current sensing module 6 . Preferably, a plurality of current sensing modules 6 can be provided to detect the current values passing through the first conductive element 24 , the second conductive element 25 and the third conductive element 26 respectively. Further, the current sensing module 6 may also correspond to at least one of the first conductive column 42 and the second conductive column 52. Preferably, a plurality of current sensing modules 6 Current values of the conductive pillars 42 and the second conductive pillars 52 . Further, the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive column 42 and/or the second conductive column 52 can pass through the current sensing module 6, respectively, and the first conductive element 24. The second conductive element 25 , the third conductive element 26 , the first conductive column 42 and/or the second conductive column 52 are arranged in a protruding shape relative to the current sensing module 6 .

Next, please refer to FIG. 10 and FIG. 11 again, and please refer to FIG. 12 . FIG. 12 is a schematic cross-sectional view of the XII-XII section of FIG. 10 . The controller device U may further comprise a plurality of water blocking jackets 9 . For example, one of the plurality of water blocking sleeves 9 is disposed in the first wire through hole 711B and between the case body 710 and the first wire 81 , and one of the plurality of water blocking sleeves 9 The water blocking jacket 9 abuts against the case body 710 and the first wire 81 . In addition, another water blocking jacket 9 among the plurality of water blocking jackets 9 is disposed in the second wire through hole 712B and between the case body 710 and the second wire 82 , and the other water blocking jacket 9 among the plurality of water blocking jackets 9 blocks water. The sleeve 9 abuts against the housing body 710 and the second wire 82 . Further, according to the present invention, the plurality of water blocking sleeves 9 may be further disposed in the third wire through hole 713B, the fourth wire through hole 714B and the fifth wire through hole 715B, respectively, to further correspond to the third wire 83 , the fourth wire 84 and the fifth wire 85 . That is to say, another water blocking jacket 9 among the plurality of water blocking jackets 9 is disposed in the third wire through hole 713B and between the case body 710 and the third wire 83 , and another water blocking jacket 9 among the plurality of water blocking jackets 9 The water blocking jacket 9 abuts against the case body 710 and the third wire 83 . In addition, another water blocking jacket 9 among the plurality of water blocking jackets 9 is disposed in the fourth wire through hole 714B and located between the case body 710 and the fourth wire 84 , and another water blocking jacket 9 among the plurality of water blocking jackets 9 blocks water. The sleeve 9 abuts against the housing body 710 and the fourth wire 84 . In addition, yet another water blocking jacket 9 among the plurality of water blocking jackets 9 is disposed in the fifth wire through hole 715B and located between the housing body 710 and the fifth wire 85 , and yet another water blocking jacket 9 among the plurality of water blocking jackets 9 The water blocking jacket 9 abuts against the case body 710 and the fifth wire 85 . In addition, FIG. 12 of the present invention illustrates a state in which the water blocking jacket 9 is provided in the fourth wire through hole 714B as an example.

10 to 12 , the water blocking sleeve 9 disposed in the first wire through hole 711B and located between the casing body 710 and the first wire 81 will be used as an example for illustration. In detail, each water blocking jacket 9 includes a body portion 91 , a first abutting portion 92 disposed at one end of the body portion 91 , a second abutting portion 93 disposed at the other end of the body portion 91 , and A plurality of water blocking portions 94 are disposed on the main body portion 91 and protrude from the main body portion 91 . In this way, the arrangement of multiple water blocking jackets 9 can be used to further prevent liquid or moisture from the external environment from infiltrating into the controller device U along the wire set 8 .

Based on the above, it should be noted that the housing assembly 7 may further include an airtight test hole 70 and a water blocking valve B corresponding to the airtight test hole 70. The airtight test hole 70 may be provided on the housing body 710, and The water blocking valve B may be disposed in the airtight test hole 70 to close the airtight test hole 70 . In this way, in one embodiment, high-pressure gas can be injected through the air-tight test hole 70, and it can be observed whether there is excessive gas leakage. After the test is completed, the water blocking valve B can be placed in the airtight test hole 70 to close the airtight test hole 70 .

Beneficial Effects of Embodiments

One of the beneficial effects of the present invention is that the controller device U provided by the present invention can be disposed on the heat dissipation assembly 1 through the "shell assembly 7, and cover the first control module 2, the first conductive structure 4 and the second Conductive structure 5", "shell assembly 7 includes a shell structure 71 and a cover structure 72 disposed on the shell structure 71. The shell structure 71 includes a shell body 710, a shell body 710 and a corresponding A first hole 711A in the first conductive structure 4 , a second hole 712A disposed on the case body 710 and corresponding to the second conductive structure 5 , a first wire through hole 711B disposed on the case body 710 , and a second hole 711B disposed on the case body 710 . The second wire through hole 712B on the case body 710 and the wire group 8 include a first wire 81 passing through the first wire through hole 711B and electrically connected to the first conductive structure 4 and a second wire through hole 712B and electrically connected to the first conductive structure 4 . The technical solution of connecting the second wire 82 ″ of the second conductive structure 5 so that the electrical connection between the first wire 81 and the first conductive structure 4 and the electrical connection between the second wire 82 and the second conductive structure 5 It is enclosed in the housing assembly 7 to prevent liquid or moisture from the external environment from affecting its electrical connections.

Further, the controller device U provided by the present invention can further prevent liquid or water vapor from the external environment from infiltrating the controller through the arrangement of the first gasket E1, the second gasket E2 and/or the water blocking jacket 9 in device U.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the protection scope of the claims of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and the accompanying drawings of the present invention are included in the present invention. within the scope of protection of the claims of the invention.

Claims

A controller device, characterized in that the controller device comprises:

a heat dissipation component;

a first control module, the first control module is disposed on the heat dissipation assembly;

a first conductive structure, the first conductive structure is disposed on the first control module and is electrically connected to the first control module, wherein the first conductive structure includes a conductive structure disposed on the first control module a first positioning plate on the module and a first conductive column connected to the first positioning plate;

a second conductive structure, the second conductive structure is disposed on the first control module and is electrically connected to the first control module, wherein the second conductive structure includes a a second positioning plate on the module and a second conductive column connected to the second positioning plate;

a casing assembly, the casing assembly is disposed on the heat dissipation assembly and covers the first control module, the first conductive structure and the second conductive structure, wherein the casing assembly includes a A shell structure and a cover structure disposed on the shell structure, the shell structure comprising a shell body, a first hole disposed on the shell body and corresponding to the first conductive structure, a second hole disposed on the casing body and corresponding to the second conductive structure, a first wire through hole disposed on the casing body, and a second wire through hole disposed on the casing body; as well as

A wire set including a first wire passing through the first wire and electrically connected to the first conductive structure and a wire passing through the second wire and electrically connected to the second wire the second lead of the conductive structure.
The controller device according to claim 1, wherein the controller device further comprises: a first gasket disposed between the housing structure and the heat dissipation assembly.
The controller device according to claim 1, wherein the controller device further comprises: a second gasket disposed between the casing structure and the cover structure.
The controller device according to claim 1, wherein the controller device further comprises: a plurality of water blocking jackets, wherein one of the water blocking jackets among the plurality of the water blocking jackets is disposed on the The first wire through hole is located between the case body and the first wire, and one of the water blocking sleeves abuts against the case body and the first wire. A wire; wherein, the other one of the plurality of water blocking jackets is disposed in the second wire through hole and located between the shell body and the second wire, and a plurality of the water blocking jackets The other one of the water blocking jackets abuts against the casing body and the second wire.
The controller device according to claim 4, wherein each of the water blocking jackets comprises a body portion, a first abutting portion disposed at one end of the body portion, and a first abutting portion disposed at one end of the body portion. The second abutting part at the other end of the part and a plurality of water blocking parts arranged on the main body part and protrudingly arranged relative to the main body part.
The controller device according to claim 1, wherein the controller device further comprises: a first locking member and a second locking member, and the first conductive structure further comprises a A first locking hole on the first positioning plate, the second conductive structure further includes a second locking hole disposed on the second positioning plate, and the first control module includes a corresponding a first opening of the first locking hole and a second opening corresponding to the second locking hole; wherein the first locking member passes through the first opening and the first lock in sequence The fixing hole is fitted with the heat dissipation assembly to fix the first conductive structure and the first control module on the heat dissipation assembly, and the second locking member passes through the second opening and the heat dissipation assembly in sequence. The second locking hole is fitted with the heat dissipation assembly, so as to fix the second conductive structure and the first control module on the heat dissipation assembly.
The controller device according to claim 1, wherein the first control module further comprises a circuit board, a first conductive element disposed on the circuit board, a first conductive element disposed on the circuit board The second conductive element and a third conductive element arranged on the circuit board.
The controller device according to claim 1, wherein the heat dissipation component comprises a heat dissipation structure and an accommodating space disposed on the heat dissipation structure and recessed relative to the heat dissipation structure.
The controller device according to claim 8, wherein the first control module comprises a circuit board, a chip and a capacitor, the circuit board comprises a first surface facing away from the heat dissipation component and a a second surface facing the heat dissipation assembly, wherein the chip is arranged on the first surface, and the capacitor is arranged on the second surface; wherein the second surface of the circuit board A part abuts on the heat dissipation structure, and the capacitor disposed on the second surface is located in the accommodating space.
The controller device according to claim 9, wherein the circuit board comprises a first circuit board and a second circuit board, the first circuit board comprises a first substrate, the second circuit board It includes a second substrate, the chip is arranged on the first substrate, and the capacitor is arranged on the second substrate.
11. The controller device according to claim 10, wherein the first substrate and the second substrate have different materials, and the thermal conductivity of the first substrate is greater than the thermal conductivity of the second substrate.
The controller device according to claim 10, wherein the first substrate is electrically connected to the second substrate, the first substrate is disposed on the heat dissipation component, and the second substrate is disposed on on the first substrate, and the vertical projection of the first substrate relative to the heat dissipation component at least partially overlaps the vertical projection of the second substrate relative to the heat dissipation component.
The controller device according to claim 1, wherein the controller device further comprises: a second control module, wherein the second control module is disposed on the heat dissipation component, and the first control module A control module and the second control module are stacked along a direction away from the heat dissipation component.
The controller device of claim 13, wherein the second control module comprises a third circuit board, and the third circuit board comprises the first conductive pillars corresponding to the first conductive structures a first through hole and a second through hole corresponding to the second conductive column of the second conductive structure, the first conductive column passes through the first through hole, and the second conductive column A post passes through the second through hole.
The controller device according to claim 14, wherein the controller device further comprises: a current sensing module, the current sensing module is disposed on the second control module.