TWI689064B - Controller device - Google Patents

Abstract

The present invention provides a controller device including a heat dissipation module, a first control module, a second control module, a first conductive structure, and a conductive structure. The first control module is disposed on the heat dissipation module. The second control module is disposed on the heat dissipation module and the first control module is located between the second control module and the heat dissipation module. The first conductive structure is disposed on the first control module and electrically connected with the first control module. The second conductive structure is disposed on the first control module and electrically connected with the first control module.

Description

Controller device

The invention relates to a controller device, in particular to a controller device applicable to electric vehicles.

First of all, with the global issues of energy saving and carbon reduction, countries have increasingly higher requirements for the quality and performance of new energy vehicles. In order to meet the requirements of different regulations and different customer groups, the specifications of various parts and components are also increasing. The higher. Therefore, how to make highly integrated and modularized drivers to meet different specifications is becoming increasingly important.

Next, the driver of the electric vehicle in the prior art generally sets the control circuit, power crystal and capacitor of the driver on the same printed circuit board, and there is no concept of modular design. Therefore, the non-modular design makes it more difficult to cope with different customer specifications, and if the power requirement of the design structure increases, the number of power crystals and capacitors will increase, and eventually the printed circuit board area will become larger. In addition, the prior art power crystals and capacitors are stacked on the printed circuit board in the same direction, but this design will cause the overall structure of the driver to become thicker, and the capacitor is not easy to dissipate heat.

Therefore, how to improve the structural design to avoid increasing the heat dissipation efficiency of the controller device of the electric vehicle to overcome the above-mentioned defects has become one of the important issues to be solved by this business.

The technical problem to be solved by the present invention is to provide a controller device for the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a controller device including: a heat dissipation module, a first control module, a second control module, and a first conductive Structure and a second conductive structure. The first control module is disposed on the heat dissipation module, and the first control module abuts the heat dissipation module. The second control module is disposed on the heat dissipation module, and the first control module and the second control module are stacked in a direction away from the heat dissipation module. The first conductive structure is disposed on the first control module and is coupled to the first control module, wherein the first conductive structure includes a third disposed on the first control module A positioning plate and a first conductive post connected to the first positioning plate. The second conductive structure is disposed on the first control module and is coupled to the first control module, wherein the second conductive structure includes a third disposed on the first control module Two positioning plates and a second conductive post connected to the second positioning plate.

One of the beneficial effects of the present invention is that the controller device provided by the present invention can pass "the first control module is disposed on the heat dissipation module, and the second control module is disposed on the heat dissipation On the module, and the first control module and the second control module are stacked in a direction away from the heat dissipation module to increase the heat dissipation efficiency.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and explanation only, and are not intended to limit the present invention.

The following is a description of the implementation of the "controller device" disclosed by the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual sizes, and are declared in advance. The following embodiments will further describe the related technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" as used herein may include any combination of any one or more of the associated listed items, depending on the actual situation.

[Example]

First, referring to FIGS. 1 to 4, FIGS. 1 and 2 are respectively a three-dimensional schematic diagram of a controller device according to an embodiment of the present invention, and FIGS. 3 and 4 are respectively a three-dimensional exploded schematic diagram of the controller device according to an embodiment of the present invention. . An embodiment of the present invention provides a controller device U, which includes a heat dissipation module 1, a first control module 2, a second control module 3, a first conductive structure 4, and a second conductive structure 5. The first control module 2 may be disposed on the heat dissipation module 1, and the first control module 2 may abut the heat dissipation module 1. In addition, the second control module 3 may be disposed on the heat dissipation module 1, and the first control module 2 and the second control module 3 may be sequentially stacked along a direction (Y direction) away from the heat dissipation module 1 . In addition, for example, the second control module 3 may be elevated with a copper pillar C so that the first control module 2 is located between the heat dissipation module 1 and the second control module 3, but the present invention does not The manner in which the second control module 3 is disposed above the first control module 2 is limited.

According to the above, the first conductive structure 4 may be disposed on the first control module 2 and coupled to the first control module 2, and the second conductive structure 5 may be disposed on the first control module 2 and coupled to the first Control module 2. In addition, the first control module 2 may include a circuit board 21, a chip 22, a capacitor 23, a first conductive element 24, a second conductive element 25, and a third conductive element 26. The first conductive structure 4, the second conductive structure 5, the wafer 22, the capacitor 23, the first conductive element 24, the second conductive element 25 and the third conductive element 26 may be disposed on the circuit board 21 and coupled to the circuit board 21. In addition, for example, the controller device U provided by the embodiment of the present invention is preferably applicable to a driver of an electric vehicle, but the present invention is not limited thereto. In addition, the first conductive element 24, the second conductive element 25, and the third conductive element 26 of the controller device U can be connected to the motor, respectively, and the first conductive structure 4 and the second conductive structure 5 can be used as the positive electrode and the negative electrode of direct current, respectively However, the present invention is not limited to this. In addition, it should be noted that, although the above description uses the first control module 2 including the chip 22 and the capacitor 23 as an example, in other embodiments, the first control module 2 may also include other electronic components. In addition, it is worth noting that the coupling throughout the present invention may be a direct connection or an indirect connection, or a direct electrical connection or an indirect electrical connection, and the present invention is not limited thereto.

According to the above, for example, the controller device U may further include a current sensing module 6, the current sensing module 6 may be disposed on the second control module 3, and the current sensing module 6 may be used for sensing The current value flowing through the first conductive structure 4, the second conductive structure 5, the first conductive element 24, the second conductive element 25 and/or the third conductive element 26 is measured. However, it should be noted that the present invention does not limit the setting of the current sensing module 6 or not, and also does not limit the form and number of the current sensing module 6. In addition, for example, the controller device U may further include a housing structure 7 that may be disposed on the heat dissipation module 1 and cover the first control module 2, the second control module 3, and the third A conductive structure 4, a second conductive structure 5, and a current sensing module 6. Further, the housing structure 7 may include a housing body 71, a first hole 72 provided on the housing body 71 corresponding to the first conductive structure 4, and a second hole 72 provided on the housing body 71 5, a second hole 73, a third hole 74 provided on the case body 71 corresponding to the first conductive element 24, a fourth hole 75 provided on the case body 71 corresponding to the second conductive element 25, and a The fifth hole 76 disposed on the case body 71 and corresponding to the third conductive element 26. Furthermore, the first conductive structure 4, the second conductive structure 5, the first conductive element 24, the second conductive element 25 and the third conductive element 26 can pass through the first hole 72, the second hole 73, the third The hole 74, the fourth hole 75, and the fifth hole 76 are exposed outside the shell body 71 for insertion of other components.

Next, please refer to FIG. 3 and FIG. 4 again, and refer to FIGS. 5 to 8 together. FIG. 5 is a heat dissipation module, a first control module, and a first of a controller device according to an embodiment of the present invention. A schematic diagram of a three-dimensional combination of a conductive structure and a second conductive structure. FIGS. 6 to 8 are respectively a three-dimensional decomposition of a heat dissipation module, a first control module, a first conductive structure, and a second conductive structure of a controller device according to an embodiment of the present invention. Schematic diagram, the following will further illustrate the arrangement of the heat dissipation module 1, the first control module 2, the first conductive structure 4 and the second conductive structure 5. In detail, the first conductive structure 4 may include a first positioning plate 41 disposed on the first control module 2 and a first conductive post 42 connected to the first positioning plate 41, the length of the first positioning plate 41 The direction (X direction) and the length direction (Y direction) of the first conductive pillar 42 are perpendicular to each other. The second conductive structure 5 includes a second positioning plate 51 disposed on the first control module 2 and a second conductive post 52 connected to the second positioning plate 51. The length direction of the second positioning plate 51 (X direction) The longitudinal directions (Y direction) of the second conductive pillar 52 are perpendicular to each other. Thereby, the first conductive structure 4 and the second conductive structure 5 can form an inverted T-shaped structure.

According to the above, the first conductive pillar 42 may be disposed between the center of the first positioning plate 41 (not labeled in the figure) and a first end portion 411 of the first positioning plate 41, that is, the first conductive pillar The distance from 42 to the first end portion 411 of the first positioning plate 41 is different from the distance from the first conductive post 42 to a second end portion 412 of the first positioning plate 41. In addition, the second conductive post 52 may be disposed between the center of the second positioning plate 51 (not labeled in the figure) and a third end portion 511 of the second positioning plate 51, that is, the second conductive post 52 The distance from a third end portion 511 of the second positioning plate 51 is different from the distance from the second conductive post 52 to the fourth end portion 512 of the second positioning plate 51. In addition, it is worth noting that the position of the center of the first positioning plate 41 refers to the intermediate position between the first end portion 411 and the second end portion 633 of the first positioning plate 41, and the center of the second positioning plate 51 The position of refers to the intermediate position between the third end portion 511 and the fourth end portion 512 of the second positioning plate 51. In addition, for example, the length of the first positioning plate 41 may be greater than the length of the first conductive pillar 42, and the length of the second positioning plate 51 may be greater than the length of the second conductive pillar 52, but the invention is not limited thereto.

According to the above, for example, the shapes of the first positioning plate 41 and the second positioning plate 51 may be elongated, the length of the first positioning plate 41 may be greater than that of the first conductive post 42, and the length of the second positioning plate 51 may be It is larger than the second conductive pillar 52, but the invention is not limited thereto. Further, when the first conductive structure 4 and the second conductive structure 5 are disposed on the first control module 2, the first positioning plate 41 and the second positioning plate 51 may be parallel to each other and arranged side by side, and the first The conductive pillar 42 and the second conductive pillar 52 may be arranged in a staggered manner. Thus, since the first conductive pillar 42 is asymmetrically disposed relative to the first positioning plate 41, and the second conductive pillar 52 is asymmetrically disposed relative to the second positioning plate 51, The invention can utilize the positions of the first conductive structure 4 and the second conductive structure 5 provided on the first control module 2 so that when the first conductive structure 4 and the second conductive structure 5 are manufactured, the first conductive structure 4 and the second conductive structure 5 The shape and structure of the two conductive structures 5 may be completely the same.

Next, please refer to FIG. 5 to FIG. 8 again. Preferably, in terms of the present invention, the controller U may further include a first lock S1 and a second lock S2, that is, a first conductive structure 4 and the second conductive structure 5 can be respectively disposed on the first control module 2 and the heat dissipation module 1 by using the first locking member S1 and a second locking member S2 and are electrically connected to the first control module 2. Further, the first conductive structure 4 may further include a first locking hole 43 disposed on the first positioning plate 41, and the second conductive structure 5 may further include a first positioning hole 51 disposed on the second positioning plate 51. Two locking holes 53. The first control module 2 may include a first opening 212A corresponding to the first locking hole 43 and a second opening 212B corresponding to the second locking hole 53. The first locking member S1 can be sequentially fitted into the heat dissipation module 1 through the first opening 212A and the first locking hole 43 to fix the first conductive structure 4 and the first control module 2 on the heat dissipation module 1 . The second locking member S2 can be sequentially fitted into the heat dissipation module 1 through the second opening 212B and the second locking hole 53 to fix the second conductive structure 5 and the first control module 2 on the heat dissipation module 1 . In addition, it should be noted that in a preferred embodiment, the controller device U may include a plurality of first lock firmware S1 and a second lock firmware S2, so that the plurality of first lock firmware S1 and the second lock firmware S2 Locked on the plurality of first locking holes 43, the plurality of second locking holes 53, the plurality of first openings 212A, and the plurality of second openings 212B, respectively, and the first conductive structure 4 and the second conductive The structure 5 and the first control module 2 are fixed on the heat dissipation module 1. In addition, it is worth noting that the controller device U may further include one or more insulating pads R. The insulating pads R may correspond to the first locking member S1 and/or the second locking member S2, respectively. A lock S1 is between the first conductive structure 4 and the insulating pad R is disposed between the second lock S2 and the second conductive structure 5, but the invention is not limited to this.

In light of the above, in terms of the present invention, the heat dissipation module 1 may include a heat dissipation structure 11, and the circuit board 21 may be disposed on a bearing surface 110 of the heat dissipation structure 11 and abut the bearing surface 110 of the heat dissipation structure 11. In addition, the circuit board 21 may include a first surface 2101 facing away from the heat dissipation module 1 and a second surface 2102 facing the heat dissipation module 1, the chip 22 may be disposed on the first surface 2101, and the capacitor 23 may be disposed on the second On the surface 2102. In other words, the height direction (positive Y direction) of the wafer 22 provided on the circuit board 21 and the height direction (negative Y direction) of the capacitor 23 provided on the circuit board 21 are opposite to each other. That is, the height direction of the chip 22 (positive Y direction) is a direction away from the heat dissipation module 1, and the height direction of the capacitor 23 (negative Y direction) is a direction closer to the heat dissipation module 1. Further, since the height direction (negative Y direction) of the capacitor 23 is toward the direction close to the heat dissipation module 1, the heat dissipation module 1 preferably further includes a recess on the heat dissipation structure 11 that is recessed relative to the heat dissipation structure 11容的容空间12。 Set the accommodating space 12. Therefore, a part of the second surface 2102 of the circuit board 21 may abut against the heat dissipation structure 11, and the capacitor 23 disposed on the second surface 2102 may be located in the accommodating space 12. In this way, the capacitor 23 can be placed upside down relative to the wafer 22 to reduce the volume of the controller U. In addition, it is worth noting that part of the second surface 2102 of the circuit board 21 may directly abut the heat dissipation structure 11, or one-to-one thermally conductive adhesive material may be disposed on the second surface 2102 of the circuit board 21 and the heat dissipation structure 11 Therefore, a part of the second surface 2102 of the circuit board 21 can indirectly abut the heat dissipation structure 11.

Based on the above, further, the controller device U may further include a thermally conductive material T, the thermally conductive material T may be disposed in the accommodating space 12, and the capacitor 23 disposed on the circuit board 21 may be disposed in the accommodating space 12 And embedded in the thermally conductive material T. In this way, the heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 by the heat conductive material T, thereby increasing the heat dissipation efficiency of the capacitor 23. In addition, by embedding the capacitor 23 in the heat conductive material T, the effect of shock absorption can also be achieved. For example, the thermally conductive material T may be a thermally conductive colloid, but the invention is not limited thereto.

Next, please refer to FIG. 5 to FIG. 8 again. Preferably, in terms of the present invention, the circuit board 21 may be composed of a first circuit board 21A and a second circuit board 21B, that is, the first control module 2 It may include a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23. The first circuit board 21A may include a first substrate 211A, the second circuit board 21B includes a second substrate 211B, the first substrate 211A may be coupled to the second substrate 211B, and the first conductive structure 4 and the second conductive structure 5 It can be coupled to the first substrate 211A and the second substrate 211B. For example, according to the present invention, one or more conductive pads P may be disposed on the first substrate 211A and the second substrate 211B, respectively, so as to couple the first substrate 211A and the second substrate 211B with the conductive pads P. Further, the first substrate 211A may be disposed on the heat dissipation module 1, the second substrate 211B may be disposed on the first substrate 211A, and the vertical projection of the first substrate 211A relative to the heat dissipation module 1 is opposite to the second substrate The vertical projections of the heat dissipation module 1 overlap at least partially. In other words, the first substrate 211A and the second substrate 211B are at least partially overlapped. In addition, the conductive pads P of the first substrate 211A and the second substrate 211B may be disposed at the position where the first substrate 211A and the second substrate 211B overlap, so that the first substrate 211A and the second substrate 211B are arranged by overlapping And coupled to each other.

Based on the above, further, the first substrate 211A of the first circuit board 21A may include a first surface 2101A facing away from the heat dissipation module 1 and a second surface 2102A facing the heat dissipation module 1, and the second circuit board 21B The second substrate 211B may include a first surface 2101B facing away from the heat dissipation module 1 and a second surface 2102B facing the accommodating space 12 of the heat dissipation module 1. The wafer 22 may be disposed on the first surface 2101A of the first substrate 211A, and the capacitor 23 may be disposed on the second surface 2102B of the second substrate 211B. Accordingly, the height direction (positive Y direction) of the chip 22 is away from the heat dissipation module 1, and the height direction (negative Y direction) of the capacitor 23 is toward the heat dissipation module 1.

Based on the above, and further, the second surface 2102A of the first substrate 211A may be disposed on a bearing surface 110 of the heat dissipation structure 11 and abut the bearing surface 110 of the heat dissipation structure 11, thereby, the heat generated by the chip 22 It can be directly transferred to the heat dissipation structure 11 through the first substrate 211A, thereby increasing the heat dissipation efficiency of the wafer 22. In addition, the conductive pad P provided on the first substrate 211A may be provided on the first surface 2101A of the first substrate 211A.

Based on the above, furthermore, the conductive pad P disposed on the second substrate 211B may be disposed on the second surface 2102B of the second substrate 211B, and the second surface 2102B of the second substrate 211B may abut the first substrate The first surface 2101A of 211A is such that the conductive pad P provided on the first surface 2101A of the first substrate 211A and the conductive pad P provided on the second substrate 211B abut against each other and are coupled to each other.

Based on the above, furthermore, the conductive pad P may be further disposed on the first surface 2101B of the second substrate 211B, so that the first conductive structure 4 and the second conductive structure 5 abut against the second substrate 211B The conductive pad P on the first surface 2101B is coupled to the conductive pad P provided on the first surface 2101B of the second substrate 211B. Thereby, the first conductive structure 4 and the second conductive structure 5 can be coupled to the first circuit board 21A and the second circuit board 21B.

Based on the above, and further, the first conductive element 24, the second conductive element 25, and the third conductive element 26 may be disposed on the first surface 2101A of the first substrate 211A and coupled to the first substrate 211A. In addition, the first conductive element 24, the second conductive element 25, and the third conductive element 26 may also be respectively disposed on the first substrate 211A and the heat dissipation module 1 by the fastener S and electrically connected to the first substrate 211A.

According to the above, preferably, in terms of the present invention, the materials of the first substrate 211A and the second substrate 211B may be different from each other, and more preferably, the thermal conductivity of the first substrate 211A may be greater than the thermal conductivity of the second substrate 211B. For example, the first substrate 211A may be an aluminum substrate, the second substrate 211B may be an FR4 substrate, and the wafer 22 may be a power crystal (such as, but not limited to, MOS field effect power transistor). Control the electrical signals transmitted to the motor through the first conductive element 24, the second conductive element 25, and the third conductive element 26. The capacitor 23 can be used to stabilize the power supply and provide instantaneous current, but the invention is not limited to this . Thereby, the heat energy generated by the power crystal is transmitted to the heat dissipation structure 11 through the first substrate 211A (aluminum substrate), thereby greatly improving the heat dissipation efficiency of the chip 22. The heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 through the conduction of the heat conductive material T. In addition, for example, the heat dissipation structure 11 may also be a metal with good thermal conductivity, such as but not limited to aluminum.

Next, please refer to FIG. 5 and refer to FIGS. 9 and 10 together. FIG. 9 is a heat dissipation module, a first control module, and a second control module of a controller device according to an embodiment of the present invention. , A three-dimensional exploded schematic view of the first conductive structure, the second conductive structure, and the current sensing module. FIG. 10 is a heat dissipation module, first control module, second control module, and A three-dimensional schematic diagram of a conductive structure, a second conductive structure and a current sensing module. The second control module 3 may be disposed on the heat dissipation module 1, and the second control module 3 may be elevated with a copper pillar C so that the first control module 2 is located in the heat dissipation module 1 and the second control module Between Group 3. In addition, for example, the second control module 3 may include a third circuit board 31 and an electronic component 32 disposed on the third circuit board 31. In addition, the electronic component 32 may be a chip, a capacitor, a microprocessor or The signal port is not limited to this invention.

9 and 10, the third circuit board 31 may further include a first through hole 311 corresponding to the first conductive pillar 42 of the first conductive structure 4 and corresponding to the second conductive A second through hole 312 of the second conductive pillar 52 of the structure 5, a third through hole 313 corresponding to the first conductive element 24, a fourth through hole 314 corresponding to the second conductive element 25 and corresponding to the third A fifth through hole 315 of the conductive element 26. The first conductive pillar 42 may pass through the first through hole 311, and the second conductive pillar 52 may pass through the second through hole 312. In addition, the first conductive element 24 can pass through the third through hole 313, the second conductive element 25 can pass through the fourth through hole 314, and the third conductive element 26 can pass through the fifth through hole 315. Thereby, the first conductive pillar 42 of the first conductive structure 4, the second conductive pillar 52 of the second conductive structure 5, the first conductive element 24, the second conductive element 25 and the third conductive element 26 can be relative to the third circuit The plate 31 is provided in a convex shape.

According to the above, the current sensing module 6 may be disposed on the third circuit board 31 of the second control module 3 and coupled to the third circuit board 31. In addition, the current sensing module 6 may correspond to at least one of the first conductive element 24, the second conductive element 25, and the third conductive element 26, and the first conductive element 24, the second conductive element 25, and the third At least one of the three conductive elements 26 can pass through the current sensing module 6 to detect the current value through the current sensing module 6. Preferably, a plurality of current sensing modules 6 can be provided to detect the current values passing through the first conductive element 24, the second conductive element 25, and the third conductive element 26, respectively. Further, the current sensing module 6 may also correspond to at least one of the first conductive pillar 42 and the second conductive pillar 52. Preferably, a plurality of current sensing modules 6 may be provided to detect separately The current value passing through the first conductive pillar 42 and the second conductive pillar 52. Further, the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 may respectively pass through the current sensing module 6, and the first conductive The element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 are arranged in a convex shape relative to the current sensing module 6.

Next, please refer to FIGS. 11 and 12, which are respectively a three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the invention. The current sensing module 6 may include a carrier 61, a current sensing element 62 disposed on the carrier 61 and coupled to the carrier 61, and a current sensing element 62 disposed on the carrier 61 and corresponding to the current sensing element 62 Current sensing ring 63. For example, the current sensing module 6 may be a Hall current sensor (Hall Current Sensor), the carrier board 61 may be a printed circuit board (Printed circuit board (PCB), and the current sensing ring 63 may be a C-shaped magnetic ring, but the invention is not limited to this. Further, the current sensing ring 63 may include an annular body portion 631, a first end portion connected to the annular body portion 631, and a second end portion 633 connected to the annular body portion 631, the first end portion 632 and the second There may be an air gap 634 between the two end portions 633, and the annular body portion 631 can surround a sensing space 635. In addition, it is worth noting that the current sensing ring 63 may be formed using powder metallurgy or a silicon steel sheet wound around, and the invention is not limited thereto.

According to the above, the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 may be located in the sensing space 635 of the current sensing module 6, To detect its current value. In addition, the current sensing module 6 can also be disposed on the third circuit board 31 of the second control module 3 using the copper pillar C.

Next, please refer to FIGS. 13 and 14, which are respectively a three-dimensional exploded schematic view of the heat dissipation module of the controller device according to the embodiment of the present invention. According to the present invention, the heat dissipation module 1 may further include a liquid flow channel 13 provided in the heat dissipation structure 11, a first orifice 14 provided on the heat dissipation structure 11 and connected to the liquid flow channel 13, and a The heat dissipation structure 11 is connected to the second orifice 15 of the liquid channel 13. In other words, the heat dissipation module 1 provided by the present invention may be a water-cooled heat dissipation module 1 to increase the overall heat dissipation efficiency of the controller device U. Preferably, the vertical projection of the liquid flow channel 13 relative to the bearing surface 110 of the heat dissipation structure 11 can form a first projection area, and the vertical projection of the circuit board 21 relative to the bearing surface 110 of the heat dissipation structure 11 can form a second projection area. The first projection area and the second projection area at least partially overlap. Further, the second projection area is preferably a vertical projection of the first substrate 211A of the circuit board 21 relative to the bearing surface 110 of the heat dissipation structure 11, and the first projection area and the second projection area at least partially overlap. In other words, the liquid flow path 13 is preferably provided below the first substrate 211A to improve the heat dissipation efficiency of the first circuit board 21A. In addition, the heat dissipation structure 11 may include a heat dissipation body 111 and a cover 112 connected to the heat dissipation body 111, and the liquid flow path 13 is disposed between the heat dissipation body 111 and the cover 112. In other words, the heat dissipation structure 11 may be composed of the heat dissipation body 111 and the cover 112, and the cover 112 may be used to close the liquid flow path 13.

Next, please refer to FIG. 15, which is a three-dimensional schematic diagram of another embodiment of the heat dissipation module of the controller device according to the embodiment of the present invention. As can be seen from the comparison between FIG. 15 and FIG. 2, in the embodiment of FIG. 15, the liquid flow channel 13 may not be provided, and the heat dissipation structure 11 includes a plurality of heat dissipation fins disposed on the heat dissipation body 111. In other words, the heat dissipation module 1 shown in FIG. 15 may be an air-cooled heat dissipation module 1.

[Beneficial effect of embodiment]

One of the beneficial effects of the present invention is that the controller device U provided by the present invention can be set on the heat dissipation module 1 through the "first control module 2 and the second control module 3 on the heat dissipation module 1 And the first control module 2 and the second control module 3 are stacked in a direction away from the heat dissipation module 1 to increase the heat dissipation efficiency.

Furthermore, the controller device U provided by the present invention can be fitted into the heat dissipation module 1 through the first opening 212A and the first locking hole 43 in order through A conductive structure 4 and the first control module 2 are fixed on the heat dissipation module 1, and the second locking member S2 is sequentially fitted into the heat dissipation module 1 through the second opening 212B and the second locking hole 53 to connect the first The two conductive structures 5 and the first control module 2 are fixed on the heat dissipation module 1” to improve the assembly efficiency in the manufacturing process.

Furthermore, the controller device U provided by the present invention can pass “the chip 22 is provided on the first surface 2101 of the circuit board 21, and the capacitor 23 is provided on the second surface 2102 of the circuit board 21” and the “capacitance The technical solution that 23 is located in the accommodating space 12”, so that the capacitor 23 is inverted compared to the wafer, and the overall height of the controller device U can be reduced.

Furthermore, the controller device U provided by the present invention can pass the “first control module 2 including a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23, the first The circuit board 21A includes a first substrate 211A, the second circuit board 21B includes a second substrate 211B, the chip 22 is disposed on the first substrate 211A, and the capacitor 23 is disposed on the second substrate 211B. The material of the second substrate 211B is different, and the thermal conductivity of the first substrate 211A is greater than the thermal conductivity of the second substrate 211B", so that the hotter chip 22 is disposed on the first substrate 211A with better thermal conductivity , And the heat dissipation efficiency of the controller device U can be increased.

Furthermore, the heat dissipation module 1, the first control module 2, the second control module 3, the current sensing module 6, the first conductive structure 4 and/or the first conductive structure 4 of the present invention are modules The design can be directly replaced in response to different specifications.

The content disclosed above is only a preferred and feasible embodiment of the present invention, and therefore does not limit the scope of the patent application of the present invention, so any equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. Within the scope of the patent.

U: controller device 1: Cooling module 11: Heat dissipation structure 110: bearing surface 111: cooling body 112: Cover 12: accommodating space 13: Liquid flow path 14: First orifice 15: Second orifice 2: The first control module 21: Circuit board 2101: first surface 2102: Second surface 21A: First circuit board 2101A: First surface 2102A: Second surface 211A: the first substrate 212A: The first opening 21B: Second circuit board 2101B: First surface 2102B: Second surface 211B: Second substrate 212B: Second opening 22: Wafer 23: capacitance 24: The first conductive element 25: second conductive element 26: Third conductive element 3: Second control module 31: Third circuit board 311: first through hole 312: Second through hole 313: Third through hole 314: Fourth through hole 315: Fifth through hole 32: Electronic components 4: The first conductive structure 41: First positioning plate 411: the first end 412: Second end 42: The first conductive column 43: The first locking hole 5: Second conductive structure 51: Second positioning plate 511: third end 512: fourth end 52: Second conductive column 53: Second locking hole 6: Current sensing module 61: Carrier board 62: Current sensing element 63: Current sensing loop 631: Ring body 632: First end 633: Second end 634: Air gap 635: Sensing space 7: Shell structure 71: Shell body 72: The first hole 73: Second hole 74: third hole 75: fourth hole 76: Fifth hole S1: The first lock firmware S2: Second lock firmware S: Lock firmware P: conductive pad R: Insulation pad C: copper pillar T: thermally conductive material X, Y, Z: direction

FIG. 1 is a schematic perspective view of a controller device according to an embodiment of the invention.

FIG. 2 is another schematic perspective view of a controller device according to an embodiment of the invention.

FIG. 3 is a schematic exploded view of a controller device according to an embodiment of the invention.

FIG. 4 is another schematic exploded view of the controller device according to the embodiment of the invention.

FIG. 5 is a three-dimensional schematic diagram of a heat dissipation module, a first control module, a first conductive structure, and a second conductive structure of a controller device according to an embodiment of the present invention.

6 is a three-dimensional exploded schematic diagram of a heat dissipation module, a first control module, a first conductive structure, and a second conductive structure of a controller device according to an embodiment of the present invention.

7 is another three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to an embodiment of the present invention.

FIG. 8 is still another three-dimensional exploded schematic diagram of a heat dissipation module, a first control module, a first conductive structure, and a second conductive structure of a controller device according to an embodiment of the present invention.

9 is a three-dimensional exploded schematic diagram of a heat dissipation module, a first control module, a second control module, a first conductive structure, a second conductive structure, and a current sensing module of a controller device according to an embodiment of the present invention.

10 is a three-dimensional schematic diagram of a heat dissipation module, a first control module, a second control module, a first conductive structure, a second conductive structure, and a current sensing module of a controller device according to an embodiment of the present invention.

FIG. 11 is a three-dimensional exploded schematic diagram of a current sensing module of a controller device according to an embodiment of the invention.

12 is another schematic exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the invention.

FIG. 13 is a perspective exploded view of a heat dissipation module of a controller device according to an embodiment of the invention.

14 is another schematic exploded schematic view of the heat dissipation module of the controller device according to the embodiment of the invention.

15 is a three-dimensional schematic diagram of another embodiment of the heat dissipation module of the controller device according to the embodiment of the invention.

U: controller device

1: Cooling module

11: Heat dissipation structure

110: bearing surface

12: accommodating space

2: The first control module

21: Circuit board

2101: first surface

2102: Second surface

21A: First circuit board

2101A: First surface

2102A: Second surface

21B: Second circuit board

2101B: First surface

2102B: Second surface

22: Wafer

23: capacitance

24: The first conductive element

25: second conductive element

26: Third conductive element

3: Second control module

31: Third circuit board

32: Electronic components

4: The first conductive structure

5: Second conductive structure

6: Current sensing module

7: Shell structure

71: Shell body

72: The first hole

73: Second hole

74: third hole

75: fourth hole

76: Fifth hole

T: thermally conductive material

C: copper pillar

X, Y, Z: direction

Claims (13)

A controller device includes: a heat dissipation module; a first control module, the first control module is disposed on the heat dissipation module; a second control module, the second control module Disposed on the heat dissipation module, and the first control module and the second control module are stacked in a direction away from the heat dissipation module; a first conductive structure, the first conductive The structure is disposed on the first control module and coupled to the first control module, wherein the first conductive structure includes a first positioning plate and a first positioning module disposed on the first control module A first conductive post connected to the first positioning plate; and a second conductive structure, the second conductive structure is disposed on the first control module and coupled to the first control module, wherein The second conductive structure includes a second positioning plate disposed on the first control module and a second conductive post connected to the second positioning plate. The controller device according to item 1 of the patent application scope further includes: a first locking member and a second locking member, and the first conductive structure further includes a first positioning board The first locking hole, the second conductive structure further includes a second locking hole provided on the second positioning plate, and the first control module includes a corresponding to the first locking hole A first opening and a second opening corresponding to the second locking hole; wherein the first locking member passes through the first opening and the first locking hole and the The heat dissipation module is fitted to fix the first conductive structure and the first control module on the heat dissipation module, and the second locking member sequentially passes through the second opening and the first Two locking holes are fitted with the heat dissipation module to fix the second conductive structure and the first control module on the heat dissipation module. The controller device according to item 1 of the patent application range, wherein the first positioning plate includes a first end portion and a second end portion corresponding to the first end portion, the second positioning plate It includes a third end portion and a fourth end portion corresponding to the third end portion; wherein, the distance from the first conductive pillar to the first end portion and the first conductive pillar to the first The distance between the two end portions is different, and the distance from the second conductive post to the third end portion is different from the distance from the second conductive post to the fourth end portion. The controller device according to item 1 of the patent application scope, wherein the first control module includes a circuit board, a chip, and a capacitor, and the circuit board includes a first facing away from the heat dissipation module A surface and a second surface facing the heat dissipation module, the chip is disposed on the first surface, and the capacitor is disposed on the second surface. The controller device according to item 4 of the patent application scope, wherein the heat dissipation module includes a heat dissipation structure and an accommodating space located on the heat dissipation structure and recessed relative to the heat dissipation structure. A part of the second surface of the circuit board abuts on the heat dissipation structure, and the capacitor provided on the second surface is located in the accommodating space. The controller device according to item 5 of the patent application scope, wherein the heat dissipation module further includes a liquid flow path provided in the heat dissipation structure, and a liquid flow path provided in the heat dissipation structure and connected to the The first orifice of the liquid flow path and a second orifice provided on the heat dissipation structure and connected to the liquid flow path, wherein the vertical projection of the liquid flow path relative to the heat dissipation structure can form a In the first projection area, the vertical projection of the circuit board relative to the heat dissipation structure can form a second projection area, and the first projection area and the second projection area at least partially overlap. The controller device according to item 4 of the patent application scope, wherein the first control module further includes a first conductive element provided on the circuit board, and a first provided on the circuit board Two conductive elements and a third conductive element arranged on the circuit board. The controller device according to item 1 of the patent application scope, wherein the first control module includes a first circuit board, a second circuit board, a chip, and a capacitor, and the first circuit board includes a A first substrate, the second circuit board includes a second substrate, the chip is disposed on the first substrate, and the capacitor is disposed on the second substrate. The controller device according to item 8 of the patent application range, wherein the materials of the first substrate and the second substrate are different, and the thermal conductivity of the first substrate is greater than that of the second substrate . The controller device according to item 8 of the patent application scope, wherein the first substrate is coupled to the second substrate, the first substrate is disposed on the heat dissipation module, and the second substrate is disposed On the first substrate, the vertical projection of the first substrate relative to the heat dissipation module and the vertical projection of the second substrate relative to the heat dissipation module at least partially overlap. The controller device according to item 1 of the patent application scope, wherein the second control module includes a third circuit board, and the third circuit board includes the first corresponding to the first conductive structure A first through hole of the conductive pillar and a second through hole corresponding to the second conductive pillar of the second conductive structure, the first conductive pillar passes through the first through hole, and the first Two conductive pillars pass through the second through hole. The controller device according to item 11 of the patent application scope further includes: a current sensing module, the current sensing module is provided on the second control module; wherein, the first control The module further includes a first conductive element provided on the circuit board, a second conductive element provided on the circuit board, and a third conductive element provided on the circuit board; wherein, The third circuit board of the second control module further includes a third through hole corresponding to the first conductive element, a fourth through hole corresponding to the second conductive element, and corresponding to the A fifth through hole of the third conductive element; wherein the current sensing module corresponds to at least one of the first conductive element, the second conductive element, and the third conductive element. The controller device as described in item 1 of the scope of the patent application further includes: a housing structure, the housing structure is disposed on the heat dissipation module.

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