WO2020211034A1

WO2020211034A1 - Controller device

Info

Publication number: WO2020211034A1
Application number: PCT/CN2019/083174
Authority: WO
Inventors: 林继谦; 萧家祥; 李国荣; 阎柏均
Original assignee: 威刚科技股份有限公司
Priority date: 2019-04-18
Filing date: 2019-04-18
Publication date: 2020-10-22

Abstract

A controller device (U), comprising a heat dissipation module (1) and a first control module (2). The heat dissipation module (1) comprises a heat dissipation structure (11) and an accommodation space (12) provided on the heat dissipation structure (11) and recessed relative to the heat dissipation structure (11). The first control module (2) is disposed on the heat dissipation module (1), and comprises a circuit board (21), a chip (22), and a capacitor (23). The circuit board (21) comprises a first surface (2101) facing away from the heat dissipation module (1) and a second surface (2102) facing the heat dissipation module (1). The chip (22) is disposed on the first surface, and the capacitor (23) is disposed on the second surface. A portion of the second surface of the circuit board (21) contacts the heat dissipation structure (11), and the capacitor (23) disposed on the second surface is located in the accommodation space (12). The invention thus improves the efficiency of heat dissipation while reducing the overall height of the controller device (U).

Description

Controller device

Technical field

The present invention relates to a controller device, in particular to a controller device that can be applied to electric vehicles.

Background technique

First of all, with the global issue of energy saving and carbon reduction, countries have higher and higher requirements for the quality and performance of new energy vehicles. In order to meet the needs of different regulations and different customer groups, the specifications of various parts are also increasing. Come higher. Therefore, how to make highly integrated and modular drives to adapt to different specifications becomes increasingly important.

Next, the driver of the prior art electric vehicle generally has the driver's control circuit, power transistor and capacitor arranged on the same printed circuit board, and there is no concept of modular design. Therefore, a non-modularized design will make it more difficult to cope with different customer specifications, and if the power demand of the design architecture increases, the number of power transistors and capacitors will increase, and finally the printed circuit board area will increase. In addition, the power transistors and capacitors in the prior art are laminated on the printed circuit board facing the same direction, but this design will cause the overall structure of the driver to become thicker and the capacitors will not easily dissipate heat.

Therefore, how to avoid increasing the heat dissipation efficiency of the controller device of an electric vehicle by improving the structural design to overcome the above-mentioned shortcomings has become one of the important issues to be solved by this business.

Summary of the invention

The technical problem to be solved by the present invention is to provide a controller device for the shortcomings of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a controller device, which includes: a heat dissipation module and a first control module. The heat dissipation module includes a heat dissipation structure and an accommodation space located on the heat dissipation structure and recessed relative to the heat dissipation structure. The first control module is arranged on the heat dissipation module, the first control module includes a circuit board, a chip, and a capacitor, and the circuit board includes a first surface facing away from the heat dissipation module and a surface facing The second surface of the heat dissipation module, wherein the chip is arranged on the first surface, and the capacitor is arranged on the second surface. Wherein, a part of the second surface of the circuit board abuts on the heat dissipation structure, and the capacitor provided on the second surface is located in the accommodating space.

Furthermore, the heat dissipation module further includes a liquid flow channel arranged in the heat dissipation structure, a first orifice arranged on the heat dissipation structure and connected to the liquid flow channel, and a liquid flow channel arranged in the heat dissipation structure. On the heat dissipation structure and connected to the second orifice of the liquid flow channel, wherein the vertical projection of the liquid flow channel with respect to the heat dissipation structure can form a first projection area, and the circuit board is opposite to the The vertical projection of the heat dissipation structure can form a second projection area, and the first projection area and the second projection area at least partially overlap.

Furthermore, the heat dissipation structure includes a heat dissipation body and a cover body connected to the heat dissipation body, and the liquid flow channel is arranged between the heat dissipation body and the cover body; wherein, the accommodating body The space faces a first predetermined direction relative to an opening of the heat dissipating body, the liquid flow channel faces a second predetermined direction relative to an opening of the heat dissipating body, and the first predetermined direction is opposite to the second predetermined direction. The directions are different from each other.

Furthermore, the circuit board includes a first circuit board and a second circuit board, the first circuit board includes a first substrate, the second circuit board includes a second substrate, and the chip is disposed on On the first substrate, the capacitor is arranged on the second substrate.

Furthermore, the materials of the first substrate and the second substrate are different, and the thermal conductivity of the first substrate is greater than the thermal conductivity of the second substrate.

Furthermore, the first substrate is coupled to the second substrate, the first substrate is disposed on the heat dissipation module, the second substrate is disposed on the first substrate, and the first substrate is The vertical projection of the substrate relative to the heat dissipation module and the vertical projection of the second substrate relative to the heat dissipation module at least partially overlap.

Furthermore, the controller device further includes: a first conductive structure and a second conductive structure, the first conductive structure being disposed on the first control module and coupled to the first control module , The second conductive structure is disposed on the first control module and coupled to the first control module; wherein, the first conductive structure includes a first positioner disposed on the first control module Plate and a first conductive post connected to the first positioning plate, the second conductive structure includes a second positioning plate arranged on the first control module and a second positioning plate connected to the second positioning plate The second conductive pillar.

Furthermore, the controller device further includes: a first locking member and a second locking member, and the first conductive structure further includes a first locking hole provided on the first positioning plate , The second conductive structure further includes a second locking hole provided on the second positioning plate, the first control module includes a first opening corresponding to the first locking hole, and A second opening corresponding to the second locking hole; wherein, the first locking member passes through the first opening and the first locking hole in sequence to fit into the heat dissipation module to The first conductive structure and the first control module are fixed on the heat dissipation module, and the second locking member sequentially passes through the second opening and the second locking hole and the heat dissipation module Mating to fix the second conductive structure and the first control module on the heat dissipation module.

Further, the first positioning plate includes a first end portion and a second end portion corresponding to the first end portion, and the second positioning plate includes a third end portion and a second end portion corresponding to the The fourth end portion of the third end portion; wherein the distance from the first conductive post to the first end portion is different from the distance from the first conductive post to the second end portion, and the first The distance from the two conductive pillars to the third end portion is different from the distance from the second conductive pillar to the fourth end portion.

Furthermore, the first control module further includes a first conductive element arranged on the circuit board, a second conductive element arranged on the circuit board, and a second conductive element arranged on the circuit board. The third conductive element.

Further, the controller device further includes: a second control module, the second control module is arranged on the heat dissipation module, and the first control module and the second control module are far away The heat dissipation modules are stacked in one direction.

Furthermore, the second control module includes a third circuit board, and the third circuit board includes a first through hole corresponding to the first conductive column of the first conductive structure and corresponding to the A second through hole of the second conductive pillar of the second conductive structure, the first conductive pillar passes through the first through hole, and the second conductive pillar passes through the second through hole.

Furthermore, the controller device further includes: a current sensing module, the current sensing module is arranged on the second control module; wherein, the third circuit board of the second control module It further includes a third through hole corresponding to the first conductive element, a fourth through hole corresponding to the second conductive element, and a fifth through hole corresponding to the third conductive element; wherein, The current sensing module corresponds to at least one of the first conductive element, the second conductive element, and the third conductive element.

Furthermore, the controller device further includes: a housing structure, and the housing structure is disposed on the heat dissipation module.

One of the beneficial effects of the present invention is that the controller device provided by the present invention can pass "the circuit board includes a first surface facing away from the heat dissipation module and a second surface facing the heat dissipation module, Wherein, the chip is arranged on the first surface, the capacitor is arranged on the second surface" and "a part of the second surface of the circuit board abuts against the heat dissipation structure, And the technical solution of "the capacitor arranged on the second surface is located in the accommodating space" is to increase the heat dissipation efficiency while reducing the overall height of the controller device.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description, and are not used to limit the present invention.

Description of the drawings

FIG. 1 is a schematic diagram of a three-dimensional assembly of a controller device according to an embodiment of the present invention.

FIG. 2 is another three-dimensional assembly diagram of the controller device according to the embodiment of the present invention.

FIG. 3 is a three-dimensional exploded schematic diagram of the controller device according to the embodiment of the present invention.

4 is another three-dimensional exploded schematic diagram of the controller device according to the embodiment of the present invention.

5 is a three-dimensional assembly diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to an embodiment of the present invention.

6 is an exploded perspective view of one of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.

FIG. 7 is another three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.

8 is another three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.

FIG. 9 is an exploded perspective view of one of the heat dissipation modules of the controller device according to the embodiment of the present invention.

10 is another three-dimensional exploded schematic diagram of the heat dissipation module of the controller device according to the embodiment of the present invention.

FIG. 11 is a three-dimensional schematic diagram of another embodiment of the heat dissipation module of the controller device according to the embodiment of the present invention.

12 is a three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the second control module, the first conductive structure, the second conductive structure, and the current sensing module of the controller device according to an embodiment of the present invention.

FIG. 13 is a three-dimensional assembly diagram of the heat dissipation module, the first control module, the second control module, the first conductive structure, the second conductive structure, and the current sensing module of the controller device according to an embodiment of the present invention.

FIG. 14 is a three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the present invention.

15 is another three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the present invention.

detailed description

The following is a specific embodiment to illustrate the implementation of the "controller device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

Example

First, referring to Figures 1 to 4, Figures 1 and 2 are respectively a three-dimensional assembly schematic diagram of the controller device according to an embodiment of the invention, and Figures 3 and 4 are respectively a three-dimensional exploded schematic diagram of the controller device according to an embodiment of the invention . The embodiment of the present invention provides a controller device U, which includes a heat dissipation module 1 and a first control module 2. The first control module 2 can be arranged on the heat dissipation module 1, and the first control module 2 can abut on the heat dissipation module 1. Preferably, the controller device U may further include a second control module 3, a first conductive structure 4, a second conductive structure 5, a current sensing module 6 and/or a housing structure 7. The housing structure 7 can be arranged on the heat dissipation module 1 and cover the first control module 2, the second control module 3, the first conductive structure 4, the second conductive structure 5 and the current sensing module 6.

In view of the above, the second control module 3 can be arranged on the heat dissipation module 1, and the first control module 2 and the second control module 3 can be stacked in sequence along a direction away from the heat dissipation module 1 (the Y direction). In addition, for example, the second control module 3 can be elevated by using copper pillars C, so that the first control module 2 is located between the heat dissipation module 1 and the second control module 3. However, the present invention does not use the second control module 3 The arrangement above the first control module 2 is limited.

In view of the above, the first conductive structure 4 can be disposed on the first control module 2 and coupled to the first control module 2, and the second conductive structure 5 can be disposed on the first control module 2 and coupled to the first control module 2 . In addition, the first control module 2 may include a circuit board 21, a chip 22, a capacitor 23, a first conductive element 24, a second conductive element 25 and a third conductive element 26. The first conductive structure 4, the second conductive structure 5, the chip 22, the capacitor 23, the first conductive element 24, the second conductive element 25 and the third conductive element 26 may be disposed on the circuit board 21 and coupled to the circuit board 21. In addition, for example, the controller device U provided in the embodiment of the present invention can preferably be applied to a drive of an electric vehicle, but the present invention is not limited thereto. The controller device U provided by the embodiment of the present invention can also be applied to a system that requires high heat dissipation efficiency. In addition, the first conductive element 24, the second conductive element 25, and the third conductive element 26 of the controller device U can be respectively connected to the motor, and the first conductive structure 4 and the second conductive structure 5 can be used as the positive and negative electrodes of the direct current, respectively However, the present invention is not limited to this. In addition, it should be noted that although the foregoing content is illustrated by using the chip 22 and the capacitor 23 in the first control module 2 as an example, in other embodiments, the first control module 2 may also include other electronic components. In addition, it is worth noting that the coupling in the full text of the present invention may be a direct connection or an indirect connection, or a direct electrical connection or an indirect electrical connection, and the present invention is not limited thereto.

In view of the above, the current sensing module 6 can be arranged on the second control module 3, and the current sensing module 6 can be used to sense the flow through the first conductive structure 4, the second conductive structure 5, the first conductive element 24, and the second The current value of the conductive element 25 and/or the third conductive element 26. However, it should be noted that the present invention is not limited by whether the current sensing module 6 is installed or not, and at the same time, it is not limited by the form and quantity of the current sensing module 6. In addition, the shell structure 7 may include a shell body 71, a first hole 72 provided on the shell body 71 and corresponding to the first conductive structure 4, and a first hole 72 provided on the shell body 71 and corresponding to the second conductive structure 5. The second hole 73, a third hole 74 provided on the shell body 71 and corresponding to the first conductive element 24, a fourth hole 75 provided on the shell body 71 and corresponding to the second conductive element 25, and a fourth hole 75 provided on the The shell body 71 corresponds to the fifth hole 76 of the third conductive element 26. More specifically, the first conductive structure 4, the second conductive structure 5, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can pass through the first hole 72, the second hole 73, and the third hole, respectively. The hole 74, the fourth hole 75, and the fifth hole 76 are exposed outside the shell body 71 for insertion of other components.

Next, please refer to FIGS. 3 and 4 again, and please also refer to FIGS. 5 to 8. FIG. 5 shows the heat dissipation module, the first control module, and the first conductive structure of the controller device according to the embodiment of the present invention. Figure 6 to Figure 8 are the three-dimensional exploded schematic diagrams of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device of the embodiment of the present invention. Further exemplify the configuration of the heat dissipation module 1, the first control module 2, the first conductive structure 4, and the second conductive structure 5. In detail, the first conductive structure 4 may include a first positioning plate 41 arranged on the first control module 2 and a first conductive column 42 connected to the first positioning plate 41. The length direction of the first positioning plate 41 The (X direction) and the length direction (Y direction) of the first conductive pillar 42 are perpendicular to each other. The second conductive structure 5 includes a second positioning plate 51 provided on the first control module 2 and a second conductive column 52 connected to the second positioning plate 51. The length direction (X direction) of the second positioning plate 51 is the same as The length directions (Y direction) of the second conductive pillars 52 are perpendicular to each other. Thereby, the first conductive structure 4 and the second conductive structure 5 can form an inverted T-shaped structure.

In view of the above, the first conductive pillar 42 may be disposed at a position between the center (not numbered in the figure) of the first positioning plate 41 and a first end portion 411 of the first positioning plate 41, that is, the first conductive pillar The distance from 42 to the first end portion 411 of the first positioning plate 41 is different from the distance from the first conductive pillar 42 to a second end portion 412 of the first positioning plate 41. In addition, the second conductive pillar 52 may be disposed at a position between the center (not numbered in the figure) of the second positioning plate 51 and a third end portion 511 of the second positioning plate 51, that is, the second conductive pillar 52 The distance to a third end portion 511 of the second positioning plate 51 is different from the distance from the second conductive column 52 to the fourth end portion 512 of the second positioning plate 51. In addition, it is worth noting that the position of the center of the first positioning plate 41 refers to the middle position between the first end 411 and the second end 633 of the first positioning plate 41, and the center of the second positioning plate 51 The position of refers to the middle position between the third end portion 511 and the fourth end portion 512 of the second positioning plate 51. In addition, for example, the length of the first positioning plate 41 may be greater than the length of the first conductive pillar 42 and the length of the second positioning plate 51 may be greater than the length of the second conductive pillar 52, but the present invention is not limited thereto.

In view of the above, for example, the shape of the first positioning plate 41 and the second positioning plate 51 may be elongated, the length of the first positioning plate 41 may be greater than that of the first conductive column 42, and the length of the second positioning plate 51 may be It is larger than the second conductive pillar 52, but the present invention is not limited thereto. Furthermore, when the first conductive structure 4 and the second conductive structure 5 are disposed on the first control module 2, the first positioning plate 41 and the second positioning plate 51 can be arranged parallel to each other and side by side, and the first conductive structure The pillars 42 and the second conductive pillars 52 can be arranged alternately. Thereby, because the first conductive pillar 42 is arranged asymmetrically with respect to the first positioning plate 41, and the second conductive pillar 52 is arranged asymmetrically with respect to the second positioning plate 51, the present invention The invention can utilize the position of the first conductive structure 4 and the second conductive structure 5 arranged on the first control module 2, so that when the first conductive structure 4 and the second conductive structure 5 are made, the first conductive structure 4 and the second conductive structure 5 The shape and structure of the conductive structure 5 may be completely the same.

Next, please refer to FIGS. 5 to 8 again. Preferably, in terms of the present invention, the controller device U may further include a first fastener S1 and a second fastener S2, that is, a first conductive structure 4 and the second conductive structure 5 can be respectively disposed on the first control module 2 and the heat dissipation module 1 by using a first locking member S1 and a second locking member S2 and are electrically connected to the first control module 2. Furthermore, the first conductive structure 4 may further include a first locking hole 43 provided on the first positioning plate 41, and the second conductive structure 5 may further include a first locking hole 43 provided on the second positioning plate 51. Two locking holes 53, the first control module 2 may include a first opening 212A corresponding to the first locking hole 43 and a second opening 212B corresponding to the second locking hole 53. The first locking member S1 can be fitted into the heat dissipation module 1 through the first opening 212A and the first locking hole 43 in sequence to fix the first conductive structure 4 and the first control module 2 on the heat dissipation module 1. The second locking member S2 can be fitted into the heat dissipation module 1 through the second opening 212B and the second locking hole 53 in sequence to fix the second conductive structure 5 and the first control module 2 on the heat dissipation module 1. In addition, it should be noted that in a preferred embodiment, the controller device U may include a plurality of first locking members S1 and a second locking member S2, so that the plurality of first locking members S1 and the second locking members S2 are respectively Locked on the plurality of first locking holes 43, the plurality of second locking holes 53, the plurality of first openings 212A, and the plurality of second openings 212B, and the first conductive structure 4, the second conductive structure 5 and the first control module 2 are fixed on the heat dissipation module 1. In addition, it is worth noting that the controller device U may further include one or more insulating pads R, the insulating pads R may respectively correspond to the first locking member S1 and/or the second locking member S2, and the insulating pad R is arranged on the A locking member S1 and the first conductive structure 4, and an insulating pad R is disposed between the second locking member S2 and the second conductive structure 5, but the present invention is not limited thereto.

In view of the above, in terms of the present invention, the heat dissipation module 1 may include a heat dissipation structure 11, and the circuit board 21 may be disposed on a bearing surface 110 of the heat dissipation structure 11 and abut against the bearing surface 110 of the heat dissipation structure 11. In addition, the circuit board 21 may include a first surface 2101 facing away from the heat dissipation module 1 and a second surface 2102 facing the heat dissipation module 1. The chip 22 may be disposed on the first surface 2101, and the capacitor 23 may be disposed on the second surface 2102. on. In other words, the height direction (positive Y direction) of the chip 22 provided on the circuit board 21 and the height direction (negative Y direction) of the capacitor 23 provided on the circuit board 21 are opposite to each other. That is, the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation module 1, and the height direction (negative Y direction) of the capacitor 23 is a direction closer to the heat dissipation module 1. Furthermore, since the height direction (negative Y direction) of the capacitor 23 is toward the direction close to the heat dissipation module 1, the heat dissipation module 1 preferably may further include a heat dissipation structure 11 that is recessed relative to the heat dissipation structure 11 Housing space 12. Therefore, a part of the second surface 2102 of the circuit board 21 can abut on the heat dissipation structure 11, and the capacitor 23 provided on the second surface 2102 can be located in the accommodating space 12. Thereby, the capacitor 23 can be arranged in an inverted manner relative to the chip 22 to reduce the volume of the controller device U. In addition, it is worth noting that a part of the second surface 2102 of the circuit board 21 may directly abut on the heat dissipation structure 11, or a thermally conductive adhesive may be provided between the second surface 2102 of the circuit board 21 and the heat dissipation structure 11. Therefore, a part of the second surface 2102 of the circuit board 21 can indirectly abut on the heat dissipation structure 11.

In view of the above, further speaking, the controller device U may further include a thermally conductive material T, the thermally conductive material T may be disposed in the accommodating space 12, and the capacitor 23 disposed on the circuit board 21 may be disposed in the accommodating space 12 And embedded in the thermal conductive material T. Thereby, the heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 by the thermally conductive material T, thereby increasing the heat dissipation efficiency of the capacitor 23. In addition, by embedding the capacitor 23 in the thermally conductive material T, the effect of shock absorption can also be achieved. For example, the thermally conductive material T may be a thermally conductive gel, but the invention is not limited to this.

Next, please refer to FIGS. 5 to 8 again. Preferably, according to the present invention, the circuit board 21 can be composed of a first circuit board 21A and a second circuit board 21B, that is, the first control module 2 can It includes a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23. The first circuit board 21A may include a first substrate 211A, the second circuit board 21B includes a second substrate 211B, the first substrate 211A may be coupled to the second substrate 211B, and the first conductive structure 4 and the second conductive structure 5 It can be coupled to the first substrate 211A and the second substrate 211B. For example, in the present invention, one or more conductive pads P may be provided on the first substrate 211A and the second substrate 211B, respectively, so that the first substrate 211A and the second substrate 211B are coupled to each other by the conductive pads. Furthermore, the first substrate 211A may be disposed on the heat dissipation module 1, the second substrate 211B may be disposed on the first substrate 211A, and the vertical projection of the first substrate 211A relative to the heat dissipation module 1 and the second substrate 211A relative to the heat dissipation module The vertical projections of 1 at least partially overlap. In other words, the first substrate 211A and the second substrate 211B are at least partially overlapped. In addition, the conductive pads P of the first substrate 211A and the second substrate 211B can be arranged at the position where the first substrate 211A and the second substrate 211B are overlapped, so that the first substrate 211A and the second substrate 211B are arranged by overlap And coupled with each other.

In view of the above, further, the first substrate 211A of the first circuit board 21A may include a first surface 2101A facing away from the heat dissipation module 1 and a second surface 2102A facing the heat dissipation module 1, and the second circuit board 21B The second substrate 211B may include a first surface 2101B facing away from the heat dissipation module 1 and a second surface 2102B facing the accommodating space 12 of the heat dissipation module 1. The chip 22 may be disposed on the first surface 2101A of the first substrate 211A, and the capacitor 23 may be disposed on the second surface 2102B of the second substrate 211B. Thereby, the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation module 1, and the height direction (negative Y direction) of the capacitor 23 is a direction closer to the heat dissipation module 1.

In view of the above, and further speaking, the second surface 2102A of the first substrate 211A can be disposed on a bearing surface 110 of the heat dissipation structure 11 and abuts against the bearing surface 110 of the heat dissipation structure 11, whereby the heat generated by the chip 22 It can be directly transferred to the heat dissipation structure 11 through the first substrate 211A, thereby increasing the heat dissipation efficiency of the chip 22. In addition, the conductive pad P provided on the first substrate 211A may be provided on the first surface 2101A of the first substrate 211A.

In view of the above, and further, the conductive pad P provided on the second substrate 211B can be provided on the second surface 2102B of the second substrate 211B, and the second surface 2102B of the second substrate 211B can abut against the first substrate On the first surface 2101A of the 211A, the conductive pad P provided on the first surface 2101A of the first substrate 211A and the conductive pad P provided on the second substrate 211B abut against each other to be coupled to each other.

In view of the above, and further speaking, the conductive pad P can also be further disposed on the first surface 2101B of the second substrate 211B, so that the first conductive structure 4 and the second conductive structure 5 abut against the second substrate 211B. The conductive pad P on the first surface 2101B is coupled to the conductive pad P provided on the first surface 2101B of the second substrate 211B. Thereby, the first conductive structure 4 and the second conductive structure 5 can be coupled to the first circuit board 21A and the second circuit board 21B.

In view of the above, and further, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can be disposed on the first surface 2101A of the first substrate 211A and coupled to the first substrate 211A. In addition, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can also be disposed on the first substrate 211A and the heat dissipation module 1 by using the fastener S, and are electrically connected to the first substrate 211A.

In view of the above, preferably, according to the present invention, the materials of the first substrate 211A and the second substrate 211B may be different from each other. More preferably, the thermal conductivity of the first substrate 211A may be greater than the thermal conductivity of the second substrate 211B. For example, the first substrate 211A may be an aluminum substrate, the second substrate 211B may be an FR4 substrate, and the chip 22 may be a power transistor (such as but not limited to MOS (Metal Oxide Semiconductor) field effect power). Transistor (Field-effect Power Transistor) to control the electric signal transmitted to the motor through the first conductive element 24, the second conductive element 25, and the third conductive element 26. The capacitor 23 can be used to stabilize the power supply and instantaneous current However, the present invention is not limited to this. In this way, the heat generated by the power transistor is conducted to the heat dissipation structure 11 through the first substrate 211A (aluminum substrate), and the heat dissipation efficiency of the chip 22 is greatly improved. The heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 through the conduction of the thermally conductive material T. In addition, for example, the heat dissipation structure 11 may also be a metal with good thermal conductivity, such as but not limited to aluminum.

Next, please refer to FIGS. 9 and 10. FIGS. 9 and 10 are respectively an exploded view of the heat dissipation module of the controller device according to the embodiment of the present invention. According to the present invention, the heat dissipation module 1 may further include a liquid flow channel 13 arranged in the heat dissipation structure 11, a first opening 14 arranged on the heat dissipation structure 11 and connected to the liquid flow channel 13, and a first opening 14 arranged in the heat dissipation structure 11 The structure 11 is connected to the second orifice 15 of the liquid channel 13. In other words, the heat dissipation module 1 provided by the present invention may be a water-cooled heat dissipation module 1 to increase the overall heat dissipation efficiency of the controller device U. In addition, the controller device U may further include a connecting tube V connected to the first orifice 14 and the second orifice 15 to use the connecting tube V to connect an external liquid pipeline.

In view of the above, the vertical projection of the liquid channel 13 relative to the bearing surface 110 of the heat dissipation structure 11 can form a first projection area, and the vertical projection of the circuit board 21 relative to the bearing surface 110 of the heat dissipation structure 11 can form a second projection area. The first projection area and the second projection area at least partially overlap. Furthermore, the second projection area is preferably a vertical projection of the first substrate 211A of the circuit board 21 with respect to the carrying surface 110 of the heat dissipation structure 11, and the first projection area and the second projection area at least partially overlap. In other words, the liquid flow channel 13 is preferably arranged below the first substrate 211A to improve the heat dissipation efficiency of the first circuit board 21A. In addition, the heat dissipation structure 11 may include a heat dissipation body 111 and a cover 112 connected to the heat dissipation body 111, and the liquid flow channel 13 is disposed between the heat dissipation body 111 and the cover 112. In other words, the heat dissipation structure 11 can be composed of the heat dissipation body 111 and the cover 112, and the cover 112 can be used to seal the liquid flow channel 13.

In view of the above, it is worth noting that the accommodating space 12 faces a first predetermined direction (positive Y direction) relative to an opening of the heat dissipation body 11, and the liquid flow channel 13 faces a second predetermined direction relative to an opening of the heat dissipation body 11 (Negative Y direction), and the first predetermined direction and the second predetermined direction are different from each other. In other words, the accommodating space 12 is provided on one side of the heat dissipation body 11, and the liquid flow channel 13 is provided on the other side of the heat dissipation body 11, and the accommodating space 12 and the liquid flow channel 13 are mutually exclusive. Connected. Furthermore, in order to reduce the overall thickness of the heat dissipation module 1, the accommodating space 12 and the liquid flow channel 13 may be arranged perpendicular to the height direction (Y direction) of the heat dissipation body 11. That is, the accommodating space 12 is adjacent to the liquid flow channel 13.

Next, please refer to FIG. 11, which is a perspective schematic diagram of another embodiment of the heat dissipation module of the controller device according to the embodiment of the present invention. From the comparison of FIG. 11 with FIG. 9 and FIG. 10, it can be seen that in the embodiment of FIG. 11, the liquid flow channel 13 may not be provided, and the heat dissipation structure 11 includes a plurality of heat dissipation fins provided on the heat dissipation body 111. In other words, the heat dissipation module 1 shown in FIG. 11 may be an air-cooled heat dissipation module 1. However, it should be noted that in the embodiment of the heat dissipation module 1 shown in FIG. 11, the heat dissipation module 1 may still include a accommodating space 12 for accommodating the capacitor 23.

Next, please refer to Fig. 5, and please also refer to Figs. 12 and 13. Fig. 12 shows the heat dissipation module, the first control module, the second control module, and the first control module of the controller device according to the embodiment of the present invention. The three-dimensional exploded schematic diagram of the conductive structure, the second conductive structure, and the current sensing module. A schematic diagram of the three-dimensional assembly of the structure and the current sensing module. The second control module 3 can be arranged on the heat dissipation module 1, and the second control module 3 can be elevated by using copper pillars C, so that the first control module 2 is located between the heat dissipation module 1 and the second control module 3. In addition, for example, the second control module 3 may include a third circuit board 31 and an electronic component 32 disposed on the third circuit board 31. In addition, the electronic component 32 may be a chip, a capacitor, a microprocessor, or a signal. The connection port is not limited to the present invention.

In view of the above, please refer to FIGS. 12 and 13, the third circuit board 31 may further include a first through hole 311 corresponding to the first conductive pillar 42 of the first conductive structure 4, and corresponding to the second conductive Structure 5 has a second through hole 312 of the second conductive pillar 52, a third through hole 313 corresponding to the first conductive element 24, a fourth through hole 314 corresponding to the second conductive element 25, and a fourth through hole 314 corresponding to the third conductive element. A fifth through hole 315 of the conductive element 26. The first conductive pillar 42 may pass through the first through hole 311, and the second conductive pillar 52 may pass through the second through hole 312. In addition, the first conductive element 24 can pass through the third through hole 313, the second conductive element 25 can pass through the fourth through hole 314, and the third conductive element 26 can pass through the fifth through hole 315. Thereby, the first conductive pillar 42 of the first conductive structure 4, the second conductive pillar 52 of the second conductive structure 5, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can be relative to the third circuit The plate 31 is arranged in a convex shape.

In view of the above, the current sensing module 6 can be disposed on the third circuit board 31 of the second control module 3 and coupled to the third circuit board 31. In addition, the current sensing module 6 may at least correspond to at least one of the first conductive element 24, the second conductive element 25, and the third conductive element 26, and the first conductive element 24, the second conductive element 25, and the third conductive element At least one of the conductive elements 26 can pass through the current sensing module 6 to detect the current value through the current sensing module 6. Preferably, a plurality of current sensing modules 6 may be provided to detect the current values passing through the first conductive element 24, the second conductive element 25, and the third conductive element 26, respectively. Furthermore, the current sensing module 6 may also correspond to at least one of the first conductive pillar 42 and the second conductive pillar 52. Preferably, a plurality of current sensing modules 6 may be provided to detect the passage of the first conductive pillar respectively. The current value of the conductive pillar 42 and the second conductive pillar 52. Furthermore, the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 can respectively pass through the current sensing module 6, and the first conductive element 24. The second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 are arranged in a convex shape relative to the current sensing module 6.

Next, please refer to FIGS. 14 and 15. FIGS. 14 and 15 are respectively a three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the present invention. The current sensing module 6 may include a carrier board 61, a current sensing element 62 arranged on the carrier board 61 and coupled to the carrier board 61, and a current sensing element 62 arranged on the carrier board 61 and corresponding to the current sensing element 62 Sensing ring 63. For example, the current sensing module 6 can be a Hall Current Sensor, the carrier 61 can be a printed circuit board (PCB), and the current sensing ring 63 can be a C However, the invention is not limited to this. Furthermore, the current sensing ring 63 may include an annular body portion 631, a first end portion connected to the annular body portion 631, and a second end portion 633 connected to the annular body portion 631. The first end portion 632 and the second end portion 633 There can be an air gap 634 between the two end portions 633, and the ring-shaped body portion 631 can surround a sensing space 635. In addition, it is worth noting that the current sensing ring 63 may be formed by powder metallurgy, or formed by a wound silicon steel sheet, and the present invention is not limited thereto.

In view of the above, the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 can be respectively located in the sensing space 635 of the current sensing module 6 to Check the current value. In addition, the current sensing module 6 can also be arranged on the third circuit board 31 of the second control module 3 by using a copper pillar C.

Advantages of the embodiment

One of the beneficial effects of the present invention is that the controller device U provided by the present invention can pass through "The circuit board 21 includes a first surface 2101 facing away from the heat dissipation module 1 and a second surface 2102 facing the heat dissipation module 1. Among them, the chip 22 is arranged on the first surface 2101, and the capacitor 23 is arranged on the second surface 2102" and "a part of the second surface 2102 of the circuit board 21 abuts on the heat dissipation structure 11 and is arranged on the second surface 2102. The upper capacitor 23 is located in the accommodating space 12" to increase the heat dissipation efficiency and reduce the overall height of the controller device U.

Furthermore, the controller device U provided by the present invention can be implemented by "the chip 22 is arranged on the first surface 2101 of the circuit board 21, and the capacitor 23 is arranged on the second surface 2102 of the circuit board 21" and "the capacitor The technical solution that 23 is located in the accommodating space 12" enables the capacitor 23 to be inverted compared to the chip, which can reduce the overall height of the controller device U.

Furthermore, the controller device U provided by the present invention can be configured by "the first control module 2 is arranged on the heat dissipation module 1, the second control module 3 is arranged on the heat dissipation module 1, and the first control module 2 and The second control module 3 is stacked in a direction away from the heat dissipation module 1 to increase the heat dissipation efficiency.

Furthermore, the controller device U provided by the present invention can be inserted into the heat dissipation module 1 through the first locking member S1 through the first opening 212A and the first locking hole 43 in sequence, so as The conductive structure 4 and the first control module 2 are fixed on the heat dissipating module 1, and the second locking member S2 is fitted into the heat dissipating module 1 through the second opening 212B and the second locking hole 53 in order to mate the second conductive structure 5 And the first control module 2 is fixed on the heat dissipation module 1 to improve the assembly efficiency of the manufacturing process.

Furthermore, the controller device U provided by the present invention can pass "the first control module 2 includes a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23, and the first circuit The board 21A includes a first substrate 211A, the second circuit board 21B includes a second substrate 211B, the chip 22 is disposed on the first substrate 211A, and the capacitor 23 is disposed on the second substrate 211B. The materials of the two substrates 211B are different, and the thermal conductivity of the first substrate 211A is greater than the thermal conductivity of the second substrate 211B, so that the hotter chip 22 is arranged on the first substrate 211A with better thermal conductivity. It can increase the heat dissipation efficiency of the controller device U.

Furthermore, the heat dissipation module 1, the first control module 2, the second control module 3, the current sensing module 6, the first conductive structure 4 and/or the first conductive structure 4 of the present invention are of modular design, and It can be directly replaced by different specifications.

The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not therefore limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made using the content of the description and drawings of the present invention are included in this invention. Within the protection scope of the claims of the invention.

Claims

A controller device, characterized in that the controller device includes:

A heat dissipation module, the heat dissipation module including a heat dissipation structure and an accommodation space located on the heat dissipation structure and recessed relative to the heat dissipation structure; and

A first control module, the first control module is arranged on the heat dissipation module, the first control module includes a circuit board, a chip and a capacitor, the circuit board includes a back of the heat dissipation module A first surface and a second surface facing the heat dissipation module, wherein the chip is disposed on the first surface, and the capacitor is disposed on the second surface;

Wherein, a part of the second surface of the circuit board abuts on the heat dissipation structure, and the capacitor provided on the second surface is located in the accommodating space.
The controller device according to claim 1, wherein the heat dissipation module further comprises a liquid flow channel arranged in the heat dissipation structure, and a liquid flow channel arranged on the heat dissipation structure and connected to the liquid flow channel. The first orifice of the channel and a second orifice arranged on the heat dissipation structure and connected to the liquid flow channel, wherein the vertical projection of the liquid flow channel with respect to the heat dissipation structure can form a first In the projection area, the vertical projection of the circuit board relative to the heat dissipation structure can form a second projection area, and the first projection area and the second projection area at least partially overlap.
3. The controller device according to claim 2, wherein the heat dissipation structure comprises a heat dissipation body and a cover connected to the heat dissipation body, and the liquid flow channel is provided between the heat dissipation body and the heat dissipation body. Between the covers; wherein the accommodating space faces a first predetermined direction relative to an opening of the heat dissipation body, and the liquid flow channel faces a second predetermined direction relative to an opening of the heat dissipation body, so The first predetermined direction and the second predetermined direction are different from each other.
3. The controller device of claim 1, wherein the circuit board comprises a first circuit board and a second circuit board, the first circuit board comprises a first substrate, and the second circuit board It includes a second substrate, the chip is arranged on the first substrate, and the capacitor is arranged on the second substrate.
4. The controller device of claim 4, wherein the first substrate and the second substrate are made of different materials, and the thermal conductivity of the first substrate is greater than the thermal conductivity of the second substrate.
4. The controller device of claim 4, wherein the first substrate is coupled to the second substrate, the first substrate is disposed on the heat dissipation module, and the second substrate is disposed on the On the first substrate, the vertical projection of the first substrate relative to the heat dissipation module and the vertical projection of the second substrate relative to the heat dissipation module at least partially overlap.
The controller device according to claim 1, wherein the controller device further comprises: a first conductive structure and a second conductive structure, the first conductive structure is disposed on the first control module Above and coupled to the first control module, the second conductive structure is disposed on the first control module and coupled to the first control module; wherein, the first conductive structure includes a A first positioning plate on the first control module and a first conductive column connected to the first positioning plate, and the second conductive structure includes a second positioning plate arranged on the first control module And a second conductive post connected to the second positioning plate.
8. The controller device of claim 7, wherein the controller device further comprises: a first locking member and a second locking member, and the first conductive structure further includes a The first locking hole on the first positioning plate, the second conductive structure further includes a second locking hole provided on the second positioning plate, and the first control module includes a A first opening of the first locking hole and a second opening corresponding to the second locking hole; wherein the first locking member passes through the first opening and the first lock in sequence The fixing hole is engaged with the heat dissipation module to fix the first conductive structure and the first control module on the heat dissipation module, and the second locking member sequentially passes through the second opening and the The second locking hole is engaged with the heat dissipation module to fix the second conductive structure and the first control module on the heat dissipation module.
7. The controller device of claim 7, wherein the first positioning plate includes a first end portion and a second end portion corresponding to the first end portion, and the second positioning plate includes A third end portion and a fourth end portion corresponding to the third end portion; wherein the distance from the first conductive pillar to the first end portion is the same as the distance from the first conductive pillar to the second conductive pillar The distances of the end portions are different, and the distance from the second conductive pillar to the third end portion is different from the distance from the second conductive pillar to the fourth end portion.
The controller device according to claim 7, wherein the first control module further comprises a first conductive element arranged on the circuit board, and a second conductive element arranged on the circuit board. Components and a third conductive component arranged on the circuit board.
8. The controller device of claim 7, wherein the controller device further comprises: a second control module, the second control module is disposed on the heat dissipation module, and the first control The module and the second control module are stacked in a direction away from the heat dissipation module.
11. The controller device of claim 11, wherein the second control module includes a third circuit board, and the third circuit board includes the first conductive pillar corresponding to the first conductive structure A first through hole of the second conductive structure and a second through hole of the second conductive column corresponding to the second conductive structure, the first conductive column passes through the first through hole, and the second conductive The column passes through the second through hole.
The controller device according to claim 11, wherein the controller device further comprises: a current sensing module, the current sensing module is arranged on the second control module; wherein, the The third circuit board of the second control module further includes a third through hole corresponding to the first conductive element, a fourth through hole corresponding to the second conductive element, and a fourth through hole corresponding to the third conductive element. A fifth through hole of the conductive element; wherein the current sensing module corresponds to at least one of the first conductive element, the second conductive element, and the third conductive element.
The controller device according to claim 1, wherein the controller device further comprises: a housing structure, and the housing structure is disposed on the heat dissipation module.