WO2022028416A1

WO2022028416A1 - Optical module housing and optical module

Info

Publication number: WO2022028416A1
Application number: PCT/CN2021/110317
Authority: WO
Inventors: 张超; 王克武; 鲁长武
Original assignee: 苏州旭创科技有限公司
Priority date: 2020-08-06
Filing date: 2021-08-03
Publication date: 2022-02-10
Also published as: CN114063226B; CN114063226A

Abstract

An optical module housing (10) and an optical module. The housing (10) comprises a first housing (11) and a second housing (12); the first housing (11) comprises a first bottom plate (111) and sidewalls (112) on two sides thereof; the second housing (12) comprises a second bottom plate (121) and a heat dissipation structure (122); the heat dissipation structure (122) comprises two sheet-like ribs (122a) on two sides of the second bottom plate (121) and extending in the length direction of the housing (10); the second housing (12) is covered on the first housing (11); the first bottom plate (111), the sidewalls (112) on the two sides of the first bottom (111), and the second bottom plate (12) form a cavity (14); and the sheet-like ribs (122a) on the two sides of the second bottom plate (121) are at least partially attached to one side of each of the sidewalls (112), such that the sheet-like ribs (122a) are in thermal conductive connection to the side surfaces of the sidewalls (112). The position of a boundary surface (13) of the two housings (11 and 12) of the housing (10) is modified, such that the two housings (11 and 12) have a larger contact area, thereby reducing the thermal contact resistance between the two housings (11 and 12), effectively reducing the temperature difference between the two housings (11 and 12), and improving the heat dissipation capability of the optical module. Moreover, the EMI performance of the optical module is improved; a smaller wall thickness is realized, such that a larger layout space is reserved for a circuit board (20).

Description

Optical module housing and optical module

technical field

The present application relates to the technical field of optical communication, and in particular, to an optical module housing and an optical module.

Background technique

A commonly used optical module usually includes a casing, a circuit board and an optoelectronic component arranged in the casing. As shown in FIG. 1 , for the convenience of assembly, the casing 10 ′ is generally divided into an upper casing 12 ′ and a lower casing 11 ′. The interface 13' of the body 12' and the lower case 11' is near the circuit board 20'. During operation, the heat generated by the circuit board 20' or the chip of the optoelectronic component needs to be dissipated through the casing 10'. The heat dissipation capacity of the upper shell 12' and the lower shell 11' is quite different. The shell (such as the upper shell 12') where the main heat dissipation surface (with heat dissipation fins) is located dissipates heat faster, and the shell where the auxiliary heat dissipation surface is located. (The lower shell 11') dissipates heat slowly, and the contact area at the interface 13' of the upper and lower shells is small, the thermal resistance is large, and the heat conduction between the upper and lower shells is slow, resulting in a large temperature difference between the upper and lower shells during operation. , Usually the temperature difference between the upper and lower casings can reach 10°C, which affects the heat dissipation effect of the optical module, resulting in poor stability of the optoelectronic components, and the overall performance and yield of the optical module are affected.

technical solutions

The purpose of the present application is to provide an optical module housing and an optical module, which can effectively reduce the temperature difference of the housing and improve the heat dissipation capability.

In order to achieve one of the above purposes, the present application provides an optical module housing, comprising:

a first casing, the first casing includes a first bottom plate and side walls on both sides of the first bottom plate;

a second casing, the second casing includes a second bottom plate, and a heat dissipation structure connected and fixed to the second bottom plate, the heat dissipation structure includes two sides of the second bottom plate along the length of the casing Two extended fins;

The second shell is covered on the first shell, the first bottom plate, the side walls on both sides of the first bottom plate and the second bottom plate form a cavity; the two sides of the second bottom plate form a cavity; The sheet-shaped rib is at least partially attached to one side of the side wall, so that the sheet-shaped rib is thermally connected to the side surface of the side wall.

As a further improvement of the embodiment, the second bottom plate and the sheet-like ribs on both sides thereof are located between the side walls on both sides of the first bottom plate, and the outer sides of the sheet-like ribs are attached to the The inner side of the side wall.

As a further improvement of the embodiment, the first housing is provided with a first limiting structure, the second housing is provided with a second limiting structure, the first limiting structure and the second limiting structure cooperate to limit the position of the second base plate relative to the first base plate.

As a further improvement of the embodiment, the first limiting structure includes an upper edge located on the side wall in a direction away from the first bottom plate, and the second limiting structure includes an outer edge disposed on the sheet-like rib. Limit steps on the side;

The limiting step abuts against the upper edge of the side wall to limit the distance between the second bottom plate and the first bottom plate.

As a further improvement of the embodiment, the upper edge of the side wall has at least a first height and a second height along the length direction of the casing, and the first height and the second height are not equal.

As a further improvement of the embodiment, the first limiting structure includes a slot provided on the side wall, the second limiting structure includes a protrusion provided on the sheet-shaped rib, the protrusion It is snapped into the card slot to limit the position of the second bottom plate.

As a further improvement of the embodiment, the optical module further includes a circuit board, and the circuit board is arranged in the cavity; a boss is provided on the inner side of the side wall or on the first bottom plate for supporting the the circuit board.

As a further improvement of the embodiment, the sheet-like rib or the second base plate is provided with a clamping structure extending toward the first base plate, and the clamping structure cooperates with the boss to clamp the circuit board .

As a further improvement of the embodiment, the heat dissipation structure further includes a heat dissipation fin located between the two sheet-shaped fins; the heat dissipation fins are needle-shaped or sheet-shaped;

The heat dissipation structure is integrally formed with the second bottom plate.

Another optical module housing provided by this application includes:

a first casing, the first casing includes a first bottom plate and first side walls on both sides of the first bottom plate;

a second casing, the second casing includes a second bottom plate and second side walls on both sides of the second bottom plate, the second bottom plate includes an opposite bottom surface and a top surface, the bottom surface faces the first a bottom plate;

The second shell is covered on the first shell, the second bottom plate forms a cavity with the first bottom plate and the first side wall; the height of the first side wall is at least partially higher On the bottom surface of the second bottom plate, the second side wall is attached to the first side wall.

As a further improvement of the embodiment, the second side wall extends in a direction away from the first bottom plate, and the height of the first side wall is at least partially higher than the top surface of the second bottom plate.

As a further improvement of the embodiment, a heat dissipation structure is also included, the heat dissipation structure is disposed between the second side walls on both sides of the second bottom plate, and the heat dissipation structure is thermally connected to the second bottom plate.

As a further improvement of the embodiment, the heat dissipation structure includes a plurality of heat dissipation fins integrally formed with the second bottom plate; or,

The heat dissipation structure includes a main board and a plurality of heat dissipation fins arranged on the main board, and the main board is thermally connected to the second bottom plate.

The present application also provides an optical module, a circuit board, an optoelectronic component, and the optical module housing according to any of the above embodiments, wherein the circuit board and the optoelectronic component are arranged in a cavity of the optical module housing Inside.

beneficial effect

The beneficial effects of the present application: the position of the interface between the first shell and the second shell is improved, the first shell and the second shell have a larger contact area, and the first shell and the second shell are reduced. The contact thermal resistance between the two casings can effectively reduce the temperature difference between the two casings and improve the heat dissipation capacity of the optical module; at the same time, the first casing and the second casing have a larger overlapping area, which improves the EMI of the optical module. Performance; single sidewall thickness is smaller, allowing more board layout space.

Description of drawings

Figure 1 is a schematic diagram of the structure of a common optical module;

FIG. 2 is a schematic structural diagram of an optical module of the present application;

3 is an exploded schematic diagram of the structure of an optical module according to Embodiment 1 of the present application;

4 is a schematic diagram of an optical module housing according to Embodiment 1 of the present application;

FIG. 5 is a schematic diagram of the cross-section A of the optical module according to Embodiment 1 of the present application;

6 is a schematic diagram of a cross-section B of an optical module according to Embodiment 1 of the present application;

FIG. 7 is a schematic diagram of an optical module housing according to Embodiment 2 of the present application.

Embodiments of the present invention

The present application will be described in detail below with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present application, and the structural, method, or functional transformations made by those of ordinary skill in the art according to these embodiments are all included in the protection scope of the present application.

In various figures of the present application, some dimensions of structures or parts are exaggerated relative to other structures or parts for convenience of illustration, and thus, are only used to illustrate the basic structure of the subject matter of the present application.

Additionally, terms such as "upper," "over," "lower," "below," and the like, referring to spatially relative positions, are used herein for convenience of description to describe an element or feature as shown in the figures relative to one another. A relationship to another unit or feature. The term spatially relative position may be intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatially relative descriptors used herein interpreted accordingly. When an element or layer is referred to as being "on", "connected" to another element or layer, it can be directly on, connected to, or "connected to" another element or layer, or Intermediate elements or layers may be present.

The present application provides an optical module, which improves the interface position of the optical module housing, makes the two housings have a larger contact area, reduces the contact thermal resistance between the first housing and the second housing, and can Effectively reduce the temperature difference between the two shells. Specifically, it will be described in detail in the following embodiments.

Example 1

As shown in FIGS. 2-6 , this embodiment provides an optical module, including a housing 10 , a circuit board 20 and an optoelectronic component 30 . One end of the housing 10 is provided with an optical fiber connector 40 and a pulling and unlocking mechanism (not shown in the figure). shown in). The housing 10 includes a first housing 11 and a second housing 12 , and the pull-to-unlock mechanism is provided on the first housing 11 . The first shell 11 includes a first bottom plate 111 and side walls 112 located on both sides of the first bottom plate 111; the second shell 12 includes a second bottom plate 121, and a heat dissipation structure 122 connected and fixed to the second bottom plate 121. Here, the heat dissipation The structure is integrally formed with the second bottom plate. The heat dissipation structure 122 includes two sheet-like fins 122a located on both sides of the second bottom plate 121 and extending along the length direction of the housing 10, and a heat-dissipating fin 122b located between the two sheet-like fins 122a. In this embodiment, the heat dissipation fins 122b located between the two sheet-shaped fins 122a are also sheet-shaped fins. In other embodiments, the heat dissipation fins may be needle-shaped fins. The above-mentioned two sheet-like ribs 122a located on both sides of the second bottom plate 121 and extending along the length direction of the casing 10 can also be regarded as two side walls of the second casing 12, that is, the second side walls. The wall extends away from the first bottom plate.

The second shell 12 is covered on the first shell 11 , the first bottom plate 111 , the side walls 112 on both sides of the first bottom plate 111 and the second bottom plate 121 form a cavity 14 ; the sheet-like ribs on both sides of the second bottom plate 121 The sheet 122 a is at least partially attached to one side of the side wall 112 of the first bottom plate 111 , so that the sheet-like rib 122 a is thermally connected to the side surface of the side wall 112 . In this embodiment, the second bottom plate 121 is embedded between the side walls 112 on both sides of the first bottom plate 111, and the two sheet-like ribs 122a on both sides of the second bottom plate 121 are at least partially nested inside the two side walls 112, so that the The outer side surface 122c of the rib 122a is attached to the inner side surface 112b of the side wall 112 to achieve thermally conductive connection between the two. The above-mentioned circuit board 20 and the optoelectronic component 30 are disposed in the cavity 14 formed by the first casing 11 and the second casing 12 , and the optoelectronic component 30 is electrically connected to the circuit board 20 . Here, the optoelectronic assembly 30 includes an optoelectronic chip, a lens, and an optical socket. The optoelectronic chip can be arranged on the circuit board 20 or at the edge of the circuit board 20, or the optoelectronic chip, the lens, and the optical socket can be packaged together and then electrically connected to the circuit board 20. The inner side of the side wall 112 refers to the surfaces of the two side walls 112 facing each other, and the outer side of the sheet-like rib 122a refers to the opposite side of the two sheet-like fins 122a. The outer side surface of the side wall 112 of the first housing 11 (opposite to its inner side surface 112 b ) is provided with a groove 115 for installing the pull-unlock mechanism at a position adjacent to the optical fiber connector 40 . In other embodiments, deep grooves can also be set on the sheet-like rib, so that the side walls on both sides of the first bottom plate are respectively embedded in the deep grooves of the sheet-like fins on both sides of the second bottom plate, so that the inner sides of the side walls and A large part of the outer side is fitted into the deep groove of the sheet-like rib. At this time, the sheet-like rib partially covers the outer side of the side wall of the first bottom plate.

In this embodiment, when the second bottom plate 121 is embedded between the side walls 112 on both sides of the first bottom plate 111, the two sheet-like ribs 122a on both sides of the second bottom plate 121 are nested inside the two side walls 112, and the sheet-like rib The outer side surface of the sheet 122a is in close contact with the inner side surface of the side wall 112, and the two are directly attached to realize a thermally conductive connection. In other embodiments, the sheet-like fins 122a and the sidewalls 112 may also be thermally connected by thermally conductive materials such as thermally conductive adhesives to enhance thermal conductivity. In order to obtain better heat dissipation effect, the overlapping length of the side wall 112 and the sheet-like fins 122a in the longitudinal direction of the casing in this embodiment is greater than half of the total length of the casing; The overlapping height in the height direction is greater than one-eighth of the total height of the housing. The structure of the casing 10 improves the position of the interface 13 between the first casing 11 and the second casing 12 compared with the commonly used casing structure. The height of the side wall 112 of the first casing 11 is increased, so that the side wall 112 of the first casing 11 is sufficient to support the second casing 12, so that the cavity 14 in the casing 10 has a sufficient height, and the side wall 112 is sufficient to support the second casing 12. The height of 112 is also enough to cover the sheet-like rib 122a, so that most of the outer side of the sheet-like fin 122a overlaps with the inner side of the side wall 112, so that the first shell 11 and the second shell 12 have more The large contact area reduces the contact thermal resistance between the first casing 11 and the second casing 12 , which can effectively reduce the temperature difference between the two casings and improve the heat dissipation capability of the optical module. Meanwhile, the first casing 11 and the second casing 12 have a larger overlapping area, which improves the EMI (Electromagnetic Interference) performance of the optical module.

A first limiting structure is provided on the first shell, and a second limiting structure is provided on the second shell. The first limiting structure and the second limiting structure cooperate to limit the position of the second bottom plate. In this embodiment, the first limiting structure includes an upper edge 112a located on the side wall 112 of the first housing 11 away from the first bottom plate 111 , and the second limiting structure includes a Limit step 123 . During assembly, the limiting step 123 of the sheet-like rib 122a abuts against the upper edge 112a of the side wall 112 to limit the position where the second bottom plate 121 is embedded into the inner side of the side wall 112, thereby limiting the distance between the second bottom plate 121 and the first bottom plate 111. The distance between them (ie the height of the cavity 14). In this embodiment, the limiting step 123 is set near the upper edge of the sheet-shaped rib 122a away from the second bottom plate 121, so that the outer side of the entire sheet-shaped rib 122a and the inner side of the side wall 112 have the largest contact area , in order to achieve better heat conduction, minimize the temperature difference between the first casing 11 and the second casing 12, and at the same time make the optical module have better EMI performance. In this embodiment, the upper edge 112a of the side wall 112 has a first height 112c, a second height 112d and a third height 112e along the length direction of the housing 10, where the first height 112c, the second height 112d and the third height 112e are not equal to each other. In other embodiments, the upper edge of the side wall may also have unequal first heights and second heights, or more unequal heights along the housing direction, so as to form the side walls along the length direction of the housing 10 . At least one step is used to limit the position of the second bottom plate relative to the first bottom plate in the longitudinal direction of the casing 10 .

In this embodiment, the first limiting structure may also include a slot 113 provided on the inner side of the side wall 122 of the first housing 11 , and in other embodiments, the slot 113 may also be provided on the upper edge 112 a of the side wall 112 The second limiting structure also includes a protrusion 124 provided on the outer side of the sheet-shaped rib 122a. During assembly, the protrusion 124 is snapped into the slot 113 to limit the position of the second base plate 121, including the position of the second base plate 121 in the length direction of the optical module, to prevent the second base plate 121 from sliding back and forth. A boss 114 is also provided on the inner side of the side wall 112 for supporting the circuit board 20 . Of course, the boss 114 can also be provided on the first bottom plate 111 , or both the first bottom plate 111 and the inner side of the side wall 112 are provided with a boss 114 . Desk 114. Correspondingly, a clamping structure 125 extending toward the first base plate 111 is provided on the sheet-shaped rib 122 a or the second base plate 121 , and the clamping structure 125 cooperates with the above-mentioned bosses 114 to clamp the circuit board 20 . Here, the clamping structure 125 may be a column or a flat plate extending toward the first bottom plate 111 . On the side of the second base plate 121 opposite to the heat dissipation structure 122 , that is, the bottom surface of the second base plate 121 , a heat-conducting block 126 extending toward the first base plate 111 may also be provided, and the heat-conducting block 126 and the second base plate 121 are integrally formed. It is used for thermally conductive connection with the heat dissipation area on the circuit board 20 or the heat sink of the optoelectronic component. Of course, in other embodiments, the above-mentioned first limiting structure can also be provided on the first bottom plate, and the second limiting structure can be provided on the second bottom plate at a position opposite to the first limiting structure; the above-mentioned heat conduction block can also be It is a heat-conducting material attached to the first base plate and is thermally connected to the second base plate.

The casing of the optical module needs to have a sufficient thickness of side walls to ensure the reliability of the casing, and at the same time, it is also desirable to have the thickness of the side walls as small as possible to leave the maximum layout space for the circuit board. That is, the side wall of the casing should not only ensure the reliability of the casing, but also be thin enough. In the common optical module shown in Fig. 1, the interface 13' of the upper and lower casings is located near the circuit board 20'. In order to ensure the EMI performance of the optical module, the side walls of the upper and lower casings generally have a wall thickness of 0.5 mm and a thickness of 0.5 mm. The gap of 0.05mm, so the total wall thickness of one side of the shell should be at least 1.05mm. In the case that the outer dimensions of the shell meet the standard requirements, the thicker the wall thickness, the greater the internal space occupied, and the internal circuit board 20' can be distributed The board space is less. As shown in FIGS. 5 and 6 , in the optical module housing of the present application, the interface 13 between the two housings is set on the heat dissipation structure 122 adjacent to the upper edge of the sheet-like fins 122 a , and there are only one left and one left near the circuit board 20 . On the side wall 112 of the first casing 11 , only the clamping structure 125 can be provided at a certain position to clamp the circuit board 20 . For other non-clamping positions, the thickness D of the single side wall can be controlled within 0.75mm, and the single side is larger than The original structure has an extra width of 0.3 mm, which can provide at least a 0.6 mm wide layout space for the circuit board 20 as a whole. Of course, better space can also be obtained by locally thinning. For example, the side wall 112 of the first housing 11 may have different thicknesses at different locations. The thickness of the side wall 112 at the position where the sheet-like rib 122 a is attached is smaller than that at other positions (that is, where it is not attached); ) thickness. The thickness of the second casing 12 can be designed in comparison with the first casing 11 .

Example 2

As shown in FIG. 7 , the difference from Embodiment 1 is that in this embodiment, the heat dissipation structure 128 of the optical module housing 10 and the second housing 12 are combined in separate structures. Of course, the heat dissipation structure can also be removed. Specifically, the casing 10 of the optical module includes a first casing 11 and a second casing 12 , wherein the first casing 11 includes a first bottom plate 111 and first side walls 112 located on both sides of the first bottom plate 111 (with The side walls in Embodiment 1 are the same); the second housing 12 includes a second bottom plate 121 and second side walls 127 located on both sides of the second bottom plate 121 . The second bottom plate 121 includes a bottom surface 121 a and a top surface 121 b opposite to each other, and the bottom surface 121 a faces the first bottom plate 111 . The second casing 12 is covered on the first casing 11 . The second bottom plate 121 , the first bottom plate 111 and the first side wall 112 form a cavity 14 , wherein the height of the first side wall 112 is at least partially higher than that of the second casing 112 . The bottom surface 121a of the bottom plate 121 makes the second side wall 127 fit with the first side wall 112 to realize thermally conductive connection between the two. In this embodiment, the second bottom plate 121 is located inside the two first side walls 112 of the first housing 11 , so that the outer side surfaces of the second side walls 127 are thermally connected to the inner side surfaces of the first side walls 112 . The second side wall 127 extends in a direction away from the first bottom plate 111 to form a side wall equivalent to the sheet-like rib in Embodiment 1. The height of the first side wall 112 is higher than the top surface 121b of the second bottom plate 121 , adjacent to the upper edge of the second side wall 127 . At this time, the second bottom plate 121 is embedded between the first side walls 112 on both sides of the first bottom plate 111 to form a cavity 14 together with the first bottom plate 111 and the first side walls 112 . The second side wall 127 is nested inside the first side wall 112 , so that the outer side surface of the second side wall 127 is thermally connected to the inner side surface of the first side wall 112 . The circuit board and the optoelectronic components are arranged in the cavity 14 formed by the first casing 11 and the second casing 12 , and the optoelectronic components are electrically connected to the circuit board. In other embodiments, the second side wall of the second bottom plate may also extend in a direction close to the first bottom plate. During assembly, the second side wall is embedded in the inner side of the first side wall on both sides of the first bottom plate, and the second side The outer side of the wall is thermally connected to the inner side of the first side wall. At this time, the upper edge of the first side wall is located between the bottom surface and the top surface of the second bottom plate, that is, the interface between the first casing and the second casing is located at the second bottom plate.

In this embodiment, when the second bottom plate 121 is embedded between the first side walls 112 on both sides of the first bottom plate 111 , the second side walls 127 on both sides of the second bottom plate 121 are embedded in the inner sides of the two first side walls 112 . The outer side surfaces of the two side walls 127 are closely attached to the inner side surfaces of the first side wall 112 , and the two are directly attached to achieve thermally conductive connection. In other embodiments, the second side wall 127 and the first side wall 112 may also be thermally connected by thermally conductive adhesive. The housing structure improves the position of the interface between the first housing 11 and the second housing 12, and extends the second side wall 127 away from the first bottom plate 111, that is, the second side wall 127 extends out of the housing, and The interface is provided on the second side wall 127 of the second shell 12, and the height of the first side wall 112 is increased at the same time, so that the first side wall 112 of the first shell 11 is sufficient to support the second shell 12, so that the height of the first side wall 112 is increased. The cavity 14 in the housing 10 has a sufficient height, and the first side wall 112 is also sufficient to cover the second side wall 127 , so that most of the outer side of the second side wall 127 overlaps with the inner side of the first side wall 112 together, so that the first shell 11 and the second shell 12 have a larger contact area, reduce the contact thermal resistance between the first shell 11 and the second shell 12, and effectively reduce the two shells The temperature difference between them improves the heat dissipation capacity of the optical module. Meanwhile, the first casing 11 and the second casing 12 have a larger overlapping area, which improves the EMI (Electromagnetic Interference) performance of the optical module. Same as Example 1, the thickness of the single side wall can be controlled within 0.75mm in the non-clamping position of the structure, and the width of one side is 0.3mm more than the original structure, and the overall width of the circuit board can be at least 0.6mm more. of board space.

Same as Embodiment 1, in this embodiment, the first housing 11 is provided with a first limiting structure, the second housing 12 is provided with a second limiting structure, and the first limiting structure and the second limiting structure cooperate to Constrain the position of the second base plate. Here, the first limiting structure includes an upper edge 112 a located on the first side wall 112 of the first housing 11 in a direction away from the first bottom plate 111 , and the second limiting structure includes a limiting structure provided on the outer side surface of the second side wall 127 . Step 123. During assembly, the limiting step 123 of the second side wall 127 abuts against the upper edge 112 a of the first side wall 112 to limit the position where the second bottom plate 121 is embedded inside the first side wall 112 , thereby limiting the second bottom plate 121 and the first side wall 112 . A distance between the bottom plates 111 (ie, the height of the cavity 14). In this embodiment, the limiting step 123 is set near the upper edge of the second side wall 127 away from the second bottom plate 121 , so that the outer side of the entire second side wall 127 and the inner side of the first side wall 112 have the largest contact area, to achieve better heat conduction, minimize the temperature difference between the first housing 11 and the second housing 12, and at the same time make the optical module have better EMI performance. Of course, the above-mentioned first limiting structure and second limiting structure can also be the same as the first embodiment, including different structures arranged in other different positions, such as the cooperation between the slot and the protrusion, etc., so as to limit the second bottom plate from different directions. s position.

The optical module housing is further provided with a heat dissipation structure 128 . The heat dissipation structure 128 is disposed between the second side walls 127 on both sides of the second base plate 121 and is thermally connected to the second base plate 121 . In this embodiment, the heat dissipation structure 128 adopts a structure that is combined with the second bottom plate 121 separately. Specifically, the heat dissipation structure 128 includes a main board 128a and a plurality of heat dissipation fins 128b disposed on the main board 128a. The heat dissipation structure 128 is thermally connected to the second base plate 121 through the main board 128a. Here, the main board 128a may be adhered to the second bottom plate 121 by means of thermally conductive adhesive, or fixed to the second bottom plate 121 by welding or fastener locking. Of course, in other embodiments, the heat dissipation structure can also be integrally formed with the second base plate, including a plurality of heat dissipation fins integrally formed with the second base plate. Here, the heat dissipation fins 128b are sheet-shaped fins that are substantially parallel to the second side wall 127. In other embodiments, the heat dissipation fins can also be needle-shaped fins.

The housings of the optical modules in the above embodiments are made of common alloy materials, such as zinc alloys, etc., which can be manufactured by machining or die-casting.

The series of detailed descriptions listed above are only specific descriptions for the feasible embodiments of the present application, and they are not used to limit the protection scope of the present application. Changes should be included within the scope of protection of this application.

Claims

An optical module housing, characterized in that it includes:

a first casing, the first casing includes a first bottom plate and side walls on both sides of the first bottom plate;

a second casing, the second casing includes a second bottom plate, and a heat dissipation structure connected and fixed to the second bottom plate, the heat dissipation structure includes two sides of the second bottom plate along the length of the casing Two extended fins;

The second shell is covered on the first shell, the first bottom plate, the side walls on both sides of the first bottom plate and the second bottom plate form a cavity; the two sides of the second bottom plate form a cavity; The sheet-shaped rib is at least partially attached to one side of the side wall, so that the sheet-shaped rib is thermally connected to the side surface of the side wall.
The optical module housing according to claim 1, wherein:

The second bottom plate and the sheet-like ribs on both sides thereof are located between the side walls on both sides of the first bottom plate, and the outer sides of the sheet-like ribs are attached to the inner sides of the side walls.
The optical module housing according to claim 1, wherein:

The first housing is provided with a first limiting structure, the second housing is provided with a second limiting structure, and the first limiting structure and the second limiting structure cooperate to limit the second limiting structure. The position of the second bottom plate relative to the first bottom plate.
The optical module housing according to claim 3, wherein:

The first limiting structure includes an upper edge located on the side wall in a direction away from the first bottom plate, and the second limiting structure includes a limiting step provided on the outer side surface of the sheet-like rib;

The limiting step abuts against the upper edge of the side wall to limit the distance between the second bottom plate and the first bottom plate.
The optical module case according to claim 4, wherein the upper edge of the side wall has at least a first height and a second height along the length direction of the case, the first height and the second height not equal.
The optical module housing according to claim 3, wherein the first limiting structure comprises a slot provided on the side wall, and the second limiting structure comprises a sheet-shaped rib. The protrusion on the plate is snapped into the slot to limit the position of the second bottom plate.
The optical module housing according to claim 1, wherein:

The optical module further includes a circuit board, and the circuit board is arranged in the cavity;

The inner side of the side wall or the first bottom plate is provided with a boss for supporting the circuit board.
The optical module housing according to claim 7, wherein the sheet-shaped rib or the second bottom plate is provided with a clamping structure extending toward the first bottom plate, and the clamping structure cooperates with the bosses to hold the circuit board.
The optical module housing according to any one of claims 1-7, wherein the heat dissipation structure further comprises a heat dissipation fin located between the two sheet-shaped fins; the heat dissipation fin is a pin shape or sheet;

The heat dissipation structure is integrally formed with the second bottom plate.
An optical module housing, characterized in that it includes:

a first casing, the first casing includes a first bottom plate and first side walls on both sides of the first bottom plate;

a second casing, the second casing includes a second bottom plate and second side walls on both sides of the second bottom plate, the second bottom plate includes an opposite bottom surface and a top surface, the bottom surface faces the first a bottom plate;

The second shell is covered on the first shell, the second bottom plate forms a cavity with the first bottom plate and the first side wall; the height of the first side wall is at least partially higher On the bottom surface of the second bottom plate, the second side wall is attached to the first side wall.
The optical module case according to claim 10, wherein the second side wall extends in a direction away from the first bottom plate, and the height of the first side wall is at least partially higher than that of the second bottom plate the top surface.
The optical module housing of claim 10, wherein the first housing is provided with a first limiting structure, the second housing is provided with a second limiting structure, and the first limiting structure The structure cooperates with the second limiting structure to limit the position of the second bottom plate relative to the first bottom plate.
The optical module housing according to any one of claims 10 to 12, further comprising a heat dissipation structure, wherein the heat dissipation structure is arranged between the second side walls on both sides of the second bottom plate, so that the The heat dissipation structure is thermally connected to the second base plate.
The optical module housing according to claim 13, wherein:

The heat dissipation structure includes a plurality of heat dissipation fins integrally formed with the second bottom plate; or,

The heat dissipation structure includes a main board and a plurality of heat dissipation fins arranged on the main board, and the main board is thermally connected to the second bottom plate.
An optical module, a circuit board and an optoelectronic assembly, further comprising the optical module housing according to any one of claims 1-14, wherein the circuit board and the optoelectronic assembly are arranged in the optical module housing inside the cavity.