WO2022025260A1 - Thermal conductive unit and cooling device - Google Patents

Thermal conductive unit and cooling device Download PDF

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Publication number
WO2022025260A1
WO2022025260A1 PCT/JP2021/028355 JP2021028355W WO2022025260A1 WO 2022025260 A1 WO2022025260 A1 WO 2022025260A1 JP 2021028355 W JP2021028355 W JP 2021028355W WO 2022025260 A1 WO2022025260 A1 WO 2022025260A1
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Prior art keywords
support member
support
plate
heat conductive
conductive member
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PCT/JP2021/028355
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French (fr)
Japanese (ja)
Inventor
征志 高尾
仕▲ゆ▼ 楊
敏彦 小関
雅昭 花野
淳一 石田
Original Assignee
日本電産株式会社
尼得科超▲しゅう▼科技股▲ふん▼有限公司
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Priority claimed from JP2021088006A external-priority patent/JP2023123891A/en
Application filed by 日本電産株式会社, 尼得科超▲しゅう▼科技股▲ふん▼有限公司 filed Critical 日本電産株式会社
Publication of WO2022025260A1 publication Critical patent/WO2022025260A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • FIG. 7 is a perspective view of the heat conductive member after forming the closed portion.
  • FIG. 8 is a bottom view of the support member included in the heat conduction unit.
  • FIG. 9 is a cross-sectional view showing another configuration of the heat conduction unit.
  • FIG. 10 is a cross-sectional view showing still another configuration of the heat conduction unit.
  • FIG. 11 is a cross-sectional view showing still another configuration of the heat conduction unit.
  • FIG. 12 is a cross-sectional view showing still another configuration of the heat conduction unit.
  • FIG. 13 is a cross-sectional view of the heat conductive member before and after the formation of the closed portion.
  • FIG. 14 is an enlarged cross-sectional view showing a configuration in the vicinity of the outer peripheral region of the heat conductive member.
  • vertical between A and B means that A and B intersect at an angle of 90 °, but an angle within a predetermined range from 90 ° (for example, 90 ° ⁇ 10). Even if they intersect at an angle within the range of °), they are included in the concept of "vertical” and can be treated as “vertical”.
  • parallel between A and B means that the angle between A and B is exactly 0 ° and A and B do not intersect, but the angle between A and B is within a predetermined range. Even if the angle is within (for example, an angle within the range of ⁇ 10 °) and does not intersect, it is included in the concept of “parallel” and can be treated as “parallel”. It was
  • the heat conductive member 10 has a main body region 10M and an outer peripheral region 10C when viewed from one side in the thickness direction (for example, the ⁇ Z direction side).
  • the closed portion 60 has a protruding portion 61 protruding from the outer peripheral region 10C in the ⁇ Y direction, and the protruding portion 61 may be cut off and removed. It was
  • the first plate 4 is a flat metal plate, for example, a copper plate.
  • the first plate 4 may be formed by plating the surface of a metal other than copper with copper.
  • As the metal other than copper for example, stainless steel can be considered.
  • the first plate 4 is located on the + Z direction side with respect to the second plate 5. That is, the heat conductive member 10 has a first plate 4 and a second plate 5 which are located so as to overlap each other in the thickness direction.
  • the support member 20 has a first support portion 21 and a second support portion 22.
  • the first support portion 21 supports the longitudinal portion 10L (see FIG. 6) of the outer peripheral region 10C of the heat conductive member 10 from the ⁇ Z direction. That is, the support member 20 has a first support portion 21 that supports the longitudinal portion 10L of the outer peripheral region 10C. It was
  • the first support portion 21 supports the longitudinal portion 10L, the warp of the longitudinal portion 10L of the heat conductive member 10 that tends to occur due to thermal expansion can be suppressed by the first support portion 21. As a result, it is possible to suppress the warp of the entire heat conductive member 10 due to thermal expansion. It was
  • the second support portion 22 supports the short portion 10S, the warp of the short portion 10S of the heat conductive member 10 due to thermal expansion can be suppressed by the second support portion 22. Thereby, for example, the warp of the entire heat conductive member 10 due to thermal expansion can be further suppressed as compared with the configuration in which the support member 20 supports only the longitudinal portion 10L. It was
  • the portion 21-2 and the first short support portion 22-1 are connected in order. That is, the first support portion 21 and the second support portion 22 are alternately connected along the rectangular outer shape of the heat conductive member 10.
  • the frame-shaped support member 20 is formed when viewed from the ⁇ Z direction. That is, as the support member 20, a frame 20F having a rectangular opening 20P in the center when viewed from the ⁇ Z direction is formed. It was
  • the thickness of the support member 20 can be kept constant, and the first support portion 21 can have higher strength than the second support portion 22.
  • the effect of suppressing the warp of the longitudinal portion 10L of the heat conductive member 10 due to thermal expansion by the first support portion 21 can be enhanced, and the effect of suppressing the warp of the entire heat conductive member 10 can be enhanced.
  • the first support portion 21 and the second support portion 22 of the support member 20 have different widths (WD1> WD2) as described above. Therefore, the first support portion 21 and the second support portion 22 can have different strengths.
  • the supported region 10P supported by a wider support portion eg, first support portion 21
  • a narrower support portion eg, second support portion 22. Higher strength is ensured.
  • the closed portion 60 is located on the supported region 10P having higher strength in the outer peripheral region 10C, the communication hole 60a1 that communicates with the internal space S before the closed portion 60 is formed in the supported region 10P. It can be said that the working medium 2 can be stably injected into the internal internal space S through the communication hole 60a1 before closing.
  • FIG. 15 is an enlarged cross-sectional view showing another configuration in the vicinity of the outer peripheral region 10C of the heat conductive member 10. If T1 + T2 ⁇ T3 is satisfied, T2 + T3 ⁇ TB may be satisfied as shown in the figure. That is, in the thickness direction of the heat conductive member 10, the sum of the thickness of the second joint portion 5C and the thickness of the support member 20 may be smaller than the thickness of the entire second plate 5. It was
  • the second plate 5 has a second flat plate portion 5P, a second wall portion 5W, and a second joint portion 5C. Then, the support member 20 supports the second joint portion 5C. In this configuration, it is desirable that the support member 20 supports the second joint portion 5C at a position where a gap d (mm) is interposed between the support member 20 and the second wall portion 5W.
  • the value of the gap d can be arbitrarily set.
  • the support member 20 and the heat conductive member 10 may be fixed, and the heat conductive member 10 and the housing 40 may be fixed by brazing. Even in this case, the support member 20, the heat conductive member 10, and the housing 40 can be firmly fixed. It was
  • the porous pillar portion 132 may support the first plate 4 and the second plate 5 via the first wick portion 31 and the second wick portion 32.
  • the first flat plate portion 4P of the first plate 4 and the second flat plate portion 5P of the second plate 5 are supported by the solid pillar portion 131 and the porous pillar portion 132.
  • the solid solid column 131 has higher rigidity than the porous porous column 132.
  • the ratio occupied by the solid pillar portion 131 is made larger than the ratio occupied by the porous pillar portion 132, so that the first flat plate portion 4P of the first plate 4 and the second plate 5 are second.
  • the position accuracy of the flat plate portion 5P is improved, and deformation due to the pressure difference between the inside and outside is suppressed. It was
  • the heat conductive member 10 of the heat conductive unit 1 is configured by a vapor chamber
  • the heat conductive member 10 is not limited to the vapor chamber.
  • the heat conductive member 10 may be a single metal plate such as a copper plate and a graphite sheet, or may be a heat pipe.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

This thermal conductive unit comprises a thermal conductive member having an internal space for accommodating a working medium, and a support member for supporting the thermal conductive member. The thermal conductive member has a body area, an outer peripheral area located along the outer periphery of the body area when viewed from the thickness direction of the thermal conductive member, and a pole part placed in the internal space. The support member supports at least part of the outer peripheral area.

Description

熱伝導ユニットおよび冷却装置Heat conduction unit and cooling device
本発明は、熱伝導ユニットおよび冷却装置に関する。 The present invention relates to a heat conduction unit and a cooling device.
従来から、熱伝導部材として平板状のベーパーチャンバーが提案されている（例えば特許文献１参照）。 Conventionally, a flat plate-shaped vapor chamber has been proposed as a heat conductive member (see, for example, Patent Document 1).
日本国公開公報：特開２０１９－１９４５１５号公報Japanese Publication: Japanese Patent Application Laid-Open No. 2019-194515
発熱体を冷却するために、熱伝導部材を発熱体に接触して配置したとき、発熱体が発熱して高温になると、発熱体の熱によって熱伝導部材が膨張し、反りが発生する虞がある。　 When the heat conductive member is placed in contact with the heat generating element in order to cool the heating element, if the heating element generates heat and becomes high in temperature, the heat conducting member may expand due to the heat of the heating element and warp may occur. be. It was
本発明は、上記の点に鑑み、熱伝導部材が熱膨張して反りが発生することを抑制することができる熱伝導ユニットと、その熱伝導ユニットを備えた冷却装置とを提供することを目的とする。 In view of the above points, it is an object of the present invention to provide a heat conduction unit capable of suppressing thermal expansion of a heat conduction member from generation of warpage, and a cooling device provided with the heat conduction unit. And.
本発明の例示的な熱伝導ユニットは、作動媒体が収容される内部空間を有する熱伝導部材と、前記熱伝導部材を支持する支持部材と、を備え、前記熱伝導部材は、本体領域と、前記熱伝導部材の厚み方向から見て前記本体領域の外周に沿って位置する外周領域と、前記内部空間に配置される柱部と、を有し、前記支持部材は、前記外周領域の少なくとも一部を支持する。 The exemplary heat conduction unit of the present invention includes a heat conduction member having an internal space for accommodating the working medium and a support member for supporting the heat conduction member, and the heat conduction member includes a main body region and a main body region. It has an outer peripheral region located along the outer periphery of the main body region when viewed from the thickness direction of the heat conductive member, and a pillar portion arranged in the internal space, and the support member is at least one of the outer peripheral regions. Support the club.
本発明によると、熱伝導部材が熱膨張して反りが発生することを抑制することができる。 According to the present invention, it is possible to prevent the heat conductive member from thermally expanding and causing warpage.
図１は、本発明の一実施形態の熱伝導ユニットを下方から見たときの斜視図である。FIG. 1 is a perspective view of the heat conduction unit according to the embodiment of the present invention when viewed from below. 図２は、図１の熱伝導ユニットの分解斜視図である。FIG. 2 is an exploded perspective view of the heat conduction unit of FIG. 1. 図３は、図１の熱伝導ユニットをＡ－Ａ線を含むＺＸ断面で切断したときの断面図である。FIG. 3 is a cross-sectional view when the heat conduction unit of FIG. 1 is cut in a ZX cross section including the AA line. 図４は、図１の熱伝導ユニットをＢ－Ｂ線を含むＹＺ断面で切断したときの断面図である。FIG. 4 is a cross-sectional view when the heat conduction unit of FIG. 1 is cut in a YZ cross section including the BB line. 図５は、図１の熱伝導ユニットをＣ－Ｃ線を含むＹＺ断面で切断したときの断面図である。FIG. 5 is a cross-sectional view when the heat conduction unit of FIG. 1 is cut in a YZ cross section including the CC line. 図６は、熱伝導ユニットが有する熱伝導部材の底面図である。FIG. 6 is a bottom view of the heat conductive member included in the heat conductive unit. 図７は、閉鎖部を形成した後の熱伝導部材の斜視図である。FIG. 7 is a perspective view of the heat conductive member after forming the closed portion. 図８は、熱伝導ユニットが有する支持部材の底面図である。FIG. 8 is a bottom view of the support member included in the heat conduction unit. 図９は、熱伝導ユニットの他の構成を示す断面図である。FIG. 9 is a cross-sectional view showing another configuration of the heat conduction unit. 図１０は、熱伝導ユニットのさらに他の構成を示す断面図である。FIG. 10 is a cross-sectional view showing still another configuration of the heat conduction unit. 図１１は、熱伝導ユニットのさらに他の構成を示す断面図である。FIG. 11 is a cross-sectional view showing still another configuration of the heat conduction unit. 図１２は、熱伝導ユニットのさらに他の構成を示す断面図である。FIG. 12 is a cross-sectional view showing still another configuration of the heat conduction unit. 図１３は、閉鎖部の形成前後での熱伝導部材の断面図である。FIG. 13 is a cross-sectional view of the heat conductive member before and after the formation of the closed portion. 図１４は、熱伝導部材の外周領域付近の構成を拡大して示す断面図である。FIG. 14 is an enlarged cross-sectional view showing a configuration in the vicinity of the outer peripheral region of the heat conductive member. 図１５は、熱伝導部材の外周領域付近の他の構成を拡大して示す断面図である。FIG. 15 is an enlarged cross-sectional view showing another configuration in the vicinity of the outer peripheral region of the heat conductive member. 図１６は、熱伝導部材の外周領域付近のさらに他の構成を拡大して示す断面図である。FIG. 16 is an enlarged cross-sectional view showing still another configuration in the vicinity of the outer peripheral region of the heat conductive member. 図１７は、冷却装置の概略の構成を示す断面図である。FIG. 17 is a cross-sectional view showing a schematic configuration of the cooling device. 図１８は、図１７とは異なる断面での冷却装置の断面図である。FIG. 18 is a cross-sectional view of the cooling device having a cross section different from that of FIG. 図１９は、支持部材の他の構成を示す底面図である。FIG. 19 is a bottom view showing another configuration of the support member. 図２０は、支持部材のさらに他の構成を示す底面図である。FIG. 20 is a bottom view showing still another configuration of the support member. 図２１は、熱伝導部材の他の構成を示す斜視図である。FIG. 21 is a perspective view showing another configuration of the heat conductive member. 図２２は、変形例の熱伝導ユニットの分解斜視図である。FIG. 22 is an exploded perspective view of the heat conduction unit of the modified example. 図２３は、熱伝導ユニットをＺＸ断面で切断した断面図である。FIG. 23 is a cross-sectional view of the heat conduction unit cut along the ZX cross section. 図２４は、熱伝導ユニットの他の例をＹＺ断面で切断した断面図である。FIG. 24 is a cross-sectional view taken along the YZ cross section of another example of the heat conduction unit. 図２５は、さらに別の変形例の熱伝導ユニットのＹＺ断面で切断した断面図である。FIG. 25 is a cross-sectional view taken along the YZ cross section of the heat conduction unit of yet another modification. 図２６は、図２５に示す熱伝導ユニットのＺＸ断面で切断した断面図である。FIG. 26 is a cross-sectional view taken along the ZX cross section of the heat conduction unit shown in FIG. 25. 図２７は、変形例の熱伝導ユニットのＺＸ平面と平行な平面で切断した断面図である。FIG. 27 is a cross-sectional view taken along a plane parallel to the ZX plane of the heat conduction unit of the modified example.
以下、本発明の例示的な実施形態について、図面を参照しながら詳細に説明する。なお、図面においては、適宜、３次元直交座標系としてＸＹＺ座標系を示す。ＸＹＺ座標系において、Ｚ軸方向は、鉛直方向（すなわち上下方向）を示し、＋Ｚ方向が上側（重力方向の反対側）であり、－Ｚ方向が下側（重力方向）である。Ｚ軸方向は、後述する本実施形態の熱伝導ユニット、熱伝導部材および支持部材の厚み方向でもある。Ｘ軸方向は、Ｚ軸方向と直交する方向を指し、その正逆方向を、それぞれ＋Ｘ方向および－Ｘ方向とする。Ｙ軸方向は、Ｚ軸方向およびＸ軸方向の両方向と直交する方向を指し、その正逆方向を、それぞれ＋Ｙ方向および－Ｙ方向とする。　 Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the XYZ coordinate system is shown as a three-dimensional Cartesian coordinate system as appropriate. In the XYZ coordinate system, the Z-axis direction indicates a vertical direction (that is, a vertical direction), the + Z direction is the upper side (opposite the gravity direction), and the −Z direction is the lower side (gravity direction). The Z-axis direction is also the thickness direction of the heat conduction unit, the heat conduction member, and the support member of the present embodiment described later. The X-axis direction refers to a direction orthogonal to the Z-axis direction, and the forward and reverse directions thereof are the + X direction and the −X direction, respectively. The Y-axis direction refers to a direction orthogonal to both the Z-axis direction and the X-axis direction, and the forward and reverse directions thereof are the + Y direction and the −Y direction, respectively. It was
本明細書において、ＡとＢとが「垂直」であるとは、厳密にＡとＢとが９０°の角度で交わることを指すが、９０°から所定範囲内の角度（例えば９０°±１０°の範囲内の角度）で交わる場合も「垂直」の概念に含まれるとし、「垂直」として扱うことができるとする。また、ＡとＢとが「平行」であるとは、厳密にＡとＢとのなす角度が０°でＡとＢとが交わらないことを指すが、ＡとＢとのなす角度が所定範囲内の角度（例えば±１０°の範囲内の角度）であって、交わっていない場合も「平行」の概念に含まれるとし、「平行」として扱うことができるとする。　 In the present specification, "vertical" between A and B means that A and B intersect at an angle of 90 °, but an angle within a predetermined range from 90 ° (for example, 90 ° ± 10). Even if they intersect at an angle within the range of °), they are included in the concept of "vertical" and can be treated as "vertical". Further, "parallel" between A and B means that the angle between A and B is exactly 0 ° and A and B do not intersect, but the angle between A and B is within a predetermined range. Even if the angle is within (for example, an angle within the range of ± 10 °) and does not intersect, it is included in the concept of “parallel” and can be treated as “parallel”. It was
本明細書において、ＡとＢとが「つながる」とは、ＡとＢとが機械的に「接続」または「連結」されることを意味し、ＡとＢとが電気的に接続されることを意味しない。また、空間を介さずに２部材を接触させて物理的、機械的な方法（例えば後述するホットプレス）等でつなぎ合わせることを、「接合する」と表現する場合もある。　 As used herein, "connecting" A and B means that A and B are mechanically "connected" or "connected", and that A and B are electrically connected. Does not mean. Further, the process of bringing two members into contact with each other without passing through a space and connecting them by a physical or mechanical method (for example, a hot press described later) may be expressed as "joining". It was
本明細書において、２部材の間に形成された孔が、一方の部材が物理的に変形して他の部材と接触することによって閉じることを、ここでは「閉鎖」と呼ぶ。「閉鎖」は、孔等の空間が間に存在している２部材を接触させる点で、間に空間が存在せず、最初から接触している２部材をつなぎ合わせる上記の「接合」とは区別される。　 In the present specification, closing a hole formed between two members by physically deforming one member and contacting the other member is referred to as "closing" here. "Closed" is the point where two members with a space such as a hole come into contact with each other, and the above-mentioned "joining" that connects two members that have no space between them and are in contact from the beginning. Distinguished. It was
〔１．熱伝導ユニットの概要〕



図１は、本実施形態の熱伝導ユニット１を下方から見たときの斜視図である。図２は、図１の熱伝導ユニット１の分解斜視図である。図３は、図１の熱伝導ユニット１をＡ－Ａ線を含むＺＸ断面で切断したときの断面図である。図４は、図１の熱伝導ユニット１をＢ－Ｂ線を含むＹＺ断面で切断したときの断面図である。図５は、図１の熱伝導ユニット１をＣ－Ｃ線を含むＹＺ断面で切断したときの断面図である。なお、図１および図２では、便宜的に、図３に示す発熱体Ｈの図示を省略している。また、図１では、熱伝導部材１０において連通部６０ａを示しているが、これは連通部６０ａの説明の便宜のためであり、熱伝導ユニット１として実際に使用される場合は、図７に示すように、連通部６０ａの少なくとも一部を押し潰して閉鎖部６０を形成した状態で使用される。　 [1. Overview of heat conduction unit]



FIG. 1 is a perspective view of the heat conduction unit 1 of the present embodiment as viewed from below. FIG. 2 is an exploded perspective view of the heat conduction unit 1 of FIG. FIG. 3 is a cross-sectional view when the heat conduction unit 1 of FIG. 1 is cut along a ZX cross section including the AA line. FIG. 4 is a cross-sectional view when the heat conduction unit 1 of FIG. 1 is cut in a YZ cross section including the BB line. FIG. 5 is a cross-sectional view when the heat conduction unit 1 of FIG. 1 is cut along a YZ cross section including a CC line. Note that in FIGS. 1 and 2, for convenience, the heating element H shown in FIG. 3 is not shown. Further, in FIG. 1, the communication portion 60a is shown in the heat conduction member 10, but this is for convenience of explanation of the communication portion 60a, and when it is actually used as the heat conduction unit 1, it is shown in FIG. As shown, it is used in a state where at least a part of the communication portion 60a is crushed to form the closed portion 60.
熱伝導ユニット１は、熱伝導部材１０と、支持部材２０と、フィン３０と、を備える。なお、フィン３０の設置を省略して熱伝導ユニット１を構成することも可能である。　 The heat conduction unit 1 includes a heat conduction member 10, a support member 20, and fins 30. It is also possible to configure the heat conduction unit 1 by omitting the installation of the fins 30. It was
熱伝導部材１０は、発熱体Ｈ（図３参照）と接触して配置され、発熱体Ｈの熱を輸送して外部に放出する。上記の発熱体Ｈは、例えばインバータのパワートランジスタである。上記インバータは、例えば車両の車輪を駆動するためのトラクションモータに設けられる。この場合、上記パワートランジスタは、例えばＩＧＢＴ（Insulated Gate Bipolar Transistor）である。つまり、本実施形態の熱伝導ユニット１は、例えばＩＧＢＴ用途に用いられて、ＩＧＢＴを冷却する。　 The heat conductive member 10 is arranged in contact with the heating element H (see FIG. 3), transports the heat of the heating element H, and releases it to the outside. The heating element H is, for example, a power transistor of an inverter. The inverter is provided in, for example, a traction motor for driving the wheels of a vehicle. In this case, the power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor). That is, the heat conduction unit 1 of the present embodiment is used, for example, for an IGBT application to cool the IGBT. It was
なお、熱伝導ユニット１は、他の用途に用いられてもよい。例えば、熱伝導ユニット１は、電子機器用途に用いられてもよい。電子機器用途では、熱伝導ユニット１は、スマートフォンまたはノート型パーソナルコンピュータなどの電子機器に搭載されて、電子機器内の電子部品または基板を冷却する。 The heat conduction unit 1 may be used for other purposes. For example, the heat conduction unit 1 may be used for electronic device applications. In electronic device applications, the heat transfer unit 1 is mounted on an electronic device such as a smartphone or a notebook personal computer to cool an electronic component or substrate in the electronic device.
本実施形態では、熱伝導部材１０に対して－Ｚ方向側に発熱体Ｈが接触して位置する。また、熱伝導部材１０に対して＋Ｚ方向側にフィン３０が位置する。この構成では、発熱体Ｈで発生した熱は、熱伝導部材１０により＋Ｚ方向側に伝導され、フィン３０を介して外部に放出される。したがって、本実施形態では、熱伝導部材１０に対して－Ｚ方向側が発熱側であり、＋Ｚ方向側が放熱側である。　 In the present embodiment, the heating element H is located in contact with the heat conductive member 10 on the −Z direction side. Further, the fin 30 is located on the + Z direction side with respect to the heat conductive member 10. In this configuration, the heat generated by the heating element H is conducted in the + Z direction by the heat conductive member 10 and discharged to the outside through the fins 30. Therefore, in the present embodiment, the side in the −Z direction is the heat generation side and the side in the + Z direction is the heat dissipation side with respect to the heat conductive member 10. It was
支持部材２０は、発熱体Ｈと異なる位置で熱伝導部材１０と接触する。本実施形態では、図３に示すように、支持部材２０は、発熱体Ｈと異なる位置で、熱伝導部材１０を－Ｚ方向側から、つまり、下方から支持する。なお、支持部材２０は、熱伝導部材１０に対して＋Ｚ方向側に取り付けられて、熱伝導部材１０を上方から支持してもよい（図９参照）。また、支持部材２０は、熱伝導部材１０を上方および下方の両方から支持してもよい（図１０参照）。さらに、支持部材２０は、熱伝導部材１０を上方および下方から挟み込んで支持してもよい（図１１参照）。すなわち、熱伝導ユニット１は、熱伝導部材１０と、熱伝導部材１０を支持する支持部材２０と、を備える。　 The support member 20 comes into contact with the heat conductive member 10 at a position different from that of the heating element H. In the present embodiment, as shown in FIG. 3, the support member 20 supports the heat conductive member 10 from the −Z direction side, that is, from below, at a position different from the heating element H. The support member 20 may be attached to the heat conductive member 10 on the + Z direction side to support the heat conductive member 10 from above (see FIG. 9). Further, the support member 20 may support the heat conductive member 10 from both above and below (see FIG. 10). Further, the support member 20 may support the heat conductive member 10 by sandwiching it from above and below (see FIG. 11). That is, the heat conduction unit 1 includes a heat conduction member 10 and a support member 20 that supports the heat conduction member 10. It was
フィン３０は、熱伝導部材１０に対して放熱側（＋Ｚ方向側）に位置する。フィン３０は、例えばスタックドフィン３０Ｓ（図３～図５参照）で構成される。スタックドフィン３０Ｓは、金属製のベース３０ａと、複数の金属板３０ｂと、を有する。ベース３０ａは、熱伝導部材１０と接触する板状の部材である。金属板３０ｂは、ベース３０ａ上でＹ方向（またはＸ方向）に所定間隔で並べて配置される。ベース３０ａおよび金属板３０ｂを構成する金属としては、例えば、銅、アルミニウム、合金など、熱伝導率の高い材料が用いられる。　 The fin 30 is located on the heat dissipation side (+ Z direction side) with respect to the heat conductive member 10. The fin 30 is composed of, for example, a stacked fin 30S (see FIGS. 3 to 5). The stacked fin 30S has a metal base 30a and a plurality of metal plates 30b. The base 30a is a plate-shaped member that comes into contact with the heat conductive member 10. The metal plates 30b are arranged side by side on the base 30a in the Y direction (or the X direction) at predetermined intervals. As the metal constituting the base 30a and the metal plate 30b, a material having high thermal conductivity such as copper, aluminum, and an alloy is used. It was
このように、本実施形態の熱伝導ユニット１は、熱伝導部材１０の放熱側に位置するフィン３０を備える。この構成では、フィン３０を例えば空冷または水冷することにより、熱伝導部材１０の放熱効率を向上させることができる。　 As described above, the heat conduction unit 1 of the present embodiment includes fins 30 located on the heat dissipation side of the heat conduction member 10. In this configuration, the heat dissipation efficiency of the heat conductive member 10 can be improved by, for example, air-cooling or water-cooling the fins 30. It was
なお、フィン３０は、ピンフィンで構成されてもよい。ピンフィンは、金属製のベース上に、複数の円柱状の金属製のピンをＸ方向およびＹ方向に所定の間隔で並べて配置することによって構成される。Ｚ方向から見たときに、Ｘ方向に１列に並ぶ複数のピンフィンと、上記複数のピンフィンとＹ方向に隣り合って位置してＸ方向に並ぶ他の列の複数のピンフィンとは、Ｘ方向に半ピッチずれて位置する。フィン３０は、他の金属板を介して熱伝導部材１０上に位置してもよい。　 The fin 30 may be composed of pin fins. The pin fin is configured by arranging a plurality of columnar metal pins arranged side by side at predetermined intervals in the X direction and the Y direction on a metal base. When viewed from the Z direction, the plurality of pin fins arranged in one row in the X direction and the plurality of pin fins in the other row located adjacent to the plurality of pin fins in the Y direction and arranged in the X direction are in the X direction. It is located half a pitch off. The fin 30 may be located on the heat conductive member 10 via another metal plate. It was
以下、上記した熱伝導部材１０および支持部材２０の詳細について、図１～図５を参照しつつ、さらに他の図面も参照して説明する。図６は、熱伝導部材１０を－Ｚ方向側から見たときの底面図である。図７は、連通部６０ａの一部を押し潰して閉鎖部６０を形成した後の熱伝導部材１０の斜視図である。　 Hereinafter, the details of the heat conductive member 10 and the support member 20 described above will be described with reference to FIGS. 1 to 5 and further with reference to other drawings. FIG. 6 is a bottom view of the heat conductive member 10 when viewed from the −Z direction side. FIG. 7 is a perspective view of the heat conductive member 10 after a part of the communication portion 60a is crushed to form the closed portion 60. It was
〔２．熱伝導部材〕



まず、熱伝導部材１０を厚み方向から見たときの各領域について説明する。図６に示すように、熱伝導部材１０は、厚み方向の一方側（例えば－Ｚ方向側）から見て、本体領域１０Ｍと、外周領域１０Ｃと、を有する。　 [2. Heat conduction member]



First, each region when the heat conductive member 10 is viewed from the thickness direction will be described. As shown in FIG. 6, the heat conductive member 10 has a main body region 10M and an outer peripheral region 10C when viewed from one side in the thickness direction (for example, the −Z direction side).
（本体領域）



本体領域１０Ｍは、発熱体Ｈで発生した熱を伝導する領域であり、後述する作動媒体２（図３参照）を収容する領域でもある。外周領域１０Ｃは、－Ｚ方向から見て、本体領域１０Ｍの外周に沿って位置する。すなわち、熱伝導部材１０は、本体領域１０Ｍと、熱伝導部材１０の厚み方向から見て本体領域１０Ｍの外周に沿って位置する外周領域１０Ｃと、を有する。　 (Main body area)



The main body region 10M is a region for conducting heat generated by the heating element H, and is also a region for accommodating the working medium 2 (see FIG. 3) described later. The outer peripheral region 10C is located along the outer peripheral region of the main body region 10M when viewed from the −Z direction. That is, the heat conductive member 10 has a main body region 10M and an outer peripheral region 10C located along the outer circumference of the main body region 10M when viewed from the thickness direction of the heat conductive member 10.
本実施形態では、－Ｚ方向から見て、熱伝導部材１０の外形は矩形である。すなわち、熱伝導部材１０は、厚み方向から見て矩形の外形を有する。そして、－Ｚ方向から見たとき、本体領域１０Ｍは矩形状であり、外周領域１０Ｃは枠状である。なお、本実施形態では、便宜的に、－Ｚ方向から見て、熱伝導部材１０の矩形の長手方向をＸ方向とし、短手方向をＹ方向とする。　 In the present embodiment, the outer shape of the heat conductive member 10 is rectangular when viewed from the −Z direction. That is, the heat conductive member 10 has a rectangular outer shape when viewed from the thickness direction. When viewed from the −Z direction, the main body region 10M has a rectangular shape, and the outer peripheral region 10C has a frame shape. In the present embodiment, for convenience, the longitudinal direction of the rectangle of the heat conductive member 10 is the X direction and the lateral direction is the Y direction when viewed from the −Z direction. It was
なお、図６では、閉鎖部６０の形成前の連通部６０ａが－Ｙ方向に突出しているため、熱伝導部材１０の外形が矩形であるとは正確には言いにくい。しかし、図７に示すように、連通部６０ａを押し潰して閉鎖部６０を形成した後、連通部６０ａの突出した部分に相当する突出部６１が後述のように切断されると、熱伝導部材１０の外形は－Ｚ方向から見て矩形であると言うことができる。　 In FIG. 6, since the communication portion 60a before the formation of the closed portion 60 protrudes in the −Y direction, it is difficult to say that the outer shape of the heat conductive member 10 is rectangular. However, as shown in FIG. 7, after the communicating portion 60a is crushed to form the closed portion 60, when the protruding portion 61 corresponding to the protruding portion of the communicating portion 60a is cut as described later, the heat conductive member It can be said that the outer shape of 10 is a rectangle when viewed from the −Z direction. It was
（外周領域）



外周領域１０Ｃは、長手部１０Ｌと、短手部１０Ｓと、を有する。長手部１０Ｌは、Ｘ方向に沿って延びる。すなわち、外周領域１０Ｃは、矩形の長手方向に沿って延びる長手部１０Ｌを有する。長手部１０Ｌは、２本の長手部、つまり、第１長手部１０Ｌ－１および第２長手部１０Ｌ－２を有する。第１長手部１０Ｌ－１および第２長手部１０Ｌ－２は、Ｙ方向に互いに離間した位置で、Ｘ方向に沿ってそれぞれ延びる。　 (Outer circumference area)



The outer peripheral region 10C has a longitudinal portion 10L and a lateral portion 10S. The longitudinal portion 10L extends along the X direction. That is, the outer peripheral region 10C has a longitudinal portion 10L extending along the longitudinal direction of the rectangle. The longitudinal portion 10L has two longitudinal portions, that is, a first longitudinal portion 10L-1 and a second longitudinal portion 10L-2. The first longitudinal portion 10L-1 and the second longitudinal portion 10L-2 extend in the X direction at positions separated from each other in the Y direction.
短手部１０Ｓは、Ｙ方向に沿って延びる。すなわち、外周領域１０Ｃは、矩形の短手方向に沿って延びる短手部１０Ｓを有する。短手部１０Ｓは、２本の短手部、つまり、第１短手部１０Ｓ－１および第２短手部１０Ｓ－２を有する。第１短手部１０Ｓ－１および第２短手部１０Ｓ－２は、Ｘ方向に互いに離間した位置で、Ｙ方向に沿ってそれぞれ延びる。　 The short portion 10S extends along the Y direction. That is, the outer peripheral region 10C has a short portion 10S extending along the short side direction of the rectangle. The short portion 10S has two short portions, that is, a first short portion 10S-1 and a second short portion 10S-2. The first short hand portion 10S-1 and the second short hand portion 10S-2 extend in the Y direction at positions separated from each other in the X direction. It was
第１長手部１０Ｌ－１の＋Ｘ方向側の端部は、第１短手部１０Ｓ－１の－Ｙ方向側の端部とつながる。第１長手部１０Ｌ－１の－Ｘ方向側の端部は、第２短手部１０Ｓ－２の－Ｙ方向側の端部とつながる。第２長手部１０Ｌ－２の＋Ｘ方向側の端部は、第１短手部１０Ｓ－１の＋Ｙ方向側の端部とつながる。第２長手部１０Ｌ－２の－Ｘ方向側の端部は、第２短手部１０Ｓ－２の＋Ｙ方向側の端部とつながる。これにより、－Ｚ方向側から見て反時計回りに、第１長手部１０Ｌ－１、第２短手部１０Ｓ－２、第２長手部１０Ｌ－２、および第１短手部１０Ｓ－１が順につながる。その結果、－Ｚ方向から見て枠状の外周領域１０Ｃが形成される。　 The end portion of the first longitudinal portion 10L-1 on the + X direction side is connected to the end portion of the first short end portion 10S-1 on the −Y direction side. The end portion of the first longitudinal portion 10L-1 on the −X direction side is connected to the end portion of the second short portion 10S-2 on the −Y direction side. The end of the second longitudinal portion 10L-2 on the + X direction side is connected to the end of the first short portion 10S-1 on the + Y direction side. The end portion of the second longitudinal portion 10L-2 on the −X direction side is connected to the end portion of the second short portion 10S-2 on the + Y direction side. As a result, the first longitudinal portion 10L-1, the second lateral portion 10S-2, the second longitudinal portion 10L-2, and the first lateral portion 10S-1 are arranged counterclockwise when viewed from the −Z direction side. Connect in order. As a result, a frame-shaped outer peripheral region 10C is formed when viewed from the −Z direction. It was
後述するように、支持部材２０は、第１貫通孔２０ａ（図５参照）を有する。外周領域１０Ｃは、第２貫通孔１０ａを有する。第２貫通孔１０ａは、外周領域１０ＣをＺ方向に貫通する孔である。第２貫通孔１０ａは、第１貫通孔２０ａとＺ方向において重なって位置する。第２貫通孔１０ａは、後述する第１プレート４の第１開口部４ａと、後述する第２プレート５の第２開口部５ａと、をＺ方向に重ね合わせて構成される。　 As will be described later, the support member 20 has a first through hole 20a (see FIG. 5). The outer peripheral region 10C has a second through hole 10a. The second through hole 10a is a hole that penetrates the outer peripheral region 10C in the Z direction. The second through hole 10a is located so as to overlap the first through hole 20a in the Z direction. The second through hole 10a is configured by superimposing the first opening 4a of the first plate 4 described later and the second opening 5a of the second plate 5 described later in the Z direction. It was
第１貫通孔２０ａおよび第２貫通孔１０ａには、締結部材５０（図５参照）が挿入される。締結部材５０は、例えばボルトまたはビスである。第１貫通孔２０ａおよび第２貫通孔１０ａへの締結部材５０の挿入後に、締結部材５０の先端をナットで固定することにより、熱伝導部材１０と支持部材２０とが締結（共締め）される。なお、ナットを用いず、締結部材５０の先端をかしめる等により、熱伝導部材１０と支持部材２０とが締結されてもよい。なお、図６では、外周領域１０Ｃに合計１６個の第２貫通孔１０ａが図示されているが、第２貫通孔１０ａの個数は、任意に設定されればよい。また、外周領域１０Ｃにおける第２貫通孔１０ａの形成位置も任意に設定されればよい。　 A fastening member 50 (see FIG. 5) is inserted into the first through hole 20a and the second through hole 10a. The fastening member 50 is, for example, a bolt or a screw. After inserting the fastening member 50 into the first through hole 20a and the second through hole 10a, the heat conductive member 10 and the support member 20 are fastened (co-tightened) by fixing the tip of the fastening member 50 with a nut. .. The heat conductive member 10 and the support member 20 may be fastened by crimping the tip of the fastening member 50 without using a nut. Although a total of 16 second through holes 10a are shown in the outer peripheral region 10C in FIG. 6, the number of the second through holes 10a may be arbitrarily set. Further, the formation position of the second through hole 10a in the outer peripheral region 10C may be arbitrarily set. It was
次に、熱伝導部材１０の断面構成について説明する。図３～図５に示すように、熱伝導部材１０は、作動媒体２と、ウィック構造体３と、第１プレート４と、第２プレート５と、を備える。　 Next, the cross-sectional structure of the heat conductive member 10 will be described. As shown in FIGS. 3 to 5, the heat conductive member 10 includes a working medium 2, a wick structure 3, a first plate 4, and a second plate 5. It was
（作動媒体）



作動媒体２は、熱を輸送するために熱伝導部材１０の内部空間Ｓに収容される。作動媒体２は、例えば水であるが、アルコールなどの他の液体であってもよい。作動媒体２は、支持部材２０で熱伝導部材１０が支持された後、連通孔６０ａ１（図１３参照）を有する連通部６０ａを介して内部空間Ｓに注入される。作動媒体２の内部空間Ｓへの注入後は、図７に示すように、押圧部材７０によって連通部６０ａの一部が押し潰される。これにより、連通部６０ａの連通孔６０ａ１が閉じられて、内部空間Ｓの閉鎖部６０が形成される。　 (Operating medium)



The working medium 2 is housed in the internal space S of the heat conductive member 10 to transport heat. The working medium 2 is, for example, water, but may be another liquid such as alcohol. After the heat conductive member 10 is supported by the support member 20, the working medium 2 is injected into the internal space S through the communication portion 60a having the communication hole 60a1 (see FIG. 13). After the actuating medium 2 is injected into the internal space S, as shown in FIG. 7, a part of the communication portion 60a is crushed by the pressing member 70. As a result, the communication hole 60a1 of the communication portion 60a is closed, and the closed portion 60 of the internal space S is formed.
なお、図７では、連通部６０ａの一部のみを押圧部材７０で押し潰して閉鎖部６０を形成しているが、連通部６０ａの全体を押し潰して閉鎖部６０を形成してもよい。また、図７では、閉鎖部６０は、外周領域１０Ｃから－Ｙ方向側に突出する突出部６１を有しているが、この突出部６１は切断されて除去されてもよい。　 In FIG. 7, only a part of the communication portion 60a is crushed by the pressing member 70 to form the closed portion 60, but the entire communicating portion 60a may be crushed to form the closed portion 60. Further, in FIG. 7, the closed portion 60 has a protruding portion 61 protruding from the outer peripheral region 10C in the −Y direction, and the protruding portion 61 may be cut off and removed. It was
内部空間Ｓは密閉空間であり、例えば大気圧よりも気圧が低い減圧状態に維持される。内部空間Ｓが減圧状態であることにより、内部空間Ｓに収容される作動媒体２が蒸発しやすくなる。熱伝導部材１０のＺ方向の厚みは、ＩＧＢＴ用途では例えば３ｍｍ以上であり、電子機器用途では例えば０．３ｍｍ以下である。　 The internal space S is a closed space, and is maintained in a decompressed state where the atmospheric pressure is lower than the atmospheric pressure, for example. When the internal space S is in a decompressed state, the working medium 2 housed in the internal space S is likely to evaporate. The thickness of the heat conductive member 10 in the Z direction is, for example, 3 mm or more for IGBT applications and 0.3 mm or less for electronic device applications. It was
（ウィック構造体）



図３等に示すウィック構造体３は、熱伝導部材１０において作動媒体２の内部空間Ｓ内に位置する。ウィック構造体３は、多孔質のウィック構造を有し、毛細管現象によって作動媒体２を輸送する。このようなウィック構造体３は、例えば銅の焼結体で構成される。なお、「焼結」とは、金属の粉末または上記金属を含むペーストを、上記金属の融点よりも低い温度まで加熱して、上記金属の粒子を焼き固める技術を指す。そして、「焼結体」とは、焼結によって得られる物体を指す。ウィック構造体３の厚みは、ＩＧＢＴ用途では例えば１ｍｍ以下であり、電子機器用途では例えば０．１ｍｍ以下である。ウィック構造体３は、上記した本体領域１０Ｍに位置する。　 (Wick structure)



The wick structure 3 shown in FIG. 3 and the like is located in the internal space S of the working medium 2 in the heat conductive member 10. The wick structure 3 has a porous wick structure and transports the working medium 2 by a capillary phenomenon. Such a wick structure 3 is composed of, for example, a copper sintered body. The term "sintering" refers to a technique of heating a metal powder or a paste containing the metal to a temperature lower than the melting point of the metal to bake and harden the metal particles. The "sintered body" refers to an object obtained by sintering. The thickness of the wick structure 3 is, for example, 1 mm or less for IGBT applications and 0.1 mm or less for electronic device applications. The wick structure 3 is located in the main body region 10M described above.
なお、ウィック構造体３は、内部空間Ｓ内で、毛細管現象によって作動媒体２を輸送できる構造であればよい。したがって、ウィック構造体３は、上記した多孔質のウィック構造（焼結ウィック）のほか、金属メッシュからなるメッシュウィック、溝構造を有するグルーブウィックであってもよい。　 The wick structure 3 may be any structure as long as it can transport the working medium 2 by the capillary phenomenon in the internal space S. Therefore, the wick structure 3 may be a mesh wick made of a metal mesh or a groove wick having a groove structure, in addition to the porous wick structure (sintered wick) described above. It was
（第１プレート）



第１プレート４は、平板状の金属板であり、例えば銅板である。なお、第１プレート４は、銅以外の金属の表面に銅メッキを施して形成されてもよい。銅以外の金属としては、例えばステンレス鋼が考えられる。第１プレート４は、第２プレート５に対して＋Ｚ方向側に位置する。すなわち、熱伝導部材１０は、厚み方向に重なって位置する第１プレート４および第２プレート５を有する。　 (1st plate)



The first plate 4 is a flat metal plate, for example, a copper plate. The first plate 4 may be formed by plating the surface of a metal other than copper with copper. As the metal other than copper, for example, stainless steel can be considered. The first plate 4 is located on the + Z direction side with respect to the second plate 5. That is, the heat conductive member 10 has a first plate 4 and a second plate 5 which are located so as to overlap each other in the thickness direction.
第１プレート４は、第１平板部４Ｐと、第１接合部４Ｃと、を有する。第１平板部４Ｐは、本体領域１０Ｍに位置し、＋Ｚ方向と交差する方向（例えばＸ方向およびＹ方向）に延びる。なお、第１平板部４Ｐは、平板部Ｐの一例である。第１接合部４Ｃは、外周領域１０Ｃに位置し、Ｚ方向において第１平板部４Ｐと同じ位置で、第１平板部４Ｐとつながる。また、第１接合部４Ｃは、後述する凹部５Ｋの外側で、つまり、凹部５Ｋ内の内部空間Ｓの外側で、第２プレート５の後述する第２接合部５ＣとＺ方向につながる。すなわち、第１プレート４は、内部空間Ｓの外側で第２プレート５とつながる第１接合部４Ｃを有する。　 The first plate 4 has a first flat plate portion 4P and a first joint portion 4C. The first flat plate portion 4P is located in the main body region 10M and extends in a direction intersecting the + Z direction (for example, the X direction and the Y direction). The first flat plate portion 4P is an example of the flat plate portion P. The first joint portion 4C is located in the outer peripheral region 10C and is connected to the first flat plate portion 4P at the same position as the first flat plate portion 4P in the Z direction. Further, the first joint portion 4C is connected to the second joint portion 5C described later of the second plate 5 in the Z direction on the outside of the recess 5K described later, that is, on the outside of the internal space S in the recess 5K. That is, the first plate 4 has a first joint portion 4C connected to the second plate 5 outside the internal space S. It was
第１接合部４Ｃには、Ｚ方向に貫通する第１開口部４ａ（図５参照）が設けられる。第１接合部４Ｃにおいて、第１開口部４ａは、後述する第２プレート５の第２開口部５ａとＺ方向において重なって位置する。第１開口部４ａと第２開口部５ａとで、第２貫通孔１０ａが形成される。　 The first joint portion 4C is provided with a first opening portion 4a (see FIG. 5) penetrating in the Z direction. In the first joint portion 4C, the first opening portion 4a is positioned so as to overlap with the second opening portion 5a of the second plate 5, which will be described later, in the Z direction. A second through hole 10a is formed by the first opening 4a and the second opening 5a. It was
第１プレート４の第１平板部４Ｐには、－Ｚ方向に延びる柱部１３（後述の図２７参照）が一体的に形成される。柱部１３は、ピラーとも呼ばれ、第２プレート５の後述する第２平板部５Ｐと接触して、第１平板部４Ｐと第２平板部５Ｐとの距離を一定に保つ。これにより、第１平板部４Ｐと第２平板部５Ｐとの間に、Ｚ方向の厚みが一定の内部空間Ｓが確保される。なお、柱部１３は、第１プレート４と別体で形成されてもよい。　 A pillar portion 13 (see FIG. 27 described later) extending in the −Z direction is integrally formed on the first flat plate portion 4P of the first plate 4. The pillar portion 13, also called a pillar, comes into contact with the second flat plate portion 5P described later of the second plate 5, and keeps the distance between the first flat plate portion 4P and the second flat plate portion 5P constant. As a result, an internal space S having a constant thickness in the Z direction is secured between the first flat plate portion 4P and the second flat plate portion 5P. The pillar portion 13 may be formed separately from the first plate 4. It was
（第２プレート）



第２プレート５は、第１プレート４と同じ金属材料で構成される。したがって、第１プレート４が銅で構成される場合、第２プレート５も銅で構成される。また、第１プレート４がステンレス鋼の表面に銅メッキを施した金属板で構成される場合、第２プレート５もステンレス鋼の表面に銅メッキを施した金属板で構成される。なお、第２プレート５は、第１プレート４と異なる金属材料で構成されていてもよい。　 (2nd plate)



The second plate 5 is made of the same metal material as the first plate 4. Therefore, when the first plate 4 is made of copper, the second plate 5 is also made of copper. When the first plate 4 is made of a metal plate having a surface of stainless steel plated with copper, the second plate 5 is also made of a metal plate having a surface of stainless steel plated with copper. The second plate 5 may be made of a metal material different from that of the first plate 4.
第２プレート５は、第２平板部５Ｐと、第２壁部５Ｗと、第２接合部５Ｃと、を有する。第２平板部５Ｐは、本体領域１０Ｍに位置し、Ｚ方向と交差する方向（例えばＸ方向およびＹ方向）に延びる。なお、第２平板部５Ｐは、平板部Ｐの一例である。第２壁部５Ｗは、本体領域１０Ｍにおいて、＋Ｚ方向から見て第２平板部５Ｐを囲んで位置する。また、第２壁部５Ｗは、第２平板部５Ｐと交差する方向（例えば－Ｚ方向）に延びて第２平板部５Ｐとつながる。なお、第２壁部５Ｗは、壁部Ｗの一例である。　 The second plate 5 has a second flat plate portion 5P, a second wall portion 5W, and a second joint portion 5C. The second flat plate portion 5P is located in the main body region 10M and extends in a direction intersecting the Z direction (for example, the X direction and the Y direction). The second flat plate portion 5P is an example of the flat plate portion P. The second wall portion 5W is located in the main body region 10M so as to surround the second flat plate portion 5P when viewed from the + Z direction. Further, the second wall portion 5W extends in a direction intersecting with the second flat plate portion 5P (for example, in the −Z direction) and is connected to the second flat plate portion 5P. The second wall portion 5W is an example of the wall portion W. It was
第２平板部５Ｐおよび第２壁部５Ｗにより、－Ｚ方向に凹む形状の凹部５Ｋが形成される。凹部５Ｋ内には、上記の作動媒体２が収容される。したがって、凹部５Ｋは、作動媒体２の内部空間Ｓを形成する。なお、凹部５Ｋは、内部に作動媒体２の内部空間Ｓを有する凹部Ｋの一例である。　 The second flat plate portion 5P and the second wall portion 5W form a recess 5K having a shape recessed in the −Z direction. The above-mentioned working medium 2 is housed in the recess 5K. Therefore, the recess 5K forms the internal space S of the working medium 2. The recess 5K is an example of the recess K having the internal space S of the working medium 2 inside. It was
なお、凹部Ｋは、後述するように、第１プレート４に設けられてもよいし（図９参照）、第１プレート４および第２プレート５の両方に設けられてもよい（図１０参照）。したがって、本実施形態では、第１プレート４および第２プレート５の少なくとも一方は、内部に作動媒体２の内部空間Ｓを有する凹部Ｋを有する。　 The recess K may be provided in the first plate 4 (see FIG. 9) or may be provided in both the first plate 4 and the second plate 5 (see FIG. 10), as will be described later. .. Therefore, in the present embodiment, at least one of the first plate 4 and the second plate 5 has a recess K having an internal space S of the working medium 2 inside. It was
第２接合部５Ｃは、外周領域１０Ｃに位置するとともに、第２平板部５ＰとＺ方向において異なる位置にある。具体的には、第２接合部５Ｃは、第２平板部５Ｐよりも＋Ｚ方向側に位置する。そして、第２接合部５Ｃは、第２壁部５Ｗを介して第２平板部５Ｐとつながる。また、第２接合部５Ｃは、凹部５Ｋの外側で、つまり、凹部５Ｋ内の内部空間Ｓの外側で、第１プレート４の第１接合部４ＣとＺ方向につながる。すなわち、第２プレート５は、内部空間Ｓの外側で第１プレート４とつながる第２接合部５Ｃを有する。　 The second joint portion 5C is located in the outer peripheral region 10C and is located at a different position in the Z direction from the second flat plate portion 5P. Specifically, the second joint portion 5C is located on the + Z direction side with respect to the second flat plate portion 5P. Then, the second joint portion 5C is connected to the second flat plate portion 5P via the second wall portion 5W. Further, the second joint portion 5C is connected to the first joint portion 4C of the first plate 4 in the Z direction on the outside of the recess 5K, that is, on the outside of the internal space S in the recess 5K. That is, the second plate 5 has a second joint portion 5C connected to the first plate 4 outside the internal space S. It was
上記のように、第１プレート４の第１接合部４Ｃ、および第２プレート５の第２接合部５Ｃは両方とも、熱伝導部材１０の外周領域１０Ｃに位置する。すなわち、外周領域１０Ｃは、第１接合部４Ｃおよび第２接合部５Ｃを有する。　 As described above, both the first joint portion 4C of the first plate 4 and the second joint portion 5C of the second plate 5 are located in the outer peripheral region 10C of the heat conductive member 10. That is, the outer peripheral region 10C has a first joint portion 4C and a second joint portion 5C. It was
第１接合部４Ｃと第２接合部５Ｃとは、例えば、ホットプレス、拡散接合、ろう材を用いた接合（ろう付け）などの方法により接合され、これによってＺ方向につながる。なお、ホットプレスおよび拡散接合は、いずれも加熱および加圧によって２つの部材を接合する方法であるが、以下の点で互いに区別される。拡散接合では、例えば数時間の加熱および加圧により、２つの部材の接合界面付近の原子または粒子を拡散させて、２つの部材を接合する。これに対して、ホットプレスでは、拡散接合よりも低温および短時間での加熱および加圧により、２つの部材の接合界面付近の一部の原子または粒子のみを拡散させて、２つの部材を接合する。　 The first joint portion 4C and the second joint portion 5C are joined by a method such as hot pressing, diffusion joining, or joining (brazing) using a brazing material, whereby the first joining portion 4C and the second joining portion 5C are connected in the Z direction. Both hot pressing and diffusion joining are methods of joining two members by heating and pressurizing, but they are distinguished from each other in the following points. In diffusion bonding, for example, by heating and pressurizing for several hours, atoms or particles near the bonding interface of the two members are diffused to bond the two members. On the other hand, in the hot press, only some atoms or particles near the bonding interface of the two members are diffused by heating and pressurizing at a lower temperature and in a shorter time than the diffusion bonding, and the two members are bonded. do. It was
第２プレート５の第２接合部５Ｃには、Ｚ方向に貫通する第２開口部５ａ（図５参照）が設けられる。第２接合部５Ｃにおいて、第２開口部５ａは、支持部材２０の第１貫通孔２０ａとＺ方向において重なって位置する。これにより、支持部材２０の第１貫通孔２０ａに挿入される締結部材５０が、熱伝導部材１０の第２貫通孔１０ａ（第２開口部５ａ、第１開口部４ａ）にも挿入される。　 The second joint portion 5C of the second plate 5 is provided with a second opening portion 5a (see FIG. 5) penetrating in the Z direction. In the second joint portion 5C, the second opening portion 5a is located so as to overlap the first through hole 20a of the support member 20 in the Z direction. As a result, the fastening member 50 inserted into the first through hole 20a of the support member 20 is also inserted into the second through hole 10a (second opening 5a, first opening 4a) of the heat conductive member 10. It was
上記の構成の熱伝導部材１０において、発熱体Ｈが冷却される原理は、以下の通りである。例えば図３において、発熱体Ｈの熱により、熱伝導部材１０において発熱体Ｈとの接触部分が加熱されると、熱伝導部材１０の内部空間Ｓに収容された作動媒体２が気化する。気化した蒸気は、熱伝導部材１０の内部を発熱体Ｈから遠ざかる側へ移動する。そして、蒸気は、熱伝導部材１０の内部を移動するにつれて放熱によって冷却され、液化する。特に、熱伝導部材１０と接触するフィン３０を空冷または水冷することにより、放熱が促進され、蒸気の冷却および液化が進む。　 The principle of cooling the heating element H in the heat conductive member 10 having the above configuration is as follows. For example, in FIG. 3, when the contact portion of the heat conductive member 10 with the heating element H is heated by the heat of the heating element H, the working medium 2 housed in the internal space S of the heat conductive member 10 is vaporized. The vaporized steam moves inside the heat conductive member 10 to the side away from the heating element H. Then, as the steam moves inside the heat conductive member 10, it is cooled by heat dissipation and liquefied. In particular, by air-cooling or water-cooling the fins 30 in contact with the heat conductive member 10, heat dissipation is promoted, and steam cooling and liquefaction proceed. It was
放熱によって液化した作動媒体２は、熱伝導部材１０の凹部５Ｋの内面またはピラーの側面を伝って、さらには毛細管現象によってウィック構造体３の内部を流れ、発熱体Ｈ側に向かって移動する。なお、図３等では、作動媒体２が気化した蒸気の流れを黒矢印で示し、液体の作動媒体２の流れを白抜き矢印で示す。上記のように作動媒体２が状態変化を伴いながら移動することにより、熱伝導部材１０の内部で発熱側から放熱側への熱の輸送が連続的に行われる。このような熱の輸送により、熱伝導部材１０と接触する発熱体Ｈが冷却される。　 The working medium 2 liquefied by heat dissipation travels along the inner surface of the recess 5K of the heat conductive member 10 or the side surface of the pillar, further flows inside the wick structure 3 due to the capillary phenomenon, and moves toward the heating element H side. In FIG. 3 and the like, the flow of the vapor vaporized by the working medium 2 is indicated by a black arrow, and the flow of the liquid working medium 2 is indicated by a white arrow. As described above, the working medium 2 moves while changing its state, so that heat is continuously transferred from the heat generating side to the heat radiating side inside the heat conductive member 10. By such heat transport, the heating element H in contact with the heat conductive member 10 is cooled. It was
〔３．支持部材〕



次に、支持部材２０の詳細について説明する。図８は、支持部材２０を－Ｚ方向側から見たときの底面図である。支持部材２０は、熱伝導部材１０の外周領域１０Ｃの全体を－Ｚ方向側から支持する。なお、支持部材２０は、外周領域１０Ｃの一部のみを支持してもよいが、この例については後述する。したがって、本実施形態では、支持部材２０は、熱伝導部材１０の外周領域１０Ｃの少なくとも一部を支持する。支持部材２０は、例えばステンレス鋼（ＳＵＳ）で形成されるが、支持部材２０の構成材料の詳細については後述する。　 [3. Support member]



Next, the details of the support member 20 will be described. FIG. 8 is a bottom view of the support member 20 when viewed from the −Z direction side. The support member 20 supports the entire outer peripheral region 10C of the heat conductive member 10 from the −Z direction side. The support member 20 may support only a part of the outer peripheral region 10C, but this example will be described later. Therefore, in the present embodiment, the support member 20 supports at least a part of the outer peripheral region 10C of the heat conductive member 10. The support member 20 is made of, for example, stainless steel (SUS), and details of the constituent materials of the support member 20 will be described later.
本実施形態では、熱伝導部材１０において、支持部材２０で支持される部分が外周領域１０Ｃであるため、図３で示したように、残りの本体領域１０Ｍに、ＩＧＢＴなどの発熱体Ｈを接触させることができる。これにより、発熱体Ｈで発生する熱を本体領域１０Ｍで放熱側に伝導させて、発熱体Ｈを冷却することができる。また、熱伝導部材１０の外周領域１０Ｃの少なくとも一部が支持部材２０によって支持されるため、熱伝導部材１０に反りや撓みなどの変形が生じにくくなる。したがって、熱伝導部材１０に発熱体Ｈから高温の熱が付与された場合でも、熱伝導部材１０の熱膨張による反り（撓み）を抑制することができる。　 In the present embodiment, in the heat conductive member 10, the portion supported by the support member 20 is the outer peripheral region 10C. Therefore, as shown in FIG. 3, the heating element H such as the IGBT is in contact with the remaining main body region 10M. Can be made to. As a result, the heat generated by the heating element H can be conducted to the heat dissipation side in the main body region 10M to cool the heating element H. Further, since at least a part of the outer peripheral region 10C of the heat conductive member 10 is supported by the support member 20, the heat conductive member 10 is less likely to be deformed such as warped or bent. Therefore, even when high-temperature heat is applied to the heat conductive member 10 from the heating element H, warpage (deflection) due to thermal expansion of the heat conductive member 10 can be suppressed. It was
支持部材２０は、第１支持部２１と、第２支持部２２と、を有する。第１支持部２１は、熱伝導部材１０の外周領域１０Ｃの長手部１０Ｌ（図６参照）を－Ｚ方向から支持する。すなわち、支持部材２０は、外周領域１０Ｃの長手部１０Ｌを支持する第１支持部２１を有する。　 The support member 20 has a first support portion 21 and a second support portion 22. The first support portion 21 supports the longitudinal portion 10L (see FIG. 6) of the outer peripheral region 10C of the heat conductive member 10 from the −Z direction. That is, the support member 20 has a first support portion 21 that supports the longitudinal portion 10L of the outer peripheral region 10C. It was
第１支持部２１が長手部１０Ｌを支持することにより、熱膨張によって生じやすい熱伝導部材１０の長手部１０Ｌの反りを、第１支持部２１によって抑制することができる。これにより、熱膨張による熱伝導部材１０全体の反りを抑制することができる。　 Since the first support portion 21 supports the longitudinal portion 10L, the warp of the longitudinal portion 10L of the heat conductive member 10 that tends to occur due to thermal expansion can be suppressed by the first support portion 21. As a result, it is possible to suppress the warp of the entire heat conductive member 10 due to thermal expansion. It was
第２支持部２２は、外周領域１０Ｃの短手部１０Ｓ（図６参照）を－Ｚ方向から支持する。すなわち、支持部材２０は、外周領域１０Ｃの短手部１０Ｓを支持する第２支持部２２を有する。　 The second support portion 22 supports the short portion 10S (see FIG. 6) of the outer peripheral region 10C from the −Z direction. That is, the support member 20 has a second support portion 22 that supports the short portion 10S of the outer peripheral region 10C. It was
第２支持部２２が短手部１０Ｓを支持することにより、熱膨張による熱伝導部材１０の短手部１０Ｓの反りを、第２支持部２２によって抑制することができる。これにより、例えば支持部材２０が長手部１０Ｌのみを支持する構成に比べて、熱膨張による熱伝導部材１０全体の反りをさらに抑制することができる。　 Since the second support portion 22 supports the short portion 10S, the warp of the short portion 10S of the heat conductive member 10 due to thermal expansion can be suppressed by the second support portion 22. Thereby, for example, the warp of the entire heat conductive member 10 due to thermal expansion can be further suppressed as compared with the configuration in which the support member 20 supports only the longitudinal portion 10L. It was
このように、支持部材２０は、外周領域１０Ｃの一部（例えば長手部１０Ｌ）を支持する第１支持部２１と、外周領域１０Ｃの他の一部（例えば短手部１０Ｓ）を支持する第２支持部２２と、を有する。また、図８に示すように、第１支持部２１はＸ方向に延び、第２支持部２２はＹ方向に延びる。すなわち、第１支持部２１および第２支持部２２は、厚み方向に垂直な方向で、かつ、互いに異なる２方向（Ｘ方向、Ｙ方向）にそれぞれ延びる。　 As described above, the support member 20 supports the first support portion 21 that supports a part of the outer peripheral region 10C (for example, the longitudinal portion 10L) and the other part of the outer peripheral region 10C (for example, the short portion 10S). It has two support portions 22 and. Further, as shown in FIG. 8, the first support portion 21 extends in the X direction, and the second support portion 22 extends in the Y direction. That is, the first support portion 21 and the second support portion 22 extend in a direction perpendicular to the thickness direction and in two directions (X direction and Y direction) different from each other. It was
異なる２方向に延びる第１支持部２１および第２支持部２２によって、熱伝導部材１０の外周領域１０Ｃが支持されることにより、熱伝導部材１０に反りや撓みなどの変形を生じにくくさせることができる。これにより、上述した熱伝導部材１０の熱膨張による反りを抑制する効果を高めることができる。　 The outer peripheral region 10C of the heat conductive member 10 is supported by the first support portion 21 and the second support portion 22 extending in two different directions, so that the heat conductive member 10 is less likely to be deformed such as warped or bent. can. Thereby, the effect of suppressing the warp due to the thermal expansion of the heat conductive member 10 described above can be enhanced. It was
以下、第１支持部２１および第２支持部２２の詳細について説明する。　 Hereinafter, the details of the first support portion 21 and the second support portion 22 will be described. It was
（第１支持部）



第１支持部２１は、第１長手支持部２１－１と、第２長手支持部２１－２と、を有する。第１長手支持部２１－１と第２長手支持部２１－２とは、Ｙ方向に互いに離間した位置で、Ｘ方向に沿ってそれぞれ延びる。第１長手支持部２１－１は、外周領域１０Ｃの第１長手部１０Ｌ－１を支持する。第２長手支持部２１－２は、外周領域１０Ｃの第２長手部１０Ｌ－２を支持する。 (1st support part)



The first support portion 21 has a first longitudinal support portion 21-1 and a second longitudinal support portion 21-2. The first longitudinal support portion 21-1 and the second longitudinal support portion 21-2 extend in the X direction at positions separated from each other in the Y direction. The first longitudinal support portion 21-1 supports the first longitudinal support portion 10L-1 of the outer peripheral region 10C. The second longitudinal support portion 21-2 supports the second longitudinal support portion 10L-2 of the outer peripheral region 10C.
第１長手支持部２１－１は、第１窪み面２０Ｒと、第２窪み面２０Ｓと、を有する。第１窪み面２０Ｒは、＋Ｙ方向に窪んだ凹形状の面であり、円筒状の押圧部材７０（図７参照）の外周面に沿って＋Ｚ方向に延びる。支持部材２０が第１窪み面２０Ｒを有することにより、熱伝導部材１０を支持部材２０で支持した状態で、第１窪み面２０Ｒに沿って押圧部材７０をＺ方向に移動させ、連通部６０ａを押し潰すことができる。つまり、押圧部材７０を支持部材２０と干渉させることなくＺ方向に移動させて、連通部６０ａを押し潰すことができる。　 The first longitudinal support portion 21-1 has a first recessed surface 20R and a second recessed surface 20S. The first recessed surface 20R is a concave surface recessed in the + Y direction, and extends in the + Z direction along the outer peripheral surface of the cylindrical pressing member 70 (see FIG. 7). Since the support member 20 has the first recessed surface 20R, the pressing member 70 is moved in the Z direction along the first recessed surface 20R in a state where the heat conductive member 10 is supported by the support member 20, and the communication portion 60a is moved. Can be crushed. That is, the pressing member 70 can be moved in the Z direction without interfering with the support member 20, and the communication portion 60a can be crushed. It was
第２窪み面２０Ｓは、－Ｚ方向に窪んだ凹形状の面であり、熱伝導部材１０の連通部６０ａ（図１、図７等参照）の外周面に沿って＋Ｙ方向に延びる。支持部材２０が第２窪み面２０Ｓを有することにより、熱伝導部材１０に連通部６０ａが存在する状態であっても、連通部６０ａを押し潰すことなく支持部材２０を熱伝導部材１０の外周領域１０Ｃに接触させて、外周領域１０Ｃを支持することができる。　 The second recessed surface 20S is a concave surface recessed in the −Z direction, and extends in the + Y direction along the outer peripheral surface of the communication portion 60a (see FIGS. 1, 7, etc.) of the heat conductive member 10. Since the support member 20 has the second recessed surface 20S, even if the communication portion 60a is present in the heat conduction member 10, the support member 20 can be moved to the outer peripheral region of the heat conduction member 10 without crushing the communication portion 60a. The outer peripheral region 10C can be supported by contacting with 10C. It was
（第２支持部）



第２支持部２２は、第１短手支持部２２－１と、第２短手支持部２２－２と、を有する。第１短手支持部２２－１と第２短手支持部２２－２とは、Ｘ方向に互いに離間した位置で、Ｙ方向に沿ってそれぞれ延びる。第１短手支持部２２－１は、外周領域１０Ｃの第１短手部１０Ｓ－１を支持する。第２短手支持部２２－２は、外周領域１０Ｃの第２短手部１０Ｓ－２を支持する。 (2nd support)



The second support portion 22 has a first short support portion 22-1 and a second short support portion 22-2. The first short support portion 22-1 and the second short support portion 22-2 extend in the Y direction at positions separated from each other in the X direction. The first short support portion 22-1 supports the first short support portion 10S-1 of the outer peripheral region 10C. The second short support portion 22-2 supports the second short support portion 10S-2 of the outer peripheral region 10C.
上記した第１長手支持部２１－１の＋Ｘ方向側の端部は、第１短手支持部２２－１の－Ｙ方向側の端部とつながる。第１長手支持部２１－１の－Ｘ方向側の端部は、第２短手支持部２２－２の－Ｙ方向側の端部とつながる。第２長手支持部２１－２の＋Ｘ方向側の端部は、第１短手支持部２２－１の＋Ｙ方向側の端部とつながる。第２長手支持部２１－２の－Ｘ方向側の端部は、第２短手支持部２２－２の＋Ｙ方向側の端部とつながる。これにより、－Ｚ方向側から見て反時計回りに、熱伝導部材１０の矩形の外形に沿って、第１長手支持部２１－１、第２短手支持部２２－２、第２長手支持部２１－２、および第１短手支持部２２－１が順につながる。すなわち、第１支持部２１および第２支持部２２は、熱伝導部材１０の矩形の外形に沿って交互につながる。その結果、－Ｚ方向から見て枠状の支持部材２０が形成される。つまり、支持部材２０として、－Ｚ方向から見て中央に矩形の開口２０Ｐを有するフレーム２０Ｆが形成される。　 The end portion of the first longitudinal support portion 21-1 on the + X direction side is connected to the end portion of the first short support portion 22-1 on the −Y direction side. The end portion of the first longitudinal support portion 21-1 on the −X direction side is connected to the end portion of the second short support portion 22-2 on the −Y direction side. The end portion of the second longitudinal support portion 21-2 on the + X direction side is connected to the end portion of the first short support portion 22-1 on the + Y direction side. The end portion of the second longitudinal support portion 21-2 on the −X direction side is connected to the end portion of the second short support portion 22-2 on the + Y direction side. As a result, the first longitudinal support portion 21-1, the second short support portion 22-2, and the second longitudinal support along the rectangular outer shape of the heat conductive member 10 counterclockwise when viewed from the −Z direction side. The portion 21-2 and the first short support portion 22-1 are connected in order. That is, the first support portion 21 and the second support portion 22 are alternately connected along the rectangular outer shape of the heat conductive member 10. As a result, the frame-shaped support member 20 is formed when viewed from the −Z direction. That is, as the support member 20, a frame 20F having a rectangular opening 20P in the center when viewed from the −Z direction is formed. It was
第１支持部２１および第２支持部２２が交互につながることにより、熱伝導部材１０の長手部１０Ｌおよび短手部１０Ｓが支持部材２０によって一続きに支持される。これにより、熱伝導部材１０の熱膨張による反りの抑制効果を高めることができる。また、熱伝導ユニット１全体の機械的強度を確保することも可能となる。さらに、中央に開口２０Ｐを有するフレーム２０Ｆが形成されるため、開口２０Ｐに熱伝導部材１０の本体領域１０Ｍを嵌め込むことで、外周領域１０Ｃを支持部材２０で支持する熱伝導ユニット１を容易に実現することができる。　 By alternately connecting the first support portion 21 and the second support portion 22, the longitudinal portion 10L and the short portion 10S of the heat conductive member 10 are continuously supported by the support member 20. As a result, the effect of suppressing warpage due to thermal expansion of the heat conductive member 10 can be enhanced. It is also possible to secure the mechanical strength of the entire heat conduction unit 1. Further, since the frame 20F having the opening 20P is formed in the center, the heat conduction unit 1 that supports the outer peripheral region 10C by the support member 20 can be easily provided by fitting the main body region 10M of the heat conduction member 10 into the opening 20P. It can be realized. It was
支持部材２０は、第１貫通孔２０ａを有する。第１貫通孔２０ａは、支持部材２０をＺ方向に貫通する孔である。第１貫通孔２０ａは、支持部材２０の第１支持部２１に位置するとともに、熱伝導部材１０の第２貫通孔１０ａとＺ方向において重なって位置する。第１貫通孔２０ａおよび第２貫通孔１０ａの各内径は、締結部材５０（図５参照）の挿入部の径に応じて個別に設定されればよい。したがって、第１貫通孔２０ａおよび第２貫通孔１０ａの各内径は、互いに一致してもよいし、不一致であってもよい。　 The support member 20 has a first through hole 20a. The first through hole 20a is a hole that penetrates the support member 20 in the Z direction. The first through hole 20a is located in the first support portion 21 of the support member 20 and is positioned so as to overlap the second through hole 10a of the heat conductive member 10 in the Z direction. The inner diameters of the first through hole 20a and the second through hole 10a may be individually set according to the diameter of the insertion portion of the fastening member 50 (see FIG. 5). Therefore, the inner diameters of the first through hole 20a and the second through hole 10a may or may not match each other. It was
（第１支持部の幅と第２支持部の幅との関係）



図８に示すように、厚み方向から見て、第１支持部２１の幅ＷＤ１は、第２支持部２２の幅ＷＤ２と異なる。本実施形態では、厚み方向から見て、支持部材２０の第１支持部２１の幅ＷＤ１は、第２支持部２２の幅ＷＤ２よりも広い。なお、幅ＷＤ１および幅ＷＤ２の単位は、ともにｍｍ（ミリメートル）である。ここで、「幅」とは、厚み方向であるＺ方向に垂直なＸＹ面内で、支持部材２０が延びる方向に垂直な方向の長さを指す。したがって、第１支持部２１の幅ＷＤ１とは、ＸＹ面内で第１支持部２１が延びるＸ方向に垂直なＹ方向（短手方向）における第１支持部２１の長さを指す。また、第２支持部２２の幅ＷＤ２とは、ＸＹ面内で第２支持部２２が延びるＹ方向に垂直なＸ方向（長手方向）における第２支持部２２の長さを指す。つまり、厚み方向から見て、第１支持部２１の、延びる方向に垂直な方向の幅ＷＤ１は、第２支持部２２の、延びる方向に垂直な方向の幅ＷＤ２と異なる。特に、厚み方向から見て、支持部材２０の第１支持部２１の（矩形の）短手方向の幅ＷＤ１は、第２支持部２２の（矩形の）長手方向の幅ＷＤ２よりも広い。 (Relationship between the width of the first support and the width of the second support)



As shown in FIG. 8, the width WD1 of the first support portion 21 is different from the width WD2 of the second support portion 22 when viewed from the thickness direction. In the present embodiment, the width WD1 of the first support portion 21 of the support member 20 is wider than the width WD2 of the second support portion 22 when viewed from the thickness direction. The units of the width WD1 and the width WD2 are both mm (millimeters). Here, the "width" refers to the length in the direction perpendicular to the direction in which the support member 20 extends in the XY plane perpendicular to the Z direction, which is the thickness direction. Therefore, the width WD1 of the first support portion 21 refers to the length of the first support portion 21 in the Y direction (short direction) perpendicular to the X direction in which the first support portion 21 extends in the XY plane. Further, the width WD2 of the second support portion 22 refers to the length of the second support portion 22 in the X direction (longitudinal direction) perpendicular to the Y direction in which the second support portion 22 extends in the XY plane. That is, when viewed from the thickness direction, the width WD1 of the first support portion 21 in the direction perpendicular to the extending direction is different from the width WD2 of the second support portion 22 in the direction perpendicular to the extending direction. In particular, when viewed from the thickness direction, the width WD1 of the first support portion 21 of the support member 20 in the (rectangular) lateral direction is wider than the width WD2 of the second support portion 22 in the (rectangular) longitudinal direction.
ＷＤ１＞ＷＤ２の関係により、支持部材２０の厚みを一定として、第２支持部２２よりも高い強度を第１支持部２１に持たせることができる。これにより、熱膨張による熱伝導部材１０の長手部１０Ｌの反りを第１支持部２１によって抑制する効果を高めて、熱伝導部材１０全体の反りを抑制する効果を高めることができる。　 Due to the relationship of WD1> WD2, the thickness of the support member 20 can be kept constant, and the first support portion 21 can have higher strength than the second support portion 22. As a result, the effect of suppressing the warp of the longitudinal portion 10L of the heat conductive member 10 due to thermal expansion by the first support portion 21 can be enhanced, and the effect of suppressing the warp of the entire heat conductive member 10 can be enhanced. It was
〔４．熱伝導ユニットの他の構成〕



図９は、熱伝導ユニット１の他の構成を示す断面図である。熱伝導部材１０の第１プレート４は凹部４Ｋを有し、第２プレート５は平板で構成されてもよい。以下、この構成について説明する。　 [4. Other configurations of heat conduction unit]



FIG. 9 is a cross-sectional view showing another configuration of the heat conduction unit 1. The first plate 4 of the heat conductive member 10 may have a recess 4K, and the second plate 5 may be made of a flat plate. Hereinafter, this configuration will be described.
図９の構成では、第１プレート４は、上述した第１平板部４Ｐおよび第１接合部４Ｃに加えて、第１壁部４Ｗをさらに有する。第１壁部４Ｗは、本体領域１０Ｍにおいて、＋Ｚ方向から見て第１平板部４Ｐを囲んで位置する。また、第１壁部４Ｗは、第１平板部４Ｐと交差する方向（例えば＋Ｚ方向）に延びて第２平板部５Ｐとつながる。なお、第１壁部４Ｗは、壁部Ｗの一例である。　 In the configuration of FIG. 9, the first plate 4 further has a first wall portion 4W in addition to the first flat plate portion 4P and the first joint portion 4C described above. The first wall portion 4W is located in the main body region 10M so as to surround the first flat plate portion 4P when viewed from the + Z direction. Further, the first wall portion 4W extends in a direction intersecting the first flat plate portion 4P (for example, in the + Z direction) and is connected to the second flat plate portion 5P. The first wall portion 4W is an example of the wall portion W. It was
第１接合部４Ｃは、外周領域１０Ｃに位置するとともに、第１平板部４ＰとＺ方向において異なる位置にある。具体的には、第１接合部４Ｃは、第１平板部４Ｐに対して－Ｚ方向側に位置する。そして、第１接合部４Ｃは、第１壁部４Ｗを介して第１平板部４Ｐとつながる。　 The first joint portion 4C is located in the outer peripheral region 10C and is located at a different position in the Z direction from the first flat plate portion 4P. Specifically, the first joint portion 4C is located on the −Z direction side with respect to the first flat plate portion 4P. Then, the first joint portion 4C is connected to the first flat plate portion 4P via the first wall portion 4W. It was
第１平板部４Ｐおよび第１壁部４Ｗにより、＋Ｚ方向に凹む形状の凹部４Ｋが形成される。凹部４Ｋ内には、上記の作動媒体２が収容される。したがって、凹部４Ｋは、作動媒体２の内部空間Ｓを形成する。なお、凹部４Ｋは、内部に作動媒体２の内部空間Ｓを有する凹部Ｋの一例である。第１プレート４の第１接合部４Ｃと、第２プレート５の第２接合部５Ｃとは、凹部４Ｋの外側でＺ方向につながる。つまり、第１接合部４Ｃと第２接合部５Ｃとは、凹部４Ｋ内の内部空間Ｓの外側でＺ方向につながる。　 The first flat plate portion 4P and the first wall portion 4W form a recess 4K having a shape recessed in the + Z direction. The above-mentioned working medium 2 is housed in the recess 4K. Therefore, the recess 4K forms the internal space S of the working medium 2. The recess 4K is an example of the recess K having the internal space S of the working medium 2 inside. The first joint portion 4C of the first plate 4 and the second joint portion 5C of the second plate 5 are connected in the Z direction on the outside of the recess 4K. That is, the first joint portion 4C and the second joint portion 5C are connected in the Z direction outside the internal space S in the recess 4K. It was
図９の構成では、支持部材２０は、第１接合部４Ｃを＋Ｚ方向側から支持してもよい。このような支持部材２０の支持は、例えば図５の構成と同様に、締結部材５０を用いて支持部材２０と熱伝導部材１０とを共締めすることによって行われる。　 In the configuration of FIG. 9, the support member 20 may support the first joint portion 4C from the + Z direction side. Such support of the support member 20 is performed, for example, by fastening the support member 20 and the heat conductive member 10 together using the fastening member 50, as in the configuration of FIG. It was
図１０は、熱伝導ユニット１のさらに他の構成を示す断面図である。熱伝導部材１０は、第１プレート４が上述した凹部４Ｋを有し、第２プレート５も上述した凹部５Ｋを有することによって形成されてもよい。　 FIG. 10 is a cross-sectional view showing still another configuration of the heat conduction unit 1. The heat conductive member 10 may be formed by having the first plate 4 having the above-mentioned recess 4K and the second plate 5 also having the above-mentioned recess 5K. It was
図１０の構成では、２つの支持部材２０によって熱伝導部材１０を支持してもよい。つまり、一方の支持部材２０により、熱伝導部材１０の第１接合部４Ｃを＋Ｚ方向側から支持し、他方の支持部材２０により、熱伝導部材１０の第２接合部５Ｃを－Ｚ方向側から支持してもよい。このような２つの支持部材２０の支持は、例えば図５の構成と同様に、締結部材５０を用いて２つの支持部材２０と熱伝導部材１０とを共締めすることによって行われる。　 In the configuration of FIG. 10, the heat conductive member 10 may be supported by the two support members 20. That is, one support member 20 supports the first joint portion 4C of the heat conductive member 10 from the + Z direction side, and the other support member 20 supports the second joint portion 5C of the heat conductive member 10 from the −Z direction side. You may support it. Such support of the two support members 20 is performed, for example, by co-fastening the two support members 20 and the heat conductive member 10 using the fastening member 50, as in the configuration of FIG. It was
図１１は、熱伝導ユニット１のさらに他の構成を示す断面図である。図１０と同様の構成を有する熱伝導部材１０を用いた構成において、支持部材２０は、第１プレート４の第１接合部４Ｃおよび第２プレート５の第２接合部５Ｃを上下方向から挟み込む形状で形成されて、熱伝導部材１０を支持してもよい。　 FIG. 11 is a cross-sectional view showing still another configuration of the heat conduction unit 1. In the configuration using the heat conductive member 10 having the same configuration as that of FIG. 10, the support member 20 has a shape that sandwiches the first joint portion 4C of the first plate 4 and the second joint portion 5C of the second plate 5 from above and below. The heat conductive member 10 may be supported by the heat conductive member 10. It was
図１２は、熱伝導ユニット１のさらに他の構成を示す断面図である。第２プレート５の第２接合部５Ｃは、第１プレート４の第１壁部４ＷとＺ方向につながってもよい。この場合、第１壁部４Ｗは第１接合部４Ｃを兼ねる。そして、第１接合部４Ｃは、内部空間Ｓの外側で第２プレート５とＺ方向につながる。また、第２接合部５Ｃは、内部空間Ｓの外側で第１プレート４とＺ方向につながる。　 FIG. 12 is a cross-sectional view showing still another configuration of the heat conduction unit 1. The second joint portion 5C of the second plate 5 may be connected to the first wall portion 4W of the first plate 4 in the Z direction. In this case, the first wall portion 4W also serves as the first joint portion 4C. Then, the first joint portion 4C is connected to the second plate 5 in the Z direction on the outside of the internal space S. Further, the second joint portion 5C is connected to the first plate 4 in the Z direction on the outside of the internal space S. It was
図１２の構成では、支持部材２０は、第２接合部５Ｃを－Ｚ方向側から支持してもよい。なお、支持部材２０による支持は、第１貫通孔２０ａおよび第２貫通孔１０ａへの締結部材５０の挿入によって行われてもよいし、専用の固定治具（図示せず）を用いて熱伝導部材１０と支持部材２０とを固定することによって行われてもよい。　 In the configuration of FIG. 12, the support member 20 may support the second joint portion 5C from the −Z direction side. The support by the support member 20 may be performed by inserting the fastening member 50 into the first through hole 20a and the second through hole 10a, or heat conduction using a dedicated fixing jig (not shown). This may be done by fixing the member 10 and the support member 20. It was
すなわち、図３、図９～図１２に示したように、支持部材２０は、第１接合部４Ｃおよび第２接合部５Ｃの少なくとも一方を支持する。　 That is, as shown in FIGS. 3, 9 to 12, the support member 20 supports at least one of the first joint portion 4C and the second joint portion 5C. It was
第１プレート４と第２プレート５とが第１接合部４Ｃおよび第２接合部５Ｃでつながり、内部に作動媒体２の内部空間Ｓを有する熱伝導部材１０は、ベーパーチャンバーとも呼ばれる。熱伝導部材１０がベーパーチャンバーで構成される場合でも、支持部材２０が外周領域１０Ｃの第１接合部４Ｃおよび第２接合部５Ｃの少なくとも一方を支持することにより、ベーパーチャンバーの熱膨張による反りを抑制することができる。　 The heat conductive member 10 in which the first plate 4 and the second plate 5 are connected by the first joint portion 4C and the second joint portion 5C and have the internal space S of the working medium 2 inside is also referred to as a vapor chamber. Even when the heat conductive member 10 is composed of a vapor chamber, the support member 20 supports at least one of the first joint portion 4C and the second joint portion 5C of the outer peripheral region 10C to prevent warpage due to thermal expansion of the vapor chamber. It can be suppressed. It was
〔５．熱伝導部材の閉鎖部の詳細について〕



次に、熱伝導部材１０が有する閉鎖部６０の詳細について説明する。図１３は、閉鎖部６０の形成前後での熱伝導部材１０の断面図である。図１３の下段に示すように、熱伝導部材１０の外周領域１０Ｃは、接合領域ＣＲと、閉鎖領域ＮＲと、を有する。接合領域ＣＲは、第１接合部４Ｃと第２接合部５Ｃとが接合される領域である。なお、ここでの接合とは、上述したように、ホットプレス等による接合を指す。　 [5. Details of the closed part of the heat conductive member]



Next, the details of the closed portion 60 included in the heat conductive member 10 will be described. FIG. 13 is a cross-sectional view of the heat conductive member 10 before and after the formation of the closed portion 60. As shown in the lower part of FIG. 13, the outer peripheral region 10C of the heat conductive member 10 has a joint region CR and a closed region NR. The joint region CR is a region where the first joint portion 4C and the second joint portion 5C are joined. As described above, the joining here refers to joining by hot pressing or the like.
一方、閉鎖領域ＮＲは、内部空間Ｓ（図３等参照）の閉鎖部６０を有する領域である。すなわち、外周領域１０Ｃは、第１接合部４Ｃおよび第２接合部５Ｃの接合領域ＣＲと、内部空間Ｓの閉鎖部６０を有する閉鎖領域ＮＲと、を有する。閉鎖部６０は、ホットプレス等による接合ではなく、上述のように、押圧部材７０（図７参照）によって連通部６０ａを押し潰すことによって形成される。連通部６０ａは、内部空間Ｓと連通する連通孔６０ａ１を有する。このため、連通部６０ａが押し潰されると、内部空間Ｓと連通する連通孔６０ａ１が閉じる。その結果、内部の内部空間Ｓを閉鎖する閉鎖部６０が形成される。なお、図１３では、外周領域１０Ｃにおいて、閉鎖部６０が形成される前の領域、つまり、連通部６０ａが位置する領域を、閉鎖前領域ＮＲ－１として示す。　 On the other hand, the closed region NR is a region having a closed portion 60 of the internal space S (see FIG. 3 and the like). That is, the outer peripheral region 10C has a joint region CR of the first joint portion 4C and the second joint portion 5C, and a closed region NR having the closed portion 60 of the internal space S. The closed portion 60 is formed by crushing the communicating portion 60a with the pressing member 70 (see FIG. 7) as described above, instead of joining by hot pressing or the like. The communication portion 60a has a communication hole 60a1 that communicates with the internal space S. Therefore, when the communication portion 60a is crushed, the communication hole 60a1 communicating with the internal space S is closed. As a result, a closed portion 60 that closes the internal internal space S is formed. In FIG. 13, in the outer peripheral region 10C, the region before the closed portion 60 is formed, that is, the region where the communicating portion 60a is located is shown as the pre-closed region NR-1. It was
外周領域１０Ｃにおいて、接合領域ＣＲと閉鎖領域ＮＲとは、例えば矩形の長手方向（Ｘ方向）に並んで位置する。つまり、外周領域１０Ｃにおいて、接合領域ＣＲと閉鎖領域ＮＲとは異なる位置にある。このような接合領域ＣＲと閉鎖領域ＮＲとの位置関係は、以下のようにして実現される。　 In the outer peripheral region 10C, the junction region CR and the closed region NR are located side by side in the longitudinal direction (X direction) of a rectangle, for example. That is, in the outer peripheral region 10C, the junction region CR and the closed region NR are located at different positions. Such a positional relationship between the junction region CR and the closed region NR is realized as follows. It was
まず、外周領域１０Ｃにおいて、閉鎖前領域ＮＲ－１を除く領域に、第１接合部４Ｃと第２接合部５Ｃとをホットプレス等により接合する。そして、熱伝導部材１０の外周領域１０Ｃを支持部材２０によって支持する。この状態で、連通部６０ａの連通孔６０ａ１を介して内部空間Ｓに作動媒体２（図３等参照）を注入する。その後、押圧部材７０（図７参照）によって閉鎖前領域ＮＲ－１の連通部６０ａを押し潰して閉鎖部６０を形成する。これにより、第１接合部４Ｃと第２接合部５Ｃとを接合した接合領域ＣＲとは異なる位置に、閉鎖部６０を有する閉鎖領域ＮＲが形成される。すなわち、外周領域１０Ｃは、第１接合部４Ｃおよび第２接合部５Ｃの接合領域ＣＲとは異なる位置に、内部空間Ｓの閉鎖部６０を有する。言い換えれば、外周領域１０Ｃは、内部空間Ｓと外部との連通部分（連通部６０ａ）を押し潰して閉鎖した形状の閉鎖部６０を有する。　 First, in the outer peripheral region 10C, the first joint portion 4C and the second joint portion 5C are joined to a region other than the pre-closed region NR-1 by hot pressing or the like. Then, the outer peripheral region 10C of the heat conductive member 10 is supported by the support member 20. In this state, the working medium 2 (see FIG. 3 and the like) is injected into the internal space S through the communication hole 60a1 of the communication portion 60a. After that, the communication portion 60a of the pre-closed region NR-1 is crushed by the pressing member 70 (see FIG. 7) to form the closed portion 60. As a result, the closed region NR having the closed portion 60 is formed at a position different from the joint region CR where the first joint portion 4C and the second joint portion 5C are joined. That is, the outer peripheral region 10C has a closed portion 60 of the internal space S at a position different from the joint region CR of the first joint portion 4C and the second joint portion 5C. In other words, the outer peripheral region 10C has a closed portion 60 having a shape in which the communicating portion (communication portion 60a) between the internal space S and the outside is crushed and closed. It was
本実施形態では、図７に示すように、上記の閉鎖部６０は、外周領域１０Ｃの長手部１０Ｌに位置する。そして、支持部材２０は、閉鎖部６０が位置する長手部１０Ｌを支持する（図１、図８等参照）。すなわち、閉鎖部６０は、外周領域１０Ｃにおいて、第１支持部２１および第２支持部２２のうち、厚み方向から見たときの幅がより広い方（ここでは第１支持部２１）によって支持される被支持領域１０Ｐ上に位置する。なお、被支持領域１０Ｐは、本実施形態では長手部１０Ｌを指す。　 In the present embodiment, as shown in FIG. 7, the closed portion 60 is located in the longitudinal portion 10L of the outer peripheral region 10C. Then, the support member 20 supports the longitudinal portion 10L in which the closing portion 60 is located (see FIGS. 1, 8 and the like). That is, the closed portion 60 is supported by the wider of the first support portion 21 and the second support portion 22 when viewed from the thickness direction (here, the first support portion 21) in the outer peripheral region 10C. It is located on the supported area 10P. The supported region 10P refers to the longitudinal portion 10L in the present embodiment. It was
なお、上記の閉鎖部６０は、外周領域１０Ｃの短手部１０Ｓに位置してもよい（図２１照）。この場合、支持部材２０は、閉鎖部６０が位置する短手部１０Ｓを支持してもよい。また、閉鎖部６０は、外周領域１０Ｃの長手部１０Ｌと短手部１０Ｓとの両方に位置してもよい。つまり、熱伝導部材１０の外周領域１０Ｃは閉鎖部６０を複数有し、各閉鎖部６０が外周領域１０Ｃの長手部１０Ｌと短手部１０Ｓとの両方に位置してもよい（図７と図２１とを組み合わせた構成であってもよい）。この場合、支持部材２０は、各閉鎖部６０が位置する長手部１０Ｌおよび短手部１０Ｓの両方を支持してもよい。 The closed portion 60 may be located on the short portion 10S of the outer peripheral region 10C (see FIG. 21). In this case, the support member 20 may support the short portion 10S on which the closed portion 60 is located. Further, the closed portion 60 may be located at both the longitudinal portion 10L and the short portion 10S of the outer peripheral region 10C. That is, the outer peripheral region 10C of the heat conductive member 10 may have a plurality of closed portions 60, and each closed portion 60 may be located in both the longitudinal portion 10L and the short portion 10S of the outer peripheral region 10C (FIGS. 7 and 7). 21 may be combined with the configuration). In this case, the support member 20 may support both the longitudinal portion 10L and the short portion 10S where each closed portion 60 is located.
つまり、閉鎖部６０は、外周領域１０Ｃの長手部１０Ｌおよび短手部１０Ｓの少なくとも一方に位置する。そして、支持部材２０は、閉鎖部６０が位置する、長手部１０Ｌおよび短手部１０Ｓの少なくとも一方を支持する。　 That is, the closed portion 60 is located at least one of the longitudinal portion 10L and the short portion 10S of the outer peripheral region 10C. Then, the support member 20 supports at least one of the longitudinal portion 10L and the short portion 10S where the closing portion 60 is located. It was
支持部材２０は、閉鎖部６０が位置する外周領域１０Ｃ（長手部１０Ｌおよび短手部１０Ｓの少なくとも一方）を支持するため、閉鎖部６０が位置する部分における外周領域１０Ｃの強度を確保することができる。これにより、内部空間Ｓの閉鎖部６０を形成する前に、つまり、内部空間Ｓと連通していた連通孔６０ａ１を閉鎖する前に、その連通孔６０ａ１を介して、内部の内部空間Ｓに作動媒体２を安定して注入することができる。　 Since the support member 20 supports the outer peripheral region 10C (at least one of the longitudinal portion 10L and the short portion 10S) where the closed portion 60 is located, the strength of the outer peripheral region 10C in the portion where the closed portion 60 is located can be ensured. can. As a result, before forming the closed portion 60 of the internal space S, that is, before closing the communication hole 60a1 communicating with the internal space S, the operation is applied to the internal internal space S through the communication hole 60a1. The medium 2 can be stably injected. It was
本実施形態では、支持部材２０の第１支持部２１および第２支持部２２は、上述したように幅が互いに異なる（ＷＤ１＞ＷＤ２）。このため、第１支持部２１および第２支持部２２に異なる強度を持たせることができる。特に、より幅の広い支持部（例えば第１支持部２１）によって支持される被支持領域１０Ｐは、より幅の狭い支持部（例えば第２支持部２２）によって支持される外周領域１０Ｃの一部よりも高い強度が確保される。閉鎖部６０は、外周領域１０Ｃにおいてより強度の高い被支持領域１０Ｐ上に位置するため、被支持領域１０Ｐに閉鎖部６０を形成する前に、つまり、内部空間Ｓと連通していた連通孔６０ａ１を閉鎖する前に、その連通孔６０ａ１を介して、内部の内部空間Ｓに作動媒体２を安定して注入することができるとも言える。 In the present embodiment, the first support portion 21 and the second support portion 22 of the support member 20 have different widths (WD1> WD2) as described above. Therefore, the first support portion 21 and the second support portion 22 can have different strengths. In particular, the supported region 10P supported by a wider support portion (eg, first support portion 21) is part of the outer peripheral region 10C supported by a narrower support portion (eg, second support portion 22). Higher strength is ensured. Since the closed portion 60 is located on the supported region 10P having higher strength in the outer peripheral region 10C, the communication hole 60a1 that communicates with the internal space S before the closed portion 60 is formed in the supported region 10P. It can be said that the working medium 2 can be stably injected into the internal internal space S through the communication hole 60a1 before closing.
特に、図８で示したように、ＷＤ１＞ＷＤ２である本実施形態では、閉鎖部６０は、外周領域１０Ｃの長手部１０Ｌに位置する（図７参照）。つまり、厚み方向から見て、支持部材２０の第１支持部２１の（矩形の）短手方向の幅ＷＤ１は、第２支持部２２の（矩形の）長手方向の幅ＷＤ２よりも広く、閉鎖部６０は、第１支持部２１で支持される外周領域１０Ｃの長手部１０Ｌに位置する。　 In particular, as shown in FIG. 8, in the present embodiment in which WD1> WD2, the closed portion 60 is located in the longitudinal portion 10L of the outer peripheral region 10C (see FIG. 7). That is, when viewed from the thickness direction, the width WD1 in the (rectangular) lateral direction of the first support portion 21 of the support member 20 is wider than the width WD2 in the (rectangular) longitudinal direction of the second support portion 22 and is closed. The portion 60 is located in the longitudinal portion 10L of the outer peripheral region 10C supported by the first support portion 21. It was
ＷＤ１＞ＷＤ２である場合、第２支持部２２よりも高い強度を第１支持部２１に持たせることができる。そして、より強度の高い第１支持部２１により、外周領域１０Ｃの長手部１０Ｌが安定して支持される。したがって、反りが生じやすい長手部１０Ｌに閉鎖部６０を位置させる構成であっても、閉鎖部６０を形成する前に（連通孔６０ａ１の閉鎖前に）、連通孔６０ａ１を介して、内部の内部空間Ｓに作動媒体２を安定して注入することができる。　 When WD1> WD2, the first support portion 21 can have a higher strength than the second support portion 22. Then, the longitudinal portion 10L of the outer peripheral region 10C is stably supported by the first support portion 21 having higher strength. Therefore, even if the closing portion 60 is positioned in the longitudinal portion 10L where warpage is likely to occur, before the closing portion 60 is formed (before closing the communication hole 60a1), the inside of the inside is passed through the communication hole 60a1. The working medium 2 can be stably injected into the space S. It was
〔６．第１接合部、第２接合部および支持部材の厚みの関係〕



図１４は、熱伝導部材１０の外周領域１０Ｃ付近の構成を拡大して示す断面図である。本実施形態では、熱伝導部材１０の厚み方向において、第１接合部４Ｃの厚さをＴ１（ｍｍ）とし、第２接合部５Ｃの厚さをＴ２（ｍｍ）とし、支持部材２０の厚さをＴ３（ｍｍ）としたとき、



　　　Ｔ１＋Ｔ２＜Ｔ３



である。つまり、熱伝導部材１０の厚み方向において、第１接合部４Ｃの厚さと第２接合部５Ｃの厚さとの和は、支持部材２０の厚さよりも小さい。例えば、Ｔ１＝０．５ｍｍ、Ｔ２＝０．５ｍｍ、Ｔ３＝２ｍｍに設定することにより、上記の条件が満足される。　 [6. Relationship between the thickness of the first joint, the second joint and the support member]



FIG. 14 is an enlarged cross-sectional view showing the configuration of the heat conductive member 10 in the vicinity of the outer peripheral region 10C. In the present embodiment, in the thickness direction of the heat conductive member 10, the thickness of the first joint portion 4C is T1 (mm), the thickness of the second joint portion 5C is T2 (mm), and the thickness of the support member 20. When is T3 (mm)



T1 + T2 <T3



Is. That is, in the thickness direction of the heat conductive member 10, the sum of the thickness of the first joint portion 4C and the thickness of the second joint portion 5C is smaller than the thickness of the support member 20. For example, by setting T1 = 0.5 mm, T2 = 0.5 mm, and T3 = 2 mm, the above conditions are satisfied.
上記のＴ１、Ｔ２およびＴ３の関係では、第１接合部４Ｃおよび第２接合部５Ｃのトータルの厚みよりも、支持部材２０の厚みが大きい。このため、第１接合部４Ｃおよび第２接合部５Ｃのトータルの厚みに対して、熱伝導部材１０の反りの抑制に必要な支持部材２０の剛性を確保することができる。　 In the above relationship of T1, T2 and T3, the thickness of the support member 20 is larger than the total thickness of the first joint portion 4C and the second joint portion 5C. Therefore, it is possible to secure the rigidity of the support member 20 necessary for suppressing the warp of the heat conductive member 10 with respect to the total thickness of the first joint portion 4C and the second joint portion 5C. It was
ここで、第２プレート５全体のＺ方向の厚さをＴＢ（ｍｍ）としたとき、図１４では、Ｔ２＋Ｔ３＝ＴＢとなっているが、Ｔ１＋Ｔ２＜Ｔ３を満足するのであれば、Ｔ２＋Ｔ３＝ＴＢには限定されない。つまり、熱伝導部材１０の厚み方向において、第２接合部５Ｃの厚さと支持部材２０の厚さとの和は、第２プレート５全体の厚さと同じであってもよいし、異なっていてもよい。　 Here, when the thickness of the entire second plate 5 in the Z direction is TB (mm), T2 + T3 = TB in FIG. 14, but if T1 + T2 <T3 is satisfied, T2 + T3 = TB. Is not limited. That is, in the thickness direction of the heat conductive member 10, the sum of the thickness of the second joint portion 5C and the thickness of the support member 20 may be the same as or different from the thickness of the entire second plate 5. .. It was
図１５は、熱伝導部材１０の外周領域１０Ｃ付近の他の構成を拡大して示す断面図である。Ｔ１＋Ｔ２＜Ｔ３を満足するのであれば、同図に示すように、Ｔ２＋Ｔ３＜ＴＢであってもよい。つまり、熱伝導部材１０の厚み方向において、第２接合部５Ｃの厚さと支持部材２０の厚さとの和は、第２プレート５全体の厚さよりも小さくてもよい。　 FIG. 15 is an enlarged cross-sectional view showing another configuration in the vicinity of the outer peripheral region 10C of the heat conductive member 10. If T1 + T2 <T3 is satisfied, T2 + T3 <TB may be satisfied as shown in the figure. That is, in the thickness direction of the heat conductive member 10, the sum of the thickness of the second joint portion 5C and the thickness of the support member 20 may be smaller than the thickness of the entire second plate 5. It was
図１６は、熱伝導部材１０の外周領域１０Ｃ付近のさらに他の構成を拡大して示す断面図である。Ｔ１＋Ｔ２＜Ｔ３を満足するのであれば、同図に示すように、Ｔ２＋Ｔ３＞ＴＢであってもよい。つまり、熱伝導部材１０の厚み方向において、第２接合部５Ｃの厚さと支持部材２０の厚さとの和は、第２プレート５全体の厚さよりも大きくてもよい。　 FIG. 16 is an enlarged cross-sectional view showing still another configuration in the vicinity of the outer peripheral region 10C of the heat conductive member 10. If T1 + T2 <T3 is satisfied, T2 + T3> TB may be satisfied as shown in the figure. That is, in the thickness direction of the heat conductive member 10, the sum of the thickness of the second joint portion 5C and the thickness of the support member 20 may be larger than the thickness of the entire second plate 5. It was
〔７．壁部に対する支持部材の位置について〕



図１４で示した構成では、第２プレート５が、第２平板部５Ｐと、第２壁部５Ｗと、第２接合部５Ｃと、を有する。そして、支持部材２０が第２接合部５Ｃを支持する。この構成では、支持部材２０は、第２壁部５Ｗとの間に隙間ｄ（ｍｍ）が介在する位置で、第２接合部５Ｃを支持することが望ましい。なお、隙間ｄの値は、任意に設定可能である。　 [7. About the position of the support member with respect to the wall]



In the configuration shown in FIG. 14, the second plate 5 has a second flat plate portion 5P, a second wall portion 5W, and a second joint portion 5C. Then, the support member 20 supports the second joint portion 5C. In this configuration, it is desirable that the support member 20 supports the second joint portion 5C at a position where a gap d (mm) is interposed between the support member 20 and the second wall portion 5W. The value of the gap d can be arbitrarily set.
また、図９で示した構成では、第１プレート４が、第１平板部４Ｐと、第１壁部４Ｗと、第１接合部４Ｃと、を有する。そして、支持部材２０が第１接合部４Ｃを支持する。この構成では、支持部材２０は、第１壁部４Ｗとの間に隙間ｄが介在する位置で、第１接合部４Ｃを支持することが望ましい。　 Further, in the configuration shown in FIG. 9, the first plate 4 has a first flat plate portion 4P, a first wall portion 4W, and a first joint portion 4C. Then, the support member 20 supports the first joint portion 4C. In this configuration, it is desirable that the support member 20 supports the first joint portion 4C at a position where a gap d is interposed between the support member 20 and the first wall portion 4W. It was
さらに、図１０で示した構成では、第１プレート４が、第１平板部４Ｐと、第１壁部４Ｗと、第１接合部４Ｃと、を有する。そして、一方の支持部材２０が第１接合部４Ｃを支持する。また、第２プレート５が、第２平板部５Ｐと、第２壁部５Ｗと、第２接合部５Ｃと、を有する。そして、他方の支持部材２０が第２接合部５Ｃを支持する。この構成では、一方の支持部材２０が第１壁部４Ｗとの間に隙間ｄが介在する位置で、第１接合部４Ｃを支持し、他方の支持部材２０が、第２壁部５Ｗとの間に隙間ｄが介在する位置で、第２接合部５Ｃを支持することが望ましい。　 Further, in the configuration shown in FIG. 10, the first plate 4 has a first flat plate portion 4P, a first wall portion 4W, and a first joint portion 4C. Then, one of the support members 20 supports the first joint portion 4C. Further, the second plate 5 has a second flat plate portion 5P, a second wall portion 5W, and a second joint portion 5C. Then, the other support member 20 supports the second joint portion 5C. In this configuration, one support member 20 supports the first joint portion 4C at a position where a gap d is interposed between the first wall portion 4W and the other support member 20 with the second wall portion 5W. It is desirable to support the second joint portion 5C at a position where the gap d is interposed between them. It was
すなわち、本実施形態の熱伝導ユニット１では、第１プレート４および第２プレート５の少なくとも一方は、厚み方向と交差して位置する平板部Ｐと、厚み方向から見て平板部Ｐを囲んで位置する壁部Ｗと、を有する。第１接合部４Ｃまたは第２接合部５Ｃは、壁部Ｗを介して平板部Ｐとつながる。なお、上記の平板部Ｐは、第１平板部４Ｐおよび第２平板部５Ｐの少なくとも一方を含む。また、上記の壁部Ｗは、第１壁部４Ｗおよび第２壁部５Ｗの少なくとも一方を含む。そして、支持部材２０は、壁部Ｗとの間に隙間ｄが介在する位置で、第１接合部４Ｃまたは第２接合部５Ｃを支持する。　 That is, in the heat conduction unit 1 of the present embodiment, at least one of the first plate 4 and the second plate 5 surrounds the flat plate portion P located so as to intersect the thickness direction and the flat plate portion P when viewed from the thickness direction. It has a wall portion W to be located. The first joint portion 4C or the second joint portion 5C is connected to the flat plate portion P via the wall portion W. The flat plate portion P includes at least one of the first flat plate portion 4P and the second flat plate portion 5P. Further, the wall portion W includes at least one of the first wall portion 4W and the second wall portion 5W. Then, the support member 20 supports the first joint portion 4C or the second joint portion 5C at a position where the gap d is interposed with the wall portion W. It was
壁部Ｗと支持部材２０との間に隙間ｄが介在することにより、発熱体Ｈ（図３参照）で発生した熱が、熱伝導部材１０の壁部Ｗを介して支持部材２０に伝わりにくくなる。したがって、支持部材２０の上記熱による温度上昇を抑制することができる。その結果、熱に弱い他の電子部品を支持部材２０の周辺にさらに配置するレイアウトを採用することが可能となる。また、壁部Ｗと支持部材２０との間に隙間ｄが介在すると、支持部材２０の開口２０Ｐ（図８参照）の内側に熱伝導部材１０を嵌め込むことが容易となり、熱伝導ユニット１の組立性も向上する。　 Since the gap d is interposed between the wall portion W and the support member 20, the heat generated by the heating element H (see FIG. 3) is difficult to be transmitted to the support member 20 through the wall portion W of the heat conductive member 10. Become. Therefore, it is possible to suppress the temperature rise of the support member 20 due to the heat. As a result, it becomes possible to adopt a layout in which other heat-sensitive electronic components are further arranged around the support member 20. Further, when the gap d is interposed between the wall portion W and the support member 20, it becomes easy to fit the heat conduction member 10 inside the opening 20P (see FIG. 8) of the support member 20, and the heat conduction unit 1 Assemblability is also improved. It was
〔８．支持部材の材料について〕



本実施形態では、支持部材２０は、熱伝導部材１０の第１プレート４および第２プレート５と同等の熱伝導率を有する材料、または第１プレート４および第２プレート５よりも熱伝導率の低い材料で構成される。例えば、第１プレート４および第２プレート５が銅で構成される場合、支持部材２０としては、銅、アルミニウム、鉄、ステンレス鋼、カーボンなどの材料で構成される。ここで、各金属材料の熱伝導率は、その単位を（Ｗ／ｍ・Ｋ）として、銅；約４０３、アルミニウム；２３６、鉄；８３．５、ステンレス鋼（ＳＵＳ３０４）；１６、カーボン；５８、である。　 [8. About the material of the support member]



In the present embodiment, the support member 20 is made of a material having the same thermal conductivity as the first plate 4 and the second plate 5 of the heat conductive member 10, or has a higher thermal conductivity than the first plate 4 and the second plate 5. Composed of low material. For example, when the first plate 4 and the second plate 5 are made of copper, the support member 20 is made of a material such as copper, aluminum, iron, stainless steel, and carbon. Here, the thermal conductivity of each metal material is, in its unit (W / m · K), copper; about 403, aluminum; 236, iron; 83.5, stainless steel (SUS304); 16, carbon; 58. ,.
特に、支持部材２０は、第１プレート４および第２プレート５よりも熱伝導率の低い材料で構成されることが望ましい。例えば、第１プレート４および第２プレート５が銅で構成される場合、支持部材２０としては、アルミニウム、鉄、ステンレス鋼、カーボンなどの材料で構成されることが望ましい。 In particular, it is desirable that the support member 20 is made of a material having a lower thermal conductivity than that of the first plate 4 and the second plate 5. For example, when the first plate 4 and the second plate 5 are made of copper, it is desirable that the support member 20 is made of a material such as aluminum, iron, stainless steel, or carbon.
このように、支持部材２０の熱伝導率は、第１プレート４および第２プレート５の熱伝導率よりも低い。この構成では、発熱体Ｈ（図３参照）で発生した熱が、熱伝導部材１０を介して支持部材２０に伝わりにくくなる。これにより、熱伝導部材１０の内部で、発熱側（発熱体Ｈとの接触側）と放熱側との間での作動媒体２の移動（循環）を効率よく行って、放熱効率を向上させることが可能となる。　 As described above, the thermal conductivity of the support member 20 is lower than the thermal conductivity of the first plate 4 and the second plate 5. In this configuration, the heat generated by the heating element H (see FIG. 3) is less likely to be transferred to the support member 20 via the heat conductive member 10. As a result, the working medium 2 is efficiently moved (circulated) between the heat generating side (contact side with the heating element H) and the heat radiating side inside the heat conductive member 10, and the heat radiating efficiency is improved. Is possible. It was
特に、支持部材２０は、第１プレート４および第２プレート５よりもヤング率の高い材料で構成されることが望ましい。例えば、第１プレート４および第２プレート５が銅で構成される場合、支持部材２０としては、ステンレス鋼（ＳＵＳ３０４）などの材料で構成されることが望ましい。ちなみに、銅のヤング率は、約１３０ＧＰａであり、ステンレス鋼のヤング率は、約１９７ＧＰａである。支持部材２０のヤング率が第１プレート４および第２プレート５よりも高い場合、支持部材２０は第１プレート４および第２プレート５よりも剛性が高く、変形しにくい。したがって、熱膨張による熱伝導部材１０の反りを、支持部材２０で抑制する効果を高めることができる。　 In particular, it is desirable that the support member 20 is made of a material having a higher Young's modulus than the first plate 4 and the second plate 5. For example, when the first plate 4 and the second plate 5 are made of copper, it is desirable that the support member 20 is made of a material such as stainless steel (SUS304). Incidentally, the Young's modulus of copper is about 130 GPa, and the Young's modulus of stainless steel is about 197 GPa. When the Young's modulus of the support member 20 is higher than that of the first plate 4 and the second plate 5, the support member 20 has higher rigidity than the first plate 4 and the second plate 5, and is less likely to be deformed. Therefore, the effect of suppressing the warp of the heat conductive member 10 due to thermal expansion by the support member 20 can be enhanced. It was
〔９．冷却装置について〕



図１７は、冷却装置１００の概略の構成を示す断面図である。冷却装置１００は、上述した本実施形態の熱伝導ユニット１と、筐体４０と、を有する。筐体４０は、冷却媒体の供給口４０－１および排出口４０－２を有する。冷却媒体は、例えば水である。この場合、筐体４０は、ウォータージャケットとも呼ばれる。筐体４０は、フィン３０を熱伝導部材１０とは反対側から（例えば＋Ｚ方向側から）覆う。すなわち、冷却装置１００は、熱伝導ユニット１と、冷却媒体の供給口４０－１を有し、フィン３０を熱伝導部材１０とは反対側から覆う筐体４０と、を有する。　 [9. About the cooling device]



FIG. 17 is a cross-sectional view showing a schematic configuration of the cooling device 100. The cooling device 100 includes the heat conduction unit 1 of the present embodiment described above and the housing 40. The housing 40 has a supply port 40-1 and a discharge port 40-2 for the cooling medium. The cooling medium is, for example, water. In this case, the housing 40 is also called a water jacket. The housing 40 covers the fins 30 from the side opposite to the heat conductive member 10 (for example, from the + Z direction side). That is, the cooling device 100 has a heat conduction unit 1 and a housing 40 that has a supply port 40-1 for a cooling medium and covers the fins 30 from the side opposite to the heat conduction member 10.
冷却媒体が供給口４０－１を介して筐体４０内に導入されると、冷却媒体によってフィン３０が冷却される。フィン３０を冷却した冷却媒体は、排出口４０－２から筐体４０の外部に排出される。以降、冷却媒体の筐体４０内への投入、および筐体４０からの排出が繰り返される。なお、図１７における破線の矢印は、冷却媒体が流れる流路を示す。　 When the cooling medium is introduced into the housing 40 via the supply port 40-1, the fins 30 are cooled by the cooling medium. The cooling medium that has cooled the fins 30 is discharged to the outside of the housing 40 from the discharge port 40-2. After that, the cooling medium is repeatedly put into the housing 40 and discharged from the housing 40. The broken line arrow in FIG. 17 indicates the flow path through which the cooling medium flows. It was
筐体４０を有する冷却装置１００の構成では、上記のように、供給口４０－１を介して筐体４０内に冷却媒体を供給して、筐体４０内のフィン３０を冷却することができる。これにより、熱伝導部材１０の放熱効率を向上させることができる。　 In the configuration of the cooling device 100 having the housing 40, as described above, the cooling medium can be supplied into the housing 40 through the supply port 40-1 to cool the fins 30 in the housing 40. .. This makes it possible to improve the heat dissipation efficiency of the heat conductive member 10. It was
図１８は、図１７とは異なる断面（ＹＺ断面）での冷却装置１００の断面図である。なお、熱伝導部材１０、支持部材２０およびフィン３０の構成は、図５で示した構成と同じとする。上述した筐体４０は、締結穴４０ａを有する。締結穴４０ａの内面には、ねじ溝が切られている。上記のねじ溝は、締結部材５０の外表面のねじと噛み合う。締結穴４０ａは、－Ｚ方向側が開口し、＋Ｚ方向側が閉じた穴であるが、Ｚ方向に貫通する貫通孔であってもよい。また、筐体４０において、締結穴４０ａは、支持部材２０の第１貫通孔２０ａおよび熱伝導部材１０の外周領域１０Ｃの第２貫通孔１０ａとＺ方向において重なる位置にある。　 FIG. 18 is a cross-sectional view of the cooling device 100 having a cross section (YZ cross section) different from that of FIG. The configurations of the heat conductive member 10, the support member 20, and the fins 30 are the same as those shown in FIG. The housing 40 described above has a fastening hole 40a. A thread groove is cut on the inner surface of the fastening hole 40a. The above thread groove meshes with the screw on the outer surface of the fastening member 50. The fastening hole 40a is a hole that is open on the −Z direction side and closed on the + Z direction side, but may be a through hole that penetrates in the Z direction. Further, in the housing 40, the fastening hole 40a is located at a position overlapping the first through hole 20a of the support member 20 and the second through hole 10a of the outer peripheral region 10C of the heat conductive member 10 in the Z direction. It was
つまり、図１８で示す冷却装置１００は、締結部材５０をさらに備える。支持部材２０は、第１貫通孔２０ａを有する。熱伝導部材１０の外周領域１０Ｃは、第２貫通孔１０ａを有する。筐体４０は、締結穴４０ａを有する。そして、第１貫通孔２０ａおよび第２貫通孔１０ａは、厚み方向において締結穴４０ａと重なって位置する。　 That is, the cooling device 100 shown in FIG. 18 further includes a fastening member 50. The support member 20 has a first through hole 20a. The outer peripheral region 10C of the heat conductive member 10 has a second through hole 10a. The housing 40 has a fastening hole 40a. The first through hole 20a and the second through hole 10a are positioned so as to overlap the fastening hole 40a in the thickness direction. It was
このような構成では、締結部材５０を第１貫通孔２０ａおよび第２貫通孔１０ａを介して締結穴４０ａに挿入する。締結部材５０を回転させることで、締結部材５０の外表面のねじが締結穴４０ａのねじ溝と噛み合い、締結部材５０が固定される。すなわち、締結部材５０は、第１貫通孔２０ａおよび第２貫通孔１０ａを貫通して、締結穴４０ａに固定される。　 In such a configuration, the fastening member 50 is inserted into the fastening hole 40a via the first through hole 20a and the second through hole 10a. By rotating the fastening member 50, the screws on the outer surface of the fastening member 50 mesh with the screw grooves of the fastening hole 40a, and the fastening member 50 is fixed. That is, the fastening member 50 penetrates the first through hole 20a and the second through hole 10a and is fixed to the fastening hole 40a. It was
このように、筐体４０が、第１貫通孔２０ａおよび第２貫通孔１０ａとＺ方向において重なった位置に締結穴４０ａを有する構成では、第１貫通孔２０ａ、第２貫通孔１０ａ、および締結穴４０ａに締結部材５０を挿入して、支持部材２０、熱伝導部材１０、および筐体４０の三者を一体的に締結（共締め）することができる。これにより、上記三者が強固に固定された冷却装置１００を実現することができる。　 As described above, in the configuration in which the housing 40 has the fastening hole 40a at a position where the housing 40 overlaps the first through hole 20a and the second through hole 10a in the Z direction, the first through hole 20a, the second through hole 10a, and the fastening are fastened. By inserting the fastening member 50 into the hole 40a, the support member 20, the heat conductive member 10, and the housing 40 can be integrally fastened (co-tightened). As a result, it is possible to realize a cooling device 100 in which the above three parties are firmly fixed. It was
なお、支持部材２０と熱伝導部材１０との固定、および熱伝導部材１０と筐体４０との固定は、ろう付けによってそれぞれ行われてもよい。この場合でも、支持部材２０、熱伝導部材１０、筐体４０の三者を強固に固定することができる。　 The support member 20 and the heat conductive member 10 may be fixed, and the heat conductive member 10 and the housing 40 may be fixed by brazing. Even in this case, the support member 20, the heat conductive member 10, and the housing 40 can be firmly fixed. It was
〔１０．支持部材の他の構成〕



図１９は、熱伝導ユニット１に適用される支持部材２０の他の構成を示す底面図である。支持部材２０は、図８で示したフレーム２０Ｆを２以上に分割した構成（分割フレーム）であってもよい。図１９では、支持部材２０が、第１支持部品２０Ｔ１と、第２支持部品２０Ｔ２との２部品を有する。第１支持部品２０Ｔ１は、第１長手支持部２１－１と第２短手支持部２２－２とをつなぎ合わせたＬ字形の部品である。第２支持部品２０Ｔ２は、第２長手支持部２１－２と第１短手支持部２２－１とをつなぎ合わせたＬ字形の部品である。　 [10. Other configurations of support members]



FIG. 19 is a bottom view showing another configuration of the support member 20 applied to the heat conduction unit 1. The support member 20 may have a configuration (divided frame) in which the frame 20F shown in FIG. 8 is divided into two or more. In FIG. 19, the support member 20 has two components, a first support component 20T1 and a second support component 20T2. The first support component 20T1 is an L-shaped component in which the first longitudinal support portion 21-1 and the second short support portion 22-2 are connected. The second support component 20T2 is an L-shaped component in which the second longitudinal support portion 21-2 and the first short support portion 22-1 are connected.
第１支持部品２０Ｔ１および第２支持部品２０Ｔ２を熱伝導部材１０の外形に沿って位置させて、外周領域１０Ｃに接触させる。ただし、第１支持部品２０Ｔ１と第２支持部品２０Ｔ２とは互いに非接触で位置させる。これにより、熱伝導部材１０の外周領域１０Ｃの全体ではなく、一部が支持部材２０によって支持される。このような支持の仕方でも、熱伝導部材１０の外周領域１０Ｃが補強されるため、熱伝導部材１０に変形が生じにくくなる。したがって、熱伝導部材１０の熱膨張による反りを抑制することができる。　 The first support component 20T1 and the second support component 20T2 are positioned along the outer shape of the heat conductive member 10 and brought into contact with the outer peripheral region 10C. However, the first support component 20T1 and the second support component 20T2 are positioned so as not to contact each other. As a result, not the entire outer peripheral region 10C of the heat conductive member 10 but a part thereof is supported by the support member 20. Even with such a support method, the outer peripheral region 10C of the heat conductive member 10 is reinforced, so that the heat conductive member 10 is less likely to be deformed. Therefore, it is possible to suppress the warp of the heat conductive member 10 due to thermal expansion. It was
図２０は、支持部材２０のさらに他の構成を示す底面図である。支持部材２０は、第１長手支持部２１－１、第２短手支持部２２－２、第２長手支持部２１－２、第１短手支持部２２－１がそれぞれ離間して配置される構成であってもよい。この構成であっても、熱伝導部材１０の外周領域１０Ｃの全体ではなく、一部が支持部材２０によって支持される。このため、図１９の構成と同様に、熱伝導部材１０の熱膨張による反りを抑制することができる。 FIG. 20 is a bottom view showing still another configuration of the support member 20. In the support member 20, the first longitudinal support portion 21-1, the second short support portion 22-2, the second longitudinal support portion 21-2, and the first short support portion 22-1 are arranged apart from each other. It may be a configuration. Even with this configuration, not the entire outer peripheral region 10C of the heat conductive member 10 but a part thereof is supported by the support member 20. Therefore, as in the configuration of FIG. 19, warpage due to thermal expansion of the heat conductive member 10 can be suppressed.
〔１１．その他〕



図２１は、熱伝導部材１０の他の構成を示す斜視図である。熱伝導部材１０の外周領域１０Ｃの短手部１０Ｓが支持部材２０によって支持される構成では、閉鎖部６０は短手部１０Ｓに位置してもよい。閉鎖部６０が位置する短手部１０Ｓが支持部材２０によって支持されることにより、短手部１０Ｓが補強される。したがって、この構成であっても、閉鎖部６０を形成する前に、つまり、内部空間Ｓと連通していた連通孔６０ａ１（図１３参照）を閉鎖する前に、その連通孔６０ａ１を介して、内部の内部空間Ｓに作動媒体２を安定して注入することができる。　 [11. others〕



FIG. 21 is a perspective view showing another configuration of the heat conductive member 10. In a configuration in which the short portion 10S of the outer peripheral region 10C of the heat conductive member 10 is supported by the support member 20, the closed portion 60 may be located at the short portion 10S. The short portion 10S where the closed portion 60 is located is supported by the support member 20, so that the short portion 10S is reinforced. Therefore, even in this configuration, before forming the closed portion 60, that is, before closing the communication hole 60a1 (see FIG. 13) that communicates with the internal space S, the communication hole 60a1 is passed through the communication hole 60a1. The working medium 2 can be stably injected into the internal internal space S.
図２２は、変形例の熱伝導ユニット１Ａの分解斜視図である。図２２に示すとおり、熱伝導ユニット１Ａは、熱伝導部材１０と支持部材２０との間に配置されるスペーサ部材８０をさらに有する。そして、スペーサ部材８０は、熱伝導部材１０および支持部材２０のそれぞれと接触する。　 FIG. 22 is an exploded perspective view of the heat conduction unit 1A of the modified example. As shown in FIG. 22, the heat conduction unit 1A further includes a spacer member 80 arranged between the heat conduction member 10 and the support member 20. Then, the spacer member 80 comes into contact with each of the heat conductive member 10 and the support member 20. It was
スペーサ部材８０は、第１スペーサ部８１と、第２スペーサ部８２とを有する。第１スペーサ部８１は、支持部材２０の第１支持部２１と第２プレート５の第２接合部５Ｃとの間に配置される。また、第２スペーサ部８２は、支持部材２０の第２支持部２２と第２プレート５の第２接合部５Ｃとの間に配置される。本実施形態では、スペーサ部材８０は、単一の部材として形成されるが、第１スペーサ部８１および第２スペーサ部８２がそれぞれ異なる部材として形成されてもよい。その場合、第１スペーサ部８１と第２スペーサ部８２とは、互いに隙間をあけて配置されてもよい。　 The spacer member 80 has a first spacer portion 81 and a second spacer portion 82. The first spacer portion 81 is arranged between the first support portion 21 of the support member 20 and the second joint portion 5C of the second plate 5. Further, the second spacer portion 82 is arranged between the second support portion 22 of the support member 20 and the second joint portion 5C of the second plate 5. In the present embodiment, the spacer member 80 is formed as a single member, but the first spacer portion 81 and the second spacer portion 82 may be formed as different members. In that case, the first spacer portion 81 and the second spacer portion 82 may be arranged with a gap between them. It was
スペーサ部材８０は、複数個のスペーサ貫通孔８０ａを有する。スペーサ部材８０において、スペーサ貫通孔８０ａは、支持部材２０の第１貫通孔２０ａとＺ方向において重なって位置する。これにより、支持部材２０の第１貫通孔２０ａおよび熱伝導部材１０の第２貫通孔１０ａ（第２開口部５ａ、第１開口部４ａ）、に挿入される締結部材５０がスペーサ貫通孔８０ａにも挿入される。上述のように、締結部材５０によって、熱伝導部材１０と支持部材２０とが締結（共締め）されるとき、スペーサ部材８０は、熱伝導部材１０および支持部材２０と接触した状態で締結（共締め）される。　 The spacer member 80 has a plurality of spacer through holes 80a. In the spacer member 80, the spacer through hole 80a is located so as to overlap the first through hole 20a of the support member 20 in the Z direction. As a result, the fastening member 50 inserted into the first through hole 20a of the support member 20 and the second through hole 10a (second opening 5a, first opening 4a) of the heat conductive member 10 is inserted into the spacer through hole 80a. Is also inserted. As described above, when the heat conductive member 10 and the support member 20 are fastened (co-tightened) by the fastening member 50, the spacer member 80 is fastened (co-tightened) in contact with the heat conductive member 10 and the support member 20. (Tightened). It was
そして、第１スペーサ部８１および第２スペーサ部８２は、支持部材２０よりも熱伝導率が小さい材料で形成される。すなわち、スペーサ部材８０の熱伝導率は、支持部材２０の熱伝導率よりも小さい。　 The first spacer portion 81 and the second spacer portion 82 are formed of a material having a thermal conductivity lower than that of the support member 20. That is, the thermal conductivity of the spacer member 80 is smaller than the thermal conductivity of the support member 20. It was
このように構成することで、スペーサ部材８０の熱抵抗によって、発熱体Ｈ（図３参照）で発生した熱が、熱伝導部材１０を介して支持部材２０に伝わりにくくなり、支持部材２０の熱による変形が抑制される。その結果、支持部材２０によって支持される熱伝導部材１０の反りや撓みなどの変形が抑制される。　 With this configuration, the heat generated by the heating element H (see FIG. 3) is less likely to be transferred to the support member 20 via the heat conductive member 10 due to the thermal resistance of the spacer member 80, and the heat of the support member 20 is reduced. Deformation due to is suppressed. As a result, deformation such as warpage and bending of the heat conductive member 10 supported by the support member 20 is suppressed. It was
図２３は、熱伝導ユニット１ＡをＺＸ断面で切断した断面図である。ここでは、第１スペーサ部８１を主に説明するが、第２スペーサ部８２も同様の構成を有する。図２３に示すように、第１スペーサ部８１は、平板状の基材部８３と、基材部８３の厚み方向の両面に配置された接着層８４、８５を有する。接着層８４は、第２プレート５と接触し、接着層８５は支持部材２０と、接触する。　 FIG. 23 is a cross-sectional view of the heat conduction unit 1A cut along the ZX cross section. Here, the first spacer portion 81 will be mainly described, but the second spacer portion 82 also has the same configuration. As shown in FIG. 23, the first spacer portion 81 has a flat plate-shaped base material portion 83 and adhesive layers 84 and 85 arranged on both sides of the base material portion 83 in the thickness direction. The adhesive layer 84 is in contact with the second plate 5, and the adhesive layer 85 is in contact with the support member 20. It was
第１スペーサ部８１は、接着層８４によって第２プレート５の第２接合部５Ｃに接着されるとともに、接着層８５によって支持部材２０の第１支持部２１に接着される。なお、第２スペーサ部８２も同様に、接着層によって第２プレート５の第２接合部５Ｃおよび第２支持部２２に接着される。　 The first spacer portion 81 is adhered to the second joint portion 5C of the second plate 5 by the adhesive layer 84, and is also adhered to the first support portion 21 of the support member 20 by the adhesive layer 85. Similarly, the second spacer portion 82 is also adhered to the second joint portion 5C and the second support portion 22 of the second plate 5 by the adhesive layer. It was
熱伝導部材１０と支持部材２０とは、締結部材５０で締結される。スペーサ部材８０が、熱伝導部材１０と支持部材２０とを接着することで、締結部材５０で締結するときに、熱伝導部材１０および支持部材２０を強固に固定できる。また、接着によって仮止めをおこなうことも可能であり、熱伝導部材１０および支持部材２０を仮止めした状態で保持が容易になり、作業効率を高めることができる。　 The heat conductive member 10 and the support member 20 are fastened by the fastening member 50. By adhering the heat conductive member 10 and the support member 20 to each other, the spacer member 80 can firmly fix the heat conductive member 10 and the support member 20 when fastening with the fastening member 50. Further, it is also possible to temporarily fix the heat conductive member 10 and the support member 20 by bonding, so that the heat conductive member 10 and the support member 20 can be easily held in a temporarily fixed state, and the work efficiency can be improved. It was
なお、本変形例のスペーサ部材８０は、厚み方向の両面に接着層８４および接着層８５を有しているが、これに限定されない。例えば、熱伝導部材１０側にのみ接着層８４を有していてもよいし、支持部材２０側にのみ接着層８５を有していてもよい。すなわち、スペーサ部材８０は、熱伝導部材１０および支持部材２０の少なくとも一方と接着される接着層８４、８５を有してもよい。　 The spacer member 80 of this modification has an adhesive layer 84 and an adhesive layer 85 on both sides in the thickness direction, but is not limited thereto. For example, the adhesive layer 84 may be provided only on the heat conductive member 10 side, or the adhesive layer 85 may be provided only on the support member 20 side. That is, the spacer member 80 may have adhesive layers 84 and 85 that are adhered to at least one of the heat conductive member 10 and the support member 20. It was
スペーサ部材８０として、基材部８３を備えた構成を挙げているが、これに限定されず、例えば、熱伝導部材１０および支持部材２０の一方または両方に接着剤を塗布して、接着層を構成するとともに、スペーサ部材８０として利用してもよい。　 As the spacer member 80, a configuration including a base material portion 83 is mentioned, but the present invention is not limited to this, and for example, an adhesive is applied to one or both of the heat conductive member 10 and the support member 20 to form an adhesive layer. In addition to being configured, it may be used as the spacer member 80. It was
図２４は、熱伝導ユニットの他の例をＺＸ断面で切断した断面図である。図２４に示すように、スペーサ部材８０は、第２プレート５の第２壁部５Ｗと支持部材２０との間に配置されてもよい。このように配置することで、第２プレート５の第２壁部５Ｗから支持部材２０への熱伝達が抑制される。また、第２壁部５Ｗの厚み方向への変形も支持部材２０によって抑制される。これにより、熱伝導部材１０の変形を抑制する効果を高めることが可能である。　 FIG. 24 is a cross-sectional view taken along the ZX cross section of another example of the heat conductive unit. As shown in FIG. 24, the spacer member 80 may be arranged between the second wall portion 5W of the second plate 5 and the support member 20. By arranging in this way, heat transfer from the second wall portion 5W of the second plate 5 to the support member 20 is suppressed. Further, the deformation of the second wall portion 5W in the thickness direction is also suppressed by the support member 20. This makes it possible to enhance the effect of suppressing the deformation of the heat conductive member 10. It was
図２５は、さらに別の変形例の熱伝導ユニット１ＢのＹＺ断面で切断した断面図である。図２６は、図２５に示す熱伝導ユニット１ＢのＺＸ断面で切断した断面図である。図２５、図２６に示すとおり、熱伝導ユニット１Ｂにおいて、支持部材２０の第１支持部２１および第２支持部２２は第２プレート５と接触する凸部２３を有する。これ以外の点において、熱伝導ユニット１Ｂは熱伝導ユニット１と同じ構成を有する。そのため、熱伝導ユニット１Ｂにおいて、実質上、熱伝導ユニット１と同じ部分には、同じ符号を付すととともに、同じ部分の詳細な説明を省略する。　 FIG. 25 is a cross-sectional view taken along the YZ cross section of the heat conduction unit 1B of yet another modification. FIG. 26 is a cross-sectional view taken along the ZX cross section of the heat conduction unit 1B shown in FIG. 25. As shown in FIGS. 25 and 26, in the heat conduction unit 1B, the first support portion 21 and the second support portion 22 of the support member 20 have a convex portion 23 that comes into contact with the second plate 5. In other respects, the heat transfer unit 1B has the same configuration as the heat transfer unit 1. Therefore, in the heat conduction unit 1B, substantially the same parts as the heat conduction unit 1 are designated by the same reference numerals, and detailed description of the same parts will be omitted. It was
図２５、図２６に示すとおり、支持部材２０の第１支持部２１および第２支持部２２は、第２プレート５の第２壁部５Ｗおよび第２接合部５Ｃと接触する。そして、支持部材２０は、第２プレート５と接触する凸部２３を有する。さらに説明すると、凸部２３は、第１支持部２１および第２支持部２２の第２接合部５Ｃと対向する対向面から突出し、先端が第２接合部５Ｃと接触する第１凸部２３－１を有する。また、凸部２３は、第１支持部２１および第２支持部２２の第２壁部５Ｗと対向する対向面から突出し、先端が第２壁部５Ｗと接触する第２凸部２３－２を有する。　 As shown in FIGS. 25 and 26, the first support portion 21 and the second support portion 22 of the support member 20 come into contact with the second wall portion 5W and the second joint portion 5C of the second plate 5. The support member 20 has a convex portion 23 that comes into contact with the second plate 5. More specifically, the convex portion 23 protrudes from the facing surface of the first support portion 21 and the second support portion 22 facing the second joint portion 5C, and the tip of the convex portion 23 comes into contact with the second joint portion 5C. Has 1. Further, the convex portion 23 projects from the facing surface of the first support portion 21 and the second support portion 22 facing the second wall portion 5W, and the tip of the convex portion 23 comes into contact with the second wall portion 5W. Have. It was
支持部材２０は、第１凸部２３－１を介して第２接合部５Ｃと接触する。その結果、支持部材２０の第２接合部５Ｃと対向する面が、第２接合部５Ｃと全面接触する場合に比べて、支持部材２０と第２接合部５Ｃとの接触面積が小さくなる。これにより、第２接合部５Ｃから支持部材２０に熱が伝わるときの熱抵抗が大きくなり、第２接合部５Ｃから支持部材２０に熱が伝わりにくい。　 The support member 20 comes into contact with the second joint portion 5C via the first convex portion 23-1. As a result, the contact area between the support member 20 and the second joint portion 5C is smaller than that in the case where the surface of the support member 20 facing the second joint portion 5C is in full contact with the second joint portion 5C. As a result, the thermal resistance when heat is transferred from the second joint portion 5C to the support member 20 becomes large, and it is difficult for heat to be transferred from the second joint portion 5C to the support member 20. It was
また、支持部材２０は、第２凸部２３－２を介して第２壁部５Ｗと接触する。その結果、支持部材２０の第２壁部５Ｗと対向する面が、第２壁部５Ｗと全面接触する場合に比べて、支持部材２０と第２壁部５Ｗとの接触面積が小さくなる。これにより、第２壁部５Ｗから支持部材２０に熱が伝わるときの熱抵抗が大きくなり、第２壁部５Ｗから支持部材２０に熱が伝わりにくい。 Further, the support member 20 comes into contact with the second wall portion 5W via the second convex portion 23-2. As a result, the contact area between the support member 20 and the second wall portion 5W becomes smaller than in the case where the surface of the support member 20 facing the second wall portion 5W is in full contact with the second wall portion 5W. As a result, the thermal resistance when heat is transferred from the second wall portion 5W to the support member 20 becomes large, and it is difficult for heat to be transferred from the second wall portion 5W to the support member 20.
以上のとおり、発熱体Ｈ（図３参照）で発生した熱が、熱伝導部材１０を介して支持部材２０に伝わりにくくなり、支持部材２０の熱による変形が抑制される。その結果、支持部材２０によって支持される熱伝導部材１０の反りや撓みなどの変形が抑制される。　 As described above, the heat generated by the heating element H (see FIG. 3) is less likely to be transferred to the support member 20 via the heat conductive member 10, and the deformation of the support member 20 due to heat is suppressed. As a result, deformation such as warpage and bending of the heat conductive member 10 supported by the support member 20 is suppressed. It was
また、支持部材２０は、第２プレート５の第２接合部５Ｃおよび第２壁部５Ｗと接触して支持する構成である。そのため、支持部材２０の第２プレート５の第２接合部５Ｃとの接触面積が小さくなっても、熱伝導部材１０の変形を抑制できる。　 Further, the support member 20 is configured to contact and support the second joint portion 5C and the second wall portion 5W of the second plate 5. Therefore, even if the contact area of the support member 20 with the second joint portion 5C of the second plate 5 becomes small, the deformation of the heat conductive member 10 can be suppressed. It was
なお、支持部材２０が、熱伝導部材１０の反りや撓みなどの変形を抑制できる場合、支持部材２０は、第２壁部５Ｗと接触しなくてもよい。この場合、第２凸部２３－２を省略してもよい。　 When the support member 20 can suppress deformation such as warpage and bending of the heat conductive member 10, the support member 20 does not have to come into contact with the second wall portion 5W. In this case, the second convex portion 23-2 may be omitted. It was
なお、支持部材２０が第２プレート５側に配置される構成について説明したがこれに限定されない。例えば、図９に示す熱伝導ユニット１のような、第１接合部４Ｃを支持する支持部材２０に凸部２３を形成してもよい。なお、図９の構成とは異なり、支持部材２０が、第１壁部４Ｗまたは第２壁部５Ｗと接触する場合、第１凸部２３－１は、第１接合部４Ｃと接触し、第２凸部２３－２は、第２壁部５Ｗと接触する。　 Although the configuration in which the support member 20 is arranged on the second plate 5 side has been described, the present invention is not limited to this. For example, the convex portion 23 may be formed on the support member 20 that supports the first joint portion 4C, such as the heat conduction unit 1 shown in FIG. In addition, unlike the configuration of FIG. 9, when the support member 20 comes into contact with the first wall portion 4W or the second wall portion 5W, the first convex portion 23-1 comes into contact with the first joint portion 4C, and the first The two convex portions 23-2 come into contact with the second wall portion 5W. It was
また、図１０、図１１に示す熱伝導ユニット１のような、第１接合部４Ｃおよび第２接合部５Ｃを支持する支持部材２０に凸部２３を形成してもよい。なお、いずれの構成の場合も、図１０、図１１の構成とは異なり、支持部材２０は、第１壁部４Ｗまたは第２壁部５Ｗと接触する。この場合、第１凸部２３－１は、第１接合部４Ｃおよび第２接合部５Ｃと接触し、第２凸部２３－２は、第１壁部４Ｗおよび第２壁部５Ｗと接触する。　 Further, the convex portion 23 may be formed on the support member 20 that supports the first joint portion 4C and the second joint portion 5C, such as the heat conduction unit 1 shown in FIGS. 10 and 11. In any of the configurations, unlike the configurations of FIGS. 10 and 11, the support member 20 comes into contact with the first wall portion 4W or the second wall portion 5W. In this case, the first convex portion 23-1 is in contact with the first joint portion 4C and the second joint portion 5C, and the second convex portion 23-2 is in contact with the first wall portion 4W and the second wall portion 5W. .. It was
すなわち、支持部材２０は、壁部４Ｗまたは５Ｗと接触する位置で、第１接合部４Ｃまたは第２接合部５Ｃを支持し、支持部材２０の壁部４Ｗまたは５Ｗと対向する面から壁部４Ｗまたは５Ｗに向かって突出し、壁部４Ｗまたは５Ｗと接触する凸部２３－２を有する。　 That is, the support member 20 supports the first joint portion 4C or the second joint portion 5C at a position in contact with the wall portion 4W or 5W, and the wall portion 4W from the surface of the support member 20 facing the wall portion 4W or 5W. Alternatively, it has a convex portion 23-2 that protrudes toward 5W and comes into contact with the wall portion 4W or 5W. It was
また、支持部材２０は、第１接合部４Ｃおよび第２接合部５Ｃの少なくとも一方と対向する対向面から突出し、第１接合部４Ｃおよび第２接合部５Ｃのうち少なくとも一方の対向面と対向する部分と接触する複数の凸部２３－１を有する。　 Further, the support member 20 projects from the facing surface facing at least one of the first joint portion 4C and the second joint portion 5C, and faces at least one facing surface of the first joint portion 4C and the second joint portion 5C. It has a plurality of protrusions 23-1 that come into contact with the portions. It was
図２７は、変形例の熱伝導ユニット１ＣのＺＸ平面と平行な平面で切断した断面図である。図２７に示す熱伝導ユニット１Ｃのウィック構造体３は、第１ウィック部３１と、第２ウィック部３２とを有する。なお、図２７に示す熱伝導ユニット１Ｃの内部空間Ｓには、柱部１３が配置される。柱部１３は、少なくとも１つの中実な中実柱部１３１を有する。また、柱部１３は、少なくとも１つの多孔質の多孔質柱部１３２を有する。なお、柱部１３は、中実柱部１３１のみを有してもよく、多孔質柱部１３２のみを有してもよい。 FIG. 27 is a cross-sectional view taken along a plane parallel to the ZX plane of the heat conduction unit 1C of the modified example. The wick structure 3 of the heat conduction unit 1C shown in FIG. 27 has a first wick portion 31 and a second wick portion 32. The pillar portion 13 is arranged in the internal space S of the heat conduction unit 1C shown in FIG. 27. The pillar portion 13 has at least one solid solid pillar portion 131. Further, the pillar portion 13 has at least one porous pillar portion 132. The pillar portion 13 may have only the solid pillar portion 131, or may have only the porous pillar portion 132.
中実柱部１３１は、内部空間Ｓに配置され、第１プレート４及び第２プレート５を支持する。本実施形態において、中実柱部１３１は、第１プレート４と一体であり、中実な部材である。このとき、中実柱部１３１は、第１プレート４をエッチング又は切削して形成することができる。なお、「中実」な部材は、いわゆるソリッドな部材であることを意味し、中身が密に詰まっており、且つ多孔質でない物体で構成された部材を指す。例えば、「中実」な部材は、内部に空洞が内部材で合ってもよいし、単数又は複数の巨視的な空洞を内部に有する部材であってもよい。　 The solid pillar portion 131 is arranged in the internal space S and supports the first plate 4 and the second plate 5. In the present embodiment, the solid pillar portion 131 is integrated with the first plate 4 and is a solid member. At this time, the solid pillar portion 131 can be formed by etching or cutting the first plate 4. The "solid" member means a so-called solid member, and refers to a member whose contents are tightly packed and which is composed of a non-porous object. For example, a "solid" member may have a cavity inside, which may be an internal member, or may be a member having one or more macroscopic cavities inside. It was
中実柱部１３１は、Ｚ軸方向に延び、中実柱部１３１の上端部及び下端部は、第２プレート５の上面にろう材を用いて接合される。なお、中実柱部１３１は、ろう材による接合以外に溶接などにより第２プレート５と接合されてもよい。なお、中実柱部１３１は、第１プレート４及び第２プレート５と別体であってもよい。　 The solid pillar portion 131 extends in the Z-axis direction, and the upper end portion and the lower end portion of the solid pillar portion 131 are joined to the upper surface of the second plate 5 by using a brazing material. The solid column portion 131 may be joined to the second plate 5 by welding or the like in addition to joining with a brazing material. The solid pillar portion 131 may be separate from the first plate 4 and the second plate 5. It was
中実柱部１３１は、例えば、上方視において円形の円柱で構成される。中実柱部１３１は、ＸＹ面内において２次元的に、かつ、規則的に並んで位置する。Ｚ軸方向において中実柱部１３１が、第１プレート４及び第２プレート５を支持することにより、熱伝導部材１０のＺ軸方向の厚みが一定に保たれる。これにより、熱伝導部材１０のＺ軸方向の変形によって内部空間Ｓが、狭くなることを抑制できる。　 The solid pillar portion 131 is composed of, for example, a circular cylinder when viewed upward. The solid pillar portions 131 are two-dimensionally and regularly arranged side by side in the XY plane. By supporting the first plate 4 and the second plate 5 by the solid pillar portion 131 in the Z-axis direction, the thickness of the heat conductive member 10 in the Z-axis direction is kept constant. As a result, it is possible to prevent the internal space S from becoming narrow due to the deformation of the heat conductive member 10 in the Z-axis direction. It was
多孔質柱部１３２は、Ｚ軸方向に延び、例えば、上方視において円形の円柱で構成される。多孔質柱部１３２は、多孔質の焼結体である。また、多孔質柱部１３２は、ＸＹ面内において２次元的に、かつ、規則的に並んで位置する。多孔質柱部１３２は、隣り合う中実柱部１３１の中間に配置されることが好ましい。なお、熱伝導部材１０は、少なくとも１つの中実な中実柱部１３１と、少なくとも１つの多孔質の多孔質柱部１３２と、を有する。 The porous pillar portion 132 extends in the Z-axis direction and is composed of, for example, a circular cylinder when viewed upward. The porous pillar portion 132 is a porous sintered body. Further, the porous column portions 132 are two-dimensionally and regularly arranged side by side in the XY plane. The porous column portion 132 is preferably arranged in the middle of the adjacent solid column portions 131. The heat conductive member 10 has at least one solid solid pillar portion 131 and at least one porous porous pillar portion 132.
なお、中実柱部１３１と多孔質柱部１３２とは、同数であってもよいし、異なる数であってもよい。熱伝導部材１０の剛性を高めるため、中実柱部１３１の数が、多孔質柱部１３２の数よりも多くてもよい。　 The number of the solid pillar portion 131 and the number of the porous pillar portion 132 may be the same or different. In order to increase the rigidity of the heat conductive member 10, the number of solid column portions 131 may be larger than the number of porous column portions 132. It was
第１ウィック部３１及び第２ウィック部３２は、多孔質であり、作動媒体２の流路を形成する空隙部（不図示）を有する。第１ウィック部３１は、第１プレート４の内面に配置されて内部空間Ｓに臨む。第２ウィック部３２は、第２プレート５の内面に配置されて内部空間Ｓに臨む。なお、本明細書において、内部空間Ｓに「臨む」とは、内部空間Ｓと「向かい合う」ことを指す。　 The first wick portion 31 and the second wick portion 32 are porous and have a gap portion (not shown) that forms a flow path of the working medium 2. The first wick portion 31 is arranged on the inner surface of the first plate 4 and faces the internal space S. The second wick portion 32 is arranged on the inner surface of the second plate 5 and faces the internal space S. In addition, in this specification, "facing" the interior space S means "facing" the interior space S. It was
多孔質柱部１３２は、第１ウィック部３１および第２ウィック部３２を介して第１プレート４および第２プレート５を支持してもよい。熱伝導ユニット１Ｃにおいて、第１プレート４の第１平板部４Ｐおよび第２プレート５の第２平板部５Ｐとは、中実柱部１３１および多孔質柱部１３２にて支持される。上述の通り中実な中実柱部１３１は、多孔質の多孔質柱部１３２よりも高剛性である。そして、内部空間Ｓにおいて、中実柱部１３１が占める割合を、多孔質柱部１３２が占める割合よりも多くすることで、第１プレート４の第１平板部４Ｐと第２プレート５の第２平板部５Ｐの位置精度が高くなるとともに、内外の圧力差による変形が抑制される。　 The porous pillar portion 132 may support the first plate 4 and the second plate 5 via the first wick portion 31 and the second wick portion 32. In the heat conduction unit 1C, the first flat plate portion 4P of the first plate 4 and the second flat plate portion 5P of the second plate 5 are supported by the solid pillar portion 131 and the porous pillar portion 132. As described above, the solid solid column 131 has higher rigidity than the porous porous column 132. Then, in the internal space S, the ratio occupied by the solid pillar portion 131 is made larger than the ratio occupied by the porous pillar portion 132, so that the first flat plate portion 4P of the first plate 4 and the second plate 5 are second. The position accuracy of the flat plate portion 5P is improved, and deformation due to the pressure difference between the inside and outside is suppressed. It was
また、第１ウィック部３１と、第２ウィック部３２と、多孔質柱部１３２と、は、それぞれ多孔質の焼結体であり、一体である。第１ウィック部３１、第２ウィック部３２及び多孔質柱部１３２を多孔質の焼結体とすることにより、メッシュ材よりも容易に製造可能であり、熱伝導ユニット１Ｃの製造コストを下げることができる。また、多孔質柱部１３２を有することによって、第１ウィック部３１から第２ウィック部３２への作動媒体２の流路が増す。　 Further, the first wick portion 31, the second wick portion 32, and the porous pillar portion 132 are porous sintered bodies, respectively, and are integrated with each other. By making the first wick portion 31, the second wick portion 32 and the porous pillar portion 132 into a porous sintered body, it can be manufactured more easily than the mesh material, and the manufacturing cost of the heat conduction unit 1C can be reduced. Can be done. Further, by having the porous pillar portion 132, the flow path of the working medium 2 from the first wick portion 31 to the second wick portion 32 is increased. It was
第２ウィック部３２の厚みＷ２は、第１ウィック部３１の厚みＷ１よりもＺ方向に大きい。発熱体Ｈ側に配置される第２ウィック部３２は、第１ウィック部３１よりも液状の作動媒体２の気化が、促進される。このため、第２ウィック部３２の厚みＷ２を、第１ウィック部３１の厚みＷ１よりもＺ方向に大きくすることにより、第２ウィック部３２の作動媒体２の保持性を第１ウィック部３１の作動媒体２の保持性よりも高くできる。　 The thickness W2 of the second wick portion 32 is larger in the Z direction than the thickness W1 of the first wick portion 31. The second wick portion 32 arranged on the heating element H side promotes the vaporization of the liquid working medium 2 as compared with the first wick portion 31. Therefore, by making the thickness W2 of the second wick portion 32 larger in the Z direction than the thickness W1 of the first wick portion 31, the holding property of the actuating medium 2 of the second wick portion 32 is improved by the first wick portion 31. It can be higher than the retention of the working medium 2. It was
また、第２ウィック部３２の作動媒体２の保持性が、向上することにより、発熱体ＨとＺ方向に対向する領域において、第２ウィック部３２の保持する液状の作動媒体２が完全に気化する、いわゆるドライアウトの発生を抑制できる。　 Further, by improving the holding property of the working medium 2 of the second wick portion 32, the liquid working medium 2 held by the second wick portion 32 is completely vaporized in the region facing the heating element H in the Z direction. It is possible to suppress the occurrence of so-called dry out. It was
さらに、Ｚ方向において、第１ウィック部３１の厚みＷ１と、第２ウィック部３２の厚みＷ２と、第１ウィック部３１と第２ウィック部３２との隙間の長さＷ３とは、以下の式を満たすことが好ましい。　 Further, in the Z direction, the thickness W1 of the first wick portion 31, the thickness W2 of the second wick portion 32, and the length W3 of the gap between the first wick portion 31 and the second wick portion 32 are as follows. It is preferable to satisfy. It was
Ｗ３＞Ｗ２＋Ｗ１　　 W3> W2 + W1
内部空間Ｓにおいて、第１ウィック部３１と第２ウィック部３２とのＺ方向の隙間を大きく設けることにより、第１ウィック部３１から気化した作動媒体２が、内部空間Ｓ内でＸ方向およびＹ方向に拡散し易くなる。これにより、第１ウィック部３１における作動媒体２の凝縮が促進される。　 By providing a large gap in the Z direction between the first wick portion 31 and the second wick portion 32 in the internal space S, the actuating medium 2 vaporized from the first wick portion 31 can be moved in the X direction and Y in the internal space S. It becomes easy to diffuse in the direction. This promotes the condensation of the working medium 2 in the first wick portion 31. It was
また、第２ウィック部３２は、第１ウィック部３１よりも空隙率が高い。これにより、第２ウィック部３２の毛細管力が、第１ウィック部３１の毛細管力よりも大きくなる。　 Further, the second wick portion 32 has a higher porosity than the first wick portion 31. As a result, the capillary force of the second wick portion 32 becomes larger than the capillary force of the first wick portion 31. It was
ここで、空隙率とは、第１ウィック部３１および第２ウィック部３２の全体積に対する空間の体積の割合である。空隙率の単位は％である。空隙率は以下の方法によって求められる。例えば、ウィック構造体３の断面写真から、空間の面積を測定し、空間の面積が全体に占める割合を算出することにより、空隙率を求めることができる。第１ウィック部３１および第２ウィック部３２の断面の観察においては、被写界深度の深い走査型電子顕微鏡を用いることが好ましい。なお、断面の観察の方法は、金属部分と空間とを容易に判別できる方法であればよく、特に限定されない。　 Here, the porosity is the ratio of the volume of the space to the total product of the first wick portion 31 and the second wick portion 32. The unit of porosity is%. The porosity is determined by the following method. For example, the porosity can be obtained by measuring the area of the space from the cross-sectional photograph of the wick structure 3 and calculating the ratio of the area of the space to the whole. When observing the cross sections of the first wick portion 31 and the second wick portion 32, it is preferable to use a scanning electron microscope having a deep depth of field. The method of observing the cross section is not particularly limited as long as it can easily distinguish between the metal portion and the space. It was
なお、本実施形態では、第１ウィック部３１および第２ウィック部３２を多孔質の焼結体で構成しているが、第１ウィック部３１および第２ウィック部３２の少なくとも一方を複数の金属線状部材が編み込まれたメッシュ部材であってもよい。第２ウィック部３２をメッシュ材で構成し、第１ウィック部３１を多孔質の焼結体で構成することにより、第２ウィック部３２の毛細管力を、第１ウィック部３１の毛細管力よりも大きく容易に形成することができる。　 In the present embodiment, the first wick portion 31 and the second wick portion 32 are made of a porous sintered body, but at least one of the first wick portion 31 and the second wick portion 32 is made of a plurality of metals. It may be a mesh member in which a linear member is woven. By forming the second wick portion 32 with a mesh material and the first wick portion 31 with a porous sintered body, the capillary force of the second wick portion 32 is larger than the capillary force of the first wick portion 31. It is large and can be easily formed. It was
本実施形態では、熱伝導ユニット１の熱伝導部材１０をベーパーチャンバーで構成した例について説明したが、熱伝導部材１０はベーパーチャンバーに限定されない。例えば、熱伝導部材１０は、銅プレートおよびグラファイトシートなどの１枚の金属板であってもよく、ヒートパイプであってもよい。 In the present embodiment, an example in which the heat conductive member 10 of the heat conductive unit 1 is configured by a vapor chamber has been described, but the heat conductive member 10 is not limited to the vapor chamber. For example, the heat conductive member 10 may be a single metal plate such as a copper plate and a graphite sheet, or may be a heat pipe.
熱伝導部材１０の種類に応じて、フィン３０を適宜選択してもよい。特に、本実施形態のように、熱伝導部材１０がベーパーチャンバーで構成される場合、フィン３０としてはスタックドフィン３０Ｓを用いることが効果的である。また、熱伝導部材１０が１枚の銅プレートで構成される場合、フィン３０としてはピンフィンを用いることが効果的である。　 The fin 30 may be appropriately selected depending on the type of the heat conductive member 10. In particular, when the heat conductive member 10 is composed of a vapor chamber as in the present embodiment, it is effective to use the stacked fins 30S as the fins 30. Further, when the heat conductive member 10 is composed of one copper plate, it is effective to use pin fins as the fins 30. It was
本実施形態では、熱伝導部材１０を厚み方向から見たときの形状（外形）が矩形である場合について説明したが、熱伝導部材１０の上記形状は矩形には限定されない。例えば、上記形状は正方形であってもよく、その他の多角形であってもよい。　 In the present embodiment, the case where the shape (outer shape) of the heat conductive member 10 when viewed from the thickness direction is rectangular has been described, but the shape of the heat conductive member 10 is not limited to the rectangle. For example, the shape may be a square or another polygon. It was
以上、本発明の実施形態につき説明したが、本発明の範囲はこれに限定されず、発明の主旨を逸脱しない範囲で種々の変更を加えて実施することができる。また、上記実施形態やその変形例は適宜任意に組み合わせることができる。　 Although the embodiments of the present invention have been described above, the scope of the present invention is not limited to this, and various modifications can be made without departing from the gist of the invention. Further, the above-described embodiment and its modifications can be arbitrarily combined. It was
本発明の熱伝導ユニットは、例えばＩＧＢＴのような、高温で発熱する発熱体の冷却に利用可能である。 The heat conduction unit of the present invention can be used for cooling a heating element that generates heat at a high temperature, such as an IGBT.
１　　　熱伝導ユニット　　　　２　　　作動媒体　　　　４　　　第１プレート　　　　４Ｃ　　第１接合部　　　　５　　　第２プレート　　　　５Ｃ　　第２接合部　　　１０　　　熱伝導部材　　　１０ａ　　第２貫通孔　　　１０Ｃ　　外周領域　　　１０Ｌ　　長手部　　　１０Ｍ　　本体領域　　　１０Ｐ　　被支持領域　　　１０Ｓ　　短手部　　　２０　　　支持部材　　　２０ａ　　第１貫通孔　　　２１　　　第１支持部　　　２２　　　第２支持部　　　３０　　　フィン　　　４０　　　筐体　　　４０ａ　　締結穴　　　４０－１　　　供給口　　　５０　　　締結部材　　　６０　　　閉鎖部　　１００　　　冷却装置　　　　Ｋ　　　凹部　　　　Ｐ　　　平板部　　　　Ｓ　　　内部空間　　　　Ｗ　　　壁部　　　ＣＲ　　　接合領域　　　ＮＲ　　　閉鎖領域 1 heat conduction unit 2 working medium 4 1st plate 4C 1st joint 5 2nd plate 5C 2nd joint 10 heat conduction member 10a 2nd through hole 10C main body 10C outer peripheral area 10C Part 20 Support member 20a 1st through hole 21 1st support part 22 2nd support part 30 fins 40 housing 40a fastening hole 40-1 supply port 50 cooling member K space Wall part CR joint area NR closed area

Claims (20)

  1. 作動媒体が収容される内部空間を有する熱伝導部材と、



    前記熱伝導部材を支持する支持部材と、を備え、



    前記熱伝導部材は、



    本体領域と、



    前記熱伝導部材の厚み方向から見て前記本体領域の外周に沿って位置する外周領域と、



    前記内部空間に配置される柱部と、を有し、



    前記支持部材は、前記外周領域の少なくとも一部を支持する、熱伝導ユニット。     A heat conductive member having an internal space in which the working medium is housed,



    A support member for supporting the heat conductive member and a support member are provided.



    The heat conductive member is



    Main body area and



    An outer peripheral region located along the outer circumference of the main body region when viewed from the thickness direction of the heat conductive member, and an outer peripheral region.



    It has a pillar portion arranged in the internal space, and has.



    The support member is a heat conduction unit that supports at least a part of the outer peripheral region.
  2. 前記柱部は、少なくとも１つの中実な中実柱部を有する請求項１に記載の熱伝導ユニット。 The heat conduction unit according to claim 1, wherein the pillar portion has at least one solid solid pillar portion.
  3. 前記柱部は、少なくとも１つの多孔質な多孔質柱部を有する請求項１又は２に記載の熱伝導ユニット。 The heat conduction unit according to claim 1 or 2, wherein the pillar portion has at least one porous porous pillar portion.
  4. 前記熱伝導部材は、前記厚み方向から見て矩形の外形を有し、



    前記外周領域は、前記矩形の長手方向に沿って延びる長手部を有し、



    前記支持部材は、前記外周領域の前記長手部を支持する第１支持部を有する、請求項１～３のいずれかに記載の熱伝導ユニット。     The heat conductive member has a rectangular outer shape when viewed from the thickness direction.



    The outer peripheral region has a longitudinal portion extending along the longitudinal direction of the rectangle.



    The heat conduction unit according to any one of claims 1 to 3, wherein the support member has a first support portion that supports the longitudinal portion of the outer peripheral region.
  5. 前記外周領域は、前記矩形の短手方向に沿って延びる短手部を有し、



    前記支持部材は、前記外周領域の前記短手部を支持する第２支持部を有する、請求項４に記載の熱伝導ユニット。     The outer peripheral region has a short portion extending along the short side of the rectangle.



    The heat conduction unit according to claim 4, wherein the support member has a second support portion that supports the short side portion of the outer peripheral region.
  6. 前記第１支持部および前記第２支持部は、前記熱伝導部材の前記矩形の外形に沿って交互につながる、請求項５に記載の熱伝導ユニット。 The heat conduction unit according to claim 5, wherein the first support portion and the second support portion are alternately connected along the rectangular outer shape of the heat conduction member.
  7. 前記厚み方向から見て、前記支持部材の前記第１支持部の前記短手方向の幅は、前記第２支持部の前記長手方向の幅よりも広い、請求項５又は６に記載の熱伝導ユニット。 The heat conduction according to claim 5 or 6, wherein the width of the first support portion of the support member in the lateral direction is wider than the width of the second support portion in the longitudinal direction when viewed from the thickness direction. unit.
  8. 前記熱伝導部材は、前記厚み方向に重なって位置する第１プレートおよび第２プレートを有し、



    前記第１プレートおよび前記第２プレートの少なくとも一方は、前記内部空間が形成される凹部を有し、



    前記第１プレートは、前記内部空間の外側で前記第２プレートとつながる第１接合部を有し、



    前記第２プレートは、前記内部空間の外側で前記第１プレートとつながる第２接合部を有し、



    前記外周領域は、前記第１接合部および前記第２接合部を有し、



    前記支持部材は、前記第１接合部および前記第２接合部の少なくとも一方を支持する、請求項５または６に記載の熱伝導ユニット。     The heat conductive member has a first plate and a second plate that are overlapped with each other in the thickness direction.



    At least one of the first plate and the second plate has a recess in which the internal space is formed.



    The first plate has a first junction that connects to the second plate outside the interior space.



    The second plate has a second junction that connects to the first plate outside the interior space.



    The outer peripheral region has the first joint portion and the second joint portion.



    The heat conduction unit according to claim 5 or 6, wherein the support member supports at least one of the first joint portion and the second joint portion.
  9. 前記外周領域は、



    前記第１接合部および前記第２接合部の接合領域と、



    前記内部空間の閉鎖部を有する閉鎖領域と、を有し、



    前記閉鎖領域の前記閉鎖部は、前記外周領域の前記長手部および前記短手部の少なくとも一方に位置し、



    前記支持部材は、前記閉鎖部が位置する、前記長手部および前記短手部の少なくとも一方を支持する、請求項８に記載の熱伝導ユニット。     The outer peripheral region is



    With the joint region of the first joint and the second joint,



    With a closed area having a closed portion of the interior space,



    The closed portion of the closed region is located at least one of the longitudinal portion and the short portion of the outer peripheral region.



    The heat conduction unit according to claim 8, wherein the support member supports at least one of the longitudinal portion and the short portion where the closed portion is located.
  10. 前記厚み方向から見て、前記支持部材の前記第１支持部の前記短手方向の幅は、前記第２支持部の前記長手方向の幅よりも広く、



    前記閉鎖部は、前記外周領域の前記長手部に位置する、請求項９に記載の熱伝導ユニット。     When viewed from the thickness direction, the width of the first support portion of the support member in the lateral direction is wider than the width of the second support portion in the longitudinal direction.



    The heat conduction unit according to claim 9, wherein the closed portion is located in the longitudinal portion of the outer peripheral region.
  11. 前記熱伝導部材の厚み方向において、前記第１接合部の厚さと前記第２接合部の厚さとの和は、前記支持部材の厚さよりも小さい、請求項８から１０のいずれかに記載の熱伝導ユニット。 The heat according to any one of claims 8 to 10, wherein the sum of the thickness of the first joint portion and the thickness of the second joint portion is smaller than the thickness of the support member in the thickness direction of the heat conductive member. Conduction unit.
  12. 前記第１プレートおよび前記第２プレートの少なくとも一方は、



    前記厚み方向と交差して位置する平板部と、



    前記厚み方向から見て前記平板部を囲んで位置する壁部と、を有し、



    前記第１接合部または前記第２接合部は、前記壁部を介して前記平板部とつながり、



    前記支持部材は、前記壁部との間に隙間が介在する位置で、前記第１接合部または前記第２接合部を支持する、請求項８から１１のいずれかに記載の熱伝導ユニット。     At least one of the first plate and the second plate



    A flat plate portion located intersecting the thickness direction and



    It has a wall portion located around the flat plate portion when viewed from the thickness direction, and has.



    The first joint portion or the second joint portion is connected to the flat plate portion via the wall portion, and is connected to the flat plate portion.



    The heat conduction unit according to any one of claims 8 to 11, wherein the support member supports the first joint portion or the second joint portion at a position where a gap is interposed between the support member and the wall portion.
  13. 前記第１プレートおよび前記第２プレートの少なくとも一方は、



    前記厚み方向と交差して位置する平板部と、



    前記厚み方向から見て前記平板部を囲んで位置する壁部と、を有し、



    前記第１接合部または前記第２接合部は、前記壁部を介して前記平板部とつながり、



    前記支持部材は、前記壁部と接触する位置で、前記第１接合部および前記第２接合部の少なくとも一方を支持し、



    前記支持部材の前記壁部と対向する面から前記壁部に向かって突出し、前記壁部と接触する凸部を有する、請求項８から１１のいずれかに記載の熱伝導ユニット。     At least one of the first plate and the second plate



    A flat plate portion located intersecting the thickness direction and



    It has a wall portion located around the flat plate portion when viewed from the thickness direction, and has.



    The first joint portion or the second joint portion is connected to the flat plate portion via the wall portion, and is connected to the flat plate portion.



    The support member supports at least one of the first joint portion and the second joint portion at a position in contact with the wall portion.



    The heat conduction unit according to any one of claims 8 to 11, wherein the support member has a convex portion that protrudes from a surface facing the wall portion toward the wall portion and comes into contact with the wall portion.
  14. 前記支持部材は、前記第１接合部および前記第２接合部の少なくとも一方と対向する対向面から突出し、



    前記第１接合部および前記第２接合部のうち少なくとも一方の前記対向面と対向する部分と接触する複数の凸部を有する請求項８から請求項１３のいずれか記載の熱伝導ユニット。     The support member projects from the facing surface facing at least one of the first joint portion and the second joint portion.



    The heat conduction unit according to any one of claims 8 to 13, which has a plurality of convex portions in contact with at least one of the first joint portion and the second joint portion facing the facing surface.
  15. 前記支持部材の熱伝導率は、前記第１プレートおよび前記第２プレートの熱伝導率よりも低い、請求項８から１４のいずれかに記載の熱伝導ユニット。 The heat conduction unit according to any one of claims 8 to 14, wherein the heat conductivity of the support member is lower than the heat conductivity of the first plate and the second plate.
  16. 前記熱伝導部材と前記支持部材との間に配置され、前記熱伝導部材および前記支持部材のそれぞれと接触するスペーサ部をさらに有し、



    前記スペーサ部の熱伝導率は、前記支持部材の熱伝導率よりも小さい請求項１５に記載の熱伝導ユニット。     Further having a spacer portion arranged between the heat conductive member and the support member and in contact with each of the heat conductive member and the support member.



    The heat conductive unit according to claim 15, wherein the heat conductivity of the spacer portion is smaller than the heat conductivity of the support member.
  17. 前記スペーサ部は、前記熱伝導部材および前記支持部材の少なくとも一方と接着される接着層を有する請求項１６に記載の熱伝導ユニット。　 The heat conduction unit according to claim 16, wherein the spacer portion has an adhesive layer that is adhered to at least one of the heat conduction member and the support member. It was
  18. 前記熱伝導部材の放熱側に位置するフィンをさらに備える、請求項１から１７のいずれかに記載の熱伝導ユニット。 The heat conduction unit according to any one of claims 1 to 17, further comprising fins located on the heat dissipation side of the heat conduction member.
  19. 請求項１８に記載の熱伝導ユニットと、



    冷却媒体の供給口を有し、前記フィンを前記熱伝導部材とは反対側から覆う筐体と、を有する、冷却装置。     The heat conduction unit according to claim 18,



    A cooling device having a supply port for a cooling medium and having a housing that covers the fins from a side opposite to the heat conductive member.
  20. 締結部材をさらに備え、



    前記支持部材は、第１貫通孔を有し、



    前記熱伝導部材の前記外周領域は、第２貫通孔を有し、



    前記筐体は、締結穴を有し、



    前記第１貫通孔および前記第２貫通孔は、前記厚み方向において前記締結穴と重なって位置し、



    前記締結部材は、前記第１貫通孔および前記第２貫通孔を貫通して、前記締結穴に固定される、請求項１９に記載の冷却装置。     With more fastening members



    The support member has a first through hole and has a first through hole.



    The outer peripheral region of the heat conductive member has a second through hole and has a second through hole.



    The housing has a fastening hole and has a fastening hole.



    The first through hole and the second through hole are located so as to overlap with the fastening hole in the thickness direction.



    19. The cooling device according to claim 19, wherein the fastening member penetrates the first through hole and the second through hole and is fixed to the fastening hole.
PCT/JP2021/028355 2020-07-31 2021-07-30 Thermal conductive unit and cooling device WO2022025260A1 (en)

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JP2020-131230 2020-07-31
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JP2020-166441 2020-09-30
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JP2020183303 2020-10-30
JP2021-088006 2021-05-25
JP2021088006A JP2023123891A (en) 2020-09-30 2021-05-25 Heat conduction unit and cooling device

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004028442A (en) * 2002-06-25 2004-01-29 Furukawa Electric Co Ltd:The Plate type heat pipe, and its mounting structure
JP2008262974A (en) * 2007-04-10 2008-10-30 Sumitomo Electric Ind Ltd Semiconductor device
JP2013174376A (en) * 2012-02-24 2013-09-05 Furukawa Electric Co Ltd:The Sheet-shaped heat pipe and electronic apparatus having sheet-shaped heat pipe
JP2016050682A (en) * 2014-08-28 2016-04-11 東芝ホームテクノ株式会社 Sheet-type heat pipe
JP2019105416A (en) * 2017-12-13 2019-06-27 大日本印刷株式会社 Vapor chamber

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004028442A (en) * 2002-06-25 2004-01-29 Furukawa Electric Co Ltd:The Plate type heat pipe, and its mounting structure
JP2008262974A (en) * 2007-04-10 2008-10-30 Sumitomo Electric Ind Ltd Semiconductor device
JP2013174376A (en) * 2012-02-24 2013-09-05 Furukawa Electric Co Ltd:The Sheet-shaped heat pipe and electronic apparatus having sheet-shaped heat pipe
JP2016050682A (en) * 2014-08-28 2016-04-11 東芝ホームテクノ株式会社 Sheet-type heat pipe
JP2019105416A (en) * 2017-12-13 2019-06-27 大日本印刷株式会社 Vapor chamber

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