WO2022017346A1 - 一种单相浸没式液冷系统 - Google Patents

一种单相浸没式液冷系统 Download PDF

Info

Publication number
WO2022017346A1
WO2022017346A1 PCT/CN2021/107242 CN2021107242W WO2022017346A1 WO 2022017346 A1 WO2022017346 A1 WO 2022017346A1 CN 2021107242 W CN2021107242 W CN 2021107242W WO 2022017346 A1 WO2022017346 A1 WO 2022017346A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
cooling
cabinet
pipe
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/107242
Other languages
English (en)
French (fr)
Inventor
刘向东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alibaba Group Holding Ltd
Original Assignee
Alibaba Group Holding Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alibaba Group Holding Ltd filed Critical Alibaba Group Holding Ltd
Publication of WO2022017346A1 publication Critical patent/WO2022017346A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the embodiments of this specification relate to the technical field of heat dissipation of electronic devices, and in particular, to a single-phase immersion liquid cooling system.
  • the embodiments of this specification provide a single-phase immersion liquid cooling system, which achieves the technical effect of providing a new cooling method for cooling electronic devices.
  • the embodiments of the present specification provide a single-phase immersion liquid cooling system, including a cabinet and a liquid cooling device, the liquid cooling device includes a driving heat exchange device, a liquid inlet pipe and a liquid outlet pipe, and the driving heat exchange device includes a liquid driver and a liquid cooling device. heat exchanger;
  • the cabinet is used for arranging electronic devices and cooling liquid for cooling the electronic devices, and a liquid inlet pipe fixing hole and a liquid outlet pipe fixing hole are opened on the side wall of the cabinet;
  • the liquid inlet pipe is provided with a liquid inlet valve, and one end of the liquid inlet pipe is communicated with the inside of the cabinet through the liquid inlet pipe fixing hole;
  • the liquid outlet pipe is provided with a liquid outlet valve, and the outlet pipe is One end of the liquid pipe is communicated with the inside of the cabinet through the fixing hole of the liquid outlet pipe; the other ends of the liquid outlet pipe and the liquid inlet pipe are respectively communicated with both ends of the driving heat exchange device;
  • the position of at least one of the liquid inlet valve and the liquid outlet valve is higher than the working liquid level of the cooling liquid in the cabinet.
  • the position of at least one of the liquid inlet valve and the liquid outlet valve is set higher than the working liquid level of the cabinet. Therefore, after the liquid driver is turned off, the cooling liquid falls back, so that the liquid inlet valve and the outlet valve are set to be higher than the working liquid level of the cabinet. There is no coolant in the valve of the liquid valve that is higher than the working liquid level of the cabinet. You can directly repair and replace the valve that is higher than the working liquid level of the cabinet. Compared with setting the position of the liquid valve and the liquid outlet valve below When the working liquid level of the cabinet is reached, it is not necessary to extract the liquid in the cabinet, which greatly reduces the time for maintenance or replacement and reduces the impact on business operation.
  • the position of the liquid inlet valve is higher than the working liquid level of the cooling liquid in the cabinet, and the liquid outlet pipe is set to be lower than the working liquid level of the cabinet, and the inlet of the liquid outlet pipe is set to be lower than the working liquid level of the cabinet.
  • the liquid outlet is provided with a detachable liquid outlet pipe plugging head, it is not only convenient for maintenance and replacement, but also can avoid the technical problem of air accumulation in the liquid outlet pipe, and does not require regular exhaust operation.
  • FIG. 1 shows a schematic structural diagram of a single-phase immersion liquid cooling system according to an embodiment of the present specification
  • FIG. 2 shows a schematic structural diagram of a single-phase immersion liquid cooling system according to another embodiment of the present specification
  • FIG. 3 shows a schematic structural diagram of a single-phase immersion liquid cooling system according to yet another embodiment of the present specification
  • FIG. 4 shows a schematic structural diagram of a single-phase immersion liquid cooling system according to yet another embodiment of the present specification
  • FIG. 5 shows a schematic structural diagram of a single-phase immersion liquid cooling system according to yet another embodiment of the present specification
  • FIG. 6 shows a schematic structural diagram of a single-phase immersion liquid cooling system according to yet another embodiment of the present specification
  • FIG. 7 shows a schematic structural diagram of a single-phase immersion liquid cooling system according to yet another embodiment of the present specification.
  • FIG. 8 shows a schematic structural diagram of a single-phase immersion liquid cooling system according to yet another embodiment of the present specification.
  • FIG. 9 shows a schematic structural diagram of a single-phase immersion liquid cooling system according to yet another embodiment of the present specification.
  • FIG. 10 shows a partial enlarged view of the single-phase immersion liquid cooling system in FIG. 9;
  • FIG. 11 shows a schematic structural diagram of the panel of the cabinet of the single-phase immersion liquid cooling system in FIG. 9 .
  • the embodiment of this specification provides a single-phase immersion liquid cooling system.
  • the single-phase immersion liquid cooling system 100 includes a cabinet 10 and a liquid cooling device.
  • the cabinet 10 is provided with an electronic device 11 .
  • the electronic device 11 is an electronic device of a server.
  • the electronic device 11 may be a switch, a desktop computer, or other electronic devices that require cooling.
  • the liquid cooling device includes a driving heat exchange device 200 , a liquid inlet pipe 20 and a liquid outlet pipe 30 .
  • An electronic device 11 is arranged in the cabinet 10 , and a liquid inlet pipe fixing hole 12 and a liquid outlet pipe fixing hole 13 are opened on the side wall of the cabinet 10 .
  • the liquid inlet pipe 20 is provided with a liquid inlet valve 21 , and one end of the liquid inlet pipe 20 is communicated with the inside of the cabinet 10 through the liquid inlet pipe fixing hole 12 .
  • the liquid in the liquid inlet pipe 20 can be cut off or the liquid in the liquid inlet pipe 20 can be circulated.
  • the liquid outlet pipe 30 is provided with a liquid outlet valve 31 , and one end of the liquid outlet pipe 30 is communicated with the inside of the cabinet 10 through the liquid outlet pipe fixing hole 13 .
  • the liquid in the liquid discharge pipe 30 can be blocked or the liquid in the liquid discharge pipe 30 can be circulated.
  • the end of the liquid inlet pipe 20 extending into the cabinet 10 is located at the upper middle part of the cabinet 10
  • the end of the liquid outlet pipe 30 extending into the cabinet 10 is located at the bottom or middle of the cabinet 10 .
  • the liquid entering the cabinet 10 absorbs the heat of the electronic device 11, it enters the liquid outlet pipe 30, and the liquid that absorbs the heat is led out.
  • the driving heat exchange device 200 includes a liquid driver and a heat exchanger (not shown in the figure), the liquid driver is used to drive the liquid to flow and provide power for the liquid to flow, specifically a pump, etc.; the heat exchanger is used for the liquid to flow. heat exchange.
  • the liquid inlet pipe 20 is communicated with the liquid outlet end of the driving heat exchange device 200, and the liquid outlet pipe 30 is communicated with the liquid inlet end of the driving heat exchange device 200, that is, the liquid inlet pipe 20 and the liquid outlet pipe 30 are respectively connected with the driving Both ends of the heat exchange device 200 are connected to form a liquid circulation loop between the cabinet 10, the liquid outlet pipe 30, the driving heat exchange device 200 and the liquid inlet pipe 20;
  • the cooling liquid in 10 reaches the working liquid level
  • the liquid driver and heat exchanger are started, and the driving cooling liquid circulates in the liquid circuit formed by the cabinet 10, the liquid outlet pipe 30, the driving heat exchange device 200 and the liquid inlet pipe 20, that is, cooling
  • the liquid absorbs the heat generated by the electronic device 11 it enters the heat exchanger through the liquid outlet pipe 30, and after heat exchange and cooling in the heat exchanger, it enters the cabinet 10 through the liquid inlet pipe 20 to cool the electronic device 11. Circulation to achieve cooling of the electronic device 11, and the cooling effect is greatly improved due to the adoption of the cooling liquid
  • the cooling liquid in this specification is a liquid, which has the characteristics of insulation, safety, stability, etc., and has no phase state change within the working temperature range.
  • the cooling fluid may be mineral oil, synthetic oil, fluorocarbon or the like.
  • Fluorocarbons mainly refer to organic compounds or polymers in which hydrogen atoms of corresponding carbon chains are substituted with fluorine, including perfluoroalkanes, perfluorinated ammonia, hydrofluoroethers, perfluoroketones, and hydrofluorocarbons.
  • the positions of the liquid inlet valve 21 and the liquid outlet valve 31 are set higher than the cabinet 10 working liquid level, that is to say, the positions of the liquid inlet valve 21 and the liquid outlet valve 31 can be set to be higher than the working liquid level in the cabinet 10, regardless of the shape and placement of the pipeline, as shown in Figure 2.
  • the liquid inlet valve 21 and the liquid outlet valve 31 are respectively on the vertical pipe parts of the liquid inlet pipe 20 and the liquid outlet pipe 30. As shown in FIG.
  • the liquid inlet valve 21 and the liquid outlet valve 31 are respectively in the liquid inlet pipe 20 and the liquid outlet On the lateral pipe portion of the liquid pipe 30, in other embodiments, if the liquid inlet pipe 20 and the liquid outlet pipe 30 have inclined pipe portions, the liquid inlet valve 21 and the liquid outlet valve 31 can be respectively fed into the liquid pipe 20 and the liquid outlet. on the inclined tube portion of the tube 30 .
  • the liquid inlet valve 21 and the liquid outlet valve 31 can also be arranged on different pipe parts of the liquid inlet pipe 20 and the liquid outlet pipe 30 respectively, for example, the liquid inlet valve 21 can be arranged on the liquid inlet pipe. 20, and the liquid outlet valve 31 is arranged on the vertical pipeline of the liquid outlet pipe 30, etc., which can be set as required.
  • the working liquid level is the height of the liquid in the cabinet 10 that can satisfy the normal operation of the electronic device 11 in the cabinet 10 .
  • the electronic device 11 can work normally only when the temperature is below 40 degrees
  • the working liquid level is the height that can satisfy the liquid in the cabinet 10 when the temperature is below 40 degrees.
  • Different electronic devices 11 have different normal working temperatures, so the working fluid level is also different for different electronic devices 11.
  • the height of the added cooling liquid is greater than the highest point of the liquid inlet pipe 20 and the liquid outlet pipe 30, and after the liquid driver is started, the excess cooling liquid is drawn out, so that the liquid inlet pipe 20 and the liquid outlet pipe can be guaranteed before the liquid driver is started.
  • the tube 30 is filled with liquid to prevent the liquid driver from idling due to absorbing air, resulting in damage to the liquid driver.
  • the liquid driver When the liquid inlet valve 21 and the liquid outlet valve 31 are faulty or damaged, the liquid driver is closed. Since the positions of the liquid inlet valve 21 and the liquid outlet valve 31 are higher than the working liquid level of the cabinet 10, after the liquid driver is closed, the cooling The liquid falls back, so that there is no cooling liquid in the liquid inlet valve 21 and the liquid outlet valve 31, and the liquid inlet valve 21 and the liquid outlet valve 31 can be directly repaired and replaced.
  • the working liquid level of the cabinet 10 is lower than that of the cabinet 10, the liquid in the cabinet 10 does not need to be pumped out, which greatly reduces the maintenance or replacement time and reduces the impact on the business operation.
  • the cooling liquid in the liquid inlet valve 21 and the liquid outlet valve 31 can fall back at the first time, and the liquid inlet valve 21 and the liquid outlet valve 31 are respectively arranged at the highest positions of the liquid inlet pipe 20 and the liquid outlet pipe 30. As shown in Figures 1 and 3, the liquid inlet valve 21 and the liquid outlet valve 31 are both arranged at the highest positions of the liquid inlet pipe 20 and the liquid outlet pipe 30. Location.
  • the cooling liquid in the liquid inlet valve 21 and the liquid outlet valve 31 are respectively arranged at the highest positions of the liquid inlet pipe 20 and the liquid outlet pipe 30, after the liquid driver is turned off, the cooling liquid in the liquid inlet valve 21 and the liquid outlet valve 31 can be released in the first Once the time falls, the operator or maintenance personnel can repair and replace the liquid inlet valve 21 and the liquid outlet valve 31 at the first time of the liquid driver, without waiting for the cooling liquid of the liquid inlet pipe 20 and the liquid outlet pipe 30. Completely back down before repair and replacement.
  • the liquid inlet pipe 20 and the liquid outlet pipe 30 respectively comprise a transverse pipe portion 22 located at the highest position of the liquid outlet pipe 20 and the liquid inlet pipe 30
  • the liquid inlet valve 21 and the liquid outlet valve 31 are respectively arranged on the liquid inlet pipe 20 and the lateral pipe portion 22 of the liquid outlet pipe 30, and the lateral pipe portions 22 of the liquid inlet pipe 20 and the liquid outlet pipe 30 respectively pass through the liquid inlet pipe fixing hole 12 and the liquid outlet pipe fixing hole 13, and the liquid inlet pipe fixing hole
  • the positions of 12 and the fixing hole 13 of the liquid outlet pipe are on the same horizontal plane as the positions of the liquid inlet valve 21 and the liquid outlet valve 31 .
  • the positions of the liquid inlet pipe fixing hole 12 and the liquid outlet pipe fixing hole 13 are the same as those of the liquid inlet pipe.
  • the positions of the liquid valve 21 and the liquid outlet valve 31 are located on the same level, so as to reduce the bending of the pipeline, thereby reducing the resistance of the cooling liquid flow.
  • the liquid inlet pipe 20 and the liquid outlet pipe 30 are roughly Z-shaped. In other embodiments, the liquid inlet pipe 20 and the liquid outlet pipe 30 can be set according to space requirements, usage requirements, etc. shape.
  • the positions of the liquid inlet valve 21 and the liquid outlet valve 31 can be set according to the working liquid level.
  • the coolant there may be more than one alternative coolant, and different coolants have different characteristics and different cooling temperatures, resulting in different working liquid levels of the coolant.
  • the larger the volume of a certain coolant changes with temperature the The greater the volume change, the greater the change in the liquid level in the cabinet.
  • the positions of the liquid inlet valve 21 and the liquid outlet valve 31 are set to be higher than the highest working liquid level of the cooling liquid in the cabinet 10 .
  • the maximum working liquid level is higher than or equal to the working liquid level, which is the highest liquid level that the cooling liquid in the cabinet 10 can reach due to the influence of temperature or flow rate when the electronic device 11 is working.
  • the maximum working liquid level is determined by factors such as the height of the top plate of the electronic device (if the electronic device is a server, the top plate is the top plate of the server), the flow rate of the coolant and the effect of temperature changes on the volume of the coolant.
  • the maximum working liquid level is higher than or equal to 50 mm above the top plate of the electronic device.
  • the maximum working liquid level should be highly adjusted according to the influence of the coolant flow rate and temperature change on the coolant volume. If the coolant flow rate is relatively small, then It is also necessary to increase the height of the highest working liquid level. For another example, the larger the coolant volume changes with temperature, the height of the highest working liquid level also needs to be increased.
  • a liquid inlet pipe 20 and a liquid outlet pipe 30 communicate with the cabinet 10 and drive the heat exchange device.
  • the liquid inlet valve 21 and the liquid outlet valve 31 are faulty or damaged
  • the cooling liquid stops circulating, and the electronic device 11 in the cabinet 10 is no longer cooled, and the electronic device 11 cannot continue to work normally, and the electronic device 11 needs to suspend the work.
  • the repair or replacement it will be restarted The work can continue, thus affecting the normal work of the electronic device 11.
  • the electronic device 11 is a server, the server cannot work normally, which will affect the use or operation of related services supported by the server.
  • each liquid cooling device passes through the liquid inlet pipe 20 and the liquid outlet pipe 30 . It communicates with the cabinet 10, that is to say, a group of liquid cooling devices is added on the basis of the first embodiment.
  • the liquid drivers in the two sets of liquid cooling devices can be turned on at the same time, so that the heat exchangers in the two sets of liquid cooling devices can both cool the cooling liquid. only the heat exchanger in this group of liquid cooling devices works, and the other group of liquid cooling devices is for standby.
  • the liquid driver of another group of liquid cooling devices can be started, so that the heat exchangers of the other group of liquid cooling devices can work to cool the cooling liquid. In this way, it is not necessary to suspend the normal operation of the electronic device 11.
  • the electronic device 11 is a server When the server can work normally, the normal operation of the server business is guaranteed.
  • the bottom of the cabinet 10 is provided with a support 14 , and the number of the supports 14 is plural for supporting the cabinet 10 .
  • the number of cabinets 10 can be set to multiple. In FIG. 5 , the number of cabinets 10 is two for illustration. In order to maintain the liquid level balance among the multiple cabinets 10, the single-phase immersion liquid cooling system also The liquid level equalization pipe 300 is included, and the liquid level equalization pipe 300 communicates with multiple cabinets 10 at the same time to maintain the liquid level balance in the multiple cabinets 10 and avoid multiple cabinets caused by inconsistent distances from the liquid-driven pump. 10 level difference.
  • the positions of the liquid inlet valve 21 and the liquid outlet valve 31 are set higher than the working liquid level of the cabinet 10 . Therefore, after the liquid driver is turned off, the cooling liquid falls back, thereby making the liquid inlet valve 21 and the liquid outlet valve 31 . There is no cooling liquid in it, and the liquid inlet valve 21 and the liquid outlet valve 31 can be directly repaired and replaced. Compared with setting the positions of the liquid valve 21 and the liquid outlet valve 31 below the working liquid level of the cabinet 10, it is not necessary to install the cabinet. The liquid in 10 is extracted, which greatly reduces the time for maintenance or replacement and reduces the impact on business operations.
  • the positions of the liquid inlet valve 21 and the liquid outlet valve 31 can also be set higher than the working liquid level of the cooling liquid in the cabinet 10 at the same time. Specifically, as shown in FIG. The positions of the liquid valves 21 are set to be higher than the working liquid level of the cooling liquid in the cabinet 10 , and the positions of the liquid outlet valves 31 are set to be lower than the working liquid level of the cooling liquid in the cabinet 10 . In other embodiments, the position of the liquid outlet valve 31 is set to be higher than the working liquid level of the cooling liquid in the cabinet 10 , and the position of the liquid inlet valve 21 is set to the bottom of the cooling liquid in the cabinet 10 . working fluid level. That is, the technology of the present specification only needs to satisfy that the position of at least one of the liquid inlet valve 21 and the liquid outlet valve 31 is set higher than the working liquid level of the cooling liquid in the cabinet 10 .
  • the positions of the liquid valve 21 and the liquid outlet valve 31 are set lower than the work of the cabinet 10. When the liquid level is reached, it is not necessary to extract the liquid in the cabinet 10, which greatly reduces the time for maintenance or replacement and reduces the impact on business operation.
  • the liquid outlet pipe 30 is lower than the working liquid level of the cabinet 10 .
  • a detachable liquid outlet pipe plugging head 32 is provided on the liquid inlet of the liquid outlet pipe 30 .
  • the liquid pipe blocking head 32 is detachably blocked on the liquid inlet of the liquid outlet pipe 30 .
  • the liquid inlet of the liquid outlet pipe 30 is located in the cabinet 10 , and the liquid in the cabinet 10 enters the liquid outlet pipe 30 from the liquid inlet of the liquid outlet pipe 30 .
  • the parts in this embodiment are the same in structure and function as the single-phase immersion liquid cooling system in the first embodiment, and will not be repeated here.
  • the liquid outlet pipe plugging head 32 is pulled out from the liquid inlet of the liquid outlet pipe 30 to form a liquid circulation loop between the cabinet 10, the liquid outlet pipe 30, the driving heat exchange device 200 and the liquid inlet pipe 20; Then, the cooling liquid is added into the cabinet 10. After the cooling liquid in the cabinet 10 reaches the working liquid level, the liquid driver and the heat exchanger are started to drive the cooling liquid in the cabinet 10, the liquid outlet pipe 30, the driving heat exchange device 200 and the inlet and outlet.
  • the liquid circuit formed by the liquid pipe 20 circulates in the liquid circuit, that is, after the cooling liquid absorbs the heat generated by the electronic device 11, it enters the heat exchanger through the liquid outlet pipe 30, and after heat exchange and cooling in the heat exchanger, it passes through the liquid inlet pipe 20. Entering into the cabinet 10, the electronic device 11 is cooled, and the electronic device 11 is cooled in such a cycle, and the cooling effect is greatly improved due to the adoption of the cooling liquid cooling method.
  • the liquid inlet valve 21 and the liquid outlet valve 31 are faulty or damaged, close the liquid driver. Since the position of the liquid inlet valve 21 is higher than the working liquid level of the cabinet 10, the liquid inlet of the liquid outlet pipe 30 is provided with a detachable outlet. The liquid pipe blocking head 32, therefore, after the liquid driver is turned off, the cooling liquid falls back, and the liquid outlet pipe blocking head 32 is blocked on the liquid inlet of the liquid outlet pipe 30, so that there is no cooling liquid in the liquid inlet valve 21. , the liquid outlet pipe 30 no longer has liquid flow, and the liquid inlet valve 21 and the liquid outlet valve 31 can be directly repaired and replaced.
  • the positions of the liquid valve 21 and the liquid outlet valve 31 are set lower than the work of the cabinet 10. When the liquid level is reached, it is not necessary to extract the liquid in the cabinet 10, which greatly reduces the time for maintenance or replacement and reduces the impact on business operation.
  • a backup valve 33 is provided on the liquid outlet pipe 30 lower than the working liquid level of the cabinet 10 , that is to say, if the liquid outlet valve 31 fails or is damaged, the backup valve can be directly used 33 Complete the work that the liquid outlet valve 31 needs to complete, so that the liquid outlet valve 31 does not need to be replaced, and the faulty or damaged liquid outlet valve 31 will not be replaced or repaired, so that the liquid in the cabinet 10 will not be replaced.
  • the backup valve 33 is connected in parallel with the liquid outlet valve 31 .
  • the backup valve 33 is connected in series with the liquid outlet valve 31 , or two backup valves are provided at the same time, and one is connected in parallel with the liquid outlet valve 31 . , one is connected in series with the liquid outlet valve 31 , which can be set as required, which is not specifically limited in this embodiment.
  • a parallel or series-connected standby valve may be arranged on the liquid inlet valve 21 . That is, when the position of one of the liquid inlet valve 21 and the liquid outlet valve 31 is higher than the working liquid level of the cooling liquid in the cabinet 10, the other one of the liquid inlet valve 21 and the liquid outlet valve 31 is located A spare valve 33 is provided on the pipeline.
  • the single-phase immersion liquid cooling system 100 further includes a base 14 , and the number of cabinets 10 is N, where N is an integer greater than or equal to 2.
  • the number of liquid cooling devices is two, and the N cabinets 10 and the two liquid cooling devices are fixed on the base 14 in parallel, wherein the two liquid cooling devices are located in the middle of the base 14 .
  • Each liquid cooling device includes two driving heat exchange devices 200, and the two driving heat exchanging devices 200 are associated with the corresponding liquid inlet pipe 20 and liquid outlet pipe 30, that is, the two driving heat exchange devices 200 in each liquid cooling device At the same time, it is communicated with the liquid inlet pipe 20 and the liquid outlet pipe 30 of the liquid cooling device, which are used for the liquid inlet heat exchange in the circuit and the liquid flow in the driving circuit.
  • the thermal efficiency can be increased, and the driving force of the liquid can be increased, so that the liquid in the cabinet 10 far away from the driving heat exchange device 200 can also be well circulated, thereby improving the cooling effect.
  • the liquid inlet pipes 20 and the liquid outlet pipes 30 of the two liquid cooling devices are respectively disposed on opposite sides of the base 14 and fixed on the base 14 .
  • the single-phase immersion liquid cooling system 100 further includes a liquid level balance pipe 300, and the liquid level balance pipe 300 is communicated with multiple cabinets 10 at the same time for maintaining multiple The liquid level in each cabinet 10 is balanced, thereby solving the technical problem of affecting the cooling effect caused by the liquid level difference.
  • the single-phase immersion liquid cooling system 100 further includes a balance pipe plugging head 310 , and the balance pipe plugging head 310 is detachably plugged in a nozzle on the balance pipe 300 located in the cabinet 10 .
  • the balance pipe plugging head 310 is detachably plugged in a nozzle on the balance pipe 300 located in the cabinet 10 .
  • each driving heat exchange device 200 are respectively provided with a total liquid inlet valve 210 and a total liquid outlet valve 220.
  • a certain driving heat exchange device 200 fails, after closing the driving heat exchange device 200, at the same time, Close the main liquid inlet valve 210 and the main liquid outlet valve 220, and the other driving heat exchange device 200 can continue to work, so as to avoid the failure of a certain driving heat exchange device 200 to continue cooling the electronic device 11 in the cabinet 10, thus affecting the The electronic device 11 in the cabinet 10 operates.
  • the liquid cooling device can be turned off, and the other liquid cooling device continues to cool the electronic device 11 to ensure the normal operation of the electronic device 11 .
  • two liquid cooling devices can work at the same time, or one liquid cooling device can work, and the other liquid cooling device can be used as a backup.
  • the backup cooling device is activated.
  • another cooling device is activated, so as to not only ensure the normal operation of the electronic device 11 but also improve the operation efficiency.
  • the nozzle of the balance pipe 300 and the liquid inlet of the liquid outlet pipe 30 are set to face the working liquid level of the cooling liquid, It is convenient to block the balance pipe plugging head 310 in the nozzle of the balance pipe 300, and the liquid pipe plugging head 32 to block the liquid inlet of the liquid outlet pipe 30. At the same time, the liquid outlet of the liquid inlet pipe 20 faces the cabinet 10. bottom of.
  • modules in the device in the embodiment can be adaptively changed and arranged in one or more devices different from the embodiment.
  • the modules or units or components in the embodiments may be combined into one module or unit or component, and further they may be divided into multiple sub-modules or sub-units or sub-assemblies. All features disclosed in this specification (including accompanying claims, abstract and drawings) and any method so disclosed may be employed in any combination unless at least some of such features and/or procedures or elements are mutually exclusive. All processes or units of equipment are combined.
  • Each feature disclosed in this specification may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本说明书实施例提供了一种单相浸没液冷系统,包括机柜和液冷装置,所述液冷装置包括驱动换热装置、进液管和出液管,所述驱动换热装置包括液体驱动器和热交换器;所述机柜内用于设置电子装置和用于冷却所述电子装置的冷却液,所述机柜的侧壁上开设有进液管固定孔和出液管固定孔;所述进液管上设置有进液阀门,所述进液管的一端穿过所述进液管固定孔与所述机柜内部连通;所述出液管上设置有出液阀门,所述出液管的一端穿过所述出液管固定孔与所述机柜内部连通;所述出液管和所述进液管的另一端分别与所述驱动换热装置的两端连通;其中,所述进液阀门和所述出液阀门中至少一者的位置高于所述机柜内的冷却液的工作液面。

Description

一种单相浸没式液冷系统
本申请要求2020年07月24日递交的申请号为202010722581.5、发明名称为“一种单相浸没式液冷系统”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本说明书实施例涉及电子设备散热技术领域,尤其涉及一种单相浸没液冷系统。
背景技术
随着云计算的高速发展,对计算性能的要求越来越高。服务器性能提升的同时,功耗呈现急速上升之势,机柜功耗成倍数上升,数据显示,近十年来数据中心机柜的功率密度提高了15倍。过去一个机架的功耗一般为1.5-2kW,现在却出现局部高达20-30kW的情况。
现有的服务器和数据中心采用的是空调风冷的方式,通过空调送入的冷空气,对电子装置进行冷却。但是,随着功率密度的稳定攀升,空调风冷方式的冷却能力也正趋向极限,不能满足冷却需求,因此,有必要提供一种新的冷却方式对电子装置进行冷却。
发明内容
本说明书实施例提供一种单相浸没液冷系统,实现提供一种新的冷却方式对电子装置进行冷却的技术效果。
本说明书实施例提供一种单相浸没液冷系统,包括机柜和液冷装置,所述液冷装置包括驱动换热装置、进液管和出液管,所述驱动换热装置包括液体驱动器和热交换器;
所述机柜内用于设置电子装置和冷却所述电子装置的冷却液,所述机柜的侧壁上开设有进液管固定孔和出液管固定孔;
所述进液管上设置有进液阀门,所述进液管的一端穿过所述进液管固定孔与所述机柜内部连通;所述出液管上设置有出液阀门,所述出液管的一端穿过所述出液管固定孔与所述机柜内部连通;所述出液管和所述进液管的另一端分别与所述驱动换热装置的两端连通;
其中,所述进液阀门和所述出液阀门中至少一者的位置高于所述机柜内的冷却液的工作液面。
本说明书实施例有益效果如下:
本说明书实施例中,通过将进液阀门、出液阀门中至少一者的位置设置为高于机柜的工作液面,因此,在液体驱动器关闭后,冷却液回落,从而使得进液阀门、出液阀门中位置高于机柜的工作液面的阀门内无冷却液,可直接对高于机柜的工作液面的阀门进行维修和更换,相对于将液阀门、出液阀门的位置设置在低于机柜的工作液面时,不必将机柜内的液体抽出,大大减少了维修或者更换的时间,降低对业务运行的影响。
本说明书实施例中,通过采用将进液阀门的位置高于所述机柜内的冷却液的工作液面,且将出液管设置为低于机柜的工作液面,并在出液管的进液口上设置有可拆卸的出 液管封堵头后,不仅能够便于维修和更换,而且还能够避免出液管内出现空气累积的技术问题,不需要定期进行排气操作。
附图说明
通过阅读下文优选实施方式的详细描述,各种其他的优点和益处对于本领域普通技术人员将变得清楚明了。附图仅用于示出优选实施方式的目的,而并不认为是对本说明书的限制。而且在整个附图中,用相同的参考符号表示相同的部件。在附图中:
图1示出了本说明书一个实施例一种单相浸没液冷系统的结构示意图;
图2示出了本说明书另一个实施例一种单相浸没液冷系统的结构示意图;
图3示出了本说明书再一个实施例一种单相浸没液冷系统的结构示意图;
图4示出了本说明书又一个实施例一种单相浸没液冷系统的结构示意图;
图5示出了本说明书又一个实施例一种单相浸没液冷系统的结构示意图;
图6示出了本说明书又一个实施例一种单相浸没液冷系统的结构示意图;
图7示出了本说明书又一个实施例一种单相浸没液冷系统的结构示意图;
图8示出了本说明书又一个实施例一种单相浸没液冷系统的结构示意图;
图9示出了本说明书又一个实施例一种单相浸没液冷系统的结构示意图;
图10示出了图9中的单相浸没液冷系统的局部放大图;
图11示出了图9中的单相浸没液冷系统的机柜的面板的结构示意图。
具体实施方式
为了更好地理解上述技术方案,下面通过附图以及具体实施例对本说明书实施例的技术方案做详细说明,应当理解本说明书实施例以及实施例中的具体特征是对本说明书实施例技术方案的详细说明,而不是对本说明书技术方案的限定。在不冲突的情况下,本说明书实施例以及实施例中的技术特征可以相互组合。
本说明书实施例提供一种单相浸没液冷系统。
如图1所示,所述单相浸没液冷系统100包括机柜10和液冷装置。机柜10内设置有电子装置11,在本实施方式中,电子装置11为服务器的电子装置,在其它实施方式中,电子装置11可以为交换机、台式电脑或者其它需要冷却的电子装置的电子装置。
液冷装置包括驱动换热装置200、进液管20和出液管30。
机柜10内设置有电子装置11,机柜10的侧壁上开设有进液管固定孔12和出液管固定孔13。
进液管20上设置有进液阀门21,进液管20的一端穿过进液管固定孔12与机柜10内部连通。通过开闭进液阀门21,可以截断进液管20内的液体或者使进液管20内的液体进行流通。
出液管30上设置有出液阀门31,出液管30的一端穿过出液管固定孔13与机柜10内部连通。通过开闭出液阀门31,可以截断出液管30内的液体或者使出液管30内的液 体进行流通。具体地,在本实施方式中,进液管20的伸入机柜10内的端部位于机柜10的中上部,而出液管30的伸入机柜10内的端部位于机柜10的底部或中下部,以便于进入机柜10内的液体吸收电子装置11的热量后,进入出液管30内,将吸收热量的液体导出。
其中,驱动换热装置200包括液体驱动器和热交换器(图未标示),所述液体驱动器用于驱动液体流动,提供液体流动的动力,具体可以为泵等;所述热交换器用于对液体进行热交换。
使用时,首先,进液管20与驱动换热装置200的出液端连通,出液管30与驱动换热装置200的进液端连通,即进液管20和出液管30分别与驱动换热装置200的两端相连通,以在机柜10、出液管30、驱动换热装置200和进液管20之间形成液体循环回路;然后,再向机柜10内加入冷却液,在机柜10内冷却液达到工作液面后,启动液体驱动器和热交换器,驱动冷却液在机柜10、出液管30、驱动换热装置200和进液管20形成的液体回路内循环,即,冷却液吸收电子装置11产生的热量后,通过出液管30进入热交换器,在热交换器内进行换热冷却后,再通过进液管20进入机柜10内,对电子装置11进行冷却,如此循环,实现对电子装置11的冷却,由于采用了冷却液冷却的方式,大大提高了冷却效果。
特别说明的是,本说明书中的冷却液是一种液体,其具有绝缘、安全、稳定等特性,并且在工作温度区间范围内无相态变化。冷却液具体可以为矿物油、合成油、氟碳化合物等。氟碳化合物主要指以氟取烷代相应碳链氢原子的有机化合物或聚合物,包括全氟烷烃、全氟氨、氢氟醚、全氟酮、氢氟烃等。
在本实施方式中,为了在进液阀门21、出液阀门31发生故障或者损坏时,避免将机柜10内的冷却液排出,将进液阀门21、出液阀门31的位置设置为高于机柜10的工作液面,也就是说,进液阀门21、出液阀门31的位置设置为高于机柜10内的工作液面即可,与管路的形状和摆放位置无关,如图2所示,进液阀门21、出液阀门31分别进液管20和出液管30的竖向管部上,如图1所示,进液阀门21、出液阀门31分别进液管20和出液管30的横向管部上,在其它实施方式中,若进液管20和出液管30有倾斜管部,则可将进液阀门21、出液阀门31分别进液管20和出液管30的倾斜管部上。另外,在不同的实施方式中,也可以将进液阀门21、出液阀门31分别设置在进液管20和出液管30的不同管部上,如将进液阀门21设置在进液管20的横向管部,而将出液阀门31设置在出液管30的竖向管路上,等等,可以根据需要进行设置。
特别说明的是,在本实施例中,“高”、“低”位置关系均是以水平面为参照依据。
工作液面是能满足机柜10内电子装置11正常工作时,机柜10内液体的高度。比如,电子装置11可以在温度40度以下才可正常工作,则工作液面为能够满足温度在40度以下时机柜10内液体的高度。不同的电子装置11正常工作的温度不同,所以,工作液面 也因电子装置11的不同而高度不同。
使用时,向机柜10内加入冷却液,在机柜10内冷却液达到工作液面后,继续加入冷却液,待冷却液的高度大于进液管20和出液管30的最高点后,启动液体驱动器,驱动冷却液在机柜10、出液管30、驱动换热装置200和进液管20形成的液体回路内循环;最后,将机柜10内多余的液体抽出,使得液体的高度位于工作液面即可。通过加入的冷却液的高度大于进液管20和出液管30的最高点,且在液体驱动器启动后,将多余的冷却液抽出,可以保证在液体驱动器启动前,进液管20和出液管30内充满液体,避免液体驱动器吸收空气而空转,导致液体驱动器损坏。
在进液阀门21、出液阀门31发生故障或者损坏时,关闭液体驱动器,由于进液阀门21、出液阀门31的位置高于机柜10的工作液面,因此,在液体驱动器关闭后,冷却液回落,从而使得进液阀门21、出液阀门31内无冷却液,可直接对进液阀门21、出液阀门31进行维修和更换,相对于将液阀门21、出液阀门31的位置设置在低于机柜10的工作液面时,不必将机柜10内的液体抽出,大大减少了维修或者更换的时间,降低对业务运行的影响。
具体地,为了节省管路在高度方向占用的空间,便于在关闭液体驱动器后,进液阀门21、出液阀门31内的冷却液能够在第一时间回落,将进液阀门21和出液阀门31分别设置在进液管20和出液管30的最高位置,如图1和图3所示,进液阀门21和出液阀门31均是设置在进液管20和出液管30的最高位置。因为,进液阀门21和出液阀门31分别设置在进液管20和出液管30的最高处,在关闭液体驱动器后,进液阀门21、出液阀门31内的冷却液就能够在第一时间回落,操作人员或者维修人员,在液体驱动器的第一时间,便可对进液阀门21和出液阀门31进行维修和更换,而不必等进液管20和出液管30的冷却液完全回落,再进行维修和更换。
继续参见图1,进液管20和出液管30分别包括位于出液管20和进液管30最高位置的横向管部22,进液阀门21和出液阀门31分别设置于进液管20和出液管30的横向管部22上,且进液管20和出液管30的横向管部22分别穿过进液管固定孔12和出液管固定孔13,且进液管固定孔12和出液管固定孔13的位置与进液阀门21和出液阀门31的位置位于同一水平面上。通过将进液阀门21和出液阀门31分别设置于进液管20和出液管30最高位置的横向管部22上,且进液管固定孔12和出液管固定孔13的位置与进液阀门21和出液阀门31的位置位于同一水平面上,从而减少管路的弯折,进而减少冷却液流动的阻力。具体地,在本实施方式中,进液管20和出液管30大致呈为Z字型,在其它实施方式中,可以根据空间要求、使用要求等设置进液管20和出液管30的形状。
在设置进液阀门21和出液阀门31的位置时,若确定会使用某种冷却液,可以根据该冷却液的温度、冷却液的流动速度,计算在机柜10内的电子装置11使用时的工作液面,根据工作液面设置进液阀门21和出液阀门31的位置即可。
而实际中,可能备选的冷却液不止一种,不同的冷却液的特性也不同,冷却温度不同,从而导致冷却液的工作液面不同,如某种冷却液体积随温度变化越大,则体积变化越大,会导致机柜内的液位变化大,温度越高,液位越高;又或者在使用的过程中,会调整冷却液的流动速度,冷却液的流速也不同,也会导致冷却液工作液面高度不同。为了满足上述需求,将进液阀门21、出液阀门31的位置设置为高于机柜10内冷却液的最高工作液面。最高工作液面高于或等于工作液面,是电子装置11工作时,机柜10内的冷却液因温度或者流速等影响能达到的最高液面。
最高工作液面由电子装置的顶板(若电子装置为服务器的时,顶板即为服务器的顶板)的高度、冷却液流速和温度变化对冷却液体积的影响等因素确定。最高工作液面高于或等于电子装置的顶板之上50毫米,同时,最高工作液面还要根据冷却液流速和温度变化对冷却液体积的影响进行高度调整,如冷却液流速比较小,则还需要调高最高工作液面的高度,又如,冷却液体积随温度变化越大,则也需要调高最高工作液面的高度。
在本实施方式中,如图1所示,通过一根进液管20和一根出液管30连通机柜10以及驱动换热装置,在进液阀门21、出液阀门31发生故障或者损坏时,关闭液体驱动器后,冷却液停止循环,不再对机柜10内的电子装置11进行冷却,电子装置11无法继续进行正常工作,电子装置11需要暂停工作,待维修或者更换完毕后,再次启动才可继续进行工作,从而影响了电子装置11的正常工作,比如电子装置11为服务器时,服务器不能正常工作,会影响服务器支持的相关业务的使用或者运行。
基于此,如图4所示,设置两组液冷装置,两个所述液冷装置分别位于所述机柜10的相对两侧,每个液冷装置均通过进液管20和出液管30与机柜10连通,也就是说,在实施例一的基础上增加一组液冷装置。使用时,可以两组液冷装置中的液体驱动器同时开启,使得两组液冷装置中的热交换器均对冷却液进行冷却,也可根据需要,同一时间内只开启一组液冷装置中的液体驱动器,只有该组组液冷装置中的热交换器进行工作,另一组液冷装置备用,在进行工作的液体驱动器、热交换器或者进液阀门21、出液阀门31出现故障时,可启动另一组液冷装置的液体驱动器,使得另一组液冷装置的热交换器进行工作,对冷却液进行冷却,如此,不必暂停电子装置11的正常工作,比如电子装置11为服务器时,服务器能够正常工作,保证服务器业务的正常运行。
具体地,机柜10底部设置有支座14,支座14的数目为多个,用于支撑机柜10。
进一步地,机柜10的数目可以设置为多个,在图5中,以机柜10的数目为两个进行举例说明,为了维持多个机柜10之间的液面平衡,单相浸没液冷系统还包括液面平衡管300,所述液面平衡管300同时与多个机柜10连通,用于维持多个机柜10内的液面平衡,避免因与液体驱动泵的距离不一致而造成的多个机柜10的液面差。
本实施方式通过将进液阀门21、出液阀门31的位置设置为高于机柜10的工作液面,因此,在液体驱动器关闭后,冷却液回落,从而使得进液阀门21、出液阀门31内无冷 却液,可直接对进液阀门21、出液阀门31进行维修和更换,相对于将液阀门21、出液阀门31的位置设置在低于机柜10的工作液面时,不必将机柜10内的液体抽出,大大减少了维修或者更换的时间,降低对业务运行的影响。
在其它实施方式中,也可以将不同时将进液阀门21和出液阀门31的位置都设置为高于机柜10内的冷却液的工作液面,具体地,如图6所示,将进液阀门21的位置都设置为高于机柜10内的冷却液的工作液面,而将出液阀门31的位置都设置为底于机柜10内的冷却液的工作液面。在其它实施方式中,也就是将出液阀门31的位置都设置为高于机柜10内的冷却液的工作液面,而将进液阀门21的位置都设置为底于机柜10内的冷却液的工作液面。即,本说明书的技术只要满足将进液阀门21和出液阀门31中的至少一者的位置设置为高于机柜10内的冷却液的工作液面即可。
通过将进液阀门21、出液阀门31中的至少一者的位置设置为高于机柜10的工作液面,因此,在液体驱动器关闭后,冷却液回落,从而使得进液阀门21、出液阀门31中高于工作液面的阀门内无冷却液,可直接对高于工作液面的阀门进行维修和更换,相对于将液阀门21、出液阀门31的位置设置在低于机柜10的工作液面时,不必将机柜10内的液体抽出,大大减少了维修或者更换的时间,降低对业务运行的影响。
进一步地,如图6所示,在本实施方式中,所述出液管30低于机柜10的工作液面。如图7所示,为了解决在维修过程中,机柜10内的液体继续从出液管30流出,所述出液管30的进液口上设置有可拆卸的出液管封堵头32,出液管封堵头32可拆卸地封堵于出液管30的进液口上。出液管30的进液口位于机柜10,机柜10内的液体从出液管30的进液口进入出液管30内。
对于本实施例中与实施例一中单相浸没液冷系统中结构和功能相同部分,在此不再赘述。
使用时,将出液管封堵头32从出液管30的进液口上拔出,以在机柜10、出液管30、驱动换热装置200和进液管20之间形成液体循环回路;然后,再向机柜10内加入冷却液,在机柜10内冷却液达到工作液面后,启动液体驱动器和热交换器,驱动冷却液在机柜10、出液管30、驱动换热装置200和进液管20形成的液体回路内循环,即,冷却液吸收电子装置11产生的热量后,通过出液管30进入热交换器,在热交换器内进行换热冷却后,再通过进液管20进入机柜10内,对电子装置11进行冷却,如此循环,实现对电子装置11的冷却,由于采用了冷却液冷却的方式,大大提高了冷却效果。
在进液阀门21、出液阀门31发生故障或者损坏时,关闭液体驱动器,由于进液阀门21的位置高于机柜10的工作液面,出液管30的进液口上设置有可拆卸的出液管封堵头32,因此,在液体驱动器关闭后,冷却液回落,且将出液管封堵头32封堵于出液管30的进液口上,从而使得进液阀门21内无冷却液,出液管30也不再有液体流动,可直接对进液阀门21、出液阀门31进行维修和更换,相对于将液阀门21、出液阀门31的位 置设置在低于机柜10的工作液面时,不必将机柜10内的液体抽出,大大减少了维修或者更换的时间,降低对业务运行的影响。
另外,在将进液阀门21、出液阀门31的位置设置为高于机柜10的工作液面时,由于出液管30高于机柜10内的工作液面,出液管30为负压,在出液管30的最高点,工作过程中容易出现空气累积,需要定期排气,影响机柜10内电子装置11的运行。在采用将进液阀门21的位置高于所述机柜10内的冷却液的工作液面,且将出液管30设置为低于机柜10的工作液面,并在出液管30的进液口上设置有可拆卸的出液管封堵头32后,不仅能够便于维修和更换,而且还能够避免出液管30内出现空气累积的技术问题,不需要定期进行排气操作。
在其它实施方式中,如图8所示,在低于机柜10的工作液面的出液管30上设置备用阀门33,也就是说若出液阀门31发生故障或者损坏,可以直接采用备用阀门33完成出液阀门31需要完成的工作,从而不需要对出液阀门31进行更换,也就不会对发生故障或者损坏的出液阀门31进行更换或者维修,进而就不会机柜10内的液体继续从出液管30流出的问题。具体地,在本实施方式中,备用阀门33与出液阀门31并联,在其它实施方式中,备用阀门33与出液阀门31串联,或者同时设置两个备用阀门,一个与出液阀门31并联,一个与出液阀门31串联,具体可以根据需要进行设置,本实施方式不做具体限定。
在其它实施方式中,在进液管20低于机柜10的工作液面时,同样地,可设置于进液阀门21设置并联或者串联的备用阀门。即,直接在进液阀门21和出液阀门31中的其中一者的位置高于机柜10内的冷却液的工作液面时,进液阀门21和出液阀门31中的另一者所在的管路上设置有备用阀门33。
具体地,如图9和图10所示,单相浸没液冷系统100还包括底座14,机柜10的数目为N,其中,N为大于等于2的整数。液冷装置的数目为2个,N个机柜10和2个液冷装置并列固定于底座14上,其中,2个液冷装置位于底座14的中部。
每个液冷装置包括2个驱动换热装置200,2个驱动换热装置200均与对应的进液管20和出液管30,即每个液冷装置内的2个驱动换热装置200同时与该液冷装置的进液管20和出液管30连通,用于对回路内的液体进换热和驱动回路内的液体流动,通过设置2个驱动换热装置200,不仅可以提高换热效率,而且能够增加液体的驱动力,使得距离驱动换热装置200较远的机柜10内的液体也能得到很好的循环,提高冷却效果。
两个液冷装置的进液管20和出液管30分别设置于底座14的相对两侧,并固定于底座14上。
在本实施方式中,由于机柜10数目为N个,且每个机柜10与液体驱动器的距离不一致,导致N个机柜10内的液体出现液面差,影响冷却效果。为了解决因出现液面差导致的影响冷却效果的技术问题,单相浸没液冷系统100还包括液面平衡管300,所述 液面平衡管300同时与多个机柜10连通,用于维持多个机柜10内的液面平衡,从而解决了因出现液面差导致的影响冷却效果的技术问题。
进一步地,如图11所示,单相浸没液冷系统100还包括平衡管封堵头310,平衡管封堵头310可拆卸地封堵于平衡管300上位于机柜10内的管口内。在某个机柜10需要停止检修时,关闭与该机柜10连通的进液管20上的进液阀门21和出液管30上的出液阀门31,同时,将出液管封堵头32封堵于出液管30上位于机柜10内的进液口内,将平衡管封堵头310封堵于平衡管300上位于机柜10内的管口内,即可对机柜10进行停止检修。
进一步地,每个驱动换热装置200的两端分别设置有总进液阀门210和总出液阀门220,在某个驱动换热装置200出现故障时,关闭该驱动换热装置200后,同时关闭总进液阀门210和总出液阀门220,另一个驱动换热装置200可继续进行工作,避免因某一个驱动换热装置200出现不能对机柜10内的电子装置11进行继续冷却,故而影响机柜10内的电子装置11运行。
由于设置有两个液冷装置,在其中一个液冷装置出现故障时,可将该液冷装置关闭,另一个液冷装置继续对电子装置11进行冷却,保证电子装置11的正常工作。另外,正常使用时,可以两个液冷装置同时工作,也可以一个液冷装置工作,另一个液冷装置备用,在机柜10内的电子装置11的温度达到警告值时,启动备用冷却装置,或者在一个液冷装置出现故障时,启动另外一个冷却装置,从而不仅保证电子装置11的正常运行,提高运行效率。
进一步地,为了便于对平衡管300和出液管30进行封堵,在本实施方式中,将平衡管300的管口和出液管30的进液口设置为朝向冷却液的工作液面,便于将平衡管封堵头310封堵于平衡管300的管口内,液管封堵头32封堵于出液管30的进液口内,同时,将进液管20的出液口朝向机柜10的底部。
在此处所提供的说明书中,说明了大量具体细节。然而,能够理解,本发明的实施例可以在没有这些具体细节的情况下实践。在一些实例中,并未详细示出公知的方法、结构和技术,以便不模糊对本说明书的理解。
类似地,应当理解,为了精简本公开并帮助理解各个发明方面中的一个或多个,在上面对本发明的示例性实施例的描述中,本发明的各个特征有时被一起分组到单个实施例、图、或者对其的描述中。然而,并不应将该公开的方法解释成反映如下意图:即所要求保护的本发明要求比在每个权利要求中所明确记载的特征更多的特征。更确切地说,如下面的权利要求书所反映的那样,发明方面在于少于前面公开的单个实施例的所有特征。因此,遵循具体实施方式的权利要求书由此明确地并入该具体实施方式,其中每个权利要求本身都作为本发明的单独实施例。
本领域那些技术人员可以理解,可以对实施例中的设备中的模块进行自适应性地改 变并且把它们设置在与该实施例不同的一个或多个设备中。可以把实施例中的模块或单元或组件组合成一个模块或单元或组件,以及此外可以把它们分成多个子模块或子单元或子组件。除了这样的特征和/或过程或者单元中的至少一些是相互排斥之外,可以采用任何组合对本说明书(包括伴随的权利要求、摘要和附图)中公开的所有特征以及如此公开的任何方法或者设备的所有过程或单元进行组合。除非另外明确陈述,本说明书(包括伴随的权利要求、摘要和附图)中公开的每个特征可以由提供相同、等同或相似目的的替代特征来代替。
此外,本领域的技术人员能够理解,尽管在此的一些实施例包括其它实施例中所包括的某些特征而不是其它特征,但是不同实施例的特征的组合意味着处于本发明的范围之内并且形成不同的实施例。例如,在下面的权利要求书中,所要求保护的实施例的任意之一都可以以任意的组合方式来使用。
应该注意的是上述实施例对本发明进行说明而不是对本发明进行限制,并且本领域技术人员在不脱离所附权利要求的范围的情况下可设计出替换实施例。在权利要求中,不应将位于括号之间的任何参考符号构造成对权利要求的限制。单词“包含”不排除存在未列在权利要求中的元件或步骤。位于元件之前的单词“一”或“一个”不排除存在多个这样的元件。本发明可以借助于包括有若干不同元件的硬件以及借助于适当编程的计算机来实现。在列举了若干装置的单元权利要求中,这些装置中的若干个可以是通过同一个硬件项来具体体现。单词第一、第二、以及第三等的使用不表示任何顺序。可将这些单词解释为名称。

Claims (15)

  1. 一种单相浸没液冷系统,包括机柜和液冷装置,所述液冷装置包括驱动换热装置、进液管和出液管,所述驱动换热装置包括液体驱动器和热交换器;
    所述机柜内用于设置电子装置和冷却所述电子装置的冷却液,所述机柜的侧壁上开设有进液管固定孔和出液管固定孔;
    所述进液管上设置有进液阀门,所述进液管的一端穿过所述进液管固定孔与所述机柜内部连通;所述出液管上设置有出液阀门,所述出液管的一端穿过所述出液管固定孔与所述机柜内部连通;所述出液管和所述进液管的另一端分别与所述驱动换热装置的两端连通;
    其中,所述进液阀门和所述出液阀门中至少一者的位置高于所述机柜内的冷却液的工作液面。
  2. 根据权利要求1所述的单相浸没液冷系统,所述进液阀门和所述出液阀门分别设置在所述进液管和所述出液管的最高位置处。
  3. 根据权利要求1中任一项所述的单相浸没液冷系统,所述进液阀门、所述出液阀门中至少一者的位置高于所述机柜内冷却液的最高工作液面。
  4. 根据权利要求3所述的单相浸没液冷系统,所述最高工作液面由所述电子装置的顶板的高度、所述冷却液流速和温度变化对所述冷却液体积的影响进行确定。
  5. 根据权利要求4所述的单相浸没液冷系统,所述最高工作液面高于或等于所述电子装置的顶板之上50毫米。
  6. 根据权利要求1所述的单相浸没液冷系统,在所述进液阀门和所述出液阀门中的其中一者的位置高于所述机柜内的冷却液的工作液面时,所述进液阀门和所述出液阀门中的另一者所在的管路上设置有备用阀门。
  7. 根据权利要求1所述的单相浸没液冷系统,所述液冷装置的数目为两个,两个所述液冷装置分别位于所述机柜的相对两侧。
  8. 根据权利要求1所述的单相浸没液冷系统,所述进液阀门的位置高于所述机柜内的冷却液的工作液面,所述出液管低于所述机柜内的冷却液的工作液面,所述单相浸没液冷机柜还包括出液管封堵头,所述出液管封堵头可拆卸地固定于所述出液管的进液口上。
  9. 根据权利要求8所述的单相浸没液冷系统,所述进液阀门设置在所述进液管的最高位置处,所述进液阀门的位置高于所述机柜内冷却液的最高工作液面。
  10. 根据权利要求8所述的单相浸没液冷系统,所述机柜为N个,其中,N为大于等于2的整数,所述液冷装置为两个,所述单相浸没液冷系统还包括液面平衡管,所述液面平衡管同时与N个所述机柜连通。
  11. 根据权利要求10所述的单相浸没液冷系统,所述单相浸没液冷系统还包括平衡管封堵头,所述平衡管封堵头可拆卸地封堵于所述液面平衡管上位于所述机柜内的管口 内。
  12. 根据权利要求11所述的单相浸没液冷系统,所述液面平衡管的管口和所述出液管的进液口朝向所述冷却液的工作液面,所述进液管的出液口朝向所述机柜的底部。
  13. 根据权利要求10所述的单相浸没液冷系统,所述单相浸没液冷系统还包括底座,N个所述机柜和两个所述液冷装置并列固定于所述底座上,两个所述液冷装置位于所述底座的中部。
  14. 根据权利要求10所述的单相浸没液冷系统,每个所述液冷装置包括两个所述驱动换热装置,两个所述驱动换热装置均与该液冷装置的进液管和出液管连接。
  15. 根据权利要求14所述的单相浸没液冷系统,每个所述驱动换热装置的两端分别设置有总进液阀门和总出液阀门。
PCT/CN2021/107242 2020-07-24 2021-07-20 一种单相浸没式液冷系统 Ceased WO2022017346A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010722581.5A CN113301766B (zh) 2020-07-24 2020-07-24 一种单相浸没式液冷系统
CN202010722581.5 2020-07-24

Publications (1)

Publication Number Publication Date
WO2022017346A1 true WO2022017346A1 (zh) 2022-01-27

Family

ID=77318596

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/107242 Ceased WO2022017346A1 (zh) 2020-07-24 2021-07-20 一种单相浸没式液冷系统

Country Status (2)

Country Link
CN (1) CN113301766B (zh)
WO (1) WO2022017346A1 (zh)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114745930A (zh) * 2022-04-29 2022-07-12 深圳市瀚强科技股份有限公司 液冷机柜设备及其控制方法
CN115085477A (zh) * 2022-07-01 2022-09-20 中国华能集团清洁能源技术研究院有限公司 一种风力发电机液冷系统过滤装置及风力发电机液冷系统
CN115764060A (zh) * 2022-11-21 2023-03-07 中国华能集团清洁能源技术研究院有限公司 浸没式液冷系统及储能电池系统
CN115942697A (zh) * 2022-11-29 2023-04-07 珠海科创储能科技有限公司 适用于浸没式液冷储能系统的温控系统及方法
CN116017951A (zh) * 2023-01-10 2023-04-25 北京百度网讯科技有限公司 液冷式机柜和液冷系统
CN116133324A (zh) * 2022-12-14 2023-05-16 深圳绿色云图科技有限公司 温度控制装置及其使用方法
CN116321934A (zh) * 2022-12-30 2023-06-23 比赫电气(太仓)有限公司 一种5u机架式浸没式液冷系统
CN117289774A (zh) * 2023-11-22 2023-12-26 安徽百信信息技术有限公司 一种基于形态可变、接触式且热源可插拔的散热组件
CN118131874A (zh) * 2024-04-29 2024-06-04 苏州元脑智能科技有限公司 服务器节点及整机柜系统
WO2025081830A1 (zh) * 2023-10-20 2025-04-24 中兴通讯股份有限公司 维护装置、液冷系统组件及液冷系统的维护方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114206086A (zh) * 2022-01-14 2022-03-18 北京字节跳动网络技术有限公司 模块化风冷设备和冷却系统
CN115038303B (zh) * 2022-06-17 2025-03-18 北京有竹居网络技术有限公司 浸没式液冷装置及液冷系统
WO2024098110A1 (en) * 2022-11-10 2024-05-16 Firmus Metal Technologies Singapore Pte Ltd Systems for cooling of computing devices using liquid immersion
CN119603936B (zh) * 2024-12-06 2025-10-31 浙江康盛热交换器有限公司 多机柜液冷系统的控制方法、电子设备及计算机可读介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104284536A (zh) * 2014-10-28 2015-01-14 储敏健 服务器机柜及具有其的机柜组和液体浸没冷却服务器系统
US9049800B2 (en) * 2013-02-01 2015-06-02 Dell Products L.P. Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet
CN207519036U (zh) * 2017-11-03 2018-06-19 阿里巴巴集团控股有限公司 冷却设备
CN210247359U (zh) * 2019-06-27 2020-04-03 苏州浪潮智能科技有限公司 一种服务器集装箱数据中心及其温控系统

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5331012B2 (ja) * 2010-01-05 2013-10-30 株式会社日立製作所 電子機器の冷却システム
CN104699208B (zh) * 2015-03-31 2019-01-18 广东申菱环境系统股份有限公司 水环自然冷却热管空调和液冷装置结合的服务器散热系统
CN110958818B (zh) * 2019-12-11 2021-06-04 深圳绿色云图科技有限公司 单相浸没式液冷机柜及单相浸没式液冷系统

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9049800B2 (en) * 2013-02-01 2015-06-02 Dell Products L.P. Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet
CN104284536A (zh) * 2014-10-28 2015-01-14 储敏健 服务器机柜及具有其的机柜组和液体浸没冷却服务器系统
CN207519036U (zh) * 2017-11-03 2018-06-19 阿里巴巴集团控股有限公司 冷却设备
CN210247359U (zh) * 2019-06-27 2020-04-03 苏州浪潮智能科技有限公司 一种服务器集装箱数据中心及其温控系统

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114745930A (zh) * 2022-04-29 2022-07-12 深圳市瀚强科技股份有限公司 液冷机柜设备及其控制方法
CN115085477A (zh) * 2022-07-01 2022-09-20 中国华能集团清洁能源技术研究院有限公司 一种风力发电机液冷系统过滤装置及风力发电机液冷系统
CN115764060A (zh) * 2022-11-21 2023-03-07 中国华能集团清洁能源技术研究院有限公司 浸没式液冷系统及储能电池系统
CN115942697B (zh) * 2022-11-29 2024-01-30 珠海科创储能科技有限公司 适用于浸没式液冷储能系统的温控系统及方法
CN115942697A (zh) * 2022-11-29 2023-04-07 珠海科创储能科技有限公司 适用于浸没式液冷储能系统的温控系统及方法
CN116133324A (zh) * 2022-12-14 2023-05-16 深圳绿色云图科技有限公司 温度控制装置及其使用方法
CN116321934A (zh) * 2022-12-30 2023-06-23 比赫电气(太仓)有限公司 一种5u机架式浸没式液冷系统
CN116321934B (zh) * 2022-12-30 2023-12-22 比赫电气(太仓)有限公司 一种5u机架式浸没式液冷系统
CN116017951A (zh) * 2023-01-10 2023-04-25 北京百度网讯科技有限公司 液冷式机柜和液冷系统
WO2025081830A1 (zh) * 2023-10-20 2025-04-24 中兴通讯股份有限公司 维护装置、液冷系统组件及液冷系统的维护方法
CN117289774A (zh) * 2023-11-22 2023-12-26 安徽百信信息技术有限公司 一种基于形态可变、接触式且热源可插拔的散热组件
CN117289774B (zh) * 2023-11-22 2024-03-29 安徽百信信息技术有限公司 一种基于形态可变、接触式且热源可插拔的散热组件
CN118131874A (zh) * 2024-04-29 2024-06-04 苏州元脑智能科技有限公司 服务器节点及整机柜系统

Also Published As

Publication number Publication date
CN113301766A (zh) 2021-08-24
CN113301766B (zh) 2023-07-18

Similar Documents

Publication Publication Date Title
CN113301766B (zh) 一种单相浸没式液冷系统
CN104320953B (zh) 一种二次水环路服务器机柜散热系统
CN106032919B (zh) 一种冷冻水冷却系统
US8929080B2 (en) Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US20190343026A1 (en) Liquid cooling system for cabinet server
US7024573B2 (en) Method and apparatus for cooling heat generating components
CN114071972B (zh) 一种用于高功率密度机柜的泵驱双环路热管组合散热系统
WO2019061721A1 (zh) 一种数据中心冷却系统以及数据中心
US8842434B2 (en) Heat dissipation system
CN113543595B (zh) 流动浸没式服务器、工作站和工作系统
CN109952003A (zh) 一种数据中心液冷系统
CN211429864U (zh) 一种单机柜数据中心液冷结构
CN111988973A (zh) 气冷散热设备和冷却系统
CN114710931A (zh) 一种数据中心的制冷系统及液冷机柜
CN205281101U (zh) 一种集成型液冷系统及投影设备
CN104102310B (zh) 用于服务器整机柜的冷却系统
CN106852086B (zh) 双级串联式液气双通道自然冷却数据中心散热系统
CN222663205U (zh) 一种带散热装置的充电桩
CN107249289A (zh) 一种服务器机柜的冷却系统
HK40059155A (zh) 一种单相浸没式液冷系统
TW201306454A (zh) 電子設備的冷卻系統
CN117276748A (zh) 一种带自然冷却功能的风冷型储能液冷热管理系统
CN217564002U (zh) 机柜冷却装置
CN207752998U (zh) 闭环液冷装置及其应用的电子设备
TWI893981B (zh) 浸沒式冷卻模組、多層浸沒式冷卻系統及其方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21846734

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21846734

Country of ref document: EP

Kind code of ref document: A1