WO2022006785A1 - 一种电路板的制备方法 - Google Patents

一种电路板的制备方法 Download PDF

Info

Publication number
WO2022006785A1
WO2022006785A1 PCT/CN2020/100907 CN2020100907W WO2022006785A1 WO 2022006785 A1 WO2022006785 A1 WO 2022006785A1 CN 2020100907 W CN2020100907 W CN 2020100907W WO 2022006785 A1 WO2022006785 A1 WO 2022006785A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
insulating part
preparing
conductive ink
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/100907
Other languages
English (en)
French (fr)
Inventor
王成勇
郭紫莹
刘志华
姚俊雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong University of Technology
Original Assignee
Guangdong University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong University of Technology filed Critical Guangdong University of Technology
Priority to PCT/CN2020/100907 priority Critical patent/WO2022006785A1/zh
Publication of WO2022006785A1 publication Critical patent/WO2022006785A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing

Definitions

  • the invention relates to the technical field of circuit boards, in particular to a preparation method of a circuit board.
  • circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board Thin circuit boards, printed (copper etching technology) circuit boards, etc.
  • the circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances.
  • the circuit board can be called a printed circuit board or a printed circuit board, the English name is (Printed Circuit Board) PCB, (Flexible Printed Circuit board) FPC circuit board (FPC circuit board is also called flexible circuit board Flexible circuit board is based on polyimide Or a polyester film as the base material is a highly reliable, excellent flexible printed circuit board. It has the characteristics of high wiring density, light weight, thin thickness and good bendability.) and soft and hard Combination plate (reechas, Soft and hard combination plate) - The birth and development of FPC and PCB gave birth to the new product of soft and hard combination plate.
  • the rigid-flex board is a flexible circuit board and a rigid circuit board, which are combined according to the relevant process requirements through lamination and other processes to form a circuit board with FPC characteristics and PCB characteristics; 3D printing usually uses digital technology materials. printer to achieve. It is often used to make models in the fields of mold making, industrial design, etc., and then gradually used for the direct manufacturing of some products. There are already parts printed using this technology.
  • the technology has applications in jewelry, footwear, industrial design, architecture, engineering and construction (AEC), automotive, aerospace, dental and medical industries, education, geographic information systems, civil engineering, firearms, and more.
  • 3D printing technology is also used in the production process of existing circuit boards.
  • the conductive layer or insulating layer is usually printed by layer-by-layer printing, but this method not only consumes Long time, high cost, expensive equipment, and the need to print a variety of materials with different properties, so that the insulating layer and conductive layer of the circuit board will be bent, weakly connected or burned due to differences in material properties such as thermal expansion coefficient during layer-by-layer printing. Defects such as coke.
  • the purpose of the present invention is to avoid the deficiencies in the prior art and provide a method for preparing a circuit board, which not only has less technical difficulty in operation, simpler equipment and lower price, but also avoids the formation of insulating layers and conductive layers in the Bending, weak connection, or burning defects due to differences in material properties such as thermal expansion coefficient during layer-by-layer printing. .
  • a preparation method of a circuit board comprising the following steps:
  • the 3D drawing software is any one of SolidWorks and VG.
  • step (2) after the insulating part structure is printed and formed by 3D printing technology, the insulating part needs to be cured, surface treated and covered in sequence.
  • the curing method is any one of photocuring, thermal curing and cooling.
  • the surface treatment method is electrolytic polishing or chemical polishing.
  • the covering method is a mask or a protective film.
  • the 3D printing technology is any one of SLA, DLP and FDM.
  • the method of the coating treatment is to inject conductive ink into the insulating part structure or soak the insulating part structure in the conductive ink.
  • step (3) the insulating part structure is subjected to the action of a field when the conductive ink is applied, and the field is a force field or a temperature field.
  • step (4) the curing method of the conductive ink is high temperature drying or air drying.
  • the insulating part with cavities is printed by 3D printing technology, and the technical difficulty of 3D printing resin is less than that of printing metal, which makes the equipment simpler and cheaper, which is conducive to popularization and use.
  • defects such as bending, weak connection or burning caused by the difference in material properties such as thermal expansion coefficient during the layer-by-layer printing of the insulating layer and the conductive layer are avoided.
  • FIG. 1 is a process flow diagram of a method for preparing a circuit board of the present invention.
  • a preparation method of a circuit board comprising the following steps:
  • step (1) in step (1), in step (1), the 3D drawing software is any one of SolidWorks and VG.
  • step (2) after the insulating part structure is printed and formed by 3D printing technology, the insulating part needs to be cured, surface treated and covered in sequence, and the curing treatment is to make the insulating part structure effective.
  • Forming, surface treatment is to improve the bonding strength of insulating resin and conductive ink
  • masking treatment is to cover the position where conduction is not required, in order to prevent the line from being deformed or short-circuited due to the overflow of conductive ink, and to ensure the integrity of the line.
  • the curing method is any one of light curing, thermal curing and cooling, and the curing effect is the best.
  • the surface treatment method is electrolytic polishing or chemical polishing.
  • the covering method is a mask or a protective film.
  • the 3D printing technology is any one of SLA, DLP and FDM, and this technology has the best printing effect.
  • the method of the coating treatment is to inject conductive ink into the insulating part structure or soak the insulating part structure in the conductive ink.
  • step (3) the insulating part structure is subjected to the action of a field when the conductive ink is applied, and the field is a force field or a temperature field, so that the cavity of the insulating part structure can be fully contacted with the conductive ink .
  • the curing method of the conductive ink is one of high temperature drying (temperature 100°C-200°C) and air drying.
  • This embodiment provides a method for preparing a circuit board, comprising the following steps:
  • step (2) Using 3D printing technology to print the insulating part structure; the specific process is: input the software data in step (1) into SLA printing, and at the same time use photosensitive resin to print the insulating part with cavities by SLA printing technology, and then Light curing is carried out on a light curing machine, so that the structure of the insulating part can be effectively formed, and then the surface of the cavity is activated with an activator. Affix the protective film to cover the positions that do not need to be conductive. In order to prevent the conductive ink from overflowing and cause the circuit to be deformed or short-circuited, and to ensure the integrity of the circuit, it is finally immersed in the nano-silver conductive ink;
  • the specific process is: when the insulating part is immersed in the conductive ink, repeated vibration occurs at a frequency of a certain force field, so that the cavity is fully contacted and combined with the conductive ink;
  • the specific process is: then propose an insulating part with the conductive ink, then the conductive ink is dried at a high temperature, and the high temperature is controlled to be 100 ° C, and the medium is dried and cured. , and finally tear off the protective film.
  • This embodiment provides a method for preparing a circuit board, comprising the following steps:
  • step (2) Use 3D printing technology to print the insulating part structure; the specific process is: input the software data in step (1) into SLA printing, and at the same time use photosensitive resin to print the insulating part with cavities by SLA printing technology, and then Light curing is carried out on a light curing machine, so that the structure of the insulating part can be effectively formed, and then the surface of the cavity is activated with an activator. Affix the protective film to cover the positions that do not need to be conductive. In order to prevent the conductive ink from overflowing and cause the circuit to deform or short-circuit, and to ensure the integrity of the circuit, it is finally immersed in the nano-silver conductive ink;
  • the specific process is: when the insulating part is immersed in the conductive ink, repeated vibration occurs at a frequency of a certain temperature field, so that the cavity is fully contacted and combined with the conductive ink; (4) curing the conductive ink in the cavity structure; the specific process is: then propose an insulating part with the conductive ink, then the conductive ink is dried at a high temperature, and the high temperature is controlled to be 150 ° C, and the medium is dried and cured. , and finally tear off the protective film.
  • This embodiment provides a method for preparing a circuit board, comprising the following steps:
  • step (2) Use 3D printing technology to print the insulating part structure; the specific process is: input the software data in step (1) into SLA printing, and at the same time use photosensitive resin to print the insulating part with cavities by SLA printing technology, and then Light curing is carried out on a light curing machine, so that the structure of the insulating part can be effectively formed, and then the surface of the cavity is activated with an activator. Affix the protective film to cover the positions that do not need to be conductive. In order to prevent the conductive ink from overflowing and cause the circuit to deform or short-circuit, and to ensure the integrity of the circuit, it is finally immersed in the nano-silver conductive ink;
  • the specific process is: when the insulating part is immersed in the conductive ink, repeated vibration occurs at a frequency of a certain force field, so that the cavity is fully contacted and combined with the conductive ink;
  • the insulating part with cavities is printed by 3D printing technology, and the technical difficulty of 3D printing resin is less than that of printing metal, which makes the equipment simpler and cheaper, which is conducive to popularization and use.
  • defects such as bending, weak connection or burning caused by the difference in material properties such as thermal expansion coefficient during the layer-by-layer printing of the insulating layer and the conductive layer are avoided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本发明公开一种电路板的制备方法，包括以下步骤：(1)使用3D画图软件获得带有空腔的绝缘部分结构，所述空腔的结构与电路布线结构相同；(2)利用3D打印技术打印所述绝缘部分结构；(3)利用导电油墨对所述绝缘部分结构进行涂履处理；(4)将导电油墨固化在空腔结构中，该制备方法不仅操作技术难度小，设备更加简单和价格低廉，同时还能避免绝缘层和导电层在逐层打印时因热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦的缺陷。

Description

一种电路板的制备方法 技术领域
本发明涉及线路板技术领域，特别是涉及一种电路板的制备方法。
背景技术
电路板的名称有：陶瓷电路板，氧化铝陶瓷电路板，氮化铝陶瓷电路板，线路板，PCB板，铝基板，高频板，厚铜板，阻抗板，PCB，超薄线路板，超薄电路板，印刷(铜刻蚀技术)电路板等。电路板使电路迷你化、直观化，对于固定电路的批量生产和优化用电器布局起重要作用。电路板可称为印刷线路板或印刷电路板，英文名称为(Printed Circuit Board)PCB、(Flexible Printed Circuit board)FPC线路板(FPC线路板又称柔性线路板柔性电路板是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板。具有配线密度高、重量轻、厚度薄、弯折性好的特点。)和软硬结合板(reechas，Soft and hard combination plate)-FPC与PCB的诞生与发展，催生了软硬结合板这一新产品。因此，软硬结合板，就是柔性线路板与硬性线路板，经过压合等工序，按相关工艺要求组合在一起，形成的具有FPC特性与PCB特性的线路板；3D打印通常是采用数字技术材料打印机来实现的。常在模具制造、工业设计等领域被用于制造模型，后逐渐用于一些产品的直接制造，已经有使用这种技术打印而成的零部件。该技术在珠宝、鞋类、工业设计、建筑、工程和施工(AEC)、汽车，航空航天、牙科和医疗产业、教育、地理信息系统、土木工程、枪支以及其他领域都有所应用。
现有的电路板在制作的过程当中也会用到3D打印技术，目前在使用3D打印技术制备电路板时，通常是采用逐层打印的方法打印导电层或绝缘层，但是这种方法不仅耗时长，成本高、设备昂贵，同时需要对多种不同性质材料进行打印，使得电路板的绝缘层和导电层在逐层打印时会受热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦等缺陷。
发明内容
本发明的目的在于避免现有技术中的不足之处而提供一种电路板的制备方法，该制备方法不仅操作技术难度小，设备更加简单和价格低廉，同时还能避免绝缘层和导电层在逐层打印时因热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦的缺陷。。
本发明的目的通过以下技术方案实现：
一种电路板的制备方法，包括以下步骤：
(1)使用3D画图软件获得带有空腔的绝缘部分结构，所述空腔的结构与电路布线结构相 同；
(2)利用3D打印技术打印所述绝缘部分结构；
(3)利用导电油墨对所述绝缘部分结构进行涂履处理；
(4)将导电油墨固化在空腔结构中。
进一步的，步骤(1)中，所述3D画图软件为SolidWorks、VG中的任意一种画图软件。
进一步的，步骤(2)中，所述绝缘部分结构通过3D打印技术打印成型后，需要依次对绝缘部分进行进行固化、表面处理和遮盖处理。
进一步的，所述固化方法为光固化、热固化和冷却中的任一种方法。
进一步的，所述表面处理方法为电解抛光或化学抛光。
进一步的，所述遮盖的方法为掩膜或贴保护膜。
进一步的，步骤(2)中，所述3D打印技术为SLA、DLP和FDM中的任一种技术。
进一步的，步骤(3)中，所述涂履处理的方法为将导电油墨注入到所述绝缘部分结构内或者将绝缘部分结构浸泡在导电油墨中。
进一步的，步骤(3)中，所述绝缘部分结构在涂履导电油墨时受到场的作用，所述场为力场或温度场。
进一步的，步骤(4)中，所述导电油墨的固化方法为高温烘干或风干。
有益效果：由于该电路板的制备过程当中，通过3D打印技术打印带有空腔的绝缘部分，并且3D打印树脂比打印金属的技术难度小，使得设备更加简单和价格低廉，有利于推广使用，同时避免绝缘层和导电层在逐层打印时因热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦等缺陷。
附图说明
利用附图对发明作进一步说明，但附图中的实施例不构成对本发明的任何限制，对于本领域的普通技术人员，在不付出创造性劳动的前提下，还可以根据以下附图获得其它的附图。
图1是本发明的一种电路板的制备方法的工艺流程图。
具体实施方式
一种电路板的制备方法，包括以下步骤：
(1)使用3D画图软件获得带有空腔的绝缘部分结构，所述空腔的结构与电路布线结构相 同；
(2)利用3D打印技术打印所述绝缘部分结构；
(3)利用导电油墨对所述绝缘部分结构进行涂履处理；
(4)将导电油墨固化在空腔结构中。
优选实施例中，步骤(1)中，步骤(1)中，所述3D画图软件为SolidWorks、VG中的任意一种画图软件。
优选实施例中，步骤(2)中，所述绝缘部分结构通过3D打印技术打印成型后，需要依次对绝缘部分进行进行固化处理、表面处理和遮盖处理，固化处理是使得绝缘部分结构得到有效的成型，表面处理是为了提高绝缘树脂与导电油墨的结合强度，遮盖处理是在不需要导电的位置贴膜进行遮盖，为了防止导电油墨外溢导致线路变形或短路，保证线路完整。
优选实施例中，所述固化方法为光固化、热固化和冷却中的任一种方法，该固化效果最佳。
优选实施例中，所述表面处理方法为电解抛光或化学抛光。
优选实施例中，所述遮盖的方法为掩膜或贴保护膜。
优选实施例中，步骤(2)中，所述3D打印技术为SLA、DLP和FDM中的任一种技术，该技术打印效果最佳。
优选实施例中，步骤(3)中，所述涂履处理的方法为将导电油墨注入到所述绝缘部分结构内或者将绝缘部分结构浸泡在导电油墨中。
优选实施例中，步骤(3)中，所述绝缘部分结构在涂履导电油墨时受到场的作用，所述场为力场或温度场，使得绝缘部分结构的腔道能够与导电油墨充分接触。
优选实施例中，步骤(4)中，所述导电油墨的固化方法为高温烘干(温度100℃-200℃)和风干中的一种方法。
实施例1
本实施例提供一种电路板的制备方法，包括以下步骤：
(1)使用SolidWorks画图软件获得带有空腔的绝缘部分结构，所述空腔的结构与电路布线结构相同；具体工艺是：从软件中获得带有空腔的绝缘部分三维模型的制作软件数据，其中空腔结构要求与电路图的布线结构相同；
(2)利用3D打印技术打印所述绝缘部分结构；具体工艺是：将步骤(1)中的软件数据输入到SLA打印中，同时通过SLA打印技术使用光敏树脂打印具有空腔的绝缘部分，随后在光固化机上进行光固化，使得绝缘部分结构得到有效的成型，随后使用活化剂对空腔 表面进行活化处理，为了提高绝缘树脂与导电油墨的结合强度，接下来对不需要附着导电油墨的位置贴上保护膜，对不需要导电的位置贴膜进行遮盖，为了防止导电油墨外溢导致线路变形或短路，保证线路完整，最后浸泡在纳米银导电油墨中；
(3)利用导电油墨对所述绝缘部分结构进行涂履处理；具体工艺是：绝缘部分浸泡在导电油墨中时以一定力场的频率发生反复振动，使得腔道与导电油墨充分接触和结合；
(4)将导电油墨固化在空腔结构中；具体工艺是：随后提出附有导电油墨的绝缘部分，随后将导电油墨在高温烘干的条件下，控制高温温度为100℃，中烘干固化，最后撕掉保护膜。
实施例2
本实施例提供一种电路板的制备方法，包括以下步骤：
(1)使用SolidWorks画图软件获得带有空腔的绝缘部分结构，所述空腔的结构与电路布线结构相同；具体工艺是：从软件中获得带有空腔的绝缘部分三维模型的制作软件数据，其中空腔结构要求与电路图的布线结构相同；
(2)利用3D打印技术打印所述绝缘部分结构；具体工艺是：将步骤(1)中的软件数据输入到SLA打印中，同时通过SLA打印技术使用光敏树脂打印具有空腔的绝缘部分，随后在光固化机上进行光固化，使得绝缘部分结构得到有效的成型，随后使用活化剂对空腔表面进行活化处理，为了提高绝缘树脂与导电油墨的结合强度，接下来对不需要附着导电油墨的位置贴上保护膜，对不需要导电的位置贴膜进行遮盖，为了防止导电油墨外溢导致线路变形或短路，保证线路完整，最后浸泡在纳米银导电油墨中；
(3)利用导电油墨对所述绝缘部分结构进行涂履处理；具体工艺是：绝缘部分浸泡在导电油墨中时以一定温度场的频率发生反复振动，使得腔道与导电油墨充分接触和结合；(4)将导电油墨固化在空腔结构中；具体工艺是：随后提出附有导电油墨的绝缘部分，随后将导电油墨在高温烘干的条件下，控制高温温度为150℃，中烘干固化，最后撕掉保护膜。
实施例3
本实施例提供一种电路板的制备方法，包括以下步骤：
(1)使用VG画图软件获得带有空腔的绝缘部分结构，所述空腔的结构与电路布线结构相同；具体工艺是：从软件中获得带有空腔的绝缘部分三维模型的制作软件数据，其中空腔结构要求与电路图的布线结构相同；
(2)利用3D打印技术打印所述绝缘部分结构；具体工艺是：将步骤(1)中的软件 数据输入到SLA打印中，同时通过SLA打印技术使用光敏树脂打印具有空腔的绝缘部分，随后在光固化机上进行光固化，使得绝缘部分结构得到有效的成型，随后使用活化剂对空腔表面进行活化处理，为了提高绝缘树脂与导电油墨的结合强度，接下来对不需要附着导电油墨的位置贴上保护膜，对不需要导电的位置贴膜进行遮盖，为了防止导电油墨外溢导致线路变形或短路，保证线路完整，最后浸泡在纳米银导电油墨中；
(3)利用导电油墨对所述绝缘部分结构进行涂履处理；具体工艺是：绝缘部分浸泡在导电油墨中时以一定力场的频率发生反复振动，使得腔道与导电油墨充分接触和结合；
(4)将导电油墨固化在空腔结构中；具体工艺是：随后提出附有导电油墨的绝缘部分，随后风干固化，最后撕掉保护膜。
有益效果：由于该电路板的制备过程当中，通过3D打印技术打印带有空腔的绝缘部分，并且3D打印树脂比打印金属的技术难度小，使得设备更加简单和价格低廉，有利于推广使用，同时避免绝缘层和导电层在逐层打印时因热膨胀系数等材料性能差异出现的弯曲、连接不牢或烧焦等缺陷。
最后应当说明的是，以上实施例仅用以说明本发明的技术方案，而非对本发明保护范围的限制，尽管参照较佳实施例对本发明作了详细地说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的实质和范围。

Claims (10)

  1. 一种电路板的制备方法，其特征在于：包括以下步骤：
    (1)使用3D画图软件获得带有空腔的绝缘部分结构，所述空腔的结构与电路布线结构相同；
    (2)利用3D打印技术打印所述绝缘部分结构；
    (3)利用导电油墨对所述绝缘部分结构进行涂履处理；
    (4)将导电油墨固化在空腔结构中。
  2. 如权利要1所述的一种电路板的制备方法，其特征在于：步骤(1)中，所述3D画图软件为SolidWorks、VG中的任意一种画图软件。
  3. 如权利要1所述的一种电路板的制备方法，其特征在于：步骤(2)中，所述绝缘部分结构通过3D打印技术打印成型后，需要依次对绝缘部分进行进行固化、表面处理和遮盖处理。
  4. 如权利要2所述的一种电路板的制备方法，其特征在于：所述固化方法为光固化、热固化和冷却中的任一种方法。
  5. 如权利要2所述的一种电路板的制备方法，其特征在于：所述表面处理方法为电解抛光或化学抛光。
  6. 如权利要2所述的一种电路板的制备方法，其特征在于：所述遮盖的方法为掩膜或贴保护膜。
  7. 如权利要1所述的一种电路板的制备方法，其特征在于：步骤(2)中，所述3D打印技术为SLA、DLP和FDM中的任一种技术。
  8. 如权利要1所述的一种电路板的制备方法，其特征在于：步骤(3)中，所述涂履处理的方法为将导电油墨注入到所述绝缘部分结构内或者将绝缘部分结构浸泡在导电油墨中。
  9. 如权利要1所述的一种电路板的制备方法，其特征在于：步骤(3)中，所述绝缘部分结构在涂履导电油墨时受到场的作用，所述场为力场或温度场。
  10. 如权利要1所述的一种电路板的制备方法，其特征在于：步骤(4)中，所述导电油墨的固化方法为高温烘干或风干。
PCT/CN2020/100907 2020-07-08 2020-07-08 一种电路板的制备方法 Ceased WO2022006785A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/100907 WO2022006785A1 (zh) 2020-07-08 2020-07-08 一种电路板的制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/100907 WO2022006785A1 (zh) 2020-07-08 2020-07-08 一种电路板的制备方法

Publications (1)

Publication Number Publication Date
WO2022006785A1 true WO2022006785A1 (zh) 2022-01-13

Family

ID=79553421

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/100907 Ceased WO2022006785A1 (zh) 2020-07-08 2020-07-08 一种电路板的制备方法

Country Status (1)

Country Link
WO (1) WO2022006785A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018031186A1 (en) * 2016-08-08 2018-02-15 Nano-Dimension Technologies, Ltd. Printed circuit board fabrication methods programs and libraries
CN110536551A (zh) * 2019-07-10 2019-12-03 广东工业大学 一种电路板的制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018031186A1 (en) * 2016-08-08 2018-02-15 Nano-Dimension Technologies, Ltd. Printed circuit board fabrication methods programs and libraries
CN110536551A (zh) * 2019-07-10 2019-12-03 广东工业大学 一种电路板的制备方法

Similar Documents

Publication Publication Date Title
CN110430666B (zh) 一种3d打印电路板的制备方法
CN101360397B (zh) 镂空电路板的制作方法
CN102056425B (zh) 多层印制线路板制作方法
CN107493662B (zh) 在印刷线路板上制作低阻值、厚度≥25um碳油的方法
CN107027240A (zh) 一种高电阻碳膜线路板及其制造方法
CN105309052A (zh) 柔性印刷电路板的制造方法及由其制造的柔性印刷电路板
CN102196668B (zh) 电路板制作方法
CN110430674A (zh) 一种电镀沉积电路板的制备方法
CN110536551B (zh) 一种电路板的制备方法
TW201813458A (zh) 鏤空柔性電路板及製作方法
CN108419384B (zh) 半弯折印刷线路板及其制作方法
WO2022006785A1 (zh) 一种电路板的制备方法
US8828247B2 (en) Method of manufacturing printed circuit board having vias and fine circuit and printed circuit board manufactured using the same
WO2022006792A1 (zh) 一种电镀沉积电路板的制备方法
KR101989798B1 (ko) 연성회로기판의 제조방법 및 이에 의해 제조된 연성회로기판
CN101657074B (zh) 电路板及电路板的制作方法
CN104661439A (zh) 印刷电路板的制造方法
WO2022006787A1 (zh) 一种3d打印电路板的制备方法
CN101448367A (zh) 结合厚膜电阻及薄膜线路的印刷电路板及其制法
CN113966073A (zh) 一种热电分离铜基板及其制造工艺
TW511434B (en) Manufacturing method of printed circuit board built with resistors
CN206698498U (zh) 一种高电阻碳膜线路板
KR100642047B1 (ko) 내장형 저항체 제조방법 및 이를 이용한 인쇄회로기판의제조방법
CN104821280A (zh) 高密度铜蚀刻线路板的制备方法
JPH05235522A (ja) ポリイミド膜の形成方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20944294

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20944294

Country of ref document: EP

Kind code of ref document: A1