WO2021251639A1 - Autoclave device - Google Patents

Autoclave device Download PDF

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Publication number
WO2021251639A1
WO2021251639A1 PCT/KR2021/006146 KR2021006146W WO2021251639A1 WO 2021251639 A1 WO2021251639 A1 WO 2021251639A1 KR 2021006146 W KR2021006146 W KR 2021006146W WO 2021251639 A1 WO2021251639 A1 WO 2021251639A1
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WO
WIPO (PCT)
Prior art keywords
chamber
housing
tray
door
preheating
Prior art date
Application number
PCT/KR2021/006146
Other languages
French (fr)
Korean (ko)
Inventor
문경원
Original Assignee
문경원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문경원 filed Critical 문경원
Publication of WO2021251639A1 publication Critical patent/WO2021251639A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/04Pressure vessels, e.g. autoclaves
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50Forming devices by joining two substrates together, e.g. lamination techniques

Definitions

  • the present invention relates to an autoclave apparatus, and more particularly, to an autoclave capable of heat-pressing a panel assembly on which a plurality of panel elements are laminated to remove air bubbles existing between the panel elements and improve bonding strength between the panel elements. It's about the device.
  • a liquid crystal display LCD
  • organic light emitting diode OLED
  • Such various flat panel display devices are manufactured by attaching panels having various functions, such as a transparent protection plate, to a flat panel display panel.
  • a touch screen is an input device installed on a display surface of various flat panel display devices to allow a user to select desired information while viewing the display device.
  • the touch screen includes a resistive type, a capacitive type, an electro-magnetic type, a saw type, and an infrared type.
  • Such a touch screen is manufactured by attaching a transparent electrode panel to a window panel made of a transparent material.
  • a display panel used for a panel type display such as a flat panel display device or a touch screen is manufactured by attaching a plurality of panel elements.
  • a method of attaching a plurality of panel elements constituting a display panel there is a method of attaching two panel elements by attaching a double-sided tape around one surface of any one panel element and bonding the other panel elements thereto.
  • panel elements are attached through an automated device, and the display panel configured by attaching panel elements uses an autoclave device to remove air bubbles between panel elements and improve bonding strength between panel elements. It is heat-pressed.
  • the heat and pressurized display panel is shipped after passing through an inspection process by an inspection device.
  • the autoclave device generally includes a sealed housing opened and closed by a door, a heater for applying heat to a chamber inside the sealed housing in which the display panel is accommodated, and a gas supply device for supplying gas into the chamber of the sealed housing. to be.
  • a sealed housing opened and closed by a door a heater for applying heat to a chamber inside the sealed housing in which the display panel is accommodated
  • a gas supply device for supplying gas into the chamber of the sealed housing. to be.
  • Such an autoclave device is disclosed in Korean Patent Publication No. 1139595, Korean Patent Publication No. 1119792, etc. of various structures.
  • the present invention has been devised in view of the foregoing, and by continuously and rapidly performing heat and pressure treatment on the panel assembly, more easily removes air bubbles present in the panel assembly, improves the adhesive force of the panel assembly, ,
  • An object of the present invention is to provide an autoclave device capable of improving productivity.
  • the autoclave device may include a fan device installed in the housing to generate an airflow in the process chamber.
  • the autoclave apparatus may include a heater installed in the housing to provide heat to the process chamber.
  • the gas inlet and the gas outlet may be installed adjacent to each other so as to form a pair.
  • the housing includes a preheating chamber disposed between the inlet and the process chamber, and a buffer chamber disposed between the process chamber and the outlet.
  • the preheating chamber and the process chamber are provided. a first intermediate door for opening and closing a passage therebetween; a second intermediate door for opening and closing a passage between the process chamber and the buffer chamber; a preheating gas supply device for supplying heated gas to the preheating chamber; a post-heating gas supply device for supplying heated gas to the buffer chamber; a preheating chamber guide rail installed in the preheating chamber to guide the tray; a process chamber guide rail installed in the process chamber to guide the tray; a buffer chamber guide rail installed in the buffer chamber to guide the tray; a preheating chamber tray transfer device for moving the tray from the preheating chamber toward the process chamber; a process chamber tray transfer device for moving the tray from the process chamber to the buffer chamber; and a buffer chamber tray transfer device for moving the tray from the buffer chamber toward the outlet, wherein the control device
  • the outlet The inlet door, the outlet door, the first intermediate door, the second intermediate door, the preheating gas supply device, the heat treatment gas supply device, and the post-heating gas supply device so as to be discharged through the The preheat chamber tray transfer device, the process chamber tray transfer device, and the buffer chamber tray transfer device may be controlled.
  • the housing may include a preheating housing having the inlet, the preheating chamber, and a preheating housing outlet connected to the preheating chamber to discharge the tray from the preheating chamber, the process chamber and the preheating housing outlet a process housing having a process housing inlet connected to the process chamber and a process housing outlet connected to the process chamber so that the tray can be discharged from the process chamber; and the buffer chamber and the process housing outlet to face the process housing outlet a buffer housing having an inlet connected to the buffer chamber and a buffer housing having the outlet, wherein the first intermediate door is configured to simultaneously open and close the outlet of the preheating housing and the inlet of the process housing.
  • the second intermediate door may be installed between the process housing and the buffer housing so as to simultaneously open and close the process housing outlet and the buffer housing inlet.
  • the autoclave apparatus sequentially performs a preheating process, a heat treatment process, and a postheating process on the panel assembly while sequentially transferring the tray on which the panel assembly is loaded through the preheating chamber, the process chamber, and the buffer chamber inside the housing. can do. Therefore, it is possible to effectively perform a heat treatment operation on the panel assembly, and it is possible to improve productivity.
  • the autoclave apparatus preheats the panel assembly in the preheating chamber, heat-treats the panel assembly by applying a constant temperature and pressure in the process chamber, and discharges the heat-treated panel assembly after heating in the buffer chamber. It is possible to prevent the panel assembly from being damaged by thermal shock, and to provide a high-quality panel assembly in which air bubbles are removed and bonding strength is improved.
  • the operation is efficient and the process time can be shortened.
  • FIG 1 schematically shows an autoclave apparatus according to an embodiment of the present invention.
  • FIG. 2 is a side cross-sectional view showing a partial configuration of an autoclave apparatus according to an embodiment of the present invention.
  • FIG. 3 is a plan cross-sectional view illustrating a process housing of an autoclave apparatus according to an embodiment of the present invention.
  • FIG. 4 is a front cross-sectional view showing the process housing of the autoclave apparatus according to an embodiment of the present invention.
  • Figure 5 is a perspective view showing the inlet door of the autoclave device according to an embodiment of the present invention.
  • Figure 6 is a side cross-sectional view showing the inlet door of the autoclave device according to an embodiment of the present invention.
  • FIG. 7 is for explaining the operation of the inlet door shown in FIGS. 5 and 6 .
  • FIG. 8 is a perspective view showing a first intermediate door of the autoclave apparatus according to an embodiment of the present invention.
  • FIG. 9 is a side cross-sectional view showing a first intermediate door of the autoclave apparatus according to an embodiment of the present invention.
  • FIG. 10 is for explaining the operation of the first intermediate door shown in FIGS. 8 and 9 .
  • FIG 11 is for explaining the operation of the tray conveying device provided in the autoclave device according to an embodiment of the present invention.
  • FIG. 1 schematically shows an autoclave apparatus according to an embodiment of the present invention
  • FIG. 2 is a side cross-sectional view showing a partial configuration of the autoclave apparatus according to an embodiment of the present invention.
  • the autoclave device 100 includes a housing 200 having a space for accommodating the tray 10 on which the panel assembly 20 is mounted, and the housing ( A preheating gas supply device 245, a heat treatment gas supply device 247, and a post-heating gas supply device 249 for supplying gas for heating and pressurizing the panel assembly 20 to the inside of the panel assembly 200; 20) a tray input device 300 for putting the loaded tray 10 into the inside of the housing 200, and a tray discharge device 400 for discharging the tray 10 passing through the housing 200; It includes a tray transport device 500 for transporting the tray 10 to the tray input device 300 side, and a control device 600 for controlling the overall operation of the autoclave device 100 .
  • An inlet 204 is provided at one end of the housing 200, into which the tray 10 on which the panel assembly 20 is loaded, and the other end of the housing 200, the tray 10 on which the panel assembly 20 is loaded is discharged.
  • An outlet 235 is provided.
  • a preheating chamber 203 , a process chamber 218 , and a buffer chamber 233 are sequentially disposed between the inlet 204 and the outlet 235 .
  • the tray 10 loaded with the panel assembly 20 is put into the preheating chamber 203 through the inlet 204, and then passes through the process chamber 218 and the buffer chamber 233 in turn, and through the outlet 235, the housing ( 200) is released.
  • the panel assembly 20 loaded on the tray 10 is preheated by receiving heat and pressure in the preheating chamber 203 , and is heated and pressurized in the process chamber 218 .
  • the panel assembly 20 heated and pressurized in the process chamber 218 is discharged from the housing 200 after receiving heat and pressure in the buffer chamber 233 .
  • the autoclave apparatus 100 removes air bubbles between the panel elements constituting the panel assembly P through a series of heat treatment processes, and improves the adhesion between the panel elements, thereby improving the quality of the panel assembly ( 20) can be provided.
  • the panel assembly P to be processed by the autoclave apparatus 100 may be of various types in which a plurality of panel elements such as a display panel or an optical panel are laminated.
  • the housing 200 includes a preheating housing 202 having a preheating chamber 203 disposed therein, a process housing 217 having a process chamber 218 disposed therein, and a buffer housing 232 having a buffer chamber 233 disposed therein. ) is included.
  • the preheating housing 202, the process housing 217, and the buffer housing 232 are arranged in a line such that the tray 10 containing the panel assembly 20 is provided with the preheating housing 202, the process housing 217 and the buffer housing ( 232) can be passed sequentially.
  • An inlet door 257 is disposed in front of the preheating housing 202 , and a first intermediate door 270 is disposed between the preheating housing 202 and the process housing 217 .
  • a second intermediate door 285 is disposed between the process housing 217 and the buffer housing 232 , and an outlet door 290 is disposed behind the buffer housing 232 .
  • An inlet 204 is provided at one end of the preheating housing 202 to be connected to the preheating chamber 203 .
  • the inlet 204 may be opened and closed by the inlet door 257 .
  • a preheating housing outlet 205 connected to the preheating chamber 203 and opened toward the process housing 217 is provided at the other end of the preheating housing 202 .
  • the preheating housing outlet 205 may be opened and closed by the first intermediate door 270 .
  • At least one preheating housing intake port 206 for introducing gas into the preheating chamber 203 is provided at one side of the preheating housing 202 .
  • a gas supply pipe 246 connected to the preheating gas supply device 245 is connected to the preheating housing intake port 206 . The gas supplied from the preheating gas supply device 245 may be introduced into the preheating chamber 203 through the preheating housing intake 206 .
  • the preheating gas supply device 245 supplies the heated gas to the preheating chamber 203 to preheat the panel assembly 20 fed into the preheating chamber 203 .
  • the preheating gas supply device 245 supplies the heated gas to the preheating chamber 203 , so that the preheating chamber 203 can be maintained in an atmosphere of a preset preheating temperature and preheating pressure.
  • the panel assembly 20 may be introduced into the preheating chamber 203 to undergo a preheating process in an atmosphere of a preset temperature and pressure.
  • the panel assembly 20 at room temperature is directly introduced into the process chamber 218 to apply high temperature and high pressure, the panel assembly 20 may receive a thermal shock. Accordingly, when the panel assembly 20 is preheated through the preheating chamber 203 and then introduced into the process chamber 218 , a thermal shock problem can be prevented.
  • the temperature and pressure in the preheat chamber 203 may be set to be lower than the temperature and pressure in the process chamber 218 .
  • a preheating chamber guide rail 208 is installed inside the preheating housing 202 to guide the tray 10 to linearly move.
  • the preheating chamber guide rail 208 includes a plurality of rollers 209 and a guide rail body 210 supporting the plurality of rollers 209 .
  • the plurality of rollers 209 are spaced apart along the transport direction of the tray 10 .
  • the rollers 209 may be arranged in a double row on the guide rail body 210 .
  • a pair of preheating chamber guide rails 208 may be spaced apart from each other in a direction perpendicular to the transport direction of the tray 10 and disposed parallel to each other.
  • a plurality of tray grooves 11 into which the rollers 209 can be inserted are provided in the lower portion of the tray 10 .
  • the plurality of tray grooves 11 are disposed to correspond to the rows of the plurality of rollers 209 disposed in the preheating chamber 203 .
  • the tray 10 is placed on the preheat chamber guide rail 208 so that the rollers 209 are inserted into the plurality of tray grooves 11 , so that the tray 10 can be guided to move linearly by the rollers 209 .
  • the number of preheating chamber guide rails 208 installed and the arrangement of rollers 209 provided in the preheating chamber guide rail 208 may be variously changed.
  • the preheating chamber guide rail 208 is installed in the preheating housing 202 to guide the tray 10 to move linearly. can be
  • the tray 10 may be transferred by a preheating chamber tray transfer device 212 .
  • the preheating chamber tray transfer device 212 includes a transfer pad 213 capable of pushing or pulling the tray 10 , a pad transfer device 214 that linearly moves the transfer pad 213 , and lifting and lowering of the transfer pad 213 . It includes a pad lifting device 215 connected to the pad transfer device 214 in order to do so.
  • the transfer pad 213 can move up and down and linearly in the space between the pair of preheating chamber guide rails 208 .
  • the tray 10 moves toward the process chamber 218 by the pad transfer device 214 while the transfer pad 213 is in contact with one end of the tray 10 .
  • ) may be moved from the preheating chamber 203 to the process chamber 218 side.
  • the transfer pad 213 rises away from the preheating chamber guide rail 208 by the pad elevating device 215 and is fed into the preheating chamber 203 ( 10) does not interfere with
  • the transport pad 213 may come into contact with the tray 10 by descending in a direction closer to the preheating chamber guide rail 208 by the pad lifting device 215 .
  • the preheating chamber tray transfer device 212 may be changed to various other structures capable of moving the tray 10 to the process chamber 218 side in the preheating chamber 203 .
  • one end of the process housing 217 is provided with a process housing inlet 219 connected to the process chamber 218 , and the other end of the process housing 217 is connected to the process chamber 218 .
  • a process housing outlet 220 is provided.
  • the process housing inlet 219 faces the preheat housing outlet 205 of the preheat housing 202 , and the process housing outlet 220 opens towards the buffer housing 232 .
  • the process housing inlet 219 may be opened and closed by the first intermediate door 270 .
  • a space in which the first intermediate door 270 is installed is provided between the preheating housing 202 and the process housing 217 , and this space may be covered by the first cover 242 .
  • the process housing outlet 220 may be opened and closed by the second intermediate door 285 .
  • a space in which the second intermediate door 285 is installed is provided between the process housing 217 and the buffer housing 232 , and this space may be covered by the second cover 243 .
  • the process chamber 218 may be sized to accommodate the plurality
  • the process housing 217 is provided with a plurality of gas intake ports 221 for introducing gas into the process chamber 218 and a plurality of gas exhaust ports 222 for exhausting gas from the process chamber 218 .
  • the gas exhaust port 222 is disposed adjacent to the gas intake port 221 to mate with the gas intake port 221 .
  • Each gas intake port 221 may be opened and closed by an intake valve 223
  • each gas exhaust port 222 may be opened and closed by an exhaust valve 224 .
  • a gas supply pipe 248 connected to the heat treatment gas supply device 247 is connected to each intake valve 223 .
  • the gas supplied from the heat treatment gas supply device 247 may be introduced into the process chamber 218 through the plurality of gas inlets 221 .
  • the heat treatment gas supply device 247 supplies the heated gas to the process chamber 218 to heat-treat the panel assembly 20 introduced into the process chamber 218 .
  • the heat treatment gas supply device 247 supplies the heated gas to the process chamber 218 , so that the process chamber 218 may be maintained in an atmosphere of a preset heat treatment temperature and heat treatment pressure. . Accordingly, the panel assembly 20 introduced into the process chamber 218 is heat-treated to remove air bubbles between the panel elements constituting the panel assembly P, and adhesion between the panel elements may be increased.
  • the plurality of gas intake ports 221 are spaced apart from each other in the process chamber 218 in the transport direction of the tray 10 .
  • the temperature and pressure of the entire process chamber 218 need to be uniformly maintained.
  • the temperature and pressure of the entire process chamber 218 may be uniform.
  • the portion of the process chamber 218 having a relatively low temperature or a relatively low pressure By rapidly increasing the temperature or pressure in , the temperature and pressure of the entire process chamber 218 may be made uniform.
  • the intake valve 223 for opening and closing the gas inlet 221 and the exhaust valve 224 for opening and closing the gas exhaust port 222 are the detection signals of the thermometer 252 and the pressure gauge 253 installed in the process housing 217 .
  • a plurality of thermometers 252 are installed in the process chamber 218 so as to be adjacent to the plurality of gas intake ports 221 , respectively.
  • a plurality of pressure gauges 253 are installed in the process chamber 218 so as to be adjacent to the plurality of gas intake ports 221 , respectively.
  • the detection signal of the thermometer 252 and the detection signal of the pressure gauge 253 are provided to the control device 600 , and the control device 600 causes intake air according to the detection signal of the thermometer 252 or the detection signal of the pressure gauge 253 .
  • the valve 223 and the exhaust valve 224 may be controlled.
  • thermometers 252 and a plurality of pressure gauges 253 are installed in the process chamber 218 , so that temperature and pressure can be detected at a plurality of locations in the process chamber 218 , and preset in the process chamber 218 . It is possible to identify the part that does not reach temperature or pressure. And by supplying new high-temperature and high-pressure gas while evacuating the gas from the part by opening the gas inlet 221 and the gas exhaust port 222 adjacent to the part that does not reach the preset heat treatment temperature or heat treatment pressure, the temperature or The pressure can be raised quickly.
  • a plurality of fan devices 254 and a plurality of heaters are provided in the process housing 217 to quickly increase the temperature and pressure of the process chamber 218 and to make the temperature and pressure of the entire process chamber 218 uniform. (255) is installed.
  • the plurality of fan devices 254 generate an airflow in the process chamber 218 so that the gas supplied to the process chamber 218 is evenly spread throughout the process chamber 218 and heat generated by the heater 255 is removed. It may be evenly distributed throughout the process chamber 218 .
  • a process chamber guide rail 226 for guiding the tray 10 to linearly move is installed inside the process housing 217 .
  • the process chamber guide rail 226 includes a plurality of rollers 209 , like the preheating chamber guide rail 208 , and a guide rail body 210 supporting the plurality of rollers 209 .
  • a pair of process chamber guide rails 226 may be spaced apart from each other in a direction perpendicular to the transport direction of the tray 10 and disposed parallel to each other. In the process chamber 218 , the tray 10 may move linearly along the process chamber guide rail 226 .
  • the process chamber guide rail 226 is installed in the process housing 217, in addition to the structure including a plurality of rollers 209 as shown, to be changed to various other structures that can guide the tray 10 to move linearly.
  • the tray 10 may be transferred by a plurality of process chamber tray transfer devices 228 , 229 , 230 .
  • These process chamber tray transfer devices 228 , 229 , 230 are similar to the preheat chamber tray transfer device 212 installed in the preheating housing 202 , the transfer pad 213 moves up and down and linearly moves to the tray 10 . It may be configured to push or pull.
  • the transfer pad 213 of each of the process chamber tray transfer devices 228 , 229 , 230 can move up and down and linearly move in the space between the pair of process chamber guide rails 226 .
  • a plurality of process chamber tray transport devices 228 , 229 , 230 are suitable for upper and lower portions of the process chamber guide rail 226 .
  • the tray 10, which is disposed to pass through the preheating chamber 203 and passes through the process chamber 218, may be transferred to the buffer chamber 233 side. That is, one process chamber tray transfer device 228 transfers the tray 10 passing through the preheating chamber 203 to the middle side of the process chamber 218 , and the other process chamber tray transfer device 229 transfers the tray 10 . (10) transports the tray 10 in the middle of the process chamber 218 toward the process housing outlet 220 by a certain distance, and another process chamber tray transport device 230 moves the tray 10 to the buffer chamber 233 can be transferred to the side.
  • Each of the process chamber tray transfer devices 228 , 229 , 230 guides the process chamber so that each transfer pad 213 does not interfere with the transferred tray 10 when the tray 10 does not transfer. It may rise or fall in a direction away from the rail 226 .
  • the process chamber tray transfer devices 228 , 229 , 230 may be changed to various other structures other than the illustrated structure, which can move the tray 10 to the buffer chamber 233 side in the process chamber 218 . .
  • the number of process chamber tray transfer devices 228 , 229 , 230 installed in the process housing 217 may be variously changed.
  • a buffer housing inlet 234 connected to the buffer chamber 233 is provided at one end of the buffer housing 232 , and an outlet 235 is provided at the other end of the buffer housing 232 .
  • the buffer housing inlet 234 faces the process housing outlet 220 of the process housing 217 .
  • the buffer housing inlet 234 may be opened and closed by the second intermediate door 285 , and the outlet 235 may be opened and closed by the outlet door 290 .
  • At least one buffer housing intake 236 for introducing gas into the buffer chamber 233 is provided in the buffer housing 232 .
  • a gas supply pipe 250 connected to the post-heating gas supply device 249 is connected to the buffer housing intake 236 .
  • the gas supplied from the post-heating gas supply device 249 may be introduced into the buffer chamber 233 through the buffer housing intake 236 .
  • the post-heating gas supply device 249 supplies the heated gas to the buffer chamber 233 to post-heat the panel assembly 20 input to the buffer chamber 233 .
  • the post-heating gas supply device 249 supplies the heated gas to the buffer chamber 233 , so that the buffer chamber 233 may be maintained at a preset temperature and pressure. Accordingly, the panel assembly 20 may be introduced into the buffer chamber 233 to undergo a post-heating process in an atmosphere of a preset post-heating temperature and post-heating pressure.
  • the temperature of the panel assembly 20 is rapidly lowered and the panel assembly 20 may receive a thermal shock. Accordingly, if the panel assembly 20 passing through the process chamber 218 is discharged from the housing 200 after being heated in the buffer chamber 233 without being directly discharged from the housing 200 , a thermal shock problem can be prevented.
  • the temperature and pressure in the buffer chamber 233 may be set to be lower than the temperature and pressure in the process chamber 218 .
  • a buffer chamber guide rail 238 is installed inside the buffer housing 232 to guide the tray 10 to linearly move.
  • the buffer chamber guide rail 238 includes a plurality of rollers 209 , like the preheating chamber guide rail 208 , and a guide rail body 210 supporting the plurality of rollers 209 .
  • a pair of buffer chamber guide rails 238 may be spaced apart from each other in a direction perpendicular to the transport direction of the tray 10 and disposed parallel to each other. In the buffer chamber 233 , the tray 10 may linearly move along the process chamber guide rail 226 .
  • the buffer chamber guide rail 238 is installed in the buffer housing 232 in addition to the structure including a plurality of rollers 209 as shown in the figure and can be changed to various other structures that can guide the tray 10 to move linearly. can
  • the tray 10 may be transferred by the buffer chamber tray transfer device 240 .
  • the buffer chamber tray transfer device 240 may have a structure in which the transfer pad 213 moves up and down and linearly moves to push or pull the tray 10 like the preheating chamber tray transfer device 212 described above.
  • the transfer pad 213 of the buffer chamber tray transfer device 240 can move up and down and linearly move in the space between the pair of buffer chamber guide rails 238 .
  • the transfer pad 213 rises away from the buffer chamber guide rail 238 and does not interfere with the tray 10 fed into the buffer chamber 233 .
  • the transfer pad 213 may descend in a direction closer to the buffer chamber guide rail 238 to contact the tray 10 .
  • the buffer chamber tray transfer device 240 may be changed to various other structures capable of moving the tray 10 toward the outlet 235 in the buffer chamber 233 .
  • the inlet door 257 is disposed at one end of the preheating housing 202 to open and close the inlet 204 .
  • the inlet door 257 includes a door body 258 and a packing 264 disposed inside the door body 258 .
  • the packing 264 is annular to surround the inlet 204 of the preheat housing 202 .
  • the cross-sectional shape of the packing 264 has a shape in which the width gradually decreases from one end to the other end.
  • the packing 264 may be made of an elastically deformable material such as rubber or silicone.
  • a door chamber 259 in which the packing 264 is accommodated is provided inside the door body 258 .
  • a door opening 260 connected to the door chamber 259 and opened toward the preheating housing 202 is provided on one surface of the door body 258 .
  • the door opening 260 has an annular shape corresponding to the shape of the packing 264 so that the annular packing 264 can be inserted.
  • the door opening 260 has a shape in which the width gradually decreases from the inside of the door body 258 to the outside of the door body 258 .
  • the packing 264 may be inserted into the door opening 260 to move in the door opening 260 , and an end thereof may protrude from one surface of the door body 258 toward the preheating housing 202 .
  • a door intake port 261 connected to the door chamber 259 is provided at one side of the door body 258 .
  • a supply tube 267 is connected to the door intake port 261 .
  • the supply tube 267 may be connected to the door gas supply 266 for supplying gas to the door chamber 259 to flow the gas supplied from the door gas supply 266 to the door intake port 261 .
  • the pressure in the door chamber 259 increases so that the packing 264 is pushed outward of the door body 258 in the door opening 260 . it becomes In this case, the end of the packing 264 may protrude from the surface of the door body 258 .
  • a door exhaust port 262 connected to the door chamber 259 is provided at the other side of the door body 258 .
  • the door exhaust port 262 is for exhausting the gas of the door chamber 259 .
  • a door exhaust valve 263 for opening and closing the door exhaust port 262 is connected to the door exhaust port 262 .
  • the door exhaust valve 263 blocks the door exhaust port 262 .
  • the door exhaust valve 263 opens the door exhaust port 262 , the gas in the door chamber 259 may be discharged through the door exhaust port 262 .
  • the inlet door 257 may be raised and lowered by the inlet door moving device 268 . As shown in FIG. 6 , the inlet door 257 lowers the upper end of the inlet door moving device 268 lower than the inlet 204 of the preheating housing 202 to close the inlet 204 of the preheating housing 202. can be opened And the inlet door 257 may rise to a height facing the inlet 204 by the inlet door moving device 268, as shown in Fig. 7 (a).
  • the first intermediate door 270 is disposed between the preheating housing 202 and the process housing 217 to provide a preheating housing outlet 205 of the preheating housing 202 and a process
  • the process housing inlet 219 of the housing 217 may be simultaneously opened and closed.
  • the first intermediate door 270 includes a door body 271 and a first packing 278 and a second packing 279 disposed inside the door body 271 .
  • the first packing 278 is annular to wrap around the preheat housing outlet 205 of the preheat housing 202 .
  • the cross-sectional shape of the first packing 278 has a shape in which the width gradually decreases from one end to the other end.
  • the first packing 278 may be made of an elastically deformable material such as rubber or silicone.
  • the second packing 279 is annular to surround the process housing inlet 219 of the process housing 217 .
  • the cross-sectional shape of the second packing 279 is formed in a shape in which the width gradually decreases from one end to the other end.
  • the second packing 279 may be made of an elastically deformable material such as rubber or silicone.
  • a door chamber 272 in which the first packing 278 and the second packing 279 are accommodated is provided inside the door body 271 .
  • a first door opening 273 connected to the door chamber 272 and opened toward the preheating housing 202 is provided on one surface of the door body 271 , and connected to the door chamber 272 on the other surface of the door body 271 .
  • a second door opening 274 that is opened toward the process housing 217 is provided.
  • the first door opening 273 has an annular shape corresponding to the shape of the first packing 278 so that the annular first packing 278 can be inserted.
  • the first door opening 273 has a shape in which the width gradually decreases from the inside of the door body 271 to the outside of the door body 271 to correspond to the cross-sectional shape of the first packing 278 .
  • the first packing 278 may be inserted into the first door opening 273 to move in the first door opening 273 , and its end may protrude from one surface of the door body 271 toward the preheating housing 202 . have.
  • the second door opening 274 has an annular shape corresponding to the shape of the second packing 279 so that the annular second packing 279 can be inserted.
  • the second door opening 274 has a shape in which the width gradually decreases from the inside of the door body 271 to the outside of the door body 271 to correspond to the cross-sectional shape of the second packing 279 .
  • the second packing 279 may be inserted into the second door opening 274 and move in the second door opening 274 , and its end may protrude from the other surface of the door body 271 toward the process housing 217 . have.
  • a door intake port 275 connected to the door chamber 272 is provided at one side of the door body 271 .
  • a supply tube 282 is connected to the door intake 275 .
  • the supply tube 282 may be connected to the door gas supplier 281 for supplying gas to the door chamber 272 to flow the gas supplied from the door gas supplier 281 to the door intake port 275 .
  • the pressure of the door chamber 272 increases so that the first packing 278 is inserted into the door body 271 in the first door opening 273 . It is pushed outward, and the second packing 279 is pushed outward of the door body 271 in the second door opening 274 .
  • an end of the first packing 278 may protrude from one surface of the door body 271
  • an end of the second packing 279 may protrude from the other surface of the door body 271 .
  • a door exhaust port 276 connected to the door chamber 272 is provided at the other side of the door body 271 .
  • the door exhaust port 276 is for exhausting the gas of the door chamber 272 .
  • a door exhaust valve 277 for opening and closing the door exhaust port 276 is connected to the door exhaust port 276 .
  • the door exhaust valve 277 blocks the door exhaust port 276 .
  • the door exhaust valve 277 opens the door exhaust port 276 , the gas in the door chamber 272 may be discharged through the door exhaust port 276 .
  • the first intermediate door 270 may be raised and lowered by the first intermediate door moving device 283 . As shown in FIG. 9 , the first intermediate door 270 has the upper ends of the preheating housing outlet 205 of the preheating housing 202 and the process housing of the process housing 217 by the first intermediate door moving device 283 . Lowering below inlet 219 may open preheat housing outlet 205 and process housing inlet 219 . And, the first intermediate door 270 is moved to a height facing the preheating housing outlet 205 and the process housing inlet 219 by the first intermediate door moving device 283, as shown in FIG. can rise
  • the door chamber 272 When gas is supplied to the door chamber 272 from the door gas supply 281 while the first intermediate door 270 is raised to a height that can block the preheating housing outlet 205 and the process housing inlet 219, the door chamber As the pressure of the 272 increases, the first packing 278 and the second packing 279 are pushed outwardly of the door body 271 . At this time, as shown in FIG. 10B , the end of the first packing 278 protrudes from one surface of the door body 271 and surrounds the preheating housing outlet 205 and is in close contact with the outer surface of the preheating housing 202 . As a result, the preheating housing outlet 205 can be reliably sealed. And the end of the second packing 279 protrudes from the other surface of the door body 271 and surrounds the process housing inlet 219 and is in close contact with the outer surface of the process housing 217, thereby stably sealing the process housing inlet 219 can be
  • the gas in the door chamber 272 is discharged through the door exhaust port 276 to the door chamber 272 .
  • the adhesive force of the first packing 278 that was in close contact with the outer surface of the preheating housing 202 is released and the adhesion of the second packing 279 that the process housing 217 is in close contact with the outer surface is released.
  • the first intermediate door 270 may be smoothly lowered to a position where the preheating housing outlet 205 and the process housing inlet 219 are opened by the first intermediate door moving device 283 .
  • the second intermediate door 285 is disposed between the process housing 217 and the buffer housing 232 to open the process housing outlet 220 of the process housing 217 and the buffer housing inlet 234 of the buffer housing 232 . Can be opened and closed at the same time.
  • the second intermediate door 285 has the same structure as the first intermediate door 270 shown in FIG. 8 .
  • the second intermediate door 285 is a door provided with a door chamber 272 , a first door opening 273 , a second door opening 274 , a door intake port 275 , and a door exhaust port 276 .
  • the first door opening 273 opens toward the process housing 217
  • the second door opening 274 opens toward the buffer housing 232 .
  • a supply tube 287 connected to a door gas supply 286 for supplying gas is connected to the door intake port 275 .
  • the second intermediate door 285 is at a position where the process housing outlet 220 and the buffer housing inlet 234 are opened by the second intermediate door mover 288 or the process housing outlet 220 and the buffer housing inlet 234 can be moved to a position to block
  • the first packing 278 protrudes toward the process housing 217 and the second packing 279 protrudes toward the buffer housing 232 .
  • the first packing 278 surrounds the process housing outlet 220 and is in close contact with the process housing 217 to seal the process housing outlet 220
  • the second packing 279 closes the buffer housing inlet 234 . While being surrounded, it may be closely attached to the buffer housing 232 to seal the buffer housing inlet 234 .
  • the outlet door 290 is disposed at one end of the buffer housing 232 to open and close the outlet 235 .
  • the outlet door 290 has the same structure as the inlet door 257 shown in FIG. 5 . That is, the outlet door 290 is inserted into the door chamber 259 , the door opening 260 , the door intake port 261 , the door body 258 in which the door exhaust port 262 is formed, and the door opening 260 . It includes a packing 264 disposed in the door chamber 259 as much as possible, and a door exhaust valve 263 for opening and closing the door exhaust port 262 .
  • the door opening 260 opens towards the buffer housing 232 .
  • a supply tube 292 connected to a door gas supply 291 for supplying gas is connected to the door exhaust port 262 .
  • the outlet door 290 may be moved to a position in which the outlet 235 is opened or the outlet 235 is blocked by the outlet door moving device 293 .
  • the packing 264 moves toward the buffer housing 232 . protrude In this case, the packing 264 may be in close contact with the buffer housing 232 while surrounding the outlet 235 to seal the outlet 235 .
  • the tray input device 300 may transfer the tray 10 on which the panel assembly 20 is loaded to the preheating chamber 203 through the inlet 204 of the housing 200 .
  • the tray input device 300 may be installed at a location where the loading pedestal 310 on which the tray 10 is loaded is installed.
  • the tray input device 300 has a structure in which the transfer pad 213 linearly moves to push the tray 10 as shown, or other various structures capable of transferring the tray 10 to the preheating chamber 203 side. can
  • the tray 10 may be loaded onto the loading pedestal 310 with the panel assembly 20 mounted thereon, or may be loaded onto the loading pedestal 310 with the panel assembly 20 not mounted thereon. In the latter case, the plurality of panel assemblies 20 may be loaded on the tray 10 while the empty tray 10 is loaded on the loading pedestal 310 .
  • An input guide rail 320 for transporting the tray 10 may be installed between the housing 200 and the loading pedestal 310 .
  • the input guide rail 320 may have a structure including a plurality of rollers 209 as shown, or various other structures capable of guiding the tray 10 .
  • the tray discharge device 400 is installed on the side of the discharge port 235 of the housing 200 to transfer the tray 10 that has passed through the preheating chamber 203 to a predetermined position outside the housing 200 .
  • the tray discharge device 400 may transfer the tray 10 to the unloading pedestal 410 . After the panel assembly 20 is separated from the unloading pedestal 410 , the tray 10 may be transported by the tray transport device 500 .
  • the tray discharge device 400 may take various structures capable of transporting the tray 10 .
  • a discharge guide rail 420 for transporting the tray 10 may be installed between the housing 200 and the unloading pedestal 410 .
  • the discharge guide rail 420 may have a structure including a plurality of rollers 209 as shown, or various other structures capable of guiding the tray 10 .
  • the tray transport device 500 may transport the tray 10 from which the heat-treated panel assembly 20 is separated to a position where it can be re-inserted into the housing 200 .
  • the tray transport device 500 includes a first tray transport device 510 , a transport conveyor 520 , and a second tray transport device 530 .
  • the first tray transport device 510 transports the tray 10 located on the unloading pedestal 410 to the transport conveyor 520 .
  • the first tray transport device 510 is a transport tray for transporting the tray carrier 511 on which the tray 10 can be placed, and the tray 10 placed on the unloading pedestal 410 to the tray carrier 511 . It includes a conveying device 513 and another conveying tray conveying device 514 for conveying the tray 10 placed on the tray carrier 511 to the conveying conveyor 520 .
  • the tray carrier 511 may be raised and lowered by the elevating device 512 .
  • the lifting device 512 may raise the tray carrier 511 to the height of the unloading pedestal 410 or lower it to the height of the conveyer 520 .
  • one conveying tray transfer device 513 operates to move the tray 10 placed on the unloading pedestal 410 to the tray carrier 511 ) can be transported.
  • another conveying tray conveying device 514 operates to move the tray 10 placed on the tray conveyer 511 to the conveying conveyor 520 ) can be transported.
  • the transport tray transport device 513, 514 provided in the first tray transport device 510 has a structure in which the transport pad 213 linearly moves to push or pull the tray 10 as shown, or other trays (10) can take a variety of structures that can be transported.
  • the first tray transport device 510 is, as shown, in addition to the structure including the tray transporter 511 and a pair of transport tray transporters 513 and 514, the unloading pedestal 410. It may be of various other structures capable of transporting the placed tray 10 to the conveying conveyor 520 .
  • the transport conveyor 520 is disposed between the first tray transport device 510 and the second tray transport device 530 to transport the tray 10 transported by the first tray transport device 510 to the second tray transport device 530 . ) is transferred to The conveying conveyor 520 may be a belt conveyor as shown, or a conveyor having various other structures.
  • the second tray transport device 530 transports the tray 10 transported by the transport conveyor 520 to the loading pedestal 310 .
  • the second tray transport device 530 is for transporting the tray carrier 531 on which the tray 10 can be placed, and the tray 10 transported on the transport conveyor 520 to the tray carrier 531 .
  • It includes a tray transport device 533 and another transport tray transport device 534 for transporting the tray 10 placed on the tray carrier 531 to the loading pedestal 310 .
  • the tray carrier 531 may be elevated by the elevating device 532 .
  • the lifting device 532 may raise the tray carrier 531 to the height of the loading pedestal 310 or lower it to the height of the conveyer 520 .
  • the conveying tray conveying device 533 operates to transport the tray 10 loaded on the conveying conveyor 520 to the tray conveyer 531 . can do.
  • another conveying tray transfer device 534 operates to place the tray 10 placed on the tray carrier 531 on the loading pedestal 310. can be transported to
  • the transport tray transport device 533, 534 provided in the second tray transport device 530 has a structure in which the transport pad 213 linearly moves to push or pull the tray 10 as shown, or other trays (10) can take a variety of structures that can be transported.
  • the second tray transport device 530 is mounted on the transport conveyor 520 in addition to the structure including the tray transporter 531 and a pair of transport tray transporters 533 and 534 as shown.
  • the tray 10 to be transported may be formed in various other structures that can be transported to the loading pedestal 310 .
  • the tray transport device 500 may transport the tray 10 from which the panel assembly 20 is separated from the unloading pedestal 410 to the loading pedestal 310 . And when the tray transfer device 500 transfers the tray 10 to the loading pedestal 310 , a plurality of panel assemblies 20 are placed on the tray 10 placed on the loading pedestal 310 , and then a new panel assembly 20 ) loaded tray 10 may be put back into the housing 200 by the tray input device 300 .
  • the tray conveying device 500 is, as shown, a first tray conveying device 510, a conveying conveyor 520, and a second tray conveying device 530.
  • the outlet of the housing 200 The tray 10 discharged to the 235 may be formed in various other structures that can be transferred back to the inlet 204 side of the housing 200 .
  • the tray 10 on which the panel assembly 20 is loaded is fed into the housing 200 through the inlet 204 , and the preheat chamber 203 , the process chamber 218 , and the buffer chamber 233 . ) to be discharged from the housing 200 through the discharge port 235, and the tray 10 is conveyed to the inlet 204 side by the tray conveying device 500 through the overall operation of the autoclave device 100.
  • the control device 600 operates By operating the tray input device 300 , the tray 10 is introduced into the preheating chamber 203 through the input hole 204 . After the tray 10 is put into the preheating chamber 203, the control device 600 operates the inlet door 257 and the first intermediate door 270 to operate the inlet 204 of the housing 200 and the preheating housing outlet ( 205) is sealed. Thereafter, the controller 600 operates the preheating gas supply device 245 to supply the heated gas to the preheating chamber 203 .
  • the preheating chamber 203 As the heated gas is supplied to the preheating chamber 203, the preheating chamber 203 is maintained at a preset preheating temperature and preheating pressure, and the panel assembly 20 placed in the preheating chamber 203 performs a preheating process for a preset time. will go through
  • the controller 600 After the preheating process for the panel assembly 20 is finished, the controller 600 operates the first intermediate door 270 to open the preheating housing outlet 205 and the process housing inlet 219 . Thereafter, the controller 600 operates the preheating chamber tray transfer device 212 to transfer the tray 10 of the preheating chamber 203 to the process chamber 218 . After the tray 10 loaded with the panel assembly 20 is transferred to the process chamber 218 , the controller 600 operates the first intermediate door 270 and the second intermediate door 285 to operate the process housing inlet ( 219) and process housing outlet 220.
  • the controller 600 After the process chamber 218 is sealed, the controller 600 operates the heat treatment gas supply device 247 to supply the heated gas to the process chamber 218 . At this time, the intake valve 223 is controlled to open to open the gas intake port 221 , and the exhaust valve 224 is controlled to close to block the gas exhaust port 222 .
  • the controller 600 operates the fan device 254 and the heater 255 installed in the process chamber 218 as necessary.
  • the process chamber 218 is maintained at a preset heat treatment temperature and heat treatment pressure by the action of the heat treatment gas supply device 247 , the fan device 254 , and the heater 255 , and the panel assembly 20 placed in the process chamber 218 . is heat treated for a preset time.
  • control device 600 receives detection signals from a plurality of thermometers 252 and a plurality of pressure gauges 253 installed in the process chamber 218 to detect temperatures and pressures at a plurality of locations within the process chamber 218 . . And if there is a portion that does not reach the preset temperature or pressure in the process chamber 218 , the control device 600 connects the gas intake port 221 and the gas exhaust port 222 adjacent to the portion that does not reach the preset temperature or pressure. Opening control of the corresponding intake valve 223 and exhaust valve 224, respectively. At this time, as the gas is exhausted from the corresponding part, a new high-temperature and high-pressure gas is supplied, and the temperature or pressure in the part can be rapidly increased. Accordingly, the entire process chamber 218 may be maintained at a uniform temperature and uniform pressure, and all panel assemblies 20 introduced into the process chamber 218 may be heat-treated under uniform conditions.
  • the controller 600 After the heat treatment process for the panel assembly 20 is finished, the controller 600 operates the second intermediate door 285 to open the process housing outlet 220 and the buffer housing inlet 234 . Thereafter, the controller 600 operates the process chamber tray transfer devices 228 , 229 , 230 to transfer the tray 10 of the process chamber 218 to the buffer chamber 233 .
  • the controller 600 After the tray 10 loaded with the panel assembly 20 is transferred to the buffer chamber 223 , the controller 600 operates the second intermediate door 285 and the outlet door 290 to operate the buffer housing inlet 234 . And the outlet 235 is sealed. After the buffer chamber 233 is sealed, the controller 600 operates the post-heating gas supply device 249 to supply the heated gas to the buffer chamber 233 .
  • the buffer chamber 233 As the heated gas is supplied to the buffer chamber 233, the buffer chamber 233 is maintained at a preset post-heating temperature and post-heating pressure, and the panel assembly 20 placed in the buffer chamber 233 is heated for a preset time. It goes through a heating process.
  • control device 600 After the post-heating process for the panel assembly 20 is finished, the control device 600 operates the outlet door 290 to open the outlet 235 . Thereafter, the control device 600 operates the buffer chamber tray transfer device 240 to transfer the tray 10 of the buffer chamber 233 to the outlet 235 side, and operates the tray discharge device 400 to move the tray 10 ) is transferred to the unloading pedestal 410 .
  • the control device 600 operates the tray transport device 500 to transport the empty tray 10 toward the loading pedestal 310 .
  • the control device 600 operates the tray input device 300 .
  • the tray 10 on which the panel assembly 20 is loaded is put back into the housing 200 .
  • control device 600 controls the panel assembly 20 while the tray 10 on which the panel assembly 20 is loaded passes sequentially through the preheating chamber 203 , the process chamber 218 , and the buffer chamber 233 .
  • the overall operation of the autoclave apparatus 100 is controlled so that the preheating process, the heat treatment process, and the postheating process are continuously performed.
  • control device 600 controls the tray transport device 500 so that the tray 10 discharged from the housing 200 is transferred to the inlet 204 side so that the panel assembly 20 is continuously moved inside the housing 200 . to be put into
  • the preheating chamber 203 and the process chamber 218 inside the housing 200 are provided with the tray 10 on which the panel assembly 20 is loaded. ) and the buffer chamber 233 , a preheating process, a heat treatment process, and a postheating process may be sequentially performed on the panel assembly 20 . Therefore, it is possible to effectively perform the operation of removing air bubbles and increasing the adhesion to the panel assembly 20 .
  • the autoclave apparatus 100 after preheating the panel assembly 20 in the preheating chamber 203 , heat treatment is performed by applying a constant temperature and pressure in the process chamber 218 , and the heat-treated panel Since the assembly 20 is discharged after being heated in the buffer chamber 233 , it is possible to prevent the panel assembly 20 from being damaged due to thermal shock in the process of processing the panel assembly 20 , and a high-quality panel assembly 20 ) can be provided.
  • the operation is efficient and the operation time can be shortened. .
  • the preset temperature or pressure is present.
  • the temperature or pressure in the portion can be quickly increased. Accordingly, the entire process chamber 218 can be maintained at a uniform temperature and pressure, and all panel assemblies 20 injected into the process chamber 218 are heat-treated under uniform conditions to reduce the defect rate, and a plurality of panel assemblies (20) can be batch-processed to shorten the working time.
  • the autoclave apparatus 100 automatically transfers the tray 10 that has passed through the buffer chamber 233 to the inlet 204 side, thereby reducing work force and increasing workability. have.
  • the autoclave apparatus 100 can continuously and rapidly perform heat treatment on the panel assembly 20 in connection with a front and rear process apparatus such as a panel attachment apparatus or a panel inspection apparatus, the product can improve productivity.
  • the housing 200 is divided into a preheating housing 202 , a process housing 217 , and a buffer housing 232 , and a space between the preheating housing 202 and the process housing 217 is removed. It is shown that the first cover 242 covers, and the second cover 243 covers the space between the process housing 217 and the buffer housing 232, but the housing 200 includes the inlet 204 and the preheating chamber ( 203 , a process chamber 218 , a buffer chamber 233 , and an outlet 235 may be modified into various other structures.
  • heat treatment gas supply device 247 supplies heated gas to the inside of the process housing 217
  • a heat treatment gas supply device that supplies heated gas to the process chamber 218 ( 247) may be plural.
  • the inlet door 257, the first intermediate door 270, the second intermediate door 285, and the outlet door 290 move from the lower side to the upper side to open and close the transfer passage of the tray 10.
  • the opening and closing structure of these doors may be variously changed.
  • the inlet door 257, the first intermediate door 270, the second intermediate door 285, and the outlet door 290 have a structure in which the packing protrudes from the door body by the gas supplied from the gas supply for the door.
  • the preheat chamber 203 , the process chamber 218 , and the buffer chamber 233 may be modified into various other structures capable of sealing each other.
  • tray input device 300 and the tray discharge device 400 are each one, a plurality of them may be disposed, respectively.
  • each of the preheating chamber tray transfer device 212 and the buffer chamber tray transfer device 240 is one, a plurality of these may also be disposed on the process chamber trolley like the transfer device.

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Abstract

The present invention relates to an autoclave device. The objective of the present invention is to provide an autoclave device which enables continuous and rapid heat and pressure treatments on a panel assembly, thereby more easily removing air bubbles present in the panel assembly, improving adhesion of the panel assembly, and improving productivity.

Description

오토클레이브 장치autoclave device
본 발명은 오토클레이브 장치에 관한 것으로서, 보다 상세하게는 복수의 패널 소자가 라미네이팅된 패널 조립체를 가열 가압 처리하여 패널 소자들 사이에 존재하는 기포를 제거하고 패널 소자 간의 접합력을 향상시킬 수 있는 오토클레이브 장치에 관한 것이다.The present invention relates to an autoclave apparatus, and more particularly, to an autoclave capable of heat-pressing a panel assembly on which a plurality of panel elements are laminated to remove air bubbles existing between the panel elements and improve bonding strength between the panel elements. It's about the device.
최근 스마트폰, 디지털 TV, 테블릿 PC, 노트북, 네비게이션 등 다양한 디지털 기기가 출시되면서 평판 표시 장치나 터치 스크린 등에 이용되는 디스플레이용 패널의 수요가 증가하고 있다.Recently, as various digital devices such as smartphones, digital TVs, tablet PCs, notebook computers, and navigation devices have been released, the demand for display panels used in flat panel displays or touch screens is increasing.
평판 표시 장치로는 액정 표시 장치(LCD), 유기 발광 다이오드(OLED) 등이 대표적이다. 이러한 각종 평판 표시 장치는 평판 표시 패널에 투명 보호판 등 다양한 기능의 패널을 부착하여 제조한다.As a flat panel display, a liquid crystal display (LCD), an organic light emitting diode (OLED), etc. are representative. Such various flat panel display devices are manufactured by attaching panels having various functions, such as a transparent protection plate, to a flat panel display panel.
터치 스크린은 각종 평판 표시 장치의 표시면에 설치되어 사용자가 표시 장치를 보면서 원하는 정보를 선택하도록 하는데 이용되는 입력장치이다. 터치 스크린은 저항막 방식(resistive type), 정전용량 방식(capacitive type), 전기자기장형 방식(electro-magnetic type), 소오 방식(saw type) 및 적외선 방식(infrared type) 등이 있다. 이러한 터치 스크린은 투명한 재질의 윈도우 패널에 투명전극 패널을 부착하여 제조한다.A touch screen is an input device installed on a display surface of various flat panel display devices to allow a user to select desired information while viewing the display device. The touch screen includes a resistive type, a capacitive type, an electro-magnetic type, a saw type, and an infrared type. Such a touch screen is manufactured by attaching a transparent electrode panel to a window panel made of a transparent material.
이와 같이 평판 표시 장치나 터치 스크린 등 패널형 디스플레이에 이용되는 디스플레이용 패널은 복수의 패널 소자를 부착하여 제조한다. 디스플레이용 패널을 구성하는 복수의 패널 소자를 부착하는 방법으로는, 어느 하나의 패널 소자의 한쪽 면 둘레에 양면 테이프를 부착하고 다른 패널 소자를 이에 합착하여 두 개의 패널 소자를 부착하는 방법이 있다. 이 밖에, OCA 등의 접착 필름으로 두 패널 소자 사이의 마주보는 면 전체를 접착하는 방법이나, 접착하고자 하는 두 패널 소자 사이에 경화성 용제를 도포하고 이를 경화시켜 접합하는 방법이 복수의 패널 소자를 접합하여 디스플레이용 패널을 제조하는데 이용된다.As described above, a display panel used for a panel type display such as a flat panel display device or a touch screen is manufactured by attaching a plurality of panel elements. As a method of attaching a plurality of panel elements constituting a display panel, there is a method of attaching two panel elements by attaching a double-sided tape around one surface of any one panel element and bonding the other panel elements thereto. In addition, a method of bonding the entire facing surface between two panel elements with an adhesive film such as OCA, or a method of applying a curable solvent between two panel elements to be adhered and curing it to bond a plurality of panel elements It is used to manufacture a panel for display.
통상적으로, 디스플레이용 패널의 제조에 있어서, 패널 소자들은 자동화 장치를 통해 부착되며, 패널 소자들이 부착되어 구성된 디스플레이용 패널은 패널 소자 사이의 기포 제거와 패널 소자 간의 접합력 향상을 위해 오토클레이브 장치를 통해 가열 가압 처리된다. 그리고 가열 가압 처리된 디스플레이용 패널은 검사장치에 의한 검사 공정을 거친 후 출하된다.In general, in the manufacture of a display panel, panel elements are attached through an automated device, and the display panel configured by attaching panel elements uses an autoclave device to remove air bubbles between panel elements and improve bonding strength between panel elements. It is heat-pressed. In addition, the heat and pressurized display panel is shipped after passing through an inspection process by an inspection device.
오토클레이브 장치는 도어에 의해 개폐되는 밀폐 하우징과, 디스플레이용 패널이 수용되는 밀폐 하우징 내부의 챔버에 열을 가하기 위한 히터와, 밀폐 하우징의 챔버 내로 기체를 공급하기 위한 기체 공급장치를 포함하는 것이 일반적이다. 이러한 오토클레이브 장치는 등록특허공보 제1139595호, 등록특허공보 제1119792호 등에 다양한 구조의 것이 개시되어 있다.The autoclave device generally includes a sealed housing opened and closed by a door, a heater for applying heat to a chamber inside the sealed housing in which the display panel is accommodated, and a gas supply device for supplying gas into the chamber of the sealed housing. to be. Such an autoclave device is disclosed in Korean Patent Publication No. 1139595, Korean Patent Publication No. 1119792, etc. of various structures.
현재 다양한 구조의 오토클레이브 장치가 개발되어 있지만, 패널 소자들 사이에 존재하는 기포를 보다 효율적으로 제거하고, 페널 소자들 간의 접착력을 보다 향상시킬 수 있으며, 생산성을 향상시킬 수 있는 오토클레이브 장치를 제공하기 위한 연구 개발이 지속적으로 이루어지고 있다.Currently, autoclave devices having various structures have been developed, but an autoclave device capable of more efficiently removing air bubbles present between panel elements, improving adhesion between panel elements, and improving productivity. Research and development for this purpose is continuously being carried out.
본 발명은 상술한 바와 같은 점을 감안하여 안출된 것으로서, 패널 조립체에 대한 가열 가압 처리를 연속적으로 신속하게 수행함으로써, 패널 조립체에 존재하는 기포를 보다 용이하게 제거하고, 패널 조립체의 접착력을 향상시키며, 생산성을 향상시킬 수 있는 오토클레이브 장치를 제공하는 것을 목적으로 한다.The present invention has been devised in view of the foregoing, and by continuously and rapidly performing heat and pressure treatment on the panel assembly, more easily removes air bubbles present in the panel assembly, improves the adhesive force of the panel assembly, , An object of the present invention is to provide an autoclave device capable of improving productivity.
본 발명의 목적은 상술한 것에 한정되지 않으며, 언급되지 아니한 다른 목적들은 아래의 기재로부터 통상의 기술자에게 명확하게 이해될 수 있을 것이다.Objects of the present invention are not limited to those described above, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.
상술한 바와 같은 목적을 달성하기 위한 본 발명에 따른 오토클레이브 장치는, 패널 조립체가 실린 트레이가 투입될 수 있는 투입구와, 패널 조립체가 배출될 수 있는 배출구와, 상기 투입구와 상기 배출구 사이에 배치되는 공정 챔버와, 상기 공정 챔버로 기체를 유입시키기 위한 복수의 기체 흡입구와, 상기 공정 챔버의 기체를 배기시키기 위한 복수의 기체 배기구를 구비하는 하우징; 상기 투입구를 개폐하기 위한 투입구 도어; 상기 배출구를 개폐하기 위한 배출구 도어; 상기 복수의 기체 흡입구를 통해 상기 공정 챔버에 가열된 기체를 공급하는 열처리 기체 공급장치; 상기 복수의 기체 흡입구와 각각 연결되도록 설치되어 상기 복수의 기체 흡입구를 통한 기체의 유동을 단속하는 복수의 흡기 밸브; 상기 복수의 기체 배기구와 각각 연결되도록 설치되어 상기 복수의 기체 배기구를 통한 기체의 유동을 단속하는 복수의 배기 밸브; 상기 공정 챔버 내의 온도를 검출하기 위해 상기 하우징에 설치되는 복수의 온도계; 상기 공정 챔버 내의 압력를 검출하기 위해 상기 하우징에 설치되는 복수의 압력계; 및 상기 복수의 온도계 및 상기 복수의 압력계로부터 검출 신호를 수신하고, 상기 트레이에 실린 패널 조립체가 상기 공정 챔버에서 사전 설정된 열처리 온도 및 열처리 압력으로 열처리되도록 상기 투입구 도어와, 상기 배출구 도어와, 상기 열처리 기체 공급장치와, 상기 복수의 흡기 밸브와, 상기 복수의 배기 밸브를 제어하는 제어장치;를 포함하고, 상기 제어장치는, 상기 복수의 온도계 및 상기 복수의 압력계로부터 수신한 검출 신호에 따라 상기 복수의 흡기 밸브 및 상기 복수의 배기 밸브를 제어하되, 상기 공정 챔버 내에서 상기 열처리 온도 또는 상기 열처리 압력에 미치지 못하는 부분에 인접한 기체 흡입구 및 기체 배기구에 각각 대응하는 흡기 밸브 및 배기 밸브를 열림 제어하여 해당 부분에서 기체를 배기시키면서 상기 열처리 기체 공급장치에서 공급되는 기체를 공급하는 것을 특징으로 한다.An autoclave apparatus according to the present invention for achieving the above object includes an inlet through which a tray loaded with a panel assembly can be inserted, an outlet through which the panel assembly can be discharged, and the inlet and the outlet disposed between the outlet a housing having a process chamber, a plurality of gas inlets for introducing gas into the process chamber, and a plurality of gas outlets for exhausting gas from the process chamber; an inlet door for opening and closing the inlet; an outlet door for opening and closing the outlet; a heat treatment gas supply device for supplying heated gas to the process chamber through the plurality of gas inlets; a plurality of intake valves installed to be respectively connected to the plurality of gas intakes to control the flow of gas through the plurality of gas intakes; a plurality of exhaust valves installed to be respectively connected to the plurality of gas exhaust ports to control the flow of gas through the plurality of gas exhaust ports; a plurality of thermometers installed in the housing to detect a temperature in the process chamber; a plurality of pressure gauges installed in the housing to detect pressure in the process chamber; and receiving the detection signals from the plurality of thermometers and the plurality of pressure gauges, the inlet door, the outlet door, and the heat treatment such that the panel assembly loaded on the tray is heat treated at a preset heat treatment temperature and heat treatment pressure in the process chamber a gas supply device, a control device for controlling the plurality of intake valves, and the plurality of exhaust valves, wherein the control device includes: control the intake valve and the plurality of exhaust valves of the , and control the opening of the intake valve and exhaust valve respectively corresponding to the gas intake and gas exhaust ports adjacent to the portion that does not reach the heat treatment temperature or the heat treatment pressure in the process chamber. It is characterized in that the gas supplied from the heat treatment gas supply device is supplied while exhausting the gas from the part.
본 발명에 따른 오토클레이브 장치는, 상기 공정 챔버 내에서 기류를 발생시킬 수 있도록 상기 하우징에 설치되는 팬 장치;를 포함할 수 있다.The autoclave device according to the present invention may include a fan device installed in the housing to generate an airflow in the process chamber.
본 발명에 따른 오토클레이브 장치는, 상기 공정 챔버 내에 열을 제공할 수 있도록 상기 하우징에 설치되는 히터;를 포함할 수 있다.The autoclave apparatus according to the present invention may include a heater installed in the housing to provide heat to the process chamber.
상기 기체 흡입구와 상기 기체 배기구는 하나씩 짝을 이루도록 상호 인접하여 설치될 수 있다.The gas inlet and the gas outlet may be installed adjacent to each other so as to form a pair.
상기 하우징에는, 상기 투입구와 상기 공정 챔버 사이에 배치되는 예열 챔버와, 상기 공정 챔버와 상기 배출구 사이에 배치되는 버퍼 챔버가 구비되고, 본 발명에 따른 오토클레이브 장치는, 상기 예열 챔버와 상기 공정 챔버 사이의 통로를 개폐하기 위한 제1 중간 도어; 상기 공정 챔버와 상기 버퍼 챔버 사이의 통로를 개폐하기 위한 제2 중간 도어; 상기 예열 챔버에 가열된 기체를 공급하는 예열 기체 공급장치; 상기 버퍼 챔버에 가열된 기체를 공급하는 후가열 기체 공급장치; 상기 트레이를 가이드하기 위해 상기 예열 챔버에 설치되는 예열 챔버 가이드레일; 상기 트레이를 가이드하기 위해 상기 공정 챔버에 설치되는 공정 챔버 가이드레일; 상기 트레이를 가이드하기 위해 상기 버퍼 챔버에 설치되는 버퍼 챔버 가이드레일; 상기 예열 챔버에서 상기 트레이를 상기 공정 챔버 측으로 이동시키는 예열 챔버 트레이 이송장치; 상기 공정 챔버에서 상기 트레이를 상기 버퍼 챔버 측으로 이동시키는 공정 챔버 트레이 이송장치; 및 상기 버퍼 챔버에서 상기 트레이를 상기 배출구 측으로 이동시키는 버퍼 챔버 트레이 이송장치;를 포함하고, 상기 제어장치는, 상기 트레이에 실린 패널 조립체가, 상기 예열 챔버에서 사전 설정된 예열 온도 및 예열 압력으로 예열된 후 상기 공정 챔버로 이송되고, 상기 공정 챔버에서 사전 설정된 열처리 온도 및 열처리 압력으로 열처리된 후 상기 버퍼 챔버로 이송되며, 상기 버퍼 챔버에서 사전 설정된 후가열 온도 및 후가열 압력으로 후가열된 후 상기 배출구를 통해 배출되도록 상기 투입구 도어와, 상기 배출구 도어와, 상기 제1 중간 도어와, 상기 제2 중간 도어와, 상기 예열 기체 공급장치와, 상기 열처리 기체 공급장치와, 상기 후가열 기체 공급장치와, 상기 예열 챔버 트레이 이송장치와, 상기 공정 챔버 트레이 이송장치와, 상기 버퍼 챔버 트레이 이송장치를 제어할 수 있다.The housing includes a preheating chamber disposed between the inlet and the process chamber, and a buffer chamber disposed between the process chamber and the outlet. In the autoclave apparatus according to the present invention, the preheating chamber and the process chamber are provided. a first intermediate door for opening and closing a passage therebetween; a second intermediate door for opening and closing a passage between the process chamber and the buffer chamber; a preheating gas supply device for supplying heated gas to the preheating chamber; a post-heating gas supply device for supplying heated gas to the buffer chamber; a preheating chamber guide rail installed in the preheating chamber to guide the tray; a process chamber guide rail installed in the process chamber to guide the tray; a buffer chamber guide rail installed in the buffer chamber to guide the tray; a preheating chamber tray transfer device for moving the tray from the preheating chamber toward the process chamber; a process chamber tray transfer device for moving the tray from the process chamber to the buffer chamber; and a buffer chamber tray transfer device for moving the tray from the buffer chamber toward the outlet, wherein the control device is configured such that the panel assembly loaded on the tray is preheated to a preset preheating temperature and preheating pressure in the preheating chamber. After being transferred to the process chamber, heat-treated at a preset heat treatment temperature and heat treatment pressure in the process chamber, and then transferred to the buffer chamber, after being post-heated to a preset post-heating temperature and post-heating pressure in the buffer chamber, the outlet The inlet door, the outlet door, the first intermediate door, the second intermediate door, the preheating gas supply device, the heat treatment gas supply device, and the post-heating gas supply device so as to be discharged through the The preheat chamber tray transfer device, the process chamber tray transfer device, and the buffer chamber tray transfer device may be controlled.
상기 하우징은, 상기 투입구와, 상기 예열 챔버와, 상기 예열 챔버에서 상기 트레이가 배출될 수 있도록 상기 예열 챔버와 연결되는 예열 하우징 출구를 갖는 예열 하우징과, 상기 공정 챔버와, 상기 예열 하우징 출구와 마주하여 상기 공정 챔버와 연결되는 공정 하우징 입구와, 상기 공정 챔버에서 상기 트레이가 배출될 수 있도록 상기 공정 챔버와 연결되는 공정 하우징 출구를 갖는 공정 하우징과, 상기 버퍼 챔버와, 상기 공정 하우징 출구와 마주하여 상기 버퍼 챔버와 연결되는 버퍼 하우징 입구와, 상기 배출구를 갖는 버퍼 하우징을 포함하고, 상기 제1 중간 도어는 상기 예열 하우징 출구와 상기 공정 하우징 입구를 동시에 개폐할 수 있도록 상기 예열 하우징과 상기 공정 하우징의 사이에 설치되고, 상기 제2 중간 도어는 상기 공정 하우징 출구와 상기 버퍼 하우징 입구를 동시에 개폐할 수 있도록 상기 공정 하우징과 상기 버퍼 하우징의 사이에 설치될 수 있다.The housing may include a preheating housing having the inlet, the preheating chamber, and a preheating housing outlet connected to the preheating chamber to discharge the tray from the preheating chamber, the process chamber and the preheating housing outlet a process housing having a process housing inlet connected to the process chamber and a process housing outlet connected to the process chamber so that the tray can be discharged from the process chamber; and the buffer chamber and the process housing outlet to face the process housing outlet a buffer housing having an inlet connected to the buffer chamber and a buffer housing having the outlet, wherein the first intermediate door is configured to simultaneously open and close the outlet of the preheating housing and the inlet of the process housing. The second intermediate door may be installed between the process housing and the buffer housing so as to simultaneously open and close the process housing outlet and the buffer housing inlet.
상술한 바와 같은 본 발명에 따른 오토클레이브 장치는 패널 조립체가 열처리되는 공정 챔버 내에서 사전 설정된 온도 또는 압력에 미치지 못하는 부분이 존재하면, 사전 설정된 온도 또는 압력에 미치지 못하는 부분에서 기체를 배기시키면서 새로운 고온 고압의 기체를 공급함으로써, 해당 부분에서의 온도 또는 압력을 신속하게 상승시킬 수 있다. 따라서, 공정 챔버 전체를 균일한 온도 및 균일한 압력으로 유지시킬 수 있고, 공정 챔버로 투입된 모든 패널 조립체를 균일한 조건으로 열처리하여 불량률을 줄이고, 다수의 패널 조립체를 일괄 처리하여 작업 시간을 단축할 수 있다.In the autoclave apparatus according to the present invention as described above, if there is a portion that does not reach the preset temperature or pressure in the process chamber in which the panel assembly is heat treated, a new high temperature while exhausting gas from the portion that does not reach the preset temperature or pressure By supplying high-pressure gas, it is possible to quickly increase the temperature or pressure in the part. Therefore, it is possible to maintain the entire process chamber at a uniform temperature and uniform pressure, reduce the defect rate by heat-treating all panel assemblies put into the process chamber under uniform conditions, and shorten the working time by batch processing a number of panel assemblies. can
또한, 본 발명에 따른 오토클레이브 장치는 패널 조립체가 실린 트레이를 하우징의 내부의 예열 챔버와, 공정 챔버 및 버퍼 챔버를 따라 차례로 이송하면서 패널 조립체에 대해 예열 공정, 열처리 공정 및 후가열 공정을 차례로 수행할 수 있다. 따라서, 패널 조립체에 대한 열처리 작업을 효과적으로 수행할 수 있고, 생산성을 향상시킬 수 있다.In addition, the autoclave apparatus according to the present invention sequentially performs a preheating process, a heat treatment process, and a postheating process on the panel assembly while sequentially transferring the tray on which the panel assembly is loaded through the preheating chamber, the process chamber, and the buffer chamber inside the housing. can do. Therefore, it is possible to effectively perform a heat treatment operation on the panel assembly, and it is possible to improve productivity.
또한, 본 발명에 따른 오토클레이브 장치는 패널 조립체를 예열 챔버에서 예열한 후 공정 챔버에서 일정한 온도와 압력을 가해 열처리하고, 열처리된 패널 조립체를 버퍼 챔버에서 후가열한 후 배출시키므로, 패널 조립체 처리 과정에서 패널 조립체가 열충격을 받아 손상되는 문제를 방지할 수 있고, 기포가 제거되고 접합력이 향상된 고품질의 패널 조립체를 제공할 수 있다.In addition, the autoclave apparatus according to the present invention preheats the panel assembly in the preheating chamber, heat-treats the panel assembly by applying a constant temperature and pressure in the process chamber, and discharges the heat-treated panel assembly after heating in the buffer chamber. It is possible to prevent the panel assembly from being damaged by thermal shock, and to provide a high-quality panel assembly in which air bubbles are removed and bonding strength is improved.
또한, 본 발명에 따른 오토클레이브 장치는 패널 조립체에 대한 예열 공정, 열처리 공정 및 후가열 공정이 연속적으로 수행되므로, 작업이 효율적이고 공정 시간을 단축할 수 있다.In addition, in the autoclave apparatus according to the present invention, since the preheating process, the heat treatment process, and the postheating process for the panel assembly are continuously performed, the operation is efficient and the process time can be shortened.
본 발명의 효과는 상술한 것에 한정되지 않으며, 언급되지 아니한 다른 효과들은 아래의 기재로부터 통상의 기술자에게 명확하게 이해될 수 있을 것이다.Effects of the present invention are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.
도 1은 본 발명의 일실시예에 따른 오토클레이브 장치를 개략적으로 나타낸 것이다.1 schematically shows an autoclave apparatus according to an embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 오토클레이브 장치의 일부 구성을 나타낸 측단면도이다.2 is a side cross-sectional view showing a partial configuration of an autoclave apparatus according to an embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 오토클레이브 장치의 공정 하우징을 나타낸 평단면도이다.3 is a plan cross-sectional view illustrating a process housing of an autoclave apparatus according to an embodiment of the present invention.
도 4는 본 발명의 일실시예에 따른 오토클레이브 장치의 공정 하우징을 나타낸 정단면도이다.4 is a front cross-sectional view showing the process housing of the autoclave apparatus according to an embodiment of the present invention.
도 5는 본 발명의 일실시예에 따른 오토클레이브 장치의 투입구 도어를 나타낸 사시도이다.Figure 5 is a perspective view showing the inlet door of the autoclave device according to an embodiment of the present invention.
도 6은 본 발명의 일실시예에 따른 오토클레이브 장치의 투입구 도어를 나타낸 측단면도이다.Figure 6 is a side cross-sectional view showing the inlet door of the autoclave device according to an embodiment of the present invention.
도 7은 도 5 및 도 6에 나타낸 투입구 도어의 작용을 설명하기 위한 것이다.7 is for explaining the operation of the inlet door shown in FIGS. 5 and 6 .
도 8은 본 발명의 일실시예에 따른 오토클레이브 장치의 제1 중간 도어를 나타낸 사시도이다.8 is a perspective view showing a first intermediate door of the autoclave apparatus according to an embodiment of the present invention.
도 9는 본 발명의 일실시예에 따른 오토클레이브 장치의 제1 중간 도어를 나타낸 측단면도이다.9 is a side cross-sectional view showing a first intermediate door of the autoclave apparatus according to an embodiment of the present invention.
도 10은 도 8 및 도 9에 나타낸 제1 중간 도어의 작용을 설명하기 위한 것이다.FIG. 10 is for explaining the operation of the first intermediate door shown in FIGS. 8 and 9 .
도 11은 본 발명의 일실시예에 따른 오토클레이브 장치에 구비되는 트레이 반송장치의 작용을 설명하기 위한 것이다.11 is for explaining the operation of the tray conveying device provided in the autoclave device according to an embodiment of the present invention.
이하, 첨부한 도면을 참고로 하여 본 발명의 실시예들에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예들에 한정되지 않는다.Hereinafter, with reference to the accompanying drawings, the embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. The present invention may be embodied in several different forms and is not limited to the embodiments described herein.
본 발명을 설명함에 있어서, 도면에 도시된 구성요소의 크기나 형상 등은 설명의 명료성과 편의를 위해 과장되거나 단순화되어 나타날 수 있다. In describing the present invention, the size or shape of the components shown in the drawings may be exaggerated or simplified for clarity and convenience of explanation.
또한, 본 발명의 구성 및 작용을 고려하여 특별히 정의된 용어들은 사용자, 운용자의 의도 또는 관례에 따라 달라질 수 있다. 이러한 용어들은 본 명세서 전반에 걸친 내용을 토대로 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야 한다.In addition, terms specifically defined in consideration of the configuration and operation of the present invention may vary depending on the intention or custom of the user or operator. These terms should be interpreted as meanings and concepts consistent with the technical spirit of the present invention based on the contents throughout this specification.
본 발명을 명확하게 설명하기 위하여 본 발명의 기술적 사상과 관계없는 부분의 설명은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조 부호를 붙이도록 한다In order to clearly explain the present invention, the description of parts not related to the technical idea of the present invention is omitted, and the same reference numerals are given to the same or similar elements throughout the specification.
또한, 여러 실시예들에 있어서, 동일한 구성을 가지는 구성요소에 대해서는 동일한 부호를 사용하여 대표적인 실시예에서만 설명하고, 그 외의 다른 실시예에서는 대표적인 실시예와 다른 구성에 대해서만 설명하기로 한다.In addition, in various embodiments, components having the same configuration will be described using the same reference numerals only in the representative embodiment, and only configurations different from the representative embodiment will be described in other embodiments.
명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐만 아니라, 다른 부재를 사이에 두고 "간접적으로 연결"된 것도 포함한다. 또한, 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함하는 것을 의미할 수 있다.Throughout the specification, when a part is "connected" to another part, it includes not only the case where it is "directly connected" but also the case where it is "indirectly connected" with another member interposed therebetween. In addition, when a part "includes" a certain component, this may mean further including other components rather than excluding other components unless otherwise stated.
도 1은 본 발명의 일실시예에 따른 오토클레이브 장치를 개략적으로 나타낸 것이고, 도 2는 본 발명의 일실시예에 따른 오토클레이브 장치의 일부 구성을 나타낸 측단면도이다.1 schematically shows an autoclave apparatus according to an embodiment of the present invention, and FIG. 2 is a side cross-sectional view showing a partial configuration of the autoclave apparatus according to an embodiment of the present invention.
도면에 나타낸 것과 같이, 본 발명의 일실시예에 따른 오토클레이브 장치(100)는 패널 조립체(20)가 실린 트레이(10)를 수용할 수 있는 공간이 내부에 마련된 하우징(200)과, 하우징(200)의 내부로 패널 조립체(20)를 가열 및 가압하기 위한 기체를 공급하기 위한 예열 기체 공급장치(245)와 열처리 기체 공급장치(247) 및 후가열 기체 공급장치(249)와, 패널 조립체(20)가 실린 트레이(10)를 하우징(200)의 내부로 투입시키기 위한 트레이 투입장치(300)와, 하우징(200)을 통과하는 트레이(10)를 배출시키기 위한 트레이 배출장치(400)와, 트레이(10)를 트레이 투입장치(300) 측으로 반송시키기 위한 트레이 반송장치(500)와, 오토클레이브 장치(100)의 전반적인 동작을 제어하는 제어장치(600)를 포함한다.As shown in the drawing, the autoclave device 100 according to an embodiment of the present invention includes a housing 200 having a space for accommodating the tray 10 on which the panel assembly 20 is mounted, and the housing ( A preheating gas supply device 245, a heat treatment gas supply device 247, and a post-heating gas supply device 249 for supplying gas for heating and pressurizing the panel assembly 20 to the inside of the panel assembly 200; 20) a tray input device 300 for putting the loaded tray 10 into the inside of the housing 200, and a tray discharge device 400 for discharging the tray 10 passing through the housing 200; It includes a tray transport device 500 for transporting the tray 10 to the tray input device 300 side, and a control device 600 for controlling the overall operation of the autoclave device 100 .
하우징(200)의 일단에는 패널 조립체(20)가 실린 트레이(10)가 투입되는 투입구(204)가 마련되고, 하우징(200)의 타단에는 패널 조립체(20)가 실린 트레이(10)가 배출되는 배출구(235)가 구비된다. 투입구(204)와 배출구(235)의 사이에는 예열 챔버(203)와, 공정 챔버(218)와, 버퍼 챔버(233)가 차례로 배치된다. 패널 조립체(20)가 실린 트레이(10)는 투입구(204)를 통해 예열 챔버(203)로 투입된 후 공정 챔버(218)와 버퍼 챔버(233)를 차례로 통과하고, 배출구(235)를 통해 하우징(200)에서 배출된다. 트레이(10)에 실린 패널 조립체(20)는 예열 챔버(203)에서 열과 압력을 받아 예열되고, 공정 챔버(218)에서 가열 및 가압 처리된다. 그리고 공정 챔버(218)에서 가열 및 가압 처리된 패널 조립체(20)는 버퍼 챔버(233)에서 열과 압력을 받은 후 하우징(200)에서 배출된다.An inlet 204 is provided at one end of the housing 200, into which the tray 10 on which the panel assembly 20 is loaded, and the other end of the housing 200, the tray 10 on which the panel assembly 20 is loaded is discharged. An outlet 235 is provided. A preheating chamber 203 , a process chamber 218 , and a buffer chamber 233 are sequentially disposed between the inlet 204 and the outlet 235 . The tray 10 loaded with the panel assembly 20 is put into the preheating chamber 203 through the inlet 204, and then passes through the process chamber 218 and the buffer chamber 233 in turn, and through the outlet 235, the housing ( 200) is released. The panel assembly 20 loaded on the tray 10 is preheated by receiving heat and pressure in the preheating chamber 203 , and is heated and pressurized in the process chamber 218 . In addition, the panel assembly 20 heated and pressurized in the process chamber 218 is discharged from the housing 200 after receiving heat and pressure in the buffer chamber 233 .
본 발명의 일실시예에 따른 오토클레이브 장치(100)는 일련의 열처리 공정을 통해 패널 조립체(P)를 구성하는 패널 소자 사이의 기포를 제거하고, 패널 소자 간의 부착력을 향상시킴으로써 고품질의 패널 조립체(20)를 제공할 수 있다. 오토클레이브 장치(100)의 처리 대상이 되는 패널 조립체(P)로는 디스플레이용 패널이나, 광학 패널 등 복수의 패널 소자가 라미네이팅된 다양한 종류의 것일 수 있다.The autoclave apparatus 100 according to an embodiment of the present invention removes air bubbles between the panel elements constituting the panel assembly P through a series of heat treatment processes, and improves the adhesion between the panel elements, thereby improving the quality of the panel assembly ( 20) can be provided. The panel assembly P to be processed by the autoclave apparatus 100 may be of various types in which a plurality of panel elements such as a display panel or an optical panel are laminated.
하우징(200)은 내부에 예열 챔버(203)가 마련된 예열 하우징(202)과, 내부에 공정 챔버(218)가 마련된 공정 하우징(217)과, 내부에 버퍼 챔버(233)가 마련된 버퍼 하우징(232)을 포함한다. 예열 하우징(202)과 공정 하우징(217) 및 버퍼 하우징(232)은 일렬로 배치됨으로써, 패널 조립체(20)가 실린 트레이(10)가 예열 하우징(202)과 공정 하우징(217) 및 버퍼 하우징(232)을 차례로 통과할 수 있다. 예열 하우징(202)의 전방에는 투입구 도어(257)가 배치되고, 예열 하우징(202)과 공정 하우징(217)의 사이에는 제1 중간 도어(270)가 배치된다. 그리고 공정 하우징(217)과 버퍼 하우징(232)의 사이에는 제2 중간 도어(285)가 배치되고, 버퍼 하우징(232)의 후방에는 배출구 도어(290)가 배치된다.The housing 200 includes a preheating housing 202 having a preheating chamber 203 disposed therein, a process housing 217 having a process chamber 218 disposed therein, and a buffer housing 232 having a buffer chamber 233 disposed therein. ) is included. The preheating housing 202, the process housing 217, and the buffer housing 232 are arranged in a line such that the tray 10 containing the panel assembly 20 is provided with the preheating housing 202, the process housing 217 and the buffer housing ( 232) can be passed sequentially. An inlet door 257 is disposed in front of the preheating housing 202 , and a first intermediate door 270 is disposed between the preheating housing 202 and the process housing 217 . A second intermediate door 285 is disposed between the process housing 217 and the buffer housing 232 , and an outlet door 290 is disposed behind the buffer housing 232 .
예열 하우징(202)의 일단에는 투입구(204)가 예열 챔버(203)와 연결되도록 구비된다. 투입구(204)는 투입구 도어(257)에 의해 개폐될 수 있다. 예열 하우징(202)의 타단에는 예열 챔버(203)와 연결되어 공정 하우징(217)을 향해 개방되는 예열 하우징 출구(205)가 마련된다. 예열 하우징 출구(205)는 제1 중간 도어(270)에 의해 개폐될 수 있다. 예열 하우징(202)의 일측에는 기체를 예열 챔버(203)로 유입시키기 위한 적어도 하나의 예열 하우징 흡기구(206)가 구비된다. 예열 하우징 흡기구(206)에는 예열 기체 공급장치(245)와 연결되는 기체 공급관(246)이 연결된다. 예열 기체 공급장치(245)에서 공급되는 기체가 예열 하우징 흡기구(206)를 통해 예열 챔버(203)의 내부로 유입될 수 있다.An inlet 204 is provided at one end of the preheating housing 202 to be connected to the preheating chamber 203 . The inlet 204 may be opened and closed by the inlet door 257 . A preheating housing outlet 205 connected to the preheating chamber 203 and opened toward the process housing 217 is provided at the other end of the preheating housing 202 . The preheating housing outlet 205 may be opened and closed by the first intermediate door 270 . At least one preheating housing intake port 206 for introducing gas into the preheating chamber 203 is provided at one side of the preheating housing 202 . A gas supply pipe 246 connected to the preheating gas supply device 245 is connected to the preheating housing intake port 206 . The gas supplied from the preheating gas supply device 245 may be introduced into the preheating chamber 203 through the preheating housing intake 206 .
예열 기체 공급장치(245)는 예열 챔버(203)로 투입되는 패널 조립체(20)를 예열할 수 있도록 가열된 기체를 예열 챔버(203)에 공급한다. 예열 챔버(203)가 밀폐된 상태에서 예열 기체 공급장치(245)가 가열된 기체를 예열 챔버(203)에 공급함으로써 예열 챔버(203)가 사전 설정된 예열 온도와 예열 압력의 분위기로 유지될 수 있다. 따라서, 패널 조립체(20)가 예열 챔버(203)로 투입되어 사전 설정된 온도와 압력의 분위기 속에서 예열 공정을 거칠 수 있다.The preheating gas supply device 245 supplies the heated gas to the preheating chamber 203 to preheat the panel assembly 20 fed into the preheating chamber 203 . In a state in which the preheating chamber 203 is sealed, the preheating gas supply device 245 supplies the heated gas to the preheating chamber 203 , so that the preheating chamber 203 can be maintained in an atmosphere of a preset preheating temperature and preheating pressure. . Accordingly, the panel assembly 20 may be introduced into the preheating chamber 203 to undergo a preheating process in an atmosphere of a preset temperature and pressure.
상온에 있던 패널 조립체(20)를 바로 공정 챔버(218)로 유입시켜 고온 고압을 가하면 패널 조립체(20)가 열충격을 받을 수 있다. 따라서, 패널 조립체(20)를 예열 챔버(203)를 통과시켜 예열한 후 공정 챔버(218)로 유입시키면 열충격 문제를 방지할 수 있다. 예열 챔버(203) 내의 온도와 압력은 공정 챔버(218) 내의 온도와 압력보다 낮게 설정될 수 있다.When the panel assembly 20 at room temperature is directly introduced into the process chamber 218 to apply high temperature and high pressure, the panel assembly 20 may receive a thermal shock. Accordingly, when the panel assembly 20 is preheated through the preheating chamber 203 and then introduced into the process chamber 218 , a thermal shock problem can be prevented. The temperature and pressure in the preheat chamber 203 may be set to be lower than the temperature and pressure in the process chamber 218 .
예열 하우징(202)의 내측에는 트레이(10)를 선형 이동하도록 가이드하는 예열 챔버 가이드레일(208)이 설치된다. 예열 챔버 가이드레일(208)은 복수의 롤러(209)와, 복수의 롤러(209)를 지지하는 가이드레일 바디(210)를 포함한다. 복수의 롤러(209)는 트레이(10)의 이송 방향을 따라 이격 배치된다. 또한, 롤러(209)는 가이드레일 바디(210)에 복열로 배치될 수 있다. 예열 챔버 가이드레일(208)은 한 쌍이 트레이(10)의 이송 방향과 수직 방향으로 이격되어 상호 평행하게 배치될 수 있다.A preheating chamber guide rail 208 is installed inside the preheating housing 202 to guide the tray 10 to linearly move. The preheating chamber guide rail 208 includes a plurality of rollers 209 and a guide rail body 210 supporting the plurality of rollers 209 . The plurality of rollers 209 are spaced apart along the transport direction of the tray 10 . In addition, the rollers 209 may be arranged in a double row on the guide rail body 210 . A pair of preheating chamber guide rails 208 may be spaced apart from each other in a direction perpendicular to the transport direction of the tray 10 and disposed parallel to each other.
트레이(10)의 하부에는 롤러(209)가 삽입될 수 있는 복수의 트레이 홈(11)이 마련된다. 복수의 트레이 홈(11)은 예열 챔버(203)에 배치되는 복수의 롤러(209) 열에 대응하도록 배치된다. 트레이(10)는 복수의 트레이 홈(11)에 롤러(209)가 삽입되도록 예열 챔버 가이드레일(208) 위에 놓임으로써, 롤러(209)에 의해 선형 이동하도록 가이드될 수 있다.A plurality of tray grooves 11 into which the rollers 209 can be inserted are provided in the lower portion of the tray 10 . The plurality of tray grooves 11 are disposed to correspond to the rows of the plurality of rollers 209 disposed in the preheating chamber 203 . The tray 10 is placed on the preheat chamber guide rail 208 so that the rollers 209 are inserted into the plurality of tray grooves 11 , so that the tray 10 can be guided to move linearly by the rollers 209 .
예열 챔버 가이드레일(208)의 설치 개수나, 예열 챔버 가이드레일(208)에 구비되는 롤러(209)의 배치 구조는 다양하게 변경될 수 있다. 그리고 예열 챔버 가이드레일(208)은 도시된 것과 같이 복수의 롤러(209)를 포함하는 구조 이외에, 예열 하우징(202) 속에 설치되어 트레이(10)를 선형 이동하도록 가이드할 수 있는 다양한 다른 구조로 변경될 수 있다.The number of preheating chamber guide rails 208 installed and the arrangement of rollers 209 provided in the preheating chamber guide rail 208 may be variously changed. In addition to the structure including a plurality of rollers 209 as shown, the preheating chamber guide rail 208 is installed in the preheating housing 202 to guide the tray 10 to move linearly. can be
예열 챔버(203) 속에서 트레이(10)는 예열 챔버 트레이 이송장치(212)에 의해 이송될 수 있다. 예열 챔버 트레이 이송장치(212)는 트레이(10)를 밀거나 당길 수 있는 이송 패드(213)와, 이송 패드(213)를 선형 이동시키는 패드 이송장치(214)와, 이송 패드(213)를 승강시키기 위해 패드 이송장치(214)와 연결되는 패드 승강장치(215)를 포함한다. 이송 패드(213)는 한 쌍의 예열 챔버 가이드레일(208) 사이의 공간에서 승강 및 선형 이동할 수 있다.In the preheating chamber 203 , the tray 10 may be transferred by a preheating chamber tray transfer device 212 . The preheating chamber tray transfer device 212 includes a transfer pad 213 capable of pushing or pulling the tray 10 , a pad transfer device 214 that linearly moves the transfer pad 213 , and lifting and lowering of the transfer pad 213 . It includes a pad lifting device 215 connected to the pad transfer device 214 in order to do so. The transfer pad 213 can move up and down and linearly in the space between the pair of preheating chamber guide rails 208 .
이러한 예열 챔버 트레이 이송장치(212)는 이송 패드(213)가 트레이(10)의 일단에 접한 상태에서 트레이(10)가 패드 이송장치(214)에 의해 공정 챔버(218) 측으로 이동함으로써 트레이(10)를 예열 챔버(203)에서 공정 챔버(218) 측으로 이동시킬 수 있다. 예열 챔버(203)로 트레이(10)가 투입될 때 이송 패드(213)는 패드 승강장치(215)에 의해 예열 챔버 가이드레일(208)으로부터 멀어지도록 상승하여 예열 챔버(203)로 투입되는 트레이(10)와 간섭되지 않는다. 그리고 트레이(10)를 이송시켜야 하는 경우, 이송 패드(213)는 패드 승강장치(215)에 의해 예열 챔버 가이드레일(208)에 가까워지는 방향으로 하강하여 트레이(10)에 접할 수 있다.In this preheat chamber tray transfer device 212 , the tray 10 moves toward the process chamber 218 by the pad transfer device 214 while the transfer pad 213 is in contact with one end of the tray 10 . ) may be moved from the preheating chamber 203 to the process chamber 218 side. When the tray 10 is put into the preheating chamber 203, the transfer pad 213 rises away from the preheating chamber guide rail 208 by the pad elevating device 215 and is fed into the preheating chamber 203 ( 10) does not interfere with In addition, when the tray 10 needs to be transported, the transport pad 213 may come into contact with the tray 10 by descending in a direction closer to the preheating chamber guide rail 208 by the pad lifting device 215 .
예열 챔버 트레이 이송장치(212)는 도시된 구조 이외에, 예열 챔버(203) 속에서 트레이(10)를 공정 챔버(218) 측으로 이동시킬 수 있는 다양한 다른 구조로 변경될 수 있다.In addition to the structure shown, the preheating chamber tray transfer device 212 may be changed to various other structures capable of moving the tray 10 to the process chamber 218 side in the preheating chamber 203 .
도 2 내지 도 4를 참조하면, 공정 하우징(217)의 일단에는 공정 챔버(218)와 연결되는 공정 하우징 입구(219)가 구비되고, 공정 하우징(217)의 타단에는 공정 챔버(218)와 연결되는 공정 하우징 출구(220)가 마련된다. 공정 하우징 입구(219)는 예열 하우징(202)의 예열 하우징 출구(205)와 마주하고, 공정 하우징 출구(220)는 버퍼 하우징(232)을 향해 개방된다. 공정 하우징 입구(219)는 제1 중간 도어(270)에 의해 개폐될 수 있다. 예열 하우징(202)과 공정 하우징(217)의 사이에는 제1 중간 도어(270)가 설치되는 공간이 마련되고, 이 공간은 제1 커버(242)에 의해 덮일 수 있다. 공정 하우징 출구(220)는 제2 중간 도어(285)에 의해 개폐될 수 있다. 공정 하우징(217)과 버퍼 하우징(232)의 사이에는 제2 중간 도어(285)가 설치되는 공간이 마련되고, 이 공간은 제2 커버(243)에 의해 덮일 수 있다. 공정 챔버(218)는 복수의 트레이(10)를 수용할 수 있는 크기로 이루어질 수 있다.2 to 4 , one end of the process housing 217 is provided with a process housing inlet 219 connected to the process chamber 218 , and the other end of the process housing 217 is connected to the process chamber 218 . A process housing outlet 220 is provided. The process housing inlet 219 faces the preheat housing outlet 205 of the preheat housing 202 , and the process housing outlet 220 opens towards the buffer housing 232 . The process housing inlet 219 may be opened and closed by the first intermediate door 270 . A space in which the first intermediate door 270 is installed is provided between the preheating housing 202 and the process housing 217 , and this space may be covered by the first cover 242 . The process housing outlet 220 may be opened and closed by the second intermediate door 285 . A space in which the second intermediate door 285 is installed is provided between the process housing 217 and the buffer housing 232 , and this space may be covered by the second cover 243 . The process chamber 218 may be sized to accommodate the plurality of trays 10 .
공정 하우징(217)에는 기체를 공정 챔버(218)로 유입시키기 위한 복수의 기체 흡입구(221)와, 기체를 공정 챔버(218)로부터 배출시키기 위한 복수의 기체 배기구(222)가 구비된다. 기체 배기구(222)는 기체 흡입구(221)와 짝을 이루도록 기체 흡입구(221)에 인접하여 배치된다. 각각의 기체 흡입구(221)는 흡기 밸브(223)에 의해 개폐되고, 각각의 기체 배기구(222)는 배기 밸브(224)에 의해 개폐될 수 있다. 또한, 각각의 흡기 밸브(223)에는 열처리 기체 공급장치(247)와 연결되는 기체 공급관(248)이 연결된다.The process housing 217 is provided with a plurality of gas intake ports 221 for introducing gas into the process chamber 218 and a plurality of gas exhaust ports 222 for exhausting gas from the process chamber 218 . The gas exhaust port 222 is disposed adjacent to the gas intake port 221 to mate with the gas intake port 221 . Each gas intake port 221 may be opened and closed by an intake valve 223 , and each gas exhaust port 222 may be opened and closed by an exhaust valve 224 . In addition, a gas supply pipe 248 connected to the heat treatment gas supply device 247 is connected to each intake valve 223 .
열처리 기체 공급장치(247)에서 공급되는 기체가 복수의 기체 흡입구(221)를 통해 공정 챔버(218)의 내부로 유입될 수 있다. 열처리 기체 공급장치(247)는 공정 챔버(218)로 투입되는 패널 조립체(20)를 열처리할 수 있도록 가열된 기체를 공정 챔버(218)에 공급한다. 공정 챔버(218)가 밀폐된 상태에서 열처리 기체 공급장치(247)가 가열된 기체를 공정 챔버(218)에 공급함으로써 공정 챔버(218)가 사전 설정된 열처리 온도 및 열처리 압력의 분위기로 유지될 수 있다. 따라서, 공정 챔버(218)로 투입되는 패널 조립체(20)는 열처리되어 패널 조립체(P)를 구성하는 패널 소자 사이의 기포가 제거되고, 패널 소자 간의 부착력이 증대될 수 있다.The gas supplied from the heat treatment gas supply device 247 may be introduced into the process chamber 218 through the plurality of gas inlets 221 . The heat treatment gas supply device 247 supplies the heated gas to the process chamber 218 to heat-treat the panel assembly 20 introduced into the process chamber 218 . In a state in which the process chamber 218 is sealed, the heat treatment gas supply device 247 supplies the heated gas to the process chamber 218 , so that the process chamber 218 may be maintained in an atmosphere of a preset heat treatment temperature and heat treatment pressure. . Accordingly, the panel assembly 20 introduced into the process chamber 218 is heat-treated to remove air bubbles between the panel elements constituting the panel assembly P, and adhesion between the panel elements may be increased.
복수의 기체 흡입구(221)는 공정 챔버(218)에서 트레이(10)의 이송 방향을 따라 이격 배치된다. 공정 챔버(218)에서 복수의 트레이(10)에 각각 실린 복수의 패널 조립체(20)를 동시에 가열 및 가압 처리하기 위해서 공정 챔버(218) 전체의 온도 및 압력이 균일하게 유지될 필요가 있다. 복수의 기체 흡입구(221)를 통해 공정 챔버(218)의 여러 위치에서 고온 고압의 기체를 동시에 공급함으로써 공정 챔버(218) 전체의 온도 및 압력을 균일하게 할 수 있다.The plurality of gas intake ports 221 are spaced apart from each other in the process chamber 218 in the transport direction of the tray 10 . In order to simultaneously heat and pressurize the plurality of panel assemblies 20 loaded on the plurality of trays 10 in the process chamber 218 , the temperature and pressure of the entire process chamber 218 need to be uniformly maintained. By simultaneously supplying high-temperature and high-pressure gas to various positions of the process chamber 218 through the plurality of gas inlets 221 , the temperature and pressure of the entire process chamber 218 may be uniform.
또한, 공정 챔버(218) 중에서 상대적으로 온도가 낮거나 상대적으로 압력이 낮은 부분에서 기체 배기구(222)를 통해 기체를 배기시키면서 기체 흡입구(221)를 통해 새로운 고온 고압의 기체를 공급하면, 그 부분에서의 온도 또는 압력을 신속하게 상승시킴으로써 공정 챔버(218) 전체의 온도 및 압력을 균일하게 만들 수 있다.In addition, when a new high-temperature and high-pressure gas is supplied through the gas inlet 221 while exhausting the gas through the gas exhaust port 222 in a portion of the process chamber 218 having a relatively low temperature or a relatively low pressure, the portion By rapidly increasing the temperature or pressure in , the temperature and pressure of the entire process chamber 218 may be made uniform.
기체 흡입구(221)를 개폐하기 위한 흡기 밸브(223)와 기체 배기구(222)를 개폐하기 위한 배기 밸브(224)는 공정 하우징(217)에 설치되는 온도계(252) 및 압력계(253)의 검출 신호에 따라 제어될 수 있다. 도 2 및 도 3에 나타낸 것과 같이, 온도계(252)는 복수의 기체 흡입구(221)에 각각 인접하도록 복수 개가 공정 챔버(218) 내에 설치된다. 온도계(252)와 마찬가지로, 압력계(253)도 복수의 기체 흡입구(221)에 각각 인접하도록 복수 개가 공정 챔버(218) 내에 설치된다. 온도계(252)의 검출 신호와, 압력계(253)의 검출 신호는 제어장치(600)에 제공되고, 제어장치(600)가 온도계(252)의 검출 신호 또는 압력계(253)의 검출 신호에 따라 흡기 밸브(223)와 배기 밸브(224)를 제어할 수 있다.The intake valve 223 for opening and closing the gas inlet 221 and the exhaust valve 224 for opening and closing the gas exhaust port 222 are the detection signals of the thermometer 252 and the pressure gauge 253 installed in the process housing 217 . can be controlled according to As shown in FIGS. 2 and 3 , a plurality of thermometers 252 are installed in the process chamber 218 so as to be adjacent to the plurality of gas intake ports 221 , respectively. Like the thermometer 252 , a plurality of pressure gauges 253 are installed in the process chamber 218 so as to be adjacent to the plurality of gas intake ports 221 , respectively. The detection signal of the thermometer 252 and the detection signal of the pressure gauge 253 are provided to the control device 600 , and the control device 600 causes intake air according to the detection signal of the thermometer 252 or the detection signal of the pressure gauge 253 . The valve 223 and the exhaust valve 224 may be controlled.
복수의 온도계(252) 및 복수의 압력계(253)가 공정 챔버(218) 내에 설치됨으로써 공정 챔버(218) 내의 복수의 개소에서 온도 및 압력의 검출이 가능하고, 공정 챔버(218) 내에서 사전 설정된 온도 또는 압력에 미치지 못하는 부분을 확인하는 것이 가능하다. 그리고 사전 설정된 열처리 온도 또는 열처리 압력에 미치지 못하는 부분에 인접한 기체 흡입구(221) 및 기체 배기구(222)를 개방하여 해당 부분에서 기체를 배기시키면서 새로운 고온 고압의 기체를 공급함으로써, 해당 부분에서의 온도 또는 압력을 신속하게 상승시킬 수 있다.A plurality of thermometers 252 and a plurality of pressure gauges 253 are installed in the process chamber 218 , so that temperature and pressure can be detected at a plurality of locations in the process chamber 218 , and preset in the process chamber 218 . It is possible to identify the part that does not reach temperature or pressure. And by supplying new high-temperature and high-pressure gas while evacuating the gas from the part by opening the gas inlet 221 and the gas exhaust port 222 adjacent to the part that does not reach the preset heat treatment temperature or heat treatment pressure, the temperature or The pressure can be raised quickly.
또한, 공정 챔버(218)의 온도 및 압력을 신속하게 상승시키고, 공정 챔버(218) 전체의 온도 및 압력을 균일하게 할 수 있도록 공정 하우징(217)에는 복수의 팬 장치(254) 및 복수의 히터(255)가 설치된다. 복수의 팬 장치(254)는 공정 챔버(218) 내에서 기류를 발생시킴으로써, 공정 챔버(218)로 공급되는 기체가 공정 챔버(218) 전체에 고르게 퍼지게 하고, 히터(255)에서 발생하는 열을 공정 챔버(218) 전체에 고르게 분포시킬 수 있다.In addition, a plurality of fan devices 254 and a plurality of heaters are provided in the process housing 217 to quickly increase the temperature and pressure of the process chamber 218 and to make the temperature and pressure of the entire process chamber 218 uniform. (255) is installed. The plurality of fan devices 254 generate an airflow in the process chamber 218 so that the gas supplied to the process chamber 218 is evenly spread throughout the process chamber 218 and heat generated by the heater 255 is removed. It may be evenly distributed throughout the process chamber 218 .
공정 하우징(217)의 내측에는 트레이(10)를 선형 이동하도록 가이드하는 공정 챔버 가이드레일(226)이 설치된다. 공정 챔버 가이드레일(226)은 예열 챔버 가이드레일(208)과 같이, 복수의 롤러(209)와, 복수의 롤러(209)를 지지하는 가이드레일 바디(210)를 포함한다. 공정 챔버 가이드레일(226)은 한 쌍이 트레이(10)의 이송 방향과 수직 방향으로 이격되어 상호 평행하게 배치될 수 있다. 공정 챔버(218)에서 트레이(10)가 공정 챔버 가이드레일(226)을 따라 선형 이동할 수 있다.A process chamber guide rail 226 for guiding the tray 10 to linearly move is installed inside the process housing 217 . The process chamber guide rail 226 includes a plurality of rollers 209 , like the preheating chamber guide rail 208 , and a guide rail body 210 supporting the plurality of rollers 209 . A pair of process chamber guide rails 226 may be spaced apart from each other in a direction perpendicular to the transport direction of the tray 10 and disposed parallel to each other. In the process chamber 218 , the tray 10 may move linearly along the process chamber guide rail 226 .
공정 챔버 가이드레일(226)은 도시된 것과 같이 복수의 롤러(209)를 포함하는 구조 이외에, 공정 하우징(217) 속에 설치되어 트레이(10)를 선형 이동하도록 가이드할 수 있는 다양한 다른 구조로 변경될 수 있다.The process chamber guide rail 226 is installed in the process housing 217, in addition to the structure including a plurality of rollers 209 as shown, to be changed to various other structures that can guide the tray 10 to move linearly. can
공정 챔버(218) 속에서 트레이(10)는 복수의 공정 챔버 트레이 이송장치(228)(229)(230)에 의해 이송될 수 있다. 이들 공정 챔버 트레이 이송장치(228)(229)(230)는 예열 하우징(202)에 설치되는 예열 챔버 트레이 이송장치(212)와 같이, 이송 패드(213)가 승강 및 선형 이동하여 트레이(10)를 밀거나 당기는 구조로 이루어질 수 있다. 각 공정 챔버 트레이 이송장치(228)(229)(230)의 이송 패드(213)는 한 쌍의 공정 챔버 가이드레일(226) 사이의 공간에서 승강 및 선형 이동할 수 있다.In the process chamber 218 , the tray 10 may be transferred by a plurality of process chamber tray transfer devices 228 , 229 , 230 . These process chamber tray transfer devices 228 , 229 , 230 are similar to the preheat chamber tray transfer device 212 installed in the preheating housing 202 , the transfer pad 213 moves up and down and linearly moves to the tray 10 . It may be configured to push or pull. The transfer pad 213 of each of the process chamber tray transfer devices 228 , 229 , 230 can move up and down and linearly move in the space between the pair of process chamber guide rails 226 .
공정 챔버(218) 속에서 트레이(10)의 이송 거리가 상대적으로 길기 때문에, 복수의 공정 챔버 트레이 이송장치(228)(229)(230)는 공정 챔버 가이드레일(226)의 상측 및 하측에 적절하게 배치되어 예열 챔버(203)를 통과하는 트레이(10)를 공정 챔버(218)를 거쳐 버퍼 챔버(233) 측으로 이송시킬 수 있다. 즉, 하나의 공정 챔버 트레이 이송장치(228)가 예열 챔버(203)를 통과하는 트레이(10)를 공정 챔버(218)의 중간 측으로 이송시키고, 다른 하나의 공정 챔버 트레이 이송장치(229)가 트레이(10)를 공정 챔버(218) 중간의 트레이(10)를 공정 하우징 출구(220)를 향해 일정 거리 이송시키고, 또 다른 공정 챔버 트레이 이송장치(230)가 트레이(10)를 버퍼 챔버(233) 측으로 이송시킬 수 있다.Since the transport distance of the tray 10 in the process chamber 218 is relatively long, a plurality of process chamber tray transport devices 228 , 229 , 230 are suitable for upper and lower portions of the process chamber guide rail 226 . The tray 10, which is disposed to pass through the preheating chamber 203 and passes through the process chamber 218, may be transferred to the buffer chamber 233 side. That is, one process chamber tray transfer device 228 transfers the tray 10 passing through the preheating chamber 203 to the middle side of the process chamber 218 , and the other process chamber tray transfer device 229 transfers the tray 10 . (10) transports the tray 10 in the middle of the process chamber 218 toward the process housing outlet 220 by a certain distance, and another process chamber tray transport device 230 moves the tray 10 to the buffer chamber 233 can be transferred to the side.
각 공정 챔버 트레이 이송장치(228)(229)(230)는 트레이(10)에 대한 이송 동작을 하지 않을 때, 각각의 이송 패드(213)가 이송되는 트레이(10)와 간섭되지 않도록 공정 챔버 가이드레일(226)에서 멀어지는 방향으로 상승 또는 하강할 수 있다.Each of the process chamber tray transfer devices 228 , 229 , 230 guides the process chamber so that each transfer pad 213 does not interfere with the transferred tray 10 when the tray 10 does not transfer. It may rise or fall in a direction away from the rail 226 .
공정 챔버 트레이 이송장치(228)(229)(230)는 도시된 구조 이외에, 공정 챔버(218) 속에서 트레이(10)를 버퍼 챔버(233) 측으로 이동시킬 수 있는 다양한 다른 구조로 변경될 수 있다. 그리고 공정 하우징(217)에 설치되는 공정 챔버 트레이 이송장치(228)(229)(230)의 개수는 다양하게 변경될 수 있다.The process chamber tray transfer devices 228 , 229 , 230 may be changed to various other structures other than the illustrated structure, which can move the tray 10 to the buffer chamber 233 side in the process chamber 218 . . In addition, the number of process chamber tray transfer devices 228 , 229 , 230 installed in the process housing 217 may be variously changed.
버퍼 하우징(232)의 일단에는 버퍼 챔버(233)와 연결되는 버퍼 하우징 입구(234)가 구비되고, 버퍼 하우징(232)의 타단에는 배출구(235)가 마련된다. 버퍼 하우징 입구(234)는 공정 하우징(217)의 공정 하우징 출구(220)와 마주한다. 버퍼 하우징 입구(234)는 제2 중간 도어(285)에 의해 개폐될 수 있고, 배출구(235)는 배출구 도어(290)에 의해 개폐될 수 있다.A buffer housing inlet 234 connected to the buffer chamber 233 is provided at one end of the buffer housing 232 , and an outlet 235 is provided at the other end of the buffer housing 232 . The buffer housing inlet 234 faces the process housing outlet 220 of the process housing 217 . The buffer housing inlet 234 may be opened and closed by the second intermediate door 285 , and the outlet 235 may be opened and closed by the outlet door 290 .
버퍼 하우징(232)에는 기체를 버퍼 챔버(233)로 유입시키기 위한 적어도 하나의 버퍼 하우징 흡기구(236)가 구비된다. 버퍼 하우징 흡기구(236)에는 후가열 기체 공급장치(249)와 연결되는 기체 공급관(250)이 연결된다. 후가열 기체 공급장치(249)에서 공급되는 기체가 버퍼 하우징 흡기구(236)를 통해 버퍼 챔버(233)의 내부로 유입될 수 있다.At least one buffer housing intake 236 for introducing gas into the buffer chamber 233 is provided in the buffer housing 232 . A gas supply pipe 250 connected to the post-heating gas supply device 249 is connected to the buffer housing intake 236 . The gas supplied from the post-heating gas supply device 249 may be introduced into the buffer chamber 233 through the buffer housing intake 236 .
후가열 기체 공급장치(249)는 버퍼 챔버(233)로 투입되는 패널 조립체(20)를 후가열할 수 있도록 가열된 기체를 버퍼 챔버(233)에 공급한다. 버퍼 챔버(233)가 밀폐된 상태에서 후가열 기체 공급장치(249)가 가열된 기체를 버퍼 챔버(233)에 공급함으로써 버퍼 챔버(233)가 사전 설정된 온도와 압력의 분위기로 유지될 수 있다. 따라서, 패널 조립체(20)가 버퍼 챔버(233)로 투입되어 사전 설정된 후가열 온도와 후가열 압력의 분위기 속에서 후가열 공정을 거칠 수 있다.The post-heating gas supply device 249 supplies the heated gas to the buffer chamber 233 to post-heat the panel assembly 20 input to the buffer chamber 233 . In a state in which the buffer chamber 233 is sealed, the post-heating gas supply device 249 supplies the heated gas to the buffer chamber 233 , so that the buffer chamber 233 may be maintained at a preset temperature and pressure. Accordingly, the panel assembly 20 may be introduced into the buffer chamber 233 to undergo a post-heating process in an atmosphere of a preset post-heating temperature and post-heating pressure.
공정 챔버(218)에서 가열 및 가압된 패널 조립체(20)를 바로 하우징(200)에서 배출시키면 패널 조립체(20)의 온도가 급격하게 낮아져 패널 조립체(20)가 열충격을 받을 수 있다. 따라서, 공정 챔버(218)를 통과하는 패널 조립체(20)를 바로 하우징(200)에서 배출시키지 않고 버퍼 챔버(233)에서 후가열한 후 하우징(200)에서 배출시키면 열충격 문제를 방지할 수 있다. 버퍼 챔버(233) 내의 온도와 압력은 공정 챔버(218) 내의 온도와 압력보다 낮게 설정될 수 있다.When the panel assembly 20 heated and pressurized in the process chamber 218 is directly discharged from the housing 200 , the temperature of the panel assembly 20 is rapidly lowered and the panel assembly 20 may receive a thermal shock. Accordingly, if the panel assembly 20 passing through the process chamber 218 is discharged from the housing 200 after being heated in the buffer chamber 233 without being directly discharged from the housing 200 , a thermal shock problem can be prevented. The temperature and pressure in the buffer chamber 233 may be set to be lower than the temperature and pressure in the process chamber 218 .
버퍼 하우징(232)의 내측에는 트레이(10)를 선형 이동하도록 가이드하는 버퍼 챔버 가이드레일(238)이 설치된다. 버퍼 챔버 가이드레일(238)은 예열 챔버 가이드레일(208)과 같이, 복수의 롤러(209)와, 복수의 롤러(209)를 지지하는 가이드레일 바디(210)를 포함한다. 버퍼 챔버 가이드레일(238)은 한 쌍이 트레이(10)의 이송 방향과 수직 방향으로 이격되어 상호 평행하게 배치될 수 있다. 버퍼 챔버(233)에서 트레이(10)가 공정 챔버 가이드레일(226)을 따라 선형 이동할 수 있다.A buffer chamber guide rail 238 is installed inside the buffer housing 232 to guide the tray 10 to linearly move. The buffer chamber guide rail 238 includes a plurality of rollers 209 , like the preheating chamber guide rail 208 , and a guide rail body 210 supporting the plurality of rollers 209 . A pair of buffer chamber guide rails 238 may be spaced apart from each other in a direction perpendicular to the transport direction of the tray 10 and disposed parallel to each other. In the buffer chamber 233 , the tray 10 may linearly move along the process chamber guide rail 226 .
버퍼 챔버 가이드레일(238)은 도시된 것과 같이 복수의 롤러(209)를 포함하는 구조 이외에, 버퍼 하우징(232) 속에 설치되어 트레이(10)를 선형 이동하도록 가이드할 수 있는 다양한 다른 구조로 변경될 수 있다.The buffer chamber guide rail 238 is installed in the buffer housing 232 in addition to the structure including a plurality of rollers 209 as shown in the figure and can be changed to various other structures that can guide the tray 10 to move linearly. can
버퍼 챔버(233) 속에서 트레이(10)는 버퍼 챔버 트레이 이송장치(240)에 의해 이송될 수 있다. 버퍼 챔버 트레이 이송장치(240)는 앞서 설명한 예열 챔버 트레이 이송장치(212)와 같이, 이송 패드(213)가 승강 및 선형 이동하여 트레이(10)를 밀거나 당기는 구조로 이루어질 수 있다. 버퍼 챔버 트레이 이송장치(240)의 이송 패드(213)는 한 쌍의 버퍼 챔버 가이드레일(238) 사이의 공간에서 승강 및 선형 이동할 수 있다.In the buffer chamber 233 , the tray 10 may be transferred by the buffer chamber tray transfer device 240 . The buffer chamber tray transfer device 240 may have a structure in which the transfer pad 213 moves up and down and linearly moves to push or pull the tray 10 like the preheating chamber tray transfer device 212 described above. The transfer pad 213 of the buffer chamber tray transfer device 240 can move up and down and linearly move in the space between the pair of buffer chamber guide rails 238 .
버퍼 챔버(233)로 트레이(10)가 투입될 때 이송 패드(213)는 버퍼 챔버 가이드레일(238)로부터 멀어지도록 상승하여 버퍼 챔버(233)로 투입되는 트레이(10)와 간섭되지 않는다. 그리고 트레이(10)를 이송시켜야 하는 경우, 이송 패드(213)는 버퍼 챔버 가이드레일(238)에 가까워지는 방향으로 하강하여 트레이(10)에 접할 수 있다.When the tray 10 is fed into the buffer chamber 233 , the transfer pad 213 rises away from the buffer chamber guide rail 238 and does not interfere with the tray 10 fed into the buffer chamber 233 . In addition, when the tray 10 needs to be transferred, the transfer pad 213 may descend in a direction closer to the buffer chamber guide rail 238 to contact the tray 10 .
버퍼 챔버 트레이 이송장치(240)는 도시된 구조 이외에, 버퍼 챔버(233) 속에서 트레이(10)를 배출구(235) 측으로 이동시킬 수 있는 다양한 다른 구조로 변경될 수 있다.In addition to the structure shown, the buffer chamber tray transfer device 240 may be changed to various other structures capable of moving the tray 10 toward the outlet 235 in the buffer chamber 233 .
도 1, 도 2, 도 5 내지 도 7을 참조하면, 투입구 도어(257)는 예열 하우징(202)의 일단에 배치되어 투입구(204)를 개폐한다. 투입구 도어(257)는 도어 바디(258)와, 도어 바디(258)의 내측에 배치되는 패킹(264)을 포함한다.1, 2, and 5 to 7 , the inlet door 257 is disposed at one end of the preheating housing 202 to open and close the inlet 204 . The inlet door 257 includes a door body 258 and a packing 264 disposed inside the door body 258 .
패킹(264)은 예열 하우징(202)의 투입구(204) 둘레를 둘러쌀 수 있도록 환형으로 이루어진다. 패킹(264)의 단면 형상은 일단에서 타단 측으로 갈수록 폭이 점진적으로 감소하는 형상으로 이루어진다. 패킹(264)은 고무나 실리콘 등 탄성 변형 가능한 소재로 이루어질 수 있다.The packing 264 is annular to surround the inlet 204 of the preheat housing 202 . The cross-sectional shape of the packing 264 has a shape in which the width gradually decreases from one end to the other end. The packing 264 may be made of an elastically deformable material such as rubber or silicone.
도어 바디(258)의 내측에는 패킹(264)이 수용되는 도어 챔버(259)가 마련된다. 그리고 도어 바디(258)의 일면에는 도어 챔버(259)와 연결되어 예열 하우징(202) 측으로 개방되는 도어 개구(260)가 마련된다. 도어 개구(260)는 환형의 패킹(264)이 삽입될 수 있도록 패킹(264) 형상에 대응하는 환형으로 이루어진다. 도어 개구(260)는 도어 바디(258)의 내측에서 도어 바디(258)의 외측으로 갈수록 폭이 점진적으로 감소하는 형상으로 이루어진다. 패킹(264)은 도어 개구(260)에 삽입되어 도어 개구(260) 속에서 움직일 수 있으며, 그 끝단이 도어 바디(258)의 일면으로부터 예열 하우징(202) 측으로 돌출될 수 있다.A door chamber 259 in which the packing 264 is accommodated is provided inside the door body 258 . A door opening 260 connected to the door chamber 259 and opened toward the preheating housing 202 is provided on one surface of the door body 258 . The door opening 260 has an annular shape corresponding to the shape of the packing 264 so that the annular packing 264 can be inserted. The door opening 260 has a shape in which the width gradually decreases from the inside of the door body 258 to the outside of the door body 258 . The packing 264 may be inserted into the door opening 260 to move in the door opening 260 , and an end thereof may protrude from one surface of the door body 258 toward the preheating housing 202 .
도어 바디(258)의 일측에는 도어 챔버(259)와 연결되는 도어 흡기구(261)가 마련된다. 도어 흡기구(261)에는 공급 튜브(267)가 연결된다. 공급 튜브(267)는 도어 챔버(259)에 기체를 공급하기 위한 도어용 기체 공급기(266)와 연결되어 도어용 기체 공급기(266)에서 공급되는 기체를 도어 흡기구(261)로 유동시킬 수 있다. 도어용 기체 공급기(266)에서 기체가 도어 챔버(259)로 유입되면 도어 챔버(259)의 압력이 증가하여 패킹(264)이 도어 개구(260) 속에서 도어 바디(258)의 외측 방향으로 밀리게 된다. 이때, 패킹(264)의 끝단이 도어 바디(258)의 표면으로부터 돌출될 수 있다. A door intake port 261 connected to the door chamber 259 is provided at one side of the door body 258 . A supply tube 267 is connected to the door intake port 261 . The supply tube 267 may be connected to the door gas supply 266 for supplying gas to the door chamber 259 to flow the gas supplied from the door gas supply 266 to the door intake port 261 . When gas flows into the door chamber 259 from the gas supply 266 for the door, the pressure in the door chamber 259 increases so that the packing 264 is pushed outward of the door body 258 in the door opening 260 . it becomes In this case, the end of the packing 264 may protrude from the surface of the door body 258 .
도어 바디(258)의 다른 일측에는 도어 챔버(259)와 연결되는 도어 배기구(262)가 구비된다. 도어 배기구(262)는 도어 챔버(259)의 기체를 배출하기 위한 것이다. 도어 배기구(262)에는 도어 배기구(262)를 개폐하기 위한 도어 배기 밸브(263)가 연결된다. 도어 흡기구(261)를 통해 도어 챔버(259)로 기체가 공급될 때 도어 배기 밸브(263)는 도어 배기구(262)를 차폐한다. 도어 배기 밸브(263)가 도어 배기구(262)를 개방하면 도어 챔버(259)의 기체가 도어 배기구(262)를 통해 배출될 수 있다.A door exhaust port 262 connected to the door chamber 259 is provided at the other side of the door body 258 . The door exhaust port 262 is for exhausting the gas of the door chamber 259 . A door exhaust valve 263 for opening and closing the door exhaust port 262 is connected to the door exhaust port 262 . When gas is supplied to the door chamber 259 through the door intake port 261 , the door exhaust valve 263 blocks the door exhaust port 262 . When the door exhaust valve 263 opens the door exhaust port 262 , the gas in the door chamber 259 may be discharged through the door exhaust port 262 .
투입구 도어(257)는 투입구 도어 이동장치(268)에 의해 승강할 수 있다. 도 6에 나타낸 것과 같이, 투입구 도어(257)는 투입구 도어 이동장치(268)에 의해 그 상단부가 예열 하우징(202)의 투입구(204)보다 낮게 하강함으로써 예열 하우징(202)의 투입구(204)를 개방할 수 있다. 그리고 투입구 도어(257)는 도 7의 (a)에 나타낸 것과 것과 같이, 투입구 도어 이동장치(268)에 의해 투입구(204)와 마주하는 높이까지 상승할 수 있다.The inlet door 257 may be raised and lowered by the inlet door moving device 268 . As shown in FIG. 6 , the inlet door 257 lowers the upper end of the inlet door moving device 268 lower than the inlet 204 of the preheating housing 202 to close the inlet 204 of the preheating housing 202. can be opened And the inlet door 257 may rise to a height facing the inlet 204 by the inlet door moving device 268, as shown in Fig. 7 (a).
투입구 도어(257)가 투입구(204)를 막을 수 있는 높이까지 상승한 상태에서 도어용 기체 공급기(266)로부터 도어 챔버(259)에 기체가 공급되면, 도어 챔버(259)의 압력이 상승하여 패킹(264)이 도어 바디(258)의 외측 방향으로 밀리게 된다. 이때, 도 7의 (b)에 나타낸 것과 같이, 패킹(264)의 끝단이 도어 바디(258)의 표면으로부터 돌출되어 투입구(204)를 둘러싸면서 예열 하우징(202)의 외면에 밀착된다. 따라서, 투입구(204)가 안정적으로 밀폐될 수 있다.When gas is supplied to the door chamber 259 from the door gas supply 266 in a state where the inlet door 257 rises to a height that can block the inlet 204, the pressure in the door chamber 259 rises and the packing ( 264 is pushed outward of the door body 258 . At this time, as shown in FIG. 7B , the end of the packing 264 protrudes from the surface of the door body 258 and surrounds the inlet 204 and is in close contact with the outer surface of the preheating housing 202 . Accordingly, the inlet 204 can be stably sealed.
한편, 도어 챔버(259)로 기체 공급이 중단되고 도어 배기 밸브(263)가 도어 배기구(262)를 개방하게 되면 도어 챔버(259)의 기체가 도어 배기구(262)를 통해 배출되어 도어 챔버(259)의 압력이 떨어지게 된다. 이때, 예열 하우징(202)의 외면에 밀착되었던 패킹(264)의 밀착력이 해제되며, 이 상태에서 투입구 도어(257)는 투입구 도어 이동장치(268)에 의해 투입구(204)를 개방하는 위치까지 원활하게 하강할 수 있다.On the other hand, when the gas supply to the door chamber 259 is stopped and the door exhaust valve 263 opens the door exhaust port 262 , the gas in the door chamber 259 is discharged through the door exhaust port 262 to the door chamber 259 . ) will drop the pressure. At this time, the adhesion of the packing 264 that was in close contact with the outer surface of the preheating housing 202 is released, and in this state, the inlet door 257 is smoothly moved to the position where the inlet 204 is opened by the inlet door moving device 268 . can go down
도 2, 도 8 내지 도 10을 참조하면, 제1 중간 도어(270)는 예열 하우징(202)과 공정 하우징(217)의 사이에 배치되어 예열 하우징(202)의 예열 하우징 출구(205) 및 공정 하우징(217)의 공정 하우징 입구(219)를 동시에 개폐할 수 있다. 제1 중간 도어(270)는 도어 바디(271)와, 도어 바디(271)의 내측에 배치되는 제1 패킹(278) 및 제2 패킹(279)을 포함한다.2 and 8 to 10 , the first intermediate door 270 is disposed between the preheating housing 202 and the process housing 217 to provide a preheating housing outlet 205 of the preheating housing 202 and a process The process housing inlet 219 of the housing 217 may be simultaneously opened and closed. The first intermediate door 270 includes a door body 271 and a first packing 278 and a second packing 279 disposed inside the door body 271 .
제1 패킹(278)은 예열 하우징(202)의 예열 하우징 출구(205) 둘레를 둘러쌀 수 있도록 환형으로 이루어진다. 제1 패킹(278)의 단면 형상은 일단에서 타단 측으로 갈수록 폭이 점진적으로 감소하는 형상으로 이루어진다. 제1 패킹(278)은 고무나 실리콘 등 탄성 변형 가능한 소재로 이루어질 수 있다. 제2 패킹(279)은 공정 하우징(217)의 공정 하우징 입구(219) 둘레를 둘러쌀 수 있도록 환형으로 이루어진다. 제2 패킹(279)의 단면 형상은 일단에서 타단 측으로 갈수록 폭이 점진적으로 감소하는 형상으로 이루어진다. 제1 패킹(278)과 마찬가지로 제2 패킹(279)은 고무나 실리콘 등 탄성 변형 가능한 소재로 이루어질 수 있다.The first packing 278 is annular to wrap around the preheat housing outlet 205 of the preheat housing 202 . The cross-sectional shape of the first packing 278 has a shape in which the width gradually decreases from one end to the other end. The first packing 278 may be made of an elastically deformable material such as rubber or silicone. The second packing 279 is annular to surround the process housing inlet 219 of the process housing 217 . The cross-sectional shape of the second packing 279 is formed in a shape in which the width gradually decreases from one end to the other end. Like the first packing 278 , the second packing 279 may be made of an elastically deformable material such as rubber or silicone.
도어 바디(271)의 내측에는 제1 패킹(278) 및 제2 패킹(279)이 수용되는 도어 챔버(272)가 마련된다. 도어 바디(271)의 일면에는 도어 챔버(272)와 연결되어 예열 하우징(202) 측으로 개방되는 제1 도어 개구(273)가 마련되고, 도어 바디(271)의 타면에는 도어 챔버(272)와 연결되어 공정 하우징(217) 측으로 개방되는 제2 도어 개구(274)가 구비된다.A door chamber 272 in which the first packing 278 and the second packing 279 are accommodated is provided inside the door body 271 . A first door opening 273 connected to the door chamber 272 and opened toward the preheating housing 202 is provided on one surface of the door body 271 , and connected to the door chamber 272 on the other surface of the door body 271 . A second door opening 274 that is opened toward the process housing 217 is provided.
제1 도어 개구(273)는 환형의 제1 패킹(278)이 삽입될 수 있도록 제1 패킹(278) 형상에 대응하는 환형으로 이루어진다. 제1 도어 개구(273)는 제1 패킹(278)의 단면 형상에 대응하도록 도어 바디(271)의 내측에서 도어 바디(271)의 외측으로 갈수록 폭이 점진적으로 감소하는 형상으로 이루어진다. 제1 패킹(278)은 제1 도어 개구(273)에 삽입되어 제1 도어 개구(273) 속에서 움직일 수 있으며, 그 끝단이 도어 바디(271)의 일면으로부터 예열 하우징(202) 측으로 돌출될 수 있다.The first door opening 273 has an annular shape corresponding to the shape of the first packing 278 so that the annular first packing 278 can be inserted. The first door opening 273 has a shape in which the width gradually decreases from the inside of the door body 271 to the outside of the door body 271 to correspond to the cross-sectional shape of the first packing 278 . The first packing 278 may be inserted into the first door opening 273 to move in the first door opening 273 , and its end may protrude from one surface of the door body 271 toward the preheating housing 202 . have.
제2 도어 개구(274)는 환형의 제2 패킹(279)이 삽입될 수 있도록 제2 패킹(279) 형상에 대응하는 환형으로 이루어진다. 제2 도어 개구(274)는 제2 패킹(279)의 단면 형상에 대응하도록 도어 바디(271)의 내측에서 도어 바디(271)의 외측으로 갈수록 폭이 점진적으로 감소하는 형상으로 이루어진다. 제2 패킹(279)은 제2 도어 개구(274)에 삽입되어 제2 도어 개구(274) 속에서 움직일 수 있으며, 그 끝단이 도어 바디(271)의 타면으로부터 공정 하우징(217) 측으로 돌출될 수 있다.The second door opening 274 has an annular shape corresponding to the shape of the second packing 279 so that the annular second packing 279 can be inserted. The second door opening 274 has a shape in which the width gradually decreases from the inside of the door body 271 to the outside of the door body 271 to correspond to the cross-sectional shape of the second packing 279 . The second packing 279 may be inserted into the second door opening 274 and move in the second door opening 274 , and its end may protrude from the other surface of the door body 271 toward the process housing 217 . have.
도어 바디(271)의 일측에는 도어 챔버(272)와 연결되는 도어 흡기구(275)가 마련된다. 도어 흡기구(275)에는 공급 튜브(282)가 연결된다. 공급 튜브(282)는 도어 챔버(272)에 기체를 공급하기 위한 도어용 기체 공급기(281)와 연결되어 도어용 기체 공급기(281)에서 공급되는 기체를 도어 흡기구(275)로 유동시킬 수 있다. 도어용 기체 공급기(281)에서 기체가 도어 챔버(272)로 유입되면 도어 챔버(272)의 압력이 증가하여 제1 패킹(278)이 제1 도어 개구(273) 속에서 도어 바디(271)의 외측 방향으로 밀리고, 제2 패킹(279)이 제2 도어 개구(274) 속에서 도어 바디(271)의 외측 방향으로 밀리게 된다. 이때, 제1 패킹(278)의 끝단이 도어 바디(271)의 일면으로부터 돌출되고, 제2 패킹(279)의 끝단이 도어 바디(271)의 타면으로부터 돌출될 수 있다.A door intake port 275 connected to the door chamber 272 is provided at one side of the door body 271 . A supply tube 282 is connected to the door intake 275 . The supply tube 282 may be connected to the door gas supplier 281 for supplying gas to the door chamber 272 to flow the gas supplied from the door gas supplier 281 to the door intake port 275 . When gas flows into the door chamber 272 from the door gas supply 281 , the pressure of the door chamber 272 increases so that the first packing 278 is inserted into the door body 271 in the first door opening 273 . It is pushed outward, and the second packing 279 is pushed outward of the door body 271 in the second door opening 274 . In this case, an end of the first packing 278 may protrude from one surface of the door body 271 , and an end of the second packing 279 may protrude from the other surface of the door body 271 .
도어 바디(271)의 다른 일측에는 도어 챔버(272)와 연결되는 도어 배기구(276)가 구비된다. 도어 배기구(276)는 도어 챔버(272)의 기체를 배출하기 위한 것이다. 도어 배기구(276)에는 도어 배기구(276)를 개폐하기 위한 도어 배기 밸브(277)가 연결된다. 도어 흡기구(275)를 통해 도어 챔버(272)로 기체가 공급될 때 도어 배기 밸브(277)는 도어 배기구(276)를 차폐한다. 도어 배기 밸브(277)가 도어 배기구(276)를 개방하면 도어 챔버(272)의 기체가 도어 배기구(276)를 통해 배출될 수 있다.A door exhaust port 276 connected to the door chamber 272 is provided at the other side of the door body 271 . The door exhaust port 276 is for exhausting the gas of the door chamber 272 . A door exhaust valve 277 for opening and closing the door exhaust port 276 is connected to the door exhaust port 276 . When gas is supplied to the door chamber 272 through the door intake port 275 , the door exhaust valve 277 blocks the door exhaust port 276 . When the door exhaust valve 277 opens the door exhaust port 276 , the gas in the door chamber 272 may be discharged through the door exhaust port 276 .
제1 중간 도어(270)는 제1 중간 도어 이동장치(283)에 의해 승강할 수 있다. 도 9에 나타낸 것과 같이, 제1 중간 도어(270)는 제1 중간 도어 이동장치(283)에 의해 그 상단부가 예열 하우징(202)의 예열 하우징 출구(205) 및 공정 하우징(217)의 공정 하우징 입구(219)보다 낮게 하강함으로써 예열 하우징 출구(205) 및 공정 하우징 입구(219)를 개방할 수 있다. 그리고 제1 중간 도어(270)는 도 10의 (a)에 나타낸 것과 것과 같이, 제1 중간 도어 이동장치(283)에 의해 예열 하우징 출구(205) 및 공정 하우징 입구(219)와 마주하는 높이까지 상승할 수 있다.The first intermediate door 270 may be raised and lowered by the first intermediate door moving device 283 . As shown in FIG. 9 , the first intermediate door 270 has the upper ends of the preheating housing outlet 205 of the preheating housing 202 and the process housing of the process housing 217 by the first intermediate door moving device 283 . Lowering below inlet 219 may open preheat housing outlet 205 and process housing inlet 219 . And, the first intermediate door 270 is moved to a height facing the preheating housing outlet 205 and the process housing inlet 219 by the first intermediate door moving device 283, as shown in FIG. can rise
제1 중간 도어(270)가 예열 하우징 출구(205) 및 공정 하우징 입구(219)를 막을 수 있는 높이까지 상승한 상태에서 도어용 기체 공급기(281)로부터 도어 챔버(272)에 기체가 공급되면 도어 챔버(272)의 압력이 상승하여 제1 패킹(278) 및 제2 패킹(279)이 도어 바디(271)의 외측 방향으로 밀리게 된다. 이때, 도 10의 (b)에 나타낸 것과 같이, 제1 패킹(278)의 끝단이 도어 바디(271)의 일면으로부터 돌출되어 예열 하우징 출구(205)를 둘러싸면서 예열 하우징(202)의 외면에 밀착됨으로써, 예열 하우징 출구(205)가 안정적으로 밀폐될 수 있다. 그리고 제2 패킹(279)의 끝단이 도어 바디(271)의 타면으로부터 돌출되어 공정 하우징 입구(219)를 둘러싸면서 공정 하우징(217)의 외면에 밀착됨으로써, 공정 하우징 입구(219)가 안정적으로 밀폐될 수 있다.When gas is supplied to the door chamber 272 from the door gas supply 281 while the first intermediate door 270 is raised to a height that can block the preheating housing outlet 205 and the process housing inlet 219, the door chamber As the pressure of the 272 increases, the first packing 278 and the second packing 279 are pushed outwardly of the door body 271 . At this time, as shown in FIG. 10B , the end of the first packing 278 protrudes from one surface of the door body 271 and surrounds the preheating housing outlet 205 and is in close contact with the outer surface of the preheating housing 202 . As a result, the preheating housing outlet 205 can be reliably sealed. And the end of the second packing 279 protrudes from the other surface of the door body 271 and surrounds the process housing inlet 219 and is in close contact with the outer surface of the process housing 217, thereby stably sealing the process housing inlet 219 can be
한편, 도어 챔버(272)로 기체 공급이 중단되고 도어 배기 밸브(277)가 도어 배기구(276)를 개방하게 되면 도어 챔버(272)의 기체가 도어 배기구(276)를 통해 배출되어 도어 챔버(272)의 압력이 떨어지게 된다. 이때, 예열 하우징(202)의 외면에 밀착되었던 제1 패킹(278)의 밀착력이 해제되고 공정 하우징(217)이 외면에 밀착되었던 제2 패킹(279)의 밀착력이 해제된다. 이 상태에서 제1 중간 도어(270)는 제1 중간 도어 이동장치(283)에 의해 예열 하우징 출구(205) 및 공정 하우징 입구(219)를 개방하는 위치까지 원활하게 하강할 수 있다.On the other hand, when the gas supply to the door chamber 272 is stopped and the door exhaust valve 277 opens the door exhaust port 276 , the gas in the door chamber 272 is discharged through the door exhaust port 276 to the door chamber 272 . ) will drop the pressure. At this time, the adhesive force of the first packing 278 that was in close contact with the outer surface of the preheating housing 202 is released and the adhesion of the second packing 279 that the process housing 217 is in close contact with the outer surface is released. In this state, the first intermediate door 270 may be smoothly lowered to a position where the preheating housing outlet 205 and the process housing inlet 219 are opened by the first intermediate door moving device 283 .
제2 중간 도어(285)는 공정 하우징(217)과 버퍼 하우징(232)의 사이에 배치되어 공정 하우징(217)의 공정 하우징 출구(220) 및 버퍼 하우징(232)의 버퍼 하우징 입구(234)를 동시에 개폐할 수 있다. 제2 중간 도어(285)는 도 8에 나타낸 것과 같은 제1 중간 도어(270)와 같은 구조로 이루어진다.The second intermediate door 285 is disposed between the process housing 217 and the buffer housing 232 to open the process housing outlet 220 of the process housing 217 and the buffer housing inlet 234 of the buffer housing 232 . Can be opened and closed at the same time. The second intermediate door 285 has the same structure as the first intermediate door 270 shown in FIG. 8 .
즉, 제2 중간 도어(285)는 도어 챔버(272)와, 제1 도어 개구(273)와, 제2 도어 개구(274)와, 도어 흡기구(275)와, 도어 배기구(276)가 마련된 도어 바디(271)와, 제1 도어 개구(273) 및 제2 도어 개구(274)에 각각 삽입되도록 도어 챔버(272)에 배치되는 제1 패킹(278) 및 제2 패킹(279)과, 도어 배기구(276)를 개폐하기 위한 도어 배기 밸브(277)를 포함한다. 제1 도어 개구(273)는 공정 하우징(217)을 향해 개방되고, 제2 도어 개구(274)는 버퍼 하우징(232)을 향해 개방된다. 도어 흡기구(275)에는 기체를 공급하는 도어용 기체 공급기(286)에 연결되는 공급 튜브(287)가 연결된다.That is, the second intermediate door 285 is a door provided with a door chamber 272 , a first door opening 273 , a second door opening 274 , a door intake port 275 , and a door exhaust port 276 . The body 271, the first packing 278 and the second packing 279 disposed in the door chamber 272 to be inserted into the first door opening 273 and the second door opening 274, respectively, and the door exhaust port and a door exhaust valve 277 for opening and closing 276 . The first door opening 273 opens toward the process housing 217 , and the second door opening 274 opens toward the buffer housing 232 . A supply tube 287 connected to a door gas supply 286 for supplying gas is connected to the door intake port 275 .
제2 중간 도어(285)는 제2 중간 도어 이동장치(288)에 의해 공정 하우징 출구(220) 및 버퍼 하우징 입구(234)를 개방하는 위치 또는 공정 하우징 출구(220) 및 버퍼 하우징 입구(234)를 차단하는 위치로 움직일 수 있다.The second intermediate door 285 is at a position where the process housing outlet 220 and the buffer housing inlet 234 are opened by the second intermediate door mover 288 or the process housing outlet 220 and the buffer housing inlet 234 can be moved to a position to block
제2 중간 도어(285)가 공정 하우징 출구(220) 및 버퍼 하우징 입구(234)와 마주하는 위치까지 상승한 상태에서 도어용 기체 공급기(286)에서 공급되는 기체가 도어 챔버(272)로 유입되면, 제1 패킹(278)이 공정 하우징(217) 측으로 돌출되고 제2 패킹(279)이 버퍼 하우징(232) 측으로 돌출된다. 이때, 제1 패킹(278)은 공정 하우징 출구(220)를 둘러싸면서 공정 하우징(217)에 밀착되어 공정 하우징 출구(220)를 밀폐하고, 제2 패킹(279)은 버퍼 하우징 입구(234)를 둘러싸면서 버퍼 하우징(232)에 밀착되어 버퍼 하우징 입구(234)를 밀폐할 수 있다.When the gas supplied from the gas supply 286 for the door flows into the door chamber 272 while the second intermediate door 285 is raised to a position facing the process housing outlet 220 and the buffer housing inlet 234, The first packing 278 protrudes toward the process housing 217 and the second packing 279 protrudes toward the buffer housing 232 . At this time, the first packing 278 surrounds the process housing outlet 220 and is in close contact with the process housing 217 to seal the process housing outlet 220 , and the second packing 279 closes the buffer housing inlet 234 . While being surrounded, it may be closely attached to the buffer housing 232 to seal the buffer housing inlet 234 .
배출구 도어(290)는 버퍼 하우징(232)의 일단에 배치되어 배출구(235)를 개폐한다. 배출구 도어(290)는 도 5에 나타낸 투입구 도어(257)와 같은 구조로 이루어진다. 즉, 배출구 도어(290)는 도어 챔버(259)와, 도어 개구(260)와, 도어 흡기구(261)와, 도어 배기구(262)가 형성된 도어 바디(258)와, 도어 개구(260)에 삽입되도록 도어 챔버(259)에 배치되는 패킹(264)과, 도어 배기구(262)를 개폐하기 위한 도어 배기 밸브(263)를 포함한다. 도어 개구(260)는 버퍼 하우징(232)을 향해 개방된다. 도어 배기구(262)에는 기체를 공급하는 도어용 기체 공급기(291)에 연결되는 공급 튜브(292)가 연결된다.The outlet door 290 is disposed at one end of the buffer housing 232 to open and close the outlet 235 . The outlet door 290 has the same structure as the inlet door 257 shown in FIG. 5 . That is, the outlet door 290 is inserted into the door chamber 259 , the door opening 260 , the door intake port 261 , the door body 258 in which the door exhaust port 262 is formed, and the door opening 260 . It includes a packing 264 disposed in the door chamber 259 as much as possible, and a door exhaust valve 263 for opening and closing the door exhaust port 262 . The door opening 260 opens towards the buffer housing 232 . A supply tube 292 connected to a door gas supply 291 for supplying gas is connected to the door exhaust port 262 .
배출구 도어(290)는 배출구 도어 이동장치(293)에 의해 배출구(235)를 개방하는 위치 또는 배출구(235)를 차단하는 위치로 움직일 수 있다.The outlet door 290 may be moved to a position in which the outlet 235 is opened or the outlet 235 is blocked by the outlet door moving device 293 .
배출구 도어(290)가 배출구(235)와 마주하는 위치까지 상승한 상태에서 도어용 기체 공급기(291)에서 공급되는 기체가 도어 챔버(259)로 유입되면, 패킹(264)이 버퍼 하우징(232) 측으로 돌출된다. 이때, 패킹(264)은 배출구(235)를 둘러싸면서 버퍼 하우징(232)에 밀착되어 배출구(235)를 밀폐할 수 있다.When the gas supplied from the door gas supply 291 flows into the door chamber 259 while the outlet door 290 rises to a position facing the outlet 235 , the packing 264 moves toward the buffer housing 232 . protrude In this case, the packing 264 may be in close contact with the buffer housing 232 while surrounding the outlet 235 to seal the outlet 235 .
도 1을 참조하면, 트레이 투입장치(300)는 패널 조립체(20)가 실린 트레이(10)를 하우징(200)의 투입구(204)를 통해 예열 챔버(203) 측으로 이송할 수 있다. 트레이 투입장치(300)는 트레이(10)가 로딩되는 로딩 받침대(310)가 설치된 위치에 설치될 수 있다. 트레이 투입장치(300)는 도시된 것과 같이 이송 패드(213)가 선형 이동하여 트레이(10)를 미는 구조, 또는 그 밖에 트레이(10)를 예열 챔버(203) 측으로 이송할 수 있는 다양한 구조를 취할 수 있다.Referring to FIG. 1 , the tray input device 300 may transfer the tray 10 on which the panel assembly 20 is loaded to the preheating chamber 203 through the inlet 204 of the housing 200 . The tray input device 300 may be installed at a location where the loading pedestal 310 on which the tray 10 is loaded is installed. The tray input device 300 has a structure in which the transfer pad 213 linearly moves to push the tray 10 as shown, or other various structures capable of transferring the tray 10 to the preheating chamber 203 side. can
트레이(10)는 패널 조립체(20)가 실린 상태로 로딩 받침대(310)에 로딩되거나, 패널 조립체(20)가 실리지 않은 상태로 로딩 받침대(310)에 로딩될 수 있다. 후자의 경우, 로딩 받침대(310)에 빈 트레이(10)가 로딩된 상태에서 복수의 패널 조립체(20)가 트레이(10)에 실릴 수 있다.The tray 10 may be loaded onto the loading pedestal 310 with the panel assembly 20 mounted thereon, or may be loaded onto the loading pedestal 310 with the panel assembly 20 not mounted thereon. In the latter case, the plurality of panel assemblies 20 may be loaded on the tray 10 while the empty tray 10 is loaded on the loading pedestal 310 .
하우징(200)과 로딩 받침대(310)의 사이에는 트레이(10)를 이송하기 위한 투입 가이드레일(320)이 설치될 수 있다. 투입 가이드레일(320)은 도시된 것과 같이 복수의 롤러(209)를 포함하는 구조, 또는 그 밖에 트레이(10)를 가이드할 수 있는 다양한 다른 구조로 이루어질 수 있다.An input guide rail 320 for transporting the tray 10 may be installed between the housing 200 and the loading pedestal 310 . The input guide rail 320 may have a structure including a plurality of rollers 209 as shown, or various other structures capable of guiding the tray 10 .
트레이 배출장치(400)는 하우징(200)의 배출구(235) 측에 설치되어 예열 챔버(203)를 거친 트레이(10)를 하우징(200) 외부의 소정의 위치로 이송시킨다. 트레이 배출장치(400)는 트레이(10)를 언로딩 받침대(410)로 이송할 수 있다. 언로딩 받침대(410)에서 패널 조립체(20)가 분리된 후 트레이(10)가 트레이 반송장치(500)에 의해 반송될 수 있다. 트레이 배출장치(400)는 트레이(10)를 이송할 수 있는 다양한 구조를 취할 수 있다.The tray discharge device 400 is installed on the side of the discharge port 235 of the housing 200 to transfer the tray 10 that has passed through the preheating chamber 203 to a predetermined position outside the housing 200 . The tray discharge device 400 may transfer the tray 10 to the unloading pedestal 410 . After the panel assembly 20 is separated from the unloading pedestal 410 , the tray 10 may be transported by the tray transport device 500 . The tray discharge device 400 may take various structures capable of transporting the tray 10 .
하우징(200)과 언로딩 받침대(410)의 사이에는 트레이(10)를 이송하기 위한 배출 가이드레일(420)이 설치될 수 있다. 배출 가이드레일(420)은 도시된 것과 같이 복수의 롤러(209)를 포함하는 구조, 또는 그 밖에 트레이(10)를 가이드할 수 있는 다양한 다른 구조로 이루어질 수 있다.A discharge guide rail 420 for transporting the tray 10 may be installed between the housing 200 and the unloading pedestal 410 . The discharge guide rail 420 may have a structure including a plurality of rollers 209 as shown, or various other structures capable of guiding the tray 10 .
도 1 및 도 11을 참조하면, 트레이 반송장치(500)는 열처리된 패널 조립체(20)가 분리된 트레이(10)를 하우징(200)으로 재투입시킬 수 있는 위치로 반송할 수 있다. 트레이 반송장치(500)는 제1 트레이 운반장치(510)와, 반송 컨베이어(520)와, 제2 트레이 운반장치(530)를 포함한다.1 and 11 , the tray transport device 500 may transport the tray 10 from which the heat-treated panel assembly 20 is separated to a position where it can be re-inserted into the housing 200 . The tray transport device 500 includes a first tray transport device 510 , a transport conveyor 520 , and a second tray transport device 530 .
제1 트레이 운반장치(510)는 언로딩 받침대(410)에 위치한 트레이(10)를 반송 컨베이어(520)로 운반한다. 제1 트레이 운반장치(510)는 트레이(10)가 놓일 수 있는 트레이 운반대(511)와, 언로딩 받침대(410)에 놓인 트레이(10)를 트레이 운반대(511)로 이송시키는 반송용 트레이 이송장치(513)와, 트레이 운반대(511)에 놓이는 트레이(10)를 반송 컨베이어(520)로 이송하는 또 다른 반송용 트레이 이송장치(514)를 포함한다. 트레이 운반대(511)는 승강장치(512)에 의해 승강할 수 있다. 승강장치(512)는 트레이 운반대(511)를 언로딩 받침대(410)의 높이까지 상승시키거나, 반송 컨베이어(520)의 높이까지 하강시킬 수 있다.The first tray transport device 510 transports the tray 10 located on the unloading pedestal 410 to the transport conveyor 520 . The first tray transport device 510 is a transport tray for transporting the tray carrier 511 on which the tray 10 can be placed, and the tray 10 placed on the unloading pedestal 410 to the tray carrier 511 . It includes a conveying device 513 and another conveying tray conveying device 514 for conveying the tray 10 placed on the tray carrier 511 to the conveying conveyor 520 . The tray carrier 511 may be raised and lowered by the elevating device 512 . The lifting device 512 may raise the tray carrier 511 to the height of the unloading pedestal 410 or lower it to the height of the conveyer 520 .
트레이 운반대(511)가 언로딩 받침대(410)의 높이까지 상승한 상태에서 하나의 반송용 트레이 이송장치(513)가 작동하여 언로딩 받침대(410)에 놓이는 트레이(10)를 트레이 운반대(511)로 운반할 수 있다. 그리고 트레이 운반대(511)가 반송 컨베이어(520)의 높이로 하강한 상태에서 또 다른 반송용 트레이 이송장치(514)가 작동하여 트레이 운반대(511)에 놓이는 트레이(10)를 반송 컨베이어(520)로 운반할 수 있다.In a state in which the tray carrier 511 is raised to the height of the unloading pedestal 410, one conveying tray transfer device 513 operates to move the tray 10 placed on the unloading pedestal 410 to the tray carrier 511 ) can be transported. And in a state in which the tray carrier 511 is lowered to the height of the conveyer 520, another conveying tray conveying device 514 operates to move the tray 10 placed on the tray conveyer 511 to the conveying conveyor 520 ) can be transported.
제1 트레이 운반장치(510)에 구비되는 반송용 트레이 이송장치(513)(514)는 도시된 것과 같이 이송 패드(213)가 선형 이동하여 트레이(10)를 밀거나 당기는 구조, 또는 그 밖에 트레이(10)를 이송할 수 있는 다양한 구조를 취할 수 있다. 또한, 제1 트레이 운반장치(510)는 도시된 것과 같이, 트레이 운반대(511)와 한 쌍의 반송용 트레이 이송장치(513)(514)를 포함하는 구조 이외에, 언로딩 받침대(410)에 놓이는 트레이(10)를 반송 컨베이어(520)로 운반할 수 있는 다양한 다른 구조로 이루어질 수 있다.The transport tray transport device 513, 514 provided in the first tray transport device 510 has a structure in which the transport pad 213 linearly moves to push or pull the tray 10 as shown, or other trays (10) can take a variety of structures that can be transported. In addition, the first tray transport device 510 is, as shown, in addition to the structure including the tray transporter 511 and a pair of transport tray transporters 513 and 514, the unloading pedestal 410. It may be of various other structures capable of transporting the placed tray 10 to the conveying conveyor 520 .
반송 컨베이어(520)는 제1 트레이 운반장치(510)와 제2 트레이 운반장치(530) 사이에 배치되어 제1 트레이 운반장치(510)가 운반하는 트레이(10)를 제2 트레이 운반장치(530)로 이송한다. 반송 컨베이어(520)는 도시된 것과 같은 벨트 컨베이어, 또는 그 밖의 다양한 구조의 컨베이어가 이용될 수 있다.The transport conveyor 520 is disposed between the first tray transport device 510 and the second tray transport device 530 to transport the tray 10 transported by the first tray transport device 510 to the second tray transport device 530 . ) is transferred to The conveying conveyor 520 may be a belt conveyor as shown, or a conveyor having various other structures.
제2 트레이 운반장치(530)는 반송 컨베이어(520)에 의해 이송되는 트레이(10)를 로딩 받침대(310)로 운반한다. 제2 트레이 운반장치(530)는 트레이(10)가 놓일 수 있는 트레이 운반대(531)와, 반송 컨베이어(520)에 실려 이송되는 트레이(10)를 트레이 운반대(531)로 이송시키는 반송용 트레이 이송장치(533)와, 트레이 운반대(531)에 놓이는 트레이(10)를 로딩 받침대(310)로 이송하는 또 다른 반송용 트레이 이송장치(534)를 포함한다. 트레이 운반대(531)는 승강장치(532)에 의해 승강할 수 있다. 승강장치(532)는 트레이 운반대(531)를 로딩 받침대(310)의 높이까지 상승시키거나, 반송 컨베이어(520)의 높이까지 하강시킬 수 있다.The second tray transport device 530 transports the tray 10 transported by the transport conveyor 520 to the loading pedestal 310 . The second tray transport device 530 is for transporting the tray carrier 531 on which the tray 10 can be placed, and the tray 10 transported on the transport conveyor 520 to the tray carrier 531 . It includes a tray transport device 533 and another transport tray transport device 534 for transporting the tray 10 placed on the tray carrier 531 to the loading pedestal 310 . The tray carrier 531 may be elevated by the elevating device 532 . The lifting device 532 may raise the tray carrier 531 to the height of the loading pedestal 310 or lower it to the height of the conveyer 520 .
트레이 운반대(531)가 반송 컨베이어(520)의 높이로 하강한 상태에서 반송용 트레이 이송장치(533)가 작동하여 반송 컨베이어(520)에 실린 트레이(10)를 트레이 운반대(531)로 운반할 수 있다. 그리고 트레이 운반대(531)가 로딩 받침대(310)의 높이까지 상승한 상태에서 또 다른 반송용 트레이 이송장치(534)가 작동하여 트레이 운반대(531)에 놓이는 트레이(10)를 로딩 받침대(310)로 운반할 수 있다.In a state in which the tray carrier 531 is lowered to the height of the conveyer 520 , the conveying tray conveying device 533 operates to transport the tray 10 loaded on the conveying conveyor 520 to the tray conveyer 531 . can do. And in a state in which the tray carrier 531 has risen to the height of the loading pedestal 310, another conveying tray transfer device 534 operates to place the tray 10 placed on the tray carrier 531 on the loading pedestal 310. can be transported to
제2 트레이 운반장치(530)에 구비되는 반송용 트레이 이송장치(533)(534)는 도시된 것과 같이 이송 패드(213)가 선형 이동하여 트레이(10)를 밀거나 당기는 구조, 또는 그 밖에 트레이(10)를 이송할 수 있는 다양한 구조를 취할 수 있다. 또한, 제2 트레이 운반장치(530)는 도시된 것과 같이, 트레이 운반대(531)와 한 쌍의 반송용 트레이 이송장치(533)(534)를 포함하는 구조 이외에, 반송 컨베이어(520)에 실려 이송되는 트레이(10)를 로딩 받침대(310)로 운반할 수 있는 다양한 다른 구조로 이루어질 수 있다.The transport tray transport device 533, 534 provided in the second tray transport device 530 has a structure in which the transport pad 213 linearly moves to push or pull the tray 10 as shown, or other trays (10) can take a variety of structures that can be transported. In addition, the second tray transport device 530 is mounted on the transport conveyor 520 in addition to the structure including the tray transporter 531 and a pair of transport tray transporters 533 and 534 as shown. The tray 10 to be transported may be formed in various other structures that can be transported to the loading pedestal 310 .
이와 같이, 트레이 반송장치(500)는 언로딩 받침대(410)에서 패널 조립체(20)가 분리된 트레이(10)를 로딩 받침대(310)로 반송시킬 수 있다. 그리고 트레이 반송장치(500)가 로딩 받침대(310)로 트레이(10)를 반송시키면, 로딩 받침대(310)에 놓인 트레이(10)에 복수의 패널 조립체(20)가 놓인 후, 새로운 패널 조립체(20)가 실린 트레이(10)가 트레이 투입장치(300)에 의해 다시 하우징(200)의 내부로 투입될 수 있다.In this way, the tray transport device 500 may transport the tray 10 from which the panel assembly 20 is separated from the unloading pedestal 410 to the loading pedestal 310 . And when the tray transfer device 500 transfers the tray 10 to the loading pedestal 310 , a plurality of panel assemblies 20 are placed on the tray 10 placed on the loading pedestal 310 , and then a new panel assembly 20 ) loaded tray 10 may be put back into the housing 200 by the tray input device 300 .
트레이 반송장치(500)는 도시된 것과 같이, 제1 트레이 운반장치(510)와, 반송 컨베이어(520)와, 제2 트레이 운반장치(530)를 포함하는 구조 외이에, 하우징(200)의 배출구(235)로 배출되는 트레이(10)를 다시 하우징(200)의 투입구(204) 측으로 반송시킬 수 있는 다양한 다른 구조로 이루어질 수 있다.The tray conveying device 500 is, as shown, a first tray conveying device 510, a conveying conveyor 520, and a second tray conveying device 530. In addition to the structure including the second tray conveying device 530, the outlet of the housing 200 The tray 10 discharged to the 235 may be formed in various other structures that can be transferred back to the inlet 204 side of the housing 200 .
제어장치(600)는 패널 조립체(20)가 실린 트레이(10)가 투입구(204)를 통해 하우징(200)의 내부로 투입되어 예열 챔버(203)와, 공정 챔버(218) 및 버퍼 챔버(233)를 차례로 통과하여 배출구(235)를 통해 하우징(200)에서 배출되도록 하고, 트레이(10)가 트레이 반송장치(500)에 의해 투입구(204) 측으로 반송되도록 오토클레이브 장치(100)의 전반적인 동작을 제어한다.In the control device 600 , the tray 10 on which the panel assembly 20 is loaded is fed into the housing 200 through the inlet 204 , and the preheat chamber 203 , the process chamber 218 , and the buffer chamber 233 . ) to be discharged from the housing 200 through the discharge port 235, and the tray 10 is conveyed to the inlet 204 side by the tray conveying device 500 through the overall operation of the autoclave device 100. control
이하에서는, 본 발명의 일실시예에 따른 오토클레이브 장치(100)의 작용에 대하여 설명한다.Hereinafter, the operation of the autoclave apparatus 100 according to an embodiment of the present invention will be described.
로딩 받침대(310)에 패널 조립체(20)가 실린 트레이(10)가 로딩되고 투입구 도어(257)가 하우징(200)의 투입구(204)를 개방하는 위치로 이동한 후, 제어장치(600)가 트레이 투입장치(300)를 작동시켜 트레이(10)를 투입구(204)를 통해 예열 챔버(203)로 투입시킨다. 트레이(10)가 예열 챔버(203)로 투입된 후, 제어장치(600)는 투입구 도어(257)와 제1 중간 도어(270)를 작동시켜 하우징(200)의 투입구(204)와 예열 하우징 출구(205)를 밀폐한다. 이후, 제어장치(600)는 예열 기체 공급장치(245)를 작동시켜 예열 챔버(203)에 가열된 기체를 공급한다. 예열 챔버(203)에 가열된 기체가 공급됨에 따라 예열 챔버(203)는 사전 설정된 예열 온도와 예열 압력으로 유지되며, 예열 챔버(203)에 놓인 패널 조립체(20)는 사전 설정된 시간 동안 예열 공정을 거치게 된다.After the tray 10 on which the panel assembly 20 is loaded is loaded on the loading pedestal 310 and the inlet door 257 moves to a position where the inlet 204 of the housing 200 is opened, the control device 600 operates By operating the tray input device 300 , the tray 10 is introduced into the preheating chamber 203 through the input hole 204 . After the tray 10 is put into the preheating chamber 203, the control device 600 operates the inlet door 257 and the first intermediate door 270 to operate the inlet 204 of the housing 200 and the preheating housing outlet ( 205) is sealed. Thereafter, the controller 600 operates the preheating gas supply device 245 to supply the heated gas to the preheating chamber 203 . As the heated gas is supplied to the preheating chamber 203, the preheating chamber 203 is maintained at a preset preheating temperature and preheating pressure, and the panel assembly 20 placed in the preheating chamber 203 performs a preheating process for a preset time. will go through
패널 조립체(20)에 대한 예열 공정이 종료된 후, 제어장치(600)는 제1 중간 도어(270)를 작동시켜 예열 하우징 출구(205) 및 공정 하우징 입구(219)를 개방한다. 이후, 제어장치(600)는 예열 챔버 트레이 이송장치(212)를 작동시켜 예열 챔버(203)의 트레이(10)를 공정 챔버(218)로 이송시킨다. 패널 조립체(20)가 실린 트레이(10)가 공정 챔버(218)로 이송된 후, 제어장치(600)는 제1 중간 도어(270) 및 제2 중간 도어(285)를 작동시켜 공정 하우징 입구(219) 및 공정 하우징 출구(220)를 밀폐시킨다.After the preheating process for the panel assembly 20 is finished, the controller 600 operates the first intermediate door 270 to open the preheating housing outlet 205 and the process housing inlet 219 . Thereafter, the controller 600 operates the preheating chamber tray transfer device 212 to transfer the tray 10 of the preheating chamber 203 to the process chamber 218 . After the tray 10 loaded with the panel assembly 20 is transferred to the process chamber 218 , the controller 600 operates the first intermediate door 270 and the second intermediate door 285 to operate the process housing inlet ( 219) and process housing outlet 220.
공정 챔버(218)가 밀폐된 후, 제어장치(600)는 열처리 기체 공급장치(247)를 작동시켜 가열된 기체를 공정 챔버(218)로 공급한다. 이때, 흡기 밸브(223)는 기체 흡입구(221)를 개방하도록 열림 제어되고 배기 밸브(224)는 기체 배기구(222)를 차단하도록 닫힘 제어된다. 공정 챔버(218)에 가열된 기체가 공급될 때, 제어장치(600)는 필요에 따라 공정 챔버(218)에 설치된 팬 장치(254)와 히터(255)를 작동시킨다. 열처리 기체 공급장치(247)와 팬 장치(254) 및 히터(255)의 작용으로 공정 챔버(218)는 사전 설정된 열처리 온도와 열처리 압력으로 유지되며, 공정 챔버(218)에 놓인 패널 조립체(20)는 사전 설정된 시간 동안 열처리된다. 이러한 공정 챔버(218)에서의 열처리 공정을 통해 패널 조립체(P)를 구성하는 패널 소자 사이의 기포가 제거하고, 패널 소자 간의 부착력이 증대될 수 있다. 패널 조립체(20)가 실린 트레이는 공정 챔버(218)에서 복수 개가 공정 하우징 입구(219)에서 공정 하우징 출구(220) 쪽으로 공정 챔버 트레이 이송장치들에 의해 순차적으로 이동하면서 열처리된다.After the process chamber 218 is sealed, the controller 600 operates the heat treatment gas supply device 247 to supply the heated gas to the process chamber 218 . At this time, the intake valve 223 is controlled to open to open the gas intake port 221 , and the exhaust valve 224 is controlled to close to block the gas exhaust port 222 . When the heated gas is supplied to the process chamber 218 , the controller 600 operates the fan device 254 and the heater 255 installed in the process chamber 218 as necessary. The process chamber 218 is maintained at a preset heat treatment temperature and heat treatment pressure by the action of the heat treatment gas supply device 247 , the fan device 254 , and the heater 255 , and the panel assembly 20 placed in the process chamber 218 . is heat treated for a preset time. Through the heat treatment process in the process chamber 218 , air bubbles between the panel elements constituting the panel assembly P are removed, and adhesion between the panel elements can be increased. A plurality of trays on which the panel assembly 20 is loaded are heat-treated while sequentially moving by the process chamber tray transporters from the process housing inlet 219 to the process housing outlet 220 in the process chamber 218 .
한편, 제어장치(600)는 공정 챔버(218)에 설치된 복수의 온도계(252) 및 복수의 압력계(253)로부터 검출 신호를 수신하여 공정 챔버(218) 내의 복수의 개소에서 온도 및 압력을 검출한다. 그리고 공정 챔버(218) 내에서 사전 설정된 온도 또는 압력에 미치지 못하는 부분이 존재하면, 제어장치(600)는 사전 설정된 온도 또는 압력에 미치지 못하는 부분에 인접한 기체 흡입구(221) 및 기체 배기구(222)에 각각 대응하는 흡기 밸브(223) 및 배기 밸브(224)를 열림 제어한다. 이때, 해당 부분에서 기체가 배기되면서 새로운 고온 고압의 기체가 공급되며, 그 부분에서의 온도 또는 압력을 신속하게 상승시킬 수 있다. 따라서, 공정 챔버(218) 전체가 균일한 온도 및 균일한 압력으로 유지될 수 있고, 공정 챔버(218)로 투입된 모든 패널 조립체(20)가 균일한 조건으로 열처리될 수 있다.Meanwhile, the control device 600 receives detection signals from a plurality of thermometers 252 and a plurality of pressure gauges 253 installed in the process chamber 218 to detect temperatures and pressures at a plurality of locations within the process chamber 218 . . And if there is a portion that does not reach the preset temperature or pressure in the process chamber 218 , the control device 600 connects the gas intake port 221 and the gas exhaust port 222 adjacent to the portion that does not reach the preset temperature or pressure. Opening control of the corresponding intake valve 223 and exhaust valve 224, respectively. At this time, as the gas is exhausted from the corresponding part, a new high-temperature and high-pressure gas is supplied, and the temperature or pressure in the part can be rapidly increased. Accordingly, the entire process chamber 218 may be maintained at a uniform temperature and uniform pressure, and all panel assemblies 20 introduced into the process chamber 218 may be heat-treated under uniform conditions.
패널 조립체(20)에 대한 열처리 공정이 종료된 후, 제어장치(600)는 제2 중간 도어(285)를 작동시켜 공정 하우징 출구(220) 및 버퍼 하우징 입구(234)를 개방한다. 이후, 제어장치(600)는 공정 챔버 트레이 이송장치들(228)(229)(230)을 작동시켜 공정 챔버(218)의 트레이(10)를 버퍼 챔버(233)로 이송시킨다.After the heat treatment process for the panel assembly 20 is finished, the controller 600 operates the second intermediate door 285 to open the process housing outlet 220 and the buffer housing inlet 234 . Thereafter, the controller 600 operates the process chamber tray transfer devices 228 , 229 , 230 to transfer the tray 10 of the process chamber 218 to the buffer chamber 233 .
패널 조립체(20)가 실린 트레이(10)가 버퍼 챔버(223)로 이송된 후, 제어장치(600)는 제2 중간 도어(285) 및 배출구 도어(290)를 작동시켜 버퍼 하우징 입구(234) 및 배출구(235)를 밀폐시킨다. 버퍼 챔버(233)가 밀폐된 후, 제어장치(600)는 후가열 기체 공급장치(249)를 작동시켜 가열된 기체를 버퍼 챔버(233)로 공급한다.After the tray 10 loaded with the panel assembly 20 is transferred to the buffer chamber 223 , the controller 600 operates the second intermediate door 285 and the outlet door 290 to operate the buffer housing inlet 234 . And the outlet 235 is sealed. After the buffer chamber 233 is sealed, the controller 600 operates the post-heating gas supply device 249 to supply the heated gas to the buffer chamber 233 .
버퍼 챔버(233)에 가열된 기체가 공급됨에 따라 버퍼 챔버(233)는 사전 설정된 후가열 온도와 후가열 압력으로 유지되며, 버퍼 챔버(233)에 놓인 패널 조립체(20)는 사전 설정된 시간 동안 후가열 공정을 거치게 된다.As the heated gas is supplied to the buffer chamber 233, the buffer chamber 233 is maintained at a preset post-heating temperature and post-heating pressure, and the panel assembly 20 placed in the buffer chamber 233 is heated for a preset time. It goes through a heating process.
패널 조립체(20)에 대한 후가열 공정이 종료된 후, 제어장치(600)는 배출구 도어(290)를 작동시켜 배출구(235)를 개방한다. 이후, 제어장치(600)는 버퍼 챔버 트레이 이송장치(240)를 작동시켜 버퍼 챔버(233)의 트레이(10)를 배출구(235) 측으로 이송시키고, 트레이 배출장치(400)를 작동시켜 트레이(10)를 언로딩 받침대(410)로 이송시킨다.After the post-heating process for the panel assembly 20 is finished, the control device 600 operates the outlet door 290 to open the outlet 235 . Thereafter, the control device 600 operates the buffer chamber tray transfer device 240 to transfer the tray 10 of the buffer chamber 233 to the outlet 235 side, and operates the tray discharge device 400 to move the tray 10 ) is transferred to the unloading pedestal 410 .
트레이(10)가 언로딩 받침대(410)로 이송된 후, 트레이(10)에 놓인 패널 조립체(20)가 트레이(10)에서 분리된다. 패널 조립체(20)가 트레이(10)에서 분리된 후, 제어장치(600)는 트레이 반송장치(500)를 작동시켜 빈 트레이(10)를 로딩 받침대(310) 측으로 반송시킨다. 로딩 받침대(310)로 트레이(10)가 반송된 후, 로딩 받침대(310)에 놓인 트레이(10)에 패널 조립체(20)가 실리면, 제어장치(600)는 트레이 투입장치(300)를 작동시켜 패널 조립체(20)가 실린 트레이(10)를 다시 하우징(200)의 내부로 투입하게 된다.After the tray 10 is transferred to the unloading pedestal 410 , the panel assembly 20 placed on the tray 10 is separated from the tray 10 . After the panel assembly 20 is separated from the tray 10 , the control device 600 operates the tray transport device 500 to transport the empty tray 10 toward the loading pedestal 310 . After the tray 10 is transferred to the loading pedestal 310 , when the panel assembly 20 is loaded on the tray 10 placed on the loading pedestal 310 , the control device 600 operates the tray input device 300 . Thus, the tray 10 on which the panel assembly 20 is loaded is put back into the housing 200 .
이와 같이, 제어장치(600)는 패널 조립체(20)가 실린 트레이(10)가 예열 챔버(203)와, 공정 챔버(218) 및 버퍼 챔버(233)를 차례로 통과하면서 패널 조립체(20)에 대한 예열 공정, 열처리 공정 및 후가열 공정이 연속적으로 이루어지도록 오토클레이브 장치(100)의 전반적인 동작을 제어한다. 또한, 제어장치(600)는 하우징(200)에서 배출되는 트레이(10)가 투입구(204) 측으로 이송되도록 트레이 반송장치(500)를 제어하여 패널 조립체(20)가 연속적으로 하우징(200)의 내부로 투입되도록 한다.In this way, the control device 600 controls the panel assembly 20 while the tray 10 on which the panel assembly 20 is loaded passes sequentially through the preheating chamber 203 , the process chamber 218 , and the buffer chamber 233 . The overall operation of the autoclave apparatus 100 is controlled so that the preheating process, the heat treatment process, and the postheating process are continuously performed. In addition, the control device 600 controls the tray transport device 500 so that the tray 10 discharged from the housing 200 is transferred to the inlet 204 side so that the panel assembly 20 is continuously moved inside the housing 200 . to be put into
상술한 것과 같이, 본 발명의 일실시예에 따른 오토클레이브 장치(100)는 패널 조립체(20)가 실린 트레이(10)를 하우징(200)의 내부의 예열 챔버(203)와, 공정 챔버(218) 및 버퍼 챔버(233)를 따라 차례로 이송하면서 패널 조립체(20)에 대해 예열 공정, 열처리 공정 및 후가열 공정을 차례로 수행할 수 있다. 따라서, 패널 조립체(20)에 대한 기포 제거 및 부착력을 증대 작업을 효과적으로 수행할 수 있다.As described above, in the autoclave apparatus 100 according to an embodiment of the present invention, the preheating chamber 203 and the process chamber 218 inside the housing 200 are provided with the tray 10 on which the panel assembly 20 is loaded. ) and the buffer chamber 233 , a preheating process, a heat treatment process, and a postheating process may be sequentially performed on the panel assembly 20 . Therefore, it is possible to effectively perform the operation of removing air bubbles and increasing the adhesion to the panel assembly 20 .
또한, 본 발명의 일실시예에 따른 오토클레이브 장치(100)는 패널 조립체(20)를 예열 챔버(203)에서 예열한 후 공정 챔버(218)에서 일정한 온도와 압력을 가해 열처리하고, 열처리된 패널 조립체(20)를 버퍼 챔버(233)에서 후가열한 후 배출시키므로, 패널 조립체(20) 처리 과정에서 패널 조립체(20)가 열충격을 받아 손상되는 문제를 방지할 수 있고, 고품질의 패널 조립체(20)를 제공할 수 있다.In addition, in the autoclave apparatus 100 according to an embodiment of the present invention, after preheating the panel assembly 20 in the preheating chamber 203 , heat treatment is performed by applying a constant temperature and pressure in the process chamber 218 , and the heat-treated panel Since the assembly 20 is discharged after being heated in the buffer chamber 233 , it is possible to prevent the panel assembly 20 from being damaged due to thermal shock in the process of processing the panel assembly 20 , and a high-quality panel assembly 20 ) can be provided.
또한, 본 발명의 일실시예에 따른 오토클레이브 장치(100)는 패널 조립체(20)에 대한 예열 공정, 열처리 공정 및 후가열 공정이 연속적으로 수행되므로, 작업이 효율적이고 작업 시간을 단축할 수 있다.In addition, in the autoclave apparatus 100 according to an embodiment of the present invention, since the preheating process, the heat treatment process, and the postheating process for the panel assembly 20 are continuously performed, the operation is efficient and the operation time can be shortened. .
또한, 본 발명의 일실시예에 따른 오토클레이브 장치(100)는 패널 조립체(20)가 열처리되는 공정 챔버(218) 내에서 사전 설정된 온도 또는 압력에 미치지 못하는 부분이 존재하면, 사전 설정된 온도 또는 압력에 미치지 못하는 부분에서 기체를 배기시키면서 새로운 고온 고압의 기체를 공급함으로써, 그 부분에서의 온도 또는 압력을 신속하게 상승시킬 수 있다. 따라서, 공정 챔버(218) 전체를 균일한 온도 및 균일한 압력으로 유지시킬 수 있고, 공정 챔버(218)로 투입된 모든 패널 조립체(20)를 균일한 조건으로 열처리하여 불량률을 줄이고, 다수의 패널 조립체(20)를 일괄 처리하여 작업 시간을 단축할 수 있다.In addition, in the autoclave apparatus 100 according to an embodiment of the present invention, if there is a portion that does not reach the preset temperature or pressure in the process chamber 218 in which the panel assembly 20 is heat-treated, the preset temperature or pressure is present. By supplying new high-temperature and high-pressure gas while evacuating the gas from the portion that does not reach the required level, the temperature or pressure in the portion can be quickly increased. Accordingly, the entire process chamber 218 can be maintained at a uniform temperature and pressure, and all panel assemblies 20 injected into the process chamber 218 are heat-treated under uniform conditions to reduce the defect rate, and a plurality of panel assemblies (20) can be batch-processed to shorten the working time.
또한, 본 발명의 일실시예에 따른 오토클레이브 장치(100)는 버퍼 챔버(233)를 통과한 트레이(10)를 자동으로 투입구(204) 측으로 반송시킴으로써, 작업 인력을 줄이고, 작업성을 높일 수 있다.In addition, the autoclave apparatus 100 according to an embodiment of the present invention automatically transfers the tray 10 that has passed through the buffer chamber 233 to the inlet 204 side, thereby reducing work force and increasing workability. have.
또한, 본 발명의 일실시예에 따른 오토클레이브 장치(100)는 패널 부착장치나 패널 검사장치 등 전후 공정 장치와 연계하여 패널 조립체(20)에 대한 열처리를 연속적으로 신속하게 수행할 수 있으므로, 제품의 생산성을 향상시킬 수 있다.In addition, since the autoclave apparatus 100 according to an embodiment of the present invention can continuously and rapidly perform heat treatment on the panel assembly 20 in connection with a front and rear process apparatus such as a panel attachment apparatus or a panel inspection apparatus, the product can improve productivity.
이상 본 발명에 대해 바람직한 예를 들어 설명하였으나 본 발명의 범위가 앞에서 설명되고 도시되는 형태로 한정되는 것은 아니다.Although preferred examples of the present invention have been described above, the scope of the present invention is not limited to the forms described and illustrated above.
예를 들어, 도면에는 하우징(200)이 예열 하우징(202)과, 공정 하우징(217)과, 버퍼 하우징(232)으로 구분되고, 예열 하우징(202)과 공정 하우징(217) 사이의 공간을 제1 커버(242)가 덮고, 공정 하우징(217)과 버퍼 하우징(232) 사이의 공간을 제2 커버(243)가 덮는 것으로 나타냈으나, 하우징(200)은 투입구(204)와, 예열 챔버(203)와, 공정 챔버(218)와, 버퍼 챔버(233)와, 배출구(235)를 갖는 다양한 다른 구조로 변경될 수 있다.For example, in the drawing, the housing 200 is divided into a preheating housing 202 , a process housing 217 , and a buffer housing 232 , and a space between the preheating housing 202 and the process housing 217 is removed. It is shown that the first cover 242 covers, and the second cover 243 covers the space between the process housing 217 and the buffer housing 232, but the housing 200 includes the inlet 204 and the preheating chamber ( 203 , a process chamber 218 , a buffer chamber 233 , and an outlet 235 may be modified into various other structures.
또한, 도면에는 하나의 열처리 기체 공급장치(247)가 공정 하우징(217)의 내부에 가열된 기체를 공급하는 것으로 나타냈으나, 공정 챔버(218)에 가열된 기체를 공급하는 열처리 기체 공급장치(247)는 복수일 수 있다.In addition, although it is shown in the drawing that one heat treatment gas supply device 247 supplies heated gas to the inside of the process housing 217 , a heat treatment gas supply device that supplies heated gas to the process chamber 218 ( 247) may be plural.
또한, 도면에는 투입구 도어(257)와, 제1 중간 도어(270)와, 제2 중간 도어(285) 및 배출구 도어(290)가 하측에서 상측으로 이동하여 트레이(10)의 이송 통로를 개폐하는 것으로 나타냈으나, 이들 도어의 개폐 구조는 다양하게 변경될 수 있다.In addition, in the drawing, the inlet door 257, the first intermediate door 270, the second intermediate door 285, and the outlet door 290 move from the lower side to the upper side to open and close the transfer passage of the tray 10. However, the opening and closing structure of these doors may be variously changed.
또한, 투입구 도어(257)와, 제1 중간 도어(270)와, 제2 중간 도어(285) 및 배출구 도어(290)는 도어용 기체 공급기로부터 공급되는 기체에 의해 패킹이 도어 바디에서 돌출되는 구조 이외에, 예열 챔버(203)와, 공정 챔버(218)와, 버퍼 챔버(233)를 각각 밀폐할 수 있는 다양한 다른 구조로 변경될 수 있다.In addition, the inlet door 257, the first intermediate door 270, the second intermediate door 285, and the outlet door 290 have a structure in which the packing protrudes from the door body by the gas supplied from the gas supply for the door. In addition, the preheat chamber 203 , the process chamber 218 , and the buffer chamber 233 may be modified into various other structures capable of sealing each other.
또한, 도면에는 트레이 투입장치(300)와 트레이 배출장치(400)가 각각 하나씩인 것으로 나타냈으나 이들은 각각 복수개가 배치될 수 있다. In addition, although the drawing shows that the tray input device 300 and the tray discharge device 400 are each one, a plurality of them may be disposed, respectively.
또한, 도면에는 예열 챔버 트레이 이송장치(212)와 버퍼 챔버 트레이 이송장치(240)가 각각 하나씩인 것으로 나타냈으나 이들 역시 공정 챔버 트러에 이송장치와 같이 복수개가 배치될 수 있다.In addition, although it is shown in the drawings that each of the preheating chamber tray transfer device 212 and the buffer chamber tray transfer device 240 is one, a plurality of these may also be disposed on the process chamber trolley like the transfer device.
지금까지, 본 발명을 본 발명의 원리를 예시하기 위한 바람직한 실시예와 관련하여 도시하고 설명하였으나, 본 발명은 그와 같이 도시되고 설명된 그대로의 구성 및 작용으로 한정되는 것이 아니며, 첨부된 청구범위의 사상 및 범위를 일탈함이 없이 본 발명에 대한 다수의 변경 및 수정이 가능함을 본 발명이 속하는 기술분야의 통상의 기술자들은 잘 이해할 수 있을 것이다.While the present invention has so far been shown and described in connection with preferred embodiments for illustrating the principles of the invention, the invention is not limited to the construction and operation as so shown and described, and is not intended to be limited by the scope of the appended claims. It will be understood by those skilled in the art that many changes and modifications can be made to the present invention without departing from the spirit and scope of the present invention.

Claims (6)

  1. 패널 조립체가 실린 트레이가 투입될 수 있는 투입구와, 패널 조립체가 배출될 수 있는 배출구와, 상기 투입구와 상기 배출구 사이에 배치되는 공정 챔버와, 상기 공정 챔버로 기체를 유입시키기 위한 복수의 기체 흡입구와, 상기 공정 챔버의 기체를 배기시키기 위한 복수의 기체 배기구를 구비하는 하우징;an inlet through which the tray loaded with the panel assembly is put in; an outlet through which the panel assembly can be discharged; a process chamber disposed between the inlet and the outlet; and a plurality of gas inlets for introducing gas into the process chamber; , a housing having a plurality of gas exhaust ports for exhausting the gas of the process chamber;
    상기 투입구를 개폐하기 위한 투입구 도어;an inlet door for opening and closing the inlet;
    상기 배출구를 개폐하기 위한 배출구 도어;an outlet door for opening and closing the outlet;
    상기 복수의 기체 흡입구를 통해 상기 공정 챔버에 가열된 기체를 공급하는 열처리 기체 공급장치;a heat treatment gas supply device for supplying heated gas to the process chamber through the plurality of gas inlets;
    상기 복수의 기체 흡입구와 각각 연결되도록 설치되어 상기 복수의 기체 흡입구를 통한 기체의 유동을 단속하는 복수의 흡기 밸브;a plurality of intake valves installed to be respectively connected to the plurality of gas intakes to control the flow of gas through the plurality of gas intakes;
    상기 복수의 기체 배기구와 각각 연결되도록 설치되어 상기 복수의 기체 배기구를 통한 기체의 유동을 단속하는 복수의 배기 밸브;a plurality of exhaust valves installed to be respectively connected to the plurality of gas exhaust ports to control the flow of gas through the plurality of gas exhaust ports;
    상기 공정 챔버 내의 온도를 검출하기 위해 상기 하우징에 설치되는 복수의 온도계;a plurality of thermometers installed in the housing to detect a temperature in the process chamber;
    상기 공정 챔버 내의 압력를 검출하기 위해 상기 하우징에 설치되는 복수의 압력계; 및a plurality of pressure gauges installed in the housing to detect pressure in the process chamber; and
    상기 복수의 온도계 및 상기 복수의 압력계로부터 검출 신호를 수신하고, 상기 트레이에 실린 패널 조립체가 상기 공정 챔버에서 사전 설정된 열처리 온도 및 열처리 압력으로 열처리되도록 상기 투입구 도어와, 상기 배출구 도어와, 상기 열처리 기체 공급장치와, 상기 복수의 흡기 밸브와, 상기 복수의 배기 밸브를 제어하는 제어장치;를 포함하고,The inlet door, the outlet door, and the heat treatment gas receive detection signals from the plurality of thermometers and the plurality of pressure gauges, and such that the panel assembly loaded on the tray is heat treated at a preset heat treatment temperature and heat treatment pressure in the process chamber. a supply device, a control device for controlling the plurality of intake valves, and the plurality of exhaust valves;
    상기 제어장치는, 상기 복수의 온도계 및 상기 복수의 압력계로부터 수신한 검출 신호에 따라 상기 복수의 흡기 밸브 및 상기 복수의 배기 밸브를 제어하되, 상기 공정 챔버 내에서 상기 열처리 온도 또는 상기 열처리 압력에 미치지 못하는 부분에 인접한 기체 흡입구 및 기체 배기구에 각각 대응하는 흡기 밸브 및 배기 밸브를 열림 제어하여 해당 부분에서 기체를 배기시키면서 상기 열처리 기체 공급장치에서 공급되는 기체를 공급하는 것을 특징으로 하는 오토클레이브 장치.The control device controls the plurality of intake valves and the plurality of exhaust valves according to detection signals received from the plurality of thermometers and the plurality of pressure gauges, but does not reach the heat treatment temperature or the heat treatment pressure in the process chamber An autoclave apparatus, characterized in that the gas supplied from the heat treatment gas supply device is supplied while exhausting the gas from the corresponding part by controlling the opening of the intake valve and the exhaust valve respectively corresponding to the gas inlet and the gas exhaust port adjacent to the non-disabled part.
  2. 제1항에 있어서,According to claim 1,
    상기 공정 챔버 내에서 기류를 발생시킬 수 있도록 상기 하우징에 설치되는 팬 장치;를 포함하는 것을 특징으로 하는 오토클레이브 장치.and a fan device installed in the housing to generate an airflow in the process chamber.
  3. 제1항에 있어서,According to claim 1,
    상기 공정 챔버 내에 열을 제공할 수 있도록 상기 하우징에 설치되는 히터;를 포함하는 특징으로 하는 오토클레이브 장치.and a heater installed in the housing to provide heat to the process chamber.
  4. 제1항에 있어서,According to claim 1,
    상기 기체 흡입구와 상기 기체 배기구는 하나씩 짝을 이루도록 상호 인접하여 설치되는 것을 특징으로 하는 오토클레이브 장치.The autoclave apparatus, characterized in that the gas inlet and the gas exhaust port are installed adjacent to each other to form a pair.
  5. 제1항에 있어서,According to claim 1,
    상기 하우징에는, 상기 투입구와 상기 공정 챔버 사이에 배치되는 예열 챔버와, 상기 공정 챔버와 상기 배출구 사이에 배치되는 버퍼 챔버가 구비되고,The housing includes a preheating chamber disposed between the inlet and the process chamber, and a buffer chamber disposed between the process chamber and the outlet,
    상기 예열 챔버와 상기 공정 챔버 사이의 통로를 개폐하기 위한 제1 중간 도어;a first intermediate door for opening and closing a passage between the preheating chamber and the process chamber;
    상기 공정 챔버와 상기 버퍼 챔버 사이의 통로를 개폐하기 위한 제2 중간 도어;a second intermediate door for opening and closing a passage between the process chamber and the buffer chamber;
    상기 예열 챔버에 가열된 기체를 공급하는 예열 기체 공급장치;a preheating gas supply device for supplying heated gas to the preheating chamber;
    상기 버퍼 챔버에 가열된 기체를 공급하는 후가열 기체 공급장치;a post-heating gas supply device for supplying heated gas to the buffer chamber;
    상기 트레이를 가이드하기 위해 상기 예열 챔버에 설치되는 예열 챔버 가이드레일;a preheating chamber guide rail installed in the preheating chamber to guide the tray;
    상기 트레이를 가이드하기 위해 상기 공정 챔버에 설치되는 공정 챔버 가이드레일;a process chamber guide rail installed in the process chamber to guide the tray;
    상기 트레이를 가이드하기 위해 상기 버퍼 챔버에 설치되는 버퍼 챔버 가이드레일;a buffer chamber guide rail installed in the buffer chamber to guide the tray;
    상기 예열 챔버에서 상기 트레이를 상기 공정 챔버 측으로 이동시키는 예열 챔버 트레이 이송장치;a preheating chamber tray transfer device for moving the tray from the preheating chamber toward the process chamber;
    상기 공정 챔버에서 상기 트레이를 상기 버퍼 챔버 측으로 이동시키는 공정 챔버 트레이 이송장치; 및a process chamber tray transfer device for moving the tray from the process chamber to the buffer chamber; and
    상기 버퍼 챔버에서 상기 트레이를 상기 배출구 측으로 이동시키는 버퍼 챔버 트레이 이송장치;를 포함하고,and a buffer chamber tray transfer device for moving the tray from the buffer chamber toward the outlet.
    상기 제어장치는, 상기 트레이에 실린 패널 조립체가, 상기 예열 챔버에서 사전 설정된 예열 온도 및 예열 압력으로 예열된 후 상기 공정 챔버로 이송되고, 상기 공정 챔버에서 사전 설정된 열처리 온도 및 열처리 압력으로 열처리된 후 상기 버퍼 챔버로 이송되며, 상기 버퍼 챔버에서 사전 설정된 후가열 온도 및 후가열 압력으로 후가열된 후 상기 배출구를 통해 배출되도록 상기 투입구 도어와, 상기 배출구 도어와, 상기 제1 중간 도어와, 상기 제2 중간 도어와, 상기 예열 기체 공급장치와, 상기 열처리 기체 공급장치와, 상기 후가열 기체 공급장치와, 상기 예열 챔버 트레이 이송장치와, 상기 공정 챔버 트레이 이송장치와, 상기 버퍼 챔버 트레이 이송장치를 제어하는 것을 특징으로 하는 오토클레이브 장치.The control device is configured to include, after the panel assembly loaded on the tray is preheated to a preset preheating temperature and preheating pressure in the preheating chamber, transferred to the process chamber, and heat treated at a preset heat treatment temperature and heat treatment pressure in the process chamber The inlet door, the outlet door, the first intermediate door, and the first intermediate door and the first door are transferred to the buffer chamber and discharged through the outlet after being post-heated to a preset post-heating temperature and post-heating pressure in the buffer chamber. 2 a middle door, the preheating gas supply device, the heat treatment gas supply device, the post-heating gas supply device, the preheating chamber tray transport device, the process chamber tray transport device, and the buffer chamber tray transport device. Autoclave device, characterized in that the control.
  6. 제5항에 있어서,6. The method of claim 5,
    상기 하우징은,The housing is
    상기 투입구와, 상기 예열 챔버와, 상기 예열 챔버에서 상기 트레이가 배출될 수 있도록 상기 예열 챔버와 연결되는 예열 하우징 출구를 갖는 예열 하우징과,a preheating housing having the inlet, the preheating chamber, and a preheating housing outlet connected to the preheating chamber so that the tray is discharged from the preheating chamber;
    상기 공정 챔버와, 상기 예열 하우징 출구와 마주하여 상기 공정 챔버와 연결되는 공정 하우징 입구와, 상기 공정 챔버에서 상기 트레이가 배출될 수 있도록 상기 공정 챔버와 연결되는 공정 하우징 출구를 갖는 공정 하우징과,a process housing having the process chamber, a process housing inlet connected to the process chamber facing the preheating housing outlet, and a process housing outlet connected to the process chamber so that the tray is discharged from the process chamber;
    상기 버퍼 챔버와, 상기 공정 하우징 출구와 마주하여 상기 버퍼 챔버와 연결되는 버퍼 하우징 입구와, 상기 배출구를 갖는 버퍼 하우징을 포함하고,a buffer housing having the buffer chamber, a buffer housing inlet connected to the buffer chamber facing the process housing outlet, and the outlet;
    상기 제1 중간 도어는 상기 예열 하우징 출구와 상기 공정 하우징 입구를 동시에 개폐할 수 있도록 상기 예열 하우징과 상기 공정 하우징의 사이에 설치되고,the first intermediate door is installed between the preheating housing and the process housing to open and close the outlet of the preheating housing and the inlet of the process housing at the same time;
    상기 제2 중간 도어는 상기 공정 하우징 출구와 상기 버퍼 하우징 입구를 동시에 개폐할 수 있도록 상기 공정 하우징과 상기 버퍼 하우징의 사이에 설치되는 것을 특징으로 하는 오토클레이브 장치.and the second intermediate door is installed between the process housing and the buffer housing so as to simultaneously open and close the process housing outlet and the buffer housing inlet.
PCT/KR2021/006146 2020-06-09 2021-05-17 Autoclave device WO2021251639A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06154577A (en) * 1992-11-16 1994-06-03 Ashida Seisakusho:Kk Method for controlling gas temperature of autoclave
KR20050094910A (en) * 2004-03-23 2005-09-29 박웅기 Processing method and apparatus by the autoclave
KR20060027944A (en) * 2004-09-24 2006-03-29 오성엘에스티(주) Autoclave apparatus
KR101325808B1 (en) * 2010-11-26 2013-11-05 가부시키가이샤 아시다세이사쿠쇼 Autoclave Molding Method and Autoclave Molding Apparatus
US20180133681A1 (en) * 2016-11-14 2018-05-17 Airbus Operations Gmbh Autoclave and method for welding thermoplastic composite parts

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101119792B1 (en) 2009-12-22 2012-03-22 박웅기 Autoclave Apparatus
KR101139595B1 (en) 2009-12-22 2012-04-27 박웅기 Autoclave Apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06154577A (en) * 1992-11-16 1994-06-03 Ashida Seisakusho:Kk Method for controlling gas temperature of autoclave
KR20050094910A (en) * 2004-03-23 2005-09-29 박웅기 Processing method and apparatus by the autoclave
KR20060027944A (en) * 2004-09-24 2006-03-29 오성엘에스티(주) Autoclave apparatus
KR101325808B1 (en) * 2010-11-26 2013-11-05 가부시키가이샤 아시다세이사쿠쇼 Autoclave Molding Method and Autoclave Molding Apparatus
US20180133681A1 (en) * 2016-11-14 2018-05-17 Airbus Operations Gmbh Autoclave and method for welding thermoplastic composite parts

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