WO2021248901A1 - 一种制冷系统及制冷设备 - Google Patents

一种制冷系统及制冷设备 Download PDF

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Publication number
WO2021248901A1
WO2021248901A1 PCT/CN2020/142112 CN2020142112W WO2021248901A1 WO 2021248901 A1 WO2021248901 A1 WO 2021248901A1 CN 2020142112 W CN2020142112 W CN 2020142112W WO 2021248901 A1 WO2021248901 A1 WO 2021248901A1
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WIPO (PCT)
Prior art keywords
cooling
heat dissipation
refrigeration system
panel
fan body
Prior art date
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PCT/CN2020/142112
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English (en)
French (fr)
Inventor
梁永诒
陈鹏
吴业和
梁立昶
代周兴
李治方
Original Assignee
佛山市顺德区大磐电器实业有限公司
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Publication of WO2021248901A1 publication Critical patent/WO2021248901A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/12—Sound

Definitions

  • the invention belongs to the field of refrigeration equipment, and particularly relates to a refrigeration system and refrigeration equipment.
  • semiconductor refrigeration technology has been widely used in various types of refrigeration equipment, such as refrigerators or refrigeration equipment, and semiconductor refrigeration systems have been widely used for refrigeration.
  • Semiconductor refrigeration mainly uses semiconductor chips to be energized to form a hot end and a cold end.
  • the cold end exchanges heat with the air in the cabinet through the cooling structure to form cold air, thereby achieving the effect of cooling and cooling, and the hot end is performed through the heat dissipation structure Heat dissipation.
  • the heat dissipation structure usually adopts a fan and a heat sink aluminum sheet, and the heat sink aluminum sheet is connected to the hot end, and then the fan drives the airflow to dissipate heat.
  • the embodiment of the present invention provides a refrigeration system and refrigeration equipment.
  • the heat dissipation is performed by silently working heat dissipation ducts and heat dissipation steel wires, instead of fans and heat dissipation aluminum fins, which greatly reduces the operation time of the refrigeration system and the refrigeration equipment using it. The noise produced.
  • a refrigeration system provided by an embodiment of the present invention includes:
  • the semiconductor chip has a cold end and a hot end
  • the cooling structure is connected to the cold end of the semiconductor chip
  • a heat dissipation structure connected to the hot end of the semiconductor chip
  • a cold circulation fan is arranged corresponding to the cooling structure, so that the air from the cooling circulation fan passes through the cooling structure and exchanges heat with the cooling structure;
  • the heat dissipation structure includes:
  • the heat dissipation pipe is connected to the hot end of the semiconductor chip, and a refrigerant is arranged in the pipe;
  • the heat dissipation steel wire is connected with the heat dissipation pipe.
  • the above-mentioned cooling structure includes a cooling plate, the cooling plate is connected to the cold end of the semiconductor chip through a cooling element, and the cooling plate is distributed with auxiliary cooling parts.
  • the above-mentioned cooling structure includes a cooling plate, the cooling plate is connected to the cold end of the semiconductor chip through a cooling element, the cooling element is provided with an extension support portion, and the cooling plate is connected to the cold end of the semiconductor chip.
  • the extension support part is connected.
  • the above-mentioned cold circulation fan includes a damping structure, a panel, and a fan body, the fan body is connected to the panel through the damping structure; the damping structure includes a damping plate, and the damping plate is arranged at Between the fan body and the panel.
  • the above-mentioned shock-absorbing structure further includes an elastic fixing member, and the fan body and the panel are fixedly connected by the elastic fixing member.
  • the above-mentioned fan body, damping plate and panel are provided with corresponding fixing holes, and both ends of the elastic fixing member are respectively provided with a first limiting portion and a second limiting portion; Said fixing holes, said first limiting portion and second limiting portion are used to clamp outside the fixing holes of the fan body or the panel, so as to fix the fan body, the damping plate and the panel connect.
  • the above-mentioned second limiting portion is provided with a limiting end and a guiding end, and the limiting end and the guiding end are continuously provided; the guiding end is far away from the first limiting portion and is used for guiding the second limiting portion.
  • the limiting portion passes through the three fixing holes; the limiting end is close to the first limiting portion and is used to clamp the fan body after the second limiting portion passes through the three fixing holes Or outside the fixing hole of the panel.
  • the above-mentioned fan body has a fixing member, the fixing member is provided with a first flow restricting portion around the fan body, an air duct is formed between the first flow restricting portion and the fan body, and the air duct is provided with an air outlet , The air outlet corresponds to the cooling structure.
  • the aforementioned panel and the damping plate are provided with a first air inlet corresponding to the fan body; the fixing member is provided with a second air inlet corresponding to the fan body.
  • a refrigeration device provided by an embodiment of the present invention includes a cabinet and the aforementioned refrigeration system.
  • the refrigeration system provided by the embodiment of the present invention has a simple structure, adopts a heat dissipation structure of heat dissipation pipes and heat dissipation steel wires, and circulates heat absorption vaporization and pre-cooling liquefaction through the refrigerant in the heat dissipation pipes to absorb heat from the hot end of the semiconductor chip, and then dissipate heat.
  • the pipe is transferred to the heat-dissipating steel wire for heat dissipation, and the heat dissipation process is low-noise and achieves a superior noise reduction effect.
  • Fig. 1 is a side view of an embodiment of a refrigeration system of the present invention.
  • Fig. 2 is a schematic structural diagram of the refrigeration system shown in Fig. 1.
  • Fig. 3 is a side view of another embodiment of a refrigeration system of the present invention.
  • Fig. 4 is an exploded view of a cold circulation fan of a refrigeration system of the present invention.
  • Figure 5 is a perspective view of the cold circulation fan shown in Figure 4
  • Fig. 6 is a schematic structural diagram of the elastic fixing member of the cold circulation fan shown in Fig. 4.
  • Fig. 7 is a front view of a refrigeration equipment of the present invention.
  • Fig. 8 is a rear view of the refrigeration equipment shown in Fig. 7.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present invention, “plurality” means two or more than two, unless specifically defined otherwise.
  • the "above” or “below” of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them.
  • “above”, “above” and “above” the second feature of the first feature include the first feature being directly above and obliquely above the second feature, or merely indicating that the level of the first feature is higher than that of the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • a refrigeration system includes: a semiconductor chip 100 having a cold end and a hot end; a cooling structure 200 connected to the cold end of the semiconductor chip 100; and a heat dissipation structure 300, Connected to the hot end of the semiconductor chip 100; a cold circulation fan 400 is arranged corresponding to the cooling structure 200, so that the air from the cooling circulation fan 200 passes through the cooling structure 200 and interacts with the cooling structure 200 Heat exchange.
  • the heat dissipation structure 300 includes a heat dissipation pipe 310 connected to the hot end of the semiconductor chip 100 and a refrigerant is arranged in the pipe; and a heat dissipation steel wire 320 is connected to the heat dissipation pipe 310.
  • the refrigeration system uses the refrigerant in the heat dissipation pipe to perform the cycle of heat absorption, vaporization and pre-cooling liquefaction to absorb the heat of the hot end of the semiconductor chip, and then transfer it to the heat dissipation steel wire through the heat dissipation pipe for heat dissipation.
  • the heat dissipation process is zero noise and can meet various requirements. Applications in occasions/locations with high noise requirements.
  • the heat dissipation pipe 310 is arranged in contact with the hot end of the semiconductor chip 100, and performs heat exchange in a heat conduction manner, and specifically can be fixed by screws.
  • the refrigerant in the heat dissipation pipe 310 is heated and vaporized, and the gaseous refrigerant flows along the heat dissipation pipe, and then is pre-cooled and liquefied to return.
  • the heat dissipation effect is achieved through the cycle process of heated vaporization and pre-cooling liquefaction.
  • the heat dissipation pipe 310 is arranged in a spiral or winding arrangement to increase the range of movement of the refrigerant vaporized in the tube, promote the pre-cooling and liquefaction of the refrigerant, and thereby promote heat dissipation.
  • the heat dissipation steel wire 320 is arranged around the heat dissipation pipe 310 and is arranged in contact with the heat dissipation pipe 310 to exchange heat in the manner of heat conduction to promote the heat dissipation of the refrigerant.
  • the above-mentioned heat dissipation pipe can be made of materials that can conduct heat conduction in the prior art, preferably materials with high thermal conductivity, such as copper tubes, etc.; the refrigerant can be a refrigerant in the prior art, such as environmentally friendly refrigerant R600A/ R134A etc.
  • the semiconductor chip is also wrapped with insulation material.
  • the above-mentioned cold circulation fan is used to promote the circulation of cold air to improve the refrigeration efficiency.
  • increasing the rotation speed of the cold circulation fan is beneficial to the improvement of the refrigeration efficiency.
  • the cold circulation fan rotates, its main structure (drive motor, fan blades, etc.) will vibrate, which will cause collisions between the structures and generate noise.
  • the higher the fan speed the more The greater the vibration generated, the greater the subsequent noise.
  • the above-mentioned cooling structure 200 includes a cooling plate 201, and the cooling plate 201 is connected to the cold end of the semiconductor chip through a cooling element 110.
  • the cooling plate 201 is provided with auxiliary cooling parts 210 distributedly.
  • the auxiliary cooling unit can increase the cooling area of the cooling plate, thereby improving the cooling efficiency, reducing the workload of the cooling circulation fan, and reducing the operating noise of the cooling circulation fan and the refrigeration system.
  • the auxiliary cooling part 210 is a strip-shaped cooling plate protrudingly provided on the cooling plate 201, and a plurality of strip-shaped cooling plates are arranged at intervals on the front of the cooling plate 201 facing the inner cavity of the cabinet. The back surface of the plate 201 is directly in contact with the cold conductive element 110 for heat transfer.
  • the semiconductor chip 100 and the cold conductive element 110 are inlaid and connected to the back of the cabinet 500, and the heat dissipation pipe 310 is connected to the semiconductor chip 100 and then installed outside the cabinet 500 through the cabinet 500.
  • the mounting bracket can be used 330 for installation; the cold circulation fan 400 is connected to the cabinet 500 through the panel 410, and the three sides of the panel 410 that are not air outlets are connected to the top, left and right sides of the cabinet 500, respectively, and the panel 410 corresponds to the air outlet 461
  • One side is connected to the cooling plate 201 below, so that the panel 410 and the cooling plate 201 form a side wall of the storage cavity of the cabinet. Since the cold conducting element 110 is inlaid and connected to the back of the cabinet 500, there is no ventilation space between the back of the cooling plate and the cabinet, and the air flowing out of the cooling circulation fan can only flow through the front of the cooling plate.
  • the cold conductive element is provided with an extended support portion 111, and the cold plate 201 is connected to the extended support portion 111.
  • a ventilation space is formed between the back of the cold plate and the cabinet, and the air from the cooling circulation fan 400 can pass through the front and back sides of the cold plate 201 to take away the cooling capacity, thereby improving the cooling efficiency.
  • the extension support part and the cold conducting element may be integrally formed, for example, an integrally formed aluminum block.
  • the cooling plate 201, the auxiliary cooling part 210, the cooling element 110, and the extension support 111 can be made of materials that can conduct heat conduction in the prior art, preferably materials with a higher thermal conductivity, such as aluminum. Sheets or copper plates, etc.
  • the cold conducting element 110 is arranged in contact with the cooling plate 201, which can be fixed by screws. Therefore, the cold generated by the cold end is transferred to the cooling plate 201 through the cooling element 110, and the cooling plate 201 is connected to the air. Contact for heat exchange, so as to achieve the cooling effect.
  • the air outlet 461 of the cold circulation fan 400 corresponds to the cooling plate 201, and the air enters from the first air inlet 462, the second air inlet 463 and the third air inlet 464 of the cold circulation fan 400, and flows from the air outlet 461 through the air duct 422.
  • the cooling plate 201 is driven by the cooling circulation fan 400 to circulate the air to exchange heat with the cooling plate 201, so as to diffuse the cold carried by the cooling plate 201, thereby promoting refrigeration.
  • the cold circulation fan 400 includes a shock-absorbing structure, a panel 410, and a fan body 420.
  • the fan body 420 is connected to the panel 410 through the shock-absorbing structure;
  • the shock-absorbing structure includes a shock-absorbing plate 430,
  • the damping plate 430 is arranged between the fan body 420 and the panel 410.
  • the fan body 420 is connected to the panel 410 through the damping structure, which can buffer and absorb the vibration generated when the fan body 420 rotates.
  • a damping plate 430 is arranged between the fan body 420 and the panel 410 to block the transmission of vibration to the panel 410.
  • the cooling process is low in noise, and the beneficial effect of vibration and noise reduction can be achieved when the refrigeration system is in operation.
  • the above-mentioned shock-absorbing structure further includes an elastic fixing member 440, and the fan body 420 and the panel 410 are fixedly connected by the elastic fixing member 440.
  • the fixed connection between the fan body 420, the damping plate 430 and the panel 410 is completed by the elastic fixing member 440, which can eliminate the noise generated by the collision caused by the rotation of the fan when the hardware connection is used, thereby promoting the vibration reduction of the refrigeration system. noise.
  • the fan body 420, the damping plate 430, and the panel 410 are provided with corresponding fixing holes 471, and the two ends of the elastic fixing member 440 are respectively provided with first limits.
  • the hole 471 is externally clamped to fix the fan body 420, the damping plate 430 and the panel 410, and the structure is simple.
  • the first restricting portion 410 and/or the second restricting portion 420 and the elastic fixing member 400 may be provided separately, for example, in the form of a snap button, or may be integrally provided.
  • the second limiting portion 442 is provided with a limiting end 4421 and a guiding end 4422, the limiting end 4421 and the guiding end 4422 are continuously arranged, and the guiding end 4422 is far away from the first
  • a limiting portion 441 is used to guide the second limiting portion 442 through the three fixing holes 471; the limiting end 4421 is close to the first limiting portion 441, and is used for the second limiting portion 442 to pass through the three fixing holes 471
  • the hole 471 is clamped behind the fixing hole 471 of the fan body 420 or the panel 410. . In this way, it is possible to realize the integral arrangement of the first limiting portion 441 and the second limiting portion 442 with the elastic fixing member 440, and the connection between the fan body 420 and the panel 410 can be completed in a simple and quick manner.
  • the elastic fixing member 440 is a rotating body, and the cross-sectional diameter of the first limiting portion 441 is larger than the aperture of the fixing hole 471, so that when the fixed connection is made, the first limiting portion 441 is blocked outside the fixing hole 471 (this In the embodiment, it is blocked outside the fixing hole 471 of the panel 410); the cross-sectional diameters of the limiting end 4421 and the guiding end 4422 of the second limiting portion 442 continuously change, gradually decreasing from the limiting end 4421 to the guiding end 4422, and The cross-sectional diameter of the limiting end 4421 is larger than the diameter of the fixing hole 471, and the cross-sectional diameter of the guiding end 4422 is smaller than the diameter of the fixing hole 471.
  • the guiding end 4422 can pass through the fixing hole 471, and the limiting end 4421 is blocked by Outside the fixing hole 471 (in this embodiment, it is blocked by the fixing hole 471 of the fan body 420); a connecting portion 443 is also provided between the first limiting portion 441 and the second limiting portion 442, the center of the connecting portion 443
  • the shaft length is equal to the total thickness of the fan body 420, the shock-absorbing plate 430, and the panel 410, and the cross-sectional diameter of the connecting portion 443 is smaller than the diameter of the fixing hole 471.
  • the guiding end 4422 of the second limiting portion 442 enters the fixing hole 471, and a pulling force is applied to cause the limiting end 4421 of the second limiting portion 442 to undergo elastic deformation (limiting The length of the central axis of the end 4421 becomes larger and the cross-sectional diameter becomes smaller), and the guide end 4422 guides it through the fixing hole 471; when the second limiting portion 442 passes through the fixing hole 471, the limiting end 4421 restores its deformation and is blocked from being fixed.
  • the connecting portion 443 is placed in the three fixing holes 471, and the first limiting portion 441 is blocked outside the fixing hole 471, thereby realizing the fixed connection between the fan body 420, the damping plate 430 and the panel 410, and the operation is simple .
  • the limit end 4421 is provided with an extrusion gap 445, and the extrusion gap 445 is used to provide space so that the limit end 4421 can be contracted by force to pass through the fixing hole 471.
  • the extrusion gap 445 is used to provide space so that the limit end 4421 can be contracted by force to pass through the fixing hole 471.
  • the above-mentioned second limiting portion 442 is further provided with a pulling portion 440 which is connected to the guiding end 4422.
  • a pulling force is applied to the pulling portion 440 to make the second limiting The position portion 442 passes through the fixing hole 471.
  • the panel 410 is provided with a buckle 411, and a corresponding position of the shock-absorbing plate 430 is provided with a slot 431.
  • a plurality of buckles 411 can be provided on the peripheral edges of the panel 410. During specific installation and connection, the buckle 411 is inserted into the slot 431 to realize the connection between the shock-absorbing plate 430 and the panel 410.
  • a screw 450 can be provided between the shock-absorbing plate 430 and the panel 410 for reinforcement connection, because the screw 450 is arranged on the shock-absorbing plate 430, and the screw 450 is not connected to the fan body 420 , So it will not affect the fan's vibration and noise reduction effect.
  • the above-mentioned shock-absorbing structure adopts silica gel or rubber material. Silicone or rubber materials have good elasticity. On the one hand, the shock-absorbing structure has a good shock-proof effect, which in turn enables the fan to achieve a better noise reduction effect. On the other hand, it can make the connection and disassembly of the elastic fixing member easier Fast. In specific applications, the shock-absorbing structure can also use other elastic shock-proof materials that are easily known to those skilled in the art.
  • the fan body has a fixing member 421.
  • the fixing member 421 surrounds the fan body 420 and is provided with a first flow restricting portion 423.
  • An air duct 422 is formed, and the air duct 422 is provided with an air outlet 461 corresponding to the aforementioned cooling structure 200. Therefore, compared with the refrigeration system in the prior art, the air diverges and circulates around the fan after entering the fan, and the impact between the air and the fan structure generates noise.
  • the uniform circulation is guided by the air duct 422, which makes the air flow smooth and smooth, eliminates the impact between the air and the other structure of the fan, and effectively reduces the noise during the operation of the fan; and the air flows through the air duct 422 from the air outlet 461 to the cooling
  • the structure 200 can promote heat exchange between the air and the cooling structure 200, maximize the diffusion of cold energy, and improve the cooling efficiency.
  • the shock absorption plate 430 is provided with a third limiting portion 432, which surrounds the first current limiting portion 423 and is connected to the first limiting portion 423.
  • the restrictor 423 fits closely. As a result, the airtightness of the air duct 422 is ensured, and air will not escape from the gap to cause noise such as airflow sound.
  • the panel 410 and the damping plate 430 are provided with a first air inlet 462 corresponding to the fan body 420; the fixing member 421 is provided with a second air inlet 462 corresponding to the fan body 420 463.
  • the fan achieves double-sided air intake, and the air enters from the front and back of the fan at the same time, and then flows out from the air outlet.
  • This can accelerate the cold air circulation in refrigeration equipment such as refrigerators or wine cabinets, and promote cooling and cooling, which can be based on The usage condition reduces the working power of the fan, so as to reduce the noise during the operation of the refrigeration system.
  • the cold circulation fan is installed in refrigeration equipment such as a refrigerator or a wine cabinet through a panel 410, and the panel 410 faces the inside of the cabinet.
  • the side of the panel 410 corresponding to the air outlet 461 is provided with a cooling structure 200, and the other sides are connected to the cabinet of refrigeration equipment such as a freezer or a wine cooler.
  • the panel 410 and the shock-absorbing plate 430 are provided with corresponding ventilation holes 472, so that the air in the cabinet can flow from the ventilation holes 472 to the back of the cooling circulation fan 400, and then from the back of the cooling circulation fan 400 (The second air inlet 463) enters the air; and the air in the cabinet directly enters the air from the front of the cooling circulation fan (the first air inlet 462), so that the cooling circulation fan 400 achieves double-sided air intake.
  • the air duct 422 is provided with a third air inlet 464, which further promotes the circulation of cold air in practical applications.
  • the damping plate 430 is provided with a protective structure 433 at a position corresponding to the air outlet 461.
  • the protective structure 433 can prevent foreign matter from entering the fan body 420 or the air duct 422 from the air outlet 461; for example, in specific applications, when children open the freezer to play, the existence of the protective structure can prevent children from taking their hands (fingers) out of the refrigerator.
  • the tuyere extends into the fan body and causes a safety accident.
  • the protective structure 433 includes a plurality of protective rods 434 distributedly arranged.
  • the refrigeration system provided by the embodiments of the present application adopts a heat dissipation structure of a heat dissipation pipe and a heat dissipation steel wire.
  • the refrigerant in the heat dissipation pipe performs a cycle of heat absorption, vaporization, and precooling liquefaction to absorb heat from the hot end of the semiconductor chip, and then transmits it through the heat dissipation pipe.
  • the heat dissipation steel wire is used to dissipate heat, and there is no noise during the heat dissipation process; the auxiliary cooling part is provided by the cooling plate, and the extension support part is provided for the cooling member to promote the cooling efficiency, thereby reducing the noise generated by the refrigeration system during operation; through the shock absorption structure and air duct
  • the structure reduces the noise generated by the cooling circulation fan when it is working; the cooling system of the present application can reduce the noise to 27 decibels or less, achieving a superior noise reduction effect.
  • a refrigeration device provided by an embodiment of the present invention includes a cabinet 500 and the aforementioned refrigeration system.
  • the semiconductor chip 100, the cooling structure 200 and the cold circulation fan 400 are arranged in the cabinet 500. After the heat dissipation structure 300 is connected to the hot end of the semiconductor chip 100, it is connected to the cabinet 500 outside the cabinet 500.
  • the semiconductor chip 100 and the cold conductive element 110 are inlaid and connected to the back of the cabinet 500, and the heat dissipation pipe 310 is connected to the semiconductor chip 100 and then installed outside the cabinet 500 through the outer cabinet board.
  • the installation can be carried out through the mounting bracket 330.
  • the cold circulation fan 400 is connected to the cabinet 500 through the panel 410, and the three sides of the panel 410 that are not air outlets are connected to the top, left and right sides of the cabinet 500, respectively, and the panel 410 corresponds to one side of the air outlet 461
  • the edge is connected to the cooling plate 201 below, so that the panel 410 and the cooling plate 201 form a side wall of the storage cavity of the cabinet.
  • the refrigeration equipment provided by the embodiments of the present application adopts a heat dissipation structure of a heat dissipation pipe and a heat dissipation steel wire.
  • the refrigerant in the heat dissipation pipe undergoes a cycle of heat absorption, vaporization, and precooling liquefaction to absorb heat from the hot end of the semiconductor chip, and then transfer it through the heat dissipation pipe
  • the heat dissipation steel wire is used to dissipate heat, and there is no noise during the heat dissipation process;
  • the auxiliary cooling part is provided by the cooling plate, and the extension support part is provided for the cooling member to promote the cooling efficiency, thereby reducing the noise generated by the refrigeration system during operation; through the shock absorption structure and air duct
  • the structure reduces the noise generated by the cooling circulation fan during operation, so that the noise of the refrigeration equipment can be reduced to 27 decibels or less during operation, achieving a superior noise reduction effect.
  • the description with reference to the terms “one embodiment”, “certain embodiments”, “exemplary embodiments”, “examples”, “specific examples”, or “some examples” etc. means to combine The specific features, structures, materials or characteristics described in the embodiments or examples are included in at least one embodiment or example of the present invention.
  • the schematic representations of the above-mentioned terms do not necessarily refer to the same embodiment or example.
  • the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开了一种制冷系统及制冷设备，其中包括：半导体芯片，具有一冷端和一热端；散冷结构，与半导体芯片的冷端连接；散热结构，与半导体芯片的热端连接；冷循环风扇，与散冷结构对应设置，以使从冷循环风扇出来的空气经过散冷结构，并与散冷结构进行热交换；该散热结构包括：散热导管，与半导体芯片的热端连接，其管内设置有制冷剂；散热钢丝，与散热导管连接。制冷设备包括柜体以及上述的制冷系统。本发明提供了一种制冷系统及制冷设备，通过静音工作的散热导管和散热钢丝进行散热，取代风扇和散热铝片的散热形式，大大地降低了制冷系统及应用其的制冷设备工作时产生的噪音。

Description

一种制冷系统及制冷设备 技术领域
本发明属于制冷设备领域，特别涉及一种制冷系统及制冷设备。
背景技术
现有技术中，半导体制冷技术已被广泛应用于各种类型的制冷设备中，比如冷柜或制冷设备，已广泛利用半导体制冷系统进行制冷。半导体制冷主要利用半导体芯片通电后，形成一个热端和一个冷端，冷端通过散冷结构与柜内的空气进行热交换形成冷空气，进而达到降温制冷的效果，而热端通过散热结构进行散热。现有的制冷系统，其散热结构通常采用风扇和散热铝片，将散热铝片与热端连接，然后通过风扇带动风流进行散热。此类散热结构，当风扇转动时，风扇主体结构(驱动马达、扇叶等)会发生振动，而风扇的结构部件之间进行硬连接，导致该振动会引起风扇结构之间发生碰撞而产生不可忽略的噪音。当制冷系统安装在冷柜或制冷设备等制冷设备上使用时，由于风扇与设备的柜体之间亦是进行硬连接，甚至会导致风扇和柜体之间也因此发生碰撞而产生噪音，使得制冷设备在工作过程中产生大量噪音，甚至噪音过大，对人们的工作和生活造成影响，给人们带来不愉快的使用体验。
因此，现有技术有待改进和发展。
发明内容
本发明实施例提供了一种制冷系统及制冷设备，通过静音工作的散热导管和散热钢丝进行散热，取代风扇和散热铝片的散热形式，大大地降低了制冷系统及应用其的制冷设备工作时产生的噪音。
为解决其技术问题，一方面，本发明实施例提供的一种制冷系统包括：
半导体芯片，具有一冷端和一热端；
散冷结构，与所述半导体芯片的冷端连接；
散热结构，与所述半导体芯片的热端连接；
冷循环风扇，与所述散冷结构对应设置，以使从所述冷循环风扇出来的空气经过所述散冷结构，并与所述散冷结构进行热交换；
所述散热结构包括：
散热导管，与所述半导体芯片的热端连接，其管内设置有制冷剂；
散热钢丝，与所述散热导管连接。
进一步地，上述散冷结构包括散冷板，所述散冷板通过导冷件与所述半导体芯片的冷端连接，所述散冷板分布设有辅助散冷部。
进一步地，上述散冷结构包括散冷板，所述散冷板通过导冷件与所述半导体芯片的冷端连接，所述导冷件设有延伸支撑部，所述散冷板与所述延伸支撑部连接。
进一步地，上述冷循环风扇包括减震结构、面板和风扇本体，所述风扇本体通过所述减震结构与所述面板连接；所述减震结构包括减震板，所述减震板设于所述风扇本体与所述面板之间。
进一步地，上述减震结构还包括弹性固定件，所述风扇本体与所述面板之间通过所述弹性固定件进行固定连接。
进一步地，上述风扇本体、减震板和面板设有对应的固定孔，所述弹性固定件的两端分别设有第一限位部和第二限位部；所述弹性固定件置于三个所述固定孔，所述第一限位部和第二限位部用于在所述风扇本体或所述面板的固定孔外卡紧，以将所述风扇本体、减震板和面板固定连接。
进一步地，上述第二限位部设有限位端与导向端，所述限位端与所述导向端连续设置；所述导向端远离所述第一限位部，用于引导所述第二限位部通过三个所述固定孔；所述限位端靠近所述第一限位部，用于在所述第二限位部通过三个所述固定孔后卡紧于所述风扇本体或所述面板的固定孔外。
进一步地，上述风扇本体具有固定件，所述固定件围绕所述风扇本体设有第一限流部，所述第一限流部与风扇本体间形成风道，所述风道设有出风口，所述出风口对应所述散冷结构。
进一步地，上述面板与所述减震板对应所述风扇本体设有第一进风口；所述固定件对应所述风扇本体设有第二进风口。
另一方面，本发明实施例提供的一种制冷设备，包括柜体以及上述的制冷系统。
本发明实施例提供的制冷系统结构简单，采用散热导管和散热钢丝的散热结构，通过散热导管内的制冷剂进行吸热气化、预冷液化的循环以吸收半导体芯片热端的热量，再通过散热导管传递至散热钢丝进行散热，散热过程低噪音，达到了优越的降噪效果。
附图说明
图1为本发明一种制冷系统的一种实施例的侧视图。
图2为图1所示的制冷系统的结构示意图。
图3为本发明一种制冷系统另一种实施例的侧视图。
图4为本发明一种制冷系统的冷循环风扇的爆炸图。
图5为图4所示的冷循环风扇的立体图
图6为图4所示的冷循环风扇的弹性固定件的结构示意图。
图7为本发明一种制冷设备的正视图。
图8为为图7所示的一种制冷设备的后视图。
具体实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
如图1～4所示，本发明实施例一种制冷系统包括：半导体芯片100，具有一冷端和一热端；散冷结构200，与该半导体芯片100的冷端连接；散热结构300，与该半导体芯片100的热端连接；冷循环风扇400，与该散冷结构200对应设置，以使从该冷循环风扇200出来的空气经过该散冷结构200，并与该散冷结构200进行热交换。该散热结构300包括：散热导管310，与该半导体芯片100的热端连接，其管内设置有制冷剂；散热钢丝320，与该散热导管310连接。
本制冷系统通过散热导管内的制冷剂进行吸热气化、预冷液化的循环以吸收半导体芯片热端的热量，再通过散热导管传递至散热钢丝进行散热，散热过程零噪音，能够满足多种对噪音具有高要求的场合/场所的应用。
该散热导管310与半导体芯片100的热端接触设置，以热传导的方式进行热交换，具体可以通过螺钉进行固定。散热导管310内的制冷剂受热汽化，气态的制冷剂沿散热导管流动，然后预冷液化回流，通过受热汽化、预冷液化的循环过程达到散热的效果。作为优选方案，该散热导管310盘旋设置，或迂回设置，以增加制冷剂在管内汽化的运动行程范围，促进制冷剂的预冷液化，进而促进散热。该散热钢丝320围绕散热导管310设置，并与散热导管310接触设置，以热传导的方式进行热交换，促进制冷剂的散热。具体地，上述散热导管可以采用现有技术中能够进行热传导的材质，优选热传导系数较高的材质，比如采用铜管等；制冷剂可以采用现有技术中的制冷剂，比如环保制冷剂R600A/R134A等。半导体芯片外还包裹有保温材料。
具体应用中，上述冷循环风扇用于促进冷空气的循环，以提高制冷效率，在一定程度上，提高该冷循环风扇的转速有利于制冷效率的提高。但是另一方面，冷循环风扇在转动时，其主体结构(驱动马达、扇叶等)会发生振动，从而引起结构之间发生碰撞而产生噪音，在一定程度上，风扇的转速越大，其产生的振动越大，继而产生的噪音越大。
如图1、2所示，具体地，上述散冷结构200包括散冷板201，该散冷板201通过导冷件110与半导体芯片的冷端连接。
在一些优选的实施方式中，该散冷板201分布设有辅助散冷部210。由此，通过辅助散冷部能够增大散冷板的散冷面积，从而能够提高制冷效率，进而能够减轻冷循环风扇的工作负荷，从而降低冷循环风扇以及制冷系统的工作噪音。具体地，辅助散冷部210为散冷板201上凸起设置的条形散冷板，多个条形散冷板间隔排列设置在该散冷板201面向柜体内腔的正面，该散冷板201的背面直接与导冷件110接触设置进行热传递。
具体使用安装时，半导体芯片100和导冷件110与柜体500的背部镶嵌连接，散热导管310与半导体芯片100连接后，穿过柜体500于柜体500外进行安装，具体可以通过安装支架330进行安装；冷循环风扇400通过面板410与柜体500连接，其中面板410非出风口出风的三侧边分别与柜体500的的顶部、左右侧部连接，面板410对应出风口461的一侧边在下方对接散冷板201，由此，面板410和散冷板201形成柜体储物内腔的一侧壁。由于导冷件110与柜体500的背部镶嵌连接，使得散冷板的背面与柜体之间没有通风空间，从冷循环风扇流出的空气仅能流经散冷板的正面。
如图3所示，在一些优选的实施方式中，该导冷件设有延伸支撑部111，该散冷板201与该延伸支撑部111连接。由此，散冷板的背面与柜体之间形成有通风空间，从冷循环风扇400出来的空气能够从散冷板201的正面、背面两侧面经过而带走冷量，从而能够提高制冷效率，进而能够减轻冷循环风扇的工作负荷，从而降低冷循环风扇以及制冷系统的工作噪音。具体地，该延伸支撑部与导冷件可以一体成型设置，比如采用一体成型的铝块。
具体地，上述散冷板201、辅助散冷部210、导冷件110、延伸支撑部111可以采用现有技术中能够进行热传导的材质，优选热传导系数较高的材质，比如散冷板采用铝片或铜板等。
具体应用中，导冷件110与散冷板201接触设置，具体可以通过螺钉进行固定，由此，冷端产生的冷量经过导冷件110传递至散冷板201，散冷板201与空气接触进行热交换，从而达到制冷效果。冷循环风扇400的出风口461对应该散冷板201，空气从冷循环风扇400的第一进风口462、第二进风口463和第三进风口464进入，经风道422从出风口461流向散冷板201，通过冷循环风扇400带动空气循环流动与散冷板201进行热交换，将散冷板201带有的冷量扩散，从而促进制冷。
如图4、5所示，该冷循环风扇400包括减震结构、面板410和风扇本体420，该风扇本体420通过该减震结构与该面板410连接；该减震结构包括减震板430，该减震板430设于该风扇本体420与该面板410之间。
通过减震结构将风扇本体420连接在面板410上，能够缓冲与吸收风扇本体420转动时产生的振动，在风扇本体420与面板410之间设置减震 板430，阻隔了振动传递至面板410，进而使散冷过程低噪音，使制冷系统运作时能够达到减震降噪的有益效果。
在一些优选的实施方式中，上述减震结构还包括弹性固定件440，该风扇本体420与面板410之间通过该弹性固定件440进行固定连接。由此，通过弹性固定件440完成风扇本体420、减震板430与面板410之间的固定连接，能够消除采用硬件连接时风扇转动引起的碰撞而产生的噪音，进而促进制冷系统的减震降噪。
如图4～6所示，在一些优选的实施方式中，上述风扇本体420、减震板430和面板410设有对应的固定孔471，上述弹性固定件440的两端分别设有第一限位部441和第二限位部442；该弹性固定件440置于上述三个固定孔471，该第一限位部441和第二限位部442用于在风扇本体420或面板410的固定孔471外卡紧，以将风扇本体420、减震板430和面板410固定连接，结构简单。具体地，第一限位部410和/或第二限位部420与弹性固定件400可以分体设置，比如采用按扣的方式，亦可以一体设置。
如图6所示，在一些优选的实施方式中，该第二限位部442设有限位端4421与导向端4422，该限位端4421与该导向端4422连续设置，该导向端4422远离第一限位部441，用于引导第二限位部442通过上述三个固定孔471；该限位端4421靠近第一限位部441，用于在第二限位部442通过上述三个固定孔471后卡紧于风扇本体420或面板410的固定孔471外。。由此，能够实现第一限位部441和第二限位部442与弹性固定件440的一体设置，通过简单快捷的方式完成上述风扇本体420与面板410之间的连接。
具体地，该弹性固定件440为旋转体，该第一限位部441的截面直径大于固定孔471的孔径，由此做固定连接时，第一限位部441受阻于固定孔471外(本实施例中受阻于面板410的固定孔471外)；该第二限位部442的限位端4421与导向端4422的截面直径连续变化，由限位端4421向导向端4422逐渐减小，并且限位端4421的截面直径大于固定孔471的孔径，导向端4422的截面直径小于固定孔471的孔径，由此做固定连接时，导向端4422能够通过固定孔471，而限位端4421受阻于固定孔471外(本实施例中受阻于风扇本体420的固定孔471外)；在第一限位部441与第二限位部442之间还设有连接部443，该连接部443的中心轴长度等于风扇本体420、减震板430和面板410三者的厚度总和，该连接部443的截面直径小于固定孔471的孔径。具体应用中，利用该弹性固定件440的弹性变形，由第二限位部442的导向端4422进入固定孔471，施加拉力使第二限位部442的限位端4421发生弹性形变(限位端4421的中心轴长度变大，截面直 径变小)，由导向端4422引导其通过固定孔471；当第二限位部442通过固定孔471后，其限位端4421恢复形变而受阻于固定孔471外，连接部443置于三个固定孔471中，而第一限位部441受阻于固定孔471外，进而实现风扇本体420、减震板430和面板410间的固定连接，操作简单。
在一些优选的实施方式中，上述限位端4421设有挤压空隙445，该挤压空隙445用于提供空间，使该限位端4421能够受力收缩以通过固定孔471。具体应用中，需要做拆卸时，挤压限位端4421相应的位置，使限位端4421收缩至能够进入固定孔471，由此使该弹性固定件440脱离三个固定孔471，进而简单快速地完成风扇的拆卸；当做固定连接而施加拉力时，促进其发生形变通过固定孔471。
在一些实施方式中，上述第二限位部442还设有施拉部440，该施拉部440与导向端4422连接，当做固定连接时，在该施拉部440施加拉力以使第二限位部442通过固定孔471。
如图4所示，在一些实施方式中，面板410设有卡扣411，减震板430对应的位置设置有卡槽431。具体地，根据需求，可以在面板410的四周边缘设置多个卡扣411。具体安装连接时，将卡扣411卡置于卡槽431内，可以实现减震板430与面板410之间的连接。
如图4所示，具体地，可以在减震板430与面板410之间的设置螺钉450做加固连接，由于该螺钉450设置在减震板430上，并且该螺钉450没有与风扇本体420连接，所以不会影响风扇的减震降噪效果。
在一些优选的实施方式中，上述减震结构采用硅胶或橡胶材料。硅胶或橡胶材料具有良好的弹性，一方面，使减震结构具有良好地防震效果，进而使风扇达到更优地的降噪效果，另一方面，能够使弹性固定件的连接和拆卸工作更轻松快捷。具体应用中，减震结构亦可以采用本领域技术人员容易得知的其他具有弹性的防震材料。
如图4所示，在一些优选的实施方式中，上述风扇本体具有固定件421，该固定件421围绕风扇本体420设有第一限流部423，第一限流部423与风扇本体420间形成风道422，该风道422设有出风口461，该出风口对应上述散冷结构200。由此，相比于现有技术中的制冷系统，空气进入风扇后向四周发散流通，空气与风扇结构之间撞击产生噪音，本申请实施例中通过设置风道，使空气进入风扇本体420后，经风道422引导统一流通，使得空气的流通通顺流畅，消除空气与风扇其他结构之间的撞击，进而有效降低了风扇工作时的噪音；并且空气经风道422从出风口461流向散冷结构200，能够促进空气与散冷结构200进行热交换，最大化地将冷量扩散，提交制冷效率。
如图5所示，在一些优选的实施方式中，上述减震板430设有第三限位部432，该第三限位部432外围绕上述第一限流部423，并与该第一限流部423紧密配合。由此，保证风道422的密封性，空气不会从空隙中窜出而引起气流声等噪音。
如图4、5所示，在一些优选的实施方式中，上述面板410与减震板430对应风扇本体420设有第一进风口462；上述固定件421对应风扇本体420设有第二进风口463。由此，风扇实现双面进风，空气从风扇的正面和背面同时进风，再汇流从出风口出风，能够加速冷柜或酒柜等制冷设备内的冷风循环，促进制冷降温，进而可以基于使用情况降低风扇的工作功率，从而能够降低制冷系统运作时的噪音。
具体应用中，该冷循环风扇通过面板410安装在冷柜或酒柜等制冷设备内，并且面板410面向柜体内部。面板410对应出风口461的一侧设置散冷结构200，其他侧边与冷柜或酒柜等制冷设备的柜体连接，导致该冷循环风扇400的背部空气不流畅，因此，为实现双面进风，在一些实施方式中，面板410和减震板430设有对应的通风孔472，使得柜体内的空气能够从通风孔472流到冷循环风扇400的背部，进而从冷循环风扇400的背部(第二进风口463)进风；而柜体内的空气直接从冷循环风扇的正面(第一进风口462)进风，由此该冷循环风扇400实现双面进风。
在一些优选的实施方式中，上述风道422设置有第三进风口464，由此在实际应用中，进一步促进冷风循环。
如图5所示，在一些实施方式中，该减震板430对应出风口461的位置设有防护结构433。通过防护结构433可以防止异物从出风口461进入风扇本体420内部或风道422；比如在具体应用中，孩童贪图凉快而打开冷柜玩耍时，防护结构的存在可以防止孩童将手(指)从出风口伸入风扇本体内部而引发安全事故。具体地，该防护结构433包括多个分布设置的防护杆434。
本申请实施例提供的制冷系统，采用散热导管和散热钢丝的散热结构，通过散热导管内的制冷剂进行吸热气化、预冷液化的循环以吸收半导体芯片热端的热量，再通过散热导管传递至散热钢丝进行散热，散热过程零噪音；通过散冷板设置辅助散冷部、导冷件设置延伸支撑部以促进制冷效率，从而降低制冷系统在运作时产生的噪音；通过减震结构和风道结构降低冷循环风扇工作时产生的噪音；采用本申请的制冷系统，噪音能够降至27分贝以下，达到优越的降噪效果。
如图7～8所示，另一方面，本发明实施例提供的一种制冷设备，包括柜体500以及上述的制冷系统。其中半导体芯片100、散冷结构200和冷循 环风扇400设于该柜体500内，散热结构300与半导体芯片100的热端连接后，于柜体500外与该柜体500连接。
具体地，半导体芯片100和导冷件110与柜体500的背部镶嵌连接，散热导管310与半导体芯片100连接后，穿过外柜板于柜体500外进行安装，具体可以通过安装支架330进行安装；冷循环风扇400通过面板410与柜体500连接，其中面板410非出风口出风的三侧边分别与柜体500的的顶部、左右侧部连接，面板410对应出风口461的一侧边在下方对接散冷板201，由此，面板410和散冷板201形成柜体储物内腔的一侧壁。
本申请实施例提供的制冷设备，采用散热导管和散热钢丝的散热结构，通过散热导管内的制冷剂进行吸热气化、预冷液化的循环以吸收半导体芯片热端的热量，再通过散热导管传递至散热钢丝进行散热，散热过程零噪音；通过散冷板设置辅助散冷部、导冷件设置延伸支撑部以促进制冷效率，从而降低制冷系统在运作时产生的噪音；通过减震结构和风道结构降低冷循环风扇工作时产生的噪音，使制冷设备在工作时噪音能够降至27分贝以下，达到优越的降噪效果。
在本说明书的描述中，参考术语“一个实施方式”、“某些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。

Claims (10)

  1. 一种制冷系统及制冷设备，其特征在于，包括：
    半导体芯片(100)，具有一冷端和一热端；
    散冷结构(200)，与所述半导体芯片(100)的冷端连接；
    散热结构(300)，与所述半导体芯片(100)的热端连接；
    冷循环风扇(400)，与所述散冷结构(200)对应设置，以使从所述冷循环风扇(400)出来的空气经过所述散冷结构(200)，并与所述散冷结构(200)进行热交换；
    所述散热结构(300)包括：
    散热导管(310)，与所述半导体芯片(100)的热端连接，其管内设置有制冷剂；
    散热钢丝(320)，与所述散热导管(310)连接。
  2. 根据权利要求1所述的制冷系统，其特征在于，所述散冷结构(200)包括散冷板(201)，所述散冷板(201)通过导冷件(110)与所述半导体芯片(100)的冷端连接，所述散冷板(201)分布设有辅助散冷部(210)。
  3. 根据权利要求1所述的制冷系统，其特征在于，所述散冷结构(200)包括散冷板(201)，所述散冷板(201)通过导冷件(110)与所述半导体芯片(100)的冷端连接，所述导冷件(110)设有延伸支撑部(111)，所述散冷板(201)与所述延伸支撑部(111)连接。
  4. 根据权利要求1所述的制冷系统，其特征在于，所述冷循环风扇(400)包括减震结构、面板(410)和风扇本体(420)，所述风扇本体(420)通过所述减震结构与所述面板(410)连接；所述减震结构包括减震板(430)，所述减震板(430)设于所述风扇本体(420)与所述面板(410)之间。
  5. 根据权利要求4所述的制冷系统，其特征在于，所述减震结构还包括弹性固定件(440)，所述风扇本体(420)与所述面板(410)之间通过所述弹性固定件(440)进行固定连接。
  6. 根据权利要求5所述的制冷系统，其特征在于，所述风扇本体(420)、减震板(430)和面板(410)设有对应的固定孔(471)，所述弹性固定件(440)的两端分别设有第一限位部(441)和第二限位部(442)；
    所述弹性固定件(440)置于三个所述固定孔(471)，所述第一限位部(441)和第二限位部(442)用于在所述风扇本体(420)或所述面板(410)的固定孔(471)外卡紧，以将所述风扇本体(420)、减震板(430)和面板(410)固定连接。
  7. 根据权利要求6所述的制冷系统，其特征在于，所述第二限位部(442) 设有限位端(4421)与导向端(4422)，所述限位端(4421)与所述导向端(4422)连续设置；所述导向端(4422)远离所述第一限位部(441)，用于引导所述第二限位部(442)通过三个所述固定孔(471)；所述限位端(4421)靠近所述第一限位部(441)，用于在所述第二限位部(442)通过三个所述固定孔(471)后卡紧于所述风扇本体(420)或所述面板(410)的固定孔(471)外。
  8. 根据权利要求4所述的制冷系统，其特征在于，所述风扇本体(420)具有固定件(421)，所述固定件(421)围绕所述风扇本体(420)设有第一限流部(423)，所述第一限流部(423)与风扇本体(420)间形成风道(422)，所述风道(422)设有出风口(461)，所述出风口(461)对应所述散冷结构(200)。
  9. 根据权利要求4所述的制冷系统，其特征在于，所述面板(410)与所述减震板(430)设有与所述风扇本体(420)对应的第一进风口(462)；所述固定件(421)设有与所述风扇本体(420)对应的第二进风口(463)。
  10. 一种制冷设备，其特征在于，包括柜体(500)以及权利要求1～9任一所述的制冷系统。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115406165A (zh) * 2022-09-08 2022-11-29 中山市凯腾电器有限公司 一种智能多温区冷柜
WO2024002183A1 (zh) * 2022-06-29 2024-01-04 莱尔德热系统(深圳)有限公司 用于半导体制冷片的换热系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111623551A (zh) * 2020-06-12 2020-09-04 广东奥达信制冷科技有限公司 一种制冷系统及制冷设备

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316423A (en) * 1992-12-11 1994-05-31 Kin Daniel C C Acoustic isolation fastener and method for attachment
JPH11132592A (ja) * 1997-10-31 1999-05-21 Koa Corporation:Kk 電子冷却器の冷却方法
KR20070102256A (ko) * 2006-04-14 2007-10-18 잘만테크 주식회사 부품 고정구
US20100002389A1 (en) * 2008-07-01 2010-01-07 Xigmatek Co., Ltd. Fan fastener
CN201497248U (zh) * 2009-08-12 2010-06-02 广东德豪润达电气股份有限公司 制冷装置及电子酒柜
EP3376135A1 (en) * 2017-03-14 2018-09-19 LG Electronics Inc. Refrigerator
US20190186806A1 (en) * 2017-12-19 2019-06-20 Lg Electronics Inc. Refrigerator
CN110431368A (zh) * 2017-03-21 2019-11-08 Lg电子株式会社 冰箱
CN110462315A (zh) * 2017-03-15 2019-11-15 Lg电子株式会社 冰箱
CN111623551A (zh) * 2020-06-12 2020-09-04 广东奥达信制冷科技有限公司 一种制冷系统及制冷设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201104376Y (zh) * 2007-10-16 2008-08-20 佛山市顺德区奥达信电器有限公司 用于电子冰箱的热管散热装置
CN101216227A (zh) * 2008-01-10 2008-07-09 上海精励汽车科技有限公司 半导体制冷器
CN201255534Y (zh) * 2008-08-01 2009-06-10 佛山市顺德区奥达信电器有限公司 半导体电子冰箱的热管改进结构
CN201265982Y (zh) * 2008-08-15 2009-07-01 佛山市顺德区奥达信电器有限公司 一种电子冰箱的传热装置
US9435578B2 (en) * 2013-12-05 2016-09-06 Tokitae Llc Storage apparatuses and related methods for storing temperature-sensitive items
CN107764113A (zh) * 2016-08-17 2018-03-06 青岛海尔智能技术研发有限公司 换热装置及具有该换热装置的半导体制冷设备
CN209639311U (zh) * 2019-02-21 2019-11-15 佛山市顺德区美的饮水机制造有限公司 热管流动饮用液体半导体制冷系统及制冷设备

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316423A (en) * 1992-12-11 1994-05-31 Kin Daniel C C Acoustic isolation fastener and method for attachment
JPH11132592A (ja) * 1997-10-31 1999-05-21 Koa Corporation:Kk 電子冷却器の冷却方法
KR20070102256A (ko) * 2006-04-14 2007-10-18 잘만테크 주식회사 부품 고정구
US20100002389A1 (en) * 2008-07-01 2010-01-07 Xigmatek Co., Ltd. Fan fastener
CN201497248U (zh) * 2009-08-12 2010-06-02 广东德豪润达电气股份有限公司 制冷装置及电子酒柜
EP3376135A1 (en) * 2017-03-14 2018-09-19 LG Electronics Inc. Refrigerator
CN110462315A (zh) * 2017-03-15 2019-11-15 Lg电子株式会社 冰箱
CN110431368A (zh) * 2017-03-21 2019-11-08 Lg电子株式会社 冰箱
US20190186806A1 (en) * 2017-12-19 2019-06-20 Lg Electronics Inc. Refrigerator
CN111623551A (zh) * 2020-06-12 2020-09-04 广东奥达信制冷科技有限公司 一种制冷系统及制冷设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024002183A1 (zh) * 2022-06-29 2024-01-04 莱尔德热系统(深圳)有限公司 用于半导体制冷片的换热系统
CN115406165A (zh) * 2022-09-08 2022-11-29 中山市凯腾电器有限公司 一种智能多温区冷柜
CN115406165B (zh) * 2022-09-08 2024-03-15 广东凯得智能科技股份有限公司 一种智能多温区冷柜

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