WO2021244290A1

WO2021244290A1 - Optical module heat dissipation assembly and communication device

Info

Publication number: WO2021244290A1
Application number: PCT/CN2021/094578
Authority: WO
Inventors: 伍磊; 闫涛; 王宣强
Original assignee: 华为技术有限公司
Priority date: 2020-06-05
Filing date: 2021-05-19
Publication date: 2021-12-09
Also published as: CN113759474A; CN115857116A; CN113759474B

Abstract

An optical module heat dissipation assembly (200) and a communication device, which are used for improving the heat dissipation efficiency of two optical modules symmetrically arranged on two sides of a circuit board (201). The optical module heat dissipation assembly (200) comprises a first heat dissipation end portion (214) and a second heat dissipation end portion (221) which are opposite in position, wherein the first heat dissipation end portion (214) is connected to a first optical module cage (210), the second heat dissipation end portion (221) is connected to a second optical module cage (220), the first heat dissipation end portion (214) comprises a plurality of heat dissipation teeth (215) arranged at intervals, and the second heat dissipation end portion (221) comprises a plurality of heat dissipation teeth arranged at intervals. Heat conduction is carried out between a first optical module and a second optical module by means of the first heat dissipation end portion (214) and the second heat dissipation end portion (221), thereby improving the heat dissipation efficiency of the optical module heat dissipation assembly (200), effectively preventing stress from damaging the optical module heat dissipation assembly (200), and prolonging the service life.

Description

Optical module heat dissipation component and communication equipment

This application claims the priority of a Chinese patent application filed with the State Intellectual Property Office of China, the application number is 202010506635.4, and the application name is "an optical module heat dissipation assembly and communication equipment" on June 5, 2020, the entire content of which is incorporated by reference In this application.

Technical field

This application relates to the field of optical communications, and in particular to an optical module heat dissipation assembly and communication equipment.

Background technique

In communication equipment with high reliability requirements, optical modules are one of the key components. With the continuous evolution of communication to high speed, large bandwidth, and large traffic, optical modules are in terms of quantity, aggregation, and heat generation of a single module. All of them are constantly developing in the direction of high density, clustering, and high heat. The heat dissipation problem of the optical module caused by this has become more and more difficult.

In the scenario where there are a large number of optical modules that cannot be completely put down on one side of a printed circuit board (PCB), the optical modules will be symmetrically arranged on the front and back sides of the PCB. If the two optical modules are symmetrically arranged on the front and back sides of the PCB When there is a large temperature difference, the optical module on the higher temperature side will become the bottleneck for heat dissipation of the entire communication device, while the optical module on the other side still has a heat dissipation margin.

It can be seen that the solution for heat dissipation of optical modules provided in the prior art has low heat dissipation efficiency for two optical modules symmetrically arranged on both sides of the PCB.

Summary of the invention

The present application provides an optical module heat dissipation assembly and a communication device, which are used to improve the heat dissipation efficiency of two optical modules arranged symmetrically on both sides of a PCB, and effectively increase the service life of the optical module heat dissipation assembly.

In the first aspect, the present application provides an optical module heat dissipation assembly, including a printed circuit board, and a first optical module cage and a second optical module cage located on both sides of the printed circuit board, and the first optical module cage is used for accommodating the first optical module cage. The optical module, the second optical module cage is used for accommodating the second optical module, and the optical module heat dissipation assembly further includes a first heat dissipation end and a second heat dissipation end that are positioned opposite to each other, the first heat dissipation end and the first light The module cage is attached, and the second heat dissipation end is attached to the second optical module cage. If the temperature of the first optical module is higher than that of the second optical module, the first optical module is used to pass heat sequentially through the second optical module. A heat dissipation end and the second heat dissipation end conduct to the second optical module. If the temperature of the second optical module is higher than that of the first optical module, the second optical module is used to transfer heat sequentially through the first optical module. The two heat dissipation ends and the first heat dissipation end conduct conduction to the first optical module; the first heat dissipation end includes a plurality of first heat dissipation teeth arranged at intervals, and there are two adjacent first heat dissipation teeth The first gap, the first heat dissipation tooth is used to deform in the first gap under the action of the pressure of the first heat dissipation end; the second heat dissipation end includes a plurality of second heat dissipation teeth arranged at intervals. There is a second gap between two adjacent second heat dissipation teeth, and the second heat dissipation teeth are used to deform in the second gap under the pressure of the second heat dissipation end.

It can be seen that between the first optical module and the second optical module, heat is conducted through the first heat dissipation end and the second heat dissipation end, so that there is a gap between the temperature of the first optical module and the temperature of the second optical module. In the case of a temperature difference, heat can also be dissipated through the first heat dissipation end and the second heat dissipation end, so that the first optical module and the second optical module can be sufficiently dissipated, and the heat dissipation efficiency of the optical module heat dissipation assembly is improved, and Through the heat dissipation mode of the intercommunication between the first optical module and the second optical module, the heat dissipation balance of the optical module heat dissipation assembly is improved, the reliability of the optical module is improved, and the use time of the optical module is prolonged. Moreover, the stress on the first heat dissipation end can be fully released in the first gap, effectively avoiding the possibility of stress damaging the cage of the first optical module, and the stress on the second heat dissipation end can be fully released in the second gap, effectively This avoids the possibility of stress damaging the second optical module cage, effectively improves the safety of the first optical module cage and the second optical module cage, and increases the service life of the first optical module cage and the second optical module cage. Moreover, the use of multiple first heat dissipation teeth and multiple second heat dissipation teeth effectively avoids heat conduction between the first heat dissipation end and the second heat dissipation end through the air with relatively high thermal resistance, and effectively reduces the first heat dissipation. The thermal resistance between the end and the second heat dissipation end, and during the deformation process of the first heat dissipation tooth and the second heat dissipation tooth, will increase the contact area between the first heat dissipation tooth and the first heat dissipation end, and increase The contact area between the large second heat dissipation tooth and the second heat dissipation end is more conducive to the heat conduction between the first heat dissipation end and the second heat dissipation end, and the heat dissipation efficiency is improved.

With reference to the first aspect, in an optional implementation manner, the first heat dissipation end portion and the second heat dissipation end portion are both made of a thermally conductive material, and the first optical module cage faces the printed circuit board The end face is attached to the first heat dissipation end, and the end face of the second optical module cage facing the printed circuit board is attached to the second heat dissipation end; the printed circuit board includes an opening, and the opening The window penetrates the printed circuit board in a direction perpendicular to the printed circuit board, the first heat dissipation end portion and the second heat dissipation end portion are both inserted into the window and set, and the first The heat dissipation end portion and the second heat dissipation end portion are positioned opposite to each other in a direction perpendicular to the printed circuit board.

It can be seen that both the first heat dissipation end portion and the second heat dissipation end portion are inserted into the opening of the printed circuit board, thereby effectively realizing the position alignment between the first heat dissipation end portion and the second heat dissipation end portion and avoiding Therefore, the position between the first heat dissipation end portion and the second heat dissipation end portion is staggered, which results in a situation in which the first heat dissipation end portion and the second heat dissipation end portion cannot achieve intercommunication heat dissipation performance.

With reference to the first aspect, in an optional implementation manner, a first elastic member made of a thermally conductive material is provided in the first optical module cage, and the first elastic member is located between the first optical module and the The first elastic member, which is in a compressed state between the first heat dissipation ends, is simultaneously attached to the first optical module and the first heat dissipation end; the second optical module cage is provided with a thermally conductive material The second elastic part is made, the second elastic part is located between the second light module and the second heat dissipation end, and the second elastic part is in a compressed state at the same time as the second light The module is attached to the second heat dissipation end.

It can be seen that the first elastic member is tightly attached to the first heat dissipation end and the first optical module, and the first optical module can conduct heat to the first heat dissipation end through the first elastic member. Because the conduction process is carried out through the first elastic member made of heat-conducting material, the disadvantage that the heat of the first optical module is conducted to the first heat dissipation end through the air with high thermal resistance is avoided, thereby effectively reducing the first heat dissipation end. The thermal resistance of an optical module in the process of conducting heat to the first heat dissipation end. For the description of the beneficial effects of using the second elastic member, please refer to the description of the first elastic member for details, and will not be repeated.

With reference to the first aspect, in an optional implementation manner, the first elastic member includes a first fixed end and a first elastic end that are connected to each other, and the first fixed end is fixedly connected to the first heat dissipation end. Toward the end surface of the first optical module, the first elastic end extends between the first heat dissipation end and the first optical module; the second elastic member includes a second fixed end and The second elastic end, the second fixed end is fixedly connected to the end surface of the second heat dissipation end facing the second optical module, and the second elastic end extends between the second heat dissipation end and the first optical module. Between two optical modules.

It can be seen that the first fixed end is fixedly connected to the end surface of the first heat dissipation end facing the first optical module, and the first fixed end effectively ensures that the first elastic member and the first optical module cage The stability of the structure prevents the first elastic member from detaching from the first optical module cage. The first elastic end extends between the first heat dissipation end and the first optical module, and The first elastic end can be freely deformed under the action of pressure, so that when the first elastic end is deformed, the heat of the first optical module can be conducted to the first heat dissipation end, and the conduction process has low thermal resistance . For the description of the beneficial effects of using the second elastic member, please refer to the description of the first elastic member for details, and will not be repeated.

With reference to the first aspect, in an optional implementation manner, the optical module heat dissipation assembly further includes a heat conduction middle piece made of a heat conduction material, and the heat conduction middle piece is located at the first heat dissipation end and the second heat dissipation end. Between the heat-dissipating end portions, and both sides of the thermally conductive intermediate piece are attached to the first heat-dissipating end portion and the second heat-dissipating end portion.

It can be seen that the heat conduction between the first heat dissipation end portion and the second heat dissipation end portion is carried out through the heat conduction middle piece, which reduces the heat transfer between the first heat dissipation end portion and the second heat dissipation end portion. Thermal resistance prevents heat conduction between the first heat dissipation end and the second heat dissipation end through high thermal resistance air, and improves the efficiency of heat conduction between the first heat dissipation end and the second heat dissipation end.

With reference to the first aspect, in an optional implementation manner, the first optical module cage is connected to a first heat sink, the second optical module cage is connected to a second heat sink, and the first optical module is used to pass through the A heat dissipation path and a second heat dissipation path are used for heat dissipation. The first heat dissipation path is for the first optical module to dissipate heat through the first heat sink; if the temperature of the first optical module is higher than that of the second optical module, Module, the second heat dissipation path is for the first optical module to pass through the first optical module cage, the first heat dissipation end, the second heat dissipation end, and the second optical module in sequence The cage, the second optical module and the second heat sink dissipate heat.

It can be seen that the heat dissipation of the first optical module through the first heat dissipation path and the second heat dissipation path can effectively use the second heat sink while effectively improving the heat dissipation efficiency of the first optical module. The heat dissipation margin for the first optical module to dissipate heat, which realizes the balanced heat dissipation between the first optical module and the second optical module when there is a temperature difference between the temperature of the first optical module and the temperature of the second optical module .

With reference to the first aspect, in an optional implementation manner, the first optical module cage is connected to a first heat sink, the second optical module cage is connected to a second heat sink, and the second optical module is used to pass through the Three heat dissipation paths and a fourth heat dissipation path, where the third heat dissipation path is for the second optical module to dissipate heat through the second heat sink; if the temperature of the second optical module is higher than that of the first optical module, Then the fourth heat dissipation path is for the second optical module to pass through the second optical module cage, the second heat dissipation end, the first heat dissipation end, the first optical module cage, The first optical module and the first heat sink dissipate heat.

It can be seen that heat dissipation of the second optical module through the third heat dissipation path and the fourth heat dissipation path can effectively use the first heat sink while effectively improving the heat dissipation efficiency of the second optical module. The heat dissipation margin for the second optical module to dissipate heat, to achieve a balanced heat dissipation between the first optical module and the second optical module when there is a temperature difference between the temperature of the first optical module and the temperature of the second optical module .

With reference to the first aspect, in an optional implementation manner, a first space and a second space exist between the first optical module cage and the second optical module cage, and the first space is used to set the Printed circuit board; the optical module heat dissipation assembly further includes a first intercommunication heat dissipation member made of a thermally conductive material, the first intercommunication heat dissipation member is located in the second space, and the first end of the first intercommunication heat dissipation member It is attached to the first optical module cage, and the second end of the first intercommunication heat sink is attached to the second optical module cage.

It can be seen that the first optical module and the second optical module can also realize the heat dissipation performance of the communication between the first optical module and the second optical module through the first intercommunication heat sink, thereby further improving the heat dissipation efficiency.

With reference to the first aspect, in an optional implementation manner, the first optical module cage has a bottom shell and a first shell, and the first shell is buckled and connected to the bottom shell so as to be connected to the first shell An accommodating space for accommodating the first optical module is formed between the bottom case and the bottom case, the bottom case is disposed toward the printed circuit board, the second optical module cage has a top case and a second outer case, and the The second housing is buckled and connected to the top housing to form an accommodating space for accommodating the second optical module between the second housing and the top housing, and the top housing faces the printed circuit board The optical module heat dissipation assembly further includes a second intercommunication heat dissipation member made of a thermally conductive material, the first end of the second intercommunication heat dissipation member is attached to the first housing, and the second intercommunication heat dissipation member The second end is attached to the second housing.

It can be seen that the first optical module and the second optical module can also realize the heat dissipation performance of the intercommunication between the first optical module and the second optical module through the second intercommunication heat sink, thereby further improving the heat dissipation efficiency.

In a second aspect, the present application provides a communication device, including a cabinet, and the cabinet includes at least one optical module heat dissipation assembly according to any one of the above-mentioned first aspects.

Description of the drawings

Fig. 1 is an example diagram of a side structure of a communication device provided by the prior art;

2 is an example diagram of a side cross-sectional structure of an embodiment of an optical module heat dissipation assembly provided by this application;

FIG. 3 is an example diagram of an overall structure of the first optical module cage provided by this application;

FIG. 4 is an example diagram of a partial structure of the optical module heat dissipation assembly provided by this application;

Fig. 5 is a diagram showing another example of the overall structure of the first optical module cage provided by this application;

Fig. 6 is an example diagram of the bottom surface structure of the first optical module cage provided by this application;

FIG. 7 is an example diagram of a side cross-sectional structure of the first optical module cage provided by this application;

FIG. 8 is an example diagram of a side cross-sectional structure of another embodiment of the optical module heat dissipation assembly provided by this application.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the protection scope of the present invention.

The terms "first", "second", etc. in the description and claims of the application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It should be understood that the components used in this way can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in a sequence other than the content illustrated or described herein. In addition, the terms "including" and "having" and any variations of them are intended to cover non-exclusive inclusions.

This application provides an optical module heat dissipation assembly, which is used to dissipate heat for the optical module. For a better understanding, the structure of a communication device to which the optical module heat dissipation assembly is applied is illustrated below in conjunction with FIG. 1 Sexual description, where Fig. 1 is an example diagram of a side structure of a communication device provided in the prior art.

In order to adapt to the continuous evolution of communication equipment to high speed, large bandwidth, and large traffic, it is necessary for communication equipment to integrate more optical modules as much as possible. Among them, optical modules are a kind of conversion of optical signals into electrical signals and/or An integrated module that converts electrical signals into optical signals plays an important role in the process of optical communication. The optical module generates a large amount of heat during operation. The laser used to generate or receive optical signals in the optical module has relatively strict temperature requirements. In order to ensure the normal operation of optical communication, the heat generated by the optical module needs to be dissipated in time.

As shown in Figure 1, the communication device includes a PCB100, and the communication device integrates more optical modules, then the communication device can have two optical modules symmetrically arranged on both sides of the PCB100, that is, the first optical module is arranged on the first side of the PCB100 In the cage 101, a second optical module cage 102 is provided on the second side of the PCB 100, so that the first optical module cage 101 and the second optical module cage 102 are symmetrical with the PCB 100 as the center.

Specifically, the first optical module cage 101 is used to accommodate the first optical module, and the first optical module cage 101 is connected to the first heat sink 104 through the flexible heat pipe 103, so that the first optical module sequentially passes through the first optical module cage 101 and The flexible heat pipe 103 conducts heat to the first radiator 104, and the first radiator 104 can dissipate the acquired heat. The second optical module cage 102 is used to accommodate the second optical module, and the second optical module cage 102 is connected to the second heat sink 106 through the flexible heat pipe 105, so that the second optical module sequentially passes through the second optical module cage 102 and the flexible heat pipe 105 The heat is conducted to the second radiator 106, and the second radiator 106 can dissipate the acquired heat.

As shown in FIG. 1, only two optical modules symmetrically arranged on both sides of the PCB 100 are used for description, and the arrangement of other optical modules included in the communication device is not described in detail. It can be seen that the communication device shown in FIG. 1 can effectively increase the number of optical modules installed in the communication device through the optical modules symmetrically arranged on both sides of the PCB 100, thereby realizing a high-density layout of the optical modules on the PCB 100, and improving the communication equipment Business volume.

However, the heat dissipation paths of the optical modules symmetrically arranged on both sides of the PCB 100 are isolated from each other. The first optical module shown in FIG. The heat is dissipated by conducting to the second heat sink 106, which results in uneven heat dissipation of the optical modules located on both sides of the PCB. The specific description is shown in the following example:

For example, in a scenario where the temperature of the first optical module and the temperature of the second optical module are relatively large, for example, the temperature of the first optical module is higher, and the temperature of the second optical module is lower, the disadvantage is : First of all, the heat that the first optical module needs to dissipate exceeds the heat dissipation capacity of the first radiator 104, which will cause the first radiator 104 to fail to dissipate the first optical module sufficiently, which reduces the reliability of the first optical module . Secondly, the heat dissipated by the second optical module is lower than the heat dissipation capacity of the second heat sink 106, which will cause the second heat sink 106 to have a heat dissipation margin that is not used, which reduces the heat dissipation efficiency of the second heat sink 106.

In order to solve the disadvantages of the existing communication equipment shown in FIG. 1 in the heat dissipation performance, the present application provides an optical module heat dissipation assembly, which is used to improve the heat dissipation efficiency of the optical modules symmetrically arranged on both sides of the PCB, thereby improving the integrated For the heat dissipation capability of a communication device with multiple optical modules, the following first describes the structure of the optical module heat dissipation assembly provided in this embodiment with reference to FIG. 2, where FIG. 2 is one of the optical module heat dissipation assemblies provided by this application Example side view sectional structure diagram of the embodiment.

The optical module heat dissipation assembly 200 shown in this embodiment includes an optical module heat dissipation assembly housing. For example, the optical module heat dissipation assembly housing shown in FIG. 2 specifically includes an upper housing 202 and a lower housing 203, an upper housing 202 and a lower housing The accommodating space formed between 203 is used for accommodating PCB 201.

A first optical module cage 210 and a second optical module cage 220 are provided on both sides of the PCB 201, and the first optical module cage 210 is located between the upper housing 202 and the PCB 201, and the second optical module cage 220 is located between the lower housing 203 and the PCB 201 . The first optical module cage 210 is used for accommodating a first optical module, and the second optical module cage 220 is used for accommodating a second optical module.

The structure of the first optical module cage 210 is exemplarily described below in conjunction with FIG. 2 and FIG. 3, wherein FIG. 3 is an example diagram of an overall structure of the first optical module cage provided in this embodiment.

The side of the first optical module cage 210 facing away from the PCB 201 is provided with a first opening 211. It can be seen that the first opening 211 is positioned opposite to the upper housing 202, and can pass through the first opening when the first optical module is installed. 211 places the first optical module inside the first optical module cage 210. It should be clear that in this embodiment, the first opening 211 is provided on the top surface of the first optical module cage 210 as an example for illustrative description, and it is not limited. In other scenarios, the first optical module cage may be A first opening or the like is provided on the side wall or bottom surface of 210, as long as the first opening can reduce the thermal resistance of the first optical module cage 210. The second optical module cage 220 shown in this embodiment is also provided with a second opening. For a specific description of the second opening, please refer to the first opening 211 for details, and will not be repeated.

A first heat sink for dissipating heat for the first optical module is also provided between the PCB 201 and the upper housing 202 shown in this embodiment. The specific location of the first heat sink is not limited in this embodiment, as long as the first heat sink is The heat sink can dissipate the heat of the first optical module located in the first optical module cage 210.

The following is an exemplary description of how the first heat sink specifically dissipates heat from the first optical module. The first heat conducting member 213 is provided in the first opening 211 shown in this embodiment, and the first heat conducting member shown in this embodiment is 213 is made of a thermally conductive material, and the thermally conductive material can be a thermally conductive gel, a thermally conductive pad, a carbon fiber thermally conductive pad, a phase change thermally conductive material, a thermally conductive potting glue, a thermally conductive silicone grease, or a graphite temperature equalizing sheet, etc., which are not specifically limited. This embodiment does not limit the thermal conductivity of the thermally conductive material. For example, the thermal conductivity is not less than 330 watts/meter·degree (W/m.K), and for example, the thermal conductivity is not less than 180 W/m.K.

One end of the first heat-conducting member 213 shown in this embodiment is attached to the first optical module, and the other end is connected to the first heat sink. Optionally, the first heat-conducting member 213 may be directly connected to the first heat sink. , The first heat-conducting member 213 can be indirectly connected to the first radiator through a flexible heat pipe, etc., which is not specifically limited in this embodiment, as long as the first heat-conducting member 213 can obtain heat from the first optical module and conduct the heat to The first radiator is enough. The heat dissipation assembly of the optical module shown in this embodiment further includes a second heat sink, which is used to dissipate heat from the second optical module. For a specific description of the second heat sink, please refer to the first heat sink for details. The description of the module's heat dissipation will not be repeated.

In this embodiment, in order to improve the heat dissipation efficiency of the optical modules symmetrically arranged on both sides of the PCB 201, it is shown in conjunction with FIG. 2 and FIG. 4, where FIG. 4 is an example of a partial structure of the optical module heat dissipation assembly provided by this embodiment picture. In this embodiment, an opening 204 is provided through the PCB 201, and the opening 204 extends in a direction perpendicular to the PCB 201 (the arrow direction shown in FIG. 4).

With reference to Figure 2, Figure 5 and Figure 6, the first optical module cage 210 shown in this embodiment is attached to the end face of the PCB 201 and is provided with a first heat dissipation end 214 made of a thermally conductive material. Optionally, this embodiment The bonding arrangement shown in the example may refer to welding the first heat dissipation end 214 to the end surface of the first optical module cage 210 facing the PCB 201. It can be seen that the first heat dissipation end 214 and the first heat dissipation end 214 in this case are The optical module cages 210 are in a fixed connection relationship. Optionally, the bonding arrangement shown in this embodiment may also refer to that the first heat dissipation end 214 and the first optical module cage 210 are two independent components, and the first heat dissipation end 214 is under pressure. (For example, pressure from the first optical module cage 210), to realize the adhesion between the first optical module cages 210.

The second optical module cage 220 shown in this embodiment is attached to the end surface of the PCB 201 and is provided with a second heat dissipation end 221. For the description, please refer to the description of the bonding arrangement between the first heat dissipation end 214 and the first optical module cage 210 for details, and will not be repeated.

The first heat dissipation end portion 214 extends along a direction perpendicular to the PCB 201, and the first heat dissipation end portion 214 is inserted into the window 204. The second heat dissipation end portion 221 extends in a direction perpendicular to the PCB 201, and the second heat dissipation end portion 221 is inserted into the window 204. Combining the first heat dissipation end portion 214 and the second heat dissipation end portion 221, it can be seen that in the window 204, the first heat dissipation end portion 214 and the second heat dissipation end portion 221 are positioned opposite to each other in a direction perpendicular to the PCB 201.

When the first heat dissipation end portion 214 and the second heat dissipation end portion 221 are inserted into the opening 204, the position alignment between the first heat dissipation end portion 214 and the second heat dissipation end portion 221 is effectively realized. It is avoided that the position between the first heat dissipation end portion 214 and the second heat dissipation end portion 221 is misaligned, which results in a situation where the first heat dissipation end portion 214 and the second heat dissipation end portion 221 cannot achieve intercommunication heat dissipation performance.

In this embodiment, the first optical module can not only dissipate heat through the first radiator, but also through the second optical module, and the second optical module can not only radiate heat through the second radiator, but also through the first optical module. The module performs heat dissipation, that is, based on the first heat dissipation end 214 and the second heat dissipation end 221 to realize the intercommunication and heat dissipation between the first optical module and the second optical module, the intercommunication between the first optical module and the second optical module will be performed as follows The process of heat dissipation is explained:

First, the heat dissipation path of the first optical module is described:

The first optical module shown in this embodiment has two heat dissipation paths, namely a first heat dissipation path and a second heat dissipation path. The first heat dissipation path is: the first optical module conducts heat through the first heat conducting member 213 To the first radiator, the first radiator can dissipate the heat of the first optical module.

The first optical module shown in this embodiment can also dissipate heat through the second heat dissipation path. The prerequisites for the second heat dissipation path are described below:

Prerequisite: The difference between the temperature of the first optical module and the temperature of the second optical module is relatively large, and the temperature of the first optical module is higher than the temperature of the second optical module. The heat dissipation of the first optical module will lead to the situation that the first optical module cannot be sufficiently dissipated and the heat dissipation margin of the second heat sink cannot be fully used. However, the first optical module shown in this embodiment can not only The heat is dissipated through the first heat dissipation path, and the heat may also be dissipated through the second heat dissipation path, thereby effectively ensuring sufficient heat dissipation of the first optical module, so as to improve the heat dissipation efficiency of the heat dissipation of the optical module.

Wherein, the second heat dissipation path is: the first optical module is used to sequentially pass through the first optical module cage 210, the first heat dissipation end 214, the second heat dissipation end 221, and the second optical module cage 220 and the second optical module, conduct the heat to be dissipated by the first optical module to the second radiator, and the second radiator can dissipate the heat from the first optical module.

It can be seen that, in this embodiment, when the temperature of the first optical module is higher than the temperature of the second optical module, the first optical module can dissipate heat from the first optical module through the first heat sink, and can also use the The first heat dissipation end portion 214 and the second heat dissipation end portion 221 located opposite to each other in the window 204 conduct heat to the second heat sink for heat dissipation. The first heat dissipation path and the second heat dissipation path are An optical module dissipates heat. Under the condition that the heat dissipation efficiency of the first optical module is effectively improved, the heat dissipation margin of the second heat sink can also be effectively used to dissipate the first optical module. In the case that there is a temperature difference between the temperature of one optical module and the temperature of the second optical module, balanced heat dissipation between the first optical module and the second optical module.

Secondly, the heat dissipation path of the second optical module is described:

The second optical module shown in this embodiment has two heat dissipation paths, namely a third heat dissipation path and a fourth heat dissipation path. The third heat dissipation path is: the second optical module conducts heat to The second heat sink, the second heat sink can dissipate the heat of the second optical module. For the specific description of the second heat-conducting member, please refer to the description of the first heat-conducting member 213 shown above for details, and the details will not be repeated. .

The second optical module shown in this embodiment can also perform heat dissipation through the fourth heat dissipation path. The prerequisites of the fourth heat dissipation path are described below:

Prerequisite: The difference between the temperature of the first optical module and the temperature of the second optical module is relatively large, and the temperature of the second optical module is higher than the temperature of the first optical module. Dissipating heat by the second optical module will result in a situation where the second optical module cannot be sufficiently dissipated and the heat dissipation margin of the first heat sink cannot be fully used. However, the second optical module shown in this embodiment can not only Heat dissipation is conducted through the third heat dissipation path, and heat dissipation may also be conducted through the fourth heat dissipation path, thereby effectively ensuring sufficient heat dissipation of the first optical module. The fourth heat dissipation path includes: the second optical module is used to sequentially pass through The second optical module cage 220, the second heat dissipation end portion 221, the first heat dissipation end portion 214, the first optical module cage 210, and the first optical module dissipate the second optical module The heat is conducted to the first radiator.

It can be seen that, in this embodiment, when the temperature of the second optical module is higher than the temperature of the first optical module, the second optical module can dissipate heat from the second optical module through the second heat sink, and can also use the The first heat dissipation end portion 214 and the second heat dissipation end portion 221 located opposite to each other in the window 204 conduct heat to the first heat sink for heat dissipation through the third heat dissipation path and the fourth heat dissipation path Heat dissipation of the second optical module, while effectively improving the heat dissipation efficiency of the second optical module, can also effectively use the heat dissipation margin of the first heat sink to dissipate heat from the second optical module, thereby realizing In the case where there is a temperature difference between the temperature of the first optical module and the temperature of the second optical module, balanced heat dissipation between the first optical module and the second optical module.

The first heat dissipation end portion 214 and the second heat dissipation end portion 221 shown in this embodiment can also fully release the stress, effectively avoiding damage to the components included in the optical module heat dissipation assembly due to the effect of stress. And it can effectively improve the heat dissipation efficiency, as follows:

As shown in FIG. 2 and FIG. 5, the first heat dissipation end 214 includes a plurality of first heat dissipation teeth 215 arranged at intervals, and the plurality of first heat dissipation teeth 215 shown in this embodiment extend into the opening 204 and are arranged. It can be seen that the end of each first heat dissipating tooth 215 is opposite to the second heat dissipating end 221. The specific shape of the first heat dissipating tooth 215 is not limited in this embodiment. For example, each first heat dissipating tooth 215 may be long. Bar, cylindrical, conical, etc.

Specifically, among the plurality of first heat dissipation teeth 215 included in the first heat dissipation end portion 214, there is a first gap 216 between any two adjacent first heat dissipation teeth 215. The shape and depth are not limited. The function of the first gap 216 is described below:

First, the first heat dissipation end portion 214 is subject to stress: specifically, the first heat dissipation end portion 214 is made of a thermally conductive material with a certain degree of elasticity. When the first optical module cage 210 is mounted on the PCB 201 , The first optical module cage 210 exerts a force on the first heat dissipation end portion 214 toward the PCB 201, and this force causes the first heat dissipation end portion 214 to generate stress, and the direction of the stress is far away from the PCB 201 direction.

Secondly, the disadvantages of stress are explained: specifically, the stress in the direction away from the PCB 201 acts on the first optical module cage 210, which will increase the possibility of damaging the first optical module cage 210, for example, as shown in FIG. 5 , The first optical module cage 210 includes pins 217. When the first optical module cage 210 needs to be installed on the PCB 201, the pins 217 need to be inserted and damaged on the PCB 201, so as to realize the fixation of the first optical module cage 210 The purpose on PCB201. However, when the first optical module cage 210 is subjected to the stress from the first heat dissipation end 214, the pin 217 will receive a force away from the PCB 201, which is very easy to damage the pin 217, resulting in the pin 217 It is damaged, thereby reducing the stability of the structure between the first optical module cage 210 and the PCB 201.

Once again, the function of the first heat dissipation teeth 215 is described: it can be seen that in order to avoid the possibility of damage to the first optical module cage 210, the stress generated by the first heat dissipation end 214 needs to be released as much as possible, so as The avoidance application is applied to the first optical module cage 210 to avoid damage to the devices included in the first optical module cage 210. For this reason, as shown in this embodiment, the first heat dissipation end 210 is provided with a plurality of first heat dissipation teeth 215 arranged at intervals toward the end surface of the PCB 201. When the first optical module cage 210 is mounted on the PCB 201, the first A heat dissipating tooth 215 is stressed by the first optical module cage 210, and the first heat dissipating tooth 215 will deform in a direction parallel to the PCB 201 under the action of the stress. However, due to the two adjacent first heat dissipating teeth There is a first gap 216 between 215, so that the first heat dissipating teeth 215 can be freely deformed in the first gap 216, and the first heat dissipating teeth 215 that can be freely deformed in the first gap 216 will fully stress the Release. After the stress of each first heat dissipation tooth 215 is released through the first gap 216, the stress of the first heat dissipation end 214 will not or rarely act on the first optical module cage 210, thereby effectively avoiding Damage to the first optical module cage 210.

The second heat dissipation end portion 221 shown in this embodiment also includes a plurality of second heat dissipation teeth arranged at intervals. For the description of the second heat dissipation teeth, please refer to the description of the first heat dissipation teeth 215, which will not be repeated.

It can be seen that the use of the plurality of first heat dissipation teeth 215 and the plurality of second heat dissipation teeth shown in this embodiment effectively avoids the passage of air with relatively high thermal resistance between the first heat dissipation end 214 and the second heat dissipation end 221. Conducting heat conduction effectively reduces the thermal resistance between the first heat dissipation end 214 and the second heat dissipation end 221, and increases the first heat dissipation during the deformation of the first heat dissipation teeth 215 and the second heat dissipation teeth. The contact area between the teeth and the first heat dissipation end 214 and the increase in the contact area between the second heat dissipation teeth and the second heat dissipation end are more conducive to the difference between the first heat dissipation end 214 and the second heat dissipation end 221 The heat conduction between them improves the heat dissipation efficiency.

In order to improve the heat dissipation efficiency of the heat dissipation component of the optical module, it is necessary to reduce the thermal resistance of the heat dissipation component of the optical module. The following describes several alternative ways of reducing the thermal resistance of the heat dissipation component of the optical module shown in this embodiment:

Way 1

As shown in FIG. 2, FIG. 3, and FIG. 7, FIG. 7 is an example diagram of a side cross-sectional structure of an embodiment of the first optical module cage provided by this embodiment. The first optical module cage 210 is provided with a first elastic member 301 made of a thermally conductive material. The first elastic member 301 is located between the first optical module 302 and the first heat dissipation end 214 and passes The first elastic member 301 realizes a close fit between the first optical module and the first heat dissipation end 214, thereby effectively reducing the thermal resistance between the first optical module and the first heat dissipation end 214.

Specifically, this embodiment does not limit the specific shape of the first elastic member 301, as long as the first elastic member 301 has an elastic structure, for example, the first elastic member 301 may be a tongue or a spring. When the first optical module 302 is not installed inside the first optical module cage 210 (as shown on the left side of FIG. 7), the first elastic member 301 is in a naturally extended state, and the first optical module 302 is installed in the first optical module. When the module cage 210 is inside (as shown on the right side of FIG. 7), the first elastic member 301 is deformed by the pressure of the first optical module 302, so that the first elastic member 301 in a compressed state resists the first heat sink. Between the end 214 and the first optical module 302, so that the first elastic member 301 is closely attached to the first heat dissipation end 214 and the first optical module 302, respectively, and the first optical module 302 That is to say, the heat is conducted to the first heat dissipation end 214 through the first elastic member 301, because the conduction process is performed through the first elastic member 301 made of a thermally conductive material, thereby preventing the heat of the first optical module 302 from passing through The disadvantage that the air with high thermal resistance conducts to the first heat dissipation end 214 effectively reduces the thermal resistance during the heat conduction of the first optical module 302 to the first heat dissipation end 214.

This embodiment does not limit the arrangement of the first elastic member 301, as long as the first elastic member 301 is located between the first optical module 302 and the first heat dissipation end 214. For example, as shown in FIG. 7, the The first elastic member 301 includes a first fixed end 303 and a first elastic end 304 that are connected to each other. The first fixed end 303 is welded to the end surface of the first heat dissipation end 214 facing the first optical module 302 through The first fixed end 303 effectively ensures the stability of the structure between the first elastic member 301 and the first optical module cage 210, and prevents the first elastic member 301 from detaching from the first optical module cage 210. The first elastic end 304 extends between the first heat dissipation end portion 214 and the first optical module 302, and the first elastic end 304 can be freely deformed under the action of pressure, so that the first elastic end When the 304 is deformed, the purpose of being able to conduct the heat of the first optical module 302 to the first heat dissipation end 214.

The second optical module cage 220 shown in this embodiment includes a second elastic member. For the description of the second elastic member, please refer to the description of the first elastic member 301 shown above for details, and details are not repeated.

Way 2

As shown in FIG. 2, the optical module heat dissipation assembly 200 further includes a thermally conductive middle piece 230 made of a thermally conductive material, and the thermally conductive middle piece 230 is located at the first heat dissipation end 214 and the second heat dissipation end 221 , And both surfaces of the thermally conductive middle piece 230 are attached to the first heat dissipation end portion 214 and the second heat dissipation end portion 221.

This embodiment does not limit the specific shape of the heat-conducting middle piece 230, as long as one side of the heat-conducting middle piece 230 is attached to the first heat dissipation end 214, and the other side of the heat-conducting middle piece 230 is connected to the second heat dissipation end 214. The heat-dissipating end 221 can be attached to each other, so that the first heat-dissipating end 214 and the second heat-dissipating end 221 conduct heat conduction through the heat-conducting middle piece 230, which reduces the first heat-dissipating end 214 and the second heat-dissipating end 214. The thermal resistance during heat conduction between the two heat dissipation ends 221 prevents the heat conduction between the first heat dissipation end 214 and the second heat dissipation end 221 through high thermal resistance air, which improves the first heat dissipation end 214 and the second heat dissipation end 221. The efficiency of heat conduction between the second heat dissipation ends 221.

In the above embodiment, heat is conducted between the first optical module and the second optical module through the first heat dissipation end and the second heat dissipation end located in the PCB window, so that the temperature of the first optical module and the second When there is a temperature difference between the temperatures of the two optical modules, heat can also be dissipated through the first heat dissipation end and the second heat dissipation end, so that the first and second optical modules can be sufficiently dissipated, and the light can be improved. The heat dissipation efficiency of the module's heat dissipation components, and the heat dissipation method that communicates between the first optical module and the second optical module, improves the heat dissipation balance of the optical module's heat dissipation components, improves the reliability of the optical module, and extends the usage time.

For example, taking the electric power of the first optical module and the second optical module as 3 watts (w), and taking the temperature of the first optical module and the temperature of the second optical module as an example, the difference between the temperature of the first optical module and the temperature of the second optical module is 5℃. In the case of the existing solution shown in 1, taking the first optical module as an example, the temperature of the first optical module can be lowered to T1, and in the case of the optical module heat dissipation assembly shown in this embodiment, the first optical module can be reduced The temperature of an optical module is reduced to T2, and T1 is higher than T2. It can be seen that the use of the optical module heat dissipation assembly shown in this embodiment can effectively improve the heat dissipation efficiency of the optical module, even if the single-point heat consumption of the optical module continues Enlarged, it can also effectively dissipate the heat of the optical module.

In order to improve the heat dissipation efficiency of the optical module heat dissipating assembly on the optical module, several optional heat dissipation methods included in the optical module heat dissipating assembly are described below.

Way 1

As shown in FIG. 4, there is a first space 401 and a second space 402 parallel to each other between the first optical module cage 210 and the second optical module cage 220, and the first space 401 is used to set the PCB201, for the specific description of PCB201, please refer to the above-mentioned embodiment for details, and will not be repeated.

The optical module heat dissipation assembly further includes a first intercommunication heat dissipation member 403 made of a thermally conductive material. The first intercommunication heat dissipation member 403 is located in the second space 402, that is, the first intercommunication heat dissipation member 403 is located in the second space 402. Between the first optical module cage 210 and the second optical module cage 220, and the first end of the first intercommunication heat sink 403 is attached to the first optical module cage 210, the first intercommunication heat dissipation member The second end of 403 is attached to the second optical module cage 220.

It can be seen that the first optical module and the second optical module can also realize the heat dissipation performance of the intercommunication between the first optical module and the second optical module through the first intercommunication heat sink 403 shown in this manner, thereby further improving the heat dissipation efficiency. Ground, when the temperature of the first optical module is higher than the temperature of the second optical module, the first optical module can pass through the first optical module cage 210, the first intercommunication heat sink 403, and the second optical module in sequence. The optical module cage 220 and the second optical module conduct heat to the second heat sink. In the case that the temperature of the second optical module is higher than the temperature of the first optical module, the second optical module can pass through the second optical module cage 220, the first intercommunication heat sink 403, and the first optical module in sequence. The cage 210 and the first optical module conduct heat to the first radiator.

Way 2

5 and 8, the first optical module cage 210 has a bottom shell 801 and a first shell 802. The first shell 802 is buckled and connected to the bottom shell 801, and the bottom shell 801 faces the bottom shell 801. The PCB 201 is arranged, and an accommodating space for accommodating the first optical module is formed between the first housing 802 and the bottom housing 801. In this embodiment, the overall shape of the first optical module cage 210 formed by the bottom shell 801 and the first outer shell 802 formed by buckling with each other is not limited, as long as the first optical module cage can accommodate the first optical module. Module is fine.

The second optical module cage 220 has a top shell 803 and a second shell. For the description of the second shell, please refer to the description of the first shell 802, and details are not repeated. The second housing and the top housing 803 are buckled and connected to form an accommodating space for accommodating the second optical module between the second housing and the top housing 803, wherein the top housing 803 is arranged facing the PCB201.

The optical module heat dissipation assembly shown in this embodiment further includes a second intercommunication heat dissipation member 800 made of a thermally conductive material. The first end of the second intercommunication heat dissipation member 800 is connected to the first housing 802, and the The second end of the second intercommunication heat sink 800 is connected to the second housing.

This embodiment does not limit the specific shape of the second intercommunicating heat sink 800. The second intercommunicating heat sink 800 can be connected to the first housing 802 and the second housing at the same time, for example, the second intercommunicating heat sink 800 800 is a flexible heat pipe. The second intercommunication heat sink 800 shown in this embodiment can achieve the heat dissipation performance of the intercommunication between the first optical module and the second optical module, thereby further improving the heat dissipation efficiency. In the case where the temperature of the module is higher than the temperature of the second optical module, the first optical module can pass through the first optical module cage 210, the second intercommunication heat sink 800, the second optical module cage 220, and all the modules in sequence. The second optical module conducts heat to the second heat sink. When the temperature of the second optical module is higher than the temperature of the first optical module, the second optical module may pass through the second optical module cage 220, the second intercommunication heat sink 800, and the first optical module in sequence. The cage 210 and the first optical module conduct heat to the first radiator.

As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, a person of ordinary skill in the art should understand that: The technical solutions recorded in the embodiments are modified, or some of the technical features are equivalently replaced; these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

An optical module heat dissipation assembly, which is characterized by comprising a printed circuit board, and a first optical module cage and a second optical module cage located on both sides of the printed circuit board, and the first optical module cage is used for accommodating the first optical module. Module, the second optical module cage is used for accommodating the second optical module, the optical module heat dissipation assembly further includes a first heat dissipation end and a second heat dissipation end that are positioned opposite to each other, the first heat dissipation end and the The first optical module cage is attached, and the second heat dissipation end is attached to the second optical module cage. If the temperature of the first optical module is higher than that of the second optical module, the first optical module It is used to conduct heat to the second optical module via the first heat dissipation end and the second heat dissipation end in sequence, and if the temperature of the second optical module is higher than that of the first optical module, then The second optical module is configured to conduct heat to the first optical module via the second heat dissipation end and the first heat dissipation end in sequence;

The first heat dissipation end includes a plurality of first heat dissipation teeth arranged at intervals, a first gap exists between two adjacent first heat dissipation teeth, and the first heat dissipation teeth are used to dissipate heat in the first heat dissipation. The end portion is deformed in the first gap under the pressure of the end portion; the second heat dissipation end portion includes a plurality of second heat dissipation teeth arranged at intervals, and there is a second heat dissipation tooth between two adjacent second heat dissipation teeth. Two gaps, the second heat dissipation teeth are used to deform in the second gap under the action of the pressure of the second heat dissipation end.
The optical module heat dissipation assembly according to claim 1, wherein the first heat dissipation end portion and the second heat dissipation end portion are both made of a thermally conductive material, and the first optical module cage faces the printed circuit The end face of the board is attached to the first heat dissipation end, and the end face of the second optical module cage facing the printed circuit board is attached to the second heat dissipation end;

The printed circuit board includes an open window, the open window is disposed through the printed circuit board in a direction perpendicular to the printed circuit board, and the first heat dissipation end portion and the second heat dissipation end portion are both inserted in The first heat dissipation end portion and the second heat dissipation end portion are positioned opposite to each other in a direction perpendicular to the printed circuit board.
The optical module heat dissipation assembly according to claim 1 or 2, wherein a first elastic member made of a thermally conductive material is provided in the first optical module cage, and the first elastic member is located in the first optical module. Between the module and the first heat dissipation end, the first elastic member in a compressed state is simultaneously attached to the first optical module and the first heat dissipation end; in the second optical module cage A second elastic member made of a thermally conductive material is provided, and the second elastic member is located between the second optical module and the second heat dissipation end, and the second elastic member in a compressed state is at the same time as the second elastic member. The second optical module is attached to the second heat dissipation end.
The optical module heat dissipation assembly of claim 3, wherein the first elastic member comprises a first fixed end and a first elastic end that are connected to each other, and the first fixed end is fixedly connected to the first heat sink. The end faces the end surface of the first optical module, and the first elastic end extends between the first heat dissipation end and the first optical module; the second elastic member includes a second fixing that is connected to each other End and a second elastic end, the second fixed end is fixedly connected to the end surface of the second heat dissipation end facing the second optical module, and the second elastic end extends between the second heat dissipation end and the second optical module. Between the second optical modules.
The optical module heat dissipation assembly according to any one of claims 1 to 4, wherein the optical module heat dissipation assembly further comprises a heat-conducting middle piece made of a heat-conducting material, and the heat-conducting middle piece is located in the first heat sink. Between the end portion and the second heat dissipation end portion, and both surfaces of the thermally conductive intermediate piece are attached to the first heat dissipation end portion and the second heat dissipation end portion.
The optical module heat dissipation assembly according to any one of claims 1 to 5, wherein the first optical module cage is connected to a first heat sink, the second optical module cage is connected to a second heat sink, and the first optical module cage is connected to a second heat sink. An optical module is used to dissipate heat through a first heat dissipation path and a second heat dissipation path. The first heat dissipation path is for the first optical module to dissipate heat through the first heat sink; if the temperature of the first optical module is Higher than the second optical module, the second heat dissipation path is for the first optical module to pass through the first optical module cage, the first heat dissipation end, and the second heat dissipation end in sequence , The second optical module cage, the second optical module and the second heat sink dissipate heat.
The optical module heat dissipation assembly according to any one of claims 1 to 5, wherein the first optical module cage is connected to a first heat sink, the second optical module cage is connected to a second heat sink, and the first optical module cage is connected to a second heat sink. The second optical module is used to pass through a third heat dissipation path and a fourth heat dissipation path, where the third heat dissipation path is for the second optical module to dissipate heat through the second heat sink; if the temperature of the second optical module is higher than For the first optical module, the fourth heat dissipation path is for the second optical module to pass through the second optical module cage, the second heat dissipation end, the first heat dissipation end, and the second optical module in sequence. The first optical module cage, the first optical module and the first heat sink dissipate heat.
The optical module heat dissipation assembly according to any one of claims 1 to 7, wherein a first space and a second space exist between the first optical module cage and the second optical module cage, and the first A space for arranging the printed circuit board;

The optical module heat dissipation assembly further includes a first intercommunication heat dissipation member made of a thermally conductive material, the first intercommunication heat dissipation member is located in the second space, and a first end of the first intercommunication heat dissipation member is connected to the second space. An optical module cage is attached, and the second end of the first intercommunication heat sink is attached to the second optical module cage.
The optical module heat dissipation assembly according to any one of claims 1 to 8, wherein the first optical module cage has a bottom shell and a first shell, and the first shell is buckled and connected to the bottom shell, A accommodating space for accommodating the first optical module is formed between the first housing and the bottom case, the bottom case is disposed toward the printed circuit board, and the second optical module cage has a top case And a second housing, the second housing is buckled and connected with the top housing to form an accommodating space for accommodating the second optical module between the second housing and the top housing, and the top The shell is arranged toward the printed circuit board;

The optical module heat dissipation assembly further includes a second intercommunication heat dissipation member made of a thermally conductive material, a first end of the second intercommunication heat dissipation member is attached to the first housing, and a second communication member The end is attached to the second housing.
A communication device, which is characterized by comprising a cabinet, and at least one optical module heat dissipation assembly according to any one of claims 1 to 9 is contained in the cabinet.