WO2021237772A1 - 电路板、传输线及电子设备 - Google Patents

电路板、传输线及电子设备 Download PDF

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Publication number
WO2021237772A1
WO2021237772A1 PCT/CN2020/094375 CN2020094375W WO2021237772A1 WO 2021237772 A1 WO2021237772 A1 WO 2021237772A1 CN 2020094375 W CN2020094375 W CN 2020094375W WO 2021237772 A1 WO2021237772 A1 WO 2021237772A1
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Prior art keywords
layer
mpi
substrate
transmission line
ground
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PCT/CN2020/094375
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English (en)
French (fr)
Inventor
王建安
陈勇利
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AAC Technologies Holdings Shenzhen Co Ltd
AAC Module Technologies Changzhou Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
AAC Module Technologies Changzhou Co Ltd
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Publication of WO2021237772A1 publication Critical patent/WO2021237772A1/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • This application relates to a circuit board, and more particularly to a laminated circuit board and a transmission line and electronic equipment using the circuit board.
  • Planar transmission lines can be used as a kind of Substitutes with application value, and flat transmission lines have high requirements for substrates.
  • the cost of such substrates is very high. The more the number of substrate stacks, the greater the processing complexity, the higher the cost, and the lower the yield rate. Therefore, the thickness of the existing planar transmission line is generally thin, and cannot meet the actual application requirements.
  • the purpose of this application is to provide a circuit board, a transmission line and an electronic device.
  • the present application provides a circuit board, the total thickness of the substrate layer of the electrical circuit board is at least 150 ⁇ m, and includes at least one LCP substrate layer and at least one MPI substrate layer.
  • the electrical circuit board further includes a glue layer arranged between adjacent substrate layers.
  • the wire circuit board further includes a conductive layer disposed on the surface of the substrate layer.
  • the present application also provides a transmission line, including a first ground layer, a second ground layer, and a conductor layer located between the first ground layer and the second ground layer.
  • the first ground layer and the second ground layer The total thickness of the substrate layer between the second grounding layers is at least 150 ⁇ m, and includes at least one LCP substrate layer and at least one MPI substrate layer.
  • At least one MPI substrate layer is provided between the conductor layer and the first ground layer, and at least one LCP substrate layer is provided between the conductor layer and the second ground layer.
  • the transmission line further includes a glue layer arranged between adjacent substrate layers.
  • a first MPI substrate layer and a second MPI substrate layer are sequentially arranged between the first ground layer and the conductor layer, the first MPI substrate layer and the second MPI substrate layer There is also a first glue layer between.
  • a second adhesive layer is further provided between the conductor layer and the second ground layer, and the second adhesive layer is used to connect the second MPI substrate layer and the LCP substrate layer.
  • the first ground layer is a conductive layer formed on the surface of the first MPI substrate layer
  • the conductive layer is a conductive layer formed on the surface of the second MPI substrate layer
  • the second ground The layer is a conductive layer formed on the surface of the LCP substrate layer.
  • the application also provides an electronic device, including the above-mentioned transmission line.
  • the beneficial effects of this application are: by using both MPI substrate and LCP substrate in the circuit board or transmission line, the LCP substrate is used to replace part of the MPI substrate that needs to be stacked in multiple layers to reduce costs and reduce the number of adhesive layers. Simplify the processing procedures and improve the overall performance of the product.
  • Figure 1 is a schematic diagram of the structure of the transmission line of the application
  • FIG. 2 is a schematic structural diagram of another embodiment of the transmission line of this application.
  • Fig. 3 is a schematic diagram of the process of the structure of Fig. 1.
  • an element when an element is referred to as being “fixed on” or “disposed on” another element, the element may be directly on the other element or a centering element may also exist at the same time.
  • an element When an element is referred to as being “connected” to another element, it can be directly connected to the other element or there may be a central element at the same time.
  • the present application provides a transmission line 10 including a first ground layer 11, a second ground layer 12, and a conductor layer 13 located between the first ground layer 11 and the second ground layer 12.
  • the conductor layer 13 is used to transmit signals, such as a signal with a certain wavelength and frequency.
  • the wavelength of the signal transmitted by the conductor layer 13 may be a variable value, that is, the signal transmitted by the conductor layer 13 is in a frequency band.
  • the first ground layer 11 and the second ground layer 12 are conductive layers that can conduct electricity and are used for grounding.
  • the material of the conductor layer 13, the first ground layer 11 and the second ground layer 12 may include conductive metals or alloys, preferably copper materials.
  • the first ground layer 11 and the second ground layer 12 are arranged parallel to each other in this embodiment, and form a strip line with the conductor layer 13.
  • a substrate layer 14 is provided between the first ground layer 11 and the second ground layer 12.
  • the total thickness of the substrate layer 14 is at least 150 ⁇ m, and the dielectric constant is 3.2-3.4, preferably, the dielectric constant is 3.3.
  • the substrate layer 14 includes at least one MPI substrate layer and at least one LCP substrate layer.
  • the conductive layer 13, the first ground layer 11 and the second ground layer 12 are all conductive layers formed on the surface of a certain substrate layer 14.
  • the total thickness of the substrate layer between the first ground layer 11 and the second ground layer 12 is 200 ⁇ m.
  • the substrate layer between the first ground layer 11 and the conductor layer 13 is a first MPI substrate layer 141 and a second MPI substrate layer 142, and the thickness of the first MPI substrate layer 141 is 50 ⁇ m.
  • the thickness of the second MPI base layer 142 is 25 ⁇ m.
  • a first adhesive layer 143 is further provided between the conductor layer 13 and the first ground layer 11, and the first adhesive layer 143 has a thickness of 25 ⁇ m, and is arranged on the first MPI substrate layer 141 and the second MPI substrate layer 142 between.
  • the substrate layer between the conductor layer 13 and the second ground layer 12 is a layer of LCP substrate layer 144, the thickness of the LCP substrate layer 144 is 75 ⁇ m; the conductor layer 13 and the second ground layer A second adhesive layer 145 is also provided between the 12, and the second adhesive layer 145 has a thickness of 25 ⁇ m and is used to connect the second MPI substrate layer 142 and the LCP substrate layer 144.
  • the first adhesive layer 143 and the second adhesive layer 145 are both high-frequency adhesive layers.
  • the first MPI substrate layer 141 is connected to the first ground layer 11, and the second MPI substrate layer 142 and the second adhesive layer 145 are both connected.
  • the first ground layer 11 is formed on the surface of the first MPI substrate layer 141
  • the conductor layer 13 is formed on the surface of the second MPI substrate layer 142
  • the second ground layer 12 is formed on the LCP.
  • the surface of the substrate layer 144 is a layer of LCP substrate layer 144.
  • the total thickness of the substrate layer between the first ground layer 11 and the second ground layer 12 is 150 ⁇ m.
  • the substrate layer between the first ground layer 11 and the conductor layer 13 is a layer of MPI substrate layer 146, the thickness of the MPI substrate layer 146 is 50 ⁇ m; the conductor layer 13 and the second ground layer 12
  • the base material layer between is a layer of LCP base material layer 147, the thickness of the LCP base material layer 147 is 75 ⁇ m; there is a layer of glue between the MPI base material layer 146 and the LCP base material layer 147
  • the thickness of the adhesive layer 148 is 25 ⁇ m.
  • a technical solution of a transmission line in the prior art is to use only the MPI substrate as the substrate layer.
  • the cost of this solution will increase after the stack is increased.
  • the MPI substrate layer currently has a mass production thickness of 50um or less, the cost of 50um or more is higher than the LCP substrate layer. Therefore, in order to achieve a large thickness substrate
  • the method of superimposing the MPI base material layer by layer will increase the processing flow and difficulty.
  • this application uses a combination of MPI substrate layer, high-frequency adhesive layer and LCP substrate layer. In the case of multi-layer stacking, a lower cost LCP substrate layer is used to replace part of the MPI that requires multi-layer stacking.
  • the substrate layer can reduce the number of adhesive layers and reduce the problems of plate bursting and glue flow caused by the adhesion and water absorption of the adhesive layer.
  • the water absorption performance of the LCP substrate layer is about 0.05%, compared with MPI substrate Layer and glue layer can reduce the overall product water absorption.
  • the processes required for the transmission line described in this application are also greatly optimized.
  • the first solution in the prior art uses seven steps of glueing, pressing, etching, glueing, etching, glueing, and pressing.
  • the transmission line described in this application only needs to adopt the four steps of S1 paste, S2 etching, S3 paste, and S4 pressing as described in FIG. 3, which can greatly reduce the process flow and reduce the processing cost.
  • this application provides a transmission line.
  • the LCP substrate is used to replace part of the MPI substrate that requires multiple layers to reduce the cost and reduce the glue layer. Quantity, simplifying processing procedures and improving the overall performance of the product.
  • the present application also provides a circuit board (not shown), the total thickness of the substrate layer of the circuit board is at least 150 ⁇ m, and includes at least one LCP substrate layer and at least one MPI substrate layer.
  • the circuit board further includes a glue layer arranged between adjacent substrate layers.
  • the circuit board further includes a ground layer disposed on the surface of the substrate layer.
  • the total thickness of the substrate layer of the circuit board is 150 ⁇ m
  • the substrate layer includes a layer of LCP substrate layer with a thickness of 75 ⁇ m and a layer of MPI substrate layer with a thickness of 50 ⁇ m.
  • a 25 ⁇ m thick glue layer is also provided between the base material layer and the MPI base material layer.
  • the total thickness of the substrate layer of the circuit board is 200 ⁇ m
  • the substrate layer includes a layer of 75 ⁇ m thickness LCP substrate layer and a layer of 25 ⁇ m thickness arranged in sequence from bottom to top.
  • This application provides a circuit board.
  • the LCP substrate is used to replace part of the MPI substrate that needs to be stacked in multiple layers, so as to reduce costs and reduce the number of adhesive layers. , Simplify the processing procedures and improve the overall performance of the product.
  • the electronic device may be a mobile terminal, such as a mobile phone, and the electronic device includes the above-mentioned transmission line.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本申请公开了一种传输线，包括第一接地层、第二接地层以及位于第一接地层和第二接地层之间的导体层，所述第一接地层和所述第二接地层之间的基材层总厚度至少为150μm，且包括至少一层LCP基材层和至少一层MPI基材层。本申请通过在传输线中同时采用MPI基材和LCP基材的方式，用LCP基材替代部分需要多层叠加的MPI基材，以达到降低成本、减少胶层数量、简化加工工序以及提升产品整体性能的效果。本申请还公开了一种电路板和电子设备。

Description

电路板、传输线及电子设备 技术领域
本申请涉及电路板，尤其涉及一种叠层电路板及应用该电路板的传输线及电子设备。
 背景技术
随着5G及超宽带等技术的兴起，射频传输需求日益增加，现有的同轴传输线布局上需要一定的空间，对于高速发展的终端产品内部布局有一定的局限性，平面传输线可作为一种具有应用价值的替代品，而平面传输线对于基材的要求很高，此类基材的成本很高，且基材叠层数量越多，加工复杂程度越大、成本越高、良品率越低，因此现有的平面传输线厚度普遍偏薄，并不能满足实际的应用需求。
因此，有必要提供一种新的技术方案以解决上述缺陷。
 技术问题
本申请的目的在于提供了一种电路板、传输线及电子设备。
 技术解决方案
为达到上述目的，本申请提供了一种电路板，所述电线路板的基材层总厚度至少为150μm，且包括至少一层LCP基材层和至少一层MPI基材层。
优选的，所述电线路板还包括设置于相邻基材层之间的胶层。
优选的，所述线电路板还包括设置于所述基材层表面的导电层。
为达到上述目的，本申请还提供了一种传输线，包括第一接地层、第二接地层以及位于第一接地层和第二接地层之间的导体层，所述第一接地层和所述第二接地层之间的基材层总厚度至少为150μm，且包括至少一层LCP基材层和至少一层MPI基材层。
优选的，所述导体层与第一接地层之间设有至少一层MPI基材层，所述导体层与第二接地层之间设有至少一层LCP基材层。
优选的，所述传输线还包括设置于相邻基材层之间的胶层。
优选的，所述第一接地层与所述导体层之间依次设有第一MPI基材层和第二MPI基材层，所述第一MPI基材层和所述第二MPI基材层之间还设有第一胶层。
优选的，所述导体层与第二接地层之间还设有第二胶层，所述第二胶层用于连接所述第二MPI基材层和所述LCP基材层。
优选的，所述第一接地层为形成于所述第一MPI基材层表面的导电层，所述导体层为形成于所述第二MPI基材层表面的导电层，所述第二接地层为形成于所述LCP基材层表面的导电层。
本申请还提供了一种电子设备，包括如上所述的传输线。
 有益效果
本申请的有益效果在于：通过在电路板或传输线中同时采用MPI基材和LCP基材的方式，用LCP基材替代部分需要多层叠加的MPI基材，以降低成本、减少胶层数量、简化加工工序以及提升产品的整体性能。
 附图说明
图1为本申请的传输线的结构示意图；
图2为本申请的传输线另一实施例的结构示意图；
图3为图1结构的工艺示意图。
 本发明的实施方式
下面结合附图和实施方式对本申请作进一步说明。
需要说明的是，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后、内、外、顶部、底部……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
还需要说明的是，当元件被称为“固定于”或“设置于”另一个元件上时，该元件可以直接在另一个元件上或者可能同时存在居中元件。当一个元件被称为“连接”另一个元件，它可以是直接连接另一个元件或者可能同时存在居中元件。
请参考图1，本申请提供了一种传输线10，包括第一接地层11、第二接地层12以及位于第一接地层11和第二接地层12之间的导体层13。具体的，所述导体层13用于传输信号，如具有一定波长和频率的信号，所述导体层13传输的信号的波长可以为一个变化值，即导体层13传输的信号为在一个频段内的信号，而不是一个固定频率的信号；所述第一接地层11、第二接地层12为能够导电的导电层，用于接地。所述导体层13、第一接地层11和第二接地层12的材质可以包括导电的金属或合金，优选为铜制材料。所述第一接地层11、第二接地层12在本实施例中相互平行设置，与导体层13形成带状线。
进一步的，所述第一接地层11与第二接地层12之间设有基材层14。所述基材层14的总厚度至少为150μm，其介电常数为3.2～3.4，优选介电常数为3.3。所述基材层14包括至少一层MPI基材层和至少一层LCP基材层。所述导体层13、第一接地层11和第二接地层12均为形成于某一所述基材层14表面的导电层。
请继续参考图1，在一较佳实施例中，所述第一接地层11和所述第二接地层12之间的基材层总厚度为200μm。所述第一接地层11和导体层13之间的基材层为第一MPI基材层141和第二MPI基材层142，所述第一MPI基材层141的厚度为50μm，所述第二MPI基材层142的厚度为25μm。所述导体层13与第一接地层11之间还设有第一胶层143，所述第一胶层143厚度为25μm，并设于第一MPI基材层141和第二MPI基材层142之间。所述导体层13和第二接地层12之间的基材层为一层的LCP基材层144，所述的LCP基材层144的厚度为75μm；所述导体层13与第二接地层12之间还设有第二胶层145，所述第二胶层145的厚度为25μm，并用于连接所述第二MPI基材层142和所述LCP基材层144。优选的，所述第一胶层143和所述第二胶层145均为高频胶层。进一步的，所述第一MPI基材层141与第一接地层11相接，所述第二MPI基材层142与第二胶层145均相接。所述第一接地层11形成于所述第一MPI基材层141表面，所述导体层13形成于所述第二MPI基材层142表面，所述第二接地层12形成于所述LCP基材层144表面。
请参考图2，在另一较佳实施例中，所述第一接地层11和所述第二接地层12之间的基材层总厚度为150μm。所述第一接地层11和导体层13之间的基材层为一层的MPI基材层146，所述MPI基材层146的厚度为50μm；所述导体层13和第二接地层12之间的基材层为一层的LCP基材层147，所述LCP基材层147的厚度为75μm；所述MPI基材层146和所述LCP基材层147之间还设有一层胶层148，所述胶层148的厚度为25μm。
现有技术的一种传输线的技术方案，是仅用MPI基材作为基材层。但是，这种方案在叠层增加以后成本也会随之增加，由于MPI基材层目前可量产厚度主要为50um以下，50um以上成本高于LCP基材层，因此，为了实现大厚度基材层而叠加MPI基材层的方式将导致加工流程及难度都会增加。而，本申请采用了MPI基材层、高频胶层以及LCP基材层组合的方式，在需要多层叠加的情况下，采用费用更低的LCP基材层替代部分需要多层叠加的MPI基材层，可以减少胶层数量，降低了因胶层结合力、吸水等引起的爆板、流胶等问题，同时，由于LCP基材层的吸水性能为0.05%左右，相比MPI基材层和胶层可降低整体产品吸水率。而且，本申请所述传输线需要的工序也大大的优化，例如，现有技术的第一种方案采用了贴胶、压合、蚀刻、贴胶、蚀刻、贴胶以及压合等七个步骤，而本申请所述的传输线只需要采用如图3所述的S1贴胶、S2蚀刻、S3贴胶和S4压合这四个步骤，能大大缩减了工艺流程，降低了加工成本。此外，更改叠层后可提升传输线的整体性能，请参考下表1，提供了现有技术与本申请传输线方案的插入损耗对比测试表，本申请传输线方案的整体性能要优于现有技术的整体性能。
表1
Frequency （GHz） 现有技术（dBm） 本申请（dBm）
2 -0.68 -0.64
4 -1.08 -1.06
6 -1.38 -1.37
8 -1.76 -1.63
10 -2.06 -1.93
据此，本申请提供了一种传输线，通过在传输线中同时采用MPI基材和LCP基材的方式，用LCP基材替代部分需要多层叠加的MPI基材，以达到降低成本、减少胶层数量、简化加工工序以及提升产品整体性能的效果。
本申请还提供了一种电路板（未图示），所述电路板的基材层总厚度至少为150μm，且包括至少一层LCP基材层和至少一层MPI基材层。
进一步的，所述电路板还包括设置于相邻基材层之间的胶层。
进一步的，所述电路板还包括设置于所述基材层表面的接地层。
在一较佳实施例中，所述电路板的基材层总厚度为150μm，所述基材层包括一层75μm厚度的LCP基材层和一层50μm厚度的MPI基材层，所述LCP基材层和MPI基材层之间还设有一层25μm厚度的胶层。
在另一较佳实施例中，所述电路板的基材层总厚度为200μm，所述基材层包括由下到上依次设置的一层75μm厚度的LCP基材层、一层25μm厚度的胶层、一层25μm厚度的MPI基材层、一层25μm厚度的胶层、一层50μm厚度的MPI基材层。本申请提供了一种电路板，通过在电路板中同时采用MPI基材和LCP基材的方式，用LCP基材替代部分需要多层叠加的MPI基材，以达到降低成本、减少胶层数量、简化加工工序以及提升产品整体性能的效果。
本申请还提供一种电子设备（未图示），电子设备可以是移动终端，如手机，电子设备包括上述的传输线。
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。

Claims (10)

1、一种电路板，其特征在于，所述电路板的基材层总厚度至少为150μm，且包括至少一层LCP基材层和至少一层MPI基材层。
2、根据权利要求1所述的电路板，其特征在于，所述电路板还包括设置于相邻基材层之间的胶层。
3、根据权利要求2所述的电路板，其特征在于，所述电路板还包括设置于所述基材层表面的导电层。
4、一种传输线，包括第一接地层、第二接地层以及位于第一接地层和第二接地层之间的导体层，其特征在于，所述第一接地层和所述第二接地层之间的基材层总厚度至少为150μm，且包括至少一层LCP基材层和至少一层MPI基材层。
5、根据权利要求4所述的传输线，其特征在于，所述导体层与第一接地层之间设有至少一层MPI基材层，所述导体层与第二接地层之间设有至少一层LCP基材层。
6、根据权利要求5所述的传输线，其特征在于：所述传输线还包括设置于相邻基材层之间的胶层。
7、根据权利要求6所述的传输线，其特征在于：所述第一接地层与所述导体层之间依次设有第一MPI基材层和第二MPI基材层，所述第一MPI基材层和所述第二MPI基材层之间设有第一胶层。
8、根据权利要求7所述的传输线，其特征在于：所述导体层与第二接地层之间还设有第二胶层，所述第二胶层用于连接所述第二MPI基材层和所述LCP基材层。
9、根据权利要求8所述的传输线，其特征在于：所述第一接地层为形成于所述第一MPI基材层表面的导电层，所述导体层为形成于所述第二MPI基材层表面的导电层，所述第二接地层为形成于所述LCP基材层表面的导电层。
10、一种电子设备，其特征在于，包括如权利要求4-9任一项所述的传输线。
PCT/CN2020/094375 2020-05-28 2020-06-04 电路板、传输线及电子设备 Ceased WO2021237772A1 (zh)

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