WO2021223448A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2021223448A1
WO2021223448A1 PCT/CN2020/137794 CN2020137794W WO2021223448A1 WO 2021223448 A1 WO2021223448 A1 WO 2021223448A1 CN 2020137794 W CN2020137794 W CN 2020137794W WO 2021223448 A1 WO2021223448 A1 WO 2021223448A1
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WO
WIPO (PCT)
Prior art keywords
optical fiber
optical
module
light
cavity
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Application number
PCT/CN2020/137794
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English (en)
French (fr)
Inventor
李丹
付孟博
谢一帆
傅钦豪
Original Assignee
青岛海信宽带多媒体技术有限公司
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Publication of WO2021223448A1 publication Critical patent/WO2021223448A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms

Definitions

  • the present disclosure relates to the field of optical communication technology, and in particular to an optical module.
  • optical communication technology In cloud computing, mobile Internet, video and other new business and application modes, optical communication technology will be used.
  • the optical module realizes the function of photoelectric conversion in the field of optical communication technology and is one of the key components in optical communication equipment.
  • the intensity of the optical signal input from the optical module to the external optical fiber directly affects the quality of optical fiber communication.
  • the light emitting part of some optical modules is packaged in a micro-optical form, that is, the light emitted by the optical chip enters the air, and devices such as lenses and optical fiber adapters are arranged on the optical path, and the light emitted by the optical chip is coupled to the optical fiber adapter through the lens.
  • the optical fiber adapter is connected to the optical fiber. The efficiency of coupling the light emitted by the optical chip into the optical fiber affects the optical power of the optical signal, and the transmission loss of light in the optical fiber also affects the optical power of the optical signal.
  • An optical module provided by the present disclosure includes: an optical emission sub-module for outputting signal light; a first optical fiber for transmitting signal light output by the optical emission sub-module; an optical fiber adapter, one end of which is connected to the optical emission sub-module, and the other end One end connected to the first optical fiber, used to couple the signal light output by the optical emission sub-module to the first optical fiber; the first optical fiber socket, one end connected to the other end of the first optical fiber, used for the optical module to connect to an external optical fiber; the optical emission sub-module Including: the light emission sub-module cavity, the side wall of the light emission sub-module cavity is provided with a through hole, the through hole is used to insert one end of the optical fiber adapter; the light emitting chip is arranged in the light emission sub-module cavity to generate signal light The lens is arranged in the light emission sub-module cavity and on the signal light transmission path, used to converge the signal light to the optical fiber coupler; wherein, the through hole is inclined to the top surface
  • Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal
  • Figure 2 is a schematic diagram of the structure of an optical network unit
  • FIG. 3 is a schematic structural diagram of an optical module provided by an embodiment of the disclosure.
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module provided by an embodiment of the disclosure.
  • FIG. 5 is a cross-sectional view of an optical module structure provided by an embodiment of the disclosure.
  • FIG. 6 is a schematic diagram of an assembly structure of a light emitting sub-module and an optical fiber socket provided by an embodiment of the disclosure
  • FIG. 7 is an exploded view of the structure of the optical emission sub-module provided by an embodiment of the disclosure.
  • FIG. 8 is a schematic diagram of an assembly cross-sectional view of a light emitting sub-module and an optical fiber adapter provided by an embodiment of the disclosure
  • FIG. 9 is a second schematic diagram of an exploded structure of a back-illuminated photoelectric conversion device according to an embodiment of the disclosure.
  • FIG. 10 is a first exploded schematic diagram of a light emitting sub-module and an optical fiber adapter provided by an embodiment of the disclosure
  • FIG. 11 is a second exploded schematic diagram of a light emitting sub-module and an optical fiber adapter provided by an embodiment of the disclosure
  • FIG. 12 is a schematic diagram of an exploded cross-sectional view of an optical fiber adapter provided by an embodiment of the disclosure.
  • FIG. 13 is a schematic cross-sectional view of a partial assembly of a light emitting sub-module and an optical fiber adapter provided by an embodiment of the disclosure
  • 14A is a schematic diagram of the optical path structure of a light emitting sub-module provided by the prior art
  • FIG. 14B is a simulation diagram of the coupling efficiency of the optical path structure in FIG. 14A;
  • 15A is a schematic diagram of the optical path structure of the optical emission sub-module provided by the prior art
  • FIG. 15B is a simulation diagram of the coupling efficiency of the optical path structure in FIG. 15A;
  • 15C is a simulation diagram of the coupling efficiency of the optical axis entering the inclined fiber ferrule through the center of the focusing lens
  • 16A is a schematic diagram of the optical path structure of the optical emission sub-module provided by an embodiment of the disclosure.
  • FIG. 16B is a simulation diagram of the coupling efficiency of the optical path structure in FIG. 16A.
  • One of the core links of optical communication is the mutual conversion of optical and electrical signals.
  • Optical communication uses information-carrying optical signals to be transmitted in information transmission equipment such as optical fibers/optical waveguides, and the passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost and low-loss information transmission; and information processing equipment such as computers Electrical signals are used.
  • information transmission equipment such as optical fibers/optical waveguides
  • information processing equipment such as computers Electrical signals are used.
  • the optical module realizes the above-mentioned mutual conversion function of optical and electrical signals in the field of optical fiber communication technology, and the mutual conversion of optical signals and electrical signals is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the golden finger on its internal circuit board.
  • the main electrical connections include power supply, I2C signal, data signal and grounding, etc.; the electrical connection method realized by the golden finger has become the optical module.
  • the mainstream connection method of the industry based on this, the definition of the pins on the golden finger has formed a variety of industry protocols/standards.
  • Figure 1 is a schematic diagram of the connection relationship of an optical communication terminal.
  • the connection of an optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103.
  • One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing equipment.
  • the connection between the local information processing equipment and the remote server is completed by the connection of the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is The optical network unit 100 with the optical module 200 is completed.
  • the optical port of the optical module 200 is connected to the optical fiber 101, and a bidirectional optical signal connection is established with the optical fiber.
  • the electrical port of the optical module 200 is connected to the optical network unit 100 to establish a two-way electrical signal connection with the optical network unit.
  • the optical module realizes the mutual conversion between optical signals and electrical signals, thereby realizing the establishment of a connection between the optical fiber 101 and the optical network unit 100.
  • the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input into the optical fiber.
  • the optical module 200 is a tool for realizing the mutual conversion of photoelectric signals, and does not have the function of processing data. In the foregoing photoelectric conversion process, the carrier of information is converted between light and electricity, but the information itself has not changed.
  • the optical network unit 100 has an optical module interface 102 for connecting to the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200.
  • the optical network unit has a network cable interface 104, which is used to connect to the network cable 103 and establish a two-way electrical signal connection with the network cable 103; the optical module 200 and the network cable 103 establish a connection through the optical network unit.
  • the optical network unit transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network unit acts as the upper computer of the optical module to monitor the operation of the optical module.
  • the remote server establishes a bidirectional signal transmission channel with the local information processing equipment through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103 in sequence.
  • Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network unit is the upper computer of the optical module, which provides data signals to the optical module and receives data signals from the optical module.
  • the common optical module upper computer also has optical lines Terminal OLT, etc.
  • FIG. 2 is a schematic diagram of the optical network unit structure.
  • the optical network unit 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector connected to the circuit board 105 is provided in the cage 106 for accessing golden fingers, etc.
  • the optical module 200 is inserted into the optical network unit 100. Specifically, the electrical port of the optical module is inserted into the electrical connector in the cage 106, and the optical port of the optical module is connected to the optical fiber 101.
  • the cage 106 is located on the circuit board 105 of the optical network unit 100 and wraps the electrical connectors on the circuit board 105 in the cage; the optical module is inserted into the cage, and the optical module is fixed by the cage, and the heat generated by the optical module is conducted through the optical module housing Give it to the cage, and finally spread through the radiator 107 on the cage.
  • Fig. 3 is a schematic structural diagram of an optical module provided by an embodiment of the present disclosure
  • Fig. 4 is an exploded schematic diagram of an optical module structure provided by an embodiment of the present disclosure.
  • the optical module provided by the embodiment of the present disclosure 200 includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a light emitting sub-module 400, a light receiving sub-module 500, and an optical fiber socket 502.
  • the upper shell 201 and the lower shell 202 form a wrapping cavity with two ports, which can be two ports (204, 205) in the same direction, or two ports in different directions; one of the ports is The electrical port 204 is used to plug into the upper computer such as the optical network unit; the other port is the optical port 205, which is used to connect the external optical fiber 101; the circuit board 300, the optical transmitting sub-module 400 and the optical receiving sub-module 500 and other optoelectronic devices are located on the upper , In the wrapping cavity formed by the lower shell.
  • the upper shell and the lower shell are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation; the assembly method of the upper shell and the lower shell is used to facilitate the installation of circuit boards and other components into the shell. Generally, optical modules are not used.
  • the housing is made into an integrated structure, so that when assembling circuit boards and other devices, the positioning components, heat dissipation and electromagnetic shielding structures are not easy to install, which is not conducive to production automation.
  • the unlocking handle 203 is located on the outer wall of the wrapping cavity/lower housing 202. Pulling the end of the unlocking handle can make the unlocking handle move relatively on the outer wall surface; when the optical module is inserted into the upper computer, the unlocking handle 203 is engaged with the cage 106, thereby holding the optical module It is fixed in the upper computer; the locking relationship between the optical module 200 and the cage 106 is released by pulling the unlocking handle, so that the optical module can be withdrawn from the upper computer.
  • the circuit board 300 is located in an enveloping cavity formed by an upper shell and a shell.
  • the circuit board 300 is electrically connected to the light emitting sub-module 400 and the light receiving sub-module 500 respectively.
  • the circuit board is provided with electrical devices such as chips, capacitors, and resistors. Choose the corresponding chip according to the needs of the product. Common chips include microprocessor MCU, clock data recovery chip CDR, laser driver chip, transimpedance amplifier TIA chip, limiting amplifier LA chip, power management chip, etc. Among them, the transimpedance amplifier is closely related to the light detection chip. Some products will package the transimpedance amplifier and the light detection chip together, such as in the same TO package or the same shell; the light detection chip and the transimpedance amplifier can also be separated Separately install the transimpedance amplifier on the circuit board.
  • the chip on the circuit board 300 can be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are fused into one chip, or a laser driver chip, a limiting amplifier chip, and an MCU can be fused into one chip.
  • the chip is an integrated circuit , But the function of each circuit has not disappeared because of the collection, but the appearance of the circuit has changed, and the circuit form is still present in the chip. Therefore, when the circuit board is provided with three independent chips, the MCU, the laser driver chip, and the limiting amplifier chip, this is the same as setting a single chip with three functions in one on the circuit board 300. The solution is equivalent.
  • the end surface of the circuit board 300 has golden fingers.
  • the golden fingers are composed of independent pins.
  • the circuit board is inserted into the electrical connector in the cage, and the golden fingers are conductively connected to the snap-fitting shrapnel in the electrical connector. ;
  • Gold fingers can be set on only one side surface of the circuit board. Considering the large number of pins, gold fingers are generally set on the lower surface of the circuit board; the gold fingers are used to establish electrical connections with the upper computer, and the specific electrical The connection can be power supply, ground, I2C signal, communication data signal, etc.
  • the optical module also includes an optical emission sub-module and an optical receiving sub-module, and the optical emission sub-module and the optical receiving sub-module can be collectively referred to as an optical sub-module.
  • the optical module provided by the embodiment of the present disclosure includes a light emitting sub-module 400 and a light receiving sub-module 500.
  • the light emitting sub-module 400 is located on the edge of the circuit board 300, and the light emitting sub-module 400 and the light receiving sub-module 500 are The staggered arrangement on the surface of the circuit board 300 is conducive to achieving a better electromagnetic shielding effect.
  • the light emitting sub-module 400 is arranged on the surface of the circuit board 300. In another common packaging method, the light emitting sub-module is physically separated from the circuit board, and the electrical connection is achieved through a flexible board. In the embodiment of the present disclosure, the light emitting sub-module 400 is connected to the first optical fiber socket 502 through the first optical fiber 501.
  • the light emitting sub-module 400 is located in the wrapping cavity formed by the upper and lower shells.
  • the circuit board 300 is provided with a notch 301 for placing the light emitting sub-module; the notch 301 can be set in the middle of the circuit board , Can also be set on the edge of the circuit board; the light emitting sub-module is embedded in the gap 301 of the circuit board, so that the circuit board can be inserted into the light emitting sub-module, and it is also convenient to fix the light emitting sub-module and the circuit board in Together.
  • the light emitting sub-module 400 may be fixedly supported by the lower housing 202.
  • the light-receiving sub-module 500 is arranged on the surface of the circuit board 300. In another common packaging method, the light-receiving sub-module is physically separated from the circuit board and is electrically connected through a flexible board. In the embodiment of the present disclosure, the light receiving sub-module 500 is connected to the second optical fiber socket 504 through the second optical fiber 503. The signal light outside the optical module is transmitted to the second optical fiber socket 504 through the external optical fiber to the second optical fiber 503, and then transmitted to the light receiving sub-module 500 through the second optical fiber 503, and the receiving sub-module 500 converts the received signal light into electric current Signal.
  • the light receiving sub-module 500 includes an optical device and an optoelectronic device.
  • optical devices such as fiber optic adapters, arrayed waveguide gratings, lenses, etc.
  • the second optical fiber 503 transmits the signal light to the optical device, and then converts the optical device to the signal light beam transmission path, and finally transmits it to the optoelectronic device.
  • FIG. 5 is a cross-sectional view of an optical module structure provided by an embodiment of the present disclosure.
  • the optical module provided by the embodiment of the present disclosure includes a lower housing 202, a circuit board 300, a light emitting sub-module 400, and a light receiving sub-module 500.
  • the light emitting sub-module 400 and the light receiving sub-module 500 are located on the circuit board 300.
  • the first optical fiber receptacle 502 is connected to the light transmitting sub-module 400 through the first optical fiber 501, and the second optical fiber receptacle 504 is connected to the light receiving sub-module 500 through the second optical fiber 503.
  • the first optical fiber socket 502 and the light transmitting sub-module 400 are connected through the first optical fiber 501 as an example for description.
  • the lower housing 202 is used to carry the circuit board 300 and the second optical fiber socket 502, and the circuit board 300 carries the light emitting sub-module 400.
  • the lower housing 202 has a card slot 206 with a gap 206a in the card slot 206, and the card slot 206 may be formed by protruding upward from the surface of the lower housing.
  • the first optical fiber socket 502 includes a main body 502a and a protrusion 502b.
  • the protrusion 502b is located on the surface of the main body 502a, and the protrusion protrudes relative to the main body.
  • the first optical fiber socket 502 and the slot 206 on the lower housing 202 are assembled and fixed. In a certain embodiment provided in the present disclosure, by placing the protrusion 502b in the gap 206a of the slot 206, the fiber socket is fixed on the lower housing.
  • the structure and fixing method of the second optical fiber receptacle 504 can be referred to the first optical fiber receptacle 502.
  • the card slot 206 divides the lower housing into two areas.
  • the circuit board 300 is arranged in one of the areas.
  • a convex post is formed on the surface of the lower housing in this area to fix the circuit board 300; the light emitting sub-module 400 is fixed to the circuit board 300 Together, by fixing the circuit board 300, the light emitting sub-module is fixed on the lower casing.
  • the light emitting sub-module can also be directly fixed on the lower housing without indirect fixing through the circuit board 300.
  • the optical fiber socket is arranged in the other area, and the external optical fiber plug extends into the other area to be connected to the optical fiber socket. Therefore, the circuit board 300 and the optical fiber socket are respectively fixed on the lower housing, that is, the positions of the light emitting sub-module 400 and the optical fiber socket 502 are relatively fixed. Therefore, the optical fiber 501a connecting the light emitting sub-module and the optical fiber socket needs to have a specific size .
  • FIG. 6 is a schematic diagram of an assembly structure of a light emitting sub-module and an optical fiber socket provided by an embodiment of the disclosure.
  • the optical transmission sub-module 400 is connected to the first optical fiber socket 502 through the optical fiber adapter 600 and the first optical fiber 501 in sequence.
  • One end of the first optical fiber 501 is connected to the optical fiber adapter 600, and the other end is connected to the first optical fiber socket 502.
  • the optical fiber adapter 600 is used for inserting into the light emitting sub-module to receive the light converged by the optical lens; the first optical fiber socket 502 is connected to the first optical fiber 501 and the optical fiber plug outside the optical module, respectively, for realizing the internal and external optical module
  • the optical connection between the light emission sub-modules is connected to the optical fiber through the optical fiber adapter, and is transmitted from the optical fiber to the first optical fiber socket 502, and then transmitted to the outside of the optical module through the first optical fiber socket 502.
  • FIG. 7 is an exploded view of the structure of the optical emission sub-module provided by an embodiment of the disclosure.
  • the light emitting sub-module provided by the embodiment of the present disclosure is provided with a laser assembly 404, and the laser assembly 404 includes a laser chip 404a, a collimator lens 404b, a metalized ceramic 404c, and a semiconductor cooler 404d.
  • the common light emitting chip of the optical module is a laser chip.
  • the laser chip 404a is placed on the surface of the metalized ceramic 404c, and the surface of the metalized ceramic 404c forms a circuit pattern, which can supply power to the laser chip; at the same time, the metalized ceramic 404C has better thermal conductivity , Can be used as a heat sink of the laser chip 404a for heat dissipation.
  • lasers have become the preferred light source for optical modules and even optical fiber transmission; other types of light, such as LED light, etc., are generally not used in common optical communication systems, even for special optical communication systems
  • This kind of light source is used in this kind of light source, the characteristics of the light source and the chip structure are quite different from the laser, which makes the optical module using laser and the optical module using other light sources have a large technical difference.
  • Those skilled in the art generally do not think that These two types of optical modules can give technical inspiration to each other.
  • the function of the optical lens is to converge the light, and the light emitted from the light emitting chip is in a divergent state.
  • the common convergence is to converge divergent light into parallel light, and converge divergent light and parallel light into convergent light.
  • Figure 7 shows a collimating lens 404b and a focusing lens 407.
  • the collimating lens 404b is arranged on the light path of the laser chip to converge the divergent light of the laser chip into parallel light; the focusing lens 407 is arranged close to the optical fiber On the side of the adapter 600, the parallel light is converged into the fiber optic adapter 600.
  • the light emission sub-module may also include a semiconductor cooler TEC404d.
  • the TEC404d is directly or indirectly arranged on the bottom surface of the light emitting sub-module cavity, and the metalized ceramic is arranged on the surface of the TEC404d.
  • the TEC404d is used to balance the heat to maintain the set working temperature of the laser chip.
  • the light emission sub-module has a packaging structure to package laser chips, etc.
  • the existing packaging structures include coaxial packaging TO-CAN, silicon optical packaging, chip-on-board lens component packaging COB-LENS, and micro-optics XMD packaging.
  • Packaging is also divided into airtight packaging and non-airtight packaging. On the one hand, the package provides a stable and reliable working environment for the laser chip, and on the other hand forms an external electrical connection and light output.
  • the optical module will adopt different packages to make the optical emission sub-module.
  • the laser chip has a vertical cavity surface to emit light, and there is also an edge emitting.
  • the different direction of the laser chip's light output will also affect the choice of package form.
  • the light emission sub-module 400 provided by the embodiment of the present disclosure further includes a cover plate 401 and a light emission sub-module cavity (hereinafter referred to as the cavity) 402.
  • the cover plate 401 covers the cavity from above. 402.
  • One side wall of the cavity 402 has an opening 403 for inserting the circuit board 300, and the circuit board 300 is fixed to the lower housing of the optical module.
  • a laser component 404 is provided in the cavity 402, and the circuit board 300 extending into the cavity is electrically connected to the laser component 404.
  • the laser component has components such as a laser chip and a collimating lens to form collimated light to emit.
  • An optical multiplexing component 405 is provided in the cavity 402, and the optical multiplexing component 405 receives multiple beams of light from the laser component 404, and combines the multiple beams into one beam of light, which includes light of different wavelengths.
  • the other side wall of the cavity 402 has a through hole 406, and a beam of light combined by the optical multiplexing component 405 enters the through hole 406.
  • a focusing lens 407 may also be provided between the through hole 406 and the optical multiplexing component 405, and the light is condensed by the focusing lens to facilitate subsequent light coupling.
  • the optical fiber adapter 600 extends into the through hole 406 to couple and receive the light from the optical multiplexing component.
  • the tail of the optical fiber adapter is connected to the first optical fiber socket 502 through the first optical fiber 501, and the light received by the optical fiber adapter 600 is transmitted to the first optical fiber 501 through the first optical fiber 501.
  • 4 metalized ceramics 404c, 4 laser chips 404a, and 4 collimating lenses 404b are shown in FIG. 7.
  • the 4 laser chips emit light of 4 different wavelengths, and the data transmission capacity is increased by increasing the number of optical paths.
  • the collimating lens 404b is located in the light emitting direction of the laser chip and is used to converge the divergent light emitted by the laser chip into 4 parallel lights. Use components to combine 4 parallel lights into 1 light.
  • FIG. 8 is a schematic diagram of an assembly cross-section of the optical emission sub-module and an optical fiber adapter provided by an embodiment of the disclosure
  • FIG. 9 is an exploded schematic diagram of an assembly cross-section of the optical emission sub-module and an optical fiber adapter provided by an embodiment of the disclosure.
  • the first optical fiber 501 is located between the optical emission sub-module 400 and the optical fiber socket 502, and the distance between the optical emission sub-module and the optical fiber socket is relatively fixed, so the size of the optical fiber must meet the distance requirements of the optical emission sub-module and the optical socket, and consider the process
  • the existence of errors, in reality, the size of the optical fiber always has the problem of being too short or too long.
  • the fiber is too short to be connected; the fiber is too long to bend, and the bent fiber is not conducive to the propagation of optical signals.
  • a through hole 406 is provided on the side wall of the cavity 402, and the fiber optic adapter extends into the through hole 406 to realize the fixation with the cavity 402.
  • This fitting structure design can make the fiber optic adapter 600 move back and forth in the through hole 406 and can be adjusted.
  • the required size of the optical fiber between the optical transmitter module and the optical fiber plug When the optical fiber is short, the optical fiber adapter can be moved backward (toward the outside of the cavity) in the through hole to meet the connection size requirements; when the optical fiber is longer At this time, the optical fiber adapter can be moved forward (toward the inside of the cavity) in the through hole to straighten the optical fiber and avoid bending of the optical fiber.
  • a step is provided at one end of the through hole 406 close to the inside of the cavity 402 and the bottom of the cavity 402.
  • the fiber optic adapter and the cavity are fixed, the fiber optic adapter is fixed in the through hole and cannot be moved, but the through hole and the fiber optic adapter can adjust the bending degree of the fiber during the assembly process to avoid the problem of the fiber being too short or too long.
  • the light emitted by the laser chip in the laser component 404 is condensed into parallel light by the collimator lens 404b and then injected into the optical multiplexing component 405, and the multiple lights are combined into one light by the optical multiplexing component 405 Then, it is shot into the optical fiber adapter through the focusing lens 407; the optical fiber adapter 600 includes an isolator 602 and an optical fiber ferrule 603, and the light is refracted at the optical fiber ferrule 603, changing the original propagation direction.
  • the direction of the optical axis is not changed before and after the convergence, that is, the light enters along the center of the focusing lens.
  • This incident direction can ensure that the converged light retains the mold spot before the convergence to the greatest extent. Distribution, presenting a regular circular spot, which is beneficial to the subsequent coupling process to improve efficiency; the light enters along the center of the focusing lens, which specifically refers to the light converging through the center of the focusing lens.
  • the center of the light beam passes through the center of the focusing lens;
  • the refraction of the optical fiber ferrule changes the direction of the optical axis.
  • the through hole 406 is inclined to the plane where the cover plate 401 is located, that is, the axis of the through hole 406 is inclined to the plane where the cover plate 401 is located, and the axis direction of the through hole 406 is in line with the light of the lens.
  • the axis direction is not parallel, so that the optical axis direction before the light enters the isolator 602 is not parallel to the axial direction of the through hole 406, and the optical axis direction before the light enters the isolator 602 is not parallel to the axial direction of the optical fiber ferrule 603 .
  • the light is refracted at the light incident surface of the optical fiber ferrule 603, changing the original propagation direction, and the changed optical axis propagation direction is parallel to the axial direction of the optical fiber in the optical fiber ferrule (ideally coincides).
  • the through hole 406 is inclined to realize the control of the angle between the optical axis direction before the light enters the isolator 602 and the axial direction of the optical fiber ferrule 603, which reduces the optical axis before the light enters the isolator 602.
  • the difficulty of the angle between the direction and the axial direction of the optical fiber ferrule 603 reduces the difficulty of production.
  • the inclination angle of the through hole 406 to the plane where the cover plate 401 is located is 2° to 7°, such as 3°.
  • the optical fiber ferrule is soft, and it is not easy to fix the position of the optical transmission sub-module with high precision, thus the optical fiber ferrule is designed.
  • the optical fiber ferrule is wrapped with a hard material that can realize high-precision processing, and the fixing of the material realizes the fixing of the optical fiber.
  • the optical fiber ferrule may be formed by wrapping an optical fiber with a ceramic material.
  • the optical fiber is used to conduct light.
  • the ceramic has high processing accuracy and can achieve high-precision position alignment. It is composed of a combination of optical fiber and ceramic.
  • the optical fiber ferrule realizes the fixation of the optical fiber by fixing the ceramic.
  • the ceramic material restricts the fixing direction of the optical fiber in the optical fiber ferrule.
  • the ceramic is processed into a cylinder, and a linear through hole is set in the center of the ceramic cylinder.
  • the optical fiber is inserted into the through hole of the ceramic cylinder to achieve fixation, so the optical fiber is straight The fixed in the ceramic body.
  • the axial direction of the optical fiber is parallel to the axial direction of the optical fiber ferrule.
  • FIG. 10 is an exploded schematic diagram 1 of a light emission sub-module and an optical fiber adapter provided by an embodiment of the disclosure
  • FIG. 11 is an exploded schematic diagram 2 of a light emission sub-module and an optical fiber adapter provided by an embodiment of the disclosure.
  • the optical fiber adapter 600 provided by the embodiment of the present disclosure includes a tube case 601, an isolator 602, and an optical fiber ferrule 603.
  • the tube shell 601, the isolator 602, and the optical fiber ferrule 603 are all cylindrical structures, and the through hole 106 is a cylindrical through hole.
  • the isolator 602 and the optical fiber ferrule 603 are respectively disposed in the tube shell 601, and the optical fiber ferrule 603 is connected to the optical fiber 501a.
  • the fixing cooperation of the tube shell 601 and the through hole 406 realizes the fixing of the optical fiber adapter 600 and the cavity 402.
  • the tube shell 601 is used to fix the isolator 602 and the optical fiber ferrule 603, and facilitate the installation of the isolator 602 and the optical fiber ferrule 603.
  • the isolator 603 allows light to pass through in one direction and is blocked in the opposite direction to prevent reflected light from returning to the laser chip. Of course, the cut-off capability of the isolator 603 cannot realize that all light is blocked.
  • FIG. 12 is an exploded cross-sectional schematic diagram of an optical fiber adapter provided by an embodiment of the disclosure. As shown in FIG. 12, the tube shell 601 has a baffle 605 a to divide the space of the tube shell 601 into a first cavity 604 and a second cavity 605.
  • the isolator 602 is arranged in the first cavity 604, the optical fiber ferrule 603 is arranged in the second cavity 605, the baffle 605a is located between the isolator 602 and the optical fiber ferrule 603, and the optical fiber ferrule 603 extends into the second cavity
  • the moving process of 605 is blocked by the baffle, thereby restricting the position of the optical fiber ferrule 603; the isolator 602 is placed in the first cavity, and the position can be set with the baffle as a reference.
  • the baffle 605a separates and fixes the isolator 602 and the optical fiber ferrule 603.
  • a hole for installing the isolator and the optical fiber ferrule is provided in the tube case, and the aperture size of the hole for installing the isolator and the optical fiber ferrule is different.
  • the limit of the core ensures the installation accuracy of the isolator and the optical fiber ferrule.
  • the axial direction of the isolator 602 is parallel to the axial direction of the optical fiber ferrule 603, for example, the axial direction of the isolator 602 coincides with the axial direction of the optical fiber ferrule 603 .
  • the axial direction of the first cavity 604 and the axial direction of the second cavity 605 can be coincident, so that the axial direction of the isolator 602 coincides with the axial direction of the optical fiber ferrule 603.
  • FIG. 13 is a schematic cross-sectional view of a partial assembly of a light emitting sub-module and an optical fiber adapter provided by an embodiment of the disclosure.
  • the through hole 406 is inclined away from the bottom end of the cavity 402, and the axial direction C of the through hole 406 intersects the optical axis direction D before the light enters the isolator 602.
  • the axial direction C of the through hole 406 is parallel to the axial direction B of the optical fiber ferrule 603 (ideally coincides), and the optical axis direction D before the light enters the isolator 602 and the optical fiber ferrule 603
  • the axis direction B intersects.
  • the light enters the fiber of the fiber ferrule through the air, and the light will not be refracted when it enters the fiber end face of the fiber ferrule perpendicularly. In this way, it is easy to control the angle relationship between the laser chip's light emitting direction and the fiber ferrule.
  • the reflected light returns along the original optical path, and the returned light returns to the laser chip, which will affect the laser chip's light output.
  • the optical path is designed to make the light non-perpendicularly incident on the end face of the fiber; in order to realize the non-perpendicular light incident on the end face of the fiber, the light incident surface of the optical fiber ferrule is ground into a bevel.
  • an optical fiber is wrapped in ceramic to form an optical fiber ferrule 603, and the end face of the optical fiber ferrule 603 is ground into a bevel, and the optical fiber end face in the optical fiber ferrule 603 follows A slope 603a is formed.
  • the inclined surface 603a is inclined toward the bottom surface of the cavity 402, and the inclination angle may be 6° to 15°, such as 7°.
  • the light transmitted to the end face of the optical fiber ferrule 603 is refracted into the optical fiber ferrule 603 through the inclined surface 603a, and the combination of the inclined surface 603a and the inclined through hole 406 can realize the optical axis direction of the signal light that is refracted into the optical fiber ferrule 603 and the optical axis direction of the optical fiber ferrule 603.
  • the axis directions are parallel or nearly parallel, and finally the signal light output by the light emission sub-module is coupled into the first optical fiber with high efficiency.
  • the optical fiber ferrule is composed of a ceramic cylinder wrapped with an optical fiber, the axial direction of the optical fiber ferrule is the same as the axial direction of the optical fiber, and the optical fiber ferrule is ground into a light surface.
  • Inclined surface that is, the light incident surface of the optical fiber is ground into the same inclined surface;
  • the optical fiber is composed of a core layer and a cladding layer with different refractive indexes, and the light is totally reflected at the interface between the core layer and the cladding layer, thereby constraining the transmission in the core layer.
  • the prerequisite for total reflection is to have a sufficiently large angle of incidence. Therefore, the total reflection of light in the optical fiber requires that after the light is refracted at the light incident surface of the optical fiber, the refraction angle is small enough to satisfy that the light has a large enough incident angle when it is reflected again in the optical fiber. After refraction, a sufficiently small refraction angle is formed, and a sufficiently small incident angle is required for refraction; in order to achieve better coupling efficiency, the optical axis after entering the fiber is required to be parallel to the fiber axis, and the light beam entering the fiber is symmetrical with the center axis. Therefore, the light incident on the light incident surface of the optical fiber has a specific incident angle range.
  • the light emitted by the laser chip is center-symmetric about the optical axis, and the light entering the fiber is also center-symmetric about the optical axis.
  • Three typical rays are used as an example for illustration, and the light on the optical axis is used for illustration.
  • FIG. 14A is a schematic diagram of the optical path structure of an optical emission submodule provided in the prior art
  • FIG. 14B is a simulation diagram of the coupling efficiency of the optical path structure in FIG. 14A.
  • the laser chip 404a, the collimating lens 404b, and the focusing lens 407 are respectively located in the light emitting sub-module cavity 402.
  • the axial direction of the optical fiber ferrule is parallel to the optical axis of the laser chip
  • the axial direction A of the optical fiber adapter is parallel to the axial direction of the optical fiber ferrule
  • the axial direction of the optical fiber ferrule is parallel to the axial direction of the optical fiber in the optical fiber ferrule (ideal state The following is coincident).
  • the divergent light emitted by the laser chip is condensed into parallel light by the collimating lens, and the parallel light is condensed by the center of the focusing lens and then enters the light incident surface of the optical fiber ferrule 603. After two times of convergence, the light maintains the original optical axis direction, the shape of the spot is unchanged, and it is a circular spot in an ideal state.
  • the converged light meets the angle requirement of the total reflection of the optical fiber, and the optical axis of the converged light is perpendicular to the light incident surface of the optical fiber.
  • the light is converged through the center of the focusing lens 407, and the converged light is coupled to the fiber ferrule 603. Most of the light is transmitted through the fiber in the center of the fiber ferrule, and there is less light distributed around the fiber. ,
  • the optical path structure of Fig. 14A achieves a higher coupling efficiency.
  • the optical axis is perpendicular to the light incident surface, and the refraction that occurs at this time has the smallest incident angle (0°) and the smallest refraction angle.
  • the optical path design adopted in Fig. 14A can meet the angle requirement of the total reflection of the optical fiber, and the spot shape is also conducive to optical coupling, but the reflected light generated on the light incident surface of the optical fiber will return along the original optical path, thereby affecting the light output of the laser chip.
  • the advantage of the optical path design of Fig. 14A and Fig. 14B is that the center of the focusing lens is used to converge the light path, which can maintain a better spot pattern.
  • the disadvantage is that the reflected light generated by the light incident surface of the fiber will return to the laser chip along the original optical path. .
  • FIG. 15A is a schematic diagram of the optical path structure of the optical emission submodule provided by the prior art
  • FIG. 15B is a simulation diagram of the coupling efficiency of the optical path structure in FIG. 15A.
  • the tilt direction of the inclined surface of the optical fiber ferrule is only the difference in the viewing angle.
  • the optical fiber ferrule is a cylinder, and the tilt direction of the inclined surface is different when the angle of view is rotated. As shown in FIG.
  • the laser chip 404a, the collimating lens 404b, and the focusing lens 407 are respectively located in the light emitting sub-module cavity 402, and the direction of the axis of the optical fiber ferrule (the axis of the optical fiber) is parallel to the direction of the light exiting optical axis of the laser chip.
  • the axial direction A of the optical fiber adapter is parallel to the axial direction of the optical fiber ferrule 603, and the axial direction of the optical fiber ferrule is parallel to the axial direction of the optical fiber in the optical fiber ferrule (ideally coincides).
  • the divergent light emitted by the laser chip is condensed into parallel light by the collimator lens, and the parallel light is condensed by the focusing lens and then enters the light incident surface of the optical fiber ferrule 603.
  • the light incident surface of the optical fiber ferrule 603 is inclined.
  • the light enters the non-central position of the focusing lens 407, the light is converged through the non-center of the focusing lens 404, and the optical axis direction of the light is changed by the focusing lens 407.
  • the light incident surface of the optical fiber is inclined, and the direction of the optical fiber axis in the optical fiber ferrule has not changed.
  • the convergent light must not be able to maintain the figure. 14A this kind of propagation direction.
  • the optical axis maintains the direction in FIG. 14A and is parallel to the direction of the light-emitting optical axis of the laser chip, and the incident surface of the light is incident in a non-vertical direction, the incident angle is reduced, and the refraction angle is reduced. It is also reduced, which is not conducive to total reflection.
  • the solution of FIG. 15A changes the direction of the optical axis in FIG. 14A, and the direction of the optical axis after converging by the focusing lens is not parallel to the direction of the optical axis of the laser chip to increase the angle of incidence during refraction.
  • the optical axis does not pass through the center of the focusing lens 407. After the light passes through the focusing lens, the direction of the optical axis is changed. The efficiency of coupling into the optical fiber is significantly reduced.
  • the advantage of the optical path design of Fig. 15A and Fig. 15B is to prevent the reflected light from the light incident surface of the optical fiber from returning to the laser chip along the original optical path.
  • the disadvantage is that the center of the focusing lens is not used to converge the light path. Produce greater deterioration.
  • FIG. 15C is a simulation diagram of the coupling efficiency of the optical axis entering the inclined fiber ferrule through the center of the focusing lens.
  • the light incident surface of the optical fiber ferrule is inclined.
  • the light emitted by the laser chip 404a is collimated by the collimating lens 404b, and then converged by the focusing lens 407 into the optical fiber adapter 603; the light passes through the center of the focusing lens 407
  • the axis direction A of the fiber optic adapter is parallel to the center axis direction of the focusing lens 407
  • the axis direction of the fiber optic ferrule 603 is parallel to the axis direction A of the fiber adapter
  • the center axis direction of the focusing lens is parallel to the axis direction of the light adapter.
  • the axial direction of the ferrule is parallel to the axial direction of the optical fiber in the optical fiber ferrule (ideally coincides); the light is coupled into the optical fiber adapter after being refracted, and a large amount of light can be seen from the optical fiber of the optical fiber adapter.
  • the coupling efficiency is relatively high. Low.
  • FIG. 16A is a schematic diagram of the optical path structure of the optical emission sub-module provided by an embodiment of the disclosure
  • FIG. 16B is a simulation diagram of the coupling efficiency of the optical path structure in FIG. 16A.
  • the inclined through hole realizes the inclination of the axis of the optical fiber ferrule.
  • the inclined direction of the inclined surface of the optical fiber ferrule is different only from the angle of view.
  • the optical fiber ferrule is a cylinder, and the inclined direction of the inclined surface is different from the rotating angle of view.
  • the laser chip 404a, the collimating lens 404b and the focusing lens 407 are respectively located in the light emitting sub-module cavity 402; the axial direction of the optical fiber ferrule 603 is parallel to the axial direction A of the optical fiber adapter, and the optical fiber ferrule 603
  • the direction of the optical fiber is parallel to the axial direction of the optical fiber ferrule 603 (ideally coincides); the axial direction of the optical fiber ferrule is parallel to the axial direction of the optical fiber adapter/fiber adapter housing; the axial direction of the through hole on the cavity 402 is parallel to the laser
  • the direction of the light-emitting optical axis of the chip is not parallel, the axis direction of the fiber adapter/fiber adapter housing is parallel to the axis of the through hole on the cavity 402, and the light-emitting axis direction of the laser chip is in line with the axis direction of the fiber adapter/fiber adapter housing Non-parallel; the divergent light e
  • the light incident surface of the optical fiber is inclined; in order to use the principle of refraction to inject light into the optical fiber, the light emitted by the laser chip is emitted through the center of the focusing lens without changing the original optical axis during focusing.
  • the light is refracted into the optical fiber ferrule 603 through the inclined surface 603a of the optical fiber ferrule 603.
  • the signal light is refracted into the optical fiber ferrule 603 through the inclined surface 603a, and the inclination angle of the inclined surface 603a and the inclination angle of the through hole are coordinated and controlled, so that the optical axis direction of the signal light refracted into the optical fiber ferrule 603 is parallel or close to parallel to the optical fiber ferrule 603. Axis direction.
  • the optical path design provided in Figure 16A aims to maintain a good spot and mode shape after the light is converged, and to match the light incident slope of the optical fiber ferrule 603.
  • the optical axis direction of the signal light that is refracted into the optical fiber ferrule 603 is parallel to the optical fiber insert.
  • the axial direction of the core 603 is to complete the high-efficiency coupling of light into the optical fiber.
  • the light is condensed through the center of the focusing lens 407, and the light is emitted through the center of the focusing lens, and the direction of the optical axis after focusing remains unchanged.
  • the light spot shape can maintain a circular spot shape under the ideal shape, which is beneficial to improve the efficiency of light coupling.
  • the light incident surface of the optical fiber ferrule/the light incident surface of the optical fiber is designed to be inclined.
  • the optical path structure shown in FIG. 14A shows that when the light When converging through the center of the focusing lens, the light incident surface of the subsequent matching optical fiber cannot be an oblique surface, so that the light refracted at the light incident surface can undergo total reflection transmission;
  • the optical path structure shown in Fig. 15A shows that when the incident light When the light surface is an oblique surface, the light matched with it cannot be condensed through the center of the focusing lens, so that the light refracted at the light incident surface can undergo total reflection transmission.
  • the embodiment of the present disclosure provides a new structural design, through the inclination of the through hole on the cavity 402, so that the axial direction of the optical fiber ferrule 603 is not parallel to the light emitting direction of the laser chip.
  • the optical fiber ferrule is inclined at a certain angle relative to the direction of the laser chip.
  • the light is converged through the center of the focusing lens 407, and the light incident surface of the optical fiber ferrule is inclined (inclined surface 603a), and the light condensed by the focusing lens can be efficiently coupled into the optical fiber Most of the light enters the optical fiber.
  • the incident angle of the light is the same, and the angle after the light is refracted is also the same.
  • the fiber axis direction in Figure 15A is parallel to the laser chip's light-emitting direction, and the optical axis passes through the non-central area of the focusing lens; while the fiber axis direction in Figure 16A is not parallel to the laser chip's light-emitting direction, and the optical axis passes through the focus.
  • the central area of the lens is
  • the optical path design provided by the embodiments of the present disclosure realizes that the optical axis direction of the signal light refracted into the optical fiber ferrule 603 is parallel to the axial direction of the optical fiber ferrule 603, and high-efficiency coupling of light into the optical fiber is completed.

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Abstract

光模块包括光发射次模块（400），光发射次模块（400）包括光发射次模块腔体（402），方便发光芯片和透镜的设置，光发射次模块腔体（402）的侧壁上设置通孔（406）。光纤适配器（600）的一端伸入该通孔（406）内，另一端通过光纤（501）与光纤插座（502）连接，进而通孔（406）方便光发射次模块腔体（402）与光纤适配器（600）的连接，进而方便光发射次模块（400）输出的信号光耦合至第一光纤（501）中，然后通过第一光纤插座（502）传输至光模块连接外部光纤。光发射次模块腔体（402）侧壁设置通孔（406）、光纤适配器（600）与光纤（501）的连接方式、光纤适配器（600）与通孔（406）的结合方式，可以通过光纤适配器（600）在通孔（406）中的移动。通孔（406）向光发射次模块腔体（402）的顶面倾斜，使通孔（406）的轴线方向与传输至光纤适配器（600）之前的信号光的光轴方向不平行，实现光发射次模块（400）输出的信号光高效率耦合进第一光纤（501）。

Description

一种光模块
本公开要求在2020年05月08日提交中国专利局、申请号为202010382332.6、发明名称为“一种光模块”的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块。
背景技术
在云计算、移动互联网、视频等新型业务和应用模式，均会用到光通信技术。光模块在光通信技术领域中实现光电转换的功能，是光通信设备中的关键器件之一，光模块向外部光纤中输入的光信号强度直接影响光纤通信的质量。
部分光模块的光发射部分采用微光学形态封装，即光芯片发出的光进入空气中，在光学路径上设置透镜、光纤适配器等器件，将光芯片发出的光经透镜后耦合至光纤适配器中，光纤适配器与光纤连接。光芯片发出的光耦合至光纤中的效率影响光信号的光功率，光在光纤中的传输损耗同样对光信号的光功率有所影响。
发明内容
本公开提供的一种光模块，包括：光发射次模块，用于输出信号光；第一光纤，用于传输光发射次模块输出的信号光；光纤适配器，一端连接光发射次模块，另一端连接第一光纤的一端，用于将光发射次模块输出的信号光耦合至第一光纤；第一光纤插座，一端连接第一光纤的另一端，用于光模块连接外部光纤；光发射次模块包括：光发射次模块腔体，光发射次模块腔体的侧壁上设置通孔，通孔用于插入光纤适配器的一端；发光芯片，设置在光发射次模块腔体内，用于产生信号光；透镜，设置在光发射次模块腔体内并设置在信号光的传输光路上，用于将信号光汇聚至光纤耦合器；其中，通孔向光发射次模块腔体的顶面倾斜，以使通孔的轴线方向与透镜的光轴方向不平行。
附图说明
为了更清楚地说明本公开的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为光通信终端连接关系示意图；
图2为光网络单元结构示意图；
图3为本公开实施例提供的一种光模块结构示意图；
图4为本公开实施例提供的光模块分解结构示意图；
图5为本公开实施例提供的一种光模块结构剖面图；
图6为本公开实施例提供的光发射次模块与光纤插座装配结构示意图；
图7为本公开实施例提供的光发射次模块结构分解图；
图8为本公开实施例提供的光发射次模块和光纤适配器装配剖面示意图；
图9为本公开实施例提供的一种背照式光电转换器件的分解结构示意图二；
图10为本公开实施例提供的一种光发射次模块和光纤适配器的分解示意图一；
图11为本公开实施例提供的一种光发射次模块和光纤适配器的分解示意图二；
图12为本公开实施例提供的一种光纤适配器分解剖面示意图；
图13为本公开实施例提供的光发射次模块和光纤适配器局部装配剖面示意图；
图14A为已有技术提供的一种光发射次模块光路结构示意图；
图14B为图14A中光路结构耦合效率仿真图；
图15A为已有技术提供的光发射次模块光路结构示意图；
图15B为图15A中光路结构耦合效率仿真图；
图15C为光轴通过聚焦透镜中心射入倾斜光纤插芯的耦合效率仿真图；
图16A为本公开实施例提供的光发射次模块光路结构示意图；
图16B为图16A中光路结构耦合效率仿真图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
光通信的核心环节之一是光、电信号的相互转换。光通信使用携带信息的光信号在光纤/光波导等信息传输设备中传输，利用光在光纤/光波导中的无源传输特性可以实现低成本、低损耗的信息传输；而计算机等信息处理设备使用的是电信号，为了在光纤/光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，就需要实现电信号与光信号的相互转换。
光模块在光纤通信技术领域中实现上述光、电信号的相互转换功能，光信号与电信号的相互转换是光模块的核心功能。光模块通过其内部电路板上的金手指实现与外部上位机之间的电连接，主要的电连接包括供电、I2C信号、数据信号以及接地等；采用金手指实现的电连接方式已经成为光模块行业的主流连接方式，以此为基础，金手指上引脚的定义形成了多种行业协议/规范。
图1为光通信终端连接关系示意图。如图1所示，光通信终端的连接主要包括光网络单元100、光模块200、光纤101及网线103。
光纤101的一端连接远端服务器，网线103的一端连接本地信息处理设备，本地信息处理设备与远端服务器的连接由光纤101与网线103的连接完成；而光纤101与网线103之间的连接由具有光模块200的光网络单元100完成。
光模块200的光口与光纤101连接，与光纤建立双向的光信号连接。光模块200的电口接入光网络单元100中，与光网络单元建立双向的电信号连接。光模块实现光信号与电 信号的相互转换，从而实现在光纤101与光网络单元100之间建立连接。
在本公开提供的某一实施例中，来自光纤的光信号由光模块转换为电信号后输入至光网络单元100中，来自光网络单元100的电信号由光模块转换为光信号输入至光纤101中。光模块200是实现光电信号相互转换的工具，不具有处理数据的功能，在上述光电转换过程中，信息的载体在光与电之间变换，但信息本身并未发生变化。
光网络单元100具有光模块接口102，用于接入光模块200，与光模块200建立双向的电信号连接。光网络单元具有网线接口104，用于接入网线103，与网线103建立双向的电信号连接；光模块200与网线103之间通过光网络单元建立连接。在本公开提供的某一实施例中，光网络单元将来自光模块的信号传递给网线，将来自网线的信号传递给光模块，光网络单元作为光模块的上位机监控光模块的工作。
至此，远端服务器依次通过光纤101、光模块200、光网络单元100及网线103，与本地信息处理设备之间建立双向的信号传递通道。
常见的信息处理设备包括路由器、交换机、电子计算机等；光网络单元是光模块的上位机，向光模块提供数据信号，并接收来自光模块的数据信号，常见的光模块上位机还有光线路终端OLT等。
图2为光网络单元结构示意图。如图2所示，在光网络单元100中具有电路板105，在电路板105的表面设置笼子106；在笼子106中设置有与电路板105连接的电连接器，用于接入金手指等光模块电口；在笼子106上设置有散热器107，散热器107具有增大散热面积的翅片等凸起结构。
光模块200插入光网络单元100中，具体为光模块的电口插入笼子106中的电连接器，光模块的光口与光纤101连接。
笼子106位于光网络单元100的电路板105上，将电路板105上的电连接器包裹在笼子中；光模块插入笼子中，由笼子固定光模块，光模块产生的热量通过光模块壳体传导给笼子，最终通过笼子上的散热器107进行扩散。
图3为本公开实施例提供的一种光模块结构示意图，图4为本公开实施例提供的一种光模块结构爆炸示意图，如图3、图4所示，本公开实施例提供的光模块200包括上壳体201、下壳体202、解锁手柄203、电路板300、光发射次模块400、光接收次模块500及光纤插座502。
上壳体201与下壳体202形成具有两个端口的包裹腔体，具体可以是在同一方向的两端口(204、205)，也可以是在不同方向上的两处端口；其中一个端口为电口204，用于插入光网络单元等上位机中；另一个端口为光口205，用于连接外部光纤101；电路板300、光发射次模块400及光接收次模块500等光电器件位于上、下壳体形成的包裹腔体中。
上壳体及下壳体一般采用金属材料，利于实现电磁屏蔽以及散热；采用上壳体、下壳体结合的装配方式，便于将电路板等器件安装到壳体中，一般不会将光模块的壳体做成一体结构，这样在装配电路板等器件时，定位部件、散热以及电磁屏蔽结构不便于安装，不利于生产自动化。
解锁手柄203位于包裹腔体/下壳体202的外壁，拉动解锁手柄的末端可以在使解锁手 柄在外壁表面相对移动；光模块插入上位机时由解锁手柄203卡合笼子106，从而将光模块固定在上位机中；通过拉动解锁手柄以解除光模块200与笼子106的卡合关系，从而可以将光模块从上位机中抽出。
电路板300位于由上、壳体形成包裹腔体中，电路板300分别与光发射次模块400及光接收次模块500电连接，电路板上设置有芯片、电容、电阻等电器件。根据产品的需求选择相应的芯片，常见的芯片包括微处理器MCU、时钟数据恢复芯片CDR、激光驱动芯片、跨阻放大器TIA芯片、限幅放大器LA芯片、电源管理芯片等。其中跨阻放大器与光探测芯片紧密关联，部分产品会将跨阻放大器与光探测芯片封装在一起，如封装在同一TO管壳中或同一外壳中；也可以将光探测芯片与跨阻放大器分开分装，将跨阻放大器设置在电路板上。
电路板300上的芯片可以是多功能合一芯片，比如将激光驱动芯片与MCU芯片融合为一个芯片，也可以将激光驱动芯片、限幅放大器芯片及MCU融合为一个芯片，芯片是电路的集成，但各个电路的功能并没有因为集合而消失，只是电路呈现形态发生改变，芯片中仍然具有该电路形态。所以，当电路板上设置有MCU、激光驱动芯片及限幅放大器芯片三个独立芯片，这与电路板300上设置一个三功能合一的单个芯片，方案是等同的。
电路板300端部表面具有金手指，金手指由相互独立的一根根引脚组成的，电路板插入笼子中的电连接器中，由金手指与电连接器中的卡接弹片导通连接；可以仅在电路板的一侧表面设置金手指，考虑到引脚数量需求较大，一般会在在电路板上下表面均设置金手指；金手指用于与上位机建立电连接，具体的电连接可以是供电、接地、I2C信号、通信数据信号等。
光模块还包括光发射次模块及光接收次模块，光发射次模块及光接收次模块可以统称为光学次模块。如图4所示，本公开实施例提供的光模块包括光发射次模块400及光接收次模块500，光发射次模块400位于电路板300的边缘，光发射次模块400与光接收次模块500在电路板300表面错开设置，利于实现更佳的电磁屏蔽效果。
光发射次模块400设置在电路板300表面，在另一种常见的封装方式中，光发射次模块与电路板物理分离，通过柔性板实现电连接。在本公开实施例中，光发射次模块400通过第一光纤501连接第一光纤插座502。
光发射次模块400位于由上、下壳体形成包裹腔体中.如图4所示，电路板300设置有缺口301，用于放置光发射次模块；该缺口301可以设置在电路板的中间，也可以设置在电路板的边缘；光发射次模块通过嵌入的方式设置在电路板的缺口301中，便于电路板伸入光发射次模块内部，同样便于将光发射次模块与电路板固定在一起。在本公开提供的某一实施例中，光发射次模块400可通过下壳体202固定支撑。
光接收次模块500设置在电路板300表面，在另一种常见的封装方式中，光接收次模块与电路板物理分离，通过柔性板实现电连接。在本公开实施例中，光接收次模块500通过第二光纤503连接第二光纤插座504。光模块外部的信号光通过外部光纤传输至第二光纤插座504传输至第二光纤503，然后经第二光纤503传输至光接收次模块500，接收次模块500将接收到的信号光转换为电流信号。
在本公开提供的某一实施例中，光接收次模块500包括光学器件和光电装换器件。其中，光学器件如光纤适配器、阵列波导光栅、透镜等。第二光纤503将信号光传输光学器件，然后将光学器件进行信号光光束传输路径的转换，最后传输至光电装换器件。
图5是本公开实施例提供的一种光模块结构剖面图。如图5所示,本公开实施例提供的光模块包括下壳体202、电路板300、光发射次模块400和光接收次模块500。光发射次模块400及光接收次模块500位于电路板300上。
第一光纤插座502通过第一光纤501与光发射次模块400连接，第二光纤插座504通过第二光纤503与光接收次模块500连接。以下以第一光纤插座502与光发射次模块400通过第一光纤501连接为例进行说明。
下壳体202用于承载电路板300及第二光纤插座502，电路板300承载光发射次模块400。在本公开提供的某一实施例中，下壳体202具有卡槽206，在卡槽206中具有间隙206a，卡槽206可以是下壳体表面向上凸起形成的。
第一光纤插座502包括主体502a及凸起502b，凸起502b位于主体502a表面，凸起相对于主体而凸起。第一光纤插座502与下壳体202上的卡槽206实现装配固定。在本公开提供的某一实施例中，通过将凸起502b放置在卡槽206的间隙206a中，实现光纤插座固定在下壳体上。在本公开提供的某一实施例中，第二光纤插座504的结构以及固定方式可参见第一光纤插座502。
卡槽206将下壳体分割成两个区域，电路板300设置在其中一个区域中，在这个区域的下壳体表面形成凸柱以固定电路板300；光发射次模块400与电路板300固定在一起，通过固定电路板300，实现了光发射次模块固定在下壳体上。当然，光发射次模块也可以直接固定在下壳体上，不需要通过电路板300进行间接的固定。
光纤插座设置在其中另一个区域中，外部的光纤插头伸入其中另一个区域中与光纤插座对接。由此，电路板300与光纤插座分别固定在下壳体上，即光发射次模块400与光纤插座502的位置相对固定，由此，连接光发射次模块及光纤插座的光纤501a需要具有特定的尺寸。
图6为本公开实施例提供的光发射次模块与光纤插座装配结构示意图。如图6所示，光发射次模块400依次通过光纤适配器600及第一光纤501实现与第一光纤插座502的连接。第一光纤501一端连接光纤适配器600，另一端连接第一光纤插座502。
光纤适配器600用于插入光发射次模块中，以接收光学透镜汇聚的光；第一光纤插座502分别与第一光纤501及光模块外部的光纤插头连接，用于实现光模块内与光模块外之间的光连接，从而形成光发射次模块的光通过光纤适配器接入光纤，由光纤传输至第一光纤插座502，经第一光纤插座502传输至光模块外。
图7为本公开实施例提供的光发射次模块结构分解图。如图7所示，本公开实施例提供的光发射次模块中设置有激光组件404，激光组件404包括激光芯片404a、准直透镜404b、金属化陶瓷404c及半导体制冷器404d。光模块常见的光发射芯片为激光芯片，将激光芯片404a设置在金属化陶瓷404c的表面，金属化陶瓷404c表面形成电路图案，可以为激光芯片供电；同时金属化陶瓷404C具有较佳的导热性能，可以作为激光芯片404a的热沉进 行散热。激光以较好的单波长特性及较佳的波长调谐特性成为光模块乃至光纤传输的首选光源；其他类型的光如LED光等，常见的光通信系统一般不会采用，即使特殊的光通信系统中采用了这种光源，其光源的特性及芯片结构与激光存在较大的差别，使得采用激光的光模块与采用其他光源的光模块存在较大的技术差别，本领域技术人员一般不会认为这两种类型的光模块可以相互给与以技术启示。
光学透镜的作用是汇聚光，从光发射芯片发出的光呈发散状态，为了便于后续的光路设计及光耦合进光纤，都需要对进行汇聚处理。常见的汇聚为将发散光汇聚为平行光，将发散光、平行光汇聚为汇聚光。图7中示出了一种准直透镜404b及一种聚焦透镜407，准直透镜404b设置在激光芯片的出光光路上，将激光芯片的发散光汇聚为平行光；聚焦透镜407设置在靠近光纤适配器600一侧，将平行光汇聚至光纤适配器600中。
根据传输设计以及激光芯片的特性，光发射次模块中还可以包括半导体制冷器TEC404d。TEC404d直接或间接设置在光发射次模块腔体的底面，金属化陶瓷设置在TEC404d表面，TEC404d用于平衡热量以维持激光芯片的设定工作温度。
光发射次模块具有封装结构，以将激光芯片等封装起来，已有的封装结构包括同轴封装TO-CAN、硅光封装、板上芯片透镜组件封装COB-LENS、微光学XMD封装。封装还分为气密性封装及非气密性封装，封装一方面为激光芯片提供稳定、可靠的工作环境，另一方面形成对外的电连接及光输出。
根据产品设计及工艺，光模块会采用不同的封装以制作光发射次模块。激光芯片有垂直腔面出光，也有边发光，激光芯片出光方向的不同也会影响对封装形态的选择。各种封装之间具有明显的技术区别，不论从结构还是从工艺都是不同的技术方向，本领域技术人员知晓，虽然不同封装实现的目的具有一定的相同点，但是不同封装属于不同的技术路线，不同的封装技术之间不会相互给与技术启示。
如图6、图7所示，本公开实施例提供的光发射次模块400还包括盖板401及光发射次模块腔体(以下简称腔体)402，由盖板401从上方盖合腔体402，腔体402的一侧壁具有开口403，用于电路板300插入，电路板300与光模块的下壳体固定。在腔体402中设置有激光组件404，伸入腔体中的电路板300与激光组件404电连接，激光组件中具有激光芯片、准直透镜等组件，形成准直光射出。腔体402中设置有光复用组件405，光复用组件405接收来自激光组件404的多束光，将多束光合并为一束光，该一束光中包括不同波长的光。腔体402的另一侧壁具有通孔406，经光复用组件405合并后的一束光射入该通孔406中。在通孔406与光复用组件405之间还可以设置聚焦透镜407，通过聚焦透镜汇聚光以便于后续耦合光。光纤适配器600伸入通孔406中以耦合接收来自光复用组件的光，光纤适配器尾部通过第一光纤501与第一光纤插座502连接，由光纤适配器600接收的光经第一光纤501传输至第一光纤插座502。
在本公开提供的某一实施例中，图7中示出了4个金属化陶瓷404c、4个激光芯片404a及4个准直透镜404b。4个激光芯片发出4个不同波长的光，通过增加光路数量实现提升数据传输容量，准直透镜404b位于激光芯片出光方向上，用于将激光芯片发出的发散光汇聚为4路平行光，光复用组件将4路平行光合并为1路光。
图8为本公开实施例提供的光发射次模块和光纤适配器装配剖面示意图，图9为本公开实施例提供的光发射次模块和光纤适配器装配剖面分解示意图。如图8和9所示，在光发射次模块400由盖板401及腔体402围成的空间中，具有激光组件404、光复用组件405、聚焦透镜407及通孔406，光纤适配器600插入通孔406中以实现与光发射次模块400的固定；装配过程中，光纤适配器600可以在通孔406中移动以选择固定位置。
第一光纤501位于光发射次模块400与光纤插座502之间，而光发射次模块与光纤插座的距离相对固定，所以光纤的尺寸要满足光发射次模块及光线插座的距离要求，而且考虑工艺误差的存在，实际中光纤的尺寸总是存在过短或过长的问题。光纤过短无法实现连接；光纤过长则发生弯曲，弯曲的光纤不利于光信号的传播。
腔体402的侧壁上设置通孔406，光纤适配器伸入通孔406中以实现与腔体402的固定，这种配装结构设计可以使得光纤适配器600在通孔406中前后移动，可以调节光纤在光发射次模块及光纤插头之间的需求尺寸，当光纤较短时，可以在通孔中将光纤适配器向后(向腔体外部方向)移动，以满足连接尺寸要求；当光纤较长时，可以在通孔中将光纤适配器向前(向腔体内部方向)移动，以拉直光纤，避免光纤弯曲。
在本公开提供的某一实施例中，在本公开实施例中，通孔406靠近腔体402内部的一端与腔体402的底部设置有台阶。当将光纤适配器600装配至通孔406内时，光纤适配器600伸入通孔406内的端面顶靠该台阶，通过该台阶实现光纤适配器600装配位置的固定，进而利用机加工精度保证光纤适配器600中光耦合效率。
在完成光纤适配器与腔体的固定时，光纤适配器被固定在通孔中无法移动，但通孔与光纤适配器在装配过程中可以调节光纤的弯曲程度，避免光纤过短或过长的问题。
如图8和9所示，激光组件404中由激光芯片发出的光经准直透镜404b汇聚为平行光后射入光复用组件405中，经光复用组件405将多束光合并为一束光后，经聚焦透镜407射入光纤适配器中；光纤适配器600中包括隔离器602及光纤插芯603，光在光纤插芯603处发生折射，改变了原有的传播方向。
光虽然经过聚焦透镜407产生了汇聚，但汇聚前后光轴方向并未改变，即光沿聚焦透镜的中心射入，这一射入方向可以最大程度的保证汇聚后的光保有汇聚前的模斑分布，呈现规则的圆形光斑，利于后续耦合过程提高效率；光沿聚焦透镜的中心射入，具体指光通过聚焦透镜的中心进行汇聚，理想状态下，光束的中心经过聚焦透镜的中心；在光纤插芯入光面发生的折射，改变了光轴的方向。
在本公开实施例中，如图8和9所示，通孔406向盖板401所在平面倾斜，即通孔406的轴线向盖板401所在平面倾斜，通孔406的轴线方向与透镜的光轴方向不平行，使光射入隔离器602之前的光轴方向与通孔406的轴线方向不平行，进而使光射入隔离器602之前的光轴方向与光纤插芯603的轴线方向不平行。光在光纤插芯603的入光面处发生折射，改变了原传播方向，改变后的光轴传播方向与光纤插芯中光纤的轴线方向平行(理想状态为重合)。本公开实施例中，通过通孔406倾斜，实现光射入隔离器602之前的光轴方向与光纤插芯603的轴线方向夹角的控制，降低了控制光射入隔离器602之前的光轴方向与光纤插芯603的轴线方向夹角的难度，降低生产难度。
在本公开提供的某一实施例中，通孔406向盖板401所在平面倾斜的倾斜角为2°至7°，如3°等。
另外，光纤柔软，不易与光发射次模块进行高精度的位置固定，由此设计了光纤插芯。光纤插芯由一种较硬、可实现高精度加工的材料包裹光纤，对该材料的固定即实现了对光纤的固定。在本公开提供的某一实施例中，光纤插芯可以由陶瓷材料包裹光纤形成，光纤用于传导光，陶瓷具有较高的加工精度，可以实现高精度的位置对齐，由光纤与陶瓷组合成光纤插芯，通过对陶瓷的固定实现了对光纤的固定。陶瓷材料限制了光纤在光纤插芯中的固定方向，一般将陶瓷加工成圆柱体，在陶瓷柱体中心设置直线型通孔，将光纤插入陶瓷柱体的通孔中以实现固定，所以光纤笔直的固定在陶瓷体中。光纤插芯中，光纤的轴线方向与光纤插芯的轴线方向平行。
图10为本公开实施例提供的一种光发射次模块和光纤适配器的分解示意图一，图11为本公开实施例提供的一种光发射次模块和光纤适配器的分解示意图二。如图10和11所示，本公开实施例提供的光纤适配器600中包括管壳601、隔离器602及光纤插芯603。管壳601、隔离器602及光纤插芯603均为圆柱状结构，以及通孔106为圆柱形通孔。
隔离器602及光纤插芯603分别设置在管壳601中，光纤插芯603与光纤501a连接。管壳601与通孔406的固定配合实现光纤适配器600与腔体402的固定。管壳601用于固定隔离器602及光纤插芯603，并方便隔离器602及光纤插芯603的安装。隔离器603允许光单方向通过，反方向被阻拦，用于防止反射光回到激光芯片中。当然，隔离器603的截止能力无法实现所有光均被阻拦。
为方便隔离器及光纤插芯的固定，管壳内设置挡板，挡板用于隔离器及光纤插芯的限位。图12为本公开实施例提供的一种光纤适配器分解剖面示意图。如图12所示，管壳601中具有挡板605a，以将管壳601的空间分为第一腔体604及第二腔体605。隔离器602设置在第一腔体604中，光纤插芯603设置在第二腔体605中，挡板605a位于隔离器602与光纤插芯603之间，光纤插芯603伸入第二腔体605的移动过程被挡板挡住，从而限制光纤插芯603的位置；隔离器602放入第一腔体中，可以以挡板为参考进行位置设置。挡板605a对隔离器602及光纤插芯603起到分隔、固定的作用。
或者，管壳内设置用于安装隔离器及光纤插芯的孔，用于安装隔离器及光纤插芯的孔的孔径大小不同，进而在安装隔离器及光纤插芯时便于隔离器及光纤插芯的限位，保证隔离器及光纤插芯的安装精度。
在本公开提供的某一实施例中，在本公开实施例中，隔离器602的轴线方向与光纤插芯603的轴线方向平行，如隔离器602的轴线方向与光纤插芯603的轴线方向重合。具体的，可通过第一腔体604的轴线方向与第二腔体605的轴线方向重合，实现隔离器602的轴线方向与光纤插芯603的轴线方向重合。
图13为本公开实施例提供的光发射次模块和光纤适配器局部装配剖面示意图。如图13所示，本公开实施例中，通孔406向背离腔体402底端方向倾斜，进而通孔406的轴线方向C与光射入隔离器602之前的光轴方向D相交。而如图13所示，通孔406的轴线方向C与光纤插芯603的轴线方向B平行(理想状态为重合)，进而光射入隔离器602之前 的光轴方向D与光纤插芯603的轴线方向B相交。
光通过空气射入光纤插芯的光纤中，光垂直射入光纤插芯的光纤端面时不会发生折射，采用这种方式易于控制激光芯片出光方向与光纤插芯的角度关系，但是垂直入射会使反射光沿原光路返回，返回的光回到激光芯片中会影响激光芯片出光。
为了防止反射光沿原光路返回，光路设计上使光非垂直入射光纤端面；为了实现光非垂直入射光纤端面，将光纤插芯的入光面研磨成斜面。在本公开提供的某一实施例中，如图13所示，将光纤包裹在陶瓷中形成光纤插芯603，将光纤插芯603的端面研磨成斜面，光纤插芯603中的光纤端面随之形成斜面603a。斜面603a向腔体402的底面方向倾斜，倾斜角度可选6°至15°，如7°。传输至光纤插芯603端面的光通过斜面603a折射进入光纤插芯603，进而斜面603a与倾斜的通孔406结合可实现折射进入光纤插芯603的信号光的光轴方向与光纤插芯603的轴线方向平行或接近平行，最终实现光发射次模块输出的信号光高效率耦合进第一光纤中。
在本公开提供的某一实施例中，在本公开实施例中，光纤插芯由陶瓷柱体包裹光纤构成，光纤插芯的轴线方向与光纤的轴线方向相同，光纤插芯入光面研磨成斜面，即将光纤入光面研磨成同样的斜面；光纤由不同折射率的芯层与包层构成，光在芯层与包层的交界面发生全反射，从而约束在芯层中传输。
全反射发生的前提是具备足够大的入射角。因此光在光纤中发生全反射，要求光在光纤入光面处发生折射后，折射角足够小，以满足光在光纤内再次反射时拥有足够大的入射角。而折射后形成足够小的折射角，需要折射时具有足够小的入射角；为实现较佳的耦合效率，要求进入光纤后的光轴与光纤轴线平行，进入光纤的光束成中心轴对称。由此，射入光纤入光面的光具有特定的入射角度范围。
激光芯片射出的光以光轴呈中心对称，进入光纤中的光也以光轴呈中心对称，以三条典型光线为例进行图示，以光轴处的光线进行示意说明。
图14A为已有技术提供的一种光发射次模块光路结构示意图，图14B为图14A中光路结构耦合效率仿真图。如图14A所示，激光芯片404a、准直透镜404b及聚焦透镜407分别位于光发射次模块腔体402中。光纤插芯的轴线方向与激光芯片的出光光轴方向平行，光纤适配器的轴线方向A与光纤插芯的轴线方向平行，光纤插芯的轴线方向与光纤插芯中光纤的轴线方向平行(理想状态下为重合)。激光芯片发出的发散光经准直透镜汇聚为平行光，平行光经聚焦透镜的中心汇聚后射入光纤插芯603的入光面。经过两次汇聚之后的光保持原光轴方向，光斑形态未改变，理想状态下为圆形光斑。汇聚后的光满足光纤全反射的角度要求，汇聚光的光轴与光纤入光面垂直。如图14B所示，光线经聚焦透镜407的中心实现汇聚，汇聚后的光耦合至光纤插芯603中，大部分的光通过光纤插芯中心的光纤进行传输，光纤周围分布有较少的光线，图14A的光路结构实现了较高的耦合效率。
光轴与入光面垂直，此时发生的折射具有最小的入射角(0°)以及最小的折射角。图14A采用的光路设计，可以满足光纤全反射的角度要求，光斑形态也有利于光耦合，但是在光纤入光面产生的反射光会沿原光路返回，进而影响激光芯片的出光。
图14A及图14B这种光路设计的优点是采用聚焦透镜的中心进行光路汇聚，可以保持 较好的光斑模斑形态，缺点是光纤入光面产生的反射光会沿原光路回到激光芯片中。
图15A为已有技术提供的光发射次模块光路结构示意图，图15B为图15A中光路结构耦合效率仿真图。光纤插芯斜面的倾斜方向不同仅是视图角度的不同，光纤插芯是圆柱体，旋转视角看到斜面的倾斜方向不同。如图15A所示，激光芯片404a、准直透镜404b及聚焦透镜407分别位于光发射次模块腔体402中，光纤插芯的轴线(光纤的轴线)方向与激光芯片的出光光轴方向平行，光纤适配器的轴线方向A与光纤插芯603的轴线方向平行，光纤插芯的轴线方向与光纤插芯中光纤的轴线方向平行(理想状态下为重合)。激光芯片发出的发散光经准直透镜汇聚为平行光，平行光经聚焦透镜汇聚后射入光纤插芯603的入光面。为了防止反射光可逆的反射回激光芯片，光纤插芯603的入光面为斜面。为了利用折射原理使进入光纤的光满足全反射的条件，光射入聚焦透镜407的非中心位置，光经聚焦透镜404的非中心进行汇聚，经聚焦透镜407改变光的光轴方向后，射入光纤的入光斜面上；在入光斜面发生光折射从而射入光纤中。
如图15A所示，与图14A相比，光纤的入光面为斜面，而光纤插芯中的光纤轴线方向未改变，为了使折射后的光满足全反射的条件，汇聚光肯定不能保持图14A这种传播方向。在本公开提供的某一实施例中，光轴保持图14A中的方向，与激光芯片的出光光轴方向平行，则以非垂直方向射入光线的入光面，入射角减小，折射角也减小，不利于发生全反射。为了增大入射角，图15A的方案中改变了图14A中的光轴方向，经过聚焦透镜汇聚后的光轴方向与激光芯片的出光光轴方向不平行，以增大折射时的入射角。
通过图15B中的仿真图可知，经过聚焦透镜汇聚后的光，其光轴方向发生改变，以使得汇聚后的光与图14B中的传播方向不同，此时光线经聚焦透镜407的非中心位置进行汇聚。为了实现光线中的全反射，射入光纤入光面的光具有特定的入射角度范围，该角度范围也限定了经过聚焦透镜404汇聚的光，不能通过聚焦透镜407的中心进行汇聚。
采用图15A这种光路设计，光轴未通过聚焦透镜407的中心，光经过聚焦透镜后改变了光轴的方向，光斑会发生较大的形变，光斑形状扭曲，光斑的模场分布不规则，耦合进光纤的效率明显降低。
图15A及图15B这种光路设计的优点是防止光纤入光面产生的反射光会沿原光路回到激光芯片中，缺点是未采用聚焦透镜的中心进行光路汇聚，汇聚后的光斑模斑形态产生较大的劣变。
图15C为光轴通过聚焦透镜中心射入倾斜光纤插芯的耦合效率仿真图。如图15C所示，光纤插芯的入光面为斜面，激光芯片404a发出的光经准直透镜404b准直后，由聚焦透镜407汇聚射入光纤适配器603中；光经聚焦透镜407的中心进行汇聚，光纤适配器的轴线方向A与聚焦透镜407的中心轴线方向平行，光纤插芯603的轴线方向与光纤适配器的轴线方向A平行，聚焦透镜的中心轴线方向与光线适配器的轴线方向平行，光纤插芯的轴线方向与光纤插芯中光纤的轴线方向平行(理想状态下为重合)；光经折射后耦合进光纤适配器中，可以看到大量的光线从光纤适配器的光纤中射出，耦合效率较低。
图16A为本公开实施例提供的光发射次模块光路结构示意图，图16B为图16A中光路结构耦合效率仿真图。倾斜的通孔实现光纤插芯轴线的倾斜，同时光纤插芯斜面的倾斜 方向不同仅是视图角度的不同，光纤插芯是圆柱体，旋转视角看到斜面的倾斜方向不同。
如图16A所示，激光芯片404a、准直透镜404b及聚焦透镜407分别位于光发射次模块腔体402中；光纤插芯603的轴线方向与光纤适配器的轴线方向A平行，光纤插芯603中的光纤方向与光纤插芯603的轴线方向平行(理想状态下为重合)；光线插芯的轴线方向与光纤适配器/光纤适配器壳体的轴线方向平行；腔体402上通孔的轴线方向与激光芯片的出光光轴方向不平行，光纤适配器/光纤适配器壳体的轴线方向与腔体402上通孔的轴线方向平行，进而激光芯片的出光光轴方向与光纤适配器/光纤适配器壳体的轴线方向不平行；激光芯片发出的发散光经准直透镜汇聚为平行光，平行光经聚焦透镜汇聚后射入光纤插芯603的斜面603a。
为了防止反射光可逆的反射回激光芯片，光纤的入光面为斜面；为了利用折射原理将光射入光纤中，激光芯片发出的光通过聚焦透镜的中心射出，聚焦过程中没有改变原光轴方向，射入光纤插芯603的斜面603a时，通过光纤插芯603的斜面603a光折射进入光纤插芯603中。信号光通过斜面603a折射进入光纤插芯603，协调控制斜面603a的倾斜角以及通孔的倾斜角，使折射进入光纤插芯603的信号光的光轴方向平行或接近平行于光纤插芯603的轴线方向。
图16A提供的光路设计，目的是光经汇聚后保持较好的光斑模斑形态，并且与光纤插芯603的入光斜面匹配，折射进入光纤插芯603的信号光的光轴方向平行光纤插芯603的轴线方向，以完成光高效率耦合进光纤中。
为了使光经汇聚后保持较好的光斑模斑形态，将光通过聚焦透镜407的中心进行汇聚，光通过聚焦透镜中心的射出，聚焦后的光轴方向没有改变，汇聚之后的光保持汇聚之前的光斑形态，理想状体下可以保持圆形光斑形态，这利于提高光耦合的效率。
为了防止光纤入光面产生的反射光会沿原光路回到激光芯片中，光纤插芯的入光面/光纤的入光面设计成斜面，然而，图14A示出的光路结构表明，当光通过聚焦透镜的中心进行汇聚时，后续与之匹配的光纤入光面不能是斜面，才能满足在入光面处折射后的光可以发生全反射传输；图15A示出的光路结构表明，当入光面为斜面时，在前与之匹配的光不能通过聚焦透镜的中心进行汇聚，才能满足在入光面处折射后的光可以发生全反射传输。
为了使耦合进光纤的光发生全反射，本公开实施例提供一种新的结构设计，通过腔体402上通孔的倾斜，让光纤插芯603的轴线方向与激光芯片的出光方向不平行，让光纤插芯相对激光芯片出光方向倾斜一定的角度。
光折射进入光纤后，与光纤轴线成特定的角度关系，这种角度关系在图14A、图15A及图16A中完全相同，这也是光在光纤中发生全发射的必然要求。
如图16B所示，采用图16A的光路结构，光线通过聚焦透镜407的中心进行汇聚，光纤插芯的入光面呈斜面(斜面603a)，经聚焦透镜汇聚的光可以高效率的耦合进光纤中，大部分的光线进入了光纤中。
图15A与图16A中，以光纤入光斜面603a为参考，光入射的角度相同，光折射后的角度也相同。不同之处在于：图15A中的光纤轴线方向与激光芯片的出光方向平行，光轴通过聚焦透镜的非中心区域；而图16A中光纤轴线方向与激光芯片的出光方向不平行，光 轴通过聚焦透镜的中心区域。进而本公开实施例提供的光路设计，实现折射进入光纤插芯603的信号光的光轴方向平行光纤插芯603的轴线方向，完成光高效率耦合进光纤中。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (10)

  1. 一种光模块，其特征在于，包括：
    光发射次模块，用于输出信号光；
    第一光纤，用于传输所述光发射次模块输出的信号光；
    光纤适配器，一端连接所述光发射次模块，另一端连接所述第一光纤的一端，用于将所述光发射次模块输出的信号光耦合至所述第一光纤；
    第一光纤插座，一端连接所述第一光纤的另一端，用于所述光模块连接外部光纤；
    所述光发射次模块包括：
    光发射次模块腔体，所述光发射次模块腔体的侧壁上设置通孔，所述通孔用于插入所述光纤适配器的一端；
    发光芯片，设置在所述光发射次模块腔体内，用于产生信号光；
    透镜，设置在所述光发射次模块腔体内并设置在所述信号光的传输光路上，用于将所述信号光汇聚至所述光纤耦合器；
    其中，所述通孔向所述光发射次模块腔体的顶面倾斜，以使所述通孔的轴线方向与所述透镜的光轴方向不平行。
  2. 根据权利要求1所述的光模块，其特征在于，所述光纤适配器包括管壳和光纤插芯，所述管壳的轴线方向与所述光纤插芯的轴线方向平行，所述光纤插芯的入光面为斜面。
  3. 根据权利要求1所述的光模块，其特征在于，所述光模块还包括下壳体，所述下壳体支撑连接所述光发射次模块腔体；
    所述下壳体的内表面设置有卡槽，所述卡槽上设置有间隙，所述第一光纤插座上设置有凸起；所述凸起置于所述间隙中，以实现所述第一光纤插座与所述下壳体固定。
  4. 根据权利要求3所述的光模块，其特征在于，所述光模块还包括电路板，所述光发射次模块腔体上设置有开口，所述电路板通过所述开口伸入所述腔体中，所述电路板与所述下壳体固定。
  5. 根据权利要求2所述的光模块，其特征在于，所述管壳内还设置有挡板和隔离器，所述隔离器位于所述挡板的一侧，所述光纤插芯位于所述挡板的另一侧。
  6. 根据权利要求2所述光模块，其特征在于，所述第一光纤位于所述光纤插芯中，所述光纤的轴线方向与所述光纤插芯的轴线方向平行。
  7. 根据权利要求2所述的光模块，其特征在于，所述光纤插芯的轴线方向与所述通孔的轴线方向平行。
  8. 根据权利要求5所述的光模块，其特征在于，所述隔离器的轴线与所述管壳的轴线平行。
  9. 根据权利要求1所述的光模块，其特征在于，所述通孔向所述光发射次模块腔体的顶面倾斜的倾斜角度为3°。
  10. 根据权利要求2所述光模块，其特征在于，所述斜面的倾斜角度为7°。
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