WO2021210187A1

WO2021210187A1 - Component mounter

Info

Publication number: WO2021210187A1
Application number: PCT/JP2020/016980
Authority: WO
Inventors: 弘昭伊奈; 雅明伊藤; 龍平神尾
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2020-04-18
Filing date: 2020-04-18
Publication date: 2021-10-21
Also published as: JPWO2021210187A1; JP7270107B2

Abstract

A component mounter comprises: a mounting head for supporting a holding member that can hold a component; a mounting control unit that controls a mounting operation by performed by the mounting head so that the component is mounted in a prescribed orientation on a substrate; and an assessment unit that, after an attempt has been made to release the component held by the holding member, when the degree of similarity of the external shape of the component and the external shape of a component to be mounted on the substrate in the subsequent mounting operation by the holding member is equal to or greater than a reference value, executes an adhesion assessment as to whether the component is in a state of having adhered to the holding member, and that, when said degree of similarity is less than the reference value, omits the adhesion assessment.

Description

Parts mounting machine

The present invention relates to a component mounting machine.

The component mounting machine executes a mounting process for mounting the component on the board by using a holding member that holds the component. Parts may be unintentionally attached to the holding member due to, for example, dirt. If unnecessary parts are attached to the holding member, it may affect the next part collection operation and mounting operation. Patent Document 1 discloses a configuration for executing an adhesion determination (take-out determination) for confirming whether an unnecessary component is attached to a holding member (suction nozzle), and a configuration for executing a disposal operation for the unnecessary component. ing.

International Publication No. 2016/194174

The above adhesion determination requires imaging of the holding member using a camera and sensing of the holding member using a sensor. As a result, the movement time of the mounting head that supports the holding member and the processing time of the adhesion determination affect the production with the execution of the adhesion determination, which may reduce the productivity.

An object of the present specification is to provide a component mounting machine capable of suppressing a decrease in productivity by omitting an adhesion determination under a predetermined condition.

In the present specification, a mounting head that supports a holding member capable of holding a component, a mounting control unit that controls a mounting operation by the mounting head so that the component is mounted on a substrate in a predetermined posture, and the holding member. After attempting to open the part held by, the similarity between the appearance shape of the part and the appearance shape of the part that the holding member plans to mount on the substrate in the next mounting operation is equal to or higher than the reference value. In this case, a component mounting machine including a determination unit for executing an adhesion determination as to whether or not the component is attached to the holding member and omitting the adhesion determination when the similarity is less than the reference value. To disclose.

According to such a configuration, does the component mounting machine execute the adhesion determination on condition that the appearance shape of the part attempted to be opened and the appearance shape of the part related to the next mounting operation have a high degree of similarity? Switch whether to omit. As a result, the omissible adhesion determination is omitted, so that a decrease in productivity can be suppressed.

It is a schematic diagram which shows the structure of the component mounting machine. It is the top view which shows typically the mounting head. It is a block diagram which shows the function of the component mounting machine. It is a schematic diagram which shows the part held in the posture unsuitable for a suction nozzle. It is a figure which shows a part of the image data including the unsuitable part of FIG. It is a figure which shows the control program and various information. It is a flowchart which shows the mounting process by a component mounting machine. It is a flowchart which shows the recognition process of a holding state.

1. 1. Configuration of the component mounting machine 1 The component mounting machine 1 constitutes a production line for producing board products together with a plurality of types of board-to-board working machines including, for example, another component mounting machine 1. The board-to-board working machine constituting the above-mentioned production line may include a printing machine, an inspection device, a reflow furnace, and the like. The component mounting machine 1 includes a base 2 fixed to the installation floor.

1-1. Board transfer device 10
As shown in FIG. 1, the component mounting machine 1 includes a substrate transfer device 10. The substrate transfer device 10 sequentially conveys the substrate 91 in the transfer direction, and positions the substrate 91 at a predetermined position in the machine.

1-2. Parts supply device 20
The component mounting machine 1 includes a component supply device 20. The component supply device 20 supplies components to be mounted on the substrate 91. The component supply device 20 is equipped with a feeder 22 in each of the plurality of slots 21. To the feeder 22, for example, a tape feeder in which a carrier tape containing a large number of parts is fed and moved so that the parts can be collected is applied.

1-3. Parts transfer device 30
The component mounting machine 1 includes a component transfer device 30. The component transfer device 30 transfers the components supplied by the component supply device 20 to a predetermined mounting position on the substrate 91. The component transfer device 30 includes a head drive device 31, a moving table 32, and a mounting head 33. The head driving device 31 moves the moving table 32 in the horizontal direction (X direction and Y direction) by a linear motion mechanism. The mounting head 33 is detachably fixed to the moving table 32 by a clamp member (not shown), and is provided so as to be movable in the machine in the horizontal direction.

As shown in FIG. 2, the mounting head 33 supports a plurality of holding members so as to be able to move up and down and rotatably around a rotation axis (Q-axis) for each of the plurality of holding members. In the present embodiment, the holding member is a suction nozzle 34 that holds the component 92 by sucking the component 92 with the supplied negative pressure air. As the holding member, a chuck or the like that holds the component by gripping it can be adopted.

The mounting head 33 rotates a plurality of suction nozzles 34 around the R axis extending in the vertical direction. By determining the angle of the mounting head 33 at a predetermined angle around the R axis, the mounting head 33 is determined to an elevating position where one suction nozzle 34 is elevated by the elevating device (not shown). The mounting head 33 raises and lowers the suction nozzle 34 determined to the raising and lowering position among the plurality of suction nozzles 34. It should be noted that the mounting head 33 may adopt a configuration in which two or more elevating positions are provided and a plurality of elevating devices that can be independently driven so that the suction nozzles 34 positioned at each can be elevated.

The number of suction nozzles 34 supported by the mounting head 33 having the above configuration may differ depending on the type of mounting head 33. Further, the mounting head 33 may adopt various modes in addition to the mode in which the plurality of suction nozzles 34 are supported in an annular shape at equal intervals as in the present embodiment. For example, the mounting head 33 may adopt an embodiment in which the mounting head 33 supports a plurality of suction nozzles 34 arranged in a linear or matrix shape. Further, the mounting head 33 may adopt a mode in which only one holding member is supported.

1-4. Parts camera 41, board camera 42
The component mounting machine 1 includes a component camera 41 and a board camera 42. The component camera 41 and the substrate camera 42 are digital image pickup devices having an image pickup element such as CMOS. The component camera 41 and the substrate camera 42 take an image based on the control signal and send out the image data acquired by the image pickup. The component camera 41 is provided on the base 2 and is configured so that the component held by the suction nozzle 34 can be imaged from below. The board camera 42 is provided on the moving table 32 so as to be movable in the horizontal direction integrally with the mounting head 33. The substrate camera 42 is configured so that the substrate 91 can be imaged from above.

2. Control device 50
As shown in FIG. 1, the component mounting machine 1 includes a control device 50. The control device 50 is mainly composed of a CPU, various memories, and a control circuit. The control device 50 includes a storage unit 51 as shown in FIG. The storage unit 51 is composed of an optical drive device such as a hard disk device, a flash memory, or the like. Various data such as the control program M1 and the component information M2 used for controlling the mounting process are stored in the storage unit 51 of the control device 50.

The control program M1 indicates the type, mounting position, mounting angle, and mounting order of the parts 92 mounted on the substrate 91 in the mounting process (see FIG. 6). In the above mounting process, a collecting operation of collecting the component 92 supplied by the component supply device 20 by the holding member (suction nozzle 34) and mounting the component 92 at a predetermined mounting position on the substrate 91 at a predetermined mounting angle are performed. A PP cycle (pick and place cycle) in which the mounting operation is repeatedly executed is included.

The part information M2 includes shape data for each type of the part 92. The above "shape data" includes at least one of the outer edge shape of the part 92, the shape of the feature portion of the part 92, and the dimensions of the part 92. The "outer edge shape" of the component 92 corresponds to the shape of the outer edge when the inside and the background of the component 92 are separated by the outer edge of the component 92 as a boundary.

The "shape of the feature portion" of the part 92 corresponds to the boundary shape of the feature portion on the appearance due to the shape, pattern, color, etc. of the part 92. As the characteristic portion of the component 92, a corner portion, a bump, a terminal, a lead portion, or the like of the component 92 can be applied. Further, in addition to the shape data, the component information M2 may include, for example, the maximum allowable moving speed (acceleration) for each component, a sampling position (for example, a position in contact with the suction nozzle 34), and the like.

2-1. State recognition unit 52
As shown in FIG. 3, the control device 50 includes a state recognition unit 52. The state recognition unit 52 recognizes the holding state of the parts 92 by the plurality of suction nozzles 34 based on the image data M3 acquired by the imaging of the parts camera 41. Specifically, the state recognition unit 52 performs image processing on the image data M3 and recognizes the position and angle of each component 92 with respect to the reference position of the mounting head 33. At this time, the state recognition unit 52 recognizes the position and angle of the component 92 based on the shape and area of the area occupied by the component 92 in the image-processed image data M3.

Further, in the present embodiment, the state recognition unit 52 recognizes whether or not the part 92 is suitable for the mounting operation scheduled to be executed as a holding state based on the appearance shape of the part 92 held by the suction nozzle 34. That is, the holding state by the state recognition unit 52 includes the result of the suitability determination for the mounting operation. Here, in order for the component 92 to be suitable for mounting operation, for example, it is a type specified by the control program M1, the suction nozzle 34 is held at a position and orientation within an allowable range, and the component 92 itself is not defective. It takes.

That is, when the type determined from the appearance shape of the component 92 held by the suction nozzle 34 is different from the type specified by the control program M1, the state recognition unit 52 plans to execute the component 92. It is judged that it is not suitable for the mounting operation of. If the appearance shape of the component 92 cannot be normally determined, the state recognition unit 52 determines that the component 92 is an unsuitable component in the same manner as described above.

Here, as shown in FIG. 4, the suction surface at the tip of the suction nozzle 34 may not come into contact with the upper surface of the component 92 in parallel, and the component 92 may be held at an angle. In such a case, in the image-processed image data M3, the component 92 does not have the original rectangular shape but has a polygonal shape as shown in FIG. When the component 92 is not held in the suction nozzle 34 in an appropriate posture, the state recognition unit 52 determines that the component 92 is unsuitable for the mounting operation scheduled to be executed.

Further, the state recognition unit 52 determines the quality of the component 92 from the appearance of the component 92. For example, the state recognition unit 52 is a virtual plane and a component composed of the tips of the plurality of leads when the component 92 is a lead component and the flatness formed by the tips of the plurality of leads is not within the permissible range. If the distance from the lower surface of the main body is not within the permissible range, it is determined that this lead component is unsuitable for the mounting operation to be executed.

In addition to the component camera 41, the state recognition unit 52 captures image data acquired by, for example, a head camera unit integrally provided with the mounting head 33, capturing the component 92 from the side, below, or above. Image processing may be performed. Further, the state recognition unit 52 may execute the recognition process in the holding state by using the image data M3 acquired by the imaging of the component camera 41 and the head camera unit.

2-2. Mounting control unit 53
As shown in FIG. 3, the control device 50 includes a mounting control unit 53. The mounting control unit 53 controls the mounting operation by the mounting head 33 so that the component 92 is mounted on the substrate 91 in a predetermined posture in the attachment process. At this time, the mounting control unit 53 controls the mounting operation based on the holding state recognized by the state recognition unit 52. That is, the mounting control unit 53 corrects the position of the mounting head 33 and the angle around the Q axis of the suction nozzle 34 so as to correct the deviation of the position and angle of the component 92 held by the suction nozzle 34 with respect to the Q axis. do.

Further, the mounting control unit 53 lowers the suction nozzle 34 in the mounting operation, and after the component 92 comes into contact with the substrate 91, raises the suction nozzle 34 and supplies positive pressure air to the suction nozzle 34 to open the component 92. Try. Then, the mounting control unit 53 separates the suction nozzle 34 from the component 92 and moves the mounting head 33 to mount the component 92 at the next mounting position.

Here, in the holding state recognition process previously executed by the state recognition unit 52, the mounting control unit 53 determines that at least a part of the plurality of parts 92 is an unsuitable component that is not suitable for the mounting operation scheduled to be executed. In that case, the disposal operation of discarding the component 92 is executed. Specifically, in this PP cycle, the mounting control unit 53 skips the mounting operation related to the unsuitable component among the plurality of parts 92, and executes only the mounting operation related to the conforming component. Then, the mounting control unit 53 moves the mounting head 33 so that the suction nozzle 34 for holding the unsuitable parts is located above the waste box 45 installed in the machine.

After that, the mounting control unit 53 cuts off the supply of negative pressure air to the suction nozzle 34 and tries to open the component 92. As a result, the component 92 falls into the disposal box 45 and is collected. After executing the disposal operation as described above, the mounting control unit 53 moves the mounting head 33 to the component supply device 20 side in order to execute the next PP cycle. As described above, the mounting control unit 53 intentionally releases the component 92 from the suction nozzle 34 when the conforming component is mounted and when the inappropriate component is discarded during the mounting process.

2-3. Judgment unit 54
As shown in FIG. 3, the control device 50 includes a determination unit 54. The determination unit 54 executes an adhesion determination as to whether or not the component 92 is attached to the holding member (suction nozzle 34). Here, if the tip of the suction nozzle 34 is dirty with claim solder or the like, the suction nozzle 34 is unintentionally componentized even though the mounting control unit 53 has attempted to release the component 92 from the suction nozzle 34. 92 may be attached. Therefore, the determination unit 54 executes the above-mentioned adhesion determination after trying to release the component 92 from the suction nozzle 34.

Specifically, in the adhesion determination, the determination unit 54 first moves the mounting head 33 so that the suction nozzle 34 to be determined fits in the camera field of view of the component camera 41. Then, the determination unit 54 determines whether the component 92 is attached or not attached to the target suction nozzle 34 based on the image data M3 acquired by the imaging of the component camera 41. In the image processing in this adhesion determination, the determination is made based on the presence or absence of the component 92 around the tip of the target suction nozzle 34.

In the embodiment using such a component camera 41, it is necessary to pass above the component camera 41 when moving the mounting head 33 from the last mounting position to the component supply device 20 side in the PP cycle. Therefore, as the moving distance of the mounting head 33 becomes longer, the time required for the mounting process becomes longer, which may reduce the productivity.

Further, the determination unit 54 may adopt, for example, a mode in which a head camera unit or a dedicated sensor is used in addition to the embodiment in which the component camera 41 is used in the adhesion determination. However, in the embodiment using the head camera unit or the dedicated sensor, sensing of the suction nozzle 34 is required, and if the mounting head 33 waits for movement according to the processing time required for the adhesion determination, the time required for the mounting process is long. It may be long.

Therefore, in the present embodiment, the determination unit 54 adopts a configuration capable of suppressing a decrease in productivity by omitting the adhesion determination under a predetermined condition. Specifically, the determination unit 54 determines that the similarity between the external shape of the component 92 and the external shape of the component 92 to be mounted on the substrate 91 in the next mounting operation is equal to or higher than the reference value. It is executed to determine whether or not the component 92 is attached to the suction nozzle 34. On the other hand, the determination unit 54 omits the adhesion determination when the similarity is less than the reference value.

In the present embodiment, the determination unit 54 calculates the similarity of the appearance shape of the component 92 based on at least one of the outer edge shape of the component 92, the shape of the feature portion of the component 92, and the dimension of the component 92. Specifically, the determination unit 54 acquires the information of the component 92 attempted to be released from the suction nozzle 34 and the information of the component 92 related to the next mounting operation from the control program M1 and the component information M2. For example, when the types of these parts 92 match, the determination unit 54 determines that the degree of similarity between the two is high (“H” in the determination information D3 of the degree of similarity in FIG. 6).

Further, although the types of these parts 92 do not match, in the shape data (outer edge shape, feature portion, dimensions) of the part information M2, for example, the outer edge shape of the part 92 may be indistinguishable or misidentified. When is dissimilar to some extent, the determination unit 54 determines that the similarity between the two is low (“L” in the determination information D3 of the similarity in FIG. 6). In the present embodiment, the reference value of the similarity is when a misidentification may occur in the conformity determination as to whether or not the component 92 conforms to the mounting operation scheduled to be executed in the holding state recognition process by the state recognition unit 52. It is set so that it is judged that the similarity is high.

According to the above configuration, the determination unit 54 relates to the discarded component and the next mounting operation when, for example, the disposal operation of the component 92 is executed and the component 92 is tried to be released from the suction nozzle 34. If the degree of similarity with the part to be mounted is lower than the reference value, the adhesion judgment can be omitted and is not executed. As a result, the time required for the adhesion determination can be shortened, and the processing load can be reduced.

Here, if the adhesion determination is omitted, it is assumed that the next PP cycle will be executed with the component 92 attached to the suction nozzle 34 with a small probability. Then, in the sampling operation using the suction nozzle 34, the waste parts prevent the parts to be mounted from being sucked by the negative pressure air, or the waste parts are mounted in a state of being attached to the side wall of the tip of the suction nozzle 34. Scheduled parts may be sucked.

However, even if the above collection operation is executed, the discarded parts are recognized as unsuitable parts in the subsequent holding state recognition process. This prevents the discarded parts from being mounted on the substrate 91 in the next PP cycle. On the other hand, when the similarity between the appearance shapes of the discarded parts and the parts to be mounted is equal to or higher than the reference value, the adhesion determination is executed, the parts 92 are not attached to the suction nozzle 34, and the next PP is normally performed. It is determined whether the cycle can be executed.

2-4. Notification unit 55
As shown in FIG. 3, the control device 50 includes a notification unit 55. When the notification unit 55 determines by the state recognition unit 52 that the component 92 held next by the holding member (suction nozzle 34) is not suitable for the mounting operation scheduled to be executed after the determination unit 54 omits the adhesion determination. Notify the worker of the abnormality. That is, for example, the adhesion determination is omitted after the disposal operation is executed, the component 92 is attached to the suction nozzle 34, and the indefinite component is determined in the holding state recognition process for the component to be mounted. In this case, the notification unit 55 notifies the abnormality.

At this time, the notification unit 55 may notify that an unsuitable component is detected in the holding state recognition process and that an unintended component 92 may be attached to the suction nozzle 34. As a result, the operator is prompted to confirm the target suction nozzle 34, and can perform maintenance of the suction nozzle 34 as needed.

Further, the notification unit 55 notifies the operator of the abnormality when the component 92 that has been attempted to be opened is attached to the holding member (suction nozzle 34) in the adhesion determination executed by the determination unit 54. That is, the determination unit 54 executes the adhesion determination without omitting it, and when it is detected that the component 92 is attached to the suction nozzle 34 in this adhesion determination, the notification unit 55 informs the operator of the suction nozzle. Notify 34 that there is a possibility that waste parts or inappropriate parts are attached.

3. 3. Mounting process and holding state recognition process 3-1. Mounting process by the component mounting machine 1 The mounting process by the component mounting machine 1 will be described with reference to FIGS. 6 and 7. First, as shown in FIG. 7, the substrate transfer device 10 executes the carry-in process of the substrate 91 (S11). As a result, the substrate 91 is carried into the machine and is positioned at a predetermined position in the machine. Next, the mounting control unit 53 repeatedly executes the sampling operation in the PP cycle over a plurality of times (S12). Subsequently, the state recognition unit 52 executes a process of recognizing the holding state of the parts held by the plurality of suction nozzles 34 (S13).

The mounting control unit 53 repeatedly executes the mounting operation a plurality of times based on the result of the recognition process (S13) (S14). In the mounting operation, the mounting control unit 53 controls the operation of the mounting head 33 so that the component 92 is mounted at a predetermined mounting position designated by the control program M1 at a predetermined mounting angle. It should be noted that, among the plurality of mounting operations included in the PP cycle, mounting control is performed when the sampled component 92 is set to be skipped because it is an inappropriate component in the holding state recognition process (S13). The unit 53 skips the mounting operation.

The mounting control unit 53 executes the disposal process of the component 92 when an inappropriate component is detected in the holding state recognition process (S13) (S15: Yes). The mounting control unit 53 first disposes of unsuitable parts in the disposal box 45 (S21). As a result, each of the plurality of suction nozzles 34 supported by the mounting head 33 is in a state in which the opening of the component 92 is attempted by either the mounting operation (S14) or the disposal operation (S21). Next, the determination unit 54 has similarities between the external shape of the discarded component 92 and the external shape of the component 92 that the suction nozzle 34 holding the component 92 is scheduled to mount on the substrate 91 in the next mounting operation. It is determined whether the value is equal to or higher than the reference value (S22).

Specifically, as shown in FIG. 6, the determination unit 54 recognizes that the third (No. 003) component 92 in this PP cycle is an inappropriate component (“NG” in the mounting suitability determination information D2). If so, the type (Pc) of this part 92 is acquired. Next, the determination unit 54 identifies the suction nozzle 34 (“Nozzle03” in the allocation information D1) assigned to the mounting operation of the inappropriate component, and the component to be mounted by this suction nozzle 34 in the mounting operation of the next PP cycle. Obtain 92 types (Pk).

Subsequently, the determination unit 54 calculates the similarity between the above two types of parts 92 (Pc, Pk) based on the part information M2, and compares them with the preset reference values. The determination unit 54 records the determination result (H / L) of the similarity in the determination information D3. When the similarity is equal to or higher than the reference value (S22: Yes), the determination unit 54 executes an adhesion determination as to whether or not the component 92 is attached to the suction nozzle 34 (S23). Thereby, for example, the image data M3 acquired by the imaging of the component camera 41 is image-processed, and it is determined whether or not the discarded component 92 is attached to the target suction nozzle 34.

In S23, when it is determined that the discarded component 92 is attached to the target suction nozzle 34 (S24: No), the control device 50 executes error processing (S41). Specifically, the control device 50 interrupts the mounting process being executed, and the notification unit 55 notifies the operator of the abnormality. As a result, maintenance such as confirmation of the state of the target suction nozzle 34 by the operator and removal work of unnecessary parts 92 is performed, and then the mounting process is restarted.

On the other hand, in S23, when it is determined that the discarded component 92 is not attached to the target suction nozzle 34 (S24: Yes), or when an inappropriate component is not detected in the holding state recognition process (S13). (S15: No), the control device 50 ends the PP cycle this time. Further, the determination unit 54 omits the adhesion determination (S23) when the similarity is less than the reference value (S22: No).

The mounting control unit 53 determines whether or not all PP cycles have been completed based on the control program M1 (S16). If all the PP cycles have not been completed (S16: No), the mounting control unit 53 repeatedly executes the PP cycle (S12-S14) and, if necessary, the disposal process (S21-S24). When all the PP cycles are completed (S16: Yes), the control device 50 executes the unloading process of the substrate 91 (S17). In the unloading process of the substrate 91, the substrate transport device 10 unclamps the positioned substrate 91 and unloads the substrate 91 out of the component mounting machine 1.

3-2. The holding state recognition process by the state recognition unit 52 The holding state recognition process by the state recognition unit 52 will be described with reference to FIG. First, the state recognition unit 52 acquires the image data M3 (S31). The image data M3 is acquired by, for example, imaging the component camera 41, and includes the component 92 held by the plurality of suction nozzles 34, respectively. The state recognition unit 52 executes image processing such as binarization so that, for example, only the component 92 becomes white and the other parts become black (S32).

The state recognition unit 52 determines whether or not the component 92 is held by the above image processing (S32), whether or not the component 92 is suitable for the mounting operation to be executed, and whether or not the component 92 is suitable for the mounting operation to be executed. Recognize the position and angle as the holding state. When the state recognition unit 52 includes an unsuitable component that is not suitable for mounting operation among the plurality of components 92 (S33: No), the suction nozzle 34 that holds the unsuitable component is discarded in the previous PP cycle. It is determined whether or not the target component 92 is held (S34).

When the suction nozzle 34 holding the inappropriate part holds the part 92 that was the target of the disposal operation in the previous PP cycle (S34: Yes), the control device 50 executes the error processing (S42). This means that the adhesion determination (S23) is omitted after the disposal operation (S21) is executed in the previous PP cycle, and the component 92 for which disposal is attempted is in a state of being attached to the suction nozzle 34. Then, the above state is detected in the recognition process of the holding state of the PP cycle this time. Since the error processing (S42) is the same as the error processing (S41) described above, the description thereof will be omitted.

On the other hand, when the suction nozzle 34 that holds the unsuitable part does not hold the part 92 that was the target of the disposal operation in the previous PP cycle (S34: No), the state recognition unit 52 determines whether or not the mounting is appropriate. The result is recorded in the determination information D2. Specifically, the state recognition unit 52 records "NG" in the mounting suitability determination information D2, assuming that the collected component 92 is an unsuitable component. As a result, the corresponding mounting operation is set to be skipped in this PP cycle.

If the reason for skipping is an inappropriate part, the disposal operation (S21) will be executed. On the other hand, if the reason for skipping is that the component 92 is not held, the disposal operation (S21) is omitted. After the recording of the determination information D2 (S35) is completed, or when a plurality of parts 92 that are not suitable for the mounting operation are not included (S33: Yes), the state recognition unit 52 performs the PP cycle this time. Is enabled to continue, and the process of recognizing the holding state is terminated.

4. Effect of the configuration of the embodiment According to such a configuration, the component mounting machine 1 has a degree of similarity between the external shape of the component 92 that has been attempted to be opened by a disposal operation or the like and the external shape of the component 92 related to the next mounting operation. (S22), it is switched whether to execute or omit the adhesion determination (S23) on the condition of. As a result, the omissible adhesion determination (S23) is omitted, so that a decrease in productivity can be suppressed.

Further, even if the adhesion determination (S23) is omitted under a predetermined condition and the component 92 that has been attempted to be discarded is attached to the suction nozzle 34, in the next PP cycle holding state recognition process (S13). Detected as an inappropriate part. This prevents the discarded parts from being mounted on the substrate 91 in the next PP cycle.

5. Modification of Embodiment In the embodiment, the adhesion determination (S23) is for determining whether or not the component 92 that has been attempted to be opened by disposal is attached to the target suction nozzle 34 after the disposal operation (S21) is executed. It was supposed to be executed. In addition to this, the adhesion determination (S23) can be executed at various timings as long as the holding member (suction nozzle 34) attempts to open the component 92.

For example, the control device 50 may execute the adhesion determination in order to confirm whether or not the component 92 is properly released from the target suction nozzle 34 after executing the mounting operation once or a plurality of times. As for the adhesion determination that can be executed at the above timing, as illustrated in the embodiment, it is possible to apply a configuration that switches whether the adhesion determination is executed or omitted under a predetermined condition. As a result, the same effect as that of the embodiment is obtained.

In the embodiment, the holding member is a suction nozzle 34 that holds the component 92 by sucking the component 92 with the supplied negative pressure air. On the other hand, as the holding member, if the component 92 can be held, a chuck for gripping the component 92 or various end effectors can be adopted as described above. In any aspect, if there is a possibility that the component 92 unintentionally adheres to the holding member due to some factor and the adhesion determination is required, it is decided whether to execute or omit the adhesion determination under predetermined conditions. A switching configuration can be applied.

1: Parts mounting machine, 2: Base, 30: Parts transfer device, 33: Mounting head, 34: Suction nozzle (holding member), 41: Parts camera, 45: Disposal box, 50: Control device, 51: Memory Unit, 52: Status recognition unit, 53: Mounting control unit, 54: Judgment unit, 55: Notification unit, 91: Board, 92: Parts, M1: Control program, M2: Parts information, M3: Image data

Claims

A mounting head that supports a holding member that can hold parts,
A mounting control unit that controls the mounting operation by the mounting head so that the component is mounted on the board in a predetermined posture.
After attempting to open the component held by the holding member, the degree of similarity between the appearance shape of the component and the appearance shape of the component that the holding member plans to mount on the substrate in the next mounting operation is similar. A determination unit that executes an adhesion determination as to whether or not the component is attached to the holding member when the value is equal to or higher than the reference value and omits the adhesion determination when the similarity is less than the reference value.
Parts mounting machine equipped with.
The component mounting machine further includes a state recognition unit that recognizes the holding state of the component by the holding member.
The component mounting machine according to claim 1, wherein the mounting control unit controls the mounting operation based on the holding state recognized by the state recognition unit.
Based on the appearance shape of the part held by the holding member, the state recognition unit recognizes whether or not the part is suitable for the mounting operation to be executed as the holding state.
The component mounting machine according to claim 2, wherein the mounting control unit attempts to open the component by a disposal operation of discarding the component when the component is not suitable for the mounting operation to be executed.
When the state recognition unit determines that the component next held by the holding member is not suitable for the mounting operation to be executed after the determination unit omits the adhesion determination. The component mounting machine according to claim 3, further comprising a notification unit for notifying an operator of an abnormality.
The component according to claim 4, wherein the notification unit notifies the operator of an abnormality when the component attempted to be opened is attached to the holding member in the adhesion determination executed by the determination unit. Wearing machine.
The component mounting machine according to any one of claims 1-5, wherein the mounting head supports a plurality of the holding members so as to be able to move up and down and rotatably around a rotation axis of each holding member.
The component mounting machine according to any one of claims 1-6, wherein the holding member is a suction nozzle that holds the component by sucking the component with supplied negative pressure air.
The component mounting machine is based on a base, a component camera provided on the base and capable of capturing an image of the component held by the holding member from below, and image data acquired by imaging of the component camera. A state recognition unit that recognizes the holding state of the component by the holding member is further provided.
Any one of claims 1-7, wherein the determination unit executes the adhesion determination using image data acquired by imaging of the component camera targeting the holding member for which the component has been tried to open. Parts mounting machine described in the section.
15. The parts mounting machine described in any one of the items.