WO2021201496A1 - Procédé pour former un motif superhydrophobe à l'aide d'un laser - Google Patents

Procédé pour former un motif superhydrophobe à l'aide d'un laser Download PDF

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Publication number
WO2021201496A1
WO2021201496A1 PCT/KR2021/003712 KR2021003712W WO2021201496A1 WO 2021201496 A1 WO2021201496 A1 WO 2021201496A1 KR 2021003712 W KR2021003712 W KR 2021003712W WO 2021201496 A1 WO2021201496 A1 WO 2021201496A1
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WIPO (PCT)
Prior art keywords
laser
pattern
superhydrophobic
forming
processing
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Application number
PCT/KR2021/003712
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English (en)
Korean (ko)
Inventor
이종훈
도우종
김현덕
황준호
이찬우
Original Assignee
경북대학교 산학협력단
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Publication of WO2021201496A1 publication Critical patent/WO2021201496A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing

Definitions

  • the present invention relates to a method for forming a superhydrophobic pattern using a laser.
  • the superhydrophobic surface that blocks water not only controls the wetting properties of micro-array devices that perform bioquantification by approaching new micro- or nano-scales, but also protects micro-electronic devices that are adversely affected by surrounding water or moisture. However, it is being used for surface treatment that can control the growth of cells and for self-cleaning of surfaces such as windows and walls exposed to the outside.
  • superhydrophobic surfaces have already been used in a variety of ways by evolution in the natural world. In particular, they are observed on the leaves of plants such as lotus leaves, the wings of insects living in a humid atmosphere such as mosquitoes, the eyes, and the surfaces of the legs and the legs of water striders. .
  • a superhydrophobic surface with a high contact angle usually more than 150°
  • tangential angle formed by water droplets on the surface and a very small sliding angle, meaning the minimum inclination at which water droplets existing on the surface begin to roll.
  • the demand for occurrence is increasing.
  • a method mainly used in the production field to have superhydrophobicity is made by applying a chemically hydrophobic polymer such as Teflon to the surface of a target solid.
  • a chemically hydrophobic polymer such as Teflon
  • various methods such as surface coating and plasma treatment are being tried.
  • the adhesive force between the target surface and the coated compound is changed in a short time due to time or physical external environment such as the surrounding chemical environment and friction, which causes a lot of problems in use. are doing
  • Micromachining using a laser has the characteristic that the laser beam can be focused in the size of several micrometers to several hundreds of micrometers through optical parts such as lenses or mirrors, so the focal size can be easily changed by selecting an appropriate lens. .
  • the method of forming a superhydrophobic pattern using a laser according to the existing method has a problem in that the substrate may be damaged due to heat damage depending on the wavelength of the laser.
  • the pattern there was a problem in that it was difficult to apply superhydrophobicity to a material having a higher viscosity than water.
  • the present invention intends to propose a method of forming a superhydrophobic pattern using a pulsed laser.
  • a method for forming a superhydrophobic pattern by processing a plurality of grooves using a pulsed laser to form a pattern.
  • the overlapping processing may be performed by shortening the interval between the patterns to be formed rather than the size of the patterns being processed on the surface of the material by using the pulse laser.
  • the distance between the formed laser patterns may be formed to be 30 micrometers or less.
  • the gap width of the pattern processed on the surface of the material by the pulse laser may be equal to or smaller than the size of the pattern.
  • the pulse time of the laser may be a laser having a pulse time of nanoseconds (10 -9 /sec) to femtoseconds (10 -12 /sec) or less.
  • the pulse laser is characterized in that it has a wavelength from the UV region to the IR region, and a superhydrophobic pattern is formed by using a pulse laser having a short time width during laser oscillation.
  • FIG. 1 is a flowchart illustrating a method for forming a superhydrophobic pattern according to the present invention.
  • 2(a) to 2(b) are diagrams for comparatively explaining a laser used for forming a superhydrophobic pattern according to the present invention.
  • FIG 3 is a side view of forming a superhydrophobic pattern using a pulsed laser.
  • FIGS. 4(a) to 4(c) are perspective views illustrating that a superhydrophobic pattern is formed using a pulse laser.
  • 5 (a) to 5 (c) is a view of the superhydrophobic pattern formed according to an embodiment of the present invention observed under a microscope.
  • 6(a) to 6(c) are diagrams illustrating patterns formed according to various pitch lengths observed under a microscope.
  • FIG. 7 is a view illustrating observation of a pattern formed according to a pitch length as a 2D image and a 3D image.
  • the present invention it is possible to impart a hydrophobic function to the surface of a substrate through beam-on-reference superimposition array processing on the surface of a material by using a pulsed laser. More specifically, the superhydrophobic pattern can be implemented by overlapping the pattern shape by shortening the pattern interval than the pattern size of the surface processed by using a pulse laser.
  • FIG. 1 is a flowchart illustrating a method for forming a superhydrophobic pattern according to the present invention.
  • the superhydrophobic pattern can be formed by adjusting the width of the pulse applied by the pulsed laser and the interval between the laser pattern formed by the pulsed laser.
  • the superhydrophobic pattern according to the present invention may be processed so that the pattern formed on the substrate overlaps by forming a pattern pitch shorter than the pattern size (Width). In this way, the patterns are formed to overlap, so that a embossed pattern can be formed on the surface of the substrate, and through this, a surface having superhydrophobic properties can be obtained.
  • 2(a) to 2(b) are diagrams for comparatively explaining a laser used for forming a superhydrophobic pattern according to the present invention.
  • FIG. 2(a) shows an example of forming a pattern using a laser having a long pulse wavelength
  • FIG. 2(b) shows an example of forming a pattern using a laser having a short pulse wavelength
  • Laser ablation processing refers to cutting the surface of a workpiece by irradiating a short-pulse laser beam to the workpiece.
  • the heat-affected zone of the processing part is overwhelmingly smaller than processing by a continuous oscillation laser or a normal pulse laser, so that very high-precision micromachining is possible.
  • FIG 3 is a side view of forming a superhydrophobic pattern using a pulsed laser.
  • the pulse laser may be applied in the form of a triangular pulse on the substrate when viewed from the side.
  • the laser pattern is illustrated to be applied in the form of a triangular pulse, but the laser pattern may be applied in various pulse forms according to settings.
  • the laser pattern may be applied in the form of a semicircle.
  • the array shape of the laser pattern formed on the substrate may be any one of a lens shape (lenticular), a V-groove (V-groove), or a grid shape.
  • the shape of the laser pattern formed on the substrate may be any one of a prism, an R-prism, a circle, a triangle, and a cone.
  • a pattern can be formed on a substrate by using a pulse laser.
  • the pitch interval that is, the interval at which the pattern is formed is shown to be very short, but this is exaggerated to help understanding, and the actual pitch interval may be formed wider than this.
  • a pitch interval which is an interval at which a laser pattern is formed, may be formed to be narrower than a width at which a laser pattern is formed.
  • FIGS. 4(a) to 4(c) are perspective views illustrating that a superhydrophobic pattern is formed using a pulse laser.
  • FIG. 4( a ) a diagram of applying a laser on a substrate using a pulsed laser is disclosed.
  • a laser may be applied on the substrate 10 through the laser applying unit 20 .
  • the substrate 10 may be glass.
  • the substrate 20 may be acrylic.
  • the material of the substrate 10 provided in the present invention is not limited to the same embodiment, and materials having various materials may be selected as the substrate 10 . For this reason, the present invention has the advantage of being able to process various materials.
  • the laser applying unit 20 may include a driving unit capable of driving the laser applying unit 20 .
  • the laser applying unit 20 may be spaced apart from the substrate 10 by a predetermined interval to apply a laser to the substrate.
  • the laser application unit 20 may move in the first direction and apply a laser to the substrate to form a pattern.
  • the laser applying unit 20 may move in a second direction perpendicular to the first direction and apply a laser to the substrate to form a pattern.
  • the first direction may be a horizontal direction of the substrate.
  • the laser application unit 20 may apply the laser 30 on the substrate 10 by adjusting the wavelength, power, and pulse width of the applied laser.
  • the driving unit may control the speed at which the laser moves.
  • the driving unit may control the interval at which the pattern is formed by controlling the speed at which the laser moves and the timing at which the laser applying unit discharges the laser.
  • FIG. 4(b) is an enlarged view of part A in FIG. 4(a), and FIG. 4(c) shows an enlarged view of the pattern portion formed in FIG. 4(b).
  • the interval at which the laser is applied is P, and the size (diameter) of the laser pulse beam is S.
  • S may be the size of the laser pulse.
  • the size of the beam of the laser pulse may be 5 micrometers to 30 micrometers.
  • the interval P at which the laser is applied may have a value smaller than S, which is the size of the beam of the laser pulse.
  • the units of the variables P and S may be micrometers.
  • the superhydrophobic pattern can be formed by forming the embossed pattern through laser processing.
  • a stage on which a substrate is placed may be disposed in a processing chamber for processing a laser pattern, and an optical head may be disposed.
  • the tilt of the material is because it is possible, it is possible to process hydrophobic patterns of 3D shapes such as front and side surfaces.
  • the pattern may be formed on a two-dimensional or three-dimensional surface according to the number of processing axes of the processing chamber.
  • Superhydrophobic patterns can be formed on various sides of the material through the configuration of the x, y, and z axes or additional rotation axes.
  • rotation axis is additionally configured, it may be possible to process a hydrophobic pattern on the surface of a 3D structure according to the additional configuration of the x, y, z axis and the rotation axis in the x, y, z axis (3-axis based) reference plane processing.
  • 5 (a) to 5 (c) is a view of the superhydrophobic pattern formed according to an embodiment of the present invention observed under a microscope.
  • FIG. 5 (a) to 5 (b) is a view of the surface of the formed pattern observed under a microscope
  • Figure 5 (c) is a view taken from the side of an enlarged one of the formed pattern.
  • 6(a) to 6(c) are diagrams illustrating a microscope observation of a surface of a laser pattern formed according to various pitch lengths.
  • Figure 6 (a) shows the result of observing the pattern when the pitch length is 10 micrometers.
  • 6(b) shows the result of observing the pattern when the pitch length is 20 micrometers.
  • 6( c ) shows the result of observing the pattern when the pitch length is 30 micrometers.
  • the pulse width of the laser pattern tested in FIGS. 6(a) to 6(c) was set to a value greater than 30 micrometers.
  • FIG. 7 is a diagram illustrating observation of a pattern formed according to a pitch length as a 2D image and a 3D image.
  • the hydrophobic embossed pattern is implemented when the pitch interval is 10 micrometers. It can be confirmed that this is formed in a nanoscale pattern.
  • the laser according to the present invention may utilize a pulse laser. More preferably, the pulse time of the laser according to the present invention may be a laser having a short time from nanoseconds (Nanosecond, 10 -9 /sec) to femtoseconds (10 -15 /sec) or less. These pulse lasers have temporal oscillation and stop functions, so they are more efficient in pattern processing.
  • the laser wavelength according to the present invention may be a laser having a wavelength between the UV and IR region.
  • a laser that satisfies the above conditions it is possible to perform pattern processing more easily, and even when patterns overlap during processing to form a superhydrophobic pattern, other patterns can be prevented from being affected. have.
  • various wavelengths there is an advantage that patterns can be formed based on various materials such as polymers and metals.
  • the method for forming a superhydrophobic pattern according to the present invention may form a pattern by utilizing process conditions of a laser output of 0.1 mW or more, a processing repetition number of 1 or more, and a processing speed of 0.01 mm/sec or more.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Optical Integrated Circuits (AREA)
  • Lasers (AREA)

Abstract

Selon un mode de réalisation, la présente invention concerne un procédé pour former un motif superhydrophobe. Dans le procédé de formation de motif, en utilisant le laser à impulsions, un intervalle de motif de référence de taille de motif à traiter sur la surface d'un matériau est réduit et, ainsi, une super-hydrophobicité peut être conférée à la surface d'un matériau de base par découpe par chevauchement d'une forme de motif.
PCT/KR2021/003712 2020-03-31 2021-03-25 Procédé pour former un motif superhydrophobe à l'aide d'un laser WO2021201496A1 (fr)

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KR1020200039117A KR102423770B1 (ko) 2020-03-31 2020-03-31 레이저를 이용한 초소수성 패턴 형성 방법
KR10-2020-0039117 2020-03-31

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WO2021201496A1 true WO2021201496A1 (fr) 2021-10-07

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090061380A (ko) * 2007-12-11 2009-06-16 한국기계연구원 초발수 제품 성형 방법
KR20110047098A (ko) * 2009-10-29 2011-05-06 한국세라믹기술원 친수/발수 패터닝 유리기판 제조방법
KR20120108752A (ko) * 2011-03-25 2012-10-05 한국기계연구원 미세 요철부를 형성하기 위한 레이저 가공 방법
WO2012157822A1 (fr) * 2011-05-13 2012-11-22 Lee Sanghyun Procédé de traitement de nanopores
KR20200022185A (ko) * 2018-08-22 2020-03-03 울산대학교 산학협력단 초소수성 패턴을 갖는 바이오칩 및 초소수성 패턴을 갖는 바이오칩 제조방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101442061B1 (ko) 2013-09-02 2014-09-18 국립대학법인 울산과학기술대학교 산학협력단 초소수성 나노 그래핀 및 그 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090061380A (ko) * 2007-12-11 2009-06-16 한국기계연구원 초발수 제품 성형 방법
KR20110047098A (ko) * 2009-10-29 2011-05-06 한국세라믹기술원 친수/발수 패터닝 유리기판 제조방법
KR20120108752A (ko) * 2011-03-25 2012-10-05 한국기계연구원 미세 요철부를 형성하기 위한 레이저 가공 방법
WO2012157822A1 (fr) * 2011-05-13 2012-11-22 Lee Sanghyun Procédé de traitement de nanopores
KR20200022185A (ko) * 2018-08-22 2020-03-03 울산대학교 산학협력단 초소수성 패턴을 갖는 바이오칩 및 초소수성 패턴을 갖는 바이오칩 제조방법

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KR20210121801A (ko) 2021-10-08
KR102423770B1 (ko) 2022-07-22

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