WO2021196422A1

WO2021196422A1 - Laser cleaning system and method for protecting base materials from being burnt and melting

Info

Publication number: WO2021196422A1
Application number: PCT/CN2020/097980
Authority: WO
Inventors: 袁和平; 陈水宣; 洪昭斌; 陈杰; 姚飞闪
Original assignee: 厦门理工学院; 厦门华联电子股份有限公司
Priority date: 2020-04-01
Filing date: 2020-06-24
Publication date: 2021-10-07
Also published as: CN111530853A

Abstract

A laser cleaning system for protecting base materials from being burnt and melting, which system relates to the technical field of laser cleaning. The system comprises: a control module (1); and a laser cleaning module (2), a temperature regulation module (3), a temperature detection module (4) and a base material melting-point data center (5), which are all connected to the control module (1), wherein the laser cleaning module (2) is used for focusing a laser and cleaning base materials; the temperature detection module (4) is used for detecting the temperature of cleaning points of the base materials and feeding same back to the control module (1); the base material melting-point data center (5) is used for recording the melting point value of each base material; the control module (1) is used for comparing a cleaning temperature, which is fed back, with the melting point value of the base material and sending a control signal; and the temperature regulation module (3) receives the control signal and is used for regulating the laser emission temperature of the laser cleaning module (2). In the system, a laser temperature can be adjusted according to the melting point value of a base material, so as to protect the base material from being burnt and melting during cleaning. The system has the advantage of improving the cleaning effect.

Description

Laser cleaning system and method for protecting base material from being sintered

Technical field

The invention relates to the technical field of laser cleaning, and more specifically, it relates to a laser cleaning system and method for protecting a substrate from being sintered.

Background technique

Pollutant spots such as rust, corrosion, and oil stains often appear on the surface of metal plates. There are many ways to clean metals in the prior art. Basically, they use chemical agents and mechanical methods to clean. With people’s increasing awareness of environmental protection and safety Intensified, my country's requirements for industrial environmental protection are getting higher and higher. When the environmental protection requirements are met, the types of chemicals that can be used in industrial cleaning are becoming fewer and fewer.

Therefore, a laser cleaning method is designed in the prior art. Laser cleaning has the cleaning characteristics of non-grinding, non-contact, non-thermal effect and suitable for objects of various materials, and is considered to be the most reliable and effective solution. At the same time, laser cleaning can solve problems that cannot be solved by traditional cleaning methods. In the prior art, laser cleaning usually emits a laser directly at the workpiece, so as to use the laser to clean the stains on the workpiece. However, the base material of each workpiece has a melting point value. If the laser cleaning temperature is too high, it may cause the workpiece to be melted, causing damage to the workpiece, and affecting the cleaning effect.

Summary of the invention

In view of the shortcomings of the prior art, the purpose of the present invention is to provide a laser cleaning system that protects the substrate from being fused, which can adjust the laser temperature according to the melting point of the substrate, protect the substrate from being fused during cleaning, and improve Advantages of cleaning effect.

In order to achieve the above objective, the present invention provides the following technical solutions:

A laser cleaning system for protecting a substrate from being fused, comprising a control module, a laser cleaning module, a temperature adjustment module, a temperature detection module, and a base material melting point data center all connected to the control module, the laser cleaning module is used to focus the laser And clean the substrate, the temperature detection module is used to detect the temperature of the substrate cleaning point and feed it back to the control module, the substrate melting point data center is used to record the melting point value of each substrate, and the control module is used to The feedback cleaning temperature is compared with the melting point value of the substrate and a control signal is sent. The temperature adjustment module receives the control signal and is used to adjust the laser emission temperature of the laser cleaning module.

Further arrangement: the laser cleaning module includes a mounting frame, a laser head arranged on the mounting frame, and a moving mechanism for driving the laser head to move closer to or away from the substrate, and the laser head is used to emit toward the cleaning point For the laser, the moving mechanism is connected to a control module, and the control module controls the moving mechanism to drive the moving stroke value of the laser head according to the temperature feedback from the temperature detection module.

It is further provided that the moving mechanism includes a sliding seat slid on the mounting frame and a pushing cylinder for pushing the sliding seat to move, the laser head is mounted on the sliding seat, and a displacement sensor is provided on the sliding seat. The sensor is connected to the control module, the control module sets the stroke value range according to the substrate melting point value determined by the substrate melting point data center, the displacement sensor feeds back the sliding stroke of the sliding seat and feeds it back to the control module, and the control module controls and pushes The pushing stroke value of the cylinder, and the pushing stroke value is within the range of the stroke value.

Further arrangement: a proportional valve used to precisely control the amount of intake air is provided on the intake end of the pushing cylinder.

Further setting: the temperature adjustment module includes a regulator for adjusting the laser emission power and a cooling module for reducing the temperature of the laser cleaning module, the regulator and the cooling module are both connected to the laser cleaning module, and are controlled by On the control module.

Further arrangement: the cooling module includes a water cooling pipe arranged in the laser cleaning module, a water chiller connected to the water inlet end of the water cooling pipe, and a water return pipe connected to the water outlet end of the water cooling pipe.

Further configuration: the temperature detection module includes an infrared thermal imager, a data transmitter connected to the infrared thermal imager, and a data receiver set on the control module, the data receiver is connected to the data transmitter and used to receive data transmission Data from the device.

Further arrangement: it also includes a cooling protection device for cooling the substrate, the cooling protection device is located at one side of the laser cleaning device, and the cooling protection device is connected to the control module.

It is further provided that the cooling protection device includes a cooling box, a cooling gas filled in the cooling box, and a gas spray head for spraying the cooling gas onto the surface of the substrate, and the gas spray head is connected to the cooling box through a gas pipe.

Compared with the prior art, the present invention has the following advantages by adopting the above technical solutions:

1. Determine the melting point value of the substrate through the substrate melting point data center, and the control module outputs the corresponding laser power to clean the workpiece to prevent the laser cleaning temperature from exceeding the melting point value to provide protection for the cleaning of the substrate and improve the cleaning effect advantage;

2. The temperature detection module detects the temperature value of the substrate during cleaning in real time, and feeds the temperature value back to the control module. If the detected temperature exceeds the melting point of the substrate, the temperature adjustment module adjusts the laser emission temperature to realize the adjustment of the laser The effect of cleaning temperature prevents the substrate from being sintered and has the advantage of improving the cleaning effect;

3. The moving mechanism drives the laser head to move, which can adjust the distance between the laser head and the substrate, thereby adjusting the cleaning temperature of the substrate cleaning point, and avoiding the substrate from being smelted;

4. The cooling protection device provided can cool the cleaned substrate and provide cooling protective gas to prevent oxidation, so as to protect the substrate, facilitate thorough cleaning of the substrate, and have the advantage of improving the cleaning effect.

The second object of the present invention is to provide a laser cleaning method for protecting the substrate from being sintered, adjusting the laser temperature according to the melting point of the substrate, protecting the substrate from sintering during cleaning, and having the advantage of improving the cleaning effect.

A laser cleaning method for protecting a substrate from sintering, using the aforementioned laser cleaning system, includes the following steps:

S1. Position the substrate pair on the laser cleaning module, and enter the substrate information into the control module, and the control module compares the substrate melting point data center to determine the substrate melting point value;

S2. Start the laser cleaning module to clean the substrate, detect the temperature value at the cleaning point of the substrate through the temperature detection module, and feed it back to the control module in real time;

S3. The control module compares the feedback cleaning point temperature value with the determined substrate melting point value, and sends a control signal to control the temperature adjustment module to adjust the temperature of the laser cleaning module to prevent the cleaning point temperature value from exceeding the substrate melting point value.

By determining the melting point value of the substrate, the melting point value is compared with the temperature value of the cleaning point during the cleaning process of the substrate, so as to facilitate the use of the temperature adjustment module to adjust the laser emission temperature and prevent the temperature of the substrate cleaning point from exceeding the melting point of the substrate. The material is not melted and has the advantage of improving the cleaning effect.

Description of the drawings

Figure 1 is a schematic diagram of a laser cleaning system for protecting a substrate from being sintered;

Figure 2 is a schematic diagram of the structure of the laser cleaning module;

FIG. 3 is a schematic diagram of the connection relationship between the temperature detection module and the temperature adjustment module connected to the laser cleaning module.

In the figure: 1. Control module; 2. Laser cleaning module; 21. Mounting frame; 22. Laser head; 23. Moving mechanism; 231. Sliding seat; 232. Push cylinder; 233. Displacement sensor; 234. Proportional valve; 3. 31. Regulator; 32. Cooling module; 321. Water cooling pipe; 322. Chiller; 323. Return pipe; 324. Heat exchanger; 4. Temperature detection module; 41. Infrared thermal imager; 42 4. Data transmitter; 43. Data receiver; 5. Base material melting point data center; 6. Cooling protection device; 61. Cooling box; 62. Cooling gas; 63. Gas nozzle.

Detailed ways

The laser cleaning system that protects the substrate from being sintered will be further described with reference to FIGS. 1 to 3.

A laser cleaning system for protecting substrates from melting, as shown in FIG. 1, includes a control module 1 and a laser cleaning module 2, a temperature adjustment module 3, a temperature detection module 4, a cooling protection device 6 connected to the control module 1, and The base material melting point data center 5 uses the temperature detection module 4 to detect the temperature of the laser cleaning point, and feeds it back to the control module 1. The control module 1 compares the temperature detected by the temperature detection module 4 with the melting point of the cleaning substrate, and According to the comparison result, a control signal is sent to the temperature adjustment module 3. The temperature adjustment module 3 adjusts the laser emission temperature of the laser cleaning module 2 to ensure that the temperature is lower than the melting point of the substrate, and the cooling protection device 6 provides further protection and cooling for the substrate. In this way, while ensuring the cleaning effect, the substrate is prevented from being sintered.

As shown in Figure 1, the base material melting point data center 5 is set up as a computer that records the melting point data of various base materials, and the computer has a storage hard disk. The melting point value of the substrate is recorded in the storage hard disk to ensure that it can be directly queried later. The control module 1 is set as a PLC controller. When in use, first operate the substrate melting point data center 5 to query the melting point value of the substrate to be cleaned, and send the value to the control module 1, so that the control module 1 can send out corresponding control signals. Thereby improving the cleaning effect and preventing the substrate from being sintered.

As shown in Figures 1 and 3, the temperature detection module 4 includes an infrared thermal imager 41, a data transmitter 42 connected to the infrared thermal imager 41, and a data receiver 43 arranged on the control module 1, wherein the infrared thermal imager The meter 41 is arranged on the laser cleaning module 2 and can move along with the laser cleaning emission point of the laser cleaning module 2 to accurately and real-time locate the laser cleaning point, so as to detect and image the temperature of the laser cleaning point. The data transmitter 42 is used to send out the data signals tested by the infrared thermal imager 41, and the data receiver 43 is connected to the data transmitter 42 and used to receive the data fed back by the data transmitter 42, specifically, the data receiver 43 and the data transmitter 42 is transmitted through a wireless network signal to facilitate the control module 1 to receive the temperature value of the laser cleaning point during cleaning in real time, so as to facilitate timely adjustment according to the melting point value of the substrate.

As shown in Figures 1 and 2, the laser cleaning module 2 includes a mounting frame 21, a laser head 22 arranged on the mounting frame 21, and a moving mechanism 23 for driving the laser head 22 to move closer to or away from the substrate. The laser head 22 is connected with a laser transmitter. The laser transmitter connects the laser light to the laser head 22 through a polarizer, and the extension direction of the laser beam refracted by the polarizer to the laser head 22 is consistent with the driving direction of the moving mechanism 23 to ensure the laser During the movement, the head 22 can receive laser light and emit it to clean the substrate. The moving mechanism 23 is connected to the control module 1. The control module 1 controls the moving mechanism 23 to drive the movement stroke value of the laser head 22 according to the temperature detection module 4 feedback, thereby adjusting the distance between the laser head 22 and the substrate, so that the laser is emitted The distance between the dot and the cleaning point of the substrate is appropriately adjusted according to temperature changes to further prevent the substrate from being fused.

As shown in Figures 1 and 3, the temperature adjustment module 3 includes a regulator 31 for adjusting the laser emission power and a cooling module 32 for reducing the temperature of the laser cleaning module 2, wherein the regulator 31 and the cooling module 32 are both The laser cleaning module 2 is connected, and the cooling module 32 is arranged on the laser head 22 to cool down the laser head 22, adjust the laser emission temperature, and adjust the laser emission power in conjunction with the regulator 31 to reduce the overall laser emission temperature, so as to prevent the substrate from being damaged. Fuse. The regulator 31 and the cooling module 32 are both controlled by the control module 1. The control module 1 sends out a control signal after comparing the melting point value of the substrate with the temperature detected by the temperature detection module 4 to make the regulator 31 cooperate with the cooling module 32. Adjust the laser emission temperature to a reasonable temperature range to ensure the cleaning effect and avoid the substrate from being fused.

As shown in Figures 1 and 3, the cooling module 32 includes a water cooling tube 321 arranged in the laser head 22 of the laser cleaning module 2, a chiller 322 connected to the water inlet end of the water cooling tube 321, and a water cooling tube 321 connected to the water outlet end of the water cooling tube 321. The water return pipe 323 is cooled by the water chiller 322 and transported to the water cooling pipe 321, so that the water cooling pipe 321 is used for cooling, which is convenient for adjusting the temperature of the laser head 22 and cooling the laser emission temperature. Wherein, the return pipe 323 is provided with a heat exchanger 324, and the end of the return pipe 323 away from the water-cooled pipe 321 is connected to the chiller 322, so that the water in the return pipe 323 passes through the heat exchanger 324 and then circulates it. Cooling is performed in the chiller 322 to form a circulation loop, which facilitates the continuous use of the cooling water.

As shown in Figures 1 and 2, the cooling protection device 6 includes a cooling box 61, a cooling gas 62 filled in the cooling box 61, and a gas spray head 63 for spraying the cooling gas 62 onto the surface of the substrate, wherein the gas spray head 63 is connected to the cooling box 61 through a gas pipe, and the cooling box 61 cools the gas in the cooling box 61 through a refrigeration system, so that the cooling gas 62 is sprayed onto the substrate through the gas nozzle 63 for cooling and cooling to protect the substrate. Specifically, the gas is argon or nitrogen, and the pressure of the cooling gas 62 is 0.3-0.6 MPa, so that the cooling gas 62 can protect the cleaned area of the substrate and prevent the cleaned area of the substrate from reacting with oxygen to generate new oxidation. At the same time, it can speed up the cooling of the cleaned area and protect the substrate from being melted by the second laser.

As shown in Figures 1 and 2, during the movement of the laser head 22, it is driven by the moving mechanism 23. Specifically, the moving mechanism 23 includes a sliding seat 231 slid on the mounting frame 21 and a push for pushing the sliding seat 231 to move. Air cylinder 232, in which the laser head 22 is mounted on the sliding seat 231, and a displacement sensor 233 is arranged on the sliding seat 231. The displacement sensor 233 is connected to the control module 1. The control module 1 determines the melting point of the substrate according to the melting point of the substrate 5 in the data center 5. Set the stroke value range, the displacement sensor 233 feeds back the sliding stroke of the sliding seat 231 and feeds it back to the control module 1. The control module 1 controls the pushing stroke value of the pushing cylinder 232, and the pushing stroke value is within the range of the stroke value to facilitate the adjustment of the laser The temperature of the cleaning point during cleaning to prevent the substrate from being melted. Further, a proportional valve 234 for accurately controlling the intake air volume is provided on the intake end of the pushing cylinder 232 to improve the accuracy of controlling the stroke of the laser head 22.

Working principle: When in use, the laser head 22 is positioned at the substrate, and the specific melting point value of the substrate is searched and determined in the substrate melting point data center 5, so that the melting point value of the substrate is fed back to the control module 1 for recording. The control module 1 preliminarily determines the laser emission power according to the melting point of the substrate, and then starts the laser cleaning module 2 to perform laser cleaning on the substrate. During the cleaning process, the temperature detection module 4 detects the temperature of the laser cleaning point of the substrate in real time and feeds back the temperature. To control module 1. The control module 1 compares the detected temperature with the melting point value of the substrate according to the received detection temperature. If it is lower than the melting point of the substrate, the current cleaning parameters are maintained; if it is higher than the melting point of the substrate, it sends a control signal to the temperature adjustment module 3 and the moving mechanism 23. By adjusting the laser emission power, the distance between the laser head 22 and the substrate, and cooling the laser head 22, the temperature of the laser cleaning point on the substrate can be adjusted, and the adjusted temperature is consistent with that the substrate is not In the case of the melting point, the laser cleaning temperature can be fully adjusted to ensure the accuracy of the adjustment and improve the cleaning effect while avoiding the substrate from being smelted. And during the cleaning process, the cooling protection device 6 sprays cooling gas 62 to the cleaned part of the substrate to protect the substrate from secondary oxidation, and at the same time cools the cleaned part of the substrate to protect the substrate from sintering. Through the above solution, the present invention can adjust the laser temperature according to the melting point of the substrate, protect the substrate from being melted during cleaning, and has the advantage of improving the cleaning effect.

The second embodiment, the difference between this embodiment and the first embodiment is to provide a laser cleaning method for protecting the substrate from being sintered, using the laser cleaning system mentioned in the first embodiment, including the following steps:

S1. Position the substrate pair on the laser cleaning module 2, and record the substrate information into the control module 1, and the control module 1 compares the substrate melting point data center 5 to determine the substrate melting point value;

S2. Start the laser cleaning module 2 to clean the substrate, detect the temperature value at the cleaning point of the substrate through the temperature detection module 4, and feed it back to the control module 1 in real time;

S3. The control module 1 compares the feedback cleaning point temperature value with the determined substrate melting point value, and sends a control signal to control the temperature adjustment module 3 to adjust the temperature of the laser cleaning module 2 to prevent the cleaning point temperature value from exceeding the substrate melting point value.

The above are only the preferred embodiments of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments. All technical solutions under the idea of the present invention belong to the protection scope of the present invention. It should be pointed out that for those of ordinary skill in the art, several improvements and modifications made without departing from the principle of the present invention, these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

A laser cleaning system for protecting a substrate from being fused, which is characterized by comprising a control module (1), a laser cleaning module (2), a temperature adjustment module (3), and a temperature detection module all connected to the control module (1) (4) With the substrate melting point data center (5), the laser cleaning module (2) is used to focus the laser and clean the substrate, and the temperature detection module (4) is used to detect the temperature of the substrate cleaning point and feed it back to On the control module (1), the base material melting point data center (5) is used to record the melting point value of each base material, and the control module (1) is used to compare the feedback cleaning temperature with the base material melting point value and issue a control Signal, the temperature adjustment module (3) receives the control signal and is used to adjust the laser emission temperature of the laser cleaning module (2).
The laser cleaning system for protecting substrates from melting according to claim 1, wherein the laser cleaning module (2) comprises a mounting frame (21), and a laser head arranged on the mounting frame (21) (22) and a moving mechanism (23) for driving the laser head (22) to move closer to or away from the substrate, the laser head (22) is used to emit laser light to the cleaning point, and the moving mechanism (23) ) Is connected to the control module (1), and the control module (1) controls the movement mechanism (23) to drive the movement stroke value of the laser head (22) according to the feedback temperature of the temperature detection module (4).
The laser cleaning system for protecting substrates from being melted according to claim 2, wherein the moving mechanism (23) comprises a sliding seat (231) slid on the mounting frame (21) and a sliding seat (231) for pushing The sliding seat (231) is moved to push the cylinder (232), the laser head (22) is mounted on the sliding seat (231), and the sliding seat (231) is provided with a displacement sensor (233), and the displacement sensor ( 233) Connected to the control module (1), the control module (1) sets the stroke value range according to the base material melting point value determined by the base material melting point data center (5), and the displacement sensor (233) feeds back the sliding seat (231) The sliding stroke is fed back to the control module (1), and the control module (1) controls the pushing stroke value of the pushing cylinder (232), and the pushing stroke value is within the range of the stroke value.
The laser cleaning system for protecting substrates from smelting according to claim 3, characterized in that, a proportional valve (234) for precisely controlling the amount of intake air is provided on the intake end of the pushing cylinder (232) .
The laser cleaning system for protecting substrates from being melted according to claim 1, wherein the temperature adjustment module (3) includes a regulator (31) for adjusting the laser emission power and for reducing the laser emission power. The temperature cooling module (32) of the cleaning module (2), the regulator (31) and the cooling module (32) are all connected to the laser cleaning module (2), and are all controlled by the control module (1).
The laser cleaning system for protecting substrates from melting according to claim 5, wherein the cooling module (32) comprises a water-cooled tube (321) arranged in the laser cleaning module (2), and a water-cooled The water chiller (322) connected to the water inlet end of the pipe (321) and the return pipe (323) connected to the water outlet end of the water cooling pipe (321).
The laser cleaning system for protecting substrates from being melted according to claim 1, wherein the temperature detection module (4) comprises an infrared thermal imager (41) connected to the infrared thermal imager (41) The data transmitter (42) and the data receiver (43) set on the control module (1), the data receiver (43) is connected with the data transmitter (42) and is used to receive feedback from the data transmitter (42) The data.
The laser cleaning system for protecting the substrate from melting according to claim 1, further comprising a cooling protection device (6) for cooling the substrate, and the cooling protection device (6) is located in the laser One side of the cleaning device, and the cooling protection device (6) is connected with the control module (1).
The laser cleaning system for protecting substrates from being melted according to claim 5, wherein the cooling protection device (6) comprises a cooling box (61), and a cooling gas (6) filled in the cooling box (61). 62) and a gas spray head (63) for spraying cooling gas (62) onto the surface of the substrate, and the gas spray head (63) is connected to the cooling box (61) through a gas pipe.
A laser cleaning method for protecting a substrate from melting, using the laser cleaning system according to any one of claims 1-9, characterized in that it comprises the following steps:

S1. Position the substrate pair on the laser cleaning module (2), and enter the substrate information into the control module (1), and the control module (1) compares the substrate melting point data center (5) to determine the substrate melting point value;

S2. Start the laser cleaning module (2) to clean the substrate, detect the temperature value at the cleaning point of the substrate through the temperature detection module (4), and feed it back to the control module (1) in real time;

S3. The control module (1) compares the feedback temperature value of the cleaning point with the determined melting point value of the substrate, and sends a control signal to control the temperature adjustment module (3) to adjust the temperature of the laser cleaning module (2) to prevent the temperature value of the cleaning point Exceeds the melting point of the base material.