WO2021189876A1 - 一种在工件表面形成微结构的加工方法及控制系统 - Google Patents

一种在工件表面形成微结构的加工方法及控制系统 Download PDF

Info

Publication number
WO2021189876A1
WO2021189876A1 PCT/CN2020/129340 CN2020129340W WO2021189876A1 WO 2021189876 A1 WO2021189876 A1 WO 2021189876A1 CN 2020129340 W CN2020129340 W CN 2020129340W WO 2021189876 A1 WO2021189876 A1 WO 2021189876A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
microstructure
wire electrode
processing method
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/129340
Other languages
English (en)
French (fr)
Inventor
贺海东
王春举
孙宇
刘楠
孙立宁
宁学中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou University
Original Assignee
Suzhou University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou University filed Critical Suzhou University
Publication of WO2021189876A1 publication Critical patent/WO2021189876A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
    • B23H3/04—Electrodes specially adapted therefor or their manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
    • B23H3/02—Electric circuits specially adapted therefor, e.g. power supply, control, preventing short circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
    • B23H9/008—Surface roughening or texturing

Definitions

  • the invention relates to a processing method and a control system for forming a microstructure on the surface of a workpiece.
  • Surface microtexturing technology refers to the use of microfabrication methods to construct a series of microstructure arrays with a certain shape, size and arrangement on the surface of a material, so as to improve/regulate the surface characteristics of the material.
  • surface microtexturing technology has been used in bionics, tribology (reduce friction, reduce tool wear and reduce adhesion), microfluid mechanics (microchannel drag reduction) and biomedicine ( Improving the biocompatibility of implants) and other fields have been successfully applied, and achieved good results.
  • microstructure array (microtexture) processing technologies mainly include micro-milling, laser processing, abrasive gas jet, electric discharge machining, and mask electrochemical machining.
  • micro-milling has processing stress and surface residual stress, and it is difficult to achieve texture treatment on the surface of difficult-to-machine materials; laser processing and EDM surfaces have heat-affected zones, and the surface The roughness is poor; the abrasive gas jet is only suitable for processing brittle materials.
  • TMECM Mask Electrochemical Machining
  • the mask when the characteristic parameters of the required array structure need to be changed, if the traditional TMECM process is adopted, the mask must be remade, which not only causes a waste of materials, but also greatly prolongs the process cycle.
  • the existing mask electrochemical machining technology is usually used for the preparation of planar or large-diameter revolving surface microstructure arrays, and it is difficult to achieve small-diameter revolving and quasi-rotating thin-walled curved surfaces (for example: inner/outer revolving surfaces of cardiovascular stents, Micro-gears, cams and other quasi-rotating contour surfaces, etc.) processing of micro-structure arrays.
  • the purpose of the present invention is to provide a processing method for forming microstructures on the surface of a workpiece, so as to realize the flexibility and controllable preparation of the microstructure array on the surface of the workpiece, especially to realize the cross-scale of the small-diameter revolving surface, the quasi-revolving surface, and the revolving inner surface High-quality flexible processing of microstructure arrays.
  • a processing method for forming a microstructure on the surface of a workpiece comprising:
  • the first microstructure is obtained by one of laser processing, electron beam processing, chemistry and laser processing.
  • an ultra-short pulse power supply is used for power supply.
  • the ultrashort pulse duration may be 50-500 ns, and the pulse period may be 0.1-1 MHz.
  • the fine rod is a metal rod.
  • the diameter of the metal rod is 0.1-3.0 mm.
  • the first microstructure is one of a groove type, a quasi-groove type, and a lattice type.
  • the surface of the workpiece is one of a revolving inner surface, a revolving outer surface, a quasi-revolving inner surface, a quasi-revolving outer surface, a plane, and a quasi-plane.
  • the method further includes washing and drying the micro-rods.
  • the present invention also provides a control system that realizes the formation of microstructures on the surface of a workpiece.
  • the processing method of forming a microstructure on the surface of the workpiece is used to process the workpiece arranged in the electrolyte as the anode.
  • the control system includes A wire electrode arranged in the electrolyte, a power supply device electrically connected to the wire electrode and the workpiece, the power supply device forms a loop with the wire electrode and the workpiece, wherein the wire electrode is a cathode, The workpiece is an anode.
  • the beneficial effect of the present invention is that the processing method for forming a microstructure on the surface of a workpiece provided by the present invention uses the wire electrode of the first microstructure with a large electrochemical impedance value as the tool electrode, and the rotation of the wire electrode is controlled by cooperation. And rotating around the workpiece, using the transient effect of the electric double layer charging on the surface of the wire electrode, combined with the difference in electrochemical impedance in the local micro-area of the wire electrode, to achieve selective electrochemical corrosion of the workpiece surface, so as to realize the microstructure array of the workpiece surface Flexible and controllable preparation, especially to realize the processing of small-diameter revolving surface and quasi-revolving surface microstructure array.
  • the wire electrode can be reused, and the processing method is suitable for any curved surface obtained by linear scanning.
  • FIG. 1 is a processing flow chart of the processing method for forming microstructures on the surface of a workpiece shown in the first embodiment of the present invention
  • FIG. 2 is an enlarged view of area A in FIG. 1, where a and b are schematic diagrams of the structure of the first pattern and the second pattern of two kinds of wire electrodes;
  • Fig. 3 is an enlarged view of area B in Fig. 1, where c and d are schematic diagrams of the structure of two workpieces with microstructures, and c is obtained based on a and d is obtained based on b;
  • Fig. 4 is a structural schematic diagram of the wire electrode in Fig. 1 rotating and rotating around the workpiece;
  • FIG. 5 is a schematic diagram of the structure of the microstructure formed on the surface of the workpiece based on the wire electrode in FIG. 1, where t1 and t2 are the processing regions of the workpiece at two different moments;
  • Figure 6 is the potential waveform curve in Figure 1, where 13 is the pulse voltage waveform; 12 is the potential waveform of the region corresponding to the first pattern; 11 is the potential waveform of the region corresponding to the first pattern; U is the set pulse voltage Size; ⁇ ⁇ is the steady-state potential; ⁇ 0 is the electrochemical decomposition potential of the anode workpiece material; t on is the pulse duration; t off is the pulse off time;
  • FIG. 7 is a schematic diagram of the structure of the wire electrode and the workpiece in FIG. 1, where the workpiece is a typical curved surface obtained by scanning the generatrix as a straight line, and e and f are two different views.
  • the present invention provides a control system that realizes the formation of microstructures on the surface of a workpiece 5.
  • the processing method of forming a microstructure on the surface of the workpiece 5 is used for the workpiece 5 set in the electrolyte as an anode.
  • the control system includes a wire electrode 2 set in the electrolyte solution and a power supply device 6 electrically connected to the wire electrode 2 and the workpiece 5 respectively.
  • the power supply device 6 forms a loop with the wire electrode 2 and the workpiece 5, and in the loop,
  • the power supply device 6 is an ultra-short pulse power supply 6.
  • the ultra-short pulse duration can be 50-500 ns, and the pulse period is 0.1-1 MHz.
  • the specific duration and pulse period are selected according to actual conditions and are not specifically limited here.
  • the wire electrode 2 is the cathode, and the workpiece 5 is the anode.
  • the wire electrode 2 is obtained by high temperature treatment using a micro rod 1, wherein the micro rod 1 is a metal rod 1, and the diameter of the metal rod 1 is 0.1-3.0 mm. Specifically, what kind of metal is used, and the specific diameter of the metal rod 1 is here There is no specific restriction, it can be determined according to the actual situation.
  • the electrochemical impedance value of the surface of the micro rod 1 is very small. At this time, the electrochemical impedance value is the intrinsic electrochemical impedance value of the metal surface of the micro rod 1.
  • the first microstructure with a larger electrochemical impedance value is obtained. 4.
  • the area of the first microstructure 4 can be equivalent to an insulator under the action of the ultrashort pulse, that is, the surface of the wire electrode 2 is divided into two parts, the first pattern 3 and the second pattern 4, and the first pattern 3 is a micro rod 1
  • the original surface without high temperature treatment has a very small electrochemical impedance value.
  • the second pattern 4 is a micro rod. 1
  • the first microstructure 4 can be obtained by laser processing or electron beam processing. Of course, the first microstructure 4 can also be obtained in other ways, and there is no specific limitation here.
  • control system is used to realize a processing method for forming a microstructure on the surface of the workpiece 5, and the method includes:
  • the first microstructure 4 of the wire electrode 2 is one of a trench type, a quasi-groove type, and a lattice type.
  • the first microstructure 4 can also be of other types, which is not specifically limited here.
  • the wire electrode 2 with the first microstructure 4 on the surface can be reused many times, thereby reducing material waste and greatly shortening the processing cycle.
  • the processing method also includes cleaning and drying the micro rod 1.
  • the micro rod 1 is ultrasonically decontaminated with acetone, alcohol, and deionized water, and dried in a vacuum. Dry in the box.
  • the obtained wire electrode 2 with the first microstructure 4 on the surface is also subjected to ultrasonic cleaning, and is to be used in subsequent electrolytic processing.
  • the wire electrode 2 in the preparation of the microstructure on the surface of the workpiece 5, that is, during the electrochemical machining process, the wire electrode 2 not only rotates around its own axis, but also follows a translational path 9 having the same cross-sectional shape as the anode workpiece 5, so that the workpiece 5 The entire surface is processed with the required microstructure.
  • the surface of the wire electrode 2 will produce the electric double layer charging and discharging transient effect.
  • the area corresponding to the second pattern 4 has a large electrochemical impedance, and its surface is formed
  • the electric double layer time constant is also very large, resulting in the charging potential of the electric double layer within the pulse duration Unable to reach the electrochemical decomposition potential of workpiece 5 Therefore, during the rotation of the wire electrode 2, the material on the surface of the anode workpiece 5 and the micro-area corresponding to the second pattern 4 will not be electrochemically dissolved (referred to as the insoluble area 8); and the area corresponding to the part of the first pattern 3 Since the electrochemical impedance is very small, the charge/discharge time constant of the formed electric double layer is very small.
  • the potential of the electric double layer can exceed the electrochemical decomposition potential of the anode workpiece 5 Therefore, during the rotation of the wire electrode 2, the material on the surface of the anode workpiece 5 and the micro-region corresponding to the first pattern 3 will be electrochemically dissolved and removed (referred to as the dissolving zone 7), thereby obtaining a workpiece 5 with a microstructure.
  • the processing method shown in the present invention is suitable for any curved surface whose shape is obtained by linear scanning of the generatrix.
  • the surface of the workpiece 5 is the inner surface of revolution, the outer surface of revolution, the inner surface of quasi-rotation, the outer surface of quasi-rotation, and the plane.
  • One of the quasi-planes can of course also be other planes, and there is no specific restriction here.
  • electrochemical machining mainly includes the following steps: First, the prepared wire electrode 2 with the first microstructure 4 on the surface is mounted on the wire electrode 2 fixture in the micro electrochemical machining platform, and its axis and axis are precisely adjusted.
  • the surface of the anode workpiece 5 is parallel to ensure that the distance between the wire electrode 2 and the workpiece 5 along the axis of the wire electrode 2, that is, the processing gap 10 is the same; then, according to the characteristic size of the microstructure to be processed and the surface shape of the workpiece 5,
  • Set the electrochemical machining parameters including the voltage, pulse frequency, pulse duration, the rotation angular velocity ⁇ r of the wire electrode 2, the translational path 9 of the wire electrode 2 and the translational speed v p, etc., start the electrochemical machining, and wait for the end of the machining
  • the first microstructure 4 on the surface of the wire electrode 2 will be transferred to the surface of the anode workpiece 5 according to a certain ratio; finally, after the electrochemical processing is completed, the workpiece
  • Step 1 Use a tungsten rod 1 with a diameter of 1.0mm, and wash them in acetone, alcohol, and deionized water for 5 minutes in order to remove oil stains and other dust impurities on the surface. Then, place it in a vacuum drying oven at 100°C and bake for 10 minutes to ensure that the surface is relatively dry.
  • Step 2 Use the laser scanning processing method to process the above-mentioned tungsten rod 1 to form the first microstructure 4 on its surface to obtain the wire electrode 2.
  • the area corresponding to the second pattern 4 is the area processed by the laser
  • the first pattern 3 is the original surface of the tungsten rod, that is, the non-laser processing area. A large amount of oxide will be formed in the laser processing area, and the electrochemical impedance is very large. Under the action of ultra-short pulse, it can be equivalent to an insulator.
  • the specific shape of the first microstructure 4 and the layout on the tungsten rod 1 are determined according to actual needs. , There are no specific restrictions here.
  • Step 3 The wire electrode 2 with the first microstructure 4 on the surface prepared in step 2 is ultrasonically cleaned in acetone, alcohol and deionized water for 5 minutes, and then dried with natural air, the wire electrode 2 is prepared.
  • Step 4 Mount the prepared wire electrode 2 on the wire electrode fixture in the micro electrochemical machining platform.
  • the anode workpiece 5 to be processed is a 316L stainless steel tube with an outer diameter of 5.0mm and a wall thickness of 0.5mm, which is fixed on the anode fixture. .
  • the ammeter is used for dry tool setting, and the machining gap 10 is set to 0.003mm. It is true that the value of the machining gap 10 can also be other, and the range of the machining gap 10 is 0.001mm-0.005mm. Therefore, the value of the machining gap 10 can be determined according to the actual situation, which is not limited here.
  • Step five the frequency ultrashort pulse power supply 6 is set to 1MHz, ultrashort pulse duration t on is 200ns, the wire electrode rotation angular velocity ⁇ r 2 is 0.1rad / s, translational path 9 is provided concentrically with the 316L stainless steel
  • the radius of the circle is the sum of the diameter of the wire electrode 2, the diameter of the workpiece 5 and the machining gap, which is 2.5mm+0.003mm+0.5mm, and the translational speed v p is 0.01mm/s.
  • the anode workpiece 5 The required microstructures are formed on the surface, see Figure 3 for details. Among them, the specific values of the rotation angular velocity ⁇ r and the translation velocity v p of the wire electrode 2 are set according to actual needs, and no specific limitation is made here.
  • Step 6 The anode workpiece 5 with microstructure is ultrasonically cleaned in acetone, alcohol and deionized water for 5 minutes, and the processing is finished.
  • Step 1 The diameter of the tungsten rod 1 is 0.5 mm, and the cleaning and drying methods are the same as those in the first embodiment, and will not be repeated here.
  • Step 2 Immerse the tungsten rod 1 in a certain concentration of fluorosilane solution for surface fluorination treatment at a temperature of 60°C for 0.5 hours; take out the tungsten rod 1 and place it in a vacuum drying oven at 120°C for 1.0 hour After the above process, a molecular film with a thickness of hundreds of nanometers is formed on the surface of the tungsten rod 1.
  • the molecular film has a large electrochemical impedance. Under the action of an ultrashort pulse, it can wait The effect is an insulator.
  • the above-mentioned tungsten rod 1 is processed by a laser scanning processing method to form a first microstructure 4 on its surface to obtain a wire electrode 2, as shown in FIG.
  • the first microstructure 4 that is, the area corresponding to the second pattern 4 is It is the area reserved for the molecular film, that is, the area not processed by laser, and the electrochemical impedance is very large.
  • the first pattern 3 is the original surface of the tungsten rod 1, that is, the laser processing area. The molecular film is removed and the original surface of the tungsten rod 1 is exposed. The regional electrochemical impedance is very small.
  • the specific shape of the first microstructure 4 and the layout on the tungsten rod 1 are determined according to actual needs, and there is no specific limitation here.
  • Step 3 The wire electrode 2 is cleaned, and the cleaning method is the same as that of the first embodiment, and will not be repeated here.
  • Step 4 This step of this embodiment is basically the same as that of the first embodiment, except that the workpiece 5 is a titanium alloy tube with an outer diameter of 3.0 mm and a wall thickness of 0.2 mm, and the machining gap 10 is 0.002 mm.
  • Step 5 This step of this embodiment is basically the same as that of embodiment 1, except that the pulse duration t on of the pulse power supply 6 is set to 100 ns, and the rotation angular velocity ⁇ r of the wire electrode 2 is set to 0.2 rad/s,
  • the translation path 9 is set as a circle concentric with the titanium alloy tube, the radius of the circle is 1.5 mm + 0.002 mm + 0.25 mm, and the translation speed v p is 0.005 mm/s.
  • Step 6 The anode workpiece 5 is ultrasonically cleaned in acetone, alcohol and deionized water for 5 minutes, and the entire processing process is over.
  • the processing method for forming microstructures on the surface of a workpiece uses the wire electrode of the first microstructure with a larger electrochemical impedance value as the tool electrode, and the rotation of the wire electrode and the rotation around the workpiece are coordinately controlled.
  • the wire electrode can be reused, and the processing method is suitable for any curved surface obtained by linear scanning.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

一种在工件（5）表面形成微结构的加工方法，包括：S1、提供表面具有较小电化学阻抗值的微细棒（1），高温以使微细棒表面形成具有较大电化学阻抗值的第一微结构（4），得到线电极（2）；S2、提供插入至电解液中的工件作为阳极，驱动线电极自转并驱动线电极围绕工件旋转，给工件和线电极供电以依据线电极上的第一微结构在工件的表面形成所需要的微结构。使用表面具有较大电化学阻抗值的第一微结构的线电极作为工具电极，以可实现工件表面微结构阵列的柔性、可控制备，特别是实现小口径回转表面、准回转表面微结构阵列的加工，此外，线电极可重复使用，且该加工方法适用于任意由直线扫描得到的曲面。

Description

一种在工件表面形成微结构的加工方法及控制系统
本申请要求了申请日为2020年03月25日，申请号为202010217579.2的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及一种在工件表面形成微结构的加工方法及控制系统。
背景技术
表面微织构技术是指利用微细加工方法在材料表面构建系列具有一定形态、大小和排列方式的微结构阵列，从而改善/调控材料表面特性。近年来，随着微细加工技术的发展，表面微织构技术已在仿生学、摩擦学(减小摩擦、刀具减磨减低粘附)、微流体力学(微流道减阻)和生物医学(改善植入体生物相容性)等多个领域中得到了成功的应用，并取得了良好的效果。
目前，表面微结构阵列(微织构)加工技术主要包括，微细铣削、激光加工、磨料气射流，电火花加工及掩膜电解加工等。但以上方法均存在一定的缺陷，例如：微细铣削存在加工应力和表面残余应力，且很难实现对难加工材料表面的织构化处理；激光加工和电火花加工表面均存在热影响区，表面粗糙度较差；磨料气射流仅适用于对脆性材料的加工等。
掩模电解加工(TMECM)是一种将阳极表面经光刻处理后进行电解加工的特种加工工艺，该技术结合了光刻技术的高分辨率和电解加工的高效率，成为金属材料表面微结构阵列制备的常用方法之一。在TMECM工艺过程中，掩模板的制作是十分关键的步骤，目前，掩模的制作方法主要有照相精缩法、电子束直写法和聚焦离子束直写法等，但是这些方法均存在价格昂贵、制作周期长和掩模板面积小等缺点。而且，当所需阵列结构的特征参数需要改变时，如果采用传统的TMECM工艺，掩模板则必须重新制作，这不仅造成了材料的浪费，而且将大大延长工艺周期。另外，现有的掩模电解加工技术通常用于平面或大口径的回转表面微结构阵列的制备，很难实现小口径回转、准回转薄壁曲面(例如：心血管支架内/外回转表面、微齿轮、凸轮等准回转轮廓面等)微结构阵列的加工。
发明内容
本发明的目的在于提供一种在工件表面形成微结构的加工方法，以实现工件表面微结构阵列的柔性、可控制备，特别是实现小口径回转表面、准回转表面、以及回转内表面跨尺度微结构阵列的高质量柔性加工。
为达到上述目的，本发明提供如下技术方案：一种在工件表面形成微结构的加工方法，所述方法包括：
S1、提供表面具有较小电化学阻抗值的微细棒，高温以使所述微细棒表面形成具有较大电化学阻抗值的第一微结构，得到线电极；
S2、提供插入至电解液中的工件作为阳极，驱动所述线电极自转并驱动所述线电极围绕所述工件旋转，给所述工件和所述线电极供电以依据所述线电极上的第一微结构在所述工件的表面形成所需要的微结构。
进一步地，所述第一微结构通过激光加工、电子束加工、化学和激光加工中的一种得到。
进一步地，在所述S2中，采用超短脉冲电源供电。
进一步地，所述超短脉冲持续时间可为50～500ns，脉冲周期为0.1～1MHz。
进一步地，所述微细棒为金属棒。
进一步地，所述金属棒的直径为0.1～3.0mm。
进一步地，所述第一微结构为沟槽型、准沟槽型、以及点阵型中的一个。
进一步地，所述工件的表面为回转内面、回转外面、准回转内转面、准回转外转面、平面、准平面中的一个。
进一步地，在将所述微细棒高温处理前，所述方法还包括将所述微细棒进行清洗并烘干。
本发明还提供一种实现在工件表面形成微结构的控制系统，采用在工件表面形成微结构的加工方法，用以对设置在电解液中作为阳极的工件进行加工，所述控制系统包括用以设置在电解液中的线电极、分别与所述线电极和所述工件电连接的供电装置，所述供电装置与所述线电极、所述工件构成回路，其中，所述线电极为阴极，所述工件为阳极。
本发明的有益效果在于：本发明所提供的在工件表面形成微结构的加工方 法，使用表面具有较大电化学阻抗值的第一微结构的线电极作为工具电极，通过协同控制线电极的自转和围绕工件旋转，利用线电极表面双电层充电的暂态效应，结合线电极局部微区域内电化学阻抗的差异，实现工件表面的选择性电化学腐蚀，以可实现工件表面微结构阵列的柔性、可控制备，特别是实现小口径回转表面、准回转表面微结构阵列的加工，此外，线电极可重复使用，且该加工方法适用于任意由直线扫描得到的曲面。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，并可依照说明书的内容予以实施，以下以本发明的较佳实施例并配合附图详细说明如后。
附图说明
图1为本发明第一实施例所示的工件表面形成微结构的加工方法的加工的流程图；
图2为图1中区域A的放大图，其中，a和b为两种线电极的第一图案和第二图案的结构示意图；
图3为图1中区域B的放大图，其中，其中，c和d为两种具有微结构的工件的结构示意图，并且c基于a得到、d基于b得到；
图4为图1中线电极绕着工件旋转并自转的结构示意图；
图5为图1中基于线电极在工件表面形成微结构的结构示意图，其中，t1和t2为两个不同时刻的工件的加工区域；
图6为图1中的电位波形曲线，其中，13为脉冲电压波形；12为第一图案所对应区域的电位波形；11为第一图案所对应区域的电位波形；U为设定的脉冲电压大小；φ ∞为稳态电位；φ 0为阳极工件材料的电化学分解电位；t on为脉冲持续时间；t off为脉冲关断时间；
图7为图1中线电极和工件的结构示意图，其中，工件为典型的以母线为直线扫描得到的曲面，e和f为两种不同的视图。
具体实施方式
下面将结合附图对本发明的技术方案进行清楚、完整地描述，显然，所描 述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
此外，下面所描述的本发明不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
请参见图1至图3，本发明提供一种实现在工件5表面形成微结构的控制系统，采用在工件5表面形成微结构的加工方法，用以对设置在电解液中作为阳极的工件5进行加工，控制系统包括用以设置在电解液中的线电极2、分别与线电极2和工件5电连接的供电装置6，供电装置6与线电极2、工件5构成回路，在回路中，供电装置6为超短脉冲电源6，超短脉冲持续时间可为50～500ns，脉冲周期为0.1～1MHz，具体持续时间和脉冲周期根据实际进行选择，在此不做具体限制。其中，线电极2为阴极，工件5为阳极。线电极2为采用微细棒1经过高温处理得到，其中，微细棒1为金属棒1，金属棒1的直径为0.1～3.0mm，具体的，使用何种金属，金属棒1的具体直径在此不做具体限制，可根据实际情况而定。微细棒1的表面的电化学阻抗值很小，此时的电化学阻抗值为微细棒1的金属表面固有的电化学阻抗值，高温处理后得到具有较大电化学阻抗值的第一微结构4，第一微结构4的区域在超短脉冲作用下，可等效为绝缘体，即线电极2表面分为两个部分，第一图案3和第二图案4，第一图案3为微细棒1未经过高温处理的原始表面，具有很小的电化学阻抗值，第二图案4为微细棒1经过高温处理的第一微结构4，第一微结构4可以通过激光加工、电子束加工得到，诚然，第一微结构4还可以通过其他方式得到，在此不做具体限制。
上述控制系统用以实现在工件5表面形成微结构的加工方法，该方法包括：
S1、提供表面具有较小电化学阻抗值的微细棒1，高温以使微细棒1表面形成具有较大电化学阻抗值的第一微结构4，得到线电极2；
S2、提供插入至电解液中的工件5作为阳极，驱动线电极2自转并驱动线电极2围绕工件5旋转，给工件5和线电极2供电以依据线电极2上的第一微结构4在工件5的表面形成所需要的微结构。
本发明中，线电极2的第一微结构4为沟槽型、准沟槽型、以及点阵型中的一个，诚然，第一微结构4也可以其他类型，在此不做具体限制。表面具有第一微结构4的线电极2可以多次重复使用，以此减少了材料的浪费，而且将大大缩短加工工艺周期。
诚然，在将微细棒1高温处理前，加工方法还包括将微细棒1进行清洗并烘干，具体的，微细棒1分别依次用丙酮、酒精和去离子水进行超声去污，并在真空干燥箱中烘干。得到的表面具有第一微结构4的线电极2还进行超声清洗，待后续电解加工使用。
请参见图4，在工件5表面制备微结构中，即电解加工过程中，线电极2不仅绕自身轴线旋转，同时沿着与阳极工件5横截面形状相同的平动路径9，从而在工件5整个表面加工出所需的微结构。通过协同控制线电极2的自转角速度ω r和沿工件5表面的平动速度v p，可实现不同尺寸微结构的柔性制备。
请结合图5和图6，在超短脉冲作用下，线电极2表面将产生双电层充放电暂态效应，第二图案4所对应的区域由于具有很大的电化学阻抗，其表面形成的双电层时间常数也很大，导致在脉冲持续时间内，双电层充电电位
Figure PCTCN2020129340-appb-000001
无法达到工件5的电化学分解电位
Figure PCTCN2020129340-appb-000002
因此，在线电极2旋转过程中，阳极工件5表面与第二图案4所对应微区域内的材料不会发生电化学溶解(称为不溶解区8)；而第一图案3部分所对应的区域由于电化学阻抗很小，所形成的双电层充/放电时间常数很小，在脉冲持续时间(t on)内，双电层的电位能够超过阳极工件5的电化学分解电位
Figure PCTCN2020129340-appb-000003
因此，在线电极2旋转过程中，阳极工件5表面与第一图案3所对应微区域内的材料将发生电化学溶解去除(称为溶解区7)，以此得到具有微结构的工件5。
请参见图7，本发明所示的加工方法适用于形状为由母线为直线扫描得到的任意曲面，工件5的表面为回转内面、回转外面、准回转内转面、准回转外转面、平面、准平面中的一个，诚然还可以为其他面，在此不做具体限制。
本发明中，电解加工主要包括以下几个步骤：首先，将所制备的表面具有第一微结构4的线电极2安装在微细电解加工平台中的线电极2夹具上，并精 确调整其轴线与阳极工件5表面平行，以保证沿线电极2轴线方向各处线电极2与工件5之间的距离，即加工间隙10相同；然后，按照所需加工的微结构的特征尺寸及工件5表面形状，设置电解加工参数，其中包括电压、脉冲频率、脉冲持续时间、线电极2的自转角速度ω r、线电极2的平动路径9及平动速度v p等参数，开始进行电解加工，待加工结束后，线电极2表面的第一微结构4将按一定的比例转印到阳极工件5表面上；最后，电解加工结束后，将工件5进行超声清洗，除去表面残留的电解液等杂质，整个加工工艺过程结束。
关于在工件5表面形成微结构的加工方法，下面结合图1并以具体实施例进行说明：
实施例一
步骤一、采用直径为1.0mm的钨棒1，将其分别依次在丙酮、酒精和去离子水中超声清洗5分钟，以除去其表面的油污和其他粉尘杂质。然后，置于100℃的真空干燥箱中烘烤10min，确保其表面相对干燥。
步骤二、采用激光扫描加工方法对上述钨棒1进行加工，使其表面形成第一微结构4，得到线电极2，请参见图2，其中第二图案4所对应的区域为激光加工的区域，第一图案3为钨棒的原始表面，即非激光加工区域。激光加工区域会形成大量的氧化物，电化学阻抗很大，在超短脉冲作用下，可等效为绝缘体，具体第一微结构4的形状和在钨棒1上的布局根据实际需要而定，在此不做具体限制。
步骤三、将步骤中二所制备的表面具有第一微结构4的线电极2分别依次在丙酮、酒精和去离子水中超声清洗5分钟，然后用自然风吹干，线电极2制备完毕。
步骤四、将所制备的线电极2安装在微细电解加工平台中的线电极夹具上，待加工阳极工件5为外径5.0mm、壁厚0.5mm的316L不锈钢管，将其固定在阳极夹具上。精确调整线电极2的轴线与阳极工件5表面平行，以保证在加工过程中沿线电极2轴线方向各处的加工间隙10相同，采用电流表进行干法对刀，设定加工间隙10为0.003mm，诚然，加工间隙10的数值也可以为其他，加工 间隙10的范围为0.001mm-0.005mm，故，可根据实际确定加工间隙10的数值，在此不做限定。
步骤五、将超短脉冲电源6的频率设置为1MHz，超短脉冲持续时间t on为200ns，线电极2的自转角速度ω r为0.1rad/s，平动路径9设置为与316L不锈钢管同心的圆，圆的半径为线电极2的直径、工件5直径以及加工间隙的总和，即2.5mm+0.003mm+0.5mm，平动速度v p为0.01mm/s，电解加工完毕后，阳极工件5表面形成有所需要的微结构，具体可参见图3。其中，线电极2的自转角速度ω r和平动速度v p的具体值根据实际需要进行设置，在此不做具体限制。
步骤六、将具有微结构的阳极工件5分别在丙酮、酒精和去离子水中超声清洗5分钟，加工结束。
实施例二
步骤一、采用钨棒1的直径为0.5mm，对其清洗和干燥处理方法与实施例一相同，在此不在赘述。
步骤二、将钨棒1浸泡在一定浓度的氟硅烷溶液中进行表面氟化处理，温度为60℃，时间为0.5小时；取出钨棒1，置于120℃的真空干燥箱中烘烤1.0小时，然后在空气环境中自然冷却，经过上述工艺后，钨棒1表面形成一层厚度为数百纳米的分子膜，该分子膜具有较大的电化学阻抗，在超短脉冲作用下，可等效为绝缘体。采用激光扫描加工方法对上述钨棒1进行加工，使其表面形成第一微结构4，得到线电极2，请参见图2，其中第一微结构4，即第二图案4所对应的区域为为分子膜保留区域，即非激光加工的区域，电化学阻抗很大，第一图案3为钨棒1的原始表面，即激光加工区域，分子膜被去除，钨棒1的原始表面露出，该区域电化学阻抗很小。具体第一微结构4的形状和在钨棒1上的布局根据实际需要而定，在此不做具体限制。
步骤三、将线电极2进行清洗，对其清洗的方法与实施例一相同，在此不在赘述。
步骤四、本实施例的该步骤与实施例一中的步骤基本相同，不同点为：工件5为外径3.0mm、壁厚0.2mm的钛合金管，加工间隙10为0.002mm。
步骤五、本实施例的该步骤与实施例一中的步骤基本相同，不同点为：脉冲电源6脉冲持续时间t on设置为100ns，线电极2的自转角速度ω r设置为0.2rad/s，平动路径9设置为与钛合金管同心的圆，圆的半径为1.5mm+0.002mm+0.25mm，平动速度v p为0.005mm/s。
步骤六、将阳极工件5分别在丙酮、酒精和去离子水中超声清洗5分钟，整个加工工艺过程结束。
综上，本发明所提供的在工件表面形成微结构的加工方法，使用表面具有较大电化学阻抗值的第一微结构的线电极作为工具电极，通过协同控制线电极的自转和围绕工件旋转，利用线电极表面双电层充电的暂态效应，结合线电极局部微区域内电化学阻抗的差异，实现工件表面的选择性电化学腐蚀，以可实现工件表面微结构阵列的柔性、可控制备，特别是实现小口径回转表面、准回转表面微结构阵列的加工，此外，线电极可重复使用，且该加工方法适用于任意由直线扫描得到的曲面。
以上实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种在工件表面形成微结构的加工方法，其特征在于，所述方法包括：
    S1、提供表面具有较小电化学阻抗值的微细棒，高温以使所述微细棒表面形成具有较大电化学阻抗值的第一微结构，得到线电极；
    S2、提供插入至电解液中的工件作为阳极，驱动所述线电极自转并驱动所述线电极围绕所述工件旋转，给所述工件和所述线电极供电以依据所述线电极上的第一微结构在所述工件的表面形成所需要的微结构。
  2. 如权利要求1所述的在工件表面形成微结构的加工方法，其特征在于，所述第一微结构通过激光加工、电子束加工、化学和激光加工中的一种得到。
  3. 如权利要求1所述的在工件表面形成微结构的加工方法，其特征在于，在所述S2中，采用超短脉冲电源供电。
  4. 如权利要求3所述的在工件表面形成微结构的加工方法，其特征在于，所述超短脉冲持续时间可为50～500ns，脉冲周期为0.1～1MHz。
  5. 如权利要求1所述的在工件表面形成微结构的加工方法，其特征在于，所述微细棒为金属棒。
  6. 如权利要求5所述的在工件表面形成微结构的加工方法，其特征在于，所述金属棒的直径为0.1～3.0mm。
  7. 如权利要求1所述的在工件表面形成微结构的加工方法，其特征在于，所述第一微结构为沟槽型、准沟槽型、以及点阵型中的一个。
  8. 如权利要求1所述的在工件表面形成微结构的加工方法，其特征在于，所述工件的表面为回转内面、回转外面、准回转内转面、准回转外转面、平面、准平面中的一个。
  9. 如权利要求1所述的在工件表面形成微结构的加工方法，其特征在于，在将所述微细棒高温处理前，所述方法还包括将所述微细棒进行清洗并烘干。
  10. 一种实现在工件表面形成微结构的控制系统，其特征在于，采用如权利要求1至9项中任一项所述的在工件表面形成微结构的加工方法，用以对设置在电解液中作为阳极的工件进行加工，所述控制系统包括用以设置在电解液中的线电极、分别与所述线电极和所述工件电连接的供电装置，所述供电装置 与所述线电极、所述工件构成回路，其中，所述线电极为阴极，所述工件为阳极。
PCT/CN2020/129340 2020-03-25 2020-11-17 一种在工件表面形成微结构的加工方法及控制系统 Ceased WO2021189876A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010217579.2A CN111299731B (zh) 2020-03-25 2020-03-25 一种在工件表面形成微结构的加工方法及控制系统
CN202010217579.2 2020-03-25

Publications (1)

Publication Number Publication Date
WO2021189876A1 true WO2021189876A1 (zh) 2021-09-30

Family

ID=71153801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/129340 Ceased WO2021189876A1 (zh) 2020-03-25 2020-11-17 一种在工件表面形成微结构的加工方法及控制系统

Country Status (2)

Country Link
CN (1) CN111299731B (zh)
WO (1) WO2021189876A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114289804A (zh) * 2022-01-25 2022-04-08 扬州大学 一种表面微坑阵列结构超声平动射流电解加工方法
CN114515874A (zh) * 2022-03-25 2022-05-20 燕山大学 一种移动掩膜微细电解加工装置及方法
CN114888379A (zh) * 2022-06-02 2022-08-12 江苏悦达起亚汽车有限公司 一种振动进给电解加工镍基高温合金阵列微方孔的方法
JP2023538702A (ja) * 2021-07-28 2023-09-08 南京航空航天大学 フレキシブル電極動的変形電解加工方法及びその使用

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111299731B (zh) * 2020-03-25 2021-09-24 苏州大学 一种在工件表面形成微结构的加工方法及控制系统
CN112475495B (zh) * 2020-11-17 2022-06-14 苏州大学 一种跨尺寸微纳结构阵列的制备方法
CN113500261B (zh) * 2021-06-11 2022-06-28 邯郸钢铁集团有限责任公司 一种快速设定轧辊毛化参数的方法
CN119525625B (zh) * 2024-08-14 2025-11-14 南京航空航天大学 一种薄板类零件随动式外冲液旋印电解加工装置和方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19727132C2 (de) * 1997-06-26 2000-02-03 Hueck Engraving Gmbh Verfahren und Vorrichtung zur Herstellung einer Prägestruktur auf einem der Oberflächenformung von Preßlaminaten dienenden Prägewerkzeug
CN101070605A (zh) * 2007-03-28 2007-11-14 南京航空航天大学 柱形回转体零件外表面微细织构电解加工方法
CN103182573A (zh) * 2012-10-23 2013-07-03 南通大学 采用平板电极电解转印加工金属双极板表面微流道的方法及其平板电极
CN103433579A (zh) * 2013-09-12 2013-12-11 安徽工业大学 一种套筒类零件内表面微凸起的电解加工方法
CN104384643A (zh) * 2014-10-16 2015-03-04 南京航空航天大学 航空发动机薄壁机匣电解加工方法
CN111299731A (zh) * 2020-03-25 2020-06-19 苏州大学 一种在工件表面形成微结构的加工方法及控制系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090166334A1 (en) * 2005-11-16 2009-07-02 The University Of Tokyo Microshaft Forming Method, Microshaft Formed by This Method and Microshaft Forming Apparatus
KR101210653B1 (ko) * 2010-10-15 2012-12-11 한국과학기술원 전기장을 이용한 레이저 가공장치 및 가공방법
CN108080782B (zh) * 2018-01-02 2020-02-21 南京航空航天大学 微小孔电解加工电极的侧壁绝缘方法及应用
CN108857050A (zh) * 2018-06-21 2018-11-23 西安理工大学 一种金属表面规则微凹织构阵列的制备方法
CN109570662A (zh) * 2019-01-28 2019-04-05 安徽理工大学 一种基于电磁感应加热的适用于多种形状的微细电解加工微细工具电极侧壁绝缘方法及应用

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19727132C2 (de) * 1997-06-26 2000-02-03 Hueck Engraving Gmbh Verfahren und Vorrichtung zur Herstellung einer Prägestruktur auf einem der Oberflächenformung von Preßlaminaten dienenden Prägewerkzeug
CN101070605A (zh) * 2007-03-28 2007-11-14 南京航空航天大学 柱形回转体零件外表面微细织构电解加工方法
CN103182573A (zh) * 2012-10-23 2013-07-03 南通大学 采用平板电极电解转印加工金属双极板表面微流道的方法及其平板电极
CN103433579A (zh) * 2013-09-12 2013-12-11 安徽工业大学 一种套筒类零件内表面微凸起的电解加工方法
CN104384643A (zh) * 2014-10-16 2015-03-04 南京航空航天大学 航空发动机薄壁机匣电解加工方法
CN111299731A (zh) * 2020-03-25 2020-06-19 苏州大学 一种在工件表面形成微结构的加工方法及控制系统

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023538702A (ja) * 2021-07-28 2023-09-08 南京航空航天大学 フレキシブル電極動的変形電解加工方法及びその使用
JP7390087B2 (ja) 2021-07-28 2023-12-01 南京航空航天大学 フレキシブル電極動的変形電解加工方法及びその使用
CN114289804A (zh) * 2022-01-25 2022-04-08 扬州大学 一种表面微坑阵列结构超声平动射流电解加工方法
CN114289804B (zh) * 2022-01-25 2023-09-01 扬州大学 一种表面微坑阵列结构超声平动射流电解加工方法
CN114515874A (zh) * 2022-03-25 2022-05-20 燕山大学 一种移动掩膜微细电解加工装置及方法
CN114515874B (zh) * 2022-03-25 2023-05-26 燕山大学 一种移动掩膜微细电解加工装置及方法
CN114888379A (zh) * 2022-06-02 2022-08-12 江苏悦达起亚汽车有限公司 一种振动进给电解加工镍基高温合金阵列微方孔的方法

Also Published As

Publication number Publication date
CN111299731B (zh) 2021-09-24
CN111299731A (zh) 2020-06-19

Similar Documents

Publication Publication Date Title
WO2021189876A1 (zh) 一种在工件表面形成微结构的加工方法及控制系统
CN109226973B (zh) 一种激光-电化学沉积制备仿生超疏水金属表面的系统及方法
CN102019474B (zh) 线电极电化学磨削微细工具在线制备系统及方法
CN204397104U (zh) 孔板电极扫描式掩膜电解加工装置
CN101249580B (zh) 电化学-激光掩模聚焦微刻蚀加工方法及装置
CN112475495B (zh) 一种跨尺寸微纳结构阵列的制备方法
CN110904485B (zh) 一种扫描式激光辅助微弧氧化装置及方法
He et al. An investigation into wire electrochemical micro machining of pure tungsten
CN109279570B (zh) 一种基于飞秒激光直写与电化学还原相结合制备水凝胶中三维导电金属微纳结构的方法
CN114346337A (zh) 一种磨粒辅助激光电解自耦合协同对位打孔方法及系统
CN109676379B (zh) 激光刻蚀电化学微增材换热功能表面的制备装置及方法
Wang et al. Anodic dissolution behavior and microstructure preparation of nickel based superalloy in cryogenic-shielded and laser-assisted electrochemical machining
CN103334145B (zh) 医用钛表面两步法制备宏观/微观双级孔隙结构生物活性微弧氧化陶瓷涂层的方法
CN115142102A (zh) 一种利用激光辐照实现薄壁件背面诱导定域电沉积的方法及装置
CN105081488A (zh) 金属材料表面大面积微/纳米织构的快速可控制造方法
TWI480916B (zh) 鋁之電子束拋光
CN114481266A (zh) 一种激光刻蚀微织构表面复合电沉积自润滑涂层的制备方法及装置
CN110385520A (zh) 激光微织构304不锈钢表面疏水性微细电解复合加工工艺
Liu et al. Developments, challenges and future trends in advanced sustainable machining technologies for preparing array micro-holes
CN112126955B (zh) 一种膛线式空心旋转电极的激光电化学复合沉积的方法及装置
CN112658414B (zh) 一种渐开线样板加工装置及工作方法
CN107999908B (zh) 一种微坑阵列的制作方法
CN110767515B (zh) 一种应用于场发射冷阴极的可调长径比碳纳米管阵列束的制备方法
CN110514493A (zh) 一种透射电镜样品的电化学清洗及减薄方法
CN115070144A (zh) 一种基于电化学射流的增材构件的三维重构装置和方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20927141

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20927141

Country of ref document: EP

Kind code of ref document: A1