WO2021187279A1

WO2021187279A1 - Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring line, and provisional support for photosensitive transfer material

Info

Publication number: WO2021187279A1
Application number: PCT/JP2021/009633
Authority: WO
Inventors: 隆志有冨; 一真両角; 洋行海鉾
Original assignee: 富士フイルム株式会社
Priority date: 2020-03-19
Filing date: 2021-03-10
Publication date: 2021-09-23
Also published as: JPWO2021187279A1; JP7416910B2; CN115298612A

Abstract

The present disclosure provides: a photosensitive transfer material which comprises a provisional support and a photosensitive resin layer on the provisional support, wherein the change ratio of the contact angle of water with respect to a surface of the provisional support, said surface being on the reverse side of the surface facing the photosensitive resin layer, is from 0% to 10.0% before and after a 15-minute heat treatment at 100°C; and applications of this photosensitive transfer material.

Description

Photosensitive transfer material, resin pattern manufacturing method, circuit wiring manufacturing method, and temporary support for photosensitive transfer material

The present disclosure relates to a photosensitive transfer material, a resin pattern manufacturing method, a circuit wiring manufacturing method, and a temporary support for a photosensitive transfer material.

A display device (for example, an organic electroluminescence display device and a liquid crystal display device) provided with a touch panel (for example, a capacitance type input device) has a patterned conductive layer inside the touch panel. Examples of the patterned conductive layer include an electrode pattern corresponding to a sensor in the visual recognition portion and wiring (for example, peripheral wiring and take-out wiring).

In forming a patterned conductive layer, a method using a photosensitive transfer material is widely adopted because the number of steps for obtaining a required pattern shape is small (for example, Patent Document 1). For example, a photosensitive resin layer is provided on a substrate using a photosensitive transfer material, and then the photosensitive resin layer is exposed to a mask having a desired pattern, and then developed and etched. Therefore, a patterned conductive layer can be formed.

Japanese Unexamined Patent Publication No. 2019-128445

In the pattern forming method using a photosensitive transfer material, a thin temporary support is used in order to obtain a high-resolution pattern. This is because the distance between the photosensitive resin layer and the photomask can be shortened when the photosensitive resin layer is exposed through the thin temporary support. However, when the thickness of the temporary support is reduced, the photosensitive transfer material having the thin temporary support and the adherend (meaning an object (for example, a substrate) to be attached to the photosensitive transfer material; the same applies hereinafter). Wrinkles may occur on the temporary support during the bonding process. If wrinkles are generated on the temporary support, for example, there is a possibility that the transportability is lowered by the roll-to-roll method or a wiring failure is caused.

This disclosure has been made in view of the above circumstances.
One aspect of the present disclosure is to provide a photosensitive transfer material that suppresses the occurrence of wrinkles in a temporary support in a step of bonding a photosensitive transfer material and an adherend.
Another aspect of the present disclosure is to provide a method for producing a resin pattern using a photosensitive transfer material that suppresses the occurrence of wrinkles in a temporary support in a step of bonding a photosensitive transfer material and an adherend. And.
Another aspect of the present disclosure is to provide a method for manufacturing a circuit wiring using a photosensitive transfer material that suppresses the occurrence of wrinkles in a temporary support in a step of bonding a photosensitive transfer material and an adherend. And.
Another aspect of the present disclosure is to provide a temporary support used as a photosensitive transfer material that suppresses the occurrence of wrinkles in the temporary support in the step of bonding the photosensitive transfer material and the adherend. do.

The present disclosure includes the following aspects.
<1> It has a temporary support and a photosensitive resin layer on the temporary support, and faces the photosensitive resin layer of the temporary support before and after heat treatment at 100 ° C. for 15 minutes. A photosensitive transfer material in which the rate of change of the contact angle of water with respect to the surface opposite to the surface is 0% to 10.0%.
<2> Before the heat treatment at 100 ° C. for 15 minutes, the contact angle of water with respect to the surface of the temporary support opposite to the surface facing the photosensitive resin layer is 90 degrees or less <1>. The photosensitive transfer material described.
<3> The photosensitive transfer material according to <1> or <2>, wherein the temporary support has an average thickness of 20 μm or less.
<4> The absolute value of the difference between the haze of the temporary support before the heat treatment at 120 ° C. for 5 minutes and the haze of the temporary support after the heat treatment at 120 ° C. for 5 minutes is 0% to 0.40. The photosensitive transfer material according to any one of <1> to <3>, which is%.
<5> The photosensitive transfer material according to any one of <1> to <4>, wherein the temporary support has a peeling force of 0.5 gf / cm or more.
<6> The photosensitive transfer material according to any one of <1> to <5>, wherein the average thickness of the photosensitive resin layer is 3 μm to 10 μm.
<7> The photosensitive transfer material according to any one of <1> to <6>, wherein the temporary support contains wax.
<8> The photosensitive transfer material according to <7>, wherein the wax content is 0.0001% by mass to 0.05% by mass with respect to the total mass of the temporary support.
<9> A step of adhering the photosensitive transfer material according to any one of <1> to <8> and a substrate, and arranging a photosensitive resin layer on the substrate, and the photosensitive resin layer. A method for producing a resin pattern, which comprises a step of pattern exposure and a step of developing the photosensitive resin layer to form a resin pattern in this order.
<10> The step of laminating the photosensitive transfer material according to any one of <1> to <8> and the substrate having the conductive layer, and arranging the photosensitive resin layer on the substrate, and the above. A step of pattern-exposing the photosensitive resin layer, a step of developing the photosensitive resin layer to form a resin pattern, and a step of forming a resin pattern.
A method for manufacturing a circuit wiring, which includes a step of etching a conductive layer in a region where the resin pattern is not arranged to form a circuit wiring, and a step of forming a circuit wiring in this order.
<11> A temporary support for a photosensitive transfer material having a surface in which the rate of change in the contact angle of water is 0% to 10.0% before and after heat treatment at 100 ° C. for 15 minutes.
<12> The photosensitive property according to <11>, wherein the absolute value of the difference between the haze before the heat treatment at 120 ° C. for 5 minutes and the haze after the heat treatment at 120 ° C. for 5 minutes is 0% to 0.40%. Temporary support for transfer material.

According to one aspect of the present disclosure, there is provided a photosensitive transfer material that suppresses the occurrence of wrinkles in the temporary support in the step of bonding the photosensitive transfer material and the adherend.
According to another aspect of the present disclosure, there is provided a method for producing a resin pattern using a photosensitive transfer material that suppresses the occurrence of wrinkles in a temporary support in the step of bonding the photosensitive transfer material and the adherend. ..
According to another aspect of the present disclosure, there is provided a method for manufacturing a circuit wiring using the photosensitive transfer material that suppresses the occurrence of wrinkles in the temporary support in the step of bonding the photosensitive transfer material and the adherend. ..
According to another aspect of the present disclosure, there is provided a temporary support used as a photosensitive transfer material that suppresses the occurrence of wrinkles in the temporary support in the step of bonding the photosensitive transfer material and the adherend.

It is a schematic side view which shows an example of the structure of the photosensitive transfer material. It is a schematic plan view which shows an example of the pattern of the mask for touch panel manufacturing. It is the schematic plan view which shows another example of the pattern of the mask for touch panel manufacturing.

Hereinafter, embodiments of the present disclosure will be described in detail. The present disclosure is not limited to the following embodiments, and may be carried out with appropriate modifications within the scope of the purpose of the present disclosure.

When the embodiment of the present disclosure is described with reference to the drawings, the description of overlapping components and reference numerals in the drawings may be omitted. The components shown by using the same reference numerals in the drawings mean that they are the same components. The dimensional ratio in the drawings does not necessarily represent the actual dimensional ratio.

In the present disclosure, the numerical range indicated by using "-" indicates a range including the numerical values before and after "-" as the lower limit value and the upper limit value, respectively. In the numerical range described stepwise in the present disclosure, the upper limit value or the lower limit value described in a certain numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value described in a certain numerical range may be replaced with the value shown in the examples.

In the present disclosure, the amount of each component in the composition means the total amount of the plurality of substances present in the composition when a plurality of substances corresponding to each component are present in the composition, unless otherwise specified. ..

In the present disclosure, the term "process" is included in the term "process" as long as the intended purpose of the process is achieved, not only in an independent process but also in cases where it cannot be clearly distinguished from other processes. ..

In the present disclosure, "% by mass" and "% by weight" are synonymous, and "parts by mass" and "parts by weight" are synonymous.

In the present disclosure, a combination of two or more preferred embodiments is a more preferred embodiment.

In the present disclosure, the groups (atomic groups) not described as substituted and unsubstituted include a group having no substituent and a group having a substituent. For example, the notation "alkyl group" includes not only an alkyl group having no substituent (ie, an unsubstituted alkyl group) but also an alkyl group having a substituent (ie, a substituted alkyl group).

In the present disclosure, "(meth) acrylic acid" means acrylic acid, methacrylic acid, or both acrylic acid and methacrylic acid.

In the present disclosure, the "(meth) acryloyl group" means an acryloyl group, a methacryloyl group, or both an acryloyl group and a methacryloyl group.

In the present disclosure, "(meth) acrylate" means acrylate, methacrylate, or both acrylate and methacrylate.

In the present disclosure, "alkali-soluble" means the property that the solubility of sodium carbonate in an aqueous solution (100 g, sodium carbonate concentration: 1% by mass) is 0.1 g or more at a liquid temperature of 22 ° C.

In the present disclosure, the chemical structural formula may be described by a structural formula in which a hydrogen atom is omitted.

In the present disclosure, "exposure" includes not only exposure using light but also drawing using particle beams (for example, electron beam and ion beam) unless otherwise specified. Examples of the light used for exposure include active rays (also referred to as active energy rays). Examples of the active light beam include the emission line spectrum of a mercury lamp, far ultraviolet rays typified by an excimer laser, extreme ultraviolet rays (EUV (Extreme ultraviolet lithium) light), and X-rays.

In the present disclosure, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are "TSKgel GMHxL", "TSKgel G4000HxL", and "TSKgel G2000HxL" (all products manufactured by Toso Co., Ltd.) unless otherwise specified. It is a molecular weight converted by detecting a compound in THF (tetrahexyl) with a differential refractometer by a gel permeation chromatography (GPC) analyzer using a column of (name) and using polystyrene as a standard substance.

In the present disclosure, "solid content" means a component obtained by removing a solvent from all the components of an object.

In the present disclosure, the ordinal numbers (eg, "first" and "second") are terms used to distinguish the components and do not limit the number of components and the superiority or inferiority of the components. ..

In the present disclosure, the symbols added to the names (for example, "A" and "B") are symbols used to distinguish the components, and are the types of components, the number of components, and the components. It does not limit the superiority or inferiority of.

In the present disclosure, unless otherwise specified, the refractive index is a value measured using an ellipsometer at a wavelength of 550 nm.

<Photosensitive transfer material>
The photosensitive transfer material according to the present disclosure has a temporary support and a photosensitive resin layer on the temporary support, and before and after heat treatment at 100 ° C. for 15 minutes, the above-mentioned temporary support The rate of change of the contact angle of water with respect to the surface opposite to the surface facing the photosensitive resin layer is 0% to 10.0%. According to the photosensitive transfer material according to the present disclosure, the occurrence of wrinkles in the temporary support is suppressed in the step of bonding the photosensitive transfer material and the adherend.

The reason why the photosensitive transfer material according to the present disclosure exerts the above effect is presumed as follows. In the pattern forming method using the photosensitive transfer material, the step of bonding the photosensitive transfer material and the adherend may be performed under heating conditions. For example, the photosensitive transfer material and the adherend are bonded together by bringing a heated pressure-bonding member (for example, a roll) into contact with the temporary support. In the above method, a component such as an oligomer is deposited on the surface of the heated temporary support, so that the adhesiveness of the surface of the temporary support is increased. As a result, it is considered that the surface characteristics (for example, slipperiness) of the temporary support are changed and wrinkles are generated on the temporary support. On the other hand, in the photosensitive transfer material according to the present disclosure, the rate of change in the contact angle of water with respect to the surface of the temporary support opposite to the surface facing the photosensitive resin layer before and after the heat treatment at 100 ° C. for 15 minutes. When it is 0% to 10.0%, it is possible to suppress the change in the surface characteristics of the temporary support even when the photosensitive transfer material and the adherend are bonded together under heating conditions. Therefore, according to the photosensitive transfer material according to the present disclosure, the occurrence of wrinkles in the temporary support is suppressed in the step of bonding the photosensitive transfer material and the adherend.

<< Components >>
The photosensitive transfer material according to the present disclosure has a temporary support and a photosensitive resin layer on the temporary support. The photosensitive resin layer may be laminated on the temporary support directly or via an arbitrary layer. In the photosensitive transfer material according to the present disclosure, an arbitrary layer may be laminated on the photosensitive resin layer. Examples of the arbitrary layer include other layers described later. Hereinafter, the components of the photosensitive transfer material according to the present disclosure will be specifically described.

[Temporary support]
The photosensitive transfer material according to the present disclosure has a temporary support. The temporary support is a support that can be peeled off from the photosensitive transfer material. The temporary support can support at least a photosensitive resin layer. The structure of the temporary support may be a single-layer structure or a multi-layer structure. The layer structure of the temporary support having a multi-layer structure is not limited. The temporary support having a multi-layer structure may have a coating layer or a functional layer. Examples of the temporary support having a multi-layer structure include a temporary support having a base material and a coating layer or a functional layer. Examples of the base material include materials (for example, glass substrate, resin film, and paper) described in the section of "composition" below. The coating layer is a layer that covers a part or all of the surface of an arbitrary layer (for example, a base material). Examples of the functional layer include an adhesive layer (adhesive layer), a peeling layer, a slippery imparting layer, an antistatic layer, a layer for preventing exudation of components from a support, a smoothing imparting layer, and a hard coat layer. Be done. The coating layer may be a functional layer. Further, the temporary support having a multi-layer structure is formed by a coating method or coextrusion.

(Contact angle)
Before and after the heat treatment at 100 ° C. for 15 minutes, the rate of change of the contact angle of water with respect to the surface of the temporary support opposite to the surface facing the photosensitive resin layer is 0% to 10.0%. In the present disclosure, the "surface of the temporary support facing the photosensitive resin layer" refers to the surface of the temporary support facing the photosensitive resin layer. For example, when the temporary support is adjacent to the photosensitive resin layer, the surface of the temporary support facing the photosensitive resin layer is the surface of the temporary support that is in contact with the photosensitive resin layer. Hereinafter, the "surface of the temporary support facing the photosensitive resin layer" may be referred to as a "first surface". Hereinafter, the "surface opposite to the surface of the temporary support facing the photosensitive resin layer" may be referred to as a "second surface". Since the rate of change of the contact angle of water with respect to the second surface of the temporary support is 0% to 10.0%, it is possible to suppress the change in the surface characteristics of the temporary support under heating conditions. In the process of bonding the photosensitive transfer material and the adherend, the occurrence of wrinkles on the temporary support is suppressed. The rate of change of the contact angle is preferably 9.0% or less. Further, from the viewpoint of roll-to-roll transportability, the contact angle of water with respect to the second surface of the temporary support after the heat treatment is preferably 90 degrees or less, more preferably 85 degrees or less. , 80 degrees or less is more preferable.

When the contact angle of water before the heat treatment is C1 and the contact angle of water after the heat treatment is C2, the rate of change of the contact angle of water is calculated according to the following formula. In the following formula, "| C2-C1 |" represents the absolute value of the difference between C2 and C1.
Formula: Change rate of contact angle of water (%) = (| C2-C1 |) / C1 × 100

The contact angle (C1) of water before the heat treatment is measured by the following method.
(1) The temporary support is allowed to stand for 24 hours in an atmosphere where the room temperature is 25 ° C. and the relative humidity is 50%.
(2) The contact angle of 12 μL of pure water dropped on the second surface of the temporary support under the atmosphere shown in (1) above is measured using a contact angle meter CA-D type (Kyowa Interface Science Co., Ltd.). .. The above measurements are performed a total of 5 times.
(3) The arithmetic mean of the three measured values excluding the maximum and minimum values of the five measured values is defined as the water contact angle (C1) before the heat treatment.

The contact angle (C2) of water after the heat treatment is measured by the following method.
(1) The temporary support is allowed to stand for 15 minutes in an atmosphere of 100 ° C.
(2) The temporary support is allowed to stand for 24 hours in an atmosphere where the room temperature is 25 ° C. and the relative humidity is 50%.
(3) The contact angle of 12 μL of pure water dropped on the second surface of the temporary support under the atmosphere shown in (2) above is measured using a contact angle meter CA-D type (Kyowa Interface Science Co., Ltd.). .. The above measurements are performed a total of 5 times.
(4) The arithmetic mean of the three measured values excluding the maximum and minimum values of the five measured values is defined as the contact angle (C2) of the water after the heat treatment.

Before the heat treatment at 100 ° C. for 15 minutes, the contact angle of water with respect to the second surface of the temporary support is preferably 90 degrees or less, and more preferably 80 degrees or less from a practical point of view. The lower limit of the contact angle is not limited. When setting the lower limit of the contact angle, the contact angle is preferably 50 degrees or more, and more preferably 60 degrees or more.

A known method can be used as a method for adjusting the contact angle of water with respect to the second surface of the temporary support (including the rate of change of the contact angle of water; the same shall apply hereinafter in this paragraph). The contact angle of water with respect to the second surface of the temporary support varies depending on, for example, the composition of the temporary support and the surface roughness of the temporary support. For example, by using wax, which will be described later, as a component of the temporary support, the contact angle of water with respect to the second surface of the temporary support can be adjusted. Further, by changing the composition of the resin used as the raw material of the temporary support, or by adding a matting agent or an inorganic filler as a component of the temporary support, the contact angle of water with respect to the second surface of the temporary support can be adjusted. can do.

The above-mentioned properties related to the contact angle may be exhibited at least on the second surface of the temporary support. The first surface of the temporary support may have the same properties as the second surface of the temporary support described above.

(Haze)
The haze of the temporary support preferably does not change easily in a heating environment. Specifically, the haze of the temporary support before the heat treatment at 120 ° C. for 5 minutes (hereinafter, may be referred to as “H1”) and the haze of the temporary support after the heat treatment at 120 ° C. for 5 minutes (hereinafter, referred to as “H1”). The absolute value of the difference from (sometimes referred to as "H2") (that is, | H2-H1 |) is preferably 0% to 0.40%, more preferably 0% to 0.30%. It is preferably 0% to 0.20%, more preferably 0% to 0.10%. The haze of the temporary support before the heat treatment at 120 ° C. for 5 minutes is preferably 0% to 0.40%, more preferably 0% to 0.30%, and 0% to 0.20. % Is particularly preferable.

The haze of the temporary support is measured using a haze meter (for example, NDH-2000, Nippon Denshoku Industries Co., Ltd.) by a method according to "JIS K 7105". However, in the "haze of the temporary support after heat treatment at 120 ° C. for 5 minutes", the temporary support is allowed to stand for 5 minutes in an atmosphere of 120 ° C., and then an atmosphere of room temperature of 25 ° C. and a relative humidity of 50%. After allowing the temporary support to stand for 180 minutes, the haze of the temporary support measured by the above method is used.

(Peeling force)
The peeling force of the temporary support is preferably 0.2 gf / cm or more, more preferably 0.5 gf / cm or more, further preferably 0.8 gf / cm or more, and 1.0 gf / cm or more. It is particularly preferable that it is cm or more. When the peeling force of the temporary support is 0.2 gf / cm or more, the adhesion between the layer adjacent to the temporary support (for example, the photosensitive resin layer) and the temporary support in the photosensitive transfer material is increased. Therefore, the occurrence of wrinkles on the temporary support can be further suppressed. The upper limit of the peeling force of the temporary support is not limited. When setting the upper limit of the peeling force of the temporary support, the peeling force of the temporary support may be determined in the range of, for example, 10 gf / cm or less. The peeling force of the temporary support defined in the present disclosure is the peeling force of the temporary support before the heat treatment.

The peeling force of the temporary support is measured by the following method. As the measuring device, a Tensilon tensile tester (Orientec Co., Ltd., model name: "RTM500") is used. Using a cutter, the photosensitive transfer material is cut into a rectangular shape having a width of 25 mm and a length of 80 mm. The longitudinal direction of the obtained test piece is fixed along the vertical direction (gravity direction). Peel off the lower tip of the temporary support on the fixed test piece. The tip of the peeled temporary support is sandwiched between the chucks of the Tensilon tensile tester (meaning a jig for sandwiching the test piece). The force (adhesive force) when the chuck sandwiching the tip of the temporary support is moved upward (that is, in the direction opposite to the vertical direction) at a tensile speed of 100 mm / min and the temporary support is peeled 180 degrees. ) Is measured. However, after the start of measurement, the measurement value of the first 30 mm length is ignored. The value obtained by averaging the forces measured from the start of peeling of the temporary support to the end of peeling is adopted as the adhesive force. The peeling force (gf / cm) of the temporary support is obtained by dividing the adhesive force by the width of the test piece (25 mm = 2.5 cm).

(thickness)
The average thickness of the temporary support is preferably 20 μm or less, preferably 18 μm or less, from the viewpoint of improving the resolution of the pattern formed by exposing the photosensitive resin layer through the temporary support. It is more preferable, and it is particularly preferable that it is 16 μm or less. In the photosensitive transfer material according to the present disclosure, even when the thin temporary support as described above is adopted, wrinkles of the temporary support are generated in the step of bonding the photosensitive transfer material and the adherend. It can be suppressed. The lower limit of the thickness of the temporary support is not limited. The average thickness of the temporary support is preferably 5 μm or more, and more preferably 10 μm or more, from the viewpoint of ease of handling and versatility.

The average thickness of the temporary support is measured by the following method. A scanning electron microscope (SEM) is used to observe the cross section in the direction perpendicular to the main surface of the temporary support (that is, in the thickness direction). Based on the obtained observation image, the thickness of the temporary support is measured at 10 points. The average thickness of the temporary support is obtained by arithmetically averaging the measured values. The above-mentioned measuring method is not limited to the temporary support having a single-layer structure, but is also applied to the temporary support having a multi-layer structure.

(Optical transparency)
The temporary support preferably has light transmission. Since the temporary support has light transmission property, when the photosensitive resin layer is exposed, the photosensitive resin layer can be exposed through the temporary support. In the present disclosure, "having light transmittance" means that the transmittance of light having a wavelength used for pattern exposure is 50% or more. In the temporary support, the transmittance of light having a wavelength (preferably a wavelength of 365 nm) used for pattern exposure is preferably 60% or more, preferably 70% or more, from the viewpoint of improving the exposure sensitivity of the photosensitive resin layer. More preferably. In the present disclosure, the "transmittance" refers to a layer to be measured with respect to the intensity of the incident light when light is incident in a direction perpendicular to the main surface of the layer to be measured (that is, in the thickness direction). It is the ratio of the intensity of the emitted light that has passed through and emitted. The transmittance is measured using MCPD Series manufactured by Otsuka Electronics Co., Ltd.

(composition)
Examples of the temporary support include a glass substrate, a resin film, and paper. The temporary support is preferably a resin film from the viewpoint of strength, flexibility, and light transmission.

Examples of the resin film include polyethylene terephthalate film (that is, PET film), cellulose triacetate film, polystyrene film, and polycarbonate film. The resin film is preferably a PET film, more preferably a biaxially stretched PET film.

Examples of the temporary support include a biaxially stretched polyethylene terephthalate film having a thickness of 16 μm, a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm, and a biaxially stretched polyethylene terephthalate film having a thickness of 9 μm.

The temporary support preferably contains wax. Since the temporary support contains wax, it is possible to suppress the precipitation of components such as oligomers on the surface of the temporary support. Therefore, the temporary support is used in the step of bonding the photosensitive transfer material and the adherend. The occurrence of wrinkles can be further suppressed. From the same viewpoint as above, the temporary support preferably has a layer containing wax, and more preferably has a surface layer (coating layer) containing wax.

As the wax, a known wax can be used. Examples of the wax include natural wax and synthetic wax.

Natural waxes include, for example, vegetable waxes (eg, carnauba wax, candelilla wax, and wood wax), petroleum waxes (eg, paraffin wax, and microcrystallin wax), mineral waxes (eg, montan wax), and animals. Examples thereof include based waxes (for example, beeswax and lanolin).

Examples of synthetic waxes include olefin waxes (eg, polyethylene wax and polypropylene wax), synthetic hydrocarbon waxes (eg, Fishertropsh wax), and hydride waxes (eg, hardened castor oil, hardened castor oil derivative). Can be mentioned. Synthetic waxes also include, for example, esters, amides, bisamides, ketones, or metal salts of stearic acid, oleic acid, erucic acid, lauric acid, behenic acid, palmitic acid, or adipic acid, and derivatives thereof.

The molecular weight of wax is not limited. From the viewpoint of abrasion resistance, the molecular weight of the wax is preferably 100 or more, and more preferably 300 or more. The molecular weight of the wax is preferably 5,000 or less, and more preferably 3,000 or less, from the viewpoint of imparting slipperiness. When the wax has a molecular weight distribution, the "molecular weight of the wax" means the weight average molecular weight of the wax.

The temporary support may contain one type of wax alone or two or more types of wax.

The wax content is preferably 0.0001% by mass or more, more preferably 0.0005% by mass or more, and 0.001% by mass or more with respect to the total mass of the temporary support. Is particularly preferable. The wax content is preferably 0.05% by mass or less, more preferably 0.03% by mass or less, and 0.01% by mass or less with respect to the total mass of the temporary support. Is particularly preferable. When the wax content is in the above range, it is possible to further suppress the occurrence of wrinkles in the temporary support in the step of bonding the photosensitive transfer material and the adherend.

(Roughness)
The arithmetic mean roughness Ra selected from the group consisting of the first surface of the temporary support and the second surface of the temporary support is preferably 0.1 μm or less, and preferably 0.05 μm or less. It is more preferably 0.02 μm or less, and particularly preferably 0.02 μm or less. The lower limit of the arithmetic mean roughness Ra is not limited. When setting the lower limit of the arithmetic mean roughness Ra, at least one arithmetic mean roughness Ra selected from the group consisting of the first surface of the temporary support and the second surface of the temporary support is, for example, in the range of 0 μm or more. You can decide with. Of the first surface of the temporary support and the second surface of the temporary support, it is preferable that at least the arithmetic mean roughness Ra of the second surface of the temporary support is in the above range.

Arithmetic mean roughness Ra is measured by the following method. Using a three-dimensional optical profiler (New View7300, Zygo), the surface profile of the object to be measured is obtained under the following conditions. As the measurement and analysis software, Microscope Application of MetroPro ver 8.3.2 is used. Next, the Surface Map screen is displayed using the above software, and histogram data is obtained in the Surface Map screen. From the obtained histogram data, the arithmetic mean roughness Ra of the surface of the object to be measured is obtained. When the surface of the object to be measured is in contact with the surface of another layer, the arithmetic mean roughness Ra of the surface of the exposed object to be measured may be measured by peeling the object to be measured from the other layer. ..

(Other properties)
It is preferable that the temporary support (particularly the resin film) is free from, for example, deformation (for example, wrinkles), scratches, and defects. From the viewpoint of pattern formation during pattern exposure via the temporary support and transparency of the temporary support, it is preferable that the number of fine particles, foreign substances, defects, and precipitates contained in the temporary support is small. In the temporary support, the number of fine particles, foreign substances, and defects having a diameter of 1 μm or more ^{is preferably 50 pieces / 10 mm 2} or less, more preferably 10 pieces / 10 mm ² or less, and 3 pieces / It is more preferably 10 mm ² or less, and particularly preferably ^{0/10 mm 2.}

Regarding preferred embodiments of the provisional support, for example, paragraphs 0017 to 0018 of JP-A-2014-85643, paragraphs 0019 to paragraph 0026 of JP-A-2016-27363, and paragraphs 0041 to International Publication No. 2012/081680. It is described in paragraph 0057, paragraphs 0029 to 0040 of International Publication No. 2018/179370, and paragraphs 0012 to 0032 of JP-A-2019-101405. The contents of these gazettes are incorporated herein by reference.

[Photosensitive resin layer]
The photosensitive transfer material according to the present disclosure has a photosensitive resin layer. The photosensitive resin layer is preferably a negative photosensitive resin layer in which the solubility of the exposed portion in the developing solution is reduced by exposure and the non-exposed portion is removed by development. However, the photosensitive resin layer is not limited to the negative photosensitive resin layer, and even if the photosensitive resin layer is a positive photosensitive resin layer in which the solubility of the exposed portion in the developing solution is improved by exposure and the exposed portion is removed by development. good.

In certain embodiments, the photosensitive resin layer preferably contains a polymer A, a polymerizable compound B, and a photopolymerization initiator. In certain embodiments, the photosensitive resin layer comprises 10% by mass to 90% by mass of the polymer A, 5% by mass to 70% by mass of the polymerizable compound B, and 0, based on the total mass of the photosensitive resin layer. It is preferable to contain 0.01% by mass to 20% by mass of a photopolymerization initiator. The polymer A, the polymerizable compound B, and the photopolymerization initiator will be described later.

(Polymer A)
The photosensitive resin layer preferably contains the polymer A. The polymer A is preferably an alkali-soluble polymer. Alkali-soluble polymers include polymers that are easily soluble in alkaline substances.

The acid value of the polymer A is preferably 220 mgKOH / g or less, and more preferably less than 200 mgKOH / g, from the viewpoint of improving the resolution by suppressing the swelling of the photosensitive resin layer due to the developing solution. It is preferably less than 190 mgKOH / g, especially preferably less than 190 mgKOH / g. The lower limit of acid value is not limited. The acid value of the polymer A is preferably 60 mgKOH / g or more, more preferably 120 mgKOH / g or more, further preferably 150 mgKOH / g or more, and 170 mgKOH / g or more, from the viewpoint of more excellent developability. It is particularly preferable that it is g or more. The acid value of the polymer A can be adjusted, for example, by the type of the structural unit constituting the polymer A and the content of the structural unit containing an acid group.

In the present disclosure, the acid value is the mass (mg) of potassium hydroxide required to neutralize 1 g of the sample. In the present disclosure, the unit of acid value is described as mgKOH / g. The acid value can be calculated, for example, from the average content of acid groups in the compound.

The weight average molecular weight (Mw) of the polymer A is preferably 5,000 to 500,000. It is preferable that the weight average molecular weight is 500,000 or less from the viewpoint of improving the resolvability and the developability. The weight average molecular weight of the polymer A is more preferably 100,000 or less, further preferably 60,000 or less, and particularly preferably 50,000 or less. On the other hand, it is preferable to set the weight average molecular weight to 5,000 or more from the viewpoint of controlling the properties of the developed aggregate, the edge fuse property, and the cut chip property. The weight average molecular weight of the polymer A is more preferably 10,000 or more, further preferably 20,000 or more, and particularly preferably 30,000 or more. The edge fuse property refers to the degree to which the photosensitive resin layer easily protrudes from the end face of the roll when the photosensitive transfer material is wound into a roll. The cut chip property refers to the degree of ease with which the chip flies when the unexposed film is cut with a cutter. For example, if the chip adheres to the surface of the photosensitive transfer material, the chip is transferred to the mask in the exposure process, which causes a defective product.

The dispersity of the polymer A is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, and even more preferably 1.0 to 4.0. It is particularly preferably 0.0 to 3.0. In the present disclosure, the degree of dispersion is the ratio of the weight average molecular weight to the number average molecular weight (weight average molecular weight / number average molecular weight).

The polymer A preferably has a structural unit derived from a monomer having an aromatic hydrocarbon group, from the viewpoint of suppressing the line width thickening when the focal position is deviated during exposure and the deterioration of resolution.

Examples of the aromatic hydrocarbon group include a substituted or unsubstituted phenyl group and a substituted or unsubstituted aralkyl group.

The content ratio of the structural unit derived from the monomer having an aromatic hydrocarbon group in the polymer A is preferably 20% by mass or more, preferably 30% by mass or more, based on the total mass of the polymer A. More preferably, it is more preferably 40% by mass or more, particularly preferably 45% by mass or more, and most preferably 50% by mass or more. The upper limit of the content ratio of the structural unit derived from the monomer having an aromatic hydrocarbon group is not limited. The content ratio of the structural unit derived from the monomer having an aromatic hydrocarbon group in the polymer A is preferably 95% by mass or less, preferably 85% by mass or less, based on the total mass of the polymer A. Is more preferable. When the photosensitive resin layer contains a plurality of types of polymers A, the content ratio of the structural unit derived from the monomer having an aromatic hydrocarbon group is determined as a weight average value.

Examples of the monomer having an aromatic hydrocarbon group include a monomer having an aralkyl group, styrene, and a polymerizable styrene derivative (for example, methylstyrene, vinyltoluene, tert-butoxystyrene, acetoxystyrene, 4-). Vinyl benzoic acid, styrene dimer, and styrene trimmer). The monomer having an aromatic hydrocarbon group is preferably a monomer having an aralkyl group or styrene.

Examples of the aralkyl group include a substituted or unsubstituted phenylalkyl group (excluding a benzyl group) and a substituted or unsubstituted benzyl group, and a substituted or unsubstituted benzyl group is preferable.

Examples of the monomer having a phenylalkyl group include phenylethyl (meth) acrylate.

Examples of the monomer having a benzyl group include a (meth) acrylate having a benzyl group (for example, benzyl (meth) acrylate and a chlorobenzyl (meth) acrylate), a vinyl monomer having a benzyl group (for example, vinylbenzyl chloride, and the like). Vinyl benzyl alcohol). The monomer having a benzyl group is preferably a benzyl (meth) acrylate.

In certain embodiments, when the structural unit derived from the monomer having an aromatic hydrocarbon group in the polymer A is the structural unit derived from the benzyl (meth) acrylate, the benzyl (meth) acrylate single amount in the polymer A is used. The content ratio of the structural unit derived from the body is preferably 50% by mass to 95% by mass, more preferably 60% by mass to 90% by mass, and 70% by mass, based on the total mass of the polymer A. It is more preferably% to 90% by mass, and particularly preferably 75% by mass to 90% by mass.

In a certain embodiment, when the structural unit derived from the monomer having an aromatic hydrocarbon group in the polymer A is the structural unit derived from styrene, the content ratio of the structural unit derived from styrene in the polymer A is determined. It is preferably 20% by mass to 60% by mass, more preferably 25 to 55% by mass, and further preferably 30% by mass to 50% by mass with respect to the total mass of the polymer A. When the photosensitive resin layer contains a plurality of types of polymers A, the content of the structural unit having an aromatic hydrocarbon group is determined as a weight average value.

In a certain embodiment, the polymer A having a structural unit derived from a monomer having an aromatic hydrocarbon group includes a monomer having an aromatic hydrocarbon group, a first monomer described later, and a monomer described later. It is preferable that the copolymer is obtained by polymerizing at least one selected from the group consisting of the second monomer. The above-mentioned copolymer is a group consisting of a structural unit derived from a monomer having an aromatic hydrocarbon group, a structural unit derived from the first monomer, and a structural unit derived from the second monomer. It has at least one selected from the above.

The polymer A may be a polymer having no structural unit derived from a monomer having an aromatic hydrocarbon group. The polymer A having no structural unit derived from the monomer having an aromatic hydrocarbon group is at least one kind of the first monomer (excluding the monomer having an aromatic hydrocarbon group) described later. It is preferable that the polymer is obtained by polymerizing the above, and at least one of the first monomer (excluding the monomer having an aromatic hydrocarbon group) described later and the second simpler described later. It is more preferable that it is a copolymer obtained by polymerizing at least one of a dimer (excluding a monomer having an aromatic hydrocarbon group).

In a certain embodiment, the polymer A is preferably a polymer obtained by polymerizing at least one of the first monomers described later, and is preferably the same as at least one of the first monomers described below. It is more preferable that the copolymer is obtained by polymerizing with at least one of the second monomers described later. The copolymer has a structural unit derived from the first monomer and a structural unit derived from the second monomer.

The first monomer is a monomer having a carboxy group and a polymerizable unsaturated group in the molecule. The first monomer may be a monomer having no aromatic hydrocarbon group in the molecule. Examples of the first monomer include (meth) acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, maleic anhydride, and maleic acid semiester. The first monomer is preferably (meth) acrylic acid.

The content ratio of the structural unit derived from the first monomer in the polymer A is preferably 5% by mass to 50% by mass, and 10% by mass to 40% by mass, based on the total mass of the polymer A. Is more preferable, and 15% by mass to 30% by mass is particularly preferable.

The second monomer is a monomer that is non-acidic and has at least one polymerizable unsaturated group in the molecule. The second monomer may be a monomer having no aromatic hydrocarbon group in the molecule. Examples of the second monomer include a (meth) acrylate compound, an ester compound of vinyl alcohol, and (meth) acrylonitrile. In the present disclosure, "(meth) acrylonitrile" includes acrylonitrile, methacrylonitrile, or both acrylonitrile and methacrylonitrile.

Examples of the (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, and isobutyl (meth) acrylate. Examples thereof include tert-butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate.

Examples of the ester compound of vinyl alcohol include vinyl acetate.

The second monomer is preferably at least one selected from the group consisting of methyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and n-butyl (meth) acrylate, and is preferably methyl (meth). More preferably, it is an acrylate.

The content ratio of the structural unit derived from the second monomer in the polymer A is preferably 5% by mass to 60% by mass, and 15% by mass to 50% by mass, based on the total mass of the polymer A. Is more preferable, and 20% by mass to 45% by mass is particularly preferable.

The polymer A is composed of a structural unit derived from a monomer having an aralkyl group and a structural unit derived from styrene from the viewpoint of suppressing the line width thickening when the focal position is deviated during exposure and the deterioration of resolution. It is preferable to include at least one selected from the group. For example, the polymer A is a copolymer containing a structural unit derived from methacrylic acid, a structural unit derived from benzyl methacrylate, a structural unit derived from styrene, a structural unit derived from methacrylic acid, and methyl. It is preferably at least one selected from the group consisting of copolymers containing a structural unit derived from methacrylate, a structural unit derived from benzyl methacrylate, and a structural unit derived from styrene.

In a certain embodiment, the polymer A contains 25% by mass to 60% by mass of a structural unit derived from a monomer having an aromatic hydrocarbon group and 20% by mass or more of a structural unit derived from a first monomer. A polymer containing 55% by mass and 15% by mass to 55% by mass of a structural unit derived from the second monomer is preferable. In the polymer A, the structural unit derived from the monomer having an aromatic hydrocarbon group is 25% by mass to 40% by mass, the structural unit derived from the first monomer is 20% by mass to 35% by mass, and the like. It is more preferable that the polymer contains 15% by mass to 45% by mass of the structural unit derived from the second monomer.

In certain embodiments, the polymer A contains 70% by mass to 90% by mass of a structural unit derived from a monomer having an aromatic hydrocarbon group, and 10% by mass of a structural unit derived from a first monomer. It is preferably a polymer containing up to 25% by mass.

The glass transition temperature (Tg) of the polymer A is preferably 30 ° C to 135 ° C. When the Tg of the polymer A is 135 ° C. or lower in the photosensitive resin layer, it is possible to suppress the line width thickening and the deterioration of the resolution when the focal position at the time of exposure is deviated. From the above viewpoint, the Tg of the polymer A is more preferably 130 ° C. or lower, further preferably 120 ° C. or lower, and particularly preferably 110 ° C. or lower. Further, it is preferable that the Tg of the polymer A is 30 ° C. or higher from the viewpoint of improving the edge fuse resistance. From the above viewpoint, the Tg of the polymer A is more preferably 40 ° C. or higher, further preferably 50 ° C. or higher, particularly preferably 60 ° C. or higher, and most preferably 70 ° C. or higher. preferable.

The polymer A may be a commercially available product or a synthetic product. The synthesis of the polymer A is carried out, for example, by diluting at least one of the above-mentioned monomers with a solvent (for example, acetone, methyl ethyl ketone, or isopropanol) with a radical polymerization initiator (for example, benzoyl peroxide or azoisobuty). Butyronitrile) is preferably added in an appropriate amount, and then heated and stirred. In some cases, the synthesis is carried out while dropping a part of the mixture into the reaction solution. After completion of the reaction, a solvent may be further added to adjust the concentration to a desired level. As the synthesis means, bulk polymerization, suspension polymerization, or emulsion polymerization may be used in addition to solution polymerization.

The photosensitive resin layer may contain one type alone or two or more types of polymer A. When the photosensitive resin layer contains two or more kinds of polymers A, the photosensitive resin layer contains two or more kinds of polymers A having a structural unit derived from a monomer having an aromatic hydrocarbon group. Alternatively, it may contain a polymer A having a structural unit derived from a monomer having an aromatic hydrocarbon group and a polymer A having no structural unit derived from a monomer having an aromatic hydrocarbon group. preferable. In the latter case, the content ratio of the polymer A having a structural unit derived from the monomer having an aromatic hydrocarbon group is preferably 50% by mass or more, preferably 70% by mass or more, based on the total mass of the polymer A. It is more preferably mass% or more, more preferably 80% by mass or more, and particularly preferably 90% by mass or more.

The content ratio of the polymer A is preferably 10% by mass to 90% by mass, more preferably 30% by mass to 70% by mass, and 40% by mass to the total mass of the photosensitive resin layer. It is particularly preferably 60% by mass. It is preferable that the content ratio of the polymer A to the photosensitive resin layer is 90% by mass or less from the viewpoint of controlling the developing time. On the other hand, it is preferable that the content ratio of the polymer A to the photosensitive resin layer is 10% by mass or more from the viewpoint of improving the edge fuse resistance.

(Polymerizable compound B)
The photosensitive resin layer preferably contains a polymerizable compound B having a polymerizable group. In the present disclosure, the "polymerizable compound" means a compound that polymerizes under the action of a polymerization initiator. The polymerizable compound B is a compound different from the polymer A.

The polymerizable group in the polymerizable compound B is not limited as long as it is a group involved in the polymerization reaction. Examples of the polymerizable group in the polymerizable compound B include a group containing an ethylenically unsaturated bond (for example, a vinyl group, an acryloyl group, a methacryloyl group, a styryl group, and a maleimide group), and a cationically polymerizable group (for example, a cationically polymerizable group). Epoxide group and oxetane group). The polymerizable group is preferably a group containing an ethylenically unsaturated bond (hereinafter, may be referred to as an "ethylenically unsaturated group"), and more preferably an acryloyl group or a metaacryloyl group.

The polymerizable compound B is preferably a compound having one or more ethylenically unsaturated groups in one molecule (that is, an ethylenically unsaturated compound) in that the photosensitive resin layer is more photosensitive. More preferably, it is a compound having two or more ethylenically unsaturated groups in one molecule (that is, a polyfunctional ethylenically unsaturated compound). In addition, the number of ethylenically unsaturated groups contained in one molecule of the ethylenically unsaturated compound is preferably 6 or less, and preferably 3 or less, in terms of being excellent in resolution and peelability. It is more preferable, and it is particularly preferable that the number is two or less.

The ethylenically unsaturated compound is preferably a (meth) acrylate compound having one or more (meth) acryloyl groups in one molecule.

The polymerizable compound B is a compound having two ethylenically unsaturated groups in one molecule (that is, bifunctional ethylenically) from the viewpoint of having a better balance of photosensitivity, resolution, and peelability in the photosensitive resin layer. It is preferably at least one selected from the group consisting of (unsaturated compounds) and compounds having three ethylenically unsaturated groups in one molecule (that is, trifunctional ethylenically unsaturated compounds), preferably in one molecule. It is more preferable that the compound has two ethylenically unsaturated groups.

In the photosensitive resin layer, the ratio of the content of the bifunctional ethylenically unsaturated compound to the content of the polymerizable compound B is preferably 60% by mass or more from the viewpoint of excellent peelability of the photosensitive resin layer. It is more preferably more than 70% by mass, and particularly preferably 90% by mass or more. The upper limit of the content ratio of the bifunctional ethylenically unsaturated compound to the content of the polymerizable compound B is not limited and may be 100% by mass. That is, all the polymerizable compounds B contained in the photosensitive resin layer may be bifunctional ethylenically unsaturated compounds.

-Polymerizable compound B1-
The photosensitive resin layer preferably contains a polymerizable compound B1 having one or more aromatic rings and two ethylenically unsaturated groups in one molecule. The polymerizable compound B1 is a bifunctional ethylenically unsaturated compound having one or more aromatic rings in one molecule among the above-mentioned polymerizable compounds B.

In the photosensitive resin layer, the ratio of the content of the polymerizable compound B1 to the content of the polymerizable compound B is preferably 40% by mass or more, preferably 50% by mass or more, from the viewpoint of better resolution. More preferably, it is more preferably 55% by mass or more, and particularly preferably 60% by mass or more. The upper limit of the ratio of the content of the polymerizable compound B1 to the content of the polymerizable compound B is not limited. The ratio of the content of the polymerizable compound B1 to the content of the polymerizable compound B is preferably 99% by mass or less, more preferably 95% by mass or less, and 90% by mass or less from the viewpoint of peelability. Is more preferable, and 85% by mass or less is particularly preferable.

Examples of the aromatic ring in the polymerizable compound B1 include an aromatic hydrocarbon ring (for example, a benzene ring, a naphthalene ring, and an anthracene ring) and an aromatic heterocycle (for example, a thiophene ring, a furan ring, a pyrrole ring, and an imidazole ring. Triazole ring and pyridine ring), and fused rings thereof. The aromatic ring is preferably an aromatic hydrocarbon ring, more preferably a benzene ring. The aromatic ring may have a substituent.

The polymerizable compound B1 preferably has a bisphenol structure from the viewpoint of improving the resolution by suppressing the swelling of the photosensitive resin layer due to the developing solution. Examples of the bisphenol structure include a bisphenol A structure derived from bisphenol A (that is, 2,2-bis (4-hydroxyphenyl) propane) and bisphenol F (that is, 2,2-bis (4-hydroxyphenyl) methane). Examples include a bisphenol F structure derived from bisphenol B and a bisphenol B structure derived from bisphenol B (that is, 2,2-bis (4-hydroxyphenyl) butane). The bisphenol structure is preferably a bisphenol A structure.

Examples of the polymerizable compound B1 having a bisphenol structure include a compound having a bisphenol structure and two polymerizable groups (preferably (meth) acryloyl groups) bonded to both ends of the bisphenol structure. Each polymerizable group may be directly attached to the bisphenol structure. Each polymerizable group may be attached to the bisphenol structure via one or more alkyleneoxy groups. The alkyleneoxy group added to both ends of the bisphenol structure is preferably an ethyleneoxy group or a propyleneoxy group, and more preferably an ethyleneoxy group. The number of alkyleneoxy groups added to the bisphenol structure is not limited, but is preferably 4 to 16 per molecule, and more preferably 6 to 14.

The polymerizable compound B1 having a bisphenol structure is described in paragraphs 0072 to 0080 of JP-A-2016-224162. The contents of the above gazette are incorporated herein by reference.

The polymerizable compound B1 is preferably a bifunctional ethylenically unsaturated compound having a bisphenol A structure, and more preferably 2,2-bis (4-((meth) acryloxypolyalkoxy) phenyl) propane. ..

Examples of 2,2-bis (4-((meth) acryloxipolyalkoxy) phenyl) propane include 2,2-bis (4- (methacryloxydiethoxy) phenyl) propane (FA-324M, Hitachi Chemical Co., Ltd.). Company), 2,2-bis (4- (methacryloxyethoxypropoxy) phenyl) propane, 2,2-bis (4- (methacryloxypentethoxy) phenyl) propane (BPE-500, Shin-Nakamura Chemical Industry Co., Ltd.) , 2,2-Bis (4- (methacryloxydodecaethoxytetrapropoxy) phenyl) propane (FA-3200MY, Hitachi Chemical Co., Ltd.), 2,2-bis (4- (methacryloxypentadecaethoxy) phenyl) propane ( BPE-1300, Shin-Nakamura Chemical Industry Co., Ltd.), 2,2-bis (4- (methacryloxydiethoxy) phenyl) propane (BPE-200, Shin-Nakamura Chemical Industry Co., Ltd.), and ethoxylated (10) bisphenol A Diacrylate (NK ester A-BPE-10, Shin-Nakamura Chemical Industry Co., Ltd.) can be mentioned.

Examples of the polymerizable compound B1 include a compound represented by the following general formula (I).

In the general formula (I), R ₁ and R ₂ independently represent a hydrogen atom or a methyl group, A represents C ₂ H ₄ , B represents C ₃ H ₆ , and n. ₁ and n ₃ are independently integers from 1 to 39, n ₁ + n ₃ are integers from 2 to 40, and n ₂ _{and n 4} are independent integers from 0 to 29, respectively. N ₂ + n ₄ is an integer of 0 to 30, and the sequence of repeating units of-(AO)-and-(BO)-is random or block. good. In the case of a block, either − (A—O) − or − (BO) − may be on the bisphenyl group side. n ₂ + n ₄ is preferably an integer of 0 to 10, more preferably an integer of 0 to 4, further preferably an integer of 0 to 2, and particularly preferably 0. n ₁ + n ₂ + n ₃ + n ₄ is preferably an integer of 2 to 20, more preferably an integer of 2 to 16, and particularly preferably an integer of 4 to 12.

The photosensitive resin layer may contain one type alone or two or more types of polymerizable compound B1.

The content ratio of the polymerizable compound B1 in the photosensitive resin layer is preferably 10% by mass or more, preferably 20% by mass or more, based on the total mass of the photosensitive resin layer from the viewpoint of better resolution. Is more preferable. The upper limit of the content ratio of the polymerizable compound B1 is not limited. The content ratio of the polymerizable compound B1 in the photosensitive resin layer is preferably 70% by mass or less, preferably 60% by mass, based on the total mass of the photosensitive resin layer from the viewpoint of transferability and edge fuse resistance. It is more preferable that it is as follows.

The photosensitive resin layer may contain a polymerizable compound B1 and a polymerizable compound B other than the polymerizable compound B1. Examples of the polymerizable compound B other than the polymerizable compound B1 include a monofunctional ethylenically unsaturated compound (that is, a compound having one ethylenically unsaturated group in one molecule) and a bifunctional ethylenically having no aromatic ring. Unsaturated compounds (ie, compounds that do not have an aromatic ring in one molecule and have two ethylenically unsaturated groups), and trifunctional or higher functional ethylenically unsaturated compounds (ie, in one molecule). Compounds having 3 or more ethylenically unsaturated groups).

Examples of the monofunctional ethylenically unsaturated compound include ethyl (meth) acrylate, ethylhexyl (meth) acrylate, 2- (meth) acryloyloxyethyl succinate, polyethylene glycol mono (meth) acrylate, and polypropylene glycol mono (meth) acrylate. , And phenoxyethyl (meth) acrylate.

Examples of the bifunctional ethylenically unsaturated compound having no aromatic ring include alkylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, urethane di (meth) acrylate, and trimethylolpropane diacrylate.

Examples of the alkylene glycol di (meth) acrylate include tricyclodecanedimethanol diacrylate (A-DCP, Shin-Nakamura Chemical Industry Co., Ltd.), tricyclodecanedimethanol dimethacrylate (DCP, Shin-Nakamura Chemical Industry Co., Ltd.), and the like. 1,9-Nonandiol diacrylate (A-NOD-N, Shin-Nakamura Chemical Industry Co., Ltd.), 1,6-Hexanediol diacrylate (A-HD-N, Shin-Nakamura Chemical Industry Co., Ltd.), Ethylene glycol dimethacrylate , 1,10-decanediol diacrylate, and neopentyl glycol di (meth) acrylate.

Examples of the polyalkylene glycol di (meth) acrylate include polyethylene glycol di (meth) acrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, and polypropylene glycol di (meth) acrylate.

Examples of the urethane di (meth) acrylate include propylene oxide-modified urethane di (meth) acrylate, and ethylene oxide and propylene oxide-modified urethane di (meth) acrylate. Examples of commercially available products include 8UX-015A (Taisei Fine Chemical Co., Ltd.), UA-32P (Shin Nakamura Chemical Industry Co., Ltd.), and UA-1100H (Shin Nakamura Chemical Industry Co., Ltd.).

Examples of the trifunctional or higher functional ethylenically unsaturated compound include dipentaerythritol (tri / tetra / penta / hexa) (meth) acrylate, pentaerythritol (tri / tetra) (meth) acrylate, and trimethylolpropane tri (meth). Acrylate (for example, A-TMPT manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), trimethylolpropane tetra (meth) acrylate, trimethylolethanetri (meth) acrylate, isocyanurate tri (meth) acrylate, glycerin tri (meth) acrylate, And these alkylene oxide modified products. In the present disclosure, "(tri / tetra / penta / hexa) (meth) acrylate" is a concept that includes tri (meth) acrylate, tetra (meth) acrylate, penta (meth) acrylate, and hexa (meth) acrylate. be. In the present disclosure, "(tri / tetra) (meth) acrylate" is a concept including tri (meth) acrylate and tetra (meth) acrylate.

Examples of the alkylene oxide-modified product of the trifunctional or higher functional ethylenically unsaturated compound include caprolactone-modified (meth) acrylate compound (for example, KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd.) and Shin-Nakamura Chemical Industry Co., Ltd. A-9300-1CL), alkylene oxide-modified (meth) acrylate compound (for example, KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E manufactured by Shin-Nakamura Chemical Industry Co., Ltd., Shin-Nakamura Chemical Industry Co., Ltd. A-9300 manufactured by A-9300, EBECRYL (registered trademark) 135) manufactured by Daicel Ornex, glycerin triacrylate ethoxylated (for example, A-GLY-9E manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), Aronix (registered trademark) TO Examples thereof include -2349 (Toa Synthetic Co., Ltd.), Aronix M-520 (Toa Synthetic Co., Ltd.), Aronix M-510 (Toa Synthetic Co., Ltd.), and SR454 (Alchema Co., Ltd.).

Examples of the polymerizable compound B other than the polymerizable compound B1 include the polymerizable compounds having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942.

In certain embodiments, the photosensitive resin layer preferably contains a polymerizable compound B1 and a trifunctional or higher functional ethylenically unsaturated compound, with the polymerizable compound B1 and two or more trifunctional or higher ethylenically unsaturated compounds. More preferably, it contains a compound. In the above embodiment, the mass ratio of the polymerizable compound B1 to the trifunctional or higher ethylenically unsaturated compound ([total mass of the polymerizable compound B1]: [total mass of the trifunctional or higher ethylenically unsaturated compound] is In certain embodiments, it is preferably 1: 1 to 5: 1, more preferably 1.2: 1 to 4: 1, and particularly preferably 1.5: 1 to 3: 1. The photosensitive resin layer preferably contains a polymerizable compound B1 and two or more trifunctional ethylenically unsaturated compounds.

The molecular weight of the polymerizable compound B (when the polymerizable compound B has a molecular weight distribution, it means the weight average molecular weight (Mw)) is preferably 200 to 3,000, and preferably 280 to 2,200. Is more preferable, and 300 to 2,200 is particularly preferable.

The value of the ratio Mm / Mb of the content Mm of the ethylenically unsaturated compound and the content Mb of the polymer A in the photosensitive resin layer is 1.0 or less from the viewpoint of resolution and linearity. It is more preferably 0.9 or less, and particularly preferably 0.5 or more and 0.9 or less.
Further, the ethylenically unsaturated compound in the photosensitive resin layer preferably contains a (meth) acrylic compound, and more preferably contains a (meth) acrylate compound, from the viewpoint of curability and resolvability.
Further, the ethylenically unsaturated compound in the photosensitive resin layer contains the (meth) acrylic compound from the viewpoint of curability, resolution and linearity, and the (meth) acrylic compound contained in the photosensitive resin layer. The content of the acrylic compound with respect to the total mass of the above is more preferably 60% by mass or less.

The photosensitive resin layer may contain one type alone or two or more types of polymerizable compound B.

The content ratio of the polymerizable compound B in the photosensitive resin layer is preferably 10% by mass to 70% by mass, more preferably 20% by mass to 60% by mass, based on the total mass of the photosensitive resin layer. It is preferably 20% by mass to 50% by mass, and particularly preferably 20% by mass.

(Arbitrary ingredient)
The photosensitive resin layer may contain components other than the above-mentioned components (hereinafter, may be referred to as “arbitrary components”). Optional components include photopolymerization initiators, dyes, surfactants, and additives other than the above components.

-Photopolymerization initiator-
The photosensitive resin layer preferably contains a photopolymerization initiator. The photopolymerization initiator is a compound that receives active light (for example, ultraviolet rays, visible light, and X-rays) to initiate polymerization of a polymerizable compound (for example, polymerizable compound B).

The photopolymerization initiator is not limited, and a known photopolymerization initiator can be used. Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferable.

Examples of the photoradical polymerization initiator include a photopolymerization initiator having an oxime ester structure, a photopolymerization initiator having an α-aminoalkylphenone structure, a photopolymerization initiator having an α-hydroxyalkylphenone structure, and an acylphosphine oxide. Examples thereof include a photopolymerization initiator having a structure and a photopolymerization initiator having an N-phenylglycine structure.

The photosensitive resin layer is a dimer of 2,4,5-triarylimidazole as a photoradical polymerization initiator from the viewpoints of photosensitivity, visibility of exposed parts, visibility of unexposed parts, and resolution. And at least one selected from the group consisting of derivatives of 2,4,5-triarylimidazole dimer. The two 2,4,5-triarylimidazole dimers and their derivatives may have the same or different structures.

Derivatives of the 2,4,5-triarylimidazole dimer include, for example, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di. (Methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, and 2- Examples thereof include (p-methoxyphenyl) -4,5-diphenylimidazole dimer.

Examples of the photoradical polymerization initiator include the polymerization initiators described in paragraphs 0031 to 0042 of JP2011-95716A and paragraphs 0064 to 0081 of JP2015-14783A.

Examples of the photoradical polymerization initiator include ethyl dimethylaminobenzoate (DBE, CAS No. 10287-53-3), benzoin methyl ether, anisyl (p, p'-dimethoxybenzyl), and benzophenone.

Commercially available photoradical polymerization initiators include, for example, TAZ-110 (Midori Chemical Co., Ltd.), TAZ-111 (Midori Chemical Co., Ltd.), 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-Tetraphenyl-1,2'-biimidazole (Tokyo Kasei Kogyo Co., Ltd. and Hampford), 1- [4- (Phenylthio) phenyl] -1,2-octanedione-2- (O-) Benzoyl oxime) (trade name: IRGACURE (registered trademark) OXE-01, BASF), 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl] etanone-1- (O) -Acetyloxym) (trade name: IRGACURE OXE-02, BASF), IRGACURE OXE-03 (BASF), IRGACURE OXE-04 (BASF), 2- (dimethylamino) -2-[(4-methylphenyl) ) Methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone (trade name: Omnirad 379EG, IGM Resins BV), 2-methyl-1- (4-methylthiophenyl) -2 -Morphorinopropan-1-one (trade name: Omnirad 907, IGM Resins VV), 2-hydroxy-1- {4- [4- (2-hydroxy-2-methylpropionyl) benzyl] phenyl} -2-Methylpropan-1-one (trade name: Omnirad 127, IGM Resins VV), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1 (trade name:) Omnirad 369, IGM Resins BV), 2-Hydroxy-2-methyl-1-phenylpropan-1-one (trade name: Omnirad 1173, IGM Resins BV), 1-hydroxycyclohexylphenylketone (Product name: Omnirad 184, IGM Resins BV), 2,2-dimethoxy-1,2-diphenylethane-1-one (Product name: Omnirad 651, IGM Resins BV), 2, 4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO H, IGM Resins BV), bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (trade name: Omnirad 819, IGM Re sins B. V. ) And an oxime ester-based photopolymerization initiator (trade name: Lunar 6, DKSH Japan Co., Ltd.).

A photocationic polymerization initiator (that is, a photoacid generator) is a compound that generates an acid by receiving active light. As the photocationic polymerization initiator, a compound that is sensitive to active light having a wavelength of 300 nm or more, preferably a wavelength of 300 nm to 450 nm and generates an acid is preferable. However, the chemical structure of the photocationic polymerization initiator is not limited. In addition, a photocationic polymerization initiator that is not directly sensitive to active light with a wavelength of 300 nm or more is also a sensitizer if it is a compound that is sensitive to active light with a wavelength of 300 nm or more and generates an acid when used in combination with a sensitizer. Can be preferably used in combination with.

The photocationic polymerization initiator is preferably a photocationic polymerization initiator that generates an acid having a pKa of 4 or less, and more preferably a photocationic polymerization initiator that generates an acid having a pKa of 3 or less. A photocationic polymerization initiator that generates 2 or less acids is particularly preferable. The lower limit of pKa is not limited. The pKa of the acid generated from the photocationic polymerization initiator is preferably -10.0 or more, for example.

Examples of the photocationic polymerization initiator include an ionic photocationic polymerization initiator and a nonionic photocationic polymerization initiator.

Examples of the ionic photocationic polymerization initiator include onium salt compounds (for example, diaryliodonium salt compounds and triarylsulfonium salt compounds), and quaternary ammonium salt compounds.

Examples of the ionic photocationic polymerization initiator include the ionic photocationic polymerization initiator described in paragraphs 0114 to 0133 of JP-A-2014-85643.

Examples of the nonionic photocationic polymerization initiator include trichloromethyl-s-triazine compounds, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. Examples of the trichloromethyl-s-triazine compound, the diazomethane compound, and the imide sulfonate compound include the compounds described in paragraphs 0083 to 0088 of Japanese Patent Application Laid-Open No. 2011-22149. Examples of the oxime sulfonate compound include the compounds described in paragraphs 0084 to 0088 of International Publication No. 2018/179640.

The photosensitive resin layer preferably contains a photoradical polymerization initiator, and is selected from the group consisting of 2,4,5-triarylimidazole dimers and derivatives of 2,4,5-triarylimidazole dimers. It is more preferable to contain at least one of the above-mentioned types.

The photosensitive resin layer may contain one type alone or two or more types of photopolymerization initiators.

The content ratio of the photopolymerization initiator in the photosensitive resin layer is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, based on the total mass of the photosensitive resin layer. It is particularly preferably 1.0% by mass or more. The upper limit of the content ratio of the photopolymerization initiator is not limited. The content ratio of the photopolymerization initiator is preferably 10% by mass or less, more preferably 7% by mass or less, based on the total mass of the photosensitive resin layer.

-Dye-
The photosensitive resin layer has a maximum absorption wavelength of 450 nm in the wavelength range of 400 nm to 780 nm at the time of color development from the viewpoints of visibility of the exposed portion, visibility of the non-exposed portion, pattern visibility after development, and resolution. It is preferable to include a dye (hereinafter, may be referred to as "dye N") whose maximum absorption wavelength is changed by an acid, a base, or a radical. Although the detailed mechanism is unknown, the inclusion of the dye N in the photosensitive resin layer improves the adhesion to the layers adjacent to the photosensitive resin layer (for example, the temporary support and the intermediate layer), and the resolution is improved. Better in sex.

In the present disclosure, the term "maximum absorption wavelength changes by acid, base, or radical" used with respect to a dye means a mode in which a dye in a color-developing state is decolorized by an acid, base, or radical, or a decolorized state. It may mean any aspect of a mode in which the dye in the above color is developed by an acid, a base or a radical, and a mode in which the dye in a color-developing state changes to a color-developing state of another hue.

Specifically, the dye N may be a compound that changes from the decolorized state by exposure to develop a color, or may be a compound that changes from the decolorized state by exposure to decolorize. In the above aspect, the dye N may be a dye whose color development or decolorization state is changed by the action of an acid, a base, or a radical generated by exposure. Further, the dye N may be a dye whose color development or decolorization state changes due to a change in the state (for example, pH) in the photosensitive resin layer due to an acid, a base, or a radical generated by exposure. good. On the other hand, the dye N may be a dye whose color development or decolorization state changes by directly receiving an acid, a base, or a radical as a stimulus without exposure.

The dye N is preferably a dye whose maximum absorption wavelength is changed by an acid or a radical from the viewpoint of visibility of an exposed portion, visibility of a non-exposed portion, and resolution, and the maximum absorption wavelength is changed by a radical. It is more preferable that the pigment is a radical.

The photosensitive resin layer contains both a dye whose maximum absorption wavelength is changed by radicals and a photoradical polymerization initiator as the dye N from the viewpoints of visibility of the exposed part, visibility of the non-exposed part, and resolution. It is preferable to include it.

The dye N is preferably a dye that develops color with an acid, a base, or a radical from the viewpoint of the visibility of the exposed part and the visibility of the non-exposed part.

As an example of the color development mechanism of dye N, photoradical polymerization is carried out by exposing a photosensitive resin layer containing a photoradical polymerization initiator, a photocationic polymerization initiator (that is, a photoacid generator), or a photobase generator. A mode in which a radical-reactive dye, an acid-reactive dye, or a base-reactive dye (for example, leuco dye) is colored by a radical, an acid, or a base generated from an initiator, a photocationic polymerization initiator, or a photobase generator. Can be mentioned.

In the dye N, the maximum absorption wavelength in the wavelength range of 400 nm to 780 nm at the time of color development is preferably 550 nm or more, preferably 550 nm to 700 nm, from the viewpoint of the visibility of the exposed portion and the visibility of the non-exposed portion. More preferably, it is particularly preferably 550 to 650 nm.

Further, the dye N may have one or two or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm at the time of color development. When the dye N has two or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm at the time of color development, the maximum absorption wavelength having the highest absorbance among the two or more maximum absorption wavelengths may be 450 nm or more.

For the maximum absorption wavelength of dye N, the transmission spectrum of a solution containing dye N (liquid temperature 25 ° C.) is measured in the range of 400 nm to 780 nm using a spectrophotometer (UV3100, Shimadzu Corporation) in an atmospheric atmosphere. Then, the measurement is performed by detecting the wavelength at which the light intensity becomes the minimum (maximum absorption wavelength).

Examples of the dye that develops or decolorizes by exposure include leuco compounds. Examples of dyes that are decolorized by exposure include leuco compounds, diarylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes, and anthraquinone dyes. The dye N is preferably a leuco compound from the viewpoint of the visibility of the exposed portion and the visibility of the non-exposed portion.

Examples of the leuco compound include a leuco compound having a triarylmethane skeleton (triarylmethane dye), a leuco compound having a spiropylan skeleton (spiropylan dye), a leuco compound having a fluorane skeleton (fluorane dye), and a diarylmethane skeleton. It has a leuco compound (diarylmethane dye) having a leuco compound (diarylmethane dye), a leuco compound having a rhodamine lactam skeleton (rodamine lactam dye), a leuco compound having an indrill phthalide skeleton (indrill phthalide dye), and a leuco auramine skeleton. Leuco compounds (leuco auramine dyes) can be mentioned. The leuco compound is preferably a triarylmethane dye or a fluorane dye, and more preferably a leuco compound having a triphenylmethane skeleton (triphenylmethane dye) or a fluorane dye.

The leuco compound preferably has a lactone ring, a surujin ring, or a sultone ring from the viewpoint of the visibility of the exposed portion and the visibility of the non-exposed portion. By reacting the lactone ring, sultin ring, or sulton ring contained in the leuco compound with a radical generated from the photoradical polymerization initiator or an acid generated from the photocationic polymerization initiator, the leuco compound is changed to a closed ring state. The color can be decolorized, or the radical compound can be changed to a ring-opened state to develop a color. The leuco compound is preferably a compound having a lactone ring, a sultone ring, or a sultone ring, and the lactone ring, the sultone ring, or the sultone ring is opened by a radical or an acid to develop a color. It is more preferable that the compound has, and the lactone ring is opened by a radical or an acid to develop a color.

Specific examples of leuco compounds include p, p', p "-hexamethyltriaminotriphenylmethane (leucocrystal violet), Pergascript Blue SRB (Ciba Geigy), crystal violet lactone, malakite green lactone, benzoyl leucomethylene blue, 2 -(N-phenyl-N-methylamino) -6- (N-p-tolyl-N-ethyl) aminofluorane, 2-anilino-3-methyl-6- (N-ethyl-p-toluizino) fluorane, 3,6-dimethoxyfluorane, 3- (N, N-diethylamino) -5-methyl-7- (N, N-dibenzylamino) fluorane, 3- (N-cyclohexyl-N-methylamino) -6- Methyl-7-anilinofluorane, 3- (N, N-diethylamino) -6-methyl-7-anilinofluorane, 3- (N, N-diethylamino) -6-methyl-7-xylidinofluorane , 3- (N, N-diethylamino) -6-methyl-7-chlorofluorine, 3- (N, N-diethylamino) -6-methoxy-7-aminofluorane, 3- (N, N-diethylamino) -7- (4-Chloroanilino) fluorane, 3- (N, N-diethylamino) -7-chlorofluorane, 3- (N, N-diethylamino) -7-benzylaminofluorane, 3- (N, N-) Diethylamino) -7,8-benzofluorolane, 3- (N, N-dibutylamino) -6-methyl-7-anilinofluorane, 3- (N, N-dibutylamino) -6-methyl-7- Xylidinofluolane, 3-piperidino-6-methyl-7-anilinofluoran, 3-pyrrolidino-6-methyl-7-anilinofluorane, 3,3-bis (1-ethyl-2-methylindol-) 3-yl) phthalide, 3,3-bis (1-n-butyl-2-methylindol-3-yl) phthalide, 3,3-bis (p-dimethylaminophenyl) -6-dimethylaminophthalide, 3 -(4-Diethylamino-2-ethoxyphenyl) -3- (1-ethyl-2-methylindole-3-yl) -4-azaphthalide, 3- (4-diethylaminophenyl) -3- (1-ethyl-2) -Methylindole-3-yl) phthalide and 3', 6'-bis (diphenylamino) spiroisobenzofuran-1 (3H), 9'-[9H] xanthen-3-one can be mentioned.

Examples of the dye N include dyes. Specific examples of dyes include Brilliant Green, Ethyl Violet, Methyl Green, Crystal Violet, Basic Fuxin, Methyl Violet 2B, Kinaldine Red, Rose Bengal, Metanyl Yellow, Timor Sulfophthalene, Xylenol Blue, Methyl Orange, and Paramethyl. Red, Congofred, Benzopurpurin 4B, α-Naftil Red, Nile Blue 2B, Nile Blue A, Methyl Violet, Malakite Green, Parafuxin, Victoria Pure Blue-Naphthalene Sulfonate, Victoria Pure Blue BOH (Hodoya Chemical Industry Co., Ltd.) Company), Oil Blue # 603 (Orient Chemical Industry Co., Ltd.), Oil Pink # 312 (Orient Chemical Industry Co., Ltd.), Oil Red 5B (Orient Chemical Industry Co., Ltd.), Oil Scarlet # 308 (Orient Chemical Industry Co., Ltd.), Oil Red OG (Orient Chemical Industry Co., Ltd.), Oil Red RR (Orient Chemical Industry Co., Ltd.), Oil Green # 502 (Orient Chemical Industry Co., Ltd.), Spiron Red BEH Special (Hodogaya Chemical Industry Co., Ltd.), m-cresol purple , Cresol Red, Rhodamine B, Rhodamine 6G, Sulfo Rhodamine B, Auramine, 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxyanilino-4-p-diethylaminophenyliminonaphthoquinone, 2-carboxystearylamino-4-p- N, N-bis (hydroxyethyl) amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-p-diethylaminophenylimino-5-pyrazolone, and 1-β-naphthyl-4-p-diethylaminophenylimino- 5-Pyrazolone is mentioned.

The dye N is preferably a dye whose maximum absorption wavelength is changed by radicals from the viewpoints of visibility of exposed parts, visibility of non-exposed parts, pattern visibility after development, and resolution, and color is developed by radicals. It is more preferable that the pigment is a radical.

The dye N is preferably leuco crystal violet, crystal violet lactone, brilliant green, or Victoria pure blue-naphthalene sulfonate.

The photosensitive resin layer may contain one kind alone or two or more kinds of dyes N.

The content ratio of the dye N is 0.1 mass with respect to the total mass of the photosensitive resin layer from the viewpoints of the visibility of the exposed portion, the visibility of the non-exposed portion, the pattern visibility after development, and the resolution. % Or more, more preferably 0.1% by mass to 10% by mass, further preferably 0.1% by mass to 5% by mass, and 0.1% by mass to 1% by mass. It is particularly preferable to have.

The content ratio of the dye N means the content ratio of the dye when all of the dye N contained in the photosensitive resin layer is in a colored state. Hereinafter, a method for quantifying the content ratio of dye N will be described by taking a dye that develops color by radicals as an example. Two solutions are prepared by dissolving the dye (0.001 g) and the dye (0.01 g) in methyl ethyl ketone (100 mL). IRGACURE OXE-01 (BASF) is added to each of the obtained solutions as a photoradical polymerization initiator, and then radicals are generated by irradiating with light of 365 nm to bring all the dyes into a colored state. Next, in an air atmosphere, the absorbance of each solution having a liquid temperature of 25 ° C. is measured using a spectrophotometer (UV3100, Shimadzu Corporation) to prepare a calibration curve. Next, the absorbance of the solution in which all the dyes are colored is measured by the same method as above except that the photosensitive resin layer (3 g) is dissolved in methyl ethyl ketone instead of the dye. From the absorbance of the obtained solution containing the photosensitive resin layer, the content of the dye contained in the photosensitive resin layer is calculated based on the calibration curve.

-Surfactant-
The photosensitive resin layer preferably contains a surfactant from the viewpoint of thickness uniformity. Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic (nonionic) surfactants, and amphoteric surfactants, and nonionic surfactants are preferable.

Examples of the nonionic surfactant include a polyoxyethylene higher alkyl ether compound, a polyoxyethylene higher alkylphenyl ether compound, a higher fatty acid diester compound of polyoxyethylene glycol, a silicone-based nonionic surfactant, and a fluorine-based nonionic property. Surfactants can be mentioned.

The photosensitive resin layer preferably contains a fluorine-based nonionic surfactant from the viewpoint of being more excellent in resolution. It is considered that the photosensitive resin layer contains a fluorine-based nonionic surfactant to suppress the penetration of the etching solution into the photosensitive resin layer and reduce the side etching. Commercially available products of the fluorine-based nonionic surfactant include, for example, Megafvck (registered trademark) F-551, F-552 (DIC Corporation), and Megafvck F-554 (DIC Corporation).

Examples of the surfactant include the surfactant described in paragraphs 0120 to 0125 of International Publication No. 2018/179640, the surfactant described in paragraph 0017 of Japanese Patent No. 45027884, and JP-A-2009-237362. The surfactants described in paragraphs 0060 to 0071 of the publication are also mentioned.

Further, as the surfactant, a nonionic surfactant, a fluorine-based surfactant or a silicone-based surfactant is preferable.

Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (eg, glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, etc. Polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic (trade name) L10, L31, L61, L62, 10R5, 17R2 , 25R2 (above, manufactured by BASF), Tetronic (trade name) 304, 701, 704, 901, 904, 150R1 (above, manufactured by BASF), Solsperse (trade name) 20000 (above, manufactured by Nippon Lubrizol Co., Ltd.) ), NCW-101, NCW-1001, NCW-1002 (above, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), Pionin (trade name) D-6112, D-6112-W, D-6315 (above, Takemoto Yushi Co., Ltd.) (Manufactured by the company), Orphine E1010, Surfinol 104, 400, 440 (all manufactured by Nissin Chemical Industry Co., Ltd.) and the like.

Commercially available products of fluorine-based surfactants include, for example, Megafuck (trade names) F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143. , F-144, F-437, F-444, F-475, F-477, F-479, F-482, F-551-A, F-552, F-554, F-555-A, F -556, F-557, F-558, F-559, F-560, F-561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, MFS -578, MFS-579, MFS-586, MFS-587, R-41, R-41-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90 , R-94, RS-72-K, DS-21 (above, manufactured by DIC Co., Ltd.), Florard (trade name) FC430, FC431, FC171 (above, manufactured by Sumitomo 3M Co., Ltd.), Surflon (trade name) S- 382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Co., Ltd.), PolyFox (trade name) ) PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA), Futagent (trade name) 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, Examples thereof include 208G, 710LA, 710FS, 730LM, 650AC, 681, 683 (all manufactured by Neos Co., Ltd.).
Further, the fluorine-based surfactant has a molecular structure having a functional group containing a fluorine atom, and an acrylic compound in which a portion of the functional group containing a fluorine atom is cut off and the fluorine atom volatilizes when heat is applied. Can be preferably used. Examples of such fluorine-based surfactants include Megafuck (trade name) DS series manufactured by DIC Corporation (The Chemical Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)). For example, Megafuck (trade name) DS-21 can be mentioned.

Further, as the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound.
A block polymer can also be used as the fluorine-based surfactant. The fluorine-based surfactant has a structural unit derived from a (meth) acrylate compound having a fluorine atom and 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy groups and propyleneoxy groups) (meth). A fluorine-containing polymer compound containing a structural unit derived from an acrylate compound can also be preferably used.
As the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated group in the side chain can also be used. Mega-Fuck (trade name) RS-101, RS-102, RS-718K, RS-72-K (all manufactured by DIC Corporation) and the like can be mentioned.
As the fluorine-based surfactant, for example, a compound having a linear perfluoroalkyl group having 7 or more carbon atoms may be used. However, from the viewpoint of improving environmental suitability, it is preferable to use a substitute material of perfluorooctanoic acid (PFOA) or perfluorooctanesulfonic acid (PFOS) as the fluorine-based surfactant.

Examples of the silicone-based surfactant include a linear polymer composed of a siloxane bond and a modified siloxane polymer in which an organic group is introduced into a side chain or a terminal.
Specific examples of silicone-based surfactants include DOWNSIL (trade name) 8032 ADDITIVE, Torre Silicone DC3PA, Torre Silicone SH7PA, Torre Silicone DC11PA, Torre Silicone SH21PA, Torre Silicone SH28PA, Torre Silicone SH29PA, Torre Silicone SH30PA, Torre Silicone SH8400. (The above is manufactured by Toray Dow Corning Co., Ltd.), X-22-4952, X-22-2272, X-22-6266, KF-351A, K354L, KF-355A, KF-945, KF-640, KF -642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Chemical Industry Co., Ltd.), F-4440, TSF -4300, TSF-4445, TSF-4460, TSF-4452 (above, manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (above, manufactured by Big Chemie) and the like.

The photosensitive resin layer may contain one type alone or two or more types of surfactants.

The content ratio of the surfactant is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass, based on the total mass of the photosensitive resin layer.

-Additive-
The photosensitive resin layer may contain a known additive in addition to the above components, if necessary. Examples of the additive include a thermocrossable compound, a radical polymerization inhibitor, a sensitizer, a plasticizer, a heterocyclic compound, a benzotriazole compound, a carboxybenzotriazole compound, a resin other than the polymer A, and a solvent. The photosensitive resin layer may contain one kind alone or two or more kinds of additives.

The photosensitive resin layer preferably contains a heat-crosslinkable compound from the viewpoint of the strength of the obtained cured film and the adhesiveness of the obtained uncured film. In this specification, the heat-crosslinkable compound having an ethylenically unsaturated group, which will be described later, is not treated as an ethylenically unsaturated compound, but is treated as a heat-crosslinkable compound.
Examples of the heat-crosslinkable compound include a methylol compound and a blocked isocyanate compound. Of these, a blocked isocyanate compound is preferable from the viewpoint of the strength of the obtained cured film and the adhesiveness of the obtained uncured film.
Since the blocked isocyanate compound reacts with the hydroxy group and the carboxy group, for example, when the polymer A and / or the ethylenically unsaturated compound has at least one of the hydroxy group and the carboxy group, the hydrophilicity of the formed film The properties are reduced, and the function when a film obtained by curing the photosensitive resin layer is used as a protective film tends to be enhanced.
The blocked isocyanate compound refers to "a compound having a structure in which the isocyanate group of isocyanate is protected (so-called masked) with a blocking agent".

The dissociation temperature of the blocked isocyanate compound is not particularly limited, but is preferably 100 ° C. to 160 ° C., more preferably 130 ° C. to 150 ° C.
The dissociation temperature of the blocked isocyanate means "the temperature of the endothermic peak associated with the deprotection reaction of the blocked isocyanate when measured by DSC (Differential scanning calorimetry) analysis using a differential scanning calorimeter".
As the differential scanning calorimeter, for example, a differential scanning calorimeter (model: DSC6200) manufactured by Seiko Instruments Inc. can be preferably used. However, the differential scanning calorimeter is not limited to this.

Examples of the blocking agent having a dissociation temperature of 100 ° C. to 160 ° C. include active methylene compounds [malonate diester (dimethyl malonate, diethyl malonate, din-butyl malonate, di2-ethylhexyl malonate, etc.)] and oxime compounds. (A compound having a structure represented by -C (= N-OH)-in the molecule such as formaldehyde, acetaldoxime, acetoxime, methylethylketooxime, and cyclohexanone oxime) can be mentioned.
Among these, the blocking agent having a dissociation temperature of 100 ° C. to 160 ° C. preferably contains, for example, an oxime compound from the viewpoint of storage stability.

The blocked isocyanate compound preferably has an isocyanurate structure, for example, from the viewpoint of improving the brittleness of the membrane and improving the adhesion to the transferred material.
The blocked isocyanate compound having an isocyanurate structure can be obtained, for example, by isocyanurate-forming and protecting hexamethylene diisocyanate.
Among the blocked isocyanate compounds having an isocyanurate structure, a compound having an oxime structure using an oxime compound as a blocking agent is more likely to have a dissociation temperature in a preferable range than a compound having no oxime structure, and has a smaller development residue. It is preferable from the viewpoint of ease.

The blocked isocyanate compound may have a polymerizable group.
The polymerizable group is not particularly limited, and a known polymerizable group can be used, and a radical polymerizable group is preferable.
Examples of the polymerizable group include an ethylenically unsaturated group such as a (meth) acryloxy group, a (meth) acrylamide group and a styryl group, and a group having an epoxy group such as a glycidyl group.
Among them, as the polymerizable group, an ethylenically unsaturated group is preferable, a (meth) acryloxy group is more preferable, and an acryloxy group is further preferable.

As the blocked isocyanate compound, a commercially available product can be used.
Examples of commercially available blocked isocyanate compounds include Karenz (registered trademark) AOI-BM, Karenz (registered trademark) MOI-BM, Karenz (registered trademark) MOI-BP, etc. (all manufactured by Showa Denko KK), block type. Duranate series (for example, Duranate (registered trademark) TPA-B80E, Duranate (registered trademark) WT32-B75P, etc., manufactured by Asahi Kasei Chemicals Co., Ltd.) can be mentioned.
Further, as the blocked isocyanate compound, a compound having the following structure can also be used.

The heat-crosslinkable compound may be used alone or in combination of two or more.
When the photosensitive resin layer contains a heat-crosslinkable compound, the content of the heat-crosslinkable compound is preferably 1% by mass to 50% by mass, and 5% by mass to 30% by mass, based on the total mass of the photosensitive resin layer. Is more preferable.

The photosensitive resin layer may contain a radical polymerization inhibitor. Examples of the radical polymerization inhibitor include the thermal polymerization inhibitor described in paragraph 0018 of Japanese Patent No. 4502784. The radical polymerization inhibitor is preferably phenothiazine, phenoxazine, or 4-methoxyphenol. Examples of the radical polymerization inhibitor other than the above include naphthylamine, cuprous chloride, nitrosophenylhydroxyamine aluminum salt, and diphenylnitrosamine. It is preferable to use a nitrosophenylhydroxyamine aluminum salt as a radical polymerization inhibitor so as not to impair the sensitivity of the photosensitive resin layer.

The photosensitive resin layer may contain a benzotriazole compound. Examples of the benzotriazole compound include 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, bis (N-2-ethylhexyl) aminomethylene-1,2,3-benzotriazole, and the like. Examples thereof include bis (N-2-ethylhexyl) aminomethylene-1,2,3-tolyltriazole and bis (N-2-hydroxyethyl) aminomethylene-1,2,3-benzotriazole.

The photosensitive resin layer may contain a carboxybenzotriazole compound. Examples of the carboxybenzotriazole compound include 4-carboxy-1,2,3-benzotriazole, 5-carboxy-1,2,3-benzotriazole, and N- (N, N-di-2-ethylhexyl) aminomethylene. Examples thereof include carboxybenzotriazole, N- (N, N-di-2-hydroxyethyl) aminomethylene carboxybenzotriazole, and N- (N, N-di-2-ethylhexyl) aminoethylene carboxybenzotriazole. Examples of commercially available products of the carboxybenzotriazole compound include CBT-1 (Johoku Chemical Industry Co., Ltd.).

The ratio of the total content of the radical polymerization inhibitor, the benzotriazol compound, and the carboxybenzotriazol compound may be 0.01% by mass to 3% by mass with respect to the total mass of the photosensitive resin layer. It is preferably 0.05% by mass to 1% by mass, more preferably. It is preferable that the ratio of the total content of each of the above components is 0.01% by mass or more from the viewpoint of imparting storage stability to the photosensitive resin layer. On the other hand, it is preferable that the ratio of the total content of each of the above-mentioned components is 3% by mass or less from the viewpoint of maintaining the sensitivity and suppressing the decolorization of the dye.

The photosensitive resin layer may contain a sensitizer. The sensitizer is not limited, and a known sensitizer can be used. In addition, dyes and pigments can also be used as the sensitizer. Examples of the sensitizer include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, and triazole compounds (for example, 1,2,4-triazole), stillben compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoaclysin compounds.

The photosensitive resin layer may contain one type alone or two or more types of sensitizers.

When the photosensitive resin layer contains a sensitizer, the content ratio of the sensitizer can be appropriately selected depending on the purpose, but from the viewpoint of improving the sensitivity to the light source and improving the curing rate by balancing the polymerization rate and the chain transfer. It is preferably 0.01% by mass to 5% by mass, and more preferably 0.05% by mass to 1% by mass with respect to the total mass of the photosensitive resin layer.

The photosensitive resin layer may contain at least one selected from the group consisting of a plasticizer and a heterocyclic compound. Examples of the plasticizer and the heterocyclic compound include the compounds described in paragraphs 097 to 0103 and 0111 to 0118 of International Publication No. 2018/179640.

The photosensitive resin layer may contain a resin other than the polymer A. Resins other than the polymer A include acrylic resins, styrene-acrylic copolymers (however, limited to copolymers having a styrene content of 40% by mass or less), polyurethane resins, polyvinyl alcohols, polyvinyl formals, and polyamide resins. Examples thereof include polyester resin, epoxy resin, polyacetal resin, polyhydroxystyrene resin, polyimide resin, polybenzoxazole resin, polysiloxane resin, polyethyleneimine, polyallylamine, and polyalkylene glycol.

The photosensitive resin layer may contain a solvent. When the photosensitive resin layer is formed by the photosensitive resin composition containing a solvent, the solvent may remain in the photosensitive resin layer. The solvent will be described later.

The photosensitive resin layer can be used as an additive, for example, as a metal oxide particle, an antioxidant, a dispersant, an acid growth agent, a development accelerator, conductive fiber, a thermal radical polymerization initiator, a thermal acid generator, or an ultraviolet absorber. , At least one selected from the group consisting of thickeners, cross-linking agents, organic precipitation inhibitors, and inorganic precipitation inhibitors. Additives are described, for example, in paragraphs 0165 to 0184 of JP2014-85643A. The contents of the above gazette are incorporated herein by reference.

(Impurities, etc.)
The photosensitive resin layer may contain a predetermined amount of impurities. Specific examples of impurities include sodium, potassium, magnesium, calcium, iron, manganese, copper, aluminum, titanium, chromium, cobalt, nickel, zinc, tin, halogen, and ions thereof. Among the above, halide ions, sodium ions, and potassium ions are likely to be mixed as impurities, so the content is preferably as follows.

The content of impurities in the photosensitive resin layer is preferably 80 ppm or less, more preferably 10 ppm or less, and further preferably 2 ppm or less on a mass basis. The content of impurities in the photosensitive resin layer can be 1 ppb or more or 0.1 ppm or more on a mass basis.

As a method of setting impurities in the above range, a raw material having a low content of impurities is selected as a raw material of the photosensitive resin layer, prevention of impurities from being mixed in when forming the photosensitive resin layer, and cleaning of the manufacturing equipment. Removal of impurities can be mentioned. By such a method, the amount of impurities can be kept within the above range.

Impurities can be quantified by a known method, for example, ICP (Inductively Coupled Plasma) emission spectroscopy, atomic absorption spectroscopy, or ion chromatography.

The content of benzene, formaldehyde, trichlorethylene, 1,3-butadiene, carbon tetrachloride, chloroform, N, N-dimethylformamide, N, N-dimethylacetamide, and hexane in the photosensitive resin layer is preferably low. The content of the above compound in the photosensitive resin layer is preferably 100 ppm or less, more preferably 20 ppm or less, still more preferably 4 ppm or less on a mass basis. The content of the above-mentioned compound in the photosensitive resin layer can be 10 ppb or more or 100 ppb or more on a mass basis. The content of the above-mentioned compound can be suppressed in the same manner as the above-mentioned metal impurities. Moreover, it can be quantified by a known measurement method.

The water content in the photosensitive resin layer is preferably 0.01% by mass to 1.0% by mass, preferably 0.05% by mass to 0.5% by mass, from the viewpoint of improving reliability and laminateability. Is more preferable.

(Residual monomer)
The photosensitive resin layer may contain a residual monomer corresponding to each structural unit of the polymer A described above.
From the viewpoint of patterning property and reliability, the content of the residual monomer is preferably 5,000 mass ppm or less, more preferably 2,000 mass ppm or less, and 500 mass ppm or less, based on the total mass of the polymer A. The following is more preferable. The lower limit is not particularly limited, but 1 mass ppm or more is preferable, and 10 mass ppm or more is more preferable.
The residual monomer of each structural unit of the polymer A is preferably 3,000 mass ppm or less, more preferably 600 mass ppm or less, based on the total mass of the photosensitive resin layer from the viewpoint of patterning property and reliability. , 100 mass ppm or less is more preferable. The lower limit is not particularly limited, but is preferably 0.1 mass ppm or more, and more preferably 1 mass ppm or more.

The amount of residual monomer of the monomer when the polymer A is synthesized by the polymer reaction is also preferably in the above range. For example, when the polymer A is synthesized by reacting the carboxylic acid side chain with glycidyl acrylate, the content of glycidyl acrylate is preferably in the above range.
The amount of residual monomer can be measured by a known method such as liquid chromatography and gas chromatography.

(thickness)
The average thickness of the photosensitive resin layer is generally 0.1 μm to 300 μm. The average thickness of the photosensitive resin layer is preferably 0.5 μm or more, more preferably 1 μm or more, and further preferably 3 μm or more. When the layer adjacent to the temporary support is a photosensitive resin layer, the adhesive force between the photosensitive resin layer and the temporary support is increased when the average thickness of the photosensitive resin layer is within the above range. The occurrence of wrinkles on the support can be further suppressed. The average thickness of the photosensitive resin layer is preferably 100 μm or less, more preferably 50 μm or less, further preferably 15 μm or less, and particularly preferably 10 μm or less. When the average thickness of the photosensitive resin layer is within the above range, the developability of the photosensitive resin layer can be improved and the resolution can be improved. The average thickness of the photosensitive resin layer is measured by a method according to the method for measuring the average thickness of the temporary support.

(Transmittance)
In the photosensitive resin layer, the transmittance of light having a wavelength of 365 nm is preferably 10% or more, more preferably 30% or more, and particularly preferably 50% or more, from the viewpoint of being more excellent in adhesion. .. The upper limit of transmittance is not limited. In the photosensitive resin layer, the transmittance of light having a wavelength of 365 nm is preferably 99.9% or less.

(Formation method)
The method for forming the photosensitive resin layer is not limited as long as it is a method capable of forming a layer containing the above components. Examples of the method for forming the photosensitive resin layer include a method of applying the photosensitive resin composition to the surface of the temporary support and then drying the coating film of the photosensitive resin composition.

Examples of the photosensitive resin composition include a composition containing a polymer A, a polymerizable compound B, an optional component, and a solvent. The photosensitive resin composition preferably contains a solvent in order to adjust the viscosity of the photosensitive resin composition and facilitate the formation of the photosensitive resin layer.

The solvent is not limited as long as it can dissolve or disperse the polymer A, the polymerizable compound B, and any component, and a known solvent can be used. Examples of the solvent include an alkylene glycol ether solvent, an alkylene glycol ether acetate solvent, an alcohol solvent (for example, methanol and ethanol), a ketone solvent (for example, acetone and methyl ethyl ketone), and an aromatic hydrocarbon solvent (for example, toluene). Examples include aprotonic polar solvents (eg, N, N-dimethylformamide), cyclic ether solvents (eg, tetrahydrofuran), ester solvents, amide solvents, and lactone solvents.

The photosensitive resin composition preferably contains at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. The photosensitive resin composition comprises at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, and at least one selected from the group consisting of a ketone solvent and a cyclic ether solvent. It is more preferable to include it. It is particularly preferable that the photosensitive resin composition contains at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, a ketone solvent, and a cyclic ether solvent.

Examples of the alkylene glycol ether solvent include ethylene glycol monoalkyl ether, ethylene glycol dialkyl ether, propylene glycol monoalkyl ether, propylene glycol dialkyl ether, diethylene glycol dialkyl ether, dipropylene glycol monoalkyl ether, and dipropylene glycol dialkyl ether. Be done.

Examples of the alkylene glycol ether acetate solvent include ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate, and dipropylene glycol monoalkyl ether acetate.

As the solvent, the solvent described in paragraphs 0092 to 0094 of International Publication No. 2018/179640 and the solvent described in paragraph 0014 of JP-A-2018-177789 may be used. These contents are incorporated herein by reference.

The photosensitive resin composition may contain one kind of solvent alone or two or more kinds of solvents.

The content ratio of the solvent in the photosensitive resin composition is preferably 50 parts by mass to 1,900 parts by mass, and 100 parts by mass to 900 parts by mass with respect to 100 parts by mass of the total solid content in the photosensitive resin composition. It is more preferable that it is a part.

The method for preparing the photosensitive resin composition is not limited. As a method for preparing the photosensitive resin composition, for example, a method of preparing a photosensitive resin composition by preparing a solution in which each component is dissolved in a solvent in advance and mixing the obtained solutions in a predetermined ratio. Can be mentioned. The photosensitive resin composition is preferably filtered using a filter having a pore size of 0.2 μm to 30 μm before forming the photosensitive resin layer.

The method for applying the photosensitive resin composition is not limited, and a known method can be used. Examples of the coating method include slit coating, spin coating, curtain coating, and inkjet coating.

Further, the photosensitive resin layer may be formed by applying the photosensitive resin composition on a cover film described later and drying it.

[Other layers]
The photosensitive transfer material according to the present disclosure may have a layer other than the above-mentioned layer (hereinafter, referred to as “another layer”). Other layers include a cover film, a thermoplastic resin, an intermediate layer, and a contrast enhancement layer (also referred to as a refractive index adjusting layer).

(Cover film)
The photosensitive transfer material according to the present disclosure may have a cover film (also referred to as a protective film). According to the cover film, the surface of the layer (for example, the photosensitive resin layer) in contact with the cover film can be protected.

In a certain embodiment, the photosensitive transfer material preferably includes a temporary support, a photosensitive resin layer, and a cover film in this order. In the above-mentioned photosensitive transfer material, the photosensitive resin layer may be laminated on the temporary support directly or via an arbitrary layer. In the above-mentioned photosensitive transfer material, the cover film may be laminated on the photosensitive resin layer directly or via an arbitrary layer. Examples of the arbitrary layer in the photosensitive transfer material include other layers described later.

In certain embodiments, the photosensitive transfer material preferably has a cover film in contact with the surface of the photosensitive resin layer opposite to the surface facing the temporary support.

Examples of the cover film include a resin film and paper. The cover film is preferably a resin film from the viewpoint of strength and flexibility.

Examples of the resin film include polyethylene film, polypropylene film, polyethylene terephthalate film, cellulose triacetate film, polystyrene film, and polycarbonate film. The resin film is preferably a polyethylene film, a polypropylene film, or a polyethylene terephthalate film.

The thickness of the cover film is not limited. The average thickness of the cover film is preferably 5 μm to 100 μm, more preferably 10 μm to 50 μm, and particularly preferably 10 μm to 20 μm. The average thickness of the cover film is measured by a method according to the method for measuring the average thickness of the temporary support.

The arithmetic mean roughness Ra of the surface of the cover film on the side on which the photosensitive resin layer is arranged is preferably 0.3 μm or less, and more preferably 0.1 μm or less, from the viewpoint of excellent resolution. , 0.05 μm or less is particularly preferable. When the arithmetic mean roughness of the surface on the side where the photosensitive resin layer of the cover film is arranged is within the above range, the uniformity of the thickness of the photosensitive resin layer and the formed resin pattern is improved. The lower limit of the arithmetic mean roughness Ra is not limited. The arithmetic mean roughness Ra of the surface of the cover film on the side on which the photosensitive resin layer is arranged is preferably 0.001 μm or more. The arithmetic mean roughness Ra of the surface of the cover film on the side on which the photosensitive resin layer is arranged is measured by a method according to the method for measuring the arithmetic mean roughness Ra described in the above section "Temporary Support".

(Thermoplastic resin layer)
The photosensitive transfer material according to the present disclosure may have a thermoplastic resin layer. In certain embodiments, the photosensitive transfer material preferably has a thermoplastic resin layer between the temporary support and the photosensitive resin layer. Since the photosensitive transfer material has a thermoplastic resin layer between the temporary support and the photosensitive resin layer, the followability to the substrate in the process of being bonded to the substrate is improved, and the substrate and the photosensitive transfer material can be separated from each other. This is because, as a result of suppressing the mixing of air bubbles between the layers, the adhesion between the layers is improved.

-Alkali-soluble resin-
The thermoplastic resin layer preferably contains an alkali-soluble resin as the thermoplastic resin.

Examples of the alkali-soluble resin include acrylic resin, polystyrene resin, styrene-acrylic copolymer, polyurethane resin, polyvinyl alcohol, polyvinyl formal, polyamide resin, polyester resin, epoxy resin, polyacetal resin, polyhydroxystyrene resin, and polyimide resin. Examples thereof include polybenzoxazole resin, polysiloxane resin, polyethyleneimine, polyallylamine, and polyalkylene glycol.

The alkali-soluble resin is preferably an acrylic resin from the viewpoint of developability and adhesion to a layer adjacent to the thermoplastic resin layer. Here, the "acrylic resin" is selected from the group consisting of a structural unit derived from (meth) acrylic acid, a structural unit derived from (meth) acrylic acid ester, and a structural unit derived from (meth) acrylic acid amide. It means a resin having at least one kind.

In the acrylic resin, the ratio of the total content of the structural unit derived from (meth) acrylic acid, the structural unit derived from (meth) acrylic acid ester, and the structural unit derived from (meth) acrylic acid amide is the ratio of the total content of the acrylic resin. It is preferably 50% by mass or more with respect to the total mass. In the acrylic resin, the ratio of the total content of the structural unit derived from (meth) acrylic acid and the structural unit derived from (meth) acrylic acid ester is 30% by mass to 100% by mass with respect to the total mass of the acrylic resin. %, More preferably 50% by mass to 100% by mass.

Further, the alkali-soluble resin is preferably a polymer having an acid group. Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group, and a carboxy group is preferable.

From the viewpoint of developability, the alkali-soluble resin is preferably an alkali-soluble resin having an acid value of 60 mgKOH / g or more, and more preferably a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more. The upper limit of acid value is not limited. The acid value of the alkali-soluble resin is preferably 200 mgKOH / g or less, and more preferably 150 mgKOH / g or less.

The carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more is not limited and can be appropriately selected from known resins and used. Examples of the carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more include carboxy group-containing acrylic resins having an acid value of 60 mgKOH / g or more among the polymers described in paragraph 0025 of JP-A-2011-95716. Described in paragraphs 0033 to 0052 of Japanese Patent Application Laid-Open No. 2010-237589, a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more, and paragraphs 0053 to 0068 of JP-A-2016-224162. Among the binder polymers of the above, a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more can be mentioned.

The content ratio of the structural unit having a carboxy group in the carboxy group-containing acrylic resin is preferably 5% by mass to 50% by mass, preferably 10% by mass to 40% by mass, based on the total mass of the carboxy group-containing acrylic resin. It is more preferable, and it is particularly preferable that it is 12% by mass to 30% by mass.

The alkali-soluble resin is particularly preferably an acrylic resin having a structural unit derived from (meth) acrylic acid from the viewpoint of developability and adhesion to a layer adjacent to the thermoplastic resin layer.

The alkali-soluble resin may have a reactive group. The reactive group may be, for example, a group capable of addition polymerization. Reactive groups include, for example, ethylenically unsaturated groups, polycondensable groups (eg, hydroxy and carboxy groups), and polyaddition reactive groups (eg, epoxy groups and (blocking) isocyanate groups). Be done.

The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 1,000 or more, more preferably 10,000 to 100,000, and particularly preferably 20,000 to 50,000.

The thermoplastic resin layer may contain one type alone or two or more types of alkali-soluble resins.

The content ratio of the alkali-soluble resin is 10% by mass to 99% by mass with respect to the total mass of the thermoplastic resin layer from the viewpoint of developability and adhesion to the layer adjacent to the thermoplastic resin layer. It is more preferably 20% by mass to 90% by mass, further preferably 40% by mass to 80% by mass, and particularly preferably 50% by mass to 70% by mass.

-Dye-
The thermoplastic resin layer has a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 nm to 780 nm at the time of color development, and the maximum absorption wavelength is changed by an acid, a base, or a radical (hereinafter referred to as “dye B”). In some cases), it is preferable to include. The preferred embodiment of the dye B is the same as the preferred embodiment of the dye N described above, except for the points described later.

The dye B is preferably a dye whose maximum absorption wavelength is changed by an acid or a radical from the viewpoints of visibility of the exposed portion, visibility of the non-exposed portion, and resolution, and the maximum absorption wavelength is changed by the acid. It is more preferable that the pigment is a dye.

The thermoplastic layer includes a dye whose maximum absorption wavelength is changed by an acid as the dye B and a compound that generates an acid by light, which will be described later, from the viewpoints of visibility of the exposed part, visibility of the non-exposed part, and resolution. , Are preferably included.

The thermoplastic resin layer may contain one type alone or two or more types of dye B.

The content ratio of the dye B is preferably 0.2% by mass or more, preferably 0.2% by mass, based on the total mass of the thermoplastic resin layer from the viewpoint of the visibility of the exposed portion and the visibility of the non-exposed portion. It is more preferably% to 6% by mass, further preferably 0.2% by mass to 5% by mass, and particularly preferably 0.25% by mass to 3.0% by mass.

Here, the content ratio of the dye B means the content ratio of the dye when all of the dye B contained in the thermoplastic resin layer is in a colored state. Hereinafter, a method for quantifying the content ratio of dye B will be described by taking a dye that develops color by radicals as an example. Two solutions are prepared by dissolving the dye (0.001 g) and the dye (0.01 g) in methyl ethyl ketone (100 mL). IRGACURE OXE-01 (BASF) is added to each of the obtained solutions as a photoradical polymerization initiator, and then radicals are generated by irradiating with light of 365 nm to bring all the dyes into a colored state. Next, in an air atmosphere, the absorbance of each solution having a liquid temperature of 25 ° C. is measured using a spectrophotometer (UV3100, Shimadzu Corporation) to prepare a calibration curve. Next, the absorbance of the solution in which all the dyes are colored is measured by the same method as above except that the thermoplastic resin layer (0.1 g) is dissolved in methyl ethyl ketone instead of the dye. From the absorbance of the obtained solution containing the thermoplastic resin layer, the amount of the dye contained in the thermoplastic resin layer is calculated based on the calibration curve.

-Compounds that generate acids, bases, or radicals with light-
The thermoplastic resin layer may contain a compound that generates an acid, a base, or a radical by light (hereinafter, may be referred to as “Compound C”). Compound C is preferably a compound that receives active rays (for example, ultraviolet rays and visible rays) to generate acids, bases, or radicals. Examples of compound C include known photoacid generators, photobase generators, and photoradical polymerization initiators (photoradical generators). Compound C is preferably a photoacid generator.

[Photoacid generator]
The thermoplastic resin layer preferably contains a photoacid generator from the viewpoint of resolution. Examples of the photoacid generator include a photocationic polymerization initiator that may be contained in the above-mentioned photosensitive resin layer, and the preferred embodiments are the same except for the points described below.

From the viewpoint of sensitivity and resolution, the photoacid generator preferably contains at least one selected from the group consisting of onium salt compounds and oxime sulfonate compounds, and has sensitivity, resolution and adhesion. From the viewpoint, it is more preferable to contain an oxime sulfonate compound.

It is also preferable that the photoacid generator is a photoacid generator having the following structure.

[Photobase generator]
The thermoplastic resin layer may contain a photobase generator. Examples of the photobase generator include 2-nitrobenzylcyclohexylcarbamate, triphenylmethanol, O-carbamoylhydroxylamide, O-carbamoyloxime, [[(2,6-dinitrobenzyl) oxy] carbonyl] cyclohexylamine, and bis [ [(2-Nitrobenzyl) oxy] carbonyl] hexane 1,6-diamine, 4- (methylthiobenzoyl) -1-methyl-1-morpholinoetan, (4-morpholinobenzoyl) -1-benzyl-1-dimethylaminopropane , N- (2-nitrobenzyloxycarbonyl) pyrrolidine, hexaammine cobalt (III) tris (triphenylmethylborate), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2,6 -Dimethyl-3,5-diacetyl-4- (2-nitrophenyl) -1,4-dihydropyridine, and 2,6-dimethyl-3,5-diacetyl-4- (2,4-dinitrophenyl) -1, 4-Dihydropyridine can be mentioned.

[Photoradical polymerization initiator]
The thermoplastic resin layer may contain a photoradical polymerization initiator. Examples of the photoradical polymerization initiator include a photoradical polymerization initiator that may be contained in the above-mentioned photosensitive resin layer, and the preferred embodiment is also the same.

The thermoplastic resin layer may contain one kind alone or two or more kinds of compound C.

The content ratio of the compound C is 0.1% by mass to 10% by mass with respect to the total mass of the thermoplastic resin layer from the viewpoint of the visibility of the exposed portion, the visibility of the non-exposed portion, and the resolution. It is preferable, and it is more preferable that it is 0.5% by mass to 5% by mass.

-Plasticizer-
The thermoplastic resin layer preferably contains a plasticizer from the viewpoints of resolution, adhesion to a layer adjacent to the thermoplastic resin layer, and developability.

The molecular weight of the plasticizer (the molecular weight of the oligomer or polymer is the weight average molecular weight (Mw); the same applies hereinafter in this paragraph) is preferably smaller than the molecular weight of the alkali-soluble resin. The molecular weight of the plasticizer is preferably 200 to 2,000.

The plasticizer is not limited as long as it is a compound that develops plasticity by being compatible with an alkali-soluble resin. From the viewpoint of imparting plasticity, the plasticizer is preferably a compound having an alkyleneoxy group in the molecule, and more preferably a polyalkylene glycol compound. The alkyleneoxy group contained in the plasticizer preferably has a polyethyleneoxy structure or a polypropyleneoxy structure.

The plasticizer preferably contains a (meth) acrylate compound from the viewpoint of resolution and storage stability. From the viewpoint of compatibility, resolution, and adhesion to the layer adjacent to the thermoplastic resin layer, it is more preferable that the alkali-soluble resin is an acrylic resin and the plasticizer contains a (meth) acrylate compound.

Examples of the (meth) acrylate compound used as a plasticizer include the (meth) acrylate compound described in the above-mentioned "Polymerizable Compound B" section. In the photosensitive transfer material, when the thermoplastic resin layer and the photosensitive resin layer are arranged in direct contact with each other, the thermoplastic resin layer and the photosensitive resin layer may each contain the same (meth) acrylate compound. preferable. This is because the thermoplastic resin layer and the photosensitive resin layer each contain the same (meth) acrylate compound, so that the diffusion of components between the layers is suppressed and the storage stability is improved.

When the thermoplastic resin layer contains a (meth) acrylate compound as a plasticizer, the (meth) acrylate compound may not polymerize even in the exposed portion after exposure from the viewpoint of adhesion to the layer adjacent to the thermoplastic resin layer. preferable.

In certain embodiments, the (meth) acrylate compound used as the plasticizer is composed of two or more (meth) acrylate compounds in one molecule from the viewpoints of resolution, adhesion to a layer adjacent to the thermoplastic resin layer, and developability. It is preferably a (meth) acrylate compound having a meta) acryloyl group.

In certain embodiments, the (meth) acrylate compound used as a plasticizer is preferably a (meth) acrylate compound having an acid group or a urethane (meth) acrylate compound.

The thermoplastic resin layer may contain one type alone or two or more types of plasticizers.

The content ratio of the plasticizer is 1% by mass to 70% by mass with respect to the total mass of the thermoplastic resin layer from the viewpoints of resolution, adhesion to the layer adjacent to the thermoplastic resin layer, and developability. It is preferably 10% by mass to 60% by mass, and particularly preferably 20% by mass to 50% by mass.

-Surfactant-
The thermoplastic resin layer preferably contains a surfactant from the viewpoint of thickness uniformity. Examples of the surfactant include a surfactant that may be contained in the above-mentioned photosensitive resin layer, and the preferred embodiment is also the same.

The thermoplastic resin layer may contain one type alone or two or more types of surfactants.

The content ratio of the surfactant is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass, based on the total mass of the thermoplastic resin layer.

-Sensitizer-
The thermoplastic resin layer may contain a sensitizer. Examples of the sensitizer include sensitizers that may be contained in the above-mentioned photosensitive resin layer.

The thermoplastic resin layer may contain one type alone or two or more types of sensitizers.

The content ratio of the sensitizer is 0.01% by mass to 5% by mass with respect to the total mass of the thermoplastic resin layer from the viewpoint of improving the sensitivity to the light source, the visibility of the exposed part, and the visibility of the non-exposed part. %, More preferably 0.05% by mass to 1% by mass.

-Additive-
The thermoplastic resin layer may contain known additives in addition to the above components, if necessary.

Further, the thermoplastic resin layer is described in paragraphs 0189 to 0193 of Japanese Patent Application Laid-Open No. 2014-85643. The contents of the above gazette are incorporated herein by reference.

-thickness-
The thickness of the thermoplastic resin layer is not limited. The average thickness of the thermoplastic resin layer is preferably 1 μm or more, and more preferably 2 μm or more, from the viewpoint of adhesion to the layer adjacent to the thermoplastic resin layer. The upper limit of the average thickness of the thermoplastic resin layer is not limited. From the viewpoint of developability and resolvability, the average thickness of the thermoplastic resin layer is preferably 20 μm or less, more preferably 10 μm or less, and particularly preferably 5 μm or less. The average thickness of the thermoplastic resin layer is measured by a method according to the method for measuring the average thickness of the temporary support.

-Formation method-
The method for forming the thermoplastic resin layer is not limited as long as it is a method capable of forming a layer containing the above components. Examples of the method for forming the thermoplastic resin layer include a method in which the thermoplastic resin composition is applied to the surface of the temporary support and the coating film of the thermoplastic resin composition is dried.

Examples of the thermoplastic resin composition include a composition containing the above components. The thermoplastic resin composition preferably contains a solvent in order to adjust the viscosity of the thermoplastic resin composition and facilitate the formation of the thermoplastic resin layer.

The solvent contained in the thermoplastic resin composition is not limited as long as it is a solvent capable of dissolving or dispersing the components contained in the thermoplastic resin layer. Examples of the solvent include a solvent that may be contained in the above-mentioned photosensitive resin composition, and the preferred embodiment is also the same.

The thermoplastic resin composition may contain one kind alone or two or more kinds of solvents.

The content ratio of the solvent in the thermoplastic resin composition is preferably 50 parts by mass to 1,900 parts by mass, and 100 parts by mass to 900 parts by mass with respect to 100 parts by mass of the total solid content in the thermoplastic resin composition. It is more preferable that it is a part.

The preparation of the thermoplastic resin composition and the formation of the thermoplastic resin layer may be carried out according to the method for preparing the photosensitive resin composition and the method for forming the photosensitive resin layer described above. For example, a thermoplastic resin composition was prepared by preparing a solution in which each component contained in the thermoplastic resin layer was dissolved in a solvent in advance and mixing the obtained solutions in a predetermined ratio, and then obtained. The thermoplastic resin layer can be formed by applying the thermoplastic resin composition to the surface of the temporary support and drying the coating film of the thermoplastic resin composition. Further, after forming the photosensitive resin layer on the cover film described later, the thermoplastic resin layer may be formed on the surface of the photosensitive resin layer.

(Middle class)
The photosensitive transfer material according to the present disclosure preferably has an intermediate layer between the thermoplastic resin layer and the photosensitive resin layer. According to the intermediate layer, it is possible to suppress the mixing of components when forming a plurality of layers and during storage.

The intermediate layer is preferably a water-soluble layer from the viewpoint of developability and suppressing mixing of components during application of the plurality of layers and storage after application. In the present disclosure, "water-soluble" means that the solubility in 100 g of water having a liquid temperature of 22 ° C. and a pH of 7.0 is 0.1 g or more.

Examples of the intermediate layer include an oxygen blocking layer having an oxygen blocking function, which is described as a “separation layer” in JP-A-5-72724. Since the intermediate layer is an oxygen blocking layer, the sensitivity at the time of exposure is improved, the time load of the exposure machine is reduced, and as a result, the productivity is improved. The oxygen blocking layer used as the intermediate layer may be appropriately selected from known layers. The oxygen blocking layer used as the intermediate layer is preferably an oxygen blocking layer that exhibits low oxygen permeability and is dispersed or dissolved in water or an alkaline aqueous solution (1% by mass aqueous solution of sodium carbonate at 22 ° C.).

The intermediate layer preferably contains a resin. Examples of the resin contained in the intermediate layer include polyvinyl alcohol-based resin, polyvinylpyrrolidone-based resin, cellulose-based resin, acrylamide-based resin, polyethylene oxide-based resin, gelatin, vinyl ether-based resin, polyamide resin, and copolymers thereof. Can be mentioned. The resin contained in the intermediate layer is preferably a water-soluble resin.

The resin contained in the intermediate layer is either polymer A contained in the photosensitive resin layer or thermoplastic resin (alkali-soluble resin) contained in the thermoplastic resin layer from the viewpoint of suppressing mixing of components between a plurality of layers. It is preferable that the resin is different from the above.

The intermediate layer preferably contains polyvinyl alcohol, and preferably contains polyvinyl alcohol and polyvinylpyrrolidone, from the viewpoint of oxygen blocking property and suppressing mixing of components during application of the plurality of layers and storage after application. Is more preferable.

The intermediate layer may contain one kind of resin alone or two or more kinds of resins.

The content ratio of the resin in the intermediate layer is 50% by mass with respect to the total mass of the intermediate layer from the viewpoint of oxygen blocking property and suppressing mixing of components during application of the plurality of layers and storage after application. It is preferably ~ 100% by mass, more preferably 70% by mass to 100% by mass, further preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass. preferable.

Further, the intermediate layer may contain an additive if necessary. Examples of the additive include a surfactant.

The thickness of the intermediate layer is not limited. The average thickness of the intermediate layer is preferably 0.1 μm to 5 μm, more preferably 0.5 μm to 3 μm. When the thickness of the intermediate layer is within the above range, the oxygen blocking property is not deteriorated, the mixing of the components at the time of forming a plurality of layers and at the time of storage can be suppressed, and the intermediate layer at the time of development can be suppressed. The increase in removal time can be suppressed. The average thickness of the intermediate layer is measured by a method according to the method for measuring the average thickness of the temporary support.

The method of forming the intermediate layer is not limited as long as it is a method capable of forming a layer containing the above components. Examples of the method for forming the intermediate layer include a method in which the composition for the intermediate layer is applied to the surface of the thermoplastic resin layer or the photosensitive resin layer, and then the coating film of the composition for the intermediate layer is dried.

Examples of the composition for the intermediate layer include a composition containing a resin and an arbitrary additive. The composition for the intermediate layer preferably contains a solvent in order to adjust the viscosity of the composition for the intermediate layer and facilitate the formation of the intermediate layer. The solvent is not limited as long as it is a solvent that can dissolve or disperse the resin. The solvent is preferably at least one selected from the group consisting of water and a water-miscible organic solvent, and more preferably water or a mixed solvent of water and a water-miscible organic solvent.

Examples of the water-miscible organic solvent include alcohol, acetone, ethylene glycol, and glycerin having 1 to 3 carbon atoms. The water-miscible organic solvent is preferably an alcohol having 1 to 3 carbon atoms, and more preferably methanol or ethanol.

(Contrast enhancement layer)
The photosensitive transfer material according to the present disclosure may have a contrast enhancement layer. The contrast enhancement layer is described in, for example, paragraph 0134 of International Publication No. 2018/179640 and paragraphs 0194 to 0196 of JP2014-85643A. The contents of these gazettes are incorporated herein by reference.

[Relationship between temporary support, photosensitive resin layer and cover film]
In the photosensitive transfer material according to the present disclosure, the cured film obtained by curing the photosensitive resin layer has a breaking elongation at 120 ° C. of 15% or more, and the arithmetic mean roughness Ra of the surface of the temporary support on the photosensitive resin layer side is high. It is preferably 50 nm or less, and the arithmetic mean roughness Ra of the surface of the cover film on the photosensitive resin layer side is 150 nm or less.

Further, the photosensitive transfer material according to the present disclosure preferably satisfies the following formula (R1).
X × Y <1,500: Equation (R1)
Here, in the above formula (R1), X represents the value (%) of the elongation at break at 120 ° C. of the cured film obtained by curing the photosensitive resin layer, and Y represents the surface of the temporary support on the photosensitive resin layer side. Represents the value (nm) of the arithmetic mean roughness Ra of.
X × Y is more preferably 750 or less.

It is preferable that the breaking elongation at 120 ° C. is twice or more larger than the breaking elongation at 23 ° C. of the cured film obtained by curing the photosensitive resin layer.
The elongation at break was determined by exposing a photosensitive resin layer having a thickness of 20 μm to 120 mJ / cm ² with an ultra-high pressure mercury lamp and curing it, and then further exposing it to 400 mJ / cm ² with a high pressure mercury lamp and heating it at 145 ° C. for 30 minutes. The later cured film is used and measured by a tensile test.

Further, the photosensitive transfer material according to the present disclosure preferably satisfies the following formula (R2).
Y ≤ Z: Equation (R2)
Here, in the above formula (R2), Y represents the value (nm) of the arithmetic mean roughness Ra of the surface of the temporary support on the photosensitive resin layer side, and Z represents the value (nm) of the photosensitive resin layer side of the cover film. It represents the value (nm) of the arithmetic mean roughness Ra of the surface.

<< Average thickness >>
The average thickness of the photosensitive transfer material is preferably 5 μm to 55 μm, more preferably 10 μm to 50 μm, and particularly preferably 20 μm to 40 μm. The average thickness of the photosensitive transfer material is measured by a method according to the method for measuring the average thickness of the temporary support.

<< Shape >>
The shape of the photosensitive transfer material according to the present disclosure is not limited. The shape of the photosensitive transfer material according to the present disclosure is preferably roll-shaped from the viewpoint of versatility and transportability. By winding up the photosensitive transfer material, the shape of the photosensitive transfer material can be made into a roll.

<< Manufacturing method >>
In the method for producing a photosensitive transfer material according to the present disclosure, for example, the method for forming each layer described in the above section "Components" can be used. Hereinafter, a preferred example of a method for producing a photosensitive transfer material will be described with reference to FIG. However, the method for producing the photosensitive transfer material is not limited to the method described below.

FIG. 1 is a schematic side view showing an example of the configuration of the photosensitive transfer material. The method for producing the photosensitive transfer material 100 shown in FIG. 1 includes, for example, a step of forming a photosensitive resin layer 12 by applying a photosensitive resin composition on a temporary support 10, and the above-mentioned photosensitive. A method including a step of arranging the cover film 14 on the resin layer 12 and a method including the step of arranging the cover film 14 can be mentioned. In the above method, the photosensitive resin composition applied on the temporary support 10 may be dried, if necessary. The drying method is not limited, and a known drying method can be used.

Examples of the method of arranging the cover film 14 on the photosensitive resin layer 12 include a method of crimping the cover film 14 to the photosensitive resin layer 12.

By going through the above steps, the photosensitive transfer material 100 having the temporary support 10, the photosensitive resin layer 12, and the cover film 14 can be manufactured. The manufactured photosensitive transfer material 100 may be wound into a roll. The roll-shaped photosensitive transfer material 100 can be used, for example, in a bonding step with a substrate by a roll-to-roll method.

<< Applications >>
The photosensitive transfer material according to the present disclosure can be used, for example, for forming a resin pattern and forming a circuit wiring. However, the use of the photosensitive transfer material according to the present disclosure is not limited to the above-mentioned use.

The photosensitive transfer material according to the present disclosure may be used, for example, as a photosensitive transfer material for a wiring protective film. Examples of the layer structure of the photosensitive transfer material preferably used as the photosensitive transfer material for the wiring protective film include the following (1) and (2).
(1) Temporary support / photosensitive resin layer / refractive index adjustment layer / cover film (2) Temporary support / photosensitive resin layer / cover film

Hereinafter, the components of the photosensitive transfer material preferably used as the photosensitive transfer material for the wiring protective film will be described. However, the components of the photosensitive transfer material preferably used as the photosensitive transfer material for the wiring protective film are not limited to the components shown below.

[Temporary support]
Examples of the temporary support include the temporary support described in the above section "Components". The preferred embodiment of the temporary support is the same as the preferred embodiment of the temporary support described in the section “Components” above.

[Cover film]
Examples of the temporary support include the cover film described in the above section "Components". The preferred embodiment of the cover film is the same as the preferred embodiment of the cover film described in the above section "Components".

[Photosensitive resin layer]
(Alkali-soluble resin)
The photosensitive resin layer preferably contains an alkali-soluble resin.
Examples of the alkali-soluble resin include (meth) acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin, ester resin, urethane resin, and reaction of epoxy resin with (meth) acrylic acid. Examples thereof include an epoxy acrylate resin obtained in 1 and an acid-modified epoxy acrylate resin obtained by reacting an epoxy acrylate resin with an acid anhydride.

One of the preferred embodiments of the alkali-soluble resin is a (meth) acrylic resin in that it is excellent in alkali developability and film forming property.
In the present specification, the (meth) acrylic resin means a resin having a structural unit derived from the (meth) acrylic compound. The content of the structural unit derived from the (meth) acrylic compound is preferably 50% by mass or more, more preferably 70% by mass or more, still more preferably 90% by mass or more, based on all the structural units of the (meth) acrylic resin. ..
The (meth) acrylic resin may be composed of only structural units derived from the (meth) acrylic compound, or may have structural units derived from a polymerizable monomer other than the (meth) acrylic compound. .. That is, the upper limit of the content of the structural unit derived from the (meth) acrylic compound is 100% by mass or less with respect to all the structural units of the (meth) acrylic resin.

Examples of the (meth) acrylic compound include (meth) acrylic acid, (meth) acrylic acid ester, (meth) acrylamide, and (meth) acrylonitrile.
Examples of the (meth) acrylic acid ester include (meth) acrylic acid alkyl ester, (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic acid diethylaminoethyl ester, and (meth) acrylic acid ester. ) Acrylic acid glycidyl ester, (meth) acrylic acid benzyl ester, 2,2,2-trifluoroethyl (meth) acrylate, and 2,2,3,3-tetrafluoropropyl (meth) acrylate. Meta) Acrylic acid alkyl esters are preferred.
Examples of (meth) acrylamide include acrylamide such as diacetone acrylamide.

Examples of the (meth) acrylic acid alkyl ester include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, and (meth). Hexyl acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, and Examples thereof include (meth) acrylic acid alkyl esters having an alkyl group having 1 to 12 carbon atoms, such as dodecyl (meth) acrylic acid.
As the (meth) acrylic acid ester, a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 4 carbon atoms is preferable, and methyl (meth) acrylate or ethyl (meth) acrylate is more preferable.

The (meth) acrylic resin may have a structural unit other than the structural unit derived from the (meth) acrylic compound.
The polymerizable monomer forming the above-mentioned structural unit is not particularly limited as long as it is a compound other than the (meth) acrylic compound that is copolymerizable with the (meth) acrylic compound, and is, for example, styrene, vinyltoluene, and α. -Styrene compounds such as methylstyrene which may have a substituent at the α-position or aromatic ring, vinyl alcohol esters such as acrylonitrile and vinyl-n-butyl ether, maleic acid, maleic acid anhydride, monomethyl maleate, maleic acid Examples thereof include monoethyl and maleic acid monoesters such as monoisopropyl maleate, fumaric acid, silicic acid, α-cyanosilicic acid, itaconic acid, and crotonic acid.
These polymerizable monomers may be used alone or in combination of two or more.

Further, the (meth) acrylic resin preferably has a structural unit having an acid group from the viewpoint of improving the alkali developability. Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, and a phosphonic acid group.
Among them, the (meth) acrylic resin more preferably has a structural unit having a carboxy group, and further preferably has a structural unit derived from the above-mentioned (meth) acrylic acid.

The content of the constituent unit having an acid group (preferably the constituent unit derived from (meth) acrylic acid) in the (meth) acrylic resin is excellent in developability with respect to the total mass of the (meth) acrylic resin. 10% by mass or more is preferable. The upper limit is not particularly limited, but is preferably 50% by mass or less, more preferably 40% by mass or less, in terms of excellent alkali resistance.

Further, it is more preferable that the (meth) acrylic resin has a structural unit derived from the above-mentioned (meth) acrylic acid alkyl ester.
The content of the structural unit derived from the (meth) acrylic acid alkyl ester in the (meth) acrylic resin is preferably 50% by mass to 90% by mass, preferably 60% by mass or more, based on all the structural units of the (meth) acrylic resin. 90% by mass is more preferable, and 65% by mass to 90% by mass is further preferable.

As the (meth) acrylic resin, a resin having both a structural unit derived from (meth) acrylic acid and a structural unit derived from (meth) acrylic acid alkyl ester is preferable, and the structural unit derived from (meth) acrylic acid and the structural unit derived from (meth) acrylic acid are preferable. A resin composed only of structural units derived from (meth) acrylic acid alkyl ester is more preferable.
Further, as the (meth) acrylic resin, an acrylic resin having a structural unit derived from methacrylic acid, a structural unit derived from methyl methacrylate, and a structural unit derived from ethyl acrylate is also preferable.

Further, the (meth) acrylic resin preferably has at least one selected from the group consisting of a structural unit derived from methacrylic acid and a structural unit derived from methacrylic acid alkyl ester from the viewpoint of resolvability, and methacrylic acid. It is preferable to have both a structural unit derived from an acid and a structural unit derived from an alkyl methacrylate ester.
The total content of the methacrylic acid-derived structural unit and the methacrylic acid alkyl ester-derived structural unit in the (meth) acrylic resin is 40 with respect to all the structural units of the (meth) acrylic resin from the viewpoint of resolution. It is preferably mass% or more, and more preferably 60% by mass or more. The upper limit is not particularly limited, and may be 100% by mass or less, preferably 80% by mass or less.

Further, the (meth) acrylic resin is derived from at least one selected from the group consisting of a structural unit derived from methacrylic acid and a structural unit derived from methacrylic acid alkyl ester from the viewpoint of resolution, and acrylic acid. It is also preferable to have at least one selected from the group consisting of a structural unit and a structural unit derived from an acrylic acid alkyl ester.
From the viewpoint of resolution, the total content of the structural unit derived from methacrylic acid and the structural unit derived from methacrylic acid alkyl ester is the total content of the structural unit derived from acrylic acid and the structural unit derived from acrylic acid alkyl ester. The mass ratio is preferably 60/40 to 80/20 with respect to the amount.

The (meth) acrylic resin preferably has an ester group at the end in that the photosensitive resin layer after transfer is excellent in developability.
The terminal portion of the (meth) acrylic resin is composed of a site derived from the polymerization initiator used in the synthesis. A (meth) acrylic resin having an ester group at the terminal can be synthesized by using a polymerization initiator that generates a radical having an ester group.

Further, the alkali-soluble resin is preferably an alkali-soluble resin having an acid value of 60 mgKOH / g or more, for example, from the viewpoint of developability.
Further, the alkali-soluble resin is, for example, a resin having a carboxy group having an acid value of 60 mgKOH / g or more (so-called carboxy group-containing resin) from the viewpoint that it is easily crosslinked with a crosslinked component by heating to form a strong film. It is more preferable that the resin is a (meth) acrylic resin having a carboxy group having an acid value of 60 mgKOH / g or more (so-called carboxy group-containing (meth) acrylic resin).
When the alkali-soluble resin is a resin having a carboxy group, the three-dimensional cross-linking density can be increased by adding a heat-crosslinkable compound such as a blocked isocyanate compound and heat-crosslinking. Further, when the carboxy group of the resin having a carboxy group is anhydrous and hydrophobized, the wet heat resistance can be improved.

The carboxy group-containing (meth) acrylic resin having an acid value of 60 mgKOH / g or more is not particularly limited as long as the above acid value conditions are satisfied, and can be appropriately selected from known (meth) acrylic resins.
For example, among the polymers described in paragraphs 0025 of JP2011-095716A, carboxy group-containing acrylic resins having an acid value of 60 mgKOH / g or more, and the polymers described in paragraphs 0033 to 0052 of JP2010-237589A. , A carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more can be preferably used.

Another preferred embodiment of the alkali-soluble resin is a styrene-acrylic copolymer. In the present specification, the styrene-acrylic copolymer refers to a resin having a structural unit derived from a styrene compound and a structural unit derived from a (meth) acrylic compound, and a structural unit derived from the styrene compound. The total content of the structural units derived from the (meth) acrylic compound is preferably 30% by mass or more, more preferably 50% by mass or more, based on all the structural units of the copolymer.
The content of the structural unit derived from the styrene compound is preferably 1% by mass or more, more preferably 5% by mass or more, and further preferably 5% by mass to 80% by mass, based on all the structural units of the copolymer. preferable.
The content of the structural unit derived from the (meth) acrylic compound is preferably 5% by mass or more, more preferably 10% by mass or more, and 20% by mass to 95% by mass, based on all the structural units of the copolymer. Mass% is more preferred.

The alkali-soluble resin preferably has an aromatic ring structure, and more preferably has a structural unit having an aromatic ring structure, from the viewpoint of moisture permeability and strength of the obtained cured film.
Examples of the monomer forming a structural unit having an aromatic ring structure include styrene compounds such as styrene, tert-butoxystyrene, methylstyrene, and α-methylstyrene, and benzyl (meth) acrylate.
Of these, styrene compounds are preferable, and styrene is more preferable.
Further, the alkali-soluble resin more preferably has a structural unit (constituent unit derived from styrene) represented by the following formula (S) from the viewpoint of moisture permeability and strength of the obtained cured film.

When the alkali-soluble resin has a structural unit having an aromatic ring structure, the content of the structural unit having an aromatic ring structure is set with respect to all the structural units of the alkali-soluble resin from the viewpoint of the moisture permeability and strength of the obtained cured film. It is preferably 5% by mass to 90% by mass, more preferably 10% by mass to 70% by mass, and even more preferably 20% by mass to 60% by mass.
The content of the structural unit having an aromatic ring structure in the alkali-soluble resin is 5 mol% to 70 mol% with respect to all the structural units of the alkali-soluble resin from the viewpoint of moisture permeability and strength of the obtained cured film. Preferably, 10 mol% to 60 mol% is more preferable, and 20 mol% to 60 mol% is further preferable.
Further, the content of the structural unit represented by the above formula (S) in the alkali-soluble resin is 5 mol% or more with respect to all the structural units of the alkali-soluble resin from the viewpoint of moisture permeability and strength of the obtained cured film. 70 mol% is preferable, 10 mol% to 60 mol% is more preferable, 20 mol% to 60 mol% is further preferable, and 20 mol% to 50 mol% is particularly preferable.
In the present specification, when the content of the "constituent unit" is defined by the molar ratio, the above "constituent unit" is synonymous with the "monomer unit". Further, in the present specification, the above-mentioned "monomer unit" may be modified after polymerization by a polymer reaction or the like. The same applies to the following.

The alkali-soluble resin preferably has an aliphatic hydrocarbon ring structure from the viewpoint of suppressing development residue, strength of the obtained cured film, and adhesiveness of the obtained uncured film. That is, the alkali-soluble resin preferably has a structural unit having an aliphatic hydrocarbon ring structure. Above all, it is more preferable that the alkali-soluble resin has a ring structure in which two or more aliphatic hydrocarbon rings are fused.

Examples of the ring constituting the aliphatic hydrocarbon ring structure in the structural unit having the aliphatic hydrocarbon ring structure include a tricyclodecane ring, a cyclohexane ring, a cyclopentane ring, a norbornane ring, and an isoborone ring.
Among them, a ring in which two or more aliphatic hydrocarbon rings are fused is preferable, and a tetrahydrodicyclopentadiene ring is preferable, from the viewpoints of suppressing the development residue, the strength of the obtained cured film, and the adhesiveness of the obtained uncured film. (Tricyclo [5.2.1.0 ^2,6 ] decane ring) is more preferable.
Examples of the monomer forming a structural unit having an aliphatic hydrocarbon ring structure include dicyclopentanyl (meth) acrylate, cyclohexyl (meth) acrylate, and isobornyl (meth) acrylate.
Further, the alkali-soluble resin more preferably has a structural unit represented by the following formula (Cy) from the viewpoint of suppressing development residue, strength of the obtained cured film, and adhesiveness of the obtained uncured film. It is more preferable to have a structural unit represented by the above formula (S) and a structural unit represented by the following formula (Cy).

Wherein (Cy), R ^M represents a hydrogen atom or a methyl group, R ^Cy represents a monovalent group having an aliphatic hydrocarbon ring structure.

^{R M} in the formula (Cy) is preferably a methyl group.
One R ^Cy in Formula (Cy), which has developed residual渣抑system, strength of the obtained cured film, and, in view of the tackiness of the uncured film obtained, an aliphatic hydrocarbon ring structure having 5 to 20 carbon atoms It is preferably a valent group, more preferably a monovalent group having an aliphatic hydrocarbon ring structure having 6 to 16 carbon atoms, and more preferably a monovalent group having an aliphatic hydrocarbon ring structure having 8 to 14 carbon atoms. It is more preferable that it is the basis of.
Aliphatic hydrocarbon cyclic structure in the R ^Cy of formula (Cy) can be a single ring structure or may be a polycyclic structure.
Further, the aliphatic hydrocarbon cyclic structure in the R ^Cy of formula (Cy), the development residue渣抑system, strength of the obtained cured film, and, in view of the tackiness of the uncured film obtained, a cyclopentane ring, cyclohexane It is preferably a ring structure, a tetrahydrodicyclopentadiene ring structure, a norbornane ring structure, or an isoborone ring structure, more preferably a cyclohexane ring structure or a tetrahydrodicyclopentadiene ring structure, and a tetrahydrodicyclopentadiene ring structure. Is more preferable.
Moreover, aliphatic hydrocarbon cyclic structure in the R ^Cy of formula (Cy), the development residue渣抑system, strength of the obtained cured film, and, in view of the tackiness of the uncured film obtained, bicyclic or more aliphatic A ring structure in which the hydrocarbon ring is fused is preferable, and a ring in which 2 to 4 aliphatic hydrocarbon rings are fused is more preferable.
Furthermore, ^{R Cy} in the formula (Cy), the intensity of the development residual渣抑system resistance, the resulting cured film, and, in view of the tackiness of the uncured film obtained, -C in the formula (Cy) (= O) O- The group in which the oxygen atom of the above and the aliphatic hydrocarbon ring structure are directly bonded, that is, an aliphatic hydrocarbon ring group is preferable, and a cyclohexyl group or a dicyclopentanyl group is more preferable. It is more preferably a pentanyl group.

The alkali-soluble resin may have one type of structural unit having an aliphatic hydrocarbon ring structure alone, or may have two or more types.
When the alkali-soluble resin has a structural unit having an aliphatic hydrocarbon ring structure, the content of the structural unit having an aliphatic hydrocarbon ring structure is the development residue inhibitory property, the strength of the obtained cured film, and the obtained unobtained. From the viewpoint of the adhesiveness of the cured film, 5% by mass to 90% by mass is preferable, 10% by mass to 80% by mass is more preferable, and 20% by mass to 70% by mass is further based on all the constituent units of the alkali-soluble resin. preferable.
The content of the structural unit having an aliphatic hydrocarbon ring structure in the alkali-soluble resin is determined from the viewpoint of suppressing development residue, the strength of the obtained cured film, and the adhesiveness of the obtained uncured film. 5 mol% to 70 mol% is preferable, 10 mol% to 60 mol% is more preferable, and 20 mol% to 50 mol% is further preferable, based on all the constituent units of.
Further, the content of the structural unit represented by the above formula (Cy) in the alkali-soluble resin is alkaline-soluble from the viewpoint of suppressing development residue, strength of the obtained cured film, and adhesiveness of the obtained uncured film. It is preferably 5 mol% to 70 mol%, more preferably 10 mol% to 60 mol%, still more preferably 20 mol% to 50 mol%, based on all the constituent units of the resin.

When the alkali-soluble resin has a structural unit having an aromatic ring structure and a structural unit having an aliphatic hydrocarbon ring structure, the total content of the structural unit having an aromatic ring structure and the structural unit having an aliphatic hydrocarbon ring structure is From the viewpoint of suppressing the development residue, the strength of the obtained cured film, and the adhesiveness of the obtained uncured film, 10% by mass to 90% by mass is preferable, and 20% by mass is based on all the constituent units of the alkali-soluble resin. -80% by mass is more preferable, and 40% by mass to 75% by mass is further preferable.
The total content of the structural unit having an aromatic ring structure and the structural unit having an aliphatic hydrocarbon ring structure in the alkali-soluble resin is the development residue inhibitory property, the strength of the obtained cured film, and the obtained uncured film. From the viewpoint of adhesiveness, 10 mol% to 80 mol% is preferable, 20 mol% to 70 mol% is more preferable, and 40 mol% to 60 mol% is further preferable with respect to all the constituent units of the alkali-soluble resin.
Further, the total content of the structural unit represented by the above formula (S) and the structural unit represented by the above formula (Cy) in the alkali-soluble resin is the development residue inhibitory property, the strength of the obtained cured film, and the obtained. From the viewpoint of the adhesiveness of the uncured film, 10 mol% to 80 mol% is preferable, 20 mol% to 70 mol% is more preferable, and 40 mol% to 60 mol% is preferable with respect to all the constituent units of the alkali-soluble resin. Is more preferable.
Further, the molar amount nS of the structural unit represented by the above formula (S) and the molar amount nCy of the structural unit represented by the above formula (Cy) in the alkali-soluble resin are the development residue inhibitory property and the strength of the obtained cured film. From the viewpoint of the adhesiveness of the obtained uncured film, it is preferable to satisfy the relationship represented by the following formula (SCy), more preferably the following formula (SCy-1), and the following formula (SCy-2). It is more preferable to satisfy.
0.2 ≦ nS / (nS + nCy) ≦ 0.8: Equation (SCy)
0.30 ≦ nS / (nS + nCy) ≦ 0.75: Equation (SCy-1)
0.40 ≤ nS / (nS + nCy) ≤ 0.70: Equation (SCy-2)

The alkali-soluble resin preferably has a structural unit having an acid group from the viewpoint of developability and adhesion to the substrate.
Examples of the acid group include a carboxy group, a sulfo group, a phosphonic acid group, and a phosphoric acid group, and a carboxy group is preferable.
As the structural unit having the acid group, the structural unit derived from (meth) acrylic acid, which is shown below, is preferable, and the structural unit derived from methacrylic acid is more preferable.

The alkali-soluble resin may have one type of constituent unit having an acid group alone or two or more types.
When the alkali-soluble resin has a structural unit having an acid group, the content of the structural unit having an acid group is higher than that of all the structural units of the alkali-soluble resin from the viewpoint of developability and adhesion to the substrate. 5% by mass to 50% by mass is preferable, 5% by mass to 40% by mass is more preferable, and 10% by mass to 30% by mass is further preferable.
The content of the constituent unit having an acid group in the alkali-soluble resin is preferably 5 mol% to 70 mol% with respect to all the constituent units of the alkali-soluble resin from the viewpoint of developability and adhesion to the substrate. 10 mol% to 50 mol% is more preferable, and 20 mol% to 40 mol% is further preferable.
Further, the content of the (meth) acrylic acid-derived structural unit in the alkali-soluble resin is 5 mol% to 70% with respect to all the structural units of the alkali-soluble resin from the viewpoint of developability and adhesion to the substrate. Mol% is preferable, 10 mol% to 50 mol% is more preferable, and 20 mol% to 40 mol% is further preferable.

The alkali-soluble resin preferably has a reactive group, and more preferably has a structural unit having a reactive group, from the viewpoint of curability and the strength of the obtained cured film.
As the reactive group, a radically polymerizable group is preferable, and an ethylenically unsaturated group is more preferable. When the alkali-soluble resin has an ethylenically unsaturated group, the alkali-soluble resin preferably has a structural unit having an ethylenically unsaturated group in the side chain.
In the present specification, the "main chain" represents a relatively longest binding chain among the molecules of the polymer compound constituting the resin, and the "side chain" refers to an atomic group branched from the main chain. show.
As the ethylenically unsaturated group, an allyl group or a (meth) acryloxy group is more preferable.
Examples of the structural unit having a reactive group include, but are not limited to, those shown below.

The alkali-soluble resin may have one type of structural unit having a reactive group alone or two or more types.
When the alkali-soluble resin has a structural unit having a reactive group, the content of the structural unit having a reactive group is set to all the structural units of the alkali-soluble resin from the viewpoint of curability and the strength of the obtained cured film. On the other hand, 5% by mass to 70% by mass is preferable, 10% by mass to 50% by mass is more preferable, and 20% by mass to 40% by mass is further preferable.
The content of the structural unit having a reactive group in the alkali-soluble resin is 5 mol% to 70 mol with respect to all the structural units of the alkali-soluble resin from the viewpoint of curability and the strength of the obtained cured film. % Is preferred, 10 mol% to 60 mol% is more preferred, and 20 mol% to 50 mol% is even more preferred.

As a means for introducing a reactive group into an alkali-soluble resin, a functional group such as a hydroxy group, a carboxy group, a primary amino group, a secondary amino group, an acetoacetyl group, and a sulfo group, an epoxy compound, and a block are used. Examples thereof include a method of reacting a compound such as an isocyanate compound, an isocyanate compound, a vinyl sulfone compound, an aldehyde compound, a methylol compound, and a carboxylic acid anhydride.
As a preferable example of the means for introducing a reactive group into an alkali-soluble resin, a polymer having a carboxy group is synthesized by a polymerization reaction, and then glycidyl (meth) is added to a part of the carboxy groups of the obtained resin by the polymer reaction. Examples include a means of reacting an acrylate to introduce a (meth) acryloxy group into a polymer. By this means, an alkali-soluble resin having a (meth) acryloxy group in the side chain can be obtained.
The polymerization reaction is preferably carried out under a temperature condition of 70 ° C. to 100 ° C., and more preferably carried out under a temperature condition of 80 ° C. to 90 ° C. As the polymerization initiator used in the above polymerization reaction, an azo-based initiator is preferable, and for example, V-601 (trade name) or V-65 (trade name) manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. is more preferable. The polymer reaction is preferably carried out under temperature conditions of 80 ° C. to 110 ° C. In the above polymer reaction, it is preferable to use a catalyst such as an ammonium salt.

As the alkali-soluble resin, the following resins are preferable because the effects in the present disclosure are more excellent. The content ratios (a to d) and the weight average molecular weight Mw of each of the structural units shown below can be appropriately changed according to the purpose.

In the above resin, a is preferably 20% by mass to 60% by mass, b is preferably 10% by mass to 50% by mass, c is preferably 5.0% by mass to 25% by mass, and d is preferably 10% by mass to 50% by mass. ..

In the above resin, a is 30% by mass to 65% by mass, b is 1.0% by mass to 20% by mass, c is 5.0% by mass to 25% by mass, and d is 10% by mass to 50% by mass. Is preferable.

In the above resin, a is 1.0% by mass to 20% by mass, b is 20% by mass to 60% by mass, c is 5.0% by mass to 25% by mass, and d is 10% by mass to 50% by mass. Is preferable.

Further, the alkali-soluble resin may contain a polymer having a structural unit having a carboxylic acid anhydride structure (hereinafter, also referred to as “polymer X”).
The carboxylic acid anhydride structure may be either a chain carboxylic acid anhydride structure or a cyclic carboxylic acid anhydride structure, but a cyclic carboxylic acid anhydride structure is preferable.
As the ring having a cyclic carboxylic acid anhydride structure, a 5-membered ring to a 7-membered ring is preferable, a 5-membered ring or a 6-membered ring is more preferable, and a 5-membered ring is further preferable.

The structural unit having a carboxylic acid anhydride structure is a structural unit containing a divalent group obtained by removing two hydrogen atoms from the compound represented by the following formula P-1 in the main chain, or the following formula P-1. It is preferable that the monovalent group obtained by removing one hydrogen atom from the represented compound is a structural unit bonded to the main chain directly or via a divalent linking group.

In the formula ^{P-1, R A1a} represents a ^{substituent, n 1a} number of ^{R A1a} may be the same or ^{different, Z 1a} is, -C (= O) -O- C (= O) - Represents a divalent group forming a ring containing, and n ^1a represents an integer of 0 or more.

Examples of the substituent represented by ^{RA1a include an alkyl group.}
As Z ^1a , an alkylene group having 2 to 4 carbon atoms is preferable, an alkylene group having 2 or 3 carbon atoms is more preferable, and an alkylene group having 2 carbon atoms is further preferable.
n ^1a represents an integer of 0 or more. When Z ^1a represents an alkylene group having 2 to 4 carbon atoms, n ^1a is preferably an integer of 0 to 4, more preferably an integer of 0 to 2, and even more preferably 0.
When n ^1a represents an integer of 2 or more, a plurality of ^RA1a may be the same or different. Further, the plurality of ^RA1a may be bonded to each other to form a ring, but it is preferable that they are not bonded to each other to form a ring.

As the structural unit having a carboxylic acid anhydride structure, a structural unit derived from an unsaturated carboxylic acid anhydride is preferable, a structural unit derived from an unsaturated cyclic carboxylic acid anhydride is more preferable, and an unsaturated aliphatic cyclic carboxylic acid is preferable. A structural unit derived from an acid anhydride is more preferable, a structural unit derived from maleic anhydride or itaconic anhydride is particularly preferable, and a structural unit derived from maleic anhydride is most preferable.

Hereinafter, specific examples of the structural unit having a carboxylic acid anhydride structure will be given, but the structural unit having a carboxylic acid anhydride structure is not limited to these specific examples. In the following structural units, Rx represents a hydrogen atom, a methyl group, a CH ₂ OH group, or CF ₃ groups, and Me represents a methyl group.

The structural unit having the carboxylic acid anhydride structure in the polymer X may be one kind alone or two or more kinds.

The total content of the structural units having a carboxylic acid anhydride structure is preferably 0 mol% to 60 mol%, more preferably 5 mol% to 40 mol%, and 10 mol% with respect to all the structural units of the polymer X. It is more preferably ~ 35 mol%.

The photosensitive resin layer may contain only one type of polymer X, or may contain two or more types of polymer X.
When the photosensitive resin layer contains the polymer X, the content of the polymer X is 0.1% by mass to 30% by mass with respect to the total mass of the photosensitive resin layer from the viewpoint of resolution and developability. Is more preferable, 0.2% by mass to 20% by mass is more preferable, 0.5% by mass to 20% by mass is further preferable, and 1% by mass to 20% by mass is further preferable.

The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 5,000 or more, more preferably 10,000 or more, further preferably 10,000 to 50,000, and 20 000 to 30,000 is particularly preferable.

The acid value of the alkali-soluble resin is preferably 10 mgKOH / g to 200 mgKOH / g, more preferably 60 mgKOH / g to 200 mgKOH / g, further preferably 60 mgKOH / g to 150 mgKOH / g, and particularly preferably 60 mgKOH / g to 110 mgKOH / g. ..
The acid value of the alkali-soluble resin is a value measured according to the method described in JIS K0070: 1992.
The dispersity (weight average molecular weight / number average molecular weight) of the alkali-soluble resin is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, and 1.0 to 4. 0 is more preferable, and 1.0 to 3.0 is particularly preferable.

The photosensitive resin layer may contain only one type of alkali-soluble resin, or may contain two or more types of alkali-soluble resin.
The content of the alkali-soluble resin is preferably 10% by mass to 90% by mass, preferably 20% by mass to 80% by mass, based on the total mass of the photosensitive resin layer from the viewpoint of photosensitive, resolution and developability. More preferably, 30% by mass to 70% by mass is further preferable.

(Polymerizable compound)
The photosensitive resin layer may contain a polymerizable compound.
A polymerizable compound is a compound having a polymerizable group. Examples of the polymerizable group include a radically polymerizable group and a cationically polymerizable group, and a radically polymerizable group is preferable.

The polymerizable compound preferably contains a polymerizable compound having an ethylenically unsaturated group (hereinafter, also simply referred to as “ethylenically unsaturated compound”).
As the ethylenically unsaturated group, a (meth) acryloxy group is preferable.
The ethylenically unsaturated compound in the present specification is a compound other than the binder polymer, and preferably has a molecular weight of less than 5,000.
The preferred embodiment of the ethylenically unsaturated compound is the same as the preferred embodiment of the ethylenically unsaturated compound described in the above section “Photosensitive resin layer”.

As one of the preferred embodiments of the ethylenically unsaturated compound, a compound represented by the following formula (M) (simply also referred to as “Compound M”) can be mentioned.
Q ² -R ^¹ -Q ^1: Formula (M)
In formula (M), Q ¹ and Q ² each independently represent a (meth) acryloyloxy group, and R ¹ represents a divalent linking group having a chain structure.

^{Q 1} and ^{Q 2} in the formula (M), from the viewpoint of ease of synthesis, it is preferred that ^{Q 1} and ^{Q 2} are the same group.
^{Further, Q 1} and Q ² in the formula (M) are preferably acryloyloxy groups from the viewpoint of reactivity.
The ^{R 1} in the formula (M), the development residue渣抑system resistance, rust resistance, from the viewpoint of bending resistance of the obtained cured film, an alkylene group, an alkylene oxyalkylene group ^{^{(-L 1 -O-L 1 -}} ), or , Polyalkyleneoxyalkylene group (-(L ^1- O) _p- L ^1- ) is preferable, hydrocarbon group having 2 to 20 carbon atoms or polyalkyleneoxyalkylene group is more preferable, and polyalkyleneoxyalkylene group has 4 to 20 carbon atoms. An alkylene group is more preferable, and a linear alkylene group having 6 to 18 carbon atoms is particularly preferable.
The hydrocarbon group may have a chain structure at least in part, and the portion other than the chain structure is not particularly limited, and is, for example, branched chain, cyclic, or having 1 to 1 to carbon atoms. It may be any of 5 linear alkylene groups, arylene groups, ether bonds, and combinations thereof, and alkylene groups or groups in which two or more alkylene groups and one or more arylene groups are combined are preferable. , The alkylene group is more preferable, and the linear alkylene group is further preferable.
The above L ¹ independently represents an alkylene group, preferably an ethylene group, a propylene group, or a butylene group, and more preferably an ethylene group or a 1,2-propylene group.
p represents an integer of 2 or more, and is preferably an integer of 2 to 10.

The atomic number of the connecting chain of the shortest for connecting the Q ^1, Q ² in the compound M is developing residual渣抑system resistance, rust resistance, from the viewpoint of bending resistance of the obtained cured film, 3 to 50 Is preferable, 4 to 40 pieces are more preferable, 6 to 20 pieces are further preferable, and 8 to 12 pieces are particularly preferable.
In the present specification, the "Q ^1, Q atoms linking chain shortest connecting between the ^2", connecting the atoms in R ¹ be linked to Q ¹ to atom in R ¹ be linked to Q ² The shortest number of atoms.

Specific examples of the compound M include 1,3-butanediol di (meth) acrylate, tetramethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and 1,6-hexanediol di (meth) acrylate. 1,7-Heptanediol di (meth) acrylate, 1,8-octanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, hydrogenated Di (meth) acrylate of bisphenol A, di (meth) acrylate of hydrogenated bisphenol F, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, poly (ethylene glycol / propylene glycol) di (meth) acrylate, And polybutylene glycol di (meth) acrylate can be mentioned. The ester monomer can also be used as a mixture.
Among the above compounds, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1 , 10-Decandiol di (meth) acrylate, and at least one compound selected from the group consisting of neopentyl glycol di (meth) acrylate, preferably 1,6-hexanediol di (meth) acrylate. , 1,9-Nonandiol di (meth) acrylate, and at least one compound selected from the group consisting of 1,10-decanediol di (meth) acrylate, more preferably 1,9-nonane. More preferably, it is at least one compound selected from the group consisting of diol di (meth) acrylate and 1,10-decanediol di (meth) acrylate.

Further, as one of the preferred embodiments of the ethylenically unsaturated compound, a bifunctional or higher functional ethylenically unsaturated compound can be mentioned.
As used herein, the term "bifunctional or higher functional ethylenically unsaturated compound" means a compound having two or more ethylenically unsaturated groups in one molecule.
As the ethylenically unsaturated group in the ethylenically unsaturated compound, a (meth) acryloyl group is preferable.
As the ethylenically unsaturated compound, a (meth) acrylate compound is preferable.

The bifunctional ethylenically unsaturated compound is not particularly limited and may be appropriately selected from known compounds.
Examples of the bifunctional ethylenically unsaturated compound other than the compound M include tricyclodecanedimethanol di (meth) acrylate and 1,4-cyclohexanediol di (meth) acrylate.

Commercially available bifunctional ethylenically unsaturated compounds include tricyclodecanedimethanol diacrylate (trade name: NK ester A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and tricyclodecanedimenanol dimethacrylate (commodity). Name: NK ester DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd., 1,9-nonanediol diacrylate (trade name: NK ester A-NOD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,6-hexanediol Diacrylate (trade name: NK ester A-HD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) can be mentioned.

The trifunctional or higher functional ethylenically unsaturated compound is not particularly limited and may be appropriately selected from known compounds.
Examples of the trifunctional or higher functional ethylenically unsaturated compound include dipentaerythritol (tri / tetra / penta / hexa) (meth) acrylate, pentaerythritol (tri / tetra) (meth) acrylate, and trimethylolpropane tri (meth) acrylate. Examples thereof include ditrimethylolpropane tetra (meth) acrylate, isocyanuric acid (meth) acrylate, and (meth) acrylate compound having a glycerin tri (meth) acrylate skeleton.

Examples of ethylenically unsaturated compounds include caprolactone-modified compounds of (meth) acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Industry Co., Ltd., etc.), (Meta ) Alkylene oxide-modified compound of acrylate compound (KAYARAD (registered trademark) RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin-Nakamura Chemical Industry Co., Ltd., EBECRYL (registered trademark) 135 of Daicel Ornex Co., Ltd. Etc.), ethoxylated glycerin triacrylate (NK ester A-GLY-9E, etc. manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) can also be mentioned.

Examples of the ethylenically unsaturated compound include urethane (meth) acrylate compounds.
Examples of the urethane (meth) acrylate include urethane di (meth) acrylate, and examples thereof include propylene oxide-modified urethane di (meth) acrylate, and ethylene oxide and propylene oxide-modified urethane di (meth) acrylate.
Further, as the urethane (meth) acrylate, a urethane (meth) acrylate having trifunctionality or higher can also be mentioned. As the lower limit of the number of functional groups, 6-functionality or more is more preferable, and 8-functionality or more is further preferable. The upper limit of the number of functional groups is preferably 20 functional or less. Examples of trifunctional or higher functional urethane (meth) acrylates include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), and U-15HA (manufactured by Shin-Nakamura Chemical Co., Ltd.). , UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), AH-600 (trade name) manufactured by Kyoeisha Chemical Co., Ltd., and UA-306H, UA-306T, UA-306I, UA-510H, and UX-5000. (Both manufactured by Nippon Kayaku Co., Ltd.) and the like.

One of the preferred embodiments of the ethylenically unsaturated compound is an ethylenically unsaturated compound having an acid group.
Examples of the acid group include a phosphoric acid group, a sulfo group, and a carboxy group.
Among these, the carboxy group is preferable as the acid group.
As the ethylenically unsaturated compound having an acid group, a trifunctional to tetrafunctional ethylenically unsaturated compound having an acid group [pentaerythritol tri and tetraacrylate (PETA) having a carboxy group introduced into the skeleton (acid value: 80 mgKOH) / G to 120 mgKOH / g)], a pentafunctional to hexafunctional ethylenically unsaturated compound having an acid group (dipentaerythritol penta and hexaacrylate (DPHA)) with a carboxy group introduced into the skeleton [acid value: 25 mgKOH / g] ~ 70 mgKOH / g)] and the like.
These trifunctional or higher functional ethylenically unsaturated compounds having an acid group may be used in combination with a bifunctional ethylenically unsaturated compound having an acid group, if necessary.

As the ethylenically unsaturated compound having an acid group, at least one selected from the group consisting of a bifunctional or higher functional ethylenically unsaturated compound having a carboxy group and a carboxylic acid anhydride thereof is preferable.
When the ethylenically unsaturated compound having an acid group is at least one selected from the group consisting of a bifunctional or higher functional ethylenically unsaturated compound having a carboxy group and a carboxylic acid anhydride thereof, the developability and film strength are higher. Increase.
The bifunctional or higher functional ethylenically unsaturated compound having a carboxy group is not particularly limited and can be appropriately selected from known compounds.
Bifunctional or higher functional unsaturated compounds having a carboxy group include Aronix (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), Aronix (registered trademark) M-520 (manufactured by Toagosei Co., Ltd.), and Aronix (registered trademark). A registered trademark) M-510 (manufactured by Toagosei Co., Ltd.) can be mentioned.

As the ethylenically unsaturated compound having an acid group, the polymerizable compound having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942 is preferable, and the contents described in this publication are incorporated in the present specification. Is done.

Examples of the ethylenically unsaturated compound include a compound obtained by reacting a polyhydric alcohol with an α, β-unsaturated carboxylic acid, and a compound obtained by reacting a glycidyl group-containing compound with an α, β-unsaturated carboxylic acid. , Urethane monomers such as (meth) acrylate compounds with urethane bonds, γ-chloro-β-hydroxypropyl-β'-(meth) acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β'-(meth) acryloyl Examples thereof include phthalic acid compounds such as oxyethyl-o-phthalate and β-hydroxypropyl-β'-(meth) acryloyloxyethyl-o-phthalate, and (meth) acrylic acid alkyl esters.
These are used alone or in combination of two or more.

Examples of the compound obtained by reacting a polyvalent alcohol with α, β-unsaturated carboxylic acid include 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane and 2,2-bis. Bisphenol A-based (meth) acrylate compounds such as (4-((meth) acryloxypolypropoxy) phenyl) propane and 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane , Polyethylene glycol di (meth) acrylate having 2 to 14 ethylene oxide groups, polypropylene glycol di (meth) acrylate having 2 to 14 propylene oxide groups, and 2 to 14 ethylene oxide groups. , Polyethylenepolypropylene glycol di (meth) acrylate, trimethylolpropane di (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane ethoxytri (meth) acrylate having 2 to 14 propylene oxide groups. , Trimethylolpropane diethoxytri (meth) acrylate, trimethylolpropane triethoxytri (meth) acrylate, trimethylolpropane tetraethoxytri (meth) acrylate, trimethylolpropane pentaethoxytri (meth) acrylate, trimethylolpropane ) Tetraacrylate, tetramethylolmethanetri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, and dipentaerythritol hexa (meth) acrylate. Can be mentioned.
Among them, an ethylene unsaturated compound having a tetramethylolmethane structure or a trimethylolpropane structure is preferable, and a tetramethylolmethanetri (meth) acrylate, a tetramethylolmethanetetra (meth) acrylate, a trimethylolpropane tri (meth) acrylate, or a di (Trimethylolpropane) Tetraacrylate is more preferable.

Examples of the ethylenically unsaturated compound include caprolactone-modified compounds of ethylenically unsaturated compounds (for example, KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Industry Co., Ltd., etc.). An alkylene oxide-modified compound of an ethylenically unsaturated compound (for example, KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin-Nakamura Chemical Industry Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel Ornex Co., Ltd. Etc.), ethoxylated glycerin triacrylate (A-GLY-9E, etc. manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and the like.

As the ethylenically unsaturated compound, those containing an ester bond are also preferable from the viewpoint of excellent developability.
The ethylenically unsaturated compound containing an ester bond is not particularly limited as long as it contains an ester bond in the molecule, but from the viewpoint of excellent curability and developability, ethylene having a tetramethylolmethane structure or a trimethylolpropane structure is used. Unsaturated compounds are preferred, and tetramethylolmethanetri (meth) acrylates, tetramethylolmethanetetra (meth) acrylates, trimethylolpropane tri (meth) acrylates, or di (trimethylolpropane) tetraacrylates are more preferred.
From the viewpoint of imparting reliability, the ethylenically unsaturated compound includes an ethylenically unsaturated compound having an aliphatic group having 6 to 20 carbon atoms and the above-mentioned ethylene unsaturated compound having a tetramethylol methane structure or a trimethylol propane structure. It preferably contains a compound.
Examples of the ethylenically unsaturated compound having an aliphatic structure having 6 or more carbon atoms include 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, and tricyclodecanedimethanoldi. Examples include (meth) acrylate.

One of the preferred embodiments of the ethylenically unsaturated compound is an ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure (preferably a bifunctional ethylenically unsaturated compound).
The ethylenically unsaturated compound is ethylenically having a ring structure in which two or more aliphatic hydrocarbon rings are fused (preferably a structure selected from the group consisting of a tricyclodecane structure and a tricyclodecene structure). Unsaturated compounds are preferable, bifunctional ethylenically unsaturated compounds having a ring structure in which two or more aliphatic hydrocarbon rings are fused are more preferable, and tricyclodecanedimethanol di (meth) acrylate is further preferable.
The aliphatic hydrocarbon ring structure includes a cyclopentane structure, a cyclohexane structure, a tricyclodecane structure, and a tricyclodecene from the viewpoint of the moisture permeability and bending resistance of the obtained cured film and the adhesiveness of the obtained uncured film. A structure, a norbornane structure, or an isoborone structure is preferable.

The molecular weight of the ethylenically unsaturated compound is preferably 200 to 3,000, more preferably 250 to 2,600, further preferably 280 to 2,200, and particularly preferably 300 to 2,200.
The ratio of the content of the ethylenically unsaturated compound having a molecular weight of 300 or less to the content of all the ethylenically unsaturated compounds contained in the photosensitive resin layer is based on the content of all the ethylenically unsaturated compounds contained in the photosensitive resin layer. 30% by mass or less is preferable, 25% by mass or less is more preferable, and 20% by mass or less is further preferable.

As one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer preferably contains a bifunctional or higher functional ethylenically unsaturated compound, and more preferably contains a trifunctional or higher functional ethylenically unsaturated compound. More preferably, it contains a functional or tetrafunctional ethylenically unsaturated compound.

Further, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer is an alkali-soluble compound having a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure and a structural unit having an aliphatic hydrocarbon ring. It preferably contains a resin.

Further, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer preferably contains a compound represented by the formula (M) and an ethylenically unsaturated compound having an acid group, and 1,9 It is more preferable to contain -nonanediol diacrylate, tricyclodecanedimethanol diacrylate, and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group, and 1,9-nonanediol diacrylate and tricyclodecandi It is more preferable to contain methanol diacrylate and a succinic acid-modified compound of dipentaerythritol pentaacrylate.

Further, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer comprises a compound represented by the formula (M), an ethylenically unsaturated compound having an acid group, and a heat-crosslinkable compound described later. It is preferable to include the compound represented by the formula (M), an ethylenically unsaturated compound having an acid group, and a blocked isocyanate compound described later.

Further, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer is a bifunctional ethylenically unsaturated compound (preferably a bifunctional (preferably bifunctional)) from the viewpoint of suppressing development residue and preventing rust. It is preferable to contain a (meth) acrylate compound) and a trifunctional or higher functional ethylenically unsaturated compound (preferably a trifunctional or higher functional (meth) acrylate compound).
The mass ratio of the contents of the bifunctional ethylenically unsaturated compound and the trifunctional or higher functional ethylenically unsaturated compound is preferably 10:90 to 90:10, more preferably 30:70 to 70:30.
The content of the bifunctional ethylenically unsaturated compound is preferably 20% by mass to 80% by mass, more preferably 30% by mass to 70% by mass, based on the total amount of all the ethylenically unsaturated compounds.
The content of the bifunctional ethylenically unsaturated compound in the photosensitive resin layer is preferably 10% by mass to 60% by mass, more preferably 15% by mass to 40% by mass, based on the total mass of the photosensitive resin layer.

Further, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer contains compound M and a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure from the viewpoint of rust prevention. Is preferable.
Further, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer is not ethylenically having compound M and an acid group from the viewpoints of substrate adhesion, development residue inhibitory property, and rust prevention property. It is preferable to contain a saturated compound, and more preferably compound M, a bifunctional ethylenically unsaturated compound having an aliphatic hydrocarbon ring structure, and an ethylenically unsaturated compound having an acid group, and compound M, an aliphatic. It is more preferable to contain a bifunctional ethylenically unsaturated compound having a hydrocarbon ring structure, a trifunctional or higher functional ethylenically unsaturated compound, and an ethylenically unsaturated compound having an acid group, and compound M, an aliphatic hydrocarbon ring. It is particularly preferable to contain a bifunctional ethylenically unsaturated compound having a structure, a trifunctional or higher functional ethylenically unsaturated compound, an ethylenically unsaturated compound having an acid group, and a urethane (meth) acrylate compound.
Further, as one of the preferred embodiments of the photosensitive resin layer, the photosensitive resin layer contains 1,9-nonanediol diacrylate and carboxylic from the viewpoints of substrate adhesion, development residue inhibitory property, and rust prevention property. It preferably contains a polyfunctional ethylenically unsaturated compound having an acid group, and includes 1,9-nonanediol diacrylate, tricyclodecanedimethanol diacrylate, and a polyfunctional ethylenically unsaturated compound having a carboxylic acid group. It is more preferable to contain 1,9-nonanediol diacrylate, tricyclodecanedimethanol diacrylate, dipentaerythritol hexaacrylate, and an ethylenically unsaturated compound having a carboxylic acid group, more preferably 1,9-. It is particularly preferable to contain nonanediol diacrylate, tricyclodecanedimethanol diacrylate, an ethylenically unsaturated compound having a carboxylic acid group, and a urethane acrylate compound.

The photosensitive resin layer may contain a monofunctional ethylenically unsaturated compound as the ethylenically unsaturated compound.
The content of the bifunctional or higher functional ethylenically unsaturated compound in the above ethylenically unsaturated compound is 60% by mass to 100% by mass with respect to the total content of all the ethylenically unsaturated compounds contained in the photosensitive resin layer. Preferably, 80% by mass to 100% by mass is more preferable, and 90% by mass to 100% by mass is further preferable.

The ethylenically unsaturated compound may be used alone or in combination of two or more.
The content of the ethylenically unsaturated compound in the photosensitive resin layer is preferably 1% by mass to 70% by mass, more preferably 5% by mass to 70% by mass, and 5% by mass, based on the total mass of the photosensitive resin layer. It is more preferably from 60% by mass to 50% by mass, and particularly preferably from 5% by mass to 50% by mass.

(Polymerization initiator)
The photosensitive resin layer may contain a polymerization initiator.
As the polymerization initiator, a photopolymerization initiator is preferable.
The preferred embodiment of the photopolymerization initiator is the same as the preferred embodiment of the photopolymerization initiator described in the above section “Photosensitive resin layer”.
The polymerization initiator may be used alone or in combination of two or more.
The content of the polymerization initiator is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and 1.0% by mass or more, based on the total mass of the photosensitive resin layer. Is more preferable. The upper limit of the value is preferably 10% by mass or less, and more preferably 5% by mass or less, based on the total mass of the photosensitive resin layer.

(Heterocyclic compound)
The photosensitive resin layer may contain a heterocyclic compound.
The heterocycle contained in the heterocyclic compound may be either a monocyclic or polycyclic heterocycle.
Examples of the hetero atom contained in the heterocyclic compound include a nitrogen atom, an oxygen atom and a sulfur atom. The heterocyclic compound preferably has at least one atom selected from the group consisting of a nitrogen atom, an oxygen atom and a sulfur atom, and more preferably has a nitrogen atom.

Examples of the heterocyclic compound include a triazole compound, a benzotriazole compound, a tetrazole compound, a thiadiazol compound, a triazine compound, a rhonin compound, a thiazole compound, a benzothiazole compound, a benzoimidazole compound, a benzoxazole compound, and a pyrimidine compound.
Among the above, as the heterocyclic compound, at least one selected from the group consisting of a triazole compound, a benzotriazole compound, a tetrazole compound, a thiadiazol compound, a triazine compound, a rhonin compound, a thiazole compound, a benzoimidazole compound, and a benzoxazole compound. Is preferable, and at least one compound selected from the group consisting of a triazole compound, a benzotriazole compound, a tetrazole compound, a thiadiazol compound, a thiazole compound, a benzothiazole compound, a benzoimidazole compound, and a benzoxazole compound is more preferable.

A preferable specific example of the heterocyclic compound is shown below. Examples of the triazole compound and the benzotriazole compound include the following compounds.

Examples of the tetrazole compound include the following compounds.

Examples of thiadiazole compounds include the following compounds.

Examples of the triazine compound include the following compounds.

Examples of the loadonine compound include the following compounds.

Examples of the thiazole compound include the following compounds.

Examples of the benzothiazole compound include the following compounds.

Examples of the benzimidazole compound include the following compounds.

Examples of the benzoxazole compound include the following compounds.

The heterocyclic compound may be used alone or in combination of two or more.
When the photosensitive resin layer contains a heterocyclic compound, the content of the heterocyclic compound is preferably 0.01% by mass to 20.0% by mass, preferably 0.10% by mass, based on the total mass of the photosensitive resin layer. It is more preferably ~ 10.0% by mass, further preferably 0.30% by mass to 8.0% by mass, and particularly preferably 0.50% by mass to 5.0% by mass.

(Aliphatic thiol compound)
The photosensitive resin layer may contain an aliphatic thiol compound.
When the photosensitive resin layer contains an aliphatic thiol compound, the aliphatic thiol compound undergoes an ene-thiol reaction with an ethylenically unsaturated compound, so that curing shrinkage of the formed film is suppressed and stress is relaxed. Will be done.

As the aliphatic thiol compound, a monofunctional aliphatic thiol compound or a polyfunctional aliphatic thiol compound (that is, a bifunctional or higher functional aliphatic thiol compound) is preferable.
Among the above, as the aliphatic thiol compound, a polyfunctional aliphatic thiol compound is more preferable from the viewpoint of adhesion of the formed pattern (particularly, adhesion after exposure).
As used herein, the term "polyfunctional aliphatic thiol compound" means an aliphatic compound having two or more thiol groups (also referred to as "mercapto groups") in the molecule.

As the polyfunctional aliphatic thiol compound, a low molecular weight compound having a molecular weight of 100 or more is preferable. Specifically, the molecular weight of the polyfunctional aliphatic thiol compound is more preferably 100 to 1,500, and even more preferably 150 to 1,000.

As the number of functional groups of the polyfunctional aliphatic thiol compound, for example, from the viewpoint of adhesion of the formed pattern, bifunctional to 10 functional is preferable, bifunctional to 8 functional is more preferable, and bifunctional to 6 functional is further preferable. preferable.

Examples of the polyfunctional aliphatic thiol compound include trimethylolpropanthris (3-mercaptobutylate), 1,4-bis (3-mercaptobutylyloxy) butane, pentaerythritol tetrakis (3-mercaptobutyrate), and the like. 1,3,5-Tris (3-mercaptobutylyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, trimethylolethanetris (3-mercaptobutyrate) ), Tris [(3-mercaptopropionyloxy) ethyl] isocyanurate, trimethylpropanthris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate) Pionate), Dipentaerythritol hexakis (3-mercaptopropionate), ethylene glycol bisthiopropionate, 1,4-bis (3-mercaptobutylyloxy) butane, 1,2-ethanedithiol, 1, Examples thereof include 3-propanedithiol, 1,6-hexamethylenedithiol, 2,2'-(ethylenedithio) diethanethiol, meso-2,3-dimercaptosuccinic acid, and di (mercaptoethyl) ether.

Among the above, the polyfunctional aliphatic thiol compounds include trimethylolpropane tris (3-mercaptobutyrate), 1,4-bis (3-mercaptobutyryloxy) butane, and 1,3,5-tris. At least one compound selected from the group consisting of (3-mercaptobutylyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione is preferred.

Examples of the monofunctional aliphatic thiol compound include 1-octanethiol, 1-dodecanethiol, β-mercaptopropionic acid, methyl-3-mercaptopropionate, 2-ethylhexyl-3-mercaptopropionate, and n-. Examples thereof include octyl-3-mercaptopropionate, methoxybutyl-3-mercaptopropionate, and stearyl-3-mercaptopropionate.

The photosensitive resin layer may contain one type of aliphatic thiol compound alone, or may contain two or more types of aliphatic thiol compounds.
When the photosensitive resin layer contains an aliphatic thiol compound, the content of the aliphatic thiol compound is preferably 5% by mass or more, more preferably 5% by mass to 50% by mass, based on the total mass of the photosensitive resin layer. 5, 5% by mass to 30% by mass is more preferable, and 8% by mass to 20% by mass is particularly preferable.

(Thermal crosslinkable compound)
The photosensitive resin layer preferably contains a heat-crosslinkable compound from the viewpoint of the strength of the obtained cured film and the adhesiveness of the obtained uncured film.
Examples of the heat-crosslinkable compound include the heat-crosslinkable compound described in the above section “Photosensitive resin layer”.
The heat-crosslinkable compound may be used alone or in combination of two or more.
When the photosensitive resin layer contains a heat-crosslinkable compound, the content of the heat-crosslinkable compound is preferably 1% by mass to 50% by mass, and 5% by mass to 30% by mass, based on the total mass of the photosensitive resin layer. Is more preferable.

(Surfactant)
The photosensitive resin layer may contain a surfactant.
Examples of the surfactant include the surfactant described in the above section "Photosensitive resin layer".
The surfactant may be used alone or in combination of two or more.
When the photosensitive resin layer contains a surfactant, the content of the surfactant is preferably 0.01% by mass to 3.0% by mass, preferably 0.01% by mass, based on the total mass of the photosensitive resin layer. It is more preferably from 1.0% by mass, still more preferably from 0.05% by mass to 0.80% by mass.

(Radical polymerization inhibitor)
The photosensitive resin layer may contain a radical polymerization inhibitor.
Examples of the radical polymerization inhibitor include the radical polymerization inhibitor described in the above section “Photosensitive resin layer”.
The radical polymerization inhibitor may be used alone or in combination of two or more.
When the photosensitive resin layer contains a radical polymerization inhibitor, the content of the radical polymerization inhibitor is preferably 0.01% by mass to 3% by mass, preferably 0.05% by mass, based on the total mass of the photosensitive resin layer. ~ 1% by mass is more preferable. When the content is 0.01% by mass or more, the storage stability of the photosensitive resin layer is more excellent. On the other hand, when the content is 3% by mass or less, the maintenance of sensitivity and the suppression of dye decolorization are more excellent.

(Hydrogen donating compound)
The photosensitive resin layer may contain a hydrogen donating compound.
The hydrogen-donating compound has actions such as further improving the sensitivity of the photopolymerization initiator to active light and suppressing the polymerization inhibition of the polymerizable compound by oxygen.
Examples of the hydrogen donating compound include amines and amino acid compounds.

Examples of amines include M.I. R. "Journal of Polymer Society" by Sander et al., Vol. 10, p. 3173 (1972), Japanese Patent Application Laid-Open No. 44-020189, Japanese Patent Application Laid-Open No. 51-082102, Japanese Patent Application Laid-Open No. 52-134692, Japanese Patent Application Laid-Open No. 59-138205 Examples thereof include compounds described in Japanese Patent Application Laid-Open No. 60-084305, Japanese Patent Application Laid-Open No. 62-018537, Japanese Patent Application Laid-Open No. 64-033104, Research Transaction No. 33825, and the like. More specifically, 4,4'-bis (diethylamino) benzophenone, tris (4-dimethylaminophenyl) methane (also known as leucocrystal violet), triethanolamine, p-dimethylaminobenzoic acid ethyl ester, p-formyl. Examples thereof include dimethylaniline and p-methylthiodimethylaniline.
Among them, from the viewpoint of sensitivity, curing rate, and curability, the amines are at least one selected from the group consisting of 4,4'-bis (diethylamino) benzophenone and tris (4-dimethylaminophenyl) methane. Seeds are preferred.

Examples of the amino acid compound include N-phenylglycine, N-methyl-N-phenylglycine, and N-ethyl-N-phenylglycine.
Among them, N-phenylglycine is preferable as the amino acid compound from the viewpoint of sensitivity, curing rate, and curability.

Examples of the hydrogen-donating compound include an organometallic compound (tributyltin acetate, etc.) described in JP-A-48-042465, a hydrogen donor described in JP-A-55-034414, and JP-A-6. Sulfur compounds (Trithian and the like) described in JP-A-308727 are also mentioned.

The hydrogen donating compound may be used alone or in combination of two or more.
When the photosensitive resin layer contains a hydrogen-donating compound, the content of the hydrogen-donating compound is based on the total mass of the photosensitive resin layer in terms of improving the curing rate due to the balance between the polymerization growth rate and the chain transfer. , 0.01% by mass to 10.0% by mass, more preferably 0.01% by mass to 8.0% by mass, still more preferably 0.03% by mass to 5.0% by mass.

(impurities)
The photosensitive resin layer may contain a predetermined amount of impurities.
Examples of the impurities include the impurities described in the above section "Photosensitive resin layer".

(Residual monomer)
The photosensitive resin layer may contain a residual monomer corresponding to each structural unit of the polymer A described above.
Examples of the residual monomer corresponding to each structural unit of the polymer A in the photosensitive resin layer include the residual monomer corresponding to each structural unit of the polymer A described in the above section “Photosensitive resin layer”.

(Other ingredients)
The photosensitive resin layer may contain components other than the components described above (hereinafter, also referred to as “other components”). Other components include, for example, colorants, antioxidants, and particles (eg, metal oxide particles). In addition, as other components, other additives described in paragraphs 0058 to 0071 of JP-A-2000-310706 can also be mentioned.

-particle-
As the particles, metal oxide particles are preferable.
The metal in the metal oxide particles also includes metalloids such as B, Si, Ge, As, Sb, and Te.
The average primary particle size of the particles is preferably 1 nm to 200 nm, more preferably 3 nm to 80 nm, for example, from the viewpoint of transparency of the cured film.
The average primary particle size of the particles is calculated by measuring the particle size of 200 arbitrary particles using an electron microscope and arithmetically averaging the measurement results. When the shape of the particle is not spherical, the longest side is the particle diameter.

When the photosensitive resin layer contains particles, it may contain only one type of particles having different metal types and sizes, or may contain two or more types of particles.
The photosensitive resin layer does not contain particles, or when the photosensitive resin layer contains particles, the content of the particles is more than 0% by mass and 35% by mass or less with respect to the total mass of the photosensitive resin layer. Is preferable, particles are not contained, or the content of particles is more preferably more than 0% by mass and 10% by mass or less with respect to the total mass of the photosensitive resin layer, and particles are not contained or the particles are contained. The amount is more preferably more than 0% by mass and 5% by mass or less based on the total mass of the photosensitive resin layer, and either does not contain particles or the content of particles is 0% by mass based on the total mass of the photosensitive resin layer. Ultra 1% by mass or less is more preferable, and it is particularly preferable that particles are not contained.

-Colorant-
The photosensitive resin layer may contain a colorant (pigment, dye, etc.), but for example, from the viewpoint of transparency, it is preferable that the photosensitive resin layer contains substantially no colorant.
When the photosensitive resin layer contains a colorant, the content of the colorant is preferably less than 1% by mass, more preferably less than 0.1% by mass, based on the total mass of the photosensitive resin layer.

-Antioxidant-
Examples of the antioxidant include 1-phenyl-3-pyrazolidone (also known as phenidone), 1-phenyl-4,4-dimethyl-3-pyrazolidone, and 1-phenyl-4-methyl-4-hydroxymethyl-. 3-Pyrazoridones such as 3-pyrazolidone; polyhydroxybenzenes such as hydroquinone, catechol, pyrogallol, methylhydroquinone, and chlorhydroquinone; paramethylaminophenol, paraaminophenol, parahydroxyphenylglycine, and paraphenylenediamine. Be done.
Among them, 3-pyrazolidones are preferable, and 1-phenyl-3-pyrazolidone is more preferable as the antioxidant from the viewpoint of storage stability and curability.

When the photosensitive resin layer contains an antioxidant, the content of the antioxidant is preferably 0.001% by mass or more, more preferably 0.005% by mass or more, based on the total mass of the photosensitive resin layer. 0.01% by mass or more is more preferable. The upper limit is not particularly limited, but is preferably 1% by mass or less.

(Thickness of photosensitive resin layer)
The thickness (layer thickness) of the photosensitive resin layer is not particularly limited, but from the viewpoint of developability and resolvability, it is preferably 30 μm or less, more preferably 20 μm or less, further preferably 15 μm or less, and particularly preferably 10 μm or less. Most preferably 5.0 μm or less. As the lower limit, 0.60 μm or more is preferable, and 1.5 μm or more is more preferable, because the strength of the film obtained by curing the photosensitive resin layer is excellent.

(Refractive index of photosensitive resin layer)
The refractive index of the photosensitive resin layer is preferably 1.47 to 1.56, more preferably 1.49 to 1.54.

(Color of photosensitive resin layer)
The photosensitive resin layer is preferably achromatic. Specifically, the total reflection (incident angle 8 °, light source: D-65 (2 ° field)) has ^{an L *} value of 10 to 90 in the ^{CIE1976 (L *} , a ^* , b ^* ) color space. The a ^* value is preferably −1.0 to 1.0, and the b ^* value is preferably −1.0 to 1.0.

The pattern (cured film of the photosensitive resin layer) obtained by curing the photosensitive resin layer is preferably achromatic.
Specifically, the total reflection (incident angle 8 °, light source: D-65 (2 ° field)) has ^{a pattern L *} value of 10 to 90 in the ^{CIE1976 (L *} , a ^* , b ^* ) color space. ^{The a *} value of the pattern is preferably −1.0 to 1.0, and the b ^* value of the pattern is preferably −1.0 to 1.0.

(Humidity permeability of photosensitive resin layer)
Moisture permeability in the layer thickness 40μm pattern obtained by curing the photosensitive resin layer (cured film of the photosensitive resin layer) is that from the viewpoint of corrosion resistance, it is 500g / (m 2 · ^24hr) or less preferably, more preferably not more than ^{300g / (m 2 · 24hr)} , and more preferably 100g ^/ (m 2 · 24hr) or less.
The moisture permeability is a cured film obtained by curing the photosensitive resin layer by exposing the photosensitive resin layer with an i-ray at an exposure amount of 300 mJ / cm ² and then performing post-baking at 145 ° C. for 30 minutes. Measure with.

[Refractive index adjustment layer]
The photosensitive transfer material preferably has a refractive index adjusting layer.
As the refractive index adjusting layer, a known refractive index adjusting layer can be applied. Examples of the material contained in the refractive index adjusting layer include an alkali-soluble resin, an ethylenically unsaturated compound, a metal salt, and particles.
The method of controlling the refractive index of the refractive index adjusting layer is not particularly limited, and for example, a method of using a resin having a predetermined refractive index alone, a method of using a resin and particles, and a method of using a composite of a metal salt and a resin. There is a method using.

Examples of the alkali-soluble resin and the ethylenically unsaturated compound include the alkali-soluble resin and the ethylenically unsaturated compound described in the above section "Photosensitive resin layer".

Examples of the particles include metal oxide particles and metal particles.
The type of the metal oxide particles is not particularly limited, and examples thereof include known metal oxide particles. The metal in the metal oxide particles also includes metalloids such as B, Si, Ge, As, Sb, and Te.

The average primary particle size of the particles is preferably 1 nm to 200 nm, more preferably 3 nm to 80 nm, for example, from the viewpoint of transparency of the cured film.
The average primary particle size of the particles is calculated by measuring the particle size of 200 arbitrary particles using an electron microscope and arithmetically averaging the measurement results. When the shape of the particle is not spherical, the longest side is the particle diameter.

Specific examples of the metal oxide particles include zirconium oxide particles (ZrO ₂ particles), Nb ₂ O ₅ particles, titanium oxide particles (TiO ₂ particles), silicon dioxide particles (SiO ₂ particles), and a composite thereof. At least one selected from the group consisting of particles is preferred.
Among these, as the metal oxide particles, for example, at least one selected from the group consisting of zirconium oxide particles and titanium oxide particles is more preferable from the viewpoint that the refractive index can be easily adjusted.

Commercially available metal oxide particles include calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT% -F04), calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT% -F74). Calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT% -F75), calcined zirconium oxide particles (manufactured by CIK Nanotech Co., Ltd., product name: ZRPGM15WT% -F76), zirconium oxide particles (Nano Youth OZ-S30M, Nissan) (Made by Chemical Industry Co., Ltd.) and zirconium oxide particles (Nano Youth OZ-S30K, manufactured by Nissan Chemical Industry Co., Ltd.) can be mentioned.

The particles may be used alone or in combination of two or more.
The content of particles in the refractive index adjusting layer is preferably 1% by mass to 95% by mass, more preferably 20% by mass to 90% by mass, and 40% by mass to 85% by mass with respect to the total mass of the refractive index adjusting layer. More preferred.
When titanium oxide is used as the metal oxide particles, the content of the titanium oxide particles is preferably 1% by mass to 95% by mass, more preferably 20% by mass to 90% by mass, based on the total mass of the refractive index adjusting layer. , 40% by mass to 85% by mass is more preferable.

The refractive index of the refractive index adjusting layer is preferably higher than that of the photosensitive resin layer.
The refractive index of the refractive index adjusting layer is preferably 1.50 or more, more preferably 1.55 or more, further preferably 1.60 or more, and particularly preferably 1.65 or more. The upper limit of the refractive index of the refractive index adjusting layer is preferably 2.10 or less, more preferably 1.85 or less, and particularly preferably 1.78 or less.

The thickness of the refractive index adjusting layer is preferably 50 nm to 500 nm, more preferably 55 nm to 110 nm, and even more preferably 60 nm to 100 nm.

The refractive index adjusting layer is formed by using, for example, the refractive index adjusting layer. The composition for forming the refractive index adjusting layer preferably contains various components forming the above-mentioned refractive index adjusting layer and a solvent. In the composition for forming a refractive index adjusting layer, the preferable range of the content of each component with respect to the total solid content of the composition is the same as the preferable range of the content of each component with respect to the total mass of the refractive index adjusting layer described above. be.
The solvent is not particularly limited as long as the components contained in the refractive index adjusting layer can be dissolved or dispersed, and at least one selected from the group consisting of water and a water-miscible organic solvent is preferable, and water or water and water. A mixed solvent with a water-miscible organic solvent is more preferable.
Examples of the water-miscible organic solvent include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol, and glycerin. Alcohols having 1 to 3 carbon atoms are preferable, and methanol or ethanol is more preferable.
The solvent may be used alone or in combination of two or more.
The content of the solvent is preferably 50 parts by mass to 2,500 parts by mass, more preferably 50 parts by mass to 1,900 parts by mass, and 100 parts by mass to 900 parts by mass with respect to 100 parts by mass of the total solid content of the composition. The portion is more preferable.

The method for forming the refractive index adjusting layer is not particularly limited as long as it can form a layer containing the above components, and examples thereof include known coating methods (slit coating, spin coating, curtain coating, inkjet coating, etc.). Be done.

[Relationship between temporary support, photosensitive resin layer and cover film]
It is also preferable that the photosensitive transfer material preferably used as the photosensitive transfer material for the wiring protective film also satisfies the relationship of the temporary support, the photosensitive resin layer and the cover film described above.

<Manufacturing method of resin pattern>
The method for producing a resin pattern according to the present disclosure is not limited as long as it is a method for producing a resin pattern using the photosensitive transfer material according to the present disclosure. The method for producing a resin pattern according to the present disclosure is a step of laminating a photosensitive transfer material and a substrate according to the present disclosure and arranging a photosensitive resin layer on the substrate (hereinafter, referred to as a “bonding step”). (There is), a step of pattern-exposing the photosensitive resin layer (hereinafter, may be referred to as “exposure step”), and a step of developing the photosensitive resin layer to form a resin pattern (hereinafter, “exposed step”). It may be referred to as "development step"), and it is preferable to include in this order. According to the above aspect, there is provided a method for producing a resin pattern using a photosensitive transfer material that suppresses the occurrence of wrinkles in a temporary support in the step of bonding the photosensitive transfer material and the adherend.

The resin pattern manufacturing method according to the present disclosure is preferably performed by a roll-to-roll method. The roll-to-roll method uses a substrate that can be wound and unwound as a substrate, and unwinds the substrate or a structure including the substrate before any of the steps included in the resin pattern manufacturing method (the process of unwinding the substrate or the structure including the substrate). A step (also referred to as “unwinding step”) and a step of winding the substrate or a structure including the substrate (also referred to as a “winding step”) after any of the steps, and at least one of the steps (also referred to as a “winding step”). Preferably, it refers to a method in which all steps or all steps other than the heating step) are carried out while transporting the substrate or the structure including the substrate. The unwinding method in the unwinding step and the winding method in the winding step are not limited, and a known method may be used in the manufacturing method to which the roll-to-roll method is applied.

Hereinafter, each process included in the resin pattern manufacturing method according to the present disclosure will be described.

<< Laminating process >>
In the bonding step, the photosensitive transfer material according to the present disclosure and a substrate are bonded together, and a photosensitive resin layer is arranged on the substrate. The photosensitive resin layer arranged on the substrate is a photosensitive resin layer contained in the photosensitive transfer material. In the bonding step using the photosensitive transfer material having the temporary support and the photosensitive resin layer, the photosensitive resin layer and the temporary support are usually arranged in this order on the substrate.

In the bonding step, the photosensitive resin layer (specifically, the surface of the photosensitive resin layer opposite to the surface facing the temporary support) and the substrate are brought into contact with each other, and the photosensitive transfer material and the substrate are pressure-bonded. It is preferable to let it. According to the above aspect, since the adhesion between the photosensitive resin layer and the substrate is improved, the formed resin pattern can be suitably used as an etching resist. When the conductive layer is provided on the surface of the substrate, it is preferable that the photosensitive resin layer and the conductive layer are brought into contact with each other.

When the photosensitive transfer material has a cover film, the cover film may be removed from the photosensitive transfer material, and then the photosensitive transfer material and the substrate may be bonded together.

In the photosensitive transfer material, a layer other than the cover film (for example, a high refractive index layer and / or a low refractive index layer) is arranged on the surface of the photosensitive resin layer opposite to the surface facing the temporary support. In this case, the photosensitive resin layer and the substrate may be bonded to each other via a layer other than the cover film.

The method of crimping the photosensitive transfer material and the substrate is not limited, and a known transfer method and laminating method can be used. The bonding of the photosensitive transfer material and the substrate is preferably performed by superimposing the photosensitive resin layer and the substrate and applying pressure and heating by means such as a roll. Further, for bonding, a laminator, a vacuum laminator, and an auto-cut laminator capable of further increasing productivity can be used.

[substrate]
The substrate is not limited, and a known substrate can be used. The substrate is preferably a substrate having a conductive layer, and more preferably a substrate having a base material and a conductive layer on a part or the entire surface of the base material. The substrate may have any layer other than the conductive layer, if necessary.

Examples of the base material include glass, silicon, and film.

The base material is preferably transparent. In the present disclosure, "transparent" means that the transmittance of light having a wavelength of 400 to 700 nm is 80% or more.

The refractive index of the base material is preferably 1.50 to 1.52.

Examples of the transparent glass base material include tempered glass represented by Corning's gorilla glass. Further, as the transparent glass base material, for example, the materials used in JP-A-2010-86684, JP-A-2010-152809, and JP-A-2010-257492 can be used.

When a film base material is used as the base material, it is preferable to use a film base material having low optical distortion and / or high transparency. Examples of the film substrate as described above include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer.

The base material constituting the substrate used in the roll-to-roll method is preferably a film base material. Further, when the circuit wiring for the touch panel is manufactured by the roll-to-roll method, the base material is preferably a sheet-like resin composition.

Examples of the conductive layer include a conductive layer used for general circuit wiring or touch panel wiring. The conductive layer may be at least one selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer from the viewpoint of conductivity and fine wire forming property. A metal layer is more preferable, and a copper layer or a silver layer is particularly preferable.

The substrate may have one layer alone or two or more conductive layers. A substrate having two or more conductive layers preferably has a plurality of conductive layers made of different materials.

Examples of the material of the conductive layer include metals and conductive metal oxides. Examples of the metal include Al, Zn, Cu, Fe, Ni, Cr, Mo, Ag, and Au. Examples of the conductive metal oxide include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and SiO ₂ . In the present disclosure, "conductive" means that the volume resistivity is less than ^{1 × 10 6 Ωcm.} The volume resistivity of the conductive metal oxide is preferably less than ^{1 × 10 4 Ωcm.}

When a resin pattern is produced using a substrate having a plurality of conductive layers, it is preferable that at least one of the plurality of conductive layers contains a conductive metal oxide.

As the conductive layer, an electrode pattern corresponding to the sensor of the visual recognition part used in the capacitive touch panel or wiring of the peripheral extraction part is preferable.

Preferred embodiments of the conductive layer are described, for example, in paragraph 0141 of WO 2018/155193, the contents of which are incorporated herein by reference.

As the substrate having a conductive layer, a substrate having at least one of a transparent electrode and a routing wire is preferable. The above-mentioned substrate can be suitably used as a touch panel substrate.
The transparent electrode can function suitably as a touch panel electrode. The transparent electrode is preferably composed of a metal oxide film such as ITO (indium tin oxide) and IZO (indium zinc oxide), a metal mesh, and a fine metal wire such as a metal nanowire.
Examples of the thin metal wire include thin wires such as silver and copper. Of these, silver conductive materials such as silver mesh and silver nanowires are preferable.

Metal is preferable as the material of the routing wiring.
Examples of the metal that is the material of the routing wiring include gold, silver, copper, molybdenum, aluminum, titanium, chromium, zinc, and manganese, and alloys composed of two or more of these metal elements. As the material of the routing wiring, copper, molybdenum, aluminum, or titanium is preferable, and copper is particularly preferable.

<< Exposure process >>
In the exposure step, the photosensitive resin layer is pattern-exposed.

The detailed arrangement and specific size of the pattern in the pattern exposure are not limited. For example, at least a part of the pattern (preferably the electrode pattern of the touch panel and / / Alternatively, the take-out wiring portion) preferably includes a thin wire having a width of 20 μm or less, and more preferably contains a thin wire having a width of 10 μm or less.

The light source used for exposure may be a light source that irradiates the photosensitive resin layer with light having a wavelength that allows exposure (for example, 365 nm or 405 nm). Specific examples of the light source include an ultra-high pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, and an LED (Light Emitting Diode).

The exposure amount is ^{preferably 5 mJ / cm 2} to 200 mJ / cm ² , and more preferably 10 mJ / cm ² to 100 mJ / cm ² .

In the exposure step, the temporary support may be peeled off from the photosensitive resin layer and then pattern-exposed, or the temporary support may be peeled off after pattern-exposure through the temporary support. When the temporary support is peeled off before the exposure, the mask may be exposed in contact with the photosensitive resin layer, or the mask may be exposed in close proximity without being in contact with the photosensitive resin layer. When the temporary support is exposed without being peeled off, the mask may be exposed in contact with the temporary support, or the mask may be exposed in close proximity without contacting the photosensitive resin layer. In order to prevent mask contamination due to contact between the photosensitive resin layer and the mask and to avoid the influence of foreign matter adhering to the mask on the exposure, it is preferable to perform pattern exposure without peeling off the temporary support. As the exposure method, a contact exposure method is used for contact exposure, a proximity exposure method is used for non-contact exposure method, a lens-based or mirror-based projection exposure method, and a direct exposure method using an exposure laser or the like are used. It can be appropriately selected and used. In the case of projection exposure of a lens-based mirror, an exposure machine having an appropriate numerical aperture (NA) of the lens can be used depending on the required resolution and depth of focus. In the case of the direct exposure method, drawing may be performed directly on the photosensitive resin layer, or reduced projection exposure may be performed on the photosensitive resin layer via a lens. Further, the exposure may be performed not only in the atmosphere but also under reduced pressure or vacuum. A liquid such as water may be interposed between the light source and the photosensitive resin layer for exposure.

<< Development process >>
In the developing process, the photosensitive resin layer is developed to form a resin pattern.

The photosensitive resin layer can be developed using a developing solution. The type of developer is not limited as long as the image portion (exposed portion) or non-image portion (non-exposed portion) of the photosensitive resin layer can be removed. As the developing solution, a known developing solution (for example, the developing solution described in JP-A-5-72724) can be used.

The developer is preferably an alkaline aqueous solution-based developer containing a compound having a pKa of 7 to 13 at a concentration of 0.05 mol / L to 5 mol / L. The developer may contain a water-soluble organic solvent and / or a surfactant. As the developing solution, the developing solution described in paragraph 0194 of International Publication No. 2015/093271 is also preferable.

The development method is not particularly limited, and may be any of paddle development, shower development, shower and spin development, and dip development. Shower development is a development process in which an exposed portion or a non-exposed portion is removed by spraying a developing solution onto the photosensitive resin layer after exposure by a shower.

After the developing step, it is preferable to spray the cleaning agent with a shower and rub with a brush to remove the developing residue.

The temperature of the developer is not limited. The liquid temperature of the developing solution is preferably 20 ° C. to 40 ° C.

For example, when the photosensitive transfer material contains a thermoplastic resin and an intermediate layer, in the developing process, the thermoplastic resin, together with the image portion (exposed portion) or the non-image portion (non-exposed portion) of the photosensitive resin layer, And the intermediate layer is also removed. Further, in the developing step, the thermoplastic resin layer and the intermediate layer may be removed by dissolution or dispersion in a developing solution.

The resin pattern manufacturing method according to the present disclosure may include any step other than the above steps. Examples of the steps other than the above steps include the steps described in the following "other steps".

<Manufacturing method of circuit wiring>
The method for manufacturing the circuit wiring according to the present disclosure is not limited as long as it is the method for manufacturing the circuit wiring using the photosensitive transfer material according to the present disclosure. The method for manufacturing a circuit wiring according to the present disclosure includes a step of preparing a laminate having a base material, a conductive layer, and a resin pattern formed by using the photosensitive transfer material according to the present disclosure in this order. In the laminated body, it is preferable to include a step of etching the conductive layer in a region where the resin pattern is not arranged to form a circuit wiring (hereinafter, may be referred to as an “etching step”). .. The laminate can be produced, for example, by the method for producing a resin pattern described in the section "Method for producing a resin pattern". The method for manufacturing a circuit wiring according to the present disclosure is a step of bonding a photosensitive transfer material according to the present disclosure and a substrate having a conductive layer and arranging a photosensitive resin layer on the substrate (hereinafter, "bonding"). A step of pattern-exposing the photosensitive resin layer (hereinafter, may be referred to as an “exposure step”) and a step of developing the photosensitive resin layer to form a resin pattern. (Hereinafter, it may be referred to as a “development step”) and a step of etching the conductive layer in the region where the resin pattern is not arranged to form a circuit wiring are more preferably included in this order. .. According to the above aspect, there is provided a method for manufacturing a circuit wiring using a photosensitive transfer material that suppresses the occurrence of wrinkles in a temporary support in the step of bonding the photosensitive transfer material and the adherend.

The circuit wiring manufacturing method according to the present disclosure is preferably performed by a roll-to-roll method. The roll-to-roll method is as described in the section “Method for manufacturing resin pattern” above.

<< Laminating process >>
The bonding step in the circuit wiring manufacturing method according to the present disclosure is the same as the bonding step described in the above section "Manufacturing method of resin pattern" except that a substrate having a conductive layer is used as the substrate. The preferred embodiment of the bonding step in the circuit wiring manufacturing method according to the present disclosure is the same as the preferred mode of the bonding step described in the above section “Resin pattern manufacturing method”.

<< Exposure process >>
The exposure step in the circuit wiring manufacturing method according to the present disclosure is the same as the exposure step described in the above-mentioned "Resin pattern manufacturing method" section. The preferred embodiment of the exposure step in the method for manufacturing the circuit wiring according to the present disclosure is the same as the preferred embodiment of the exposure step described in the above section “Method for manufacturing the resin pattern”.

<< Development process >>
The developing process in the circuit wiring manufacturing method according to the present disclosure is the same as the developing step described in the above-mentioned "Resin pattern manufacturing method" section. The preferred embodiment of the developing step in the method for manufacturing the circuit wiring according to the present disclosure is the same as the preferred embodiment of the developing step described in the above section "Method for manufacturing the resin pattern".

<< Etching process >>
In the etching step, the conductive layer in the region where the resin pattern is not arranged is etched to form the circuit wiring. The "conductive layer in the region where the resin pattern is not arranged" means a conductive layer that is not covered by the resin pattern (that is, an exposed conductive layer).

In the etching process, the conductive layer is etched by using the resin pattern as an etching resist. As a method of etching treatment, a known method can be applied. Examples of the etching treatment method include the methods described in paragraphs 0209 to 0210 of JP-A-2017-120435, the methods described in paragraphs 0048 to paragraph 0054 of JP-A-2010-152155, and immersion in an etching solution. Examples include a wet etching method and a dry etching (for example, plasma etching) method.

As the etching solution used in the wet etching method, an acidic or alkaline etching solution may be appropriately selected according to the etching target.

Examples of the acidic etching solution include an aqueous solution of an acidic component alone selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, acetic acid, hydrofluoric acid, oxalic acid, and phosphoric acid, an acidic component, and ferric chloride. Examples thereof include a mixed aqueous solution with a salt selected from the group consisting of ammonium fluoride and potassium permanganate. The acidic component may be a component in which a plurality of acidic components are combined.

Examples of the alkaline etching solution include an aqueous solution of an alkaline component alone selected from the group consisting of sodium hydroxide, potassium hydroxide, ammonia, organic amines, and salts of organic amines (for example, tetramethylammonium hydroxide). , A mixed aqueous solution of an alkaline component and a salt (for example, potassium permanganate). The alkaline component may be a component in which a plurality of alkaline components are combined.

<< Removal process >>
The circuit wiring manufacturing method according to the present disclosure preferably includes a step of removing the remaining resin pattern (hereinafter, may be referred to as a "removal step"). The removal step is preferably performed after the etching step.

Examples of the method for removing the remaining resin pattern include a method for removing the remaining resin pattern by chemical treatment. The method for removing the remaining resin pattern is preferably a method for removing the remaining resin pattern using a removing liquid. As a method of using the removing liquid, for example, a substrate having a residual resin pattern is added to the removing liquid during stirring at a liquid temperature of preferably 30 ° C. to 80 ° C., more preferably 50 ° C. to 80 ° C. for 1 minute to 30 ° C. A method of immersing for a minute can be mentioned.

Examples of the removing liquid include a removing liquid in which an inorganic alkaline component or an organic alkaline component is dissolved in water, dimethyl sulfoxide, N-methylpyrrolidone, or a mixed solution thereof. Examples of the inorganic alkaline component include sodium hydroxide and potassium hydroxide. Examples of the organic alkali component include a primary amine compound, a secondary amine compound, a tertiary amine compound, and a quaternary ammonium salt compound.

The method of removing the remaining resin pattern using the removing liquid is not limited to the dipping method, and may be a known method other than the dipping method (for example, a spray method, a shower method, and a paddle method).

<< Other processes >>
The circuit wiring manufacturing method according to the present disclosure may include an arbitrary process (hereinafter, may be referred to as “another process”) other than the above-mentioned process. Examples of the exposure step, the developing step, and other steps applicable to the method for manufacturing the circuit wiring according to the present disclosure include the steps described in paragraphs 0035 to 0051 of JP-A-2006-23696. In addition, examples of other steps include the steps shown below. However, the other steps are not limited to the steps shown below.

[Step to reduce visible light reflectance]
The method for manufacturing a circuit wiring according to the present disclosure may include a step of reducing the reflectance of a part or all of the conductive layer on the substrate.

Examples of the treatment for reducing the visible light reflectance of the conductive layer include an oxidation treatment. When the conductive layer contains copper, the visible light reflectance of the conductive layer can be lowered by converting copper into copper oxide by an oxidation treatment and blackening the conductive layer.

For the treatment of reducing the visible light reflectance of the conductive layer, refer to paragraphs 0017 to 0025 of JP-A-2014-150118 and paragraphs 0041, 0042, 0048, and 0058 of JP-A-2013-206315. Have been described. The contents of these gazettes are incorporated herein by reference.

[Step of forming an insulating film and step of forming a new conductive layer on the surface of the insulating film]
The method for manufacturing a circuit wiring according to the present disclosure preferably includes a step of forming an insulating film on the surface of the circuit wiring and a step of forming a new conductive layer on the surface of the insulating film. By the above steps, two electrode patterns insulated via an insulating film can be formed.

The method of forming the insulating film is not limited. In the step of forming the insulating film, for example, the insulating film may be formed by a known method for forming a permanent film. Further, an insulating film having a desired pattern may be formed by photolithography using a photosensitive material having an insulating property.

In the step of forming a new conductive layer on the insulating film, for example, a new conductive layer having a desired pattern may be formed by photolithography using a photosensitive material having conductivity.

In the circuit wiring manufacturing method according to the present disclosure, it is also preferable to use a substrate having conductive layers on both surfaces of the base material, and to form circuits on each of the conductive layers sequentially or simultaneously. According to the above method, for example, a touch panel circuit wiring having a first conductive pattern formed on one surface of the base material and a second conductive pattern formed on the other surface of the base material can be formed. Further, it is also preferable to form the circuit wiring for the touch panel on both sides of the base material by roll-to-roll according to the circuit wiring manufacturing method according to the present disclosure.

<< Applications for circuit wiring >>
The circuit wiring manufactured by the circuit wiring manufacturing method according to the present disclosure can be applied to various devices. Examples of the device provided with the circuit wiring manufactured by the method for manufacturing the circuit wiring according to the present disclosure include an input device, a touch panel is preferable, and a capacitance type touch panel is more preferable. Further, the input device can be applied to various display devices (for example, an organic EL display device and a liquid crystal display device).

<Manufacturing method of touch panel>
The method for manufacturing a touch panel according to the present disclosure is not limited as long as it is a method for manufacturing a touch panel using the photosensitive transfer material according to the present disclosure.

The method for manufacturing a touch panel according to the present disclosure includes a step of preparing a laminate having a base material, a conductive layer, and a resin pattern formed by using the photosensitive transfer material according to the present disclosure in this order, and the above. In the laminated body, it is preferable to include a step of etching the conductive layer in the region where the resin pattern is not arranged to form the wiring for the touch panel. The method for manufacturing a touch panel according to the present disclosure includes a step of bonding the photosensitive transfer material according to the present disclosure and a substrate having a conductive layer and arranging a photosensitive resin layer on the substrate, and the photosensitive resin layer. A step of pattern exposure, a step of developing the photosensitive resin layer to form a resin pattern, and a step of etching the conductive layer in a region where the resin pattern is not arranged to form wiring for a touch panel. And are more preferably included in this order.

The aspects of each step in the touch panel manufacturing method according to the present disclosure are as described in the above-mentioned "resin pattern manufacturing method" and the above-mentioned "circuit wiring manufacturing method", and the preferred embodiments are also the same. be. Regarding the method for manufacturing the touch panel according to the present disclosure, a known method for manufacturing the touch panel may be referred to except that the wiring for the touch panel is formed by the above method. In addition, the touch panel manufacturing method according to the present disclosure may include any process other than the above-mentioned process.

The mask pattern used for manufacturing the touch panel will be described with reference to FIGS. 2 and 3. FIG. 2 is a schematic plan view showing an example of a pattern of a mask for manufacturing a touch panel. FIG. 3 is a schematic plan view showing another example of the pattern of the mask for manufacturing the touch panel. In FIGS. 2 and 3, DL indicates a frame for alignment, and G indicates a non-image portion (light-shielding portion). In FIG. 2, SL indicates a non-image portion (light-shielding portion). In the method for manufacturing a touch panel according to the present disclosure, for example, by exposing the photosensitive resin layer through a mask having the pattern shown in FIG. 2, a circuit wiring having a pattern corresponding to SL and G is formed. Can manufacture touch panels. Specifically, the touch panel can be manufactured by the method shown in FIG. 1 of International Publication No. 2016/190405. In an example of the manufactured touch panel, G is a portion where a transparent electrode (that is, a touch panel electrode) is formed, and SL is a portion where wiring of a peripheral take-out portion is formed.

According to the touch panel manufacturing method according to the present disclosure, a touch panel having at least touch panel wiring is manufactured. The touch panel preferably has a transparent substrate, electrodes, and an insulating layer or a protective layer.

Examples of the detection method on the touch panel include a resistance film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method. The detection method is preferably a capacitance method.

The touch panel type includes a so-called in-cell type (for example, the configuration shown in FIGS. 5, 6, 7, and 8 of Japanese Patent Application Laid-Open No. 2012-517501), and a so-called on-cell type (for example, Japanese Patent Application Laid-Open No. 2013-168125). The configuration shown in FIG. 19 and the configurations shown in FIGS. 1 and 5 of JP2012-89102A), OGS (One Glass Solution) type, and TOR (Touch-on-Lens) type (for example, JP-A-2012). The configuration described in FIG. 2 of 2013-54727), various out-cell types (for example, GG, G1 and G2, GFF, GF2, GF1, and G1F), and other configurations (for example, Japanese Patent Application Laid-Open No. 2013-164871). The configuration shown in FIG. 6) can be mentioned.

<Temporary support for photosensitive transfer material>
The temporary support for photosensitive transfer material according to the present disclosure has a rate of change in the contact angle of water of 0% to 10.0% before and after heat treatment at 100 ° C. for 15 minutes. By applying the temporary support for photosensitive transfer material according to the present disclosure to the photosensitive transfer material, the occurrence of wrinkles in the temporary support is suppressed in the step of bonding the photosensitive transfer material and the adherend.

The temporary support for photosensitive transfer material according to the present disclosure has at least one surface in which the rate of change of the contact angle of water is 0% to 10.0% before and after heat treatment at 100 ° C. for 15 minutes. Just do it. When the temporary support for photosensitive transfer material according to the present disclosure is applied to a photosensitive transfer material, the rate of change in the contact angle of water on the surface of the temporary support for photosensitive transfer material is 0% to 10.0%. By arranging a certain surface as a surface opposite to the surface facing the photosensitive resin layer (that is, the second surface), as described in the above section "Photosensitive transfer material", the photosensitive transfer material can be used. It is possible to suppress the occurrence of wrinkles on the temporary support in the step of bonding with the adherend.

In the temporary support for photosensitive transfer material according to the present disclosure, the preferable range of the change rate of the contact angle is the same as the range described in the section of "Photosensitive transfer material". The method for measuring the rate of change of the contact angle is the same as the method described in the section “Photosensitive transfer material”.

In the temporary support for photosensitive transfer material according to the present disclosure, the absolute value of the difference between the haze before heat treatment at 120 ° C. for 5 minutes and the haze after heat treatment at 120 ° C. for 5 minutes is 0% to 0. It is preferably 40%, more preferably 0% to 0.30%, further preferably 0% to 0.20%, and particularly preferably 0% to 0.10%. The method for measuring the haze of the temporary support for the photosensitive transfer material is measured by a method according to the method for measuring the haze of the temporary support described in the above section “Photosensitive transfer material”.

The preferred embodiment of the temporary support for the photosensitive transfer material other than the above items is the same as the preferred embodiment of the temporary support described in the above section "Photosensitive transfer material". As for the aspect of the temporary support for the photosensitive transfer material according to the present disclosure, the aspect of the temporary support described in the above-mentioned "Photosensitive transfer material" section can be referred to.

Hereinafter, the present disclosure will be described in detail by way of examples. However, the present disclosure is not limited to the following examples.

<Synthesis of polymer A-1>
Propylene glycol 1-monomethyl ether (75.0 g) was placed in a three-necked flask, and the liquid temperature was raised to 90 ° C. under a nitrogen atmosphere. A solution containing styrene (52.0 g), methacrylic acid (29.0 g), methyl methacrylate (19.0 g), and propylene glycol 1-monomethyl ether (75.0 g) was maintained at 90 ° C. ± 2 ° C. 3 The solution was added dropwise to the solution in the mouth flask over 2 hours. After completion of the dropping, the mixed solution was stirred at 90 ° C. ± 2 ° C. for 2 hours to obtain a solution containing the polymer A-1 (solid content concentration: 40.0% by mass). The weight average molecular weight (Mw) of the polymer A-1 was 60,000.

<Synthesis of dimethacrylate of polyethylene glycol with an average of 15 mol of ethylene oxide and an average of 2 mol of propylene oxide added to both ends of bisphenol A>
Bisphenol A (22.83 g, 0.1 mol), toluene (30 g) as a solvent, and triethylamine (0.3 g) as a catalyst were added to a pressure-resistant reaction vessel having a content of 500 mL. After replacing the inside of the pressure-resistant reaction vessel with nitrogen gas, the nitrogen gas pressure ^{was adjusted to 0.2 kg / cm 2} , and the temperature of the mixture was raised to 80 ° C. with stirring. The temperature was raised to 150 ° C. while sequentially introducing ethylene oxide (132.15 g, 3.0 mol) and propylene oxide (23.24 g, 0.4 mol) ^{so as to maintain a pressure of about 2 kg / cm 2.} The mixture was held at 150 ° C. for 1 hour and then cooled. The mixture was neutralized with oxalic acid, then ion-exchanged water (50 g) was added to the mixture and stirred, and then the mixture was allowed to stand to extract the separated organic layer. The obtained organic layer was washed three times with ion-exchanged water (50 g), and then the solvent was removed by reducing the pressure to 30 Torr at 50 ° C. to obtain a dihydric alcohol (105.1 g). In a three-necked flask having a content of 1 L, divalent alcohol (100.0 g, 0.044 mol), methacrylic acid (11.5 g), 70 mass% methanesulfonic acid aqueous solution (0.9 g), hydroquinone (0. 2 g) and toluene (200 mL) were added, followed by esterification under reflux with toluene for 8 hours. The water produced during the reaction was removed by a Dean Stark trap. After completion of the reaction, the temperature of the mixture was cooled to room temperature, and the obtained organic layer was washed once with 5% aqueous sodium hydroxide solution (50 g) and then three times with ion-exchanged water (50 g). .. Hydroquinone monomethyl ether (0.09 g) was added to the organic layer, and the solvent was removed by reducing the pressure to 30 Torr at 50 ° C. to remove an average of 15 mol of ethylene oxide and an average of 2 mol of propylene oxide at both ends of bisphenol A. Dimethacrylate (90.0 g) of polyethylene glycol added with the above was obtained.

<Manufacturing of temporary support 1>
According to the following method, a coating liquid for forming a coating layer was applied to one side of a polyester film used as a base material, and then stretched to obtain a temporary support 1.

[Preparation of coating liquid for coating layer formation]
By mixing the components shown below, a coating liquid for forming a coating layer was obtained. The obtained coating liquid was filtered using a filter having a pore size of 2.5 μm (250PG, 3M Japan Ltd.) and then degassed (SEPAREL EF-G5, DIC Corporation).
-Acrylic polymer (AS-563A, Daicel FineChem Co., Ltd., solid content: 27.5% by mass): 125.3 parts by mass-Nonion-based surfactant (Naroacty CL95, manufactured by Sanyo Kasei Kogyo Co., Ltd., solid content: 100) Mass%): 0.7 parts by mass ・ Anionic surfactant (Lapisol A-90, Chukyo Yushi Co., Ltd., aqueous diluted solution having a solid content of 1% by mass): 111.4 parts by mass ・ Carnauba wax dispersion (cellozole) 524, Chukyo Yushi Co., Ltd., solid content: 30% by mass): 26.5 parts by mass ・ Carbodiimide compound (Carbodilite V-02-L2, Nisshinbo Chemical Co., Ltd., water-diluted liquid having a solid content of 10% by mass): 15. 7 parts by mass ・ Matte agent (Snowtex XL, Nissan Chemical Co., Ltd., solid content: 40.5% by mass): 2.8 parts by mass ・ Water: 739 parts by mass

[Extrusion molding]
Pellets of polyethylene terephthalate synthesized by using the titanium compound described in Japanese Patent No. 5575671 as a polymerization catalyst were dried until the water content became 50 ppm or less. After drying, the pellets were put into a hopper of a twin-screw kneading extruder having a diameter of 30 mm and melted at 280 ° C. The melt was passed through a filter (pore diameter: 2 μm) and then extruded from a die onto a cooling roll at 25 ° C. to obtain an unstretched film. The melt extruded from the die was brought into close contact with the cooling roll using an electrostatic application method.

[Stretching and coating]
The unstretched film was sequentially biaxially stretched by the following method.

(A) Longitudinal stretching An unstretched film was passed between two pairs of nip rolls having different peripheral speeds and stretched in the longitudinal direction (conveying direction). Specifically, the unstretched film was stretched under the conditions that the preheating temperature was 77 ° C., the stretching temperature was 110 ° C., the stretching ratio was 3.4 times, and the stretching speed was 1,300% / sec.

(B) Coating A coating liquid for forming a coating layer was applied on a vertically stretched film with a bar coater. The coating amount of the coating liquid for forming the coating layer was 5.6 g / m ² .

(C) Transverse stretching A film coated with a coating liquid for forming a coating layer was laterally stretched under the following conditions using a tenter.

-Conditions for lateral stretching-
Preheating temperature: 110 ° C
Stretching temperature: 120 ° C
Stretching ratio: 4.2 times Stretching speed: 50% / sec

[Heat fixation and heat relaxation]
The laterally stretched film was heat-fixed under the following conditions. After heat fixing, the tenter width was reduced and the heat was relaxed under the following conditions.

-Thermal process conditions-
Heat fixation temperature: 226 ° C
Heat fixing time: 5 seconds

-Heat relaxation conditions-
Heat relaxation temperature: 214 ° C
Heat relaxation rate: 4%

[Take-up]
After heat relaxation, both ends of the film were trimmed, and then both ends of the film were extruded (ie, knurled) to a width of 10 mm and then wound up at a tension of 40 kg / m. The width of the obtained film roll was 1.5 m. The winding length of the obtained film roll was 6,300 m. The obtained film roll was used as a temporary support (temporary support 1) of Example 1. The temporary support 1 has a base material (polyester film) having a thickness of 16 μm and a coating layer having a thickness of 40 nm. The content of carnauba wax was 0.008% by mass with respect to the total mass of the temporary support 1. The heat shrinkage rate of the base material of the temporary support by heating at 150 ° C. for 30 minutes was 1.4% in MD (machine direction) and 0.8% in TD (Transverse Direction).

<Manufacturing of temporary support 2>
The temporary support 2 was manufactured by the same procedure as that of the temporary support 1 except that the amount of the carnauba wax dispersion added was changed to 10.6 parts by mass. The content of carnauba wax in the temporary support 2 was 0.003% by mass.

<Manufacturing of temporary support 3>
The temporary support 3 was manufactured by the same procedure as that of the temporary support 1 except that the amount of the carnauba wax dispersion added was changed to 5.3 parts by mass. The content of carnauba wax in the temporary support 3 was 0.002% by mass.

<Manufacturing of temporary support 4>
The temporary support 4 was manufactured by the same procedure as that of the temporary support 1 except that the amount of the carnauba wax dispersion added was changed to 2.7 parts by mass. The content of carnauba wax in the temporary support 4 was 0.001% by mass.

<Manufacturing of temporary support 5>
The temporary support 5 was manufactured by the same procedure as that of the temporary support 1 except that the amount of the carnauba wax dispersion added was changed to 53.0 parts by mass. The content of carnauba wax in the temporary support 5 was 0.016% by mass.

<Manufacturing of temporary support 6>
The temporary support 6 was manufactured by the same procedure as that of the temporary support 1 except that the carnauba wax dispersion was not added.

<Preparation of photosensitive resin composition>
After mixing the components shown in Table 1, a photosensitive resin is added by adding a mixed solvent of methyl ethyl ketone, 1-methoxy-2-propanol, and propylene glycol monomethyl ether acetate (50/25/25, unit: mass%). A composition (solid content concentration: 25% by mass) was prepared.

In Table 1, "B-CIM" represents 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetraphenyl-1,2'-biimidazole.

<Example 1>
A photosensitive resin composition was applied to the surface of the base material (polyester film) of the temporary support 1 using a slit-shaped nozzle so that the thickness after drying was 6 μm. A photosensitive resin layer was formed by drying the formed coating film of the photosensitive resin composition at 95 ° C. for 100 seconds. A photosensitive transfer material was prepared by pressure-bonding a polyethylene film (Tamapoli Co., Ltd., GF-818, thickness: 19 μm) as a cover film on the surface of the formed photosensitive resin layer. By winding up the obtained photosensitive transfer material, a roll-shaped photosensitive transfer material was produced.

<Examples 2 to 8 and Comparative Example 1>
A photosensitive transfer material was prepared by the same procedure as that of the photosensitive transfer material of Example 1 except that the type of the temporary support and the thickness of the photosensitive resin layer were appropriately changed according to the description in Table 2.

<Evaluation>
[Wrinkles in the bonding process]
A PET substrate with a copper layer was produced by forming a copper layer having a thickness of 200 nm on a polyethylene terephthalate (PET) film having a thickness of 100 μm by sputtering. A vacuum laminator (MCK Co., Ltd., roll temperature: 120 ° C., linear pressure: 1.0 MPa, linear velocity) of the photosensitive transfer material sent out from the roll-type photosensitive transfer material and the PET substrate with a copper layer by a roll-to-roll method. : 0.5 m / min) was used for bonding. The layer structure of the obtained laminate is a PET film / copper layer / photosensitive resin layer / temporary support. The temporary support after the photosensitive transfer material and the PET substrate with the copper layer were bonded to each other was visually observed and evaluated for the occurrence of wrinkles according to the following criteria. Of the following criteria, A, B, or C will be accepted. The evaluation results are shown in Table 2.
A: No wrinkles are seen B: Several weak wrinkles with a width of several hundred μm can be visually recognized per 10 cm width.
C: 10 or more weak wrinkles with a width of several hundred μm can be visually recognized per 10 cm width.
D: Strong wrinkles with a width of 1 mm or more can be visually recognized.

The properties and average thickness described in the "Temporary support" column in Table 2 were measured by the method described above. The "heat treatment" in the "water contact angle before heat treatment" and the "water contact angle after heat treatment" shown in Table 2 is defined as "heat treatment" at 100 ° C. for 15 minutes as described in the section of "temporary support" above. Refers to heat treatment. The “heat treatment” in the “haze before heat treatment” and the “haze after heat treatment” described in Table 2 refers to the heat treatment at 120 ° C. for 5 minutes described in the above section “Temporary support”. .. In Table 2, the average thickness of the photosensitive resin layer was measured by the method described above.

Table 2 shows that the occurrence of wrinkles on the temporary support was suppressed in Examples 1 to 8 as compared with Comparative Example 1.

<Formation of circuit wiring>
Using each of the photosensitive transfer materials of Examples 1 to 8, a circuit wiring was formed by the following procedure.

(laminate)
The cover film of the photosensitive transfer material is peeled off on a copper substrate on which copper is sputtered on a PET film to form a copper layer having a thickness of 200 μm, and the peeled surface of the photosensitive transfer material is brought into contact with the copper substrate. A laminate was obtained by laminating with.
-Laminating conditions-
Copper substrate temperature: 40 ° C
Rubber roller temperature: 110 ° C
Linear pressure: 3N / cm
Transport speed: 2 m / min

(exposure)
Next, an exposure mask having a plurality of width lines and spaces is vacuum-adhered to a temporary support on the side where the photosensitive transfer material of the laminate is laminated, and a proximity type exposure having an ultrahigh pressure mercury lamp is passed through the exposure mask. Using a machine (manufactured by Hitachi Electronic Engineering Co., Ltd.), exposure was performed with an exposure amount such that the width of the uppermost portion of the resist pattern on the side opposite to the substrate side was the same as the width of the exposed portion of the mask.

(developing)
Then, the temporary support was peeled off from the exposed laminate and developed with a 1.0 mass% sodium carbonate aqueous solution under development conditions of 26 ° C. for 30 seconds. Then, using pure water, the development treatment was carried out at 26 ° C. for a time 1.5 times the dissolution time. Next, air was blown onto the surface to remove water, and a substrate having a resin pattern was produced. A shower-type developing machine was used for the developing treatment and the cleaning treatment, and the spray pressure was 0.08 MPa.

(Etching and peeling)
A copper layer was shower-etched on a substrate having a resin pattern for 60 seconds with a copper etching solution (Cu-02, manufactured by Kanto Chemical Co., Inc.) at 25 ° C. Then, the resin pattern was removed by shower peeling for 2 minutes using a stripping solution at 60 ° C. (KP-301 manufactured by Kanto Chemical Co., Inc.) to obtain circuit wiring.

The circuit wiring obtained by using each of the photosensitive transfer materials of Examples 1 to 8 was observed with an optical microscope, and it was confirmed that no chipping was observed in the wiring.

<Preparation of photosensitive resin composition>
Photosensitive resin compositions A-1 to A-10 having the compositions shown in the table below were prepared, respectively.

(Compound B)
The structure of compound B is shown below.

(Compound C)
The structure of compound C is shown below.

(Preparation of P-1 solution)
As the P-1 solution, a solid content 36.3% by mass solution (solvent: propylene glycol monomethyl ether acetate) of the polymer P-1 having the following structure was used. Polymer P-1 is an alkali-soluble resin. In the polymer P-1, the numerical value at the lower right of each structural unit indicates the content ratio (mol%) of each structural unit. The P-1 solution was prepared by the polymerization step and the addition step shown below.

-Polymerization process-
Propylene glycol monomethyl ether acetate (manufactured by Sanwa Chemical Industry Co., Ltd., trade name PGM-Ac) (60 g) and propylene glycol monomethyl ether (manufactured by Sanwa Chemical Industry Co., Ltd., trade name PGM) (240 g) are placed in a 2000 mL flask. Introduced. The obtained liquid was heated to 90 ° C. while stirring at a stirring speed of 250 rpm (round per minute; the same applies hereinafter).
As the preparation of the dropping solution (1), methacrylic acid (manufactured by Mitsubishi Rayon Co., Ltd., trade name Acryester M) (107.1 g), methyl methacrylate (manufactured by Mitsubishi Gas Chemical Company, Inc., trade name MMA) (5.46 g) , And cyclohexyl methacrylate (manufactured by Mitsubishi Gas Chemical Company, Inc., trade name CHMA) (231.42 g) were mixed and diluted with PGM-Ac (60 g) to obtain a dropping solution (1).
To prepare the dropping solution (2), dimethyl 2,2'-azobis (2-methylpropionate) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., trade name V-601) (9.637 g) was added to PGM-Ac (9,637 g). The dropping liquid (2) was obtained by dissolving with 136.56 g).
The dropping liquid (1) and the dropping liquid (2) were simultaneously added dropwise to the above-mentioned 2000 mL flask (specifically, a 2000 mL flask containing a liquid heated to 90 ° C.) over 3 hours.
Next, the container of the dropping liquid (1) was washed with PGM-Ac (12 g), and the washing liquid was dropped into the above 2000 mL flask. Next, the container of the dropping liquid (2) was washed with PGM-Ac (6 g), and the washing liquid was dropped into the above 2000 mL flask. During these droppings, the reaction solution in the 2000 mL flask was kept at 90 ° C. and stirred at a stirring speed of 250 rpm. Further, as a post-reaction, the mixture was stirred at 90 ° C. for 1 hour.
V-601 (2.401 g) was added to the reaction solution after the post-reaction as the first additional addition of the initiator. Further, the container of V-601 was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction liquid. Then, the mixture was stirred at 90 ° C. for 1 hour.
Next, V-601 (2.401 g) was added to the reaction solution as the second additional addition of the initiator. Further, the container of V-601 was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction liquid. Then, the mixture was stirred at 90 ° C. for 1 hour.
Next, V-601 (2.401 g) was added to the reaction solution as the third additional addition of the initiator. Further, the container of V-601 was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction liquid. Then, the mixture was stirred at 90 ° C. for 3 hours.

-Additional process-
After stirring at 90 ° C. for 3 hours, PGM-Ac (178.66 g) was introduced into the reaction solution. Next, tetraethylammonium bromide (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) (1.8 g) and hydroquinone monomethyl ether (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) (0.8 g) were added to the reaction solution. Further, each container was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction liquid. Then, the temperature of the reaction solution was raised to 100 ° C.
Next, glycidyl methacrylate (manufactured by NOF CORPORATION, trade name Blemmer G) (76.03 g) was added dropwise to the reaction solution over 1 hour. The container of Blemmer G was washed with PGM-Ac (6 g), and the washing liquid was introduced into the reaction liquid. Then, as an addition reaction, the mixture was stirred at 100 ° C. for 6 hours.
Next, the reaction solution was cooled and filtered through a mesh filter (100 mesh) for removing dust to obtain a solution (1158 g) of the polymer P-1 (solid content concentration: 36.3% by mass). The obtained polymer P-1 had a weight average molecular weight of 27,000, a number average molecular weight of 15,000, and an acid value of 95 mgKOH / g. The structure of the polymer P-1 is shown below. The molar ratio of the repeating units in the formula was 51.5: 2: 26.5: 20 in order from the repeating unit on the left side.

(Preparation of P-2 solution)
A solution having a solid content of 36.5% by mass of the polymer P-2 was prepared as a P-2 solution according to the following method. The polymer P-2 is an alkali-soluble resin. 82.4 g of propylene glycol monomethyl ether was placed in a flask and heated to 90 ° C. under a nitrogen stream. A solution in which 38.4 g of styrene, 30.1 g of dicyclopentanyl methacrylate and 34.0 g of methacrylic acid are dissolved in 20 g of propylene glycol monomethyl ether in this solution, and a polymerization initiator V-601 (Fujifilm Wako Pure Chemical Industries, Ltd.) A solution prepared by dissolving 5.4 g in 43.6 g of propylene glycol monomethyl ether acetate was simultaneously added dropwise over 3 hours. After completion of the dropping, 0.75 g of V-601 was added three times every hour. After that, it was reacted for another 3 hours. Then, it was diluted with 58.4 g of propylene glycol monomethyl ether acetate and 11.7 g of propylene glycol monomethyl ether. The temperature of the reaction solution was raised to 100 ° C. under an air flow, and 0.53 g of tetraethylammonium bromide and 0.26 g of p-methoxyphenol were added. To this, 25.5 g of glycidyl methacrylate (Blemmer GH manufactured by NOF CORPORATION) was added dropwise over 20 minutes. This was reacted at 100 ° C. for 7 hours to obtain a solution of the polymer P-2. The solid content concentration of the obtained solution was 36.5% by mass. Regarding the polymer P-2, the weight average molecular weight in terms of standard polystyrene in GPC was 17,000, the dispersity was 2.4, and the acid value was 95 mgKOH / g. The amount of residual monomer measured by gas chromatography was less than 0.1% by mass with respect to the solid content of the polymer P-2 in all the monomers. The structure of the polymer P-2 is shown below. The molar ratio of the repeating units in the formula was 41.0: 15.2: 23.9: 19.9 in order from the repeating unit on the left side.

(Preparation of P-3 solution)
A 36.2% by mass solid content solution of the polymer P-3 was prepared as a P-3 solution according to the following method. The polymer P-3 is an alkali-soluble resin. 113.5 g of propylene glycol monomethyl ether was placed in a flask and heated to 90 ° C. under a nitrogen stream. A solution in which 172 g of styrene, 4.7 g of methyl methacrylate, and 112.1 g of methacrylic acid were dissolved in 30 g of propylene glycol monomethyl ether in this solution, and a polymerization initiator V-601 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) 27. A solution prepared by dissolving 6 g in 57.7 g of propylene glycol monomethyl ether was simultaneously added dropwise over 3 hours. After completion of the dropping, 2.5 g of V-601 was added three times every hour. After that, it was reacted for another 3 hours. Then, it was diluted with 160.7 g of propylene glycol monomethyl ether acetate and 233.3 g of propylene glycol monomethyl ether. The temperature of the reaction solution was raised to 100 ° C. under an air flow, and 1.8 g of tetraethylammonium bromide and 0.86 g of p-methoxyphenol were added. 71.9 g of glycidyl methacrylate (Blemmer G manufactured by NOF CORPORATION) was added dropwise thereto over 20 minutes. This was reacted at 100 ° C. for 7 hours to obtain a solution of the polymer P-3. The solid content concentration of the obtained solution was 36.2%. Regarding the polymer P-3, the weight average molecular weight in terms of standard polystyrene in GPC was 18,000, the dispersity was 2.3, and the acid value was 124 mgKOH / g. The amount of residual monomer measured by gas chromatography was less than 0.1% by mass with respect to the solid content of the polymer P-3 in all the monomers. The structure of the polymer P-3 is shown below. The molar ratio of the repeating units in the formula was 55.1: 26.5: 1.6: 16.8 in order from the repeating unit on the left side.

(Preparation of P-4 solution)
In the synthesis of the polymer P-3, by changing the type and amount of the monomer, a solid content 36.2% by mass solution (solvent: propylene glycol monomethyl ether acetate) of the polymer P-4 was used as the P-4 solution. Got ready. The polymer P-4 is an alkali-soluble resin. The obtained polymer P-4 had a weight average molecular weight of 18,000, a dispersity of 2.3, and an acid value of 124 mgKOH / g. The structure of the polymer P-4 is shown below. Hereinafter, the molar ratio of the repeating unit in the formula was 55.1: 24.6: 1.6: 17.0: 1.7 in order from the repeating unit on the left side.

<Preparation of composition for forming refractive index adjusting layer>
Next, compositions B-1 to B-4 for forming a refractive index adjusting layer having the compositions shown in the following table were prepared. The numerical values in the table below represent "parts by mass".

(Polymer A)
Polymer A in the above table was synthesized as follows.
1-Methylenepropanol (manufactured by Tokyo Chemical Industry Co., Ltd.) (270.0 g) was introduced into a 1 L three-necked flask, and the temperature was raised to 70 ° C. under a nitrogen stream while stirring. On the other hand, allyl methacrylate (45.6 g) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) and methacrylic acid (14.4 g) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) are 1-methoxypropanol (Tokyo Chemical Industry Co., Ltd.). (Manufactured by) (270.0 g), and then 3.94 g of V-65 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) to prepare a dropping solution, and put it in a flask over 2.5 hours. Was dropped. The reaction was carried out while maintaining the stirred state for 2.0 hours as it was.
Then, the temperature was returned to room temperature, the mixture was added dropwise to ion-exchanged water (2.7 L) in a stirred state, and reprecipitation was carried out to obtain a turbid solution. Filtration was carried out by introducing a turbid solution in Nutche with a filter paper, and the filtered material was further washed with ion-exchanged water to obtain a wet powder. It was dried by blowing air at 45 ° C., and it was confirmed that the amount became constant, and polymer A was obtained as a powder in a yield of 70%.
The ratio of methacrylic acid / allyl methacrylate of the obtained polymer A was 76% by mass / 24% by mass. The weight average molecular weight Mw was 38,000.

<Examples 9 to 24>
Using a slit-shaped nozzle on the temporary support 1, the coating amount is adjusted to a coating amount at which the film thickness after drying becomes the thickness shown in the table below, and the photosensitive resin composition described in the table below is obtained. Any one of the substances A-1 to A-10 was applied to form a photosensitive resin layer. After volatilizing the solvent in the drying zone at 100 ° C., use any one of the compositions B-1 to B-4 for forming the refractive index adjusting layer in the combination shown in the table below using a slit-shaped nozzle. The coating amount is adjusted so that the film thickness after drying becomes the film thickness shown in the table below, and the film is applied onto the photosensitive resin layer, and then dried at a drying temperature of 80 ° C. to adjust the refractive index. A layer was formed. A protective film (Lumirror 16KS40, manufactured by Toray Industries, Inc.) was pressure-bonded onto the refractive index adjusting layer to prepare photosensitive transfer materials 1 to 16.

<Evaluation>
[Wrinkles in the bonding process]
The temporary support after the photosensitive transfer material and the PET substrate with the copper layer were bonded to each other was visually observed by the same method as the evaluation method of Example 1 described above, and the occurrence of wrinkles was evaluated. The evaluation results are shown in Table 6.

The photosensitive transfer material according to the present disclosure can be suitably used for various applications requiring precision microfabrication by photolithography. After patterning the photosensitive resin layer, the photosensitive resin layer may be used as a coating for etching, or electroforming may be performed mainly by electroplating. Moreover, the cured film obtained by patterning may be used as a permanent film. The cured film may be used as, for example, an interlayer insulating film, a wiring protective film, or a wiring protective film having an index matching layer. The photosensitive transfer material according to the present disclosure includes, for example, various wiring forming applications for semiconductor packages, printed circuit boards, sensor substrates, touch panels, electromagnetic wave shielding materials, conductive films such as film heaters, liquid crystal sealing materials, micromachines and micros. It can be suitably used for applications such as the formation of structures in the field of electronics.

Japanese Patent Application No. 2020-049950 filed on March 19, 2020, Japanese Patent Application No. 2020-172154 filed on October 12, 2020, and Japan filed on December 15, 2020. The disclosure of patent application 2020-207811 is incorporated herein by reference in its entirety. All documents, patent applications, and technical standards described herein are to the same extent as if the individual documents, patent applications, and technical standards were specifically and individually stated to be incorporated by reference. Incorporated herein by reference.

10: Temporary support 12: Photosensitive resin layer 14: Cover film 100: Photosensitive transfer material DL: Alignment frame G: Non-image part (light-shielding part)
SL: Non-image part (light-shielding part)

Claims

Temporary support and
Having a photosensitive resin layer on the temporary support,
Before and after the heat treatment at 100 ° C. for 15 minutes, the rate of change of the contact angle of water with respect to the surface of the temporary support opposite to the surface facing the photosensitive resin layer was 0% to 10.0%. A photosensitive transfer material.
The photosensitivity according to claim 1, wherein the contact angle of water with respect to the surface of the temporary support opposite to the surface facing the photosensitive resin layer is 90 degrees or less before the heat treatment at 100 ° C. for 15 minutes. Sex transfer material.
The photosensitive transfer material according to claim 1 or 2, wherein the temporary support has an average thickness of 20 μm or less.
The absolute value of the difference between the haze of the temporary support before the heat treatment at 120 ° C. for 5 minutes and the haze of the temporary support after the heat treatment at 120 ° C. for 5 minutes is 0% to 0.40%. The photosensitive transfer material according to any one of claims 1 to 3.
The photosensitive transfer material according to any one of claims 1 to 4, wherein the temporary support has a peeling force of 0.5 gf / cm or more.
The photosensitive transfer material according to any one of claims 1 to 5, wherein the average thickness of the photosensitive resin layer is 3 μm to 10 μm.
The photosensitive transfer material according to any one of claims 1 to 6, wherein the temporary support contains wax.
The photosensitive transfer material according to claim 7, wherein the wax content is 0.0001% by mass to 0.05% by mass with respect to the total mass of the temporary support.
A step of laminating the photosensitive transfer material according to any one of claims 1 to 8 and a substrate, and arranging a photosensitive resin layer on the substrate.
The step of pattern-exposing the photosensitive resin layer and
The step of developing the photosensitive resin layer to form a resin pattern, and
A method for manufacturing a resin pattern, which includes the above in this order.
A step of laminating the photosensitive transfer material according to any one of claims 1 to 8 and a substrate having a conductive layer, and arranging a photosensitive resin layer on the substrate.
The step of pattern-exposing the photosensitive resin layer and
The step of developing the photosensitive resin layer to form a resin pattern, and
A step of etching the conductive layer in a region where the resin pattern is not arranged to form a circuit wiring, and a step of forming a circuit wiring.
A method of manufacturing a circuit wiring including in this order.
Temporary support for photosensitive transfer material in which the rate of change of the contact angle of water is 0% to 10.0% before and after heat treatment at 100 ° C. for 15 minutes.
The photosensitive transfer material according to claim 11, wherein the absolute value of the difference between the haze before the heat treatment at 120 ° C. for 5 minutes and the haze after the heat treatment at 120 ° C. for 5 minutes is 0% to 0.40%. Temporary support.