WO2021182098A1 - Thermally conductive material and method for producing same, heat dissipation structure and method for producing same, and electronic device - Google Patents

Thermally conductive material and method for producing same, heat dissipation structure and method for producing same, and electronic device Download PDF

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Publication number
WO2021182098A1
WO2021182098A1 PCT/JP2021/006748 JP2021006748W WO2021182098A1 WO 2021182098 A1 WO2021182098 A1 WO 2021182098A1 JP 2021006748 W JP2021006748 W JP 2021006748W WO 2021182098 A1 WO2021182098 A1 WO 2021182098A1
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Prior art keywords
heat
conductive material
heat conductive
carbon fibers
prepreg
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PCT/JP2021/006748
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French (fr)
Japanese (ja)
Inventor
荒巻　慶輔
真理奈 戸端
佑介 久保
雅男 斎藤
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デクセリアルズ株式会社
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Publication of WO2021182098A1 publication Critical patent/WO2021182098A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • B29C70/10—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • B29C70/10—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres
    • B29C70/16—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres using fibres of substantial or continuous length
    • B29C70/20—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres using fibres of substantial or continuous length oriented in a single direction, e.g. roofing or other parallel fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/30—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
    • B29C70/34—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat conductive material and a method for manufacturing a heat conductive material, a heat radiating structure and a method for manufacturing a heat radiating structure, and an electronic device.
  • heat conductive material such as a heat conductive sheet between a heating element such as a semiconductor chip and a heat radiating member such as a heat sink.
  • the characteristics required for these heat-dissipating materials include high thermal conductivity and followability to the surface shapes of the heating element and the heat-dissipating member in order to improve the thermal conductivity.
  • Carbon fibers are widely used as one of the materials constituting such a heat conductive material, and a heat conductive sheet in which the carbon fibers are oriented in the heat conductive direction is known.
  • a carbon fiber sheet obtained by solidifying bundled carbon fibers with a fusing resin is prepared, laminated, impregnated with a thermosetting binder resin, and then cured to obtain a predetermined cured product.
  • a method for producing a thermosetting material that cuts at a thickness and an angle has been proposed (see, for example, Patent Document 1).
  • an object of the present invention is to provide a heat conductive material having excellent adhesion and high heat conductivity, a method for manufacturing the same, a heat radiation structure using the heat conductive material, a method for manufacturing the same, and an electronic device. ..
  • the means for solving the above-mentioned problems are as follows. That is, ⁇ 1> Production of a heat conductive material comprising a laminating step of laminating prepregs in which carbon fibers are oriented in a certain direction so that the orientation directions of the carbon fibers are aligned and pressurizing at room temperature to obtain a prepreg laminate.
  • the method. ⁇ 2> The method for producing a heat conductive material according to ⁇ 1>, which comprises a cutting step of cutting the prepreg laminate in a direction substantially perpendicular to the orientation direction of the carbon fibers.
  • ⁇ 3> The method for producing a heat conductive material according to any one of ⁇ 1> to ⁇ 2>, wherein the carbon fiber is a pitch-based carbon fiber.
  • thermosetting resin composition containing at least carbon fibers, which is a heat conductive material characterized by being a laminate in which the carbon fibers are oriented in the thickness direction.
  • thermosetting resin composition containing at least carbon fibers, which is a heat conductive material characterized by being a laminate in which the carbon fibers are oriented in the thickness direction.
  • thermosetting resin composition containing at least carbon fibers, which is a heat conductive material characterized by being a laminate in which the carbon fibers are oriented in the thickness direction.
  • ⁇ 6> A method of manufacturing a heat radiating structure composed of a heating element, a heat conductive material, and a heat radiating member.
  • a semi-cured product of the heat conductive material produced by the method for producing the heat conductive material according to any one of ⁇ 1> to ⁇ 4> is sandwiched between the heat generating body and the heat radiating member, and the heat conductive material is sandwiched between the heat generating body and the heat radiating member.
  • This is a method for manufacturing a heat-dissipating structure, which comprises heating and curing a semi-cured product of the above.
  • a heat-dissipating structure composed of a heating element, a heat-conducting material, and a heat-dissipating member.
  • a cured product of the heat conductive material according to ⁇ 5> is provided between the heating element and the heat radiating member.
  • the heating element, the heat radiating member, and a cured product of the heat conductive material have adhesiveness.
  • the adhesiveness means peeling of a 90 ° peeling test at a tensile speed of 50 mm / min, which is measured at room temperature after the stainless steel plate and the copper foil are bonded together with a heat conductive material and cured at 150 ° C. for 1 hour. It means that the force is 1 N / cm or more.
  • the above-mentioned problems in the prior art can be solved, the above-mentioned object can be achieved, a heat-conducting material having excellent adhesion and high heat conductivity, a method for producing the above-mentioned heat-conducting material, and a heat-conducting material. It is possible to provide a heat radiating structure using the above, a method for manufacturing the same, and an electronic device.
  • FIG. 1 is a schematic cross-sectional view showing an example of the heat dissipation structure of the present invention.
  • FIG. 2 is a diagram showing an example of a process of manufacturing a heat radiating structure having a silicon wafer with a heat conductive material of the present invention.
  • the method for producing a heat conductive material of the present invention preferably includes a laminating step and a cutting step, and further includes other steps if necessary.
  • the laminating step is a step of laminating prepregs in which carbon fibers are oriented in a certain direction so that the orientation directions of the carbon fibers are aligned and pressurizing at room temperature to obtain a prepreg laminated body.
  • prepregs are laminated to produce a prepreg laminated body.
  • the orientation direction of the carbon fibers in the prepreg constituting the prepreg laminate is preferably the same direction.
  • one carbon fiber is used for every 5 to 10 laminated carbon fibers in which the orientation direction of the carbon fibers is aligned.
  • the prepreg may be arranged so that the orientation direction is substantially vertical to that of the previous one.
  • the prepreg may be pulled out from the rolled body and pressurized each time one sheet is laminated, several sheets may be stacked and pressed (pressed), or the wound body may be pressed. You may pressurize (press) after cutting out from the above and stacking the required number of layers. Further, this step may be repeated in order to obtain the thickness of the laminated body.
  • the prepreg may be laminated until the required thickness is obtained, and the prepreg laminated body may be obtained by pressurizing (pressing) the prepreg at once with a press machine or the like.
  • the pressurization can be performed using, for example, a pair of press devices including a flat plate and a press head having a flat surface. Further, a pinch roll may be used, or a simple method such as a hand roller may be used as long as the required characteristics can be obtained in a small area and a small amount of production.
  • the pressure at the time of pressurization is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 0.1 MPa to 100 MPa, more preferably 0.5 MPa to 95 MPa.
  • the pressurization time is not particularly limited and may be appropriately selected depending on the binder resin component, pressure, sheet area and the like.
  • the pressurization is performed at room temperature. That is, the prepreg is not heat-cured when it is pressurized.
  • room temperature means that the environment is not heated, and means, for example, a temperature of 20 ° C to 30 ° C.
  • the prepreg laminate obtained by pressurizing at room temperature can be placed between the heating element and the heat radiating member while maintaining flexibility, and it has excellent followability to the surface shapes of the heating element and the heat radiating member. , Adhesion is improved.
  • the number of prepregs to be laminated can be appropriately selected according to the thickness of the heat conductive material and the number of heat conductive materials desired to be obtained from the laminate, but for example, the number of layers is preferably 100 to 200.
  • the prepreg is a so-called “UD prepreg” in which carbon fibers are aligned in a certain direction, the carbon fibers are impregnated with the above resin composition, and then semi-cured into a sheet.
  • UD prepreg in which carbon fibers are aligned in a certain direction, the carbon fibers are impregnated with the above resin composition, and then semi-cured into a sheet.
  • cross prepreg in which a carbon fiber sheet in which carbon fibers are woven vertically and horizontally is impregnated with a resin and then semi-cured into a sheet.
  • "UD prepreg” is preferable from the viewpoint of thermal conductivity.
  • the mass ratio of the resin in the prepreg can be appropriately selected depending on how much conductivity is imparted when used as a heat conductive material, but is preferably 20% by mass to 35% by mass, for example.
  • F.I. which is the mass of carbon fibers per unit area of the prepreg.
  • the W (Fiber Real Weight) value can be appropriately selected depending on the thermal resistance and thermal conductivity imparted to the finally obtained heat conductive material, and further the flexibility imparted to the heat conductive material before curing. For example, 100 g / m 2 to 250 g / m 2 is preferable.
  • the thickness of the prepreg does not hinder the laminating process and can be appropriately selected depending on the thermal resistance and thermal conductivity applied to the heat conductive material, but is preferably 50 ⁇ m to 150 ⁇ m, for example.
  • an appropriately manufactured prepreg may be used, or a commercially available product may be used.
  • the commercially available products include Granock prepreg NT81250-525S, NT81600-520S, NT81000-530S, NT91250-525S, NT91500-520S, NT61000-525S, and NT61350-520S (all manufactured by Nippon Graphite Fiber Co., Ltd., Pitch).
  • Prepreg in which carbon fiber is impregnated in a thermosetting resin Dialead prepreg HyEJ12M65PD, HyEJ28M45PD, HyEJ12M80QD, HyEJ34M65PD (all prepreg using pitch carbon fiber manufactured by Mitsubishi Chemical Co., Ltd.), Pyrofil prepreg TR350C125 , TR350C150, TR350E100R, TR350G175S, MRX350C125S (all manufactured by Mitsubishi Chemical Co., Ltd., prepreg using PAN-based carbon fiber) and the like. These may be used alone or in combination of two or more.
  • the prepreg used for the heat conductive material of the present invention consists of at least a resin composition and carbon fibers. Since this resin composition contains a thermosetting resin, a thermosetting resin composition is suitable.
  • the prepreg used for the heat conductive material of the present invention may use the same type of thermosetting resin composition or a mixture of different types of thermosetting resin compositions, and is easy to manufacture. From the viewpoint, it is preferable to use the same type of thermosetting resin composition.
  • thermosetting resin is not particularly limited as long as it is a compound having a thermosetting functional group, and can be appropriately selected depending on the intended purpose.
  • epoxy resin polyimide resin, polyamideimide resin, triazine resin, etc.
  • examples thereof include phenol resin, melamine resin, polyester resin, cyanate ester resin, silicone resin, and modified resins of these resins. These may be used alone or in combination of two or more.
  • epoxy resin is more preferable from the viewpoint of heat resistance, material selectivity, and adhesion.
  • -Epoxy resin- Epoxy resin is at least one of the compounds comprising one or more epoxy groups in one molecule (-C 3 H 5 O). Among these, the epoxy resin preferably contains two or more epoxy groups in one molecule.
  • the epoxy resin may be a monomer or a prepolymer in which the monomer is partially reacted with a curing agent or the like.
  • the epoxy resin is not particularly limited and may be appropriately selected depending on the intended purpose.
  • glycidyl ether type epoxy resin glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, novolak type epoxy resin, cyclic aliphatic type.
  • examples thereof include epoxy resins and long-chain aliphatic epoxy resins. These may be used alone or in combination of two or more.
  • Examples of the glycidyl ether type epoxy resin include bisphenol A type epoxy resin and bisphenol F type epoxy resin. Further, an ethylene oxide-modified bisphenol A type epoxy resin or the like in which an ethylene oxide chain is contained in these skeletons may be used.
  • Examples of the novolak type epoxy resin include cresol novolac type epoxy resin and phenol novolac type epoxy resin.
  • examples of the type of epoxy resin include flame-retardant epoxy resin, hydantoin-based epoxy resin, and isocyanurate-based epoxy resin.
  • the properties of the epoxy resin are not particularly limited and can be selected in consideration of the ease of manufacturing the prepreg and the mutual fusion property when the prepregs are laminated.
  • the epoxy resin is liquid at 25 ° C.
  • the epoxy resin and the solid epoxy resin may be mixed and used, or the solid epoxy resin may be heated and melted and two or more kinds may be mixed. Further, even in the solid epoxy resin, the softening point and the like are appropriately selected according to desired physical properties.
  • thermosetting resin composition preferably further contains at least one type of curing agent.
  • the curing agent is not particularly limited as long as the thermosetting resin can be thermally cured, and can be appropriately selected.
  • the thermosetting resin is an epoxy resin
  • examples of the curing agent include acid anhydride-based curing agents, aliphatic amine-based curing agents, aromatic amine-based curing agents, phenol-based curing agents, and mercaptan-based curing agents. Examples thereof include a heavy addition type curing agent and a catalytic type curing agent such as imidazole.
  • Examples thereof include an adduct-type latent curing agent in which an imidazole or the like is excessively reacted with the glycidyl group of an epoxy resin, and a microcapsule-type latent curing agent in which this is microencapsulated with isocyanate or the like.
  • thermosetting resin composition may be used in combination with a curing accelerator, if necessary. By using a curing accelerator in combination, it can be further sufficiently cured.
  • the type and content of the curing accelerator are not particularly limited and may be appropriately selected depending on the intended purpose, but an appropriate one may be selected from the viewpoints of reaction rate, reaction temperature, storage stability and the like. preferable.
  • Examples of the curing accelerator include imidazole compounds, organic phosphorus compounds, tertiary amines, and quaternary ammonium salts. These may be used alone or in combination of two or more.
  • thermosetting resin composition may contain other components as long as the effects of the present invention are not impaired.
  • an inorganic filler such as aluminum oxide, aluminum nitride, or boron nitride may be added from the viewpoint of improving thermal conductivity and adjusting the strength of the prepreg.
  • fine powder of a metal oxide such as fumed silica may be added.
  • an auxiliary agent such as a silane coupling agent or an aluminum chelate may be added.
  • the carbon fiber is not particularly limited and may be appropriately selected depending on the intended purpose.
  • Carbon fibers synthesized by a CVD method (chemical vapor deposition method), a CCVD method (catalytic chemical vapor deposition method), or the like can be used. These may be used alone or in combination of two or more.
  • carbon fibers obtained by graphitizing PBO fibers, carbon fibers obtained by graphitizing PAN fibers, and pitch-based carbon fibers are preferable, and pitch-based carbon fibers are particularly preferable.
  • the average fiber diameter (average minor axis length) of the carbon fibers is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 4 ⁇ m to 20 ⁇ m, and is preferably 5 ⁇ m to 14 ⁇ m. More preferred.
  • the thermal conductivity of the carbon fiber itself is appropriately selected according to the desired thermal conductivity when used as a heat conductive material, but is preferably 150 W / m ⁇ K to 1400 W / m ⁇ K.
  • the surface of the carbon fiber may be coated with, for example, an epoxy resin from the viewpoint of improving the affinity with the impregnated resin.
  • the cutting step is a step of cutting the prepreg laminate in a direction substantially perpendicular to the orientation direction of the carbon fibers. Cutting is performed using, for example, a slicing device.
  • the slicing device is not particularly limited as long as it is a means capable of cutting the prepreg laminate, and a known slicing device can be appropriately used, and examples thereof include an ultrasonic cutter and a plane (plane).
  • the other steps are not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a surface coating step and a sheet manufacturing step.
  • the heat conductive material of the present invention is at least a semi-cured product of a thermosetting resin composition impregnated with carbon fibers, and is a laminate in which the carbon fibers are oriented in the thickness direction.
  • the carbon fiber, the thermosetting resin, and the like the same ones as described in the method for producing a heat conductive material can be used.
  • the semi-cured product means a state in which the prepreg laminate is not heat-cured (completely cured), the prepreg laminate has flexibility between the heating element and the heat radiating member, and the heating element and the heat radiating member are provided. It means a state having the ability to follow each surface shape of.
  • the layer containing the heat conductive material, which is the cured product, and the heating element, heat radiating member, etc. are further cured by heating or the like. Adhesion is further improved.
  • the shape, thickness, and the like of the heat conductive material are not particularly limited and can be appropriately selected depending on the intended purpose.
  • Examples of the shape of the heat conductive material include a sheet shape and a flat plate shape.
  • the thickness of the heat conductive material is not particularly limited and can be appropriately set depending on the intended use, but is preferably 0.1 mm to 3.0 mm.
  • the method for manufacturing a heat radiating structure of the present invention is a method for manufacturing a heat radiating structure composed of a heating element, a heat conductive material, and a heat radiating member.
  • a semi-cured product of the heat conductive material produced by the method for producing a heat conductive material of the present invention is sandwiched between the heating element and the heat radiation member, and the semi-cured product of the heat conductive material is heated and cured.
  • a semi-cured product of the heat conductive material produced by the method for producing a heat conductive material of the present invention is sandwiched between the heat generating body and the heat radiating member, and heat is generated so as to follow the surface shapes of the heat generating body and the heat radiating member. Place a semi-cured material of conductive material.
  • the semi-cured material of the heat conductive material is heated.
  • it may be heated together with the heating element and the heat radiating member by passing it through a reflow furnace, or it may be heated in an oven.
  • the heating element is a semiconductor chip, a semiconductor element, a resistor, or the like, these may be generated by energizing them.
  • the resin state is in a semi-cured state.
  • the semi-cured product of the heat conductive material is completely cured by heating with the semi-cured product of the heat conductive material sandwiched between the heating element and the heat radiating member.
  • the heat radiating structure of the present invention is a heat radiating structure composed of a heating element, a heat conductive material, and a heat radiating member. A cured product of the heat conductive material of the present invention is held between the heating element and the heat radiating member.
  • the heating element, the heat radiating member, and the cured product of the heat conductive material have adhesiveness.
  • the adhesiveness means peeling of a 90 ° peeling test at a tensile speed of 50 mm / min, which is measured at room temperature after the stainless steel plate and the copper foil are bonded together with a heat conductive material and cured at 150 ° C. for 1 hour. It means that the force is 1 N / cm or more.
  • room temperature means that the environment is not heated, and means, for example, a temperature of 20 ° C to 30 ° C.
  • the heat-dissipating structure includes, for example, a heating element such as an electronic component, a heat-dissipating member such as a heat sink, a heat pipe, and a heat spreader, and a heat conductive material sandwiched between the heating element and the heat-dissipating member.
  • a heating element such as an electronic component
  • a heat-dissipating member such as a heat sink, a heat pipe, and a heat spreader
  • a heat conductive material sandwiched between the heating element and the heat-dissipating member.
  • the electronic component is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include a CPU (Central Processing Unit), an MPU (Micro Processing Unit), and a GPU (Graphics Processing Unit).
  • a CPU Central Processing Unit
  • MPU Micro Processing Unit
  • GPU Graphics Processing Unit
  • the heat radiating structure is not particularly limited as long as it is a structure that radiates heat generated by an electronic component (heating body), and can be appropriately selected according to the purpose.
  • a heat spreader for example, a heat spreader, a heat sink, a vapor chamber, and heat.
  • Examples include pipes.
  • the heat spreader is a member for efficiently transferring the heat of the electronic component to other components.
  • the material of the heat spreader is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include copper and aluminum.
  • the heat spreader usually has a flat plate shape.
  • the heat sink is a member for releasing the heat of the electronic component into the air.
  • the material of the heat sink is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include copper and aluminum.
  • the heat sink has, for example, a plurality of fins.
  • the heat sink has, for example, a base portion and a plurality of fins provided so as to extend in a direction non-parallel (for example, in a direction orthogonal to the base portion) with respect to one surface of the base portion.
  • the heat spreader and the heat sink generally have a solid structure having no space inside.
  • the vapor chamber is a hollow structure. A volatile liquid is sealed in the internal space of the hollow structure. Examples of the vapor chamber include a heat spreader having a hollow structure, a plate-shaped hollow structure having a heat sink having a hollow structure, and the like.
  • the heat pipe is a hollow structure having a cylindrical shape, a substantially cylindrical shape, or a flat tubular shape. A volatile liquid is sealed in the internal space of the hollow structure.
  • FIG. 1 is a schematic view of a semiconductor device as an example of the heat dissipation structure of the present invention.
  • FIG. 1 is a schematic cross-sectional view of an example of a semiconductor device.
  • the heat conductive sheet 1 of the present invention dissipates heat generated by an electronic component 3 such as a semiconductor element, and as shown in FIG. 1, is fixed to a main surface 2a facing the electronic component 3 of the heat spreader 2 and has electrons. It is sandwiched between the component 3 and the heat spreader 2. Further, the heat conductive sheet 1 is sandwiched between the heat spreader 2 and the heat sink 5. Then, the heat conductive sheet 1 together with the heat spreader 2 constitutes a heat radiating member that dissipates heat from the electronic component 3.
  • the heat spreader 2 has, for example, a main surface 2a formed in a square plate shape and facing the electronic component 3, and a side wall 2b erected along the outer circumference of the main surface 2a.
  • the heat conductive sheet 1 is provided on the main surface 2a surrounded by the side wall 2b, and the heat sink 5 is provided on the other surface 2c on the opposite side of the main surface 2a via the heat conductive sheet 1.
  • the heat spreader 2 has a higher thermal conductivity, the lower the thermal resistance, and efficiently absorbs the heat of the electronic component 3 such as a semiconductor element. Therefore, the heat spreader 2 is formed by using, for example, copper or aluminum having good thermal conductivity. can do.
  • the electronic component 3 is, for example, a semiconductor element such as a BGA, and is mounted on the wiring board 6. Further, in the heat spreader 2, the tip surface of the side wall 2b is mounted on the wiring board 6, whereby the side wall 2b surrounds the electronic component 3 at a predetermined distance.
  • the heat radiating structure of the present invention and a method for manufacturing the same include the following aspects.
  • the heat conductive material 11 of the present invention is bonded to the surface of the silicon wafer 12 on which the semiconductor circuit is formed, which faces the circuit forming surface.
  • the silicon wafer in this state is set in a dicing frame provided with a dicing tape, and then individualized as a semiconductor chip with a heat conductive material using a dicer or the like (FIGS. 2B and 2C). reference).
  • the semiconductor chip 13 with a heat conductive material that has been separated is mounted on, for example, an organic substrate 15 and then installed so as to come into contact with a heat radiating member 14 such as a heat spreader or a heat sink. do.
  • a heat radiating member 14 such as a heat spreader or a heat sink. do.
  • 11 is the heat conductive material of the present invention, and 16 is solder.
  • the electronic device of the present invention has the heat dissipation structure of the present invention.
  • An example of an electronic device is a semiconductor device using a semiconductor element as an electronic component.
  • Granock prepreg NT81250-525S having a width of 10 cm and a length of 5 cm (carbon fiber diameter 10 ⁇ m, FAW value 125 g / m 2 , thermosetting resin composition content 25 mass%, thickness 90 ⁇ m, Nippon Graphite Fiber Co., Ltd.) was laminated so that the orientation directions of the carbon fibers were the same. They were laminated at room temperature (25 ° C.), pressed with a hand roller for each layer, and finally 180 sheets were laminated. A prepreg laminate having a height of 23 mm, a width of 10 cm, and a length of 5 cm was obtained.
  • the prepreg laminate was sliced in a direction substantially perpendicular to the orientation direction of the carbon fibers to obtain a heat conductive material having a thickness of 300 ⁇ m (0.3 mm) in which the carbon fibers were oriented in the thickness direction in a semi-cured state.
  • the obtained semi-cured heat conductive material was cut into a circle having a diameter of 20 mm, sandwiched between copper plates, and then heated at 150 ° C. for 1 hour to obtain a test piece obtained by curing the heat conductive material.
  • the thermal resistance [° C. cm 2 / W] of the obtained test piece was measured with a load of 3 kgf / cm 2 by a method according to ASTM-D5470.
  • the thickness of the heat conductive material after thermosetting was measured using a feeler gauge.
  • a copper foil using a polyimide film as a backing material was cut into 10 mm ⁇ 100 mm.
  • a semi-cured heat conductive material having a thickness of 0.3 mm was attached to this test piece so as to have a width of 10 mm and a length of 50 mm from the end of the copper foil.
  • the copper foil to which the semi-cured heat conductive material was attached was attached to a SUS304 plate conforming to JIS G4305 by reciprocating once with a 2 kg roller. In this state, the heat conductive material was cured by heating at 150 ° C. for 1 hour, and then allowed to stand at room temperature (25 ° C.) for 24 hours to prepare a sample.
  • Example 1 a heat conductive material and a test piece were obtained under the same conditions as in Example 1 except that the heat conductive material was heated at 150 ° C. for 1 hour to cure the heat conductive material before being sandwiched between copper plates. .. The thermal resistance and thickness of this test piece were measured in the same manner as in Example 1. The results are shown in Table 1.
  • Example 1 a semi-cured heat conductive material having a thickness of 0.3 mm was attached to a copper foil backed by a polyimide film, and then heat-cured at 150 ° C. for 1 hour. I tried to attach this to the SUS304 board, but I could not attach it (peeling force cannot be measured). The results are shown in Table 1.
  • Example 1 was not heat-cured at the time of obtaining the heat conductive material containing carbon fibers, and was heat-cured after being sandwiched between copper plates. It was found that it was adhered to the copper plate, had good adhesion and thermal conductivity, and had low thermal resistance. On the other hand, in Comparative Example 1, since the obtained heat conductive material is sandwiched between copper plates after being heat-cured, the followability to the surface shape of the copper plate is low and the adhesion is poor, so that it is compared with Example 1. It was found that the thermal resistance increased.
  • Heat conductive material heat conductive sheet
  • Heat dissipation member heat spreader
  • Main surface Heating element (electronic component)
  • Top surface 5 Heat dissipation member (heat sink) 6 Wiring board

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Abstract

The present invention provides a method for producing a thermally conductive material, said method comprising a stacking step for obtaining a prepreg multilayer body by stacking prepregs, in each of which carbon fibers are oriented in a certain direction, in such a manner that the carbon fibers have the same orientation direction, and subsequently applying a pressure to the prepregs at room temperature.

Description

熱伝導材料及びその製造方法、放熱構造体及びその製造方法、並びに電子機器Thermal conductive material and its manufacturing method, heat dissipation structure and its manufacturing method, and electronic equipment
　本発明は、熱伝導材料及び熱伝導材料の製造方法、放熱構造体及び放熱構造体の製造方法、並びに電子機器に関する。 The present invention relates to a heat conductive material and a method for manufacturing a heat conductive material, a heat radiating structure and a method for manufacturing a heat radiating structure, and an electronic device.
　半導体チップ等の発熱体と、ヒートシンク等の放熱部材の間に、熱伝導シート等の熱伝導材料を設けることは広く行われている。これらの放熱材料に求められる特性として、高熱伝導性と、熱伝導性向上のために、発熱体及び放熱部材の表面形状への追従性が挙げられる。 It is widely practiced to provide a heat conductive material such as a heat conductive sheet between a heating element such as a semiconductor chip and a heat radiating member such as a heat sink. The characteristics required for these heat-dissipating materials include high thermal conductivity and followability to the surface shapes of the heating element and the heat-dissipating member in order to improve the thermal conductivity.
　このような熱伝導材料を構成する材料の一つとして、炭素繊維が広く用いられ、熱伝導方向に炭素繊維を配向させた熱伝導シートが知られている。
　例えば、束状になった炭素繊維を融着性樹脂で固めた炭素繊維シートを用意した後、これを積層し、熱硬化性のバインダ樹脂で含侵した後に硬化し、この硬化物を所定の厚みと角度で切断する熱伝導材料の製造方法が提案されている（例えば、特許文献１参照）。 Carbon fibers are widely used as one of the materials constituting such a heat conductive material, and a heat conductive sheet in which the carbon fibers are oriented in the heat conductive direction is known.
For example, a carbon fiber sheet obtained by solidifying bundled carbon fibers with a fusing resin is prepared, laminated, impregnated with a thermosetting binder resin, and then cured to obtain a predetermined cured product. A method for producing a thermosetting material that cuts at a thickness and an angle has been proposed (see, for example, Patent Document 1).
　また、炭素繊維を分散させた樹脂組成物を型に押し出し、押し出し方向に炭素繊維の長さ方向が配向した成型体を形成した後に硬化させ、この硬化物を所定の厚みで切断した熱伝導シートが提案されている（例えば、特許文献２参照）。 Further, a resin composition in which carbon fibers are dispersed is extruded into a mold to form a molded body in which the length direction of the carbon fibers is oriented in the extruding direction, and then cured, and the cured product is cut to a predetermined thickness to form a heat conductive sheet. Has been proposed (see, for example, Patent Document 2).
特開２００２－４６１３７号公報Japanese Unexamined Patent Publication No. 2002-46137 特開２０１５－４５０１９号公報Japanese Unexamined Patent Publication No. 2015-45019
　しかしながら、前記特許文献１に記載の方法では、熱伝導シートにおける炭素繊維の充填量を高くできるものの、熱伝導シートは熱硬化性樹脂の硬化物であるため、柔軟性に欠ける傾向があり、炭素繊維の優れた熱伝導性を完全には活かしきれていない。
　また、前記特許文献２に記載の熱伝導シートは、発熱体及び放熱部材の表面形状への追従性には優れるが、炭素繊維の充填量は低くなることから、上記特許文献１に記載の熱伝導シートに比して、熱伝導性は劣ることになる。
　本発明は、従来における前記諸問題を解決し、以下の目的を達成することを課題とする。即ち、本発明は、密着性に優れ、高熱伝導性を有する熱伝導材料、及びその製造方法、熱伝導材料を用いた放熱構造体及びその製造方法、並びに電子機器を提供することを目的とする。 However, in the method described in Patent Document 1, although the filling amount of carbon fibers in the heat conductive sheet can be increased, since the heat conductive sheet is a cured product of a thermosetting resin, it tends to lack flexibility and carbon. The excellent thermal conductivity of the fiber is not fully utilized.
Further, the heat conductive sheet described in Patent Document 2 is excellent in followability to the surface shapes of the heating element and the heat radiating member, but the filling amount of carbon fibers is low, so that the heat described in Patent Document 1 is described. The thermal conductivity will be inferior to that of the conductive sheet.
An object of the present invention is to solve the above-mentioned problems in the past and to achieve the following object. That is, an object of the present invention is to provide a heat conductive material having excellent adhesion and high heat conductivity, a method for manufacturing the same, a heat radiation structure using the heat conductive material, a method for manufacturing the same, and an electronic device. ..
　前記課題を解決するための手段としては、以下の通りである。即ち、
　＜１＞　炭素繊維が一定方向に配向したプリプレグを前記炭素繊維の配向方向を揃えて積層し、室温下で加圧してプリプレグ積層体を得る積層工程を含むことを特徴とする熱伝導材料の製造方法である。
　＜２＞　前記プリプレグ積層体を、前記炭素繊維の配向方向と略垂直方向に切断する切断工程とを含む前記＜１＞に記載の熱伝導材料の製造方法である。
　＜３＞　前記炭素繊維がピッチ系炭素繊維である、前記＜１＞から＜２＞のいずれかに記載の熱伝導材料の製造方法である。
　＜４＞　前記プリプレグが前記炭素繊維を熱硬化性樹脂に含侵させて得られたものである、前記＜１＞から＜３＞のいずれかに記載の熱伝導材料の製造方法である。
　＜５＞　少なくとも炭素繊維を含む熱硬化性樹脂組成物の半硬化物であり、前記炭素繊維が厚み方向に配向した積層体であることを特徴とする熱伝導材料である。
　＜６＞　発熱体と、熱伝導材料と、放熱部材とから構成される放熱構造体を製造する方法であって、
　前記発熱体と前記放熱部材の間に、前記＜１＞から＜４＞のいずれかに記載の熱伝導材料の製造方法によって製造された熱伝導材料の半硬化物を挟持し、前記熱伝導材料の半硬化物を加熱し、硬化させることを特徴とする放熱構造体の製造方法である。
　＜７＞　発熱体と、熱伝導材料と、放熱部材とから構成される放熱構造体であって、
　前記発熱体と前記放熱部材の間に、前記＜５＞に記載の熱伝導材料の硬化物を有し、
　前記発熱体及び前記放熱部材と前記熱伝導材料の硬化物とが密着性を有することを特徴とする放熱構造体である。
　ここで、前記密着性とは、ステンレス板と銅箔を熱伝導材料で貼り合せ、１５０℃で１時間硬化した後に、室温下で測定した、引っ張り速度５０ｍｍ／ｍｉｎでの９０°剥離試験の剥離力が１Ｎ／ｃｍ以上であることをいう。
　＜８＞　前記＜７＞に記載の放熱構造体を有することを特徴とする電子機器である。
　＜９＞　前記＜５＞に記載の熱伝導材料を有することを特徴とするシリコンウェーハである。 The means for solving the above-mentioned problems are as follows. That is,
<1> Production of a heat conductive material comprising a laminating step of laminating prepregs in which carbon fibers are oriented in a certain direction so that the orientation directions of the carbon fibers are aligned and pressurizing at room temperature to obtain a prepreg laminate. The method.
<2> The method for producing a heat conductive material according to <1>, which comprises a cutting step of cutting the prepreg laminate in a direction substantially perpendicular to the orientation direction of the carbon fibers.
<3> The method for producing a heat conductive material according to any one of <1> to <2>, wherein the carbon fiber is a pitch-based carbon fiber.
<4> The method for producing a heat conductive material according to any one of <1> to <3>, wherein the prepreg is obtained by impregnating the carbon fibers with a thermosetting resin.
<5> A semi-cured product of a thermosetting resin composition containing at least carbon fibers, which is a heat conductive material characterized by being a laminate in which the carbon fibers are oriented in the thickness direction.
<6> A method of manufacturing a heat radiating structure composed of a heating element, a heat conductive material, and a heat radiating member.
A semi-cured product of the heat conductive material produced by the method for producing the heat conductive material according to any one of <1> to <4> is sandwiched between the heat generating body and the heat radiating member, and the heat conductive material is sandwiched between the heat generating body and the heat radiating member. This is a method for manufacturing a heat-dissipating structure, which comprises heating and curing a semi-cured product of the above.
<7> A heat-dissipating structure composed of a heating element, a heat-conducting material, and a heat-dissipating member.
A cured product of the heat conductive material according to <5> is provided between the heating element and the heat radiating member.
It is a heat radiating structure characterized in that the heating element, the heat radiating member, and a cured product of the heat conductive material have adhesiveness.
Here, the adhesiveness means peeling of a 90 ° peeling test at a tensile speed of 50 mm / min, which is measured at room temperature after the stainless steel plate and the copper foil are bonded together with a heat conductive material and cured at 150 ° C. for 1 hour. It means that the force is 1 N / cm or more.
<8> An electronic device having the heat radiating structure according to the above <7>.
<9> A silicon wafer characterized by having the heat conductive material according to the above <5>.
　本発明によると、従来における前記諸問題を解決し、前記目的を達成することができ、密着性に優れ、高熱伝導性を有する熱伝導材料、及び前記熱伝導材料の製造方法、並びに熱伝導材料を用いた放熱構造体及びその製造方法、及び電子機器を提供することができる。 According to the present invention, the above-mentioned problems in the prior art can be solved, the above-mentioned object can be achieved, a heat-conducting material having excellent adhesion and high heat conductivity, a method for producing the above-mentioned heat-conducting material, and a heat-conducting material. It is possible to provide a heat radiating structure using the above, a method for manufacturing the same, and an electronic device.
図１は、本発明の放熱構造体の一例を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing an example of the heat dissipation structure of the present invention. 図２は、本発明の熱伝導材料付きシリコンウェーハを有する放熱構造体を製造する工程の一例を示す図である。FIG. 2 is a diagram showing an example of a process of manufacturing a heat radiating structure having a silicon wafer with a heat conductive material of the present invention.
(熱伝導材料の製造方法)
　本発明の熱伝導材料の製造方法は、積層工程を含み、切断工程を含むことが好ましく、更に必要に応じてその他の工程を含む。 (Manufacturing method of heat conductive material)
The method for producing a heat conductive material of the present invention preferably includes a laminating step and a cutting step, and further includes other steps if necessary.
＜積層工程＞
　積層工程は、炭素繊維が一定方向に配向したプリプレグを前記炭素繊維の配向方向を揃えて積層し、室温下で加圧してプリプレグ積層体を得る工程である。 <Laminating process>
The laminating step is a step of laminating prepregs in which carbon fibers are oriented in a certain direction so that the orientation directions of the carbon fibers are aligned and pressurizing at room temperature to obtain a prepreg laminated body.
　積層工程では、プリプレグを積層し、プリプレグ積層体を製造する。
　プリプレグ積層体を構成するプリプレグにおける炭素繊維の配向方向は同一方向が好ましい。しかし、熱伝導材料の熱伝導性を妨げない範囲において、熱伝導材料の強度向上を目的として、例えば、炭素繊維の配向方向を揃えた積層枚数５枚～１０枚毎に１枚、炭素繊維の配向方向がそれまでとは略垂直になるようにプリプレグを配してもよい。 In the laminating step, prepregs are laminated to produce a prepreg laminated body.
The orientation direction of the carbon fibers in the prepreg constituting the prepreg laminate is preferably the same direction. However, for the purpose of improving the strength of the heat conductive material within a range that does not interfere with the heat conductivity of the heat conductive material, for example, one carbon fiber is used for every 5 to 10 laminated carbon fibers in which the orientation direction of the carbon fibers is aligned. The prepreg may be arranged so that the orientation direction is substantially vertical to that of the previous one.
　プリプレグ積層体を得る方法としては、巻重体となった状態からプリプレグを引き出して、１枚積層する毎に加圧してもよく、数枚重ねて加圧（プレス）してもよいし、巻重体から切り出して必要な層数を重ねた後、加圧（プレス）してもよい。また、積層体の厚みを得るために、この工程を繰り返してもよい。又は、必要な厚みになるまでプリプレグを積層し、プレス機などで一度に加圧（プレス）してプリプレグ積層体を得てもよい。 As a method of obtaining the prepreg laminated body, the prepreg may be pulled out from the rolled body and pressurized each time one sheet is laminated, several sheets may be stacked and pressed (pressed), or the wound body may be pressed. You may pressurize (press) after cutting out from the above and stacking the required number of layers. Further, this step may be repeated in order to obtain the thickness of the laminated body. Alternatively, the prepreg may be laminated until the required thickness is obtained, and the prepreg laminated body may be obtained by pressurizing (pressing) the prepreg at once with a press machine or the like.
　前記加圧は、例えば、平盤と表面が平坦なプレスヘッドとからなる一対のプレス装置を使用して行うことができる。また、ピンチロールを使用して行ってもよいし、小面積且つ少量の製造であって、必要な特性が得られるのであればハンドローラーなどの簡易な方法を用いてもよい。
　前記加圧の際の圧力としては、特に制限はなく、目的に応じて適宜選択することができるが、０．１ＭＰａ～１００ＭＰａが好ましく、０．５ＭＰａ～９５ＭＰａがより好ましい。
　前記加圧の時間としては、特に制限はなく、バインダ樹脂の成分、圧力、シート面積等に応じて、適宜選択することができる。 The pressurization can be performed using, for example, a pair of press devices including a flat plate and a press head having a flat surface. Further, a pinch roll may be used, or a simple method such as a hand roller may be used as long as the required characteristics can be obtained in a small area and a small amount of production.
The pressure at the time of pressurization is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 0.1 MPa to 100 MPa, more preferably 0.5 MPa to 95 MPa.
The pressurization time is not particularly limited and may be appropriately selected depending on the binder resin component, pressure, sheet area and the like.
　前記加圧（プレス）は、室温下で行う。即ち、加圧をする際にプリプレグの加熱硬化は行わない。
　室温下とは、非加熱環境下であることを意味し、例えば、２０℃～３０℃の温度を意味する。
　室温下の加圧によって得られたプリプレグ積層体を発熱体と放熱部材との間へ柔軟性を有したまま配置することができ、発熱体と放熱部材の各々の表面形状への追従性に優れ、密着性が向上する。 The pressurization is performed at room temperature. That is, the prepreg is not heat-cured when it is pressurized.
The term "room temperature" means that the environment is not heated, and means, for example, a temperature of 20 ° C to 30 ° C.
The prepreg laminate obtained by pressurizing at room temperature can be placed between the heating element and the heat radiating member while maintaining flexibility, and it has excellent followability to the surface shapes of the heating element and the heat radiating member. , Adhesion is improved.
　プリプレグを積層する枚数は、熱伝導材料の厚み及び積層体から得たい熱伝導材料の枚数に応じて適宜選択することができるが、例えば、積層枚数が１００枚～２００枚であることが好ましい。 The number of prepregs to be laminated can be appropriately selected according to the thickness of the heat conductive material and the number of heat conductive materials desired to be obtained from the laminate, but for example, the number of layers is preferably 100 to 200.
　プリプレグとしては、炭素繊維を一定方向に整列させた状態で、炭素繊維に前記の樹脂組成物を含浸させた後、半硬化させた状態でシート状にした、いわゆる「ＵＤプリプレグ」と呼ばれるもの、あるいは、炭素繊維を縦横に織り込みできた炭素繊維シートに樹脂を含侵させた後、半硬化させた状態でシート状にした、「クロスプリプレグ」と呼ばれるものが挙げられる。これらの中でも、熱伝導性の点から、「ＵＤプリプレグ」が好ましい。 The prepreg is a so-called "UD prepreg" in which carbon fibers are aligned in a certain direction, the carbon fibers are impregnated with the above resin composition, and then semi-cured into a sheet. Alternatively, there is a so-called "cross prepreg" in which a carbon fiber sheet in which carbon fibers are woven vertically and horizontally is impregnated with a resin and then semi-cured into a sheet. Among these, "UD prepreg" is preferable from the viewpoint of thermal conductivity.
　プリプレグにおける樹脂の占める質量比は、熱伝導材料とした際の導電性をどの程度付与するかに応じて適宜選択することができるが、例えば、２０質量％～３５質量％が好ましい。 The mass ratio of the resin in the prepreg can be appropriately selected depending on how much conductivity is imparted when used as a heat conductive material, but is preferably 20% by mass to 35% by mass, for example.
　また、プリプレグの単位面積当たりの炭素繊維の質量であるＦ．Ａ．Ｗ（Ｆｉｂｅｒ Ａｒｅａｌ　Ｗｅｉｇｈｔ）値は、最終的に得られる熱伝導材料に付与する熱抵抗及び熱伝導率、更には硬化前の熱伝導材料に付与する柔軟性に応じて適宜選択することができるが、例えば、１００ｇ／ｍ２～２５０ｇ／ｍ２が好ましい。 Further, F.I., which is the mass of carbon fibers per unit area of the prepreg. A. The W (Fiber Real Weight) value can be appropriately selected depending on the thermal resistance and thermal conductivity imparted to the finally obtained heat conductive material, and further the flexibility imparted to the heat conductive material before curing. For example, 100 g / m 2 to 250 g / m 2 is preferable.
　プリプレグの厚みは、積層工程において支障がなく、また、熱伝導材料に付与する熱抵抗及び熱伝導率に応じて適宜選択することができるが、例えば、５０μｍ～１５０μｍが好ましい。 The thickness of the prepreg does not hinder the laminating process and can be appropriately selected depending on the thermal resistance and thermal conductivity applied to the heat conductive material, but is preferably 50 μm to 150 μm, for example.
　プリプレグとしては、適宜製造したものを使用してもよいし、市販品を使用してもよい。該市販品としては、例えば、グラノックプリプレグＮＴ８１２５０－５２５Ｓ、ＮＴ８１６００－５２０Ｓ、ＮＴ８１０００－５３０Ｓ、ＮＴ９１２５０－５２５Ｓ、ＮＴ９１５００－５２０Ｓ、ＮＴ６１０００－５２５Ｓ、ＮＴ６１３５０－５２０Ｓ（いずれも、日本グラファイトファイバー株式会社製、ピッチ系炭素繊維を熱硬化性樹脂に含侵させたプリプレグ）、ダイアリードプリプレグＨｙＥＪ１２Ｍ６５ＰＤ、ＨｙＥＪ２８Ｍ４５ＰＤ、ＨｙＥＪ１２Ｍ８０ＱＤ、ＨｙＥＪ３４Ｍ６５ＰＤ（いずれも、三菱ケミカル株式会社製、ピッチ系炭素繊維を用いたプリプレグ）、パイロフィルプリプレグＴＲ３５０Ｃ１２５、ＴＲ３５０Ｃ１５０、ＴＲ３５０Ｅ１００Ｒ、ＴＲ３５０Ｇ１７５Ｓ、ＭＲＸ３５０Ｃ１２５Ｓ（いずれも、三菱ケミカル株式会社製、ＰＡＮ系炭素繊維を用いたプリプレグ）などが挙げられる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。 As the prepreg, an appropriately manufactured prepreg may be used, or a commercially available product may be used. Examples of the commercially available products include Granock prepreg NT81250-525S, NT81600-520S, NT81000-530S, NT91250-525S, NT91500-520S, NT61000-525S, and NT61350-520S (all manufactured by Nippon Graphite Fiber Co., Ltd., Pitch). Prepreg in which carbon fiber is impregnated in a thermosetting resin), Dialead prepreg HyEJ12M65PD, HyEJ28M45PD, HyEJ12M80QD, HyEJ34M65PD (all prepreg using pitch carbon fiber manufactured by Mitsubishi Chemical Co., Ltd.), Pyrofil prepreg TR350C125 , TR350C150, TR350E100R, TR350G175S, MRX350C125S (all manufactured by Mitsubishi Chemical Co., Ltd., prepreg using PAN-based carbon fiber) and the like. These may be used alone or in combination of two or more.
　本発明の熱伝導材料に用いるプリプレグは、少なくとも樹脂組成物と炭素繊維からなる。この樹脂組成物は、熱硬化性樹脂を含むので、熱硬化性樹脂組成物が好適である。本発明の熱伝導材料に用いるプリプレグは同じ種類の熱硬化性樹脂組成物を使用しても、あるいは異なる種類の熱硬化性樹脂組成物を混合して使用してもよく、製造の容易さの観点から、同じ種類の熱硬化性樹脂組成物を使用することが好ましい。 The prepreg used for the heat conductive material of the present invention consists of at least a resin composition and carbon fibers. Since this resin composition contains a thermosetting resin, a thermosetting resin composition is suitable. The prepreg used for the heat conductive material of the present invention may use the same type of thermosetting resin composition or a mixture of different types of thermosetting resin compositions, and is easy to manufacture. From the viewpoint, it is preferable to use the same type of thermosetting resin composition.
－熱硬化性樹脂－
　熱硬化性樹脂としては、熱硬化性の官能基を有する化合物であれば特に制限はなく、目的に応じて適宜選択することができ、例えば、エポキシ樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、トリアジン樹脂、フェノール樹脂、メラミン樹脂、ポリエステル樹脂、シアネートエステル樹脂、シリコーン樹脂又はこれら樹脂の変性樹脂などが挙げられる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。これらの中でも、耐熱性と材料の選択性、及び密着性の観点から、エポキシ樹脂がより好ましい。 -Thermosetting resin-
The thermosetting resin is not particularly limited as long as it is a compound having a thermosetting functional group, and can be appropriately selected depending on the intended purpose. For example, epoxy resin, polyimide resin, polyamideimide resin, triazine resin, etc. Examples thereof include phenol resin, melamine resin, polyester resin, cyanate ester resin, silicone resin, and modified resins of these resins. These may be used alone or in combination of two or more. Among these, epoxy resin is more preferable from the viewpoint of heat resistance, material selectivity, and adhesion.
－エポキシ樹脂－
　エポキシ樹脂は、１つの分子の中に１つ以上のエポキシ基（－Ｃ３Ｈ５Ｏ）を含む化合物のうちの少なくとも１種である。これらの中でも、エポキシ樹脂は、１つの分子の中に２つ以上のエポキシ基を含んでいることが好ましい。エポキシ樹脂は、モノマーであっても、モノマーを硬化剤等により部分的に反応させたプレポリマーの状態であってもよい。 -Epoxy resin-
Epoxy resin is at least one of the compounds comprising one or more epoxy groups in one molecule (-C 3 H 5 O). Among these, the epoxy resin preferably contains two or more epoxy groups in one molecule. The epoxy resin may be a monomer or a prepolymer in which the monomer is partially reacted with a curing agent or the like.
　エポキシ樹脂としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、グリシジルエーテル型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ノボラック型エポキシ樹脂、環状脂肪族型エポキシ樹脂、長鎖脂肪族型エポキシ樹脂などが挙げられる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。 The epoxy resin is not particularly limited and may be appropriately selected depending on the intended purpose. For example, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, novolak type epoxy resin, cyclic aliphatic type. Examples thereof include epoxy resins and long-chain aliphatic epoxy resins. These may be used alone or in combination of two or more.
　グリシジルエーテル型エポキシ樹脂としては、例えば、ビスフェノールＡ型エポキシ樹脂及びビスフェノールＦ型エポキシ樹脂などが挙げられる。また、これらの骨格にエチレンオキサイド鎖を含むようにしたエチレンオキサイド変性型ビスフェノールＡ型エポキシ樹脂等でもよい。ノボラック型エポキシ樹脂としては、例えば、クレゾールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂などが挙げられる。この他、エポキシ樹脂の種類としては、例えば、難燃性エポキシ樹脂、ヒダントイン系エポキシ樹脂、イソシアヌレート系エポキシ樹脂などが挙げられる。 Examples of the glycidyl ether type epoxy resin include bisphenol A type epoxy resin and bisphenol F type epoxy resin. Further, an ethylene oxide-modified bisphenol A type epoxy resin or the like in which an ethylene oxide chain is contained in these skeletons may be used. Examples of the novolak type epoxy resin include cresol novolac type epoxy resin and phenol novolac type epoxy resin. In addition, examples of the type of epoxy resin include flame-retardant epoxy resin, hydantoin-based epoxy resin, and isocyanurate-based epoxy resin.
　エポキシ樹脂の性状については、特に制限はなく、プリプレグの製造のし易さや、プリプレグを積層したときの相互の融着性などを考慮して選択することができ、例えば、２５℃下において液状のエポキシ樹脂と固形状のエポキシ樹脂を混合して用いてもよいし、固形状のエポキシ樹脂を加熱溶融して２種以上混合してもよい。また、固形状のエポキシ樹脂においても、軟化点などは所望の物性に応じて適宜選択される。 The properties of the epoxy resin are not particularly limited and can be selected in consideration of the ease of manufacturing the prepreg and the mutual fusion property when the prepregs are laminated. For example, the epoxy resin is liquid at 25 ° C. The epoxy resin and the solid epoxy resin may be mixed and used, or the solid epoxy resin may be heated and melted and two or more kinds may be mixed. Further, even in the solid epoxy resin, the softening point and the like are appropriately selected according to desired physical properties.
－硬化剤－
　熱硬化性樹脂組成物は、更に硬化剤を少なくとも１種類含むことが好ましい。
　硬化剤としては、熱硬化性樹脂を熱硬化可能なものであれば特に制限はなく、適宜選択することができる。前記熱硬化性樹脂がエポキシ樹脂の場合の硬化剤としては、例えば、酸無水物系硬化剤、脂肪族アミン系硬化剤、芳香族アミン系硬化剤、フェノール系硬化剤、メルカプタン系硬化剤等の重付加型硬化剤、イミダゾール等の触媒型硬化剤などが挙げられる。また、エポキシ樹脂のグリシジル基に対しイミダゾールなどを過量反応させたアダクト型潜在性硬化剤や、更にこれをイソシアネートなどでマイクロカプセル化したマイクロカプセル型潜在性硬化剤などが挙げられる。 -Hardener-
The thermosetting resin composition preferably further contains at least one type of curing agent.
The curing agent is not particularly limited as long as the thermosetting resin can be thermally cured, and can be appropriately selected. When the thermosetting resin is an epoxy resin, examples of the curing agent include acid anhydride-based curing agents, aliphatic amine-based curing agents, aromatic amine-based curing agents, phenol-based curing agents, and mercaptan-based curing agents. Examples thereof include a heavy addition type curing agent and a catalytic type curing agent such as imidazole. Examples thereof include an adduct-type latent curing agent in which an imidazole or the like is excessively reacted with the glycidyl group of an epoxy resin, and a microcapsule-type latent curing agent in which this is microencapsulated with isocyanate or the like.
－硬化促進剤－
　熱硬化性樹脂組成物は、必要に応じて硬化促進剤を併用しても構わない。硬化促進剤を併用することで、更に十分に硬化させることができる。硬化促進剤の種類や含有量については特に制限はなく、目的に応じて適宜選択することができるが、反応速度、反応温度、及び保存安定性などの観点から、適切なものを選択することが好ましい。
　硬化促進剤としては、例えば、イミダゾール系化合物、有機リン系化合物、第３級アミン、第４級アンモニウム塩などが挙げられる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。 -Curing accelerator-
The thermosetting resin composition may be used in combination with a curing accelerator, if necessary. By using a curing accelerator in combination, it can be further sufficiently cured. The type and content of the curing accelerator are not particularly limited and may be appropriately selected depending on the intended purpose, but an appropriate one may be selected from the viewpoints of reaction rate, reaction temperature, storage stability and the like. preferable.
Examples of the curing accelerator include imidazole compounds, organic phosphorus compounds, tertiary amines, and quaternary ammonium salts. These may be used alone or in combination of two or more.
－その他の成分－
　熱硬化性樹脂組成物は、本発明の効果を損なわない限りにおいてその他の成分を含有してもよい。その他の成分としては、例えば、熱伝導性の向上及びプリプレグの強度の調整などの点から、酸化アルミニウム、窒化アルミニウム、窒化ホウ素等の無機フィラーを添加してもよい。また、熱硬化性樹脂組成物の流動性の調整の点から、ヒュームドシリカ等の金属酸化物の微粉末を添加してもよい。また、炭素繊維に対する樹脂の含浸性の点からは、例えば、シランカップリング剤、アルミニウムキレート等の助剤などを添加してもよい。 -Other ingredients-
The thermosetting resin composition may contain other components as long as the effects of the present invention are not impaired. As other components, for example, an inorganic filler such as aluminum oxide, aluminum nitride, or boron nitride may be added from the viewpoint of improving thermal conductivity and adjusting the strength of the prepreg. Further, from the viewpoint of adjusting the fluidity of the thermosetting resin composition, fine powder of a metal oxide such as fumed silica may be added. Further, from the viewpoint of the impregnation property of the resin with carbon fibers, for example, an auxiliary agent such as a silane coupling agent or an aluminum chelate may be added.
＜炭素繊維＞
　炭素繊維としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、ピッチ系炭素繊維、ＰＡＮ系炭素繊維、ＰＢＯ繊維を黒鉛化した炭素繊維、アーク放電法、レーザー蒸発法、ＣＶＤ法（化学気相成長法）、ＣＣＶＤ法（触媒化学気相成長法）等で合成された炭素繊維を用いることができる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。これらの中でも、熱伝導性の点から、ＰＢＯ繊維を黒鉛化した炭素繊維、ＰＡＮ繊維を黒鉛化した炭素繊維、ピッチ系炭素繊維が好ましく、ピッチ系炭素繊維が特に好ましい。 <Carbon fiber>
The carbon fiber is not particularly limited and may be appropriately selected depending on the intended purpose. For example, pitch-based carbon fiber, PAN-based carbon fiber, carbon fiber obtained by graphitizing PBO fiber, arc discharge method, laser evaporation method, etc. Carbon fibers synthesized by a CVD method (chemical vapor deposition method), a CCVD method (catalytic chemical vapor deposition method), or the like can be used. These may be used alone or in combination of two or more. Among these, from the viewpoint of thermal conductivity, carbon fibers obtained by graphitizing PBO fibers, carbon fibers obtained by graphitizing PAN fibers, and pitch-based carbon fibers are preferable, and pitch-based carbon fibers are particularly preferable.
　前記炭素繊維の平均繊維径（平均短軸長さ）としては、特に制限はなく、目的に応じて適宜選択することができるが、４μｍ～２０μｍであることが好ましく、５μｍ～１４μｍであることがより好ましい。 The average fiber diameter (average minor axis length) of the carbon fibers is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 4 μm to 20 μm, and is preferably 5 μm to 14 μm. More preferred.
　前記炭素繊維自体の熱伝導率としては、熱伝導材料にした際の所望の熱伝導率に応じて適宜選定されるが、１５０Ｗ／ｍ・Ｋ～１４００Ｗ／ｍ・Ｋが好ましい。 The thermal conductivity of the carbon fiber itself is appropriately selected according to the desired thermal conductivity when used as a heat conductive material, but is preferably 150 W / m · K to 1400 W / m · K.
　なお、炭素繊維は、含侵される樹脂との親和性向上の点から、例えば、エポキシ樹脂などが表面に塗布されていてもよい。 The surface of the carbon fiber may be coated with, for example, an epoxy resin from the viewpoint of improving the affinity with the impregnated resin.
＜切断工程＞
　切断工程は、前記プリプレグ積層体を、炭素繊維の配向方向と略垂直方向に切断する工程である。
　切断は、例えば、スライス装置を用いて行われる。スライス装置としては、プリプレグ積層体を切断できる手段であれば特に制限はなく、公知のスライス装置を適宜用いることができ、例えば、超音波カッター、かんな（鉋）などが挙げられる。 <Cutting process>
The cutting step is a step of cutting the prepreg laminate in a direction substantially perpendicular to the orientation direction of the carbon fibers.
Cutting is performed using, for example, a slicing device. The slicing device is not particularly limited as long as it is a means capable of cutting the prepreg laminate, and a known slicing device can be appropriately used, and examples thereof include an ultrasonic cutter and a plane (plane).
＜その他の工程＞
　その他の工程としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、表面被覆工程、シート作製工程などが挙げられる。 <Other processes>
The other steps are not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a surface coating step and a sheet manufacturing step.
（熱伝導材料）
　本発明の熱伝導材料は、少なくとも炭素繊維に含侵された熱硬化性樹脂組成物の半硬化物であり、前記炭素繊維が厚み方向に配向した積層体である。
　炭素繊維、熱硬化性樹脂などについては、熱伝導材料の製造方法で説明したものと同様のものを用いることができる。
　半硬化物とは、プリプレグ積層体が加熱硬化（完全硬化）していない状態を意味し、プリプレグ積層体が発熱体と放熱部材との間で柔軟性を有しており、発熱体と放熱部材の各々の表面形状への追従性を有している状態を意味する。
　熱伝導材料の半硬化物を発熱体や放熱部材等に接触するように配置した後、更に加熱等によって本硬化させることにより、硬化物である熱伝導材料を含む層と発熱体や放熱部材との密着性がより向上する。 (Heat conductive material)
The heat conductive material of the present invention is at least a semi-cured product of a thermosetting resin composition impregnated with carbon fibers, and is a laminate in which the carbon fibers are oriented in the thickness direction.
As the carbon fiber, the thermosetting resin, and the like, the same ones as described in the method for producing a heat conductive material can be used.
The semi-cured product means a state in which the prepreg laminate is not heat-cured (completely cured), the prepreg laminate has flexibility between the heating element and the heat radiating member, and the heating element and the heat radiating member are provided. It means a state having the ability to follow each surface shape of.
After arranging the semi-cured material of the heat conductive material so as to come into contact with the heating element, heat radiating member, etc., the layer containing the heat conductive material, which is the cured product, and the heating element, heat radiating member, etc. are further cured by heating or the like. Adhesion is further improved.
　熱伝導材料の形状、厚みなどについては特に制限はなく、目的に応じて適宜選択することができる。
　熱伝導材料の形状としては、例えば、シート状、平板状などが挙げられる。
　熱伝導材料の厚みについては、特に制限はなく、用途に応じて適宜設定することができるが、０．１ｍｍ～３．０ｍｍが好ましい。 The shape, thickness, and the like of the heat conductive material are not particularly limited and can be appropriately selected depending on the intended purpose.
Examples of the shape of the heat conductive material include a sheet shape and a flat plate shape.
The thickness of the heat conductive material is not particularly limited and can be appropriately set depending on the intended use, but is preferably 0.1 mm to 3.0 mm.
（放熱構造体の製造方法）
　本発明の放熱構造体の製造方法は、発熱体と、熱伝導材料と、放熱部材とから構成される放熱構造体を製造する方法であって、
　前記発熱体と前記放熱部材の間に、本発明の熱伝導材料の製造方法によって製造された熱伝導材料の半硬化物を挟持し、前記熱伝導材料の半硬化物を加熱し、硬化させる。 (Manufacturing method of heat dissipation structure)
The method for manufacturing a heat radiating structure of the present invention is a method for manufacturing a heat radiating structure composed of a heating element, a heat conductive material, and a heat radiating member.
A semi-cured product of the heat conductive material produced by the method for producing a heat conductive material of the present invention is sandwiched between the heating element and the heat radiation member, and the semi-cured product of the heat conductive material is heated and cured.
　まず、発熱体と放熱部材との間に本発明の熱伝導材料の製造方法によって製造された熱伝導材料の半硬化物を挟持させ、発熱体、放熱部材それぞれの表面形状に追従するように熱伝導材料の半硬化物を配置する。 First, a semi-cured product of the heat conductive material produced by the method for producing a heat conductive material of the present invention is sandwiched between the heat generating body and the heat radiating member, and heat is generated so as to follow the surface shapes of the heat generating body and the heat radiating member. Place a semi-cured material of conductive material.
　次に、この状態で熱伝導材料の半硬化物を加熱する。熱伝導材料の半硬化物を加熱する手段としては、例えば、リフロー炉を通すことで発熱体と放熱部材と共に加熱されてもよいし、オーブンで加熱してもよい。発熱体が半導体チップ又は半導体素子あるいは抵抗器などである場合には、通電させることでこれらを発熱させてもよい。 Next, in this state, the semi-cured material of the heat conductive material is heated. As a means for heating the semi-cured product of the heat conductive material, for example, it may be heated together with the heating element and the heat radiating member by passing it through a reflow furnace, or it may be heated in an oven. When the heating element is a semiconductor chip, a semiconductor element, a resistor, or the like, these may be generated by energizing them.
　加熱前の熱伝導材料の半硬化物は、非加熱下でプリプレグが積層されたプリプレグ積層体から切断された状態であるから、樹脂の状態は半硬化状態である。発熱体と放熱部材の間に熱伝導材料の半硬化物を挟持させた状態で加熱して、熱伝導材料の半硬化物を完全硬化させる。 Since the semi-cured product of the heat conductive material before heating is in a state of being cut from the prepreg laminated body in which the prepreg is laminated without heating, the resin state is in a semi-cured state. The semi-cured product of the heat conductive material is completely cured by heating with the semi-cured product of the heat conductive material sandwiched between the heating element and the heat radiating member.
　発熱体と放熱部材の間に熱伝導材料の半硬化物を挟持させた状態で完全硬化させることで、発熱体と放熱部材への密着性を維持したまま、更にそれぞれに対して接着されることになり、完全硬化した熱伝導材料を発熱体と放熱部材との間に配置する場合に比べて、より放熱性及び密着性に優れた放熱構造体とすることができる。 By completely curing the semi-cured material of the heat conductive material while sandwiching it between the heating element and the heat radiating member, it is further adhered to each while maintaining the adhesion between the heating element and the heat radiating member. Therefore, a heat radiating structure having more excellent heat radiating property and adhesion can be obtained as compared with the case where the completely cured heat conductive material is arranged between the heat generating body and the heat radiating member.
（放熱構造体）
　本発明の放熱構造体は、発熱体と、熱伝導材料と、放熱部材とから構成される放熱構造体であって、
　前記発熱体と前記放熱部材の間に、本発明の熱伝導材料の硬化物を有し、
　前記発熱体及び前記放熱部材と前記熱伝導材料の硬化物とが密着性を有する。
　ここで、前記密着性とは、ステンレス板と銅箔を熱伝導材料で貼り合せ、１５０℃で１時間硬化した後に、室温下で測定した、引っ張り速度５０ｍｍ／ｍｉｎでの９０°剥離試験の剥離力が１Ｎ／ｃｍ以上であることをいう。
　室温下とは、非加熱環境下であることを意味し、例えば、２０℃～３０℃の温度を意味する。 (Heat dissipation structure)
The heat radiating structure of the present invention is a heat radiating structure composed of a heating element, a heat conductive material, and a heat radiating member.
A cured product of the heat conductive material of the present invention is held between the heating element and the heat radiating member.
The heating element, the heat radiating member, and the cured product of the heat conductive material have adhesiveness.
Here, the adhesiveness means peeling of a 90 ° peeling test at a tensile speed of 50 mm / min, which is measured at room temperature after the stainless steel plate and the copper foil are bonded together with a heat conductive material and cured at 150 ° C. for 1 hour. It means that the force is 1 N / cm or more.
The term "room temperature" means that the environment is not heated, and means, for example, a temperature of 20 ° C to 30 ° C.
　放熱構造体としては、例えば、電子部品等の発熱体と、ヒートシンク、ヒートパイプ、ヒートスプレッダ等の放熱部材と、発熱体と放熱部材に挟持された熱伝導材料とからなる。 The heat-dissipating structure includes, for example, a heating element such as an electronic component, a heat-dissipating member such as a heat sink, a heat pipe, and a heat spreader, and a heat conductive material sandwiched between the heating element and the heat-dissipating member.
　電子部品としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、ＣＰＵ（Ｃｅｎｔｒａｌ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ）、ＭＰＵ（Ｍｉｃｒｏ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ）、ＧＰＵ（Ｇｒａｐｈｉｃｓ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ）などが挙げられる。 The electronic component is not particularly limited and may be appropriately selected according to the purpose. Examples thereof include a CPU (Central Processing Unit), an MPU (Micro Processing Unit), and a GPU (Graphics Processing Unit).
　放熱構造体としては、電子部品（発熱体）の発する熱を放熱する構造体であれば、特に制限はなく、目的に応じて適宜選択することができ、例えば、ヒートスプレッダ、ヒートシンク、ベーパーチャンバー、ヒートパイプなどが挙げられる。
　前記ヒートスプレッダは、前記電子部品の熱を他の部品に効率的に伝えるための部材である。前記ヒートスプレッダの材質としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、銅、アルミニウムなどが挙げられる。前記ヒートスプレッダは、通常、平板形状である。
　前記ヒートシンクは、前記電子部品の熱を空気中に放出するための部材である。前記ヒートシンクの材質としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、銅、アルミニウムなどが挙げられる。前記ヒートシンクは、例えば、複数のフィンを有する。前記ヒートシンクは、例えば、ベース部と、前記ベース部の一方の面に対して非平行方向（例えば、直交する方向）に向かって延びるように設けられた複数のフィンを有する。
　前記ヒートスプレッダ、及び前記ヒートシンクは、一般的に、内部に空間を持たない中実構造である。
　前記ベーパーチャンバーは、中空構造体である。前記中空構造体の内部空間には、揮発性の液体が封入されている。前記ベーパーチャンバーとしては、例えば、前記ヒートスプレッダを中空構造にしたもの、前記ヒートシンクを中空構造にしたような板状の中空構造体などが挙げられる。
　前記ヒートパイプは、円筒状、略円筒状、又は扁平筒状の中空構造体である。前記中空構造体の内部空間には、揮発性の液体が封入されている。 The heat radiating structure is not particularly limited as long as it is a structure that radiates heat generated by an electronic component (heating body), and can be appropriately selected according to the purpose. For example, a heat spreader, a heat sink, a vapor chamber, and heat. Examples include pipes.
The heat spreader is a member for efficiently transferring the heat of the electronic component to other components. The material of the heat spreader is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include copper and aluminum. The heat spreader usually has a flat plate shape.
The heat sink is a member for releasing the heat of the electronic component into the air. The material of the heat sink is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include copper and aluminum. The heat sink has, for example, a plurality of fins. The heat sink has, for example, a base portion and a plurality of fins provided so as to extend in a direction non-parallel (for example, in a direction orthogonal to the base portion) with respect to one surface of the base portion.
The heat spreader and the heat sink generally have a solid structure having no space inside.
The vapor chamber is a hollow structure. A volatile liquid is sealed in the internal space of the hollow structure. Examples of the vapor chamber include a heat spreader having a hollow structure, a plate-shaped hollow structure having a heat sink having a hollow structure, and the like.
The heat pipe is a hollow structure having a cylindrical shape, a substantially cylindrical shape, or a flat tubular shape. A volatile liquid is sealed in the internal space of the hollow structure.
　ここで、図１は、本発明の放熱構造体の一例としての半導体装置の概略図である。この図１は、半導体装置の一例の概略断面図である。本発明の熱伝導シート１は、半導体素子等の電子部品３の発する熱を放熱するものであり、図１に示すように、ヒートスプレッダ２の電子部品３と対峙する主面２ａに固定され、電子部品３と、ヒートスプレッダ２との間に挟持されるものである。また、熱伝導シート１は、ヒートスプレッダ２とヒートシンク５との間に挟持される。そして、熱伝導シート１は、ヒートスプレッダ２とともに、電子部品３の熱を放熱する放熱部材を構成する。 Here, FIG. 1 is a schematic view of a semiconductor device as an example of the heat dissipation structure of the present invention. FIG. 1 is a schematic cross-sectional view of an example of a semiconductor device. The heat conductive sheet 1 of the present invention dissipates heat generated by an electronic component 3 such as a semiconductor element, and as shown in FIG. 1, is fixed to a main surface 2a facing the electronic component 3 of the heat spreader 2 and has electrons. It is sandwiched between the component 3 and the heat spreader 2. Further, the heat conductive sheet 1 is sandwiched between the heat spreader 2 and the heat sink 5. Then, the heat conductive sheet 1 together with the heat spreader 2 constitutes a heat radiating member that dissipates heat from the electronic component 3.
　ヒートスプレッダ２は、例えば、方形板状に形成され、電子部品３と対峙する主面２ａと、主面２ａの外周に沿って立設された側壁２ｂとを有する。ヒートスプレッダ２は、側壁２ｂに囲まれた主面２ａに熱伝導シート１が設けられ、また主面２ａと反対側の他面２ｃに熱伝導シート１を介してヒートシンク５が設けられる。ヒートスプレッダ２は、高い熱伝導率を有するほど、熱抵抗が減少し、効率よく半導体素子等の電子部品３の熱を吸熱することから、例えば、熱伝導性の良好な銅やアルミニウムを用いて形成することができる。 The heat spreader 2 has, for example, a main surface 2a formed in a square plate shape and facing the electronic component 3, and a side wall 2b erected along the outer circumference of the main surface 2a. In the heat spreader 2, the heat conductive sheet 1 is provided on the main surface 2a surrounded by the side wall 2b, and the heat sink 5 is provided on the other surface 2c on the opposite side of the main surface 2a via the heat conductive sheet 1. The heat spreader 2 has a higher thermal conductivity, the lower the thermal resistance, and efficiently absorbs the heat of the electronic component 3 such as a semiconductor element. Therefore, the heat spreader 2 is formed by using, for example, copper or aluminum having good thermal conductivity. can do.
　電子部品３は、例えば、ＢＧＡ等の半導体素子であり、配線基板６へ実装される。またヒートスプレッダ２も、側壁２ｂの先端面が配線基板６に実装され、これにより側壁２ｂによって所定の距離を隔てて電子部品３を囲んでいる。 The electronic component 3 is, for example, a semiconductor element such as a BGA, and is mounted on the wiring board 6. Further, in the heat spreader 2, the tip surface of the side wall 2b is mounted on the wiring board 6, whereby the side wall 2b surrounds the electronic component 3 at a predetermined distance.
　そして、ヒートスプレッダ２の主面２ａに、熱伝導シート１が接着されることにより、電子部品３の発する熱を吸収し、ヒートシンク５より放熱する放熱部材が形成される。ヒートスプレッダ２と熱伝導シート１との接着は、熱伝導シート１自身の密着力によって行うことができる。 Then, by adhering the heat conductive sheet 1 to the main surface 2a of the heat spreader 2, a heat radiating member that absorbs the heat generated by the electronic component 3 and dissipates heat from the heat sink 5 is formed. Adhesion between the heat spreader 2 and the heat conductive sheet 1 can be performed by the adhesive force of the heat conductive sheet 1 itself.
（シリコンウェーハ）
　本発明の放熱構造体及びその製造方法としては、以下のような態様も挙げられる。
　図２の（Ａ）に示すように、半導体回路が形成されたシリコンウェーハ１２の、回路形成面と対向する面に本発明の熱伝導材料１１を貼り合せる。
　次に、この状態のシリコンウェーハを、ダイシングテープの設けられたダイシングフレームにセットした後、ダイサーなどを用いて熱伝導材料付き半導体チップとして個片化する（図２の（Ｂ）、（Ｃ）参照）。 (Silicon wafer)
The heat radiating structure of the present invention and a method for manufacturing the same include the following aspects.
As shown in FIG. 2A, the heat conductive material 11 of the present invention is bonded to the surface of the silicon wafer 12 on which the semiconductor circuit is formed, which faces the circuit forming surface.
Next, the silicon wafer in this state is set in a dicing frame provided with a dicing tape, and then individualized as a semiconductor chip with a heat conductive material using a dicer or the like (FIGS. 2B and 2C). reference).
　次に、図２（Ｄ）に示すように、個片化した熱伝導材料付き半導体チップ１３を、例えば、有機基板１５にマウントした後、ヒートスプレッダやヒートシンク等の放熱部材１４と接触するように設置する。図２の（Ｄ）中１１は本発明の熱伝導材料、１６は半田である。 Next, as shown in FIG. 2D, the semiconductor chip 13 with a heat conductive material that has been separated is mounted on, for example, an organic substrate 15 and then installed so as to come into contact with a heat radiating member 14 such as a heat spreader or a heat sink. do. In FIG. 2D, 11 is the heat conductive material of the present invention, and 16 is solder.
　その後、例えば、熱伝導材料付き半導体チップの有機基板に対する実装と、ヒートスプレッダ等の放熱部材の半導体チップへの接着を、リフロー炉で加熱しながら一括で実施する。 After that, for example, mounting the semiconductor chip with the heat conductive material on the organic substrate and adhering the heat radiation member such as the heat spreader to the semiconductor chip are collectively performed while heating in the reflow furnace.
　以上のような工程を経ることで、発熱体である電子部品（半導体チップ）の基板への実装と、電子部品とヒートスプレッダやヒートシンクなどの放熱部材とを接着する工程を同時に行うことができ、より一層の生産効率の向上を図ることができる。 By going through the above steps, it is possible to simultaneously perform the steps of mounting the electronic component (semiconductor chip), which is a heating element, on the substrate and bonding the electronic component to the heat radiation member such as the heat spreader or heat sink. It is possible to further improve the production efficiency.
（電子機器）
　本発明の電子機器は、本発明の放熱構造体を有する。
　電子機器の一例として、電子部品として半導体素子を用いた半導体装置などが挙げられる。 (Electronics)
The electronic device of the present invention has the heat dissipation structure of the present invention.
An example of an electronic device is a semiconductor device using a semiconductor element as an electronic component.
　以下、本発明の実施例を説明するが、本発明は、これらの実施例に何ら限定されるものではない。 Hereinafter, examples of the present invention will be described, but the present invention is not limited to these examples.
　ＵＤプリプレグとして、幅１０ｃｍ、長さ５ｃｍのグラノックプリプレグＮＴ８１２５０－５２５Ｓ（炭素繊維の直径１０μｍ、Ｆ．Ａ．Ｗ値１２５ｇ／ｍ２、熱硬化性樹脂組成物含有量２５質量％、厚み９０μｍ、日本グラファイトファイバー株式会社製）を、炭素繊維の配向方向が同一方向になるように積層した。室温（２５℃）下で積層し、１枚積層毎にハンドローラーで加圧し、最終的に１８０枚積層した。高さ２３ｍｍ×幅１０ｃｍ×長さ５ｃｍのプリプレグ積層体を得た。次に、炭素繊維の配向方向と略垂直方向にプリプレグ積層体をスライスし、厚み方向に炭素繊維が配向した厚さ３００μｍ（０．３ｍｍ）の半硬化状態の熱伝導材料を得た。 As a UD prepreg, Granock prepreg NT81250-525S having a width of 10 cm and a length of 5 cm (carbon fiber diameter 10 μm, FAW value 125 g / m 2 , thermosetting resin composition content 25 mass%, thickness 90 μm, Nippon Graphite Fiber Co., Ltd.) was laminated so that the orientation directions of the carbon fibers were the same. They were laminated at room temperature (25 ° C.), pressed with a hand roller for each layer, and finally 180 sheets were laminated. A prepreg laminate having a height of 23 mm, a width of 10 cm, and a length of 5 cm was obtained. Next, the prepreg laminate was sliced in a direction substantially perpendicular to the orientation direction of the carbon fibers to obtain a heat conductive material having a thickness of 300 μm (0.3 mm) in which the carbon fibers were oriented in the thickness direction in a semi-cured state.
　次に、得られた半硬化状態の熱伝導材料について、以下のようにして、熱抵抗及び厚みを測定し、密着性を評価した。結果を表１に示した。 Next, with respect to the obtained semi-cured heat conductive material, the thermal resistance and thickness were measured as follows, and the adhesion was evaluated. The results are shown in Table 1.
＜熱抵抗の測定＞
　得られた半硬化状態の熱伝導材料を、直径２０ｍｍの円形になるように切断し、銅板で挟持した後に、１５０℃で１時間加熱し、熱伝導材料を硬化させたテストピースを得た。
　得られたテストピースの熱抵抗［℃・ｃｍ２／Ｗ］を、ＡＳＴＭ－Ｄ５４７０に準拠した方法で３ｋｇｆ／ｃｍ２の荷重で測定した。
　また、熱硬化後の熱伝導材料の厚みを、隙間ゲージを用いて測定した。 <Measurement of thermal resistance>
The obtained semi-cured heat conductive material was cut into a circle having a diameter of 20 mm, sandwiched between copper plates, and then heated at 150 ° C. for 1 hour to obtain a test piece obtained by curing the heat conductive material.
The thermal resistance [° C. cm 2 / W] of the obtained test piece was measured with a load of 3 kgf / cm 2 by a method according to ASTM-D5470.
In addition, the thickness of the heat conductive material after thermosetting was measured using a feeler gauge.
＜密着性の評価＞
　ポリイミドフィルムを裏打ち材とした銅箔を１０ｍｍ×１００ｍｍに切断した。この試験片に厚み０．３ｍｍの半硬化状態である熱伝導材料を銅箔の端部から幅１０ｍｍ×長さ５０ｍｍになるように貼り付けた。半硬化状態にある熱伝導材料を貼り付けた銅箔を、ＪＩＳ　Ｇ４３０５に準拠したＳＵＳ３０４板上に２ｋｇのローラーで１往復して貼り付けた。この状態で、１５０℃で１時間加熱して熱伝導材料を硬化後、室温（２５℃）下で２４時間静置しサンプルとした。
　このサンプルを材料試験機（テンシロンＲＴＧ１２５０、エー・アンド・デイ株式会社製）にセットし、引っ張り速度５０ｍｍ／ｍｉｎで９０℃剥離試験に供して剥離力を測定し、下記基準により、密着性を評価した。
［密着性の評価基準］
　　〇：密着性を有している；９０°剥離試験の剥離力が１Ｎ／ｃｍ以上
　　×：密着性を有していない；９０°剥離試験の剥離力が１Ｎ／ｃｍ未満 <Evaluation of adhesion>
A copper foil using a polyimide film as a backing material was cut into 10 mm × 100 mm. A semi-cured heat conductive material having a thickness of 0.3 mm was attached to this test piece so as to have a width of 10 mm and a length of 50 mm from the end of the copper foil. The copper foil to which the semi-cured heat conductive material was attached was attached to a SUS304 plate conforming to JIS G4305 by reciprocating once with a 2 kg roller. In this state, the heat conductive material was cured by heating at 150 ° C. for 1 hour, and then allowed to stand at room temperature (25 ° C.) for 24 hours to prepare a sample.
This sample was set in a material testing machine (Tencilon RTG1250, manufactured by A & D Co., Ltd.) and subjected to a 90 ° C peeling test at a tensile speed of 50 mm / min to measure the peeling force and evaluate the adhesion according to the following criteria. bottom.
[Adhesion evaluation criteria]
〇: Adhesiveness; 90 ° peeling test peeling force of 1 N / cm or more ×: No adhesiveness; 90 ° peeling test peeling force of less than 1 N / cm
（比較例１）
＜熱抵抗＞
　実施例１において、銅板に挟む前に、熱伝導材料を１５０℃で１時間加熱して熱伝導材料を硬化させた以外は、実施例１と同様の条件で熱伝導材料とテストピースを得た。このテストピースについて実施例１と同様にして、熱抵抗及び厚みを測定した。結果を表１に示した。 (Comparative Example 1)
<Thermal resistance>
In Example 1, a heat conductive material and a test piece were obtained under the same conditions as in Example 1 except that the heat conductive material was heated at 150 ° C. for 1 hour to cure the heat conductive material before being sandwiched between copper plates. .. The thermal resistance and thickness of this test piece were measured in the same manner as in Example 1. The results are shown in Table 1.
＜密着性＞
　実施例１において、ポリイミドフィルムを裏打ち材とした銅箔に厚み０．３ｍｍの半硬化状態の熱伝導材料を貼り付けた後、そのまま、１５０℃で１時間加熱硬化した。これをＳＵＳ３０４板に貼り付けようとしたが、貼り付けることができなかった（剥離力測定不能）。結果を表１に示した。 <Adhesion>
In Example 1, a semi-cured heat conductive material having a thickness of 0.3 mm was attached to a copper foil backed by a polyimide film, and then heat-cured at 150 ° C. for 1 hour. I tried to attach this to the SUS304 board, but I could not attach it (peeling force cannot be measured). The results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000001
 　表１の結果から、実施例１は、炭素繊維を含有する熱伝導材料を得る時点では加熱硬化させておらず、銅板で挟持した後に加熱硬化しているため、銅板の表面形状に追従し且つ銅板と接着されており、密着性及び熱伝導性が良好であり、熱抵抗が低くなることがわかった。
　一方、比較例１は、得られた熱伝導材料を加熱硬化した後に銅板で挟持しているため、銅板の表面形状への追従性が低く、密着性も悪いため、実施例１と比較して熱抵抗が高くなることがわかった。
Figure JPOXMLDOC01-appb-T000001
 From the results in Table 1, Example 1 was not heat-cured at the time of obtaining the heat conductive material containing carbon fibers, and was heat-cured after being sandwiched between copper plates. It was found that it was adhered to the copper plate, had good adhesion and thermal conductivity, and had low thermal resistance.
On the other hand, in Comparative Example 1, since the obtained heat conductive material is sandwiched between copper plates after being heat-cured, the followability to the surface shape of the copper plate is low and the adhesion is poor, so that it is compared with Example 1. It was found that the thermal resistance increased.
　　　１　　　熱伝導材料（熱伝導シート）
　　　２　　　放熱部材（ヒートスプレッダ）
　　２ａ　　　主面
　　　３　　　発熱体（電子部品）
　　３ａ　　　上面
　　　５　　　放熱部材（ヒートシンク）
　　　６　　　配線基板 1 Heat conductive material (heat conductive sheet)
2 Heat dissipation member (heat spreader)
2a Main surface 3 Heating element (electronic component)
3a Top surface 5 Heat dissipation member (heat sink)
6 Wiring board

Claims (9)

  1. 　炭素繊維が一定方向に配向したプリプレグを前記炭素繊維の配向方向を揃えて積層し、室温下で加圧してプリプレグ積層体を得る積層工程を含むことを特徴とする熱伝導材料の製造方法。 A method for producing a heat conductive material, which comprises a laminating step of laminating prepregs in which carbon fibers are oriented in a certain direction so that the orientation directions of the carbon fibers are aligned and pressurizing at room temperature to obtain a prepreg laminate.
  2. 　前記プリプレグ積層体を、前記炭素繊維の配向方向と略垂直方向に切断する切断工程とを含む請求項１に記載の熱伝導材料の製造方法。 The method for producing a heat conductive material according to claim 1, further comprising a cutting step of cutting the prepreg laminate in a direction substantially perpendicular to the orientation direction of the carbon fibers.
  3. 　前記炭素繊維がピッチ系炭素繊維である、請求項１から２のいずれかに記載の熱伝導材料の製造方法。 The method for producing a heat conductive material according to any one of claims 1 to 2, wherein the carbon fiber is a pitch-based carbon fiber.
  4. 　前記プリプレグが前記炭素繊維を熱硬化性樹脂に含侵させて得られたものである、請求項１から３のいずれかに記載の熱伝導材料の製造方法。 The method for producing a heat conductive material according to any one of claims 1 to 3, wherein the prepreg is obtained by impregnating the carbon fibers with a thermosetting resin.
  5. 　少なくとも炭素繊維を含む熱硬化性樹脂組成物の半硬化物であり、前記炭素繊維が厚み方向に配向した積層体であることを特徴とする熱伝導材料。 A semi-cured product of a thermosetting resin composition containing at least carbon fibers, which is a heat conductive material characterized by being a laminate in which the carbon fibers are oriented in the thickness direction.
  6. 　発熱体と、熱伝導材料と、放熱部材とから構成される放熱構造体を製造する方法であって、
    　前記発熱体と前記放熱部材の間に、請求項１から４のいずれかに記載の熱伝導材料の製造方法によって製造された熱伝導材料の半硬化物を挟持し、前記熱伝導材料の半硬化物を加熱し、硬化させることを特徴とする放熱構造体の製造方法。     It is a method of manufacturing a heat radiating structure composed of a heating element, a heat conductive material, and a heat radiating member.
    A semi-cured product of the heat conductive material produced by the method for producing a heat conductive material according to any one of claims 1 to 4 is sandwiched between the heat generating body and the heat radiating member, and the heat conductive material is semi-cured. A method for manufacturing a heat-dissipating structure, which comprises heating and hardening an object.
  7. 　発熱体と、熱伝導材料と、放熱部材とから構成される放熱構造体であって、
    　前記発熱体と前記放熱部材の間に、請求項５に記載の熱伝導材料の硬化物を有し、
    　前記発熱体及び前記放熱部材と前記熱伝導材料の硬化物とが密着性を有することを特徴とする放熱構造体。
    　ここで、前記密着性とは、ステンレス板と銅箔を熱伝導材料で貼り合せ、１５０℃で１時間硬化した後に、室温下で測定した、引っ張り速度５０ｍｍ／ｍｉｎでの９０°剥離試験の剥離力が１Ｎ／ｃｍ以上であることをいう。     A heat-dissipating structure composed of a heating element, a heat-conducting material, and a heat-dissipating member.
    A cured product of the heat conductive material according to claim 5 is provided between the heating element and the heat radiating member.
    A heat radiating structure characterized in that the heating element, the heat radiating member, and a cured product of the heat conductive material have adhesiveness.
    Here, the adhesiveness means peeling of a 90 ° peeling test at a tensile speed of 50 mm / min, which is measured at room temperature after the stainless steel plate and the copper foil are bonded together with a heat conductive material and cured at 150 ° C. for 1 hour. It means that the force is 1 N / cm or more.
  8. 　請求項７に記載の放熱構造体を有することを特徴とする電子機器。 An electronic device having the heat dissipation structure according to claim 7.
  9. 　請求項５に記載の熱伝導材料を有することを特徴とするシリコンウェーハ。 A silicon wafer characterized by having the heat conductive material according to claim 5.
PCT/JP2021/006748 2020-03-09 2021-02-24 Thermally conductive material and method for producing same, heat dissipation structure and method for producing same, and electronic device WO2021182098A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002046137A (en) * 2000-08-04 2002-02-12 Nippon Graphite Fiber Corp Method for manufacturing thermally conductive sheet
JP2010050239A (en) * 2008-08-21 2010-03-04 Hitachi Ltd Heat dissipation sheet, laminate for heat dissipation using the same, and semiconductor device
JP2015164229A (en) * 2015-06-02 2015-09-10 公益財団法人鉄道総合技術研究所 heat conductive sheet
WO2018061712A1 (en) * 2016-09-28 2018-04-05 デクセリアルズ株式会社 Electromagnetic wave absorbing heat transfer sheet, method for producing electromagnetic wave absorbing heat transfer sheet, and semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002046137A (en) * 2000-08-04 2002-02-12 Nippon Graphite Fiber Corp Method for manufacturing thermally conductive sheet
JP2010050239A (en) * 2008-08-21 2010-03-04 Hitachi Ltd Heat dissipation sheet, laminate for heat dissipation using the same, and semiconductor device
JP2015164229A (en) * 2015-06-02 2015-09-10 公益財団法人鉄道総合技術研究所 heat conductive sheet
WO2018061712A1 (en) * 2016-09-28 2018-04-05 デクセリアルズ株式会社 Electromagnetic wave absorbing heat transfer sheet, method for producing electromagnetic wave absorbing heat transfer sheet, and semiconductor device

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