WO2021176915A1 - Photoelectric sensor - Google Patents

Photoelectric sensor Download PDF

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Publication number
WO2021176915A1
WO2021176915A1 PCT/JP2021/003527 JP2021003527W WO2021176915A1 WO 2021176915 A1 WO2021176915 A1 WO 2021176915A1 JP 2021003527 W JP2021003527 W JP 2021003527W WO 2021176915 A1 WO2021176915 A1 WO 2021176915A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
light
mounting surface
opening
light receiving
Prior art date
Application number
PCT/JP2021/003527
Other languages
French (fr)
Japanese (ja)
Inventor
大揮 篠原
保嘉 澤田
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to CN202180013250.7A priority Critical patent/CN115053313A/en
Priority to KR1020227028694A priority patent/KR20220124268A/en
Publication of WO2021176915A1 publication Critical patent/WO2021176915A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/12—Movable parts; Contacts mounted thereon
    • H01H13/14—Operating parts, e.g. push-button
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H35/00—Switches operated by change of a physical condition

Definitions

  • the present invention relates to a photoelectric sensor.
  • a fiber-type photoelectric sensor in which an optical fiber for light projection and an optical fiber for light reception are inserted and removed is known (see, for example, Patent Document 1).
  • the fiber-type photoelectric sensor detects whether or not the detection light projected onto the light projecting optical fiber is reflected by the detection target and returns to the light receiving optical fiber, or to what extent. This is a sensor that determines the presence / absence of a detection target and its distance. If the object to be detected is made of a translucent material, it is possible to detect the presence or absence of the object to be detected depending on whether the detected light is transmitted and the amount of light is attenuated.
  • Photoelectric sensors often have an operation unit that adjusts the detection level and switches the operation mode.
  • the operation unit includes a push button
  • the operation force for the user to press the push button becomes an excessive load, which may cause distortion of the peripheral portion of the light projecting element and the light receiving element.
  • the detection light of the photoelectric sensor is often used after being precisely adjusted according to the characteristics of the detection target so that the presence or absence of the detection target and its distance can be determined. Distortion in the peripheral portion of the element may cause a decrease in detection accuracy.
  • the present invention has been made to solve such a problem, and is a photoelectric sensor having a simple structure for preventing an excessive load from being applied to the peripheral portions of the light emitting element and the light receiving element by a user's pressing operation. Is to provide.
  • the photoelectric sensor is a housing having an opening, and a first substrate which is a hard substrate that divides the internal space of the housing into a first space on the opening side and a second space on the opposite side.
  • the light projecting element that projects the detection light onto the light projecting optical fiber, the light receiving element that receives the detected light from the light receiving optical fiber, and the light projecting element and the light receiving element are mounted close to one side of the mounting surface.
  • the second substrate which is connected to the third substrate on which the light projecting element and the light receiving element are mounted on one side and is accommodated in the second space, and one of the second substrates among the mounting surfaces of the first substrate.
  • a light emitting element mounted in a region corresponding to the side and presenting information toward the opening, and mounted in a region of the mounting surface of the first substrate opposite to one side of the second substrate, and opened. It is provided with a switch that receives a user's operating force from the unit to the first substrate.
  • the photoelectric sensor often includes a display unit together with an operation unit.
  • the display unit is arranged on the hard substrate closer to the light emitting / receiving element side, and the operation unit is arranged on the distant side. I did.
  • the switches constituting the push buttons are mounted on the hard board, the user's operation force can be received by the hard board, and the peripheral portion of the light receiving and receiving element housed in the second space is excessive. It is possible to prevent the load from being transmitted.
  • the switch and the light emitting element for presenting information are mounted on one hard substrate, it contributes to the ease of assembling the photoelectric sensor in addition to ensuring the rigidity. Further, since the switch and the light emitting element are arranged on one hard board, good operability can be expected in that the user can easily operate while checking the information.
  • the photoelectric sensor in the above aspect may be provided with a light-shielding plate provided with a through hole corresponding to the light emitting element and arranged in close contact with the mounting surface of the first substrate.
  • the photoelectric sensor in the above aspect includes a base frame to which the first substrate and the second substrate are attached, and the base frame includes an annular portion that receives the periphery of the first substrate, a beam portion that crosses the annular portion, and an annular portion. It may have an orthogonal portion extending at right angles. If a base frame having such a skeleton is provided, it is possible to withstand a stronger operating force and easily connect the first substrate and the second substrate at the time of assembly. Further, a fiber lock mechanism for detachably holding the light projecting optical fiber and the light receiving optical fiber may be provided, and the fiber lock mechanism may be configured to be supported by orthogonal portions of the base frame. With such a configuration, the rigidity around the light emitting and receiving element can be increased, and the surroundings of the light emitting and receiving element can be protected even if a stronger load is applied.
  • the first substrate may have a GND line surrounding a region in which a light emitting element and a switch are mounted. Since the first substrate functions as a lid that closes the second space, if the GND wire is provided in this way, electromagnetic waves from the opening side can be blocked to some extent.
  • FIG. 1 is an overall perspective view of the photoelectric sensor 100 according to the present embodiment.
  • the photoelectric sensor 100 according to the present embodiment is a fiber type optical fiber sensor, and whether or not the detection light projected on the light projecting optical fiber 142 is reflected by the detection object and returned to the light receiving optical fiber 143. Or, it is a sensor that determines the presence or absence of an object to be detected and its distance by detecting how much it returns. If the object to be detected is made of a translucent material, it is possible to detect the presence or absence of the object to be detected depending on whether the detected light is transmitted and the amount of light is attenuated.
  • the photoelectric sensor 100 has a flat box shape as a whole, and mainly the housing 190 and the opening / closing cover 110 that covers the upper part of the housing 190 so as to be openable / closable appear in the appearance.
  • the housing 190 has two holes on the tip side. Specifically, it has an upper insertion hole 191 for inserting and removing the light emitting optical fiber 142 and a lower insertion hole 192 for inserting and removing the light receiving optical fiber 143.
  • the photoelectric sensor 100 is used, the light emitting optical fiber 142 is inserted and fixed in the upper insertion hole 191 and the light receiving optical fiber 143 is inserted and fixed in the lower insertion hole 192.
  • the housing 190 has a receiving portion of the connector unit 146 on the rear end side, and the figure shows a state in which the connector unit 146 is attached to the receiving portion.
  • the connector unit 146 is provided at one end of the cable 147, and connects the power supply line and the signal line included in the cable 147 to the circuit board inside the housing 190.
  • the x-axis, y-axis and z-axis are defined as shown in the figure.
  • the same coordinate axes as those in FIG. 1 are also shown to indicate the orientation of the structure represented by each drawing.
  • the z-axis positive direction is upward
  • the negative direction is downward
  • the x-axis negative side is the front end side
  • the positive side is the rear end side
  • the z-axis positive side is the upper side.
  • the negative side may be referred to as the lower side
  • the direction along the x-axis may be referred to as the longitudinal direction
  • the direction along the y-axis may be referred to as the lateral direction
  • the direction along the z-axis may be referred to as the height direction.
  • FIG. 2 is an overall perspective view showing a state in which the opening / closing cover 110 is opened.
  • the opening / closing cover 110 can be rotated by a hinge structure described later, and the user can open the opening / closing cover 110 by lifting the tip side.
  • the UI unit 200 mainly has a display unit 210 and an operation unit 220. More specifically, as will be described in detail later, the display unit 210 has a multi-digit numerical display arranged along the longitudinal direction. Further, the operation unit 220 also has push buttons arranged along the longitudinal direction.
  • the user can operate the push button by opening the open / close cover 110. If it is closed, it is possible to prevent the push button from being accidentally pressed.
  • the opening / closing cover 110 is made of a transparent material, and the user can visually recognize the information presented by the display unit 210 even when the opening / closing cover 110 is closed.
  • FIG. 3 is an exploded perspective view showing the main components of the photoelectric sensor 100.
  • the photoelectric sensor 100 is mainly composed of an opening / closing cover 110, a UI unit 200, a fiber lock mechanism 141, a connector unit 146, a base frame 150, a main board 170, a shield plate 180, and a housing 190.
  • the housing 190 has an opening 193 on the upper side. That is, the internal space of the housing 190 is wide open upward.
  • the UI unit 200, the fiber lock mechanism 141, the base frame 150, the main substrate 170, and the shield plate 180 are assembled and housed in the internal space of the housing 190 through the opening 193.
  • the opening / closing cover 110 closes the opening 193.
  • the connector unit 146 is mounted from the rear end side of the housing 190.
  • the UI unit 200 is mainly composed of a mask sheet 121, a shading pad 122, a button pad 123, and a sub-board 130.
  • the sub-board 130 is a rigid plate-shaped hard board, which is also called a rigid board, and for example, a glass epoxy board is used.
  • One or more information LED 131, explicit LED 132, and tactile switch 133 are mounted on the mounting surface of the sub-board 130, respectively. The specific arrangement and configuration of these will be described in detail later.
  • the button pad 123 is a rubber molded sheet in which a key top corresponding to each tactile switch 133 and a base in contact with the mounting surface of the sub-board 130 are integrally formed.
  • the button pad 123 is placed on the mounting surface of the sub-board 130 according to the arrangement of the tactile switch 133.
  • the shading pad 122 is a light-shielding plate provided with through holes corresponding to the information LED 131, the explicit LED 132, and the button pad 123, and is arranged in close contact with the mounting surface of the sub-board 130.
  • the shading pad 122 has a function of guiding the light from the information LED 131 and the explicit LED 132 toward the opening 193 and not leaking the light to other areas.
  • the mask sheet 121 is a sheet on which a transmissive window frame that defines the outline of light from the information LED 131 and the explicit LED 132, and characters and icons that explain the role of the push button are printed. Like the shading pad 122, the mask sheet 121 is provided with a hole through which the key top of the button pad 123 is inserted, and is attached to the surface of the shading pad 122.
  • the fiber lock mechanism 141 clamps and fixes each of the light emitting optical fiber 142 inserted through the upper insertion hole 191 and the light receiving optical fiber 143 inserted through the lower insertion hole 192.
  • the clamped end face of the light projecting optical fiber 142 faces the light projecting LED 161 and causes the detection light projected by the light projecting LED 161 to enter the optical fiber.
  • the clamped end face of the light receiving optical fiber 143 faces the light receiving PD 162, and emits the detection light transmitted through the optical fiber to the light receiving PD 162.
  • the connector unit 146 connects the power supply line and the signal line included in the cable 147 to the corresponding terminals of the main board 170.
  • the connector unit 146 may be configured to be detachable from the housing 190.
  • the base frame 150 forms the skeleton of the photoelectric sensor 100 and is molded of a thick resin so as not to be easily deformed. As shown in the figure, the base frame 150 has an L-shape as a whole, and functions as a base material on which the opening / closing cover 110, the UI unit 200, the fiber lock mechanism 141, the main substrate 170, and the shield plate 180 are attached. The specific shape and function will be described in detail later.
  • the main board 170 is a circuit board on which many elements for functioning the photoelectric sensor 100 are mounted, and in particular, a light projecting LED 161 and a light receiving PD 162 are mounted. In the present embodiment, a substrate having mounting surfaces on both sides is assumed, but a multilayer substrate having three or more layers may be used.
  • the main substrate 170 is also a hard substrate like the sub substrate 130, and for example, a glass epoxy substrate is used.
  • the shield plate 180 is an electromagnetic shield plate that blocks electromagnetic waves from the outside toward the main substrate 170, and is formed by, for example, bending a copper plate.
  • the shield plate 180 has a U-shape when observed from the longitudinal direction, and has an area that covers most of both mounting surfaces of the main substrate 170 by itself. The specific shape and the positional relationship with the base frame 150 and the main substrate 170 will be described in detail later.
  • FIG. 4 is a schematic view illustrating the divided space in the housing 190.
  • the sub-board 130 has a size corresponding to the opening 193, and when it is housed in the internal space of the housing 190, the internal space is opposite to the first space on the opening 193 side. It is divided into a second space on the side.
  • the first space is a space that mainly accommodates the UI unit 200 and integrates user interface functions using the opening 193.
  • the second space is a space that mainly houses the fiber lock mechanism 141 and the main board 170, and integrates sensing functions such as a light emitting / receiving element and a signal processing circuit. In this way, by dividing the internal space of the housing 190 into two spaces by the sub-board 130 which is one hard board, the function that the phenomenon that can occur due to one space is executed in the other space is executed. The adverse effect on the above can be minimized.
  • the sub-board 130 has a GND wire 134 which is a ground wire surrounding an area in which the information LED 131, the explicit LED 132, and the tactile switch 133 are mounted.
  • a GND wire 134 is a ground wire surrounding an area in which the information LED 131, the explicit LED 132, and the tactile switch 133 are mounted.
  • FIG. 5 is a perspective view mainly showing the respective configurations of the UI unit 200, the base frame 150, and the main board 170 and their mutual arrangement relationships.
  • the button pad 123, the shading pad 122, and the mask sheet 121 are laminated and assembled on the mounting surface of the sub-board 130, and together with the sub-board 130, form the UI unit 200.
  • the base frame 150 has an L-shape as a whole as described above. Specifically, it has an annular portion 151 that forms one side of the L-shape in the longitudinal direction, and an orthogonal portion 153 that extends orthogonally to the annular portion 151 and forms the other side of the L-shape in the height direction.
  • the annular portion 151 is formed so as to orbit in the longitudinal direction and the lateral direction, and can receive the periphery of the lower surface of the sub-board 130.
  • the annular portion 151 is formed with one or more beam portions 152 formed so as to cross in the lateral direction, and the beam portions 152 support the lower surface of the sub-board 130. That is, the annular portion 151 and the beam portion 152 function as a sub-board receiving portion that receives the lower surface of the sub-board 130.
  • the sub-board 130 is placed on the sub-board receiving portion in the state of the UI unit 200, and is fixed by, for example, an adhesive.
  • the main substrate 170 has a substantially rectangular shape, and is attached to the base frame 150 so that the vicinity of two orthogonal sides is supported by the annular portion 151 and the orthogonal portion 153, respectively. By attaching to the base frame 150 on two sides in this way, it is possible to further suppress distortion of the main substrate 170.
  • the fiber lock mechanism 141 is supported and fixed to the orthogonal portion 153 of the base frame 150. Since the fiber lock mechanism 141 has a function of accurately facing the end face of the light projecting optical fiber 142 and the end face of the light receiving optical fiber 143 to the light emitting LED 161 and the light receiving PD 162, respectively, it is particularly sensitive to misalignment. As shown in the figure, the fiber lock mechanism 141 has a box shape as a whole to increase the rigidity, and is further supported by the orthogonal portion 153 over the entire longitudinal direction, so that the fiber lock mechanism 141 is particularly distorted by an external load. It has a structure that does not easily cause misalignment.
  • FIG. 6 is a cross-sectional perspective view showing a state in which the annular portion 151 shown in FIG. 5 is cut in parallel with the xz plane near the center and observed from the positive side of the y-axis.
  • priority is given to the legibility of the figure, and hatching of the cross section is omitted.
  • the light emitting LED 161 and the light receiving PD 162 are mounted close to the tip side, which is one side of the main board 170, and the light emitting portion and the light receiving portion are inserted into the fiber lock mechanism 141. More specifically, the light emitting LED 161 and the light receiving PD 162 are soldered to the mounting surface so that the light emitting portion and the light receiving portion project from the front end side edge of the main substrate 170.
  • the information LED 131 is mounted in a region corresponding to one side of the main board 170, that is, a region on the tip side of the mounting surface of the sub-board 130.
  • the shading pad 122 arranged in close contact with the mounting surface of the sub-board 130 is provided with a through hole 125 corresponding to the information LED 131, and the through hole 125 emits light emitted by the information LED 131 in the opening 193 direction. Pass through.
  • the shading pad 122 may have at least the inner surface of the through hole 125 white and reflect the light emitted by the information LED 131 on the inner surface. By making the inner surface of the through hole 125 white in this way, the visibility of the information LED 131 can be improved.
  • the shading pad 122 is preferably in close contact with the mounting surface of the sub-board 130 so as not to leak the light emitted by the information LED 131 to the space other than the through hole 125. Therefore, for example, the shading pad 122 may be heat-bonded to the mounting surface of the sub-board 130.
  • the tactile switch 133 is mounted in a region of the mounting surface of the sub-board 130 opposite to one side of the main board 170, that is, a region on the rear end side.
  • the tactile switch 133 is a board-mounted type momentary operation switch.
  • the button pad 123 has individual key tops 124 corresponding to the respective tactile switches 133, and the respective key tops 124 are connected by a thin portion.
  • the tactile switch 133 is mounted on the hard board, and the ring portion 151 and the beam portion 152 of the base frame 150 receive the hard board. It does not cause large distortion in the structure. Further, even if the structure around the tactile switch 133 is slightly distorted, since the tactile switch 133 is mounted at a position far from the light emitting / receiving element, it is excessive to the peripheral portion of the light receiving / receiving element. It is possible to prevent the load from being transmitted. Further, since the tactile switch 133 and the information LED 131 are mounted on one hard substrate, it contributes to the ease of assembling the photoelectric sensor 100 in addition to ensuring the rigidity. Further, since the switch and the light emitting element are arranged on one hard board, good operability can be expected in that the user can easily operate while checking the information.
  • the explicit LED 132 is a light emitting element for clearly indicating the adjustment button described later to the user, and is mounted in the vicinity of the tactile switch 133 constituting the adjustment button on the mounting surface of the sub-board 130.
  • the button pad 123 has a notch in the area where the explicit LED 132 is mounted, and the shading pad 122 has a through hole 125 for passing the light emitted by the explicit LED in the opening 193 direction.
  • the information LED 131 and the explicit LED 132 are arranged on the first space side divided by the hard board, it is possible to suppress the light from wrapping around to the second space side. That is, it is possible to avoid the adverse effect of the light emitted by these on the sensing function. Further, since the hard substrate also suppresses the light of the light projecting LED 161 from wrapping around to the first space side, the possibility that the light of the light projecting LED 161 reduces the visibility of the display unit 210 is reduced.
  • the chip LED for 7-segment display is used as the light emitting element of the display unit 210, but other light emitting elements may be used.
  • a display panel such as a small liquid crystal panel provided with a backlight or a self-luminous organic EL panel may be mounted on the sub-board 130 as a light emitting element.
  • the switch that receives the operation force of the user is not limited to the tactile switch, and may be a switch that can be surface-mounted.
  • a membrane switch in which a plurality of switches are continuously formed may be adopted.
  • the button pad 123 does not have to be a rubber molded sheet, and may be, for example, a resin molded product.
  • the key tops may not be connected to each other, and the surface-mounted switches may be individually provided with the key tops.
  • FIG. 7 is a view of the photoelectric sensor 100 in a state where the opening / closing cover 110 is closed, and is a view for explaining each part of the UI unit 200.
  • each push button is composed of a tactile switch 133 and a key top 124 located above it.
  • the function and arrangement of each button arranged by such a combination will be described.
  • the operation unit 220 has four push buttons. Specifically, there are two change buttons 221 and an enter button 222 and an adjustment button 223.
  • the two change buttons 221 are push buttons for changing the numerical value displayed on the display unit 210. If one of the + buttons is pressed, the numerical value is increased, and if the-button is pressed, the numerical value is decreased.
  • the change button 221 is provided adjacent to the light emitting display unit 210.
  • the decision button 222 is a push button for determining a changed numerical value or a selected item.
  • the user can adjust the sensing response time while changing the numerical value of the display unit 210 with the change button 221 and press the enter button 222 to set the response time corresponding to the numerical value in the photoelectric sensor 100.
  • the change button 221 can be used to change the item
  • the enter button 222 can be used to determine the changed item.
  • the decision button 222 is also used as a mode switching button for switching between the operation mode and the setting mode.
  • the decision button 222 is provided between the change button 221 and the adjustment button 223.
  • the adjustment button 223 is a push button that starts automatic adjustment of the reference value applied in the detection of the detected light.
  • the processing unit of the photoelectric sensor 100 executes optimum adjustment of the light projection power, the light receiving gain, and the detection threshold value so that the set detection value can be obtained.
  • the adjustment button 223 When the adjustment button 223 is pressed, the adjustment value that was manually adjusted up to that point is discarded, so it is possible to prevent the adjustment button 223 from being accidentally pressed by the user or being pressed by touching something. I want to prevent it. Therefore, the adjustment button 223 is arranged at a distance from the adjacent decision button 222 and the other adjacent push buttons, and is arranged at the end of the plurality of push buttons. Since the change button 221 is arranged adjacent to the display unit 210, the adjustment button 223 is arranged on the rearmost end side of the UI unit 200.
  • the opening / closing cover 110 rotates around the hinge receiver 154 provided on the rearmost end side of the base frame 150. That is, since the hinge receiver 154 exists in the vicinity of the adjustment button 223, the open / close cover 110 hinders the user's finger from easily entering and makes it difficult to press the adjustment button 223.
  • the explicit LED 132 is provided so that the user can recognize the existence and the adjustment state of the adjustment button 223. Specifically, the explicit LED 132 is provided between the adjustment button 223 and the decision button 222, and a frame and characters are printed on the mask sheet 121 so that it can be seen that the LED is related to the adjustment button 223. .. For example, the explicit LED 132 blinks when the automatic adjustment is not performed, and lights up when the automatic adjustment is completed.
  • the explicit LED 132 that clearly indicates the existence and adjustment state of the special push button in the area on the rear end side of the mounting surface of the sub-board 130, which is a hard board, the light is emitted in the vicinity of the light-receiving element. Can be suppressed from wrapping around. That is, it is possible to avoid the adverse effect of the light emitted by the explicit LED 132 on the sensing function. Further, since the explicit LED 132 is arranged in a space away from the adjustment button 223 and the decision button 222 in order to prevent accidental pressing, it is also preferable for shortening the sub-board 130 in the longitudinal direction.
  • FIG. 8 is a diagram showing the relationship between the base frame 150, the main substrate 170, and the shield plate 180.
  • the base frame 150 has an L-shape with the annular portion 151 and the orthogonal portion 153 as described above, but has a truss portion 155 connecting the annular portion 151 and the orthogonal portion 153 in a triangular plate shape as shown in the figure. Such a truss portion 155 increases the rigidity of the base frame 150.
  • the main board 170 has a first mounting surface 170a and a second mounting surface 170b.
  • the first mounting surface 170a is provided with a GND land 171 connected to the ground wire and an amplification element 172 that amplifies the light receiving signal of the light receiving PD 162.
  • the main board 170 has mounting holes 173 at a plurality of locations, is aligned with mounting portions 157 provided at corresponding locations of the base frame 150, and is fixed with screws.
  • the truss portion 155 is located on the second mounting surface 170b side of the fixed main board 170. The truss portion is not provided on the first mounting surface 170a side.
  • the side edge in the longitudinal direction facing the sub board 130 is the opening side edge 170c, and the bottom side when housed in the housing 190.
  • the side edge in the longitudinal direction located at is defined as the bottom side edge 170d.
  • the shield plate 180 is an electromagnetic shield plate that blocks electromagnetic waves from the outside toward the main substrate 170, and has a shape that covers a circuit region of the first mounting surface 170a and the second mounting surface 170b in which electromagnetic waves are particularly desired to be blocked. Since the amplification element 172 is an element that is easily affected by electromagnetic waves from the outside, it is located in a circuit region covered by the shield plate 180.
  • the shield plate 180 is formed by bending a metal veneer, which is a copper plate, for example, and has a U-shape as a whole when observed from the longitudinal direction. The shield plate 180 is arranged so as to take in the main substrate 170 inside the U-shape.
  • the shield plate 180 is arranged so as to cover the first mounting surface 170a and the second mounting surface 170b of the main board 170 so as to straddle the bottom side edge 170d on the side opposite to the opening side edge 170c. NS.
  • the arrangement surface 156 is a receiving surface provided on the orthogonal portion 153 for arranging the side portion of the shield plate 180 along the surface of the base frame 150.
  • the arrangement surface 156 has an inclination such that the height of the opening side edge 170c side is higher than that of the bottom side edge 170d side with respect to the first mounting surface 170a of the main substrate 170. By providing such an inclination, the soldering work described later becomes easy.
  • FIG. 9 is a perspective view of the shield plate 180 covering the main substrate 170 from one direction. Specifically, it shows a state in which the first mounting surface 170a of the main substrate 170 is mainly covered with the first surface 180a of the shield plate 180.
  • the side portion of the first surface 180a of the shield plate 180 is placed on the arrangement surface 156 provided on the orthogonal portion 153 and the arrangement surface 158 provided on the annular portion 151.
  • the first surface 180a is maintained in a state of being separated from the first mounting surface 170a. That is, it does not come into contact with the element on the mounting surface, and there is no risk of damaging the circuit.
  • the third surface 180c of the shield plate 180 is a shield surface following the first surface 180a, passes through the bottom side space of the bottom side edge 170d, and is connected to the opposite shield surface.
  • the shield plate 180 has an extending portion 181 extending from the first surface 180a toward the first mounting surface 170a.
  • the extending portion 181 includes a bent portion 182 bent toward the bottom side edge 170d at the tip end portion thereof.
  • the extending portion 181 is provided at a position corresponding to the GND land 171, and when the shield plate 180 is arranged on the base frame 150, the bent portion 182 comes into contact with the GND land 171.
  • the ground wire of the main board 170 becomes the same potential (ground potential) as the shield plate 180.
  • the GND land 171 is provided on the first mounting surface 170a at a position closer to the bottom side edge 170d than the opening side edge 170c. Since the GND land 171 is provided close to the bottom side edge 170d in this way, the extension portion 181 is caught by the element on the first mounting surface 170a and deformed when the shield plate 180 is assembled. 1 It is possible to avoid a problem of damaging the element mounted on the mounting surface 170a.
  • the bent portion 182 is bent toward the bottom side edge 170d, in the step of assembling the shield plate 180 to the base frame 150, the bent portion 182 is slid and positioned according to the surface of the first mounting surface 170a. NS. Therefore, even if the GND land 171 is provided at a position slightly away from the bottom side edge 170d, it is possible to avoid a problem that the extension portion 181 is bent in the middle during assembly.
  • the shield plate 180 is assembled more stably. be able to. Further, since the length of the extending portion 181 can be shortened by that amount, soldering becomes easy. Further, as described above, since the base frame 150 is not provided with the truss portion on the first mounting surface 170a side, the soldering work can be easily performed.
  • FIG. 10 is a perspective view of the shield plate 180 covering the main substrate 170 as observed from another direction. Specifically, it shows a state in which the second mounting surface 170b of the main board 170 is mainly covered with the second surface 180b of the shield plate 180.
  • the second surface 180b is a shield surface continuous from the above-mentioned third surface 180c.
  • the peripheral edge portion including the side portion of the second surface 180b is placed on the surface of the truss portion 155 continuous with the orthogonal portion 153 and arranged. As a result, the second surface 180b is maintained in a state of being separated from the second mounting surface 170b.
  • a retaining hole 183 is provided on the second surface 180b of the shield plate 180. Further, the truss portion 155 of the base frame 150 is provided with a lashing claw 159 for tying the lashing hole 183.
  • the retaining hole 183 fits into the retaining claw 159 when the shield plate 180 is slid toward the opening so as to sandwich the main substrate 170. In this way, the assembling worker can easily assemble the shield plate 180 to the base frame 150. Further, when the second surface 180b side is connected to the base frame 150 in this way, the soldering work performed on the first surface 180a side becomes easy.
  • the retaining hole 183 is preferably provided on the second surface 180b. That is, the anchoring hole 183 and the anchoring portion by the anchoring claw 159 are provided not on the side of the first mounting surface 170a but on the side of the second mounting surface 170b. Since the first surface 180a covers the amplification element 172 that is easily affected by electromagnetic waves from the outside, it is preferable not to provide a hole that can serve as an entry path for electromagnetic waves.
  • the tether claw 159 may be provided on the orthogonal portion 153, but if the truss portion 155 is used as the arrangement surface of the second surface 180b as in the present embodiment, the tether claw 159 is also provided on this arrangement surface. It is preferable to provide it.
  • the U-shaped shield plate 180 As described above, by adopting the U-shaped shield plate 180, the number of parts and the assembly man-hours can be reduced as compared with shielding each mounting surface individually. In particular, by providing the extension portion 181, it can be easily connected to the ground wire of the main board 370, and the state of being separated from the mounting surface of the main board 370 can be maintained. Further, since the sub-board 130 can also block electromagnetic waves from the outside toward the main board 370 to some extent, the shield plate 180 straddles the bottom side edge 170d of the main board 170 and covers both mounting surfaces, so that the entire circumference is covered from the outside. The influence of electromagnetic waves can be reduced.
  • FIG. 11 is a diagram showing another configuration example of the main board.
  • the main board 170 does not have to be a single board. That is, from the viewpoint of preventing the excessive load due to the push button operation from being transmitted to the peripheral portion of the light receiving / receiving element and preventing the stray light of the light emitting element from reaching the peripheral portion of the light receiving element, the second There may be a plurality of substrates accommodated in the space.
  • FIG. 11 shows a configuration example in which the light emitting / receiving board 380 on which the light emitting LED 161 and the light receiving PD 162 are mounted is separated from the main board 370.
  • the main board 370 and the light receiving / receiving board 380 are electrically connected via, for example, a connector.
  • the main substrate 370 may have a configuration supported by the fiber lock mechanism 141. It is preferable that the shield plate 180 is arranged so that the light emitting / receiving substrate 380 is also taken into the U-shape together with the main substrate 370.
  • the above photoelectric sensor 100 is configured so that the various effects described above can be obtained together. Therefore, it may not be possible to adopt certain configurations that have ancillary effects due to other technical requirements. Even in such a case, the embodiment according to the present invention can be used as long as the configuration is such that the effect mainly intended by the present invention can be obtained.
  • the sub-board 130 is composed of a hard board and the buttons are arranged on the side opposite to the light-receiving element side so that an excessive load is not transmitted to the peripheral portion of the light-receiving element. If this is the case, the shield plate 180 does not have to be U-shaped.
  • a housing having an opening, a first substrate which is a hard substrate that divides the internal space of the housing into a first space on the opening side and a second space on the opposite side, and a light projecting fiber.
  • a light projecting element that projects the detection light onto the light receiving element, a light receiving element that receives the detected light from the light receiving optical fiber, and a second substrate on which the light projecting element and the light receiving element are mounted and housed in the second space.
  • a light emitting element mounted on the mounting surface of the first substrate and presenting information toward the opening, and a user mounted on the mounting surface of the first substrate and heading from the opening to the first substrate.
  • a photoelectric device including a switch that receives an operating force, a base frame to which the first substrate and the second substrate are mounted, and the base frame having a receiving portion that receives a surface opposite to the mounting surface of the first substrate. It may be a sensor.
  • the base frame can be used as a structure for supporting the second substrate, it is possible to realize a photoelectric sensor that is compact as a whole and has a small number of parts.
  • the light projecting element (161) and the light receiving element (162) are mounted close to one side of the mounting surface (170a, 170b), or the light emitting element (161) and the light receiving element (162) are mounted.
  • the second substrate (170, 370) which is connected to the third substrate (380) on one side and accommodated in the second space, Light emission for mounting information on the mounting surface of the first substrate (130) corresponding to the one side of the second substrate (170, 370) and presenting information toward the opening (193).
  • Element (131) and It is mounted in a region of the mounting surface of the first substrate (130) opposite to the one side of the second substrate (170, 370), and is mounted from the opening (193) to the first substrate (130).
  • a photoelectric sensor (100) including a switch (133) that receives an operating force of an oncoming user.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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  • Geophysics And Detection Of Objects (AREA)

Abstract

This photoelectric sensor comprises: a housing having an opening; a first substrate which is a hard substrate that divides an interior space of the housing into a first space on the opening side and a second space on the opposite side; a light projecting element which projects a detection light onto an optical fiber for light projection; a light receiving element which receives the detection light from an optical fiber for light reception; a second substrate on which the light projecting element and the light receiving element are mounted closer to one side of a mounting surface, or which is connected at the one side to a third substrate on which the light projecting element and the light receiving element are mounted, the second substrate being accommodated in the second space; a light emitting element which is mounted in a region of a mounting surface of the first substrate corresponding to the one side of the second substrate, and which is for presenting information toward the opening; and a switch which is mounted in a region of the mounting surface of the first substrate that is opposite the one side of the second substrate, and which receives an operating force of a user from the opening toward the first substrate.

Description

光電センサPhotoelectric sensor
　本発明は、光電センサに関する。 The present invention relates to a photoelectric sensor.
　投光用の光ファイバと受光用の光ファイバを挿抜して用いるファイバ型の光電センサが知られている（例えば、特許文献１参照）。ファイバ型の光電センサは、投光用の光ファイバへ投射した検出光が、検出対象物で反射して受光用の光ファイバへ戻ってくるか否か、あるいはどの程度戻ってくるかを検出することにより、検出対象物の有無やその距離を判定するセンサである。検出対象物が透光素材で形成されていれば、検出光を透過させてその光量が減衰するかにより、検出対象物の有無を検出することも可能である。 A fiber-type photoelectric sensor in which an optical fiber for light projection and an optical fiber for light reception are inserted and removed is known (see, for example, Patent Document 1). The fiber-type photoelectric sensor detects whether or not the detection light projected onto the light projecting optical fiber is reflected by the detection target and returns to the light receiving optical fiber, or to what extent. This is a sensor that determines the presence / absence of a detection target and its distance. If the object to be detected is made of a translucent material, it is possible to detect the presence or absence of the object to be detected depending on whether the detected light is transmitted and the amount of light is attenuated.
特開２００４－２０５２０９号公報Japanese Unexamined Patent Publication No. 2004-205209
　光電センサは、検出レベルを調整したり、動作モードを切り替えたりする操作部を備えることが多い。特に操作部に押しボタンを含む場合には、ユーザが当該押しボタンを押し込む操作力が過剰な荷重となって、投光素子及び受光素子の周辺部を歪ませる原因となることがあった。光電センサの検出光は、上述のように検出対象物の有無やその距離を判定できるように、検出対象物の特性に合わせて精密に調整されて使用されることが多く、投光素子及び受光素子の周辺部の歪みが検出精度を低下させる原因となることがあった。 Photoelectric sensors often have an operation unit that adjusts the detection level and switches the operation mode. In particular, when the operation unit includes a push button, the operation force for the user to press the push button becomes an excessive load, which may cause distortion of the peripheral portion of the light projecting element and the light receiving element. As described above, the detection light of the photoelectric sensor is often used after being precisely adjusted according to the characteristics of the detection target so that the presence or absence of the detection target and its distance can be determined. Distortion in the peripheral portion of the element may cause a decrease in detection accuracy.
　本発明は、このような問題を解決するためになされたものであり、ユーザの押し操作によって投光素子及び受光素子の周辺部に過剰な荷重が掛かることを防ぐ簡易な構造を備えた光電センサを提供するものである。 The present invention has been made to solve such a problem, and is a photoelectric sensor having a simple structure for preventing an excessive load from being applied to the peripheral portions of the light emitting element and the light receiving element by a user's pressing operation. Is to provide.
　本発明の一態様における光電センサは、開口部を有する筐体と、筐体の内部空間を開口部側の第１空間と、反対側の第２空間とに分割するハード基板である第１基板と、投光用光ファイバに検出光を投射する投光素子と、受光用光ファイバから検出光を受光する受光素子と、投光素子と受光素子が実装面の一側方に寄せて実装され、又は投光素子と受光素子が実装された第３基板と一側方側で接続されて、第２空間に収容された第２基板と、第１基板の実装面のうち第２基板の一側方に対応する領域に実装され、開口部へ向けて情報を呈示するための発光素子と、第１基板の実装面のうち第２基板の一側方とは反対の領域に実装され、開口部から第１基板へ向かうユーザの操作力を受けるスイッチとを備える。 The photoelectric sensor according to one aspect of the present invention is a housing having an opening, and a first substrate which is a hard substrate that divides the internal space of the housing into a first space on the opening side and a second space on the opposite side. The light projecting element that projects the detection light onto the light projecting optical fiber, the light receiving element that receives the detected light from the light receiving optical fiber, and the light projecting element and the light receiving element are mounted close to one side of the mounting surface. Or, the second substrate, which is connected to the third substrate on which the light projecting element and the light receiving element are mounted on one side and is accommodated in the second space, and one of the second substrates among the mounting surfaces of the first substrate. A light emitting element mounted in a region corresponding to the side and presenting information toward the opening, and mounted in a region of the mounting surface of the first substrate opposite to one side of the second substrate, and opened. It is provided with a switch that receives a user's operating force from the unit to the first substrate.
　光電センサは操作部と共に表示部を伴うことが多いが、本発明の一態様における光電センサは、ハード基板上に表示部を投受光素子側に寄せて配置し、操作部を遠い側に配置するようにした。特に、押しボタンを構成するスイッチがハード基板に実装されているので、ユーザの操作力をハード基板で受けることができることと合わせて、第２空間に収容された投受光素子の周辺部へ過剰な荷重が伝達することを防ぐことができる。また、一つのハード基板上にスイッチと情報を呈示するための発光素子とを実装するので、剛性の確保に加え、光電センサの組立て容易性にも寄与する。さらに、スイッチと発光素子が一つのハード基板に配置されているので、ユーザは情報を確認しながら操作がしやすいという点において良好な操作性も期待できる。 The photoelectric sensor often includes a display unit together with an operation unit. However, in the photoelectric sensor according to one aspect of the present invention, the display unit is arranged on the hard substrate closer to the light emitting / receiving element side, and the operation unit is arranged on the distant side. I did. In particular, since the switches constituting the push buttons are mounted on the hard board, the user's operation force can be received by the hard board, and the peripheral portion of the light receiving and receiving element housed in the second space is excessive. It is possible to prevent the load from being transmitted. Further, since the switch and the light emitting element for presenting information are mounted on one hard substrate, it contributes to the ease of assembling the photoelectric sensor in addition to ensuring the rigidity. Further, since the switch and the light emitting element are arranged on one hard board, good operability can be expected in that the user can easily operate while checking the information.
　上記態様における光電センサは、発光素子に対応した貫通孔が設けられ、第１基板の実装面に密着して配置された遮光板を備えてもよい。このような遮光板を設けることにより、発光素子の視認性を高めると共に、投受光素子側への迷光を防ぐことができる。 The photoelectric sensor in the above aspect may be provided with a light-shielding plate provided with a through hole corresponding to the light emitting element and arranged in close contact with the mounting surface of the first substrate. By providing such a light-shielding plate, it is possible to improve the visibility of the light emitting element and prevent stray light to the light emitting / receiving element side.
　また、上記態様における光電センサは、第１基板と第２基板が取り付けられるベースフレームを備え、ベースフレームは、第１基板の周囲を受ける環状部と、環状部を横切る梁部と、環状部に直交して延在する直交部とを有してもよい。このような骨格を成すベースフレームを備えれば、より強い操作力にも耐えると共に、組み立て時において第１基板と第２基板の接続を容易に行うことができる。さらに、投光用光ファイバ及び受光用光ファイバを着脱可能に保持するファイバロック機構を備え、ファイバロック機構は、ベースフレームの直交部に支持されるように構成してもよい。このような構成により、投受光素子周りの剛性を高めることができ、より強い荷重を受けても投受光素子周りを保護することができる。 Further, the photoelectric sensor in the above aspect includes a base frame to which the first substrate and the second substrate are attached, and the base frame includes an annular portion that receives the periphery of the first substrate, a beam portion that crosses the annular portion, and an annular portion. It may have an orthogonal portion extending at right angles. If a base frame having such a skeleton is provided, it is possible to withstand a stronger operating force and easily connect the first substrate and the second substrate at the time of assembly. Further, a fiber lock mechanism for detachably holding the light projecting optical fiber and the light receiving optical fiber may be provided, and the fiber lock mechanism may be configured to be supported by orthogonal portions of the base frame. With such a configuration, the rigidity around the light emitting and receiving element can be increased, and the surroundings of the light emitting and receiving element can be protected even if a stronger load is applied.
　また、上記態様における光電センサにおいて第１基板は、発光素子及びスイッチが実装された領域を取り囲むＧＮＤ線を有してもよい。第１基板は、第２空間を閉塞する蓋として機能するので、このようにＧＮＤ線を設ければ、開口部側からの電磁波をある程度遮断することができる。 Further, in the photoelectric sensor in the above aspect, the first substrate may have a GND line surrounding a region in which a light emitting element and a switch are mounted. Since the first substrate functions as a lid that closes the second space, if the GND wire is provided in this way, electromagnetic waves from the opening side can be blocked to some extent.
　本発明により、ユーザの押し操作によって投光素子及び受光素子の周辺部に過剰な荷重が掛かることを防ぐ簡易な構造を備えた光電センサを提供することができる。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a photoelectric sensor having a simple structure that prevents an excessive load from being applied to peripheral portions of a light emitting element and a light receiving element by a user's pressing operation.
本実施形態に係る光電センサの全体斜視図である。It is an overall perspective view of the photoelectric sensor which concerns on this embodiment. 開閉カバーを開いた様子を示す全体斜視図である。It is an overall perspective view which shows the state which opened the opening / closing cover. 光電センサの主要な構成要素を示す分解斜視図である。It is an exploded perspective view which shows the main component of a photoelectric sensor. 筐体内の分割空間を説明する模式図である。It is a schematic diagram explaining the division space in a housing. ＵＩユニット、ベースフレーム及びメイン基板の関係を示す図である。It is a figure which shows the relationship of a UI unit, a base frame and a main board. 図５の様子をｘｚ平面で切断した断面図である。It is sectional drawing which cut the state of FIG. 5 in the xz plane. ＵＩユニットの各部を説明する図である。It is a figure explaining each part of a UI unit. ベースフレーム、メイン基板及びシールド板の関係を示す図である。It is a figure which shows the relationship of a base frame, a main board and a shield plate. シールド板がメイン基板を覆う様子を一方向から観察した斜視図である。It is a perspective view which observed from one direction how the shield plate covers the main board. シールド板がメイン基板を覆う様子を他方向から観察した斜視図である。It is a perspective view which observed from the other direction how the shield plate covers the main board. メイン基板の他の構成例を示す図である。It is a figure which shows the other structural example of a main board.
　添付図面を参照して、本発明の実施形態について説明する。なお、各図において、同一の符号を付したものは、同一又は同様の構成を有する。また、各図において、同一又は同様の構成を有する構造物が複数存在する場合には、煩雑となることを回避するため、一部に符号を付し、他に同一符号を付すことを省く場合がある。 An embodiment of the present invention will be described with reference to the accompanying drawings. In each figure, those having the same reference numerals have the same or similar configurations. Further, in each figure, when there are a plurality of structures having the same or similar structure, a reference numeral is added to a part of the structure and the same reference numeral is omitted from the other parts in order to avoid complication. There is.
　図１は、本実施形態に係る光電センサ１００の全体斜視図である。本実施形態に係る光電センサ１００は、ファイバ型の光電センサであり、投光用光ファイバ１４２へ投射した検出光が、検出対象物で反射して受光用光ファイバ１４３へ戻ってくるか否か、あるいはどの程度戻ってくるかを検出することにより、検出対象物の有無やその距離を判定するセンサである。検出対象物が透光素材で形成されていれば、検出光を透過させてその光量が減衰するかにより、検出対象物の有無を検出することも可能である。 FIG. 1 is an overall perspective view of the photoelectric sensor 100 according to the present embodiment. The photoelectric sensor 100 according to the present embodiment is a fiber type optical fiber sensor, and whether or not the detection light projected on the light projecting optical fiber 142 is reflected by the detection object and returned to the light receiving optical fiber 143. Or, it is a sensor that determines the presence or absence of an object to be detected and its distance by detecting how much it returns. If the object to be detected is made of a translucent material, it is possible to detect the presence or absence of the object to be detected depending on whether the detected light is transmitted and the amount of light is attenuated.
　光電センサ１００は、全体として扁平型の箱形状を成し、主に筐体１９０と、筐体１９０の上部を開閉可能に覆う開閉カバー１１０とが外観に現れている。筐体１９０は、先端側に２つの孔を有する。具体的には、投光用光ファイバ１４２を挿抜するための上部挿通孔１９１と、受光用光ファイバ１４３を挿抜するための下部挿通孔１９２を有する。光電センサ１００の使用時においては、投光用光ファイバ１４２は上部挿通孔１９１に挿通されて固定され、受光用光ファイバ１４３は下部挿通孔１９２に挿通されて固定される。 The photoelectric sensor 100 has a flat box shape as a whole, and mainly the housing 190 and the opening / closing cover 110 that covers the upper part of the housing 190 so as to be openable / closable appear in the appearance. The housing 190 has two holes on the tip side. Specifically, it has an upper insertion hole 191 for inserting and removing the light emitting optical fiber 142 and a lower insertion hole 192 for inserting and removing the light receiving optical fiber 143. When the photoelectric sensor 100 is used, the light emitting optical fiber 142 is inserted and fixed in the upper insertion hole 191 and the light receiving optical fiber 143 is inserted and fixed in the lower insertion hole 192.
　筐体１９０は、後端側にコネクタユニット１４６の受容部を有し、図は、受容部にコネクタユニット１４６が装着された様子を表している。コネクタユニット１４６は、ケーブル１４７の一端に設けられ、ケーブル１４７が内包する電源線及び信号線を筐体１９０内部の回路基板と接続する。 The housing 190 has a receiving portion of the connector unit 146 on the rear end side, and the figure shows a state in which the connector unit 146 is attached to the receiving portion. The connector unit 146 is provided at one end of the cable 147, and connects the power supply line and the signal line included in the cable 147 to the circuit board inside the housing 190.
　なお、図示するようにｘ軸、ｙ軸及びｚ軸を定める。以後の図面においても図１と同様の座標軸を併記することにより、それぞれの図面が表す構造物の向きを示す。また以後の説明において、上述のように、ｚ軸正方向を上方向、負方向を下方向、ｘ軸負の側を先端側、正の側を後端側、ｚ軸正の側を上側、負の側を下側、ｘ軸に沿う方向を長手方向、ｙ軸に沿う方向を短手方向、ｚ軸に沿う方向を高さ方向と称する場合がある。 The x-axis, y-axis and z-axis are defined as shown in the figure. In the subsequent drawings, the same coordinate axes as those in FIG. 1 are also shown to indicate the orientation of the structure represented by each drawing. Further, in the following description, as described above, the z-axis positive direction is upward, the negative direction is downward, the x-axis negative side is the front end side, the positive side is the rear end side, and the z-axis positive side is the upper side. The negative side may be referred to as the lower side, the direction along the x-axis may be referred to as the longitudinal direction, the direction along the y-axis may be referred to as the lateral direction, and the direction along the z-axis may be referred to as the height direction.
　図２は、開閉カバー１１０を開いた様子を示す全体斜視図である。開閉カバー１１０は、後述するヒンジ構造により回転可能であり、ユーザは、先端側を持ち上げることにより開閉カバー１１０を開いた状態にすることができる。 FIG. 2 is an overall perspective view showing a state in which the opening / closing cover 110 is opened. The opening / closing cover 110 can be rotated by a hinge structure described later, and the user can open the opening / closing cover 110 by lifting the tip side.
　開閉カバー１１０を開いた状態にすると、ＵＩユニット２００が外部に露出した状態になる。ＵＩユニット２００は、主に、表示部２１０と操作部２２０を有する。具体的には後に詳述するが、表示部２１０は、長手方向に沿って配置された複数桁の数値表示を有する。また、操作部２２０は、同じく長手方向に沿って配置された押しボタンを有する。 When the open / close cover 110 is opened, the UI unit 200 is exposed to the outside. The UI unit 200 mainly has a display unit 210 and an operation unit 220. More specifically, as will be described in detail later, the display unit 210 has a multi-digit numerical display arranged along the longitudinal direction. Further, the operation unit 220 also has push buttons arranged along the longitudinal direction.
　ユーザは、開閉カバー１１０を開いた状態にすれば、押しボタンを操作することができる。閉じた状態にすれば、不用意に押しボタンを押してしまうことを防ぐことができる。一方で、開閉カバー１１０は透明素材で形成されており、ユーザは、開閉カバー１１０が閉じた状態であっても表示部２１０が呈示する情報を視認することができる。 The user can operate the push button by opening the open / close cover 110. If it is closed, it is possible to prevent the push button from being accidentally pressed. On the other hand, the opening / closing cover 110 is made of a transparent material, and the user can visually recognize the information presented by the display unit 210 even when the opening / closing cover 110 is closed.
　図３は、光電センサ１００の主要な構成要素を示す分解斜視図である。光電センサ１００は、主に、開閉カバー１１０、ＵＩユニット２００、ファイバロック機構１４１、コネクタユニット１４６、ベースフレーム１５０、メイン基板１７０、シールド板１８０、筐体１９０によって構成されている。筐体１９０は、上側に開口部１９３を有する。すなわち、筐体１９０の内部空間は、上方向へ向かって大きく開いている。ＵＩユニット２００、ファイバロック機構１４１、ベースフレーム１５０、メイン基板１７０、シールド板１８０は、組み立てられて、筐体１９０の内部空間に開口部１９３から収容される。開閉カバー１１０は、開口部１９３を封塞する。また、コネクタユニット１４６は、筐体１９０の後端側から装着される。 FIG. 3 is an exploded perspective view showing the main components of the photoelectric sensor 100. The photoelectric sensor 100 is mainly composed of an opening / closing cover 110, a UI unit 200, a fiber lock mechanism 141, a connector unit 146, a base frame 150, a main board 170, a shield plate 180, and a housing 190. The housing 190 has an opening 193 on the upper side. That is, the internal space of the housing 190 is wide open upward. The UI unit 200, the fiber lock mechanism 141, the base frame 150, the main substrate 170, and the shield plate 180 are assembled and housed in the internal space of the housing 190 through the opening 193. The opening / closing cover 110 closes the opening 193. Further, the connector unit 146 is mounted from the rear end side of the housing 190.
　ＵＩユニット２００は、主に、マスクシート１２１、シェーディングパッド１２２、ボタンパッド１２３、サブ基板１３０によって構成されている。サブ基板１３０は、リジッド基板とも呼ばれる剛性のある板状のハード基板であり、例えば、ガラスエポキシ基板が用いられる。サブ基板１３０の実装面には、それぞれ１つ以上の情報用ＬＥＤ１３１、明示用ＬＥＤ１３２、タクタイルスイッチ１３３が実装されている。これらの具体的な配置や構成については、後に詳述する。 The UI unit 200 is mainly composed of a mask sheet 121, a shading pad 122, a button pad 123, and a sub-board 130. The sub-board 130 is a rigid plate-shaped hard board, which is also called a rigid board, and for example, a glass epoxy board is used. One or more information LED 131, explicit LED 132, and tactile switch 133 are mounted on the mounting surface of the sub-board 130, respectively. The specific arrangement and configuration of these will be described in detail later.
　ボタンパッド１２３は、それぞれのタクタイルスイッチ１３３に対応したキートップとサブ基板１３０の実装面に接するベースとが一体的に形成されたゴム成形シートである。ボタンパッド１２３は、タクタイルスイッチ１３３の配置に合わせてサブ基板１３０の実装面上に載置される。シェーディングパッド１２２は、情報用ＬＥＤ１３１、明示用ＬＥＤ１３２、ボタンパッド１２３に対応した貫通孔が設けられ、サブ基板１３０の実装面に密着して配置された遮光板である。シェーディングパッド１２２は、情報用ＬＥＤ１３１及び明示用ＬＥＤ１３２からの光を開口部１９３側へ導くと共に、他の領域へ漏らさない機能を担う。マスクシート１２１は、情報用ＬＥＤ１３１及び明示用ＬＥＤ１３２からの光の輪郭を定める透過窓枠や、押しボタンの役割を説明する文字やアイコンが印刷されたシートである。マスクシート１２１は、シェーディングパッド１２２と同様にボタンパッド１２３のキートップを挿通させる孔が設けられており、シェーディングパッド１２２の表面に貼着されている。 The button pad 123 is a rubber molded sheet in which a key top corresponding to each tactile switch 133 and a base in contact with the mounting surface of the sub-board 130 are integrally formed. The button pad 123 is placed on the mounting surface of the sub-board 130 according to the arrangement of the tactile switch 133. The shading pad 122 is a light-shielding plate provided with through holes corresponding to the information LED 131, the explicit LED 132, and the button pad 123, and is arranged in close contact with the mounting surface of the sub-board 130. The shading pad 122 has a function of guiding the light from the information LED 131 and the explicit LED 132 toward the opening 193 and not leaking the light to other areas. The mask sheet 121 is a sheet on which a transmissive window frame that defines the outline of light from the information LED 131 and the explicit LED 132, and characters and icons that explain the role of the push button are printed. Like the shading pad 122, the mask sheet 121 is provided with a hole through which the key top of the button pad 123 is inserted, and is attached to the surface of the shading pad 122.
　ファイバロック機構１４１は、上部挿通孔１９１を通して挿し込まれる投光用光ファイバ１４２、及び下部挿通孔１９２を通して挿し込まれる受光用光ファイバ１４３のそれぞれをクランプして固定する。クランプされた投光用光ファイバ１４２の端面は、投光ＬＥＤ１６１に対向し、投光ＬＥＤ１６１が投射する検出光を光ファイバ内に入射させる。クランプされた受光用光ファイバ１４３の端面は、受光ＰＤ１６２に対向し、光ファイバ内を伝達してきた検出光を受光ＰＤ１６２へ出射させる。 The fiber lock mechanism 141 clamps and fixes each of the light emitting optical fiber 142 inserted through the upper insertion hole 191 and the light receiving optical fiber 143 inserted through the lower insertion hole 192. The clamped end face of the light projecting optical fiber 142 faces the light projecting LED 161 and causes the detection light projected by the light projecting LED 161 to enter the optical fiber. The clamped end face of the light receiving optical fiber 143 faces the light receiving PD 162, and emits the detection light transmitted through the optical fiber to the light receiving PD 162.
　コネクタユニット１４６は、ケーブル１４７が内包する電源線及び信号線をメイン基板１７０の対応する各端子と接続させる。なお、コネクタユニット１４６は、筐体１９０に対して着脱可能に構成されてもよい。 The connector unit 146 connects the power supply line and the signal line included in the cable 147 to the corresponding terminals of the main board 170. The connector unit 146 may be configured to be detachable from the housing 190.
　ベースフレーム１５０は、光電センサ１００の骨格を成し、変形しにくいように肉厚の樹脂で成形されている。ベースフレーム１５０は、図示するように全体としてＬ字形状を成し、開閉カバー１１０、ＵＩユニット２００、ファイバロック機構１４１、メイン基板１７０、シールド板１８０が取り付けられる基材としての機能を担う。具体的な形状や機能については、後に詳述する。 The base frame 150 forms the skeleton of the photoelectric sensor 100 and is molded of a thick resin so as not to be easily deformed. As shown in the figure, the base frame 150 has an L-shape as a whole, and functions as a base material on which the opening / closing cover 110, the UI unit 200, the fiber lock mechanism 141, the main substrate 170, and the shield plate 180 are attached. The specific shape and function will be described in detail later.
　メイン基板１７０は、光電センサ１００を機能させる各種素子が多く実装された回路基板であり、特に、投光ＬＥＤ１６１及び受光ＰＤ１６２が実装されている。本実施形態においては、両面に実装面を有する基板を想定するが、三層以上の多層基板であってもよい。メイン基板１７０も、サブ基板１３０と同様にハード基板であり、例えば、ガラスエポキシ基板が用いられる。 The main board 170 is a circuit board on which many elements for functioning the photoelectric sensor 100 are mounted, and in particular, a light projecting LED 161 and a light receiving PD 162 are mounted. In the present embodiment, a substrate having mounting surfaces on both sides is assumed, but a multilayer substrate having three or more layers may be used. The main substrate 170 is also a hard substrate like the sub substrate 130, and for example, a glass epoxy substrate is used.
　シールド板１８０は、外部からメイン基板１７０へ向かう電磁波を遮断する電磁遮蔽板であり、例えば銅板を折り曲げて形成されている。シールド板１８０は、長手方向から観察した場合にＵ字形状を成し、単体でメイン基板１７０の両実装面の大部分を覆う面積を有する。具体的な形状や、ベースフレーム１５０及びメイン基板１７０との位置関係については、後に詳述する。 The shield plate 180 is an electromagnetic shield plate that blocks electromagnetic waves from the outside toward the main substrate 170, and is formed by, for example, bending a copper plate. The shield plate 180 has a U-shape when observed from the longitudinal direction, and has an area that covers most of both mounting surfaces of the main substrate 170 by itself. The specific shape and the positional relationship with the base frame 150 and the main substrate 170 will be described in detail later.
　図４は、筐体１９０内の分割空間を説明する模式図である。サブ基板１３０は、図示するように開口部１９３に相当する大きさを有し、筐体１９０の内部空間に収容された場合に、当該内部空間を、開口部１９３側の第１空間と、反対側の第２空間とに分割する。 FIG. 4 is a schematic view illustrating the divided space in the housing 190. As shown in the drawing, the sub-board 130 has a size corresponding to the opening 193, and when it is housed in the internal space of the housing 190, the internal space is opposite to the first space on the opening 193 side. It is divided into a second space on the side.
　第１空間は、主にＵＩユニット２００を収容し、開口部１９３を利用したユーザインタフェース機能が集約された空間である。第２空間は、主にファイバロック機構１４１やメイン基板１７０を収容し、投受光素子や信号処理回路などのセンシング機能が集約された空間である。このように、一枚のハード基板であるサブ基板１３０によって筐体１９０の内部空間を２つの空間に分割することにより、一方の空間に起因して生じ得る現象が他方の空間で実行される機能に及ぼす悪影響を最小限に抑制することができる。 The first space is a space that mainly accommodates the UI unit 200 and integrates user interface functions using the opening 193. The second space is a space that mainly houses the fiber lock mechanism 141 and the main board 170, and integrates sensing functions such as a light emitting / receiving element and a signal processing circuit. In this way, by dividing the internal space of the housing 190 into two spaces by the sub-board 130 which is one hard board, the function that the phenomenon that can occur due to one space is executed in the other space is executed. The adverse effect on the above can be minimized.
　サブ基板１３０は、情報用ＬＥＤ１３１、明示用ＬＥＤ１３２及びタクタイルスイッチ１３３が実装された領域を取り囲む接地線であるＧＮＤ線１３４を有する。このようなＧＮＤ線１３４を設けることにより、開口部１９３側からメイン基板１７０へ向かう電磁波を遮断する効果を期待できる。なお、ＧＮＤ線１３４は、環状に閉じていなくてもよく、一部が欠けていても一定の遮断効果を期待できる。また、ＧＮＤ線１３４は、ライン状でなくてもよく、素子が実装されていない領域をＧＮＤ領域としてもよい。 The sub-board 130 has a GND wire 134 which is a ground wire surrounding an area in which the information LED 131, the explicit LED 132, and the tactile switch 133 are mounted. By providing such a GND wire 134, the effect of blocking electromagnetic waves from the opening 193 side toward the main substrate 170 can be expected. The GND line 134 does not have to be closed in an annular shape, and a certain blocking effect can be expected even if a part of the GND line 134 is missing. Further, the GND line 134 does not have to be in a line shape, and a region in which an element is not mounted may be used as a GND region.
　図５は、主にＵＩユニット２００、ベースフレーム１５０及びメイン基板１７０のそれぞれの構成と相互の配置関係を示す斜視図である。ボタンパッド１２３、シェーディングパッド１２２およびマスクシート１２１は、サブ基板１３０の実装面上に積層されて組み付けられ、サブ基板１３０と共にＵＩユニット２００を構成する。 FIG. 5 is a perspective view mainly showing the respective configurations of the UI unit 200, the base frame 150, and the main board 170 and their mutual arrangement relationships. The button pad 123, the shading pad 122, and the mask sheet 121 are laminated and assembled on the mounting surface of the sub-board 130, and together with the sub-board 130, form the UI unit 200.
　ベースフレーム１５０は、上述のように全体としてＬ字形状を成す。具体的には、長手方向にＬ字の一辺を形成する環状部１５１と、環状部１５１に直交して延在し、高さ方向にＬ字の他辺を形成する直交部１５３とを有する。環状部１５１は、長手方向と短手方向で周回するように形成されており、サブ基板１３０の下面の周囲を受けることができる。 The base frame 150 has an L-shape as a whole as described above. Specifically, it has an annular portion 151 that forms one side of the L-shape in the longitudinal direction, and an orthogonal portion 153 that extends orthogonally to the annular portion 151 and forms the other side of the L-shape in the height direction. The annular portion 151 is formed so as to orbit in the longitudinal direction and the lateral direction, and can receive the periphery of the lower surface of the sub-board 130.
　環状部１５１には、短手方向に横切るように形成された一つ以上の梁部１５２が形成されており、梁部１５２は、サブ基板１３０の下面を支える。すなわち、環状部１５１と梁部１５２は、サブ基板１３０の下面を受けるサブ基板受け部として機能する。具体的には、サブ基板１３０は、ＵＩユニット２００の状態でサブ基板受け部に載置され、例えば接着剤により固定される。このような構造を採用することにより、ユーザによって押しボタンが強く押されても容易に変形しない剛性を確保すると共に、組み立て時において、サブ基板１３０とメイン基板１７０の電気的な接続を容易に行うことを可能にする。 The annular portion 151 is formed with one or more beam portions 152 formed so as to cross in the lateral direction, and the beam portions 152 support the lower surface of the sub-board 130. That is, the annular portion 151 and the beam portion 152 function as a sub-board receiving portion that receives the lower surface of the sub-board 130. Specifically, the sub-board 130 is placed on the sub-board receiving portion in the state of the UI unit 200, and is fixed by, for example, an adhesive. By adopting such a structure, the rigidity that does not easily deform even if the push button is strongly pressed by the user is ensured, and the sub-board 130 and the main board 170 are easily electrically connected at the time of assembly. Make it possible.
　メイン基板１７０は、略矩形形状であり、直交する２辺の近傍がそれぞれ環状部１５１と直交部１５３に支持されるようにベースフレーム１５０に取り付けられている。このように２辺でベースフレーム１５０に取り付けることにより、メイン基板１７０が歪むことを更に抑制することができる。 The main substrate 170 has a substantially rectangular shape, and is attached to the base frame 150 so that the vicinity of two orthogonal sides is supported by the annular portion 151 and the orthogonal portion 153, respectively. By attaching to the base frame 150 on two sides in this way, it is possible to further suppress distortion of the main substrate 170.
　ファイバロック機構１４１は、ベースフレーム１５０の直交部１５３に支持され、固定されている。ファイバロック機構１４１は、投光用光ファイバ１４２の端面及び受光用光ファイバ１４３の端面をそれぞれ精確に投光ＬＥＤ１６１及び受光ＰＤ１６２に対向させる機能を担うので、位置ずれには特に敏感である。図示するように、ファイバロック機構１４１は、全体を箱型にして剛性を高め、その上、長手方向の全体に亘って直交部１５３によって支持されているので、外部からの荷重に対して特に歪みや位置ずれが生じにくい構造となっている。 The fiber lock mechanism 141 is supported and fixed to the orthogonal portion 153 of the base frame 150. Since the fiber lock mechanism 141 has a function of accurately facing the end face of the light projecting optical fiber 142 and the end face of the light receiving optical fiber 143 to the light emitting LED 161 and the light receiving PD 162, respectively, it is particularly sensitive to misalignment. As shown in the figure, the fiber lock mechanism 141 has a box shape as a whole to increase the rigidity, and is further supported by the orthogonal portion 153 over the entire longitudinal direction, so that the fiber lock mechanism 141 is particularly distorted by an external load. It has a structure that does not easily cause misalignment.
　図６は、図５に示す環状部１５１の中央付近でｘｚ平面と平行に切断して、ｙ軸正の側から観察した様子を示す断面斜視図である。なお、図の見やすさを優先し、断面のハッチングを省いている。 FIG. 6 is a cross-sectional perspective view showing a state in which the annular portion 151 shown in FIG. 5 is cut in parallel with the xz plane near the center and observed from the positive side of the y-axis. In addition, priority is given to the legibility of the figure, and hatching of the cross section is omitted.
　投光ＬＥＤ１６１及び受光ＰＤ１６２は、メイン基板１７０の一側方である先端側に寄せて実装されており、それぞれの発光部及び受光部は、ファイバロック機構１４１の内部へ挿入されている。より具体的には、投光ＬＥＤ１６１及び受光ＰＤ１６２は、その発光部及び受光部がメイン基板１７０の先端側縁から突出するように、実装面にはんだ付けされている。 The light emitting LED 161 and the light receiving PD 162 are mounted close to the tip side, which is one side of the main board 170, and the light emitting portion and the light receiving portion are inserted into the fiber lock mechanism 141. More specifically, the light emitting LED 161 and the light receiving PD 162 are soldered to the mounting surface so that the light emitting portion and the light receiving portion project from the front end side edge of the main substrate 170.
　情報用ＬＥＤ１３１は、サブ基板１３０の実装面のうち、メイン基板１７０の一側方に対応する領域、すなわち先端側の領域に実装されている。サブ基板１３０の実装面に密着して配置されているシェーディングパッド１２２は、情報用ＬＥＤ１３１に対応した貫通孔１２５が設けられており、貫通孔１２５は、情報用ＬＥＤ１３１が発する光を開口部１９３方向へ通過させる。 The information LED 131 is mounted in a region corresponding to one side of the main board 170, that is, a region on the tip side of the mounting surface of the sub-board 130. The shading pad 122 arranged in close contact with the mounting surface of the sub-board 130 is provided with a through hole 125 corresponding to the information LED 131, and the through hole 125 emits light emitted by the information LED 131 in the opening 193 direction. Pass through.
　シェーディングパッド１２２は、少なくとも貫通孔１２５の内面を白色にして情報用ＬＥＤ１３１が発する光を内面反射させるようにしてもよい。このように貫通孔１２５の内面を白色にすれば、情報用ＬＥＤ１３１の視認性を高めることができる。一方で、シェーディングパッド１２２は、貫通孔１２５以外の空間へ情報用ＬＥＤ１３１が発する光を漏らさないように、サブ基板１３０の実装面に対しては密着していることが好ましい。そのため、例えばシェーディングパッド１２２をサブ基板１３０の実装面に対して熱圧着させてもよい。 The shading pad 122 may have at least the inner surface of the through hole 125 white and reflect the light emitted by the information LED 131 on the inner surface. By making the inner surface of the through hole 125 white in this way, the visibility of the information LED 131 can be improved. On the other hand, the shading pad 122 is preferably in close contact with the mounting surface of the sub-board 130 so as not to leak the light emitted by the information LED 131 to the space other than the through hole 125. Therefore, for example, the shading pad 122 may be heat-bonded to the mounting surface of the sub-board 130.
　タクタイルスイッチ１３３は、サブ基板１３０の実装面のうち、メイン基板１７０の一側方とは反対の領域、すなわち後端側の領域に実装されている。タクタイルスイッチ１３３は、基板実装タイプのモーメンタリ動作スイッチである。ボタンパッド１２３は、図示するように、それぞれのタクタイルスイッチ１３３に対応する個別のキートップ１２４を有し、それぞれのキートップ１２４を薄肉部で連接している。このような構成により、ユーザは、特定のキートップ１２４をサブ基板１３０へ向かう方向へ押し下げると、当該キートップ１２４のみが押し下げられ、その底面が直下のタクタイルスイッチ１３３の操作部を押し下げてオン状態にする。ユーザが押下操作をやめると、キートップ１２４が持ち上がり、タクタイルスイッチ１３３はオフ状態に戻る。 The tactile switch 133 is mounted in a region of the mounting surface of the sub-board 130 opposite to one side of the main board 170, that is, a region on the rear end side. The tactile switch 133 is a board-mounted type momentary operation switch. As shown in the figure, the button pad 123 has individual key tops 124 corresponding to the respective tactile switches 133, and the respective key tops 124 are connected by a thin portion. With such a configuration, when the user pushes down a specific key top 124 in the direction toward the sub-board 130, only the key top 124 is pushed down, and the bottom surface of the key top 124 pushes down the operation unit of the tactile switch 133 directly underneath to turn it on. To. When the user stops pressing, the key top 124 is lifted and the tactile switch 133 returns to the off state.
　このように、タクタイルスイッチ１３３をハード基板に実装し、さらに、ベースフレーム１５０の環状部１５１と梁部１５２で当該ハード基板を受ける構造としたので、ユーザの操作力が多少大きくても、周辺の構造体に大きな歪みを生じさせることがない。また、タクタイルスイッチ１３３の周辺の構造体に若干の歪みが生じるような場合であっても、タクタイルスイッチ１３３は投受光素子から遠い位置に実装されているので、投受光素子の周辺部へ過剰な荷重が伝達することを防ぐことができる。また、一つのハード基板上にタクタイルスイッチ１３３と情報用ＬＥＤ１３１を実装するので、剛性の確保に加え、光電センサ１００の組立て容易性にも寄与する。さらに、スイッチと発光素子が一つのハード基板に配置されているので、ユーザは情報を確認しながら操作がしやすいという点において良好な操作性も期待できる。 In this way, the tactile switch 133 is mounted on the hard board, and the ring portion 151 and the beam portion 152 of the base frame 150 receive the hard board. It does not cause large distortion in the structure. Further, even if the structure around the tactile switch 133 is slightly distorted, since the tactile switch 133 is mounted at a position far from the light emitting / receiving element, it is excessive to the peripheral portion of the light receiving / receiving element. It is possible to prevent the load from being transmitted. Further, since the tactile switch 133 and the information LED 131 are mounted on one hard substrate, it contributes to the ease of assembling the photoelectric sensor 100 in addition to ensuring the rigidity. Further, since the switch and the light emitting element are arranged on one hard board, good operability can be expected in that the user can easily operate while checking the information.
　明示用ＬＥＤ１３２は、後述する調整ボタンをユーザにわかりやすく明示するための発光素子であり、サブ基板１３０の実装面のうち、調整ボタンを構成するタクタイルスイッチ１３３の近傍に実装されている。ボタンパッド１２３は、明示用ＬＥＤ１３２が実装された領域に切欠きを有し、また、シェーディングパッド１２２は、明示用ＬＥＤが発する光を開口部１９３方向へ通過させる貫通孔１２５を有する。 The explicit LED 132 is a light emitting element for clearly indicating the adjustment button described later to the user, and is mounted in the vicinity of the tactile switch 133 constituting the adjustment button on the mounting surface of the sub-board 130. The button pad 123 has a notch in the area where the explicit LED 132 is mounted, and the shading pad 122 has a through hole 125 for passing the light emitted by the explicit LED in the opening 193 direction.
　このように、ハード基板で分割した第１空間側に情報用ＬＥＤ１３１及び明示用ＬＥＤ１３２を配置したので、第２空間側にこれらの光が回り込むことを抑制できる。すなわち、これらが発する光がセンシング機能に及ぼす悪影響を回避し得る。また、ハード基板は、投光ＬＥＤ１６１の光が第１空間側に回り込むことも抑制するので、投光ＬＥＤ１６１の光が表示部２１０の視認性を低下させる恐れも軽減される。 In this way, since the information LED 131 and the explicit LED 132 are arranged on the first space side divided by the hard board, it is possible to suppress the light from wrapping around to the second space side. That is, it is possible to avoid the adverse effect of the light emitted by these on the sensing function. Further, since the hard substrate also suppresses the light of the light projecting LED 161 from wrapping around to the first space side, the possibility that the light of the light projecting LED 161 reduces the visibility of the display unit 210 is reduced.
　なお、本実施形態においては、表示部２１０の発光素子として７セグメント表示用のチップＬＥＤを用いるが、他の発光素子を利用してもよい。バックライトを備えた小型の液晶パネルや、自発光の有機ＥＬパネルなどの表示パネルを発光素子としてサブ基板１３０に実装してもよい。また、ユーザの操作力を受けるスイッチも、タクタイルスイッチに限らず、面実装し得るスイッチであればよい。例えば、複数のスイッチが連続して形成されたメンブレンスイッチを採用してもよい。また、ボタンパッド１２３は、ゴム成形シートでなくてもよく、例えば樹脂成形品であってもよい。さらに、キートップは互いに連接されていなくてもよく、面実装されるスイッチが個々にキートップを備える構成であってもよい。 In the present embodiment, the chip LED for 7-segment display is used as the light emitting element of the display unit 210, but other light emitting elements may be used. A display panel such as a small liquid crystal panel provided with a backlight or a self-luminous organic EL panel may be mounted on the sub-board 130 as a light emitting element. Further, the switch that receives the operation force of the user is not limited to the tactile switch, and may be a switch that can be surface-mounted. For example, a membrane switch in which a plurality of switches are continuously formed may be adopted. Further, the button pad 123 does not have to be a rubber molded sheet, and may be, for example, a resin molded product. Further, the key tops may not be connected to each other, and the surface-mounted switches may be individually provided with the key tops.
　図７は、開閉カバー１１０を閉じた状態の光電センサ１００を上方から観察した図であり、ＵＩユニット２００の各部を説明する図である。上述のように、それぞれの押しボタンは、タクタイルスイッチ１３３とその上部に配置されたキートップ１２４によって構成される。ここでは、このような組み合わせによって配置された各ボタンの機能と配置について説明する。 FIG. 7 is a view of the photoelectric sensor 100 in a state where the opening / closing cover 110 is closed, and is a view for explaining each part of the UI unit 200. As described above, each push button is composed of a tactile switch 133 and a key top 124 located above it. Here, the function and arrangement of each button arranged by such a combination will be described.
　操作部２２０は、４つの押しボタンを有する。具体的には、２つの変更ボタン２２１と、決定ボタン２２２と、調整ボタン２２３である。２つの変更ボタン２２１は、表示部２１０で表示される数値を変更させる押しボタンであり、一方の＋ボタンを押せば数値が増加し、－ボタンを押せば数値が減少する。変更ボタン２２１は、発光する表示部２１０に隣接して設けられている。 The operation unit 220 has four push buttons. Specifically, there are two change buttons 221 and an enter button 222 and an adjustment button 223. The two change buttons 221 are push buttons for changing the numerical value displayed on the display unit 210. If one of the + buttons is pressed, the numerical value is increased, and if the-button is pressed, the numerical value is decreased. The change button 221 is provided adjacent to the light emitting display unit 210.
　決定ボタン２２２は、変化された数値や選択された項目を決定するための押しボタンである。ユーザは、例えば表示部２１０の数値を変更ボタン２２１によって変化させつつセンシングの応答時間を調整し、決定ボタン２２２を押せばその数値に対応する応答時間を光電センサ１００に設定することができる。また、変更ボタン２２１で項目を変更し、決定ボタン２２２でその変更された項目に決定することができる。また、決定ボタン２２２は、稼働モードと設定モードを切り替えるモード切替ボタンとしても利用される。決定ボタン２２２は、変更ボタン２２１と調整ボタン２２３の間に設けられている。 The decision button 222 is a push button for determining a changed numerical value or a selected item. For example, the user can adjust the sensing response time while changing the numerical value of the display unit 210 with the change button 221 and press the enter button 222 to set the response time corresponding to the numerical value in the photoelectric sensor 100. Further, the change button 221 can be used to change the item, and the enter button 222 can be used to determine the changed item. The decision button 222 is also used as a mode switching button for switching between the operation mode and the setting mode. The decision button 222 is provided between the change button 221 and the adjustment button 223.
　調整ボタン２２３は、検出光の検出で適用される基準値の自動調整を開始させる押しボタンである。調整ボタン２２３が押されると、光電センサ１００の処理部は、設定された検出値が得られるように、投光パワー、受光ゲイン及び検出閾値の最適調整を実行する。 The adjustment button 223 is a push button that starts automatic adjustment of the reference value applied in the detection of the detected light. When the adjustment button 223 is pressed, the processing unit of the photoelectric sensor 100 executes optimum adjustment of the light projection power, the light receiving gain, and the detection threshold value so that the set detection value can be obtained.
　調整ボタン２２３が押されると、それまで手動で調整されていた調整値は破棄されるので、調整ボタン２２３がユーザに誤って押されたり、何かに触れて押されてしまったりすることをできるだけ防ぎたい。そこで、調整ボタン２２３は、隣接する決定ボタン２２２と、他の隣接する押しボタンどうしの間隔よりも離して配置され、しかも、複数の押しボタンのうち最も端に配置されている。変更ボタン２２１は、表示部２１０に隣接して配置されているので、調整ボタン２２３は、ＵＩユニット２００において最も後端側に配置されていることになる。 When the adjustment button 223 is pressed, the adjustment value that was manually adjusted up to that point is discarded, so it is possible to prevent the adjustment button 223 from being accidentally pressed by the user or being pressed by touching something. I want to prevent it. Therefore, the adjustment button 223 is arranged at a distance from the adjacent decision button 222 and the other adjacent push buttons, and is arranged at the end of the plurality of push buttons. Since the change button 221 is arranged adjacent to the display unit 210, the adjustment button 223 is arranged on the rearmost end side of the UI unit 200.
　開閉カバー１１０は、ベースフレーム１５０の最も後端側に設けられたヒンジ受け１５４周りに回転する。すなわち、調整ボタン２２３の近傍にヒンジ受け１５４が存在することになるので、開閉カバー１１０がユーザの指の容易な進入を妨げ、調整ボタン２２３を押しにくくしている。 The opening / closing cover 110 rotates around the hinge receiver 154 provided on the rearmost end side of the base frame 150. That is, since the hinge receiver 154 exists in the vicinity of the adjustment button 223, the open / close cover 110 hinders the user's finger from easily entering and makes it difficult to press the adjustment button 223.
　明示用ＬＥＤ１３２は、調整ボタン２２３の存在及び調整状態をユーザに認識させるために設けられている。具体的には、明示用ＬＥＤ１３２は、調整ボタン２２３と決定ボタン２２２の間に設けられ、調整ボタン２２３に関連するＬＥＤであることがわかるように、枠と文字がマスクシート１２１に印刷されている。明示用ＬＥＤ１３２は、例えば、自動調整が行われていない状態においては点滅し、自動調整が完了している状態においては点灯する。 The explicit LED 132 is provided so that the user can recognize the existence and the adjustment state of the adjustment button 223. Specifically, the explicit LED 132 is provided between the adjustment button 223 and the decision button 222, and a frame and characters are printed on the mask sheet 121 so that it can be seen that the LED is related to the adjustment button 223. .. For example, the explicit LED 132 blinks when the automatic adjustment is not performed, and lights up when the automatic adjustment is completed.
　特別な押しボタンの存在及び調整状態を明示する明示用ＬＥＤ１３２を、このようにハード基板であるサブ基板１３０の実装面において後端側の領域に配置することにより、投受光素子の近傍にその光が回り込むことを抑制できる。すなわち、明示用ＬＥＤ１３２が発する光がセンシング機能に及ぼす悪影響を回避し得る。また、誤って押されることを防ぐために調整ボタン２２３を決定ボタン２２２から離したスペースに明示用ＬＥＤ１３２を配置したので、サブ基板１３０の長手方向の短小化においても好ましい。 By arranging the explicit LED 132 that clearly indicates the existence and adjustment state of the special push button in the area on the rear end side of the mounting surface of the sub-board 130, which is a hard board, the light is emitted in the vicinity of the light-receiving element. Can be suppressed from wrapping around. That is, it is possible to avoid the adverse effect of the light emitted by the explicit LED 132 on the sensing function. Further, since the explicit LED 132 is arranged in a space away from the adjustment button 223 and the decision button 222 in order to prevent accidental pressing, it is also preferable for shortening the sub-board 130 in the longitudinal direction.
　図８は、ベースフレーム１５０、メイン基板１７０及びシールド板１８０の関係を示す図である。ベースフレーム１５０は、上述のように環状部１５１と直交部１５３でＬ字形状を成すが、図示するように、環状部１５１と直交部１５３を三角板状に接続するトラス部１５５を有する。このようなトラス部１５５は、ベースフレーム１５０の剛性を高める。 FIG. 8 is a diagram showing the relationship between the base frame 150, the main substrate 170, and the shield plate 180. The base frame 150 has an L-shape with the annular portion 151 and the orthogonal portion 153 as described above, but has a truss portion 155 connecting the annular portion 151 and the orthogonal portion 153 in a triangular plate shape as shown in the figure. Such a truss portion 155 increases the rigidity of the base frame 150.
　メイン基板１７０は、第１実装面１７０ａと第２実装面１７０ｂを有する。第１実装面１７０ａには、接地線に接続されたＧＮＤランド１７１、及び受光ＰＤ１６２の受光信号を増幅する増幅素子１７２が設けられている。メイン基板１７０は、取付孔１７３を複数箇所に有し、ベースフレーム１５０の対応箇所に設けられた取付部１５７に位置合わせされ、ビスで固定される。トラス部１５５は、固定されたメイン基板１７０の第２実装面１７０ｂ側に位置する。なお、第１実装面１７０ａ側にはトラス部は設けられていない。 The main board 170 has a first mounting surface 170a and a second mounting surface 170b. The first mounting surface 170a is provided with a GND land 171 connected to the ground wire and an amplification element 172 that amplifies the light receiving signal of the light receiving PD 162. The main board 170 has mounting holes 173 at a plurality of locations, is aligned with mounting portions 157 provided at corresponding locations of the base frame 150, and is fixed with screws. The truss portion 155 is located on the second mounting surface 170b side of the fixed main board 170. The truss portion is not provided on the first mounting surface 170a side.
　このように固定された略矩形であるメイン基板１７０の四辺の側縁のうち、サブ基板１３０に対向する長手方向の側縁を開口側縁１７０ｃとし、筐体１９０に収容されたときに底部側に位置する長手方向の側縁を底部側縁１７０ｄとする。 Of the side edges of the four sides of the main board 170, which is a substantially rectangular shape fixed in this way, the side edge in the longitudinal direction facing the sub board 130 is the opening side edge 170c, and the bottom side when housed in the housing 190. The side edge in the longitudinal direction located at is defined as the bottom side edge 170d.
　シールド板１８０は、外部からメイン基板１７０へ向かう電磁波を遮断する電磁遮蔽板であり、第１実装面１７０ａ及び第２実装面１７０ｂのうち特に電磁波を遮断したい回路領域を覆う形状を有する。増幅素子１７２は、外部からの電磁波の影響を受けやすい素子であるので、シールド板１８０によって覆われる回路領域に位置する。シールド板１８０は、例えば銅板である金属単板を折り曲げて形成され、長手方向から観察した場合に全体としてＵ字形状を成す。シールド板１８０は、メイン基板１７０をＵ字形状の内側に取り込むように配置される。より具体的には、シールド板１８０は、メイン基板１７０の第１実装面１７０ａと第２実装面１７０ｂとを、開口側縁１７０ｃとは反対側の底部側縁１７０ｄを跨いで覆うように配置される。 The shield plate 180 is an electromagnetic shield plate that blocks electromagnetic waves from the outside toward the main substrate 170, and has a shape that covers a circuit region of the first mounting surface 170a and the second mounting surface 170b in which electromagnetic waves are particularly desired to be blocked. Since the amplification element 172 is an element that is easily affected by electromagnetic waves from the outside, it is located in a circuit region covered by the shield plate 180. The shield plate 180 is formed by bending a metal veneer, which is a copper plate, for example, and has a U-shape as a whole when observed from the longitudinal direction. The shield plate 180 is arranged so as to take in the main substrate 170 inside the U-shape. More specifically, the shield plate 180 is arranged so as to cover the first mounting surface 170a and the second mounting surface 170b of the main board 170 so as to straddle the bottom side edge 170d on the side opposite to the opening side edge 170c. NS.
　配置面１５６は、シールド板１８０の側部をベースフレーム１５０の表面に沿わせて配置するために直交部１５３に設けられた受け面である。配置面１５６は、メイン基板１７０の第１実装面１７０ａに対して底部側縁１７０ｄ側より開口側縁１７０ｃ側の高さが高くなる傾斜を有する。このような傾斜を設けることにより、後述するはんだ付けの作業が容易になる。 The arrangement surface 156 is a receiving surface provided on the orthogonal portion 153 for arranging the side portion of the shield plate 180 along the surface of the base frame 150. The arrangement surface 156 has an inclination such that the height of the opening side edge 170c side is higher than that of the bottom side edge 170d side with respect to the first mounting surface 170a of the main substrate 170. By providing such an inclination, the soldering work described later becomes easy.
　図９は、シールド板１８０がメイン基板１７０を覆う様子を一方向から観察した斜視図である。具体的には、主にメイン基板１７０の第１実装面１７０ａがシールド板１８０の第１面１８０ａに覆われている様子を示す。シールド板１８０の第１面１８０ａの側部は、直交部１５３に設けられた配置面１５６、及び環状部１５１に設けられた配置面１５８に載せられて配置される。これにより、第１面１８０ａは、第１実装面１７０ａから離間された状態で維持される。すなわち、実装面上の素子と接触することがなく、回路に損傷を与えるおそれがない。シールド板１８０の第３面１８０ｃは、第１面１８０ａに続くシールド面であり、底部側縁１７０ｄの底部側空間を通過して反対のシールド面へ接続される。 FIG. 9 is a perspective view of the shield plate 180 covering the main substrate 170 from one direction. Specifically, it shows a state in which the first mounting surface 170a of the main substrate 170 is mainly covered with the first surface 180a of the shield plate 180. The side portion of the first surface 180a of the shield plate 180 is placed on the arrangement surface 156 provided on the orthogonal portion 153 and the arrangement surface 158 provided on the annular portion 151. As a result, the first surface 180a is maintained in a state of being separated from the first mounting surface 170a. That is, it does not come into contact with the element on the mounting surface, and there is no risk of damaging the circuit. The third surface 180c of the shield plate 180 is a shield surface following the first surface 180a, passes through the bottom side space of the bottom side edge 170d, and is connected to the opposite shield surface.
　シールド板１８０は、第１面１８０ａから第１実装面１７０ａへ向かって延出する延出部１８１を有する。延出部１８１は、その先端部に、底部側縁１７０ｄへ向けて折り曲げられた折曲部１８２を含む。延出部１８１は、ＧＮＤランド１７１に対応する位置に設けられており、シールド板１８０がベースフレーム１５０に配置された状態においては、折曲部１８２がＧＮＤランド１７１に接触する。折曲部１８２がＧＮＤランド１７１にはんだ付けされることにより、メイン基板１７０の接地線は、シールド板１８０と同電位（接地電位）となる。このような延出部１８１を設けることにより、シールド板１８０の成形時のばらつきに起因する第１実装面１７０ａに対する浮きを吸収することができる。また、シールド板１８０に外力が加わっても延出部１８１が撓むので、はんだがダメージを受けて断線してしまうことを回避できる。 The shield plate 180 has an extending portion 181 extending from the first surface 180a toward the first mounting surface 170a. The extending portion 181 includes a bent portion 182 bent toward the bottom side edge 170d at the tip end portion thereof. The extending portion 181 is provided at a position corresponding to the GND land 171, and when the shield plate 180 is arranged on the base frame 150, the bent portion 182 comes into contact with the GND land 171. By soldering the bent portion 182 to the GND land 171, the ground wire of the main board 170 becomes the same potential (ground potential) as the shield plate 180. By providing such an extending portion 181, it is possible to absorb the floating of the shield plate 180 with respect to the first mounting surface 170a due to the variation during molding. Further, since the extending portion 181 bends even when an external force is applied to the shield plate 180, it is possible to prevent the solder from being damaged and breaking.
　本実施形態においてＧＮＤランド１７１は、第１実装面１７０ａにおいて開口側縁１７０ｃよりも底部側縁１７０ｄに近い位置に設けられている。このようにＧＮＤランド１７１が底部側縁１７０ｄに寄せて設けられることにより、シールド板１８０の組付け時において延出部１８１が第１実装面１７０ａ上の素子に引っ掛かり変形してしまう不具合、及び第１実装面１７０ａに実装された素子を破損させる不具合を回避することができる。 In the present embodiment, the GND land 171 is provided on the first mounting surface 170a at a position closer to the bottom side edge 170d than the opening side edge 170c. Since the GND land 171 is provided close to the bottom side edge 170d in this way, the extension portion 181 is caught by the element on the first mounting surface 170a and deformed when the shield plate 180 is assembled. 1 It is possible to avoid a problem of damaging the element mounted on the mounting surface 170a.
　また、折曲部１８２は、底部側縁１７０ｄへ向けて折り曲げられているので、シールド板１８０をベースフレーム１５０に組付ける工程において、第１実装面１７０ａの表面に倣って摺動し、位置決めされる。したがって、ＧＮＤランド１７１が底部側縁１７０ｄから多少離れた位置に設けられていても、組付け時に延出部１８１が中折れしてしまう不具合を回避することができる。 Further, since the bent portion 182 is bent toward the bottom side edge 170d, in the step of assembling the shield plate 180 to the base frame 150, the bent portion 182 is slid and positioned according to the surface of the first mounting surface 170a. NS. Therefore, even if the GND land 171 is provided at a position slightly away from the bottom side edge 170d, it is possible to avoid a problem that the extension portion 181 is bent in the middle during assembly.
　また、上述のように、配置面１５６は第１実装面１７０ａに対して底部側縁１７０ｄ側より開口側縁１７０ｃ側の高さが高くなる傾斜を有するので、シールド板１８０をより安定的に組み付けることができる。また、延出部１８１の長さをその分短くすることができるので、はんだ付けも容易となる。また、上述のように、第１実装面１７０ａ側にはベースフレーム１５０にトラス部が設けられていないので、はんだ付けの作業が容易に行える。 Further, as described above, since the arrangement surface 156 has an inclination such that the height of the opening side edge 170c side is higher than that of the bottom side edge 170d side with respect to the first mounting surface 170a, the shield plate 180 is assembled more stably. be able to. Further, since the length of the extending portion 181 can be shortened by that amount, soldering becomes easy. Further, as described above, since the base frame 150 is not provided with the truss portion on the first mounting surface 170a side, the soldering work can be easily performed.
　図１０は、シールド板１８０がメイン基板１７０を覆う様子を他方向から観察した斜視図である。具体的には、主にメイン基板１７０の第２実装面１７０ｂがシールド板１８０の第２面１８０ｂに覆われている様子を示す。第２面１８０ｂは、上述の第３面１８０ｃから連続するシールド面である。第２面１８０ｂの側部を含む周縁部は、直交部１５３と連続するトラス部１５５の表面に載せられて配置される。これにより、第２面１８０ｂは、第２実装面１７０ｂから離間された状態で維持される。 FIG. 10 is a perspective view of the shield plate 180 covering the main substrate 170 as observed from another direction. Specifically, it shows a state in which the second mounting surface 170b of the main board 170 is mainly covered with the second surface 180b of the shield plate 180. The second surface 180b is a shield surface continuous from the above-mentioned third surface 180c. The peripheral edge portion including the side portion of the second surface 180b is placed on the surface of the truss portion 155 continuous with the orthogonal portion 153 and arranged. As a result, the second surface 180b is maintained in a state of being separated from the second mounting surface 170b.
　シールド板１８０の第２面１８０ｂには、繋止穴１８３が設けられている。また、ベースフレーム１５０のトラス部１５５には、繋止穴１８３を繋止する繋止爪１５９が設けられている。繋止穴１８３は、メイン基板１７０を挟み込むようにシールド板１８０を開口部方向へ組み立て作業者がスライドさせると、繋止爪１５９に嵌まり込む。このように、組み立て作業者は、シールド板１８０をベースフレーム１５０へ容易に組み付けることができる。また、このように第２面１８０ｂ側でベースフレーム１５０に繋止されると、第１面１８０ａ側で行うはんだ付け作業が容易になる。 A retaining hole 183 is provided on the second surface 180b of the shield plate 180. Further, the truss portion 155 of the base frame 150 is provided with a lashing claw 159 for tying the lashing hole 183. The retaining hole 183 fits into the retaining claw 159 when the shield plate 180 is slid toward the opening so as to sandwich the main substrate 170. In this way, the assembling worker can easily assemble the shield plate 180 to the base frame 150. Further, when the second surface 180b side is connected to the base frame 150 in this way, the soldering work performed on the first surface 180a side becomes easy.
　繋止穴１８３は、第２面１８０ｂに設けられることが好ましい。すなわち、繋止穴１８３と繋止爪１５９による繋止部は、第１実装面１７０ａの側ではなく、第２実装面１７０ｂの側に設けられる。第１面１８０ａは、外部からの電磁波の影響を受けやすい増幅素子１７２を覆うので、電磁波の進入経路となり得る穴部を設けないことが好ましい。なお、繋止爪１５９は直交部１５３に設けてもよいが、本実施形態のようにトラス部１５５を第２面１８０ｂの配置面として利用するのであれば、繋止爪１５９もこの配置面に設けることが好ましい。 The retaining hole 183 is preferably provided on the second surface 180b. That is, the anchoring hole 183 and the anchoring portion by the anchoring claw 159 are provided not on the side of the first mounting surface 170a but on the side of the second mounting surface 170b. Since the first surface 180a covers the amplification element 172 that is easily affected by electromagnetic waves from the outside, it is preferable not to provide a hole that can serve as an entry path for electromagnetic waves. The tether claw 159 may be provided on the orthogonal portion 153, but if the truss portion 155 is used as the arrangement surface of the second surface 180b as in the present embodiment, the tether claw 159 is also provided on this arrangement surface. It is preferable to provide it.
　以上説明したように、Ｕ字形状のシールド板１８０を採用することにより、各実装面を個別にシールドするより、部品点数も組立て工数も軽減することができる。特に、延出部１８１を設けることにより、メイン基板３７０の接地線と容易に接続でき、また、メイン基板３７０の実装面と離間した状態を維持することもできる。また、サブ基板１３０も外部からメイン基板３７０へ向かう電磁波をある程度遮断できるので、シールド板１８０がメイン基板１７０の底部側縁１７０ｄを跨いで両実装面を覆うことにより、全周に亘って外部からの電磁波の影響を軽減することができる。 As described above, by adopting the U-shaped shield plate 180, the number of parts and the assembly man-hours can be reduced as compared with shielding each mounting surface individually. In particular, by providing the extension portion 181, it can be easily connected to the ground wire of the main board 370, and the state of being separated from the mounting surface of the main board 370 can be maintained. Further, since the sub-board 130 can also block electromagnetic waves from the outside toward the main board 370 to some extent, the shield plate 180 straddles the bottom side edge 170d of the main board 170 and covers both mounting surfaces, so that the entire circumference is covered from the outside. The influence of electromagnetic waves can be reduced.
　図１１は、メイン基板の他の構成例を示す図である。これまで説明した実施形態においては、メイン基板１７０に投光ＬＥＤ１６１及び受光ＰＤ１６２が実装される場合を説明した。しかし、ハード基板であるサブ基板１３０によって筐体１９０の内部空間を第１空間と第２空間を分割するという構成においては、メイン基板１７０は単一基板でなくても構わない。すなわち、押しボタン操作に伴う過剰な荷重が投受光素子の周辺部へ伝達することを防いだり、発光素子の迷光が受光素子の周辺部へ到達したりすることを防ぐという観点においては、第２空間に収容される基板が複数であっても構わない。 FIG. 11 is a diagram showing another configuration example of the main board. In the embodiments described so far, the case where the light projecting LED 161 and the light receiving PD 162 are mounted on the main board 170 has been described. However, in the configuration in which the internal space of the housing 190 is divided into the first space and the second space by the sub-board 130 which is a hard board, the main board 170 does not have to be a single board. That is, from the viewpoint of preventing the excessive load due to the push button operation from being transmitted to the peripheral portion of the light receiving / receiving element and preventing the stray light of the light emitting element from reaching the peripheral portion of the light receiving element, the second There may be a plurality of substrates accommodated in the space.
　図１１は、投光ＬＥＤ１６１及び受光ＰＤ１６２が実装された投受光基板３８０が、メイン基板３７０とは分離した構成である構成例を示す。メイン基板３７０と投受光基板３８０は、例えばコネクタを介して電気的に接続される。また、メイン基板３７０は、ファイバロック機構１４１に支持される構成であっても良い。なお、シールド板１８０は、メイン基板３７０と共に投受光基板３８０もＵ字形状の内側に取り込むように配置されることが好ましい。 FIG. 11 shows a configuration example in which the light emitting / receiving board 380 on which the light emitting LED 161 and the light receiving PD 162 are mounted is separated from the main board 370. The main board 370 and the light receiving / receiving board 380 are electrically connected via, for example, a connector. Further, the main substrate 370 may have a configuration supported by the fiber lock mechanism 141. It is preferable that the shield plate 180 is arranged so that the light emitting / receiving substrate 380 is also taken into the U-shape together with the main substrate 370.
　以上の光電センサ１００は、説明した様々な効果が共に得られるように構成されたものである。したがって、他の技術的な要請により付随的な効果をもたらすある構成を採用しない場合もあり得る。そのような場合であっても、本発明が主に意図する効果が得られる構成であれば、本発明に係る実施形態となり得る。例えば、サブ基板１３０をハード基板で構成し、ボタンを投受光素子の側とは反対側に配置することによって過剰な荷重が投受光素子の周辺部へ伝達しないようにすることを主に意図するのであれば、シールド板１８０がＵ字形状でなくても構わない。 The above photoelectric sensor 100 is configured so that the various effects described above can be obtained together. Therefore, it may not be possible to adopt certain configurations that have ancillary effects due to other technical requirements. Even in such a case, the embodiment according to the present invention can be used as long as the configuration is such that the effect mainly intended by the present invention can be obtained. For example, it is mainly intended that the sub-board 130 is composed of a hard board and the buttons are arranged on the side opposite to the light-receiving element side so that an excessive load is not transmitted to the peripheral portion of the light-receiving element. If this is the case, the shield plate 180 does not have to be U-shaped.
　具体的には、次のような構成も本発明が意図するものである。すなわち、開口部を有する筐体と、前記筐体の内部空間を前記開口部側の第１空間と、反対側の第２空間とに分割するハード基板である第１基板と、投光用ファイバに検出光を投射する投光素子と、受光用光ファイバから検出光を受光する受光素子と、前記投光素子と前記受光素子が実装され、前記第２空間に収容された第２基板と、前記第１基板の実装面に実装され、前記開口部へ向けて情報を呈示するための発光素子と、前記第１基板の実装面に実装され、前記開口部から前記第１基板へ向かうユーザの操作力を受けるスイッチと、前記第１基板と前記第２基板が取り付けられるベースフレームとを備え、前記ベースフレームは、前記第１基板の前記実装面とは反対の面を受ける受け部を有する光電センサ、であってもよい。 Specifically, the following configuration is also intended by the present invention. That is, a housing having an opening, a first substrate which is a hard substrate that divides the internal space of the housing into a first space on the opening side and a second space on the opposite side, and a light projecting fiber. A light projecting element that projects the detection light onto the light receiving element, a light receiving element that receives the detected light from the light receiving optical fiber, and a second substrate on which the light projecting element and the light receiving element are mounted and housed in the second space. A light emitting element mounted on the mounting surface of the first substrate and presenting information toward the opening, and a user mounted on the mounting surface of the first substrate and heading from the opening to the first substrate. A photoelectric device including a switch that receives an operating force, a base frame to which the first substrate and the second substrate are mounted, and the base frame having a receiving portion that receives a surface opposite to the mounting surface of the first substrate. It may be a sensor.
　このように剛性の高いベースフレームを用いることで、第２空間内における投受光素子の配置に依らず、ユーザの操作力が過剰な荷重となって投受光素子周りを歪ませるおそれがない。また、ベースフレームを、第２基板を支持する構造体としても利用できるので、全体的にコンパクトで部品点数の少ない光電センサを実現できる。 By using the highly rigid base frame in this way, there is no possibility that the user's operating force will become an excessive load and distort the surroundings of the light emitting and receiving elements regardless of the arrangement of the light emitting and receiving elements in the second space. Further, since the base frame can be used as a structure for supporting the second substrate, it is possible to realize a photoelectric sensor that is compact as a whole and has a small number of parts.
　［附記］
　開口部（１９３）を有する筐体（１９０）と、
　前記筐体（１９０）の内部空間を前記開口部側の第１空間と、反対側の第２空間とに分割するハード基板である第１基板（１３０）と、
　投光用光ファイバ（１４２）に検出光を投射する投光素子（１６１）と、
　受光用光ファイバ（１４３）から検出光を受光する受光素子（１６２）と、
　前記投光素子（１６１）と前記受光素子（１６２）が実装面（１７０ａ、１７０ｂ）の一側方に寄せて実装され、又は前記投光素子（１６１）と前記受光素子（１６２）が実装された第３基板（３８０）と前記一側方側で接続されて、前記第２空間に収容された第２基板（１７０、３７０）と、
　前記第１基板（１３０）の実装面のうち前記第２基板（１７０、３７０）の前記一側方に対応する領域に実装され、前記開口部（１９３）へ向けて情報を呈示するための発光素子（１３１）と、
　前記第１基板（１３０）の実装面のうち前記第２基板（１７０、３７０）の前記一側方とは反対の領域に実装され、前記開口部（１９３）から前記第１基板（１３０）へ向かうユーザの操作力を受けるスイッチ（１３３）と
を備える光電センサ（１００）。 [Appendix]
A housing (190) having an opening (193) and
A first substrate (130), which is a hard substrate that divides the internal space of the housing (190) into a first space on the opening side and a second space on the opposite side.
A light projecting element (161) that projects the detected light onto the light projecting optical fiber (142), and
A light receiving element (162) that receives detection light from a light receiving optical fiber (143), and a light receiving element (162).
The light projecting element (161) and the light receiving element (162) are mounted close to one side of the mounting surface (170a, 170b), or the light emitting element (161) and the light receiving element (162) are mounted. The second substrate (170, 370), which is connected to the third substrate (380) on one side and accommodated in the second space,
Light emission for mounting information on the mounting surface of the first substrate (130) corresponding to the one side of the second substrate (170, 370) and presenting information toward the opening (193). Element (131) and
It is mounted in a region of the mounting surface of the first substrate (130) opposite to the one side of the second substrate (170, 370), and is mounted from the opening (193) to the first substrate (130). A photoelectric sensor (100) including a switch (133) that receives an operating force of an oncoming user.
１００…光電センサ、１１０…開閉カバー、１２１…マスクシート、１２２…シェーディングパッド、１２３…ボタンパッド、１２４…キートップ、１２５…貫通孔、１３０…サブ基板、１３１…情報用ＬＥＤ、１３２…明示用ＬＥＤ、１３３…タクタイルスイッチ、１３４…ＧＮＤ線、１４１…ファイバロック機構、１４２…投光用光ファイバ、１４３…受光用光ファイバ、１４６…コネクタユニット、１４７…ケーブル、１５０…ベースフレーム、１５１…環状部、１５２…梁部、１５３…直交部、１５４…ヒンジ受け、１５５…トラス部、１５６…配置面、１５７…取付部、１５８…配置面、１５９…繋止爪、１６１…投光ＬＥＤ、１６２…受光ＰＤ、１７０…メイン基板、１７０ａ…第１実装面、１７０ｂ…第２実装面、１７０ｃ…開口側縁、１７０ｄ…底部側縁、１７１…ＧＮＤランド、１７２…増幅素子、１７３…取付孔、１８０…シールド板、１８０ａ…第１面、１８０ｂ…第２面、１８０ｃ…第３面、１８１…延出部、１８２…折曲部、１８３…繋止穴、１９０…筐体、１９１…上部挿通孔、１９２…下部挿通孔、１９３…開口部、２００…ＵＩユニット、２１０…表示部、２２０…操作部、２２１…変更ボタン、２２２…決定ボタン、２２３…調整ボタン、３７０…メイン基板、３８０…投受光基板 100 ... photoelectric sensor, 110 ... Open / close cover, 121 ... Mask sheet, 122 ... Shading pad, 123 ... Button pad, 124 ... Key top, 125 ... Through hole, 130 ... Sub-board, 131 ... Information LED, 132 ... For explicit use LED, 133 ... Tactile switch, 134 ... GND line, 141 ... Fiber lock mechanism, 142 ... Optical fiber for floodlight, 143 ... Optical fiber for light receiving, 146 ... Connector unit, 147 ... Cable, 150 ... Base frame, 151 ... Circular Part, 152 ... Beam part, 153 ... Orthogonal part, 154 ... Hinge receiver, 155 ... Truss part, 156 ... Arrangement surface, 157 ... Mounting part, 158 ... Arrangement surface, 159 ... ... Light receiving PD, 170 ... Main board, 170a ... First mounting surface, 170b ... Second mounting surface, 170c ... Opening side edge, 170d ... Bottom side edge, 171 ... GND land, 172 ... Amplifying element, 173 ... Mounting hole, 180 ... Shield plate, 180a ... 1st surface, 180b ... 2nd surface, 180c ... 3rd surface, 181 ... Extension part, 182 ... Bent part, 183 ... Binding hole, 190 ... Housing, 191 ... Upper insertion Hole, 192 ... Lower insertion hole, 193 ... Opening, 200 ... UI unit, 210 ... Display, 220 ... Operation, 221 ... Change button, 222 ... Enter button, 223 ... Adjustment button, 370 ... Main board, 380 ... Light receiving / receiving board

Claims (5)

  1. 　開口部を有する筐体と、
    　前記筐体の内部空間を前記開口部側の第１空間と、反対側の第２空間とに分割するハード基板である第１基板と、
    　投光用光ファイバに検出光を投射する投光素子と、
    　受光用光ファイバから検出光を受光する受光素子と、
    　前記投光素子と前記受光素子が実装面の一側方に寄せて実装され、又は前記投光素子と前記受光素子が実装された第３基板と前記一側方側で接続されて、前記第２空間に収容された第２基板と、
    　前記第１基板の実装面のうち前記第２基板の前記一側方に対応する領域に実装され、前記開口部へ向けて情報を呈示するための発光素子と、
    　前記第１基板の実装面のうち前記第２基板の前記一側方とは反対の領域に実装され、前記開口部から前記第１基板へ向かうユーザの操作力を受けるスイッチと
    を備える光電センサ。     A housing with an opening and
    A first substrate, which is a hard substrate that divides the internal space of the housing into a first space on the opening side and a second space on the opposite side.
    A light projecting element that projects detection light onto a light projecting optical fiber,
    A light receiving element that receives detection light from a light receiving optical fiber and
    The light emitting element and the light receiving element are mounted close to one side of the mounting surface, or the light emitting element and the light receiving element are connected to a third substrate on which the light receiving element is mounted on the one side. The second substrate housed in two spaces and
    A light emitting element mounted on a region of the mounting surface of the first substrate corresponding to the one side of the second substrate and for presenting information toward the opening.
    A photoelectric sensor including a switch mounted on a mounting surface of the first substrate opposite to the one side of the second substrate and receiving an operation force of a user from the opening toward the first substrate.
  2. 　前記発光素子に対応した貫通孔が設けられ、前記第１基板の実装面に密着して配置された遮光板を備える請求項１に記載の光電センサ。 The photoelectric sensor according to claim 1, further comprising a light-shielding plate provided with a through hole corresponding to the light emitting element and arranged in close contact with the mounting surface of the first substrate.
  3. 　前記第１基板と前記第２基板が取り付けられるベースフレームを備え、
    　前記ベースフレームは、前記第１基板の周囲を受ける環状部と、前記環状部を横切る梁部と、前記環状部に直交して延在する直交部とを有する請求項１又は２に記載の光電センサ。     A base frame to which the first substrate and the second substrate are mounted is provided.
    The photoelectric light beam according to claim 1 or 2, wherein the base frame has an annular portion that receives the periphery of the first substrate, a beam portion that crosses the annular portion, and an orthogonal portion that extends orthogonally to the annular portion. Sensor.
  4. 　前記投光用光ファイバ及び前記受光用光ファイバを着脱可能に保持するファイバロック機構を備え、
    　前記ファイバロック機構は、前記ベースフレームの前記直交部に支持されている請求項３に記載の光電センサ。     A fiber lock mechanism for detachably holding the light projecting optical fiber and the light receiving optical fiber is provided.
    The photoelectric sensor according to claim 3, wherein the fiber lock mechanism is supported at the orthogonal portion of the base frame.
  5. 　前記第１基板は、前記発光素子及び前記スイッチが実装された領域を取り囲むＧＮＤ線を有する請求項１から４のいずれか１項に記載の光電センサ。 The photoelectric sensor according to any one of claims 1 to 4, wherein the first substrate has a GND line surrounding a region in which the light emitting element and the switch are mounted.
PCT/JP2021/003527 2020-03-06 2021-02-01 Photoelectric sensor WO2021176915A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646833A (en) * 1987-06-30 1989-01-11 Toshiba Corp Detector
JPH04174924A (en) * 1990-06-15 1992-06-23 Fuji Electric Co Ltd Holding structure of photoelectric switch and case cover for photoelectric switch body
JP2001155599A (en) * 1999-11-30 2001-06-08 Omron Corp Optical fiber photoelectric sensor
JP2003297174A (en) * 2002-03-29 2003-10-17 Nidec Copal Electronics Corp Switch and touch panel therefor
JP2004205209A (en) * 2002-10-31 2004-07-22 Omron Corp Fiber type photo-electric sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646833A (en) * 1987-06-30 1989-01-11 Toshiba Corp Detector
JPH04174924A (en) * 1990-06-15 1992-06-23 Fuji Electric Co Ltd Holding structure of photoelectric switch and case cover for photoelectric switch body
JP2001155599A (en) * 1999-11-30 2001-06-08 Omron Corp Optical fiber photoelectric sensor
JP2003297174A (en) * 2002-03-29 2003-10-17 Nidec Copal Electronics Corp Switch and touch panel therefor
JP2004205209A (en) * 2002-10-31 2004-07-22 Omron Corp Fiber type photo-electric sensor

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