JP2013157372A - Optical sensor device, and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve mounting accuracy when an optical sensor is mounted on an electronic apparatus, reduce incorrect detection of the optical sensor, and improve operational reliability.SOLUTION: An optical sensor device includes: an optical sensor 5 that has a light-emission unit 5a and a light-receiving unit 5b; a cover member 6 that covers the light-emission unit 5a and the light-receiving unit 5b; a light shielding member 7 that is provided to the cover member 6, and has a transmission area 7a that transmits light from the light-emission unit 5a and light to the light-receiving unit 5b; and a light transmissive resin material 8 that is charged between the light-emission unit 5a and light-receiving unit 5b and the cover member 6. The optical sensor 5 is fixed to the cover member 6 via the light transmissive resin material 8.

Description

  The present invention relates to an optical sensor device in which a light emitting portion and a light receiving portion of a sensor module are covered with a protective cover, and a method for manufacturing the optical sensor device.

  As a portable electronic device, particularly in a mobile phone such as a smartphone, a touch panel is used as a main operation means, thereby achieving both a large screen and improved operability. However, in a call operation with a mobile phone, the display surface on which the touch panel is mounted comes into contact with the ears or cheeks during a call, and thus the touch panel may cause an unexpected malfunction. In order to prevent such a malfunction, the operation state of the touch panel is switched between ON and OFF by detecting that a face is approaching the touch panel using a proximity sensor as described later.

  FIG. 7 is a schematic diagram of an optical sensor device including an optical sensor as a general proximity sensor having a light emitting unit and a light receiving unit. As shown in FIGS. 7A and 7B, an optical sensor device 101 related to the present invention includes an optical sensor 105 having a light emitting unit 105a and a light receiving unit 105b, and a cover member 106 covering the optical sensor 105. It is equipped with. The optical sensor 105 includes a substrate 105c on which the light emitting unit 105a and the light receiving unit 105b are mounted, and a case 105d in which the light emitting unit 105a and the light receiving unit 105b are accommodated. The light emitting unit 105a emits infrared light at a light emission angle θ1. The light receiving unit 105b receives infrared light at a light receiving angle θ2. A film-shaped light blocking member 107 is formed on the cover member 106 on the surface facing the optical sensor 105. The light blocking member 107 has a transmission region 107a that transmits light from the light emitting unit 105a and light to the light receiving unit 105b.

  Most of the infrared light emitted from the light emitting unit 105a passes through the cover member 106, and the light receiving unit 105b detects the reflected light reflected by the object. When the distance to the object is long, the intensity of the received infrared light will decrease, so a threshold is set for the received light intensity, and when an object that reflects infrared light approaches within a certain distance By adjusting the sensitivity so that the optical sensor detects it, it can be applied to various uses.

  By the way, as shown in FIG. 8A and FIG. 8B, the optical sensor 105 detects light reflected by the object other than the object to be detected by the light receiving unit 105b, and the object approaches the vicinity of the optical sensor 105. Many people mistakenly recognize that they are doing it. In such a case, the operation of the touch panel, which is set so that the operation is turned off when the object detected by the optical sensor 105 approaches, and other functions of the mobile phone are locked. It may appear as a bug.

  Next, another optical sensor device related to the present invention will be described. In another optical sensor device related to the present invention, the same components as those of the optical sensor device 101 described above are denoted by the same reference numerals as those of the optical sensor device 101, and description thereof is omitted.

  As shown in FIGS. 9A and 9B, the optical sensor device 102 includes an optical sensor having a light emitting unit 115a that emits infrared light and a light receiving unit 115b that receives infrared light and visible light. A configuration including 115 is also known. As shown in FIGS. 10A and 10B, the optical sensor device 103 includes an optical sensor 125 that is a sensor module integrated with an illuminance sensor 126 that receives visible light. doing. In the optical sensor 125, an illuminance sensor 126 is disposed between the light emitting unit 125a and the light receiving unit 125b.

  Such optical sensor devices 102 and 103 basically have substantially the same problems as the optical sensor device 101 described above. However, in particular, in the optical sensor device 103 shown in FIGS. 10 (a) and 10 (b), a light shielding part (not shown) such as black paint for shielding reflected light is provided between the light emitting part 125a and the light receiving part 125b. In the case where the light-shielding portion is provided, the function of the illuminance sensor 126 is obstructed by the light-shielding portion, so that it cannot be an effective measure for shielding the reflected light.

  Patent Document 1 discloses a configuration for explaining measures for preventing malfunction. A schematic diagram of this configuration is shown in FIGS. As shown in FIGS. 11 (a), 11 (b), 12 (a), and 12 (b), the optical sensor devices 111 and 112 described in Patent Document 1 are arranged on the optical path of the light receiving unit 105b. Alternatively, a diffraction grating 120 is provided on the optical path of the light emitting unit 105a.

  In the configuration described in Patent Document 1, unnecessary reflected light is removed by narrowing the light emission angle θ <b> 1 and the light reception angle θ <b> 2 using the diffraction grating 120, and malfunction of the optical sensor 105 is prevented. However, in the method using the diffraction grating 120 as described above, the directivity of light emission or light reception becomes strong, and there is a possibility that the sensitivity is deteriorated due to a decrease in the light amount or restrictions on the light emission direction or the light reception direction.

JP 2011-049473 A

  In an electronic device such as a cellular phone using the above-described optical sensor device, an optical sensor is mounted on a wiring board or a flexible wiring board (FPC) constituting the electronic device. In the process of mounting the optical sensor on the wiring board or FPC, there are the following problems.

  The first problem tends to cause rotation or tilt with respect to a direction parallel to the optical axis of the optical sensor with variations in the position of the optical sensor during mounting. For this reason, there are problems in the appearance of an electronic device in which the optical sensor is incorporated, and that the optical sensor easily receives a reflected light from a component mounted around the optical sensor, thereby causing a malfunction.

  The second problem is that the distance between the optical sensor and the cover member is likely to fluctuate due to the variation in the fixing position of the wiring board of the electronic device, and the interface of the air layer existing between the optical sensor and the cover member. There is a problem that the optical sensor easily receives unnecessary reflected light generated in step 1, which causes malfunction.

  Then, an object of this invention is to provide the manufacturing method of the optical sensor apparatus which can solve the subject of the said related technique, and an optical sensor apparatus. An example of an object of the present invention is to provide an optical sensor device and a method for manufacturing the optical sensor device that can reduce variations that occur when the optical sensor is mounted, prevent erroneous detection of the optical sensor, and improve operation reliability. It is in.

  In order to achieve the above-described object, an optical sensor device according to the present invention includes an optical sensor having a light emitting unit and a light receiving unit, a cover member that covers the light emitting unit and the light receiving unit, and a light provided from the light emitting unit. And a light blocking member having a transmission region for transmitting light to the light receiving unit, and a light transmissive resin material filled between the light emitting unit and the light receiving unit and the cover member. The optical sensor is fixed to the cover member via a light transmissive resin material.

  In addition, the method for manufacturing an optical sensor device according to the present invention includes a light blocking member having a light emitting unit and a light receiving unit included in the optical sensor, and a transmission region that transmits light from the light emitting unit and light to the light receiving unit. A step of filling the light-transmitting resin material between the light-emitting portion and the light-receiving portion and fixing the optical sensor to the cover member via the light-transmitting resin material is provided.

  According to the present invention, it is possible to reduce fluctuations in the amount of received light due to variations in mounting of the optical sensor, and to improve the operational reliability of the optical sensor.

It is a schematic diagram which shows the optical sensor apparatus of 1st Embodiment. It is a schematic diagram for demonstrating the manufacturing method of the optical sensor apparatus of 1st Embodiment. It is a schematic diagram which shows the optical sensor apparatus of 2nd Embodiment. It is a schematic diagram which shows the optical sensor apparatus of 3rd Embodiment. It is sectional drawing shown in order to demonstrate the effect of the optical sensor apparatus of embodiment. It is a schematic diagram which shows a mobile telephone provided with the optical sensor apparatus of embodiment. It is a schematic diagram which shows the optical sensor apparatus relevant to this invention. It is a schematic diagram which shows the optical sensor apparatus relevant to this invention. It is a schematic diagram which shows the optical sensor apparatus relevant to this invention. It is a schematic diagram which shows the optical sensor apparatus relevant to this invention. It is a schematic diagram which shows the optical sensor apparatus relevant to this invention. It is a schematic diagram which shows the optical sensor apparatus relevant to this invention.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
In FIG. 1, the schematic diagram of the optical sensor apparatus of 1st Embodiment is shown. 1A is a schematic cross-sectional view of the photosensor device of the first embodiment, and FIG. 1B is a schematic plan view of the photosensor device of the first embodiment.

  The optical sensor device according to the present embodiment is a so-called proximity sensor device, and is mounted on a wiring board included in a mobile phone as an electronic device described later. As shown in FIGS. 1A and 1B, the optical sensor device 1 includes an optical sensor 5 having a light emitting unit 5a and a light receiving unit 5b, a cover member 6 that covers the light emitting unit 5a and the light receiving unit 5b, A light blocking member 7 provided on the cover member 6 and having a transmission region 7a that transmits only light from the light emitting portion 5a and light to the light receiving portion 5b, and between the light emitting portion 5a and the light receiving portion 5b and the cover member 6 And a light transmissive resin material 8 filled therein.

  The optical sensor 5 is a sensor module, and includes a light emitting unit 5a that emits infrared light, a light receiving unit 5b that receives infrared light, a substrate 5c on which the light emitting unit 5a and the light receiving unit 5b are mounted, a light emitting unit 5a, and And a case 5d in which the light receiving portion 5b is accommodated. The light emitting unit 5a and the light receiving unit 5b are disposed on the same plane, and are fixed to the cover member 6 via a light transmissive resin material 8 as shown in FIG.

  Although not shown, a connection terminal is provided on one of the substrate 5c of the optical sensor 5 and the wiring substrate electrically connected to the optical sensor 5, and a connection terminal is provided on the other of the substrate 5c and the wiring substrate. A connector to be connected to is provided.

  The cover member 6 is a so-called cover glass formed in a plate shape by a resin material such as tempered glass having light transmittance or acrylic. As the cover member 6, a screen member that covers the display surface of the mobile phone that detects the approach of the user by the optical sensor device 1, or a screen member that is fitted in the opening of the casing of the mobile phone is used. Further, as the cover member 6, a mobile phone casing itself may be used.

  The light blocking member 7 is formed in a film shape by applying a light blocking material to the inner surface of the cover member 6 facing the optical sensor 5 by coating or printing. The transmission region 7a of the light blocking member 7 is disposed at a position facing the light emitting unit 5a and the light receiving unit 5b. Although not shown, the light blocking member 7 has a transmission region 7a that allows infrared light to pass through the cover member 6 more easily than light of other wavelengths, that is, infrared light of other wavelengths. A translucent film that permeates more preferentially is formed by printing. The transmissive region 7a is not limited to one region, and may include two regions corresponding to the light emitting unit 5a and the light receiving unit 5b.

  The light transmissive resin material 8 is mixed with a curing agent and has curability. The light transmissive resin material 8 reduces the thickness D in the direction parallel to the optical axis of the light emitting portion 5a and the light receiving portion 5b as much as possible, and also covers the cover member 6 and the optical sensor 5 via the light transmissive resin material 8. It is important to reduce as much as possible that the reflection elements such as bubbles and foreign matters are mixed in the inside when joining.

  The light-transmitting resin material 8 is not necessarily applied so as to cover the entire inner surface of the cover member 6, but the light-emitting angle of the light-emitting portion 5a and the light-receiving portion 5b of the optical sensor 5 are not necessarily applied. It is necessary to apply so as to cover at least the corner area.

  With respect to the optical sensor device 1 configured as described above, a process of electrically connecting the optical sensor 5 to the wiring substrate 16 constituting the mounting portion of the mobile phone will be described. In FIG. 2, the schematic diagram for demonstrating the manufacturing method of the optical sensor apparatus 1 of 1st Embodiment is shown.

  As shown in FIGS. 2A and 2B 1, in the optical sensor device 1, the optical sensor 5 is fixed to the cover member 6 by a light-transmitting resin material 8 having a thickness D. A connection terminal 17 is provided on the substrate 5 c of the optical sensor 5 as a connection means connected to the wiring substrate 16 constituting the mobile phone 11.

  The wiring board 16 on which the optical sensor 5 is mounted is provided with a connector 18 that is electrically connected to the connection terminal 17 of the optical sensor 5 as shown in FIG. In the optical sensor 5 joined to the cover member 6 through the light transmissive resin material 8, the connection terminal 17 of the substrate 5c is connected to the connector 18 of the wiring substrate 16 as shown in FIG. Thus, the optical sensor 5 and the wiring board 16 are electrically connected.

  Alternatively, as shown in FIGS. 2 (a) and 2 (b2), when a connector 18 as a connecting means is provided on the substrate 5c of the optical sensor 5, the wiring substrate 16 is shown in FIG. 2 (c2). As described above, a connection terminal 17 that is electrically connected to the connector 18 of the optical sensor 5 is provided. The optical sensor 5 joined to the cover member 6 via the light-transmitting resin material 8 has a connector 18 of the optical sensor 5 connected to the connection terminal 17 of the wiring board 16 as shown in FIG. As a result, the optical sensor 5 and the wiring board 16 are electrically connected.

  Further, when the cover member 6 to which the optical sensor 5 is bonded is bonded to the casing of the cellular phone, the connector 16 provided on one of the substrate 5a of the optical sensor 5 and the wiring substrate 16 of the cellular phone, the substrate 5a, The mounting structure is formed so that the connection terminal 17 provided on the other side of the wiring board 16 is electrically connected.

  As described above, the optical sensor device 1 according to the embodiment has the following effects.

  The first effect is that the optical sensor 5 is fixed to the cover member 6 via the light-transmitting resin material 8 so that the air existing between the optical sensor 5 and the cover member 6 in the configuration related to the present invention. Unnecessary reflection occurring at the interface with the layer can be reduced, and malfunction of the optical sensor 5 can be reduced. Therefore, the optical sensor device 1 can improve the operation reliability.

  The second effect is that the optical sensor 5 is fixed to the cover member 6 via the light-transmitting resin material 8, so that the distance between the optical sensor and the cover member is increased as in the optical sensor device related to the present invention. Since variations due to dimensional tolerances are reduced, variations in the amount of received light associated with variations in distance can be suppressed. Furthermore, according to the embodiment, unlike the structure in which the optical sensor is fixed to the wiring board side as in the optical sensor device related to the present invention, the recommended angle of light emission and reception is affected by the influence of the inclination when the optical sensor 5 is mounted. , And an increase in reflected light can be prevented, and the risk of impairing the appearance of the mobile phone can be reduced. Therefore, according to the optical sensor device 1, it is possible to reduce the positional deviation that occurs when the optical sensor 5 is mounted on the wiring board 16 that constitutes the mobile phone, and the optical sensor 5 malfunctions and affects the appearance of the mobile phone. Can be prevented.

  The third effect is that the present embodiment has less influence on the technical and manufacturing costs because it is not necessary to add special optical components as compared with the configuration related to the present invention.

  Even if another sensor using visible light such as an illuminance sensor and a light sensor (sensor module) integrated with the light emitting unit 5a and the light receiving unit 5b are used, the fourth effect is The malfunction of the optical sensor can be reduced without causing characteristic deterioration.

  Further, the optical sensor device 1 joins the optical sensor 5 and the cover member 6 by using, for example, a light-transmitting resin material 8 having a refractive index close to the refractive index of the cover member 6, thereby allowing the optical sensor device 1 to transmit light to the cover member 6. Since the reflection generated at the interface with the conductive resin material 8 is reduced, the erroneous detection of the optical sensor 5 can be further reduced.

(Second Embodiment)
In FIG. 3, the schematic diagram of the optical sensor apparatus of 2nd Embodiment is shown. 3A is a schematic cross-sectional view of the photosensor device of the second embodiment, and FIG. 3B is a schematic plan view of the photosensor device of the second embodiment.

  As shown in FIGS. 3A and 3B, in the optical sensor device 2 of the second embodiment, the light emitting unit 25a and the light receiving unit 25b of the optical sensor 25 adjust the light emission angle and the light reception angle. Lenses 26a and 26b. The optical sensor 25 includes a substrate 25c on which the light emitting unit 25a and the light receiving unit 25b are mounted, and a case 25d in which the light emitting unit 25a and the light receiving unit 25b are accommodated.

  According to the optical sensor device 2 of the second embodiment, since the optical sensor 25 has the lenses 26a and 26b, the refractive index of the air layer in the structure related to the present invention is replaced by the light transmissive resin material. The change in refractive index can be eliminated by appropriately adjusting the shape and material of the lens in consideration of the change.

(Third embodiment)
In FIG. 4, the schematic diagram of the optical sensor apparatus of 2nd Embodiment is shown. The optical sensor device of the third embodiment is different from the optical sensor devices 1 and 2 of the above-described embodiment in that the light-transmitting resin material has wavelength selectivity of transmitted light.

  As shown in FIG. 4, in the optical sensor device 3 according to the third embodiment, infrared light is transmitted through the transmission region 7 a of the above-described light blocking member 7 toward the cover member 6 rather than light of other wavelengths. Instead of providing a translucent film for facilitating, a light blocking member 27 from which the translucent film is removed is provided, and a light-transmitting resin material 28 having the property of facilitating transmission of infrared light than light of other wavelengths is formed. Has been.

  In other words, the light transmissive resin material 28 in the present embodiment has a property of transmitting ultraviolet rays and visible rays to some extent in addition to infrared rays. Such a light transmissive resin material 28 is formed using, for example, IR transmissive ink (manufactured by Teikoku Ink).

  Next, the effect of the optical sensor device 1 of the present embodiment will be described in comparison with the optical sensor device related to the present invention. FIG. 5 is a cross-sectional view for explaining the effect of the optical sensor device of the embodiment. 5A to 5C are schematic cross-sectional views of an optical sensor device related to the present invention. 5D to 5F are schematic cross-sectional views of other optical sensor devices related to the present invention. FIG. 5G to FIG. 5I are schematic cross-sectional views of the optical sensor device of the embodiment.

  As shown in FIG. 5A, in the optical sensor device 101A related to the present invention, the optical sensor 105 is mounted on the wiring board 116 by soldering. In the optical sensor device 101 related to the present invention, as shown in FIG. 5B, when the optical sensor 105 is inclined with respect to the main surface of the wiring board 116 due to variations in soldering, the optical sensor 105 and the cover member There is a problem that the amount of unnecessary reflected light that is reflected at the interface between the air layer existing between the cover member 106 and the cover member 106 increases. Further, as shown in FIG. 5C, in the optical sensor device 101 related to the present invention, the distance between the optical sensor 105 and the cover member 106 is such that the thickness direction of the wiring board 116 on which the optical sensor 105 is mounted. Therefore, there is a problem that the amount of unnecessary reflected light reflected at the interface between the air layer and the cover member 106 increases.

  In addition, as shown in FIG. 5D, another optical sensor device related to the present invention is such that the optical sensor 105 is connected to a flexible printed circuit board (FPC) 119 disposed in a casing 122 of a cellular phone. Soldered and mounted. In another photosensor device related to the present invention, as shown in FIG. 5E, when the position of the FPC 119 fluctuates in the housing 122, the other photosensor device 101B related to the present invention uses a cover member. Since the direction of the optical axis of the optical sensor 105 with respect to 106 changes, there is a problem that the amount of unnecessary reflected light reflected at the interface between the air layer and the cover member 106 increases.

  Further, in another optical sensor device 101B related to the present invention, as shown in FIG. 5 (f), the air layer described above is caused by the variation in the distance between the FPC 119 on which the optical sensor 105 is mounted and the cover member 106. There is a problem that the amount of unnecessary reflected light reflected at the interface with the cover member 106 increases.

  On the other hand, according to the optical sensor device 1 of the present embodiment, as shown in FIG. 5G, the connector 18 of the optical sensor 5 joined to the cover member 6 via the light transmissive resin material 8 is connected to the wiring board. By being electrically connected to the 16 connection terminals 17, the optical sensor 5 is prevented from being inclined with respect to the main surface of the wiring board 16. Therefore, in the optical sensor device 1, the amount of reflected light reflected at the interface between the cover member 6 and the light transmissive resin material 8 may vary depending on the connection state between the optical sensor 5 and the wiring substrate 16. It will be resolved.

  In the optical sensor device 1 of the present embodiment, as shown in FIG. 5 (h), the optical sensor 5 joined to the cover member 6 via the light transmissive resin material 8 includes the optical sensor 5 and the connection terminal 17. Even if the wiring board 16 electrically connected by the connector 18 moves within the housing, the cover member 6 and the light transmissive property depend on the movement of the wiring board 16 on which the optical sensor 5 is mounted. The fluctuation of the amount of reflected light reflected at the interface with the resin material 8 is eliminated. Therefore, in the optical sensor device 1, the amount of reflected light reflected at the interface between the cover member 6 and the light transmissive resin material 8 varies depending on the posture of the wiring board 16 on which the optical sensor 5 is mounted. Is resolved.

  Further, as shown in FIG. 5 (i), the optical sensor device 1 according to the present embodiment has the optical sensor 5 and the cover as a result of the optical sensor 5 being bonded to the cover member 6 via the light transmissive resin material 8. The amount of reflected light reflected at the interface between the cover member 6 and the light-transmitting resin material 8 depends on the distance between the member 6 and the position of the wiring board 16 on which the optical sensor 5 is mounted. Fluctuation is eliminated.

  Finally, a configuration example of a mobile phone as an electronic apparatus to which the above-described optical sensor device 1 of the first embodiment is applied will be briefly described with reference to the drawings.

  FIG. 6 is a schematic diagram of the mobile phone according to the embodiment. As illustrated in FIG. 6, the mobile phone 11 according to the embodiment is a so-called smartphone, and includes a cover member 14 (screen member) that covers the display unit 13 disposed on the main surface of the housing 12.

  A light blocking member 15 is formed on the cover member 14. In the light blocking member 15, a transmission region 15 a for transmitting only light from the light emitting unit 5 a of the optical sensor 5 and light to the light receiving unit 5 b is formed at a position where the optical sensor device 1 is disposed. The optical sensor 5 is joined to the cover member 6 by the light transmissive resin material 8 with the light emitting portion 5a and the light receiving portion 5b facing the transmission region 15a. In addition, the cellular phone 11 includes a wiring board 16 disposed in the housing 12, and the cover member 6 to which the optical sensor 5 is fixed is assembled to the housing 12, so that the optical sensor 5 is connected. It is electrically connected to the wiring board 16 via the terminal 17 and the connector 18.

  Note that the optical sensor device according to the present invention is suitable for use in any of the above-described optical sensor devices 101 to 103, 111, and 112 related to the present invention.

  In addition, the optical sensor device according to the embodiment is used in a mobile phone, but is not limited to the mobile phone, and may be applied to other electronic devices such as a portable game machine. .

DESCRIPTION OF SYMBOLS 1 Optical sensor apparatus 5 Optical sensor 5a Light emission part 5b Light reception part 6 Cover member 7 Light shielding member 7a Transmission area | region 8 Light transmission resin material

Claims (8)

An optical sensor having a light emitting part and a light receiving part;
A cover member covering the light emitting unit and the light receiving unit;
A light blocking member provided on the cover member and having a transmission region that transmits light from the light emitting unit and light to the light receiving unit;
A light transmissive resin material filled between the light emitting unit and the light receiving unit, and the cover member;
With
The optical sensor device, wherein the optical sensor is fixed to the cover member via the light transmissive resin material.   The optical sensor device according to claim 1, wherein the light transmissive resin material has a refractive index equal to a refractive index of the cover member.   The optical sensor device according to claim 1, wherein the light-transmitting resin material has a property of facilitating transmission of infrared light as compared with light of other wavelengths.   4. The optical sensor device according to claim 1, wherein the light transmissive resin material is provided so as to cover a region of a light emitting angle of the light emitting unit and a light receiving angle of the light receiving unit. 5.   5. The optical sensor device according to claim 1, wherein the optical sensor includes a connection unit that is electrically connected to a wiring board. 6.   An electronic device comprising the optical sensor device according to claim 1. A cover member that covers the light emitting unit and the light receiving unit provided with a light emitting unit and a light receiving unit included in the optical sensor, and a light blocking member having a transmission region that transmits light from the light emitting unit and light to the light receiving unit. Filled with light-transmitting resin material,
A method of manufacturing an optical sensor device, comprising: fixing the optical sensor to the cover member via the light transmissive resin material.   The manufacturing method of the optical sensor apparatus of Claim 7 which has the process of electrically connecting the said optical sensor joined to the said cover member via the said transparent resin material with a wiring board.

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