WO2021164613A1 - Multi-grade micro-nano mixed metal paste and preparation method therefor - Google Patents

Multi-grade micro-nano mixed metal paste and preparation method therefor Download PDF

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WO2021164613A1
WO2021164613A1 PCT/CN2021/075999 CN2021075999W WO2021164613A1 WO 2021164613 A1 WO2021164613 A1 WO 2021164613A1 CN 2021075999 W CN2021075999 W CN 2021075999W WO 2021164613 A1 WO2021164613 A1 WO 2021164613A1
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micro
nano
mixed metal
metal paste
nano mixed
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PCT/CN2021/075999
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French (fr)
Chinese (zh)
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崔成强
杨冠南
徐广东
张昱
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广东工业大学
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00Other mixers; Mixing plants; Combinations of mixers
    • B01F33/80Mixing plants; Combinations of mixers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01FMIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F33/00Other mixers; Mixing plants; Combinations of mixers
    • B01F33/80Mixing plants; Combinations of mixers
    • B01F33/834Mixing in several steps, e.g. successive steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding

Definitions

  • the invention belongs to the technical field of welding materials. More specifically, it relates to a multi-stage micro-nano hybrid metal paste and a preparation method thereof.
  • Metal nanomaterials such as copper, silver and nickel are commonly used as soldering layers in electronic chips, high-speed trains, energy transmission and other fields. They have the advantages of high thermal conductivity (150 ⁇ 300W/m ⁇ K) and high service temperature.
  • An ideal high-temperature resistance and high thermal conductivity soldering material which can be used as the third-generation semiconductor electrode lead-out material and solder for chip packaging to achieve low-temperature ( ⁇ 300°C) interconnection and high-temperature service effects.
  • the commonly used silver nanomaterials are mainly nano-silver materials, but nano-silver materials have disadvantages such as high price, large expansion coefficient, large porosity, and electromigration, and their applications are greatly restricted.
  • Chinese patent application CN109935563A discloses a multi-size mixed nano-particle paste and a preparation method thereof.
  • the paste contains mixed copper nanoparticles of various sizes.
  • the gap between the particles is beneficial to realize the connection of nano-copper without pressure assistance, and improve the compactness of the metal layer after sintering.
  • this preparation method needs to impart kinetic energy to the small-sized nano-metal particles by means of physical impact, so that they can be driven into the large-sized nano-copper paste, and the nano-metal composite paste of mixed size and size is configured, and the physical impact needs to be strictly controlled and adjusted.
  • the amount of small-sized nano metal particles there are problems of uneven particles, complicated operations, and difficult to control.
  • the technical problem to be solved by the present invention is to overcome the disadvantages of high price of nano-silver materials in the prior art, large expansion coefficient difference, large porosity, electromigration, etc., the multi-size nano-copper material particles are not uniform, the preparation is relatively complicated, and the quality is difficult to control. Defects and deficiencies provide a multi-level micro-nano hybrid metal paste with low porosity, high density, uniform mixing and simple preparation method.
  • Another object of the present invention is to provide a method for preparing the multi-stage micro-nano mixed metal paste.
  • a multi-stage micro-nano mixed metal paste comprising 2 to 5 levels of micro-nano mixed metal particles with a size of 5 nm to 100 ⁇ m and a soldering flux;
  • the multi-level micro-nano hybrid metal paste of the present invention further limits the diameter of the metal particles at all levels, and adopts the form of mixing multi-level micro-nano metal particles to prepare the multi-level micro-nano hybrid metal paste.
  • the nano-particles are evenly distributed and are used for sintering.
  • the composite section has low porosity, high density, strong thermal shock resistance, high reliability, and can fully meet the requirements of low-temperature sintering and high-temperature service.
  • the multi-level micro-nano mixed metal paste includes 2 to 3 levels.
  • the multi-stage micro-nano mixed metal paste is grade 3.
  • the porosity is low, the compactness is high, and the material is saved, and the operation is simple.
  • micro-nano mixed metal particles are prepared by a multi-stage chemical reduction method, a mechanical mixing method or a solution mixing method.
  • the invention can be prepared by a simple multi-stage chemical reduction method, a mechanical mixing method or a solution mixing method, has simple operation, is convenient to control, is suitable for large-scale industrial production, and has huge economic benefits.
  • the multi-stage chemical reduction method includes the following steps:
  • Dissolve the soluble copper salt in absolute ethanol add dispersant and reducing agent in 2 to 5 times, heat up to 60-78°C and complete the reaction, centrifuge, wash, and dry to get it;
  • the weight ratio of the soluble copper salt to the dispersant added for the first time is 1: (0.1 to 3), and the weight ratio of the soluble copper salt to the dispersant added for the second to fourth times is 1: (0 to 3);
  • the first reaction temperature was 60-75°C, and the (n+1)-th reaction temperature was 0-5°C higher than the n-th reaction temperature.
  • the total added amount of the dispersant does not exceed 5 times the weight of the soluble copper salt; the total added amount of the reducing agent does not exceed 2 times the molar amount of the soluble copper salt.
  • the soluble copper salt is copper sulfate, copper acetate or copper hydroxide
  • the dispersant is polyvinylpyrrolidone, nonylphenol polyoxyethylene ether or imidazole
  • the reducing agent in question is ascorbic acid, hydrazine hydrate, boron Potassium hydride, sodium borohydride or sodium hypophosphite.
  • the mechanical mixing method includes the following steps:
  • micro-nano metal particles of different sizes into the mixing container, add spherical, polyhedral or irregularly shaped hard particles, apply static electricity to the mixing container after sealing, and perform mechanical vibration, ultrasonic vibration, continuous impact, flipping, etc.
  • the high-pressure operation makes mixing and separation, and it is obtained.
  • the hard particles are tungsten carbide, iron-based amorphous alloys or hard PVC transparent hard particles.
  • the diameter of the hard particles is 10-15 times the largest diameter in the micro-nano mixed metal particles.
  • the solution mixing method includes the following steps:
  • micro-nano metal particles of different sizes into the mixing container, add absolute ethanol and dispersant, apply static electricity to the mixing container after sealing, and perform mechanical vibration, ultrasonic vibration, continuous impact, overturning, and high-pressure operations to make the mixing uniform. , Centrifugation, magnetic field separation, that is.
  • the dispersant is polyvinylpyrrolidone.
  • the weight ratio of the micro-nano mixed metal particles and the flux is (3-5):1.
  • the weight ratio of the micro-nano mixed metal particles and the flux is 4:1. It has been found in practice that the multi-stage micro-nano mixed metal paste prepared under this ratio has low porosity and high compactness, and each effect is good.
  • soldering flux is composed of the following raw materials and their weight percentages: 10-30% of active agent, 10-50% of film-forming agent, 1-20% of surfactant and remaining solvent.
  • the active agent is hydrochloric acid, hydrofluoric acid, orthophosphoric acid, stannous chloride, zinc chloride, ammonium chloride, potassium fluoride, sodium fluoride and other inorganic substances, or rosin, dimethylamine hydrochloride, hydrochloric acid Organic halides such as diethylamine, cyclohexylamine hydrochloride, and aromatic amine hydrohalides, or organic acids such as hydroxy acids and sulfonic acids, or organic amines such as methylamine, dimethylamine, trimethylamine, and ethylamine.
  • the film forming agent is bisphenol A epoxy resin, organic high polymer, modified cellulose, etc., such as epoxy resin, various synthetic resins, acrylic resins, and the like.
  • the surfactant is cetyltrimethylammonium bromide, fluoroaliphatic polymer ether, sodium diethyl succinate sulfonate, quaternary ammonium fluoroalkyl compound and the like.
  • the solvent is terpineol, ethylene glycol, n-butanol, ethanol and the like.
  • the present invention also provides a method for preparing the multi-stage micro-nano hybrid metal paste, which is characterized in that it comprises the following steps:
  • micro-nano mixed metal particles and flux Prepare micro-nano mixed metal particles and flux, stir, sonicate, and mix the micro-nano mixed metal particles and flux evenly to obtain.
  • the multi-level micro-nano hybrid metal paste of the present invention further limits the diameter of the metal particles at all levels, and prepares the multi-level micro-nano hybrid metal paste in the form of mixing multi-level micro-nano metal particles.
  • the nano-particles are evenly distributed.
  • the bonding section has low porosity, high density, strong thermal shock resistance, and high reliability, which can fully meet the requirements of low-temperature sintering and high-temperature service.
  • the preparation method of a multi-stage micro-nano hybrid metal paste of the present invention can be a multi-stage chemical reduction method, a mechanical mixing method or a solution mixing method.
  • the operation is simple, easy to control, suitable for large-scale industrial production, and has huge advantages. Economic benefits.
  • Figure 1 is a flow chart of the multi-stage chemical reduction method of the present invention
  • 1- containing metal salt solution 2- primary metal particles, 3- secondary metal particles, 4- tertiary metal particles, 5- reducing agent and dispersant, 6-micro-nano mixed metal particles, 7-assisted Flux, 8-multi-level micro-nano mixed metal paste.
  • Figure 2 is a flow chart of the mechanical mixing method of the present invention
  • 2-level metal particles 3-level metal particles, 4-level metal particles, 6-micro-nano mixed metal particles, 7-flux, 8-multi-level micro-nano mixed metal paste, 9-closed mixed Material container, 10-hard particles, 11-mixing table.
  • Fig. 3 is an SEM observation diagram of the multi-level micro-nano mixed metal paste in Example 1 of the present invention.
  • Example 4 is a SEM observation diagram of the multi-level micro-nano mixed metal paste of Example 2 of the present invention.
  • Fig. 5 is an SEM observation diagram of the multi-level micro-nano mixed metal paste in Example 3 of the present invention.
  • the reagents, methods and equipment used in the present invention are conventional reagents, methods and equipment in the technical field.
  • Example 1 A multi-stage micro-nano mixed metal paste
  • the multi-stage micro-nano hybrid metal paste is prepared by the following method:
  • micro-nano mixed metal particles Dissolve 9g of copper acetate in 900ml of absolute ethanol, add 3.3g of dispersant polyvinylpyrrolidone and 10.56g of reducing agent ascorbic acid for the first time, heat to 70°C in a water bath, and react to completion; Add 2.4g of the dispersant polyvinylpyrrolidone and 8.1g of the reducing agent ascorbic acid twice, and heat the water bath to 75°C to complete the reaction; add 1.55g of the dispersant polyvinylpyrrolidone and 6g of the reducing agent ascorbic acid for the third time, and heat the water bath to 75°C, After the reaction is complete, centrifuged, washed with deionized water and absolute ethanol, and dried in vacuum for 12-24 hours to obtain micro-nano mixed metal particles with a weight ratio of 1:4:2 at the first level of 45nm, the second level of 200nm, and the third level of 1 ⁇
  • Flux preparation add 12% rosin (active agent), 35.5% bisphenol A type epoxy resin (film former) and 2% cetyltrimethylammonium bromide (surfactant) to the balance In terpineol (solvent), mix evenly to obtain flux;
  • micro-nano mixed metal particles obtained in step S1 and the flux obtained in step S2 are mixed according to a weight ratio of 4:1, stirred, sonicated, and mixed uniformly to obtain.
  • Example 2 A multi-stage micro-nano mixed metal paste
  • the multi-stage micro-nano hybrid metal paste is prepared by the following method:
  • micro-nano mixed metal particles Weigh the first-level 35nm, second-level 150nm, and third-level 700nm copper nanoparticles with different sizes, with a weight ratio of 0.26:1:1, totaling 0.8g, and add them to the mixing container.
  • 0.1g magnetic spherical hard iron-based amorphous alloy particles with a diameter of 0.5mm apply static electricity to the mixing container after sealing, and perform mechanical vibration, ultrasonic vibration, continuous impact, overturning, and high-pressure operations to mix, screen, and
  • the magnetic spherical hard iron-based amorphous alloy particles are separated by the magnetic field, and it is obtained;
  • Flux preparation add 12% rosin (active agent), 35.5% acrylic resin (film former) and 2% sodium diethyl succinate (surfactant) to the balance of ethylene glycol (solvent) Medium, mix evenly, get flux;
  • micro-nano mixed metal particles obtained in step S1 and the flux obtained in step S2 are mixed according to a weight ratio of 4:1, stirred, sonicated, and mixed uniformly to obtain.
  • Example 3 A multi-stage micro-nano mixed metal paste
  • the multi-stage micro-nano hybrid metal paste is prepared by the following method:
  • micro-nano mixed metal particles Weigh the first-level 25nm and second-level 110nm nano-copper particles with a weight ratio of 0.26:1, add them to the mixing container, and add 0.1g of spherical hard particles with a diameter of 0.5mm Tungsten carbide particles, after sealing, apply static electricity to the mixing container, and at the same time perform mechanical vibration, ultrasonic vibration, continuous impact, overturning, and high-pressure operations to make it uniform, and then sieving and separating spherical hard tungsten carbide particles, that is;
  • Flux preparation Add 12% rosin (active agent), 35.5% bisphenol A type epoxy resin (film former) and 2% fluoroaliphatic polyether (surfactant) to the balance of ethylene glycol ( In the solvent), mix evenly to obtain a flux;
  • micro-nano mixed metal particles obtained in step S1 and the flux obtained in step S2 are mixed according to a weight ratio of 4:1, stirred, sonicated, and mixed uniformly to obtain.
  • Example 4 A multi-stage micro-nano mixed metal paste
  • the multi-stage micro-nano hybrid metal paste is prepared by the following method:
  • micro-nano mixed metal particles obtained in step S1 and the flux obtained in step S2 are mixed according to a weight ratio of 4:1, stirred, sonicated, and mixed uniformly to obtain.
  • Example 1 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 45 nm, and other parameters and operations refer to Example 1.
  • Comparative Example 2 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 200 nm, and other parameters and operations refer to Example 1.
  • Comparative Example 3 replaces the micro-nano mixed metal particles with single micron copper particles with a size of 1 ⁇ m. Refer to Example 1 for other parameters and operations.
  • Example 2 The difference from Example 2 is that in Comparative Example 4, the micro-nano mixed metal particles are replaced by single nano-copper particles with a size of 35 nm. Refer to Example 2 for other parameters and operations.
  • Example 2 The difference from Example 2 is that in Comparative Example 5, the micro-nano mixed metal particles are replaced with single nano-copper particles with a size of 150 nm, and other parameters and operations refer to Example 2.
  • Comparative Example 6 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 700 nm, and other parameters and operations refer to Example 2.
  • Comparative Example 7 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 25 nm, and other parameters and operations refer to Example 3.
  • Comparative Example 8 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 110 nm, and other parameters and operations refer to Example 3.
  • the metal pastes prepared in Examples 1 to 3 and Comparative Examples 1 to 8 were coated on the substrate and laser sintered. The sintering thickness was all 50 ⁇ m. Each group tested 5 in parallel at the same time. The copper nanoparticles were sintered by Image J computer software The SEM image of the film was processed to calculate the average porosity. The results are shown in Table 1.

Abstract

A multi-grade micro-nano mixed metal paste, comprising 2-5 grades of 5nm-100μm micro-nano mixed metal particles (6) and flux (7). According to the metal paste (8), the diameters of the metal particles (2, 3, 4) of various grades are further defined, and the multi-grade micro-nano mixed metal paste is prepared by mixing the multi-grade micro-nano metal particles. Also provided is a preparation method for the multi-grade micro-nano mixed metal paste. The metal paste has nano particles evenly distributed, and can satisfy the requirements of low-temperature sintering and high-temperature usage. The preparation method is simple to operate, easy to control, and suitable for large-scale industrial production.

Description

一种多级微纳混合金属膏及其制备方法Multi-stage micro-nano mixed metal paste and preparation method thereof 技术领域Technical field
本发明属于焊接材料技术领域。更具体地,涉及一种多级微纳混合金属膏及其制备方法。The invention belongs to the technical field of welding materials. More specifically, it relates to a multi-stage micro-nano hybrid metal paste and a preparation method thereof.
背景技术Background technique
在电子芯片,高速动车,能源传输等领域常用金属纳米材料(如铜、银和镍)作为焊接层,其具有热导率高(150~300W/m·K),服役温度高的优点,是一种较为理想的耐高温和高导热焊接材料,可以作为第三代半导体电极引出材料和芯片封装的钎料,实现低温(<300℃)下互连,高温服役的效果。目前常用银纳米材料主要为纳米银材料,但是纳米银材料存在价格高、膨胀系数差异大、孔隙率大、存在电迁移等缺点,应用受到极大的限制。Metal nanomaterials (such as copper, silver and nickel) are commonly used as soldering layers in electronic chips, high-speed trains, energy transmission and other fields. They have the advantages of high thermal conductivity (150~300W/m·K) and high service temperature. An ideal high-temperature resistance and high thermal conductivity soldering material, which can be used as the third-generation semiconductor electrode lead-out material and solder for chip packaging to achieve low-temperature (<300°C) interconnection and high-temperature service effects. At present, the commonly used silver nanomaterials are mainly nano-silver materials, but nano-silver materials have disadvantages such as high price, large expansion coefficient, large porosity, and electromigration, and their applications are greatly restricted.
研究发现,可以采用纳米铜材料来替代纳米银材料,多尺寸结合的方式解决上述问题。如中国专利申请CN109935563A公开了一种多尺寸混合纳米颗粒膏体及其制备方法,该膏体含有多种尺寸混合铜纳米颗粒,在烧结使用时,小尺寸纳米金属颗粒会填补在大尺寸纳米金属颗粒的间隙之中,有利于在无压力辅助的情况下实现纳米铜连结,提升烧结后金属层的致密性。但是该制备方法需要通过物理冲击的方式赋予小尺寸纳米金属颗粒动能,才能使其被打入大尺寸纳米铜膏体中,配置大小尺寸混合的纳米金属复合膏体,并且需要严格控制调整物理冲击的大小,从而控制小尺寸纳米金属颗粒的量,存在颗粒不均匀,操作复杂,且较难控制的问题。Research has found that nano-copper materials can be used to replace nano-silver materials, and the above-mentioned problems can be solved in a multi-size combination. For example, Chinese patent application CN109935563A discloses a multi-size mixed nano-particle paste and a preparation method thereof. The paste contains mixed copper nanoparticles of various sizes. The gap between the particles is beneficial to realize the connection of nano-copper without pressure assistance, and improve the compactness of the metal layer after sintering. However, this preparation method needs to impart kinetic energy to the small-sized nano-metal particles by means of physical impact, so that they can be driven into the large-sized nano-copper paste, and the nano-metal composite paste of mixed size and size is configured, and the physical impact needs to be strictly controlled and adjusted. In order to control the amount of small-sized nano metal particles, there are problems of uneven particles, complicated operations, and difficult to control.
因此,迫切需要提供一种孔隙率低、致密度高、混合均匀、制备方法简单的多级微纳混合金属膏。Therefore, there is an urgent need to provide a multi-stage micro-nano hybrid metal paste with low porosity, high density, uniform mixing, and simple preparation method.
发明内容Summary of the invention
本发明要解决的技术问题是克服现有技术纳米银材料价格高、膨胀系数差异大、孔隙率大、存在电迁移等缺点,多尺寸纳米铜材料颗粒不均匀、制备较为复杂且难以控制质量的缺陷和不足,提供一种孔隙率低、致密度高、混合均匀、制备方法简单的多级微纳混合金属膏。The technical problem to be solved by the present invention is to overcome the disadvantages of high price of nano-silver materials in the prior art, large expansion coefficient difference, large porosity, electromigration, etc., the multi-size nano-copper material particles are not uniform, the preparation is relatively complicated, and the quality is difficult to control. Defects and deficiencies provide a multi-level micro-nano hybrid metal paste with low porosity, high density, uniform mixing and simple preparation method.
本发明另一目的是提供所述多级微纳混合金属膏的制备方法。Another object of the present invention is to provide a method for preparing the multi-stage micro-nano mixed metal paste.
本发明上述目的通过以下技术方案实现:The above objectives of the present invention are achieved through the following technical solutions:
一种多级微纳混合金属膏,所述多级微纳混合金属膏包括2~5级5nm~100μm尺寸的微纳混合金属颗粒和助焊剂;A multi-stage micro-nano mixed metal paste, the multi-stage micro-nano mixed metal paste comprising 2 to 5 levels of micro-nano mixed metal particles with a size of 5 nm to 100 μm and a soldering flux;
其中,所述微纳混合金属颗粒中第n级和第(n+1)级的颗粒尺寸大小比为
Figure PCTCN2021075999-appb-000001
n=1~4;
Wherein, the particle size ratio of the nth level to the (n+1)th level in the micro-nano mixed metal particles is
Figure PCTCN2021075999-appb-000001
n=1~4;
所述微纳混合金属颗粒中第1级和第2级的颗粒的重量比为
Figure PCTCN2021075999-appb-000002
所述微纳混合金属颗粒中第m级和第(m+1)级的颗粒的重量比为
Figure PCTCN2021075999-appb-000003
m=2~4。
The weight ratio of the first-level and second-level particles in the micro-nano mixed metal particles is
Figure PCTCN2021075999-appb-000002
The weight ratio of the m-th grade and (m+1)-th grade particles in the micro-nano mixed metal particles is
Figure PCTCN2021075999-appb-000003
m=2~4.
本发明多级微纳混合金属膏将各级金属颗粒直径进一步限定,采用多级微纳金属颗粒混合的形式制备得到多级微纳混合金属膏,纳米颗粒分布均匀,用于烧结时,连接键合截面孔隙率低,致密度高,耐热冲击性强,可靠性高,可以完全满足低温烧结,高温服役的要求。The multi-level micro-nano hybrid metal paste of the present invention further limits the diameter of the metal particles at all levels, and adopts the form of mixing multi-level micro-nano metal particles to prepare the multi-level micro-nano hybrid metal paste. The nano-particles are evenly distributed and are used for sintering. The composite section has low porosity, high density, strong thermal shock resistance, high reliability, and can fully meet the requirements of low-temperature sintering and high-temperature service.
优选地,所述微纳混合金属颗粒中第n级和第(n+1)级的颗粒尺寸大小比为0.225:(0.5~1),n=1~4。Preferably, the particle size ratio of the nth level and the (n+1)th level in the micro-nano mixed metal particles is 0.225:(0.5-1), n=1-4.
更优选地,所述微纳混合金属颗粒中第n级和第(n+1)级的颗粒尺寸大小比为0.225:1,n=1~4。实践中发现,在此比例条件下制备得到的多级微纳混合金属膏孔隙率低、致密性高,各效果均较好。More preferably, the particle size ratio of the nth level and the (n+1)th level in the micro-nano mixed metal particles is 0.225:1, and n=1˜4. It is found in practice that the multi-level micro-nano mixed metal paste prepared under this ratio has low porosity and high compactness, and each effect is good.
优选地,所述多级微纳混合金属膏包括2~3级。Preferably, the multi-level micro-nano mixed metal paste includes 2 to 3 levels.
更优选地,所述多级微纳混合金属膏为3级。实践中发现,当多级微纳混合金属膏为3级时,孔隙率低、致密性高均较高,且比较节省物料,操作简单。More preferably, the multi-stage micro-nano mixed metal paste is grade 3. In practice, it is found that when the multi-level micro-nano mixed metal paste is level 3, the porosity is low, the compactness is high, and the material is saved, and the operation is simple.
进一步地,所述微纳混合金属颗粒采用多级化学还原法、机械混合法或溶液混合法制备得到。Further, the micro-nano mixed metal particles are prepared by a multi-stage chemical reduction method, a mechanical mixing method or a solution mixing method.
本发明可以采用简单的多级化学还原法、机械混合法或溶液混合法制备得到,操作简单,便于控制,适合于大规模产业化生产,具有巨大的经济效益。The invention can be prepared by a simple multi-stage chemical reduction method, a mechanical mixing method or a solution mixing method, has simple operation, is convenient to control, is suitable for large-scale industrial production, and has huge economic benefits.
更进一步地,所述多级化学还原法包括以下步骤:Furthermore, the multi-stage chemical reduction method includes the following steps:
将可溶性铜盐溶于无水乙醇中,分2~5次加入分散剂和还原剂,升温至 60~78℃反应完全,离心分离、洗涤、干燥,即得;Dissolve the soluble copper salt in absolute ethanol, add dispersant and reducing agent in 2 to 5 times, heat up to 60-78°C and complete the reaction, centrifuge, wash, and dry to get it;
其中,可溶性铜盐与第1次加入的分散剂的重量比为1:(0.1~3),可溶性铜盐与第2~4次加入的分散剂的重量比为1:(0~3);Wherein, the weight ratio of the soluble copper salt to the dispersant added for the first time is 1: (0.1 to 3), and the weight ratio of the soluble copper salt to the dispersant added for the second to fourth times is 1: (0 to 3);
可溶性铜盐与第1次加入的还原剂的摩尔量比为(5~20):1,第2次加入的还原剂与第1次加入的还原剂的摩尔量比为
Figure PCTCN2021075999-appb-000004
第(m+1)次加入的还原剂与第m次加入的还原剂的摩尔量比为
Figure PCTCN2021075999-appb-000005
m=2~4;
The molar ratio of the soluble copper salt to the reducing agent added for the first time is (5~20):1, and the molar ratio of the reducing agent added for the second time to the reducing agent added for the first time is
Figure PCTCN2021075999-appb-000004
The molar ratio of the reducing agent added at the (m+1)th time to the reducing agent added at the mth time is
Figure PCTCN2021075999-appb-000005
m=2~4;
第1次的反应温度为60~75℃,第(n+1)次反应温度比第n次反应温度高0~5℃。The first reaction temperature was 60-75°C, and the (n+1)-th reaction temperature was 0-5°C higher than the n-th reaction temperature.
进一步地,所述分散剂的总添加量不超过可溶性铜盐重量的5倍;所述还原剂的总添加量不超过可溶性铜盐摩尔量的2倍。Further, the total added amount of the dispersant does not exceed 5 times the weight of the soluble copper salt; the total added amount of the reducing agent does not exceed 2 times the molar amount of the soluble copper salt.
更进一步地,所述可溶性铜盐为硫酸铜、醋酸铜或氢氧化铜,所述分散剂为聚乙烯吡咯烷酮、壬基酚聚氧乙烯醚或咪唑,所诉还原剂为抗坏血酸、水合肼、硼氢化钾、硼氢化钠或次亚磷酸钠。Furthermore, the soluble copper salt is copper sulfate, copper acetate or copper hydroxide, the dispersant is polyvinylpyrrolidone, nonylphenol polyoxyethylene ether or imidazole, and the reducing agent in question is ascorbic acid, hydrazine hydrate, boron Potassium hydride, sodium borohydride or sodium hypophosphite.
进一步地,所述机械混合法包括以下步骤:Further, the mechanical mixing method includes the following steps:
将不同尺寸的微纳金属颗粒加入混料容器中,加入球形、多面体形或不规则形状的硬质颗粒,密闭后对混料容器施加静电,同时进行机械振动、超声振动、连续撞击、翻转、高压的操作使混匀,分离,即得。Add micro-nano metal particles of different sizes into the mixing container, add spherical, polyhedral or irregularly shaped hard particles, apply static electricity to the mixing container after sealing, and perform mechanical vibration, ultrasonic vibration, continuous impact, flipping, etc. The high-pressure operation makes mixing and separation, and it is obtained.
更进一步地,所述硬质颗粒为碳化钨、铁基非晶合金或硬质PVC透明硬质颗粒。Furthermore, the hard particles are tungsten carbide, iron-based amorphous alloys or hard PVC transparent hard particles.
进一步地,所述硬质颗粒的直径为微纳混合金属颗粒中最大直径的10~15倍。Further, the diameter of the hard particles is 10-15 times the largest diameter in the micro-nano mixed metal particles.
更进一步地,所述溶液混合法包括以下步骤:Furthermore, the solution mixing method includes the following steps:
将不同尺寸的微纳金属颗粒加入混料容器中,加入无水乙醇和分散剂,密闭后对混料容器施加静电,同时进行机械振动、超声振动、连续撞击、翻转、高压的操作使混匀,离心、磁场分离,即得。Add micro-nano metal particles of different sizes into the mixing container, add absolute ethanol and dispersant, apply static electricity to the mixing container after sealing, and perform mechanical vibration, ultrasonic vibration, continuous impact, overturning, and high-pressure operations to make the mixing uniform. , Centrifugation, magnetic field separation, that is.
更进一步地,所述分散剂为聚乙烯吡咯烷酮。Furthermore, the dispersant is polyvinylpyrrolidone.
进一步地,所述微纳混合金属颗粒和助焊剂的重量比为(3~5):1。Further, the weight ratio of the micro-nano mixed metal particles and the flux is (3-5):1.
优选地,所述微纳混合金属颗粒和助焊剂的重量比为4:1。实践发现,在此比例条件下制备的多级微纳混合金属膏孔隙率低、致密性高,各效果均较好。Preferably, the weight ratio of the micro-nano mixed metal particles and the flux is 4:1. It has been found in practice that the multi-stage micro-nano mixed metal paste prepared under this ratio has low porosity and high compactness, and each effect is good.
更进一步地,所述助焊剂由以下原料及其重量百分数组成:活性剂10~30%、成膜剂10~50%、表面活性剂1~20%和溶剂余量。Furthermore, the soldering flux is composed of the following raw materials and their weight percentages: 10-30% of active agent, 10-50% of film-forming agent, 1-20% of surfactant and remaining solvent.
进一步地,所述活性剂为盐酸、氢氟酸、正磷酸、氯化亚锡、氯化锌、氯化铵、氟化钾、氟化钠等无机物,或松香、盐酸二甲胺、盐酸二乙胺、环己胺盐酸盐、芳香胺的氢卤酸盐等有机卤化物,或羟酸、磺酸等有机酸,或甲胺、二甲胺、三甲胺、乙胺等有机胺。Further, the active agent is hydrochloric acid, hydrofluoric acid, orthophosphoric acid, stannous chloride, zinc chloride, ammonium chloride, potassium fluoride, sodium fluoride and other inorganic substances, or rosin, dimethylamine hydrochloride, hydrochloric acid Organic halides such as diethylamine, cyclohexylamine hydrochloride, and aromatic amine hydrohalides, or organic acids such as hydroxy acids and sulfonic acids, or organic amines such as methylamine, dimethylamine, trimethylamine, and ethylamine.
更进一步地,所述成膜剂为双酚A型环氧树脂、有机高聚物及改性纤维素等,例如环氧树脂以及各种合成树脂、丙烯酸树脂等。Furthermore, the film forming agent is bisphenol A epoxy resin, organic high polymer, modified cellulose, etc., such as epoxy resin, various synthetic resins, acrylic resins, and the like.
进一步地,所述表面活性剂为十六烷基三甲基溴化铵、氟代脂肪族聚合醚、丁二酸二乙酯磺酸钠、季铵氟烷基化合物等。Further, the surfactant is cetyltrimethylammonium bromide, fluoroaliphatic polymer ether, sodium diethyl succinate sulfonate, quaternary ammonium fluoroalkyl compound and the like.
更进一步地,所述溶剂为松油醇、乙二醇、正丁醇、乙醇等。Furthermore, the solvent is terpineol, ethylene glycol, n-butanol, ethanol and the like.
另外的,本发明还提供了所述多级微纳混合金属膏的制备方法,其特征在于,包括以下步骤:In addition, the present invention also provides a method for preparing the multi-stage micro-nano hybrid metal paste, which is characterized in that it comprises the following steps:
制备微纳混合金属颗粒和助焊剂,将微纳混合金属颗粒和助焊剂搅拌、超声,混合均匀,即得。Prepare micro-nano mixed metal particles and flux, stir, sonicate, and mix the micro-nano mixed metal particles and flux evenly to obtain.
本发明具有以下有益效果:The present invention has the following beneficial effects:
(1)本发明一种多级微纳混合金属膏将各级金属颗粒直径进一步限定,采用多级微纳金属颗粒混合的形式制备得到多级微纳混合金属膏,纳米颗粒分布均匀,用于烧结时,连接键合截面孔隙率低,致密度高,耐热冲击性强,可靠性高,可以完全满足低温烧结,高温服役的要求。(1) The multi-level micro-nano hybrid metal paste of the present invention further limits the diameter of the metal particles at all levels, and prepares the multi-level micro-nano hybrid metal paste in the form of mixing multi-level micro-nano metal particles. The nano-particles are evenly distributed. During sintering, the bonding section has low porosity, high density, strong thermal shock resistance, and high reliability, which can fully meet the requirements of low-temperature sintering and high-temperature service.
(2)本发明一种多级微纳混合金属膏的制备方法可以为多级化学还原法、机械混合法或溶液混合法,操作简单,便于控制,适合于大规模产业化生产,具有巨大的经济效益。(2) The preparation method of a multi-stage micro-nano hybrid metal paste of the present invention can be a multi-stage chemical reduction method, a mechanical mixing method or a solution mixing method. The operation is simple, easy to control, suitable for large-scale industrial production, and has huge advantages. Economic benefits.
附图说明Description of the drawings
图1为本发明多级化学还原法的流程图;Figure 1 is a flow chart of the multi-stage chemical reduction method of the present invention;
其中,1-含有金属盐的溶液,2-一级金属颗粒,3-二级金属颗粒,4-三级金属颗粒,5-还原剂及分散剂,6-微纳混合金属颗粒,7-助焊剂,8-多级微纳混合 金属膏。Among them, 1- containing metal salt solution, 2- primary metal particles, 3- secondary metal particles, 4- tertiary metal particles, 5- reducing agent and dispersant, 6-micro-nano mixed metal particles, 7-assisted Flux, 8-multi-level micro-nano mixed metal paste.
图2为本发明机械混合法的流程图;Figure 2 is a flow chart of the mechanical mixing method of the present invention;
其中,2-一级金属颗粒,3-二级金属颗粒,4-三级金属颗粒,6-微纳混合金属颗粒,7-助焊剂,8-多级微纳混合金属膏,9-密闭混料容器,10-硬质颗粒,11-搅拌台。Among them, 2-level metal particles, 3-level metal particles, 4-level metal particles, 6-micro-nano mixed metal particles, 7-flux, 8-multi-level micro-nano mixed metal paste, 9-closed mixed Material container, 10-hard particles, 11-mixing table.
图3为本发明实施例1多级微纳混合金属膏的SEM观察图。Fig. 3 is an SEM observation diagram of the multi-level micro-nano mixed metal paste in Example 1 of the present invention.
图4为本发明实施例2多级微纳混合金属膏的SEM观察图。4 is a SEM observation diagram of the multi-level micro-nano mixed metal paste of Example 2 of the present invention.
图5为本发明实施例3多级微纳混合金属膏的SEM观察图。Fig. 5 is an SEM observation diagram of the multi-level micro-nano mixed metal paste in Example 3 of the present invention.
具体实施方式Detailed ways
以下结合说明书附图和具体实施例来进一步说明本发明,但实施例并不对本发明做任何形式的限定。除非特别说明,本发明采用的试剂、方法和设备为本技术领域常规试剂、方法和设备。The present invention will be further described below with reference to the drawings and specific embodiments of the specification, but the embodiments do not limit the present invention in any form. Unless otherwise specified, the reagents, methods and equipment used in the present invention are conventional reagents, methods and equipment in the technical field.
除非特别说明,以下实施例所用试剂和材料均为市购。Unless otherwise specified, the reagents and materials used in the following examples are all commercially available.
实施例1一种多级微纳混合金属膏Example 1 A multi-stage micro-nano mixed metal paste
所述多级微纳混合金属膏采用以下方法制备:The multi-stage micro-nano hybrid metal paste is prepared by the following method:
S1、微纳混合金属颗粒制备:将9g醋酸铜溶于900ml无水乙醇中,第1次加入3.3g分散剂聚乙烯吡咯烷酮和10.56g还原剂抗坏血酸,水浴加热至70℃,反应至完全;第2次加入2.4g分散剂聚乙烯吡咯烷酮和8.1g还原剂抗坏血酸,水浴加热至75℃,反应至完全;第3次加入1.55g分散剂聚乙烯吡咯烷酮和6g还原剂抗坏血酸,水浴加热至75℃,反应至完全,离心分离,用去离子水、无水乙醇洗涤,真空干燥12~24h,得到一级45nm、二级200nm、三级1μm,重量比为1:4:2的微纳混合金属颗粒;S1. Preparation of micro-nano mixed metal particles: Dissolve 9g of copper acetate in 900ml of absolute ethanol, add 3.3g of dispersant polyvinylpyrrolidone and 10.56g of reducing agent ascorbic acid for the first time, heat to 70℃ in a water bath, and react to completion; Add 2.4g of the dispersant polyvinylpyrrolidone and 8.1g of the reducing agent ascorbic acid twice, and heat the water bath to 75°C to complete the reaction; add 1.55g of the dispersant polyvinylpyrrolidone and 6g of the reducing agent ascorbic acid for the third time, and heat the water bath to 75°C, After the reaction is complete, centrifuged, washed with deionized water and absolute ethanol, and dried in vacuum for 12-24 hours to obtain micro-nano mixed metal particles with a weight ratio of 1:4:2 at the first level of 45nm, the second level of 200nm, and the third level of 1μm. ;
S2、助焊剂制备:将12%松香(活性剂)、35.5%双酚A型环氧树脂(成膜剂)和2%十六烷基三甲基溴化铵(表面活性剂)加入余量松油醇(溶剂)中,混合均匀,得助焊剂;S2. Flux preparation: add 12% rosin (active agent), 35.5% bisphenol A type epoxy resin (film former) and 2% cetyltrimethylammonium bromide (surfactant) to the balance In terpineol (solvent), mix evenly to obtain flux;
S3、多级微纳混合金属膏制备:将步骤S1所得微纳混合金属颗粒和步骤S2所得助焊剂按照重量比为4:1混合,搅拌、超声,混合均匀,即得。S3. Preparation of multi-stage micro-nano mixed metal paste: The micro-nano mixed metal particles obtained in step S1 and the flux obtained in step S2 are mixed according to a weight ratio of 4:1, stirred, sonicated, and mixed uniformly to obtain.
对实施例1所得多级微纳混合金属膏进行SEM图像观察、测定,结果参见图3。The SEM image observation and measurement of the multi-level micro-nano mixed metal paste obtained in Example 1 are performed, and the results are shown in FIG. 3.
实施例2一种多级微纳混合金属膏Example 2 A multi-stage micro-nano mixed metal paste
所述多级微纳混合金属膏采用以下方法制备:The multi-stage micro-nano hybrid metal paste is prepared by the following method:
S1、微纳混合金属颗粒制备:分别称取一级35nm、二级150nm和三级700nm不同尺寸的纳米铜颗粒,重量比为0.26:1:1,共0.8g,加入混料容器中,加入0.1g直径为0.5mm的磁性球形硬质铁基非晶合金颗粒,密闭后对混料容器施加静电,同时进行机械振动、超声振动、连续撞击、翻转、高压的操作使混匀,筛分、磁场分离出磁性球形硬质铁基非晶合金颗粒,即得;S1. Preparation of micro-nano mixed metal particles: Weigh the first-level 35nm, second-level 150nm, and third-level 700nm copper nanoparticles with different sizes, with a weight ratio of 0.26:1:1, totaling 0.8g, and add them to the mixing container. 0.1g magnetic spherical hard iron-based amorphous alloy particles with a diameter of 0.5mm, apply static electricity to the mixing container after sealing, and perform mechanical vibration, ultrasonic vibration, continuous impact, overturning, and high-pressure operations to mix, screen, and The magnetic spherical hard iron-based amorphous alloy particles are separated by the magnetic field, and it is obtained;
S2、助焊剂制备:将12%松香(活性剂)、35.5%丙烯酸树脂(成膜剂)和2%丁二酸二乙酯磺酸钠(表面活性剂)加入余量乙二醇(溶剂)中,混合均匀,得助焊剂;S2. Flux preparation: add 12% rosin (active agent), 35.5% acrylic resin (film former) and 2% sodium diethyl succinate (surfactant) to the balance of ethylene glycol (solvent) Medium, mix evenly, get flux;
S3、多级微纳混合金属膏制备:将步骤S1所得微纳混合金属颗粒和步骤S2所得助焊剂按照重量比为4:1混合,搅拌、超声,混合均匀,即得。S3. Preparation of multi-stage micro-nano mixed metal paste: The micro-nano mixed metal particles obtained in step S1 and the flux obtained in step S2 are mixed according to a weight ratio of 4:1, stirred, sonicated, and mixed uniformly to obtain.
对实施例2所得多级微纳混合金属膏进行SEM图像观察、测定,结果参见图4。The SEM image observation and measurement of the multi-level micro-nano mixed metal paste obtained in Example 2 are performed, and the results are shown in FIG. 4.
实施例3一种多级微纳混合金属膏Example 3 A multi-stage micro-nano mixed metal paste
所述多级微纳混合金属膏采用以下方法制备:The multi-stage micro-nano hybrid metal paste is prepared by the following method:
S1、微纳混合金属颗粒制备:分别称取一级25nm和二级110nm不同尺寸的纳米铜颗粒,重量比为0.26:1,加入混料容器中,加入0.1g直径为0.5mm的球形硬质碳化钨颗粒,密闭后对混料容器施加静电,同时进行机械振动、超声振动、连续撞击、翻转、高压的操作使混匀,筛分分离出球形硬质碳化钨颗粒,即得;S1. Preparation of micro-nano mixed metal particles: Weigh the first-level 25nm and second-level 110nm nano-copper particles with a weight ratio of 0.26:1, add them to the mixing container, and add 0.1g of spherical hard particles with a diameter of 0.5mm Tungsten carbide particles, after sealing, apply static electricity to the mixing container, and at the same time perform mechanical vibration, ultrasonic vibration, continuous impact, overturning, and high-pressure operations to make it uniform, and then sieving and separating spherical hard tungsten carbide particles, that is;
S2、助焊剂制备:将12%松香(活性剂)、35.5%双酚A型环氧树脂(成膜剂)和2%氟代脂肪族聚合醚(表面活性剂)加入余量乙二醇(溶剂)中,混合均匀,得助焊剂;S2. Flux preparation: Add 12% rosin (active agent), 35.5% bisphenol A type epoxy resin (film former) and 2% fluoroaliphatic polyether (surfactant) to the balance of ethylene glycol ( In the solvent), mix evenly to obtain a flux;
S3、多级微纳混合金属膏制备:将步骤S1所得微纳混合金属颗粒和步骤S2所得助焊剂按照重量比为4:1混合,搅拌、超声,混合均匀,即得。S3. Preparation of multi-stage micro-nano mixed metal paste: The micro-nano mixed metal particles obtained in step S1 and the flux obtained in step S2 are mixed according to a weight ratio of 4:1, stirred, sonicated, and mixed uniformly to obtain.
对实施例3所得多级微纳混合金属膏进行SEM图像观察、测定,结果参见图5。The SEM image observation and measurement of the multi-level micro-nano mixed metal paste obtained in Example 3 are carried out, and the results are shown in FIG. 5.
实施例4一种多级微纳混合金属膏Example 4 A multi-stage micro-nano mixed metal paste
所述多级微纳混合金属膏采用以下方法制备:The multi-stage micro-nano hybrid metal paste is prepared by the following method:
S1、微纳混合金属膏体的制备:S1. Preparation of micro-nano mixed metal paste:
分别称取一级35nm、二级150nm和三级700nm和四级3μm、五级13μm的纳米铜颗粒,重量比为0.26:1:1:0.5:0.5,共0.8g。将五级不同尺寸的微纳金属颗粒加入混料容器中,加入100ml无水乙醇、3g聚乙烯吡咯烷酮分散剂,密闭后对混料容器施加静电,同时进行机械振动、超声振动、连续撞击、翻转、高压的操作使混匀,离心、磁场分离,即得;Weigh the first-level 35nm, the second-level 150nm, the third-level 700nm, the fourth-level 3μm, and the fifth-level 13μm copper nanoparticles with a weight ratio of 0.26:1:1:0.5:0.5, and a total of 0.8g. Add five grades of micro-nano metal particles of different sizes into the mixing container, add 100ml of absolute ethanol and 3g of polyvinylpyrrolidone dispersant, apply static electricity to the mixing container after sealing, and perform mechanical vibration, ultrasonic vibration, continuous impact, and inversion at the same time , High-pressure operation makes mixing, centrifugation, magnetic field separation, that is;
S2、将12%松香(活性剂)、35.5%丙烯酸树脂(成膜剂)和2%十六烷基三甲基溴化铵(表面活性剂)加入余量乙二醇(溶剂)中,混合均匀,得助焊剂;S2. Add 12% rosin (active agent), 35.5% acrylic resin (film former) and 2% cetyltrimethylammonium bromide (surfactant) to the remaining ethylene glycol (solvent) and mix Uniform, get flux;
S3、多级微纳混合金属膏制备:将步骤S1所得微纳混合金属颗粒和步骤S2所得助焊剂按照重量比为4:1混合,搅拌、超声,混合均匀,即得。S3. Preparation of multi-stage micro-nano mixed metal paste: The micro-nano mixed metal particles obtained in step S1 and the flux obtained in step S2 are mixed according to a weight ratio of 4:1, stirred, sonicated, and mixed uniformly to obtain.
对比例1一种金属膏Comparative Example 1 A metal paste
与实施例1不同之处在于,对比例1将微纳混合金属颗粒替换为尺寸为45nm的单一纳米铜颗粒,其余参数及操作参考实施例1。The difference from Example 1 is that Comparative Example 1 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 45 nm, and other parameters and operations refer to Example 1.
对比例2一种金属膏Comparative Example 2 A metal paste
与实施例1不同之处在于,对比例2将微纳混合金属颗粒替换为尺寸为200nm的单一纳米铜颗粒,其余参数及操作参考实施例1。The difference from Example 1 is that Comparative Example 2 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 200 nm, and other parameters and operations refer to Example 1.
对比例3一种金属膏Comparative Example 3 A metal paste
与实施例1不同之处在于,对比例3将微纳混合金属颗粒替换为尺寸为1μm的单一微米铜颗粒,其余参数及操作参考实施例1。The difference from Example 1 is that Comparative Example 3 replaces the micro-nano mixed metal particles with single micron copper particles with a size of 1 μm. Refer to Example 1 for other parameters and operations.
对比例4一种金属膏Comparative Example 4 A metal paste
与实施例2不同之处在于,对比例4将微纳混合金属颗粒替换为尺寸为35nm的单一纳米铜颗粒,其余参数及操作参考实施例2。The difference from Example 2 is that in Comparative Example 4, the micro-nano mixed metal particles are replaced by single nano-copper particles with a size of 35 nm. Refer to Example 2 for other parameters and operations.
对比例5一种金属膏Comparative Example 5 A metal paste
与实施例2不同之处在于,对比例5将微纳混合金属颗粒替换为尺寸为150nm的单一纳米铜颗粒,其余参数及操作参考实施例2。The difference from Example 2 is that in Comparative Example 5, the micro-nano mixed metal particles are replaced with single nano-copper particles with a size of 150 nm, and other parameters and operations refer to Example 2.
对比例6一种金属膏Comparative Example 6 A metal paste
与实施例2不同之处在于,对比例6将微纳混合金属颗粒替换为尺寸为700nm的单一纳米铜颗粒,其余参数及操作参考实施例2。The difference from Example 2 is that Comparative Example 6 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 700 nm, and other parameters and operations refer to Example 2.
对比例7一种金属膏Comparative Example 7 A metal paste
与实施例3不同之处在于,对比例7将微纳混合金属颗粒替换为尺寸为25nm的单一纳米铜颗粒,其余参数及操作参考实施例3。The difference from Example 3 is that Comparative Example 7 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 25 nm, and other parameters and operations refer to Example 3.
对比例8一种金属膏Comparative Example 8 A metal paste
与实施例3不同之处在于,对比例8将微纳混合金属颗粒替换为尺寸为110nm的单一纳米铜颗粒,其余参数及操作参考实施例3。The difference from Example 3 is that Comparative Example 8 replaces the micro-nano mixed metal particles with single nano-copper particles with a size of 110 nm, and other parameters and operations refer to Example 3.
实验例1金属膏烧结薄膜及孔隙率测定Experimental example 1 Metal paste sintered film and measurement of porosity
将实施例1~3和对比例1~8制备的金属膏涂覆到基板上,进行激光烧结,烧结厚度均为50μm,各组同时平行实验5个,通过Image J电脑软件对铜纳米颗粒烧结薄膜的SEM图像进行处理,计算平均孔隙率,结果参见表1。The metal pastes prepared in Examples 1 to 3 and Comparative Examples 1 to 8 were coated on the substrate and laser sintered. The sintering thickness was all 50 μm. Each group tested 5 in parallel at the same time. The copper nanoparticles were sintered by Image J computer software The SEM image of the film was processed to calculate the average porosity. The results are shown in Table 1.
表1金属膏烧结薄膜孔隙率Table 1 Porosity of metal paste sintered film
组别Group 金属膏颗粒尺寸Metal paste particle size 平均孔隙率(%)Average porosity (%)
实施例1Example 1 45nm、200nm、1μm45nm, 200nm, 1μm 10.410.4
对比例1Comparative example 1 45nm45nm 12.212.2
对比例2Comparative example 2 200nm200nm 14.614.6
对比例3Comparative example 3 1μm1μm 26.426.4
实施例2Example 2 35nm、150nm、700nm35nm, 150nm, 700nm 10.610.6
对比例4Comparative example 4 35nm35nm 12.012.0
对比例5Comparative example 5 150nm150nm 14.514.5
对比例6Comparative example 6 700nm700nm 21.621.6
实施例3Example 3 25nm、110nm25nm, 110nm 11.611.6
对比例7Comparative example 7 25nm25nm 12.112.1
对比例8Comparative example 8 110nm110nm 14.314.3
由表1可见,本发明实施例1~3制备的多级微纳混合金属膏平均孔隙率均在12%以下,致密度高,可靠性高,且各尺寸的金属纳米颗粒分布均匀;而对比例1~8分别采用单一尺寸的纳米铜颗粒,平均孔隙率显著降低。It can be seen from Table 1 that the average porosity of the multi-level micro-nano mixed metal paste prepared in Examples 1 to 3 of the present invention is below 12%, with high density, high reliability, and uniform distribution of metal nanoparticles of various sizes; Ratios 1 to 8 use single-sized nano-copper particles, and the average porosity is significantly reduced.
上述实施例为本发明较佳的实施方式,但本发明的实施方式并不受上述实施例的限制,其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化,均应为等效的置换方式,都包含在本发明的保护范围之内。The above-mentioned embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited by the above-mentioned embodiments, and any other changes, modifications, substitutions, combinations, etc. made without departing from the spirit and principle of the present invention Simplified, all should be equivalent replacement methods, and they are all included in the protection scope of the present invention.

Claims (10)

  1. 一种多级微纳混合金属膏,其特征在于,所述多级微纳混合金属膏包括2~5级5nm~100μm尺寸的微纳混合金属颗粒和助焊剂;A multi-stage micro-nano mixed metal paste, characterized in that the multi-stage micro-nano mixed metal paste includes 2 to 5 levels of micro-nano mixed metal particles with a size of 5 nm to 100 μm and a soldering flux;
    其中,所述微纳混合金属颗粒中第n级和第(n+1)级的颗粒尺寸大小比为
    Figure PCTCN2021075999-appb-100001
    n=1~4;
    Wherein, the particle size ratio of the nth level to the (n+1)th level in the micro-nano mixed metal particles is
    Figure PCTCN2021075999-appb-100001
    n=1~4;
    所述微纳混合金属颗粒中第1级和第2级的颗粒的重量比为
    Figure PCTCN2021075999-appb-100002
    所述微纳混合金属颗粒中第m级和第(m+1)级的颗粒的重量比为
    Figure PCTCN2021075999-appb-100003
    m=2~4。
    The weight ratio of the first-level and second-level particles in the micro-nano mixed metal particles is
    Figure PCTCN2021075999-appb-100002
    The weight ratio of the m-th grade and (m+1)-th grade particles in the micro-nano mixed metal particles is
    Figure PCTCN2021075999-appb-100003
    m=2~4.
  2. 根据权利要求1所述多级微纳混合金属膏,其特征在于,所述微纳混合金属颗粒采用多级化学还原法、机械混合法或溶液混合法制备得到。The multi-stage micro-nano mixed metal paste according to claim 1, wherein the micro-nano mixed metal particles are prepared by a multi-stage chemical reduction method, a mechanical mixing method, or a solution mixing method.
  3. 根据权利要求2所述多级微纳混合金属膏,其特征在于,所述多级化学还原法包括以下步骤:The multi-stage micro-nano mixed metal paste according to claim 2, wherein the multi-stage chemical reduction method comprises the following steps:
    将可溶性铜盐溶于无水乙醇中,分2~5次加入分散剂和还原剂,升温至60~78℃反应完全,离心分离、洗涤、干燥,即得;Dissolve the soluble copper salt in absolute ethanol, add dispersant and reducing agent in 2 to 5 times, heat up to 60-78°C to complete the reaction, centrifuge, wash, and dry to get it;
    其中,可溶性铜盐与第1次加入的分散剂的重量比为1:(0.1~3),可溶性铜盐与第2~4次加入的分散剂的重量比为1:(0~3);Wherein, the weight ratio of the soluble copper salt to the dispersant added for the first time is 1: (0.1 to 3), and the weight ratio of the soluble copper salt to the dispersant added for the second to fourth times is 1: (0 to 3);
    可溶性铜盐与第1次加入的还原剂的摩尔量比为(5~20):1,第2次加入的还原剂与第1次加入的还原剂的摩尔量比为
    Figure PCTCN2021075999-appb-100004
    第(m+1)次加入的还原剂与第m次加入的还原剂的摩尔量比为
    Figure PCTCN2021075999-appb-100005
    m=2~4;
    The molar ratio of the soluble copper salt to the reducing agent added for the first time is (5~20):1, and the molar ratio of the reducing agent added for the second time to the reducing agent added for the first time is
    Figure PCTCN2021075999-appb-100004
    The molar ratio of the reducing agent added at the (m+1)th time to the reducing agent added at the mth time is
    Figure PCTCN2021075999-appb-100005
    m=2~4;
    第1次的反应温度为60~75℃,第(n+1)次反应温度比第n次反应温度高0~5℃。The first reaction temperature was 60-75°C, and the (n+1)-th reaction temperature was 0-5°C higher than the n-th reaction temperature.
  4. 根据权利要求3所述多级微纳混合金属膏,其特征在于,所述分散剂的总添加量不超过可溶性铜盐重量的5倍;所述还原剂的总添加量不超过可溶性铜盐摩尔量的2倍。The multi-stage micro-nano mixed metal paste according to claim 3, wherein the total added amount of the dispersant does not exceed 5 times the weight of the soluble copper salt; the total added amount of the reducing agent does not exceed the moles of the soluble copper salt 2 times the amount.
  5. 根据权利要求4所述多级微纳混合金属膏,其特征在于,所述可溶性铜盐为硫酸铜、醋酸铜或氢氧化铜,所述分散剂为聚乙烯吡咯烷酮、壬基酚聚氧乙烯醚或咪唑,所诉还原剂为抗坏血酸、水合肼、硼氢化钾、硼氢化钠或次亚磷酸钠。The multi-stage micro-nano mixed metal paste according to claim 4, wherein the soluble copper salt is copper sulfate, copper acetate or copper hydroxide, and the dispersant is polyvinylpyrrolidone, nonylphenol polyoxyethylene ether Or imidazole, the reducing agent in question is ascorbic acid, hydrazine hydrate, potassium borohydride, sodium borohydride or sodium hypophosphite.
  6. 根据权利要求2所述多级微纳混合金属膏,其特征在于,所述机械混合法包括以下步骤:The multi-stage micro-nano hybrid metal paste according to claim 2, wherein the mechanical mixing method comprises the following steps:
    将不同尺寸的微纳金属颗粒加入混料容器中,加入球形、多面体形或不规则形状的硬质颗粒,密闭后对混料容器施加静电,同时进行机械振动、超声振动、连续撞击、翻转、高压的操作使混匀,分离,即得。Add micro-nano metal particles of different sizes into the mixing container, add spherical, polyhedral or irregularly shaped hard particles, apply static electricity to the mixing container after sealing, and perform mechanical vibration, ultrasonic vibration, continuous impact, flipping, etc. The high-pressure operation makes mixing and separation, and it is obtained.
  7. 根据权利要求2所述多级微纳混合金属膏,其特征在于,所述溶液混合法包括以下步骤:The multi-stage micro-nano hybrid metal paste according to claim 2, wherein the solution mixing method comprises the following steps:
    将不同尺寸的微纳金属颗粒加入混料容器中,加入无水乙醇和分散剂,密闭后对混料容器施加静电,同时进行机械振动、超声振动、连续撞击、翻转、高压的操作使混匀,离心、磁场分离,即得。Add micro-nano metal particles of different sizes into the mixing container, add absolute ethanol and dispersant, apply static electricity to the mixing container after sealing, and perform mechanical vibration, ultrasonic vibration, continuous impact, overturning, and high-pressure operations to make the mixing uniform. , Centrifugation, magnetic field separation, that is.
  8. 根据权利要求1~7任一所述多级微纳混合金属膏,其特征在于,所述微纳混合金属颗粒和助焊剂的重量比为(3~5):1。The multi-stage micro-nano mixed metal paste according to any one of claims 1 to 7, wherein the weight ratio of the micro-nano mixed metal particles and the flux is (3 to 5):1.
  9. 根据权利要求8所述多级微纳混合金属膏,其特征在于,所述助焊剂由以下原料及其重量百分数组成:活性剂10~30%、成膜剂10~50%、表面活性剂1~20%和溶剂余量。The multi-level micro-nano mixed metal paste according to claim 8, wherein the flux is composed of the following raw materials and their weight percentages: 10-30% of active agent, 10-50% of film-forming agent, and 1 ~20% and solvent balance.
  10. 权利要求9所述多级微纳混合金属膏的制备方法,其特征在于,包括以下步骤:The preparation method of the multi-stage micro-nano hybrid metal paste according to claim 9, characterized in that it comprises the following steps:
    制备微纳混合金属颗粒和助焊剂,将微纳混合金属颗粒和助焊剂搅拌、超声,混合均匀,即得。Prepare micro-nano mixed metal particles and flux, stir, sonicate, and mix the micro-nano mixed metal particles and flux evenly to obtain.
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