WO2021164113A1 - 一种用于芯片镀膜工艺的砝码模组 - Google Patents

一种用于芯片镀膜工艺的砝码模组 Download PDF

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Publication number
WO2021164113A1
WO2021164113A1 PCT/CN2020/084941 CN2020084941W WO2021164113A1 WO 2021164113 A1 WO2021164113 A1 WO 2021164113A1 CN 2020084941 W CN2020084941 W CN 2020084941W WO 2021164113 A1 WO2021164113 A1 WO 2021164113A1
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WO
WIPO (PCT)
Prior art keywords
axis
weight
fixing frame
chip
indenter
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PCT/CN2020/084941
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English (en)
French (fr)
Inventor
蒋海兵
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深圳市海铭德科技有限公司
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Publication of WO2021164113A1 publication Critical patent/WO2021164113A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Definitions

  • the invention relates to a pressure maintaining device, in particular to a weight module used in a chip coating process.
  • the current method of fixing the chip is to paste the chip on the jig with double-sided tape. After the pasting process, a pressure holding process is required to ensure that the chip is adhered firmly. To prevent the coating process from contaminating the bottom of the chip, the current holding process generally adopts manual or mechanical holding.
  • the holding tool is generally a flat plate. Pressure is applied manually or mechanically, both of which have uneven pressure application. The problem is that the chip is very fragile, the above two pressure holding methods are very easy to cause damage to the chip.
  • a weight module for chip coating process comprising a base, on which is provided an XYZ three-axis motion platform, the XYZ three-axis motion platform is provided with weight components, and the weight components include several Long strip weights, a lower fixing frame and an upper fixing frame; the weights are arranged vertically and penetrate the lower fixing frame and the upper fixing frame, and the weights are placed between the lower fixing frame and the upper fixing frame.
  • the upper fixing frame can move up and down; the position of the weight on the lower fixing frame and the upper fixing frame corresponds to the position where the chip is installed on the jig; the weight includes an extension rod set on the top thereof, Place or remove floating weights on the extension rod.
  • the XYZ three-axis motion platform includes an X axis, a Y axis and a Z axis, the Z axis is arranged on the base, the X axis is arranged on the Z axis, and the Y axis The axis is set on the X axis
  • the Z-axis includes a Z-axis track arranged on the base, a Z-axis driving device is arranged on the top of the Z-axis track to drive the Z-axis slider to move up and down, the Z-axis slider X-axis rails and X-axis driving devices are provided on the X-axis rails, the X-axis sliders matched with the X-axis rails are set on the mounting frame, and the Y-axis rails and Y-axis driving devices are also provided on the mounting frame.
  • the Y-axis slider corresponding to the Y-axis track is arranged on the weight component mounting plate, and the weight component is arranged on the weight component mounting plate.
  • the Z-axis slider is in the shape of a "mouth", the Z-axis track is located in the middle of the "mouth”-shaped structure of the Z-axis slider;
  • the mounting frame is in the shape of a " ⁇ ”,
  • the " ⁇ "-shaped notch direction faces the Z axis,
  • the Y axis rails are arranged at the two ends of the mounting frame,
  • the Y axis driving device is arranged at the middle position of the mounting frame, and the Y axis
  • the output shaft of the shaft driving device faces the weight assembly mounting plate.
  • the XYZ three-axis motion platform includes an X axis, a Y axis and a Z axis, the Y axis is arranged on the base, the Z axis is arranged on the Y axis, and the X axis The axis is arranged on the Z axis.
  • a fine adjustment device is also provided between the Z axis and the Y axis for fine adjustment of the weight module in the X axis direction.
  • a clearance fit is adopted between the weight and the upper fixing frame to enable it to move up and down in the upper fixing frame, and a step is provided at the bottom of the weight so that the weight The code can be held up by the lower fixing frame.
  • the weight further includes a weight indenter, a fixed weight and an indenter rubber sleeve, the weight indenter is fixed on the end of the fixed weight facing the jig, the The indenter rubber sleeve is arranged at one end of the weight indenter away from the fixed weight.
  • the indenter rubber sleeve is provided with a recessed hole at the position contacting the chip, so that the indenter rubber sleeve can only contact the positions around the top of the chip, and the weight indenter is installed with the indenter
  • a fungus-shaped chuck is arranged at the position of the rubber sleeve, and the pressing-head rubber sleeve is installed on the chuck.
  • one end of the extension rod is provided with an external thread, and the corresponding mounting position on the weight is provided with a threaded hole, and the extension rod is detachably connected to the weight.
  • the beneficial effects of the present invention because the present invention uses a single weight instead of a flat plate to hold pressure, it can ensure that the force received by each chip is the same.
  • the adjustable floating weight allows the weight module to It is suitable for the pressure holding work of various types of chips. Because the weight module has an XYZ three-axis motion platform, the weight matrix can move horizontally and vertically, and realize the misaligned pressure holding of multiple chips by one weight. Meet the tight arrangement requirements of the chips on the fixture.
  • Figure 1 is a front view of the first weight module provided by an embodiment of the present invention.
  • Figure 2 is a side view of the first weight module provided by an embodiment of the present invention.
  • Figure 3 is a top view of the first weight module provided by an embodiment of the present invention.
  • Figure 4 is a partial enlarged view of A in Figure 1;
  • Figure 5 is a partial enlarged view of B in Figure 1;
  • FIG. 6 is a schematic diagram of the structure of the first weight module provided by an embodiment of the present invention.
  • Figure 7 is a first view of the exploded view of the XYZ three-axis motion platform of the present invention.
  • Figure 8 is an exploded view of the XYZ three-axis motion platform of the present invention from a second perspective;
  • Figure 9 is a first view of the second weight module provided by the present invention.
  • Fig. 10 is a second perspective of the second weight module provided by the present invention.
  • the present invention provides a weight module used in the chip coating process, which achieves uniform holding pressure and at the same time solves the problem that a single weight cannot satisfy the chip in the treatment.
  • the close arrangement of tools are provided.
  • a weight module for chip coating process includes a base 1, on which an XYZ three-axis motion platform is set, and the XYZ three-axis motion platform is set There is a weight assembly 3, which includes a number of long strip weights, a lower fixing frame 301 and an upper fixing frame 306; the weight penetrates the lower fixing frame 301 and the upper fixing frame 306; the weight is set vertically, and The weight can move up and down between the lower fixing frame 301 and the upper fixing frame 306; the position of the weight on the lower fixing frame 301 and the upper fixing frame 306 corresponds to the position where the chip is installed on the jig 2; the weight includes an extension set on the top of it On the rod 304, the floating weight 305 can be placed or removed on the extension rod 304.
  • the weights can move up and down in the upper fixing frame 306 and the lower fixing frame 301, and the lower fixing frame 301 supports the weights.
  • pressure holding it passes through the XYZ three-axis motion platform , After the weight moves to the top of the chip, the weight assembly 3 drops as a whole, and a single weight falls on each chip. Since the weight can move between the upper and lower fixing frames, it can be understood as the weight utilization at this time Its own weight keeps the chip under pressure, so that the glue on the chip and the jig is firmly pasted, and prevents defective products from appearing in the coating process of the chip.
  • the XYZ three-axis motion platform can be used to achieve the misalignment and pressure retention of the chip, for example, the weight Due to volume influence, one more chip is distributed between two adjacent weights, that is, a 2 ⁇ 2 matrix weight corresponds to a 4 ⁇ 4 matrix chip, and a single weight can be driven by the XYZ three-axis motion platform.
  • the chip in the misplaced pressure holding 2 ⁇ 2 matrix can be changed to a 3 ⁇ 3 matrix or a larger matrix according to the volume of the weight.
  • the present invention uses a single weight instead of a flat plate to maintain pressure, which can ensure that the force received by each chip is the same.
  • the adjustable floating weight allows the weight module to adapt to various types of chips. Pressure holding work, because the weight module is equipped with an XYZ three-axis motion platform, the weight matrix can move horizontally and vertically, so that one weight can hold multiple chips in sequence to meet the requirements of the chip on the fixture. Closely packed needs.
  • the XYZ three-axis motion platform has two structures:
  • Example 1 As shown in Figures 7-8, the XYZ three-axis motion platform includes X-axis 4, Y-axis 5 and Z-axis 6.
  • the Z-axis 6 is set on the base 1
  • the X-axis 4 is set on the Z-axis 6.
  • the Y axis 5 is on the X axis 4.
  • the Z axis 6 includes a Z axis track 610 arranged on the base 1.
  • the Z axis driving device 620 is arranged on the top of the Z axis track to drive the Z axis slider 630 to move up and down.
  • the Z axis slider 630 is provided with X axis tracks 410 and X
  • the axis driving device 430, the X-axis slider 420 matched with the X-axis rail 410 is arranged on the mounting frame 7, and the mounting frame 7 is also provided with a Y-axis rail 510 and a Y-axis driving device 530, and the Y axis corresponding to the Y-axis rail 510
  • the shaft slider 520 is arranged on the weight assembly mounting plate 8, and the weight assembly 3 is arranged on the weight assembly mounting plate 8.
  • the Z-axis driving device 620 is a motor, which uses a screw rod for transmission, and the X-axis driving device 430 and the Y-axis driving device 530 are both air cylinders.
  • the Z-axis slider 630 is in the shape of a “mouth”, and the Z-axis rail 610 is located in the middle of the “mouth”-shaped structure of the Z-axis slider 630.
  • the mounting frame 7 is in the shape of a " ⁇ ", and the direction of the notch of the " ⁇ " shape faces the Z axis 6, the Y-axis rail 510 is arranged at the two ends of the mounting frame 7, and the Y-axis driving device 530 is arranged at the middle position of the mounting frame 7, In addition, the output shaft of the Y-axis driving device 530 faces the weight assembly mounting plate 8.
  • the mounting frame 7 in the shape of a " ⁇ " includes a middle part and a bent part at both ends. At the top and bottom positions of the bent part, a Y-axis track is set, a total of four, corresponding, weight components There are four Y-axis sliders 520 on the mounting plate 8. The Y-axis sliders 520 are arranged at four corner positions on the weight component mounting plate 8 and perpendicular to the weight component mounting plate 8, so that the weight component mounting plate 8 is formed Similar to a table-shaped structure.
  • Embodiment 2 As shown in Figure 9-10, the XYZ three-axis motion platform includes X axis 4, Y axis 5 and Z axis 6, Y axis 5 is set on base 1, Z axis 6 is set on Y axis 5. The X axis 4 is arranged on the Z axis 6.
  • a fine adjustment device 9 is also provided between the Z axis 6 and the Y axis 5 for fine adjustment of the weight module in the X axis direction.
  • the fine-tuning device 9 uses a screw rod and a nut pair to perform fine-tuning. It can be known that the fine-tuning device 9 also includes a fine-tuning track 10 arranged between the Z-axis 6 and the Y-axis 5. .
  • the difference from the first embodiment is that the Y-axis 5 adopts a screw motor structure. Compared with the cylinder drive in the first embodiment, the stability and accuracy are improved, and the error is effectively reduced.
  • the weight assembly mounting plate 8 is used to install the weight assembly 3, wherein the lower fixing frame 301 and the upper fixing frame 306 are both horizontally fixed on the weight assembly mounting plate 8, and on both sides of the lower fixing frame 301 and the upper fixing frame 306 A baffle is provided.
  • the weight also includes a weight indenter 302, a fixed weight 303, and an indenter rubber sleeve 307.
  • the weight indenter 302 is fixed on the end of the fixed weight 303 facing the fixture 2.
  • the pressure head rubber sleeve 307 is arranged at the end of the weight pressure head 302 away from the fixed weight 303.
  • designing the weight into a multi-segment structure can facilitate the replacement of weight indenters 303 of different shapes or fixed weights 303 of different weights when facing different types of chips.
  • the indenter rubber sleeve 307 is provided with a recessed hole 308 at the position where it contacts the chip, so that the indenter rubber sleeve 307 only touches the positions around the top of the chip.
  • a square chip is used as an example.
  • the concave hole design of the indenter rubber sleeve 307 is used to make the weight only apply to the chip. Pressure is applied to the periphery of the chip without pressure on the middle position of the chip, which further ensures that the fragile chip is not damaged in any way.
  • the position where the weight indenter 302 is installed with the indenter rubber sleeve 307 is provided with a mushroom-shaped chuck, and the pressure-head rubber sleeve 307 is installed on the chuck. Since the indenter rubber sleeve 307 is a rubber product and has a limited service life, it is necessary to design a replaceable structure to facilitate replacement when the indenter rubber sleeve 307 is damaged.
  • one end of the extension rod 304 is provided with an external thread, and the corresponding weight is provided with a threaded hole at the installation location, and the extension rod 304 and the weight are detachably connected.
  • the detachable extension rod 304 means that it can be replaced with a lengthless one.
  • floating weights can be added without limitation to increase the overall weight of the weights.
  • a clearance fit is adopted between the weight and the upper fixing frame 306.
  • the gap between the weight and the upper fixing frame 306 is small enough, the weight can be completely perpendicular to the chip after falling on the chip, and the pressure received by the chip is equal to the weight of the weight.
  • the weight assembly 3 continues to move downward at this time. At this time, the weight gradually separates from the lower fixing frame 301, that is, the lower fixing frame 301 does not Play a supporting role again, at this time the weight of the weight is all pressed on the chip.
  • the weight module provided by the present invention for the chip coating process adopts the XYZ three-axis moving platform and the design of the weight component, so that the weight module can adapt to the pressure holding work of different types of chips.
  • the pressure of each chip of the present invention is constant and stable, the pressure holding effect is good, the yield rate in the sputtering process is effectively improved, and the economic benefits of the enterprise are guaranteed.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

一种用于芯片镀膜工艺的砝码模组，包括底座(1)，底座(1)上设置有XYZ三轴运动平台，XYZ三轴运动平台上设置有砝码组件(3)，砝码组件(3)包括若干根长条状砝码、下固定架(301)以及上固定架(306)；砝码穿透下固定架(301)和上固定架(306)，且在下固定架(301)和上固定架(306)之间能够上下运动；砝码在下固定架(301)和上固定架(306)上的位置对应治具(2)上安装芯片的位置；砝码包括设置在其顶部的延长杆(304)，延长杆(304)上放置或移除浮动砝码(305)。由于采用了单个砝码取代平板保压的方式以及具备了XYZ三轴运动平台，能够保证每一个芯片受到的力的大小都是相同的，且使得砝码矩阵能够进行水平和竖直方向的移动，实现一个砝码对多个芯片进行错位保压，满足治具上芯片的紧密排列的需求。

Description

一种用于芯片镀膜工艺的砝码模组 技术领域
本发明涉及一种保压装置，尤其是一种用于芯片镀膜工艺的砝码模组。
 背景技术
在芯片镀膜之前，需要将芯片固定在治具上，目前固定芯片的方式是通过双面胶将芯片粘贴在治具上，在粘贴工序之后，还需要经过保压工序，才能保证芯片粘贴稳固，防止镀膜工艺污染芯片的底部，目前的保压工序一般采用手工保压或机械保压，采用的保压工具一般是一块平整的板，通过手工或机械施加压力，两者均存在压力施加不均匀的问题，并且芯片十分脆弱，以上两种保压方式都十分容易导致芯片的损坏。
 技术问题
在此处键入技术问题描述段落。
 技术解决方案
鉴于上述状况，有必要提供一种用于芯片镀膜工艺的砝码模组。
一种用于芯片镀膜工艺的砝码模组，包括底座，所述底座上设置有XYZ三轴运动平台，所述XYZ三轴运动平台上设置有砝码组件，所述砝码组件包括若干根长条状砝码、下固定架以及上固定架；所述砝码竖直设置，且穿透所述下固定架和所述上固定架，所述砝码在所述下固定架和所述上固定架之间能够上下运动；所述砝码在所述下固定架和所述上固定架上的位置对应治具上安装芯片的位置；所述砝码包括设置在其顶部的延长杆，所述延长杆上放置或移除浮动砝码。
作为本发明的进一步方案：所述XYZ三轴运动平台包括X轴、Y轴和Z轴，所述Z轴设置在所述底座上，所述X轴设置在所述Z轴上，所述Y轴设置在所述X轴上
作为本发明的进一步方案：所述Z轴包括设置在所述底座上的Z轴轨道，Z轴驱动装置设置在所述Z轴轨道的顶部驱动Z轴滑块上下运动，所述Z轴滑块上设置有X轴轨道和X轴驱动装置，与所述X轴轨道配合的X轴滑块设置在安装架上，所述安装架上还设置有Y轴轨道和Y轴驱动装置，与所述Y轴轨道对应的Y轴滑块设置在砝码组件安装板上，所述砝码组件设置在所述砝码组件安装板上。
作为本发明的进一步方案：所述Z轴滑块呈“口”形，所述Z轴轨道位于所述Z轴滑块的“口”形结构的中间；所述安装架呈“匚”形，且“匚”形的缺口方向朝向所述Z轴，所述Y轴轨道设置在所述安装架的两端位置,所述Y轴驱动装置设置在所述安装架的中间位置，且所述Y轴驱动装置输出轴朝向所述砝码组件安装板上。
作为本发明的进一步方案：所述XYZ三轴运动平台包括X轴、Y轴和Z轴，所述Y轴设置在所述底座上，所述Z轴设置在所述Y轴上，所述X轴设置在所述Z轴上。
作为本发明的进一步方案：所述Z轴与所述Y轴之间还设置有微调装置，用于砝码模组在X轴方向上的微调。
作为本发明的进一步方案：所述砝码与所述上固定架之间采用间隙配合，使之能够在所述上固定架内能够上下活动，所述砝码底部设置有台阶，使得所述砝码能够被所述下固定架托起。
作为本发明的进一步方案：所述砝码还包括砝码压头、固定砝码以及压头胶套，所述砝码压头固定在所述固定砝码朝向所述治具的一端，所述压头胶套设置在所述砝码压头远离所述固定砝码的一端。
作为本发明的进一步方案：所述压头胶套上接触芯片的位置设置有一凹孔，使得所述压头胶套只会接触芯片顶部四周的位置，所述砝码压头安装所述压头胶套的位置处设置有菌伞状卡头，所述按头胶套与安装在所述卡头上。
作为本发明的进一步方案：所述延长杆的一端设置有外螺纹，对应的所述砝码上的安装处设置有螺纹孔，所述延长杆与所述砝码可拆卸连接。
 有益效果
本发明的有益效果：本发明由于采用了单个砝码取代平板保压的方式，能够保证每一个芯片收到的力的大小都是相同的，可调节的浮动砝码让本砝码模组能够适应各种型号芯片的保压工作，由于本砝码模组具备XYZ三轴运动平台，使得砝码矩阵能够进行水平和竖直方向的移动，实现一个砝码对多个芯片的错位保压，满足治具上芯片的紧密排列的需求。
 附图说明
图1是本发明实施例提供的第一种砝码模组的主视图；
图2是本发明实施例提供的第一种砝码模组的侧视图；
图3是本发明实施例提供的第一种砝码模组的俯视图；
图4是图1中A处的局部放大图；
图5是图1中B处的局部放大图；
图6是本发明实施例提供的第一种砝码模组结构示意图；
图7是本发明XYZ三轴运动平台的爆炸图第一视角；
图8是本发明XYZ三轴运动平台的爆炸图第二视角;
图9是本发明提供的第二种砝码模组的第一视角；
图10是本发明提供的第二种砝码模组的第二视角。
附图标记：1-底座；2-治具；3-砝码组件；301-下固定架；302-砝码压头；303-固定砝码；304-延长杆；305-浮动砝码；306-上固定架；307-压头胶套；308-凹孔；4-X轴；410-X轴轨道；420-X轴滑块；430-X轴驱动装置；5-Y轴；510-Y轴轨道；520-Y轴滑块；530-Y轴驱动装置；6-Z轴；610-Z轴轨道；620-Z轴驱动装置；630-Z轴滑块；7-安装架；8-砝码组件安装板；9-微调装置；10-微调轨道。
 本发明的最佳实施方式
在此处键入本发明的最佳实施方式描述段落。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明。
本发明为了解决现有技术中芯片保压时压力不均的问题，提供了一种用于芯片镀膜工艺的砝码模组，实现了保压压力均匀，同时解决单个砝码无法满足芯片在治具上的紧密排列的问题。
如图1-图3和图6-图7所示，一种用于芯片镀膜工艺的砝码模组，包括底座1，底座1上设置有XYZ三轴运动平台，XYZ三轴运动平台上设置有砝码组件3，砝码组件3包括若干根长条状砝码、下固定架301以及上固定架306；砝码穿透下固定架301和上固定架306；砝码竖直设置，且砝码在下固定架301和上固定架306之间能够上下运动；砝码在下固定架301和上固定架306上的位置对应治具2上安装芯片的位置；砝码包括设置在其顶部的延长杆304，延长杆304上能够放置或移除浮动砝码305。
在本实施例中，砝码在上固定架306和下固定架301中能够上下活动，下固定架301对砝码起到承托作用，当需要进行保压的时候，经过XYZ三轴运动平台，砝码移动到芯片的正上方后，砝码组件3整体下落，单个砝码则落到每一个芯片上，由于砝码能够在上下固定架之间活动，因此可以理解为此时砝码利用自身的重量对芯片进行保压，使芯片与治具上的胶粘贴牢固，防止芯片在镀膜过程中出现不良品。
由于芯片在治具上横纵排列十分密集，砝码的体积限制其不能够一个砝码对应一个芯片的时候，能够通过XYZ三轴运动平台来实现芯片的错位保压，比如，受砝码的体积影响，相邻的两根砝码之间多分布了一块芯片，即2×2矩阵的砝码对应着4×4矩阵的芯片，则通过XYZ三轴运动平台的驱动，能够使单个砝码错位保压2×2矩阵内的芯片，同理，根据砝码体积不同，还可以改为3×3矩阵或者更大尺寸的矩阵。
本发明由于采用了单个砝码取代平板保压的方式，能够保证每一个芯片收到的力的大小都是相同的，可调节的浮动砝码让本砝码模组能够适应各种型号芯片的保压工作，由于本砝码模组具备XYZ三轴运动平台，使得砝码矩阵能够进行水平和竖直方向的移动，实现一个砝码对多个芯片依次进行保压，满足治具上芯片的紧密排列的需求。
在本发明中，XYZ三轴运动平台具有两种结构：
实施例一：如图7-图8所示，XYZ三轴运动平台包括X轴4、Y轴5和Z轴6，Z轴6设置在底座1上，X轴4设置在Z轴6上，Y轴5在X轴4上。
Z轴6包括设置在底座1上的Z轴轨道610，Z轴驱动装置620设置在Z轴轨道的顶部驱动Z轴滑块630上下运动，Z轴滑块630上设置有X轴轨道410和X轴驱动装置430，与X轴轨道410配合的X轴滑块420设置在安装架7上，安装架7上还设置有Y轴轨道510和Y轴驱动装置530，与Y轴轨道510对应的Y轴滑块520设置在砝码组件安装板8上，砝码组件3设置在砝码组件安装板8上。
其中，Z轴驱动装置620为电机，采用丝杆进行传动，X轴驱动装置430和Y轴驱动装置530均为气缸。
Z轴滑块630呈“口”形，Z轴轨道610位于Z轴滑块630的“口”形结构中间。
安装架7呈“匚”形，且“匚”形的缺口方向朝向Z轴6，Y轴轨道510设置在安装架7的两端位置,Y轴驱动装置530设置在安装架7的中间位置，且Y轴驱动装置530输出轴朝向砝码组件安装板8上。
在本方案中，呈“匚”形的安装架7包括中间部和两端的弯折部，在弯折部的顶部和底部位置，设置了Y轴轨道，共计四个，对应的，砝码组件安装板8上有四个Y轴滑块520，Y轴滑块520设置在砝码组件安装板8上的四个角位置且垂直于砝码组件安装板8，使得砝码组件安装板8形成类似于桌子形状的结构。
实施例二：如图9-图10所示，XYZ三轴运动平台包括X轴4、Y轴5和Z轴6，Y轴5设置在底座1上，Z轴6设置在Y轴5上，X轴4设置在Z轴6上。
由于将Y轴5的安装位置改变到底座1上，在本实施中，无安装架7，且砝码组件安装板8直接设置在X轴4上。
Z轴6与Y轴5之间还设置有微调装置9，用于砝码模组在X轴方向上的微调。
如图9-图10所示，具体的，微调装置9采用丝杆配合螺母副的方式进行微调，可以知道的是微调装置9还包括设置在Z轴6和Y轴5之间的微调轨道10。
在本实施例中，与实施例一不同的是，Y轴5采用了丝杆电机结构，相对于实施例一中的气缸驱动，平稳性以及精准度都有所提升，有效减小了误差。
砝码组件安装板8用于安装砝码组件3，其中下固定架301和上固定架306均水平固定在砝码组件安装板8上，且在下固定架301和上固定架306的两侧还设置有挡板。
如图1及图4-图5所示，砝码还包括砝码压头302、固定砝码303以及压头胶套307，砝码压头302固定在固定砝码303朝向治具2的一端，压头胶套307设置在砝码压头302远离固定砝码303的一端。在本实施例中，将砝码设计成多段结构能够在面对不同型号的芯片时可以便于更换不同形状的砝码压头303或者不同重量的固定砝码303。
如图4所示，压头胶套307上接触芯片的位置设置有一凹孔308，使得压头胶套307只会接触芯片顶部四周的位置。在本实施例中，以方形芯片进行举例说明，由于芯片粘贴在治具上的时候，只有其底部四周会与胶粘贴，因此利用压头胶套307的凹孔设计使得砝码只对芯片的四周施加压力，而不对芯片的中间位置产生压力，进一步保证脆弱的芯片不受到任何损伤。
如图5所示，砝码压头302安装压头胶套307的位置处设置有菌伞状卡头，按头胶套307与安装在卡头上。由于压头胶套307属于橡胶制品，使用寿命有限，因此有必要设计成可替换的结构，在压头胶套307出现损伤时便于更换。
如图4所示，延长杆304的一端设置有外螺纹，对应的砝码上的安装处设置有螺纹孔，延长杆304与砝码可拆卸连接。在本实施例中，可拆卸的延长杆304意味着可以更换成不长度的，理论上可以无限制添加浮动砝码以增加砝码整体的重量。
如图4所示，砝码与上固定架306之间采用间隙配合，可以理解的是，砝码与上固定架306之间的缝隙越小越好，即砝码垂直程度越高越好，使之能够在上固定架306内能够上下活动，砝码底部设置有台阶，使得砝码能够被下固定架301托起。当砝码与上固定架306之间的缝隙足够小时，砝码落在芯片上后能完全垂直于芯片，则芯片收到的压力为砝码的重量相等。在进行保压的时候，当砝码底部的压头胶套307已经接触芯片之后，此时砝码组件3继续向下移动，此时砝码逐渐脱离下固定架301，即下固定架301不再起到承托作用，此时砝码的重量全部压于芯片之上。
 工业实用性
综上，本发明提供的一种用于芯片镀膜工艺的砝码模组由于采用了XYZ三轴移动平台以及砝码组件的设计，使得本砝码模组能够适应不同型号的芯片保压工作，且本发明对每一块芯片的压力都是恒定且稳定的，保压效果好，有效提升溅镀工艺中的良品率，保障企业的经济效益。
 序列表自由内容
以上所述，仅是本发明的较佳实施例而已，并非对本发明作任何形式上的限制，虽然本发明已以较佳实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容做出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (10)

  1. 一种用于芯片镀膜工艺的砝码模组，包括底座（1），其特征在于：
    所述底座（1）上设置有XYZ三轴运动平台，所述XYZ三轴运动平台上设置有砝码组件（3），所述砝码组件（3）包括若干根长条状砝码、下固定架（301）以及上固定架（306）；
    所述砝码竖直设置，且穿透所述下固定架（301）和所述上固定架（306），所述砝码在所述下固定架（301）和所述上固定架（306）之间能够上下运动；所述砝码在所述下固定架（301）和所述上固定架（306）上的位置对应治具（2）上安装芯片的位置；
    所述砝码包括设置在其顶部的延长杆（304），所述延长杆（304）上放置或移除浮动砝码（305）。
  2. 如权利要求1所述的砝码模组，其特征在于：所述XYZ三轴运动平台包括X轴（4）、Y轴（5）和Z轴（6），所述Z轴（6）设置在所述底座（1）上，所述X轴（4）设置在所述Z轴（6）上，所述Y轴（5）设置在所述X轴（4）上。
  3. 如权利要求2所述的砝码模组，其特征在于：所述Z轴（6）包括设置在所述底座（1）上的Z轴轨道（610），Z轴驱动装置（620）设置在所述Z轴轨道的顶部驱动Z轴滑块（630）上下运动，所述Z轴滑块（630）上设置有X轴轨道（410）和X轴驱动装置（430），与所述X轴轨道（410）配合的X轴滑块（420）设置在安装架（7）上，所述安装架（7）上还设置有Y轴轨道（510）和Y轴驱动装置（530），与所述Y轴轨道（510）对应的Y轴滑块（520）设置在砝码组件安装板（8）上，所述砝码组件（3）设置在所述砝码组件安装板（8）上。
  4. 如权利要求2所述的砝码模组，其特征在于，所述Z轴滑块（630）呈“口”形，所述Z轴轨道（610）位于所述Z轴滑块（630）的“口”形结构的中间；所述安装架（7）呈“匚”形，且“匚”形的缺口方向朝向所述Z轴（6），所述Y轴轨道（510）设置在所述安装架（7）的两端位置,所述Y轴驱动装置（530）设置在所述安装架（7）的中间位置，且所述Y轴驱动装置（530）输出轴朝向所述砝码组件安装板（8）上。
  5. 如权利要求1所述的砝码模组，其特征在于：所述XYZ三轴运动平台包括X轴（4）、Y轴（5）和Z轴（6），所述Y轴（5）设置在所述底座（1）上，所述Z轴（6）设置在所述Y轴（5）上，所述X轴（4）设置在所述Z轴（6）上。
  6. 如权利要求5所述的砝码模组，其特征在于：所述Z轴（6）与所述Y轴（5）之间还设置有微调装置（9），用于砝码模组在X轴方向上的微调。
  7. 如权利要求1所述的砝码模组，其特征在于，所述砝码与所述上固定架（306）之间采用间隙配合，使之能够在所述上固定架（306）内能够上下活动，所述砝码底部设置有台阶，使得所述砝码能够被所述下固定架（301）托起。
  8. 如权利要求1所述的砝码模组，其特征在于：所述砝码还包括砝码压头（302）、固定砝码（303）以及压头胶套（307），所述砝码压头（302）固定在所述固定砝码（303）朝向所述治具（2）的一端，所述压头胶套（307）设置在所述砝码压头（302）远离所述固定砝码（303）的一端。
  9. 如权利要求8所述的砝码模组，其特征在于：所述压头胶套（307）上接触芯片的位置设置有一凹孔（308），使得所述压头胶套（307）只会接触芯片顶部四周的位置，所述砝码压头（302）安装所述压头胶套（307）的位置处设置有菌伞状卡头，所述按头胶套（307）与安装在所述卡头上。
  10. 如权利要求1所述的砝码模组，其特征在于：所述延长杆（304）的一端设置有外螺纹，对应的所述砝码上的安装处设置有螺纹孔，所述延长杆（304）与所述砝码可拆卸连接。
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