WO2021158088A1 - Dispositif électronique comprenant une structure de dissipation de chaleur - Google Patents

Dispositif électronique comprenant une structure de dissipation de chaleur Download PDF

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Publication number
WO2021158088A1
WO2021158088A1 PCT/KR2021/001628 KR2021001628W WO2021158088A1 WO 2021158088 A1 WO2021158088 A1 WO 2021158088A1 KR 2021001628 W KR2021001628 W KR 2021001628W WO 2021158088 A1 WO2021158088 A1 WO 2021158088A1
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WIPO (PCT)
Prior art keywords
heat dissipation
electronic device
dissipation member
housing
disposed
Prior art date
Application number
PCT/KR2021/001628
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English (en)
Korean (ko)
Inventor
권오혁
강대석
김범주
김보람
김윤주
허재영
Original Assignee
삼성전자 주식회사
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Publication of WO2021158088A1 publication Critical patent/WO2021158088A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1688—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including a heat dissipation structure for dissipating heat from an electric element in consideration of the effect of antenna radiation of the electronic device.
  • An electronic device is a device that performs a specific function according to a loaded program, such as an electronic notebook, a portable multimedia player, a mobile communication terminal, a tablet PC, an image/audio device, a desktop/laptop computer, or a vehicle navigation device from a home appliance. It can mean a device. For example, these electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and high-speed and large-capacity wireless communication becomes common, various functions may be mounted in one electronic device, such as a mobile communication terminal, in recent years. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, and functions such as schedule management or electronic wallets are being integrated into one electronic device. will be. Such electronic devices are becoming smaller and thinner so that users can conveniently carry them.
  • a printed circuit board (PCB) and various electrical devices (or electronic components) are disposed inside a bracket on which the components are mounted.
  • Some electrical elements mounted on the printed circuit board (PCB) generate electromagnetic waves and/or heat, and the generated electromagnetic waves and/or heat may cause malfunctions and performance degradation of the electronic device.
  • a heat dissipating member, a heat dissipating member, a cooling member, or a shielding member disposed adjacent to an electrical element that is a heat source to spread heat inside the electronic device in order to prevent malfunction and performance degradation of the electronic device due to electromagnetic waves and/or heat can be used.
  • An electronic device including an electric element may generate vibration due to friction between the electric element and the inside of a bracket or a housing in the electronic apparatus.
  • an elastic member disposed adjacent to an electric element that is a vibration source to reduce vibration may be used inside the electronic device.
  • a speaker module structure in which electrical elements and a sound path in the speaker module are encapsulated may be mounted in an electronic device.
  • it is necessary to reduce the thickness of the encapsulated speaker module structure in order to miniaturize and thin the electronic device, whereby at least a portion of the metal portion of the speaker module is encapsulated in the speaker module structure. may be exposed to the outside of
  • the housing eg, back glass or back plate
  • the housing Vibration may occur on the back glass (eg back glass or back plate).
  • heat generated from the speaker module can be easily transferred to the housing surface of the electronic device. .
  • an electronic device for effectively alleviating vibration generated in an electrical element may be provided in a trend in which electronic devices are becoming smaller and thinner.
  • an electronic device including a heat dissipation structure for efficiently dissipating heat generated from an electric device.
  • an electronic device includes: a housing; at least one electrical element disposed adjacent to one surface of the housing; a metal part included in the electric element; an antenna radiator disposed adjacent to the metal part; an elastic member for protecting the electric element; and a first heat dissipation member provided to dissipate heat of the electric element, wherein the first heat dissipation member includes a 1-1 heat dissipation member and a 1-2 heat dissipation member spaced apart from each other by a segmented part device can be provided.
  • an electronic device includes: a housing; at least one electrical element disposed adjacent to one surface of the housing; a metal part included in the electric element; an antenna radiator disposed adjacent to the metal part; an elastic member having at least a portion disposed between the housing and the electrical element; and a first heat dissipation member having at least a portion disposed between the housing and the elastic member.
  • the first heat dissipation member includes a portion facing the electric element and a portion not facing the electric element divided through the segmented portion.
  • the electronic device including the heat dissipation structure of the present disclosure has a shape in which the electrical element is exposed on the space inside the electronic device surrounded by the housing, so that the electronic device becomes thinner and smaller in size. can do.
  • an electronic device including a heat dissipation structure suppresses vibration transmitted to a surface of an electronic device as an electrical element is disposed adjacent to a housing in the trend of thinner and smaller electronic devices, and It is possible to efficiently dissipate the heat generated by the electric device.
  • vibration is suppressed, and by forming a recess in the elastic member to provide an air gap between the electrical device and the housing, heat generated from the electrical device can be easily transferred to the housing surface. transmission can be inhibited.
  • the recess may be formed in a portion corresponding to the heat generating center of the electric element to suppress easy transfer of heat generated from the electric element to the surface of the housing.
  • An electronic device including a heat dissipation structure may efficiently dissipate heat generated from an electrical element in consideration of a radiation effect on an antenna included in the electronic device.
  • a material having high thermal conductivity is used as the first heat dissipating member, but by providing a segmented portion in the first heat dissipating member, coupling between the first heat dissipating member and the electric element is prevented, so that radiation performance to the antenna is deteriorated. it can be prevented
  • the heat dissipation performance that may be deteriorated as the segment is formed in the first heat dissipation member may be supplemented.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • FIG. 2A is a front perspective view of an electronic device, according to various embodiments of the present disclosure.
  • 2B is a rear perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 3 is a cross-sectional view of an electronic device, in accordance with some embodiments.
  • FIG. 4A is a cross-sectional view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 4B is a cross-sectional view of the electronic device as viewed from a different direction from that of FIG. 4A .
  • FIG. 5 is a cross-sectional view illustrating a speaker module, a first heat dissipation member, an elastic member, and a second heat dissipation member inside an electronic device, according to various embodiments of the present disclosure
  • FIG. 6 is an exploded perspective view illustrating a heat dissipation structure of an electronic device in consideration of radiation effects, according to various embodiments of the present disclosure
  • FIG. 7 is a front view illustrating an arrangement relationship between a speaker module and an antenna module disposed inside an electronic device, according to various embodiments of the present disclosure
  • FIG. 8 is a front view illustrating a state in which a first heat dissipation member is disposed on a speaker module according to various embodiments of the present disclosure
  • FIG. 9A is a front view illustrating a state in which an elastic member is disposed on a speaker module according to various embodiments of the present disclosure
  • 9B is a cross-sectional view illustrating an elastic member according to an embodiment of the present disclosure.
  • FIG. 9C is a cross-sectional view illustrating an elastic member according to an embodiment different from that of FIG. 9B.
  • FIGS. 9B and 9C are cross-sectional views illustrating an elastic member according to an embodiment different from FIGS. 9B and 9C.
  • FIG. 10 is a front view illustrating a state in which a second heat dissipation member is disposed on a speaker module according to various embodiments of the present disclosure
  • FIG. 11 is a front view illustrating an electronic device including an FPCB antenna module, according to an embodiment.
  • FIG. 12 is an exploded view illustrating layers constituting the antenna module of FIG. 11 according to an embodiment.
  • FIG. 13A is a diagram illustrating a surface temperature of an electronic device adjacent to a speaker module, according to an exemplary embodiment.
  • 13B is a diagram illustrating a surface temperature of an electronic device adjacent to a speaker module according to an embodiment of the present disclosure.
  • 13C is a diagram illustrating a surface temperature of an electronic device adjacent to a speaker module according to another embodiment of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the processor 120 executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or in conjunction with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphics processing unit, an image signal processor
  • the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).
  • the sound output device 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. there is.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the electronic device 102 may output a sound.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a computer network eg, a telecommunication network such as a LAN or WAN.
  • These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other.
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified and authenticated.
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as a part of the antenna module 197 .
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 and 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • the one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • FIG. 2A is a front perspective view of an electronic device 200 (eg, the electronic device 101 of FIG. 1 ) according to various embodiments of the present disclosure.
  • FIG. 2B is a rear perspective view of the electronic device 200 (eg, the electronic device 101 of FIG. 1 ), according to various embodiments of the present disclosure.
  • the electronic device 200 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment has a first surface (or front surface) 210A, a second surface (or rear surface). ) 210B, and a housing 210 including a side surface 210C surrounding a space between the first surface 210A and the second surface 210B.
  • the housing may refer to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 2A .
  • the first surface 210A may be formed by a front plate 202 (eg, a glass plate or a polymer plate) that is at least partially transparent.
  • the second surface 210B may be formed by a substantially opaque back plate 211 .
  • the back plate 211 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure (or “side member”) 218 including a metal and/or a polymer.
  • the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 202 includes two first regions 210D that extend seamlessly from the first surface 210A toward the rear plate 211 by bending the front plate. It can include both ends of the long edge (long edge) of (202).
  • the rear plate 211 has two second regions 210E that extend seamlessly by bending from the second surface 210B toward the front plate 202 with long edges. It can be included at both ends.
  • the front plate 202 (or the back plate 211 ) may include only one of the first regions 210D (or the second regions 210E). In another embodiment, some of the first regions 210D or the second regions 210E may not be included.
  • the side bezel structure 218 when viewed from the side of the electronic device 200 , has a side surface that does not include the first regions 210D or the second regions 210E as described above. It may have a first thickness (or width), and may have a second thickness thinner than the first thickness at a side surface including the first regions 210D or the second regions 210E.
  • the electronic device 200 includes a display 201 , audio modules 203 , 207 , 214 , sensor modules 204 , 216 , 219 , camera modules 205 , 212 , 213 , and key input. at least one of a device 217 , a light emitting element 206 , and connector holes 208 , 209 . In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or the light emitting device 206 ) or additionally include other components.
  • the display 201 may be visually exposed, for example, through a substantial portion of the front plate 202 .
  • at least a portion of the display 201 may be exposed through the front plate 202 forming the first areas 210D of the first surface 210A and the side surface 210C.
  • the edge of the display 201 may be formed to be substantially the same as an adjacent outer shape of the front plate 202 .
  • the distance between the outer periphery of the display 201 and the outer periphery of the front plate 202 may be substantially the same.
  • a recess or opening is formed in a part of the screen display area of the display 201, and the audio module 203, 207 is aligned with the recess or the opening. 214 ), sensor modules 204 , 216 , and 219 , camera modules 205 , 212 , 213 , and at least one of a light emitting device 206 .
  • audio modules 203 , 207 , 214 , sensor modules 204 , 216 , 219 , and camera modules 205 , 212 , 213 are located on the rear surface of the screen display area of the display 201 . , and may include at least one of the light emitting device 206 .
  • the display 201 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • a touch sensing circuit capable of measuring the intensity (pressure) of a touch
  • a digitizer capable of measuring the intensity (pressure) of a touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor module 204, and/or at least a portion of a key input device 217 is located in the first areas 210D, and/or the second areas 210E. can be placed.
  • the audio modules 203 , 207 , and 214 may include, for example, a microphone hole 203 and speaker holes 207 and 214 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for a call.
  • the speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or a speaker may be included without the speaker holes 207 and 214 (eg, a piezo speaker).
  • the audio modules 203 , 207 , and 214 are not limited to the above structure, and various design changes may be made depending on the structure of the electronic device 200 , such as mounting only some audio modules or adding a new audio module.
  • the sensor modules 204 , 216 , and 219 may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state.
  • the sensor modules 204 , 216 , 219 include, for example, a first sensor module 204 (eg, a proximity sensor) and/or a second sensor module ( (not shown) (eg, a fingerprint sensor), and/or a third sensor module 219 (eg, HRM sensor) and/or a fourth sensor module 216 disposed on the second side 210B of the housing 210 . ) (eg fingerprint sensor).
  • the fingerprint sensor may be disposed on the first surface 210A (eg, the display 201) as well as the second surface 210B of the housing 210.
  • the electronic device 200 includes a sensor module (not shown), such as For example, it may further include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the sensor modules 204 , 216 , and 219 are not limited to the above-described structure, and design changes may be made in various ways, such as mounting only some sensor modules or adding a new sensor module, depending on the structure of the electronic device 200 .
  • the camera modules 205 , 212 , and 213 are, for example, a first camera device 205 disposed on a first side 210A of the electronic device 200 , and a second side 210B. ) disposed in the second camera device 212 , and/or a flash 213 .
  • the camera module 205, 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .
  • the camera modules 205 , 212 , and 213 are not limited to the above structure, and various design changes may be made, such as mounting only some camera modules or adding a new camera module, depending on the structure of the electronic device 200 .
  • the key input device 217 may be disposed, for example, on the side surface 210C of the housing 210 .
  • the electronic device 200 may not include some or all of the above-mentioned key input devices 217 and the not included key input devices 217 may be displayed on the display 201 as soft keys, etc. It can be implemented in the form
  • the key input device may include a sensor module 216 disposed on the second side 210B of the housing 210 .
  • the light emitting device 206 may be disposed on the first surface 210A of the housing 210 , for example.
  • the light emitting device 206 may provide, for example, state information of the electronic device 200 in the form of light.
  • the light emitting device 206 may provide, for example, a light source that is interlocked with the operation of the camera module 205 .
  • Light emitting element 206 may include, for example, LEDs, IR LEDs, and xenon lamps.
  • the connector holes 208 and 209 are, for example, a first connector hole capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device.
  • a connector eg, a USB connector
  • a second connector hole eg, earphone jack
  • the connector holes 208 and 209 are not limited to the above structures, and may be designed in various ways, such as mounting only some connector holes or adding new connector holes, depending on the structure of the electronic device 200 .
  • the electronic device 200 may include a speaker module 220 therein.
  • the speaker module 220 may generate an acoustic signal by an electrical signal.
  • the audio modules 203 , 207 , and 214 may be integrated with the speaker module 220 or may be connected to each other.
  • the speaker module 220 may be connected to the speaker hole 207 , and a sound path (not shown) may be formed between the speaker module 220 and the speaker hole 207 .
  • the speaker module 220 , the speaker hole 207 , and the acoustic path may be encapsulated and disposed on one side of the electronic device (eg, the lower right side with respect to the front plate of FIG. 2 ).
  • the speaker module 220 may be disposed to overlap the display 201 at least in part. For example, when the electronic device 200 is viewed from the front plate, the speaker module 220 may be disposed to partially overlap the active area of the display 201 .
  • 'X' in the three-axis coordinate system may indicate a horizontal direction of the electronic device
  • 'Y' may indicate a direction perpendicular to 'X'
  • 'Z' may indicate a direction perpendicular to 'X' and 'Z' and may indicate a thickness (or height) direction of the electronic device.
  • FIG. 3 is a cross-sectional view of an electronic device 300 , in accordance with some embodiments.
  • the embodiment illustrated in FIG. 3A may represent a cross-section of the electronic device of FIGS. 2A and 2B taken in the A-A' direction.
  • the electronic device 300 may include an electrical element therein.
  • a support structure eg, support members 360 and 370 ) for supporting the electric element may be provided on one side of the electric element shown in FIG. 3 , and a cover 380 for protecting one side may be provided.
  • an electrical element for enjoying the effects according to various embodiments of the present disclosure may be a speaker module 320 .
  • One side of the speaker module 320 is surrounded by the cover 380 , and is encapsulated together with a sound path SP, at least one support member 360 , 370 , and a mesh 361 , so that the electronic device 300 is ) may be disposed inside the housing 310 .
  • the sound generated by the encapsulated speaker module 320 may pass through the sound path SP and be output to the outside of the electronic device 300 through the speaker hole 307 (eg, the speaker hole 207 of FIG. 2A ). there is.
  • an elastic member 340 is added to the electronic device 300 to reduce vibrations generated in the speaker module 320 or to protect the speaker module 320 from external vibrations or shocks.
  • the elastic member 340 may be disposed between, for example, the metal part 321 and the cover 380 included in the electrical device.
  • Heat may be generated in the speaker module 320 .
  • heat generated from the speaker module 320 or the metal part 321 may pass through the elastic member 340 and may pass through the cover 380 to be radiated.
  • the heat transferred through the cover 380 may move toward the support member 370 or may be radiated onto the space S within the electronic device.
  • one surface of the housing 310 on which the speaker module 320 is adjacently disposed may be a rear plate 311 .
  • the electronic device 300 according to the embodiment shown in FIG. 3 is an electronic device 400 similar to the embodiment shown in FIGS. 4A and 4B, which will be described later.
  • Design changes may be made.
  • 4A is a cross-sectional view of an electronic device 400 , according to various embodiments of the present disclosure.
  • FIG. 4B is a cross-sectional view of the electronic device 400 as viewed from a direction different from that of FIG. 4A .
  • the embodiment illustrated in FIG. 4A may represent a cross-section of the electronic device of FIGS. 2A and 2B taken in the A-A' direction.
  • the embodiment illustrated in FIG. 4B may represent a cross-section of the electronic device of FIGS. 2A and 2B taken in the B-B' direction.
  • the electronic device 400 (eg, the electronic device 101 of FIG. 1 ) according to the embodiment illustrated in FIGS. 4A and 4B may also include an electric element therein.
  • the electronic device 400 (eg, the electronic device 101 of FIG. 1 ) may include an internal support structure (eg, the support members 460 and 470 ) for mounting the electric device.
  • An electric device for enjoying the effects according to various embodiments of the present disclosure in the electronic device 400 may be, for example, a speaker module 420 .
  • the speaker module 420 as an electrical element will be described as an example.
  • the electronic device 400 (eg, the electronic device 101 of FIG. 1 ) includes a front plate 402 and a rear plate 411 . and a speaker module 420 structure in which the metal part 421 is exposed in a space surrounded by the side member 418 .
  • the encapsulated speaker module structure may include a speaker module 420 and a sound path (S.P.).
  • the speaker module 420 is encapsulated together with the sound path SP, at least one support member 460 , 470 , and a mesh 461 to the housing 410 of the electronic device 400 . It may be disposed inside.
  • the sound generated by the encapsulated speaker module 420 may pass through the sound path SP and be output to the outside of the electronic device 400 through the speaker hole 407 (eg, the speaker hole 207 of FIG. 2A ). there is.
  • the speaker module 420 may include at least one metal part 421 exposed in a space inside the electronic device (eg, the space S of FIG. 3 ) surrounded by the housing 410 .
  • the speaker module 420 may be supported by the support member 460 and/or the support member 470 so that at least a portion (eg, the metal part 421 ) faces the rear plate 411 .
  • the portion facing the rear plate 411 is a metal portion 421, for example, a yoke may be included.
  • the heat generated during operation of the speaker module 420 is radiated to the outside of the speaker module 420 through a heat generating part (eg, the metal part 421).
  • a heat generating part eg, the metal part 421.
  • FIGS. 4A and 4B As illustrated in FIG. 1 , the heating part (eg, the metal part 421 ) of the speaker module 420 may face the rear plate 411 .
  • a display is provided on the front plate 402 opposite to the rear plate 411, and in order to prevent the heat generated by the speaker module 420 from deteriorating the display, the rear plate 411 located in the opposite direction to the display ) to radiate heat to the side.
  • the electronic device 400 further includes an elastic member 440 for reducing vibration generated in the speaker module 420 or protecting the speaker module 420 from external vibration or shock.
  • an elastic member 440 for reducing vibration generated in the speaker module 420 or protecting the speaker module 420 from external vibration or shock.
  • the elastic member 440 may be disposed between, for example, the metal part 321 included in the electric element and the housing 410 (eg, the rear plate 411 ).
  • the cover 380 shown in FIG. 3 may not be provided on one side of the speaker module 420 according to the embodiment shown in FIGS. 4A and 4B . Accordingly, in the case of the electronic device 400 , since some components including the cover 380 are removed, it is possible to provide a smaller and thinner electronic device compared to the electronic device 300 according to the embodiment shown in FIG. 3 .
  • a movement path (arrow) of a column in the electronic device including the speaker module 420 (eg, the electronic device 101 of FIG. 1 ) is shown.
  • the heat generated by the speaker module 420 or the metal part 421 passes the elastic member 440 to relieve the speaker module 420 from impact or suppress vibration transmitted to the housing, It may be transferred to the housing 410 (eg, the rear plate 411).
  • the housing 410 eg, the rear plate 411
  • heat is transferred to the housing 410 (eg, the rear plate 411 ) to increase the surface temperature of the housing 410 (eg, the rear plate 411 ) to increase the surface temperature of the housing 410 (eg, the rear plate 411 )
  • the embodiment illustrated in FIGS. 4A and 4B is compared to the electronic device 300 according to the embodiment illustrated in FIG. 3 .
  • the cover 380 is omitted in the electronic device 400 according to the present invention, the thickness may be thinner, which may be suitable for miniaturization of the electronic device.
  • heat generated from the speaker module 320 or the metal part 321 passes through the elastic member 340 and the cover 380 and radiates heat into the space (or air gap) S.
  • heat generated from the speaker module 420 or the metal part 421 passes through the elastic member 440 to the housing 410 (eg, the rear plate 411). ) can be transferred directly to the Accordingly, in the electronic device 400 according to the embodiment shown in FIGS. 4A and 4B , the surface temperature of the housing 410 (eg, the rear plate 411 ) is lower than that of the electronic device according to the embodiment shown in FIG. 3 . can be relatively higher.
  • FIG. 5 is a cross-sectional view illustrating a speaker module 520 , a first heat dissipation member 530 , an elastic member 540 , and a second heat dissipation member 550 included in an electronic device, according to various embodiments of the present disclosure.
  • 6 is an exploded perspective view schematically illustrating a heat dissipation structure of an electronic device in consideration of radiation effects, according to various embodiments of the present disclosure;
  • a heat dissipation structure may be formed using the first heat dissipation member 530 .
  • the first heat dissipation member 530 may further include an elastic member 540 to form a heat dissipation structure.
  • the heat dissipation structure may be formed by further including the second heat dissipation member 550 in the heat dissipation structure of the first heat dissipation member 530 and the elastic member 540 .
  • the heat dissipation structure may be a configuration for dissipating heat generated in an electric element (eg, the speaker module 520 ) included in the electronic device.
  • the electronic device 500 (eg, the electronic device 101 of FIG. 1 ) has a first heat dissipation member 530 compared to the electronic device 400 shown in FIGS. 4A and 4B . and a second heat dissipation member 550 may be further included.
  • the present invention is not necessarily limited thereto, and other various embodiments may be applied, for example, as the second heat dissipation member 550 may be omitted.
  • the electronic device 500 may further include at least one cover member 530a or an adhesive member 530b.
  • the first heat dissipation member 530 may be configured to diffuse heat of the speaker module 520 to realize heat dissipation.
  • the first heat dissipation member 530 may be attached to the metal part 521 of the speaker module 520 , according to an embodiment. By using the first heat dissipation member 530 attached to the metal part 521 , heat generated from the speaker module 520 may move to a relatively low temperature portion of the electronic device.
  • the first heat dissipation member 530 may be formed in a sheet shape.
  • a graphite sheet may correspond to the first heat dissipation member 530 .
  • the first heat dissipation member 530 is coupled with the metal portion 521 (eg, yoke) of the speaker module 520 . can be ringed. Accordingly, radiation performance of the antenna disposed in the electronic device may be deteriorated.
  • a segment dividing the first heat dissipation member 530 into a portion facing the electric element (eg, the speaker module 520) and a portion not facing the electric element can provide
  • the first heat dissipation member 530 may be divided into a 1-1 heat dissipation member 531 and a 1-2 heat dissipation member 532 through the segment 533 .
  • the first heat dissipation member 530 is provided to implement heat dissipation performance, while the 1-1 th heat dissipation member 531 and the 1-2 th heat dissipation member 532 are directly disconnected through the segmented portion to cut the first heat dissipation member ( 530 and the speaker module 520 may not affect the antenna radiator.
  • the first heat dissipating member 530 that does not affect the radiator will be described in detail later in the embodiments shown in FIGS. 7, 8, 11 and 12 .
  • the elastic member 540 may be provided to protect an electric element (eg, the speaker module 520 ) disposed inside the electronic device 540 .
  • the elastic member 540 mitigates vibration, for example, when vibration generated in the speaker module 520 is transmitted to the housing 510 or external vibration transmitted to the housing 510 is transmitted to the speaker module 520 .
  • the elastic member 540 may include, for example, various materials such as sponges and poron.
  • the elastic member 540 may also serve to protect the metal part 521 exposed on the internal space S of the electronic device, and may serve as a buffer between the housing 510 and the speaker module 520 . there is.
  • a recess may be formed in at least a portion of the elastic member 540 .
  • the recess may be formed in a portion corresponding to the heating center of the electric element.
  • the second heat dissipation member 550 may be additionally provided with respect to the first heat dissipation member 530 , and the electronic device (eg, the electronic device 101 of FIG. 1 ) includes at least one second heat dissipation member 550 . may include.
  • the second heat dissipation member 550 may be a low dielectric heat dissipation sheet having good heat transfer characteristics.
  • the second heat dissipation member 550 may be provided in a configuration to compensate for a decrease in thermal conductivity by forming a segment in the first heat dissipation member 530 .
  • the second heat dissipation member 540 will be described later in more detail using the embodiment of FIG. 10 .
  • the segmented portion 533 may be filled with a low dielectric heat dissipation sheet.
  • the first heat dissipation member 530 may be provided in a configuration to compensate for a decrease in thermal conductivity by forming a segmented portion.
  • the first heat dissipation member 530 may be disposed between the housing 510 and the electrical element (eg, the speaker module 520).
  • the first heat dissipation member 530 may be disposed between the rear plate 511 and the metal part 521 .
  • a portion of the first heat dissipation member 530 eg, the 1-1 heat dissipation member 531
  • the extended portion eg, the first and second heat dissipation members 532
  • the extended portion may have a shape disposed on the upper surface (eg, the metal part 521 ) of the electric device.
  • one portion eg, the 1-2 heat dissipation member 532
  • another portion eg, the 1-1 heat dissipation member 532
  • 531 may have a shape extending from the outside of the speaker module 520 .
  • the 1-1 th heat dissipation member 531 may be formed so as not to overlap the metal part 521 of the speaker module 520 .
  • the electronic device 500 may further include at least one cover member 530a and/or at least one adhesive member 530b.
  • the electronic device 500 includes a cover member 530a attached to a lower portion of the first heat dissipation member 530 , and attaches an adhesive member 530b that is spaced apart from the first heat dissipation member 530 by a predetermined distance.
  • the cover member 530a may be made of a non-conductive material.
  • the first heat dissipation member 530 includes a conductive material (eg, when the first heat dissipation member 530 includes a graphite sheet), the first heat dissipation member 530a is formed.
  • the member 530 may serve to prevent direct contact with the metal part 521 .
  • the adhesive member 530b may be formed on substantially the same plane as the first heat dissipation member 530 , and the first heat dissipation member 530 is connected to the speaker module 520 of the electronic device 500 . It can serve to fix the adjacent position.
  • the adhesive member 530b may also serve to fix the elastic member 540 to a position adjacent to the speaker module 520 .
  • the cover member 530a may also be made of substantially the same material as the adhesive member 530b and may perform substantially the same role.
  • the cover member 530a may be formed of a non-conductive tape. Accordingly, the cover member 530a may also serve to substantially fix the first heat dissipation member 530 to a position adjacent to the speaker module 520 (eg, an upper surface of the speaker module 520 ).
  • the elastic member 540 may be disposed between the housing 510 and the first heat dissipation member 530 .
  • the elastic member 540 not only serves to buffer between the housing 510 and the speaker module 520, but also serves to buffer the housing 510 and other electrical elements or substrates, so as shown in FIG.
  • the speaker module 520 may further include an extended portion other than the corresponding portion.
  • the second heat dissipation member 550 may be disposed between the housing 510 and the elastic member 540 .
  • the second heat dissipation member 550 is in the form of a sheet having a relatively large area compared to other components, and when the second heat dissipation member 550 is viewed from above, at least a portion of the first heat dissipation member 530 and/or the elastic member 540 . and may be arranged to overlap.
  • a housing 510 (eg, a rear plate 511 ) may be disposed on the upper surface of the second heat dissipation member 550 .
  • the heat generated by the speaker module 520 is transferred to the low-temperature part of the electronic device by the first heat dissipation member 530 and the second heat dissipation sheet 550 in the process of being transferred to the surface of the housing 510 , and thus the housing 510 . It is possible to prevent heat from being concentrated on a specific part of the .
  • FIG. 7 is a front view illustrating a disposition relationship between the speaker module 520 and the antenna module 590 according to various embodiments of the present disclosure.
  • 8 is a front view illustrating a state in which the first heat dissipation member 530 is disposed on the speaker module 520 according to various embodiments of the present disclosure.
  • the electronic device may include various types of antenna modules therein.
  • the electronic device may include an antenna module 590 and/or an antenna radiator 590 ′ as shown in FIG. 7 .
  • 7 schematically shows some forms of the antenna module 590 and the antenna radiator 590'.
  • the antenna radiator 590 ′ may have a branched shape on the upper surface of the antenna module 590 as shown in FIG. 7 .
  • the shapes and positions of the antenna module 590 and the antenna radiator 590 ′ are not necessarily limited thereto and may be formed in various ways.
  • the antenna radiator 590 ′ may be provided in the form of a patch on the upper surface of the antenna module 590 .
  • the speaker module 520 may be disposed at a position very adjacent to the antenna module 590 and/or the antenna radiator 590 ′ included in the electronic device 500 .
  • the metal part 521 of the speaker module 520 may be disposed side by side toward the same direction on the same plane as the antenna radiator 590 ′.
  • the first heat dissipation member eg, the first heat dissipation member 530 of FIG.
  • the first A heat dissipation member (eg, the first heat dissipation member 530 of FIG. 5 ) may be coupled to the metal part 521 to affect the radiation performance of the adjacent antenna radiator 590 .
  • noise induced in the first heat dissipation member 530 may be transmitted to the antenna module 590 to affect radiation performance of the antenna module 590 .
  • the shape of the first heat dissipation member 530 is not limited to a specific embodiment. According to an embodiment, as shown in FIGS. 5 and 6 , two different rectangular flat plates constitute a 1-1 heat dissipation member 531 and a 1-2 heat dissipation member 532, respectively, and the segmented portion (533) can be distinguished. On the other hand, as shown in FIG.
  • a flat plate having a shape not specifically designated constitutes the 1-1 heat dissipation member 531 and the 1-2 heat dissipation member 532 , respectively, and is divided into the segmented portion 533 . It may be disposed adjacent to the speaker module 520 in a state where the Another shape of the first heat dissipation member 530 will be described later with reference to the embodiments shown in FIGS. 11 and 12 .
  • the first heat dissipation member 530 is coupled to the cover member 530a and disposed adjacent to the speaker module 520 in a state in which it is not in direct contact with the speaker module 520 using an adhesive member.
  • the first heat dissipation member 530 and the cover member 530a may be disposed to be partially spaced apart from the adhesive member 530b.
  • the cover member 530a and the adhesive member 530b may be connected to each other.
  • the cover member 530a and the adhesive member 530b may have substantially the same configuration.
  • the cover member 530a and the adhesive member 530b may be integrally connected.
  • the segmented portion 533 may be formed between a portion facing the electric element and a portion not facing the electric element.
  • the segmented portion 533 includes, for example, as shown in FIG. 8 , a portion at which the first heat dissipation member 530 faces the speaker module 520 (a portion where the first and second heat dissipation members 532 are located) and , the first heat dissipation member 530 may be formed between the speaker module 520 and a portion that does not face (a portion where the 1-1 heat dissipation member 531 is located).
  • the overall shape of the first heat dissipation member 530 is not limited to any specific embodiment. As shown in FIG. 8 , the speaker module 520 may have an extended form anywhere outside. According to various embodiments, the width of the segment 533 may be set to about 0.1 mm to 0.5 mm. When the first heat dissipating member 530 includes the segment 533 , a decrease in heat transfer performance may occur compared to a case in which the segment 533 is not provided. However, when the segmented portion 533 is formed to have a width of 0.1 mm to 0.5 mm, for example, the distance between the 1-1 heat dissipation member 531 and the 1-2 heat dissipation member 532 is 0.1 mm to 0.5 mm.
  • 9A is a front view illustrating a state in which an elastic member 540 is disposed on the speaker module 520 according to various embodiments of the present disclosure.
  • 9B is a cross-sectional view illustrating the elastic member 540 according to an embodiment of the present disclosure.
  • 9C is a cross-sectional view illustrating an elastic member 540 according to an embodiment different from that of FIG. 9B .
  • 9D is a cross-sectional view illustrating an elastic member 540 according to an embodiment different from FIGS. 9B and 9C .
  • 9B to 9D may represent cross-sections of the elastic member 540 shown in FIG. 9A cut in the C-C' direction.
  • the elastic member 540 may include a portion corresponding to the speaker module 520 and an additionally extended portion.
  • a portion corresponding to the speaker module 520 may be formed to have a size similar to the overall size of the speaker module 520 , and may have a shape overlapping most of the area of the speaker module.
  • the elastic member 540 in order to prevent heat generated in the speaker module 520 from being directly transferred to the housing surface due to the elastic member 540, the elastic member 540 is ) may be formed with a recess.
  • the shape of the recess may be various.
  • it may have a shape of a groove 540d forming a stepped surface from one surface of the elastic member 540 .
  • the elastic member 540 may have a groove forming a stepped surface from the upper surface of the elastic member 540 .
  • a groove forming a stepped surface from the lower surface of the elastic member 540 may be formed in the elastic member 540 .
  • a through hole 540h penetrating through one surface and the other surface of the elastic member 540 may be formed.
  • an air gap equal to the height of the recess is provided between the speaker module 520 and the housing 510 so that heat generated from the speaker module 520 is transferred to the housing 510 . You can avoid direct transmission.
  • FIG. 10 is a front view illustrating a state in which a second heat dissipation member 550 is disposed on a speaker module according to various embodiments of the present disclosure.
  • the second heat dissipation member 550 may be formed of a low dielectric heat dissipation sheet that does not affect antenna radiation performance.
  • the low dielectric heat dissipation sheet may be prepared by solidifying boron nitride (BN).
  • the second heat dissipation member 550 is not limited to a position adjacent to the speaker module 520 , and may have a relatively wider spread to other spaces inside the electronic device as compared to the first heat dissipation member 530 .
  • the second heat dissipation member 550 is formed to be wide unless it is limited by a part to be considered in the manufacturing process of the housing 510 (imprinting/transmitting/laser etching, etc.), so that the heat generated by the speaker module 520 is transferred to the low-temperature part of the electronic device. It may be provided so that it can be easily transmitted.
  • the second heat dissipation member 550 may be disposed at a position corresponding to the segmented portion of the first heat dissipation member 530 . Since the second heat dissipation member 550 is disposed at a position corresponding to the segmented portion of the first heat dissipation member 530 , a decrease in heat dissipation performance due to the segmentation of the first heat dissipation member 530 may be compensated.
  • FIG. 11 is a front view illustrating an electronic device including an antenna module, according to an embodiment.
  • 12 is an exploded view illustrating layers constituting the antenna module of FIG. 11 according to an embodiment.
  • an electronic device 500 including an antenna module 710 may be illustrated.
  • the first heat dissipation member 530 and the antenna module 590 according to the embodiment shown in FIGS. 5 and 7 and the heat dissipation member and the antenna module according to another embodiment may be disclosed.
  • the heat dissipation member 730 may additionally include or omit a portion that does not correspond to the first heat dissipation member 530 .
  • the antenna module 710 may include or omit the same portion as the antenna module 590 illustrated in FIG. 7 .
  • the antenna module 710 may be a flexible printed circuit board (FPCB) antenna module.
  • FPCB flexible printed circuit board
  • an electronic device 600 includes a housing 610 , an antenna module 710 , a shielding member 720 , and a heat dissipation member 730 (eg, FIG. 5 ).
  • 1 heat dissipation member 530), an adhesive member 740 (eg, the adhesive members 530a and 530b of FIG. 5), a printed circuit board 611, and at least one electrical device (eg, a speaker module 620)) may include.
  • the housing 610 may form an internal space of the electronic device 600 .
  • At least one electric device may be disposed in the inner space of the housing 610 .
  • the electrical device may be mounted on the printed circuit board 611 disposed on the distribution inside the housing 610, and heat may be generated according to the operation of the electrical device.
  • the electric device includes a processor (eg, the processor 120 of FIG. 1 ) mounted on the printed circuit board 611 , a memory (eg, the memory 130 of FIG. 1 ), and a display drive integrated circuit (DDI). , may include at least one of the speaker module 620 .
  • the electric element may be disposed to overlap the heat dissipation member 730 .
  • the electric element may be disposed to overlap the antenna module 710 .
  • the electric device may be attached to the heat dissipation member 730 or the antenna module 710 through the adhesive member 740 .
  • the printed circuit board 611 may extend from the first area 701 to the fifth area 705 along the edge of the housing 610 .
  • a plurality of electrical devices may be mounted on the printed circuit board 611 .
  • the electrical device on the printed circuit board 611 may be disposed on one surface of the heat dissipation member 730 and/or the antenna module 710 .
  • the electronic device 600 includes a first area 701 to which at least one electric element can be attached, a third area 703 to which an antenna pattern 711 is disposed, and a fifth area to which another electric element can be attached.
  • region 705 a second region 702 connecting the first region 701 and the third region 703 , and a fourth region 704 connecting the third region 703 and the fifth region 705 .
  • it may be attached to the printed circuit board 611 in the first area 701 of the antenna module 710 .
  • the antenna module 710 includes an antenna pattern 711, a base (not shown) on which the antenna pattern 711 is formed, a non-conductive layer 712 surrounding the base and the pattern formed on the base, and additional conductive properties.
  • a pattern 713 may be included.
  • the antenna pattern 711 may include a wireless charging pattern 711a, a short-range communication pattern 711b, and a magnetic secure transmission pattern 711c.
  • the wireless charging pattern 711a, the short-range communication pattern 711b, and the magnetic secure transmission pattern 711c may transmit and receive signals of different frequency bands, respectively.
  • an induced current may be generated by an external charging device and electromagnetic induction, and a battery (not shown) may be charged by the generated induced current.
  • the wireless charging pattern may be patterned with a conductive material on both sides of one base layer.
  • the wireless charging pattern 711a may be formed in the form of concentric circles, and the wireless charging pattern 711a may be electrically connected to a printed circuit board.
  • the short-range communication pattern 711b may be disposed along a periphery of the wireless charging pattern 711a.
  • the short-range communication pattern 711b may be patterned on both sides or one side based on the base layer.
  • the short-range communication pattern 711b may transmit/receive a signal to and from an external electronic device through electromagnetic induction.
  • the short-range communication pattern 711b may be electrically connected to a printed circuit board, and a signal transmitted to the short-distance communication pattern 711b may be processed through a processor.
  • the magnetic secure transmission pattern 711c may be disposed in an area adjacent to the wireless charging pattern 711a. According to an embodiment, the magnetic secure transmission pattern 711c may be formed to face one edge of the housing from the wireless charging pattern 711a. According to an embodiment, the magnetic secure transmission pattern 711c may be electrically connected to a printed circuit board, and the magnetic secure transmission pattern 711c generates a designated magnetic field stored in a memory (eg, the memory 130 of FIG. 1 ). can be sent externally.
  • a memory eg, the memory 130 of FIG. 1
  • a heat dissipation member 730 may be disposed adjacent to the antenna pattern 711 .
  • the non-conductive layer 712 may be disposed on both surfaces of the antenna pattern 711 .
  • the non-conductive layer 712 of the third region 703 corresponding to the antenna pattern may extend to the first region 701 and the fifth region 705 in which the electric device is disposed.
  • the extended portion of the non-conductive layer 712 may overlap with the heat dissipation member 730 and/or an electrical device (eg, the speaker module 620 ) or may be disposed very adjacently.
  • the extended portion of the non-conductive layer 712 may be bonded to the electrical device through the adhesive member 740 .
  • the additional conductive pattern 713 may be disposed inside the non-conductive layer 712 .
  • the additional conductive pattern 713 may be disposed in the first, second, fourth, and fifth regions 701 , 702 , 704 and 705 of the antenna module 600 .
  • the additional conductive pattern 713 may be disposed along the outer boundary of the heat dissipation member 730 .
  • the additional conductive pattern 713 may not function as a conductive wire.
  • the additional conductive pattern 713 may be electrically connected to the printed circuit board 611 .
  • the additional conductive pattern 713 may be disposed to be spaced apart from the heat dissipation member 730 . At least a portion of the additional conductive pattern 713 may serve as another antenna radiator.
  • the shielding member 720 has a magnetic field generated by the current flowing in the wireless charging pattern 711a, the short-range communication pattern 711b, and the magnetic security transmission pattern 711c is one electron that is located on the back side of the coil The influence of parts can be minimized.
  • the shielding member 720 includes a battery (not shown), a printed circuit board 611, an electric element or a support member (not shown) disposed on the surface on which the shielding member is located, a wireless charging pattern 711a, a short-range It is possible to prevent offsetting of a magnetic field generated in the communication pattern 711b or the magnetic secure transmission pattern 711c.
  • the magnetic field generated by the wireless charging pattern 711a, the short-range communication pattern 711b, and the magnetic secure transmission pattern 711c may be concentrated in the opposite direction of the shielding member 720 .
  • the shielding member 720 can concentrate the magnetic field generated by the wireless charging pattern 711a to the surface on which the rear plate (eg, the rear plate 511 of FIG. 5) of the housing 610 is disposed, so that the charging efficiency of the battery can increase
  • the shielding member 720 may concentrate the magnetic field generated in the short-range communication pattern 711b to the rear plate, so that an external electronic device (eg, the electronic device 102 of FIG. 1 ) and near field communication (NFC) are performed. can do.
  • the short-distance communication pattern 711b may communicate with an external device, and the electronic device may exchange data with the external device in a short distance.
  • a plurality of shielding members 720 may be provided to form a layer.
  • the thickness of the shielding member 720 may be different depending on the position at which the shielding member 720 is disposed, and the arrangement shape may also be different.
  • the shielding member 720 may be formed of a material having high magnetic permeability and low loss tangent in the band of the short-range communication pattern 711b and the wireless charging pattern 711a.
  • the shielding member 720 may include a material formed of microcrystalline, and may have a high magnetic permeability and a low loss tangent in the short-range communication pattern 711b and wireless charging pattern 711a bands of approximately 10Khz to 15Mhz.
  • the shielding member 720 may be used as a ferromagnetic material in the wireless charging pattern (711a) band and the short-range communication pattern (711b) band of about 10Khz to 15Mhz, thereby minimizing the effect of electronic components disposed around the antenna module 710 It is possible to improve the performance of the wireless charging pattern (711a) and the short-range communication pattern (711b).
  • the heat dissipating member 730 may be disposed on one surface of the shielding member 720 .
  • the heat dissipation member 730 may be disposed on one surface of the antenna module 710 .
  • the heat dissipation member 730 may extend to the first region 701 and the fifth region 705 to which the electrical device is attached.
  • the heat dissipation member 730 may be formed of one layer, but is not limited thereto, and the heat dissipation member 730 may be formed of a plurality of layers.
  • Each of the plurality of layers forming the heat dissipation member 730 may be formed to have the same thickness, and at least one of the plurality of layers may be formed to have a different thickness.
  • the heat dissipation member 730 may be made of a metal material.
  • the heat dissipation member 730 may radiate heat generated in the wireless charging pattern 711a or the short-range communication pattern 711b and transmitted through the shielding member 720 to the outside.
  • the thickness of the heat dissipation member 730 may be formed to a thickness sufficient to dissipate heat from the wireless charging pattern 711a.
  • the heat dissipation member 730 may be disposed to overlap the shield member 720 .
  • the heat dissipation member 730 may be disposed to overlap at least a portion of the wireless charging pattern 711a.
  • the heat dissipation member 730 may include graphite having excellent heat dissipation performance in order to reduce heat generated by the wireless charging pattern 711a or the battery.
  • the heat dissipation member 730 may include a portion extending toward the fourth region 704 and the fifth region 705 .
  • a portion extending toward the fourth region 704 and the fifth region 705 may correspond to the first heat dissipation member 530 illustrated in FIG. 5 .
  • a portion corresponding to the first heat dissipation member 530 in the fourth area 704 and the fifth area 705 may be divided into a 1-1 heat dissipation member 731 and a 1-2 heat dissipation member 732 . .
  • the 1-2 heat dissipation member 732 may overlap the speaker module 620 .
  • the 1-1 th heat dissipation member 731 and the 1-2 th heat dissipation member 732 may be separated from each other by the segment 733 .
  • the speaker module 620 and/or the metal part (eg, the metal part 521 in FIG. 5 ) of the speaker module 620 and the 1-2 heat dissipation member 732 are coupled.
  • noise induced in the first and second heat dissipation members 732 may be prevented from degrading the radiation performance of the antenna module.
  • the adhesive member 740 in the first region 701 is ) (eg, the adhesive members 530a and 530b of FIG.
  • the adhesive member 740 may be disposed between the housing 610 and an electrical device (eg, the speaker module 620 ) mounted on the printed circuit board 611 . there is. According to an embodiment, the adhesive member 740 may be disposed between the heat dissipation member 730 and an electrical element (eg, the speaker module 620 ).
  • 13A is a diagram illustrating a surface temperature of an electronic device adjacent to a speaker module, according to an exemplary embodiment.
  • 13B is a diagram illustrating a surface temperature of an electronic device adjacent to a speaker module according to an embodiment of the present disclosure.
  • 13C is a diagram illustrating a surface temperature of an electronic device adjacent to a speaker module according to another embodiment of the present disclosure.
  • 13A illustrates a surface temperature of a housing adjacent to the speaker module 820 when the first heat dissipation member and the elastic member are not provided.
  • 13B may show the surface temperature of the housing adjacent to the speaker module 820 when the first heat dissipation member and the elastic member are provided (hereinafter, 'first embodiment').
  • 13C may show the surface temperature of the housing adjacent to the speaker module 820 when the second heat dissipation member is additionally provided together with the first heat dissipation member and the elastic member (hereinafter, 'second embodiment').
  • the surface temperature of the housing due to the heat generated by the speaker module 820 is a case in which the heat dissipation structure is not included.
  • the advantage of lowering by about 0.6 degrees can be confirmed. It should be noted that, through comparison of two different embodiments, in the electronic device according to various embodiments of the present disclosure, not only the effect of reducing the housing surface temperature but also the effect of reducing the vibration generated by the speaker module 820 is significantly improved.
  • the surface temperature of the housing due to the heat generated by the speaker module 820 is the first It can be seen that the temperature improvement effect of 1.3 degrees can be obtained compared to the electronic device including the heat dissipation structure according to the embodiment.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • a or B at least one of A and B, “at least one of A or B”, “A, B or C”, “at least one of A, B and C” and “A;
  • Each of the phrases “at least one of B, or C” may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases.
  • Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101).
  • a machine eg, electronic device 101
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is different from the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided as included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
  • a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.
  • An electronic device includes a housing (eg, the housing 510 of FIG. 5 ); at least one electric element (eg, electric element 520 of FIG. 5 ) disposed adjacent to one surface of the housing; a metal part (eg, the metal part 521 of FIG. 5 ) included in the electric element; an antenna radiator disposed adjacent to the metal part (eg, the antenna radiator 590' of FIG. 7); an elastic member (eg, the elastic member 540 of FIG. 5 ) for protecting the electrical element; and a first heat dissipating member (eg, the first heat dissipating member 530 of FIG.
  • the first heat dissipating member includes a segment (eg, the segment of FIG. 5 ) 533) and a 1-1 heat dissipation member (eg, 1-1 heat dissipation member 531) and a 1-2 heat dissipation member (eg, 1-2 heat dissipation member 532) spaced apart from each other by (533).
  • the first heat dissipating member includes a segment (eg, the segment of FIG. 5 ) 533) and a 1-1 heat dissipation member (eg, 1-1 heat dissipation member 531) and a 1-2 heat dissipation member (eg, 1-2 heat dissipation member 532) spaced apart from each other by (533).
  • At least a portion of the first heat dissipation member may be disposed between the housing and the metal part.
  • the segmented portion may be formed between a portion facing the metal portion and a portion not facing the metal portion.
  • the 1-1 heat dissipation member may extend from the outside of the electrical device toward a top surface of the electrical device, and the 1-2 heat dissipation member may be disposed on the top surface of the electrical device.
  • At least a portion of the elastic member may be disposed between the housing and the first heat dissipation member.
  • a recess (eg, the recess 540d of FIG. 5 or the recess 540h of FIG. 9C ) may be formed in at least a portion of the elastic member.
  • the recess is a through hole (eg, a recess 540h in FIG. 9D ) penetrating one surface and the other surface of the elastic member or a groove forming a stepped surface with one surface of the elastic member. ) (eg, the recess 540d of FIGS. 9B and 9C ).
  • At least one second heat dissipation member (eg, the second heat dissipation member 550 of FIG. 5 ) may be further included.
  • At least a portion of the second heat dissipation member may be disposed between the housing and the elastic member.
  • the second heat dissipation member may be a low dielectric heat dissipation sheet disposed at a position corresponding to the segmented portion.
  • the first heat dissipation member may include graphite
  • the second heat dissipation member may be formed by solidifying boron nitride (BN).
  • the metal part may be exposed on a space inside the electronic device surrounded by the housing.
  • the metal part may be a yoke.
  • the electric device may be a speaker module.
  • the housing (eg, the housing 510 of FIG. 5 ) includes a front plate (eg, the front plate 402 of FIG. 4B ) disposed toward a first direction and a direction opposite to the first direction. facing back plate (eg, back plate 411 in FIG. 4B ); and a side member (eg, a side member 418 of FIG. 4B ) that surrounds a space between the front plate and the back plate.
  • a front plate eg, the front plate 402 of FIG. 4B
  • facing back plate eg, back plate 411 in FIG. 4B
  • a side member eg, a side member 418 of FIG. 4B
  • one surface of the housing on which the electric element is disposed may be the rear plate.
  • a housing eg, the housing 510 of FIG. 5 ); at least one electric element (eg, electric element 520 of FIG. 5 ) disposed adjacent to one surface of the housing; a metal part (eg, the metal part 521 of FIG. 5 ) included in the electric element; An elastic member (eg, the elastic member 540 of FIG. 5 ) at least a portion of the antenna radiator disposed adjacent to the metal part (eg, the antenna radiator 590 of FIG. 7 ) is disposed between the housing and the electrical element ; and a first heat dissipating member (eg, the first heat dissipating member 530 of FIG.
  • the first heat dissipation member includes a portion facing the electric element and a portion not facing the electric element divided through a segmented portion (eg, the segmented portion 533 of FIG. 5 ).
  • the first heat dissipation member may include a 1-1 heat dissipation member (eg, the 1-1 heat dissipation member 531 of FIG. 5 ) extending from the outside of the electrical device toward the upper surface of the electrical device. and may include a 1-2 heat dissipation member (eg, the 1-2 heat dissipation member 532 of FIG. 5 ) disposed on the upper surface of the electrical device.
  • a 1-1 heat dissipation member eg, the 1-1 heat dissipation member 531 of FIG. 5
  • 1-2 heat dissipation member eg, the 1-2 heat dissipation member 532 of FIG. 5
  • a recess (eg, a recess 540d in FIGS. 9B and 9C , or a recess ( 540h)) may be formed.
  • the recess may be formed in a portion corresponding to the heating center of the electric element.
  • At least one second heat dissipation member (eg, the second heat dissipation member 550 of FIG. 5 ) disposed between the housing and the elastic member may be further included.

Abstract

Un dispositif électronique selon divers modes de réalisation de la présente invention comprend : un boîtier; au moins un élément électrique disposé de manière adjacente à une surface du boîtier; une partie métallique comprise dans l'élément électrique; un radiateur d'antenne disposé de manière adjacente à la partie métallique; un élément élastique pour protéger l'élément électrique; et un premier élément de dissipation de chaleur prévu pour dissiper la chaleur de l'élément électrique, le premier élément de dissipation de chaleur pouvant comprendre un élément de dissipation de chaleur de 1-1 et un élément de dissipation de chaleur de 1-2 qui sont espacés l'un de l'autre par une partie de segment.
PCT/KR2021/001628 2020-02-06 2021-02-08 Dispositif électronique comprenant une structure de dissipation de chaleur WO2021158088A1 (fr)

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Application Number Priority Date Filing Date Title
KR10-2020-0014388 2020-02-06
KR1020200014388A KR20210100422A (ko) 2020-02-06 2020-02-06 방열 구조를 포함하는 전자 장치

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Citations (5)

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Publication number Priority date Publication date Assignee Title
KR20160026333A (ko) * 2014-08-29 2016-03-09 삼성전자주식회사 부품 방열 장치 및 이를 구비한 전자 장치
KR20160044052A (ko) * 2013-11-14 2016-04-22 가부시키가이샤후지쿠라 휴대형 전자 기기의 냉각 구조
KR20190012813A (ko) * 2017-07-28 2019-02-11 엘지전자 주식회사 이동 단말기
KR20190060180A (ko) * 2017-11-24 2019-06-03 삼성전자주식회사 방열 구조를 포함하는 전자 장치
KR20190079916A (ko) * 2017-12-28 2019-07-08 지엔에스티 주식회사 방열구조를 갖는 차량용 usb 전자장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160044052A (ko) * 2013-11-14 2016-04-22 가부시키가이샤후지쿠라 휴대형 전자 기기의 냉각 구조
KR20160026333A (ko) * 2014-08-29 2016-03-09 삼성전자주식회사 부품 방열 장치 및 이를 구비한 전자 장치
KR20190012813A (ko) * 2017-07-28 2019-02-11 엘지전자 주식회사 이동 단말기
KR20190060180A (ko) * 2017-11-24 2019-06-03 삼성전자주식회사 방열 구조를 포함하는 전자 장치
KR20190079916A (ko) * 2017-12-28 2019-07-08 지엔에스티 주식회사 방열구조를 갖는 차량용 usb 전자장치

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