WO2021157525A1

WO2021157525A1 - Resin pattern manufacturing method, circuit wiring manufacturing method, touch panel manufacturing method, and photosensitive transfer member

Info

Publication number: WO2021157525A1
Application number: PCT/JP2021/003540
Authority: WO
Inventors: 壮二石坂
Original assignee: 富士フイルム株式会社
Priority date: 2020-02-05
Filing date: 2021-02-01
Publication date: 2021-08-12
Also published as: CN114930250A; JPWO2021157525A1

Abstract

Provided are: a resin pattern manufacturing method for forming a resin pattern on a substrate using a photosensitive transfer member having a temporary support and a photosensitive resin layer, wherein the pattern width at the portion of the resin pattern in contact with the substrate is at least 0.2 μm larger than the pattern width at the position where the height is 90% of the maximum height of the resin pattern; a circuit wiring manufacturing method; a touch panel manufacturing method; and a photosensitive transfer member comprising a temporary support and a photosensitive resin layer, wherein when a resin pattern A having a pattern width of 6 μm at the position where the height is 90% of the maximum height is formed on a substrate, the pattern width of the resin pattern A at the portion in contact with the substrate is at least 6.2 μm, in the cross section of the resin pattern A in the width direction.

Description

Resin pattern manufacturing method, circuit wiring manufacturing method, touch panel manufacturing method, and photosensitive transfer member

The present disclosure relates to a resin pattern manufacturing method, a circuit wiring manufacturing method, a touch panel manufacturing method, and a photosensitive transfer member.

In display devices equipped with a touch panel such as a capacitance type input device (organic electroluminescence (EL) display device, liquid crystal display device, etc.), the electrode pattern corresponding to the sensor of the visual recognition part, the peripheral wiring part, and the wiring of the take-out wiring part are wired. A conductive layer pattern such as is provided inside the touch panel.
Generally, in forming a patterned layer, the number of steps for obtaining a required pattern shape is small, so that a layer of a photosensitive resin composition provided on an arbitrary substrate using a photosensitive transfer member is used. On the other hand, a method of developing after exposure through a mask having a desired pattern is widely used.

Further, as a conventional photosensitive resin composition, those described in JP-A-2014-209173 or JP-A-2011-209426 are known.
Japanese Unexamined Patent Publication No. 2014-209173 includes (A) an acid-modified photosensitive epoxy resin and (B) a non-photosensitive carboxylic acid resin having a styrene skeleton and a weight average molecular weight of 10,000 to 50,000. A photosensitive resin composition characterized by the above is described.

Japanese Patent Application Laid-Open No. 2011-209426 describes an alkali-soluble resin, a compound having a quinonediazide structure, a pyrrole structure, an isoxazole structure, a thiazole structure, an isothiazole structure, a pyridine structure, an indole structure, a quinoline structure, and an isoquinoline structure. A photosensitive resin composition comprising a nitrogen-containing heterocyclic compound having at least one structure selected from the above group is described.

An object to be solved by one embodiment of the present invention is to provide a method for producing a resin pattern having excellent resolution.
Further, an object to be solved by another embodiment of the present invention is to provide a method for manufacturing a circuit wiring having excellent resolution and a method for manufacturing a touch panel.
Further, an object to be solved by another embodiment of the present invention is to provide a photosensitive transfer member having excellent resolution.

Means for solving the above problems include the following aspects.
<1> A method for producing a resin pattern in which a resin pattern is formed on a substrate by using a temporary support and a photosensitive transfer member having a photosensitive resin layer, wherein the resin pattern has a maximum height of 90 from the substrate. A method for producing a resin pattern in which the pattern width of the resin pattern in contact with the substrate is 0.2 μm or more larger than the pattern width at the% position.
<2> The method for producing a resin pattern according to <1>, wherein the thickness of the photosensitive resin layer is 8 μm or less.
<3> The method for producing a resin pattern according to <1> or <2>, wherein the temporary support has a thickness of 25 μm or less.
<4> The value obtained by subtracting the pattern width at the position of 90% of the maximum height of the resin pattern from the pattern width at the portion of the resin pattern in contact with the substrate is 0.2 μm or more and 2.4 μm or less <1>. The method for producing a resin pattern according to any one of <3>.
<5> The method for producing a resin pattern according to any one of <1> to <4>, wherein the photosensitive resin layer contains a polymerizable compound and a binder polymer.
<6> The method for producing a resin pattern according to <5>, wherein the value of the ratio Mm / Mb of the content Mm of the polymerizable compound and the content Mb of the binder polymer in the photosensitive resin layer is 0.9 or less. ..
<7> The polymerizable compound in the photosensitive resin layer contains a (meth) acrylic compound, and the content of the acrylic compound with respect to the total mass of the (meth) acrylic compound contained in the photosensitive resin layer is 60 mass by mass. The method for producing a resin pattern according to <5> or <6>, which is less than or equal to%.
<8> The method for producing a resin pattern according to any one of <1> to <7>, wherein the resin pattern to be produced includes a resin pattern having a pattern width of 6 μm or less.
<9> The substrate has a conductive layer on the surface on the side on which the resin pattern is formed, and is manufactured by the method for manufacturing a resin pattern according to any one of <1> to <8>. A method for manufacturing a circuit wiring, which comprises a step of etching a conductive layer in a region where the resin pattern is not arranged in a laminate having the resin pattern on a substrate to form a circuit wiring.
<10> The substrate has a conductive layer on the surface on the side on which the resin pattern is formed, and is manufactured by the method for manufacturing a resin pattern according to any one of <1> to <8>. A method for manufacturing a touch panel, which comprises a step of etching a conductive layer in a region where the resin pattern is not arranged in a laminate having the resin pattern on a substrate to form wiring for a touch panel.
<11> A photosensitive transfer member having a temporary support and a photosensitive resin layer, and the photosensitive transfer member makes a pattern width of 6 μm on a substrate at a position of 90% of the maximum height from the substrate. A photosensitive transfer member having a resin pattern A having a pattern width of 6.2 μm or more in a portion in contact with the substrate in a cross section in the width direction of the resin pattern A.

According to one embodiment of the present invention, it is possible to provide a method for producing a resin pattern having excellent resolution.
Further, according to another embodiment of the present invention, it is possible to provide a method for manufacturing a circuit wiring having excellent resolution and a method for manufacturing a touch panel.
Further, according to another embodiment of the present invention, it is possible to provide a photosensitive transfer member having excellent resolution.

FIG. 1 is a schematic cross-sectional view of a resin pattern formed in the method for producing a resin pattern according to the present disclosure in the width direction. FIG. 2 is a schematic view showing an example of the layer structure of the photosensitive transfer member used in the present disclosure. FIG. 3 is a schematic view showing the pattern A. FIG. 4 is a schematic view showing the pattern B.

The contents of the present disclosure will be described below. Although the description will be given with reference to the attached drawings, the reference numerals may be omitted.
In addition, the numerical range represented by using "-" in the present specification means a range including the numerical values before and after "-" as the lower limit value and the upper limit value.
Further, in the present specification, "(meth) acrylic" represents both acrylic and methacrylic, or either, and "(meth) acrylate" represents both acrylate and methacrylate, or either.
Further, in the present specification, the amount of each component in the composition is the sum of the plurality of applicable substances present in the composition unless otherwise specified, when a plurality of substances corresponding to each component are present in the composition. Means quantity.
In the present specification, the term "process" is included in this term not only as an independent process but also as long as the intended purpose of the process is achieved even when it cannot be clearly distinguished from other processes.
In the notation of a group (atomic group) in the present specification, the notation that does not describe substitution or non-substitution includes those having no substituent as well as those having a substituent. For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
Unless otherwise specified, the term "exposure" as used herein includes not only exposure using light but also drawing using particle beams such as an electron beam and an ion beam. In addition, as the light used for exposure, generally, the emission line spectrum of a mercury lamp, far ultraviolet rays typified by an excimer laser, extreme ultraviolet rays (EUV light), X-rays, active rays such as electron beams (active energy rays) are used. Can be mentioned.
Further, the chemical structural formula in the present specification may be described by a simplified structural formula in which a hydrogen atom is omitted.
In the present disclosure, "% by mass" and "% by weight" are synonymous, and "parts by mass" and "parts by weight" are synonymous.
Further, in the present disclosure, a combination of two or more preferred embodiments is a more preferred embodiment.
Unless otherwise specified, the weight average molecular weight (Mw) and the number average molecular weight (Mn) in the present disclosure use columns of TSKgel GMHxL, TSKgel G4000HxL, and TSKgel G2000HxL (all trade names manufactured by Toso Co., Ltd.). It is a molecular weight converted by detecting with a solvent THF (tetrahydrofuran) and a differential refractometer by a gel permeation chromatography (GPC) analyzer and using polystyrene as a standard substance.

[Manufacturing method of resin pattern]
The method for producing a resin pattern according to the present disclosure is a method for producing a resin pattern that forms a resin pattern on a substrate by using a temporary support and a photosensitive transfer member having a photosensitive resin layer, and the width of the resin pattern. In the cross section in the direction, the pattern width at the portion of the resin pattern in contact with the substrate is 0.2 μm or more larger than the pattern width at the position of 90% of the maximum height of the resin pattern from the substrate.

In order to increase the definition of the photosensitive resin composition, a thin film thickness is being studied.
In the case of a thin film resist, if processing such as development and etching is performed under the same conditions as a conventional thick film resist, it may not be possible to obtain a preferable form because it is excessively developed and etched (undercut, peeling, uneven shape, etc.). ).
In particular, if the etching is excessive, the etching proceeds deep into the lower part of the resist (so-called side etching), the resist layer itself is damaged, the wiring disappears, etc., and it is difficult to miniaturize the resin pattern. There was a problem.
On the other hand, in general, the resist is required to have a rectangular shape in order to make the etching linearity and the linear shape uniform, and to obtain good linearity by further lengthening the etching time. I am designing.
However, when the resist is thinned as described above, it becomes difficult to process it with a long etching time.

The present inventor has found that the conventional method for producing a resin pattern that forms a cross-sectional shape of a pattern does not have sufficient resolution.
As a result of diligent studies, the present inventor has found that the resin pattern having the above structure is excellent in resolvability.
Although the detailed mechanism for exhibiting the above effect is unknown, the substrate of the resin pattern is larger than the pattern width at a position of 90% of the maximum height of the resin pattern from the substrate in the width direction of the resin pattern. Since the pattern width in the portion in contact with the resin pattern is 0.2 μm or more, the width of the portion of the resin pattern in contact with the substrate is large during etching using the resin pattern, which may slow down the progress of side etching. It is presumed that even if the etching pattern has a small width, the occurrence of etching defects such as pattern thinning and disconnection can be suppressed, and the resolution of the obtained etching pattern (also simply referred to as "resolution") is excellent. There is.

Further, usually, in order to prevent etching defects, the etching resist is required to have a rectangular shape without residues and skirts.
On the other hand, the resin pattern manufacturing method according to the present disclosure is designed to slow down the etching rate and prevent excessive etching by intentionally designing the resist shape after development into a shape that draws threads.
That is, the resin pattern manufacturing method according to the present disclosure is an invention having a technical idea opposite to that of the conventional negative resist design.

The method for producing a resin pattern according to the present disclosure is a method for producing a resin pattern in which a resin pattern is formed on a substrate by using a temporary support and a photosensitive transfer member having a photosensitive resin layer.
Preferred embodiments of the photosensitive transfer member used in the present disclosure will be described later.
The photosensitive transfer member used in the method for producing a resin pattern according to the present disclosure is preferably a negative type photosensitive transfer member.
Further, the resin pattern produced by the method for producing a resin pattern according to the present disclosure can be suitably used as an etching resist.

The method for producing a resin pattern according to the present disclosure is in contact with the substrate of the resin pattern rather than the pattern width at a position of 90% of the maximum height of the resin pattern from the substrate in the cross section in the width direction of the resin pattern. The pattern width in the portion is larger than 0.2 μm. When it is larger than 0.2 μm, the progress of the side edge at the time of etching can be delayed, and the resolution is excellent.
Further, the method for manufacturing a resin pattern according to the present disclosure is a pattern at a position 90% of the maximum height of the resin pattern from the pattern width at a portion of the resin pattern in contact with the substrate in a cross section in the width direction of the resin pattern. The value obtained by subtracting the width (the pattern width at the portion of the resin pattern in contact with the substrate-the value of the pattern width at a position of 90% of the maximum height of the resin pattern) is 0 from the viewpoint of resolution and linearity. It is preferably 2 μm or more and 3.0 μm or less, more preferably 0.2 μm or more and 2.4 μm or less, further preferably 0.3 μm or more and 2.0 μm or less, and 0.4 μm or more and 2.0 μm. The following is particularly preferable.

As a method for measuring the pattern width at a position of 90% of the maximum height of the resin pattern in the cross section in the width direction of the resin pattern in the present disclosure and the pattern width at the portion of the resin pattern in contact with the substrate. Cuts a substrate having a resin pattern in the width direction of the resin pattern, observes the cut resin pattern and the substrate from the cut surface side with a scanning electron microscope, and measures each pattern width. The pattern width at a position of 90% of the maximum height of the resin pattern and the pattern width at the portion of the resin pattern in contact with the substrate shall be the average value of the measured values at 10 points.

In the present disclosure, the "cross section in the width direction of the resin pattern" is a cross section in a plane parallel to the width direction and the thickness direction of the substrate, and is, for example, perpendicular to the line direction of the resin pattern which is line and space. It is a cross section in a plane.
Further, in the present disclosure, "the position of X% of the maximum height of the resin pattern in the cross section of the resin pattern in the width direction" means the maximum of the resin pattern from the substrate in the cross section of the resin pattern in the width direction. Represents a position at a height of X% of the height.
Further, in the present disclosure, the resin pattern preferably has a higher hardness than the uncured photosensitive resin layer.

FIG. 1 is a schematic cross-sectional view of a resin pattern formed in the method for producing a resin pattern according to the present disclosure in the width direction.
The resin pattern 4 on the substrate 2 shown in FIG. 1 has tailing portions 4a on both sides of the resin pattern 4 in the vicinity of the portion in contact with the substrate 2. Further, in FIG. 1, 90% of the maximum height of the resin pattern 4 from the substrate 2 is H90, and the pattern width at 90% of the maximum height of the resin pattern 4 is L1. The pattern width at the portion of 4 in contact with the substrate 2 is L2.

Further, in the method for manufacturing a resin pattern according to the present disclosure, when a resin pattern A having a pattern width of 6 μm at a position of 90% of the maximum height from the substrate is formed on the substrate, the width of the resin pattern A is formed. In the cross section in the direction, the pattern width of the resin pattern A in the portion in contact with the substrate is preferably 6.2 μm or more, and is 6.2 μm or more and 9.0 μm or less from the viewpoint of resolution and linearity. More preferably, it is more preferably 6.2 μm or more and 8.4 μm or less, particularly preferably 6.3 μm or more and 8.0 μm or less, and most preferably 6.4 μm or more and 8.0 μm or less.

In the method for producing a resin pattern according to the present disclosure, all of the resin patterns are in contact with the substrate in a cross section in the width direction of the resin pattern, rather than the pattern width at a position of 90% of the maximum height from the substrate. The pattern width does not have to be larger than 0.2 μm, and among the resin patterns produced by the photosensitive transfer member observed from the direction perpendicular to the surface direction of the substrate, in the cross section of the resin pattern in the width direction. The proportion of the resin pattern in which the pattern width in the portion of the resin pattern in contact with the substrate is 0.2 μm or more larger than the pattern width at the position of 90% of the maximum height of the resin pattern is 50 area% or more. It is more preferably 80 area% or more, and particularly preferably 90 area% or more.

Further, the method for manufacturing a resin pattern according to the present disclosure is a pattern width at a position of 90% of the maximum height of the resin pattern in a cross section in the width direction of the resin pattern-50% of the maximum height of the resin pattern. From the viewpoint of resolution and linearity, the value of the pattern width at the position is preferably −0.5 μm or more and 1.0 μm or less, more preferably −0.2 μm or more and 0.5 μm or less, and −. It is more preferably 0.2 μm or more and 0.2 μm or less, and particularly preferably −0.1 μm or more and 0.1 μm or less.

The resin pattern produced by the method for producing a resin pattern according to the present disclosure is 5% to 40% of the maximum height of the resin pattern in the widthwise cross section of the resin pattern from the viewpoint of resolution and linearity. It is more preferable that the pattern width gradually increases from the position of 1 toward the substrate, and the pattern width gradually increases from the position of 10% to 30% of the maximum height of the resin pattern toward the substrate. A resin pattern that becomes longer is more preferable, and a resin pattern in which the pattern width gradually increases from a position of 15% to 25% of the maximum height of the resin pattern toward the substrate is particularly preferable.

Further, the method for producing a resin pattern according to the present disclosure is a pattern width at a position of 90% of the maximum height of the resin pattern from the substrate in a cross section in the width direction of the resin pattern-from the substrate of the resin pattern. The value of the pattern width at the position of 5% of the maximum height is preferably 0.1 μm or more and 2.5 μm or less, and 0.1 μm or more and 2.0 μm or less from the viewpoint of resolution and linearity. More preferably, it is more preferably 0.15 μm or more and 1.8 μm or less, and particularly preferably 0.2 μm or more and 1.5 μm or less.

The resin pattern produced by the method for producing a resin pattern according to the present disclosure preferably contains a resin pattern having a pattern width of 10 μm or less, and a resin pattern having a pattern width of 8 μm or less, from the viewpoint of further exerting the effects in the present disclosure. It is more preferable to include a resin pattern having a pattern width of 6 μm or less, and it is particularly preferable to include a resin pattern having a pattern width of 1 μm or more and 6 μm or less.
Further, the resin pattern produced by the method for producing a resin pattern according to the present disclosure preferably has a line-and-space pattern from the viewpoint of more exerting the effect in the present disclosure.
Further, the resin pattern produced by the method for producing a resin pattern according to the present disclosure is preferably an etching resist pattern for wiring formation, and is an etching resist pattern for circuit wiring, from the viewpoint of further exerting the effect in the present disclosure. It is more preferable, and it is particularly preferable that the etching resist pattern for circuit wiring includes wiring having a width of 6 μm or less.

The maximum height of the resin pattern produced by the method for producing the resin pattern according to the present disclosure is 20 μm or less from the viewpoint of further exerting the effect in the present disclosure, although it is related to the thickness of the photosensitive resin layer described later. It is preferably 10 μm or less, more preferably 8 μm or less, and particularly preferably 2 μm or more and 8 μm or less.

Further, in the resin pattern manufactured by the resin pattern manufacturing method according to the present disclosure, the value of the pattern width / the maximum height of the resin pattern at a position of 90% of the maximum height of the resin pattern from the substrate is as follows. It is preferable to include a resin pattern within the numerical range of.
The value of the pattern width / the maximum height of the resin pattern at a position of 90% of the maximum height of the resin pattern from the substrate is preferably 2 or less from the viewpoint of more exerting the effect in the present disclosure. It is more preferably 1.5 or less, further preferably 1 or less, and particularly preferably 0.5 or more and 0.8 or less.

The method for producing a resin pattern according to the present disclosure is a method for producing a resin pattern in which a resin pattern is formed on a substrate by using a temporary support and a photosensitive transfer member having a photosensitive resin layer.
As a method for producing a resin pattern, a photosensitive transfer member and a substrate (preferably a conductive substrate) are placed on a second surface of the photosensitive resin layer, that is, a surface on a side not facing the temporary support. (Hereinafter, also referred to as “bonding step”), a step of pattern-exposing the photosensitive resin layer (hereinafter, also referred to as “exposure step”), and developing the exposed photosensitive resin layer. A method including a step of forming a resin pattern (hereinafter, also referred to as a “development step”) in this order is preferable.

<Lasting process>
The method for producing the resin pattern preferably includes a bonding step.
In the bonding step, it is preferable that the substrate (or the conductive layer when the conductive layer is provided on the surface of the substrate) is brought into contact with the second surface of the photosensitive resin layer, and the photosensitive transfer member and the substrate are pressure-bonded. .. In the above aspect, since the adhesion between the second surface of the photosensitive resin layer and the substrate is improved, it is suitable as an etching resist when etching the patterned photosensitive resin layer conductive layer after exposure and development. Can be used.

When the photosensitive transfer member includes a cover film, the cover film may be removed from the surface of the photosensitive resin layer and then bonded.
Further, in the bonding step, a layer other than the cover film (for example, a high refractive index layer and / or a low refractive index layer) is further formed on the surface of the photosensitive resin layer on the side where the photosensitive transfer member does not face the temporary support. In this case, the surface of the photosensitive resin layer on the side that does not have the temporary support and the substrate are bonded to each other via the layer.

The method of crimping the substrate and the photosensitive transfer member is not particularly limited, and a known transfer method and laminating method can be used.
The bonding of the photosensitive transfer member to the substrate is preferably performed by stacking the substrate on the second surface side of the photosensitive resin layer and applying pressure and heating by means such as a roll. For bonding, known laminators such as a laminator, a vacuum laminator, and an auto-cut laminator capable of further increasing productivity can be used.

The resin pattern manufacturing method and the circuit wiring manufacturing method including the bonding step are preferably performed by a roll-to-roll method.
Hereinafter, the roll-to-roll method will be described.
The roll-to-roll method is a structure in which a substrate that can be wound and unwound is used as the substrate, and the substrate or the substrate is included before any of the steps included in the resin pattern manufacturing method or the circuit wiring manufacturing method. It includes a step of unwinding a body (also referred to as a “unwinding step”) and a step of winding a substrate or a structure including the substrate (also referred to as a “winding step”) after any of the steps. A method in which at least one of the steps (preferably all steps or all steps other than the heating step) is performed while transporting the substrate or the structure including the substrate.
The unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and a known method may be used in the manufacturing method to which the roll-to-roll method is applied.

<Board>
As the substrate used in the method for producing a resin pattern according to the present disclosure, a known substrate may be used, but a substrate having a conductive layer is preferable, and it is more preferable to have a conductive layer on the surface of the substrate.
The substrate may have any layer other than the conductive layer, if necessary.

Examples of the base material constituting the substrate include glass, silicon and film.
The base material constituting the substrate is preferably transparent. As used herein, the term "transparent" means that the transmittance of light having a wavelength of 400 nm to 700 nm is 80% or more.
Further, the refractive index of the substrate constituting the substrate is preferably 1.50 to 1.52.

Examples of the transparent glass substrate include tempered glass represented by Corning's gorilla glass. Further, as the transparent glass substrate, the materials used in JP-A-2010-86684, JP-A-2010-152809 and JP-A-2010-257492 can be used.

When a film substrate is used as the substrate, it is preferable to use a film substrate with low optical distortion and / or high transparency. Examples of such film substrates include polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, triacetyl cellulose and cycloolefin polymers.

As the substrate, a film substrate is preferable when it is manufactured by the roll-to-roll method. Further, when the circuit wiring for the touch panel is manufactured by the roll-to-roll method, it is preferable that the substrate is a sheet-like resin composition.

Examples of the conductive layer included in the substrate include a conductive layer used for general circuit wiring or touch panel wiring.
As the conductive layer, at least one layer selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer and a conductive polymer layer is preferable from the viewpoint of conductivity and fine wire forming property. A metal layer is more preferable, and a copper layer or a silver layer is further preferable.
The substrate may have one conductive layer alone, or may have two or more conductive layers. When having two or more conductive layers, it is preferable to have conductive layers made of different materials.

Examples of the material of the conductive layer include metals and conductive metal oxides.
Examples of the metal include Al, Zn, Cu, Fe, Ni, Cr, Mo, Ag and Au.
Examples of the conductive metal oxide include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) and SiO ₂ .
In addition, in this specification, "conductivity" means that the volume resistivity is less than ^{1 × 10 6 Ωcm.} The volume resistivity of the conductive metal oxide is preferably less than ^{1 × 10 4 Ωcm.}

When a resin pattern is produced using a substrate having a plurality of conductive layers, it is preferable that at least one conductive layer among the plurality of conductive layers contains a conductive metal oxide.
As the conductive layer, an electrode pattern corresponding to a sensor of a visual recognition portion used in a capacitive touch panel or wiring of a peripheral extraction portion is preferable.

<Exposure process>
The method for producing the resin pattern preferably includes a step (exposure step) of pattern-exposing the photosensitive resin layer after the bonding step.

The detailed arrangement and specific size of the pattern in the pattern exposure are not particularly limited. At least a part (preferably) of the pattern so as to improve the display quality of a display device (for example, a touch panel) provided with an input device having a circuit wiring manufactured by a circuit wiring manufacturing method and to reduce the area occupied by the take-out wiring. The electrode pattern and / or the portion of the take-out wiring of the touch panel) preferably includes a thin wire having a width of 20 μm or less, and more preferably contains a thin wire having a width of 10 μm or less.

The light source used for exposure can be appropriately selected and used as long as it is a light source that irradiates the photosensitive resin layer with light having a wavelength that allows exposure (for example, 365 nm or 405 nm). Specific examples thereof include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps and LEDs (Light Emitting Diodes).

The exposure amount ^{is preferably 5 mJ / cm 2} to 200 mJ / cm ^2, more preferably 10 mJ / cm ² to 100 mJ / cm ² .

In the exposure step, the temporary support may be peeled off from the photosensitive resin layer and then pattern-exposed, or the temporary support may be peeled off after pattern-exposure through the temporary support. In order to prevent contamination of the photosensitive resin layer due to contact between the photosensitive resin layer and the mask and to avoid the influence of foreign matter adhering to the mask on the exposure, it is preferable to perform pattern exposure via a temporary support. The pattern exposure may be an exposure through a mask or a direct exposure using an exposure means such as a laser.

<Development process>
The method for producing a resin pattern preferably includes, after the above-mentioned exposure step, a step (development step) of developing the exposed photosensitive resin layer to form a resin pattern.
When the photosensitive transfer member has a thermoplastic resin and an intermediate layer, the thermoplastic resin layer and the intermediate layer in the non-exposed portion are also removed together with the photosensitive resin layer in the non-exposed portion in the developing step. Further, in the developing step, the thermoplastic resin layer and the intermediate layer of the exposed portion may also be removed in a form of being dissolved or dispersed in the developing solution.

The exposed photosensitive resin layer in the developing step can be developed by using a developing solution.
The developing solution is not particularly limited as long as the non-image portion (non-exposed portion) of the photosensitive resin layer can be removed. For example, a known developing solution such as the developing solution described in JP-A-5-72724 can be used. Can be used.
As the developing solution, an alkaline aqueous solution-based developing solution containing a compound having pKa = 7 to 13 at a concentration of 0.05 mol / L to 5 mol / L (liter) is preferable. The developer may contain a water-soluble organic solvent and / or a surfactant. As the developing solution, the developing solution described in paragraph 0194 of International Publication No. 2015/093271 is also preferable.

The development method is not particularly limited, and may be any of paddle development, shower development, shower and spin development, and dip development. Shower development is a development process for removing a non-exposed portion by spraying a developing solution on the photosensitive resin layer after exposure by a shower.
After the developing step, it is preferable to spray the cleaning agent with a shower and rub with a brush to remove the developing residue.
The temperature of the developing solution is not particularly limited, but is preferably 20 ° C to 40 ° C.

<Cover film peeling process>
When the photosensitive transfer member includes a cover film, the method for producing the resin pattern preferably includes a step of peeling the cover film from the photosensitive transfer member. The method of peeling the cover film is not limited, and a known method can be applied.

<Other processes>
The method for producing the resin pattern may include any step (other steps) other than the steps described above. For example, the following steps can be mentioned, but the steps are not limited to these steps.

Hereinafter, the photosensitive transfer member used in the present disclosure will be described in detail.

<Photosensitive transfer member>
The photosensitive transfer member used in the present disclosure includes at least a temporary support and a photosensitive resin layer.
In the photosensitive transfer member, the temporary support and the photosensitive resin layer may be directly laminated without interposing another layer, or may be laminated through another layer. Further, another layer may be laminated on the surface of the photosensitive resin layer opposite to the surface facing the temporary support.
Examples of the layer other than the temporary support and the photosensitive resin layer include a thermoplastic resin layer, an intermediate layer, and a cover film.

[Temporary support]
The photosensitive transfer member used in the present disclosure includes a temporary support.
The temporary support is a support that supports a photosensitive resin layer or a laminate containing a photosensitive resin layer and is removable.

The temporary support preferably has light transmission property from the viewpoint of enabling exposure of the photosensitive resin layer through the temporary support when pattern-exposing the photosensitive resin layer. In addition, in this specification, "having light transmittance" means that the transmittance of light of the wavelength used for pattern exposure is 50% or more.
From the viewpoint of improving the exposure sensitivity of the photosensitive resin layer, the temporary support preferably has a light transmittance of 60% or more, preferably 70% or more, at a wavelength (more preferably 365 nm) used for pattern exposure. Is more preferable.
The transmittance of the layer included in the photosensitive transfer member refers to the light emitted through the layer with respect to the intensity of the incident light when the light is incident in the direction perpendicular to the main surface of the layer (thickness direction). It is a ratio of the intensity of light emission, and is measured using MCPD Series manufactured by Otsuka Electronics Co., Ltd.

Examples of the material constituting the temporary support include a glass substrate, a resin film and paper, and a resin film is preferable from the viewpoint of strength, flexibility and light transmission.
Examples of the resin film include polyethylene terephthalate (PET) film, cellulose triacetate film, polystyrene film and polycarbonate film. Among them, a PET film is preferable, and a biaxially stretched PET film is more preferable.

The thickness (layer thickness) of the temporary support is not particularly limited, and the strength as the support, the flexibility required for bonding to the circuit wiring forming substrate, and the light required in the first exposure step. From the viewpoint of transparency, it may be selected according to the material.
The thickness of the temporary support is preferably in the range of 5 μm to 100 μm, more preferably in the range of 10 μm to 50 μm, further preferably in the range of 10 μm to 20 μm, and in the range of 10 μm to 16 μm from the viewpoint of ease of handling and versatility. Especially preferable.
The thickness of the temporary support is preferably 50 μm or less, and more preferably 25 μm or less, from the viewpoint of resolution and linearity when exposed through the temporary support.

Further, it is preferable that the film used as the temporary support has no deformation such as wrinkles, scratches, or defects.
From the viewpoint of pattern formation during pattern exposure via the temporary support and transparency of the temporary support, it is preferable that the number of fine particles, foreign substances, defects, deposits, etc. contained in the temporary support is small. The number of the above fine particles and foreign matter and defect diameter 1μm is preferably 50/10 mm ² or less, more preferably 10/10 mm ² or less, further preferably 3/10 mm ² or less , 0 pieces / 10 mm ² is particularly preferable.

Preferred embodiments of the provisional support include, for example, paragraphs 0017 to 0018 of JP2014-85643, paragraphs 0019 to 0026 of JP2016-27363, and paragraphs 0041 to 0057 of International Publication No. 2012/081680. , Paragraphs 0029 to 0040 of International Publication No. 2018/179370 and paragraphs 0012 to 0032 of JP-A-2019-101405, and the contents of these publications are incorporated in the present specification.

[Photosensitive resin layer]
The photosensitive transfer member used in the present disclosure includes a photosensitive resin layer.

The photosensitive resin layer is preferably a negative photosensitive resin layer in which the solubility of the exposed portion in the developing solution is reduced by exposure and the non-exposed portion is removed by development. However, the photosensitive resin layer is not limited to the negative photosensitive resin layer, and even if the photosensitive resin layer is a positive photosensitive resin layer in which the solubility of the exposed portion in the developing solution is improved by exposure and the exposed portion is removed by development. good.

The photosensitive resin layer preferably contains a polymerizable compound and a binder polymer, more preferably contains a polymerizable compound, a binder polymer, and a photopolymerization initiator, and contains the polymer A, the polymerizable compound, and It is particularly preferable to include a photopolymerization initiator. The photosensitive resin layer is based on the total mass of the photosensitive resin layer, and the binder polymer: 10% by mass to 90% by mass; the polymerizable compound: 5% by mass to 70% by mass; and the photopolymerization initiator: 0.01% by mass. It preferably contains% to 20% by mass.
Hereinafter, each component will be described in order.

(Binder polymer)
The photosensitive resin layer preferably contains a binder polymer.
The binder polymer is not particularly limited, and for example, a known binder polymer used for an etching resist is preferably used.
Further, examples of the binder polymer include alkali-soluble polymers.
The alkali-soluble polymer is preferably an alkali-soluble polymer having an acid group.
Among them, as the binder polymer, the polymer A described later is preferable.

-Polymer A-
The binder polymer preferably contains the polymer A.
The polymer A is preferably an alkali-soluble polymer. Alkali-soluble polymers include polymers that are easily soluble in alkaline substances.

The acid value of the polymer A is preferably 220 mgKOH / g or less, more preferably less than 200 mgKOH / g, and more preferably 190 mgKOH / g, from the viewpoint of better resolution by suppressing the swelling of the photosensitive resin layer due to the developing solution. Less than is more preferred.
The lower limit of the acid value of the polymer A is not particularly limited, but from the viewpoint of better developability, 60 mgKOH / g or more is preferable, 120 mgKOH / g or more is more preferable, 150 mgKOH / g or more is further preferable, and 170 mgKOH / g or more is preferable. Especially preferable.

The acid value is the mass [mg] of potassium hydroxide required to neutralize 1 g of the sample, and the unit is described as mgKOH / g in the present specification. The acid value can be calculated, for example, from the average content of acid groups in the compound.
The acid value of the polymer A may be adjusted according to the type of the structural unit constituting the polymer A and the content of the structural unit containing an acid group.

The weight average molecular weight of the polymer A is preferably 5,000 to 500,000. It is preferable that the weight average molecular weight is 500,000 or less from the viewpoint of improving the resolution and developability. The weight average molecular weight is more preferably 100,000 or less, further preferably 60,000 or less, and particularly preferably 50,000 or less. On the other hand, setting the weight average molecular weight to 5,000 or more is a viewpoint of controlling the properties of the developed agglomerates and the properties of the unexposed film such as edge fuse properties and cut chip properties in the case of a photosensitive resin laminate. Is preferable. The weight average molecular weight is more preferably 10,000 or more, further preferably 20,000 or more, and particularly preferably 30,000 or more. The edge fuse property refers to the degree to which the photosensitive resin layer easily protrudes from the end face of the roll when the photosensitive transfer member is wound into a roll. The cut chip property refers to the degree of ease with which the chip flies when the unexposed film is cut with a cutter. If this chip adheres to the upper surface of the photosensitive resin laminate or the like, it will be transferred to the mask in a later exposure process or the like, causing a defective product. The dispersity of the polymer A is preferably 1.0 to 6.0, more preferably 1.0 to 5.0, and even more preferably 1.0 to 4.0. It is more preferably 0.0 to 3.0. In the present disclosure, the molecular weight is a value measured using gel permeation chromatography. The degree of dispersion is the ratio of the weight average molecular weight to the number average molecular weight (weight average molecular weight / number average molecular weight).

The photosensitive resin layer may contain a monomer component having an aromatic hydrocarbon group as the polymer A from the viewpoint of suppressing line width thickening and deterioration of resolution when the focal position is deviated during exposure. preferable. Examples of such an aromatic hydrocarbon group include a substituted or unsubstituted phenyl group and a substituted or unsubstituted aralkyl group. The content ratio of the monomer component having an aromatic hydrocarbon group in the polymer A is preferably 20% by mass or more, preferably 30% by mass or more, based on the total mass of all the monomer components. More preferably, it is more preferably 40% by mass or more, particularly preferably 45% by mass or more, and most preferably 50% by mass or more. The upper limit is not particularly limited, but is preferably 95% by mass or less, and more preferably 85% by mass or less. When a plurality of types of the polymer A were contained, the content ratio of the monomer component having an aromatic hydrocarbon group was determined as a weight average value.

Examples of the monomer having an aromatic hydrocarbon group include a monomer having an aralkyl group, styrene, and a polymerizable styrene derivative (for example, methyl styrene, vinyl toluene, tert-butoxy styrene, acetoxy styrene, 4-vinyl). Benzoic acid, styrene dimer, styrene trimer, etc.). Of these, a monomer having an aralkyl group or styrene is preferable. In one embodiment, when the monomer component having an aromatic hydrocarbon group in the polymer A is styrene, the content ratio of the styrene monomer component is 20% by mass based on the total mass of all the monomer components. It is preferably ~ 50% by mass, more preferably 25% by mass to 45% by mass, further preferably 30% by mass to 40% by mass, and particularly preferably 30% by mass to 35% by mass. preferable.

Examples of the aralkyl group include a substituted or unsubstituted phenylalkyl group (excluding a benzyl group), a substituted or unsubstituted benzyl group and the like, and a substituted or unsubstituted benzyl group is preferable.

Examples of the monomer having a phenylalkyl group include phenylethyl (meth) acrylate and the like.

Examples of the monomer having a benzyl group include (meth) acrylate having a benzyl group, for example, benzyl (meth) acrylate, chlorobenzyl (meth) acrylate, etc .; vinyl monomer having a benzyl group, for example, vinylbenzyl chloride, vinylbenzyl. Examples include alcohol. Of these, benzyl (meth) acrylate is preferable. In one embodiment, when the monomer component having an aromatic hydrocarbon group in the polymer A is benzyl (meth) acrylate, the content ratio of the benzyl (meth) acrylate monomer component is the total of all the monomer components. Based on the mass, it is preferably 50% by mass to 95% by mass, more preferably 60% by mass to 90% by mass, further preferably 70% by mass to 90% by mass, and 75% by mass to 75% by mass. It is particularly preferably 90% by mass.

The polymer A containing a monomer component having an aromatic hydrocarbon group includes a monomer having an aromatic hydrocarbon group, at least one of the first monomers described later, and / or a second polymer described later. It is preferably obtained by polymerizing at least one of the monomers of.

The polymer A containing no monomer component having an aromatic hydrocarbon group is preferably obtained by polymerizing at least one of the first monomers described later, and at least the first monomer. It is more preferable to obtain it by copolymerizing one kind with at least one kind of the second monomer described later.

The first monomer is a monomer having a carboxyl group in the molecule. Examples of the first monomer include (meth) acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, 4-vinylbenzoic acid, maleic anhydride, maleic acid semiester and the like. Among these, (meth) acrylic acid is preferable.
The content ratio of the first monomer in the polymer A is preferably 5% by mass to 50% by mass, preferably 10% by mass to 40% by mass, based on the total mass of all the monomer components. Is more preferable, and 15% by mass to 30% by mass is further preferable.

In the present specification, "(meth) acrylic acid" means acrylic acid or methacrylic acid, and "(meth) acryloyl group" means an acryloyl group or methacrylic acid group, and "(meth) acrylate". "" Means "acrylate" or "methacrylate".

The copolymerization ratio of the first monomer is preferably 10% by mass to 50% by mass based on the total mass of all the monomer components. The copolymerization ratio of 10% by mass or more is preferable from the viewpoint of exhibiting good developability and controlling edge fuseability, more preferably 15% by mass or more, still more preferably 20% by mass or more. .. It is preferable that the copolymerization ratio is 50% by mass or less from the viewpoint of high resolution of the resist pattern and the shape of the resist pattern, and further from the viewpoint of chemical resistance of the resist pattern, and from these viewpoints, 35% by mass. The following is more preferable, 30% by mass or less is further preferable, and 27% by mass or less is particularly preferable.

The second monomer is a monomer that is non-acidic and has at least one polymerizable unsaturated group in the molecule. Examples of the second monomer include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, and isobutyl (meth) acrylate. , Tart-butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and other (meth) acrylates; vinyl acetate Such as vinyl alcohol esters; as well as (meth) acrylonitrile and the like. Of these, methyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and n-butyl (meth) acrylate are preferable, and methyl (meth) acrylate is particularly preferable.
The content ratio of the second monomer in the polymer A is preferably 5% by mass to 60% by mass, preferably 15% by mass to 50% by mass, based on the total mass of all the monomer components. Is more preferable, and 20% by mass to 45% by mass is further preferable.

It is preferable to contain a monomer having an aralkyl group and / or styrene as a monomer from the viewpoint of suppressing line width thickening and deterioration of resolution when the focal position is deviated during exposure. For example, a copolymer containing methacrylic acid, benzyl methacrylate and styrene, a copolymer containing methacrylic acid, methyl methacrylate, benzyl methacrylate and styrene and the like are preferable.
In one embodiment, the polymer A contains 25% by mass to 40% by mass of a monomer component having an aromatic hydrocarbon group, 20% by mass to 35% by mass of the first monomer component, and a second single amount. It is preferably a polymer containing 30% by mass to 45% by mass of a body component. In another embodiment, the polymer preferably contains 70% by mass to 90% by mass of a monomer component having an aromatic hydrocarbon group and 10% by mass to 25% by mass of the first monomer component. ..

The polymer A may have any of a linear structure, a branched structure, and an alicyclic structure in the side chain. By using a monomer containing a group having a branched structure in the side chain or a monomer containing a group having an alicyclic structure in the side chain, a branched structure or an alicyclic structure can be introduced into the side chain of the polymer A. .. The group having an alicyclic structure may be monocyclic or polycyclic.

Specific examples of the monomer containing a group having a branched structure in the side chain include isopropyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, and ( Isoamyl (meth) acrylate, tert-amyl (meth) acrylate, sec-amyl (meth) acrylate, 2-octyl (meth) acrylate, 3-octyl (meth) acrylate and tert-octyl (meth) acrylate. And so on. Among these, isopropyl (meth) acrylate, isobutyl (meth) acrylate, and tert-butyl methacrylate are preferable, and isopropyl methacrylate or tert-butyl methacrylate is more preferable.

Specific examples of the monomer containing a group having an alicyclic structure in the side chain include a monomer having a monocyclic aliphatic hydrocarbon group and a monomer having a polycyclic aliphatic hydrocarbon group. Further, (meth) acrylate having an alicyclic hydrocarbon group having 5 to 20 carbon atoms can be mentioned. More specific examples include (meth) acrylic acid (bicyclo [2.2.1] heptyl-2), (meth) acrylic acid-1-adamantyl, (meth) acrylic acid-2-adamantyl, (meth). -3-Methyl-1-adamantyl acrylate, -3,5-dimethyl-1-adamantyl (meth) acrylate, -3-ethyladamantyl (meth) acrylate, -3-methyl-5-methyl (meth) acrylate Ethyl-1-adamantyl, (meth) acrylic acid-3,5,8-triethyl-1-adamantyl, (meth) acrylic acid-3,5-dimethyl-8-ethyl-1-adamantyl, (meth) acrylic acid 2 -Methyl-2-adamantyl, 2-ethyl-2-adamantyl (meth) acrylate, 3-hydroxy-1-adamantyl (meth) acrylate, octahydro-4,7-mentanoindene (meth) acrylate-5- Il, Octahydro-4,7-mentanoinden-1-ylmethyl (meth) acrylate, -1-mentyl (meth) acrylate, tricyclodecane (meth) acrylate, -3-hydroxy- (meth) acrylate 2,6,6-trimethyl-bicyclo [3.1.1] heptyl, (meth) acrylic acid-3,7,7-trimethyl-4-hydroxy-bicyclo [4.1.0] heptyl, (meth) acrylic Examples thereof include acid (nor) bornyl, (meth) acrylate isobornyl, (meth) acrylate fentyl, (meth) acrylate-2,2,5-trimethylcyclohexyl, and (meth) acrylate cyclohexyl. Among these (meth) acrylic acid esters, (meth) acrylic acid cyclohexyl, (meth) acrylic acid (nor) boronyl, (meth) acrylic acid isobornyl, (meth) acrylic acid-1-adamantyl, (meth) acrylic acid -2-adamantyl, fentyl (meth) acrylate, 1-mentyl (meth) acrylate, or tricyclodecane (meth) acrylate is preferred, cyclohexyl (meth) acrylate, (nor) bornyl, (meth) acrylate, More preferred are isobornyl (meth) acrylate, -2-adamantyl (meth) acrylate, or tricyclodecane (meth) acrylate.

The polymer A can be used alone or in combination of two or more. When two or more types are mixed and used, two types of polymer A containing a monomer component having an aromatic hydrocarbon group may be mixed and used, or a monomer component having an aromatic hydrocarbon group may be used. It is preferable to mix and use the polymer A containing the polymer A and the polymer A containing no monomer component having an aromatic hydrocarbon group. In the latter case, the ratio of the polymer A containing the monomer component having an aromatic hydrocarbon group to the total amount of the polymer A is preferably 50% by mass or more, preferably 70% by mass or more. More preferably, it is more preferably 80% by mass or more, and more preferably 90% by mass or more.

In the synthesis of polymer A, a radical polymerization initiator such as benzoyl peroxide or azoisobutyronitrile is prepared by diluting the one or more monomers described above with a solvent such as acetone, methyl ethyl ketone or isopropanol. Is preferably added in an appropriate amount and heated and stirred. In some cases, the synthesis is carried out while dropping a part of the mixture into the reaction solution. After completion of the reaction, a solvent may be further added to adjust the concentration to a desired level. As the synthesis means, bulk polymerization, suspension polymerization, or emulsion polymerization may be used in addition to solution polymerization.

The glass transition temperature Tg of the polymer A is preferably 30 ° C. or higher and 135 ° C. or lower. By using the polymer A having a Tg of 135 ° C. or lower in the photosensitive resin layer, it is possible to suppress the line width thickening and the deterioration of the resolution when the focal position at the time of exposure is deviated. From this viewpoint, the Tg of the polymer A is more preferably 130 ° C. or lower, further preferably 120 ° C. or lower, and particularly preferably 110 ° C. or lower. Further, it is preferable to use the polymer A having a Tg of 30 ° C. or higher from the viewpoint of improving the edge fuse resistance. From this viewpoint, the Tg of the polymer A is more preferably 40 ° C. or higher, further preferably 50 ° C. or higher, particularly preferably 60 ° C. or higher, and most preferably 70 ° C. or higher. ..

The photosensitive resin layer may contain a resin other than the polymer A.
Resins other than polymer A include acrylic resins, styrene-acrylic copolymers (however, those having a styrene content of 40% by mass or less), polyurethane resins, polyvinyl alcohols, polyvinyl formal, polyamide resins, polyester resins, and polyamides. Examples thereof include resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimines, polyallylamines, and polyalkylene glycols.

The binder polymer may be used alone or in combination of two or more.
The ratio of the binder polymer to the total mass of the photosensitive resin layer is preferably in the range of 10% by mass to 90% by mass, more preferably 30% by mass to 70% by mass, and further preferably 40% by mass to 60% by mass. It is mass%. It is preferable that the ratio of the binder polymer to the photosensitive resin layer is 90% by mass or less from the viewpoint of controlling the developing time. On the other hand, it is preferable that the ratio of the binder polymer to the photosensitive resin layer is 10% by mass or more from the viewpoint of improving the edge fuse resistance.

(Polymerizable compound)
The photosensitive resin layer preferably contains a polymerizable compound.
As used herein, the term "polymerizable compound" means a compound that polymerizes under the action of a polymerization initiator, which will be described later, and is different from the binder polymer described above.

As the polymerizable compound, an ethylenically unsaturated compound is preferable.
The ethylenically unsaturated compound is a component that contributes to the photosensitivity (that is, photocurability) of the negative photosensitive resin layer and the strength of the cured film.
The ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups.
The photosensitive resin layer preferably contains a bifunctional or higher functional ethylenically unsaturated compound as the ethylenically unsaturated compound.
Here, the bifunctional or higher functional ethylenically unsaturated compound means a compound having two or more ethylenically unsaturated groups in one molecule.
As the ethylenically unsaturated group, a (meth) acryloyl group is more preferable.
As the ethylenically unsaturated compound, a (meth) acrylate compound is preferable.

The photosensitive resin layer preferably contains a polymerizable compound having a polymerizable group.
The polymerizable group contained in the polymerizable compound is not particularly limited as long as it is a group involved in the polymerization reaction, and has, for example, an ethylenically unsaturated group such as a vinyl group, an acryloyl group, a methacryloyl group, a styryl group and a maleimide group. Groups; and groups having a cationically polymerizable group such as an epoxy group and an oxetane group can be mentioned.
As the polymerizable group, a group having an ethylenically unsaturated group is preferable, and an acryloyl group or a metaacryloyl group is more preferable.

As the polymerizable compound, a compound having one or more ethylenically unsaturated groups (ethylenically unsaturated compound) is preferable, and two or more ethylenes in one molecule are preferable because the photosensitive resin layer has more excellent photosensitivity. A compound having a sex unsaturated group (polyfunctional ethylenically unsaturated compound) is more preferable.
Further, the number of ethylenically unsaturated groups contained in one molecule of the ethylenically unsaturated compound is preferably 6 or less, more preferably 3 or less, and 2 or less in terms of excellent resolution and peelability. More preferred.

The photosensitive resin layer is bifunctional or trifunctional having two or three ethylenically unsaturated groups in one molecule in that the photosensitive resin layer has a better balance of photosensitivity, resolution and peelability. It is preferable to contain an ethylenically unsaturated compound, and more preferably to contain a bifunctional ethylenically unsaturated compound having two ethylenically unsaturated groups in one molecule.
The content of the bifunctional ethylenically unsaturated compound in the photosensitive resin layer with respect to the content of the polymerizable compound is preferably 60% by mass or more, more preferably more than 70% by mass, and more preferably 90% by mass from the viewpoint of excellent peelability. The above is more preferable. The upper limit is not particularly limited and may be 100% by mass. That is, all the polymerizable compounds contained in the photosensitive resin layer may be bifunctional ethylenically unsaturated compounds.
Further, as the ethylenically unsaturated compound, a (meth) acrylate compound having a (meth) acryloyl group as a polymerizable group is preferable.

-Polymerizable compound B1-
The photosensitive resin layer preferably contains a polymerizable compound B1 having an aromatic ring and two ethylenically unsaturated groups. The polymerizable compound B1 is a bifunctional ethylenically unsaturated compound having one or more aromatic rings in one molecule among the above-mentioned polymerizable compounds.

The mass ratio of the content of the polymerizable compound B1 to the content of the polymerizable compound in the photosensitive resin layer is preferably 40% by mass or more, preferably 50% by mass or more, from the viewpoint of better resolution. More preferably, it is more preferably 55% by mass or more, and particularly preferably 60% by mass or more. The upper limit is not particularly limited, but from the viewpoint of peelability, 99% by mass or less is preferable, 95% by mass or less is more preferable, 90% by mass or less is further preferable, and 85% by mass or less is particularly preferable.

Examples of the aromatic ring contained in the polymerizable compound B1 include aromatic hydrocarbon rings such as benzene ring, naphthalene ring and anthracene ring, thiophene ring, furan ring, pyrrole ring, imidazole ring, triazole ring and pyridine ring. Heterocycles and fused rings thereof are mentioned, and aromatic hydrocarbon rings are preferable, and benzene rings are more preferable. The aromatic ring may have a substituent.
The polymerizable compound B1 may have only one aromatic ring, or may have two or more aromatic rings.

The polymerizable compound B1 preferably has a bisphenol structure from the viewpoint of improving the resolution by suppressing the swelling of the photosensitive resin layer due to the developing solution.
Examples of the bisphenol structure include a bisphenol A structure derived from bisphenol A (2,2-bis (4-hydroxyphenyl) propane) and a bisphenol derived from bisphenol F (2,2-bis (4-hydroxyphenyl) methane). Examples thereof include an F structure and a bisphenol B structure derived from bisphenol B (2,2-bis (4-hydroxyphenyl) butane), and a bisphenol A structure is preferable.

Examples of the polymerizable compound B1 having a bisphenol structure include a compound having a bisphenol structure and two polymerizable groups (preferably (meth) acryloyl groups) bonded to both ends of the bisphenol structure.
Both ends of the bisphenol structure and the two polymerizable groups may be directly bonded or may be bonded via one or more alkyleneoxy groups. As the alkyleneoxy group added to both ends of the bisphenol structure, an ethyleneoxy group or a propyleneoxy group is preferable, and an ethyleneoxy group is more preferable. The number of alkyleneoxy groups added to the bisphenol structure is not particularly limited, but 4 to 16 per molecule is preferable, and 6 to 14 is more preferable.
The polymerizable compound B1 having a bisphenol structure is described in paragraphs 0072 to 0080 of JP-A-2016-224162, and the contents described in this publication are incorporated in the present specification.

As the polymerizable compound B1, a bifunctional ethylenically unsaturated compound having a bisphenol A structure is preferable, and 2,2-bis (4-((meth) acryloxypolyalkoxy) phenyl) propane is more preferable.
Examples of the 2,2-bis (4-((meth) acryloxipolyalkoxy) phenyl) propane include 2,2-bis (4- (methacryloxydiethoxy) phenyl) propane (FA-324M, Hitachi Chemical Co., Ltd.). Co., Ltd.), 2,2-bis (4- (methacryloxyethoxypropoxy) phenyl) propane, 2,2-bis (4- (methacryloxypentaethoxy) phenyl) propane (BPE-500, Shin-Nakamura Chemical Industry Co., Ltd.) (Manufactured by Co., Ltd.), 2,2-bis (4- (methacryloxidodecaethoxytetrapropoxy) phenyl) propane (FA-3200MY, manufactured by Hitachi Kasei Co., Ltd.), 2,2-bis (4- (methacryloxypentadeca) Ethoxy) phenyl) propane (BPE-1300, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 2,2-bis (4- (methacryloxydiethoxy) phenyl) propane (BPE-200, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) ), And ethoxylated (10) bisphenol A diacrylate (NK ester A-BPE-10, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.).

The polymerizable compound B1 has the following general formula (I):

{In the equation, R ₁ and R ₂ independently represent a hydrogen atom or a methyl group, A is C ₂ H ₄ , B is C ₃ H ₆ , and n ₁ and n ₃ are independent, respectively. An integer of 1 to 39, n ₁ + n ₃ _{is an integer of 2 to 40, n 2 and n 4} are independently integers of 0 to 29, and n 2 + n 4 is an integer of 0 to 30. The sequence of repeating units of-(AO)-and-(BO)-may be random or block. In the case of a block, either − (A—O) − or − (BO) − may be on the bisphenyl group side. }
The compound represented by can be used.
In one aspect, n ₁ + n ₂ + n ₃ + n ₄ is preferably 2 to 20, more preferably 2 to 16, and even more preferably 4 to 12. Further, n ₂ + n ₄ is preferably 0 to 10, more preferably 0 to 4, further preferably 0 to 2, and particularly preferably 0.

The polymerizable compound B1 may be used alone or in combination of two or more.
The content of the polymerizable compound B1 in the photosensitive resin layer is preferably 10% by mass or more, more preferably 20% by mass or more, based on the total mass of the photosensitive resin layer, from the viewpoint of more excellent resolution. The upper limit is not particularly limited, but is preferably 70% by mass or less, more preferably 60% by mass or less, from the viewpoint of transferability and edge fusion (a phenomenon in which the photosensitive resin exudes from the end of the transfer member).

The photosensitive resin layer may contain a polymerizable compound other than the above-mentioned polymerizable compound B1.
The polymerizable compound other than the polymerizable compound B1 is not particularly limited, and can be appropriately selected from known compounds. For example, a compound having one ethylenically unsaturated group in one molecule (monofunctional ethylenically unsaturated compound), a bifunctional ethylenically unsaturated compound having no aromatic ring, and a trifunctional or higher ethylenically unsaturated compound. Examples include compounds.

Examples of the monofunctional ethylenically unsaturated compound include ethyl (meth) acrylate, ethylhexyl (meth) acrylate, 2- (meth) acryloyloxyethyl succinate, polyethylene glycol mono (meth) acrylate, and polypropylene glycol mono (meth) acrylate. , And phenoxyethyl (meth) acrylate.

Examples of the bifunctional ethylenically unsaturated compound having no aromatic ring include alkylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, urethane di (meth) acrylate, and trimethylolpropane diacrylate. Be done.
Examples of the alkylene glycol di (meth) acrylate include tricyclodecanedimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and tricyclodecanedimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.). ), 1,9-Nonandiol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) ), Ethylene glycol dimethacrylate, 1,10-decanediol diacrylate, and neopentyl glycol di (meth) acrylate.
Examples of the polyalkylene glycol di (meth) acrylate include polyethylene glycol di (meth) acrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, and polypropylene glycol di (meth) acrylate.
Examples of the urethane di (meth) acrylate include propylene oxide-modified urethane di (meth) acrylate, and ethylene oxide and propylene oxide-modified urethane di (meth) acrylate. 8UX-015A (manufactured by Taisei Fine Chemical Industry Co., Ltd.), UA-32P (manufactured by Shin Nakamura Chemical Industry Co., Ltd.), and UA-1100H (manufactured by Shin Nakamura Chemical Industry Co., Ltd.) Can be mentioned.

Examples of the trifunctional or higher functional ethylenically unsaturated compound include dipentaerythritol (tri / tetra / penta / hexa) (meth) acrylate, pentaerythritol (tri / tetra) (meth) acrylate, and trimethylolpropane tri (meth). Acrylate, ditrimethylolpropane tetra (meth) acrylate, trimethylolethane ethanetri (meth)
Examples thereof include acrylates, tri (meth) acrylates of isocyanuric acid, glycerin tri (meth) acrylates, and modified alkylene oxides thereof.
Here, "(tri / tetra / penta / hexa) (meth) acrylate" is a concept including tri (meth) acrylate, tetra (meth) acrylate, penta (meth) acrylate, and hexa (meth) acrylate. , "(Tri / tetra) (meth) acrylate" is a concept that includes tri (meth) acrylate and tetra (meth) acrylate. In one embodiment, the photosensitive resin layer preferably contains the above-mentioned polymerizable compound B1 and a trifunctional or higher ethylenically unsaturated compound, and the above-mentioned polymerizable compound B1 and two or more trifunctional or higher ethylenically unsaturated compounds. More preferably, it contains a saturated compound. In this case, the mass ratio of the polymerizable compound B1 to the trifunctional or higher ethylenically unsaturated compound is (total mass of the polymerizable compound B1): (total mass of the trifunctional or higher ethylenically unsaturated compound) = 1: 1. It is preferably ~ 5: 1, more preferably 1.2: 1 to 4: 1, and even more preferably 1.5: 1 to 3: 1.
Further, in one embodiment, the photosensitive resin layer preferably contains the above-mentioned polymerizable compound B1 and two or more trifunctional ethylenically unsaturated compounds.

Examples of the alkylene oxide-modified product of the trifunctional or higher-functional ethylenically unsaturated compound include caprolactone-modified (meth) acrylate compound (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd. and A manufactured by Shin-Nakamura Chemical Industry Co., Ltd.). -9300-1CL, etc.), alkylene oxide-modified (meth) acrylate compound (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E and A-9300 manufactured by Shin-Nakamura Chemical Industry Co., Ltd., EBECRYL manufactured by Daicel Ornex Co., Ltd. (Registered trademark) 135, etc.), ethoxylated glycerin triacrylate (A-GLY-9E, etc. manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), Aronix (registered trademark) TO-2349 (manufactured by Toa Synthetic Co., Ltd.), Aronix M- 520 (manufactured by Toa Synthetic Co., Ltd.) and Aronix M-510 (manufactured by Toa Synthetic Co., Ltd.) can be mentioned.

Further, as the polymerizable compound other than the polymerizable compound B1, the polymerizable compound having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942 may be used.

The value of the ratio Mm / Mb of the content Mm of the polymerizable compound and the content Mb of the binder polymer in the photosensitive resin layer is preferably 1.0 or less from the viewpoint of resolution and linearity, and is 0. It is more preferably 9.9 or less, and particularly preferably 0.5 or more and 0.9 or less.
Further, the polymerizable compound in the photosensitive resin layer preferably contains a (meth) acrylic compound from the viewpoint of curability and resolvability.
Further, the polymerizable compound in the photosensitive resin layer contains a (meth) acrylic compound from the viewpoint of curability, resolution and linearity, and the total mass of the (meth) acrylic compound contained in the photosensitive resin layer. The content of the acrylic compound with respect to the above is more preferably 60% by mass or less. The lower limit of the content of the acrylic compound is not particularly limited, and is, for example, 0.1% by mass.

The polymerizable compound may be used alone or in combination of two or more.
The content of the polymerizable compound in the photosensitive resin layer is preferably 10% by mass to 70% by mass, more preferably 20% by mass to 60% by mass, and 20% by mass to 50% by mass with respect to the total mass of the photosensitive resin layer. % Is more preferable.

The weight average molecular weight (Mw) of the polymerizable compound containing the polymerizable compound B1 is preferably 200 to 3,000, more preferably 280 to 2,200, and even more preferably 300 to 2,200.

(Other ingredients)
The photosensitive resin layer may contain components other than the binder polymer and the polymerizable compound.

-Photopolymerization initiator-
The photosensitive resin layer preferably contains a photopolymerization initiator.
The photopolymerization initiator is a compound that initiates the polymerization of a polymerizable compound by receiving active light such as ultraviolet rays, visible light, and X-rays. The photopolymerization initiator is not particularly limited, and a known photopolymerization initiator can be used.
Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferable.

Examples of the photoradical polymerization initiator include a photopolymerization initiator having an oxime ester structure, a photopolymerization initiator having an α-aminoalkylphenone structure, a photopolymerization initiator having an α-hydroxyalkylphenone structure, and an acylphosphine oxide. Examples thereof include a photopolymerization initiator having a structure and a photopolymerization initiator having an N-phenylglycine structure.

Further, the photosensitive resin layer contains 2,4,5-triarylimidazole dimer and 2,4,5-triarylimidazole dimer as a photoradical polymerization initiator from the viewpoints of photosensitivity, visibility of exposed and non-exposed areas, and resolution. It is preferable to contain at least one selected from the group consisting of the derivatives. The two 2,4,5-triarylimidazole structures in the 2,4,5-triarylimidazole dimer and its derivatives may be the same or different.
Derivatives of the 2,4,5-triarylimidazole dimer include, for example, 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di. (Methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, and 2 -(P-Methenylphenyl) -4,5-diphenylimidazole dimer can be mentioned.

As the photoradical polymerization initiator, for example, the polymerization initiator described in paragraphs 0031 to 0042 of JP2011-95716A and paragraphs 0064 to 0081 of JP2015-14783 may be used.

Examples of the photoradical polymerization initiator include ethyl dimethylaminobenzoate (DBE, CAS No. 10287-53-3), benzoin methyl ether, anisyl (p, p'-dimethoxybenzyl), and TAZ-110 (trade name:). Midori Kagaku Co., Ltd., Benzoinone, TAZ-111 (trade name: Midori Kagaku Co., Ltd.), IrgacureOXE01, OXE02, OXE03, OXE04 (BASF), Omnirad 651 and 369 (trade name: IGM Resins B.V.) , And 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Tokyo Kasei Kogyo Co., Ltd.) Be done.

Examples of commercially available photoradical polymerization initiators include 1- [4- (phenylthio) phenyl] -1,2-octanedione-2- (O-benzoyloxime) (trade name: IRGACURE (registered trademark) OXE-. 01, manufactured by BASF), 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl] etanone-1- (O-acetyloxime) (trade name: IRGACURE OXE-02, BASF), IRGACURE OXE-03 (BASF), 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone (Product name: Omnirad 379EG, IGM Resins BV), 2-Methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one (Product name: Omnirad 907, IGM Resins BV) , 2-Hydroxy-1- {4- [4- (2-hydroxy-2-methylpropionyl) benzyl] phenyl} -2-methylpropan-1-one (trade name: Omnirad 127, IGM Resins B. V.), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1 (trade name: Omnirad 369, IGM Resins B.V.), 2-hydroxy-2-methyl- 1-Phenylpropan-1-one (trade name: Omnirad 1173, manufactured by IGM Resins VV), 1-hydroxycyclohexylphenylketone (trade name: Omnirad 184, manufactured by IGM Resins VV), 2,2- Dimethoxy-1,2-diphenylethane-1-one (trade name: Omnirad 651, manufactured by IGM Resins VV), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: Omnirad TPO H,) IGM Resins B.V.), Bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (trade name: Omnirad 819, IGM Resins B.V.), Oxime ester-based photopolymerization initiator ( Product name: Lunar 6, manufactured by DKSH Japan Co., Ltd., 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetraphenylbisimidazole (2- (2-chlorophenyl) -4) , 5-Diphenylimidazole dimer ) (Product name: B-CIM, manufactured by Hampford) and 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer (trade name: BCTB, manufactured by Tokyo Chemical Industry Co., Ltd.). ..

In addition, 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetraphenylbisimidazole (2- (2-chlorophenyl) -4,5-diphenylimidazole dimer) is (2. Product name: B-IMD, manufactured by Kurokin Kasei Co., Ltd.) can also be used.

In the present specification, 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetraphenylbisimidazole (2- (2-chlorophenyl) -4,5-diphenylimidazole dimer is used. , B-CIM, or B-IMD.

A photocationic polymerization initiator (photoacid generator) is a compound that generates an acid by receiving active light. As the photocationic polymerization initiator, a compound that is sensitive to active light having a wavelength of 300 nm or more, preferably a wavelength of 300 to 450 nm and generates an acid is preferable, but its chemical structure is not limited. In addition, a photocationic polymerization initiator that is not directly sensitive to active light with a wavelength of 300 nm or more is also a sensitizer if it is a compound that is sensitive to active light with a wavelength of 300 nm or more and generates an acid when used in combination with a sensitizer. Can be preferably used in combination with.
As the photocationic polymerization initiator, a photocationic polymerization initiator that generates an acid having a pKa of 4 or less is preferable, a photocationic polymerization initiator that generates an acid having a pKa of 3 or less is more preferable, and an acid having a pKa of 2 or less is used. The generated photocationic polymerization initiator is particularly preferred. The lower limit of pKa is not particularly defined, but is preferably -10.0 or higher, for example.

Examples of the photocationic polymerization initiator include an ionic photocationic polymerization initiator and a nonionic photocationic polymerization initiator.
Examples of the ionic photocationic polymerization initiator include onium salt compounds such as diaryliodonium salts and triarylsulfonium salts, and quaternary ammonium salts.
As the ionic photocationic polymerization initiator, the ionic photocationic polymerization initiator described in paragraphs 0114 to 0133 of JP-A-2014-85643 may be used.

Examples of the nonionic photocationic polymerization initiator include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. As the trichloromethyl-s-triazines, the diazomethane compound and the imide sulfonate compound, the compounds described in paragraphs 0083 to 0088 of JP2011-221494 may be used. Further, as the oxime sulfonate compound, the compounds described in paragraphs 0084 to 0088 of International Publication No. 2018/179640 may be used.

The photosensitive resin layer preferably contains a photoradical polymerization initiator, and more preferably contains at least one selected from the group consisting of 2,4,5-triarylimidazole dimers and derivatives thereof. ..

The photosensitive resin layer may contain one type of photopolymerization initiator alone or two or more types.
The content of the photopolymerization initiator in the photosensitive resin layer is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, based on the total mass of the photosensitive resin layer. It is more preferably 0% by mass or more. The upper limit is not particularly limited, but is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the photosensitive resin layer.

-Dye-
The photosensitive resin layer has a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 nm to 780 nm at the time of color development from the viewpoints of visibility of exposed and unexposed areas, pattern visibility after development, and resolution. Moreover, it is preferable to contain a dye (also simply referred to as "dye N") whose maximum absorption wavelength is changed by an acid, a base, or a radical. When the dye N is contained, the detailed mechanism is unknown, but the adhesion to the adjacent layer (for example, a temporary support and the intermediate layer) is improved, and the resolution is more excellent.

In the present specification, the term "the maximum absorption wavelength is changed by an acid, a base or a radical" means that the dye in a color-developing state is decolorized by an acid, a base or a radical, and the dye in a decolorized state is an acid. It may mean any aspect of a mode in which a color is developed by a base or a radical, or a mode in which a dye in a color-developing state changes to a color-developing state of another hue.
Specifically, the dye N may be a compound that changes from the decolorized state by exposure to develop a color, or may be a compound that changes from the decolorized state by exposure to decolorize. In this case, it may be a dye whose color development or decolorization state is changed by the acid, base or radical generated and acted in the photosensitive resin layer by exposure, and the state in the photosensitive resin layer by the acid, base or radical. It may be a dye whose color development or decolorization state changes by changing (for example, pH). Further, it may be a dye that changes the state of color development or decolorization by directly receiving an acid, a base or a radical as a stimulus without exposure.

Among them, from the viewpoint of visibility and resolution of the exposed and non-exposed areas, the dye N is preferably a dye whose maximum absorption wavelength is changed by an acid or a radical, and more preferably a dye whose maximum absorption wavelength is changed by a radical.
The photosensitive resin layer may contain both a dye whose maximum absorption wavelength is changed by radicals as dye N and a photoradical polymerization initiator from the viewpoint of visibility and resolution of exposed and unexposed parts. preferable.
Further, from the viewpoint of visibility of the exposed portion and the non-exposed portion, the dye N is preferably a dye that develops color by an acid, a base, or a radical.

As an example of the color development mechanism of the dye N in the present disclosure, a photoradical polymerization initiator, a photocationic polymerization initiator (photoacid generator) or a photobase generator is added to the photosensitive resin layer, and photoradical polymerization is carried out after exposure. Examples thereof include an embodiment in which a radical-reactive dye, an acid-reactive dye or a base-reactive dye (for example, a leuco dye) is colored by a radical, an acid or a base generated from an initiator, a photocationic polymerization initiator or a photobase generator.

From the viewpoint of visibility of the exposed and unexposed areas, the dye N preferably has a maximum absorption wavelength of 550 nm or more in the wavelength range of 400 nm to 780 nm at the time of color development, more preferably 550 nm to 700 nm. It is more preferably about 650 nm.
Further, the dye N may have only one maximum absorption wavelength in the wavelength range of 400 nm to 780 nm at the time of color development, or may have two or more. When the dye N has two or more maximum absorption wavelengths in the wavelength range of 400 nm to 780 nm at the time of color development, the maximum absorption wavelength having the highest absorbance among the two or more maximum absorption wavelengths may be 450 nm or more.

The maximum absorption wavelength of the dye N is transmitted by a solution containing the dye N (liquid temperature 25 ° C.) in the range of 400 nm to 780 nm using a spectrophotometer: UV3100 (manufactured by Shimadzu Corporation) in an atmospheric atmosphere. It is obtained by measuring the spectrum and detecting the wavelength at which the light intensity becomes the minimum (maximum absorption wavelength).

Examples of the dye that develops or decolorizes by exposure include leuco compounds.
Examples of dyes that are decolorized by exposure include leuco compounds, diarylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes and anthraquinone dyes.
As the dye N, a leuco compound is preferable from the viewpoint of visibility of the exposed portion and the non-exposed portion.

Examples of the leuco compound include a leuco compound having a triarylmethane skeleton (triarylmethane dye), a leuco compound having a spiropylan skeleton (spiropylan dye), a leuco compound having a fluorane skeleton (fluorane dye), and a diarylmethane skeleton. Leuco compounds (diarylmethane dyes), leuco compounds having a rhodamine lactam skeleton (rodamine lactam dyes), leuco compounds having an indolylphthalide skeleton (indolylphthalide dyes), and leukooramine skeletons. Examples thereof include leuco compounds having leuco compounds (leuco auramine dyes).
Among them, a triarylmethane dye or a fluorane dye is preferable, and a leuco compound having a triphenylmethane skeleton (triphenylmethane dye) or a fluorane dye is more preferable.

The leuco compound preferably has a lactone ring, a surujin ring, or a sultone ring from the viewpoint of visibility of the exposed portion and the non-exposed portion. As a result, the lactone ring, sultin ring, or sulton ring of the leuco compound is reacted with the radical generated from the photoradical polymerization initiator or the acid generated from the photocationic polymerization initiator to change the leuco compound into a ring-closed state. The color can be decolorized or the leuco compound can be changed to an open ring state to develop a color. The leuco compound preferably has a lactone ring, a sultone ring, or a sultone ring, and the lactone ring, the sultone ring, or the sultone ring is opened by a radical or an acid to develop a color. A compound in which the lactone ring is opened to develop color is more preferable.

Examples of the dye N include the following dyes and leuco compounds.
Specific examples of dyes among dyes N include brilliant green, ethyl violet, methyl green, crystal violet, basic fucsin, methyl violet 2B, quinaldine red, rose bengal, methanyl yellow, timol sulfophthalein, xylenol blue, and methyl. Orange, paramethyl red, congofred, benzopurpurin 4B, α-naphthyl red, nile blue 2B, nile blue A, methyl violet, malakite green, parafuxin, Victoria pure blue-naphthalene sulfonate, Victoria pure blue BOH Tsuchiya Chemical Industry Co., Ltd.), Oil Blue # 603 (manufactured by Orient Chemical Industry Co., Ltd.), Oil Pink # 312 (manufactured by Orient Chemical Industry Co., Ltd.), Oil Red 5B (manufactured by Orient Chemical Industry Co., Ltd.), Oil Scarlet # 308 (manufactured by Orient Chemical Industry Co., Ltd.), Oil Red OG (manufactured by Orient Chemical Industry Co., Ltd.), Oil Red RR (manufactured by Orient Chemical Industry Co., Ltd.), Oil Green # 502 (manufactured by Orient Chemical Industry Co., Ltd.) ), Spiron Red BEH Special (manufactured by Hodoya Chemical Industry Co., Ltd.), m-cresol purple, cresol red, rodamine B, rodamine 6G, sulfolodamine B, auramine, 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxy Anilino-4-p-diethylaminophenyliminonaphthoquinone, 2-carboxystearylamino-4-p-N, N-bis (hydroxyethyl) amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-p-diethylamino Examples thereof include phenylimino-5-pyrazolone and 1-β-naphthyl-4-p-diethylaminophenylimino-5-pyrazolone.

Specific examples of the leuco compound among the dyes N include p, p', p "-hexamethyltriaminotriphenylmethane (leucocrystal violet), Pergascript Blue SRB (manufactured by Ciba Geigy), crystal violet lactone, and malakite green lactone. Benzoyl leucomethylene blue, 2- (N-phenyl-N-methylamino) -6- (Np-tolyl-N-ethyl) aminofluorane, 2-anilino-3-methyl-6- (N-ethyl-p) -Truizino) fluorane, 3,6-dimethoxyfluorane, 3- (N, N-diethylamino) -5-methyl-7- (N, N-dibenzylamino) fluorane, 3- (N-cyclohexyl-N-methyl) Amino) -6-methyl-7-anilinofluorane, 3- (N, N-diethylamino) -6-methyl-7-anilinofluorane, 3- (N, N-diethylamino) -6-methyl-7 -Xylidinofluorane, 3- (N, N-diethylamino) -6-methyl-7-chlorofluorane, 3- (N, N-diethylamino) -6-methoxy-7-aminofluorane, 3- (N) , N-diethylamino) -7- (4-chloroanilino) fluorane, 3- (N, N-diethylamino) -7-chlorofluorane, 3- (N, N-diethylamino) -7-benzylaminofluorane, 3- (N, N-diethylamino) -7,8-benzofluorolane, 3- (N, N-dibutylamino) -6-methyl-7-anilinofluorane, 3- (N, N-dibutylamino) -6 -Methyl-7-xylidinofluorane, 3-piperidino-6-methyl-7-anilinofluorane, 3-pyrrolidino-6-methyl-7-anilinofluorane, 3,3-bis (1-ethyl-) 2-Methylindole-3-yl) phthalide, 3,3-bis (1-n-butyl-2-methylindole-3-yl) phthalide, 3,3-bis (p-dimethylaminophenyl) -6-dimethyl Aminophthalide, 3- (4-diethylamino-2-ethoxyphenyl) -3- (1-ethyl-2-methylindole-3-yl) -4-zaphthalide, 3- (4-diethylaminophenyl) -3-( 1-Ethyl-2-methylindol-3-yl) phthalide and 3', 6'-bis (diphenylamino) spirisobenzofuran-1 (3H), 9'-[9H] xanthen-3-one are mentioned. Be done.

The dye N is preferably a dye whose maximum absorption wavelength is changed by radicals from the viewpoints of visibility of exposed and unexposed areas, pattern visibility after development, and resolution, and is a dye that develops color by radicals. Is more preferable.
As the dye N, leuco crystal violet, crystal violet lactone, brilliant green, or Victoria pure blue-naphthalene sulfonate is preferable.

The dye N may be used alone or in combination of two or more.
The content of the dye N is 0.1% by mass or more with respect to the total mass of the photosensitive resin layer from the viewpoints of visibility of the exposed and non-exposed areas, pattern visibility after development, and resolution. Preferably, 0.1% by mass to 10% by mass is more preferable, 0.1% by mass to 5% by mass is further preferable, and 0.1% by mass to 1% by mass is particularly preferable.

The content of the dye N means the content of the dye when all of the dye N contained in the photosensitive resin layer is in a colored state. Hereinafter, a method for quantifying the content of dye N will be described by taking a dye that develops color by radicals as an example.
A solution prepared by dissolving 0.001 g and 0.01 g of the dye in 100 mL of methyl ethyl ketone is prepared. A photoradical polymerization initiator Irgacure OXE01 (trade name, BASF Japan Ltd.) was added to each of the obtained solutions, and radicals were generated by irradiating with light of 365 nm.
Brings all pigments into color. Then, in an atmospheric atmosphere, the absorbance of each solution having a liquid temperature of 25 ° C. is measured using a spectrophotometer (UV3100, manufactured by Shimadzu Corporation), and a calibration curve is prepared.
Next, the absorbance of the solution in which all the dyes are colored is measured by the same method as above except that 3 g of the photosensitive resin layer is dissolved in methyl ethyl ketone instead of the dye. From the absorbance of the obtained solution containing the photosensitive resin layer, the content of the dye contained in the photosensitive resin layer is calculated based on the calibration curve.

-Surfactant-
The photosensitive resin layer preferably contains a surfactant from the viewpoint of thickness uniformity.
Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic (nonionic) surfactants, and amphoteric surfactants, and nonionic surfactants are preferable.

Examples of the nonionic surfactant include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkylphenyl ethers, polyoxyethylene glycol higher fatty acid diesters, silicone-based nonionic surfactants, and fluorine-based nonionics. Examples include sex surfactants.

The photosensitive resin layer preferably contains a fluorine-based nonionic surfactant from the viewpoint of being more excellent in resolution. It is considered that the photosensitive resin layer contains a fluorine-based nonionic surfactant to suppress the penetration of the etching solution into the photosensitive resin layer and reduce the side etching.

Examples of commercially available fluorine-based nonionic surfactants include Megafuck F-551, F-552 and F-554 (all manufactured by DIC Corporation).

Commercially available products of fluorine-based surfactants include, for example, Megafuck F-171, F-172, F-173, F-176, F-177, F-141, F-142, F-143, F. -144, F-437, F-475, F-477, F-479, F-482, F-555-A, F-556, F-557, F-558, F-559, F-560, F -561, F-565, F-563, F-568, F-575, F-780, EXP, MFS-330, MFS-578, MFS-579, MFS-586, MFS-587, R-41, R -141-LM, R-01, R-40, R-40-LM, RS-43, TF-1956, RS-90, R-94, RS-72-K, DS-21 (above, DIC Corporation) Made),
Florard FC430, FC431, FC171 (all manufactured by Sumitomo 3M Ltd.), Surflon S-382, SC-101, SC-103, SC-104, SC-105, SC-1068, SC-381, SC-383, S-393, KH-40 (all manufactured by AGC Inc.),
PolyFox PF636, PF656, PF6320, PF6520, PF7002 (all manufactured by OMNOVA),
Footgent 710FL, 710FM, 610FM, 601AD, 601ADH2, 602A, 215M, 245F, 251, 212M, 250, 209F, 222F, 208G, 710LA, 710FS, 730LM, 650AC, 681, 683 (manufactured by NEOS Co., Ltd.) And so on.

Further, as a fluorine-based surfactant, an acrylic compound having a molecular structure having a functional group containing a fluorine atom, and when heat is applied, a portion of the functional group containing a fluorine atom is cut and the fluorine atom volatilizes. Can also be preferably used. Examples of such fluorine-based surfactants include Megafuck DS series manufactured by DIC Corporation (The Chemical Daily (February 22, 2016), Nikkei Sangyo Shimbun (February 23, 2016)), for example, Megafuck. DS-21 can be mentioned.

Further, as the fluorine-based surfactant, it is also preferable to use a polymer of a fluorine atom-containing vinyl ether compound having a fluorinated alkyl group or a fluorinated alkylene ether group and a hydrophilic vinyl ether compound.

A block polymer can also be used as the fluorine-based surfactant.

The fluorine-based surfactant has a structural unit derived from a (meth) acrylate compound having a fluorine atom and 2 or more (preferably 5 or more) alkyleneoxy groups (preferably ethyleneoxy groups and propyleneoxy groups). A fluorine-containing polymer compound containing a structural unit derived from a (meth) acrylate compound can also be preferably used.

Further, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated bond-containing group in the side chain can also be used. Megafvck RS-101, RS-102, RS-718K, RS-72-K (all manufactured by DIC Corporation) and the like can be mentioned.

As the fluorine-based surfactant, from the viewpoint of improving environmental suitability, compounds having a linear perfluoroalkyl group having 7 or more carbon atoms, such as perfluorooctanoic acid (PFOA) and perfluorooctanesulfonic acid (PFOS), are used. It is preferably a surfactant derived from an alternative material.

Nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane and their ethoxylates and propoxylates (eg, glycerol propoxylate, glycerol ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, etc. Polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, Pluronic L10, L31, L61, L62, 10R5, 17R2, 25R2 (or more) , BASF), Tetronic 304, 701, 704, 901, 904, 150R1 (above, BASF), Solsparse 20000 (above, Nippon Lubrizol Co., Ltd.), NCW-101, NCW-1001, NCW -1002 (above, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), Pionin D-6112, D-6112-W, D-6315 (above, manufactured by Takemoto Yushi Co., Ltd.), Orphine E1010, Surfinol 104, 400, 440 (above, manufactured by Nissin Chemical Industry Co., Ltd.) and the like can be mentioned.

Examples of the silicone-based surfactant include a linear polymer composed of a siloxane bond and a modified siloxane polymer in which an organic group is introduced into a side chain or a terminal.

Specific examples of silicone-based surfactants include DOWNSIL 8032 ADDITIVE, Torre Silicone DC3PA, Torre Silicone SH7PA, Torre Silicone DC11PA, Torre Silicone SH21PA, Torre Silicone SH28PA, Torre Silicone SH29PA, Torre Silicone SH30PA, Torre Silicone SH8400 (above, Toray). (Made by Dow Corning Co., Ltd.), X-22-4952, X-22-2272, X-22-6266, KF-351A, K354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-6191, X-22-4515, KF-6004, KP-341, KF-6001, KF-6002 (all manufactured by Shin-Etsu Silicone Co., Ltd.), F-4440, TSF-4300, TSF -4445, TSF-4460, TSF-4452 (above, manufactured by Momentive Performance Materials), BYK307, BYK323, BYK330 (above, manufactured by Big Chemie) and the like.

Examples of the surfactant include the surfactant described in paragraphs 0120 to 0125 of International Publication No. 2018/179640, the surfactant described in paragraph 0017 of Japanese Patent No. 45027884, and JP-A-2009-237362. The surfactants described in paragraphs 0060 to 0071 can also be used.

The photosensitive resin layer may contain one type of surfactant alone or two or more types.
The content of the surfactant is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass, based on the total mass of the photosensitive resin layer.

-Additive-
The photosensitive resin layer may contain a known additive in addition to the above components, if necessary.
Examples of the additive include a radical polymerization inhibitor, a sensitizer, a plasticizer, a heterocyclic compound, benzotriazoles, carboxybenzotriazoles, a resin other than polymer A, and a solvent. The photosensitive resin layer may contain each additive alone or in combination of two or more.

The photosensitive resin layer may contain a radical polymerization inhibitor.
Examples of the radical polymerization inhibitor include the thermal polymerization inhibitor described in paragraph 0018 of Japanese Patent No. 4502784. Of these, phenothiazine, phenothiazine or 4-methoxyphenol is preferable. Examples of other radical polymerization inhibitors include naphthylamine, cuprous chloride, nitrosophenylhydroxyamine aluminum salt, diphenylnitrosamine and the like. It is preferable to use a nitrosophenylhydroxyamine aluminum salt as a radical polymerization inhibitor so as not to impair the sensitivity of the photosensitive resin layer.

Examples of benzotriazoles include 1,2,3-benzotriazole, 1-chloro-1,2,3-benzotriazole, bis (N-2-ethylhexyl) aminomethylene-1,2,3-benzotriazole, and the like. Examples thereof include bis (N-2-ethylhexyl) aminomethylene-1,2,3-tolyltriazole and bis (N-2-hydroxyethyl) aminomethylene-1,2,3-benzotriazole.

Examples of carboxybenzotriazoles include 4-carboxy-1,2,3-benzotriazole, 5-carboxy-1,2,3-benzotriazole, and N- (N, N-di-2-ethylhexyl) aminomethylene. Examples thereof include carboxybenzotriazole, N- (N, N-di-2-hydroxyethyl) aminomethylene carboxybenzotriazole, N- (N, N-di-2-ethylhexyl) aminoethylene carboxybenzotriazole and the like. As the carboxybenzotriazoles, for example, a commercially available product such as CBT-1 (Johoku Chemical Industry Co., Ltd., trade name) can be used.

The total content of the radical polymerization inhibitor, benzotriazols, and carboxybenzotriazols is preferably 0.01% by mass to 3% by mass when the total mass of the photosensitive resin layer is 100% by mass. It is more preferably 0.05% by mass to 1% by mass. It is preferable that the content is 0.01% by mass or more from the viewpoint of imparting storage stability to the photosensitive resin layer. On the other hand, it is preferable to set the content to 3% by mass or less from the viewpoint of maintaining the sensitivity and suppressing the decolorization of the dye.

The photosensitive resin layer may contain a sensitizer.
The sensitizer is not particularly limited, and known sensitizers, dyes and pigments can be used. Examples of the sensitizer include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, acridone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, and triazole compounds (for example, 1,2,4-triazole), stillben compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoaclydin compounds.

The photosensitive resin layer may contain one kind of sensitizer alone or two or more kinds.
When the photosensitive resin layer contains a sensitizer, the content of the sensitizer can be appropriately selected depending on the purpose, but from the viewpoint of improving the sensitivity to the light source and improving the curing rate by balancing the polymerization rate and the chain movement. Therefore, 0.01% by mass to 5% by mass is preferable, and 0.05% by mass to 1% by mass is more preferable with respect to the total mass of the photosensitive resin layer.

The photosensitive resin layer may contain at least one selected from the group consisting of a plasticizer and a heterocyclic compound.
Examples of the plasticizer and the heterocyclic compound include the compounds described in paragraphs 097 to 0103 and 0111 to 0118 of International Publication No. 2018/179640.

The photosensitive resin layer may contain a solvent. When the photosensitive resin layer is formed by the photosensitive resin composition containing a solvent, the solvent may remain in the photosensitive resin layer.

The photosensitive resin layer includes metal oxide particles, antioxidants, dispersants, acid growth agents, development accelerators, conductive fibers, thermal radical polymerization initiators, thermal acid generators, ultraviolet absorbers, and thickeners. , Crosslinking agents, and known additives such as organic or inorganic precipitation inhibitors may be further contained.
Additives contained in the photosensitive resin layer are described in paragraphs 0165 to 0184 of JP-A-2014-85643, and the contents of this publication are incorporated in the present specification.

<Physical characteristics, etc.>
The layer thickness of the photosensitive resin layer is preferably 0.1 μm to 300 μm, more preferably 0.2 μm to 100 μm, further preferably 0.5 μm to 50 μm, further preferably 0.5 μm to 15 μm, and even more preferably 0.5 μm to 10 μm. Is particularly preferable, and 0.5 μm to 8 μm is most preferable. As a result, the developability of the photosensitive resin layer is improved, and the resolvability can be improved.
Further, in one embodiment, 0.5 μm to 5 μm is preferable, 0.5 μm to 4 μm is more preferable, and 0.5 μm to 3 μm is further preferable.
Further, the layer thickness of the photosensitive resin layer is preferably 10 μm or less, more preferably 8 μm or less, further preferably 6 μm or less, and particularly preferably 1 μm or more and 4 μm or less from the viewpoint of linearity.
The layer thickness of each layer included in the photosensitive transfer member is based on an observation image obtained by observing a cross section in a direction perpendicular to the main surface of the photosensitive transfer member with a scanning electron microscope (SEM). It is measured by measuring the thickness of each layer at 10 points or more and calculating the average value thereof.

Further, from the viewpoint of excellent adhesion, the transmittance of light having a wavelength of 365 nm in the photosensitive resin layer is preferably 10% or more, preferably 30% or more, and more preferably 50% or more. The upper limit is not particularly limited, but is preferably 99.9% or less.

<Formation method>
The method for forming the photosensitive resin layer is not particularly limited as long as it is a method capable of forming a layer containing the above components.
As a method for forming the photosensitive resin layer, for example, a photosensitive resin composition containing a binder polymer, a polymerizable compound, a solvent and the like is prepared, and the photosensitive resin composition is applied to the surface of a temporary support or the like to make the photosensitive resin layer photosensitive. Examples thereof include a method of forming by drying a coating film of a sex resin composition.

Examples of the photosensitive resin composition used for forming the photosensitive resin layer include a binder polymer, a polymerizable compound, and a composition containing the above-mentioned optional components and a solvent.
The photosensitive resin composition preferably contains a solvent in order to adjust the viscosity of the photosensitive resin composition and facilitate the formation of the photosensitive resin layer.

(solvent)
The solvent contained in the photosensitive resin composition is not particularly limited as long as the binder polymer, the polymerizable compound and the above optional components can be dissolved or dispersed, and known solvents can be used.
Examples of the solvent include an alkylene glycol ether solvent, an alkylene glycol ether acetate solvent, an alcohol solvent (methanol, ethanol, etc.), a ketone solvent (acetone, methyl ethyl ketone, etc.), an aromatic hydrocarbon solvent (toluene, etc.), and an aprotonic polar solvent. Examples thereof include (N, N-dimethylformamide, etc.), a cyclic ether solvent (tetrahydrofuran, etc.), an ester solvent, an amide solvent, a lactone solvent, and a mixed solvent containing two or more of these.
When producing a photosensitive transfer member including a temporary support, a thermoplastic resin layer, an intermediate layer and a photosensitive resin layer, the photosensitive resin composition is selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. It is preferable to contain at least one of them. Among them, a mixed solvent containing at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent and at least one selected from the group consisting of a ketone solvent and a cyclic ether solvent is more preferable. A mixed solvent containing at least one selected from the group consisting of a glycol ether solvent and an alkylene glycol ether acetate solvent, a ketone solvent, and at least three cyclic ether solvents is more preferable.

Examples of the alkylene glycol ether solvent include ethylene glycol monoalkyl ether, ethylene glycol dialkyl ether, propylene glycol monoalkyl ether, propylene glycol dialkyl ether, diethylene glycol dialkyl ether, dipropylene glycol monoalkyl ether and dipropylene glycol dialkyl ether. ..
Examples of the alkylene glycol ether acetate solvent include ethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate and dipropylene glycol monoalkyl ether acetate.
As the solvent, the solvent described in paragraphs 0092 to 0094 of International Publication No. 2018/179640 and the solvent described in paragraph 0014 of JP-A-2018-177789 may be used, and the contents thereof are described in the present specification. Incorporated into the book.

The photosensitive resin composition may contain one type of solvent alone, or may contain two or more types of solvent.
The content of the solvent when the photosensitive resin composition is applied is preferably 50 parts by mass to 1,900 parts by mass, preferably 100 parts by mass to 900 parts by mass with respect to 100 parts by mass of the total solid content in the photosensitive resin composition. The part is more preferable.

The method for preparing the photosensitive resin composition is not particularly limited. For example, a photosensitive resin composition is prepared by preparing a solution in which each component is dissolved in the above solvent in advance and mixing the obtained solution in a predetermined ratio. There is a method of preparing.
The photosensitive resin composition is preferably filtered using a filter having a pore size of 0.2 μm to 30 μm before forming the photosensitive resin layer.

The method for applying the photosensitive resin composition is not particularly limited, and the photosensitive resin composition may be applied by a known method. Examples of the coating method include slit coating, spin coating, curtain coating and inkjet coating.
Further, the photosensitive resin layer may be formed by applying the photosensitive resin composition on a cover film described later and drying it.

[Thermoplastic resin layer]
The photosensitive transfer member may include a thermoplastic resin layer.
The photosensitive transfer member preferably includes a thermoplastic resin layer between the temporary support and the photosensitive resin layer. By providing the thermoplastic resin layer between the temporary support and the photosensitive resin layer, the photosensitive transfer member improves the followability to the substrate in the bonding process with the substrate, and the substrate and the photosensitive transfer member This is because the mixing of air bubbles between the layers is suppressed and the adhesion to the adjacent layer (for example, a temporary support) is improved.

<Ingredients>
(Alkali-soluble resin)
The thermoplastic resin layer contains an alkali-soluble resin as the thermoplastic resin.
In the present specification, "alkali-soluble" means that the solubility of sodium carbonate in 100 g of a 1% by mass aqueous solution at 22 ° C. is 0.1 g or more.
Examples of the alkali-soluble resin include acrylic resin, polystyrene resin, styrene-acrylic copolymer, polyurethane resin, polyvinyl alcohol, polyvinyl formal, polyamide resin, polyester resin, polyamide resin, epoxy resin, polyacetal resin, and polyhydroxystyrene resin. Examples thereof include polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimines, polyallylamines and polyalkylene glycols.

As the alkali-soluble resin, an acrylic resin is preferable from the viewpoint of developability and adhesion to an adjacent layer.
Here, the acrylic resin was selected from the group consisting of a structural unit derived from (meth) acrylic acid, a structural unit derived from (meth) acrylic acid ester, and a structural unit derived from (meth) acrylic acid amide. It means a resin having at least one structural unit.
As the acrylic resin, the total content of the structural unit derived from (meth) acrylic acid, the structural unit derived from (meth) acrylic acid ester, and the structural unit derived from (meth) acrylic acid amide is the total content of the acrylic resin. It is preferably 50% by mass or more with respect to the total mass.
Above all, the total content of the structural unit derived from (meth) acrylic acid and the structural unit derived from (meth) acrylic acid ester is preferably 30% by mass to 100% by mass with respect to the total mass of the acrylic resin. , 50% by mass to 100% by mass, more preferably.

Further, the alkali-soluble resin is preferably a polymer having an acid group.
Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group and a phosphonic acid group, and a carboxy group is preferable.
From the viewpoint of developability, the alkali-soluble resin is more preferably an alkali-soluble resin having an acid value of 60 mgKOH / g or more, and further preferably a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more.
The upper limit of the acid value of the alkali-soluble resin is not particularly limited, but is preferably 200 mgKOH / g or less, and more preferably 150 mgKOH / g or less.

The carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more is not particularly limited, and can be appropriately selected from known resins and used.
For example, among the polymers described in paragraphs 0025 of JP2011-95716A, an alkali-soluble resin which is a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more, described in paragraphs 0033 to 0052 of JP2010-237589. Acrylic resin containing a carboxy group having an acid value of 60 mgKOH / g or more, and a carboxy group having an acid value of 60 mgKOH / g or more among the binder polymers described in paragraphs 0053 to 0068 of JP2016-224162A. Acrylic resin can be mentioned.
The copolymerization ratio of the structural unit having a carboxy group in the carboxy group-containing acrylic resin is preferably 5% by mass to 50% by mass, more preferably 10% by mass to 40% by mass, and 12 by mass, based on the total mass of the acrylic resin. More preferably, it is by mass% to 30% by mass.
As the alkali-soluble resin, an acrylic resin having a structural unit derived from (meth) acrylic acid is particularly preferable from the viewpoint of developability and adhesion to an adjacent layer.

The alkali-soluble resin may have a reactive group. The reactive group may be any addition-polymerizable group, and an ethylenically unsaturated group; a polycondensable group such as a hydroxy group and a carboxy group; a polyadditive reactive group such as an epoxy group and a (block) isocyanate group may be used. Can be mentioned.

The weight average molecular weight (Mw) of the alkali-soluble resin is preferably 1,000 or more, more preferably 10,000 to 100,000, and even more preferably 20,000 to 50,000.

The thermoplastic resin layer may contain one kind of alkali-soluble resin alone or two or more kinds.
The content of the alkali-soluble resin is preferably 10% by mass to 99% by mass, preferably 20% by mass to 90% by mass, based on the total mass of the thermoplastic resin layer from the viewpoint of developability and adhesion to the adjacent layer. Is more preferable, 40% by mass to 80% by mass is further preferable, and 50% by mass to 70% by mass is particularly preferable.

(Dye)
The thermoplastic resin layer contains a dye (also simply referred to as "dye B") having a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 nm to 780 nm at the time of color development and whose maximum absorption wavelength is changed by an acid, a base, or a radical. It is preferable to do so.
The preferred embodiment of the dye B is the same as the preferred embodiment of the dye N except for the points described later.

The dye B is preferably a dye whose maximum absorption wavelength is changed by an acid or radical, and more preferably a dye whose maximum absorption wavelength is changed by an acid, from the viewpoint of visibility and resolution of exposed and unexposed areas. ..
From the viewpoint of visibility and resolution of the exposed and unexposed areas, the thermoplastic layer contains both a dye whose maximum absorption wavelength changes depending on the acid as the dye B and a compound that generates an acid by light, which will be described later. It is preferable to contain it.

The dye B may be used alone or in combination of two or more.
The content of the dye B is preferably 0.2% by mass or more, preferably 0.2% by mass to 6% by mass, based on the total mass of the thermoplastic resin layer from the viewpoint of visibility of the exposed part and the non-exposed part. More preferably, 0.2% by mass to 5% by mass is further preferable, and 0.25% by mass to 3.0% by mass is particularly preferable.

Here, the content of the dye B means the content of the dye when all the dyes B contained in the thermoplastic resin layer are in a colored state. Hereinafter, a method for quantifying the content of dye B will be described by taking a dye that develops color by radicals as an example.
A solution prepared by dissolving 0.001 g and 0.01 g of the dye in 100 mL of methyl ethyl ketone is prepared. A photoradical polymerization initiator Irgacure OXE01 (trade name, BASF Japan Ltd.) is added to each of the obtained solutions, and radicals are generated by irradiating with light of 365 nm to bring all the dyes into a colored state. Then, in an atmospheric atmosphere, the absorbance of each solution having a liquid temperature of 25 ° C. is measured using a spectrophotometer (UV3100, manufactured by Shimadzu Corporation), and a calibration curve is prepared.
Next, the absorbance of the solution in which all the dyes are colored is measured by the same method as above except that 0.1 g of the thermoplastic resin layer is dissolved in methyl ethyl ketone instead of the dye. From the absorbance of the obtained solution containing the thermoplastic resin layer, the amount of the dye contained in the thermoplastic resin layer is calculated based on the calibration curve.

(Compounds that generate acids, bases or radicals with light)
The thermoplastic resin layer may contain a compound (also simply referred to as “compound C”) that generates an acid, a base or a radical by light.
As the compound C, a compound that generates an acid, a base, or a radical by receiving active rays such as ultraviolet rays and visible rays is preferable.
As the compound C, a known photoacid generator, photobase generator, and photoradical polymerization initiator (photoradical generator) can be used. Of these, a photoacid generator is preferable.

-Photoacid generator-
The thermoplastic resin layer preferably contains a photoacid generator from the viewpoint of resolution.
Examples of the photoacid generator include a photocationic polymerization initiator that may be contained in the above-mentioned photosensitive resin layer, and the preferred embodiments are the same except for the points described below.

The photoacid generator preferably contains at least one compound selected from the group consisting of an onium salt compound and an oxime sulfonate compound from the viewpoint of sensitivity and resolution, and preferably contains sensitivity, resolution and resolution. From the viewpoint of adhesion, it is more preferable to contain an oxime sulfonate compound.
Further, as the photoacid generator, a photoacid generator having the following structure is also preferable.

-Photoradical polymerization initiator-
The thermoplastic resin layer may contain a photoradical polymerization initiator (photoradical polymerization initiator).
Examples of the photoradical polymerization initiator include a photoradical polymerization initiator that may be contained in the photosensitive resin layer described above, and the preferred embodiment is also the same.

-Photobase generator-
The thermoplastic resin layer may contain a photobase generator.
The photobase generator is not particularly limited as long as it is a known photobase generator, and for example, 2-nitrobenzylcyclohexylcarbamate, triphenylmethanol, O-carbamoyl hydroxylamide, O-carbamoyloxime, [[(2,2). 6-Dinitrobenzyl) oxy] carbonyl] cyclohexylamine, bis [[(2-nitrobenzyl) oxy] carbonyl] hexane 1,6-diamine, 4- (methylthiobenzoyl) -1-methyl-1-morpholinoetan, (4) -Morholinobenzoyl) -1-benzyl-1-dimethylaminopropane, N- (2-nitrobenzyloxycarbonyl) pyrrolidine, hexaammine cobalt (III) tris (triphenylmethylborate), 2-benzyl-2-dimethylamino- 1- (4-morpholinophenyl) butanone, 2,6-dimethyl-3,5-diacetyl-4- (2-nitrophenyl) -1,4-dihydropyridine, and 2,6-dimethyl-3,5-diacetyl -4- (2,4-dinitrophenyl) -1,4-dihydropyridine can be mentioned.

The thermoplastic resin layer may contain the compound C alone or in combination of two or more.
The content of compound C is preferably 0.1% by mass to 10% by mass, preferably 0.5% by mass, based on the total mass of the thermoplastic resin layer from the viewpoint of visibility and resolution of the exposed and unexposed areas. More preferably, it is by mass% to 5% by mass.

(Plasticizer)
The thermoplastic resin layer preferably contains a plasticizer from the viewpoints of resolution, adhesion to adjacent layers, and developability.
The plasticizer preferably has a smaller molecular weight (weight average molecular weight (Mw) in the case of an oligomer or polymer) than the alkali-soluble resin. The molecular weight of the plasticizer (weight average molecular weight (Mw)) is preferably 200 to 2,000.
The plasticizer is not particularly limited as long as it is a compound that is compatible with the alkali-soluble resin and exhibits plasticity, but from the viewpoint of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule, and is a polyalkylene glycol. Compounds are more preferred. The alkyleneoxy group contained in the plasticizer more preferably has a polyethyleneoxy structure or a polypropyleneoxy structure.

Further, the plasticizer preferably contains a (meth) acrylate compound from the viewpoint of resolution and storage stability. From the viewpoint of compatibility, resolution and adhesion to the adjacent layer, it is more preferable that the alkali-soluble resin is an acrylic resin and the plasticizer contains a (meth) acrylate compound.
Examples of the (meth) acrylate compound used as a plasticizer include the (meth) acrylate compound described as the polymerizable compound contained in the photosensitive resin layer described above.
In the photosensitive transfer member, when the thermoplastic resin layer and the photosensitive resin layer are directly contacted and laminated, it is preferable that both the thermoplastic resin layer and the photosensitive resin layer contain the same (meth) acrylate compound. .. This is because the thermoplastic resin layer and the photosensitive resin layer contain the same (meth) acrylate compound, respectively, so that the diffusion of components between the layers is suppressed and the storage stability is improved.

When the thermoplastic resin layer contains a (meth) acrylate compound as a plasticizer, it is preferable that the (meth) acrylate compound does not polymerize even in the exposed portion after exposure from the viewpoint of adhesion to the adjacent layer.
The (meth) acrylate compound used as a plasticizer is a polyfunctional compound having two or more (meth) acryloyl groups in one molecule from the viewpoints of resolution, adhesion to adjacent layers, and developability. A (meth) acrylate compound is preferred.
Further, as the (meth) acrylate compound used as a plasticizer, a (meth) acrylate compound having an acid group or a urethane (meth) acrylate compound is also preferable.

The thermoplastic resin layer may contain one type of plasticizer alone, or may contain two or more types of plasticizer.
The content of the plasticizer is preferably 1% by mass to 70% by mass and 10% by mass to 60% by mass with respect to the total mass of the thermoplastic resin layer from the viewpoint of resolution, adhesion to adjacent layers and developability. By mass% is more preferable, and 20% by mass to 50% by mass is particularly preferable.

(Surfactant)
The thermoplastic resin layer preferably contains a surfactant from the viewpoint of thickness uniformity.
Examples of the surfactant include surfactants that may be contained in the above-mentioned photosensitive resin layer, and the preferred embodiment is the same.

The thermoplastic resin layer may contain one type of surfactant alone or two or more types.
The content of the surfactant is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass, based on the total mass of the thermoplastic resin layer.

(Sensitizer)
The thermoplastic resin layer may contain a sensitizer.
The sensitizer is not particularly limited, and examples thereof include a sensitizer that may be contained in the above-mentioned photosensitive resin layer.

The thermoplastic resin layer may contain one type of sensitizer alone or two or more types.
The content of the sensitizer can be appropriately selected depending on the purpose, but from the viewpoint of improving the sensitivity to the light source and the visibility of the exposed and non-exposed areas, 0.01 mass with respect to the total mass of the thermoplastic resin layer. The range of% to 5% by mass is preferable, and the range of 0.05% by mass to 1% by mass is more preferable.

(Additives, etc.)
In addition to the above components, the thermoplastic resin layer may contain known additives, if necessary.
Further, the thermoplastic resin layer is described in paragraphs 0189 to 0193 of Japanese Patent Application Laid-Open No. 2014-85643, and the contents described in this publication are incorporated in the present specification.

<Physical characteristics, etc.>
The layer thickness of the thermoplastic resin layer is not particularly limited, but is preferably 1 μm or more, more preferably 2 μm or more, from the viewpoint of adhesion to adjacent layers. The upper limit is not particularly limited, but from the viewpoint of developability and resolution, 20 μm or less is preferable, 10 μm or less is more preferable, and 5 μm or less is further preferable.

<Formation method>
The method for forming the thermoplastic resin layer is not particularly limited as long as it is a method capable of forming a layer containing the above components.
As a method for forming the thermoplastic resin layer, for example, a thermoplastic resin composition containing the above components and a solvent is prepared, and the thermoplastic resin composition is applied to the surface of a temporary support or the like to form the thermoplastic resin composition. Examples thereof include a method of forming by drying a coating film of an object.
The thermoplastic resin composition preferably contains a solvent in order to adjust the viscosity of the thermoplastic resin composition and facilitate the formation of the thermoplastic resin layer.

(solvent)
The solvent contained in the thermoplastic resin composition is not particularly limited as long as the above-mentioned components contained in the thermoplastic resin layer can be dissolved or dispersed.
Examples of the solvent contained in the thermoplastic resin composition include a solvent that may be contained in the above-mentioned photosensitive resin composition, and the preferred embodiment is also the same.

The solvent contained in the thermoplastic resin composition may be one kind alone or two or more kinds.
The content of the solvent when the thermoplastic resin composition is applied is preferably 50 parts by mass to 1,900 parts by mass, preferably 100 parts by mass to 900 parts by mass with respect to 100 parts by mass of the total solid content in the thermoplastic resin composition. More preferred.

The preparation of the thermoplastic resin composition and the formation of the thermoplastic resin layer may be carried out according to the method for preparing the photosensitive resin composition and the method for forming the photosensitive resin layer described above.
For example, a solution in which each component contained in the thermoplastic resin layer is dissolved in the above solvent is prepared in advance, and the obtained solution is mixed at a predetermined ratio to prepare a thermoplastic resin composition.
The thermoplastic resin layer is formed by applying the obtained thermoplastic resin composition to the surface of the temporary support and drying the coating film of the thermoplastic resin composition.
Further, after forming the photosensitive resin layer and the intermediate layer on the cover film described later, the thermoplastic resin layer may be formed on the surface of the intermediate layer.

[Middle layer]
The photosensitive transfer member preferably has an intermediate layer between the thermoplastic resin layer and the photosensitive resin layer. By providing the intermediate layer, it is possible to suppress the mixing of the components when the plurality of layers are applied and when the layers are stored after application.
The intermediate layer is preferably a water-soluble layer from the viewpoint of developability and suppressing mixing of components during application of the plurality of layers and storage after application.
In the present specification, "water-soluble" means that the solubility in 100 g of water having a liquid temperature of 22 ° C. and a pH of 7.0 is 0.1 g or more.

Examples of the intermediate layer include an oxygen blocking layer having an oxygen blocking function, which is described as a “separation layer” in JP-A-5-72724. When the intermediate layer is an oxygen blocking layer, the sensitivity at the time of exposure is improved, the time load of the exposure machine is reduced, and the productivity is improved, which is preferable.
The oxygen blocking layer used as the intermediate layer may be appropriately selected from the known layers described in the above publications and the like. Of these, an oxygen blocking layer that exhibits low oxygen permeability and is dispersed or dissolved in water or an alkaline aqueous solution (1% by mass aqueous solution of sodium carbonate at 22 ° C.) is preferable.

The intermediate layer preferably contains a resin.
Examples of the resin contained in the intermediate layer include polyvinyl alcohol-based resin, polyvinylpyrrolidone-based resin, cellulose-based resin, acrylamide-based resin, polyethylene oxide-based resin, gelatin, vinyl ether-based resin, polyamide resin, and their common weights. Examples include resins such as coalescence.
As the resin contained in the intermediate layer, a water-soluble resin is preferable.
Further, the resin contained in the intermediate layer contains the polymer A contained in the photosensitive resin layer and the thermoplastic resin (alkali soluble) contained in the thermoplastic resin layer from the viewpoint of suppressing the mixing of the components between the plurality of layers. It is preferable that the resin is different from any of the resins).

The intermediate layer preferably contains polyvinyl alcohol, and contains both polyvinyl alcohol and polyvinylpyrrolidone, from the viewpoint of oxygen blocking property and suppressing mixing of components during application of the plurality of layers and storage after application. It is more preferable to contain it.

The intermediate layer may contain the above resin alone or in combination of two or more.
The content of the resin in the intermediate layer is not particularly limited, but is based on the total mass of the intermediate layer from the viewpoint of oxygen blocking property and suppressing the mixing of components during application of the plurality of layers and storage after application. , 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, further preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass.
Further, the intermediate layer may contain an additive such as a surfactant, if necessary.

The layer thickness of the intermediate layer is not particularly limited, but is preferably 0.1 μm to 5 μm, and more preferably 0.5 μm to 3 μm.
When the thickness of the intermediate layer is within the above range, the oxygen blocking property is not lowered, the mixing of the components at the time of applying the plurality of layers and at the time of storage after application can be suppressed, and the intermediate layer at the time of development is intermediate. This is because an increase in layer removal time can be suppressed.

The method for forming the intermediate layer is not particularly limited, and for example, an intermediate layer composition containing the above resin and any additive is prepared and applied to the surface of the thermoplastic resin layer or the photosensitive resin layer to form the intermediate layer composition. Examples thereof include a method of forming an intermediate layer by drying a coating film of an object.
The intermediate layer composition preferably contains a solvent in order to adjust the viscosity of the intermediate layer composition and facilitate the formation of the intermediate layer.

The solvent contained in the intermediate layer composition is not particularly limited as long as the above resin can be dissolved or dispersed, and at least one selected from the group consisting of water and a water-miscible organic solvent is preferable, and water or water or water is preferable. A mixed solvent of water and a water-miscible organic solvent is more preferable.
Examples of the water-miscible organic solvent include alcohols having 1 to 3 carbon atoms, acetone, ethylene glycol and glycerin, and alcohols having 1 to 3 carbon atoms are preferable, and methanol or ethanol is more preferable.

[Cover film]
The photosensitive transfer member preferably includes a cover film that is in contact with a surface of the photosensitive resin layer that does not face the temporary support.
Hereinafter, in the present specification, the surface of the photosensitive resin layer facing the temporary support is also referred to as a "first surface", and the surface opposite to the first surface is also referred to as a "second surface".

Examples of the material constituting the cover film include a resin film and paper, and a resin film is preferable from the viewpoint of strength and flexibility.
Examples of the resin film include a polyethylene film, a polypropylene film, a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film. Of these, a polyethylene film, a polypropylene film, or a polyethylene terephthalate film is preferable.

The thickness (layer thickness) of the cover film is not particularly limited, but is preferably 5 μm to 100 μm, and more preferably 10 to 50 μm.
Further, the arithmetic average roughness Ra value of the surface of the cover film in contact with the photosensitive resin layer (hereinafter, also simply referred to as “the surface of the cover film”) is preferably 0.3 μm or less from the viewpoint of excellent resolution. 1 μm or less is more preferable, and 0.05 μm or less is further preferable. It is considered that when the Ra value on the surface of the cover film is within the above range, the uniformity of the layer thickness of the photosensitive resin layer and the formed resin pattern is improved.
The lower limit of the Ra value on the surface of the cover film is not particularly limited, but is preferably 0.001 μm or more.

The Ra value on the surface of the cover film is measured by the following method.
Using a three-dimensional optical profiler (New View7300, manufactured by Zygo), the surface of the cover film is measured under the following conditions to obtain a surface profile of the optical film.
As the measurement / analysis software, Microscope Application of MetroPro ver 8.3.2 is used. Next, the Surface Map screen is displayed with the above analysis software, and histogram data is obtained in the Surface Map screen. From the obtained histogram data, the arithmetic mean roughness is calculated to obtain the Ra value of the surface of the cover film.
When the cover film is attached to the photosensitive transfer member, the cover film may be peeled off from the photosensitive transfer member, and the Ra value of the surface on the peeled side may be measured.

The photosensitive transfer member may include a layer other than the above-mentioned layer (hereinafter, also referred to as “other layer”). Other layers include, for example, a contrast enhancement layer.
The contrast enhancement layer is described in paragraph 0134 of WO 2018/179640. Further, other layers are described in paragraphs 0194 to 0196 of Japanese Patent Application Laid-Open No. 2014-85643. The contents of these gazettes are incorporated herein by reference.

The total thickness of each layer of the photosensitive transfer member excluding the temporary support and the cover film is preferably 20 μm or less, more preferably 10 μm or less, and 8 μm or less from the viewpoint of further exerting the effects in the present disclosure. It is more preferably 2 μm or more and 8 μm or less.
Further, the total thickness of the photosensitive resin layer, the intermediate layer and the thermoplastic resin layer in the photosensitive transfer member is preferably 20 μm or less, preferably 10 μm or less, from the viewpoint of further exerting the effects in the present disclosure. It is more preferably 8 μm or less, and particularly preferably 2 μm or more and 8 μm or less.

[Manufacturing method of photosensitive transfer member]
The method for producing the photosensitive transfer member used in the present disclosure is not particularly limited, and a known production method, for example, a known method for forming each layer can be used.
Hereinafter, a method for manufacturing the photosensitive transfer member used in the present disclosure will be described with reference to FIG. However, the photosensitive transfer member used in the present disclosure is not limited to the one having the configuration shown in FIG.
FIG. 2 is a schematic view showing an example of the configuration of the photosensitive transfer member used in the present disclosure. The photosensitive transfer member 100 shown in FIG. 2 has a structure in which a temporary support 10, a thermoplastic resin layer 12, an intermediate layer 14, a photosensitive resin layer 16, and a cover film 18 are laminated in this order.

As a method for producing the photosensitive transfer member 100, for example, the thermoplastic resin layer is formed by applying the thermoplastic resin composition to the surface of the temporary support 10 and then drying the coating film of the thermoplastic resin composition. A step of forming the intermediate layer 12, a step of applying the intermediate layer composition to the surface of the thermoplastic resin layer 12, and then drying the coating film of the intermediate layer composition to form the intermediate layer 14, and a step of forming the intermediate layer 14 on the surface of the intermediate layer 14. A method including a step of applying a photosensitive resin composition containing a binder polymer and a polymerizable compound and then drying a coating film of the photosensitive resin composition to form a photosensitive resin layer 16 can be mentioned.
In the above production method, it is selected from the group consisting of a thermoplastic resin composition containing at least one selected from the group consisting of an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent, and a water- and water-mixable organic solvent. A photosensitive resin composition containing at least one selected from the group consisting of an intermediate layer composition containing at least one of the above, a binder polymer, a polymerizable compound, and an alkylene glycol ether solvent and an alkylene glycol ether acetate solvent. It is preferable to use and. As a result, the components contained in the thermoplastic resin layer 12 during the application of the intermediate layer composition to the surface of the thermoplastic resin layer 12 and / or the storage period of the laminate having the coating film of the intermediate layer composition. A laminate having a coating film of the photosensitive resin composition on the surface of the intermediate layer 14 and / or a coating film of the photosensitive resin composition, which can suppress mixing with the components contained in the intermediate layer 14. During the storage period, mixing of the component contained in the intermediate layer 14 and the component contained in the photosensitive resin layer 16 can be suppressed.

The photosensitive transfer member 100 is manufactured by pressing the cover film 18 against the photosensitive resin layer 16 of the laminate manufactured by the above manufacturing method.
The method for manufacturing the photosensitive transfer member used in the present disclosure includes a step of providing a cover film 18 so as to be in contact with the second surface of the photosensitive resin layer 16, so that the temporary support 10, the thermoplastic resin layer 12, and the thermoplastic resin layer 12 are provided. It is preferable to manufacture the photosensitive transfer member 100 including the intermediate layer 14, the photosensitive resin layer 16, and the cover film 18.
After manufacturing the photosensitive transfer member 100 by the above manufacturing method, the photosensitive transfer member 100 in the form of a roll may be manufactured and stored by winding the photosensitive transfer member 100. The roll-type photosensitive transfer member can be provided as it is in the process of bonding with the substrate in the roll-to-roll method described later.

[Manufacturing method of circuit wiring]
The circuit wiring manufacturing method according to the present disclosure is not particularly limited as long as it is a circuit wiring manufacturing method including the resin pattern manufacturing method according to the present disclosure.
As a method for manufacturing a circuit wiring, the substrate has a conductive layer on the surface on the side where the resin pattern is formed, and the resin pattern manufactured by the resin pattern manufacturing method according to the present disclosure is in this order. A method including a step of etching a conductive layer in a region where a resin pattern is not arranged (hereinafter, also referred to as an “etching step”) is preferable in the laminated body laminated in (1), and the above-mentioned bonding step and the above-mentioned exposure step. It is more preferable to use a resin pattern produced by a production method including the above-mentioned development step.
Hereinafter, each process included in the circuit wiring manufacturing method will be described, but unless otherwise specified, the contents described for each process included in the resin pattern manufacturing method are for each process included in the circuit wiring manufacturing method. Also shall apply.

[Etching process]
In the circuit wiring manufacturing method, a substrate, a conductive layer, and a resin pattern (more preferably, a resin pattern manufactured by a manufacturing method including the bonding step, the exposure step, and the developing step) are laminated in this order. It is preferable to include a step (etching step) of etching the conductive layer in the region where the resin pattern is not arranged in the laminated body. “Etching the conductive layer in the region where the resin pattern is not arranged” specifically means that the conductive layer is etched and a part of the conductive layer on which the resin pattern is not arranged is removed. Means to do.

In the etching step, the resin pattern formed from the photosensitive resin layer is used as an etching resist, and the conductive layer is etched.
As a method of etching treatment, a known method can be applied, and for example, the method described in paragraphs 0209 to 0210 of JP2017-120435A and the method described in paragraphs 0048 to 0054 of JP2010-152155A. Examples thereof include a wet etching method in which the material is immersed in an etching solution, and a dry etching method such as plasma etching.

As the etching solution used for wet etching, an acidic or alkaline etching solution may be appropriately selected according to the etching target.
Examples of the acidic etching solution include an aqueous solution of an acidic component alone selected from hydrochloric acid, sulfuric acid, nitric acid, acetic acid, hydrofluoric acid, oxalic acid and phosphoric acid, an acidic component, ferric chloride, ammonium fluoride and Examples thereof include a mixed aqueous solution with a salt selected from potassium permanganate. The acidic component may be a component in which a plurality of acidic components are combined.
As the alkaline etching solution, an aqueous solution of an alkaline component alone selected from sodium hydroxide, potassium hydroxide, ammonia, an organic amine, and a salt of an organic amine (tetramethylammonium hydroxide, etc.), and an alkaline component and a salt. Examples thereof include a mixed aqueous solution with (potassium permanganate, etc.). The alkaline component may be a component in which a plurality of alkaline components are combined.

[Removal process]
In the circuit wiring manufacturing method, it is preferable to perform a step (removal step) of removing the remaining resin pattern.
The removing step is not particularly limited and can be performed as needed, but it is preferably performed after the etching step.
The method for removing the remaining resin pattern is not particularly limited, and examples thereof include a method for removing by chemical treatment, and a method for removing with a removing liquid is preferable.
As a method for removing the photosensitive resin layer, a substrate having a residual resin pattern is placed in a stirring liquid having a liquid temperature of preferably 30 ° C. to 80 ° C., more preferably 50 ° C. to 80 ° C. for 1 minute. A method of immersing for 30 minutes can be mentioned.

Examples of the removing liquid include a removing liquid in which an inorganic alkaline component or an organic alkaline component is dissolved in water, dimethyl sulfoxide, N-methylpyrrolidone, or a mixed solution thereof. Examples of the inorganic alkaline component include sodium hydroxide and potassium hydroxide. Examples of the organic alkali component include a primary amine compound, a secondary amine compound, a tertiary amine compound and a quaternary ammonium salt compound.
Further, the removing liquid may be used and removed by a known method such as a spray method, a shower method and a paddle method.

[Other processes]
The method for manufacturing the circuit wiring may include an arbitrary step (other steps) other than the above-mentioned steps. For example, the following steps can be mentioned, but the steps are not limited to these steps.
Further, examples of the exposure step, the developing step, and other steps applicable to the method for manufacturing the circuit wiring include the steps described in paragraphs 0035 to 0051 of JP-A-2006-23696.

<Step to reduce visible light reflectance>
The method for manufacturing the circuit wiring may include a step of reducing the visible light reflectance of a part or all of the plurality of conductive layers of the substrate.
Examples of the treatment for reducing the visible light reflectance include an oxidation treatment. When the substrate has a conductive layer containing copper, the visible light reflectance of the conductive layer can be reduced by oxidizing copper to copper oxide and blackening the conductive layer.
The treatment for lowering the visible light reflectance is described in paragraphs 0017 to 0025 of JP-A-2014-150118 and paragraphs 0041, 0042, 0048 and 0058 of JP-A-2013-206315. , The contents of these publications are incorporated herein by reference.

<Step of forming an insulating film, step of forming a new conductive layer on the surface of the insulating film>
The method for manufacturing a circuit wiring preferably includes a step of forming an insulating film on the surface of the circuit wiring and a step of forming a new conductive layer on the surface of the insulating film.
By the above steps, a second electrode pattern insulated from the first electrode pattern can be formed.
The step of forming the insulating film is not particularly limited, and examples thereof include a known method of forming a permanent film. Further, an insulating film having a desired pattern may be formed by photolithography using a photosensitive material having an insulating property.
The step of forming the new conductive layer on the insulating film is not particularly limited, and for example, a new conductive layer having a desired pattern may be formed by photolithography using a photosensitive material having conductivity.

As a method for manufacturing circuit wiring, it is also preferable to use a substrate having a plurality of conductive layers on both surfaces of the substrate, and to form circuits sequentially or simultaneously on the conductive layers formed on both surfaces of the substrate. With such a configuration, it is possible to form a circuit wiring for a touch panel in which a first conductive pattern is formed on one surface of a substrate and a second conductive pattern is formed on the other surface. It is also preferable to form the touch panel circuit wiring having such a configuration from both sides of the substrate by roll-to-roll.

[Use of circuit wiring]
The circuit wiring manufactured by the method of manufacturing the circuit wiring can be applied to various devices. Examples of the device provided with the circuit wiring manufactured by the above manufacturing method include an input device, a touch panel is preferable, and a capacitance type touch panel is more preferable. Further, the input device can be applied to a display device such as an organic EL display device and a liquid crystal display device.

[Manufacturing method of touch panel]
The touch panel manufacturing method according to the present disclosure is not particularly limited as long as it is a circuit wiring manufacturing method including the resin pattern manufacturing method according to the present disclosure.
As a method for manufacturing the touch panel, the substrate has a conductive layer on the surface on the side where the resin pattern is formed, and the resin patterns manufactured by using the photosensitive transfer member are laminated in this order. A method including a step of forming wiring for a touch panel by etching a conductive layer in a region where a resin pattern is not arranged in the laminated body is preferable, and the bonding step, the exposure step, and the above It is more preferable to use a resin pattern produced by a production method including a development step.

Specific aspects of each step in the touch panel manufacturing method, and embodiments such as the order in which each step is performed have been described in the above-mentioned "Resin pattern manufacturing method" and "Circuit wiring manufacturing method". This is true, and so are the preferred embodiments.
As the method for manufacturing the touch panel, a known method for manufacturing the touch panel may be referred to except that the wiring for the touch panel is formed by the above method.
Further, the touch panel manufacturing method may include any process (other process) other than those described above.

An example of a mask pattern used in manufacturing a touch panel is shown in FIGS. 3 and 4.
In the pattern A shown in FIG. 3 and the pattern B shown in FIG. 4, SL and G are non-image parts (light-shielding parts), and DL is a virtual representation of the alignment alignment frame. In the method of manufacturing a touch panel, for example, by exposing the photosensitive resin layer through a mask having a pattern A shown in FIG. 3, a touch panel in which a circuit wiring having a pattern A corresponding to SL and G is formed is manufactured. can. Specifically, it can be produced by the method shown in FIG. 1 of International Publication No. 2016/190405. In an example of the manufactured touch panel, G is a portion where a transparent electrode (touch panel electrode) is formed, and SL is a portion where wiring of a peripheral take-out portion is formed.

By the above-mentioned touch panel manufacturing method, a touch panel having at least touch panel wiring is manufactured. The touch panel preferably has a transparent substrate, electrodes, and an insulating layer or a protective layer.
Examples of the detection method on the touch panel include known methods such as a resistive film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method. Above all, the capacitance method is preferable.

The touch panel type includes a so-called in-cell type (for example, those shown in FIGS. 5, 6, 7, and 8 of Japanese Patent Application Laid-Open No. 2012-517501), and a so-called on-cell type (for example, Japanese Patent Application Laid-Open No. 2013-168125). Those described in FIG. 19 and those described in FIGS. 1 and 5 of JP2012-89102A, OGS (One Glass Solution) type, TOR (Touch-on-Lens) type (for example, JP-A). 2013-54727 (described in FIG. 2), various out-cell types (so-called GG, G1 / G2, GFF, GF2, GF1, G1F, etc.) and other configurations (for example, Japanese Patent Application Laid-Open No. 2013-164871). The one shown in FIG. 6).
Examples of the touch panel include those described in paragraph 0229 of JP2017-120345A.

[Photosensitive transfer member]
The photosensitive transfer member according to the present disclosure is a photosensitive transfer member having a temporary support and a photosensitive resin layer, and the position of 90% of the maximum height from the substrate on the substrate by the photosensitive transfer member. When the resin pattern A having a pattern width of 6 μm is formed in the above, the pattern width of the resin pattern A in the portion in contact with the substrate in the cross section in the width direction of the resin pattern A is 6.2 μm or more.
The preferred embodiment of the photosensitive transfer member according to the present disclosure is the same as the preferred embodiment of the photosensitive transfer member used in the above-described method for producing a resin pattern according to the present disclosure, except as described later.

The photosensitive transfer member according to the present disclosure has a cross section in the width direction of the resin pattern A when a resin pattern A having a pattern width of 6 μm at a position of 90% of the maximum height from the substrate is formed on the substrate. The pattern width of the resin pattern A in the portion in contact with the substrate is preferably 6.2 μm or more and 9.0 μm or less, and 6.2 μm or more and 8.4 μm or less from the viewpoint of resolution and linearity. It is more preferable that the thickness is 6.3 μm or more and 8.0 μm or less, and 6.4 μm or more and 8.0 μm or less is particularly preferable.

Hereinafter, embodiments of the present invention will be described in more detail with reference to examples. The materials, amounts used, proportions, treatment contents, treatment procedures, etc. shown in the following examples can be appropriately changed as long as they do not deviate from the gist of the embodiment of the present invention. Therefore, the scope of the embodiment of the present invention is not limited to the specific examples shown below. Unless otherwise specified, "parts" and "%" are based on mass.

(Examples 1 to 9 and Comparative Examples 1 to 3)
<Manufacturing of photosensitive transfer member>
-Formation of thermoplastic resin layer-
A PET film having a thickness of 25 μm was prepared as a temporary support. The following thermoplastic resin composition was applied to the surface of the temporary support using a slit-shaped nozzle so that the coating width was 1.0 m and the layer thickness after drying was 4.0 μm.
The formed coating film of the thermoplastic resin composition was dried at 80 ° C. for 40 seconds to form a thermoplastic resin layer.

<< Thermoplastic resin composition >>
The following components were mixed to prepare a thermoplastic resin composition.
・ Copolymer of benzyl methacrylate, methacrylic acid and acrylic acid (solid content concentration 30.0%, Mw 30,000, acid value 153 mgKOH / g): 42.85 parts ・ NK ester A-DCP (tricyclodecanedimethanoldi) Acrylate, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.): 4.63 parts, 8UX-015A (polyfunctional urethane acrylate compound, manufactured by Taisei Fine Chemical Co., Ltd.): 2.31 parts, Aronix TO-2349 (many with carboxy group) Functional acrylate compound, manufactured by Toa Synthetic Co., Ltd .): 0.77 parts-Compound having the structure shown below (photoacid generator, compound synthesized according to the method described in paragraph 0227 of JP2013-47765A): 0.32 copies

-Compounds with the structure shown below (dyes that develop color with acid): 0.08 parts

・ E-1 (Megafuck F552 (manufactured by DIC Corporation)): 0.03 parts ・ MEK (methyl ethyl ketone, manufactured by Sankyo Chemical Co., Ltd.): 39.50 parts ・ PGMEA (propylene glycol monomethyl ether acetate, Showa Denko) Made by Co., Ltd.): 9.51 copies

-Formation of intermediate layer-
The above intermediate layer composition was applied to the surface of the formed thermoplastic resin layer using a slit-shaped nozzle so that the coating width was 1.0 m and the layer thickness after drying was 1.2 μm. The coating film of the intermediate layer composition was dried at 80 ° C. for 40 seconds to form an intermediate layer.

<< Intermediate layer composition >>
The following components were mixed to prepare an intermediate layer composition.
-Ion exchanged water: 38.12 parts-Methanol (manufactured by Mitsubishi Gas Chemical Company, Inc.): 57.17 parts-Clarepovar PVA-205 (polyvinyl alcohol, manufactured by Kuraray Co., Ltd.): 3.22 parts-Polyvinylpyrrolidone K -30 (manufactured by Nippon Shokubai Co., Ltd.): 1.49 parts, Megafuck F-444 (fluorine-based nonionic surfactant, manufactured by DIC Co., Ltd.): 0.0015 parts

-Formation of photosensitive resin layer-
The photosensitive resin composition shown in Table 1 so that the coating width is 1.0 m and the layer thickness after drying is the thickness shown in Table 1 using a slit-shaped nozzle on the surface of the formed intermediate layer. Either A-1 to A-7 or AH-1 to AH-3 was applied. The coating film of any of the photosensitive resin compositions A-1 to A-7 or AH-1 to AH-3 was dried at 80 ° C. for 40 seconds to form a photosensitive resin layer.

The compositions of the photosensitive resin compositions A-1 to A-7 and AH-1 to AH-3 used are shown in Table 2 below.

“Mm / Mb” in Table 2 represents the value of the ratio Mm / Mb of the content Mm of the polymerizable compound and the content Mb of the binder polymer in the photosensitive resin layer, and “content of the acrylic compound” is the value of photosensitive. It represents the content of the acrylic compound with respect to the total mass of the (meth) acrylic compound contained in the sex resin layer, and the unit is mass%.

The details of the abbreviations in Table 2 are shown below.
BPE-500: Ethoxylation (10 molar equivalents) Bisphenol A dimethacrylate (manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
BPE-200: Ethoxylation (4 molar equivalents) Bisphenol A dimethacrylate (manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
M-270: Polypropylene glycol diacrylate (n = about 12) (manufactured by Toagosei Co., Ltd.)
A-TMPT: Trimethylolpropane triacrylate (manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
SR-454: Trimethylol ethoxylated propantriacrylate (manufactured by Arkema)
SR-502: Ethoxylation (9 molar equivalents) Trimethylolpropane triacrylate (manufactured by Arkema)
A-9300-CL1: ε-caprolactone-modified tris- (2-acryloxyethyl) isocyanurate (manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
B-CIM: 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetraphenyl-1,2'-bisimidazole (polymerization initiator, manufactured by Kurogane Kasei Co., Ltd.)
SB-PI 701: 4,4'-bis (diethylamino) benzophenone (sensitizer, manufactured by Sanyo Trading Co., Ltd.)
CBT-1: Carboxybenzotriazole (rust inhibitor, manufactured by Johoku Chemical Industry Co., Ltd.)
TDP-G: Phenothiazine (polymerization inhibitor, manufactured by Kawaguchi Chemical Industry Co., Ltd.)
Irganox245: polyethylene bis (oxyethylene) bis (3- (5-tert-butyl-4-hydroxy-m-tolyl) propionate) (polymerization inhibitor, manufactured by BASF)
F-552: Fluorosurfactant (manufactured by DIC Corporation)

-Attach cover film-
A PET film (manufactured by Toray Industries, Inc., Lumirror 16QS62, arithmetic average roughness (Ra value) 0.02 μm) was pressure-bonded to the surface of the formed photosensitive resin layer as a cover film, and the photosensitive transfer member of each embodiment was pressed. Were prepared respectively.
The obtained photosensitive transfer member was wound up to prepare a roll-shaped photosensitive transfer member.

<Manufacturing of laminated body>
The cover films of the photosensitive transfer members F-1 to F-9, FH-1 and FH-2 produced above are peeled off, the peeled surface of the photosensitive transfer member is brought into contact with the copper substrate, and copper is applied to the PET film. A laminated body was obtained by laminating under the following laminating conditions on a copper substrate on which a copper layer having a thickness of 200 μm was formed by sputtering.
-Laminating conditions-
Copper substrate temperature: 40 ° C
Rubber roller temperature: 110 ° C
Linear pressure: 3N / cm
Transport speed: 2 m / min

<Exposure>
Next, an exposure mask having an exposure pattern of line & space = 6 μm / 6 μm is brought into close contact with a temporary support on the side where the photosensitive transfer member of the laminate is laminated, and the proximity with an ultra-high pressure mercury lamp is passed through the exposure mask. Using a mold exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.), exposure was performed at an exposure amount such that the width of the height at 90% of the maximum height of the resist pattern was 6 μm.

<Development>
Then, the temporary support was peeled off from the exposed laminate and developed with a 1.0% aqueous sodium carbonate solution at 26 ° C. for 30 seconds.
Next, a washing treatment was performed at 26 ° C. for 30 seconds using pure water.
Next, air was blown onto the surface to remove water, and a substrate having a resin pattern was produced.
A shower-type developing machine was used for the developing treatment and the cleaning treatment, and the spray pressure was 0.08 MPa.

<Etching and peeling>
A copper layer was shower-etched on a substrate having a resin pattern for 60 seconds using a copper etching solution (Cu-02 manufactured by Kanto Chemical Co., Ltd.) at 25 ° C.
Then, the resin pattern was removed by shower peeling for 2 minutes using a stripping solution at 60 ° C. (KP-301 manufactured by Kanto Chemical Co., Inc.) to prepare a circuit wiring A.

<Measurement of resist line width in exposed area>
The substrate having the produced resin pattern was cut by a plane perpendicular to the line direction of the line pattern.
The cross section of the line pattern was observed from the cross section side using a scanning electron microscope (SEM), and the width of the resist was measured.
Moreover, in the same sample as above, the thickness of the layer of the non-exposed portion was measured.

<Evaluation>
-Resolution evaluation-
A wiring sample after resist peeling was prepared in the same manner as above by using a circuit wiring pattern mask having a plurality of width lines and spaces. The wiring portion of the obtained wiring sample was observed with an optical microscope, and the resolution was evaluated according to the following evaluation criteria based on the width of the thinnest wire to be resolved.
A: The width of the thinnest thin line in resolution is 6 μm or less B: The width of the thinnest thin line in resolution is greater than 6 μm and 10 μm or less C: The width of the thinnest thin line in resolution is greater than 10 μm

-Linearity evaluation-
With respect to the above wiring sample, the width of the wiring at the locations selected at random was measured at 20 locations. The standard deviation σ was calculated from the obtained line width data, and the value obtained by multiplying the standard deviation σ by 3 was defined as LWR (Line Width Roughness) and used as an index of pattern linearity.
By definition, the smaller the LWR, the smaller the line width fluctuation, which is preferable.
A: LWR value is 200 nm or less B: LWR value is greater than 200 nm and 300 nm or less C: LWR value is greater than 300 nm

(Example 10)
At the time of the above exposure, the substrate having the resin pattern and the circuit wiring are the same as in Example 5 except that the exposure pattern of line & space = 6 μm / 6 μm is changed to the exposure pattern of line & space = 8 μm / 8 μm. A was prepared.
Moreover, the evaluation was performed in the same manner as in Example 5.

(Example 11)
At the time of the above exposure, the substrate having the resin pattern and the circuit wiring are the same as in Example 5 except that the exposure pattern of line & space = 6 μm / 6 μm is changed to the exposure pattern of line & space = 4 μm / 4 μm. A was prepared.
Moreover, the evaluation was performed in the same manner as in Example 5.

(Example 12)
At the time of the above development, the development conditions at 26 ° C. for 30 seconds using a 1.0% sodium carbonate aqueous solution were changed to the development conditions at 30 ° C. for 30 seconds using a 1.2% potassium carbonate aqueous solution. , A substrate having a resin pattern and circuit wiring A were produced in the same manner as in Example 5.
Moreover, the evaluation was performed in the same manner as in Example 5.

As shown in Table 3 above, the resin pattern manufacturing methods and photosensitive transfer members of Examples 1 to 12 can obtain wiring and the like as compared with the resin pattern manufacturing methods and photosensitive transfer members of Comparative Examples 1 to 3. Excellent resolution of etching pattern.
Further, as shown in Table 3 above, the resin pattern manufacturing methods and the photosensitive transfer members of Examples 1 to 12 are also excellent in the linearity of the obtained etching pattern.

The disclosure of Japanese Patent Application No. 2020-017720 filed on February 5, 2020 is incorporated herein by reference in its entirety. Also, all documents, patent applications and technical standards described herein are to the same extent as if the individual documents, patent applications and technical standards were specifically and individually stated to be incorporated by reference. , Incorporated by reference herein.

Claims

A method for producing a resin pattern in which a resin pattern is formed on a substrate by using a temporary support and a photosensitive transfer member having a photosensitive resin layer.
In the cross section in the width direction of the resin pattern, the pattern width at the portion of the resin pattern in contact with the substrate is 0.2 μm or more larger than the pattern width at a position of 90% of the maximum height of the resin pattern from the substrate. Resin pattern manufacturing method.
The method for producing a resin pattern according to claim 1, wherein the thickness of the photosensitive resin layer is 8 μm or less.
The method for producing a resin pattern according to claim 1 or 2, wherein the temporary support has a thickness of 25 μm or less.
Claims 1 to claim that the value obtained by subtracting the pattern width at a position of 90% of the maximum height of the resin pattern from the pattern width at the portion of the resin pattern in contact with the substrate is 0.2 μm or more and 2.4 μm or less. The method for producing a resin pattern according to any one of 3.
The method for producing a resin pattern according to any one of claims 1 to 4, wherein the photosensitive resin layer contains a polymerizable compound and a binder polymer.
The method for producing a resin pattern according to claim 5, wherein the value of the ratio Mm / Mb of the content Mm of the polymerizable compound and the content Mb of the binder polymer in the photosensitive resin layer is 0.9 or less.
The polymerizable compound in the photosensitive resin layer contains a (meth) acrylic compound and contains.
The method for producing a resin pattern according to claim 5 or 6, wherein the content of the acrylic compound with respect to the total mass of the (meth) acrylic compound contained in the photosensitive resin layer is 60% by mass or less.
The method for producing a resin pattern according to any one of claims 1 to 7, wherein the resin pattern to be produced includes a resin pattern having a pattern width of 6 μm or less.
The substrate has a conductive layer on the surface on the side on which the resin pattern is formed.
In a laminate having the resin pattern on the substrate manufactured by the method for producing a resin pattern according to any one of claims 1 to 8, the conductivity in a region where the resin pattern is not arranged. Including the step of etching the layers to form circuit wiring,
How to manufacture circuit wiring.
The substrate has a conductive layer on the surface on the side on which the resin pattern is formed.
In a laminate having the resin pattern on the substrate manufactured by the method for producing a resin pattern according to any one of claims 1 to 8, the conductivity in a region where the resin pattern is not arranged. Including the step of etching the layers to form the wiring for the touch panel,
Touch panel manufacturing method.
A photosensitive transfer member having a temporary support and a photosensitive resin layer.
When a resin pattern A having a pattern width of 6 μm at a position of 90% of the maximum height from the substrate is formed on the substrate by the photosensitive transfer member, the said in the cross section in the width direction of the resin pattern A. A photosensitive transfer member having a pattern width of the resin pattern A in a portion in contact with a substrate of 6.2 μm or more.