JPWO2021157525A1 - - Google Patents

Info

Publication number
JPWO2021157525A1
JPWO2021157525A1 JP2021575783A JP2021575783A JPWO2021157525A1 JP WO2021157525 A1 JPWO2021157525 A1 JP WO2021157525A1 JP 2021575783 A JP2021575783 A JP 2021575783A JP 2021575783 A JP2021575783 A JP 2021575783A JP WO2021157525 A1 JPWO2021157525 A1 JP WO2021157525A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021575783A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021157525A1 publication Critical patent/JPWO2021157525A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
JP2021575783A 2020-02-05 2021-02-01 Pending JPWO2021157525A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020017720 2020-02-05
PCT/JP2021/003540 WO2021157525A1 (en) 2020-02-05 2021-02-01 Resin pattern manufacturing method, circuit wiring manufacturing method, touch panel manufacturing method, and photosensitive transfer member

Publications (1)

Publication Number Publication Date
JPWO2021157525A1 true JPWO2021157525A1 (en) 2021-08-12

Family

ID=77200198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021575783A Pending JPWO2021157525A1 (en) 2020-02-05 2021-02-01

Country Status (3)

Country Link
JP (1) JPWO2021157525A1 (en)
CN (1) CN114930250A (en)
WO (1) WO2021157525A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012168210A (en) * 2011-02-09 2012-09-06 Asahi Kasei E-Materials Corp Method for manufacturing laminate
WO2015093271A1 (en) * 2013-12-18 2015-06-25 富士フイルム株式会社 Photosensitive transfer material, pattern formation method, and etching method
JP2015118194A (en) * 2013-12-18 2015-06-25 東レ株式会社 Photosensitive resin composition, photosensitive resin film comprising the same, insulating film formed from the photosensitive resin film, and multilayer wiring board including the insulating film

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012168210A (en) * 2011-02-09 2012-09-06 Asahi Kasei E-Materials Corp Method for manufacturing laminate
WO2015093271A1 (en) * 2013-12-18 2015-06-25 富士フイルム株式会社 Photosensitive transfer material, pattern formation method, and etching method
JP2015118194A (en) * 2013-12-18 2015-06-25 東レ株式会社 Photosensitive resin composition, photosensitive resin film comprising the same, insulating film formed from the photosensitive resin film, and multilayer wiring board including the insulating film

Also Published As

Publication number Publication date
WO2021157525A1 (en) 2021-08-12
CN114930250A (en) 2022-08-19

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