WO2021157441A1 - Method for producing electronic device - Google Patents

Method for producing electronic device Download PDF

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Publication number
WO2021157441A1
WO2021157441A1 PCT/JP2021/002753 JP2021002753W WO2021157441A1 WO 2021157441 A1 WO2021157441 A1 WO 2021157441A1 JP 2021002753 W JP2021002753 W JP 2021002753W WO 2021157441 A1 WO2021157441 A1 WO 2021157441A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
electronic device
manufacturing
adhesive
laminated film
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PCT/JP2021/002753
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French (fr)
Japanese (ja)
Inventor
貴信 室伏
宏嘉 栗原
哲光 森本
Original Assignee
三井化学東セロ株式会社
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Priority to JP2021575746A priority Critical patent/JPWO2021157441A1/ja
Publication of WO2021157441A1 publication Critical patent/WO2021157441A1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a method for manufacturing an electronic device.
  • An electronic device for example, a semiconductor device
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-203255
  • Patent Document 2 Japanese Patent Laid-Open No. 2005-303068
  • Patent Document 1 describes an adhesive sheet that is attached to the surface of a semiconductor wafer to hold and protect the semiconductor wafer during processing of a semiconductor wafer, and has an elastic modulus of 30 to 1000 kPa on one side of a base material layer and a gel content. Described is a semiconductor wafer holding and protecting pressure-sensitive adhesive sheet characterized in that an intermediate layer having a value of 20% or less is provided and a pressure-sensitive adhesive layer is formed on the surface of the intermediate layer.
  • Patent Document 2 describes an adhesive sheet that is attached to the surface of a semiconductor wafer to hold and protect the semiconductor wafer during processing of a semiconductor wafer, and has an elastic modulus of 10 to 1000 kPa at 25 ° C. on one side of a base material layer. Described is a semiconductor wafer holding and protecting pressure-sensitive adhesive sheet characterized in that an intermediate layer having a gel content of 26 to 45% is provided and an adhesive layer is formed on the surface of the intermediate layer.
  • the adhesive film may float in the surface treatment step under high temperature vacuum.
  • the present invention has been made in view of the above circumstances, and provides a method for manufacturing an electronic device capable of suppressing floating of an adhesive film in a surface treatment step under a high temperature vacuum.
  • an adhesive laminated film having a base material layer, an ultraviolet curable unevenness absorbing resin layer and an adhesive resin layer in this order is used as a surface protective film for protecting the circuit forming surface of the electronic component.
  • an adhesive laminated film having a base material layer, an ultraviolet curable unevenness absorbing resin layer and an adhesive resin layer in this order is used as a surface protective film for protecting the circuit forming surface of the electronic component.
  • the invention was completed.
  • the following method for manufacturing an electronic device is provided.
  • the circuit includes an electronic component having a circuit-forming surface, a base material layer including a polyester-based resin layer, an ultraviolet-curable uneven-absorbing resin layer, and an adhesive laminated film having an adhesive resin layer in this order.
  • the preparation step (A) is A backgrinding step of backgrinding the surface of the electronic component opposite to the circuit forming surface with the backgrinding tape attached to the circuit forming surface of the electronic component. After the back grind process, a step of peeling the back grind tape from the electronic component and A method for manufacturing an electronic device, which comprises a step of attaching the adhesive laminated film to the circuit forming surface of the electronic component. [3] In the method for manufacturing an electronic device according to the above [1] or [2].
  • the surface treatment step (C) is a method for manufacturing an electronic device including one or more selected from the group consisting of an ion implantation step, a metal film forming step, and an annealing treatment step.
  • [4] In the method for manufacturing an electronic device according to any one of the above [1] to [3].
  • a method for manufacturing an electronic device in which the heating temperature in the surface treatment step (C) is 40 ° C. or higher and 350 ° C. or lower.
  • [5] In the method for manufacturing an electronic device according to any one of the above [1] to [4].
  • FIG. 1 and 2 are cross-sectional views schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention.
  • the method for manufacturing an electronic device includes the following steps (A), steps (B), and steps (C).
  • Adhesive laminated film Ultraviolet curing step of curing the unevenness-absorbing resin layer 30 of the adhesive laminated film 50 by irradiating 50 with ultraviolet rays
  • (C) Under vacuum heating, on the side opposite to the circuit forming surface 10A of the electronic component 10.
  • the adhesive film may float in the surface treatment step under high temperature vacuum.
  • the present inventors have made extensive studies to achieve the above problems.
  • an adhesive laminate having a base material layer 20, an ultraviolet curable uneven absorbing resin layer 30 and an adhesive resin layer 40 in this order.
  • the adhesive laminated film 50 is irradiated with ultraviolet rays before the surface treatment step (C) in which the film 50 is used and the surface of the electronic component 10 opposite to the circuit forming surface 10A is treated under high vacuum heating.
  • the adhesive laminated film 50 By performing the ultraviolet curing step (B) of curing the unevenness-absorbing resin layer 30 of the adhesive laminated film 50, the adhesive laminated film 50 floats in the surface treatment step (C) under high temperature vacuum. It was found that it can be suppressed.
  • the unevenness-absorbing resin layer 30 of the adhesive laminated film 50 By curing the unevenness-absorbing resin layer 30 of the adhesive laminated film 50, the heat resistance of the adhesive laminated film 50 can be enhanced, and the adhesive laminated film 50 in the surface treatment step (C) under high temperature vacuum can be improved. It is possible to suppress deformation such as warpage of the film. As a result, floating of the adhesive laminated film 50 can be suppressed in the surface treatment step (C) under high temperature vacuum. As described above, according to the method for manufacturing an electronic device according to the present embodiment, it is possible to suppress the floating of the adhesive film in the surface treatment step under high temperature vacuum.
  • the base material layer 20 contains only one polyester-based resin layer, and is a layer provided for the purpose of improving the handleability, mechanical properties, heat resistance, and other properties of the adhesive laminated film 50.
  • the polyester-based resin constituting the polyester-based resin layer include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polyester-based elastomer.
  • the base material layer 20 is not particularly limited, and examples thereof include a resin film.
  • the base material layer 20 may include a resin layer other than the polyester resin layer.
  • As the resin constituting the resin layer other than the polyester-based resin layer a known thermoplastic resin can be used.
  • polyolefins such as polyethylene, polypropylene, poly (4-methyl-1-pentene), poly (1-butene); polyamides such as nylon-6, nylon-66, polymethoxylen adipamide; polyacrylates; polymethas.
  • the melting point of the base material layer 20 is preferably 100 ° C. or higher.
  • the upper limit of the melting point is not particularly limited, and may be selected in consideration of processability and the like.
  • the base material layer 20 may be a single layer or two or more types of layers. Further, the form of the resin film used for forming the base material layer 20 may be a stretched film or a film stretched in the uniaxial direction or the biaxial direction.
  • the thickness of the base material layer 20 is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more, still more preferably 25 ⁇ m or more, and particularly preferably 50 ⁇ m or more, from the viewpoint of preventing warpage of electronic components after backgrinding. .. Further, it is preferable from the viewpoints of ease of cutting the adhesive laminated film 50 when the adhesive laminated film 50 is attached to an electronic component, productivity when the product form of the adhesive laminated film 50 is rolled, and the like. Is 500 ⁇ m or less, more preferably 300 ⁇ m or less, still more preferably 250 ⁇ m or less, and particularly preferably 75 ⁇ m or less.
  • the base material layer 20 may be surface-treated in order to improve the adhesiveness with other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coating treatment and the like may be performed.
  • the adhesive laminated film 50 has an ultraviolet curable type unevenness absorbing resin layer 30 between the base material layer 20 and the adhesive resin layer 40.
  • the unevenness absorbing resin layer 30 is provided for the purpose of improving the followability of the adhesive laminated film 50 to the circuit forming surface 10A and improving the adhesion between the circuit forming surface 10A and the adhesive laminated film 50. It is a layer.
  • the unevenness absorbing resin layer 30 is a layer provided for the purpose of increasing the heat resistance of the adhesive laminated film 50 by being cured by irradiation with ultraviolet rays. This makes it possible to suppress the floating of the adhesive laminated film 50 in the surface treatment step (C) under high temperature vacuum.
  • the resin constituting the unevenness-absorbing resin layer 30 is not particularly limited as long as it exhibits unevenness-absorbing property, and is selected from the group consisting of, for example, a polyolefin-based resin, a polystyrene-based resin, and a (meth) acrylic-based resin. One or more types may be mentioned.
  • the uneven absorbing resin layer 30 preferably contains a crosslinkable resin. Since the uneven absorbing resin layer 30 contains the crosslinkable resin, the uneven absorbing resin layer 30 can be more effectively crosslinked with ultraviolet rays in the ultraviolet curing step (B), and the heat resistance of the uneven absorbing resin layer 30 can be obtained. Can be further improved. As a result, even if the adhesive laminated film 50 is exposed to a high temperature in the surface treatment step (C), the deformation and melting of the adhesive laminated film 50 can be further suppressed.
  • the crosslinkable resin according to the present embodiment is not particularly limited as long as it can form the uneven absorption resin layer 30 and is crosslinked by ultraviolet rays to improve heat resistance, but is not particularly limited, and is, for example, ethylene and 3 to 20 carbon atoms.
  • a cross-linking agent such as an organic peroxide
  • an ethylene / ⁇ -olefin copolymer composed of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms
  • a low-density ethylene-based copolymer since it is easy to crosslink with ultraviolet rays using a cross-linking agent such as an organic peroxide, an ethylene / ⁇ -olefin copolymer composed of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms, a low-density ethylene-based copolymer.
  • Resins medium-density ethylene-based resins, ultra-low-density ethylene-based resins, linear low-density polyethylene (LLDPE) -based resins, ethylene / cyclic olefin copolymers, ethylene / ⁇ -olefin / cyclic olefin copolymers, ethylene / ⁇ -Olefin-based resins such as olefin / non-conjugated polyene copolymer, ethylene / ⁇ -olefin / conjugated polyene copolymer, ethylene / aromatic vinyl copolymer, ethylene / ⁇ -olefin / aromatic vinyl copolymer, ethylene -Unsaturated anhydrous carboxylic acid copolymer, ethylene / ⁇ -olefin / unsaturated anhydrous carboxylic acid copolymer, ethylene / epoxy-containing unsaturated compound copolymer, ethylene / ⁇
  • Ethylene / ⁇ -olefin copolymer composed of ethylene and ⁇ -olefin having 3 to 20 carbon atoms, low density ethylene resin, ultra low density ethylene resin, linear low density polyethylene (LLDPE) resin, ethylene / ⁇ -Olefin / non-conjugated polyene copolymer, ethylene / ⁇ -olefin / conjugated polyene copolymer, ethylene / unsaturated anhydrous carboxylic acid copolymer, ethylene / ⁇ -olefin / unsaturated anhydrous carboxylic acid copolymer, ethylene / Epoxy-containing unsaturated compound copolymer, ethylene / ⁇ -olefin / epoxy-containing unsaturated compound copolymer, ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / methacrylic acid copolymer, etc.
  • LLDPE linear low density polyethylene
  • Ethylene / ⁇ -olefin copolymer composed of ethylene and ⁇ -olefin having 3 to 20 carbon atoms, low density ethylene resin, ultra low density ethylene resin, linear low density polyethylene (LLDPE) resin, ethylene / ⁇ -Ethylene such as olefin / non-conjugated polyene copolymer, ethylene / ⁇ -olefin / conjugated polyene copolymer, ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / methacrylic acid copolymer, etc.
  • LLDPE linear low density polyethylene
  • one or more selected from unsaturated carboxylic acid copolymers are more preferable to use.
  • at least one selected from an ethylene / ⁇ -olefin copolymer and an ethylene / vinyl acetate copolymer is particularly preferably used.
  • the above-mentioned resins may be used alone or in a blended manner.
  • the ⁇ -olefin of an ethylene / ⁇ -olefin copolymer composed of ethylene and an ⁇ -olefin having 3 to 20 carbon atoms used as the crosslinkable resin in the present embodiment is usually an ⁇ -olefin having 3 to 20 carbon atoms. Can be used alone or in combination of two or more. Of these, ⁇ -olefins having 10 or less carbon atoms are preferable, and ⁇ -olefins having 3 to 8 carbon atoms are particularly preferable.
  • ⁇ -olefins examples include propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3,3-dimethyl-1-butene, and 4-methyl-1-pentene. , 1-octene, 1-decene, 1-dodecene and the like. Among these, propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene and 1-octene are preferable because of their availability.
  • the ethylene / ⁇ -olefin copolymer may be a random copolymer or a block copolymer, but a random copolymer is preferable from the viewpoint of flexibility.
  • an ultraviolet curable pressure-sensitive adhesive in which a UV-curable monomer component or an oligomer component is mixed with a general pressure-sensitive adhesive can be used.
  • general pressure-sensitive adhesives include (meth) acrylic pressure-sensitive adhesives and rubber-based pressure-sensitive adhesives. Among these, a (meth) acrylic pressure-sensitive adhesive using a (meth) acrylic polymer as a base polymer is preferable.
  • Examples of the ultraviolet curable monomer component include urethane oligomer, urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and pentaeristol tetra ().
  • Examples thereof include meta) acrylate, dipentaeristol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate.
  • Examples of the ultraviolet curable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based.
  • the content of the ultraviolet curable monomer component and the oligomer component is, for example, 5 parts by mass or more and 500 parts by mass or less, preferably 40 parts by mass, with respect to 100 parts by mass of the base polymer such as the (meth) acrylic polymer constituting the pressure-sensitive adhesive. More than 150 parts by mass or less.
  • an ultraviolet curable pressure-sensitive adhesive using a base polymer having a carbon-carbon double bond in the polymer side chain or in the main chain or at the end of the main chain can be used.
  • a base polymer having a carbon-carbon double bond a polymer having a carbon-carbon double bond and having adhesiveness can be used.
  • a base polymer one having a (meth) acrylic polymer as a basic skeleton is preferable.
  • the method for introducing an unsaturated bond into the (meth) acrylic polymer is not particularly limited. For example, a functional group capable of reacting with the functional group after copolymerizing a monomer having a functional group with the (meth) acrylic polymer.
  • Examples thereof include a method of condensing or adding a compound having a group and an unsaturated bond while maintaining the ultraviolet curability of the unsaturated bond.
  • Examples of the combination of these functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridyl group, a hydroxyl group and an isocyanate group, and the like.
  • these combinations of functional groups a combination of a hydroxyl group and an isocyanate group is preferable. It is preferable that the (meth) acrylic polymer has a hydroxyl group and the above compound has an isocyanate group.
  • Examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate and the like.
  • the (meth) acrylic polymer one obtained by copolymerizing a hydroxy group-containing monomer, an ether compound of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glucol monovinyl ether and the like is used.
  • the UV-curable pressure-sensitive adhesive may also contain the UV-curable monomer component and oligomer component.
  • the content of the ultraviolet curable monomer component and the oligomer component is, for example, preferably 30 parts by mass or less, and more preferably 10 parts by mass or less with respect to 100 parts by mass of the base polymer.
  • the UV curable pressure-sensitive adhesive preferably contains a photopolymerization initiator.
  • the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, and 2-methyl-2-hydroxypropio.
  • ⁇ -Ketol compounds such as phenone and 1-hydroxycyclohexylphenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4-( Methylthio) -phenyl] -2-morpholinopropane-1 and other acetophenone compounds; benzophenone compounds such as benzoin ethyl ether, benzoin isopropyl ether and anisoin methyl ether; benzoin ether compounds such as benzyl dimethyl ketal; 2 -Aromatic sulfonyl chloride compounds such as naphthalene sulfonyl chloride; photoactive oxime compounds such as 1-phenone-1,1-propandion-2- (o-ethoxycarbonyl) oxime; benzophenone, benzoylbenzoic acid, 3,3 Benzophenone compounds such as ′
  • the blending amount of the photopolymerization initiator is preferably 0.1 part by mass or more, more preferably 0.5 part by mass or more, with respect to 100 parts by mass of the base polymer such as the (meth) acrylic polymer constituting the pressure-sensitive adhesive. From the viewpoint of improving the storage stability of the pressure-sensitive adhesive, 15 parts by mass or less is preferable, and 5 parts by mass or less is more preferable.
  • the thickness of the unevenness absorbing resin layer 30 is not particularly limited as long as it can embed the unevenness structure of the circuit forming surface 10A of the electronic component 10, but is preferably 10 ⁇ m or more and 1000 ⁇ m or less, for example. It is more preferably 20 ⁇ m or more and 900 ⁇ m or less, and further preferably 30 ⁇ m or more and 800 ⁇ m or less.
  • H / d is 1 or less. It is preferably 0.85 or less, more preferably 0.7 or less.
  • H / d is not more than the above upper limit value, the thickness of the adhesive laminated film 50 can be made thinner and the unevenness absorption can be made better.
  • the lower limit of H / d is not particularly limited, but is, for example, 0.01 or more.
  • the height of the bump electrode is generally 2 ⁇ m or more and 600 ⁇ m or less.
  • the adhesive resin layer 40 is a layer provided on one surface side of the unevenness absorbing resin layer 30, and is a circuit of the electronic component 10 when the adhesive laminated film 50 is attached to the circuit forming surface 10A of the electronic component 10. It is a layer that comes into contact with and adheres to the forming surface 10A.
  • Examples of the adhesive constituting the adhesive resin layer 40 include (meth) acrylic adhesive, silicone adhesive, urethane adhesive, olefin adhesive, styrene adhesive and the like. Among these, a (meth) acrylic pressure-sensitive adhesive using a (meth) acrylic polymer as a base polymer is preferable because the adhesive strength can be easily adjusted.
  • the adhesive resin layer 40 is preferably formed by laminating a non-radiation-curable adhesive resin layer from the viewpoint of suppressing adhesive residue on the electronic component 10.
  • a non-radiation-curable adhesive resin layer from the viewpoint of suppressing adhesive residue on the electronic component 10.
  • the pressure-sensitive adhesive constituting the non-radiocurable adhesive resin layer from the viewpoints of adhesiveness to the electronic component 10 and cleanability of the electronic component 10 after peeling with an organic solvent such as ultrapure water or alcohol, ( A (meth) acrylic pressure-sensitive adhesive using a meta) acrylic polymer as a base polymer is preferable.
  • Examples of the (meth) acrylic polymer include (meth) acrylic acid alkyl esters (eg, methyl esters, ethyl esters, propyl esters, isopropyl esters, butyl esters, isobutyl esters, s-butyl esters, t-butyl esters, etc.
  • (meth) acrylic acid alkyl esters eg, methyl esters, ethyl esters, propyl esters, isopropyl esters, butyl esters, isobutyl esters, s-butyl esters, t-butyl esters, etc.
  • Pentyl ester isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, One or more of linear or branched alkyl esters such as hexadecyl ester, octadecyl ester, and ecosil ester) and (meth) acrylic acid cycloalkyl ester (eg, cyclopentyl ester, cyclohexyl ester, etc.) Examples thereof include a polymer used as a monomer component.
  • the (meth) acrylic polymer corresponds to the (meth) acrylic acid alkyl ester or other monomer component copolymerizable with the cycloalkyl ester, if necessary, for the purpose of modifying the cohesive force, heat resistance, etc. It may include units.
  • Such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; Acid anhydride monomers such as acids and itaconic acids anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxy (meth) acrylate Hydrolyl group-containing monomers such as hexyl, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate.
  • carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth)
  • Sulfonic acids such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalene sulfonic acid.
  • Group-containing monomers; phosphate group-containing monomers such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile, acryloylmorpholine and the like can be mentioned. These monomer components may be used alone or in combination of two or more. The amount of these copolymerizable monomers used is preferably 50% by mass or less when the total monomer components are 100% by mass.
  • a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary.
  • a polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylate.
  • the (meth) acrylic polymer can be obtained by polymerizing a mixture containing one or more kinds of monomer components.
  • the polymerization include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like.
  • the number average molecular weight of the (meth) acrylic polymer is preferably 300,000 or more, more preferably about 400,000 to 3 million.
  • an external cross-linking agent can be used in order to increase the number average molecular weight of the (meth) acrylic polymer or the like as the base polymer.
  • the external cross-linking method include a method in which a cross-linking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, or a melamine-based cross-linking agent is added and reacted.
  • the amount of the external cross-linking agent used is appropriately determined depending on the base polymer, and is, for example, preferably 5 parts by mass or less, more preferably 0.01 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the base polymer.
  • the pressure-sensitive adhesive constituting the non-radiation-curable type pressure-sensitive adhesive resin layer may further contain additives such as a pressure-sensitive adhesive and an anti-aging agent, if necessary.
  • the thickness of the adhesive resin layer 40 is not particularly limited, but is preferably 1 ⁇ m or more and 100 ⁇ m or less, and more preferably 3 ⁇ m or more and 50 ⁇ m or less.
  • the adhesive resin layer 40 can be formed, for example, by applying a pressure-sensitive adhesive coating liquid on the unevenness-absorbing resin layer 30.
  • a method for applying the pressure-sensitive adhesive coating liquid conventionally known coating methods, for example, a roll coater method, a reverse roll coater method, a gravure roll method, a bar coat method, a comma coater method, a die coater method and the like can be adopted.
  • the drying conditions of the applied pressure-sensitive adhesive are not particularly limited, but in general, it is preferable to dry the applied adhesive in a temperature range of 80 to 200 ° C. for 10 seconds to 10 minutes. More preferably, it is dried at 80 to 170 ° C. for 15 seconds to 5 minutes.
  • the pressure-sensitive adhesive coating liquid may be heated at 40 to 80 ° C. for about 5 to 300 hours after the drying is completed.
  • the thickness of the entire adhesive laminated film 50 according to the present embodiment is preferably 25 ⁇ m or more and 500 ⁇ m or less, and more preferably 50 ⁇ m or more and 300 ⁇ m or less, from the viewpoint of the balance between mechanical properties and handleability.
  • the adhesive laminated film 50 according to the present embodiment may be provided with an adhesive layer (not shown) between the layers. According to this adhesive layer, the adhesiveness between the layers can be improved.
  • the adhesive laminated film 50 according to the present embodiment is formed by, for example, laminating the adhesive resin layer 40 on the uneven absorbing resin layer 30 of the laminated body having the base material layer 20 and the uneven absorbing resin layer 30. can do.
  • Step (A) First, an electronic component 10 having a circuit forming surface 10A, and an adhesive laminated film 50 having a base material layer 20, an ultraviolet curable uneven absorbing resin layer 30 and an adhesive resin layer 40 in this order are provided, and a circuit is provided.
  • a structure 60 in which the adhesive laminated film 50 is attached to the circuit forming surface 10A of the electronic component 10 is prepared so as to protect the forming surface 10A.
  • such a structure 60 is, for example, on the side opposite to the circuit forming surface 10A of the electronic component 10 in a state where the back grind tape 80 is attached to the circuit forming surface 10A of the electronic component 10.
  • the surface 10C of the electronic component 10 opposite to the circuit forming surface 10A is back grinded while being attached to the back grind tape 80.
  • backgrinding means that the electronic component 10 is thinned to a predetermined thickness without being cracked or damaged.
  • the back grind of the electronic component 10 can be performed by a known method. For example, a method of fixing the electronic component 10 to a chuck table or the like of a grinder and grinding the surface 10C of the electronic component 10 on the side opposite to the circuit forming surface 10A can be mentioned.
  • the back grind tape 80 is not particularly limited, and a generally known back grind tape can be used.
  • the back surface grinding method is not particularly limited, but for example, a known grinding method such as a through-feed method or an in-feed method can be adopted. Each grinding can be performed while cooling water by applying it to the electronic component 10 and the grindstone.
  • the electronic component 10 attached to the back grind tape 80 is not particularly limited as long as it is an electronic component 10 having a circuit forming surface 10A, but for example, a semiconductor wafer, a mold wafer, a mold panel, a mold array package, a semiconductor substrate, or the like can be used.
  • the semiconductor substrate include a silicon substrate, a sapphire substrate, a germanium substrate, a germanium-arsenic substrate, a gallium-phosphosphide substrate, a gallium-arsenide-aluminum substrate, a gallium-arsenide substrate, and a lithium tantalate substrate.
  • the electronic component 10 may be an electronic component for any purpose, but for example, an electronic component for logic (for example, for communication, high frequency signal processing, etc.), a memory, a sensor, a power supply, and the like. Can be mentioned. These may be used alone or in combination of two or more.
  • the circuit forming surface 10A of the electronic component 10 includes, for example, a concavo-convex structure 10B made of electrodes.
  • the metal type constituting the electrode is not particularly limited, and examples thereof include silver, gold, copper, tin, lead, bismuth, and alloys thereof. These metal species may be used alone or in combination of two or more.
  • the method of peeling the back grind tape 80 from the electronic component 10 is not particularly limited, and the back grind tape 80 can be peeled by a generally known method.
  • the method of attaching the adhesive laminated film 50 to the circuit forming surface 10A of the electronic component 10 is not particularly limited, and the adhesive laminated film 50 can be peeled off by a generally known method. For example, it may be performed manually, or it may be performed by a device called an automatic pasting machine to which a roll-shaped adhesive laminated film 50 is attached.
  • Step (B) Next, the unevenness-absorbing resin layer 30 of the adhesive laminated film 50 is cured by irradiating the adhesive laminated film 50 with ultraviolet rays. Thereby, the heat resistance of the adhesive laminated film 50 can be improved. By doing so, even if the adhesive laminated film 50 is exposed to a high temperature in the step (C), the deformation of the adhesive laminated film 50 can be suppressed. Therefore, in the surface treatment step (C) under a high temperature vacuum, the adhesive laminated film 50 can be suppressed from being deformed. It is possible to suppress the floating of the adhesive laminated film 50.
  • the unevenness-absorbing resin layer 30 By irradiating the unevenness-absorbing resin layer 30 with ultraviolet rays, the unevenness-absorbing resin layer 30 can be crosslinked and cured.
  • the ultraviolet rays are emitted from, for example, the surface of the adhesive laminated film 50 on the base material layer 20 side.
  • Step (C) Next, under vacuum heating, the surface 10C on the side opposite to the circuit forming surface 10A of the electronic component 10 is processed.
  • the surface layer 70 can be formed on the surface 10C opposite to the circuit forming surface 10A of the electronic component 10.
  • the surface treatment step (C) is not particularly limited as long as it is a surface treatment under high temperature vacuum performed in the manufacturing step of the electronic device, and examples thereof include an ion implantation step, a metal film forming step, and an annealing treatment step. These steps may be performed individually by one type, or may be performed by combining two or more types.
  • the annealing treatment step is performed after the ion implantation step.
  • the metal film forming step a step of forming a metal thin film such as copper or aluminum on the surface 10C opposite to the circuit forming surface 10A of the electronic component 10 (back metal step) and the like can be mentioned.
  • the metal thin film can be formed by, for example, sputtering, vapor deposition, plating, CVD, or the like.
  • the heating temperature in the surface treatment step (C) is not particularly limited because it is appropriately set by the surface treatment step, but is, for example, 40 ° C. or higher and 350 ° C. or lower, preferably 100 ° C. or higher and 350 ° C. or lower, and more preferably 120 ° C. or higher. ° C or higher 300 ° C or higher.
  • a step (D) of peeling the electronic component 10 and the adhesive laminated film 50 may be further performed after the step (C).
  • the electronic component 10 can be peeled off from the adhesive laminated film 50.
  • the peeling temperature is, for example, 20 to 100 ° C.
  • the electronic component 10 and the adhesive laminated film 50 can be peeled off by a known method.
  • the method for manufacturing an electronic device according to the present embodiment may include other steps other than the above.
  • a step known in the method for manufacturing an electronic device can be used.
  • a dicing process for example, it is generally performed in electronic component manufacturing processes such as a dicing process, a die bonding process, a wire bonding process, a flip chip connection process, a cure heating test process, an impurity activation annealing process, a sealing process, and a reflow process. Any step or the like may be further performed.
  • electronic component manufacturing processes such as a dicing process, a die bonding process, a wire bonding process, a flip chip connection process, a cure heating test process, an impurity activation annealing process, a sealing process, and a reflow process. Any step or the like may be further performed.

Abstract

Provided is a method for producing an electronic device, comprising: a preparation step (A) for preparing a structure (60) which is provided with an electronic part (10) having a circuit formation surface (10A) and an adhesive laminated film (50) having, in this order, a base material layer (20) that includes one polyester-based resin layer, an unevenness absorption resin layer (30) that is ultraviolet-curable, and an adhesive resin layer (40), and in which the adhesive laminated film (50) is affixed to the circuit formation surface (10A) of the electronic part (10) so as to protect the circuit formation surface (10A); an ultraviolet curing step (B) for irradiating the adhesive laminated film (50) with ultraviolet rays so as to cure the unevenness absorption resin layer (30) of the adhesive laminated film (50); and a surface treatment step (C) for treating, under vacuum and with application of heat, the surface of the electronic part (10) on the opposite side from the circuit formation surface (10A).

Description

電子装置の製造方法Manufacturing method of electronic device
　本発明は、電子装置の製造方法に関する。 The present invention relates to a method for manufacturing an electronic device.
　電子装置（例えば、半導体装置）は、電子部品（例えば、半導体ウエハ）の非回路形成面を研削して電子部品の厚みを薄くする工程（バックグラインド工程）や、研削後の電子部品の非回路形成面を表面処理する工程（例えば、イオン注入工程、金属膜形成工程等）等を経て製造される場合がある。
　これらの工程において、電子部品の回路形成面を保護する観点から、電子部品の回路形成面に表面保護フィルムが貼り付けられる場合がある。 An electronic device (for example, a semiconductor device) includes a process of grinding a non-circuit forming surface of an electronic component (for example, a semiconductor wafer) to reduce the thickness of the electronic component (backgrinding process), or a non-circuit of the electronic component after grinding. It may be manufactured through a step of surface-treating the formed surface (for example, an ion injection step, a metal film forming step, etc.).
In these steps, a surface protective film may be attached to the circuit forming surface of the electronic component from the viewpoint of protecting the circuit forming surface of the electronic component.
　このような表面保護フィルムに関する技術としては、例えば、特許文献１（特開２００１－２０３２５５号公報）および特許文献２（特開２００５－３０３０６８号公報）に記載のものが挙げられる。 Examples of the technique related to such a surface protective film include those described in Patent Document 1 (Japanese Patent Laid-Open No. 2001-203255) and Patent Document 2 (Japanese Patent Laid-Open No. 2005-303068).
　特許文献１には、半導体ウエハ加工時において、半導体ウエハ表面に貼り付けて半導体ウエハを保持保護するための粘着シートであって、基材層の片面に弾性率が３０～１０００ｋＰａでありかつゲル分が２０％以下の中間層が設けられ、該中間層の表面に粘着剤層が形成されていることを特徴とする半導体ウエハ保持保護用粘着シートが記載されている。 Patent Document 1 describes an adhesive sheet that is attached to the surface of a semiconductor wafer to hold and protect the semiconductor wafer during processing of a semiconductor wafer, and has an elastic modulus of 30 to 1000 kPa on one side of a base material layer and a gel content. Described is a semiconductor wafer holding and protecting pressure-sensitive adhesive sheet characterized in that an intermediate layer having a value of 20% or less is provided and a pressure-sensitive adhesive layer is formed on the surface of the intermediate layer.
　特許文献２には、半導体ウエハ加工時において、半導体ウエハ表面に貼り付けて半導体ウエハを保持保護するための粘着シートであって、基材層の片面に、２５℃における弾性率が１０～１０００ｋＰａでありかつゲル分が２６～４５％の中間層が設けられ、該中間層の表面に粘着剤層が形成されていることを特徴とする半導体ウエハ保持保護用粘着シートが記載されている。 Patent Document 2 describes an adhesive sheet that is attached to the surface of a semiconductor wafer to hold and protect the semiconductor wafer during processing of a semiconductor wafer, and has an elastic modulus of 10 to 1000 kPa at 25 ° C. on one side of a base material layer. Described is a semiconductor wafer holding and protecting pressure-sensitive adhesive sheet characterized in that an intermediate layer having a gel content of 26 to 45% is provided and an adhesive layer is formed on the surface of the intermediate layer.
特開２００１－２０３２５５号公報Japanese Unexamined Patent Publication No. 2001-203255 特開２００５－３０３０６８号公報Japanese Unexamined Patent Publication No. 2005-303068
　本発明者らの検討によれば、従来の電子装置の製造方法において、高温真空下での表面処理工程において、粘着性フィルムの浮きが生じる場合があることが明らかになった。
　本発明は上記事情に鑑みてなされたものであり、高温真空下での表面処理工程において、粘着性フィルムの浮きを抑制することが可能な電子装置の製造方法を提供するものである。 According to the studies by the present inventors, it has been clarified that in the conventional method for manufacturing an electronic device, the adhesive film may float in the surface treatment step under high temperature vacuum.
The present invention has been made in view of the above circumstances, and provides a method for manufacturing an electronic device capable of suppressing floating of an adhesive film in a surface treatment step under a high temperature vacuum.
　本発明者らは、上記課題を達成するために鋭意検討を重ねた。その結果、電子部品の回路形成面を保護するための表面保護フィルムとして、基材層、紫外線硬化型の凹凸吸収性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルムを使用し、高温真空下での表面処理工程の前に、凹凸吸収性樹脂層を紫外線硬化させることによって、高温真空下での表面処理工程において、粘着性フィルムの浮きを抑制することができることを見出して、本発明を完成させた。 The present inventors have made extensive studies to achieve the above problems. As a result, as a surface protective film for protecting the circuit forming surface of the electronic component, an adhesive laminated film having a base material layer, an ultraviolet curable unevenness absorbing resin layer and an adhesive resin layer in this order is used. We have found that by curing the unevenness-absorbing resin layer with ultraviolet rays before the surface treatment step under high-temperature vacuum, it is possible to suppress the floating of the adhesive film in the surface treatment step under high-temperature vacuum. The invention was completed.
　本発明によれば、以下に示す電子装置の製造方法が提供される。 According to the present invention, the following method for manufacturing an electronic device is provided.
［１］
　回路形成面を有する電子部品と、ポリエステル系樹脂層を一層含む基材層、紫外線硬化型の凹凸吸収性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルムと、を備え、上記回路形成面を保護するように上記電子部品の上記回路形成面に上記粘着性積層フィルムが貼り付けられた構造体を準備する準備工程（Ａ）と、
　上記粘着性積層フィルムに対して紫外線を照射することにより、上記粘着性積層フィルムの上記凹凸吸収性樹脂層を硬化させる紫外線硬化工程（Ｂ）と、
　真空加熱下で、上記電子部品の上記回路形成面とは反対側の表面を処理する表面処理工程（Ｃ）と、
を備える電子装置の製造方法。
［２］
　上記［１］に記載の電子装置の製造方法において、
　上記準備工程（Ａ）は、
　　上記電子部品の上記回路形成面にバックグラインドテープが貼り付けられた状態で、上記電子部品の上記回路形成面とは反対側の面をバックグラインドするバックグラインド工程と、
　　上記バックグラインド工程の後に、上記電子部品から上記バックグラインドテープを剥がす工程と、
　　上記電子部品の上記回路形成面に上記粘着性積層フィルムを貼り付ける工程と、を含む電子装置の製造方法。
［３］
　上記［１］または［２］に記載の電子装置の製造方法において、
　上記表面処理工程（Ｃ）は、イオン注入工程、金属膜形成工程およびアニール処理工程からなる群から選択される一種または二種以上を含む電子装置の製造方法。
［４］
　上記［１］乃至［３］のいずれか一つに記載の電子装置の製造方法において、
　上記表面処理工程（Ｃ）における加熱温度が４０℃以上３５０℃以下である電子装置の製造方法。
［５］
　上記［１］乃至［４］のいずれか一つに記載の電子装置の製造方法において、
　上記電子部品の上記回路形成面に凹凸構造を含む電子装置の製造方法。
［６］
　上記［５］に記載の電子装置の製造方法において、
　上記凹凸構造の高さをＨ［μｍ］とし、上記凹凸吸収性樹脂層の厚みをｄ［μｍ］としたとき、Ｈ／ｄが０．０１以上１以下である電子装置の製造方法。
［７］
　上記［１］乃至［６］のいずれか一つに記載の電子装置の製造方法において、
　上記凹凸吸収性樹脂層が架橋性樹脂を含む電子装置の製造方法。
［８］
　上記［１］乃至［７］のいずれか一つに記載の電子装置の製造方法において、
　上記凹凸吸収性樹脂層の厚みが１０μｍ以上１０００μｍ以下である電子装置の製造方法。
［９］
　上記［１］乃至［８］のいずれか一つに記載の電子装置の製造方法において、
　上記粘着性樹脂層を構成する粘着剤が（メタ）アクリル系粘着剤、シリコーン系粘着剤、ウレタン系粘着剤、オレフィン系粘着剤およびスチレン系粘着剤から選択される一種または二種以上を含む電子装置の製造方法。
［１０］
　上記［１］乃至［９］のいずれか一つに記載の電子装置の製造方法において、
　上記粘着性積層フィルムは、上記基材層および上記凹凸吸収性樹脂層を有する積層体の上記凹凸吸収性樹脂層上に、非放射線硬化型の粘着性樹脂層を積層することにより形成されたフィルムである電子装置の製造方法。
［１１］
　上記［１］乃至［１０］のいずれか一つに記載の電子装置の製造方法に用いられる上記粘着性積層フィルムであって、
　ポリエステル系樹脂層を一層含む基材層、紫外線硬化型の凹凸吸収性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルム。
［１２］
　上記［１１］に記載の粘着性積層フィルムにおいて、
　上記基材層および上記凹凸吸収性樹脂層を有する積層体の上記凹凸吸収性樹脂層上に、非放射線硬化型の粘着性樹脂層を積層することにより形成された粘着性積層フィルム。 [1]
The circuit includes an electronic component having a circuit-forming surface, a base material layer including a polyester-based resin layer, an ultraviolet-curable uneven-absorbing resin layer, and an adhesive laminated film having an adhesive resin layer in this order. The preparatory step (A) of preparing a structure in which the adhesive laminated film is attached to the circuit forming surface of the electronic component so as to protect the forming surface, and
The ultraviolet curing step (B) of curing the uneven absorbing resin layer of the adhesive laminated film by irradiating the adhesive laminated film with ultraviolet rays, and
A surface treatment step (C) of treating the surface of the electronic component on the side opposite to the circuit forming surface under vacuum heating, and
A method of manufacturing an electronic device comprising.
[2]
In the method for manufacturing an electronic device according to the above [1],
The preparation step (A) is
A backgrinding step of backgrinding the surface of the electronic component opposite to the circuit forming surface with the backgrinding tape attached to the circuit forming surface of the electronic component.
After the back grind process, a step of peeling the back grind tape from the electronic component and
A method for manufacturing an electronic device, which comprises a step of attaching the adhesive laminated film to the circuit forming surface of the electronic component.
[3]
In the method for manufacturing an electronic device according to the above [1] or [2].
The surface treatment step (C) is a method for manufacturing an electronic device including one or more selected from the group consisting of an ion implantation step, a metal film forming step, and an annealing treatment step.
[4]
In the method for manufacturing an electronic device according to any one of the above [1] to [3].
A method for manufacturing an electronic device in which the heating temperature in the surface treatment step (C) is 40 ° C. or higher and 350 ° C. or lower.
[5]
In the method for manufacturing an electronic device according to any one of the above [1] to [4].
A method for manufacturing an electronic device including an uneven structure on the circuit forming surface of the electronic component.
[6]
In the method for manufacturing an electronic device according to the above [5],
A method for manufacturing an electronic device in which H / d is 0.01 or more and 1 or less when the height of the uneven structure is H [μm] and the thickness of the uneven absorbing resin layer is d [μm].
[7]
In the method for manufacturing an electronic device according to any one of the above [1] to [6].
A method for manufacturing an electronic device in which the uneven absorbing resin layer contains a crosslinkable resin.
[8]
In the method for manufacturing an electronic device according to any one of the above [1] to [7].
A method for manufacturing an electronic device in which the thickness of the uneven absorbing resin layer is 10 μm or more and 1000 μm or less.
[9]
In the method for manufacturing an electronic device according to any one of the above [1] to [8].
An electron containing one or more selected from (meth) acrylic pressure-sensitive adhesive, silicone-based pressure-sensitive adhesive, urethane-based pressure-sensitive adhesive, olefin-based pressure-sensitive adhesive, and styrene-based pressure-sensitive adhesive. How to manufacture the device.
[10]
In the method for manufacturing an electronic device according to any one of the above [1] to [9].
The adhesive laminated film is a film formed by laminating a non-radiation-curable adhesive resin layer on the uneven absorbing resin layer of a laminate having the base material layer and the uneven absorbing resin layer. A method of manufacturing an electronic device that is.
[11]
The adhesive laminated film used in the method for manufacturing an electronic device according to any one of [1] to [10].
An adhesive laminated film having a base material layer including a polyester resin layer, an ultraviolet curable uneven absorption resin layer, and an adhesive resin layer in this order.
[12]
In the adhesive laminated film according to the above [11],
An adhesive laminated film formed by laminating a non-radiation-curable adhesive resin layer on the uneven absorbent resin layer of a laminate having the base material layer and the uneven absorbent resin layer.
　本発明によれば、高温真空下での表面処理工程において、粘着性フィルムの浮きを抑制することが可能な電子装置の製造方法を提供することができる。 According to the present invention, it is possible to provide a method for manufacturing an electronic device capable of suppressing floating of an adhesive film in a surface treatment step under a high temperature vacuum.
本発明に係る実施形態の電子装置の製造方法の一例を模式的に示した断面図である。It is sectional drawing which shows typically an example of the manufacturing method of the electronic apparatus of embodiment which concerns on this invention. 本発明に係る実施形態の電子装置の製造方法の一例を模式的に示した断面図である。It is sectional drawing which shows typically an example of the manufacturing method of the electronic apparatus of embodiment which concerns on this invention.
　以下、本発明の実施形態について、図面を用いて説明する。なお、すべての図面において、同様な構成要素には共通の符号を付し、適宜説明を省略する。また、図は概略図であり、実際の寸法比率とは一致していない。また、数値範囲の「Ａ～Ｂ」は特に断りがなければ、Ａ以上Ｂ以下を表す。また、本実施形態において、「（メタ）アクリル」とは、アクリル、メタクリルまたはアクリルおよびメタクリルの両方を意味する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, similar components are designated by a common reference numeral, and the description thereof will be omitted as appropriate. Moreover, the figure is a schematic view and does not match the actual dimensional ratio. Further, "AB" in the numerical range represents A or more and B or less unless otherwise specified. Further, in the present embodiment, "(meth) acrylic" means acrylic, methacryl or both acrylic and methacryl.
　図１および図２は、本発明に係る実施形態の電子装置の製造方法の一例を模式的に示した断面図である。 1 and 2 are cross-sectional views schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention.
　本実施形態に係る電子装置の製造方法は、以下の工程（Ａ）、工程（Ｂ）および工程（Ｃ）を含む。
　（Ａ）回路形成面１０Ａを有する電子部品１０と、ポリエステル系樹脂層を一層含む基材層２０、紫外線硬化型の凹凸吸収性樹脂層３０および粘着性樹脂層４０をこの順番に有する粘着性積層フィルム５０と、を備え、回路形成面１０Ａを保護するように電子部品１０の回路形成面１０Ａに粘着性積層フィルム５０が貼り付けられた構造体６０を準備する準備工程
　（Ｂ）粘着性積層フィルム５０に対して紫外線を照射することにより、粘着性積層フィルム５０の凹凸吸収性樹脂層３０を硬化させる紫外線硬化工程
　（Ｃ）真空加熱下で、電子部品１０の回路形成面１０Ａとは反対側の表面を処理する表面処理工程 The method for manufacturing an electronic device according to the present embodiment includes the following steps (A), steps (B), and steps (C).
(A) An adhesive laminate having an electronic component 10 having a circuit forming surface 10A, a base material layer 20 including a polyester resin layer, an ultraviolet curable uneven absorption resin layer 30 and an adhesive resin layer 40 in this order. Preparation step of preparing a structure 60 having a film 50 and an adhesive laminated film 50 attached to the circuit forming surface 10A of the electronic component 10 so as to protect the circuit forming surface 10A (B) Adhesive laminated film Ultraviolet curing step of curing the unevenness-absorbing resin layer 30 of the adhesive laminated film 50 by irradiating 50 with ultraviolet rays (C) Under vacuum heating, on the side opposite to the circuit forming surface 10A of the electronic component 10. Surface treatment process to treat the surface
　前述したように、本発明者らの検討によれば、電子装置の製造方法において、高温真空下での表面処理工程において、粘着性フィルムの浮きが生じる場合があることが明らかになった。
　本発明者らは、上記課題を達成するために鋭意検討を重ねた。その結果、電子部品１０の回路形成面１０Ａを保護するための表面保護フィルムとして、基材層２０、紫外線硬化型の凹凸吸収性樹脂層３０および粘着性樹脂層４０をこの順番に有する粘着性積層フィルム５０を使用し、高真空加熱下で、電子部品１０の回路形成面１０Ａとは反対側の表面を処理する表面処理工程（Ｃ）の前に、粘着性積層フィルム５０に対して紫外線を照射することにより、粘着性積層フィルム５０の凹凸吸収性樹脂層３０を硬化させる紫外線硬化工程（Ｂ）をおこなうことによって、高温真空下での表面処理工程（Ｃ）において、粘着性積層フィルム５０の浮きを抑制することができることを見出した。
　粘着性積層フィルム５０の凹凸吸収性樹脂層３０を硬化させることによって、粘着性積層フィルム５０の耐熱性を高めることができ、高温真空下での表面処理工程（Ｃ）での粘着性積層フィルム５０の反り等の変形を抑えることができる。その結果、高温真空下での表面処理工程（Ｃ）において、粘着性積層フィルム５０の浮きを抑制することができる。
　以上のように、本実施形態に係る電子装置の製造方法によれば、高温真空下での表面処理工程において、粘着性フィルムの浮きを抑制することが可能となる。 As described above, according to the studies by the present inventors, it has been clarified that in the method for manufacturing an electronic device, the adhesive film may float in the surface treatment step under high temperature vacuum.
The present inventors have made extensive studies to achieve the above problems. As a result, as a surface protective film for protecting the circuit forming surface 10A of the electronic component 10, an adhesive laminate having a base material layer 20, an ultraviolet curable uneven absorbing resin layer 30 and an adhesive resin layer 40 in this order. The adhesive laminated film 50 is irradiated with ultraviolet rays before the surface treatment step (C) in which the film 50 is used and the surface of the electronic component 10 opposite to the circuit forming surface 10A is treated under high vacuum heating. By performing the ultraviolet curing step (B) of curing the unevenness-absorbing resin layer 30 of the adhesive laminated film 50, the adhesive laminated film 50 floats in the surface treatment step (C) under high temperature vacuum. It was found that it can be suppressed.
By curing the unevenness-absorbing resin layer 30 of the adhesive laminated film 50, the heat resistance of the adhesive laminated film 50 can be enhanced, and the adhesive laminated film 50 in the surface treatment step (C) under high temperature vacuum can be improved. It is possible to suppress deformation such as warpage of the film. As a result, floating of the adhesive laminated film 50 can be suppressed in the surface treatment step (C) under high temperature vacuum.
As described above, according to the method for manufacturing an electronic device according to the present embodiment, it is possible to suppress the floating of the adhesive film in the surface treatment step under high temperature vacuum.
１．粘着性積層フィルム
　以下、本実施形態に係る電子装置の製造方法で用いる粘着性積層フィルム５０について説明する。 1. 1. Adhesive Laminated Film The adhesive laminated film 50 used in the method for manufacturing an electronic device according to the present embodiment will be described below.
＜基材層＞
　基材層２０はポリエステル系樹脂層を一層のみ含むものであり、粘着性積層フィルム５０の取り扱い性や機械的特性、耐熱性等の特性をより良好にすることを目的として設けられる層である。ポリエステル系樹脂層を構成するポリエステル系樹脂としては、例えば、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリエステル系エラストマー等が挙げられる。
　基材層２０は特に限定されないが、例えば、樹脂フィルムが挙げられる。
　基材層２０はポリエステル系樹脂層以外の樹脂層を含んでもよい。
　ポリエステル系樹脂層以外の樹脂層を構成する樹脂としては、公知の熱可塑性樹脂を用いることができる。例えば、ポリエチレン、ポリプロピレン、ポリ（４－メチル－１－ペンテン）、ポリ（１－ブテン）等のポリオレフィン；ナイロン－６、ナイロン－６６、ポリメタキシレンアジパミド等のポリアミド；ポリアクリレート；ポリメタアクリレート；ポリ塩化ビニル；ポリイミド；ポリエーテルイミド；ポリアミドイミド；エチレン・酢酸ビニル共重合体；ポリアクリロニトリル；ポリカーボネート；ポリスチレン；アイオノマー；ポリスルホン；ポリエーテルスルホン；ポリエーテルエーテルケトン；ポリフェニレンスルフィド；ポリフェニレンエーテル；ポリアミド系エラストマー、ポリイミド系エラストマー等のエラストマー；等から選択される一種または二種以上を挙げることができる。
　また、基材層２０を構成する樹脂としては、ポリエチレンテレフタレートおよびポリエチレンナフタレートから選択される少なくとも一種が好ましい。 <Base layer>
The base material layer 20 contains only one polyester-based resin layer, and is a layer provided for the purpose of improving the handleability, mechanical properties, heat resistance, and other properties of the adhesive laminated film 50. Examples of the polyester-based resin constituting the polyester-based resin layer include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polyester-based elastomer.
The base material layer 20 is not particularly limited, and examples thereof include a resin film.
The base material layer 20 may include a resin layer other than the polyester resin layer.
As the resin constituting the resin layer other than the polyester-based resin layer, a known thermoplastic resin can be used. For example, polyolefins such as polyethylene, polypropylene, poly (4-methyl-1-pentene), poly (1-butene); polyamides such as nylon-6, nylon-66, polymethoxylen adipamide; polyacrylates; polymethas. Aacrylate; Polyvinyl chloride; Polyimide; Polyetherimide; Polyamideimide; Ethylene-vinyl acetate copolymer; Polyacrylonitrile; Polycarbonate; Polystyrene; Ionomer; Polysulfone; Polyethersulfone; Polyether ether ketone; Polyphenylene sulfide; Polyphenylene ether; Polyamide Elastomers such as elastomers and polyimide elastomers; one or more selected from the above can be mentioned.
Further, as the resin constituting the base material layer 20, at least one selected from polyethylene terephthalate and polyethylene naphthalate is preferable.
　基材層２０の融点は１００℃以上であることが好ましい。融点上限は特に限定されず、加工性等を鑑みて選択すればよい。
　このような基材層２０を用いると、表面処理工程（Ｃ）において粘着性積層フィルム５０が高温に曝されても粘着性積層フィルム５０の変形や溶融をより一層抑制することができる。 The melting point of the base material layer 20 is preferably 100 ° C. or higher. The upper limit of the melting point is not particularly limited, and may be selected in consideration of processability and the like.
By using such a base material layer 20, even if the adhesive laminated film 50 is exposed to a high temperature in the surface treatment step (C), the deformation and melting of the adhesive laminated film 50 can be further suppressed.
　基材層２０は、単層であっても、二種以上の層であってもよい。
　また、基材層２０を形成するために使用する樹脂フィルムの形態としては、延伸フィルムであってもよいし、一軸方向または二軸方向に延伸したフィルムであってもよい。 The base material layer 20 may be a single layer or two or more types of layers.
Further, the form of the resin film used for forming the base material layer 20 may be a stretched film or a film stretched in the uniaxial direction or the biaxial direction.
　基材層２０の厚さは、例えば、バックグラインド後の電子部品の反り等を防止する観点から、好ましくは１０μｍ以上、より好ましくは２０μｍ以上、さらに好ましくは２５μｍ以上、特に好ましくは５０μｍ以上である。また、粘着性積層フィルム５０を電子部品に貼付ける際の当該粘着性積層フィルム５０のカットしやすさ、粘着性積層フィルム５０の製品形態をロール状にする場合の生産性等の観点から、好ましくは５００μｍ以下、より好ましくは３００μｍ以下、さらに好ましくは２５０μｍ以下、特に好ましくは７５μｍ以下である。
　基材層２０は他の層との接着性を改良するために、表面処理を行ってもよい。具体的には、コロナ処理、プラズマ処理、アンダーコート処理、プライマーコート処理等を行ってもよい。 The thickness of the base material layer 20 is preferably 10 μm or more, more preferably 20 μm or more, still more preferably 25 μm or more, and particularly preferably 50 μm or more, from the viewpoint of preventing warpage of electronic components after backgrinding. .. Further, it is preferable from the viewpoints of ease of cutting the adhesive laminated film 50 when the adhesive laminated film 50 is attached to an electronic component, productivity when the product form of the adhesive laminated film 50 is rolled, and the like. Is 500 μm or less, more preferably 300 μm or less, still more preferably 250 μm or less, and particularly preferably 75 μm or less.
The base material layer 20 may be surface-treated in order to improve the adhesiveness with other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coating treatment and the like may be performed.
＜凹凸吸収性樹脂層＞
　本実施形態に係る粘着性積層フィルム５０は、基材層２０と粘着性樹脂層４０との間に紫外線硬化型の凹凸吸収性樹脂層３０を有する。
　凹凸吸収性樹脂層３０は、粘着性積層フィルム５０の回路形成面１０Ａへの追従性を良好にし、回路形成面１０Ａと粘着性積層フィルム５０との密着性を良好にすることを目的として設けられる層である。さらに、凹凸吸収性樹脂層３０は紫外線照射によって硬化することで、粘着性積層フィルム５０の耐熱性を高めることを目的として設けられる層である。これによって、高温真空下での表面処理工程（Ｃ）において、粘着性積層フィルム５０の浮きを抑制することが可能となる。 <Concave and convex absorbent resin layer>
The adhesive laminated film 50 according to the present embodiment has an ultraviolet curable type unevenness absorbing resin layer 30 between the base material layer 20 and the adhesive resin layer 40.
The unevenness absorbing resin layer 30 is provided for the purpose of improving the followability of the adhesive laminated film 50 to the circuit forming surface 10A and improving the adhesion between the circuit forming surface 10A and the adhesive laminated film 50. It is a layer. Further, the unevenness absorbing resin layer 30 is a layer provided for the purpose of increasing the heat resistance of the adhesive laminated film 50 by being cured by irradiation with ultraviolet rays. This makes it possible to suppress the floating of the adhesive laminated film 50 in the surface treatment step (C) under high temperature vacuum.
　凹凸吸収性樹脂層３０を構成する樹脂は、凹凸吸収性を示すものであれば特に限定されないが、例えば、ポリオレフィン系樹脂、ポリスチレン系樹脂、および（メタ）アクリル系樹脂からなる群から選択される一種または二種以上が挙げられる。 The resin constituting the unevenness-absorbing resin layer 30 is not particularly limited as long as it exhibits unevenness-absorbing property, and is selected from the group consisting of, for example, a polyolefin-based resin, a polystyrene-based resin, and a (meth) acrylic-based resin. One or more types may be mentioned.
　また、凹凸吸収性樹脂層３０は架橋性樹脂を含むことが好ましい。凹凸吸収性樹脂層３０が架橋性樹脂を含むことにより、紫外線硬化工程（Ｂ）において、凹凸吸収性樹脂層３０をより効果的に紫外線架橋させることができ、凹凸吸収性樹脂層３０の耐熱性をより一層向上させることが可能となる。これにより、表面処理工程（Ｃ）において粘着性積層フィルム５０が高温に曝されても粘着性積層フィルム５０の変形や溶融をより一層抑制することができる。
　本実施形態に係る架橋性樹脂としては凹凸吸収性樹脂層３０を形成でき、かつ、紫外線によって架橋して耐熱性が向上する樹脂であれば特に限定されないが、例えば、エチレンおよび炭素数３～２０のα－オレフィンとを含むエチレン・α－オレフィン共重合体、高密度エチレン系樹脂、低密度エチレン系樹脂、中密度エチレン系樹脂、超低密度エチレン系樹脂、直鎖状低密度ポリエチレン（ＬＬＤＰＥ）系樹脂、プロピレン（共）重合体、１－ブテン（共）重合体、４－メチルペンテン－１（共）重合体、エチレン・環状オレフィン共重合体、エチレン・α－オレフィン・環状オレフィン共重合体、エチレン・α－オレフィン・非共役ポリエン共重合体、エチレン・α－オレフィン・共役ポリエン共重合体、エチレン・芳香族ビニル共重合体、エチレン・α－オレフィン・芳香族ビニル共重合体等のオレフィン系樹脂；エチレン・不飽和無水カルボン酸共重合体、エチレン・α－オレフィン・不飽和無水カルボン酸共重合体等のエチレン・無水カルボン酸系共重合体；エチレン・エポキシ含有不飽和化合物共重合体、エチレン・α－オレフィン・エポキシ含有不飽和化合物共重合体等のエチレン・エポキシ系共重合体；エチレン・（メタ）アクリル酸エチル共重合体、エチレン・（メタ）アクリル酸メチル共重合体、エチレン・（メタ）アクリル酸プロピル共重合体、エチレン・（メタ）アクリル酸ブチル共重合体、エチレン・（メタ）アクリル酸ヘキシル共重合体、エチレン・（メタ）アクリル酸－２－ヒドロキシエチル共重合体、エチレン・（メタ）アクリル酸－２－ヒドロキシプロピル共重合体、エチレン・（メタ）アクリル酸グリシジル共重合体等のエチレン・（メタ）アクリル酸エステル共重合体；エチレン・（メタ）アクリル酸共重合体、エチレン・マレイン酸共重合体、エチレン・フマル酸共重合体、エチレン・クロトン酸共重合体等のエチレン・エチレン性不飽和酸共重合体；エチレン・酢酸ビニル共重合体、エチレン・プロピオン酸ビニル共重合体、エチレン・酪酸ビニル共重合体、エチレン・ステアリン酸ビニル共重合体等のエチレン・ビニルエステル共重合体；エチレン・スチレン共重合体等；（メタ）アクリル酸エステル（共）重合体等の不飽和カルボン酸エステル（共）重合体；エチレン・アクリル酸金属塩共重合体、エチレン・メタアクリル酸金属塩共重合体等のアイオノマー樹脂；ウレタン系樹脂；シリコーン系樹脂；アクリル酸系樹脂；メタアクリル酸系樹脂；環状オレフィン（共）重合体；α－オレフィン・芳香族ビニル化合物・芳香族ポリエン共重合体；エチレン・α－オレフィン・芳香族ビニル化合物；芳香族ポリエン共重合体；エチレン・芳香族ビニル化合物・芳香族ポリエン共重合体；スチレン系樹脂；アクリロニトリル・ブタジエン・スチレン共重合体；スチレン・共役ジエン共重合体；アクリロニトリル・スチレン共重合体；アクリロニトリル・エチレン・α－オレフィン・非共役ポリエン・スチレン共重合体；アクリロニトリル・エチレン・α－オレフィン・共役ポリエン・スチレン共重合体；メタアクリル酸・スチレン共重合体；エチレンテレフタレート樹脂；フッ素樹脂；ポリエステルカーボネート；ポリ塩化ビニル；ポリ塩化ビニリデン；ポリオレフィン系熱可塑性エラストマー；ポリスチレン系熱可塑性エラストマー；ポリウレタン系熱可塑性エラストマー；１，２－ポリブタジエン系熱可塑性エラストマー；トランスポリイソプレン系熱可塑性エラストマー；塩素化ポリエチレン系熱可塑性エラストマー；液晶性ポリエステル；ポリ乳酸等から選択される一種または二種以上を用いることができる。 Further, the uneven absorbing resin layer 30 preferably contains a crosslinkable resin. Since the uneven absorbing resin layer 30 contains the crosslinkable resin, the uneven absorbing resin layer 30 can be more effectively crosslinked with ultraviolet rays in the ultraviolet curing step (B), and the heat resistance of the uneven absorbing resin layer 30 can be obtained. Can be further improved. As a result, even if the adhesive laminated film 50 is exposed to a high temperature in the surface treatment step (C), the deformation and melting of the adhesive laminated film 50 can be further suppressed.
The crosslinkable resin according to the present embodiment is not particularly limited as long as it can form the uneven absorption resin layer 30 and is crosslinked by ultraviolet rays to improve heat resistance, but is not particularly limited, and is, for example, ethylene and 3 to 20 carbon atoms. Ethylene / α-olefin copolymer containing α-olefin, high density ethylene resin, low density ethylene resin, medium density ethylene resin, ultra low density ethylene resin, linear low density polyethylene (LLDPE) System resin, propylene (co) polymer, 1-butene (co) polymer, 4-methylpentene-1 (co) polymer, ethylene / cyclic olefin copolymer, ethylene / α-olefin / cyclic olefin copolymer , Ethylene / α-olefin / non-conjugated polyene copolymer, ethylene / α-olefin / conjugated polyene copolymer, ethylene / aromatic vinyl copolymer, ethylene / α-olefin / aromatic vinyl copolymer and other olefins Based resin: Ethylene / anhydrous carboxylic acid copolymer such as ethylene / unsaturated anhydrous carboxylic acid copolymer, ethylene / α-olefin / unsaturated anhydrous carboxylic acid copolymer; ethylene / epoxy-containing unsaturated compound copolymer Ethylene-epoxy copolymers such as ethylene / α-olefin / epoxy-containing unsaturated compound copolymers; ethylene / ethyl (meth) acrylate copolymers, ethylene / methyl (meth) acrylate copolymers, ethylene・ (Meta) propyl acrylate copolymer, ethylene ・ (meth) butyl acrylate copolymer, ethylene ・ (meth) hexyl acrylate copolymer, ethylene ・ (meth) acrylate-2-hydroxyethyl copolymer , Ethylene / (meth) acrylic acid-2-hydroxypropyl copolymer, ethylene / (meth) acrylate copolymer such as ethylene / glycidyl (meth) acrylate copolymer; ethylene / (meth) acrylic acid Ethylene / ethylenically unsaturated acid copolymers such as polymers, ethylene / maleic acid copolymers, ethylene / fumaric acid copolymers, ethylene / crotonic acid copolymers; ethylene / vinyl acetate copolymers, ethylene / propion Ethylene / vinyl ester copolymers such as vinyl acid acid copolymer, ethylene / vinyl butyrate copolymer, ethylene / vinyl stearate copolymer; ethylene / styrene copolymer, etc .; (meth) acrylic acid ester (co) weight Unsaturated carboxylic acid ester (co) polymer such as coalescence; ionic resin such as ethylene / metal acrylic acid metal salt copolymer, ethylene / methacrylic acid metal salt copolymer; ureta Styrene-based resin; Silicone-based resin; Acrylic acid-based resin; Metaacrylic acid-based resin; Cyclic olefin (co) polymer; α-olefin / aromatic vinyl compound / aromatic polyene copolymer; ethylene / α-olefin / aromatic Group vinyl compound; aromatic polyene copolymer; ethylene / aromatic vinyl compound / aromatic polyene copolymer; styrene resin; acrylonitrile / butadiene / styrene copolymer; styrene / conjugated diene copolymer; acrylonitrile / styrene Polymer; acrylonitrile / ethylene / α-olefin / non-conjugated polyene / styrene copolymer; acrylonitrile / ethylene / α-olefin / conjugated polyene / styrene copolymer; methacrylic acid / styrene copolymer; ethylene terephthalate resin; fluorine Resin; Polyester carbonate; Polyvinyl chloride; Polyvinylidene chloride; Polyolefin-based thermoplastic elastomer; Styrene-based thermoplastic elastomer; Styrene-based thermoplastic elastomer; 1,2-Polybutadiene-based thermoplastic elastomer; Transpolyisoprene-based thermoplastic elastomer; Chlorine One or more selected from synthetic polyethylene-based thermoplastic elastomers; liquid crystal polyesters; polylactic acid and the like can be used.
　これらの中でも、有機過酸化物等の架橋剤を用いた紫外線架橋が容易であることから、エチレンおよび炭素数３～２０のα－オレフィンからなるエチレン・α－オレフィン共重合体、低密度エチレン系樹脂、中密度エチレン系樹脂、超低密度エチレン系樹脂、直鎖状低密度ポリエチレン（ＬＬＤＰＥ）系樹脂、エチレン・環状オレフィン共重合体、エチレン・α－オレフィン・環状オレフィン共重合体、エチレン・α－オレフィン・非共役ポリエン共重合体、エチレン・α－オレフィン・共役ポリエン共重合体、エチレン・芳香族ビニル共重合体、エチレン・α－オレフィン・芳香族ビニル共重合体等のオレフィン系樹脂、エチレン・不飽和無水カルボン酸共重合体、エチレン・α－オレフィン・不飽和無水カルボン酸共重合体、エチレン・エポキシ含有不飽和化合物共重合体、エチレン・α－オレフィン・エポキシ含有不飽和化合物共重合体、エチレン・酢酸ビニル共重合体、エチレン・アクリル酸共重合体、エチレン・メタアクリル酸共重合体等のエチレン・不飽和カルボン酸共重合体、１，２－ポリブタジエン系熱可塑性エラストマーから選択される一種または二種以上を用いることが好ましい。
　エチレンおよび炭素数３～２０のα－オレフィンからなるエチレン・α－オレフィン共重合体、低密度エチレン系樹脂、超低密度エチレン系樹脂、直鎖状低密度ポリエチレン（ＬＬＤＰＥ）系樹脂、エチレン・α－オレフィン・非共役ポリエン共重合体、エチレン・α－オレフィン・共役ポリエン共重合体、エチレン・不飽和無水カルボン酸共重合体、エチレン・α－オレフィン・不飽和無水カルボン酸共重合体、エチレン・エポキシ含有不飽和化合物共重合体、エチレン・α－オレフィン・エポキシ含有不飽和化合物共重合体、エチレン・酢酸ビニル共重合体、エチレン・アクリル酸共重合体、エチレン・メタアクリル酸共重合体等のエチレン・不飽和カルボン酸共重合体から選択される一種または二種以上を用いることがより好ましい。
　エチレンおよび炭素数３～２０のα－オレフィンからなるエチレン・α－オレフィン共重合体、低密度エチレン系樹脂、超低密度エチレン系樹脂、直鎖状低密度ポリエチレン（ＬＬＤＰＥ）系樹脂、エチレン・α－オレフィン・非共役ポリエン共重合体、エチレン・α－オレフィン・共役ポリエン共重合体、エチレン・酢酸ビニル共重合体、エチレン・アクリル酸共重合体、エチレン・メタアクリル酸共重合体等のエチレン・不飽和カルボン酸共重合体から選択される一種または二種以上を用いることがさらに好ましい。
　これらの中でも、エチレン・α－オレフィン共重合体およびエチレン・酢酸ビニル共重合体から選択される少なくとも一種が特に好ましく使用される。なお本実施形態においては上述した樹脂は、単独で用いてもよいし、ブレンドして用いてもよい。 Among these, since it is easy to crosslink with ultraviolet rays using a cross-linking agent such as an organic peroxide, an ethylene / α-olefin copolymer composed of ethylene and an α-olefin having 3 to 20 carbon atoms, a low-density ethylene-based copolymer. Resins, medium-density ethylene-based resins, ultra-low-density ethylene-based resins, linear low-density polyethylene (LLDPE) -based resins, ethylene / cyclic olefin copolymers, ethylene / α-olefin / cyclic olefin copolymers, ethylene / α -Olefin-based resins such as olefin / non-conjugated polyene copolymer, ethylene / α-olefin / conjugated polyene copolymer, ethylene / aromatic vinyl copolymer, ethylene / α-olefin / aromatic vinyl copolymer, ethylene -Unsaturated anhydrous carboxylic acid copolymer, ethylene / α-olefin / unsaturated anhydrous carboxylic acid copolymer, ethylene / epoxy-containing unsaturated compound copolymer, ethylene / α-olefin / epoxy-containing unsaturated compound copolymer , Ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / unsaturated carboxylic acid copolymer such as ethylene / methacrylic acid copolymer, 1,2-polybutadiene thermoplastic elastomer It is preferable to use one type or two or more types.
Ethylene / α-olefin copolymer composed of ethylene and α-olefin having 3 to 20 carbon atoms, low density ethylene resin, ultra low density ethylene resin, linear low density polyethylene (LLDPE) resin, ethylene / α -Olefin / non-conjugated polyene copolymer, ethylene / α-olefin / conjugated polyene copolymer, ethylene / unsaturated anhydrous carboxylic acid copolymer, ethylene / α-olefin / unsaturated anhydrous carboxylic acid copolymer, ethylene / Epoxy-containing unsaturated compound copolymer, ethylene / α-olefin / epoxy-containing unsaturated compound copolymer, ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / methacrylic acid copolymer, etc. It is more preferable to use one or more selected from ethylene / unsaturated carboxylic acid copolymers.
Ethylene / α-olefin copolymer composed of ethylene and α-olefin having 3 to 20 carbon atoms, low density ethylene resin, ultra low density ethylene resin, linear low density polyethylene (LLDPE) resin, ethylene / α -Ethylene such as olefin / non-conjugated polyene copolymer, ethylene / α-olefin / conjugated polyene copolymer, ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / methacrylic acid copolymer, etc. It is more preferable to use one or more selected from unsaturated carboxylic acid copolymers.
Among these, at least one selected from an ethylene / α-olefin copolymer and an ethylene / vinyl acetate copolymer is particularly preferably used. In this embodiment, the above-mentioned resins may be used alone or in a blended manner.
　本実施形態における架橋性樹脂として用いられる、エチレンおよび炭素数３～２０のα－オレフィンからなるエチレン・α－オレフィン共重合体のα－オレフィンとしては、通常、炭素数３～２０のα－オレフィンを１種類単独でまたは２種類以上を組み合わせて用いることができる。中でも好ましいのは、炭素数が１０以下であるα－オレフィンであり、とくに好ましいのは炭素数が３～８のα－オレフィンである。このようなα－オレフィンとしては、例えば、プロピレン、１－ブテン、１－ペンテン、１－ヘキセン、３－メチル－１－ブテン、３，３－ジメチル－１－ブテン、４－メチル－１－ペンテン、１－オクテン、１－デセン、１－ドデセン等を挙げることができる。これらの中でも、入手の容易さからプロピレン、１－ブテン、１－ペンテン、１－ヘキセン、４－メチル－１－ペンテンおよび１－オクテンが好ましい。なお、エチレン・α－オレフィン共重合体はランダム共重合体であっても、ブロック共重合体であってもよいが、柔軟性の観点からランダム共重合体が好ましい。 The α-olefin of an ethylene / α-olefin copolymer composed of ethylene and an α-olefin having 3 to 20 carbon atoms used as the crosslinkable resin in the present embodiment is usually an α-olefin having 3 to 20 carbon atoms. Can be used alone or in combination of two or more. Of these, α-olefins having 10 or less carbon atoms are preferable, and α-olefins having 3 to 8 carbon atoms are particularly preferable. Examples of such α-olefins include propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3,3-dimethyl-1-butene, and 4-methyl-1-pentene. , 1-octene, 1-decene, 1-dodecene and the like. Among these, propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene and 1-octene are preferable because of their availability. The ethylene / α-olefin copolymer may be a random copolymer or a block copolymer, but a random copolymer is preferable from the viewpoint of flexibility.
　凹凸吸収性樹脂層３０としては、例えば、一般的な粘着剤に、紫外線硬化性モノマー成分やオリゴマー成分を配合した紫外線硬化性粘着剤を使用することもできる。
　一般的な粘着剤としては、例えば、（メタ）アクリル系粘着剤、ゴム系粘着剤等が挙げられる。これらの中でも（メタ）アクリル系重合体をベースポリマーとする（メタ）アクリル系粘着剤が好ましい。
　紫外線硬化性モノマー成分としては、例えば、ウレタンオリゴマー、ウレタン（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、テトラメチロールメタンテトラ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、ペンタエリストールテトラ（メタ）アクリレート、ジペンタエリストールモノヒドロキシペンタ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、１，４－ブタンジオールジ（メタ）アクリレート等が挙げられる。また紫外線硬化性オリゴマー成分としては、例えば、ウレタン系、ポリエーテル系、ポリエステル系、ポリカーボネート系、ポリブタジエン系等種々のオリゴマー等が挙げられる。
　紫外線硬化性モノマー成分やオリゴマー成分の含有量は、粘着剤を構成する（メタ）アクリル系重合体等のベースポリマー１００質量部に対して、例えば５質量部以上５００質量部以下、好ましくは４０質量部以上１５０質量部以下である。 As the uneven absorbing resin layer 30, for example, an ultraviolet curable pressure-sensitive adhesive in which a UV-curable monomer component or an oligomer component is mixed with a general pressure-sensitive adhesive can be used.
Examples of general pressure-sensitive adhesives include (meth) acrylic pressure-sensitive adhesives and rubber-based pressure-sensitive adhesives. Among these, a (meth) acrylic pressure-sensitive adhesive using a (meth) acrylic polymer as a base polymer is preferable.
Examples of the ultraviolet curable monomer component include urethane oligomer, urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and pentaeristol tetra (). Examples thereof include meta) acrylate, dipentaeristol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and 1,4-butanediol di (meth) acrylate. Examples of the ultraviolet curable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based.
The content of the ultraviolet curable monomer component and the oligomer component is, for example, 5 parts by mass or more and 500 parts by mass or less, preferably 40 parts by mass, with respect to 100 parts by mass of the base polymer such as the (meth) acrylic polymer constituting the pressure-sensitive adhesive. More than 150 parts by mass or less.
　また、凹凸吸収性樹脂層３０としては、ベースポリマーとして、炭素－炭素二重結合をポリマー側鎖または主鎖中もしくは主鎖末端に有するものを用いた紫外線硬化性粘着剤を用いることができる。
　上記炭素－炭素二重結合を有するベースポリマーは、炭素－炭素二重結合を有し、かつ粘着性を有するものを用いることができる。このようなベースポリマーとしては、（メタ）アクリル系重合体を基本骨格とするものが好ましい。
　（メタ）アクリル系重合体への不飽和結合の導入法は特に制限されないが、例えば、（メタ）アクリル系重合体に官能基を有するモノマーを共重合した後、この官能基と反応しうる官能基および不飽和結合を有する化合物を、不飽和結合の紫外線硬化性を維持したまま縮合または付加反応させる方法が挙げられる。
　これら官能基の組合せの例としては、カルボン酸基とエポキシ基、カルボン酸基とアジリジル基、ヒドロキシル基とイソシアネート基等が挙げられる。これら官能基の組合せの中でも、ヒドロキシル基とイソシアネート基との組合せが好ましい。（メタ）アクリル系重合体がヒドロキシル基を有し、上記化合物がイソシアネート基を有する場合が好ましい。炭素－炭素二重結合を有するイソシアネート化合物としては、例えば、メタクリロイルイソシアネート、２－メタクリロイルオキシエチルイソシアネート、ｍ－イソプロペニル－α，α－ジメチルベンジルイソシアネート等が挙げられる。また、（メタ）アクリル系重合体としては、ヒドロキシ基含有モノマーや２－ヒドロキシエチルビニルエーテル、４－ヒドロキシブチルビニルエーテル、ジエチレングルコールモノビニルエーテルのエーテル系化合物等を共重合したものが用いられる。 Further, as the uneven absorbing resin layer 30, an ultraviolet curable pressure-sensitive adhesive using a base polymer having a carbon-carbon double bond in the polymer side chain or in the main chain or at the end of the main chain can be used.
As the base polymer having a carbon-carbon double bond, a polymer having a carbon-carbon double bond and having adhesiveness can be used. As such a base polymer, one having a (meth) acrylic polymer as a basic skeleton is preferable.
The method for introducing an unsaturated bond into the (meth) acrylic polymer is not particularly limited. For example, a functional group capable of reacting with the functional group after copolymerizing a monomer having a functional group with the (meth) acrylic polymer. Examples thereof include a method of condensing or adding a compound having a group and an unsaturated bond while maintaining the ultraviolet curability of the unsaturated bond.
Examples of the combination of these functional groups include a carboxylic acid group and an epoxy group, a carboxylic acid group and an aziridyl group, a hydroxyl group and an isocyanate group, and the like. Among these combinations of functional groups, a combination of a hydroxyl group and an isocyanate group is preferable. It is preferable that the (meth) acrylic polymer has a hydroxyl group and the above compound has an isocyanate group. Examples of the isocyanate compound having a carbon-carbon double bond include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate and the like. Further, as the (meth) acrylic polymer, one obtained by copolymerizing a hydroxy group-containing monomer, an ether compound of 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glucol monovinyl ether and the like is used.
　上記紫外線硬化性粘着剤は、上記紫外線硬化性のモノマー成分やオリゴマー成分を配合することもできる。紫外線硬化性のモノマー成分やオリゴマー成分の含有量は、例えば、ベースポリマー１００質量部に対して３０質量部以下が好ましく、１０質量部以下がより好ましい。 The UV-curable pressure-sensitive adhesive may also contain the UV-curable monomer component and oligomer component. The content of the ultraviolet curable monomer component and the oligomer component is, for example, preferably 30 parts by mass or less, and more preferably 10 parts by mass or less with respect to 100 parts by mass of the base polymer.
　紫外線硬化性粘着剤は、光重合開始剤を含むことが好ましい。光重合開始剤としては、例えば、４－（２－ヒドロキシエトキシ）フェニル（２－ヒドロキシ－２－プロピル）ケトン、α－ヒドロキシ－α，α´－ジメチルアセトフェノン、２－メチル－２－ヒドロキシプロピオフェノン、１－ヒドロキシシクロヘキシルフェニルケトン等のα－ケトール系化合物；メトキシアセトフェノン、２，２－ジメトキシ－２－フェニルアセトフエノン、２，２－ジエトキシアセトフェノン、２－メチル－１－［４－（メチルチオ）－フェニル］－２－モルホリノプロパン－１等のアセトフェノン系化合物；べンゾインエチルエーテル、ベンゾインイソプロピルエーテル、アニソインメチルエーテル等のベンゾインエーテル系化合物；ベンジルジメチルケタール等のケタール系化合物；２－ナフタレンスルホニルクロリド等の芳香族スルホニルクロリド系化合物；１－フェノン－１，１－プロパンジオン－２－（ｏ－エトキシカルボニル）オキシム等の光活性オキシム系化合物；ベンゾフェノン、ベンゾイル安息香酸、３，３′－ジメチル－４－メトキシベンゾフェノン等のベンゾフェノン系化合物；チオキサンソン、２－クロロチオキサンソン、２－メチルチオキサンソン、２，４－ジメチルチオキサンソン、イソプロピルチオキサンソン、２，４－ジクロロチオキサンソン、２，４－ジエチルチオキサンソン、２，４－ジイソプロピルチオキサンソン等のチオキサンソン系化合物；カンファーキノン；ハロゲン化ケトン；アシルホスフィノキシド；アシルホスフォナート等が挙げられる。 The UV curable pressure-sensitive adhesive preferably contains a photopolymerization initiator. Examples of the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethylacetophenone, and 2-methyl-2-hydroxypropio. Α-Ketol compounds such as phenone and 1-hydroxycyclohexylphenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4-( Methylthio) -phenyl] -2-morpholinopropane-1 and other acetophenone compounds; benzophenone compounds such as benzoin ethyl ether, benzoin isopropyl ether and anisoin methyl ether; benzoin ether compounds such as benzyl dimethyl ketal; 2 -Aromatic sulfonyl chloride compounds such as naphthalene sulfonyl chloride; photoactive oxime compounds such as 1-phenone-1,1-propandion-2- (o-ethoxycarbonyl) oxime; benzophenone, benzoylbenzoic acid, 3,3 Benzophenone compounds such as ′ -dimethyl-4-methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxane Thioxanson compounds such as son, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanson; benzophenone; ketone halide; acylphosphinoxide; acylphosphonate and the like can be mentioned.
　光重合開始剤の配合量は、粘着剤を構成する（メタ）アクリル系重合体等のベースポリマー１００質量部に対して、０．１質量部以上が好ましく、０．５質量部以上がより好ましく、粘着剤の保存性を向上させる点から、１５質量部以下が好ましく、５質量部以下がより好ましい。 The blending amount of the photopolymerization initiator is preferably 0.1 part by mass or more, more preferably 0.5 part by mass or more, with respect to 100 parts by mass of the base polymer such as the (meth) acrylic polymer constituting the pressure-sensitive adhesive. From the viewpoint of improving the storage stability of the pressure-sensitive adhesive, 15 parts by mass or less is preferable, and 5 parts by mass or less is more preferable.
　凹凸吸収性樹脂層３０の厚さは、電子部品１０の回路形成面１０Ａの凹凸構造を埋め込むことができる厚さであれば、特に制限されないが、例えば、１０μｍ以上１０００μｍ以下であることが好ましく、２０μｍ以上９００μｍ以下であることがより好ましく、３０μｍ以上８００μｍ以下であることがさらに好ましい。 The thickness of the unevenness absorbing resin layer 30 is not particularly limited as long as it can embed the unevenness structure of the circuit forming surface 10A of the electronic component 10, but is preferably 10 μm or more and 1000 μm or less, for example. It is more preferably 20 μm or more and 900 μm or less, and further preferably 30 μm or more and 800 μm or less.
　また、電子部品１０の回路形成面１０Ａに存在する凹凸構造の高さをＨ［μｍ］とし、凹凸吸収性樹脂層３０の厚みをｄ［μｍ］としたとき、Ｈ／ｄが１以下であることが好ましく、０．８５以下であることがより好ましく、０．７以下であることがさらに好ましい。Ｈ／ｄが上記上限値以下であると、粘着性積層フィルム５０の厚みをより薄くしつつ、凹凸吸収性をより良好にすることができる。
　Ｈ／ｄの下限は特に限定されないが、例えば、０．０１以上である。バンプ電極の高さは、一般的に２μｍ以上６００μｍ以下である。 Further, when the height of the uneven structure existing on the circuit forming surface 10A of the electronic component 10 is H [μm] and the thickness of the uneven absorbing resin layer 30 is d [μm], H / d is 1 or less. It is preferably 0.85 or less, more preferably 0.7 or less. When H / d is not more than the above upper limit value, the thickness of the adhesive laminated film 50 can be made thinner and the unevenness absorption can be made better.
The lower limit of H / d is not particularly limited, but is, for example, 0.01 or more. The height of the bump electrode is generally 2 μm or more and 600 μm or less.
＜粘着性樹脂層＞
　粘着性樹脂層４０は、凹凸吸収性樹脂層３０の一方の面側に設けられる層であり、粘着性積層フィルム５０を電子部品１０の回路形成面１０Ａに貼り付ける際に、電子部品１０の回路形成面１０Ａに接触して粘着する層である。 <Adhesive resin layer>
The adhesive resin layer 40 is a layer provided on one surface side of the unevenness absorbing resin layer 30, and is a circuit of the electronic component 10 when the adhesive laminated film 50 is attached to the circuit forming surface 10A of the electronic component 10. It is a layer that comes into contact with and adheres to the forming surface 10A.
　粘着性樹脂層４０を構成する粘着剤は、（メタ）アクリル系粘着剤、シリコーン系粘着剤、ウレタン系粘着剤、オレフィン系粘着剤、スチレン系粘着剤等が挙げられる。これらの中でも、接着力の調整を容易にできる点等から、（メタ）アクリル系重合体をベースポリマーとする（メタ）アクリル系粘着剤が好ましい。 Examples of the adhesive constituting the adhesive resin layer 40 include (meth) acrylic adhesive, silicone adhesive, urethane adhesive, olefin adhesive, styrene adhesive and the like. Among these, a (meth) acrylic pressure-sensitive adhesive using a (meth) acrylic polymer as a base polymer is preferable because the adhesive strength can be easily adjusted.
　粘着性樹脂層４０は、電子部品１０への糊残りを抑制する観点から、非放射線硬化型の粘着性樹脂層を積層することにより形成されたものであることが好ましい。非放射線硬化型の粘着性樹脂層を構成する粘着剤としては、電子部品１０への接着性、剥離後の電子部品１０の超純水やアルコール等の有機溶剤による洗浄性等の観点から、（メタ）アクリル系重合体をベースポリマーとする（メタ）アクリル系粘着剤が好ましい。 The adhesive resin layer 40 is preferably formed by laminating a non-radiation-curable adhesive resin layer from the viewpoint of suppressing adhesive residue on the electronic component 10. As the pressure-sensitive adhesive constituting the non-radiocurable adhesive resin layer, from the viewpoints of adhesiveness to the electronic component 10 and cleanability of the electronic component 10 after peeling with an organic solvent such as ultrapure water or alcohol, ( A (meth) acrylic pressure-sensitive adhesive using a meta) acrylic polymer as a base polymer is preferable.
　（メタ）アクリル系重合体としては、例えば、（メタ）アクリル酸アルキルエステル（例えば、メチルエステル、エチルエステル、プロピルエステル、イソプロピルエステル、ブチルエステル、イソブチルエステル、ｓ－ブチルエステル、ｔ－ブチルエステル、ペンチルエステル、イソペンチルエステル、ヘキシルエステル、ヘプチルエステル、オクチルエステル、２－エチルヘキシルエステル、イソオクチルエステル、ノニルエステル、デシルエステル、イソデシルエステル、ウンデシルエステル、ドデシルエステル、トリデシルエステル、テトラデシルエステル、ヘキサデシルエステル、オクタデシルエステル、エイコシルエステル等の直鎖状又は分岐鎖状のアルキルエステル等）及び（メタ）アクリル酸シクロアルキルエステル（例えば、シクロペンチルエステル、シクロヘキシルエステル等）の一種または二種以上を単量体成分として用いた重合体等が挙げられる。 Examples of the (meth) acrylic polymer include (meth) acrylic acid alkyl esters (eg, methyl esters, ethyl esters, propyl esters, isopropyl esters, butyl esters, isobutyl esters, s-butyl esters, t-butyl esters, etc. Pentyl ester, isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester, tridecyl ester, tetradecyl ester, One or more of linear or branched alkyl esters such as hexadecyl ester, octadecyl ester, and ecosil ester) and (meth) acrylic acid cycloalkyl ester (eg, cyclopentyl ester, cyclohexyl ester, etc.) Examples thereof include a polymer used as a monomer component.
　（メタ）アクリル系重合体は、凝集力や耐熱性等の改質を目的として、必要に応じて、（メタ）アクリル酸アルキルエステル又はシクロアルキルエステルと共重合可能な他のモノマー成分に対応する単位を含んでいてもよい。このようなモノマー成分としては、例えば、アクリル酸、メタクリル酸、カルボキシエチル（メタ）アクリレート、カルボキシペンチル（メタ）アクリレート、イタコン酸、マレイン酸、フマル酸、クロトン酸等のカルボキシル基含有モノマー；無水マレイン酸、無水イタコン酸等の酸無水物モノマー；（メタ）アクリル酸２－ヒドロキシエチル、（メタ）アクリル酸２－ヒドロキシプロピル、（メタ）アクリル酸４－ヒドロキシブチル、（メタ）アクリル酸６－ヒドロキシヘキシル、（メタ）アクリル酸８－ヒドロキシオクチル、（メタ）アクリル酸１０－ヒドロキシデシル、（メタ）アクリル酸１２－ヒドロキシラウリル、（４－ヒドロキシメチルシクロヘキシル）メチル（メタ）アクリレート等のヒドロキシル基含有モノマー；スチレンスルホン酸、アリルスルホン酸、２－（メタ）アクリルアミド－２－メチルプロパンスルホン酸、（メタ）アクリルアミドプロパンスルホン酸、スルホプロピル（メタ）アクリレート、（メタ）アクリロイルオキシナフタレンスルホン酸等のスルホン酸基含有モノマー；２－ヒドロキシエチルアクリロイルホスフェート等のリン酸基含有モノマー；アクリルアミド、アクリロニトリル、アクリロイルモルホリン等が挙げられる。これらのモノマー成分は、一種単独で用いてもよいし、二種以上を併用してもよい。これらの共重合可能なモノマーの使用量は、全モノマー成分を１００質量％としたとき、５０質量％以下が好ましい。 The (meth) acrylic polymer corresponds to the (meth) acrylic acid alkyl ester or other monomer component copolymerizable with the cycloalkyl ester, if necessary, for the purpose of modifying the cohesive force, heat resistance, etc. It may include units. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; Acid anhydride monomers such as acids and itaconic acids anhydride; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxy (meth) acrylate Hydrolyl group-containing monomers such as hexyl, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate. Sulfonic acids such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalene sulfonic acid. Group-containing monomers; phosphate group-containing monomers such as 2-hydroxyethylacryloyl phosphate; acrylamide, acrylonitrile, acryloylmorpholine and the like can be mentioned. These monomer components may be used alone or in combination of two or more. The amount of these copolymerizable monomers used is preferably 50% by mass or less when the total monomer components are 100% by mass.
　（メタ）アクリル系重合体は、架橋させるため、多官能性モノマー等も、必要に応じて共重合用モノマー成分として含むことができる。このような多官能性モノマーとして、例えば、ヘキサンジオールジ（メタ）アクリレート、（ポリ）エチレングリコールジ（メタ）アクリレート、（ポリ）プロピレングリコールジ（メタ）アクリレート、ネオペンチルグリコールジ（メタ）アクリレート、ペンタエリスリトールジ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、エポキシ（メタ）アクリレート、ポリエステル（メタ）アクリレート、ウレタン（メタ）アクリレート等が挙げられる。これらの多官能性モノマーは、一種単独で用いてもよいし、二種以上を併用してもよい。多官能性モノマーの使用量は、全モノマー成分を１００質量％としたとき、３０質量％以下が好ましい。 Since the (meth) acrylic polymer is crosslinked, a polyfunctional monomer or the like can be included as a monomer component for copolymerization, if necessary. Examples of such a polyfunctional monomer include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, and neopentyl glycol di (meth) acrylate. Pentaerythritol di (meth) acrylate, trimethylolpropanthry (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, urethane (meth) Examples include acrylate. These polyfunctional monomers may be used alone or in combination of two or more. The amount of the polyfunctional monomer used is preferably 30% by mass or less when the total monomer component is 100% by mass.
　（メタ）アクリル系重合体は、一種または二種以上のモノマー成分を含む混合物を重合することにより得ることができる。重合は、溶液重合、乳化重合、塊状重合、懸濁重合等が挙げられる。電子部品１０への汚染防止等の点から、（メタ）アクリル系重合体の数平均分子量は、好ましくは３０万以上、さらに好ましくは４０万～３００万程度である。 The (meth) acrylic polymer can be obtained by polymerizing a mixture containing one or more kinds of monomer components. Examples of the polymerization include solution polymerization, emulsion polymerization, bulk polymerization, suspension polymerization and the like. From the viewpoint of preventing contamination of the electronic component 10, the number average molecular weight of the (meth) acrylic polymer is preferably 300,000 or more, more preferably about 400,000 to 3 million.
　また、非放射線硬化型の粘着性樹脂層を構成する粘着剤には、ベースポリマーである（メタ）アクリル系重合体等の数平均分子量を高めるため、外部架橋剤を用いることもできる。外部架橋方法としては、例えば、ポリイソシアネート化合物、エポキシ化合物、アジリジン化合物、メラミン系架橋剤等の架橋剤を添加し反応させる方法が挙げられる。外部架橋剤の使用量は、ベースポリマーによって適宜決定されるが、例えば、ベースポリマー１００質量部に対して好ましくは５質量部以下、より好ましくは０．０１質量部以上５質量部以下である。 Further, as the pressure-sensitive adhesive constituting the non-radiation-curable type pressure-sensitive adhesive resin layer, an external cross-linking agent can be used in order to increase the number average molecular weight of the (meth) acrylic polymer or the like as the base polymer. Examples of the external cross-linking method include a method in which a cross-linking agent such as a polyisocyanate compound, an epoxy compound, an aziridine compound, or a melamine-based cross-linking agent is added and reacted. The amount of the external cross-linking agent used is appropriately determined depending on the base polymer, and is, for example, preferably 5 parts by mass or less, more preferably 0.01 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the base polymer.
　非放射線硬化型の粘着性樹脂層を構成する粘着剤は、必要に応じて、粘着付与剤、老化防止剤等の添加剤をさらに含んでもよい。 The pressure-sensitive adhesive constituting the non-radiation-curable type pressure-sensitive adhesive resin layer may further contain additives such as a pressure-sensitive adhesive and an anti-aging agent, if necessary.
　粘着性樹脂層４０の厚みは特に制限されないが、例えば、１μｍ以上１００μｍ以下であることが好ましく、３μｍ以上５０μｍ以下であることがより好ましい。 The thickness of the adhesive resin layer 40 is not particularly limited, but is preferably 1 μm or more and 100 μm or less, and more preferably 3 μm or more and 50 μm or less.
　粘着性樹脂層４０は、例えば、凹凸吸収性樹脂層３０上に粘着剤塗布液を塗布することにより形成することができる。
　粘着剤塗布液を塗布する方法としては、従来公知の塗布方法、例えば、ロールコーター法、リバースロールコーター法、グラビアロール法、バーコート法、コンマコーター法、ダイコーター法等が採用できる。塗布された粘着剤の乾燥条件には特に制限はないが、一般的には、８０～２００℃の温度範囲において、１０秒～１０分間乾燥することが好ましい。更に好ましくは、８０～１７０℃において、１５秒～５分間乾燥する。架橋剤と粘着剤との架橋反応を十分に促進させるために、粘着剤塗布液の乾燥が終了した後、４０～８０℃において５～３００時間程度加熱してもよい。 The adhesive resin layer 40 can be formed, for example, by applying a pressure-sensitive adhesive coating liquid on the unevenness-absorbing resin layer 30.
As a method for applying the pressure-sensitive adhesive coating liquid, conventionally known coating methods, for example, a roll coater method, a reverse roll coater method, a gravure roll method, a bar coat method, a comma coater method, a die coater method and the like can be adopted. The drying conditions of the applied pressure-sensitive adhesive are not particularly limited, but in general, it is preferable to dry the applied adhesive in a temperature range of 80 to 200 ° C. for 10 seconds to 10 minutes. More preferably, it is dried at 80 to 170 ° C. for 15 seconds to 5 minutes. In order to sufficiently promote the cross-linking reaction between the cross-linking agent and the pressure-sensitive adhesive, the pressure-sensitive adhesive coating liquid may be heated at 40 to 80 ° C. for about 5 to 300 hours after the drying is completed.
　本実施形態に係る粘着性積層フィルム５０全体の厚さは、機械的特性と取扱い性のバランスから、好ましくは２５μｍ以上５００μｍ以下であり、より好ましくは５０μｍ以上３００μｍ以下である。 The thickness of the entire adhesive laminated film 50 according to the present embodiment is preferably 25 μm or more and 500 μm or less, and more preferably 50 μm or more and 300 μm or less, from the viewpoint of the balance between mechanical properties and handleability.
　本実施形態に係る粘着性積層フィルム５０は、各層の間に接着層（図示せず）を設けていてもよい。この接着層によれば、各層の間の接着性を向上させることができる。 The adhesive laminated film 50 according to the present embodiment may be provided with an adhesive layer (not shown) between the layers. According to this adhesive layer, the adhesiveness between the layers can be improved.
　本実施形態に係る粘着性積層フィルム５０は、例えば、基材層２０および凹凸吸収性樹脂層３０を有する積層体の凹凸吸収性樹脂層３０上に、粘着性樹脂層４０を積層することにより形成することができる。 The adhesive laminated film 50 according to the present embodiment is formed by, for example, laminating the adhesive resin layer 40 on the uneven absorbing resin layer 30 of the laminated body having the base material layer 20 and the uneven absorbing resin layer 30. can do.
２．電子装置の製造方法
　次に、本実施形態に係る電子装置の製造方法の各工程について説明する。 2. Manufacturing Method of Electronic Device Next, each step of the manufacturing method of the electronic device according to the present embodiment will be described.
（工程（Ａ））
　はじめに、回路形成面１０Ａを有する電子部品１０と、基材層２０、紫外線硬化型の凹凸吸収性樹脂層３０および粘着性樹脂層４０をこの順番に有する粘着性積層フィルム５０と、を備え、回路形成面１０Ａを保護するように電子部品１０の回路形成面１０Ａに粘着性積層フィルム５０が貼り付けられた構造体６０を準備する。 (Step (A))
First, an electronic component 10 having a circuit forming surface 10A, and an adhesive laminated film 50 having a base material layer 20, an ultraviolet curable uneven absorbing resin layer 30 and an adhesive resin layer 40 in this order are provided, and a circuit is provided. A structure 60 in which the adhesive laminated film 50 is attached to the circuit forming surface 10A of the electronic component 10 is prepared so as to protect the forming surface 10A.
　このような構造体６０は、例えば、図２に示すように、電子部品１０の回路形成面１０Ａにバックグラインドテープ８０が貼り付けられた状態で、電子部品１０の回路形成面１０Ａとは反対側の面１０Ｃをバックグラインドするバックグラインド工程（Ａ１）、バックグラインド工程（Ａ１）の後に、電子部品１０からバックグラインドテープ８０を剥がす工程（Ａ２）と、電子部品１０の回路形成面１０Ａに粘着性積層フィルム５０を貼り付ける工程（Ａ３）とをおこなうことによって作製することができる。 As shown in FIG. 2, such a structure 60 is, for example, on the side opposite to the circuit forming surface 10A of the electronic component 10 in a state where the back grind tape 80 is attached to the circuit forming surface 10A of the electronic component 10. After the back grind step (A1) and the back grind step (A1) for backgrinding the surface 10C, the step of peeling the back grind tape 80 from the electronic component 10 (A2) and the adhesiveness to the circuit forming surface 10A of the electronic component 10. It can be produced by performing the step (A3) of pasting the laminated film 50.
　バックグラインド工程（Ａ１）では、バックグラインドテープ８０に貼り付けられた状態で、電子部品１０の回路形成面１０Ａとは反対側の面１０Ｃをバックグラインドする。
　ここで、バックグラインドするとは、電子部品１０を割ったり、破損したりすることなく、所定の厚みまで薄化加工することを意味する。
　電子部品１０のバックグラインドは、公知の方法で行うことができる。例えば、研削機のチャックテーブル等に電子部品１０を固定し、電子部品１０の回路形成面１０Ａとは反対側の面１０Ｃを研削する方法が挙げられる。
　また、バックグラインドテープ８０としては、特に限定されず、一般的に公知のバックグラインドテープを用いることができる。 In the back grind step (A1), the surface 10C of the electronic component 10 opposite to the circuit forming surface 10A is back grinded while being attached to the back grind tape 80.
Here, backgrinding means that the electronic component 10 is thinned to a predetermined thickness without being cracked or damaged.
The back grind of the electronic component 10 can be performed by a known method. For example, a method of fixing the electronic component 10 to a chuck table or the like of a grinder and grinding the surface 10C of the electronic component 10 on the side opposite to the circuit forming surface 10A can be mentioned.
The back grind tape 80 is not particularly limited, and a generally known back grind tape can be used.
　裏面研削方式としては特に限定されないが、例えば、スルーフィード方式、インフィード方式等の公知の研削方式を採用することができる。それぞれ研削は、水を電子部品１０と砥石にかけて冷却しながら行うことができる。 The back surface grinding method is not particularly limited, but for example, a known grinding method such as a through-feed method or an in-feed method can be adopted. Each grinding can be performed while cooling water by applying it to the electronic component 10 and the grindstone.
　バックグラインドテープ８０に貼り付けられた電子部品１０としては回路形成面１０Ａを有する電子部品１０であれば特に限定されないが、例えば、半導体ウエハ、モールドウエハ、モールドパネル、モールドアレイパッケージ、半導体基板等が挙げられる。
　また、半導体基板としては、例えば、シリコン基板、サファイア基板、ゲルマニウム基板、ゲルマニウム－ヒ素基板、ガリウム－リン基板、ガリウム－ヒ素－アルミニウム基板、ガリウム－ヒ素基板、タンタル酸リチウム基板等が挙げられる。 The electronic component 10 attached to the back grind tape 80 is not particularly limited as long as it is an electronic component 10 having a circuit forming surface 10A, but for example, a semiconductor wafer, a mold wafer, a mold panel, a mold array package, a semiconductor substrate, or the like can be used. Can be mentioned.
Examples of the semiconductor substrate include a silicon substrate, a sapphire substrate, a germanium substrate, a germanium-arsenic substrate, a gallium-phosphosphide substrate, a gallium-arsenide-aluminum substrate, a gallium-arsenide substrate, and a lithium tantalate substrate.
　また、電子部品１０はどのような用途の電子部品であってもよいが、例えば、ロジック用（例えば、通信用、高周波信号処理用等）、メモリ用、センサー用、電源用の電子部品等が挙げられる。これらは、１種のみを用いてもよく２種以上を併用してもよい。 The electronic component 10 may be an electronic component for any purpose, but for example, an electronic component for logic (for example, for communication, high frequency signal processing, etc.), a memory, a sensor, a power supply, and the like. Can be mentioned. These may be used alone or in combination of two or more.
　電子部品１０の回路形成面１０Ａは、例えば、電極からなる凹凸構造１０Ｂを含む。
　電極を構成する金属種は特に限定されず、例えば、銀、金、銅、錫、鉛、ビスマス及びこれらの合金等が挙げられる。これらの金属種は１種単独で用いてもよく２種以上を併用してもよい。 The circuit forming surface 10A of the electronic component 10 includes, for example, a concavo-convex structure 10B made of electrodes.
The metal type constituting the electrode is not particularly limited, and examples thereof include silver, gold, copper, tin, lead, bismuth, and alloys thereof. These metal species may be used alone or in combination of two or more.
　バックグラインド工程（Ａ１）の後に、電子部品１０からバックグラインドテープ８０を剥がす方法は特に限定されず、一般的に公知の方法で剥がすことができる。
　また、電子部品１０の回路形成面１０Ａに粘着性積層フィルム５０を貼り付ける方法も特に限定されず、一般的に公知の方法で剥がすことができる。例えば、人手により行ってもよいし、ロール状の粘着性積層フィルム５０を取り付けた自動貼り機と称される装置によって行ってもよい。 After the back grind step (A1), the method of peeling the back grind tape 80 from the electronic component 10 is not particularly limited, and the back grind tape 80 can be peeled by a generally known method.
Further, the method of attaching the adhesive laminated film 50 to the circuit forming surface 10A of the electronic component 10 is not particularly limited, and the adhesive laminated film 50 can be peeled off by a generally known method. For example, it may be performed manually, or it may be performed by a device called an automatic pasting machine to which a roll-shaped adhesive laminated film 50 is attached.
（工程（Ｂ））
　次いで、粘着性積層フィルム５０に対して紫外線を照射することにより、粘着性積層フィルム５０の凹凸吸収性樹脂層３０を硬化させる。これにより、粘着性積層フィルム５０の耐熱性を向上させることができる。こうすることで、工程（Ｃ）において粘着性積層フィルム５０が高温に曝されても粘着性積層フィルム５０の変形を抑制することができるため、高温真空下での表面処理工程（Ｃ）において、粘着性積層フィルム５０の浮きを抑制することが可能となる。 (Step (B))
Next, the unevenness-absorbing resin layer 30 of the adhesive laminated film 50 is cured by irradiating the adhesive laminated film 50 with ultraviolet rays. Thereby, the heat resistance of the adhesive laminated film 50 can be improved. By doing so, even if the adhesive laminated film 50 is exposed to a high temperature in the step (C), the deformation of the adhesive laminated film 50 can be suppressed. Therefore, in the surface treatment step (C) under a high temperature vacuum, the adhesive laminated film 50 can be suppressed from being deformed. It is possible to suppress the floating of the adhesive laminated film 50.
　凹凸吸収性樹脂層３０に紫外線を照射することによって、凹凸吸収性樹脂層３０を架橋させて硬化させることができる。
　紫外線は、例えば、粘着性積層フィルム５０の基材層２０側の面から照射される。 By irradiating the unevenness-absorbing resin layer 30 with ultraviolet rays, the unevenness-absorbing resin layer 30 can be crosslinked and cured.
The ultraviolet rays are emitted from, for example, the surface of the adhesive laminated film 50 on the base material layer 20 side.
（工程（Ｃ））
　次いで、真空加熱下で、電子部品１０の回路形成面１０Ａとは反対側の面１０Ｃを処理する。この表面処理工程（Ｃ）によって、電子部品１０の回路形成面１０Ａとは反対側の面１０Ｃに表面層７０を形成することができる。
　表面処理工程（Ｃ）としては電子装置の製造工程においておこなわれる高温真空下における表面処理であれば特に限定されないが、例えば、イオン注入工程、金属膜形成工程およびアニール処理工程等が挙げられる。これらの工程は一種を単独でおこなってもよいし、二種以上を組み合わせておこなってもよい。
　ここで、通常はイオン注入工程後にアニール処理工程をおこなう。また、金属膜形成工程としては、電子部品１０の回路形成面１０Ａとは反対側の面１０Ｃに、銅やアルミ等の金属薄膜を形成する工程（バックメタル工程）等が挙げられる。金属薄膜の形成は、例えば、スパッタリング、蒸着、めっき、ＣＶＤ等によりおこなうことができる。 (Step (C))
Next, under vacuum heating, the surface 10C on the side opposite to the circuit forming surface 10A of the electronic component 10 is processed. By this surface treatment step (C), the surface layer 70 can be formed on the surface 10C opposite to the circuit forming surface 10A of the electronic component 10.
The surface treatment step (C) is not particularly limited as long as it is a surface treatment under high temperature vacuum performed in the manufacturing step of the electronic device, and examples thereof include an ion implantation step, a metal film forming step, and an annealing treatment step. These steps may be performed individually by one type, or may be performed by combining two or more types.
Here, usually, the annealing treatment step is performed after the ion implantation step. Further, as the metal film forming step, a step of forming a metal thin film such as copper or aluminum on the surface 10C opposite to the circuit forming surface 10A of the electronic component 10 (back metal step) and the like can be mentioned. The metal thin film can be formed by, for example, sputtering, vapor deposition, plating, CVD, or the like.
　表面処理工程（Ｃ）における加熱温度は表面処理工程によって適宜設定されるため特に限定されないが、例えば、４０℃以上３５０℃以下であり、好ましくは１００℃以上３５０℃以下であり、より好ましくは１２０℃以上３００℃以上である。 The heating temperature in the surface treatment step (C) is not particularly limited because it is appropriately set by the surface treatment step, but is, for example, 40 ° C. or higher and 350 ° C. or lower, preferably 100 ° C. or higher and 350 ° C. or lower, and more preferably 120 ° C. or higher. ° C or higher 300 ° C or higher.
（工程（Ｄ））
　また、本実施形態に係る電子装置の製造方法において、工程（Ｃ）の後に電子部品１０と粘着性積層フィルム５０とを剥離する工程（Ｄ）をさらにおこなってもよい。この工程（Ｄ）をおこなうことで、粘着性積層フィルム５０から電子部品１０を剥離することができる。剥離温度は、例えば２０～１００℃である。
　電子部品１０と粘着性積層フィルム５０との剥離は、公知の方法で行うことができる。 (Step (D))
Further, in the method for manufacturing an electronic device according to the present embodiment, a step (D) of peeling the electronic component 10 and the adhesive laminated film 50 may be further performed after the step (C). By performing this step (D), the electronic component 10 can be peeled off from the adhesive laminated film 50. The peeling temperature is, for example, 20 to 100 ° C.
The electronic component 10 and the adhesive laminated film 50 can be peeled off by a known method.
（その他の工程）
　本実施形態に係る電子装置の製造方法は、上記以外のその他の工程を有していてもよい。その他の工程としては、電子装置の製造方法において公知の工程を用いることができる。 (Other processes)
The method for manufacturing an electronic device according to the present embodiment may include other steps other than the above. As another step, a step known in the method for manufacturing an electronic device can be used.
　例えば、ダイシング工程、ダイボンディング工程、ワイヤボンディング工程、フリップチップ接続工程、キュア加温テスト工程、不純物活性化アニール処理工程、封止工程、リフロー工程等の電子部品の製造工程において一般的におこなわれている任意の工程等をさらに行ってもよい。 For example, it is generally performed in electronic component manufacturing processes such as a dicing process, a die bonding process, a wire bonding process, a flip chip connection process, a cure heating test process, an impurity activation annealing process, a sealing process, and a reflow process. Any step or the like may be further performed.
　以上、本発明の実施形態について述べたが、これらは本発明の例示であり、上記以外の様々な構成を採用することもできる。 Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above can be adopted.
　なお、本発明は前述の実施形態に限定されるものではなく、本発明の目的を達成できる範囲での変形、改良等は本発明に含まれるものである。 The present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the range in which the object of the present invention can be achieved are included in the present invention.
　この出願は、２０２０年２月４日に出願された日本出願特願２０２０－０１６７７６号を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Application Japanese Patent Application No. 2020-016776 filed on February 4, 2020, and incorporates all of its disclosures herein.
１０　　　電子部品
１０Ａ　　回路形成面
１０Ｂ　　凹凸構造
１０Ｃ　　回路形成面とは反対側の表面
２０　　　基材層
３０　　　凹凸吸収性樹脂層
４０　　　粘着性樹脂層
５０　　　粘着性積層フィルム
６０　　　構造体
７０　　　表面層
８０　　　バックグラインドテープ 10 Electronic components 10A Circuit forming surface 10B Concavo-convex structure 10C Surface opposite to the circuit forming surface 20 Base material layer 30 Concavo-convex absorbing resin layer 40 Adhesive resin layer 50 Adhesive laminated film 60 Structure 70 Surface layer 80 Back grind tape

Claims (12)

  1. 　回路形成面を有する電子部品と、ポリエステル系樹脂層を一層含む基材層、紫外線硬化型の凹凸吸収性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルムと、を備え、前記回路形成面を保護するように前記電子部品の前記回路形成面に前記粘着性積層フィルムが貼り付けられた構造体を準備する準備工程（Ａ）と、
    　前記粘着性積層フィルムに対して紫外線を照射することにより、前記粘着性積層フィルムの前記凹凸吸収性樹脂層を硬化させる紫外線硬化工程（Ｂ）と、
    　真空加熱下で、前記電子部品の前記回路形成面とは反対側の表面を処理する表面処理工程（Ｃ）と、
    を備える電子装置の製造方法。     The circuit includes an electronic component having a circuit-forming surface, a base material layer including a polyester-based resin layer, an ultraviolet-curable uneven-absorbing resin layer, and an adhesive laminated film having an adhesive resin layer in this order. A preparatory step (A) of preparing a structure in which the adhesive laminated film is attached to the circuit forming surface of the electronic component so as to protect the forming surface.
    The ultraviolet curing step (B) of curing the uneven absorbing resin layer of the adhesive laminated film by irradiating the adhesive laminated film with ultraviolet rays.
    A surface treatment step (C) of treating the surface of the electronic component on the side opposite to the circuit forming surface under vacuum heating, and
    A method of manufacturing an electronic device comprising.
  2. 　請求項１に記載の電子装置の製造方法において、
    　前記準備工程（Ａ）は、
    　　前記電子部品の前記回路形成面にバックグラインドテープが貼り付けられた状態で、前記電子部品の前記回路形成面とは反対側の面をバックグラインドするバックグラインド工程と、
    　　前記バックグラインド工程の後に、前記電子部品から前記バックグラインドテープを剥がす工程と、
    　　前記電子部品の前記回路形成面に前記粘着性積層フィルムを貼り付ける工程と、を含む電子装置の製造方法。     In the method for manufacturing an electronic device according to claim 1,
    The preparation step (A) is
    A backgrinding step of backgrinding a surface of the electronic component opposite to the circuit forming surface with the backgrinding tape attached to the circuit forming surface of the electronic component.
    After the back grind step, a step of peeling the back grind tape from the electronic component and
    A method for manufacturing an electronic device, which comprises a step of attaching the adhesive laminated film to the circuit forming surface of the electronic component.
  3. 　請求項１または２に記載の電子装置の製造方法において、
    　前記表面処理工程（Ｃ）は、イオン注入工程、金属膜形成工程およびアニール処理工程からなる群から選択される一種または二種以上を含む電子装置の製造方法。     In the method for manufacturing an electronic device according to claim 1 or 2.
    The surface treatment step (C) is a method for manufacturing an electronic device including one or more selected from the group consisting of an ion implantation step, a metal film forming step, and an annealing treatment step.
  4. 　請求項１乃至３のいずれか一項に記載の電子装置の製造方法において、
    　前記表面処理工程（Ｃ）における加熱温度が４０℃以上３５０℃以下である電子装置の製造方法。     In the method for manufacturing an electronic device according to any one of claims 1 to 3.
    A method for manufacturing an electronic device in which the heating temperature in the surface treatment step (C) is 40 ° C. or higher and 350 ° C. or lower.
  5. 　請求項１乃至４のいずれか一項に記載の電子装置の製造方法において、
    　前記電子部品の前記回路形成面に凹凸構造を含む電子装置の製造方法。     In the method for manufacturing an electronic device according to any one of claims 1 to 4.
    A method for manufacturing an electronic device including an uneven structure on the circuit forming surface of the electronic component.
  6. 　請求項５に記載の電子装置の製造方法において、
    　前記凹凸構造の高さをＨ［μｍ］とし、前記凹凸吸収性樹脂層の厚みをｄ［μｍ］としたとき、Ｈ／ｄが０．０１以上１以下である電子装置の製造方法。     In the method for manufacturing an electronic device according to claim 5.
    A method for manufacturing an electronic device in which H / d is 0.01 or more and 1 or less when the height of the uneven structure is H [μm] and the thickness of the uneven absorbing resin layer is d [μm].
  7. 　請求項１乃至６のいずれか一項に記載の電子装置の製造方法において、
    　前記凹凸吸収性樹脂層が架橋性樹脂を含む電子装置の製造方法。     In the method for manufacturing an electronic device according to any one of claims 1 to 6.
    A method for manufacturing an electronic device in which the uneven absorbing resin layer contains a crosslinkable resin.
  8. 　請求項１乃至７のいずれか一項に記載の電子装置の製造方法において、
    　前記凹凸吸収性樹脂層の厚みが１０μｍ以上１０００μｍ以下である電子装置の製造方法。     In the method for manufacturing an electronic device according to any one of claims 1 to 7.
    A method for manufacturing an electronic device in which the thickness of the uneven absorbing resin layer is 10 μm or more and 1000 μm or less.
  9. 　請求項１乃至８のいずれか一項に記載の電子装置の製造方法において、
    　前記粘着性樹脂層を構成する粘着剤が（メタ）アクリル系粘着剤、シリコーン系粘着剤、ウレタン系粘着剤、オレフィン系粘着剤およびスチレン系粘着剤から選択される一種または二種以上を含む電子装置の製造方法。     In the method for manufacturing an electronic device according to any one of claims 1 to 8.
    An electron containing one or more selected from (meth) acrylic pressure-sensitive adhesive, silicone-based pressure-sensitive adhesive, urethane-based pressure-sensitive adhesive, olefin-based pressure-sensitive adhesive, and styrene-based pressure-sensitive adhesive. How to manufacture the device.
  10. 　請求項１乃至９のいずれか一項に記載の電子装置の製造方法において、
    　前記粘着性積層フィルムは、前記基材層および前記凹凸吸収性樹脂層を有する積層体の前記凹凸吸収性樹脂層上に、非放射線硬化型の粘着性樹脂層を積層することにより形成されたフィルムである電子装置の製造方法。     In the method for manufacturing an electronic device according to any one of claims 1 to 9.
    The adhesive laminated film is a film formed by laminating a non-radiation-curable adhesive resin layer on the uneven absorbing resin layer of a laminate having the base material layer and the uneven absorbing resin layer. A method of manufacturing an electronic device that is.
  11. 　請求項１乃至１０のいずれか一項に記載の電子装置の製造方法に用いられる前記粘着性積層フィルムであって、
    　ポリエステル系樹脂層を一層含む基材層、紫外線硬化型の凹凸吸収性樹脂層および粘着性樹脂層をこの順番に有する粘着性積層フィルム。     The adhesive laminated film used in the method for manufacturing an electronic device according to any one of claims 1 to 10.
    An adhesive laminated film having a base material layer including a polyester resin layer, an ultraviolet curable uneven absorption resin layer, and an adhesive resin layer in this order.
  12. 　請求項１１に記載の粘着性積層フィルムにおいて、
    　前記基材層および前記凹凸吸収性樹脂層を有する積層体の前記凹凸吸収性樹脂層上に、非放射線硬化型の粘着性樹脂層を積層することにより形成された粘着性積層フィルム。     In the adhesive laminated film according to claim 11,
    An adhesive laminated film formed by laminating a non-radiation-curable adhesive resin layer on the uneven absorbing resin layer of a laminate having the base material layer and the uneven absorbing resin layer.
PCT/JP2021/002753 2020-02-04 2021-01-27 Method for producing electronic device WO2021157441A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
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JP2018195840A (en) * 2016-07-26 2018-12-06 三井化学東セロ株式会社 Semiconductor device manufacturing method
WO2019017226A1 (en) * 2017-07-20 2019-01-24 三井化学東セロ株式会社 Method for manufacturing electronic device
JP2019065168A (en) * 2017-09-29 2019-04-25 三井化学東セロ株式会社 Adhesive film
WO2019188543A1 (en) * 2018-03-30 2019-10-03 三井化学東セロ株式会社 Electronic device manufacturing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018195840A (en) * 2016-07-26 2018-12-06 三井化学東セロ株式会社 Semiconductor device manufacturing method
WO2019017226A1 (en) * 2017-07-20 2019-01-24 三井化学東セロ株式会社 Method for manufacturing electronic device
JP2019065168A (en) * 2017-09-29 2019-04-25 三井化学東セロ株式会社 Adhesive film
WO2019188543A1 (en) * 2018-03-30 2019-10-03 三井化学東セロ株式会社 Electronic device manufacturing method

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