WO2021147191A1

WO2021147191A1 - Strain mode analysis method and related device

Info

Publication number: WO2021147191A1
Application number: PCT/CN2020/086177
Authority: WO
Inventors: 傅愉; 陈冰; 彭登峰; 阎可宇
Original assignee: 深圳大学
Priority date: 2020-01-23
Filing date: 2020-04-22
Publication date: 2021-07-29
Also published as: CN111325718A; CN111325718B

Abstract

Embodiments of the present application provide a strain mode analysis method and a related device. Said method comprises: acquiring N images of an object to be detected, said object comprising an elastic strain light-emitting composite film, the N images being images of said object at different resonant frequencies; determining N groups of brightness information of the elastic strain light-emitting composite film according to each of the N images; and determining a strain mode of said object according to the N groups of brightness information. The present invention improves the accuracy of the strain mode.

Description

Strain modal analysis method and related devices

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on January 23, 2020, the application number is 202010076823.8, and the application name is "Strain Modal Analysis Method and Related Apparatus", the entire content of which is incorporated into this application by reference .

Technical field

This application relates to the technical field of vibration measurement, in particular to a strain modal analysis method and related devices.

Background technique

Vibration has always been an important issue in the structural design and health monitoring of various major projects, involving various fields such as aerospace, machinery manufacturing, high-speed rail, ships, vehicles, construction and other national defense, people's production and life. With the development of my country's production technology and the improvement of manufacturing level, the power structure has a trend of large-scale, high-speed, complex and lightweight development, and the resulting vibration problems have become more prominent. Modal analysis is the most important part of vibration analysis. It is the process of describing the dynamic response of the system according to the inherent characteristics of the system. Its application mainly focuses on the following aspects: (1) Evaluation of the dynamic characteristics of the structure; (2) Diagnosis and prediction of vibration faults; (3) Noise control; (4) Aided identification of weak links in the structural design as a structural power (5) Structural health monitoring; (6) Verify the accuracy of the numerical model.

At present, in the field of vibration analysis, experimental modal analysis methods and computational modal analysis methods complement each other. With the complexity of the system and the inherent shortcomings of numerical calculation methods, theoretical modal analysis often differs greatly from the real situation. Therefore, in practical engineering applications, experiments and experimental data processing are usually used to identify the actual dynamic model of the structure. The experimental modal analysis method can be divided into displacement modal analysis and strain modal analysis according to the difference of the measured physical quantities. Because the results of displacement modal analysis cannot be directly used in the fatigue design of the structure, it is used in the moving machinery and the structure under dynamic load. In the design, engineers are more concerned about the distribution of stress and strain from the standpoint of strength and fatigue. The concept of strain mode was first proposed by British scholar Hillary et al. in 1984. In 1989, Li Debao and others used the method of displacement mode differential operation to derive and discuss the strain mode theory.

At present, there are two types of strain modal experimental measurement methods commonly used in the industry: electrical measurement and optical measurement.

The electrical measurement method has become the most widely used and most reliable vibration measurement method in the last century. It mainly obtains dynamic strain information directly or indirectly through various sensors (displacement gauges, speed sensors, accelerometers, strain gauges, etc.). The main problems of this method are: (a) the spatial resolution is not high, no matter which kind of sensor, the measurement is the average physical quantity of the bonding part of the sensor and the test piece; (b) the whole field measurement cannot be realized, due to the wiring, the sensor sticks Space limitations such as posts have caused the limitation on the number of measurement points, and the modal distribution of the whole field can only be calculated by fitting after measurement; (c) The multi-point layout measurement workload is large, and the reuse rate of some sensors is low (such as Strain gauges).

Optical measurement methods mainly include (1) full-field displacement modal measurement based on laser interference; (2) based on high-speed cameras and various optical measurement methods (such as photoelastic method, electronic speckle, shear speckle, interference cloud (3) Full-field fitting using scanning laser Doppler vibrometer; (4) Digital image correlation displacement detection method based on dual high-speed cameras. Among the above methods, Laser Doppler Vibrometry (LDV) is the most widely used and has the highest accuracy. It is a vibration measurement method generally accepted in the field of experimental mechanics. However, the existing optical measurement solutions require expensive equipment, and they all need to first collect displacement modal data, and then obtain the strain modal through calculation and processing such as differentiation, and most of them are measured by point measurement, and the whole field needs to be measured later. Fitting, the spatial resolution of strain information acquisition is low.

Summary of the invention

The embodiments of the present application provide a strain modal analysis method and related devices, which can determine the strain modal by analyzing brightness information, and improve the accuracy of strain modal analysis.

The first aspect of the embodiments of the present application provides a strain modal analysis method, and the method includes:

Acquiring N images of the measured object, where the measured object includes an elastic strain light-emitting composite film, and the N images are images of the measured object at different resonance frequencies;

Determining N sets of brightness information of the elastic strain light-emitting composite film according to each of the N images;

According to the N sets of brightness information, the strain mode of the measured object is determined.

With reference to the first aspect, in a possible embodiment, the determining the N sets of brightness information of the elastic strain light-emitting composite film according to each of the N images includes:

Performing feature extraction on each of the multiple images to obtain N sets of feature data, and each set of feature data in the N sets of feature data includes feature data of each pixel of the image;

The N sets of brightness information are determined according to the N sets of characteristic data.

With reference to the first aspect, in a possible embodiment,

The brightness information includes a brightness value, and the determining the strain mode of the measured object according to the N sets of brightness information includes:

Determining, according to the N sets of brightness information, a strain value corresponding to each brightness information in the N sets of brightness information to obtain N strain fields;

Determine N vibration shapes according to the N strain fields;

The strain mode is determined according to the N vibration shapes.

With reference to the first aspect, in a possible embodiment, the elastically strained luminescent composite film includes a luminescent material, and the luminescent material emits light when the object under test is strained.

With reference to the first aspect, in a possible embodiment, the method further includes: preparing the elastic strain light-emitting composite film;

The preparation of the elastic strain light-emitting composite film includes:

Obtain the target control doping method and the target synthesis method, and prepare the constituent materials of the elastic strain light-emitting composite film to obtain the elastic strain light-emitting composite film.

A second aspect of the embodiments of the present application provides a strain modal analysis device, the device including:

An acquiring unit, configured to acquire N images of the measured object, the measured object includes an elastic strain light-emitting composite film, and the N images are images of the measured object at different resonance frequencies;

The first determining unit is configured to determine N sets of brightness information of the elastic strain light-emitting composite film according to each of the N images;

The second determining unit is configured to determine the strain mode of the measured object according to the N sets of brightness information.

With reference to the second aspect, in a possible embodiment, the first determining unit is configured to:

With reference to the second aspect, in a possible embodiment, the second determining unit is configured to:

Determine N vibration shapes according to the N strain fields;

The strain mode is determined according to the N vibration shapes.

With reference to the second aspect, in a possible embodiment, the elastically strained luminescent composite film includes a luminescent material, and the luminescent material emits light when the measured object is strained.

With reference to the second aspect, in a possible embodiment, the device is further used to: prepare the elastic strain light-emitting composite film;

In the aspect of preparing the elastic strain light-emitting composite film, the device is used for:

A third aspect of the embodiments of the present application provides a terminal, including a processor, an input device, an output device, and a memory. The processor, input device, output device, and memory are connected to each other, wherein the memory is used to store a computer program The computer program includes program instructions, and the processor is configured to invoke the program instructions to execute the instructions of the steps in the first aspect of the embodiments of the present application.

A fourth aspect of the embodiments of the present application provides a computer-readable storage medium, wherein the above-mentioned computer-readable storage medium stores a computer program for electronic data exchange, wherein the above-mentioned computer program enables a computer to execute Some or all of the steps described in one aspect.

The fifth aspect of the embodiments of the present application provides a computer program product, wherein the above-mentioned computer program product includes a non-transitory computer-readable storage medium storing a computer program, and the above-mentioned computer program is operable to cause a computer to execute as implemented in this application. Example part or all of the steps described in the first aspect. The computer program product may be a software installation package.

The implementation of the embodiments of this application has at least the following beneficial effects:

By acquiring N images of the measured object, the measured object includes an elastic strain light-emitting composite film, and the N images are the images of the measured object at different resonance frequencies. According to each of the N images Image to determine the N sets of brightness information of the elastic strain light-emitting composite film, and determine the strain mode of the measured object according to the N sets of brightness information. Therefore, compared with the strain mode measurement in the existing solution The low spatial resolution of CLP and optical measurement methods can improve the spatial resolution of strain modes.

Description of the drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

FIG. 1A provides a schematic diagram of an application scenario of a strain modal analysis method according to an embodiment of this application;

FIG. 1B provides a schematic diagram of an application scenario of another strain modal analysis method according to an embodiment of the present application;

FIG. 2 is a schematic flowchart of a strain modal analysis method according to an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a terminal provided by an embodiment of this application;

FIG. 4 is a schematic structural diagram of a strain modal analysis device provided in an embodiment of the application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific sequence. In addition, the terms "including" and "having" and any variations of them are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes unlisted steps or units, or optionally also includes Other steps or units inherent to these processes, methods, products or equipment.

The reference to "embodiments" in this application means that a specific feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art clearly and implicitly understand that the embodiments described in this application can be combined with other embodiments.

The following first introduces the modal analysis method.

Experimental modal analysis is an important method in the field of vibration analysis. Among them, compared with the displacement mode, the strain mode can directly reflect the strain of each part of the object in the corresponding mode, and it can reflect the change of the local characteristics of the object's structure. The modal parameters.

In the existing scheme, when performing the strain modal analysis of the system, electrical measurement methods and optical measurement methods are usually used.

The electrical measurement method mainly collects the strain information of the object through various sensors, for example, the strain information of the object is collected through displacement gauges, acceleration sensors, strain gauges, etc. The above-mentioned methods usually only collect strain information at different points. Perform globalization processing to obtain the strain mode of the object. Its spatial resolution during implementation is low and it is impossible to achieve direct measurement of global strain information, which makes it effective in terms of operability, accuracy, and spatial resolution. The limitations are greater.

In the optical measurement method, mainly, the point displacement information of the object is collected through various optical methods (laser Doppler vibration measurement, high-speed camera), etc., to obtain the strain mode, not only the differential of the displacement mode and the strain mode needs to be used in the later stage The relationship is recalculated, and full-field fitting needs to be combined with point measurement data. The measurement is not direct, the calculation is large and the equipment is expensive.

In order to solve the above-mentioned problems of indirect measurement, complicated measurement steps, low operability, and low spatial resolution, the embodiment of this application proposes a strain modal analysis method, which uses the elastic strain attached to the system under test. The method of luminescent composite film, by collecting, analyzing and processing the brightness information of the elastic strain luminescent composite film, directly obtains the full-field strain mode of the measured object. This method can greatly improve the space of strain mode mode shape measurement. Resolution and ease of operation.

The embodiments of the present application provide a method for obtaining a strain mode vibration shape, which can greatly improve the operation convenience and spatial resolution of strain mode measurement.

The elastic strain luminescent composite film is adhered to the surface of the object to be tested. The elastic strain luminescent composite film is embedded with luminescent particles. The luminescent particles emit light when vibrating. The elastic strain luminescent composite film can be sprayed or coated on the surface of the object. In combination, after the elastic strain luminescent composite film is set on the surface of the measured object, excitation of different frequencies is applied to the measured object to cause the measured object to vibrate. When the measured object vibrates, the elastic strain light-emitting composite film is strained during the vibration process, causing the embedded light-emitting particles to emit light. At this time, the image is captured by a video camera, industrial camera, etc., and the captured image includes the measured object, elastic strain The luminous composite film extracts the images with obvious light and dark distributions to obtain N images. The time t1, t2...tN at which the elastic strain luminescent composite film has obvious bright and dark distribution can be understood as the object under test resonates with the excitation source at the time t1, t2...tN, and the strain generated by the object at this time is much higher than other time. The image brightness is higher than the preset threshold.

According to the brightness information of N images (the brightness information can be represented by gray value or brightness value, etc.), the strain field of the measured object corresponding to each image can be obtained. When acquiring the brightness information of N images, feature extraction can be performed on each of the N images to obtain N sets of feature data. Each set of feature data in the N sets of feature data includes the feature data of each pixel of the image The feature data can be gray value or brightness value, etc., and then N groups of brightness information are determined according to the feature data. Specifically, the feature data can be directly determined as the brightness information, or the feature data can be processed to obtain the brightness information , The method of processing feature data can be normalization processing and so on. Before the feature extraction is performed on the image, the image can also be processed. The image processing can include: denoising processing, image subtraction processing, contrast processing, and so on.

After N sets of brightness information of N images are obtained, the strain field corresponding to each set of brightness information can be determined according to each set of brightness information to obtain N strain fields, and then the corresponding mode shape is determined according to the strain field. Determine the strain mode. There is a corresponding relationship between the brightness information and the strain value in the strain field, and the corresponding relationship is determined by empirical values or historical data.

Therefore, through the strain modal analysis method provided by the embodiments of the present application, the strain field of the measured object can be obtained through the brightness information of the elastic strain light-emitting composite film, so that the strain modal of the measured object can be directly obtained. Visual analysis of the dynamic strain of the measured object can be realized, which improves the convenience and accuracy of strain modal analysis.

The strain modal analysis method may also include determining the mapping relationship between the brightness and the strain value. The method for determining the mapping relationship may be: calibrating the relationship between the strain-luminous brightness and vibration frequency-luminous brightness of a single point of the measured object , And filter on-site parameters (such as environmental brightness, exposure time, aperture size, camera noise, etc.) through variable control and comparison, so that it does not affect the actual measurement results, so as to ensure the practical operability of the method.

A method for preparing an elastically strained luminescent composite film is also provided. A possible method for preparing an elastically strained luminescent composite film includes: obtaining a target control doping method and a target synthesis method, and comparing the constituent materials of the elastic strain luminescent composite film Preparation is performed to obtain the elastic strain light-emitting composite film. The target control doping method can be, for example, doping strontium aluminate and lithium niobate in a certain proportion, and the target synthesis method can be, for example, wet chemical method, oxidation-reduction reaction, powder technology, etc., as follows:

Select high-brightness elastic stress luminescence system (such as rare earth doped strontium aluminate and lithium niobate, transition metal ion doped zinc sulfide, etc.), using physical and chemical methods (high temperature solid phase method, hydrothermal synthesis method, combustion method, Sol-gel method) is used for preparation, and optimization is achieved by adjusting the doping scheme, adjusting the type of reactants, changing the synthesis route, etc., and improving the performance of the material according to different scopes of application, such as underwater environment, corrosive environment, etc. Choose a suitable adhesive solvent (such as PDMS, epoxy resin, silicone rubber, silicone resin, etc.), adjust the solute doping ratio, doped particles, curing ratio and temperature to achieve the optimal preparation of the composite film

As shown in FIG. 1A, FIG. 1A is a schematic diagram of an application scenario of a strain modal analysis method provided in an embodiment of the present application. Among them, the measured object is a vehicle, and the specific method of strain modal analysis is as follows: First, the vehicle shell beam is coated with a prefabricated elastic strain light-emitting composite film, and the vehicle shell is excited by the vibration system to generate vibrations, thereby causing the coating The elastic strain light-emitting composite film on it deforms, the embedded light-emitting particles emit light, and the deformation of different parts makes the luminous brightness different, so that the light and dark distribution is displayed on the composite film. The elastic strain light-emitting composite film is imaged through the image acquisition system. , And transmit it to the image processing system to analyze and process the image (denoising processing, contrast processing, gray value normalization processing, etc.) to obtain the full-field strain modal vibration shape of the vehicle under test, combined with the modal frequency And the coordinates and other data can get the measured strain mode of the whole field.

As shown in FIG. 1B, FIG. 1B provides a schematic diagram of an application scenario of another strain modal analysis method according to an embodiment of the present application. As shown in Fig. 1B, the strain analysis system 102 includes an image acquisition device 1021 and a processor 1022. The image acquisition device 1021 is used for image acquisition of the measured object 101, and the processor 1022 analyzes and processes the image acquired by the image acquisition device to obtain The strain distribution of the measured object 101, and the measured object 101 includes an elastic strain light-emitting composite film 1011.

The image acquisition device 101 may include a camera, a photon detector, a light sensor, etc., which is mainly used to collect an image when the elastic strain light-emitting composite film 1011 is luminous.

The elastic strain light-emitting composite film 1011 is set on the surface of the measured object 101, and its setting methods include spraying, coating, etc. The elastic strain light-emitting composite film 1011 emits different intensities of light when the measured object 101 is strained. To reflect the vibration of the measured object 101.

Here, the measured object 101 is a bridge as an example for description. Of course, it can also be any other object that needs to be subjected to strain detection.

Please refer to FIG. 2. FIG. 2 is a schematic flowchart of a strain modal analysis method provided in an embodiment of the present application. As shown in Figure 2, the strain modal analysis method includes steps 201-203, which are specifically as follows:

201. Acquire N images of a measured object, where the measured object includes an elastic strain light-emitting composite film, and the N images are images of the measured object at different resonance frequencies.

When N images are acquired, they can be acquired by a camera device. For details, please refer to the image acquisition method in the foregoing embodiment, which will not be repeated here.

202. Determine N sets of brightness information of the elastic strain light-emitting composite film according to each of the N images.

Each set of brightness information in the N sets of brightness information includes brightness information of each pixel of the image. When determining the N sets of brightness information, it may be to perform feature extraction on the image, and obtain the brightness information according to the feature data. The feature data may be a gray value or a brightness value.

203. Determine the strain mode of the measured object according to the N sets of brightness information.

When determining the strain mode, the strain field can be determined according to the brightness information, and then the vibration mode of the strain mode can be determined according to the strain field, and the strain mode can be determined according to the vibration mode.

In this example, by acquiring N images of the measured object, the measured object includes an elastic strain light-emitting composite film, and the N images are the images of the measured object at different resonance frequencies. For each image in the image, the N sets of brightness information of the elastic strain light-emitting composite film are determined, and the strain mode of the measured object is determined according to the N sets of brightness information. Therefore, compared with the existing solution In strain modal measurement, the spatial resolution of electrical measurement methods and optical measurement methods is low, which can improve the spatial resolution of strain modalities.

In a possible embodiment, the determining the N sets of brightness information of the elastic strain light-emitting composite film according to each of the N images includes:

In a possible embodiment,

Determine N vibration shapes according to the N strain fields;

The strain mode is determined according to the N vibration shapes.

In a possible embodiment, the elastically strained luminescent composite film includes a luminescent material, and the luminescent material emits light when the measured object is strained.

In a possible embodiment, the method further includes: preparing the elastic strain light-emitting composite film;

The preparation of the elastic strain light-emitting composite film includes:

For the sake of simplicity, this embodiment does not describe the strain mode in the strain modal analysis method, nor does it describe the brightness information, the preparation method of the elastic strain light-emitting composite film, etc. in detail. For the specific implementation, please refer to the foregoing implementation. The corresponding description in the example will not be repeated here.

Consistent with the foregoing embodiment, please refer to FIG. 3. FIG. 3 is a schematic structural diagram of a terminal provided by an embodiment of the application. As shown in the figure, it includes a processor, an input device, an output device, and a memory. The processor, The input device, the output device, and the memory are connected to each other, wherein the memory is used to store a computer program, the computer program includes program instructions, the processor is configured to call the program instructions, and the above program includes instructions for executing the following Step instructions;

The foregoing mainly introduces the solution of the embodiment of the present application from the perspective of the execution process on the method side. It can be understood that, in order to implement the above-mentioned functions, the terminal includes hardware structures and/or software modules corresponding to each function. Those skilled in the art should easily realize that in combination with the units and algorithm steps of the examples described in the embodiments provided herein, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a certain function is executed by hardware or computer software-driven hardware depends on the specific application and design constraint conditions of the technical solution. Professionals and technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered beyond the scope of this application.

The embodiment of the present application may divide the terminal into functional units according to the foregoing method examples. For example, each functional unit may be divided corresponding to each function, or two or more functions may be integrated into one processing unit. The above-mentioned integrated unit can be implemented in the form of hardware or software functional unit. It should be noted that the division of units in the embodiments of the present application is illustrative, and is only a logical function division, and there may be other division methods in actual implementation.

Consistent with the above, please refer to FIG. 4, which is a schematic structural diagram of a strain modal analysis device provided in an embodiment of the application. As shown in Figure 4, the device includes:

The acquiring unit 401 is configured to acquire N images of a measured object, the measured object includes an elastic strain light-emitting composite film, and the N images are images of the measured object at different resonance frequencies;

The first determining unit 402 is configured to determine N sets of brightness information of the elastic strain light-emitting composite film according to each of the N images;

The second determining unit 403 is configured to determine the strain mode of the measured object according to the N sets of brightness information.

With reference to the second aspect, in a possible embodiment, the first determining unit 402 is configured to:

With reference to the second aspect, in a possible embodiment, the second determining unit 403 is configured to:

Determine N vibration shapes according to the N strain fields;

The strain mode is determined according to the N vibration shapes.

In a possible embodiment, the device is also used for: preparing the elastic strain light-emitting composite film;

An embodiment of the present application also provides a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program enables a computer to execute any strain modal analysis method as described in the above method embodiment Some or all of the steps.

The embodiments of the present application also provide a computer program product. The computer program product includes a non-transitory computer-readable storage medium storing a computer program. The computer program causes a computer to execute any of the strains described in the above-mentioned method embodiments. Part or all of the steps of the modal analysis method.

It should be noted that for the foregoing method embodiments, for the sake of simple description, they are all expressed as a series of action combinations, but those skilled in the art should know that this application is not limited by the described sequence of actions. Because according to this application, some steps can be performed in other order or at the same time. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by this application.

In the above-mentioned embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in an embodiment, reference may be made to related descriptions of other embodiments.

In the several embodiments provided in this application, it should be understood that the disclosed device may be implemented in other ways. For example, the device embodiments described above are merely illustrative, for example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or may be Integrate into another system, or some features can be ignored or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical or other forms.

The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.

In addition, it is stated in the application that each functional unit in each embodiment may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software program modules.

If the integrated unit is implemented in the form of a software program module and sold or used as an independent product, it can be stored in a computer readable memory. Based on this understanding, the technical solution of the present application essentially or the part that contributes to the existing technology or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a memory. A number of instructions are included to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned memory includes: U disk, read-only memory (read-only memory, ROM), random access memory (random access memory, RAM), mobile hard disk, magnetic disk, or optical disk and other media that can store program codes.

Those of ordinary skill in the art can understand that all or part of the steps in the various methods of the above-mentioned embodiments can be completed by a program instructing relevant hardware. The program can be stored in a computer-readable memory, and the memory can include: a flash disk , Read-only memory, random access device, magnetic or optical disk, etc.

The embodiments of the application are described in detail above, and specific examples are used in this article to illustrate the principles and implementation of the application. The descriptions of the above embodiments are only used to help understand the methods and core ideas of the application; at the same time, for Those of ordinary skill in the art, based on the idea of the application, will have changes in the specific implementation and the scope of application. In summary, the content of this specification should not be construed as a limitation to the application.

Claims

A strain modal analysis method, characterized in that the method includes:

Acquiring N images of the measured object, where the measured object includes an elastic strain light-emitting composite film, and the N images are images of the measured object at different resonance frequencies;

Determining N sets of brightness information of the elastic strain light-emitting composite film according to each of the N images;

According to the N sets of brightness information, the strain mode of the measured object is determined.
The method according to claim 1, wherein the determining N sets of brightness information of the elastic strain light-emitting composite film according to each of the N images comprises:

Performing feature extraction on each of the multiple images to obtain N sets of feature data, and each set of feature data in the N sets of feature data includes feature data of each pixel of the image;

The N sets of brightness information are determined according to the N sets of characteristic data.
The method according to claim 1 or 2, wherein the brightness information includes a brightness value, and the determining the strain mode of the measured object according to the N sets of brightness information includes:

Determining, according to the N sets of brightness information, a strain value corresponding to each brightness information in the N sets of brightness information to obtain N strain fields;

Determine N vibration shapes according to the N strain fields;

The strain mode is determined according to the N vibration shapes.
The method according to claim 3, wherein the elastic strain light-emitting composite film comprises a light-emitting material, and the light-emitting material emits light when the measured object is strained.
The method according to claim 4, wherein the method further comprises: preparing the elastic strain light-emitting composite film;

The preparation of the elastic strain light-emitting composite film includes:

Obtain the target control doping method and the target synthesis method, and prepare the constituent materials of the elastic strain light-emitting composite film to obtain the elastic strain light-emitting composite film.
A strain modal analysis device, characterized in that the device comprises:

An acquiring unit, configured to acquire N images of the measured object, the measured object includes an elastic strain light-emitting composite film, and the N images are images of the measured object at different resonance frequencies;

The first determining unit is configured to determine N sets of brightness information of the elastic strain light-emitting composite film according to each of the N images;

The second determining unit is configured to determine the strain mode of the measured object according to the N sets of brightness information.
The device according to claim 6, wherein the first determining unit is configured to:

Performing feature extraction on each of the multiple images to obtain N sets of feature data, and each set of feature data in the N sets of feature data includes feature data of each pixel of the image;

The N sets of brightness information are determined according to the N sets of characteristic data.
The device according to claim 6 or 7, wherein the second determining unit is configured to:

Determining, according to the N sets of brightness information, a strain value corresponding to each brightness information in the N sets of brightness information to obtain N strain fields;

Determine N vibration shapes according to the N strain fields;

The strain mode is determined according to the N vibration shapes.
A terminal, characterized in that it includes a processor, an input device, an output device, and a memory, the processor, input device, output device, and memory are connected to each other, wherein the memory is used to store a computer program, and the computer program Including program instructions, and the processor is configured to call the program instructions to execute the method according to any one of claims 1-5.
A computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program includes program instructions that when executed by a processor cause the processor to execute The method of any one of 1-5 is required.