WO2021146061A1 - Cartes de circuits imprimés à jet d'encre - Google Patents

Cartes de circuits imprimés à jet d'encre Download PDF

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Publication number
WO2021146061A1
WO2021146061A1 PCT/US2020/070943 US2020070943W WO2021146061A1 WO 2021146061 A1 WO2021146061 A1 WO 2021146061A1 US 2020070943 W US2020070943 W US 2020070943W WO 2021146061 A1 WO2021146061 A1 WO 2021146061A1
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WO
WIPO (PCT)
Prior art keywords
acid
substrate
primer
polyanionic
patterning
Prior art date
Application number
PCT/US2020/070943
Other languages
English (en)
Inventor
Julia CUSHEN
Elena Sheina
Teresa Ramos
Original Assignee
Kateeva, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kateeva, Inc. filed Critical Kateeva, Inc.
Priority to CN202080092845.1A priority Critical patent/CN114945804A/zh
Priority to EP20914746.1A priority patent/EP4090914A4/fr
Priority to KR1020227026862A priority patent/KR20220127272A/ko
Priority to JP2022542635A priority patent/JP2023512445A/ja
Priority to TW110100763A priority patent/TW202136909A/zh
Publication of WO2021146061A1 publication Critical patent/WO2021146061A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Definitions

  • Embodiments herein generally relate to manufacturing circuit boards using inkjet printing processes. This application describes new methods and inks for inkjet printing circuit boards.
  • PCBs are commonly made by forming a conductive sheet, for example copper metal, on a non-conductive substrate, masking portions of the conductive sheet, and etching the unmasked portions to leave a pattern of conductive traces on the non-conductive substrate.
  • the masking is normally done using a resin material that is acid-resistant.
  • the copper is normally etched using an acid solution.
  • the mask material protects copper under the mask material from being etched by the acid.
  • the mask material is printed onto the conductive sheet using an inkjet printing process.
  • a PCB product can include one substrate with a circuit printed on one or both sides, or may include a plurality of substrate with multiple circuits laminated together in a complex device.
  • a primer material is coated onto the substrate, and then a material reactive with the primer is applied onto the primer by inkjet printing in a pattern.
  • the reactive material reacts with the primer and is frozen in place by the reaction.
  • the primer is usually a polycationic material such as polyethyleneimine, a divalent salt matrix, or vinyl pyrrolidone polymers.
  • the pattern material is an acid-resistant material that reacts with the polycationic material. Examples of such materials include acrylic and styrene- acrylic resins.
  • the primer is typically coated onto the metallic surface and dried. The pattern material is then applied in the pattern to react with the primer and freeze in place.
  • the pattern material is usually applied in base form, with pH above 7.0 to react with the primer. Acid, such as HCI, can be added to the primer to enhance the reaction.
  • the base included with the pattern material is volatile.
  • Ammonia for example, is used in some cases.
  • Volatility of the base in the pattern material complicates use of the material as an inkjet material because as the volatile material weathers, the inkjet material changes composition and properties and applying the material by inkjet printing becomes unreliable. Viscosity of the material changes, resulting in imprecise application of the material to the substrate. As a result, the pattern formed in the conductive material is often out of tolerance. There is a need in the area of inkjet printed PCBs for new methods and materials for reliably patterning a conductive coating.
  • Embodiments described herein provide a method, comprising depositing a conductive material on a substrate, applying a primer material soluble in water or aqueous acid onto the conductive material, inkjet printing an acid-resistant patterning material reactive with the primer material onto the primer material according to a pattern to form an acid-resistant mask, and exposing the substrate to an acid to etch exposed portions of the conductive material.
  • FIG. 1 is a flow diagram summarizing a method according to one embodiment.
  • FIG. 2 is a flow diagram summarizing a method according to another embodiment.
  • the processes for manufacturing a PCB described herein use inkjet processes to apply a patterned mask material to a substrate.
  • the mask material is a bi-component material that is formed from stable precursors, at least one of which is printed in a pattern using an inkjet process.
  • the bi-component material is a stable acid-resistant material that defines a circuitry pattern to be resolved in the conductive coating on the PCB.
  • Fig. 1 is a flow diagram summarizing a method 100 according to one embodiment.
  • a primer is formed on a conductive material layer of a substrate.
  • the substrate can be any material that provides a foundation for the conductive material layer.
  • the substrate can be a conventional circuit board blank made of a resin, optionally impregnated with polymer fibers.
  • the substrate can also be a piece of glass, a polymer film, or any other material on which circuitry or microcircuitry is to be formed.
  • the conductive material layer is typically a metal, or any conductive acid-dissolvable material. Copper is an example, and is commonly used.
  • the primer is an ionic material that can be applied as a liquid and solidified into a layer.
  • the primer material may be a polymer precursor or a polymeric material dissolved in a solvent.
  • the primer polymer is typically a polycationic polymer (i.e. a polybase), which is a polymer that can accept one or more protons to become a cation.
  • the polycationic polymer has a plurality of locations that can accept protons from a proton-donor to form an ionic bond, or to catalyze formation of a covalent or quasi- covalent bond.
  • polymer materials that may be used in a primer material include polyethyleneimines, polyspermines, polyspermidines, polyputrescines (poly- butanediamine) and other related polyamine polymers, which may be substantially linear or cross-linked, polyamidoamines, polyvinylpyrrolidones, polydiallyldimethylammonium chloride, polylysines, polytriazines, polyaminals and polythioaminals, and natural and semi-synthetic polycationic materials such as chitosans, gelatins, celluloses, and starch derivatives such as dextrans and dextrins, pectin, polypeptides, and alginates.
  • polyethyleneimines polyspermines, polyspermidines, polyputrescines (poly- butanediamine) and other related polyamine polymers, which may be substantially linear or cross-linked, polyamidoamines, polyvinylpyrrolidones, polydiallyldimethylammonium chlor
  • polymers and polymers such as vinyl species (i.e. polyamino-diacrylate co esters), epoxy species, and urethane species.
  • activators such as radical activators and co-activators (for example both monomers of co polymerization systems like epoxy and urethane systems) may be included.
  • the polymeric primer material is typically acid soluble, such that primer material not reacted with patterning material can be subsequently removed to expose conductive material for etching.
  • the polymeric primer material is applied using a water-based precursor containing the polymer primer material, which is applied to the conductive material of the substrate as a first component of a bi-component system for fixing a patterned acid-resistant mask on the conductive material.
  • a liquid medium for applying the primer material typically includes water with an organic, water miscible co-solvent such as monoethylene glycol, diethylene glycol, propylene glycol, dipropylene glycols, polyethylene glycols, polypropylene glycols, glycerine, aliphatic and aromatic amides, carboxylic acids, ethers, esters, alcohols, organosulfides, organosulfoxides, sulfones such as sulfolane, carbitol, butyl carbitol, cellusolve, amino alcohols (i.e.
  • an organic, water miscible co-solvent such as monoethylene glycol, diethylene glycol, propylene glycol, dipropylene glycols, polyethylene glycols, polypropylene glycols, glycerine, aliphatic and aromatic amides, carboxylic acids, ethers, esters, alcohols, organosulfides, organosulfoxides, sulfones such
  • the non-water component is typically present from 0% to about 50% by weight, and helps to dissolve any other additives that may be used, such as colorants (i.e. Bayscript blue dye), salts, chelating agents (i.e. Trilon B), and the like .
  • Wetting agents such as BYK-345, BYK-307, BYK-306, BYK-308, BYK-333, and BYK-341 , available from BYK Chemie; Fluorad FC-120 or other Fluoro surfactant; Masurf FS-1620 available from Mason Chemical Company; Surfinol 104 PG and Dynol 604 available from Air Products, Inc.; and Silwet L77 available from Witco Chemicals; TEGO Wet 270 available from Evonik; and Triton X- 100, FS-30, FS-34, FS-35, and FS3100 available from The Chemours Company.
  • the wetting agents may be present in amounts up to about 20% by weight of the total mixture.
  • compositions above are typically applied to the conductive material of the substrate using a method that can achieve a thin, uniform coating of the primer material on the conductive material.
  • One such method is inkjet printing.
  • Other methods include spray, ribbon, slot, die, and gravure coating.
  • the compositions are tuned for used in such methods, for example by adjusting viscosity for optimal application.
  • the polymers above can be tuned according to molecular weight and cross-linking by adjusting types of monomers and catalyst or activator content or activity, for example, to provide an optimal loading of primer material at a target viscosity for the application method.
  • the precursor is typically applied to a thickness of 2-50 pm in direct contact with the conductive material of the substrate, thus covering at least a portion of the conductive material to be processed for patterning into circuitry.
  • the precursor material is solidified to complete formation of the primer material.
  • the substrate may be subjected to a drying process, which may include elevated temperature of up to about 150°C, for example about 80°C, and/or reduced pressure, such as negative pressure up to about 250 Torr.
  • the substrate may be exposed to ultraviolet light to activate polymerization of such components.
  • the resulting primer is a solid coating over the conductive material of the substrate that is reactive with a second component of the bi-component system to be applied in a pattern to form the patterned mask.
  • an optional transition material is applied to the primer material.
  • the transition material prepares the surface of the primer to accept, and optimally bond to, the patterning material to be applied subsequently.
  • a solvent removal material may be applied to the primer material to speed removal of solvent species slow to evaporate by dissolving them in a more volatile material.
  • an adhesion promoter may be applied.
  • the adhesion promoter may include functionalities that can bind with the primer material and the patterning material. Examples of adhesion promoters that may be used include peptides and silane coupling agents with acid and base reactive functionalities.
  • the transition material may be similar to the primer material in function, but different in composition, physical properties, or chemical properties.
  • a second polymeric primer material may be applied that is the same composition, but different in molecular weight or reactive site density.
  • the second polymeric primer material may be a different polymer from the underlying polymeric primer material.
  • the optional transition material is optionally used to increase bonding of the patterning material to the primer material.
  • the transitional material can also be used to adjust any thickness, density, or surface elevation non-uniformities in the primer material.
  • a patterning material is applied to the transition material, or directly to the primer, to react with the primer.
  • the patterning material is applied in a pattern to form a patterned, acid-resistant mask material that covers portions of the conductive material while leaving other portions uncovered.
  • the patterning material is applied as a liquid using a method of patterned application such as printing, for example inkjet printing or other liquid printing method.
  • the patterning material contains a material that reacts with the polycationic species of the primer to form an acid-resistant polymer.
  • the material is thus the second component of the bi-component system comprising the primer material and the primer-reactive material.
  • the primer-reactive material is an anionic or polyanionic material (i.e.
  • a polyacid such as polyacrylic acid or poly methacrylic acid.
  • Mixed poly alkylacrylic acids as copolymers or multipolymers, or as mixtures of homopolymers and/or copolymers and multipolymers, can also be used.
  • suitable polyanionic materials include polyanionic cellulose (i.e. ANTISOL polyanionic cellulose from Dow Chemical Co.), and polystyrene sulfonate.
  • the polyanionic species is used in a water solution, which may also contain wetting agents, colorants, and the like, as described above.
  • a base that is at least somewhat soluble or miscible in water is added to the patterning material to activate the polyanionic species in the patterning material.
  • the strong base increases reactivity of the patterning material with the primer material or the primer-plus-transition material.
  • the strong base is believed to remove protons from the polyanionic species, generating anions that are more reactive with the primer material or the primer-plus-transition material.
  • the base should have pH of 7.2-12 and relatively low volatility such that the ink does not change composition appreciably during application to the substrate. Low toxicity is also a plus.
  • Suitable materials for use as a strong base include alkyl amines NR 1 R 2 R 3 , where at least one of R 1 , R 2 , and R 3 is made of carbon and hydrogen, and one or more of R 1 , R 2 , and R 3 may be hydrogen alone, having the general formula C x HyN z , where x is 3-6 (i.e.
  • organocyclic amines such as pyrrole, pyrrolidine, piperidine, imidazole, pyrazole, pyridine, purine, diazines, and triazines.
  • Example materials are isopropylmethylamine, butylamine, 3-dimethylamino-2-propanol, and triethanolamine. Small amounts of ammonia, for example not more than about 10% by weight of the entire composition, may be included with the above materials a stabilizer at levels where loss of ammonia from vaporization will not significantly change the properties of the patterning material.
  • Bases that contain carbon have reduced volatility that contributes to thermal stability of the patterning material. Lower molecular weight bases can be used with lower temperatures that minimize volatility of the base and composition change of the patterning material. Where higher temperatures are encountered, higher molecular weight strong bases can be used.
  • the patterning material is applied in a precision patterned deposition process such as inkjet printing.
  • the patterning material is applied in individual droplets to form features of uniform size as low as 10 pm.
  • a masking pattern can be formed on the conductive material of the substrate.
  • Precision patterned deposition of liquids can be performed using inkjet printers available from Kateeva, Inc., of Newark, California, or using systems available from other manufacturers.
  • the patterning material is frozen in place by substantially instantaneous reaction with the primer to form rigid or semi-rigid polymer features in a pattern.
  • the polymer features formed by reaction of the patterning material with the primer material are acid-resistant, so the polymer features can be used as a mask in an acid treatment to remove the unreacted primer material and exposed conductive material.
  • the patterning material can optionally be exposed to UV radiation to build hardness or rigidity.
  • the substrate following deposition of the patterning material on the primer material, the substrate may be irradiated with 395 nm light for 30 seconds to increase hardness of the patterned polymer material. Increasing hardness can increase acid resistance of the patterned polymer material.
  • the substrate is treated with an acid to remove the primer material and expose portions of the underlying conductive material.
  • a weak aqueous acid such as acetic acid or citric acid
  • Strong acids such as HCI, optionally including salts such as ferric chloride and cupric chloride, acetic acid, nitric acid, chloric acid, perchloric acid, iodic acid, bromic acid, and sulfuric acid, optionally including suitable salts (i.e. ferric or cupric salts), or a strong acid can also be used.
  • Suitable acids have a pH in water of 1.75 or higher.
  • the conductive material not covered by patterned polymer material is exposed, while the conductive material covered by patterned polymer material remains covered, since the patterned polymer material is acid- resistant.
  • the substrate may be dipped in a solution of the acid, or the acid, or solution thereof, may be sprayed onto the surface of the substrate bearing the primer material.
  • the solution may be as concentrated as 1 M, but lower concentrations can be used.
  • An electric potential may be applied in some cases to enhance etch rate.
  • an electrode can be attached to opposite edges of the conductive material, and a DC or AC electric field applied to enhance reaction of the metal with ions in the etchant solution.
  • the treatment of 108 may partially remove the primer material, leaving a thin coating to protect the conductive material from environmental factors, for example in the event the substrate is not further processed right away.
  • the acid treatment process can be done in one application, or optionally in two applications.
  • a first acid application can be performed using a weak acid
  • a second acid application can be performed using a strong acid.
  • primer material can be removed using a water treatment, without acid, and then etching is done using an acid application.
  • a strong acid can be applied, followed by a weak acid or water. In this case, the strong acid develops the pattern and etches exposed conductive material, and the weak acid or water application removes etching byproducts and can also remove remaining pattern material.
  • etching is discontinued, and the substrate is rinsed in water to remove etchants from the substrate.
  • Alcohol such as isopropyl alcohol
  • the patterned polymer may remain on the PCB in some cases, or may be removed by rinsing with water, which may be accelerated by elevated temperature and/or pH.
  • Protic co-solvents such as alcohol and ammonia can also speed dissolution.
  • the underlying primer material is also usually water soluble, but removal may be enhanced using elevated temperature and/or polar aprotic solvents such as pyridine and N-methylpyrrolidone.
  • Fig. 2 is a flow diagram summarizing a method 200 according to another embodiment.
  • the method 200 is a method of forming a patterning ink for making microcircuitry on a PCB.
  • a water miscible base is added to a volume of water to form a base mixture.
  • the base is an alkylamine, alkanolamine, or an organic heterocyclic amine.
  • the base generally has low volatility, for example boiling point between room temperature and about 180°C, pH in water of 7.5-12, and low or no toxicity is a plus, but not required.
  • Suitable alkylamines have the structure NR 1 R 2 R 3 , where at least one of R 1 , R 2 , and R 3 is carbon and hydrogen, and one or more of R 1 , R 2 , and R 3 may be hydrogen alone, having the general formula C x H y N z , where x is 3-6 (i.e. alkyl amines having 3-6 carbon atoms), z is 1 or 2 (monoamines and diamines), and y is 2x+2+z. Examples include isopropylmethylamine, diethylamine, triethylamine, and trimethylamine.
  • Suitable alkanolamines have the general structure NR 4 R 5 R 6 , where at least one of R 4 , R 5 , and R 6 is a hydroxyalkyl group C a H 2a OH, and where one or more of R 4 , R 5 , and R 6 may be hydrogen alone and one or more of R 4 , R 5 , and R 6 may be an alkyl group C a H2a+i .
  • Examples include triethanolamine and 3-dimethylamino-2- propanol.
  • Suitable organocyclic amines include pyrrole, pyrrolidine, piperidine, imidazole, pyrazole, pyridine, purine, diazines, and triazines. Mixtures of any of these classes of compounds can be used, and ammonia can be included in the mixture in small amounts.
  • the base mixture is generally prepared to a pH of 7.5-12.
  • a polyanionic material is added to the base mixture.
  • the polyanionic material is a polymer with a plurality of sites with removable protons.
  • the polyanionic material can be one or more of polyacrylic acid, poly methacrylic acid, a mixed poly alkylacrylic acids, as copolymer or multipolymer, or as a mixture of homopolymers and/or copolymers and multipolymers, a polyanionic cellulose (i.e. ANTISOL polyanionic cellulose from Dow Chemical Co.).
  • the polyanionic material is added as a solid or a water dispersion.
  • the polyanionic material is dissolved in the base mixture.
  • the base mixture with added polyanionic material is mixed for a period of time such as 2-24 hours. Heat may be applied to warm the mixture 10-20 °C above ambient temperature.
  • further solvent, surfactant, or co-solvent may optionally be added to adjust viscosity, pH, surface tension, or other properties for processing.
  • Water can be used, along with other solvents such as alcohols, for example glycols. It should be noted that any suitable solvent can be used to make mixtures according to the concepts described herein.
  • the base is selected, along with the solvent, to dissolve the polyanionic material according to the deprotonation strength of the base in the solvent.
  • Example formulations made according to the method 200 are shown below.
  • Example formulations are numbered across the top of the table and components are numbered down the side.
  • the components are as follows:
  • Component 1 - Joncryl 8085 (polyacrylic acid in ammonium hydroxide solution); Component 2 - Joncryl 682 (polyacrylic acid); Component 3 - propylene glycol; Component 4 (base) - amino methyl propanol; Component 5 (base) - isopropylmethylamine; Component 6 (base) - ethanolamine; Component 7 (base) - isobutylamine; Component 8 (base) - 1 -amino-2 - propanol; Component 9 (base) - sec-butylamine; Component 10 (base) - 3- dimethylamino-2-propanol; Component 11 - ethylenediaminetetraacetic acid (EDTA); Component 12 - Bayscript Cyan; Component 13 - Bayscript Blue; Component 14 -TEGO Wet 500; Component 15 - deionized water.
  • EDTA ethylenediaminetetraacetic acid
  • the base is added to the water to form a base mixture, and then the polyacrylic acid component is added to the base mixture to form a dispersion mixture.
  • the dispersion mixture is stirred for a period to dissolve the polyanionic material. Afterwards, the other ingredients are added in no particular order.
  • the example formulations are as follows:
  • the ink made in the method 200 of Fig. 2 is usable as a patterning material in the method 100 of Fig 1.
  • Such inks can be made prior to use in forming a circuitry pattern, and can be stored for, or used over a period of, up to a month.
  • the ink may be continuously mixed while in use to form patterned materials, or may be intermittently mixed between uses.
  • the amount of base needed depends on the dissociation constants of the base, the relative acid strength of the conjugate anions, and the polyanionic material. Stronger bases generate more anions with lower acid strength. Larger molecular weight polyanions need more and/or stronger anions to dissolve them.
  • Bases having low toxicity can be selected for convenience, but any suitable base can be selected according to its ionic properties.
  • the base is generally selected according to its solubility in the solvent or solvent mixture used for the ink along with its ability to attract protons from the polyanionic material.
  • the amount of base needed depends on the concentration of acid groups on the polyanionic material and on the dissociation constant of the base. Ideally, the base also does not react substantially with the polycationic material used as the primer, or the amount of base used is such that very little excess base remains after interacting with the polyanionic material.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Ink Jet (AREA)

Abstract

L'invention concerne des procédés de traitement de substrats qui comprennent le dépôt d'un matériau conducteur sur un substrat, l'application d'un matériau d'apprêt soluble dans de l'eau ou de l'acide aqueux sur le matériau conducteur, l'impression à jet d'encre d'un matériau de formation de motif résistant à l'acide réactif avec le matériau d'apprêt sur le matériau d'apprêt selon un motif pour former un masque résistant aux acides et l'exposition du substrat à un acide pour graver des parties exposées du matériau conducteur.
PCT/US2020/070943 2020-01-13 2020-12-21 Cartes de circuits imprimés à jet d'encre WO2021146061A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN202080092845.1A CN114945804A (zh) 2020-01-13 2020-12-21 喷墨印刷电路板
EP20914746.1A EP4090914A4 (fr) 2020-01-13 2020-12-21 Cartes de circuits imprimés à jet d'encre
KR1020227026862A KR20220127272A (ko) 2020-01-13 2020-12-21 잉크젯 인쇄 회로 기판
JP2022542635A JP2023512445A (ja) 2020-01-13 2020-12-21 インクジェットプリント回路基板
TW110100763A TW202136909A (zh) 2020-01-13 2021-01-08 噴墨印刷電路板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202062960357P 2020-01-13 2020-01-13
US62/960,357 2020-01-13

Publications (1)

Publication Number Publication Date
WO2021146061A1 true WO2021146061A1 (fr) 2021-07-22

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PCT/US2020/070943 WO2021146061A1 (fr) 2020-01-13 2020-12-21 Cartes de circuits imprimés à jet d'encre

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EP (1) EP4090914A4 (fr)
JP (1) JP2023512445A (fr)
KR (1) KR20220127272A (fr)
CN (1) CN114945804A (fr)
TW (1) TW202136909A (fr)
WO (1) WO2021146061A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018050457A1 (fr) * 2016-09-14 2018-03-22 Agfa-Gevaert N.V. Encres pour jet d'encre résistant à la gravure permettant la fabrication de cartes de circuits imprimés
US20180192521A1 (en) * 2016-12-12 2018-07-05 Jet Cu Pcb Ltd. Methods of etching conductive features, and related devices and systems
US20180206342A1 (en) * 2015-07-14 2018-07-19 Agfa-Gevaert Manufacturing printed circuit boards using uv free radical curable inkjet inks
US20190098771A1 (en) * 2014-11-16 2019-03-28 Nano Dimension Technologies, Ltd. Double-sided and multilayered printed circuit board fabrication using inkjet printing

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3304197A4 (fr) * 2015-06-04 2019-01-23 Kateeva, Inc. Procédés de production d'un motif de réserve de gravure sur une surface métallique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190098771A1 (en) * 2014-11-16 2019-03-28 Nano Dimension Technologies, Ltd. Double-sided and multilayered printed circuit board fabrication using inkjet printing
US20180206342A1 (en) * 2015-07-14 2018-07-19 Agfa-Gevaert Manufacturing printed circuit boards using uv free radical curable inkjet inks
WO2018050457A1 (fr) * 2016-09-14 2018-03-22 Agfa-Gevaert N.V. Encres pour jet d'encre résistant à la gravure permettant la fabrication de cartes de circuits imprimés
US20180192521A1 (en) * 2016-12-12 2018-07-05 Jet Cu Pcb Ltd. Methods of etching conductive features, and related devices and systems

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4090914A4 *

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Publication number Publication date
JP2023512445A (ja) 2023-03-27
TW202136909A (zh) 2021-10-01
EP4090914A4 (fr) 2024-02-21
KR20220127272A (ko) 2022-09-19
CN114945804A (zh) 2022-08-26
EP4090914A1 (fr) 2022-11-23

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