WO2021145072A1

WO2021145072A1 - Electronic device

Info

Publication number: WO2021145072A1
Application number: PCT/JP2020/043648
Authority: WO
Inventors: 一成山田
Original assignee: ソニーグループ株式会社
Priority date: 2020-01-16
Filing date: 2020-11-24
Publication date: 2021-07-22
Also published as: JPWO2021145072A1

Abstract

The present invention comprises: a plurality of media slots each having a storage medium inserted therein; a printed wiring board on which each of the plurality of media slots is mounted; a substrate attachment base on which the printed wiring board is attached; and a heat transfer direction switching unit capable of switching the direction in which heat generated by the storage mediums is conducted. The heat transfer direction switching unit switches the heat transfer direction in accordance with the access state for the storage mediums inserted in each of the plurality of media slots. Because heat generated in the storage mediums is conducted in the direction to which heat transfer is switched in accordance with the access states for the storage mediums inserted in each of the plurality of media slots, this configuration enables improvement of heat radiation efficiency regardless of the access states for the storage mediums.

Description

Electronics

This technology relates to the technical field of an electronic device having a plurality of media slots into which storage media are mounted.

Various electronic devices such as mobile terminals represented by mobile phones and cameras that function as image pickup devices have a printed wiring board arranged inside the housing, and a plurality of media slots are mounted on the printed wiring board. (See, for example, Patent Document 1 and Patent Document 2). With respect to the media slot, for example, a storage medium such as a memory card can be attached and detached by opening a lid that is openable and closable in the housing, and the storage medium mounted in the media slot can be used. Data is written or read by being accessed.

In an electronic device having such a plurality of media slots, heat is generated in the storage medium when the storage medium is accessed and the storage medium is driven. In particular, in recent years, due to the increase in the amount of data, the capacity of the data stored in the storage medium has been increasing, and the access speed when writing or reading the data has been increased, so that the data can be stored from the storage medium. The calorific value also tends to increase.

When the amount of heat generated by the storage medium increases, the heat generated causes the temperature distribution inside the housing to become uneven, which affects the surrounding electronic components and the like, causing problems in the operation of electronic devices and the storage medium. There is a risk of shortening the service life and causing malfunction.

Japanese Unexamined Patent Publication No. 2013-101478 Japanese Unexamined Patent Publication No. 2012-134814

As described above, in recent years, the amount of heat generated from the storage medium has tended to increase, and in particular, in an electronic device having a plurality of media slots, the amount of heat generated when the storage medium is driven tends to increase.

Therefore, in an electronic device having a plurality of media slots, it is desirable that the heat generated in the storage medium is efficiently released, but in each storage medium mounted in each media slot, it depends on the operating state of the electronic device. The amount of heat generated may differ, and it may be difficult to ensure an efficient heat dissipation state depending on the heat dissipation path.

Therefore, the purpose of the electronic device of the present technology is to improve the heat dissipation efficiency regardless of the access state to each storage medium.

First, the electronic device according to the present technology includes a plurality of media slots into which storage media are mounted, a printed wiring board in which the plurality of media slots are mounted, and a board mounting in which the printed wiring board is mounted. The base and a heat transfer direction switching unit capable of conducting heat generated by the storage medium and switching the heat transfer direction are provided, and the storage medium is installed in each of the plurality of media slots according to an access state to the storage medium. The heat transfer direction of the heat transfer direction switching unit can be switched.

As a result, the heat generated in the storage medium is conducted in the heat transfer direction switched according to the access state to the storage medium installed in each of the plurality of media slots.

Secondly, in the above-mentioned electronic device according to the present technology, the storage medium is put into a driven state at the time of access and a non-driven state at the time of non-access, and at least one of the storage media is in the driven state and the non-driven state, respectively. When the state is set, the heat generated in the storage medium in the driven state is transmitted to the media slot in which the storage medium in the non-driven state is mounted so that the heat is transferred to the heat transfer direction switching unit. It is desirable that the thermal direction can be switched.

As a result, heat is conducted from the storage medium in the driven state to the media slot in which the storage medium in the non-driven state is mounted by the heat transfer direction switching unit whose heat transfer direction is switched.

Third, in the electronic device according to the present technology described above, the storage medium is put into a driven state at the time of access and a non-driven state at the time of non-access, and at least one of the storage media is in the driven state and the non-driven state, respectively. The heat transfer direction of the heat transfer direction switching unit is switched so that the heat generated in the storage medium in the driven state is conducted toward the media slot in which the storage medium is not mounted when the state is set. It is desirable to be.

As a result, heat is conducted from the storage medium in the driven state to the media slot in which the storage medium is not mounted by the heat transfer direction switching unit whose heat transfer direction is switched.

Fourth, in the above-mentioned electronic device according to the present technology, a heat radiating body for releasing heat is provided, and the storage medium is put into a driving state at the time of access and a non-driving state at the time of non-access, and all the media slots are filled with. When the storage media are attached and all the storage media are driven, the heat transfer direction of the heat transfer direction switching unit is switched so that heat is transferred from all the storage media toward the heat radiating body. It is desirable to be.

As a result, heat is conducted from all the storage media in the driven state toward the radiator by the heat transfer direction switching unit whose heat transfer direction is switched.

Fifth, in the above-mentioned electronic device according to the present technology, it is desirable that a Perche element whose heat transfer direction is changed according to the direction of the supplied current is used as the heat transfer direction switching unit.

As a result, the heat transfer direction of the Pelche element that functions as the heat transfer direction switching unit is changed according to the direction of the supplied current.

Sixth, in the above-mentioned electronic device according to the present technology, it is desirable that the heat generated in the storage medium is conducted through the substrate mounting base.

This eliminates the need for a dedicated member to conduct the heat generated in the storage medium.

Seventh, in the above-mentioned electronic device according to the present technology, it is desirable that the heat transfer direction switching portion is arranged in contact with the substrate mounting base.

This makes it easier for the heat generated in the storage medium to be conducted between the board mounting base and the heat transfer direction switching portion.

Eighth, in the above-mentioned electronic device according to the present technology, a copper block is attached to the printed wiring board, and the copper block is positioned in a state of being in contact with the substrate mounting base and facing at least one of the media slots. Is desirable.

As a result, the heat generated in the storage medium is transferred to the board mounting base or the media slot via the copper block located facing the media slot.

Ninth, in the above-mentioned electronic device according to the present technology, it is desirable that the plurality of media slots are mounted on the same surface of the printed wiring board.

As a result, a plurality of media slots are located on one side of the printed wiring board.

Tenth, in the above-mentioned electronic device according to the present technology, an access state detection unit for detecting an access state to the storage medium is provided, and the heat transfer direction switching unit is provided according to the detection result of the access state detection unit. It is desirable to switch the heat transfer direction.

As a result, the heat generated in the storage medium is transferred by switching the heat transfer direction of the heat transfer direction switching unit according to the detection result of the access state detection unit.

Eleventh, in the electronic device according to the present technology described above, a change operation unit for changing the access state to the storage medium installed in each of the plurality of media slots is provided, and the change operation unit responds to the operation of the change operation unit. It is desirable that the heat transfer direction of the heat transfer direction switching unit can be switched.

As a result, the heat generated in the storage medium is transferred by switching the heat transfer direction of the heat transfer direction switching unit according to the operation of the change operation unit that changes the access state to the storage medium installed in the media slot.

2 to 28 show an embodiment of the present technology, and this figure is a perspective view of an electronic device. It is sectional drawing which follows the line II-II of FIG. It is sectional drawing of the electronic device which shows the internal structure of a printed wiring board and the like. It is a rear view of a printed wiring board. It is a perspective view of a printed wiring board and the like. It is an enlarged cross-sectional view which shows a part of the internal structure of an electronic device. Along with FIGS. 8 and 9, the heat conduction path is shown, and this figure is a schematic cross-sectional view showing an example in which the first storage medium is in the driven state and the second storage medium is in the non-driven state. be. It is schematic cross-sectional view which shows the example of the case where the 2nd storage medium is in a driven state and the 1st storage medium is in a non-driven state. It is schematic cross-sectional view which shows the example in the case where both the 1st storage medium and the 2nd storage medium are in a driving state. FIG. 11 shows an example in which a heat conductive member is provided as a heat transfer direction switching portion, and this figure shows a case where the first storage medium is in the driven state and the second storage medium is in the non-driven state. It is a schematic cross-sectional view which shows the conduction path of heat. It is a schematic cross-sectional view which shows the heat conduction path when both the 1st storage medium and the 2nd storage medium are in a driving state. FIG. 13 shows an example in which the first media slot and the second media slot are arranged on opposite sides of the board mounting base. In this figure, the first storage medium is in the driving state and the second storage is stored. It is a schematic cross-sectional view which shows the heat conduction path when a medium is in a non-driving state. It is a schematic cross-sectional view which shows the heat conduction path when both the 1st storage medium and the 2nd storage medium are in a driving state. It is a perspective view which shows the example which provided three media slots. Along with FIGS. 16 to 18, the heat conduction path in the example in which the three media slots are provided is shown. In this figure, the first storage medium is in the driving state and the second storage medium and the third storage medium are stored. It is schematic cross-sectional view which shows the example of the case where a medium is in a non-driving state. It is schematic cross-sectional view which shows the example of the case where the 1st storage medium and the 2nd storage medium are in a driven state, and the 3rd storage medium is in a non-driven state. It is schematic cross-sectional view which shows the example of the case where the 1st storage medium and the 3rd storage medium are in a driven state, and the 2nd storage medium is in a non-driven state. It is schematic cross-sectional view which shows the example in the case where the 1st storage medium, the 2nd storage medium and the 3rd storage medium are all in a driving state. It is a perspective view which shows the example which provided four media slots. Along with FIGS. 21 to 27, the heat conduction path in the example in which the four media slots are provided is shown. In this figure, the first storage medium is in the driving state and the second storage medium and the third storage medium are stored. It is a schematic cross-sectional view which shows the example in the case where a medium and a 4th storage medium are in a non-driving state. It is schematic cross-sectional view which shows the example in the case where the 1st storage medium and the 2nd storage medium are in a driven state, and the 3rd storage medium and the 4th storage medium are in a non-driven state. It is schematic cross-sectional view which shows the example in the case where the 1st storage medium and the 3rd storage medium are in a driven state, and the 2nd storage medium and the 4th storage medium are in a non-driven state. It is schematic cross-sectional view which shows the example in the case where the 1st storage medium and the 4th storage medium are in a driving state, and the 2nd storage medium and the 3rd storage medium are in a non-driving state. It is schematic cross-sectional view which shows the example of the case where the 1st storage medium, the 2nd storage medium and the 3rd storage medium are in the driven state, and the 4th storage medium is in the non-driven state. It is a schematic cross-sectional view which shows the example in the case where the 1st storage medium, the 3rd storage medium and the 4th storage medium are in a driven state, and the 2nd storage medium is in a non-driven state. It is a schematic cross-sectional view which shows the example in the case where the 1st storage medium, the 2nd storage medium and the 4th storage medium are in a driven state, and the 3rd storage medium is in a non-driven state. It is schematic cross-sectional view which shows the example of the case where the 1st storage medium, the 2nd storage medium, the 3rd storage medium and the 4th storage medium are in a driving state. It is a block diagram of an electronic device (imaging apparatus).

The mode for implementing the electronic device of the present technology will be described below with reference to the attached drawings.

The embodiment shown below is an application of the electronic device of the present technology to a single-lens reflex camera which is a still camera among imaging devices such as a camera. However, the scope of application of this technology is not limited to single-lens reflex cameras. This technology includes, for example, imaging devices such as still cameras and video cameras other than single-lens reflex cameras, mobile terminals represented by mobile phones, display devices such as televisions, sound output devices such as headphones, earphones and speakers, computers and the like. It can be widely applied to various electronic devices in which a printed wiring board is arranged inside a housing such as an information processing device.

In the following explanation, it is assumed that the direction in which the photographer sees the subject at the time of shooting with the still camera indicates the front-back, up-down, left-right directions. Therefore, when expressed with reference to the optical axis passing through the center of the lens or mount portion of the still camera, the object side (subject) on the optical axis is the front, and the image plane side on the optical axis is the rear. The directions shown below in the front-back, up-down, left-right directions are for convenience of explanation, and the implementation of the present technology is not limited to these directions.

<Configuration of electronic devices>
The electronic device (single-lens reflex camera) 1 is composed of a device main body 2 and an interchangeable lens 3 (see FIGS. 1 and 2). However, in the imaging device to which the interchangeable lens 3 is not attached, the electronic device 1 may be composed of only the device main body 2.

The device main body 2 is composed of necessary parts arranged inside and outside the housing 4. In the housing 4, for example,

various operation units

5, 5, ... Are arranged on the upper surface, the rear surface, and the like. The operation unit 5 is provided with, for example, a power button, a shutter button, a zoom knob, a mode switching knob, and the like.

A display 6 is arranged on the rear surface of the housing 4. A circular opening (not shown) is formed on the front surface of the housing 4, and an annular mount portion (not shown) for mounting the interchangeable lens 3 is provided around the opening.

An image sensor (not shown) such as CCD (Charge Coupled Device) or CMOS (Complementary Metal-Oxide Semiconductor) is arranged inside the housing 4, and the image sensor is located behind the opening.

The housing 4 has a first opening 4a formed on one side surface and a second opening 4b formed on the lower surface. A finder portion 7 is provided at the upper end portion of the housing 4. The user of the electronic device 1 can visually recognize the image of the subject through the display 6 or the finder unit 7, and can also visually recognize the image or video captured by the display 6.

A part of the housing 4, for example, the right end portion where the shutter button is provided is provided as the grip portion 4c. The grip portion 4c is a portion in which the front portion is projected so as to bulge forward from the other portions, and is gripped by the user's hand when taking a picture of the electronic device 1.

The grip portion 4c protruding so that the front portion bulges forward from the other portion is gripped by hand at the time of photographing, so that a stable gripping state of the electronic device 1 is ensured. Further, since the portion provided with the shutter button is provided as the grip portion 4c, the user can operate the shutter button with the same hand as the hand holding the grip portion 4c, so that shooting can be performed easily and quickly. This makes it possible to easily perform shooting and reduce the loss of shooting opportunities.

The housing 4 is supported by a first lid 8 that opens and closes the first opening 4a. By opening and closing the first opening 4a by the first lid 8, the inner wall portion 9 and the inner wall portion 9 arranged inside the first opening 4a inside the housing 4 are opened or closed. Will be done. The inner wall portion 9 is formed with a first insertion hole 9a and a second insertion hole 9b separated from each other on the lower side and the upper side. The inner wall portion 9 may be integrally formed with the housing 4 as a part of the housing 4.

The housing 4 is supported by a second lid 10 that opens and closes the second opening 4b. A battery case 11 is arranged inside the housing 4. The battery case 11 is formed in a box shape that is opened downward by, for example, a metal material having high heat dissipation, and is located above the second lid 10.

The battery case 11 is opened or closed by opening and closing the second opening 4b by the second lid 10. A terminal portion (not shown) is provided inside the battery case 11.

The battery 40 is inserted into the battery case 11 and attached. When the battery 40 is attached to the battery case 11 and the second lid 10 is closed, the terminal portion provided inside the battery case 11 is connected to the connector portion (not shown) provided in the battery 40.

The interchangeable lens 3 is detachable from the device main body 2, and the required parts are arranged inside and outside the outer cylinder 12.

A plurality of adjusting rings 13 are rotatably supported on the outer peripheral surface of the outer cylinder 12. The adjustment ring 13 has, for example, a function of performing focusing adjustment, zooming adjustment, light intensity adjustment of the aperture, and the like.

Inside the outer cylinder 12, a plurality of lens groups (not shown) are arranged apart from each other in the optical axis direction (front-back direction). A lens mount (not shown) is attached to the rear end of the outer cylinder 12. The interchangeable lens 3 is attached to the apparatus main body 2 by connecting the lens mount to the mount portion.

A board mounting base 14 is arranged inside the housing 4 (see FIG. 2). The substrate mounting base 14 is, for example, a chassis made of a metal material having high thermal conductivity, and is formed in a horizontally long substantially rectangular shape. The rear surface portion 11a of the battery case 11 is attached to one of the left and right side portions of the front surface 14a of the board mounting base 14.

A printed wiring board 15 is arranged inside the housing 4 (see FIGS. 2 to 5). The printed wiring board 15 is used as, for example, a double-sided board formed in a horizontally long shape, and on both sides, for example, electronic components (not shown) are mounted on both sides. The printed wiring board 15 may be a single-sided board on which electronic components and the like are mounted on only one side in the thickness direction.

The printed wiring board 15 is mounted with the front surface 15a in contact with the rear surface 14b of the board mounting base 14 (see FIG. 6). One of the left and right side portions 16 of the printed wiring board 15 is located directly behind the battery case 11 with the board mounting base 14 interposed therebetween.

The perche element 17 and the copper block 18 are attached to the side portion 16 in a state of being separated from each other in the vertical direction (see FIGS. 4 to 6). The perche element 17 and the copper block 18 are formed, for example, in the shape of a rectangular plate.

The Perche element 17 has, for example, a structure in which a conductive layer 17c having a semiconductor element is provided between a pair of first ceramic substrates 17a and a second ceramic substrate 17b (see FIG. 6). The perche element 17 has a function of conducting heat in the thickness direction, and the heat transfer direction can be switched according to the direction of the current supplied to the conductive layer 17c.

Therefore, in the Perche element 17, when a current is supplied to the conductive layer 17c in one direction, heat is conducted from the first ceramic substrate 17a to the second ceramic substrate 17b, and heat is conducted to the conductive layer 17c in the other direction. When an electric current is supplied from the second ceramic substrate 17b, heat is conducted from the second ceramic substrate 17b to the first ceramic substrate 17a. In this way, the Pelche element 17 is capable of switching the heat transfer direction, and functions as a heat transfer direction switching unit.

In the perche element 17, for example, the front surface of the first ceramic substrate 17a is positioned on the same plane as the front surface 15a of the printed wiring board 15 and is brought into surface contact with the rear surface 14b of the substrate mounting base 14, so that the second ceramic substrate 17b The rear surface is located on the same plane as the rear surface 15b of the printed wiring board 15.

In the copper block 18, for example, the front surface 18a is positioned on the same plane as the front surface 15a of the printed wiring board 15 and is in surface contact with the rear surface 14b of the substrate mounting base 14, and the rear surface 18b is in the same plane as the rear surface 15b of the printed wiring board 15. Located on top.

The first media slot 19 and the second media slot 20 are attached to the rear surface of the side portion 16 in a state of being separated from each other on the lower side and the upper side, respectively (see FIGS. 3 and 5).

The first media slot 19 has a first case body 21 formed of a metal material having high thermal conductivity and a first connector 22 attached to a side portion 16. The first case body 21 is opened to one of the front side and the side side, and is attached to the rear surface 15b of the printed wiring board 15 in a state of covering the copper block 18 from the rear side. Therefore, the rear surface portion of the first case body 21 is in a state of facing the copper block 18. One end on the side of the first case body 21 is attached to the inner wall portion 9 in the vicinity of the first insertion hole 9a, and the other end on the side of the first case body 21 has a first The connector 22 is located.

The first storage medium 50 is inserted and installed in the first media slot 19. The first storage medium 50 is inserted into the first insertion hole 9a of the inner wall portion 9 and inserted into the first case body 21 in the state where the first lid body 8 is opened, and is inserted into the first media slot 19. It will be installed. When the first storage medium 50 is installed in the first media slot 19, a terminal portion (not shown) formed in the first storage medium 50 is connected to the first connector 22.

The first storage medium 50 mounted in the first media slot 19 is accessed via a printed wiring board 15 and a first connector 22 by a control unit (not shown) such as a central processing unit to obtain a signal. Input / output is performed, and data is written or the written data is read. The state in which the data is written or read to the first storage medium 50 is the driving state of the first storage medium 50, and the data is not written or read to the first storage medium 50. The state is the non-driving state of the first storage medium 50.

The second media slot 20 has a second case body 23 made of a metal material having high thermal conductivity and a second connector 24 attached to the side portion 16. The second case body 23 is opened to one of the front side and the side side, and is attached to the rear surface 15b of the printed wiring board 15 in a state of covering the perche element 17 from the rear side. Therefore, the rear surface portion of the second case body 23 is in a state of facing the Pelche element 17. One end on the side of the second case 23 is attached to the inner wall 9 in the vicinity of the second insertion hole 9b, and the other end on the side of the second case 23 has a second. The connector 24 is located.

The second storage medium 60 is inserted and installed in the second media slot 20. The second storage medium 60 is inserted into the second insertion hole 9b of the inner wall portion 9 and inserted into the second case body 23 in the state where the first lid body 8 is opened, and is inserted into the second media slot 20. It will be installed. When the second storage medium 60 is installed in the second media slot 20, a terminal portion (not shown) formed in the second storage medium 60 is connected to the second connector 24.

The second storage medium 60 mounted in the second media slot 20 is accessed by the control unit via the printed wiring board 15 and the second connector 24 to input and output signals, and data is input and output. Writing or reading of the written data is performed. The state in which the data is written or read to the second storage medium 60 is the driving state of the second storage medium 60, and the data is not written or read to the second storage medium 60. The state is the non-driving state of the second storage medium 60.

When data is written or read in the first media slot 19 or the second media slot 20 with respect to the first storage medium 50 and the second storage medium 60, it is driven. It is a non-driving state when data is not written or read even when the data is installed in the first media slot 19 or the second media slot 20.

The first connector 22 and the second connector 24 are located in the vicinity of the copper block 18 and the Pelche element 17, respectively.

As described above, the first storage medium 50 and the second storage medium 60 are put into either a driven state or a non-driven state, but the first storage medium 50 and the second storage medium 60 are driven. When in the state, the first storage medium 50 and the second storage medium 60 generate heat, respectively.

The electronic device 1 is provided with an access state detection unit that detects access states to the first storage medium 50 and the second storage medium 60, respectively. For example, a control unit such as the central processing unit described above is an access state detection unit. Functions as. Therefore, the access state detection unit detects the access state to the first storage medium 50 and the second storage medium 60, and the first storage medium 50 and the second storage medium 60 are determined by the detection result of the access state detection unit, respectively. It is determined whether it is in the driven state or the non-driven state.

<Heat conduction path>
The heat conduction path generated in the first storage medium 50 and the second storage medium 60 in the above-mentioned electronic device 1 will be described below (see FIGS. 7 to 9).

In addition, in FIGS. 7 to 9, in order to facilitate understanding, the configuration and positional relationship of each part are simplified and shown, and the heat transfer direction can be switched. 17 is shown with a crossed diagonal line. Further, in the following, for the sake of simplicity, both the first storage medium 50 and the second storage medium 60 mounted in the first media slot 19 or the second media slot 20 are put into a driving state. Yes, it will be described as not being in the non-driving state in the mounted state.

In the following, only the main heat transfer path through which the heat generated in each storage medium is transferred will be described (the same applies to the example in which three or four media slots are provided (FIGS. 14 to 27). ). Therefore, for example, when the first storage medium 50 is mounted in the first media slot 19, the heat generated in the first storage medium 50 is also released from the first media slot 19, the printed wiring board 15, and the like. In the state where the second storage medium 60 is mounted in the second media slot 20, the heat generated in the second storage medium 60 is also released from the second media slot 20, the printed wiring board 15, and the like. However, the amount of these heats released is small, and the description of the conduction path of these heats will be omitted below.

Further, in the following, even when the storage medium is not installed in the media slot, the storage medium will be described as being in the non-driving state (an example in which three or four media slots are provided (FIGS. 14 to 27). ) Is the same.)

When the first storage medium 50 is in the driving state and the second storage medium 60 is in the non-driving state, the heat transfer direction of the perche element 17 is from the first ceramic substrate 17a to the second ceramic substrate 17b. It can be switched to a state in which it is heading (see FIG. 7).

At this time, the heat generated in the first storage medium 50 is transmitted to the board mounting base 14 via the copper block 18, is conducted from the board mounting base 14 to the battery case 11, and is also conducted from the board mounting base 14 to the Perche element 17. Will be done.

The heat conducted to the battery case 11 is released from the battery case 11 or the battery 40. Therefore, the battery case 11 and the battery 40 function as a heat radiating body that releases heat.

On the other hand, the heat conducted to the Perche element 17 is switched from the second ceramic substrate 17b to the direction in which the heat transfer direction of the Perche element 17 is directed from the first ceramic substrate 17a to the second ceramic substrate 17b. It is conducted to the second media slot 20 and discharged from the second media slot 20.

Therefore, the heat generated in the first storage medium 50 is released from the battery case 11, the battery 40, or the second media slot 20. Further, at least a part of the heat released from the battery case 11, the battery 40 or the second media slot 20 is conducted to the housing 4, and is discharged from the housing 4 to the atmosphere.

On the contrary, when the first storage medium 50 is in the non-driving state and the second storage medium 60 is in the driving state, the heat transfer direction of the perche element 17 is from the second ceramic substrate 17b to the first ceramic. The state can be switched to the direction toward the substrate 17a (see FIG. 8).

At this time, the heat generated in the second storage medium 60 is switched from the second ceramic substrate 17b to the first ceramic substrate 17a in the heat transfer direction of the perche element 17, so that the first ceramic substrate 17a is used. It is transmitted from 17a to the board mounting base 14, is conducted from the board mounting base 14 to the battery case 11, and is also conducted from the board mounting base 14 to the copper block 18.

The heat conducted to the battery case 11 is released from the battery case 11 or the battery 40.

On the other hand, the heat conducted to the copper block 18 is conducted from the copper block 18 to the first media slot 19 and discharged from the first media slot 19.

Therefore, the heat generated in the second storage medium 60 is released from the battery case 11, the battery 40, or the first media slot 19. Further, at least a part of the heat released from the battery case 11, the battery 40 or the first media slot 19 is conducted to the housing 4, and is discharged from the housing 4 to the atmosphere.

Further, when both the first storage medium 50 and the second storage medium 60 are in the driving state, the heat transfer direction of the perche element 17 goes from the second ceramic substrate 17b to the first ceramic substrate 17a. It can be switched to the direction (see FIG. 9). At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18 and conducted from the substrate mounting base 14 to the battery case 11. The heat generated in the second storage medium 60 is transferred from the first ceramic substrate 17a because the heat transfer direction of the perche element 17 is switched from the second ceramic substrate 17b to the first ceramic substrate 17a. It is transmitted to the board mounting base 14 and is conducted from the board mounting base 14 to the battery case 11.

Therefore, the heat generated in both the first storage medium 50 and the second storage medium 60 is released from the battery case 11 or the battery 40. Further, at least a part of the heat released from the battery case 11 or the battery 40 is conducted to the housing 4 and released from the housing 4 to the atmosphere.

As described above, in the electronic device 1, the heat generated in the first storage medium 50 and the second storage medium 60 is conducted through the substrate mounting base 14 that functions as the mounting member of the printed wiring board 15.

Therefore, a dedicated member for conducting heat generated in the first storage medium 50 and the second storage medium 60 is not required, and the number of parts can be reduced and the heat transfer efficiency can be improved. ..

Further, the perche element 17 that functions as a heat transfer direction switching portion is arranged in contact with the substrate mounting base 14.

Therefore, the heat generated in the first storage medium 50 and the second storage medium 60 is easily conducted between the substrate mounting base 14 and the Pelche element 17, and the heat transfer efficiency is improved by switching the heat transfer direction by the Pelche element 17. It is possible to improve the heat dissipation efficiency after improving the heat dissipation efficiency.

Further, the copper block 18 is attached to the printed wiring board 15, and the copper block 18 is positioned in contact with the substrate mounting base 14 and facing the first media slot 19.

Therefore, the heat generated in the first storage medium 50 or the second storage medium 60 passes through the copper block 18 located facing the first media slot 19 to the substrate mounting base 14 or the first media slot 19. Therefore, it is possible to improve the heat dissipation efficiency by improving the heat transfer efficiency from the first storage medium 50 and the second storage medium 60 to the substrate mounting base 14 or the first media slot 19.

In the above, an example in which heat transfer is performed by the copper block 18 attached to the printed wiring board 15, but instead of the copper block 18, for example, a through hole is formed, and heat transfer is performed by the through hole. It may be configured to be performed.

Furthermore, when both the first storage medium 50 and the second storage medium 60 mounted in the first media slot 19 and the second media slot 20, which are all media slots, are put into a driving state, respectively. A Pelche element that functions as a heat transfer direction switching unit so that heat is transferred from the first storage medium 50 and the second storage medium 60, which are all storage media, toward the battery case 11 and the battery 40 that function as radiators. The heat transfer direction of 17 is switched.

Therefore, since the heat is conducted from all the storage media in the driven state to the heat radiating body by the Pelche element 17 whose heat transfer direction is switched, the heat transfer efficiency and the heat radiating efficiency can be improved.

Furthermore, since the first media slot 19 and the second media slot 20 are mounted on the same surface of the printed wiring board 15, the first media slot 19 and the second media slot 20 are mounted on the printed wiring board 15. It is located on one surface side, and it is possible to improve the heat dissipation efficiency of the heat generated in the first storage medium 50 and the second storage medium 60 while ensuring the thinness of the electronic device 1.

The heat transfer direction of the Pelche element 17 described above is switched according to, for example, the detection result of the access state detection unit.

That is, when it is detected by the detection result of the access state detection unit that the first storage medium 50 is in the driving state and the second storage medium 60 is in the non-driving state, the heat transfer direction of the Pelche element 17 is the first. It is switched to a state in which the direction is from the ceramic substrate 17a of the above to the second ceramic substrate 17b. Further, when it is detected from the detection result of the access state detection unit that the first storage medium 50 is in the non-driving state and the second storage medium 60 is in the driving state, the heat transfer direction of the Pelche element 17 is the second. It is switched to a state in which the direction is from the ceramic substrate 17b of the above to the first ceramic substrate 17a. Further, when it is detected by the detection result of the access state detection unit that both the first storage medium 50 and the second storage medium 60 are in the driving state, the heat transfer direction of the perche element 17 is the second ceramic. The state is switched from the substrate 17b toward the first ceramic substrate 17a.

Therefore, the heat generated in the first storage medium 50 and the second storage medium 60 is transferred by switching the heat transfer direction of the Pelche element 17 according to the detection result of the access state detection unit, so that the first storage medium The heat generated in the 50 and the second storage medium 60 can be conducted in a direction according to the situation to improve the heat dissipation efficiency.

When it is detected by the detection result of the access state detection unit that both the first storage medium 50 and the second storage medium 60 are in the non-driving state, for example, a current is supplied to the Pelche element 17. It is set not to be done.

<Example of different heat transfer direction switching part>
In the above, an example in which the heat transfer direction switching unit is provided as the heat transfer direction switching unit capable of switching the heat transfer direction is shown, but the heat transfer direction switching unit may be other than the heat transfer element 17, for example. , The following heat conduction members may be provided as heat transfer direction switching portions (see FIGS. 10 and 11).

In the following example, for the sake of simplicity, the first storage medium 50 is preferentially used with respect to the second storage medium 60, and the first storage medium 50 is installed in the first media slot 19. The storage medium 50 will be described as being put into a driven state regardless of whether the second storage medium 60 is in a driven state or a non-driven state (description of the configuration shown in FIGS. 12 to 27 below). The same applies to.)

The heat conductive member 25 is made movable inside the board mounting base 14 and the printed wiring board 15 by, for example, a moving mechanism having an actuator (not shown) in the vertical direction. The heat conductive member 25 is made of, for example, a metal material having high heat conductivity.

When the first storage medium 50 is in the driven state and the second storage medium 60 is in the non-driven state, the heat conductive member 25 is moved to the lower moving end (see FIG. 10). At this time, the heat generated in the first storage medium 50 is transmitted to the board mounting base 14 via the copper block 18, is conducted from the board mounting base 14 to the battery case 11, and is conducted from the board mounting base 14 to the heat conductive member 25. Conducted.

On the other hand, the heat conducted to the heat conductive member 25 is conducted from the heat conductive member 25 to the second media slot 20 and discharged from the second media slot 20.

Further, when both the first storage medium 50 and the second storage medium 60 are in the driving state, the heat conductive member 25 is moved to the upper moving end (see FIG. 11). At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18 and conducted from the substrate mounting base 14 to the battery case 11. The heat generated in the second storage medium 60 is transferred to the heat conductive member 25, and is conducted from the heat conductive member 25 to the battery case 11.

As described above, when the first storage medium 50 is in the driven state and the second storage medium 60 is in the non-driven state, the heat conductive member 25 is moved to the lower moving end and the first storage medium 60 is moved to the lower moving end. The heat generated in the storage medium 50 is conducted from the substrate mounting base 14 to the second media slot 20 via the heat conductive member 25, and both the first storage medium 50 and the second storage medium 60 are put into a driving state. If so, the heat conductive member 25 is moved to the upper moving end, and the heat generated in the second storage medium 60 is conducted to the battery case 11 via the heat conductive member 25.

Therefore, the heat transfer direction of the heat conductive member 25 is switched according to the access state to the first storage medium 50 and the second storage medium 60.

<Example of different media slot placement positions>
In the above, an example in which the first media slot 19 and the second media slot 20 are arranged on the rear surface 14b side of the board mounting base 14 is shown, but the first media slot 19 and the second media slot 20 are arranged. It may be arranged on the front surface 14a side and the rear surface 14b side of the board mounting base 14 (see FIGS. 12 and 13). For example, the first media slot 19 is arranged on the rear surface 14b side of the board mounting base 14, and the second media slot 20 is arranged on the front surface 14a side of the board mounting base 14.

In this case, for example, a printed wiring board 26 different from the printed wiring board 15 is attached to the front surface 14a of the board mounting base 14, a second media slot 20 is attached to the front surface of the printed wiring board 26, and printed wiring is performed. The copper block 18 is attached to the position of the substrate 15 facing the first media slot 19, and the Pelche element 17 is attached to the position of the printed wiring board 26 facing the second media slot 20.

When the first storage medium 50 is in the driving state and the second storage medium 60 is in the non-driving state, the heat transfer direction of the perche element 17 is from the second ceramic substrate 17b to the first ceramic substrate 17a. It can be switched to a state in which it faces (see FIG. 12). At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18 and conducted from the substrate mounting base 14 to the Perche element 17.

Since the heat transfer direction of the Perche element 17 is switched from the second ceramic substrate 17b to the first ceramic substrate 17a, the heat conducted to the Perche element 17 is switched from the first ceramic substrate 17a to the second ceramic substrate 17a. It is conducted to the media slot 20 of the above and is discharged from the second media slot 20 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

Further, when both the first storage medium 50 and the second storage medium 60 are in the driving state, the heat transfer direction of the perche element 17 is from the first ceramic substrate 17a to the second ceramic substrate 17b. It can be switched to the direction (see FIG. 13). At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18, and is discharged mainly from the outer peripheral surface of the substrate mounting base 14. The heat generated in the second storage medium 60 is transferred from the second ceramic substrate 17b because the heat transfer direction of the perche element 17 is switched from the first ceramic substrate 17a to the second ceramic substrate 17b. It is transmitted to the board mounting base 14 and is discharged mainly from the outer peripheral surface of the board mounting base 14.

Therefore, both the heat generated in the first storage medium 50 and the second storage medium 60 is released from the substrate mounting base 14. Further, at least a part of the heat released from the substrate mounting base 14 is conducted to the housing 4, and is released from the housing 4 to the atmosphere.

<Configuration with three media slots>
Although an example of a configuration in which two media slots of a first media slot 19 and a second media slot 20 are provided has been described above, the electronic device 1 has the first media slot 19 and the second media. In addition to the slot 20, three media slots of the third media slot 27 may be provided (see FIG. 14).

The third media slot 27 has a third case body 28 and a third connector (not shown), is mounted on the printed wiring board 26, and is located on the front side of the first media slot 19 with the board mounting base 14 interposed therebetween. Has been done. A perche element 29 is attached to the printed wiring board 26 at a position facing the front surface of the third case body 28, and the perche element 29, like the perche element 17, has a heat transfer direction according to the direction of the supplied current. Functions as a heat transfer direction switching unit that can switch between. The perche element 29 has a pair of a first ceramic substrate 29a and a second ceramic substrate 29b, and the first ceramic substrate 29a is located in front of the second ceramic substrate 29b.

The heat conduction path when the first media slot 19, the second media slot 20, and the third media slot 27 are provided will be described below (see FIGS. 15 to 18).

Note that, in FIGS. 15 to 18, in order to facilitate understanding, the configuration and positional relationship of each part are shown in a simplified manner, and the

perche elements

17 and 29 are shown with crossed diagonal lines. Further, in the following, for the sake of simplicity, the first storage medium 50 and the second storage medium mounted in the first media slot 19, the second media slot 20, or the third media slot 27 will be described below. It will be described as assuming that both the 60 and the third storage medium 70 are in the driven state and are not in the non-driven state in the mounted state.

When the first storage medium 50 is in the driving state and the second storage medium 60 and the third storage medium 70 are in the non-driving state, the heat transfer direction of the perche element 17 is from the first ceramic substrate 17a. The state is switched to the direction toward the second ceramic substrate 17b, and the heat transfer direction of the perche element 29 is switched to the state toward the first ceramic substrate 29a from the second ceramic substrate 29b (see FIG. 15). ).

At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18. The heat transferred to the board mounting base 14 is conducted from the board mounting base 14 to the perche element 29 and also to the perche element 17. Since the heat transfer direction of the perche element 29 is switched from the second ceramic substrate 29b to the first ceramic substrate 29a, the heat conducted to the perche element 29 is switched from the first ceramic substrate 29a to the third ceramic substrate 29a. It is conducted to the media slot 27 of the above and is discharged from the third media slot 27 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

Therefore, the heat generated in the first storage medium 50 is released from the third media slot 27, the battery case 11, the battery 40, or the second media slot 20. Further, at least a part of the heat released from the third media slot 27, the battery case 11, the battery 40 or the second media slot 20 is conducted to the housing 4 and released from the housing 4 to the atmosphere.

When the first storage medium 50 and the second storage medium 60 are in the driving state and the third storage medium 70 is in the non-driving state, the heat transfer direction of the perche element 17 is from the second ceramic substrate 17b. The state is switched to the direction toward the first ceramic substrate 17a, and the heat transfer direction of the perche element 29 is switched to the state toward the first ceramic substrate 29a from the second ceramic substrate 29b (see FIG. 16). ).

At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18 and conducted from the substrate mounting base 14 to the Pelche element 29. Since the heat transfer direction of the perche element 29 is switched from the second ceramic substrate 29b to the first ceramic substrate 29a, the heat conducted to the perche element 29 is switched from the first ceramic substrate 29a to the third ceramic substrate 29a. It is conducted to the media slot 27 of the above and is discharged from the third media slot 27 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

On the other hand, the heat generated in the second storage medium 60 is switched from the second ceramic substrate 17b to the first ceramic substrate 17a in the heat transfer direction of the Pelche element 17, so that the first ceramic substrate is used. It is transmitted from 17a to the substrate mounting base 14, and is conducted from the substrate mounting base 14 to the perche element 29.

The heat conducted to the Pelche element 29 is conducted from the first ceramic substrate 29a to the third media slot 27, discharged from the third media slot 27, and conducted to the battery case 11 to the battery case 11 or the battery. Emitted from 40.

Therefore, the heat generated in the first storage medium 50 and the second storage medium 60 is released from the battery case 11, the battery 40, or the third media slot 27. Further, at least a part of the heat released from the battery case 11, the battery 40 or the third media slot 27 is conducted to the housing 4 and released from the housing 4 to the atmosphere.

When the first storage medium 50 and the third storage medium 70 are in the driving state and the second storage medium 60 is in the non-driving state, the heat transfer direction of the perche element 17 is from the first ceramic substrate 17a. The state is switched to the direction toward the second ceramic substrate 17b, and the heat transfer direction of the perche element 29 is switched to the state toward the second ceramic substrate 29b from the first ceramic substrate 29a (see FIG. 17). ).

At this time, the heat generated in the first storage medium 50 is transmitted to the substrate mounting base 14 via the copper block 18, and is conducted from the substrate mounting base 14 to the Pelche element 17. Since the heat transfer direction of the perche element 17 is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, the heat conducted to the perche element 17 is switched from the second ceramic substrate 17b to the second ceramic substrate 17b. It is conducted to the media slot 20 of the above and is discharged from the second media slot 20.

On the other hand, the heat generated in the third storage medium 70 is switched from the first ceramic substrate 29a to the second ceramic substrate 29b in the heat transfer direction of the perche element 29, so that the second ceramic substrate is used. It is transmitted from 29b to the board mounting base 14, and is conducted from the board mounting base 14 to the perche element 17. Since the heat transfer direction of the perche element 17 is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, the heat conducted to the perche element 17 is switched from the second ceramic substrate 17b to the second ceramic substrate 17b. It is conducted to the media slot 20 of the above and is discharged from the second media slot 20.

Therefore, the heat generated in the first storage medium 50 and the third storage medium 70 is released from the second media slot 20. Further, at least a part of the heat released from the second media slot 20 is conducted to the housing 4 and released from the housing 4 to the atmosphere.

When the first storage medium 50, the second storage medium 60, and the third storage medium 70 are all driven, the heat transfer direction of the perche element 17 is from the second ceramic substrate 17b to the first. The state is switched to the direction toward the ceramic substrate 17a, and the heat transfer direction of the perche element 29 is switched to the state toward the second ceramic substrate 29b from the first ceramic substrate 29a (see FIG. 18).

At this time, the heat generated in the first storage medium 50 is transferred to the board mounting base 14 via the copper block 18 and discharged mainly from the outer peripheral surface of the board mounting base 14.

The heat generated in the second storage medium 60 is transferred from the first ceramic substrate 17a because the heat transfer direction of the perche element 17 is switched from the second ceramic substrate 17b to the first ceramic substrate 17a. It is transmitted to the board mounting base 14 and is discharged mainly from the outer peripheral surface of the board mounting base 14.

The heat generated in the third storage medium 70 is transferred from the second ceramic substrate 29b because the heat transfer direction of the perche element 29 is switched from the first ceramic substrate 29a to the second ceramic substrate 29b. It is transmitted to the board mounting base 14 and is discharged mainly from the outer peripheral surface of the board mounting base 14.

Therefore, the heat generated in the first storage medium 50, the second storage medium 60, and the third storage medium 70 is released from the substrate mounting base 14. Further, at least a part of the heat released from the substrate mounting base 14 is conducted to the housing 4, and is released from the housing 4 to the atmosphere.

<Configuration with four media slots>
Although an example of a configuration in which two media slots or three media slots are provided has been described above, the electronic device 1 has a third medium in addition to the first media slot 19 and the second media slot 20. Four media slots, slot 27 and a fourth media slot 30, may be provided (see FIG. 19).

The fourth media slot 30 has a fourth case body 31 and a fourth connector (not shown), is mounted on the printed wiring board 26, and is located on the front side of the second media slot 20 with the board mounting base 14 interposed therebetween. Has been done. A perche element 32 is attached to the printed wiring board 26 at a position facing the front surface portion of the fourth case body 31, and the perche element 32, like the perche element 17 and the perche element 29, depends on the direction of the supplied current. It functions as a heat transfer direction switching unit that can switch the heat transfer direction. The perche element 32 has a pair of a first ceramic substrate 32a and a second ceramic substrate 32b, and the first ceramic substrate 32a is located in front of the second ceramic substrate 32b.

The heat conduction path when the first media slot 19, the second media slot 20, the third media slot 27, and the fourth media slot 30 are provided will be described below (see FIGS. 20 to 27). ).

Note that, in FIGS. 20 to 27, in order to facilitate understanding, the configuration and positional relationship of each part are shown in a simplified manner, and the

Perche elements

17, 29, and 32 are shown with diagonal lines crossed. Further, in the following, for the sake of simplicity, the first storage medium mounted in the first media slot 19, the second media slot 20, the third media slot 27, or the fourth media slot 30. It will be described as assuming that the 50, the second storage medium 60, the third storage medium 70, or the fourth storage medium 80 are all in the driven state and are not in the non-driven state in the mounted state.

When the first storage medium 50 is in the driving state and the second storage medium 60, the third storage medium 70, and the fourth storage medium 80 are in the non-driving state, the heat transfer direction of the ceramic element 17 is set. The state is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, and the heat transfer direction of the perche element 29 is the direction from the second ceramic substrate 29b to the first ceramic substrate 29a. The thermoelectric cooling element 32 is switched to a state in which the heat transfer direction is from the second ceramic substrate 32b to the first ceramic substrate 32a (see FIG. 20).

At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18. The heat transferred to the board mounting base 14 is conducted from the board mounting base 14 to the perche element 29 and also to the perche element 17 and the perche element 32.

Since the heat transfer direction of the perche element 29 is switched from the second ceramic substrate 29b to the first ceramic substrate 29a, the heat conducted to the perche element 29 is switched from the first ceramic substrate 29a to the third ceramic substrate 29a. It is conducted to the media slot 27 of the above and is discharged from the third media slot 27 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40. Since the heat transfer direction of the perche element 17 is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, the heat conducted to the perche element 17 is switched from the second ceramic substrate 17b to the second ceramic substrate 17b. It is conducted to the media slot 20 of the above and is discharged from the second media slot 20. Since the heat transfer direction of the Perche element 32 is switched from the second ceramic substrate 32b to the first ceramic substrate 32a, the heat conducted to the Perche element 32 is switched from the first ceramic substrate 32a to the fourth. It is conducted to the media slot 30 of the above and is discharged from the fourth media slot 30 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

Therefore, the heat generated in the first storage medium 50 is released from the third media slot 27, the battery case 11, the battery 40, the second media slot 20, or the fourth media slot 30. Further, at least a part of the heat released from the third media slot 27, the battery case 11, the battery 40, the second media slot 20 or the fourth media slot 30 is conducted to the housing 4, and is transmitted from the housing 4. Released into the atmosphere.

When the first storage medium 50 and the second storage medium 60 are in the driving state and the third storage medium 70 and the fourth storage medium 80 are in the non-driving state, the heat transfer direction of the ceramic element 17 is set. The state is switched from the second ceramic substrate 17b to the direction toward the first ceramic substrate 17a, and the heat transfer direction of the perche element 29 is the direction toward the first ceramic substrate 29a from the second ceramic substrate 29b. The thermoelectric cooling element 32 is switched to a state in which the heat transfer direction is from the second ceramic substrate 32b to the first ceramic substrate 32a (see FIG. 21).

At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18, and is conducted from the substrate mounting base 14 to the perche element 29 and also to the perche element 32.

Since the heat transfer direction of the perche element 29 is switched from the second ceramic substrate 29b to the first ceramic substrate 29a, the heat conducted to the perche element 29 is switched from the first ceramic substrate 29a to the third ceramic substrate 29a. It is conducted to the media slot 27 of the above and is discharged from the third media slot 27 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40. Since the heat transfer direction of the Perche element 32 is switched from the second ceramic substrate 32b to the first ceramic substrate 32a, the heat conducted to the Perche element 32 is switched from the first ceramic substrate 32a to the fourth. It is conducted to the media slot 30 of the above and is discharged from the fourth media slot 30 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

On the other hand, the heat generated in the second storage medium 60 is transferred to the substrate mounting base 14 because the heat transfer direction of the Perche element 17 is switched from the second ceramic substrate 17b to the first ceramic substrate 17a. It is transmitted and conducted from the substrate mounting base 14 to the Perche element 32 and also to the Perche element 29.

Since the heat transfer direction of the Perche element 32 is switched from the second ceramic substrate 32b to the first ceramic substrate 32a, the heat conducted to the Perche element 32 is switched from the first ceramic substrate 32a to the fourth. It is conducted to the media slot 30 of the above and is discharged from the fourth media slot 30 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40. Since the heat transfer direction of the perche element 29 is switched from the second ceramic substrate 29b to the first ceramic substrate 29a, the heat conducted to the perche element 29 is switched from the first ceramic substrate 29a to the third ceramic substrate 29a. It is conducted to the media slot 27 of the above and is discharged from the third media slot 27 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

Therefore, the heat generated in the first storage medium 50 and the second storage medium 60 is released from the battery case 11, the battery 40, the third media slot 27, or the fourth media slot 30. Further, at least a part of the heat released from the battery case 11, the battery 40, the third media slot 27 or the fourth media slot 30 is conducted to the housing 4, and is discharged from the housing 4 to the atmosphere.

When the first storage medium 50 and the third storage medium 70 are in the driving state and the second storage medium 60 and the fourth storage medium 80 are in the non-driving state, the heat transfer direction of the ceramic element 17 is set. The state is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, and the heat transfer direction of the perche element 29 is the direction from the first ceramic substrate 29a to the second ceramic substrate 29b. The thermoelectric cooling element 32 is switched to a state in which the heat transfer direction is from the second ceramic substrate 32b to the first ceramic substrate 32a (see FIG. 22).

At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18, and is conducted from the substrate mounting base 14 to the perche element 17 and also to the perche element 32.

Since the heat transfer direction of the perche element 17 is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, the heat conducted to the perche element 17 is switched from the second ceramic substrate 17b to the second ceramic substrate 17b. It is conducted to the media slot 20 of the above and is discharged from the second media slot 20. Since the heat transfer direction of the Perche element 32 is switched from the second ceramic substrate 32b to the first ceramic substrate 32a, the heat conducted to the Perche element 32 is switched from the first ceramic substrate 32a to the fourth. It is conducted to the media slot 30 of the above and is discharged from the fourth media slot 30 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

On the other hand, the heat generated in the third storage medium 70 is switched from the first ceramic substrate 29a to the second ceramic substrate 29b in the heat transfer direction of the perche element 29, so that the second ceramic substrate is used. It is transmitted from 29b to the substrate mounting base 14, is conducted from the substrate mounting base 14 to the perche element 17, and is also conducted to the perche element 32.

Therefore, the heat generated in the first storage medium 50 and the third storage medium 70 is released from the battery case 11, the battery 40, the second media slot 20, or the fourth media slot 30. Further, at least a part of the heat released from the battery case 11, the battery 40, the second media slot 20 or the fourth media slot 30 is conducted to the housing 4, and is discharged from the housing 4 to the atmosphere.

When the first storage medium 50 and the fourth storage medium 80 are in the driving state and the second storage medium 60 and the third storage medium 70 are in the non-driving state, the heat transfer direction of the ceramic element 17 is set. The state is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, and the heat transfer direction of the perche element 29 is the direction from the second ceramic substrate 29b to the first ceramic substrate 29a. The thermoelectric cooling element 32 is switched to a state in which the heat transfer direction is from the first ceramic substrate 32a to the second ceramic substrate 32b (see FIG. 23).

At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18, and is conducted from the substrate mounting base 14 to the perche element 29 and also to the perche element 17.

Since the heat transfer direction of the perche element 29 is switched from the second ceramic substrate 29b to the first ceramic substrate 29a, the heat conducted to the perche element 29 is switched from the first ceramic substrate 29a to the third ceramic substrate 29a. It is conducted to the media slot 27 of the above and is discharged from the third media slot 27 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40. Since the heat transfer direction of the perche element 17 is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, the heat conducted to the perche element 17 is switched from the second ceramic substrate 17b to the second ceramic substrate 17b. It is conducted to the media slot 20 of the above and is discharged from the second media slot 20.

On the other hand, the heat generated in the fourth storage medium 80 is switched from the first ceramic substrate 29a to the second ceramic substrate 29b in the heat transfer direction of the perche element 29, so that the second ceramic substrate is used. It is transmitted from 29b to the substrate mounting base 14, is conducted from the substrate mounting base 14 to the perche element 17, and is also conducted to the perche element 29.

Since the heat transfer direction of the perche element 17 is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, the heat conducted to the perche element 17 is switched from the second ceramic substrate 17b to the second ceramic substrate 17b. It is conducted to the media slot 20 of the above and is discharged from the second media slot 20. Since the heat transfer direction of the perche element 29 is switched from the second ceramic substrate 29b to the first ceramic substrate 29a, the heat conducted to the perche element 29 is switched from the first ceramic substrate 29a to the third ceramic substrate 29a. It is conducted to the media slot 27 of the above and is discharged from the third media slot 27 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

Therefore, the heat generated in the first storage medium 50 and the fourth storage medium 80 is released from the battery case 11, the battery 40, the second media slot 20, or the third media slot 27. Further, at least a part of the heat released from the battery case 11, the battery 40, the second media slot 20 or the third media slot 27 is conducted to the housing 4, and is discharged from the housing 4 to the atmosphere.

When the first storage medium 50, the second storage medium 60, and the third storage medium 70 are in the driving state and the fourth storage medium 80 is in the non-driving state, the heat transfer direction of the ceramic element 17 is set. The state is switched from the second ceramic substrate 17b to the direction toward the first ceramic substrate 17a, and the heat transfer direction of the perche element 29 is in the direction from the first ceramic substrate 29a to the second ceramic substrate 29b. The thermoelectric cooling element 32 is switched to a state in which the heat transfer direction is from the second ceramic substrate 32b to the first ceramic substrate 32a (see FIG. 24).

At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18 and conducted from the substrate mounting base 14 to the Pelche element 32.

Since the heat transfer direction of the Perche element 32 is switched from the second ceramic substrate 32b to the first ceramic substrate 32a, the heat conducted to the Perche element 32 is switched from the first ceramic substrate 32a to the fourth. It is conducted to the media slot 30 of the above and is discharged from the fourth media slot 30 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

The heat generated in the second storage medium 60 is transferred from the first ceramic substrate 17a because the heat transfer direction of the perche element 17 is switched from the second ceramic substrate 17b to the first ceramic substrate 17a. It is transmitted to the board mounting base 14 and is conducted from the board mounting base 14 to the perche element 32.

The heat generated in the third storage medium 70 is transferred from the second ceramic substrate 29b because the heat transfer direction of the perche element 29 is switched from the first ceramic substrate 29a to the second ceramic substrate 29b. It is transmitted to the board mounting base 14 and is conducted from the board mounting base 14 to the perche element 32.

Therefore, the heat generated in the first storage medium 50, the second storage medium 60, and the third storage medium 70 is released from the battery case 11, the battery 40, or the fourth media slot 30. Further, at least a part of the heat released from the battery case 11, the battery 40 or the fourth media slot 30 is conducted to the housing 4, and is discharged from the housing 4 to the atmosphere.

When the first storage medium 50, the third storage medium 70, and the fourth storage medium 80 are in the driving state and the second storage medium 60 is in the non-driving state, the heat transfer direction of the ceramic element 17 is set. The state is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, and the heat transfer direction of the perche element 29 is the direction from the first ceramic substrate 29a to the second ceramic substrate 29b. The thermoelectric cooling element 32 is switched to a state in which the heat transfer direction is from the first ceramic substrate 32a to the second ceramic substrate 32b (see FIG. 25).

At this time, the heat generated in the first storage medium 50 is transmitted to the substrate mounting base 14 via the copper block 18, and is conducted from the substrate mounting base 14 to the Pelche element 17.

Since the heat transfer direction of the perche element 17 is switched from the first ceramic substrate 17a to the second ceramic substrate 17b, the heat conducted to the perche element 17 is switched from the second ceramic substrate 17b to the second ceramic substrate 17b. It is conducted to the media slot 20 of the above and is discharged from the second media slot 20.

The heat generated in the third storage medium 70 is transferred from the second ceramic substrate 29b because the heat transfer direction of the perche element 29 is switched from the first ceramic substrate 29a to the second ceramic substrate 29b. It is transmitted to the board mounting base 14 and is conducted from the board mounting base 14 to the perche element 17.

The heat generated in the fourth storage medium 80 is transferred from the second ceramic substrate 32b because the heat transfer direction of the perche element 32 is switched from the first ceramic substrate 32a to the second ceramic substrate 32b. It is transmitted to the board mounting base 14 and is conducted from the board mounting base 14 to the perche element 17.

Therefore, the heat generated in the first storage medium 50, the third storage medium 70, and the fourth storage medium 80 is released from the second media slot 20. Further, at least a part of the heat released from the second media slot 20 is conducted to the housing 4 and released from the housing 4 to the atmosphere.

When the first storage medium 50, the second storage medium 60, and the fourth storage medium 80 are in the driving state and the third storage medium 70 is in the non-driving state, the heat transfer direction of the ceramic element 17 is set. The state is switched from the second ceramic substrate 17b to the direction toward the first ceramic substrate 17a, and the heat transfer direction of the perche element 29 is the direction toward the first ceramic substrate 29a from the second ceramic substrate 29b. The thermoelectric cooling element 32 is switched to a state in which the heat transfer direction is from the first ceramic substrate 32a to the second ceramic substrate 32b (see FIG. 26).

At this time, the heat generated in the first storage medium 50 is transferred to the substrate mounting base 14 via the copper block 18 and conducted from the substrate mounting base 14 to the Pelche element 29.

Since the heat transfer direction of the perche element 29 is switched from the second ceramic substrate 29b to the first ceramic substrate 29a, the heat conducted to the perche element 29 is switched from the first ceramic substrate 29a to the third ceramic substrate 29a. It is conducted to the media slot 27 of the above and is discharged from the third media slot 27 and is also conducted to the battery case 11 and discharged from the battery case 11 or the battery 40.

The heat generated in the second storage medium 60 is transferred from the first ceramic substrate 17a because the heat transfer direction of the perche element 17 is switched from the second ceramic substrate 17b to the first ceramic substrate 17a. It is transmitted to the board mounting base 14 and is conducted from the board mounting base 14 to the ceramic cooling element 29.

The heat generated in the fourth storage medium 80 is transferred from the second ceramic substrate 32b because the heat transfer direction of the perche element 32 is switched from the first ceramic substrate 32a to the second ceramic substrate 32b. It is transmitted to the board mounting base 14 and is conducted from the board mounting base 14 to the ceramic cooling element 29.

Therefore, the heat generated in the first storage medium 50, the second storage medium 60, and the fourth storage medium 80 is released from the third media slot 27. Further, at least a part of the heat released from the third media slot 27 is conducted to the housing 4 and released from the housing 4 to the atmosphere.

When the first storage medium 50, the second storage medium 60, the third storage medium 70, and the fourth storage medium 80 are all driven, the ceramic element 17 has a second heat transfer direction. The state is switched from the ceramic substrate 17b to the direction toward the first ceramic substrate 17a, and the heat transfer direction of the perche element 29 is switched to the direction from the first ceramic substrate 29a to the second ceramic substrate 29b. The thermoelectric cooling element 32 is switched to a state in which the heat transfer direction is from the first ceramic substrate 32a to the second ceramic substrate 32b (see FIG. 27).

The heat generated in the fourth storage medium 80 is transferred from the second ceramic substrate 32b because the heat transfer direction of the perche element 32 is switched from the first ceramic substrate 32a to the second ceramic substrate 32b. It is transmitted to the board mounting base 14 and is discharged mainly from the outer peripheral surface of the board mounting base 14.

Therefore, the heat generated in the first storage medium 50, the second storage medium 60, the third storage medium 70, and the fourth storage medium 80 is released from the substrate mounting base 14. Further, at least a part of the heat released from the substrate mounting base 14 is conducted to the housing 4, and is released from the housing 4 to the atmosphere.

<Summary>
As described above, in the electronic device 1, the heat transfer direction switching unit (

Pelche elements

17, 29, 32 or the heat transfer member 25, the same applies hereinafter, which conducts heat and enables switching of the heat transfer direction. A storage medium (the first media slot 19, the second media slot 20, the third media slot 27 or the fourth media slot 30, the same shall apply hereinafter). The heat transfer direction of the heat transfer direction switching unit is switched according to the access state to the storage medium 50, the second storage medium 60, the third storage medium 70, or the fourth storage medium 80, the same applies hereinafter).

Therefore, the heat generated in the storage medium is conducted in the heat transfer direction switched according to the access state to the storage media installed in each of the plurality of media slots, so that the heat dissipation efficiency is improved regardless of the access state to the storage medium. Can be planned.

In particular, in each storage medium installed in each media slot, the amount of heat generated may differ depending on the operating state of the electronic device 1, and the heat transfer direction of the heat transfer direction switching unit depends on the access state to the storage medium. By switching between, it is possible to set a heat dissipation path according to the driving state of each storage medium and the amount of heat generated, and to secure an efficient heat dissipation state.

Further, when at least one of the storage media is put into the driven state and the non-driven state, the heat generated in the stored medium in the driven state is installed in the media slot or the storage medium in which the storage medium in the non-driving state is installed. The heat transfer direction of the heat transfer direction switching unit is switched so that it is conducted toward the media slot in which is not installed.

Therefore, heat is transferred from the storage medium in the driven state to the media slot in which the storage medium in the non-drive state is installed or the media slot in which the storage medium is not installed by the heat transfer direction switching unit whose heat transfer direction is switched. Since it is conducted, it is possible to improve the heat transfer efficiency and the heat dissipation efficiency.

Further, by using the

Perche elements

17, 29, 32 whose heat transfer direction is changed according to the direction of the supplied current as the heat transfer direction switching unit, the heat transfer direction is changed according to the direction of the supplied current. Since the heat transfer directions of the

Pelche elements

17, 29, and 32 that function as switching portions are converted, the heat transfer directions can be easily and surely controlled.

The electronic device 1 has a change operation unit that changes the access state to each storage medium installed in each of the plurality of media slots, and the heat transfer direction of the heat transfer direction switching unit is changed according to the operation of the change operation unit. It may be configured to be switchable. As the change operation unit, for example, any operation unit 5 of the

operation units

5, 5, ... Can be used.

By providing such a change operation unit, each storage is performed by switching the heat transfer direction of the heat transfer direction switching unit according to the operation of the change operation unit that changes the access state to each storage medium installed in the media slot. Since the heat generated in the medium is transferred, the heat generated in each storage medium can be conducted in a direction according to the situation to improve the heat dissipation efficiency.

<Other>
Although the electronic device 1 is provided with at least two media slots, a storage medium installed in one of the plurality of media slots may be used as the main storage medium.

For example, when the first media slot 19 and the second media slot 20 are provided, the first storage medium 50 mounted in the first media slot 19 is used as the main storage medium, and the second media slot 19 is used. When the second storage medium 60 mounted in the media slot 20 of the above is used as an auxiliary storage medium and all the storage capacity of the first storage medium 50 is used, the second storage is automatically performed. Data may be stored in the medium 60.

In such a case, the access state detection unit detects that the first storage medium 50 is in the non-driving state and the second storage medium 60 is in the driving state, so that heat is transferred according to the detection result. It is possible to switch the heat transfer direction of the direction switching unit.

Further, the driven state and the non-driven state of the first storage medium 50 and the second storage medium 60 can be switched by the operation of the user, and the heat transfer of the heat transfer direction switching unit is made according to the switching operation of the user. It is also possible to have a configuration in which the direction can be switched.

Further, the number of media slots may be five or more, and the number and arrangement of the copper blocks, the Pelce elements and the heat transfer members located opposite to these media slots may be at least one Pelce element or heat. It is optional as long as a transmission member is provided.

<One Embodiment of Electronic Equipment>
Hereinafter, a configuration example of an embodiment of the electronic device (imaging device) of the present technology will be described (see FIG. 28).

The electronic device (imaging device) 1 is equipped with, for example, an interchangeable lens having a camera block 90 that has an imaging function. When the electronic device 1 has a lens barrel, the electronic device 1 is provided with the camera block 90.

The electronic device 1 has a camera signal processing unit 91 that performs signal processing such as analog-to-digital conversion of the captured image signal, and an image processing unit 92 that performs recording / playback processing of the image signal. Further, the electronic device 1 includes a display unit 93 for displaying a captured image and the like, an R / W (reader / writer) 94 for writing and reading an image signal to the memory 99, and the entire electronic device 1. A CPU (Central Processing Unit) 95 to control, a lens drive control unit 96 to control the drive of a lens arranged in a camera block 90, and an operation unit 97 (operation unit) such as various switches in which a user performs a required operation. 5) and.

The electronic device 1 is provided with an image sensor 98 such as a CCD or CMOS that converts an optical image captured by the camera block 90 into an electrical signal.

The camera signal processing unit 91 performs various signal processing such as conversion of the output signal from the image pickup element 98 into a digital signal, noise removal, image quality correction, and conversion into a luminance / color difference signal.

The image processing unit 92 performs compression coding / decompression decoding processing of an image signal based on a predetermined image data format, conversion processing of data specifications such as resolution, and the like.

The display unit 93 has a function of displaying various data such as an operation state of the user's operation unit 97 and a captured image. The electronic device 1 may not be provided with the display unit 93, and may be configured so that the captured image data is sent to another display device to display the image.

The R / W 94 writes the image data encoded by the image processing unit 92 to the memory 99 and reads the image data recorded in the memory 99.

The CPU 95 functions as a control processing unit that controls each circuit block provided in the electronic device 1, and controls each circuit block based on an instruction input signal or the like from the operation unit 97.

The lens drive control unit 96 controls a drive source for moving the lens based on a control signal from the CPU 95.

The operation unit 97 outputs an instruction input signal corresponding to the operation by the user to the CPU 95.

The memory 99 is, for example, a semiconductor memory that can be attached to and detached from a slot connected to the R / W 94, or a semiconductor memory that is preliminarily incorporated inside the electronic device 1.

The operation of the electronic device 1 will be described below.

In the shooting standby state, under the control of the CPU 95, the shot image signal is output to the display unit 93 via the camera signal processing unit 91 and displayed as a camera-through image. When the instruction input signal from the operation unit 97 is input, the CPU 95 outputs a control signal to the lens drive control unit 96, and the lens is moved based on the control of the lens drive control unit 96.

When the shooting operation is performed by the instruction input signal from the operation unit 97, the shot image signal is output from the camera signal processing unit 91 to the image processing unit 92, compressed and encoded, and converted into digital data in a predetermined data format. Will be converted. The converted data is output to R / W 94 and written to memory 99.

When the image data recorded in the memory 99 is reproduced, the R / W 94 reads the predetermined image data from the memory 99 in response to the operation on the operation unit 97, and the image processing unit 92 performs the decompression / decoding process. After that, the reproduced image signal is output to the display unit 93 and the reproduced image is displayed.

In the present technology, "imaging" means converting the photoelectric conversion process of converting the light captured by the image pickup element 98 into an electric signal to the digital signal of the output signal from the image pickup element 98 by the camera signal processing unit 91. , Noise removal, image quality correction, conversion to brightness / color difference signals, etc., compression coding / decompression decoding processing of image signals based on a predetermined image data format by the image processing unit 92, conversion processing of data specifications such as resolution, etc. , A process including only a part or all of a series of processes up to the process of writing an image signal to the memory 99 by the R / W 94.

That is, "imaging" may refer only to the photoelectric conversion process for converting the light captured by the image pickup element 98 into an electric signal, and from the photoelectric conversion process for converting the light captured by the image pickup element 98 into an electric signal. It may also refer to processing such as conversion of the output signal from the image pickup element 98 by the camera signal processing unit 91 into a digital signal, noise removal, image quality correction, and conversion into a brightness / color difference signal, and is captured by the image pickup element 98. After the photoelectric conversion process for converting light into an electric signal, the camera signal processing unit 91 converts the output signal from the image pickup element 98 into a digital signal, noise removal, image quality correction, conversion into a brightness / color difference signal, and the like. It may also refer to compression coding / decompression decoding processing of an image signal based on a predetermined image data format by the image processing unit 92 and conversion processing of data specifications such as resolution, and the light captured by the image pickup element 98 is an electric signal. The photoelectric conversion process for converting to a digital signal by the camera signal processing unit 91 to a digital signal for the output signal from the image pickup element 98, noise removal, image quality correction, conversion to a brightness / color difference signal, and the like, and the image processing unit 92. It may refer to compression coding / decompression decoding processing of an image signal based on a predetermined image data format, conversion processing of data specifications such as resolution, and writing processing of an image signal to the memory 99 by R / W94. You may point.

In the above processing, the order of each processing may be changed as appropriate.

Further, in the present technology, the camera block 90 and the electronic device 1 are configured to include only a part or all of the image sensor 98, the camera signal processing unit 91, the image processing unit 92, and the R / W 94 that perform the above processing. You may be.

Further, the camera block 90 may be configured to include a part of the image sensor 98, the camera signal processing unit 91, the image processing unit 92, and the R / W 94.

<This technology>
The present technology can also be configured as follows.

(1)
Multiple media slots into which storage media are installed, and
A printed wiring board on which the plurality of media slots are mounted, and
The board mounting base to which the printed wiring board is mounted and
It is provided with a heat transfer direction switching unit that conducts heat generated in the storage medium and can switch the heat transfer direction.
An electronic device in which the heat transfer direction of the heat transfer direction switching unit is switched according to an access state to the storage medium installed in each of the plurality of media slots.

(2)
The storage medium is put into a driving state at the time of access and is put into a non-driving state at the time of non-access.
When at least one of the storage media is put into a driven state and a non-driven state, respectively.
The heat transfer direction of the heat transfer direction switching unit is switched so that the heat generated in the storage medium in the driven state is conducted toward the media slot in which the storage medium in the non-drive state is mounted. The electronic device according to 1).

(3)
The storage medium is put into a driving state at the time of access and is put into a non-driving state at the time of non-access.
When at least one of the storage media is put into a driven state and a non-driven state, respectively.
The heat transfer direction of the heat transfer direction switching unit is switched so that the heat generated in the storage medium in the driven state is conducted toward the media slot in which the storage medium is not mounted. Electronic equipment.

(4)
A radiator that dissipates heat is provided,
The storage medium is put into a driving state at the time of access and is put into a non-driving state at the time of non-access.
When the storage medium is installed in all the media slots and all the storage media are put into a driving state,
The electronic device according to (1), wherein the heat transfer direction of the heat transfer direction switching unit is switched so that heat is transferred from all the storage media toward the heat radiating body.

(5)
The electronic device according to any one of (1) to (4) above, wherein a Perche element whose heat transfer direction is changed according to the direction of the supplied current is used as the heat transfer direction switching unit.

(6)
The electronic device according to any one of (1) to (5) above, wherein the heat generated in the storage medium is conducted through the substrate mounting base.

(7)
The electronic device according to (6), wherein the heat transfer direction switching portion is arranged in contact with the substrate mounting base.

(8)
A copper block is attached to the printed wiring board,
The electronic device according to any one of (1) to (7) above, wherein the copper block is positioned in a state of being in contact with the substrate mounting base and facing at least one of the media slots.

(9)
The electronic device according to any one of (1) to (8) above, wherein the plurality of media slots are mounted on the same surface of the printed wiring board.

(10)
An access state detection unit for detecting the access state to the storage medium is provided.
The electronic device according to any one of (1) to (9) above, wherein the heat transfer direction of the heat transfer direction switching unit is switched according to the detection result of the access state detection unit.

(11)
A change operation unit for changing the access state to the storage medium installed in each of the plurality of media slots is provided.
The electronic device according to any one of (1) to (9) above, wherein the heat transfer direction of the heat transfer direction switching unit is switched according to the operation of the change operation unit.

1 Electronic device 11 Battery case (heat radiator)
14 Board mounting base 15 Printed wiring board 17 Perche element (heat transfer direction switching part)
18 Copper block 19 First media slot 20 Second media slot 25 Heat transfer member (heat transfer direction switching part)
26 Printed circuit board 27 Third media slot 29 Pelche element (heat transfer direction switching part)
30 Fourth media slot 32 Perche element (heat transfer direction switching unit)
40 Battery (heat radiator)
50 First storage medium 60 Second storage medium 70 Third storage medium 80 Fourth storage medium

Claims

Multiple media slots into which storage media are installed, and
A printed wiring board on which the plurality of media slots are mounted, and
The board mounting base to which the printed wiring board is mounted and
It is provided with a heat transfer direction switching unit that conducts heat generated in the storage medium and can switch the heat transfer direction.
An electronic device in which the heat transfer direction of the heat transfer direction switching unit is switched according to an access state to the storage medium installed in each of the plurality of media slots.
The storage medium is put into a driving state at the time of access and is put into a non-driving state at the time of non-access.
When at least one of the storage media is put into a driven state and a non-driven state, respectively.
Claim that the heat transfer direction of the heat transfer direction switching unit is switched so that the heat generated in the storage medium in the driven state is conducted toward the media slot in which the storage medium in the non-drive state is mounted. The electronic device according to 1.
The storage medium is put into a driving state at the time of access and is put into a non-driving state at the time of non-access.
When at least one of the storage media is put into a driven state and a non-driven state, respectively.
The first aspect of the present invention, wherein the heat transfer direction of the heat transfer direction switching unit is switched so that the heat generated in the storage medium in the driven state is conducted toward the media slot in which the storage medium is not mounted. Electronics.
A radiator that dissipates heat is provided,
The storage medium is put into a driving state at the time of access and is put into a non-driving state at the time of non-access.
When the storage medium is installed in all the media slots and all the storage media are put into a driving state,
The electronic device according to claim 1, wherein the heat transfer direction of the heat transfer direction switching unit is switched so that heat is transferred from all the storage media toward the heat radiating body.
The electronic device according to claim 1, wherein a Perche element whose heat transfer direction is changed according to the direction of the supplied current is used as the heat transfer direction switching unit.
The electronic device according to claim 1, wherein the heat generated in the storage medium is conducted through the substrate mounting base.
The electronic device according to claim 6, wherein the heat transfer direction switching unit is arranged in contact with the substrate mounting base.
A copper block is attached to the printed wiring board,
The electronic device according to claim 1, wherein the copper block is positioned in a state of being in contact with the substrate mounting base and facing at least one of the media slots.
The electronic device according to claim 1, wherein the plurality of media slots are mounted on the same surface of the printed wiring board.
An access state detection unit for detecting the access state to the storage medium is provided.
The electronic device according to claim 1, wherein the heat transfer direction of the heat transfer direction switching unit is switched according to the detection result of the access state detection unit.
A change operation unit for changing the access state to the storage medium installed in each of the plurality of media slots is provided.
The electronic device according to claim 1, wherein the heat transfer direction of the heat transfer direction switching unit is switched according to the operation of the change operation unit.