WO2016194479A1 - Image pickup device - Google Patents
Image pickup device Download PDFInfo
- Publication number
- WO2016194479A1 WO2016194479A1 PCT/JP2016/061579 JP2016061579W WO2016194479A1 WO 2016194479 A1 WO2016194479 A1 WO 2016194479A1 JP 2016061579 W JP2016061579 W JP 2016061579W WO 2016194479 A1 WO2016194479 A1 WO 2016194479A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- element block
- heat
- main body
- heat radiating
- imaging device
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 claims description 123
- 230000017525 heat dissipation Effects 0.000 claims description 31
- 238000003780 insertion Methods 0.000 claims description 29
- 230000037431 insertion Effects 0.000 claims description 29
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 238000007599 discharging Methods 0.000 claims description 10
- 230000007423 decrease Effects 0.000 claims 2
- 230000005855 radiation Effects 0.000 description 29
- 230000008878 coupling Effects 0.000 description 26
- 238000010168 coupling process Methods 0.000 description 26
- 238000005859 coupling reaction Methods 0.000 description 26
- 238000012546 transfer Methods 0.000 description 23
- 238000012545 processing Methods 0.000 description 19
- 238000012986 modification Methods 0.000 description 14
- 230000004048 modification Effects 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 13
- 230000006870 function Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
- G03B17/14—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets interchangeably
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
Definitions
- This technology relates to the technical field of an image pickup apparatus having a function of releasing heat generated when an image pickup element is driven from a heat radiating portion.
- Various image pickup apparatuses such as a video camera and a still camera have a predetermined operation unit, for example, an apparatus main body on which a shutter button, a zoom knob, and the like are arranged.
- an optical image of a subject is taken into the image pickup device via an image pickup optical system such as a lens, and the picked-up optical image is photoelectrically converted by the image pickup device to generate an image or video. Is generated.
- the image sensor is disposed on the substrate, and heat is generated from the image sensor and the substrate when the image sensor is driven.
- the image pickup apparatus is provided with a heat radiating unit for releasing the generated heat. There is one that suppresses the temperature rise of the element (for example, see Patent Document 1).
- a lens unit (interchangeable lens) is provided with a heat transfer plate that is in contact with the back surface of the substrate and a heat transfer plate cover that covers the heat transfer plate.
- the main body is provided with a heat sink that functions as a heat radiating portion and a heat sink cover that covers the heat sink.
- the heat transfer plate is provided with a convex portion, and insertion holes are formed in the heat transfer cover and the heat sink, respectively, so that the heat transfer cover can be moved in the optical axis direction.
- the entire heat transfer plate including the convex portions is covered with the heat transfer plate cover and the heat sink is covered with the heat sink cover.
- the heat transfer plate cover When the lens unit is attached to the camera body, the heat transfer plate cover is moved in a direction approaching the heat transfer plate, and the convex portion of the heat transfer plate is inserted into the insertion hole of the heat transfer plate cover and the insertion hole of the heat sink cover. The tip surface of the part is in contact with the heat sink. Therefore, the heat generated when the image pickup element is driven is transmitted from the convex portion of the heat transfer plate to the heat sink, and is released from the heat sink to the inside of the apparatus main body.
- the heat transfer plate cover is moved away from the heat transfer plate, the convex portions of the heat transfer plate are taken out from the respective insertion holes, and the entire heat transfer plate including the convex portions is transferred. Covered with hot plate cover.
- the convex portion of the heat transfer plate is brought into contact with the heat sink in the lens unit and the camera body when the lens unit is attached to the camera body.
- the entire heat transfer plate including the convex portions is covered with the heat transfer plate cover and the heat sink is covered with the heat sink cover.
- the user since the user does not touch the heat transfer plate and the heat sink regardless of whether the lens unit is attached to or detached from the camera body, the user can handle the imaging device in a safe state.
- the imaging device of the present technology aims to overcome the above-described problems and improve the safety of the user after ensuring the simplification of the structure.
- an imaging apparatus includes an apparatus main body in which an operation unit is disposed, and heat generated when the imaging element is driven when an end surface on a subject side at the time of photographing of the apparatus main body is a front surface.
- a heat radiating part to be released is located behind the front surface of the apparatus main body, and a guard part that covers at least a part of the heat radiating part is provided on the apparatus main body.
- the heat radiating part is covered by the guard part in a state where the heat radiating part is located behind the front surface of the apparatus main body.
- an element block having the heat radiating portion and the imaging element is provided, and the element block is detachable from the apparatus main body.
- the element block is inserted into the insertion hole and attached to or detached from the apparatus main body.
- the element block is inserted into the insertion hole in a state where the element block is attached to the apparatus main body, and the inner peripheral surface of the guard portion and the element block It is desirable that a gap be formed between the outer peripheral surface of each other.
- a discharge hole for discharging heat released from the heat radiating portion to the outside is formed in the apparatus main body.
- the heat released from the heat radiating portion is discharged from the discharge hole to the outside of the apparatus main body, and heat is not easily transmitted to the apparatus main body, so that the apparatus main body does not become hot.
- the element block is provided with a holder portion for holding the imaging element, and the outer shape is formed to be smaller as the heat radiating portion is separated from the holder portion. It is desirable.
- the heat dissipating part is formed in an annular shape and heat dissipating fins are provided in the entire circumferential direction of the heat dissipating part.
- a cover portion that covers the heat dissipation portion is provided outside the heat dissipation portion, and the heat dissipation portion and the cover portion are positioned in a non-contact state.
- an imaging apparatus includes an apparatus main body in which an operation unit is disposed, and an element block including an imaging element and a heat radiating unit that releases heat generated when the imaging element is driven, A guard portion that covers at least a part of the heat radiating portion on the apparatus main body, the heat radiating portion being located on the rear side of the front surface of the apparatus main body when an end surface on the subject side during photographing of the apparatus main body is the front surface Is provided.
- the heat radiating part is covered by the guard part in a state where the heat radiating part is located behind the front surface of the apparatus main body.
- the element block be detachable from the apparatus main body.
- an insertion hole through which the element block is inserted when the element block is attached or detached is formed in the guard portion.
- the element block is inserted into the insertion hole and attached to or detached from the apparatus main body.
- a discharge hole for discharging heat released from the heat radiating portion to the outside is formed in the apparatus main body.
- the heat released from the heat radiating portion is discharged from the discharge hole to the outside of the apparatus main body, and heat is not easily transmitted to the apparatus main body, so that the apparatus main body does not become hot.
- the element block is provided with a holder portion for holding the imaging element therein, and the outer shape is formed to be smaller as the heat radiating portion is separated from the holder portion. It is desirable.
- the heat radiating portion is formed in an annular shape, and a heat radiating fin is provided in the entire circumferential direction of the heat radiating portion.
- a cover portion for covering the heat dissipation portion is provided outside the heat dissipation portion, and the heat dissipation portion and the cover portion are positioned in a non-contact state.
- the interchangeable lens be detachable from the element block.
- the heat radiating part is covered with the guard part in a state of being located on the rear side of the front surface of the apparatus main body, the contact with the heat radiating part of the user's finger is prevented by the guard part, and the structure is simplified. It is possible to improve the safety of the user while ensuring the above.
- FIG. 17 show an embodiment of an imaging apparatus of the present technology, and this figure is an exploded perspective view showing an apparatus main body, an element block, and an interchangeable lens. It is a perspective view which shows the state with which the element block was attached to the apparatus main body with an interchangeable lens. It is a perspective view which shows an apparatus main body, an element block, and an interchangeable lens. It is a rear view of an apparatus main body. It is a side view which shows the state in which the element block was attached to the apparatus main body. It is a front view which shows the state in which the element block was attached to the apparatus main body. It is a side view of an element block. It is a perspective view of an element block.
- FIG. 11 to 14 show a modification of the element block, and this figure is a perspective view showing a first modification. It is a perspective view which shows the 2nd modification. It is a perspective view which shows a 3rd modification. It is a perspective view which shows the 4th modification. It is a perspective view which shows the 5th modification. It is a disassembled perspective view which shows the 1st structural example of an imaging device. It is a side view which shows the 2nd structural example of an imaging device. It is a block diagram.
- the imaging device of the present technology is applied to a still camera.
- the lens group shown below may include one or a plurality of lenses and other optical elements such as a diaphragm and an iris in addition to the lens group including one or a plurality of lenses.
- the imaging device 1 is composed of a device body 2 and an element block 3 (see FIGS. 1 to 3).
- the imaging device 1 may be configured to include the interchangeable lens 4 in addition to the device body 2 and the element block 3.
- the interchangeable lens 4 may be detachable from the element block 3.
- the interchangeable lens 4 attachable to and detachable from the element block 3
- a desired type of interchangeable lens 4 can be attached to and detached from the element block 3 in accordance with the photographing mode such as the type of subject, the position of the subject and the surrounding environment. This makes it possible to improve usability and improve image quality.
- the apparatus main body 2 includes a housing 5 and various operation units 6, 6,.
- the housing 5 has a body portion 7 formed in a horizontally long shape, a flash mounting portion 8 provided on the upper side of the body portion 7, and a guard portion 9 provided on the front side of the body portion 7.
- the main body portion 7 includes a base portion 10 formed in a horizontally long flat and substantially rectangular shape, and a hold portion 11 protruding forward from the right end portion of the base portion 10.
- An attachment portion 10 a for attaching the element block 3 is provided at a position closer to the left side on the front side of the base portion 10.
- the attachment portion 10a has a circular outer shape, and the element block 3 is attached to the attachment portion 10a by, for example, bayonet coupling.
- a display 12 is disposed on the rear surface of the base portion 10 at a position excluding a part (see FIG. 4).
- An openable / closable cover 13 is disposed on one side surface of the base portion 10 (see FIG. 5). Inside the cover 13, various parts such as an earphone jack and connection terminals (not shown) are provided.
- the hold portion 11 is a portion that is held by the user during photographing, and has an outer surface that extends from the front portion to the left and right sides (see FIGS. 1 to 3). Since the outer surface extending from the front part of the hold unit 11 to both the left and right side surfaces is formed in a curved shape, the user can hold the hold unit 11 without a sense of incongruity at the time of photographing, and is stable due to good gripping properties. Can be ensured.
- the flash mounting portion 8 is provided with a front end portion and a rear end portion protruding forward and rearward from the base portion 10, respectively.
- a light emitter flash unit (not shown) can be attached to and detached from the flash mounting portion 8.
- a finder window 14 is disposed on the rear surface of the flash mounting portion 8 (see FIG. 4).
- the guard portion 9 includes a substantially annular annular portion 15 and a connecting portion 16 protruding rearward from the lower end portion of the annular portion 15, and the upper end portion of the annular portion 15 is
- the flash mounting portion 8 is coupled to the front end portion, and the rear end portion of the coupling portion 16 is coupled to the lower end portion of the base portion 10.
- the space inside the annular portion 15 is formed as a circular insertion hole 15a, and the center of the insertion hole 15a coincides with the center of the mounting portion 10a in the front-rear direction (see FIG. 6).
- the inner diameter of the annular portion 15 is made slightly larger than the outer diameter of the mounting portion 10a. Spaces penetrating in the left-right direction are formed between the left and right side portions of the annular portion 15 and the base portion 10, and these spaces serve as discharge holes 15b and 15b (see FIGS. 1 to 3).
- the operation units 6, 6,... For example, a power button, a shutter button, a zoom knob, a mode selection button, a mode switching button, and the like are provided.
- the operation units 6, 6,... are mainly provided on the upper surface and the rear surface of the main body unit 7 (see FIGS. 1 to 4).
- the element block 3 includes a holder part 17, an attaching / detaching part 18, an imaging unit 19, and a heat radiating part 20 (see FIGS. 1, 7, and 8).
- the holder portion 17 has a circular outer shape and has an arrangement recess 17a that opens forward.
- a mount portion 17 b to which the interchangeable lens 4 is attached is provided at the front end portion of the holder portion 17.
- a release knob 21 is disposed on the holder portion 17.
- the detachable portion 18 protrudes rearward from the portion excluding the outer peripheral portion of the holder portion 17 and is formed in a circular shape whose outer shape is slightly smaller than the diameter of the holder portion 17.
- the imaging unit 19 includes an imaging element 22 such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal-Oxide Semiconductor) and a substrate 23 for driving the imaging element 22.
- the imaging element 22 is disposed on the front surface of the substrate 23. Has been.
- the imaging unit 19 is inserted and arranged in the arrangement recess 17 a of the holder part 17 and is held by the holder part 17.
- the heat dissipating part 20 is arranged on the outer peripheral side of the attaching / detaching part 18 and is formed in an annular shape. Heat generated when the image sensor 22 is driven is transmitted to the heat radiating unit 20.
- the heat radiating portion 20 includes an annular front coupling portion 20a, an annular rear coupling portion 20b, and a plurality of radiating fins 20c, 20c provided between the front coupling portion 20a and the rear coupling portion 20b. It is desirable that and are integrally formed and made of a material having higher heat dissipation than the holder portion 17.
- the front coupling part 20 a is located immediately behind the holder part 17 and has an outer diameter substantially the same as the outer diameter of the holder part 17.
- the diameter of the rear coupling part 20b is smaller than the diameter of the front coupling part 20a.
- the radiation fins 20c, 20c,... Are positioned at equal intervals in the circumferential direction.
- the heat radiating portion 20 is formed in such a shape that the outer diameter becomes smaller as it is separated from the holder portion 17 because the diameter of the rear coupling portion 20b is smaller than that of the front coupling portion 20a.
- the element block 3 is detachably attached to the apparatus main body 2 (see FIGS. 1 to 3).
- the element block 3 has the detachable portion 18 attached to the attachment portion 10a of the apparatus main body 2 by, for example, bayonet coupling.
- the element block 3 can be attached to the attachment part 10a by inserting the element block 3 into the insertion hole 15a of the guard part 9, pressing the attachment / detachment part 18 against the attachment part 10a, and rotating the element block 3 to one side in the circumferential direction.
- the element block 3 is locked to the apparatus main body 2 by a lock mechanism (not shown).
- the heat radiating portion 20 is located behind the front surface 15 c of the annular portion 15 in the guard portion 9, and the discharge holes 15 b and 15 b are located on the left and right sides of the heat radiating portion 20, respectively. (See FIG. 5).
- the element block 3 is attached to the apparatus main body 2
- at least a part of the holder portion 17 of the element block 3 protrudes forward from the guard portion 9.
- a gap 24 is formed between the outer peripheral surface of the element block 3 and the inner peripheral surface of the annular portion 15 in the guard portion 9 (see FIG. 6).
- the element block 3 is detached from the apparatus main body 2 by operating a release button (not shown) provided on the apparatus main body 2 to release the lock, rotating the element block 3 to the other side in the circumferential direction, and taking it out from the insertion hole 15a. Can be performed.
- the user rotates the element block 3 while holding the holder portion 17 protruding forward from the guard portion 9. Therefore, since the user rotates the element block 3 by grasping a part other than the heat radiating part 20, the finger does not come into contact with the heat radiating part 20 that is likely to be hot, and the element block 3 is removed from the apparatus main body 2 in a safe state. be able to.
- the element block 3 can be attached to and detached from the apparatus main body 2, a desired type of element block 3 can be attached to and detached from the apparatus main body 2 in accordance with the photographing mode such as the type of subject and the surrounding environment. It is possible to improve the usability and the image quality. In particular, by preparing an element block 3 having an image sensor 22 with a large number of pixels or a sensor element 22 having a high sensitivity, it is possible to generate a high-quality image according to the type of subject. Become.
- the element block 3 may be formed integrally with the apparatus main body 2 as a part of the apparatus main body 2.
- the holder unit 17, the imaging unit 19, and the heat radiating unit 20, which are each part of the element block 3, are provided. A part of the configuration of the main body 2 is used.
- the interchangeable lens 4 has a cylindrical outer casing 25 and a lens group 26 arranged inside the outer casing 25 (see FIGS. 1 to 3).
- the interchangeable lens 4 is provided with a zoom ring 27 and a focus ring 28 that are rotatably supported by the outer casing 25. Manual zooming is performed by rotating the zoom ring 27, and manual focusing is performed by rotating the focus ring 28.
- a lens mount 29 that is bayonet-coupled to the mount portion 17 b of the element block 3 is provided.
- the attachment of the interchangeable lens 4 to the mount portion 17b in the element block 3 can be performed by pressing the lens mount 29 against the mount portion 17b and rotating the interchangeable lens 4 to one side in the circumferential direction.
- the interchangeable lens 4 is locked to the element block 3 by a lock unit (not shown).
- the release knob 21 provided in the element block 3 is operated to release the lock, and the interchangeable lens 4 is rotated to the other side in the circumferential direction. This can be done by pulling away from the element block 3.
- a subject can be captured when the still image capturing mode or the moving image capturing mode is set.
- an image of the subject captured by the lens group 26 of the interchangeable lens 4 is incident on the image sensor 22 of the element block 3 and is subjected to photoelectric conversion (analog / digital conversion) by the image sensor 22 to be a predetermined processing unit of the apparatus main body 2.
- photoelectric conversion analog / digital conversion
- the image sensor 22 is driven during photographing. When the image sensor 22 is driven, heat is generated in the image sensor 22 and the substrate 23, and the generated heat is transmitted to the heat radiating unit 20 and released from the heat radiating unit 20.
- the element block 3 has the heat radiating portion 20 formed in an annular shape, and the heat radiating fins 20c, 20c,...
- the heat is released to the outer peripheral side from each of the two to ensure high heat dissipation and to ensure a good driving state of the image sensor 22.
- the heat generated when the image pickup device 22 is driven is also released from the front coupling portion 20a and the rear coupling portion 20b in addition to the radiation fins 20c, 20c,.
- the heat released from the heat radiating unit 20 is mainly discharged from the discharge holes 15b and 15b formed in the apparatus main body 2 to the outside of the apparatus main body 2.
- the apparatus main body 2 is formed with the discharge holes 15b and 15b for discharging the heat released from the heat radiating section 20, the heat released from the heat radiating section 20 is discharged from the discharge holes 15b and 15b to the apparatus main body 2. It is reliably discharged outside. Therefore, heat is not easily transmitted to the apparatus main body 2, and the apparatus main body 2 does not reach a high temperature, and the temperature rise of the image pickup element 22 and the apparatus main body 2 is suppressed to ensure a good operation state of the image pickup element 22 and the apparatus main body 2. can do.
- the apparatus main body 2 is formed with discharge holes 15b and 15b positioned on the opposite side across the element block 3, the heat released from the heat radiating portion 20 from both sides of the element block 3 It is discharged to the outside, and the temperature rises of the image sensor 22 and the apparatus main body 2 are further suppressed, and a better operating state of the image sensor 22 and the apparatus main body 2 can be ensured.
- the discharge holes 15b and 15b located on the left and right sides of the heat radiating part 20 are formed in the apparatus main body 2 .
- the discharge holes 15b are formed at arbitrary positions around the heat radiating part 20. For example, it may be located above or below the heat dissipating part 20.
- the heat dissipating part 20 that releases heat generated when the image sensor 22 is driven is located behind the front surface 15 c of the apparatus main body 2, and the heat dissipating part 20 is disposed on the apparatus main body 2.
- a guard portion 9 is provided to cover at least a part thereof.
- the guard portion 9 having a simple structure prevents the finger from coming into contact with the heat radiating portion 20 that may become high in temperature, the user can handle the imaging device 1 in a safe state.
- the user's safety can be improved while ensuring simplification.
- the guard portion 9 is formed with an insertion hole 15a through which the element block 3 is inserted when the element block 3 is attached to and detached from the apparatus main body 2, the element block 3 is inserted into the insertion hole 15a and is attached to and detached from the apparatus main body 2. Is done. Accordingly, the guard portion 9 functions as a protection portion that protects the element block 3 and also functions as a guide portion that guides the element block 3, and functionality can be improved with a simple configuration.
- the element block 3 is provided with a holder portion 17 for holding the image pickup device 22 therein, and the outer shape becomes smaller as the heat radiating portion 20 is separated from the holder portion 17.
- the cover part 30 is positioned outside the heat dissipation part 20X in a non-contact state with the heat dissipation part 20X, so that heat released from the heat dissipation part 20X is not easily transmitted to the cover part 30, and It is difficult to feel the heat when touching, and it is possible to ensure good heat dissipation while ensuring the safety of the user during handling of the imaging device 1 such as the attaching / detaching operation of the element block 3.
- the heat dissipating part 20 ⁇ / b> A includes an annular front coupling part 20 a, an annular rear coupling part 20 b, and between the front coupling part 20 a and the rear coupling part 20 b.
- the heat dissipating fins 20d, 20d,... are inclined so as to displace to one side in the circumferential direction as they go backward. Yes.
- the radiating fins 20d, 20d,... are inclined so as to be displaced in the circumferential direction, thereby increasing the length of the radiating fins 20d, 20d,.
- it is possible to increase the heat dissipation area it is possible to improve the heat dissipation when the image sensor 22 is driven.
- the heat dissipating part 20B includes annular heat dissipating fins 20e, 20e,... And heat dissipating fins 20e, 20e,. It consists of connecting parts 20f, 20f,... To be connected, and the diameter of the heat radiation fins 20e, 20e,.
- annular radiating fins 20e, 20e,... are provided in this way, it is possible to increase the heat radiating area while ensuring a good air flow state.
- the heat dissipation in can be improved.
- the heat dissipating part 20C according to the third modification has an annular and plate-shaped heat dissipating fin 20g having a wide width in the front-rear direction. Between the heat radiating fins 20g, gaps 31 and 31 are formed between the holder portion 17 and the detachable portion 18, respectively, in which air flows.
- annular heat dissipating fins 20g having a wide width in the front-rear direction in this way, it is possible to ensure good heat dissipation during driving of the image sensor 22 with a simple structure.
- a plurality of annular radiating fins separated in the front-rear direction can be used instead of the single radiating fin 20g having a wide width in the front-rear direction. It is.
- the heat dissipating part 20D includes an annular front coupling part 20a, an annular rear coupling part 20b, and between the front coupling part 20a and the rear coupling part 20b. And a grid-like heat radiation fin 20h provided integrally with each other.
- the heat dissipating part 20E includes an annular front coupling part 20a, an annular rear coupling part 20b, and between the front coupling part 20a and the rear coupling part 20b. And a net-like heat dissipating fin 20i provided integrally with each other.
- all the above-mentioned heat radiating parts 20, 20X, 20A, 20B, 20C, 20D, 20E are located on the outer peripheral side of the detachable part 18, and the heat radiating parts 20, 20X, 20A, 20B, 20C, 20D, 20E It is desirable that a space exists between the back surface and the surface of the detachable portion 18.
- the back surface of 20E also functions as a heat radiating surface, and the air fluidity is increased, so that the heat radiating property can be further improved.
- An image pickup apparatus 1A which is a first configuration example, includes an apparatus body 2A and an element block 3 (see FIG. 15).
- the imaging device 1A may be configured to include the interchangeable lens 4 in addition to the device main body 2A and the element block 3.
- the interchangeable lens 4 may be detachable from the element block 3.
- the element block 3 may be integrally formed with the apparatus main body 2A.
- the holder unit 17, the imaging unit 19, and the heat radiating unit 20 which are each part of the element block 3 are included in the apparatus main body 2A. Part of the configuration.
- the apparatus main body 2A has a housing 5A and various operation units 6, 6,... Arranged in each part of the housing 5A.
- the housing 5A has an annular guard portion 9A and a hold portion 11A continuous to the right end of the guard portion 9A.
- the space inside the guard portion 9A is formed as a circular insertion hole 15a.
- a mounting portion 10a is provided in the housing 5A at a position directly behind the insertion hole 15a.
- a space penetrating in the vertical direction is formed on the rear side of the insertion hole 15a, and these spaces serve as discharge holes 15b and 15b.
- the heat dissipating part 20 is located behind the front surface 15c of the guard part 9A, and the discharge holes 15b and 15b are located above and below the heat dissipating part 20, respectively.
- the element block 3 is attached to the apparatus main body 2A, at least a part of the holder portion 17 of the element block 3 protrudes forward from the guard portion 9A.
- the heat generated when the imaging element 22 is driven and released from the heat radiating unit 20 is mainly from the discharge holes 15b and 15b formed in the apparatus body 2A. It is discharged outside.
- the apparatus body 2A is formed with the discharge holes 15b and 15b for discharging the heat released from the heat radiating section 20, the heat released from the heat radiating section 20 is transferred from the discharge holes 15b and 15b to the apparatus main body 2A. It is reliably discharged outside. Therefore, heat is not easily transmitted to the apparatus main body 2A, and the apparatus main body 2A does not reach a high temperature, and the temperature rise of the image pickup element 22 and the apparatus main body 2A is suppressed, and a good operating state of the image pickup element 22 and the apparatus main body 2A is ensured. can do.
- the apparatus main body 2A is formed with discharge holes 15b and 15b positioned on the opposite side across the element block 3, the heat released from the heat radiating portion 20 is transmitted from both sides of the element block 3 to the apparatus main body 2A. It is discharged to the outside, and the temperature rise of the image sensor 22 and the apparatus main body 2A is further suppressed, and a more favorable operation state of the image sensor 22 and the apparatus main body 2A can be secured.
- the one discharge hole 15b is located above the heat radiating part 20, so that the heat released from the heat radiating part 20 is reduced. Good discharge performance can be ensured.
- the imaging apparatus 1B as the second configuration example is configured by the apparatus main body 2B and the element block 3 (see FIG. 16).
- the imaging apparatus 1B may include an interchangeable lens 4 in addition to the apparatus main body 2B and the element block 3.
- the interchangeable lens 4 may be detachable from the element block 3.
- the element block 3 may be integrally formed with the apparatus main body 2B.
- the holder unit 17, the imaging unit 19, and the heat radiating unit 20 which are each part of the element block 3 are included in the apparatus main body 2B. Part of the configuration.
- the apparatus main body 2B has a housing 5B and various operation units 6, 6,... Arranged in each part of the housing 5B.
- the housing 5B has a guard portion 9B and a hold portion 11B provided in a state protruding from the guard portion 9B.
- the housing 5B is formed with a circular insertion hole (not shown) through which the element block 3 is inserted, and discharge holes 15b and 15b for discharging heat released from the heat radiation portion 20 of the element block 3B.
- the discharge holes 15b and 15b are penetrated to the left and right and are spaced apart to the left and right.
- the discharge hole 15b should just be formed in the arbitrary positions around the thermal radiation part 20, for example, may be located in at least one of the upper direction of the thermal radiation part 20, or the downward direction.
- the adapter 32 can be attached to and detached from the apparatus main body 2B.
- the adapter 32 is provided with various connection terminals 33, 33,. By connecting a predetermined connection cord to each of the connection terminals 33, 33,..., Connection between the imaging device 1B and an external device such as a display device is possible via the adapter 32.
- the viewfinder 34 can be attached to and detached from the adapter 32.
- the viewfinder 34 allows the user to reliably see the subject at the time of shooting.
- the imaging device 1B having such a viewfinder 34 is particularly preferably used as a video camera for moving image shooting.
- the adapter 32 is not necessarily attached and used at the time of shooting or the like.
- the viewfinder 34 may be detachable from the apparatus main body 2B.
- the heat radiating portion 20 is located behind the front surface 15c of the guard portion 9B, and the discharge holes 15b and 15b are located on the left and right sides of the heat radiating portion 20, respectively.
- the element block 3 is attached to the apparatus main body 2B, at least a part of the holder portion 17 of the element block 3 protrudes forward from the guard portion 9B.
- heat generated when the imaging element 22 is driven and released from the heat radiating unit 20 is mainly from the discharge holes 15b and 15b formed in the apparatus body 2B. It is discharged outside.
- the apparatus main body 2B is formed with the discharge holes 15b and 15b for discharging the heat released from the heat radiating portion 20, the heat released from the heat radiating section 20 is discharged from the discharge holes 15b and 15b to the apparatus main body 2B. It is reliably discharged outside. Therefore, heat is not easily transmitted to the apparatus main body 2B, and the apparatus main body 2B does not reach a high temperature, and the temperature rises of the image pickup element 22 and the apparatus main body 2B are suppressed, and a favorable operating state of the image pickup element 22 and the apparatus main body 2B is ensured. can do.
- the apparatus main body 2B is formed with discharge holes 15b and 15b positioned on the opposite side across the element block 3, the heat released from the heat radiating portion 20 is generated from both sides of the element block 3 on the apparatus main body 2B. It is discharged to the outside, and the temperature rises of the image sensor 22 and the apparatus main body 2B are further suppressed, and a better operating state of the image sensor 22 and the apparatus main body 2B can be secured.
- FIG. 17 shows a block diagram of an embodiment of the imaging device of the present technology.
- the imaging device 1 has, for example, a device main body 2 and an element block 3, and the interchangeable lens 4 is attached to the element block 3 for use.
- the apparatus main body 2 includes a camera signal processing unit 51 that performs predetermined signal processing and an image processing unit 52 that performs recording and reproduction processing of image signals.
- the apparatus main body 2 includes a display unit 53 (display 12) that displays captured images and the like, an R / W (reader / writer) 54 that writes and reads image signals to and from the memory 60, and an imaging apparatus.
- a central processing unit (CPU) 55 that controls the entire system 1, an operation unit 56 (operation unit 6) such as various switches that are operated by a user, and a lens group 26 provided in the interchangeable lens 4.
- a lens drive control unit 57 that controls driving.
- the camera signal processing unit 51 performs various signal processing such as noise removal, image quality correction, and conversion to luminance / color difference signals on the output signal from the image sensor 22.
- the image processing unit 52 performs compression encoding / decompression decoding processing of an image signal based on a predetermined image data format, conversion processing of data specifications such as resolution, and the like.
- the display unit 53 has a function of displaying various data such as an operation state of the user operation unit 56 and a photographed image.
- the R / W 54 writes the image data encoded by the image processing unit 52 into the memory 60 and reads out the image data recorded in the memory 60.
- the CPU 55 functions as a control processing unit that controls each unit of the imaging apparatus 1 and controls each unit based on an instruction input signal or the like from the operation unit 56.
- the operation unit 56 outputs an instruction input signal corresponding to the operation by the user to the CPU 55.
- the lens drive control unit 57 controls a drive source that drives each lens of the lens group 26 based on a control signal from the CPU 55.
- the memory 60 is a semiconductor memory that can be attached to and detached from a slot connected to the R / W 54, for example.
- the captured image signal is output to the display unit 53 via the camera signal processing unit 51 and displayed as a camera-through image under the control of the CPU 55.
- the CPU 55 outputs a control signal to the lens drive control unit 57, and a predetermined lens group 26 is controlled based on the control of the lens drive control unit 57. The lens is moved.
- the photographed image signal is output from the camera signal processing unit 51 to the image processing unit 52, subjected to compression coding processing, and converted into digital data of a predetermined data format. Converted. The converted data is output to the R / W 54 and written to the memory 60.
- Focusing is performed when the lens drive control unit 57 moves a predetermined lens of the lens group 26 based on a control signal from the CPU 55.
- predetermined image data is read from the memory 60 by the R / W 54 in accordance with an operation on the operation unit 56, and decompression decoding processing is performed by the image processing unit 52. After being performed, the reproduced image signal is output to the display unit 53 to display the reproduced image.
- the present technology may be configured as follows.
- a plurality of the discharge holes are formed in the apparatus body, The imaging device according to (5), wherein the discharge hole is positioned on the opposite side at least across the element block.
- the element block is provided with a holder portion for holding the image sensor inside,
- the heat radiating part is formed in an annular shape,
- a cover for covering the heat dissipation part is provided outside the heat dissipation part,
- a plurality of the discharge holes are formed in the apparatus body, The imaging device according to (15), wherein the discharge hole is positioned on the opposite side at least with the element block interposed therebetween.
- the element block is provided with a holder portion for holding the image sensor inside,
- the heat radiating part is formed in an annular shape,
- a cover for covering the heat dissipation part is provided outside the heat dissipation part,
- the imaging device according to any one of (11) to (18), wherein the heat dissipating part and the covering part are positioned in a non-contact state.
- An element block comprising: an imaging element; a holder part that holds the imaging element; and a heat dissipation part that releases heat generated when the imaging element is driven.
- An element block comprising: an imaging element; a holder part that holds the imaging element; and a heat dissipation part that releases heat generated when the imaging element is driven.
- SYMBOLS 1 Imaging device, 2 ... Apparatus main body, 3 ... Element block, 4 ... Interchangeable lens, 6 ... Operation part, 9 ... Guard part, 15a ... Insertion hole, 15b ... Discharge hole, 15c ... Front surface, 17 ... Holder part, 19 DESCRIPTION OF SYMBOLS ... Imaging unit, 20 ... Radiation part, 20c ... Radiation fin, 22 ... Imaging element, 24 ... Gap, 20X ... Radiation part, 30 ... Cover part, 20A ... Radiation part, 20d ... Radiation fin, 20B ... Radiation part, 20e ... Radiation fin, 20C ... radiation part, 20g ... radiation fin, 20D ...
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Abstract
The present invention ensures a simplified structure and improves user safety. Provided is a device body onto which an operation unit is disposed. In a case where the end surface of the subject-side of the device body is the front surface thereof when the device body performs image pickup, heat dissipating parts which dissipate the heat generated when the image pickup device is driven are positioned on the rear side of the device body from the front surface thereof. The device body is provided with a guard part which covers at least some of the heat dissipating parts. Due to this configuration, because the heat dissipating parts are covered by the guard part in a state where the heat dissipating parts are positioned on the rear side of the device body from the front surface thereof, the user's fingers are prevented from touching the heat dissipating parts by the guard part, and it is possible to ensure a simplified structure and improve user safety.
Description
本技術は撮像素子の駆動時に発生する熱を放熱部から放出させる機能を有する撮像装置についての技術分野に関する。
This technology relates to the technical field of an image pickup apparatus having a function of releasing heat generated when an image pickup element is driven from a heat radiating portion.
ビデオカメラやスチルカメラ等の各種の撮像装置は所定の操作部、例えば、シャッター釦やズーム摘子等が配置された装置本体を備えている。
Various image pickup apparatuses such as a video camera and a still camera have a predetermined operation unit, for example, an apparatus main body on which a shutter button, a zoom knob, and the like are arranged.
このような撮像装置においてシャッター釦が操作されると、レンズ等の撮像光学系を介して被写体の光学像が撮像素子に取り込まれ、取り込まれた光学像が撮像素子によって光電変換されて画像や映像が生成される。撮像素子は基板上に配置されており、撮像素子の駆動時には撮像素子や基板から熱が発生する。
When the shutter button is operated in such an image pickup apparatus, an optical image of a subject is taken into the image pickup device via an image pickup optical system such as a lens, and the picked-up optical image is photoelectrically converted by the image pickup device to generate an image or video. Is generated. The image sensor is disposed on the substrate, and heat is generated from the image sensor and the substrate when the image sensor is driven.
撮像素子の駆動時に撮像素子や基板から発生する熱は撮像素子の良好な駆動状態に支障を来すおそれがあるため、撮像装置には発生した熱を放出するための放熱部が設けられて撮像素子の温度上昇を抑制するようにしたものがある(例えば、特許文献1参照)。
Since heat generated from the image sensor or the substrate when driving the image sensor may interfere with a good driving state of the image sensor, the image pickup apparatus is provided with a heat radiating unit for releasing the generated heat. There is one that suppresses the temperature rise of the element (for example, see Patent Document 1).
特許文献1に記載された撮像装置にあっては、レンズユニット(交換レンズ)に基板の背面に接触される伝熱板と伝熱板を覆う伝熱板カバーとが設けられ、カメラ本体(装置本体)に放熱部として機能するヒートシンクとヒートシンクを覆うヒートシンクカバーとが設けられている。伝熱板には凸部が設けられ、伝熱カバーとヒートシンクにはそれぞれ挿入孔が形成され、伝熱カバーが光軸方向へ移動可能にされている。
In the imaging apparatus described in Patent Document 1, a lens unit (interchangeable lens) is provided with a heat transfer plate that is in contact with the back surface of the substrate and a heat transfer plate cover that covers the heat transfer plate. The main body is provided with a heat sink that functions as a heat radiating portion and a heat sink cover that covers the heat sink. The heat transfer plate is provided with a convex portion, and insertion holes are formed in the heat transfer cover and the heat sink, respectively, so that the heat transfer cover can be moved in the optical axis direction.
レンズユニットがカメラ本体から取り外された状態においては、凸部を含む伝熱板の全体が伝熱板カバーに覆われると共にヒートシンクがヒートシンクカバーに覆われている。
When the lens unit is detached from the camera body, the entire heat transfer plate including the convex portions is covered with the heat transfer plate cover and the heat sink is covered with the heat sink cover.
レンズユニットがカメラ本体に取り付けられるときには、伝熱板カバーが伝熱板に近付く方向へ移動され、伝熱板の凸部が伝熱板カバーの挿入孔及びヒートシンクカバーの挿入孔に挿入されて凸部の先端面がヒートシンクに接触される。従って、撮像素子の駆動時に発生した熱は伝熱板の凸部からヒートシンクに伝達され、ヒートシンクから装置本体の内部に放出される。
When the lens unit is attached to the camera body, the heat transfer plate cover is moved in a direction approaching the heat transfer plate, and the convex portion of the heat transfer plate is inserted into the insertion hole of the heat transfer plate cover and the insertion hole of the heat sink cover. The tip surface of the part is in contact with the heat sink. Therefore, the heat generated when the image pickup element is driven is transmitted from the convex portion of the heat transfer plate to the heat sink, and is released from the heat sink to the inside of the apparatus main body.
レンズユニットがカメラ本体から取り外されるときには、伝熱板カバーが伝熱板から離隔する方向へ移動されて伝熱板の凸部が各挿入孔から取り出され凸部を含む伝熱板の全体が伝熱板カバーに覆われる。
When the lens unit is removed from the camera body, the heat transfer plate cover is moved away from the heat transfer plate, the convex portions of the heat transfer plate are taken out from the respective insertion holes, and the entire heat transfer plate including the convex portions is transferred. Covered with hot plate cover.
このように特許文献1に記載された撮像装置にあっては、レンズユニットのカメラ本体への取付時にレンズユニットとカメラ本体の内部において伝熱板の凸部がヒートシンクに接触され、レンズユニットのカメラ本体への非取付時には凸部を含む伝熱板の全体が伝熱板カバーに覆われると共にヒートシンクがヒートシンクカバーに覆われる。
As described above, in the imaging apparatus described in Patent Document 1, the convex portion of the heat transfer plate is brought into contact with the heat sink in the lens unit and the camera body when the lens unit is attached to the camera body. When not attached to the main body, the entire heat transfer plate including the convex portions is covered with the heat transfer plate cover and the heat sink is covered with the heat sink cover.
従って、レンズユニットのカメラ本体に対する着脱状態に拘わらず使用者が伝熱板とヒートシンクに触れることがないため、使用者が安全な状態で撮像装置を取り扱うことができるようにされている。
Therefore, since the user does not touch the heat transfer plate and the heat sink regardless of whether the lens unit is attached to or detached from the camera body, the user can handle the imaging device in a safe state.
ところが、特許文献1に記載された撮像装置にあっては、上記のような使用者の安全性を確保するために、伝熱板カバーとヒートシンクカバーが設けられると共に伝熱板カバーを移動させるための移動機構が設けられている。
However, in the imaging apparatus described in Patent Document 1, in order to ensure the safety of the user as described above, a heat transfer plate cover and a heat sink cover are provided and the heat transfer plate cover is moved. The moving mechanism is provided.
従って、部品点数が多く撮像装置の構造が複雑になり、製造コストの高騰を来すおそれがある。
Therefore, the number of parts is large and the structure of the image pickup apparatus becomes complicated, which may increase the manufacturing cost.
そこで、本技術撮像装置は、上記した問題点を克服し、構造の簡素化を確保した上で使用者の安全性の向上を図ることを目的とする。
Therefore, the imaging device of the present technology aims to overcome the above-described problems and improve the safety of the user after ensuring the simplification of the structure.
第1に、本技術に係る撮像装置は、操作部が配置された装置本体を備え、前記装置本体の撮影時における被写体側の端面を前面とした場合に、撮像素子の駆動時に発生する熱を放出する放熱部が前記装置本体の前記前面より後側に位置され、前記装置本体に前記放熱部の少なくとも一部を覆うガード部が設けられたものである。
First, an imaging apparatus according to an embodiment of the present technology includes an apparatus main body in which an operation unit is disposed, and heat generated when the imaging element is driven when an end surface on a subject side at the time of photographing of the apparatus main body is a front surface. A heat radiating part to be released is located behind the front surface of the apparatus main body, and a guard part that covers at least a part of the heat radiating part is provided on the apparatus main body.
これにより、放熱部が装置本体の前面より後側に位置された状態でガード部によって覆われる。
Thus, the heat radiating part is covered by the guard part in a state where the heat radiating part is located behind the front surface of the apparatus main body.
第2に、上記した撮像装置においては、前記放熱部と前記撮像素子を有する素子ブロックが設けられ、前記素子ブロックが前記装置本体に着脱可能とされることが望ましい。
Second, in the above-described imaging apparatus, it is desirable that an element block having the heat radiating portion and the imaging element is provided, and the element block is detachable from the apparatus main body.
これにより、被写体の種類や周囲環境等の撮影態様に応じて所望の種類の素子ブロックを装置本体に着脱して撮影を行うことが可能になる。
This makes it possible to shoot by attaching / detaching a desired type of element block to / from the apparatus body in accordance with the shooting mode such as the type of subject and the surrounding environment.
第3に、上記した撮像装置においては、前記ガード部には前記素子ブロックの着脱時に前記素子ブロックが挿通される挿通孔が形成されることが望ましい。
Thirdly, in the imaging apparatus described above, it is desirable that an insertion hole through which the element block is inserted when the element block is attached or detached is formed in the guard portion.
これにより、素子ブロックが挿通孔に挿通されて装置本体に着脱される。
Thus, the element block is inserted into the insertion hole and attached to or detached from the apparatus main body.
第4に、上記した撮像装置においては、前記素子ブロックが前記装置本体に取り付けられた状態において前記素子ブロックの少なくとも一部が前記挿通孔に挿入され、前記ガード部の内周面と前記素子ブロックの外周面との間に隙間が形成されることが望ましい。
Fourth, in the imaging apparatus described above, at least a part of the element block is inserted into the insertion hole in a state where the element block is attached to the apparatus main body, and the inner peripheral surface of the guard portion and the element block It is desirable that a gap be formed between the outer peripheral surface of each other.
これにより、放熱部から放出された熱が隙間から装置本体の外部へ排出される。
This causes the heat released from the heat radiating part to be discharged from the gap to the outside of the device body.
第5に、上記した撮像装置においては、前記装置本体に前記放熱部から放出される熱を外部に排出する排出孔が形成されることが望ましい。
Fifth, in the imaging apparatus described above, it is preferable that a discharge hole for discharging heat released from the heat radiating portion to the outside is formed in the apparatus main body.
これにより、放熱部から放出される熱が排出孔から装置本体の外部へ排出され、装置本体に熱が伝達され難く装置本体が高温になることがない。
Thus, the heat released from the heat radiating portion is discharged from the discharge hole to the outside of the apparatus main body, and heat is not easily transmitted to the apparatus main body, so that the apparatus main body does not become hot.
第6に、上記した撮像装置においては、前記装置本体に複数の前記排出孔が形成され、前記排出孔が少なくとも前記素子ブロックを挟んで反対側に位置されることが望ましい。
Sixth, in the above-described imaging apparatus, it is desirable that a plurality of the discharge holes are formed in the apparatus main body, and the discharge holes are positioned on the opposite side at least across the element block.
これにより、放熱部から放出された熱が素子ブロックの両側から装置本体の外部に排出される。
This causes the heat released from the heat dissipation part to be discharged to the outside of the device body from both sides of the element block.
第7に、上記した撮像装置においては、前記素子ブロックには内部に前記撮像素子を保持するホルダー部が設けられ、前記放熱部が前記ホルダー部から離隔するに従って外形が小さくなる形状に形成されることが望ましい。
Seventhly, in the above-described imaging device, the element block is provided with a holder portion for holding the imaging element, and the outer shape is formed to be smaller as the heat radiating portion is separated from the holder portion. It is desirable.
これにより、放熱部の外形の大きさが変化されているため、素子ブロックを把持したときに指が放熱部に接触し難い。
Because of this, the size of the outer shape of the heat radiating part is changed, so that it is difficult for the finger to come into contact with the heat radiating part when the element block is gripped.
第8に、上記した撮像装置においては、前記放熱部が環状に形成され、前記放熱部の周方向における全体に放熱フィンが設けられることが望ましい。
Eighth, in the above-described imaging device, it is desirable that the heat dissipating part is formed in an annular shape and heat dissipating fins are provided in the entire circumferential direction of the heat dissipating part.
これにより、放熱フィンから放熱部の外周側に熱が放出される。
This causes heat to be released from the radiating fin to the outer peripheral side of the radiating portion.
第9に、上記した撮像装置においては、前記放熱部の外側に前記放熱部を覆う覆い部が設けられ、前記放熱部と前記覆い部が非接触の状態で位置されることが望ましい。
Ninthly, in the above-described imaging device, it is desirable that a cover portion that covers the heat dissipation portion is provided outside the heat dissipation portion, and the heat dissipation portion and the cover portion are positioned in a non-contact state.
これにより、放熱部から放出される熱が覆い部に伝達され難い。
This makes it difficult for heat released from the heat dissipating part to be transmitted to the covering part.
第10に、上記した撮像装置においては、交換レンズが前記素子ブロックに着脱可能とされることが望ましい。
Tenth, in the above-described imaging apparatus, it is desirable that the interchangeable lens be detachable from the element block.
これにより、被写体の種類や被写体の位置や周囲環境等の撮影態様に応じて所望の種類の交換レンズを素子ブロックに着脱して撮影を行うことが可能になる。
This makes it possible to shoot by attaching / detaching a desired type of interchangeable lens to / from the element block according to the shooting mode such as the type of subject, the location of the subject, and the surrounding environment.
第11に、別の本技術に係る撮像装置は、操作部が配置された装置本体と、撮像素子と前記撮像素子の駆動時に発生する熱を放出する放熱部とを有する素子ブロックとを備え、前記装置本体の撮影時における被写体側の端面を前面とした場合に、前記放熱部が前記装置本体の前記前面より後側に位置され、前記装置本体に前記放熱部の少なくとも一部を覆うガード部が設けられたものである。
Eleventh, an imaging apparatus according to another embodiment of the present technology includes an apparatus main body in which an operation unit is disposed, and an element block including an imaging element and a heat radiating unit that releases heat generated when the imaging element is driven, A guard portion that covers at least a part of the heat radiating portion on the apparatus main body, the heat radiating portion being located on the rear side of the front surface of the apparatus main body when an end surface on the subject side during photographing of the apparatus main body is the front surface Is provided.
これにより、放熱部が装置本体の前面より後側に位置された状態でガード部によって覆われる。
Thus, the heat radiating part is covered by the guard part in a state where the heat radiating part is located behind the front surface of the apparatus main body.
第12に、上記した撮像装置においては、前記素子ブロックが前記装置本体に着脱可能とされることが望ましい。
Twelfth, in the imaging apparatus described above, it is desirable that the element block be detachable from the apparatus main body.
これにより、被写体の種類や周囲環境等の撮影態様に応じて所望の種類の素子ブロックを装置本体に着脱して撮影を行うことが可能になる。
This makes it possible to shoot by attaching / detaching a desired type of element block to / from the apparatus body in accordance with the shooting mode such as the type of subject and the surrounding environment.
第13に、上記した撮像装置においては、前記ガード部には前記素子ブロックの着脱時に前記素子ブロックが挿通される挿通孔が形成されることが望ましい。
Thirteenthly, in the above-described imaging device, it is preferable that an insertion hole through which the element block is inserted when the element block is attached or detached is formed in the guard portion.
これにより、素子ブロックが挿通孔に挿通されて装置本体に着脱される。
Thus, the element block is inserted into the insertion hole and attached to or detached from the apparatus main body.
第14に、上記した撮像装置においては、前記素子ブロックが前記装置本体に取り付けられた状態において前記素子ブロックの少なくとも一部が前記挿通孔に挿入され、前記ガード部の内周面と前記素子ブロックの外周面との間に隙間が形成されることが望ましい。
14thly, in the imaging device described above, at least a part of the element block is inserted into the insertion hole in a state where the element block is attached to the apparatus body, and the inner peripheral surface of the guard portion and the element block It is desirable that a gap be formed between the outer peripheral surface of each other.
これにより、放熱部から放出された熱が隙間から装置本体の外部へ排出される。
This causes the heat released from the heat radiating part to be discharged from the gap to the outside of the device body.
第15に、上記した撮像装置においては、前記装置本体に前記放熱部から放出される熱を外部に排出する排出孔が形成されることが望ましい。
Fifteenthly, in the imaging apparatus described above, it is preferable that a discharge hole for discharging heat released from the heat radiating portion to the outside is formed in the apparatus main body.
これにより、放熱部から放出される熱が排出孔から装置本体の外部へ排出され、装置本体に熱が伝達され難く装置本体が高温になることがない。
Thus, the heat released from the heat radiating portion is discharged from the discharge hole to the outside of the apparatus main body, and heat is not easily transmitted to the apparatus main body, so that the apparatus main body does not become hot.
第16に、上記した撮像装置においては、前記装置本体に複数の前記排出孔が形成され、前記排出孔が少なくとも前記素子ブロックを挟んで反対側に位置されることが望ましい。
Sixteenth, in the above-described imaging apparatus, it is desirable that a plurality of the discharge holes are formed in the apparatus main body, and the discharge holes are positioned at least on the opposite side across the element block.
これにより、放熱部から放出された熱が素子ブロックの両側から装置本体の外部に排出される。
This causes the heat released from the heat dissipation part to be discharged to the outside of the device body from both sides of the element block.
第17に、上記した撮像装置においては、前記素子ブロックには内部に前記撮像素子を保持するホルダー部が設けられ、前記放熱部が前記ホルダー部から離隔するに従って外形が小さくなる形状に形成されることが望ましい。
Seventeenth, in the above-described imaging device, the element block is provided with a holder portion for holding the imaging element therein, and the outer shape is formed to be smaller as the heat radiating portion is separated from the holder portion. It is desirable.
これにより、放熱部の外形の大きさが変化されているため、素子ブロックを把持したときに指が放熱部に接触し難い。
Because of this, the size of the outer shape of the heat radiating part is changed, so that it is difficult for the finger to come into contact with the heat radiating part when the element block is gripped.
第18に、上記した撮像装置においては、前記放熱部が環状に形成され、前記放熱部の周方向における全体に放熱フィンが設けられることが望ましい。
Eighteenth, in the imaging apparatus described above, it is desirable that the heat radiating portion is formed in an annular shape, and a heat radiating fin is provided in the entire circumferential direction of the heat radiating portion.
これにより、放熱フィンから放熱部の外周側に熱が放出される。
This causes heat to be released from the radiating fin to the outer peripheral side of the radiating portion.
第19に、上記した撮像装置においては、前記放熱部の外側に前記放熱部を覆う覆い部が設けられ、前記放熱部と前記覆い部が非接触の状態で位置されることが望ましい。
Nineteenth, in the above-described imaging device, it is desirable that a cover portion for covering the heat dissipation portion is provided outside the heat dissipation portion, and the heat dissipation portion and the cover portion are positioned in a non-contact state.
これにより、放熱部から放出される熱が覆い部に伝達され難い。
This makes it difficult for heat released from the heat dissipating part to be transmitted to the covering part.
第20に、上記した撮像装置においては、交換レンズが前記素子ブロックに着脱可能とされることが望ましい。
20thly, in the above-described imaging apparatus, it is desirable that the interchangeable lens be detachable from the element block.
これにより、被写体の種類や被写体の位置や周囲環境等の撮影態様に応じて所望の種類の交換レンズを素子ブロックに着脱して撮影を行うことが可能になる。
This makes it possible to shoot by attaching / detaching a desired type of interchangeable lens to / from the element block according to the shooting mode such as the type of subject, the location of the subject, and the surrounding environment.
本技術によれば、放熱部が装置本体の前面より後側に位置された状態でガード部によって覆われるため、使用者の指の放熱部との接触がガード部によって防止され、構造の簡素化を確保した上で使用者の安全性の向上を図ることができる。
According to the present technology, since the heat radiating part is covered with the guard part in a state of being located on the rear side of the front surface of the apparatus main body, the contact with the heat radiating part of the user's finger is prevented by the guard part, and the structure is simplified. It is possible to improve the safety of the user while ensuring the above.
尚、本明細書に記載された効果はあくまでも例示であって限定されるものではなく、他の効果があってもよい。
It should be noted that the effects described in this specification are merely examples and are not limited, and may have other effects.
以下に、本技術を実施するための形態を添付図面を参照して説明する。
Hereinafter, modes for carrying out the present technology will be described with reference to the accompanying drawings.
以下に示した実施の形態は、本技術撮像装置をスチルカメラに適用したものである。
In the embodiment described below, the imaging device of the present technology is applied to a still camera.
尚、本技術の適用範囲はスチルカメラに限られることはなく、例えば、ビデオカメラや他の機器に組み込まれるカメラモジュールを含む各種のカメラに広く適用することができる。
Note that the scope of application of the present technology is not limited to a still camera, and can be widely applied to, for example, various cameras including a camera module incorporated in a video camera or other devices.
以下の説明にあっては、撮影時において撮影者から見た方向で前後上下左右の方向を示すものとする。従って、被写体側が前方となり、撮影者側が後方となる。
In the following explanation, it is assumed that the front, rear, up, down, left, and right directions are shown in the direction seen from the photographer at the time of shooting. Therefore, the subject side is the front and the photographer side is the rear.
尚、以下に示す前後上下左右の方向は説明の便宜上のものであり、本技術の実施に関しては、これらの方向に限定されることはない。
It should be noted that the front, rear, up, down, left, and right directions shown below are for convenience of explanation, and the implementation of the present technology is not limited to these directions.
また、以下に示すレンズ群は、単数又は複数のレンズにより構成されたものの他、これらの単数又は複数のレンズと絞りやアイリス等の他の光学素子を含んでもよい。
Further, the lens group shown below may include one or a plurality of lenses and other optical elements such as a diaphragm and an iris in addition to the lens group including one or a plurality of lenses.
[撮像装置の構成]
撮像装置1は装置本体2と素子ブロック3によって構成されている(図1乃至図3参照)。尚、撮像装置1は装置本体2と素子ブロック3に加え、交換レンズ4を含めて構成されていてもよい。この場合に、交換レンズ4が素子ブロック3に着脱可能とされていてもよい。 [Configuration of imaging device]
Theimaging device 1 is composed of a device body 2 and an element block 3 (see FIGS. 1 to 3). The imaging device 1 may be configured to include the interchangeable lens 4 in addition to the device body 2 and the element block 3. In this case, the interchangeable lens 4 may be detachable from the element block 3.
撮像装置1は装置本体2と素子ブロック3によって構成されている(図1乃至図3参照)。尚、撮像装置1は装置本体2と素子ブロック3に加え、交換レンズ4を含めて構成されていてもよい。この場合に、交換レンズ4が素子ブロック3に着脱可能とされていてもよい。 [Configuration of imaging device]
The
交換レンズ4が素子ブロック3に着脱可能とされることにより、被写体の種類や被写体の位置や周囲環境等の撮影態様に応じて所望の種類の交換レンズ4を素子ブロック3に着脱して撮影を行うことが可能になり、使い勝手の向上及び画質の向上を図ることができる。
By making the interchangeable lens 4 attachable to and detachable from the element block 3, a desired type of interchangeable lens 4 can be attached to and detached from the element block 3 in accordance with the photographing mode such as the type of subject, the position of the subject and the surrounding environment. This makes it possible to improve usability and improve image quality.
装置本体2は筐体5と筐体5の各部に配置された各種の操作部6、6、・・・とを有している。
The apparatus main body 2 includes a housing 5 and various operation units 6, 6,.
筐体5は横長の形状に形成された本体部7と本体部7の上側に設けられたフラッシュ取付部8と本体部7の前側に設けられたガード部9とを有している。
The housing 5 has a body portion 7 formed in a horizontally long shape, a flash mounting portion 8 provided on the upper side of the body portion 7, and a guard portion 9 provided on the front side of the body portion 7.
本体部7は横長の扁平な略矩形状に形成されたベース部10とベース部10の右端部から前方に突出されたホールド部11とから成る。
The main body portion 7 includes a base portion 10 formed in a horizontally long flat and substantially rectangular shape, and a hold portion 11 protruding forward from the right end portion of the base portion 10.
ベース部10の前面側における左方寄りの位置には素子ブロック3を取り付けるための取付部10aが設けられている。取付部10aは外形が円形状に形成され、取付部10aには素子ブロック3が、例えば、バヨネット結合により取り付けられる。ベース部10の後面には一部を除く位置にディスプレイ12が配置されている(図4参照)。ベース部10の一方の側面には開閉可能なカバー13が配置されている(図5参照)。カバー13の内側には図示しないイヤホンジャックや接続端子等の各部が設けられている。
An attachment portion 10 a for attaching the element block 3 is provided at a position closer to the left side on the front side of the base portion 10. The attachment portion 10a has a circular outer shape, and the element block 3 is attached to the attachment portion 10a by, for example, bayonet coupling. A display 12 is disposed on the rear surface of the base portion 10 at a position excluding a part (see FIG. 4). An openable / closable cover 13 is disposed on one side surface of the base portion 10 (see FIG. 5). Inside the cover 13, various parts such as an earphone jack and connection terminals (not shown) are provided.
ホールド部11は撮影時に使用者が把持する部分であり、前側の部分から左右両側面に亘る外面が曲面状に形成されている(図1乃至図3参照)。ホールド部11の前側の部分から左右両側面に亘る外面が曲面状に形成されていることにより、使用者が撮影時に違和感なくホールド部11を把持することが可能であり、良好な把持性による安定した撮影状態を確保することができる。
The hold portion 11 is a portion that is held by the user during photographing, and has an outer surface that extends from the front portion to the left and right sides (see FIGS. 1 to 3). Since the outer surface extending from the front part of the hold unit 11 to both the left and right side surfaces is formed in a curved shape, the user can hold the hold unit 11 without a sense of incongruity at the time of photographing, and is stable due to good gripping properties. Can be ensured.
フラッシュ取付部8は前端部と後端部がベース部10からそれぞれ前方と後方に突出された状態で設けられている。フラッシュ取付部8には図示しない発光体(フラッシュユニット)が着脱可能とされている。フラッシュ取付部8の後面にはファインダー窓14が配置されている(図4参照)。
The flash mounting portion 8 is provided with a front end portion and a rear end portion protruding forward and rearward from the base portion 10, respectively. A light emitter (flash unit) (not shown) can be attached to and detached from the flash mounting portion 8. A finder window 14 is disposed on the rear surface of the flash mounting portion 8 (see FIG. 4).
ガード部9は、図1乃至図3に示すように、略円環状の環状部15と環状部15の下端部から後方に突出された連結部16とを有し、環状部15の上端部がフラッシュ取付部8の前端部に結合され、連結部16の後端部がベース部10の下端部に結合されている。
As shown in FIGS. 1 to 3, the guard portion 9 includes a substantially annular annular portion 15 and a connecting portion 16 protruding rearward from the lower end portion of the annular portion 15, and the upper end portion of the annular portion 15 is The flash mounting portion 8 is coupled to the front end portion, and the rear end portion of the coupling portion 16 is coupled to the lower end portion of the base portion 10.
環状部15の内側の空間は円形状の挿通孔15aとして形成され、挿通孔15aの中心が取付部10aの中心に前後方向において一致されている(図6参照)。環状部15の内径は取付部10aの外径より一回り大きくされている。環状部15の左右両側部とベース部10の間にはそれぞれ左右方向に貫通された空間が形成され、これらの各空間が排出孔15b、15bとされている(図1乃至図3参照)。
The space inside the annular portion 15 is formed as a circular insertion hole 15a, and the center of the insertion hole 15a coincides with the center of the mounting portion 10a in the front-rear direction (see FIG. 6). The inner diameter of the annular portion 15 is made slightly larger than the outer diameter of the mounting portion 10a. Spaces penetrating in the left-right direction are formed between the left and right side portions of the annular portion 15 and the base portion 10, and these spaces serve as discharge holes 15b and 15b (see FIGS. 1 to 3).
操作部6、6、・・・としては、例えば、電源釦、シャッター釦、ズーム摘子、モード選択釦、モード切替釦等が設けられている。操作部6、6、・・・は、主として、本体部7の上面や後面に設けられている(図1乃至図4参照)。
As the operation units 6, 6,..., For example, a power button, a shutter button, a zoom knob, a mode selection button, a mode switching button, and the like are provided. The operation units 6, 6,... Are mainly provided on the upper surface and the rear surface of the main body unit 7 (see FIGS. 1 to 4).
素子ブロック3はホルダー部17と着脱部18と撮像ユニット19と放熱部20を有している(図1、図7及び図8参照)。
The element block 3 includes a holder part 17, an attaching / detaching part 18, an imaging unit 19, and a heat radiating part 20 (see FIGS. 1, 7, and 8).
ホルダー部17は外形が円形状に形成され、前方に開口された配置凹部17aを有している。ホルダー部17の前端部には交換レンズ4が取り付けられるマウント部17bが設けられている。ホルダー部17にはリリース摘子21が配置されている。
The holder portion 17 has a circular outer shape and has an arrangement recess 17a that opens forward. A mount portion 17 b to which the interchangeable lens 4 is attached is provided at the front end portion of the holder portion 17. A release knob 21 is disposed on the holder portion 17.
着脱部18はホルダー部17の外周部を除く部分から後方に突出され、外形がホルダー部17の径より一回り小さい円形状に形成されている。
The detachable portion 18 protrudes rearward from the portion excluding the outer peripheral portion of the holder portion 17 and is formed in a circular shape whose outer shape is slightly smaller than the diameter of the holder portion 17.
撮像ユニット19はCCD(Charge Coupled Device)やCMOS(Complementary Metal-Oxide Semiconductor)等の撮像素子22と撮像素子22を駆動するための基板23とを有し、基板23の前面に撮像素子22が配置されている。撮像ユニット19はホルダー部17の配置凹部17aに挿入されて配置され、ホルダー部17によって保持されている。
The imaging unit 19 includes an imaging element 22 such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal-Oxide Semiconductor) and a substrate 23 for driving the imaging element 22. The imaging element 22 is disposed on the front surface of the substrate 23. Has been. The imaging unit 19 is inserted and arranged in the arrangement recess 17 a of the holder part 17 and is held by the holder part 17.
放熱部20は着脱部18の外周側に配置され環状に形成されている。放熱部20には撮像素子22の駆動時に発生する熱が伝達される。放熱部20は、円環状の前側結合部20aと、円環状の後側結合部20bと、前側結合部20aと後側結合部20bの間に設けられた複数の放熱フィン20c、20c、・・・とが一体に形成されて成り、ホルダー部17より放熱性の高い材料によって形成されていることが望ましい。
The heat dissipating part 20 is arranged on the outer peripheral side of the attaching / detaching part 18 and is formed in an annular shape. Heat generated when the image sensor 22 is driven is transmitted to the heat radiating unit 20. The heat radiating portion 20 includes an annular front coupling portion 20a, an annular rear coupling portion 20b, and a plurality of radiating fins 20c, 20c provided between the front coupling portion 20a and the rear coupling portion 20b. It is desirable that and are integrally formed and made of a material having higher heat dissipation than the holder portion 17.
前側結合部20aはホルダー部17の直ぐ後側に位置され、外径がホルダー部17の外径と略同じにされている。後側結合部20bの径は前側結合部20aの径より小さくされている。放熱フィン20c、20c、・・・は周方向において等間隔の状態で位置されている。
The front coupling part 20 a is located immediately behind the holder part 17 and has an outer diameter substantially the same as the outer diameter of the holder part 17. The diameter of the rear coupling part 20b is smaller than the diameter of the front coupling part 20a. The radiation fins 20c, 20c,... Are positioned at equal intervals in the circumferential direction.
上記のように、放熱部20は後側結合部20bの径が前側結合部20aより径が小さくされているため、ホルダー部17から離隔するに従って外形が小さくなる形状に形成されている。
As described above, the heat radiating portion 20 is formed in such a shape that the outer diameter becomes smaller as it is separated from the holder portion 17 because the diameter of the rear coupling portion 20b is smaller than that of the front coupling portion 20a.
素子ブロック3は装置本体2に着脱可能とされている(図1乃至図3参照)。素子ブロック3は着脱部18が装置本体2の取付部10aに、例えば、バヨネット結合により取り付けられる。素子ブロック3の取付部10aに対する取付は、素子ブロック3をガード部9の挿通孔15aに挿入して着脱部18を取付部10aに押し付け、周方向における一方へ回転することにより行うことができる。素子ブロック3が装置本体2に取り付けられたときには、図示しないロック機構によって素子ブロック3が装置本体2にロックされる。
The element block 3 is detachably attached to the apparatus main body 2 (see FIGS. 1 to 3). The element block 3 has the detachable portion 18 attached to the attachment portion 10a of the apparatus main body 2 by, for example, bayonet coupling. The element block 3 can be attached to the attachment part 10a by inserting the element block 3 into the insertion hole 15a of the guard part 9, pressing the attachment / detachment part 18 against the attachment part 10a, and rotating the element block 3 to one side in the circumferential direction. When the element block 3 is attached to the apparatus main body 2, the element block 3 is locked to the apparatus main body 2 by a lock mechanism (not shown).
素子ブロック3が装置本体2に取り付けられた状態においては、放熱部20がガード部9における環状部15の前面15cより後側に位置され、放熱部20の左右にそれぞれ排出孔15b、15bが位置される(図5参照)。また、素子ブロック3が装置本体2に取り付けられた状態においては、素子ブロック3はホルダー部17の少なくとも一部がガード部9から前方に突出されている。さらに、素子ブロック3が装置本体2に取り付けられた状態においては、素子ブロック3の外周面とガード部9における環状部15の内周面との間に隙間24が形成されている(図6参照)。
In a state where the element block 3 is attached to the apparatus main body 2, the heat radiating portion 20 is located behind the front surface 15 c of the annular portion 15 in the guard portion 9, and the discharge holes 15 b and 15 b are located on the left and right sides of the heat radiating portion 20, respectively. (See FIG. 5). In the state where the element block 3 is attached to the apparatus main body 2, at least a part of the holder portion 17 of the element block 3 protrudes forward from the guard portion 9. Further, when the element block 3 is attached to the apparatus main body 2, a gap 24 is formed between the outer peripheral surface of the element block 3 and the inner peripheral surface of the annular portion 15 in the guard portion 9 (see FIG. 6). ).
素子ブロック3の装置本体2からの取り外しは、装置本体2に設けられた図示しないリリース釦を操作してロックを解除し、素子ブロック3を周方向における他方へ回転し、挿通孔15aから取り出すことにより行うことができる。
The element block 3 is detached from the apparatus main body 2 by operating a release button (not shown) provided on the apparatus main body 2 to release the lock, rotating the element block 3 to the other side in the circumferential direction, and taking it out from the insertion hole 15a. Can be performed.
このとき使用者はガード部9から前方に突出されたホルダー部17を把持して素子ブロック3を回転する。従って、使用者は放熱部20以外の部分を把持して素子ブロック3を回転するため、高温になり易い放熱部20に指が接触せず、安全な状態で素子ブロック3を装置本体2から取り外すことができる。
At this time, the user rotates the element block 3 while holding the holder portion 17 protruding forward from the guard portion 9. Therefore, since the user rotates the element block 3 by grasping a part other than the heat radiating part 20, the finger does not come into contact with the heat radiating part 20 that is likely to be hot, and the element block 3 is removed from the apparatus main body 2 in a safe state. be able to.
上記したように、素子ブロック3が装置本体2に着脱可能とされることにより、被写体の種類や周囲環境等の撮影態様に応じて所望の種類の素子ブロック3を装置本体2に着脱して撮影を行うことが可能になり、使い勝手の向上及び画質の向上を図ることができる。特に、素子ブロック3として画素数の多い撮像素子22を有するものや感度の高い撮像素子22を有するもの等を用意することにより、被写体の種類に応じて高画質の画像を生成することが可能になる。
As described above, since the element block 3 can be attached to and detached from the apparatus main body 2, a desired type of element block 3 can be attached to and detached from the apparatus main body 2 in accordance with the photographing mode such as the type of subject and the surrounding environment. It is possible to improve the usability and the image quality. In particular, by preparing an element block 3 having an image sensor 22 with a large number of pixels or a sensor element 22 having a high sensitivity, it is possible to generate a high-quality image according to the type of subject. Become.
尚、素子ブロック3は装置本体2の一部として装置本体2に一体に形成されていてもよく、この場合には素子ブロック3の各部であるホルダー部17、撮像ユニット19及び放熱部20が装置本体2の構成の一部とされる。
The element block 3 may be formed integrally with the apparatus main body 2 as a part of the apparatus main body 2. In this case, the holder unit 17, the imaging unit 19, and the heat radiating unit 20, which are each part of the element block 3, are provided. A part of the configuration of the main body 2 is used.
交換レンズ4は筒状に形成された外筐25と外筐25の内部に配置されたレンズ群26とを有している(図1乃至図3参照)。交換レンズ4には外筐25にそれぞれ回転自在に支持されたズームリング27とフォーカスリング28が設けられている。ズームリング27が回転操作されることによりマニュアルズーミングが行われ、フォーカスリング28が回転操作されることによりマニュアルフォーカシングが行われる。
The interchangeable lens 4 has a cylindrical outer casing 25 and a lens group 26 arranged inside the outer casing 25 (see FIGS. 1 to 3). The interchangeable lens 4 is provided with a zoom ring 27 and a focus ring 28 that are rotatably supported by the outer casing 25. Manual zooming is performed by rotating the zoom ring 27, and manual focusing is performed by rotating the focus ring 28.
交換レンズ4の後端部には、素子ブロック3のマウント部17bに、例えば、バヨネット結合されるレンズマウント29が設けられている。
At the rear end of the interchangeable lens 4, for example, a lens mount 29 that is bayonet-coupled to the mount portion 17 b of the element block 3 is provided.
交換レンズ4の素子ブロック3におけるマウント部17bに対する取付は、レンズマウント29をマウント部17bに押し付け、交換レンズ4を周方向における一方へ回転することにより行うことができる。交換レンズ4が素子ブロック3に取り付けられたときには、図示しないロック部によって交換レンズ4が素子ブロック3にロックされる。
The attachment of the interchangeable lens 4 to the mount portion 17b in the element block 3 can be performed by pressing the lens mount 29 against the mount portion 17b and rotating the interchangeable lens 4 to one side in the circumferential direction. When the interchangeable lens 4 is attached to the element block 3, the interchangeable lens 4 is locked to the element block 3 by a lock unit (not shown).
一方、交換レンズ4の素子ブロック3からの取り外しは、素子ブロック3に設けられたリリース摘子21を操作してロックを解除し、交換レンズ4を周方向における他方へ回転し、交換レンズ4を素子ブロック3から引き離すことにより行うことができる。
On the other hand, to remove the interchangeable lens 4 from the element block 3, the release knob 21 provided in the element block 3 is operated to release the lock, and the interchangeable lens 4 is rotated to the other side in the circumferential direction. This can be done by pulling away from the element block 3.
[撮像装置における放熱状態]
上記のように構成された撮像装置1において、静止画撮影モード又は動画撮影モードが設定されると被写体の撮影が可能とされる。撮影時には交換レンズ4のレンズ群26によって取り込まれた被写体の像が素子ブロック3の撮像素子22に入射され、撮像素子22によって光電変換(アナログ/デジタル変換)されて装置本体2の所定の処理部に入力されて画像又は映像が生成される。 [Heat dissipation state in the imaging device]
In theimaging apparatus 1 configured as described above, a subject can be captured when the still image capturing mode or the moving image capturing mode is set. At the time of shooting, an image of the subject captured by the lens group 26 of the interchangeable lens 4 is incident on the image sensor 22 of the element block 3 and is subjected to photoelectric conversion (analog / digital conversion) by the image sensor 22 to be a predetermined processing unit of the apparatus main body 2. To generate an image or video.
上記のように構成された撮像装置1において、静止画撮影モード又は動画撮影モードが設定されると被写体の撮影が可能とされる。撮影時には交換レンズ4のレンズ群26によって取り込まれた被写体の像が素子ブロック3の撮像素子22に入射され、撮像素子22によって光電変換(アナログ/デジタル変換)されて装置本体2の所定の処理部に入力されて画像又は映像が生成される。 [Heat dissipation state in the imaging device]
In the
撮影時には撮像素子22の駆動が行われる。撮像素子22の駆動時には撮像素子22や基板23において熱が発生し、発生した熱は放熱部20に伝達されて放熱部20から放出される。
The image sensor 22 is driven during photographing. When the image sensor 22 is driven, heat is generated in the image sensor 22 and the substrate 23, and the generated heat is transmitted to the heat radiating unit 20 and released from the heat radiating unit 20.
このとき素子ブロック3は放熱部20が環状に形成され、放熱部20の周方向における全体に放熱フィン20c、20c、・・・が設けられているため、複数の放熱フィン20c、20c、・・・からそれぞれ外周側に熱が放出され、高い放熱性を確保して撮像素子22の良好な駆動状態を確保することができる。尚、撮像素子22の駆動時に発生した熱は、放熱フィン20c、20c、・・・に加え前側結合部20aと後側結合部20bからも放出される。
At this time, the element block 3 has the heat radiating portion 20 formed in an annular shape, and the heat radiating fins 20c, 20c,... The heat is released to the outer peripheral side from each of the two to ensure high heat dissipation and to ensure a good driving state of the image sensor 22. It should be noted that the heat generated when the image pickup device 22 is driven is also released from the front coupling portion 20a and the rear coupling portion 20b in addition to the radiation fins 20c, 20c,.
また、放熱部20から放出される熱は、主に、装置本体2に形成された排出孔15b、15bから装置本体2の外部へ排出される。
Further, the heat released from the heat radiating unit 20 is mainly discharged from the discharge holes 15b and 15b formed in the apparatus main body 2 to the outside of the apparatus main body 2.
このように装置本体2には放熱部20から放出された熱を排出する排出孔15b、15bが形成されているため、放熱部20から放出された熱が排出孔15b、15bから装置本体2の外部に確実に排出される。従って、装置本体2に熱が伝達され難く装置本体2が高温になることがなく、撮像素子22及び装置本体2の温度上昇が抑制されて撮像素子22及び装置本体2の良好な動作状態を確保することができる。
Thus, since the apparatus main body 2 is formed with the discharge holes 15b and 15b for discharging the heat released from the heat radiating section 20, the heat released from the heat radiating section 20 is discharged from the discharge holes 15b and 15b to the apparatus main body 2. It is reliably discharged outside. Therefore, heat is not easily transmitted to the apparatus main body 2, and the apparatus main body 2 does not reach a high temperature, and the temperature rise of the image pickup element 22 and the apparatus main body 2 is suppressed to ensure a good operation state of the image pickup element 22 and the apparatus main body 2. can do.
また、装置本体2には素子ブロック3を挟んで反対側に位置された排出孔15b、15bが形成されているため、放熱部20から放出された熱が素子ブロック3の両側から装置本体2の外部に排出され、撮像素子22及び装置本体2の温度上昇が一層抑制されて撮像素子22及び装置本体2の一層良好な動作状態を確保することができる。
Further, since the apparatus main body 2 is formed with discharge holes 15b and 15b positioned on the opposite side across the element block 3, the heat released from the heat radiating portion 20 from both sides of the element block 3 It is discharged to the outside, and the temperature rises of the image sensor 22 and the apparatus main body 2 are further suppressed, and a better operating state of the image sensor 22 and the apparatus main body 2 can be ensured.
さらに、素子ブロック3が装置本体2に取り付けられた状態においては、素子ブロック3の外周面とガード部9における環状部15の内周面との間に隙間24が形成されている(図6参照)。従って、放熱部20から放出された熱が隙間24からも装置本体2の外部へ排出され、撮像素子22及び装置本体2の温度上昇がより一層抑制されて撮像素子22及び装置本体2のより一層良好な動作状態を確保することができる。
Further, when the element block 3 is attached to the apparatus main body 2, a gap 24 is formed between the outer peripheral surface of the element block 3 and the inner peripheral surface of the annular portion 15 in the guard portion 9 (see FIG. 6). ). Therefore, the heat released from the heat radiating unit 20 is also discharged from the gap 24 to the outside of the apparatus main body 2, and the temperature rise of the image pickup element 22 and the apparatus main body 2 is further suppressed, and the image pickup element 22 and the apparatus main body 2 are further reduced. A good operating state can be ensured.
尚、上記には、装置本体2に放熱部20の左右両側に位置される排出孔15b、15bが形成された例を示したが、排出孔15bは放熱部20の周囲の任意の位置に形成されていればよく、例えば、放熱部20の上方又は下方の少なくとも一方に位置されていてもよい。
In the above, the example in which the discharge holes 15b and 15b located on the left and right sides of the heat radiating part 20 are formed in the apparatus main body 2 is shown. However, the discharge holes 15b are formed at arbitrary positions around the heat radiating part 20. For example, it may be located above or below the heat dissipating part 20.
[まとめ]
以上に記載した通り、撮像装置1にあっては、撮像素子22の駆動時に発生する熱を放出する放熱部20が装置本体2の前面15cより後側に位置され、装置本体2に放熱部20の少なくとも一部を覆うガード部9が設けられている。 [Summary]
As described above, in theimaging device 1, the heat dissipating part 20 that releases heat generated when the image sensor 22 is driven is located behind the front surface 15 c of the apparatus main body 2, and the heat dissipating part 20 is disposed on the apparatus main body 2. A guard portion 9 is provided to cover at least a part thereof.
以上に記載した通り、撮像装置1にあっては、撮像素子22の駆動時に発生する熱を放出する放熱部20が装置本体2の前面15cより後側に位置され、装置本体2に放熱部20の少なくとも一部を覆うガード部9が設けられている。 [Summary]
As described above, in the
従って、簡素な構造であるガード部9によって高温になる可能性のある放熱部20への指の接触が防止されるため、使用者が安全な状態で撮像装置1を取り扱うことができ、構造の簡素化を確保した上で使用者の安全性の向上を図ることができる。
Therefore, since the guard portion 9 having a simple structure prevents the finger from coming into contact with the heat radiating portion 20 that may become high in temperature, the user can handle the imaging device 1 in a safe state. The user's safety can be improved while ensuring simplification.
また、ガード部9には素子ブロック3の装置本体2に対する着脱時に素子ブロック3が挿通される挿通孔15aが形成されているため、素子ブロック3が挿通孔15aに挿通されて装置本体2に着脱される。従って、ガード部9が素子ブロック3を保護する保護部として機能すると共に素子ブロック3を案内する案内部として機能し、簡素な構成により機能性の向上を図ることができる。
Further, since the guard portion 9 is formed with an insertion hole 15a through which the element block 3 is inserted when the element block 3 is attached to and detached from the apparatus main body 2, the element block 3 is inserted into the insertion hole 15a and is attached to and detached from the apparatus main body 2. Is done. Accordingly, the guard portion 9 functions as a protection portion that protects the element block 3 and also functions as a guide portion that guides the element block 3, and functionality can be improved with a simple configuration.
さらに、素子ブロック3には内部に撮像素子22を保持するホルダー部17が設けられ、放熱部20がホルダー部17から離隔するに従って外形が小さくなる形状に形成されている。
Furthermore, the element block 3 is provided with a holder portion 17 for holding the image pickup device 22 therein, and the outer shape becomes smaller as the heat radiating portion 20 is separated from the holder portion 17.
従って、放熱部20の外形の大きさが変化されているため、素子ブロック3を把持したときに指が放熱部20に接触し難く、素子ブロック3の着脱等の撮像装置1の取り扱い時において使用者の安全性の向上を図ることができる。
Accordingly, since the size of the outer shape of the heat radiating unit 20 is changed, it is difficult for a finger to come into contact with the heat radiating unit 20 when the element block 3 is gripped. The safety of the person can be improved.
[その他]
上記には、素子ブロック3の表面に露出された放熱部20の例を示したが、例えば、図9に示すように、覆い部30の内側に位置された放熱部20Xを設けることも可能である。放熱部20Xの外側には覆い部30が位置され、覆い部30の内側に放熱部20Xが覆い部30と非接触の状態で位置されている。 [Others]
Although the example of theheat radiating part 20 exposed on the surface of the element block 3 has been described above, for example, as shown in FIG. 9, it is possible to provide a heat radiating part 20X located inside the cover part 30. is there. The cover part 30 is located outside the heat radiating part 20 </ b> X, and the heat radiating part 20 </ b> X is located inside the cover part 30 in a non-contact state with the cover part 30.
上記には、素子ブロック3の表面に露出された放熱部20の例を示したが、例えば、図9に示すように、覆い部30の内側に位置された放熱部20Xを設けることも可能である。放熱部20Xの外側には覆い部30が位置され、覆い部30の内側に放熱部20Xが覆い部30と非接触の状態で位置されている。 [Others]
Although the example of the
このように放熱部20Xの外側に覆い部30が放熱部20Xと非接触の状態で位置されることにより、放熱部20Xから放出される熱が覆い部30に伝達され難く、覆い部30に指が接触したときに熱さを感じ難く、素子ブロック3の着脱作業等の撮像装置1の取り扱い時において使用者の安全性を確保した上で良好な放熱性を確保することができる。
As described above, the cover part 30 is positioned outside the heat dissipation part 20X in a non-contact state with the heat dissipation part 20X, so that heat released from the heat dissipation part 20X is not easily transmitted to the cover part 30, and It is difficult to feel the heat when touching, and it is possible to ensure good heat dissipation while ensuring the safety of the user during handling of the imaging device 1 such as the attaching / detaching operation of the element block 3.
[放熱部の変形例]
以下に、放熱部の各変形例について説明する(図10乃至図14参照)。 [Modification of heat dissipation part]
Below, each modification of a thermal radiation part is demonstrated (refer FIG. 10 thru | or FIG. 14).
以下に、放熱部の各変形例について説明する(図10乃至図14参照)。 [Modification of heat dissipation part]
Below, each modification of a thermal radiation part is demonstrated (refer FIG. 10 thru | or FIG. 14).
第1の変形例に係る放熱部20Aは、図10に示すように、円環状の前側結合部20aと、円環状の後側結合部20bと、前側結合部20aと後側結合部20bの間に設けられた複数の放熱フィン20d、20d、・・・とが一体に形成されて成り、放熱フィン20d、20d、・・・が後方へ行くに従って周方向における一方に変位するように傾斜されている。
As shown in FIG. 10, the heat dissipating part 20 </ b> A according to the first modification includes an annular front coupling part 20 a, an annular rear coupling part 20 b, and between the front coupling part 20 a and the rear coupling part 20 b. Are integrally formed, and the heat dissipating fins 20d, 20d,... Are inclined so as to displace to one side in the circumferential direction as they go backward. Yes.
このように放熱フィン20d、20d、・・・が周方向において変位するように傾斜されることにより、放熱フィン20d、20d、・・・の長さが長くなり、空気の良好な流動状態を確保した上で放熱面積を大きくすることが可能になるため、撮像素子22の駆動時における放熱性の向上を図ることができる。
In this way, the radiating fins 20d, 20d,... Are inclined so as to be displaced in the circumferential direction, thereby increasing the length of the radiating fins 20d, 20d,. In addition, since it is possible to increase the heat dissipation area, it is possible to improve the heat dissipation when the image sensor 22 is driven.
第2の変形例に係る放熱部20Bは、図11に示すように、前後に離隔して位置された円環状の放熱フィン20e、20e、・・・と放熱フィン20e、20e、・・・を連結する連結部20f、20f、・・・とから成り、放熱フィン20e、20e、・・・の径が後方に位置するほど小さくされている。
As shown in FIG. 11, the heat dissipating part 20B according to the second modification includes annular heat dissipating fins 20e, 20e,... And heat dissipating fins 20e, 20e,. It consists of connecting parts 20f, 20f,... To be connected, and the diameter of the heat radiation fins 20e, 20e,.
このように円環状の放熱フィン20e、20e、・・・が設けられることにより、空気の良好な流動状態を確保した上で放熱面積を大きくすることが可能になるため、撮像素子22の駆動時における放熱性の向上を図ることができる。
Since the annular radiating fins 20e, 20e,... Are provided in this way, it is possible to increase the heat radiating area while ensuring a good air flow state. The heat dissipation in can be improved.
第3の変形例に係る放熱部20Cは、図12に示すように、前後方向における幅が広くされた環状かつ板状の放熱フィン20gを有している。放熱フィン20gの前後にはそれぞれホルダー部17と着脱部18の間にそれぞれ空気が流動される間隙31、31が形成されている。
As shown in FIG. 12, the heat dissipating part 20C according to the third modification has an annular and plate-shaped heat dissipating fin 20g having a wide width in the front-rear direction. Between the heat radiating fins 20g, gaps 31 and 31 are formed between the holder portion 17 and the detachable portion 18, respectively, in which air flows.
このように前後方向における幅が広くされた環状の放熱フィン20gが設けられることにより、簡素な構造により撮像素子22の駆動時における良好な放熱性を確保することができる。
By providing the annular heat dissipating fins 20g having a wide width in the front-rear direction in this way, it is possible to ensure good heat dissipation during driving of the image sensor 22 with a simple structure.
尚、第3の変形例に係る放熱部20Cにおいては、前後方向における幅が広くされた環状の一つの放熱フィン20gに代えて前後方向において分離された環状の複数の放熱フィンを用いることも可能である。
In the heat radiating portion 20C according to the third modification, a plurality of annular radiating fins separated in the front-rear direction can be used instead of the single radiating fin 20g having a wide width in the front-rear direction. It is.
第4の変形例に係る放熱部20Dは、図13に示すように、円環状の前側結合部20aと、円環状の後側結合部20bと、前側結合部20aと後側結合部20bの間に設けられた格子状の放熱フィン20hとが一体に形成されて成る。
As shown in FIG. 13, the heat dissipating part 20D according to the fourth modification includes an annular front coupling part 20a, an annular rear coupling part 20b, and between the front coupling part 20a and the rear coupling part 20b. And a grid-like heat radiation fin 20h provided integrally with each other.
このように格子状の放熱フィン20hが設けられることにより、空気の良好な流動状態を確保した上で放熱面積を大きくすることが可能になるため、撮像素子22の駆動時における放熱性の向上を図ることができる。
By providing the lattice-shaped heat radiation fins 20h in this manner, it is possible to increase the heat radiation area while ensuring a good flow state of air, so that the heat radiation performance at the time of driving the image sensor 22 can be improved. You can plan.
第5の変形例に係る放熱部20Eは、図14に示すように、円環状の前側結合部20aと、円環状の後側結合部20bと、前側結合部20aと後側結合部20bの間に設けられた網目状の放熱フィン20iとが一体に形成されて成る。
As shown in FIG. 14, the heat dissipating part 20E according to the fifth modification includes an annular front coupling part 20a, an annular rear coupling part 20b, and between the front coupling part 20a and the rear coupling part 20b. And a net-like heat dissipating fin 20i provided integrally with each other.
このように網目状の放熱フィン20iが設けられることにより、空気の良好な流動状態を確保した上で放熱面積を大きくすることが可能になるため、撮像素子22の駆動時における放熱性の向上を図ることができる。
By providing the net-like heat radiation fins 20i in this way, it is possible to increase the heat radiation area while ensuring a good flow state of air, so that the heat radiation performance at the time of driving the image sensor 22 can be improved. Can be planned.
尚、上記した放熱部20、20X、20A、20B、20C、20D、20Eは何れも着脱部18の外周側に位置されており、放熱部20、20X、20A、20B、20C、20D、20Eの裏面と着脱部18の表面との間に空間が存在していることが望ましい。
In addition, all the above-mentioned heat radiating parts 20, 20X, 20A, 20B, 20C, 20D, 20E are located on the outer peripheral side of the detachable part 18, and the heat radiating parts 20, 20X, 20A, 20B, 20C, 20D, 20E It is desirable that a space exists between the back surface and the surface of the detachable portion 18.
放熱部20、20X、20A、20B、20C、20D、20Eの裏面と着脱部18の表面との間に空間が存在していることにより、放熱部20、20X、20A、20B、20C、20D、20Eの裏面も放熱面として機能すると共に空気の流動性が高くなり、放熱性の一層の向上を図ることができる。
Since there is a space between the back surface of the heat dissipating part 20, 20X, 20A, 20B, 20C, 20D, 20E and the surface of the detachable part 18, the heat dissipating part 20, 20X, 20A, 20B, 20C, 20D, The back surface of 20E also functions as a heat radiating surface, and the air fluidity is increased, so that the heat radiating property can be further improved.
[撮像装置の他の構成例]
以下に、撮像装置の他の構成例について説明する。 [Another configuration example of the imaging apparatus]
Hereinafter, another configuration example of the imaging apparatus will be described.
以下に、撮像装置の他の構成例について説明する。 [Another configuration example of the imaging apparatus]
Hereinafter, another configuration example of the imaging apparatus will be described.
第1の構成例である撮像装置1Aは装置本体2Aと素子ブロック3によって構成されている(図15参照)。尚、撮像装置1Aは装置本体2Aと素子ブロック3に加え、交換レンズ4を含めて構成されていてもよい。この場合に、交換レンズ4が素子ブロック3に着脱可能とされていてもよい。また、撮像装置1Aは装置本体2Aに素子ブロック3が一体に形成されていてもよく、この場合には素子ブロック3の各部であるホルダー部17、撮像ユニット19及び放熱部20が装置本体2Aの構成の一部とされる。
An image pickup apparatus 1A, which is a first configuration example, includes an apparatus body 2A and an element block 3 (see FIG. 15). The imaging device 1A may be configured to include the interchangeable lens 4 in addition to the device main body 2A and the element block 3. In this case, the interchangeable lens 4 may be detachable from the element block 3. Further, in the imaging apparatus 1A, the element block 3 may be integrally formed with the apparatus main body 2A. In this case, the holder unit 17, the imaging unit 19, and the heat radiating unit 20 which are each part of the element block 3 are included in the apparatus main body 2A. Part of the configuration.
装置本体2Aは筐体5Aと筐体5Aの各部に配置された各種の操作部6、6、・・・とを有している。
The apparatus main body 2A has a housing 5A and various operation units 6, 6,... Arranged in each part of the housing 5A.
筐体5Aには環状のガード部9Aとガード部9Aの右端に連続されたホールド部11Aとを有している。
The housing 5A has an annular guard portion 9A and a hold portion 11A continuous to the right end of the guard portion 9A.
ガード部9Aの内側の空間は円形状の挿通孔15aとして形成されている。筐体5Aには挿通孔15aの真後ろの位置に取付部10aが設けられている。筐体5Aには挿通孔15aより後側に上下方向に貫通された空間が形成され、これらの各空間が排出孔15b、15bとされている。
The space inside the guard portion 9A is formed as a circular insertion hole 15a. A mounting portion 10a is provided in the housing 5A at a position directly behind the insertion hole 15a. In the housing 5A, a space penetrating in the vertical direction is formed on the rear side of the insertion hole 15a, and these spaces serve as discharge holes 15b and 15b.
素子ブロック3が装置本体2Aに取り付けられた状態においては、放熱部20がガード部9Aの前面15cより後側に位置され、放熱部20の上下にそれぞれ排出孔15b、15bが位置される。また、素子ブロック3が装置本体2Aに取り付けられた状態においては、素子ブロック3はホルダー部17の少なくとも一部がガード部9Aから前方に突出されている。
In the state where the element block 3 is attached to the apparatus main body 2A, the heat dissipating part 20 is located behind the front surface 15c of the guard part 9A, and the discharge holes 15b and 15b are located above and below the heat dissipating part 20, respectively. In the state where the element block 3 is attached to the apparatus main body 2A, at least a part of the holder portion 17 of the element block 3 protrudes forward from the guard portion 9A.
上記のように構成された撮像装置1Aにおいて、撮像素子22の駆動時に発生し放熱部20から放出される熱は、主に、装置本体2Aに形成された排出孔15b、15bから装置本体2Aの外部へ排出される。
In the imaging apparatus 1A configured as described above, the heat generated when the imaging element 22 is driven and released from the heat radiating unit 20 is mainly from the discharge holes 15b and 15b formed in the apparatus body 2A. It is discharged outside.
このように装置本体2Aには放熱部20から放出された熱を排出する排出孔15b、15bが形成されているため、放熱部20から放出された熱が排出孔15b、15bから装置本体2Aの外部に確実に排出される。従って、装置本体2Aに熱が伝達され難く装置本体2Aが高温になることがなく、撮像素子22及び装置本体2Aの温度上昇が抑制されて撮像素子22及び装置本体2Aの良好な動作状態を確保することができる。
As described above, since the apparatus body 2A is formed with the discharge holes 15b and 15b for discharging the heat released from the heat radiating section 20, the heat released from the heat radiating section 20 is transferred from the discharge holes 15b and 15b to the apparatus main body 2A. It is reliably discharged outside. Therefore, heat is not easily transmitted to the apparatus main body 2A, and the apparatus main body 2A does not reach a high temperature, and the temperature rise of the image pickup element 22 and the apparatus main body 2A is suppressed, and a good operating state of the image pickup element 22 and the apparatus main body 2A is ensured. can do.
また、装置本体2Aには素子ブロック3を挟んで反対側に位置された排出孔15b、15bが形成されているため、放熱部20から放出された熱が素子ブロック3の両側から装置本体2Aの外部に排出され、撮像素子22及び装置本体2Aの温度上昇が一層抑制されて撮像素子22及び装置本体2Aの一層良好な動作状態を確保することができる。
Further, since the apparatus main body 2A is formed with discharge holes 15b and 15b positioned on the opposite side across the element block 3, the heat released from the heat radiating portion 20 is transmitted from both sides of the element block 3 to the apparatus main body 2A. It is discharged to the outside, and the temperature rise of the image sensor 22 and the apparatus main body 2A is further suppressed, and a more favorable operation state of the image sensor 22 and the apparatus main body 2A can be secured.
特に、放熱部20から発生する熱は上方に移動され易いが、上記のように、一方の排出孔15bが放熱部20の上方に位置されていることにより、放熱部20から放出される熱の良好の排出性能を確保することができる。
In particular, although the heat generated from the heat radiating part 20 is easily moved upward, as described above, the one discharge hole 15b is located above the heat radiating part 20, so that the heat released from the heat radiating part 20 is reduced. Good discharge performance can be ensured.
第2の構成例である撮像装置1Bは装置本体2Bと素子ブロック3によって構成されている(図16参照)。尚、撮像装置1Bは装置本体2Bと素子ブロック3に加え、交換レンズ4を含めて構成されていてもよい。この場合に、交換レンズ4が素子ブロック3に着脱可能とされていてもよい。また、撮像装置1Bは装置本体2Bに素子ブロック3が一体に形成されていてもよく、この場合には素子ブロック3の各部であるホルダー部17、撮像ユニット19及び放熱部20が装置本体2Bの構成の一部とされる。
The imaging apparatus 1B as the second configuration example is configured by the apparatus main body 2B and the element block 3 (see FIG. 16). Note that the imaging apparatus 1B may include an interchangeable lens 4 in addition to the apparatus main body 2B and the element block 3. In this case, the interchangeable lens 4 may be detachable from the element block 3. Further, in the imaging apparatus 1B, the element block 3 may be integrally formed with the apparatus main body 2B. In this case, the holder unit 17, the imaging unit 19, and the heat radiating unit 20 which are each part of the element block 3 are included in the apparatus main body 2B. Part of the configuration.
装置本体2Bは筐体5Bと筐体5Bの各部に配置された各種の操作部6、6、・・・とを有している。
The apparatus main body 2B has a housing 5B and various operation units 6, 6,... Arranged in each part of the housing 5B.
筐体5Bにはガード部9Bとガード部9Bから突出した状態で設けられたホールド部11Bとを有している。
The housing 5B has a guard portion 9B and a hold portion 11B provided in a state protruding from the guard portion 9B.
筐体5Bには素子ブロック3が挿通される図示しない円形状の挿通孔と素子ブロック3Bの放熱部20から放出される熱を排出する排出孔15b、15bが形成されている。排出孔15b、15bは左右に貫通され左右に離隔して位置されている。尚、排出孔15bは放熱部20の周囲の任意の位置に形成されていればよく、例えば、放熱部20の上方又は下方の少なくとも一方に位置されていてもよい。
The housing 5B is formed with a circular insertion hole (not shown) through which the element block 3 is inserted, and discharge holes 15b and 15b for discharging heat released from the heat radiation portion 20 of the element block 3B. The discharge holes 15b and 15b are penetrated to the left and right and are spaced apart to the left and right. In addition, the discharge hole 15b should just be formed in the arbitrary positions around the thermal radiation part 20, for example, may be located in at least one of the upper direction of the thermal radiation part 20, or the downward direction.
装置本体2Bにはアダプター32が着脱可能とされている。アダプター32には、例えば、各種の接続端子33、33、・・・が設けられている。接続端子33、33、・・・にそれぞれ所定の接続コードを接続することによりアダプター32を介して撮像装置1Bと表示装置等の外部機器との接続が可能とされている。
The adapter 32 can be attached to and detached from the apparatus main body 2B. The adapter 32 is provided with various connection terminals 33, 33,. By connecting a predetermined connection cord to each of the connection terminals 33, 33,..., Connection between the imaging device 1B and an external device such as a display device is possible via the adapter 32.
アダプター32にはビューファインダー34が着脱可能とされている。ビューファインダー34によって使用者が撮影時に被写体を確実に視認することができる。このようなビューファインダー34を有する撮像装置1Bは、特に、動画撮影用のビデオカメラとして用いることが好適である。
The viewfinder 34 can be attached to and detached from the adapter 32. The viewfinder 34 allows the user to reliably see the subject at the time of shooting. The imaging device 1B having such a viewfinder 34 is particularly preferably used as a video camera for moving image shooting.
尚、アダプター32は撮影時等に必ずしも取り付けられて使用される必要はなく、アダプター32が使用されない場合には、例えば、ビューファインダー34が装置本体2Bに着脱可能とされていてもよい。
Note that the adapter 32 is not necessarily attached and used at the time of shooting or the like. When the adapter 32 is not used, for example, the viewfinder 34 may be detachable from the apparatus main body 2B.
素子ブロック3が装置本体2Bに取り付けられた状態においては、放熱部20がガード部9Bの前面15cより後側に位置され、放熱部20の左右にそれぞれ排出孔15b、15bが位置される。また、素子ブロック3が装置本体2Bに取り付けられた状態においては、素子ブロック3はホルダー部17の少なくとも一部がガード部9Bから前方に突出されている。
In a state where the element block 3 is attached to the apparatus main body 2B, the heat radiating portion 20 is located behind the front surface 15c of the guard portion 9B, and the discharge holes 15b and 15b are located on the left and right sides of the heat radiating portion 20, respectively. When the element block 3 is attached to the apparatus main body 2B, at least a part of the holder portion 17 of the element block 3 protrudes forward from the guard portion 9B.
上記のように構成された撮像装置1Bにおいて、撮像素子22の駆動時に発生し放熱部20から放出される熱は、主に、装置本体2Bに形成された排出孔15b、15bから装置本体2Bの外部へ排出される。
In the imaging apparatus 1B configured as described above, heat generated when the imaging element 22 is driven and released from the heat radiating unit 20 is mainly from the discharge holes 15b and 15b formed in the apparatus body 2B. It is discharged outside.
このように装置本体2Bには放熱部20から放出された熱を排出する排出孔15b、15bが形成されているため、放熱部20から放出された熱が排出孔15b、15bから装置本体2Bの外部に確実に排出される。従って、装置本体2Bに熱が伝達され難く装置本体2Bが高温になることがなく、撮像素子22及び装置本体2Bの温度上昇が抑制されて撮像素子22及び装置本体2Bの良好な動作状態を確保することができる。
Thus, since the apparatus main body 2B is formed with the discharge holes 15b and 15b for discharging the heat released from the heat radiating portion 20, the heat released from the heat radiating section 20 is discharged from the discharge holes 15b and 15b to the apparatus main body 2B. It is reliably discharged outside. Therefore, heat is not easily transmitted to the apparatus main body 2B, and the apparatus main body 2B does not reach a high temperature, and the temperature rises of the image pickup element 22 and the apparatus main body 2B are suppressed, and a favorable operating state of the image pickup element 22 and the apparatus main body 2B is ensured. can do.
また、装置本体2Bには素子ブロック3を挟んで反対側に位置された排出孔15b、15bが形成されているため、放熱部20から放出された熱が素子ブロック3の両側から装置本体2Bの外部に排出され、撮像素子22及び装置本体2Bの温度上昇が一層抑制されて撮像素子22及び装置本体2Bの一層良好な動作状態を確保することができる。
Further, since the apparatus main body 2B is formed with discharge holes 15b and 15b positioned on the opposite side across the element block 3, the heat released from the heat radiating portion 20 is generated from both sides of the element block 3 on the apparatus main body 2B. It is discharged to the outside, and the temperature rises of the image sensor 22 and the apparatus main body 2B are further suppressed, and a better operating state of the image sensor 22 and the apparatus main body 2B can be secured.
[撮像装置の一実施形態]
図17に、本技術撮像装置の一実施形態のブロック図を示す。 [One Embodiment of Imaging Device]
FIG. 17 shows a block diagram of an embodiment of the imaging device of the present technology.
図17に、本技術撮像装置の一実施形態のブロック図を示す。 [One Embodiment of Imaging Device]
FIG. 17 shows a block diagram of an embodiment of the imaging device of the present technology.
撮像装置1は、例えば、装置本体2と素子ブロック3を有し、素子ブロック3に交換レンズ4が取り付けられて使用される。
The imaging device 1 has, for example, a device main body 2 and an element block 3, and the interchangeable lens 4 is attached to the element block 3 for use.
装置本体2は所定の信号処理を行うカメラ信号処理部51と、画像信号の記録再生処理を行う画像処理部52とを有している。また、装置本体2は、撮影された画像等を表示する表示部53(ディスプレイ12)と、メモリー60への画像信号の書込及び読出を行うR/W(リーダ/ライタ)54と、撮像装置1の全体を制御するCPU(Central Processing Unit)55と、使用者によって所要の操作が行われる各種のスイッチ等の操作部56(操作部6)と、交換レンズ4に設けられたレンズ群26の駆動を制御するレンズ駆動制御部57とを有している。
The apparatus main body 2 includes a camera signal processing unit 51 that performs predetermined signal processing and an image processing unit 52 that performs recording and reproduction processing of image signals. In addition, the apparatus main body 2 includes a display unit 53 (display 12) that displays captured images and the like, an R / W (reader / writer) 54 that writes and reads image signals to and from the memory 60, and an imaging apparatus. A central processing unit (CPU) 55 that controls the entire system 1, an operation unit 56 (operation unit 6) such as various switches that are operated by a user, and a lens group 26 provided in the interchangeable lens 4. And a lens drive control unit 57 that controls driving.
カメラ信号処理部51は、撮像素子22からの出力信号に対するノイズ除去、画質補正、輝度・色差信号への変換等の各種の信号処理を行う。
The camera signal processing unit 51 performs various signal processing such as noise removal, image quality correction, and conversion to luminance / color difference signals on the output signal from the image sensor 22.
画像処理部52は、所定の画像データフォーマットに基づく画像信号の圧縮符号化・伸張復号化処理や解像度等のデータ仕様の変換処理等を行う。
The image processing unit 52 performs compression encoding / decompression decoding processing of an image signal based on a predetermined image data format, conversion processing of data specifications such as resolution, and the like.
表示部53は使用者の操作部56に対する操作状態や撮影した画像等の各種のデータを表示する機能を有している。
The display unit 53 has a function of displaying various data such as an operation state of the user operation unit 56 and a photographed image.
R/W54は、画像処理部52によって符号化された画像データのメモリー60への書込及びメモリー60に記録された画像データの読出を行う。
The R / W 54 writes the image data encoded by the image processing unit 52 into the memory 60 and reads out the image data recorded in the memory 60.
CPU55は、撮像装置1の各部を制御する制御処理部として機能し、操作部56からの指示入力信号等に基づいて各部を制御する。
The CPU 55 functions as a control processing unit that controls each unit of the imaging apparatus 1 and controls each unit based on an instruction input signal or the like from the operation unit 56.
操作部56は使用者による操作に応じた指示入力信号をCPU55に対して出力する。
The operation unit 56 outputs an instruction input signal corresponding to the operation by the user to the CPU 55.
レンズ駆動制御部57は、CPU55からの制御信号に基づいてレンズ群26の各レンズを駆動する駆動源を制御する。
The lens drive control unit 57 controls a drive source that drives each lens of the lens group 26 based on a control signal from the CPU 55.
メモリー60は、例えば、R/W54に接続されたスロットに対して着脱可能な半導体メモリーである。
The memory 60 is a semiconductor memory that can be attached to and detached from a slot connected to the R / W 54, for example.
以下に、撮像装置1における動作を説明する。
Hereinafter, the operation of the imaging apparatus 1 will be described.
撮影の待機状態では、CPU55による制御の下で、撮影された画像信号がカメラ信号処理部51を介して表示部53に出力され、カメラスルー画像として表示される。また、操作部56からのズーミングのための指示入力信号が入力されると、CPU55がレンズ駆動制御部57に制御信号を出力し、レンズ駆動制御部57の制御に基づいてレンズ群26の所定のレンズが移動される。
In the shooting standby state, the captured image signal is output to the display unit 53 via the camera signal processing unit 51 and displayed as a camera-through image under the control of the CPU 55. When an instruction input signal for zooming is input from the operation unit 56, the CPU 55 outputs a control signal to the lens drive control unit 57, and a predetermined lens group 26 is controlled based on the control of the lens drive control unit 57. The lens is moved.
操作部56からの指示入力信号により撮影が開始されると、撮影された画像信号がカメラ信号処理部51から画像処理部52に出力されて圧縮符号化処理され、所定のデータフォーマットのデジタルデータに変換される。変換されたデータはR/W54に出力され、メモリー60に書き込まれる。
When photographing is started by an instruction input signal from the operation unit 56, the photographed image signal is output from the camera signal processing unit 51 to the image processing unit 52, subjected to compression coding processing, and converted into digital data of a predetermined data format. Converted. The converted data is output to the R / W 54 and written to the memory 60.
フォーカシングはCPU55からの制御信号に基づいてレンズ駆動制御部57がレンズ群26の所定のレンズを移動させることにより行われる。
Focusing is performed when the lens drive control unit 57 moves a predetermined lens of the lens group 26 based on a control signal from the CPU 55.
メモリー60に記録された画像データを再生する場合には、操作部56に対する操作に応じて、R/W54によってメモリー60から所定の画像データが読み出され、画像処理部52によって伸張復号化処理が行われた後に、再生画像信号が表示部53に出力されて再生画像が表示される。
When the image data recorded in the memory 60 is reproduced, predetermined image data is read from the memory 60 by the R / W 54 in accordance with an operation on the operation unit 56, and decompression decoding processing is performed by the image processing unit 52. After being performed, the reproduced image signal is output to the display unit 53 to display the reproduced image.
[本技術]
本技術は、以下のような構成にすることもできる。 [Technology]
The present technology may be configured as follows.
本技術は、以下のような構成にすることもできる。 [Technology]
The present technology may be configured as follows.
(1)
操作部が配置された装置本体を備え、
前記装置本体の撮影時における被写体側の端面を前面とした場合に、
撮像素子の駆動時に発生する熱を放出する放熱部が前記装置本体の前記前面より後側に位置され、
前記装置本体に前記放熱部の少なくとも一部を覆うガード部が設けられた
撮像装置。 (1)
It has a device main body with an operation unit,
When the end surface on the subject side at the time of shooting of the apparatus body is the front surface,
A heat dissipating part that releases heat generated when the image sensor is driven is positioned behind the front surface of the apparatus body;
An imaging apparatus, wherein a guard portion that covers at least a part of the heat radiating portion is provided in the apparatus main body.
操作部が配置された装置本体を備え、
前記装置本体の撮影時における被写体側の端面を前面とした場合に、
撮像素子の駆動時に発生する熱を放出する放熱部が前記装置本体の前記前面より後側に位置され、
前記装置本体に前記放熱部の少なくとも一部を覆うガード部が設けられた
撮像装置。 (1)
It has a device main body with an operation unit,
When the end surface on the subject side at the time of shooting of the apparatus body is the front surface,
A heat dissipating part that releases heat generated when the image sensor is driven is positioned behind the front surface of the apparatus body;
An imaging apparatus, wherein a guard portion that covers at least a part of the heat radiating portion is provided in the apparatus main body.
(2)
前記放熱部と前記撮像素子を有する素子ブロックが設けられ、
前記素子ブロックが前記装置本体に着脱可能とされた
前記(1)に記載の撮像装置。 (2)
An element block having the heat radiating portion and the imaging element is provided,
The imaging device according to (1), wherein the element block is detachable from the apparatus main body.
前記放熱部と前記撮像素子を有する素子ブロックが設けられ、
前記素子ブロックが前記装置本体に着脱可能とされた
前記(1)に記載の撮像装置。 (2)
An element block having the heat radiating portion and the imaging element is provided,
The imaging device according to (1), wherein the element block is detachable from the apparatus main body.
(3)
前記ガード部には前記素子ブロックの着脱時に前記素子ブロックが挿通される挿通孔が形成された
前記(2)に記載の撮像装置。 (3)
The imaging device according to (2), wherein the guard portion has an insertion hole through which the element block is inserted when the element block is attached or detached.
前記ガード部には前記素子ブロックの着脱時に前記素子ブロックが挿通される挿通孔が形成された
前記(2)に記載の撮像装置。 (3)
The imaging device according to (2), wherein the guard portion has an insertion hole through which the element block is inserted when the element block is attached or detached.
(4)
前記素子ブロックが前記装置本体に取り付けられた状態において前記素子ブロックの少なくとも一部が前記挿通孔に挿入され、
前記ガード部の内周面と前記素子ブロックの外周面との間に隙間が形成された
前記(3)に記載の撮像装置。 (4)
In a state where the element block is attached to the apparatus main body, at least a part of the element block is inserted into the insertion hole,
The imaging device according to (3), wherein a gap is formed between an inner peripheral surface of the guard part and an outer peripheral surface of the element block.
前記素子ブロックが前記装置本体に取り付けられた状態において前記素子ブロックの少なくとも一部が前記挿通孔に挿入され、
前記ガード部の内周面と前記素子ブロックの外周面との間に隙間が形成された
前記(3)に記載の撮像装置。 (4)
In a state where the element block is attached to the apparatus main body, at least a part of the element block is inserted into the insertion hole,
The imaging device according to (3), wherein a gap is formed between an inner peripheral surface of the guard part and an outer peripheral surface of the element block.
(5)
前記装置本体に前記放熱部から放出される熱を外部に排出する排出孔が形成された
前記(2)から前記(4)の何れかに記載の撮像装置。 (5)
The imaging apparatus according to any one of (2) to (4), wherein a discharge hole for discharging heat released from the heat radiating unit to the outside is formed in the apparatus main body.
前記装置本体に前記放熱部から放出される熱を外部に排出する排出孔が形成された
前記(2)から前記(4)の何れかに記載の撮像装置。 (5)
The imaging apparatus according to any one of (2) to (4), wherein a discharge hole for discharging heat released from the heat radiating unit to the outside is formed in the apparatus main body.
(6)
前記装置本体に複数の前記排出孔が形成され、
前記排出孔が少なくとも前記素子ブロックを挟んで反対側に位置された
前記(5)に記載の撮像装置。 (6)
A plurality of the discharge holes are formed in the apparatus body,
The imaging device according to (5), wherein the discharge hole is positioned on the opposite side at least across the element block.
前記装置本体に複数の前記排出孔が形成され、
前記排出孔が少なくとも前記素子ブロックを挟んで反対側に位置された
前記(5)に記載の撮像装置。 (6)
A plurality of the discharge holes are formed in the apparatus body,
The imaging device according to (5), wherein the discharge hole is positioned on the opposite side at least across the element block.
(7)
前記素子ブロックには内部に前記撮像素子を保持するホルダー部が設けられ、
前記放熱部が前記ホルダー部から離隔するに従って外形が小さくなる形状に形成された
前記(2)から前記(6)の何れかに記載の撮像装置。 (7)
The element block is provided with a holder portion for holding the image sensor inside,
The imaging device according to any one of (2) to (6), wherein an outer shape is reduced as the heat dissipation unit is separated from the holder unit.
前記素子ブロックには内部に前記撮像素子を保持するホルダー部が設けられ、
前記放熱部が前記ホルダー部から離隔するに従って外形が小さくなる形状に形成された
前記(2)から前記(6)の何れかに記載の撮像装置。 (7)
The element block is provided with a holder portion for holding the image sensor inside,
The imaging device according to any one of (2) to (6), wherein an outer shape is reduced as the heat dissipation unit is separated from the holder unit.
(8)
前記放熱部が環状に形成され、
前記放熱部の周方向における全体に放熱フィンが設けられた
前記(2)から前記(7)の何れかに記載の撮像装置。 (8)
The heat radiating part is formed in an annular shape,
The imaging device according to any one of (2) to (7), wherein a radiation fin is provided on the entire circumferential direction of the radiation unit.
前記放熱部が環状に形成され、
前記放熱部の周方向における全体に放熱フィンが設けられた
前記(2)から前記(7)の何れかに記載の撮像装置。 (8)
The heat radiating part is formed in an annular shape,
The imaging device according to any one of (2) to (7), wherein a radiation fin is provided on the entire circumferential direction of the radiation unit.
(9)
前記放熱部の外側に前記放熱部を覆う覆い部が設けられ、
前記放熱部と前記覆い部が非接触の状態で位置された
前記(2)から前記(8)の何れかに記載の撮像装置。 (9)
A cover for covering the heat dissipation part is provided outside the heat dissipation part,
The imaging device according to any one of (2) to (8), wherein the heat dissipating part and the covering part are positioned in a non-contact state.
前記放熱部の外側に前記放熱部を覆う覆い部が設けられ、
前記放熱部と前記覆い部が非接触の状態で位置された
前記(2)から前記(8)の何れかに記載の撮像装置。 (9)
A cover for covering the heat dissipation part is provided outside the heat dissipation part,
The imaging device according to any one of (2) to (8), wherein the heat dissipating part and the covering part are positioned in a non-contact state.
(10)
交換レンズが前記素子ブロックに着脱可能とされた
前記(2)から前記(9)の何れかに記載の撮像装置。 (10)
The imaging device according to any one of (2) to (9), wherein an interchangeable lens is detachably attached to the element block.
交換レンズが前記素子ブロックに着脱可能とされた
前記(2)から前記(9)の何れかに記載の撮像装置。 (10)
The imaging device according to any one of (2) to (9), wherein an interchangeable lens is detachably attached to the element block.
(11)
操作部が配置された装置本体と、
撮像素子と前記撮像素子の駆動時に発生する熱を放出する放熱部とを有する素子ブロックとを備え、
前記装置本体の撮影時における被写体側の端面を前面とした場合に、
前記放熱部が前記装置本体の前記前面より後側に位置され、
前記装置本体に前記放熱部の少なくとも一部を覆うガード部が設けられた
撮像装置。 (11)
An apparatus body in which an operation unit is arranged;
An element block having an image sensor and a heat radiating part that releases heat generated when the image sensor is driven;
When the end surface on the subject side at the time of shooting of the apparatus body is the front surface,
The heat dissipating part is located on the rear side of the front surface of the apparatus body;
An imaging apparatus, wherein a guard portion that covers at least a part of the heat radiating portion is provided in the apparatus main body.
操作部が配置された装置本体と、
撮像素子と前記撮像素子の駆動時に発生する熱を放出する放熱部とを有する素子ブロックとを備え、
前記装置本体の撮影時における被写体側の端面を前面とした場合に、
前記放熱部が前記装置本体の前記前面より後側に位置され、
前記装置本体に前記放熱部の少なくとも一部を覆うガード部が設けられた
撮像装置。 (11)
An apparatus body in which an operation unit is arranged;
An element block having an image sensor and a heat radiating part that releases heat generated when the image sensor is driven;
When the end surface on the subject side at the time of shooting of the apparatus body is the front surface,
The heat dissipating part is located on the rear side of the front surface of the apparatus body;
An imaging apparatus, wherein a guard portion that covers at least a part of the heat radiating portion is provided in the apparatus main body.
(12)
前記素子ブロックが前記装置本体に着脱可能とされた
前記(11)に記載の撮像装置。 (12)
The imaging device according to (11), wherein the element block is detachable from the apparatus main body.
前記素子ブロックが前記装置本体に着脱可能とされた
前記(11)に記載の撮像装置。 (12)
The imaging device according to (11), wherein the element block is detachable from the apparatus main body.
(13)
前記ガード部には前記素子ブロックの着脱時に前記素子ブロックが挿通される挿通孔が形成された
前記(11)又は前記(12)に記載の撮像装置。 (13)
The imaging device according to (11) or (12), wherein the guard portion is formed with an insertion hole through which the element block is inserted when the element block is attached or detached.
前記ガード部には前記素子ブロックの着脱時に前記素子ブロックが挿通される挿通孔が形成された
前記(11)又は前記(12)に記載の撮像装置。 (13)
The imaging device according to (11) or (12), wherein the guard portion is formed with an insertion hole through which the element block is inserted when the element block is attached or detached.
(14)
前記素子ブロックが前記装置本体に取り付けられた状態において前記素子ブロックの少なくとも一部が前記挿通孔に挿入され、
前記ガード部の内周面と前記素子ブロックの外周面との間に隙間が形成された
前記(13)に記載の撮像装置。 (14)
In a state where the element block is attached to the apparatus main body, at least a part of the element block is inserted into the insertion hole,
The imaging device according to (13), wherein a gap is formed between an inner peripheral surface of the guard part and an outer peripheral surface of the element block.
前記素子ブロックが前記装置本体に取り付けられた状態において前記素子ブロックの少なくとも一部が前記挿通孔に挿入され、
前記ガード部の内周面と前記素子ブロックの外周面との間に隙間が形成された
前記(13)に記載の撮像装置。 (14)
In a state where the element block is attached to the apparatus main body, at least a part of the element block is inserted into the insertion hole,
The imaging device according to (13), wherein a gap is formed between an inner peripheral surface of the guard part and an outer peripheral surface of the element block.
(15)
前記装置本体に前記放熱部から放出される熱を外部に排出する排出孔が形成された
前記(11)から前記(14)の何れかに記載の撮像装置。 (15)
The imaging apparatus according to any one of (11) to (14), wherein a discharge hole for discharging heat released from the heat radiating unit to the outside is formed in the apparatus main body.
前記装置本体に前記放熱部から放出される熱を外部に排出する排出孔が形成された
前記(11)から前記(14)の何れかに記載の撮像装置。 (15)
The imaging apparatus according to any one of (11) to (14), wherein a discharge hole for discharging heat released from the heat radiating unit to the outside is formed in the apparatus main body.
(16)
前記装置本体に複数の前記排出孔が形成され、
前記排出孔が少なくとも前記素子ブロックを挟んで反対側に位置された
前記(15)に記載の撮像装置。 (16)
A plurality of the discharge holes are formed in the apparatus body,
The imaging device according to (15), wherein the discharge hole is positioned on the opposite side at least with the element block interposed therebetween.
前記装置本体に複数の前記排出孔が形成され、
前記排出孔が少なくとも前記素子ブロックを挟んで反対側に位置された
前記(15)に記載の撮像装置。 (16)
A plurality of the discharge holes are formed in the apparatus body,
The imaging device according to (15), wherein the discharge hole is positioned on the opposite side at least with the element block interposed therebetween.
(17)
前記素子ブロックには内部に前記撮像素子を保持するホルダー部が設けられ、
前記放熱部が前記ホルダー部から離隔するに従って外形が小さくなる形状に形成された
前記(11)から前記(16)の何れかに記載の撮像装置。 (17)
The element block is provided with a holder portion for holding the image sensor inside,
The imaging device according to any one of (11) to (16), wherein an outer shape is reduced as the heat radiating portion is separated from the holder portion.
前記素子ブロックには内部に前記撮像素子を保持するホルダー部が設けられ、
前記放熱部が前記ホルダー部から離隔するに従って外形が小さくなる形状に形成された
前記(11)から前記(16)の何れかに記載の撮像装置。 (17)
The element block is provided with a holder portion for holding the image sensor inside,
The imaging device according to any one of (11) to (16), wherein an outer shape is reduced as the heat radiating portion is separated from the holder portion.
(18)
前記放熱部が環状に形成され、
前記放熱部の周方向における全体に放熱フィンが設けられた
前記(11)から前記(17)の何れかに記載の撮像装置。 (18)
The heat radiating part is formed in an annular shape,
The imaging device according to any one of (11) to (17), wherein a heat radiating fin is provided in the entire circumferential direction of the heat radiating portion.
前記放熱部が環状に形成され、
前記放熱部の周方向における全体に放熱フィンが設けられた
前記(11)から前記(17)の何れかに記載の撮像装置。 (18)
The heat radiating part is formed in an annular shape,
The imaging device according to any one of (11) to (17), wherein a heat radiating fin is provided in the entire circumferential direction of the heat radiating portion.
(19)
前記放熱部の外側に前記放熱部を覆う覆い部が設けられ、
前記放熱部と前記覆い部が非接触の状態で位置された
前記(11)から前記(18)の何れかに記載の撮像装置。 (19)
A cover for covering the heat dissipation part is provided outside the heat dissipation part,
The imaging device according to any one of (11) to (18), wherein the heat dissipating part and the covering part are positioned in a non-contact state.
前記放熱部の外側に前記放熱部を覆う覆い部が設けられ、
前記放熱部と前記覆い部が非接触の状態で位置された
前記(11)から前記(18)の何れかに記載の撮像装置。 (19)
A cover for covering the heat dissipation part is provided outside the heat dissipation part,
The imaging device according to any one of (11) to (18), wherein the heat dissipating part and the covering part are positioned in a non-contact state.
(20)
交換レンズが前記素子ブロックに着脱可能とされた
前記(11)から前記(19)の何れかに記載の撮像装置。 (20)
The imaging device according to any one of (11) to (19), wherein an interchangeable lens is detachable from the element block.
交換レンズが前記素子ブロックに着脱可能とされた
前記(11)から前記(19)の何れかに記載の撮像装置。 (20)
The imaging device according to any one of (11) to (19), wherein an interchangeable lens is detachable from the element block.
(21)
操作部が配置された装置本体に着脱可能とされ、
撮像素子と前記撮像素子を保持するホルダー部と前記撮像素子の駆動時に発生する熱を放出する放熱部とを備えた
素子ブロック。 (21)
It can be attached to and detached from the main body where the operation unit is located.
An element block comprising: an imaging element; a holder part that holds the imaging element; and a heat dissipation part that releases heat generated when the imaging element is driven.
操作部が配置された装置本体に着脱可能とされ、
撮像素子と前記撮像素子を保持するホルダー部と前記撮像素子の駆動時に発生する熱を放出する放熱部とを備えた
素子ブロック。 (21)
It can be attached to and detached from the main body where the operation unit is located.
An element block comprising: an imaging element; a holder part that holds the imaging element; and a heat dissipation part that releases heat generated when the imaging element is driven.
(22)
操作部が配置された装置本体に一体に設けられ、
撮像素子と前記撮像素子を保持するホルダー部と前記撮像素子の駆動時に発生する熱を放出する放熱部とを備えた
素子ブロック。 (22)
Provided integrally with the device body where the operation unit is located,
An element block comprising: an imaging element; a holder part that holds the imaging element; and a heat dissipation part that releases heat generated when the imaging element is driven.
操作部が配置された装置本体に一体に設けられ、
撮像素子と前記撮像素子を保持するホルダー部と前記撮像素子の駆動時に発生する熱を放出する放熱部とを備えた
素子ブロック。 (22)
Provided integrally with the device body where the operation unit is located,
An element block comprising: an imaging element; a holder part that holds the imaging element; and a heat dissipation part that releases heat generated when the imaging element is driven.
1…撮像装置、2…装置本体、3…素子ブロック、4…交換レンズ、6…操作部、9…ガード部、15a…挿通孔、15b…排出孔、15c…前面、17…ホルダー部、19…撮像ユニット、20…放熱部、20c…放熱フィン、22…撮像素子、24…隙間、20X…放熱部、30…覆い部、20A…放熱部、20d…放熱フィン、20B…放熱部、20e…放熱フィン、20C…放熱部、20g…放熱フィン、20D…放熱部、20h…放熱フィン、20E…放熱部、20i…放熱フィン、1A…撮像装置、2A…装置本体、9A…ガード部、1B…撮像装置、2B…装置本体、9B…ガード部、56…操作部
DESCRIPTION OF SYMBOLS 1 ... Imaging device, 2 ... Apparatus main body, 3 ... Element block, 4 ... Interchangeable lens, 6 ... Operation part, 9 ... Guard part, 15a ... Insertion hole, 15b ... Discharge hole, 15c ... Front surface, 17 ... Holder part, 19 DESCRIPTION OF SYMBOLS ... Imaging unit, 20 ... Radiation part, 20c ... Radiation fin, 22 ... Imaging element, 24 ... Gap, 20X ... Radiation part, 30 ... Cover part, 20A ... Radiation part, 20d ... Radiation fin, 20B ... Radiation part, 20e ... Radiation fin, 20C ... radiation part, 20g ... radiation fin, 20D ... radiation part, 20h ... radiation fin, 20E ... radiation part, 20i ... radiation fin, 1A ... imaging device, 2A ... device body, 9A ... guard part, 1B ... Imaging device, 2B ... device main body, 9B ... guard unit, 56 ... operation unit
Claims (20)
- 操作部が配置された装置本体を備え、
前記装置本体の撮影時における被写体側の端面を前面とした場合に、
撮像素子の駆動時に発生する熱を放出する放熱部が前記装置本体の前記前面より後側に位置され、
前記装置本体に前記放熱部の少なくとも一部を覆うガード部が設けられた
撮像装置。 It has a device main body with an operation unit,
When the end surface on the subject side at the time of shooting of the apparatus body is the front surface,
A heat dissipating part that releases heat generated when the image sensor is driven is positioned behind the front surface of the apparatus body;
An image pickup apparatus, wherein a guard part that covers at least a part of the heat radiating part is provided in the apparatus main body. - 前記放熱部と前記撮像素子を有する素子ブロックが設けられ、
前記素子ブロックが前記装置本体に着脱可能とされた
請求項1に記載の撮像装置。 An element block having the heat radiating portion and the imaging element is provided,
The imaging device according to claim 1, wherein the element block is detachable from the apparatus main body. - 前記ガード部には前記素子ブロックの着脱時に前記素子ブロックが挿通される挿通孔が形成された
請求項2に記載の撮像装置。 The imaging device according to claim 2, wherein an insertion hole through which the element block is inserted when the element block is attached or detached is formed in the guard portion. - 前記素子ブロックが前記装置本体に取り付けられた状態において前記素子ブロックの少なくとも一部が前記挿通孔に挿入され、
前記ガード部の内周面と前記素子ブロックの外周面との間に隙間が形成された
請求項3に記載の撮像装置。 In a state where the element block is attached to the apparatus main body, at least a part of the element block is inserted into the insertion hole,
The imaging device according to claim 3, wherein a gap is formed between an inner peripheral surface of the guard part and an outer peripheral surface of the element block. - 前記装置本体に前記放熱部から放出される熱を外部に排出する排出孔が形成された
請求項1に記載の撮像装置。 The imaging apparatus according to claim 1, wherein a discharge hole for discharging heat released from the heat radiating unit to the outside is formed in the apparatus main body. - 前記装置本体に複数の前記排出孔が形成され、
前記排出孔が少なくとも前記素子ブロックを挟んで反対側に位置された
請求項5に記載の撮像装置。 A plurality of the discharge holes are formed in the apparatus body,
The imaging device according to claim 5, wherein the discharge hole is positioned on the opposite side with at least the element block interposed therebetween. - 前記素子ブロックには内部に前記撮像素子を保持するホルダー部が設けられ、
前記放熱部が前記ホルダー部から離隔するに従って外形が小さくなる形状に形成された
請求項2に記載の撮像装置。 The element block is provided with a holder portion for holding the image sensor inside,
The imaging device according to claim 2, wherein the outer shape of the heat radiating portion is reduced as the distance from the holder portion decreases. - 前記放熱部が環状に形成され、
前記放熱部の周方向における全体に放熱フィンが設けられた
請求項1に記載の撮像装置。 The heat radiating part is formed in an annular shape,
The imaging device according to claim 1, wherein a heat radiating fin is provided over the entire circumferential direction of the heat radiating portion. - 前記放熱部の外側に前記放熱部を覆う覆い部が設けられ、
前記放熱部と前記覆い部が非接触の状態で位置された
請求項1に記載の撮像装置。 A cover for covering the heat dissipation part is provided outside the heat dissipation part,
The imaging device according to claim 1, wherein the heat dissipating part and the covering part are positioned in a non-contact state. - 交換レンズが前記素子ブロックに着脱可能とされた
請求項2に記載の撮像装置。 The imaging device according to claim 2, wherein an interchangeable lens is detachable from the element block. - 操作部が配置された装置本体と、
撮像素子と前記撮像素子の駆動時に発生する熱を放出する放熱部とを有する素子ブロックとを備え、
前記装置本体の撮影時における被写体側の端面を前面とした場合に、
前記放熱部が前記装置本体の前記前面より後側に位置され、
前記装置本体に前記放熱部の少なくとも一部を覆うガード部が設けられた
撮像装置。 An apparatus body in which an operation unit is arranged;
An element block having an image sensor and a heat radiating part that releases heat generated when the image sensor is driven;
When the end surface on the subject side at the time of shooting of the apparatus body is the front surface,
The heat dissipating part is located on the rear side of the front surface of the apparatus body;
An imaging apparatus, wherein a guard portion that covers at least a part of the heat radiating portion is provided in the apparatus main body. - 前記素子ブロックが前記装置本体に着脱可能とされた
請求項11に記載の撮像装置。 The imaging device according to claim 11, wherein the element block is detachable from the apparatus main body. - 前記ガード部には前記素子ブロックの着脱時に前記素子ブロックが挿通される挿通孔が形成された
請求項11に記載の撮像装置。 The imaging device according to claim 11, wherein an insertion hole through which the element block is inserted when the element block is attached or detached is formed in the guard portion. - 前記素子ブロックが前記装置本体に取り付けられた状態において前記素子ブロックの少なくとも一部が前記挿通孔に挿入され、
前記ガード部の内周面と前記素子ブロックの外周面との間に隙間が形成された
請求項13に記載の撮像装置。 In a state where the element block is attached to the apparatus main body, at least a part of the element block is inserted into the insertion hole,
The imaging device according to claim 13, wherein a gap is formed between an inner peripheral surface of the guard portion and an outer peripheral surface of the element block. - 前記装置本体に前記放熱部から放出される熱を外部に排出する排出孔が形成された
請求項11に記載の撮像装置。 The imaging apparatus according to claim 11, wherein a discharge hole for discharging heat released from the heat radiating unit to the outside is formed in the apparatus main body. - 前記装置本体に複数の前記排出孔が形成され、
前記排出孔が少なくとも前記素子ブロックを挟んで反対側に位置された
請求項15に記載の撮像装置。 A plurality of the discharge holes are formed in the apparatus body,
The imaging device according to claim 15, wherein the discharge hole is positioned on the opposite side with at least the element block interposed therebetween. - 前記素子ブロックには内部に前記撮像素子を保持するホルダー部が設けられ、
前記放熱部が前記ホルダー部から離隔するに従って外形が小さくなる形状に形成された
請求項11に記載の撮像装置。 The element block is provided with a holder portion for holding the image sensor inside,
The imaging device according to claim 11, wherein the outer shape of the heat radiating part is reduced as the distance from the holder part decreases. - 前記放熱部が環状に形成され、
前記放熱部の周方向における全体に放熱フィンが設けられた
請求項11に記載の撮像装置。 The heat radiating part is formed in an annular shape,
The imaging device according to claim 11, wherein a heat radiating fin is provided over the entire circumferential direction of the heat radiating portion. - 前記放熱部の外側に前記放熱部を覆う覆い部が設けられ、
前記放熱部と前記覆い部が非接触の状態で位置された
請求項11に記載の撮像装置。 A cover for covering the heat dissipation part is provided outside the heat dissipation part,
The imaging device according to claim 11, wherein the heat dissipating part and the covering part are positioned in a non-contact state. - 交換レンズが前記素子ブロックに着脱可能とされた
請求項11に記載の撮像装置。 The imaging device according to claim 11, wherein an interchangeable lens is detachable from the element block.
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WO2019171722A1 (en) * | 2018-03-06 | 2019-09-12 | ソニー株式会社 | Imaging device and imaging unit |
JPWO2019171722A1 (en) * | 2018-03-06 | 2021-04-01 | ソニー株式会社 | Imaging device and imaging unit |
JP7211411B2 (en) | 2018-03-06 | 2023-01-24 | ソニーグループ株式会社 | Imaging device and imaging unit |
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JP2016225780A (en) | 2016-12-28 |
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