WO2021139632A1 - 扬声器、扬声器模组及电子设备 - Google Patents

扬声器、扬声器模组及电子设备 Download PDF

Info

Publication number
WO2021139632A1
WO2021139632A1 PCT/CN2021/070212 CN2021070212W WO2021139632A1 WO 2021139632 A1 WO2021139632 A1 WO 2021139632A1 CN 2021070212 W CN2021070212 W CN 2021070212W WO 2021139632 A1 WO2021139632 A1 WO 2021139632A1
Authority
WO
WIPO (PCT)
Prior art keywords
diaphragm
speaker
support portion
bracket
electronic device
Prior art date
Application number
PCT/CN2021/070212
Other languages
English (en)
French (fr)
Inventor
于利刚
朱统
李英明
苏杰
常晶
吴桂敏
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21738865.1A priority Critical patent/EP4068804A4/en
Publication of WO2021139632A1 publication Critical patent/WO2021139632A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/227—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only  using transducers reproducing the same frequency band
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/26—Spatial arrangements of separate transducers responsive to two or more frequency ranges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
    • H04R1/2842—Enclosures comprising vibrating or resonating arrangements of the bandpass type for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2892—Mountings or supports for transducers
    • H04R1/2896—Mountings or supports for transducers for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/30—Combinations of transducers with horns, e.g. with mechanical matching means, i.e. front-loaded horns
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2209/00—Details of transducers of the moving-coil, moving-strip, or moving-wire type covered by H04R9/00 but not provided for in any of its subgroups
    • H04R2209/026—Transducers having separately controllable opposing diaphragms, e.g. for ring-tone and voice
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the embodiments of the present application relate to the field of audio technology, and in particular to a speaker, a speaker module, and an electronic device.
  • Dynamic speakers are a kind of speakers that are widely used today, and are usually used in speaker modules and earpiece modules of electronic devices such as mobile phones and tablets.
  • its loudness is insufficient; and, due to the thinner dome of the moving coil speaker and insufficient material strength, the high frequency response of the moving coil speaker is insufficient.
  • the purpose of this application is to provide a speaker, a speaker module and an electronic device.
  • the speaker combines a piezoelectric speaker core and a moving coil speaker core.
  • the diaphragm of the piezoelectric speaker core and the diaphragm of the moving coil speaker core are arranged relative to each other and share the front cavity, thereby complementing the mid-high frequency response of the speaker and improving the overall speaker Loudness.
  • the present application provides a speaker including a bracket, a first diaphragm, a first piezoelectric sheet, and a moving coil speaker core.
  • the periphery of the first diaphragm is fixed to the bracket, and the first piezoelectric sheet is fixed to the middle of the first diaphragm.
  • the core of the moving coil speaker is fixed to the bracket and arranged at a distance from the first diaphragm.
  • the core of the moving coil speaker includes a second diaphragm, the second diaphragm is arranged facing the first diaphragm, the second diaphragm, the bracket and the first diaphragm
  • the front cavity is enclosed together to form a front cavity, the bracket is provided with a sound outlet, and the sound outlet communicates with the external space of the front cavity and the speaker.
  • the speaker includes a piezoelectric speaker core having a first diaphragm and a first piezoelectric sheet. Because the speaker combines a piezoelectric speaker core and a moving coil speaker core, the first diaphragm of the piezoelectric speaker core and the second diaphragm of the moving coil speaker core can simultaneously push the air in the front cavity to vibrate to achieve sound. Compared with the traditional dynamic speaker, the overall loudness of the speaker of the present application is significantly improved. Compared with the traditional dynamic speaker, the speaker of the present application can supplement the mid- and high-frequency frequency response through the piezoelectric speaker core, so that the mid- and high-frequency sound pressure level of the speaker can be significantly improved.
  • the top space of the second diaphragm of the moving coil speaker core can be used for arrangement.
  • the first diaphragm and the second diaphragm are arranged oppositely and share the front cavity, so the speaker can When the dual diaphragm structure is realized, space is saved and the overall volume is not significantly increased, and the speaker can still have a smaller thickness and a smaller overall volume.
  • the first diaphragm may be a metal thin plate, an organic thin plate, or others.
  • the thickness of the first diaphragm may be in the range of 50 ⁇ m to 0.3 mm.
  • the first diaphragm may be rectangular, circular or other shapes.
  • the first piezoelectric sheet is located on the side of the first diaphragm away from the support or on the side facing the support.
  • the first piezoelectric sheet may be rectangular, circular, or other shapes.
  • the shape of the first piezoelectric sheet is the same as the shape of the first diaphragm, and the size of the first piezoelectric sheet is smaller than the size of the first diaphragm.
  • the bracket includes a first support portion and a second support portion that are arranged oppositely, the two sides of the periphery of the first diaphragm are respectively fixed to the first support portion and the second support portion, and the sound hole is provided in the first support portion and the second support portion.
  • the second diaphragm includes a vibrating part and a dome, and the dome is fixed at the middle of the vibrating part. In the direction from the second support portion to the first support portion, the distance between the first diaphragm and the top of the ball increases.
  • the first diaphragm is inclined relative to the second diaphragm, and the two are roughly horn-shaped, and the opening direction of the horn faces the sound hole, which is conducive to the matching of acoustic impedance between the speaker and the outside, which improves the sound efficiency and reduces Risk of airflow noise.
  • the area of the first diaphragm is greater than or equal to the area of the second diaphragm.
  • the area of the second diaphragm of the speaker is limited, a first diaphragm with a larger area is provided to increase the sound pressure level.
  • the speaker can obtain a larger front cavity space, so that the speaker has less noise and better sound quality.
  • the bracket further includes a mounting portion connected between the first support portion and the second support portion, the mounting portion is provided with a mounting hole, the moving coil speaker core is fixed to the mounting portion, and the moving coil type The speaker core is partially or completely accommodated in the mounting hole.
  • first support portion and the second support portion of the bracket are respectively located on both sides of the mounting portion, both sides of the periphery of the first diaphragm are fixed to the first support portion and the second support portion, and the second vibration The diaphragm is mounted on the mounting part, so the area of the first diaphragm can be larger than that of the second diaphragm.
  • the shape of the mounting hole is adapted to the shape of the core of the moving coil speaker.
  • the mounting hole can be roughly rectangular, circular, or other shapes.
  • the bracket further includes a third support portion and a fourth support portion that are arranged oppositely, the third support portion and the fourth support portion are connected between the first support portion and the second support portion, and the first vibration The other two sides of the periphery of the membrane are respectively fixed to the third support portion and the fourth support portion.
  • the mounting part is also connected between the third support part and the fourth support part.
  • the first supporting portion includes a first sub-supporting portion and a second sub-supporting portion, the second sub-supporting portion is connected to the mounting portion, and the first sub-supporting portion is connected to the second sub-supporting portion and the first diaphragm , The first sub-support portion protrudes in a direction away from the second support portion relative to the second sub-support portion.
  • the speaker since the first sub-support portion of the speaker protrudes away from the second support portion relative to the second sub-support portion, the speaker can pass through the first support portion when the bottom structure and size of the bracket do not change significantly.
  • the first sub-support portion of the support portion for fixing the first diaphragm protrudes away from the second support portion, so that the speaker can be provided with a larger area of the first diaphragm, thereby increasing the sound pressure level.
  • the bracket further includes a third support portion and a fourth support portion that are arranged oppositely, the third support portion and the fourth support portion are connected between the first support portion and the second support portion, and the first vibration The other two sides of the periphery of the membrane are respectively fixed to the third support portion and the fourth support portion.
  • the first support portion, the third support portion, the second support portion, and the fourth support portion may be sequentially connected to form an installation frame portion, and the peripheral edge of the first diaphragm is continuously fixed to the installation frame portion.
  • the bracket also includes a first frame portion and a second frame portion, the first frame portion is located on the side of the third support portion away from the fourth support portion, and both ends of the first frame portion are respectively connected to one end of the first support portion and the second support A first communication space is formed between the first frame portion and the third support portion.
  • the second frame portion is located on the side of the fourth support portion away from the third support portion. Both ends of the second frame portion are connected to the first The other end of the supporting part and the other end of the second supporting part form a second communication space between the second frame part and the fourth supporting part.
  • the surfaces of the first frame portion, the first support portion, the second support portion, and the second frame portion away from the first diaphragm are coplanar.
  • the surfaces of the first frame portion, the first support portion, the second support portion, and the second frame portion away from the first diaphragm are joined together to form the bottom surface of the bracket.
  • the bracket can be used The bottom surface is fixed with other parts.
  • the space below the mounting portion forms a part of the back cavity of the speaker, the first communication space between the first frame portion and the third support portion, and the second communication space between the second frame portion and the fourth support portion It is also part of the back cavity of the speaker. Therefore, the design of the first frame portion and the second frame portion is beneficial to increase the back cavity space of the speaker and improve the low-frequency sound pressure level of the speaker.
  • the piezoelectric speaker core can share a back cavity with the moving coil speaker core through the first communication space and the second communication space, so that the total back cavity space of the speaker is small, which is beneficial to the miniaturization of the speaker.
  • the speaker further includes a second piezoelectric sheet.
  • the second piezoelectric sheet and the first piezoelectric sheet are respectively fixed on both sides of the first diaphragm.
  • the second piezoelectric sheet is a part of the inner core of the piezoelectric speaker.
  • the piezoelectric speaker core includes a first piezoelectric sheet and a second piezoelectric sheet. The first piezoelectric sheet and the second piezoelectric sheet can simultaneously drive the first diaphragm to improve the sensitivity of the piezoelectric speaker core.
  • the present application also provides an electronic device, including a housing and the aforementioned speaker.
  • the speaker is housed in the housing, and the bracket is fixed to the housing.
  • the housing is provided with a communication hole that communicates the sound hole and the electronic device. External space.
  • the volume of the sound played by the electronic device using the speaker is relatively high and the sound quality is better.
  • the housing includes a middle frame and a first cover plate, the first cover plate is fixed on one side of the middle frame, and the communication hole is provided in the frame portion of the middle frame and/or the first cover plate.
  • the loudspeaker can be used as an external loudspeaker of the electronic device, and the communicating hole is provided in the frame part of the middle frame.
  • the speaker can be used as a non-external speaker of the electronic device, and the communicating hole can be provided in the frame portion of the middle frame, or in the first cover plate, or partly in the frame part of the middle frame, and partly in the first cover plate.
  • the electronic device further includes a sealing element.
  • the sealing element is installed between the shell and the bracket, and is arranged around the sound outlet and the communication hole.
  • the sealing member can isolate the front cavity and the back cavity of the speaker, thereby reducing the leakage of sound in the internal space of the electronic device.
  • the front cavity and the back cavity of the piezoelectric speaker core are completely separated, which can effectively avoid the problem of acoustic short circuit, so that the sound efficiency of the piezoelectric speaker core can be guaranteed, and the overall sound efficiency of the speaker is high.
  • the housing further includes a second cover plate, and the second cover plate is fixed to a side of the middle frame away from the first cover plate.
  • the bracket is fixed to the middle frame, the first diaphragm is arranged facing the first cover plate, and the core of the moving coil speaker is located between the first diaphragm and the second cover plate.
  • a first back cavity is formed between the first diaphragm and the first cover plate, and a second back cavity is formed between the second diaphragm and the second cover plate. Both the first back cavity and the second back cavity are part of the back cavity of the speaker.
  • the speaker can use the vacant space inside the electronic device as a back cavity, which can reduce the volume of the speaker and facilitate the thinning of the speaker, and the back cavity of the speaker has a larger space, which can effectively improve the low frequency of the speaker. Sound pressure level.
  • the second back cavity and the first back cavity are separated from each other or communicate with each other.
  • the total demand for the back cavity space of the speaker can be appropriately reduced while the low-frequency sound pressure level requirements of the speaker are basically guaranteed, thereby facilitating the miniaturization of electronic equipment.
  • the mutual interference between the vibration of the first diaphragm of the piezoelectric speaker core and the second diaphragm of the moving coil speaker core is small, which is beneficial to improve the speaker Sound quality.
  • the electronic device further includes a first device, and the first device is partially or entirely located between the first diaphragm and the second cover.
  • the first diaphragm and the first device partially overlap in the thickness direction of the electronic device, which fully utilizes the thickness space of the electronic device, which is beneficial to the miniaturization of the electronic device.
  • the speaker expands the area of the first diaphragm by making full use of the vacant space in the whole machine, and improves the sound pressure level of the speaker.
  • the first device may be an electrical connector, a circuit board, a microphone, and other devices.
  • the present application also provides a speaker module, including an upper module cover, a lower module cover, and the aforementioned speaker.
  • the upper cover of the module is fixed on one side of the bracket where the first diaphragm is installed, and the upper cover of the module is fixed on the other side of the bracket.
  • the overall loudness of the speaker is relatively high, and the sound pressure level of the medium and high frequencies is relatively high, the volume of the playback sound of the speaker module using the speaker is relatively high and the sound quality is better.
  • a first back cavity is formed between the upper cover of the module and the first diaphragm
  • a second back cavity is formed between the lower cover of the module and the second diaphragm. Both the first back cavity and the second back cavity are part of the back cavity of the speaker module.
  • the second back cavity and the first back cavity are separated from each other or communicate with each other.
  • the second back cavity and the first back cavity may communicate with each other through the first communication space and the second communication space, and the first communication space and the second communication space are also part of the back cavity of the speaker.
  • the mutual interference between the vibration of the first diaphragm of the piezoelectric speaker core and the second diaphragm of the moving coil speaker core is small, which is beneficial to improve the speaker The sound quality of the module.
  • the present application also provides an electronic device, including a housing and the aforementioned speaker module, the speaker module is housed in the housing, the upper module cover and/or the upper module cover are fixedly connected to the housing, and the housing is provided with The communication hole connects the sound hole with the external space of the electronic device.
  • the speaker module since the overall loudness of the speaker of the speaker module is relatively high, and the sound pressure level of the mid-to-high frequency is relatively high, the volume of the playback sound of the electronic device using the speaker module is relatively high and the sound quality is better.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 2 is a partial exploded schematic diagram of the electronic device shown in Fig. 1 in some embodiments;
  • FIG. 3 is a schematic structural diagram of a speaker in some embodiments according to an embodiment of the present application.
  • Fig. 4 is an exploded schematic diagram of the speaker shown in Fig. 3;
  • Fig. 5 is an exploded schematic diagram of the core of the moving coil speaker shown in Fig. 4;
  • Fig. 6 is a schematic structural diagram of the loudspeaker shown in Fig. 3 taken along A-A;
  • Fig. 7 is a schematic structural view of the loudspeaker shown in Fig. 3 taken along B-B;
  • FIG. 8 is a schematic diagram of the sound pressure level of the loudspeaker shown in FIG. 3 in a possible implementation manner
  • Fig. 9 is a structural schematic diagram 1 of the speaker shown in Fig. 3 used as an external loudspeaker applied to the electronic device shown in Fig. 2;
  • Fig. 10 is a second structural schematic diagram of the speaker shown in Fig. 3 when it is used as an external loudspeaker applied to the electronic device shown in Fig. 2;
  • FIG. 11 is a schematic structural diagram of a loudspeaker provided by an embodiment of the present application in other embodiments.
  • Fig. 12 is a schematic structural view of the loudspeaker shown in Fig. 11 cut along the C-C;
  • FIG. 13 is a schematic diagram of the structure of the speaker shown in FIG. 11 as an external speaker when applied to the electronic device shown in FIG. 2;
  • FIG. 14 is a schematic structural diagram of a speaker module provided by an embodiment of the present application.
  • FIG. 15 is a partially exploded schematic diagram of the speaker module shown in FIG. 14;
  • Fig. 16 is a schematic structural diagram of the speaker module shown in Fig. 14 cut along D-D;
  • Fig. 17 is a schematic structural view of the speaker module shown in Fig. 14 cut along E-E;
  • FIG. 18 is a schematic diagram of the structure of the speaker module shown in FIG. 14 when used as an external speaker in the electronic device shown in FIG. 2.
  • the embodiment of the present application provides a speaker, a speaker module and electronic equipment including the speaker.
  • the speaker is used to convert electrical signals into sound signals.
  • the speaker forms a double diaphragm structure by coupling the piezoelectric speaker core and the moving coil speaker core, and the diaphragm of the piezoelectric speaker core is arranged opposite to the diaphragm of the moving coil speaker core, sharing the front cavity, thereby complementing the middle and high frequency of the speaker Loud, enhance the overall loudness of the speaker.
  • the speaker can be independently installed in the electronic device, or can be used as the core of the speaker module to be integrally installed in the electronic device along with the speaker module.
  • the electronic device can be a mobile phone, a tablet computer, a notebook computer, a wearable device, and other electronic products with a sound playback function.
  • the wearable device may be a smart bracelet, smart watch, smart head display, smart glasses, etc.
  • FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application
  • FIG. 2 is a partially exploded schematic diagram of the electronic device 100 shown in FIG. 1 in some embodiments.
  • the electronic device 100 is a mobile phone as an example for description.
  • the electronic device 100 includes a housing 10, a circuit board 20, a battery 30, a camera module 40, an external speaker 50 and a non-external speaker 60 housed in the housing 10.
  • the width direction of the electronic device 100 is the X direction
  • the length direction of the electronic device 100 is the Y direction
  • the The thickness direction is the Z direction
  • the width direction X of the electronic device 100, the length direction Y of the electronic device 100, and the thickness direction Z of the electronic device 100 are perpendicular to each other.
  • the housing 10 includes a middle frame 101 and a first cover plate 102 and a second cover plate 103 respectively fixed on both sides of the middle frame 101.
  • the first cover 102 may be the front cover of the electronic device 100
  • the second cover 103 may be the rear cover of the electronic device 100.
  • the first cover 102 includes a protective cover and a display panel that are stacked, and the display panel is fixed to a side of the protective cover facing the second cover 103.
  • the display panel is used to display images, and the display panel can also be integrated with a touch function.
  • the middle frame 101 includes a frame portion 1011 and a fixing portion 1012 located inside the frame portion 1011.
  • the two sides of the frame portion 1011 of the middle frame 101 are respectively fixed to the periphery of the first cover plate 102 and the periphery of the second cover plate 103.
  • the middle frame 101 The fixing portion 1012 is located between the first cover 102 and the second cover 103 and is used to fix one or more components of the electronic device 100 housed in the housing 10. It should be noted that only a part of the structure of the fixing part 1012 of the middle frame 101 is shown in FIG. 2, and there is another part of the structure of the fixing part 1012 of the middle frame 101 that is not shown in FIG. 2.
  • the frame portion 1011 and the fixing portion 1012 of the middle frame 101 may be integrally formed, or may be assembled to form an integral structure, which is not strictly limited in this application.
  • the frame portion 1011 of the middle frame 101 and the second cover 103 may be integrally formed, or may be assembled to form an integral structure, which is not strictly limited in this application.
  • the circuit board 20, the battery 30 and the camera module 40 are all fixedly connected to the middle frame 101.
  • a plurality of devices 201 may be fixed on the circuit board 20.
  • the multiple devices 201 include, but are not limited to, a processor, a memory, etc., and the memory is coupled to the processor. Wherein, the number of the circuit board 20 may be one or more.
  • the battery 30 is used to power the electronic device 100.
  • the camera module 40 is used to collect light for shooting. Exemplarily, the camera module 40 is used for rear photography of the electronic device 100, the second cover 103 is provided with a shooting through hole 1031, and the camera module 40 collects light through the shooting through hole 1031.
  • the camera module 40 may include one or more cameras.
  • the electronic device 100 may also include a camera module for front-facing shooting, and may also include a camera module for collecting facial images and/or pupil images.
  • This application is not specific to the camera module. The quantity, type, etc. are strictly limited. In the embodiments of the present application, "A and/or B" includes the three cases of "A", “B” and “A and B".
  • both the external loudspeaker 50 and the non-external loudspeaker 60 are fixed to the middle frame 101 of the housing 10.
  • the non-external loudspeaker 60 can also be called a receiver, which can be used to transmit the voice of the other party to the user when the user is in a non-hands-free call;
  • the external loudspeaker 50 can also become a loudspeaker, which can be used to The voice of the other party is amplified and played to the user, and it can also be used to play music, navigation voice, broadcasting, and other occasions that require external sound or audio signals.
  • the housing 10 is provided with a communication hole, and the communication hole communicates the inner space of the housing 10 and the outer space of the housing 10, that is, the inner space of the electronic device 100 and the outer space of the electronic device 100 are connected.
  • the number and positions of the communication holes of the housing 10 can be designed according to factors such as the sound type, arrangement position, and sound position of the external speakers 50 and the non-external speakers 60 of the electronic device 100.
  • the external loudspeaker 50 generates sound by driving the air to vibrate through a diaphragm.
  • the loudspeaker 50 is fixed to the fixing part 1012 of the middle frame 101.
  • the housing 10 includes a communication hole 104 used as a speaker hole.
  • the communication hole 104 can be provided in the frame portion 1011 of the middle frame 101.
  • the external speaker 50 can transmit sound to the external space of the electronic device 100 through the communication hole 104 to achieve The sound is played.
  • the number of the communication holes 104 in this part may be one or more.
  • the number and shape of the communicating holes 104 can be designed in accordance with the design, so that the total cross-sectional area of the communicating holes 104 meets the sound emission requirement.
  • the electronic device 100 may further include a sealing member 70.
  • the sealing member 70 may be substantially a frame.
  • the sealing member 70 may be installed between the frame portion 1011 of the middle frame 101 and the external speaker 50 and arranged around the communication hole 104 to reduce the leakage of sound in the internal space of the electronic device 100.
  • the sealing member 70 may be double-sided tape, foam, or the like.
  • the non-external loudspeaker 60 achieves sound by driving the air to vibrate through a diaphragm.
  • the housing 10 includes a communication hole 105 used as an earpiece hole.
  • the communication hole 105 can be provided on the first cover 102.
  • the non-external speaker 60 can transmit sound to the external space of the electronic device 100 through the communication hole 105 to realize sound playback.
  • the communication hole 105 may also be provided in the frame portion 1011 of the middle frame 101.
  • the communicating hole 105 may also be partly provided in the first cover 102 and partly in the frame portion 1011 of the middle frame 101, and the two parts are joined together.
  • the non-external loudspeaker 60 can also produce sound through the screen. In this case, the housing 10 can omit the communication hole 105 used as the earpiece hole.
  • the foregoing description illustrates some implementations of the external loudspeaker 50 and the non-external loudspeaker 60 of the electronic device 100.
  • the external loudspeaker 50 and the non-external loudspeaker 60 can also have other implementations. This is not strictly limited.
  • the speaker can be used as the external speaker 50 and/or the non-external speaker 60 of the electronic device 100.
  • FIG. 3 is a schematic structural diagram of a speaker 1 in some embodiments according to an embodiment of the present application
  • FIG. 4 is an exploded schematic diagram of the speaker 1 shown in FIG. 3.
  • the speaker 1 includes a bracket 11, a piezoelectric speaker core 12 and a moving coil speaker core 13. Both the piezoelectric speaker core 12 and the moving coil speaker core 13 are mounted on the bracket 11.
  • the piezoelectric speaker core 12 includes a first diaphragm 121, a first piezoelectric sheet 122, and a second piezoelectric sheet 123.
  • the first diaphragm 121 includes a middle part and a peripheral edge arranged around the middle part.
  • the periphery of the first diaphragm 121 is fixed to the bracket 11.
  • the first piezoelectric sheet 122 and the second piezoelectric sheet 123 are fixed to the middle of the first diaphragm 121 and are respectively fixed to both sides of the first diaphragm 121.
  • the first piezoelectric sheet 122 is located on the side of the first diaphragm 121 away from the support 11, and the second piezoelectric sheet 123 is located on the side of the first diaphragm 121 facing the support 11.
  • the position of the first piezoelectric sheet 122 and the position of the second piezoelectric sheet 123 can be interchanged.
  • the piezoelectric speaker core 12 may also include a first piezoelectric sheet 122 and omit the second piezoelectric sheet 123.
  • the first piezoelectric sheet 122 is located on the side of the first diaphragm 121 away from the support 11 or facing On one side of the bracket 11, the piezoelectric speaker core 12 drives the first diaphragm 121 to vibrate through the first piezoelectric sheet 122.
  • the first diaphragm 121 may have a rectangular shape.
  • the first diaphragm 121 may be a metal thin plate, an organic thin plate, or others.
  • the thickness of the first diaphragm 121 may be in the range of 50 ⁇ m to 0.3 mm. When the area of the first diaphragm 121 is larger, a larger thickness may be selected.
  • the first piezoelectric sheet 122 and the second piezoelectric sheet 123 may have a rectangular shape. In some other embodiments, the first diaphragm 121 may also have other shapes such as a circle. In some other embodiments, the first piezoelectric sheet 122 and/or the second piezoelectric sheet 123 may also have other shapes such as a circle. Exemplarily, the shape of the first piezoelectric sheet 122 and the second piezoelectric sheet 123 may be the same as the shape of the first diaphragm 121, and the size of the first piezoelectric sheet 122 and the second piezoelectric sheet 123 is smaller than that of the first diaphragm. 121 size.
  • the bracket 11 includes a first support portion 111 and a second support portion 112 that are opposed to each other, and a third support portion 113 and a fourth support portion 114 that are opposed to each other, and the third support portion 113 and the fourth support portion 114 are opposed to each other. It is connected between the first supporting portion 111 and the second supporting portion 112. Exemplarily, the first support portion 111, the third support portion 113, the second support portion 112, and the fourth support portion 114 may be sequentially connected to form the mounting frame portion 110, and the periphery of the first diaphragm 121 is continuously fixed to the mounting frame ⁇ 110 ⁇ Department 110.
  • the bracket 11 is provided with a sound hole 115, and the sound hole 115 is provided in the first supporting portion 111. The sound hole 115 penetrates the first supporting portion 111 to communicate with the spaces on both sides of the first supporting portion 111.
  • the bracket 11 further includes a mounting portion 116.
  • the mounting portion 116 is connected between the first support portion 111 and the second support portion 112.
  • the mounting portion 116 is also connected between the third support portion 113 and the fourth support portion 114.
  • the mounting portion 116 is provided with a mounting hole 1161.
  • the mounting hole 1161 communicates with the top side space and the bottom side space of the mounting portion 116.
  • the mounting hole 1161 may be substantially rectangular.
  • the mounting hole 1161 may also have other shapes such as a circle, and the shape of the mounting hole 1161 matches the shape of the moving coil speaker core 13.
  • orientation terms such as “top” and “bottom” used in the embodiments of the present application are mainly described based on the display orientation of the relevant structure in the drawings, and do not form an indication of the orientation of the relevant structure in the actual application scenario. limited.
  • the bracket 11 may further include a first frame portion 117 and a second frame portion 118.
  • the first frame portion 117 and the second frame portion 118 are respectively fixed on both sides of the mounting frame portion 110.
  • the first frame portion 117 is located on the side of the third support portion 113 away from the fourth support portion 114. Both ends of the first frame portion 117 are respectively connected to one end of the first support portion 111 and one end of the second support portion 112.
  • a first communication space 1171 is formed between the portion 117 and the third supporting portion 113.
  • the second frame portion 118 is located on the side of the fourth support portion 114 away from the third support portion 113. Two ends of the second frame portion 118 are respectively connected to the other end of the first support portion 111 and the other end of the second support portion 112.
  • a second communication space 1181 is formed between the second frame portion 118 and the fourth support portion 114.
  • FIG. 5 is an exploded schematic diagram of the moving coil speaker core 13 shown in FIG. 4.
  • the moving coil speaker core 13 includes a basin frame 131, a vibration component 13a, and a magnetic circuit component 13b.
  • the vibration assembly 13a and the magnetic circuit assembly 13b are installed on the basin frame 131.
  • the vibration assembly 13 a includes a second diaphragm 132 and a voice coil 133.
  • the periphery of the second diaphragm 132 is fixed on one side of the basin frame 131, and the voice coil 133 is fixed on the side of the second diaphragm 132 facing the basin frame 131.
  • the magnetic circuit assembly 13b includes a lower pole piece 134, a center magnet 135, a plurality of side magnets 136, a center pole piece 137, and a side pole piece 138.
  • the lower pole piece 134 is fixed on the other side of the basin frame 131, the central magnet 135 and the multiple side magnets 136 are both fixed on the side of the lower pole piece 134 facing the basin frame 131, and the multiple side magnets 136 are distributed on the central magnet.
  • the central pole piece 137 is fixed to the side of the central magnet 135 away from the lower pole piece 134, and the side pole piece 138 is fixed to the basin frame 131, located on the side of the side magnets 136 away from the lower pole piece 134 and surrounds the central pole Slice 137 settings.
  • a first gap is formed between the plurality of side magnets 136 and the center magnet 135, a second gap is formed between the side pole piece 138 and the center pole piece 137, and the second gap is connected to the first gap to merge into a magnetic gap.
  • the end of the voice coil 133 away from the second diaphragm 132 is inserted into the magnetic gap of the magnetic circuit assembly 13b.
  • the magnetic circuit assembly 13b provides a magnetic field that drives the voice coil 133 to vibrate.
  • the voice coil 133 When the voice coil 133 is energized, the voice coil 133 drives the second diaphragm 132 to vibrate, and the moving coil speaker core 13 realizes sound.
  • the second diaphragm 132 may include a vibration part 1321 and a dome 1322.
  • the periphery of the vibration part 1321 is fixed to the basin frame 131, and the dome 1322 is fixed to the middle of the vibration part 1321.
  • the dome 1322 can be fixed to the side of the vibrating portion 1321 facing the basin frame 131 or the side away from the basin frame 131.
  • the dome 1322 is substantially in the shape of a flat plate, and the vibration portion 1321 is substantially in the shape of a folded ring.
  • FIG. 6 is a schematic structural diagram of the loudspeaker 1 shown in FIG. 3 taken along A-A
  • FIG. 7 is a structural schematic diagram of the loudspeaker 1 shown in FIG. 3 taken along B-B.
  • the periphery of the first diaphragm 121 of the piezoelectric speaker core 12 is fixed to the bracket 11. Two sides of the periphery of the first diaphragm 121 are respectively fixed to the first support portion 111 and the second support portion 112, and the other two sides of the periphery of the first diaphragm 121 are respectively fixed to the third support portion 113 and the fourth support portion 114 .
  • the first piezoelectric sheet 122 and the second piezoelectric sheet 123 are respectively fixed on both sides of the first diaphragm 121.
  • the moving coil speaker core 13 is fixed to the bracket 11 and is spaced apart from the first diaphragm 121.
  • the moving coil speaker core 13 is fixed to the mounting portion 116, and the moving coil speaker core 13 is partially or fully accommodated in the mounting hole 1161 of the mounting portion 116.
  • the dynamic speaker core 13 is located approximately below the piezoelectric speaker core 12.
  • the second diaphragm 132 of the moving coil speaker core 13 is disposed facing the first diaphragm 121, and the second diaphragm 132, the support 11 and the first diaphragm 121 jointly surround the front cavity 1a.
  • the second diaphragm 132, the mounting portion 116, the mounting frame portion 110, and the first diaphragm 121 collectively include a front cavity 1a.
  • the sound outlet 115 of the bracket 11 connects the front cavity 1 a to the external space of the speaker 1.
  • the speaker 1 since the speaker 1 combines the piezoelectric speaker core 12 and the moving coil speaker core 13, the first diaphragm 121 of the piezoelectric speaker core 12 and the second diaphragm 132 of the moving coil speaker core 13 can be simultaneously The air in the front cavity 1a is pushed to vibrate to produce sound. Therefore, compared with the traditional moving coil speaker, the overall loudness of the speaker 1 in the embodiment of the present application is significantly improved. Compared with the traditional moving coil speaker, the speaker 1 of the embodiment of the present application can supplement the mid- and high-frequency frequency response through the piezoelectric speaker core 12, so that the mid- and high-frequency sound pressure level of the speaker 1 is significantly improved.
  • the top space of the second diaphragm 132 of the moving coil speaker core 13 can be used for arrangement.
  • the first diaphragm 121 and the second diaphragm 132 are arranged opposite to each other and share the front Therefore, the speaker 1 can save space and not significantly increase the overall volume when implementing the dual-diaphragm structure, and the speaker 1 can still have a smaller thickness and a smaller overall volume.
  • the speaker 1 of the embodiment of the present application can enhance the sound pressure level in the frequency band of 1Hz-10kHz , Expand the frequency response width and enhance the sound pressure level in the 10kHz-20kHz frequency band.
  • FIG. 8 is a schematic diagram of the sound pressure level of the speaker 1 shown in FIG. 3 in a possible implementation manner.
  • the total sound pressure level of the speaker 1 of this embodiment is better than that of the traditional piezoelectric speaker and the traditional dynamic speaker.
  • the mid-to-high frequency sound of the speaker 1 of this embodiment The pressure level has been significantly improved.
  • the speaker 1 of the embodiment of the present application can adjust the first diaphragm 121 and the second diaphragm 121 by controlling the amplitude and phase of the driving voltage of the piezoelectric speaker core 12 and the moving coil speaker core 13
  • the vibration direction and amplitude of the diaphragm 132 are used to achieve vibration reduction.
  • the piezoelectric speaker core 12 can match its driving voltage to a suitable amplitude and phase according to the ratio of the vibration mass of the second diaphragm 132 to the first diaphragm 121, the vibration direction and amplitude of the second diaphragm 132.
  • the moving coil speaker core 13 can match the driving voltage appropriately according to the ratio of the vibration mass of the first diaphragm 121 to the second diaphragm 132, the vibration direction and amplitude of the first diaphragm 121 Amplitude and phase control the vibration direction and amplitude of the second diaphragm 132 so that the momentum change of the second diaphragm 132 is equal to or similar to the momentum change of the first diaphragm 121, which plays a role of damping.
  • the present application does not strictly limit the driving voltage and phase adjustment methods of the piezoelectric speaker core 12 and the moving coil speaker core 13, as long as the two are finally matched with each other.
  • M 1 V 1 M 2 V 2 .
  • M 1 is the mass of the first diaphragm 121
  • V 1 is the vibration speed of the first diaphragm 121
  • M 2 is the mass of the second diaphragm 132
  • V 2 is the vibration speed of the second diaphragm 132.
  • the correct electrode connection mode needs to be selected so that the driving voltage of the two can correctly drive the diaphragm to vibrate to meet the vibration demand.
  • the first diaphragm 121 vibrates in a direction close to the second diaphragm 132, that is, the two vibrate in a direction close to each other, and the front cavity 1a
  • the air inside is squeezed by the first diaphragm 121 and the second diaphragm 132, and is discharged to the outer space of the speaker 1 through the sound hole 115;
  • the second diaphragm 132 vibrates in a direction away from the first diaphragm 121 the first One diaphragm 121 vibrates in a direction away from the second diaphragm 132, that is, the two vibrate in a direction away from
  • the speaker 1 can drive the piezoelectric sheets (122, 123) of the piezoelectric speaker core 12 and the voice coil 133 of the moving coil speaker core 13 through two power amplifiers (PA), respectively. It can better meet the drive voltage requirements of two speakers with one core.
  • the driving voltage of the piezoelectric speaker core 12 may be about 30V
  • the driving voltage of the moving coil speaker core 13 may be about 12V.
  • the same power amplifier can also be used for driving.
  • the distance between the first diaphragm 121 and the dome 1322 of the second diaphragm 132 increases.
  • the first diaphragm 121 is inclined relative to the second diaphragm 132, and the two are roughly horn-shaped, and the opening direction of the horn faces the sound hole 115, which is beneficial to the acoustic impedance matching between the speaker 1 and the outside, and improves Sound efficiency reduces the risk of airflow noise.
  • the airflow noise of the speaker 1 can be reduced to a small amount, and the sound quality of the speaker 1 is better.
  • the degree of inclination of the first diaphragm 121 relative to the second diaphragm 132 affects the greater the overall thickness of the speaker 1, which easily makes the speaker 1 difficult to be applied to the electronic device 100 with tight internal space. Therefore, the speaker 1 can balance the demand for reducing airflow noise and the demand for installation space, and rationally design the inclination of the first diaphragm 121 relative to the second diaphragm 132.
  • the dome 1322 of the first diaphragm 121 and the second diaphragm 132 may also be parallel to each other.
  • the minimum distance between the first diaphragm 121 and the second diaphragm 132 needs to meet the vibration space requirements of the two. Therefore, when the overall volume of the speaker 1 can be controlled within a reasonable range, the greater the distance between the two Bigger is better.
  • the minimum distance between the first diaphragm 121 and the second diaphragm 132 may be 0.7 mm.
  • the area of the first diaphragm 121 is greater than or equal to the area of the second diaphragm 132.
  • the speaker 1 is provided with the first diaphragm 121 with a larger area to increase the sound pressure level.
  • the speaker 1 can obtain a larger front cavity 1a space, so that the speaker 1 has less noise and better sound quality.
  • the mounting frame portion 110 of the bracket 11 is arranged around the peripheral side of the mounting portion 116, the peripheral edge of the first diaphragm 121 is fixed to the mounting frame portion 110, and the second diaphragm 132 is mounted on the mounting portion 116, so it can
  • the area of the first diaphragm 121 is larger than that of the second diaphragm 132.
  • the bracket 11 may also have other structures to meet the installation space requirements of the first diaphragm 121 and the second diaphragm 132.
  • the mounting frame portion 110 and the mounting portion 116 are stacked on top of each other, and the mounting frame portion 110 It is horn-shaped in a direction away from the mounting portion 116, and the mounting frame portion 110 has a larger opening area at an end away from the mounting portion 116 to meet the installation space requirement of the first diaphragm 121.
  • the area of the first diaphragm 121 may also be equal to or smaller than the area of the second diaphragm 132, which is not strictly limited in the embodiment of the present application.
  • the surfaces of the first frame portion 117, the first support portion 111, the second support portion 112, and the second frame portion 118 of the bracket 11 that are away from the first diaphragm 121 share the same Face settings.
  • the bottom surface of the first frame portion 117, the bottom surface of the first support portion 111, the bottom surface of the second support portion 112, and the bottom surface of the second frame portion 118 are joined together to form the bottom surface of the bracket 11, and the speaker 1 is mounted on the other
  • the bottom surface of the bracket 11 can be fixed to other components.
  • the space below the mounting portion 116 forms a part of the back cavity of the speaker 1, the first communication space 1171 between the first frame portion 117 and the third support portion 113, and the second frame portion 118 and the fourth support portion 114
  • the second communication space 1181 therebetween is also a part of the back cavity of the speaker 1. Therefore, the design of the first frame portion 117 and the second frame portion 118 is beneficial to increase the back cavity space of the speaker 1 and improve the low-frequency sound pressure level of the speaker 1.
  • the piezoelectric speaker core 12 can share the back cavity with the moving coil speaker core 13 through the first communication space 1171 and the second communication space 1181, so that the total back cavity space of the speaker 1 is small, which is conducive to the miniaturization of the speaker 1 .
  • the speaker 1 is fixed to other components through the bottom surface of the mounting frame 110, and the space below the mounting portion 116 forms a part of the back cavity space of the speaker 1.
  • the bracket 11 can also omit the first frame portion 117 and the second frame portion 118 to reduce the volume of the speaker 1.
  • FIG. 9 is a first structural diagram of the speaker 1 shown in FIG. 3 as an external speaker 50 when applied to the electronic device 100 shown in FIG. 2, and FIG. 10 is the speaker 1 shown in FIG. 3 as an external speaker.
  • the speaker 1 is housed in the housing 10 of the electronic device 100, and the bracket 11 of the speaker 1 is fixed to the housing 10.
  • the bracket 11 is fixed to the middle frame 101, for example, the bracket 11 may be fixed to the fixing portion 1012 of the middle frame 101.
  • the bracket 11 can be fixed to the fixing portion 1012 of the middle frame 101 by bonding, or can be fixed to the fixing portion 1012 of the middle frame 101 by other methods such as clamping, welding, etc., which is not strictly limited in this application.
  • the first diaphragm 121 is disposed facing the first cover plate 102, and the moving coil speaker core 13 is located between the first diaphragm 121 and the second cover plate 103.
  • the front cavity 1 a of the speaker 1 is located between the first diaphragm 121 and the second diaphragm 132.
  • a first back cavity 106 is formed between the first diaphragm 121 and the first cover plate 102
  • a second back cavity 107 is formed between the second diaphragm 132 and the second cover plate 103
  • the second back cavity 107 is connected to the first back cavity 106 are connected to each other.
  • the second back cavity 107 and the first back cavity 106 are in communication through the first communication space 1171 and the second communication space 1181.
  • the first back cavity 106, the second back cavity 107, the first communication space 1171, and the second communication space 1181 are all part of the back cavity 1b of the speaker 1.
  • the housing 10 is provided with a communication hole 104.
  • the communicating hole 104 is provided in the frame portion 1011 of the middle frame 101.
  • the communication hole 104 communicates the sound hole 115 to the external space of the electronic device 100.
  • the front cavity 1a of the speaker 1, the sound hole 115 of the speaker 1, the communication hole 104 of the housing 10, and the external space of the electronic device 100 are in communication, and the sound of the speaker 1 can smoothly propagate to the outside of the electronic device 100.
  • the speaker 1 can use the vacant space inside the electronic device 100 as the back cavity 1b, thereby reducing the volume of the speaker 1 and facilitating the thinning of the speaker 1, and the back cavity 1b of the speaker 1 has a larger space, which can effectively improve The low-frequency sound pressure level of speaker 1.
  • the total demand for the space of the back cavity 1b can be appropriately reduced when the speaker 1 basically guarantees its low-frequency sound pressure level, which is beneficial to Miniaturization of the electronic device 100.
  • the speaker 1 can change the structure of the bracket 11 of the speaker 1, or change the structure of the fixing portion 1012 of the middle frame 101, or change the matching structure between the bracket 11 and the fixing portion 1012 of the middle frame 101, etc., so that The second back cavity 107 and the first back cavity 106 are separated from each other. At this time, the mutual interference between the vibration of the first diaphragm 121 of the piezoelectric speaker core 12 and the vibration of the second diaphragm 132 of the moving coil speaker core 13 is small, which is beneficial to improve the sound quality of the speaker 1.
  • the sealing member 70 of the electronic device 100 is installed between the frame portion 1011 of the middle frame 101 and the bracket 11, and the sealing member 70 is arranged around the sound hole 115 and the communication hole 104 to isolate the speaker
  • the front cavity 1a and the back cavity 1b of 1 reduce the leakage of sound in the internal space of the electronic device 100.
  • the front cavity and the back cavity of the piezoelectric speaker core 12 are completely separated, which can effectively avoid the problem of acoustic short circuit, so that the sound efficiency of the piezoelectric speaker core 12 can be ensured, and the overall sound efficiency of the speaker 1 is relatively high.
  • the speaker 1 can install a larger area of the first diaphragm 121 by changing part of the structure of the bracket 11, thereby increasing the sound pressure level.
  • the speaker 1 can make the top of the first support 111 for fixing the first diaphragm 121 protrude away from the second support 112 while maintaining the basic frame of the bracket 11, so that the first support
  • the distance between the protruding top portion of 111 and the second supporting portion 112 is relatively large to fix a larger area of the first diaphragm 121, and the relative positional relationship between the bottom of the first supporting portion 111 and other parts of the bracket 11 is not
  • the change or no obvious change makes the installation of the speaker 1 through the bottom of the bracket 11 less difficult.
  • the following examples illustrate.
  • FIG. 11 is a schematic structural diagram of a speaker 1 in other embodiments according to an embodiment of the present application.
  • FIG. 12 is a structure of the speaker 1 shown in FIG. 11 cut along the CC. Schematic.
  • the speaker 1 of this embodiment may include some or all of the features of the speaker 1 of the foregoing embodiment. The following mainly describes the differences of the speaker 1 of this embodiment.
  • the first supporting portion 111 includes a first sub-supporting portion 111a and a second sub-supporting portion 111b.
  • the second sub-supporting portion 111 b is connected to the mounting portion 116
  • the first sub-supporting portion 111 a is connected to the second sub-supporting portion 111 b and the first diaphragm 121.
  • the first sub-support portion 111a protrudes in a direction away from the second support portion 112 relative to the second sub-support portion 111b.
  • the speaker 1 since the first sub-supporting portion 111a of the speaker 1 protrudes away from the second support portion 112 relative to the second sub-supporting portion 111b, the speaker 1 can be installed on the bottom structure and size of the bracket 11.
  • the first sub-support portion 111a of the first support portion 111 for fixing the first diaphragm 121 protrudes away from the second support portion 112, so that the speaker 1 can be provided with a larger area of the first vibration.
  • Membrane 121 thereby increasing the sound pressure level.
  • the first sub-support portion 111 a is fixed to a side of the second sub-support portion 111 b away from the second support portion 112.
  • the surface 111c of the second sub-supporting portion 111b facing the first diaphragm 121 can be arranged obliquely, and the end of the surface 111c close to the first sub-supporting portion 111a is close to the first diaphragm 121, so that the first sub-supporting portion 111a and the second sub-supporting portion 111a are
  • the connection area of the sub-supporting portion 111b is large, and the connection reliability between the two is high.
  • the end of the surface 111c close to the mounting portion 116 is far away from the first diaphragm 121 to increase the space of the front cavity 1a of the speaker 1, which is also the first diaphragm 121 Provide sufficient vibration space.
  • the first sub-supporting portion 111a may also be fixed to the side of the second sub-supporting portion 111b facing the first diaphragm 121, and the end of the first sub-supporting portion 111a away from the second sub-supporting portion 111b is away from the first sub-supporting portion 111b.
  • the direction of the two supporting parts 112 is inclined.
  • FIG. 13 is a schematic diagram of the structure of the speaker 1 shown in FIG. 11 as an external speaker 50 when applied to the electronic device 100 shown in FIG. 2.
  • the second sub-support portion 111 b and the second support portion 112 of the first support portion 111 of the bracket 11 of the speaker 1 are fixed to the fixing portion 1012 of the middle frame 101.
  • the electronic device 100 further includes a first device 80, and the first device 80 is partially or completely located between the first diaphragm 121 and the second cover 103.
  • the first device 80 may be an electrical connector, a circuit board, a microphone, and other devices.
  • the first diaphragm 121, the first sub-support 111a, and the first device 80 partially overlap in the thickness direction Z of the electronic device 100, which makes full use of the thickness space of the electronic device 100, which is conducive to the miniaturization of the electronic device 100. ⁇ .
  • the speaker 1 expands the area of the first diaphragm 121 by making full use of the vacant space in the whole machine, and improves the sound pressure level of the speaker 1.
  • the structure of the bracket 11 of the speaker 1 can also be adjusted adaptively, so that the first diaphragm 121 can make full use of the free space. Space to increase the area.
  • the top of the third support portion 113 may be convex relative to the bottom of the third support portion 113 in a direction away from the fourth support portion 114 .
  • the top of the fourth supporting portion 114 may be convex relative to the bottom of the fourth supporting portion 114 in a direction away from the third supporting portion 113, The area of the first diaphragm 121 is increased by using the free space outside the fourth support portion 114.
  • the bracket 11 can meet the aforementioned requirements for the support of the piezoelectric speaker core 12 and the moving coil speaker core 13, and the space requirements of the front cavity 1a and the sound hole 115.
  • the design is a different structure from the foregoing embodiment, which is not strictly limited in this application.
  • the speaker 1 shown in FIG. 3 and the speaker 1 shown in FIG. 11 are mainly used as the external speaker 50 to be applied to the electronic device 100 for description, while the speaker 1 shown in FIG. 3 and the speaker 1 shown in FIG.
  • the display speaker 1 can also be applied to the electronic device 100 as a non-external speaker 60 (refer to FIG. 2).
  • the front cavity 1a of the speaker 1 is connected to the communicating hole 105, and the more detailed details of this application will not be repeated.
  • FIG. 14 is a schematic structural diagram of a speaker module 2 provided by an embodiment of the present application
  • FIG. 15 is a partially exploded schematic diagram of the speaker module 2 shown in FIG. 14.
  • the speaker module 2 includes an upper module cover 21, a lower module cover 22 and the speaker 1 described above.
  • the upper module cover 21 is fixed to the side of the support 11 where the first diaphragm 121 is installed, and the upper module cover 21 is fixed to the other side of the support 11, that is, the upper module cover 21 and the lower module cover 22 are respectively fixed On both sides of the bracket 11.
  • the upper module cover 21 and the lower module cover 22 can be fixed to the bracket 11 by bonding or the like.
  • the overall loudness of the speaker 1 is relatively high, and the sound pressure level of the medium and high frequencies is relatively high, the volume of the playback sound of the speaker module 2 using the speaker 1 is relatively high and the sound quality is better.
  • the upper module cover 21 is provided with a first leakage hole 211, and the first leakage hole 211 communicates with spaces on both sides of the upper module cover 21.
  • the lower module cover 22 is provided with a second leak hole 221, and the second leak hole 221 communicates with the space on both sides of the lower module cover 22.
  • FIG. 16 is a schematic diagram of the structure of the speaker module 2 shown in FIG. 14 cut along the DD
  • FIG. 17 is the structure of the speaker module 2 shown in FIG. 14 cut along the EE. Schematic.
  • a first back cavity 212 is formed between the upper module cover 21 and the first diaphragm 121, a second back cavity 222 is formed between the lower module cover 22 and the second diaphragm 132, and the second back cavity 222 is connected to the first back cavity 212 are interconnected.
  • the second back cavity 222 and the first back cavity 212 communicate with each other through the first communication space 1171 and the second communication space 1181.
  • the first back cavity 212, the second back cavity 222, the first communication space 1171 and the second communication space 1181 are all part of the back cavity of the speaker module 2.
  • the first diaphragm 121 and the second diaphragm 132 share the back cavity, which can reduce the total space size of the back cavity of the speaker module 2 The demand is conducive to the miniaturization of the speaker module 2.
  • the first leakage hole 211 communicates with the first back cavity 212
  • the second leakage hole 221 communicates with the second back cavity 222.
  • the speaker module 2 may also omit one of the first leakage hole 211 or the second leakage hole 221.
  • the second back cavity 222 and the first back cavity 212 may also be separated from each other.
  • the first frame portion 117 and the second frame portion 118 of the bracket 11 may be omitted, and the upper module cover 21 and the lower module cover 22 are connected to the mounting frame portion 110 of the bracket 11.
  • FIG. 18 is a schematic structural diagram of the speaker module 2 shown in FIG. 14 used as an external speaker 50 when applied to the electronic device 100 shown in FIG. 2.
  • the electronic device 100 of this embodiment may include some or all of the features of the electronic device 100 of the foregoing embodiment, and the following mainly describes the differences of the electronic device 100 of this embodiment.
  • the speaker module 2 is housed in the housing 10, and the lower module cover 22 is fixed to the housing 10.
  • the lower module cover 22 is fixed to the fixing portion 1012 of the middle frame 101 of the housing 10.
  • the housing 10 is provided with a communication hole 104, and the communication hole 104 communicates the sound hole 115 to the external space of the electronic device 100.
  • the overall loudness of the speaker 1 of the speaker module 2 is relatively high, and the sound pressure level of the medium and high frequencies is relatively high, the volume of the playback sound of the electronic device 100 using the speaker module 2 is relatively high, and the sound quality is relatively high. good.
  • the speaker module 2 may also be fixed to the housing 10 through the upper module cover 21, or both the upper module cover 21 and the lower module cover 22 are fixed to the housing 10. This application does not apply to the speaker module. 2
  • the fixing method in the electronic device 100 is strictly limited.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Multimedia (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

本申请实施例公开一种扬声器、扬声器模组及电子设备。扬声器包括支架、第一振膜、第一压电片以及动圈式扬声器内核。第一振膜的周缘固定于支架，第一压电片固定于第一振膜的中部。动圈式扬声器内核固定于支架且与第一振膜间隔设置，动圈式扬声器内核包括第二振膜，第二振膜面向第一振膜设置，第二振膜、支架及第一振膜共同包围形成前腔，支架开设有出音孔，出音孔连通前腔与扬声器的外部空间。扬声器的第一振膜与第二振膜相对设置、共用前腔，从而补足扬声器的中高频频响，提升扬声器的整体响度。

Description

扬声器、扬声器模组及电子设备
本申请要求于2020年01月08日提交中国专利局、申请号为202010019342.3、申请名称为“扬声器、扬声器模组及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及音频技术领域，尤其涉及一种扬声器、扬声器模组及电子设备。
背景技术
动圈式扬声器是当今应用非常广泛的一种扬声器，通常应用于手机、平板等电子设备的扬声器模组和听筒模组中。然而，由于动圈式扬声器的尺寸较小，导致其响度不足；并且，由于动圈式扬声器的球顶的厚度较薄、材料强度不够，导致其中高频的频响不足。
发明内容
本申请的目的在于提供一种扬声器、扬声器模组及电子设备。该扬声器融合了压电扬声器内核和动圈式扬声器内核，压电扬声器内核的振膜与动圈式扬声器内核的振膜相对设置、共用前腔，从而补足扬声器的中高频频响，提升扬声器的整体响度。
第一方面，本申请提供一种扬声器，包括支架、第一振膜、第一压电片以及动圈式扬声器内核。第一振膜的周缘固定于支架，第一压电片固定于第一振膜的中部。动圈式扬声器内核固定于支架且与第一振膜间隔设置，动圈式扬声器内核包括第二振膜，第二振膜面向第一振膜设置，第二振膜、支架及第一振膜共同包围形成前腔，支架开设有出音孔，出音孔连通前腔与扬声器的外部空间。
在本申请中，扬声器包括具有第一振膜和第一压电片的压电扬声器内核。由于扬声器融合了压电扬声器内核和动圈式扬声器内核，压电扬声器内核的第一振膜和动圈式扬声器内核的第二振膜能够同时推动前腔的空气发生振动、以实现发声，因此相较于传统的动圈式扬声器，本申请的扬声器的整体响度明显提升。相较于传统的动圈式扬声器，本申请的扬声器能够通过压电扬声器内核补足中高频频响，使得扬声器的中高频声压级得到显著提升。
此外，由于压电扬声器内核的厚度较薄，可以利用动圈式扬声器内核的第二振膜的顶部空间进行排布，第一振膜与第二振膜相对设置、共用前腔，因此扬声器能够在实现双振膜结构时节约空间、不明显增加整体体积，扬声器仍可以具有较小的厚度、整体体积较小。
一种可能的实现方式中，第一振膜可以是金属薄板、有机薄板或者其他。第一振膜的厚度可以在50μm至0.3mm的范围内。第一振膜可以呈矩形、圆形或其他形状。一种可能的实现方式中，第一压电片位于第一振膜背离支架的一侧或者朝向支架的一侧。第一压电片可以呈矩形、圆形或其他形状。一种可能的实现方式中，第一压电片的形状与第一振膜的形状相同，第一压电片的尺寸小于第一振膜的尺寸。
一种可能的实现方式中，支架包括相对设置的第一支撑部和第二支撑部，第一振膜的 周缘的两侧分别固定于第一支撑部与第二支撑部，出音孔设于第一支撑部。第二振膜包括振动部和球顶部，球顶部固定于振动部的中部。在第二支撑部向第一支撑部的方向上，第一振膜与球顶部之间的间距递增。
在本实现方式中，第一振膜相对第二振膜倾斜，两者大致呈喇叭状，且喇叭的张开方向朝向出音孔，有利于扬声器和外界的声阻抗匹配，提升发声效率，降低产生气流杂音的风险。
一种可能的实现方式中，第一振膜的面积大于或等于第二振膜的面积。在传统的动圈式扬声器中，由于模组整体体积受到较大的限制，因此其振膜面积难以提升。在本实现方式中，扬声器在第二振膜的面积有限的情况下，设置面积较大的第一振膜，以提升声压级。此外，随着第一振膜面积的增加，扬声器能够获得更大的前腔空间，使得扬声器的杂音较少，音质较佳。
一种可能的实现方式中，支架还包括安装部，安装部连接于第一支撑部与第二支撑部之间，安装部设有安装孔，动圈式扬声器内核固定于安装部，动圈式扬声器内核部分收容或全部收容于安装孔。
在本实现方式中，支架的第一支撑部及第二支撑部分别位于安装部的两侧，第一振膜的周缘的两侧固定于第一支撑部及第二支撑部，而第二振膜安装于安装部，故而能够使第一振膜的面积大于第二振膜。
一种可能的实现方式中，安装孔的形状与动圈式扬声器内核的外形相适配。安装孔可以大致呈矩形、圆形或其他形状。
一种可能的实现方式中，支架还包括相对设置的第三支撑部和第四支撑部，第三支撑部和第四支撑部连接于第一支撑部与第二支撑部之间，第一振膜的周缘的另外两侧分别固定于第三支撑部与第四支撑部。安装部还连接于第三支撑部与第四支撑部之间。
一种可能的实现方式中，第一支撑部包括第一子支撑部和第二子支撑部，第二子支撑部连接安装部，第一子支撑部连接第二子支撑部及第一振膜，第一子支撑部相对第二子支撑部向远离第二支撑部的方向凸出。
在本实现方式中，由于扬声器的第一子支撑部相对第二子支撑部向远离第二支撑部的方向凸出，故而扬声器能够在支架的底部结构和尺寸没有发生明显变化时，通过第一支撑部的用于固定第一振膜的第一子支撑部向远离第二支撑部的方向凸出，使得扬声器可以设置更大面积的第一振膜，从而提高声压级。
一种可能的实现方式中，支架还包括相对设置的第三支撑部和第四支撑部，第三支撑部和第四支撑部连接于第一支撑部与第二支撑部之间，第一振膜的周缘的另外两侧分别固定于第三支撑部与第四支撑部。换言之，第一支撑部、第三支撑部、第二支撑部及第四支撑部可以依次连接形成安装框部，第一振膜的周缘连续地固定于该安装框部。
支架还包括第一框部和第二框部，第一框部位于第三支撑部远离第四支撑部的一侧，第一框部的两端分别连接第一支撑部的一端和第二支撑部的一端，第一框部与第三支撑部之间形成第一连通空间，第二框部位于第四支撑部远离第三支撑部的一侧，第二框部的两端分别连接第一支撑部的另一端和第二支撑部的另一端，第二框部与第四支撑部之间形成第二连通空间。第一框部、第一支撑部、第二支撑部及第二框部的远离第一振膜的表面共 面设置。
在本实现方式中，第一框部、第一支撑部、第二支撑部及第二框部的远离第一振膜的表面共同拼接成支架的底面，扬声器安装于其他部件时，可以通过支架的底面与其他部件相固定。此时，安装部下方的空间形成扬声器的背腔的一部分，第一框部与第三支撑部之间的第一连通空间、以及第二框部与第四支撑部之间的第二连通空间也为扬声器的背腔的一部分。故而，第一框部和第二框部的设计有利于增加扬声器的背腔空间，提升了扬声器的低频声压级。此外，压电扬声器内核可以通过第一连通空间及第二连通空间与动圈式扬声器内核共用背腔，使得扬声器的背腔空间的总和较小，有利于扬声器的小型化。
一种可能的实现方式中，扬声器还包括第二压电片。第二压电片与第一压电片分别固定于第一振膜的两侧表面。第二压电片为压电扬声器内核的一部分。压电扬声器内核包括第一压电片和第二压电片，第一压电片和第二压电片能够同时驱动第一振膜，以提升压电扬声器内核的灵敏度。
第二方面，本申请还提供一种电子设备，包括壳体及前述扬声器，扬声器收容在壳体内，且支架固接壳体，壳体设有连通孔，连通孔连通出音孔与电子设备的外部空间。
在本申请中，由于扬声器的整体响度较高、中高频的声压级较高，因此应用该扬声器的电子设备的播放声音的音量较高、音质较佳。
一种可能的实现方式中，壳体包括中框和第一盖板，第一盖板固定于中框的一侧，连通孔设于中框的边框部和/或第一盖板。其中，扬声器可以作为电子设备的外放扬声器，连通孔设于中框的边框部。或者，扬声器可以作为电子设备的非外放扬声器，连通孔可以设于中框的边框部，或者设于第一盖板，或者部分设于中框的边框部、部分设于第一盖板。
一种可选的实现方式中，电子设备还包括密封件。密封件安装于壳体与支架之间，且环绕出音孔及连通孔设置。在本实现方式中，密封件能够隔断扬声器的前腔与背腔，从而降低声音在电子设备的内部空间的泄露。此外，压电扬声器内核的前腔与背腔完全分隔，能够有效避免出现声短路问题，使得压电扬声器内核的发声效率得以保证，扬声器的整体发声效率较高。
一种可能的实现方式中，壳体还包括第二盖板，第二盖板固定于中框远离第一盖板的一侧。支架固定于中框，第一振膜面向第一盖板设置，动圈式扬声器内核位于第一振膜与第二盖板之间。第一振膜与第一盖板之间形成第一背腔，第二振膜与第二盖板之间形成第二背腔。第一背腔和第二背腔均为扬声器的背腔的一部分。
在本实现方式中，扬声器能够利用电子设备内部空余的空间作为背腔，从而既能够降低扬声器的体积、有利于扬声器的轻薄化，并且扬声器的背腔的空间较大，能够有效提高扬声器的低频声压级。
一种可能的实现方式中，第二背腔与第一背腔彼此隔断或者相互连通。当第二背腔与第一背腔相互连通时，扬声器在基本保证其低频声压级要求时，对其背腔空间的总需求能够适当降低，从而有利于电子设备的小型化。当第二背腔与第一背腔彼此隔断时，压电扬声器内核的第一振膜的振动与动圈式扬声器内核的第二振膜的振动之间的相互干扰较小，有利于提高扬声器的音质。
一种可能的实现方式中，电子设备还包括第一器件，第一器件部分位于或全部位于第 一振膜与第二盖板之间。在本实现方式中，第一振膜与第一器件在电子设备的厚度方向上部分重叠，充分地利用了电子设备的厚度空间，有利于电子设备的小型化。同时，扬声器通过充分利用整机中的空余的空间，扩大了第一振膜的面积，提升了扬声器的声压级。
一种可能的实现方式中，第一器件可以是电连接器、电路板、麦克风等器件。
第三方面，本申请还提供一种扬声器模组，包括模组上盖、模组下盖及前述扬声器。模组上盖固定于支架安装有第一振膜的一侧，模组上盖固定于支架的另一侧。在本申请中，由于扬声器的整体响度较高，中高频的声压级较高，因此应用该扬声器的扬声器模组的播放声音的音量较高、音质较佳。
一种可能的实现方式中，模组上盖与第一振膜之间形成第一背腔，模组下盖与第二振膜之间形成第二背腔。第一背腔和第二背腔均为扬声器模组的背腔的一部分。第二背腔与第一背腔彼此隔断或者相互连通。当第二背腔与第一背腔相互连通时，扬声器模组在基本保证其低频声压级要求时，对其背腔空间的总需求能够适当降低，从而有利于扬声器模组的小型化。其中，第二背腔与第一背腔可以通过第一连通空间及第二连通空间彼此连通，第一连通空间及第二连通空间也为扬声器的背腔的一部分。当第二背腔与第一背腔彼此隔断时，压电扬声器内核的第一振膜的振动与动圈式扬声器内核的第二振膜的振动之间的相互干扰较小，有利于提高扬声器模组的音质。
第四方面，本申请还提供一种电子设备，包括壳体及前述扬声器模组，扬声器模组收容在壳体内，模组上盖和/或模组上盖固接壳体，壳体设有连通孔，连通孔连通出音孔与电子设备的外部空间。在本申请中，由于扬声器模组的扬声器的整体响度较高，中高频的声压级较高，因此应用该扬声器模组的电子设备的播放声音的音量较高、音质较佳。
附图说明
图1是本申请实施例提供的一种电子设备的结构示意图；
图2是图1所示电子设备在一些实施例中的部分分解示意图；
图3是本申请实施例提供的一种扬声器在一些实施例中的结构示意图；
图4是图3所示扬声器的分解示意图；
图5是图4所示动圈式扬声器内核的分解示意图；
图6是图3所示扬声器沿A-A处剖开的结构示意图；
图7是图3所示扬声器沿B-B处剖开的结构示意图；
图8是图3所示扬声器在一种可能的实现方式中的声压级示意图；
图9是图3所示扬声器作为外放扬声器应用于图2所示电子设备时的结构示意图一；
图10是图3所示扬声器作为外放扬声器应用于图2所示电子设备时的结构示意图二；
图11是本申请实施例提供的一种扬声器在另一些实施例中的结构示意图；
图12是图11所示扬声器沿C-C处剖开后的结构示意图；
图13是图11所示扬声器作为外放扬声器应用于图2所示电子设备时的结构示意图；
图14是本申请实施例提供的一种扬声器模组的结构示意图；
图15是图14所示扬声器模组的部分分解示意图；
图16是图14所示扬声器模组沿D-D处剖开后的结构示意图；
图17是图14所示扬声器模组沿E-E处剖开后的结构示意图；
图18是图14所示扬声器模组作为外放扬声器应用于图2所示电子设备时的结构示意图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
本申请实施例提供一种扬声器以及包括该扬声器的扬声器模组和电子设备。扬声器用于将电信号转换成声音信号。扬声器通过耦合压电扬声器内核和动圈式扬声器内核，形成双振膜结构，并且压电扬声器内核的振膜与动圈式扬声器内核的振膜相对设置，共用前腔，从而补足扬声器的中高频频响，提升扬声器的整体响度。
其中，扬声器可以独立安装于电子设备，也可以作为扬声器模组的内核，随扬声器模组整体安装于电子设备。电子设备可以是手机、平板电脑、笔记本电脑、可穿戴设备等具有声音播放功能的电子产品。可穿戴设备可以是智能手环、智能手表、智能头显、智能眼镜等。
请一并参阅图1和图2，图1是本申请实施例提供的一种电子设备100的结构示意图，图2是图1所示电子设备100在一些实施例中的部分分解示意图。图1中，以电子设备100是手机为例进行说明。
电子设备100包括壳体10以及收容在壳体10内的电路板20、电池30、摄像头模组40、外放扬声器50以及非外放扬声器60。其中，后文为方便说明电子设备100的结构，以图1中电子设备100所在方位为示例，定义电子设备100的宽度方向为X方向，电子设备100的长度方向为Y方向，电子设备100的厚度方向为Z方向，电子设备100的宽度方向X、电子设备100的长度方向Y及电子设备100的厚度方向Z两两相互垂直。
壳体10包括中框101及分别固定于中框101两侧的第一盖板102和第二盖板103。一些实施例中，第一盖板102可以为电子设备100的前盖板，第二盖板103可以为电子设备100的后盖板。第一盖板102包括层叠设置的保护盖板和显示面板，显示面板固定于保护盖板朝向第二盖板103的一侧。显示面板用于显示图像，显示面板还可以集成有触摸功能。中框101包括边框部1011和位于边框部1011内侧的固定部1012，中框101的边框部1011的两侧分别固接第一盖板102的周缘和第二盖板103的周缘，中框101的固定部1012位于第一盖板102与第二盖板103之间，用于固定位于电子设备100的收容于壳体10内的一个或多个部件。需要说明的是，图2中只示意出中框101的固定部1012的部分结构，中框101的固定部1012还有另一部分结构未在图2中示意。其中，中框101的边框部1011与固定部1012可以一体成型，也可以通过组装方式形成一体式结构，本申请对此不做严格限定。其中，中框101的边框部1011与第二盖板103可以一体成型，也可以通过组装方式形成一体式结构，本申请对此不做严格限定。
示例性的，电路板20、电池30及摄像头模组40均固接中框101。电路板20上可以固定有多个器件201。多个器件201包括但不限于处理器、存储器等，存储器耦合处理器。其中，电路板20的数量可以为一个或多个。电池30用于为电子设备100供电。摄像头模组40用于采集光线，以进行拍摄。示例性的，摄像头模组40用于电子设备100的后置拍 摄，第二盖板103设有拍摄通孔1031，摄像头模组40通过拍摄通孔1031采集光线。摄像头模组40可以包括一个或多个摄像头。在其他一些实施例中，电子设备100还可以包括用于前置拍摄的摄像头模组，也可以包括用于采集人脸图像和/或瞳孔图像的摄像头模组，本申请不对摄像头模组的具体数量、类型等做严格限定。本申请实施例中，“A和/或B”包括“A”、“B”以及“A和B”三种情况。
示例性的，外放扬声器50和非外放扬声器60均固接壳体10的中框101。其中，非外放扬声器60也可以称为听筒，可以用于在用户进行非免提通话时将对方的声音传输给用户；外放扬声器50也可以成为喇叭，可以用于在免提电话时将对方的声音放大播放给用户，也可以用于外放音乐、导航语音、广播等需要外放声音或音频信号的场合。
示例性的，壳体10设有连通孔，连通孔连通壳体10的内侧空间与壳体10的外侧空间，也即连通电子设备100的内部空间与电子设备100的外部空间。壳体10的连通孔的数量及位置可以配合电子设备100的外放扬声器50及非外放扬声器60的发声类型、排布位置、出声位置等因素进行设计。
一些实施例中，外放扬声器50通过振膜推动空气振动的方式实现发声。外放扬声器50固定于中框101的固定部1012。壳体10包括用作扬声孔的连通孔104，连通孔104可以设于中框101的边框部1011，外放扬声器50可以通过连通孔104将声音传输至电子设备100的外部空间，以实现声音播放。这部分连通孔104的数量可以为一个或多个。连通孔104的数量和形状可以配合设计，以使连通孔104的总横截面积满足出声需求。其中，电子设备100还可以包括密封件70。密封件70可以大致呈框体。密封件70可以安装于中框101的边框部1011与外放扬声器50之间，且环绕连通孔104排布，以降低声音在电子设备100的内部空间的泄露。示例性的，密封件70可以为双面胶或泡棉等。
一些实施例中，非外放扬声器60通过振膜推动空气振动的方式实现发声。壳体10包括用作听筒孔的连通孔105，连通孔105可以设于第一盖板102，非外放扬声器60可以通过连通孔105将声音传输至电子设备100的外部空间，以实现声音播放。在另一些实施例中，连通孔105也可以设于中框101的边框部1011。在再一些实施例中，连通孔105也可以部分设于第一盖板102、部分设于中框101的边框部1011，两部分相拼接。在其他一些实施例中，非外放扬声器60也可以通过屏幕发声的方式实现发声，此时，壳体10可以省略用作听筒孔的连通孔105。
可以理解的是，上述描述示意出了电子设备100的外放扬声器50及非外放扬声器60的一些实施方式，外放扬声器50及非外放扬声器60也可以有其他的实施方式，本申请对此不作严格限定。
以下结合附图说明本申请实施例提供的一种扬声器，该扬声器可以作为电子设备100的外放扬声器50和/或非外放扬声器60使用。
请一并参阅图3和图4，图3是本申请实施例提供的一种扬声器1在一些实施例中的结构示意图，图4是图3所示扬声器1的分解示意图。
一些实施例中，扬声器1包括支架11、压电扬声器内核12以及动圈式扬声器内核13。压电扬声器内核12及动圈式扬声器内核13均安装于支架11。
一些实施例中，压电扬声器内核12包括第一振膜121、第一压电片122以及第二压电 片123。第一振膜121包括中部及环绕中部设置的周缘。第一振膜121的周缘固定于支架11。第一压电片122和第二压电片123固定于第一振膜121的中部，且分别固定于第一振膜121的两侧表面。示例性的，第一压电片122位于第一振膜121背离支架11的一侧，第二压电片123位于第一振膜121朝向支架11的一侧。在其他一些实施例中，第一压电片122的位置与第二压电片123的位置可以互相调换。
第一压电片122和第二压电片123通电时发生形变，带动第一振膜121发生振动，压电扬声器内核12实现发声。在其他一些实施例中，压电扬声器内核12也可以包括第一压电片122、省略第二压电片123，第一压电片122位于第一振膜121背离支架11的一侧或朝向支架11的一侧，压电扬声器内核12通过第一压电片122驱动第一振膜121振动。
第一振膜121可以呈矩形。一些实施例中，第一振膜121可以是金属薄板、有机薄板或者其他。一些实施例中，第一振膜121的厚度可以在50μm至0.3mm的范围内，当第一振膜121的面积较大时，可以选用较大的厚度。
第一压电片122和第二压电片123可以呈矩形。在其他一些实施例中，第一振膜121也可以呈圆形等其他形状。在其他一些实施例中，第一压电片122和/或第二压电片123也可以呈圆形等其他形状。示例性的，第一压电片122和第二压电片123的形状可以与第一振膜121的形状相同，第一压电片122和第二压电片123的尺寸小于第一振膜121的尺寸。
一些实施例中，支架11包括相对设置的第一支撑部111和第二支撑部112、以及相对设置的第三支撑部113和第四支撑部114，第三支撑部113和第四支撑部114连接于第一支撑部111与第二支撑部112之间。示例性的，第一支撑部111、第三支撑部113、第二支撑部112及第四支撑部114可以依次连接形成安装框部110，第一振膜121的周缘连续地固定于该安装框部110。支架11开设有出音孔115，出音孔115设于第一支撑部111。出音孔115贯穿第一支撑部111，以连通第一支撑部111两侧的空间。
一些实施例中，支架11还包括安装部116。安装部116连接于第一支撑部111与第二支撑部112之间。安装部116还连接于第三支撑部113与第四支撑部114之间。安装部116设有安装孔1161。安装孔1161连通安装部116的顶侧空间与底侧空间。示例性的，安装孔1161可以大致呈矩形。其他一些实施例中，安装孔1161也可以呈圆形等其他形状，安装孔1161的形状与动圈式扬声器内核13的外形相适配。可以理解的是，本申请实施例所采用“顶”、“底”等方位用词主要依据相关结构于附图中的展示方位进行阐述，并不形成对相关结构于实际应用场景中的方位的限定。
一些实施例中，支架11还可以包括第一框部117和第二框部118。第一框部117和第二框部118分别固定于安装框部110的两侧。第一框部117位于第三支撑部113远离第四支撑部114的一侧，第一框部117的两端分别连接第一支撑部111的一端和第二支撑部112的一端，第一框部117与第三支撑部113之间形成第一连通空间1171。第二框部118位于第四支撑部114远离第三支撑部113的一侧，第二框部118的两端分别连接第一支撑部111的另一端和第二支撑部112的另一端，第二框部118与第四支撑部114之间形成第二连通空间1181。
请一并参阅图4和图5，图5是图4所示动圈式扬声器内核13的分解示意图。
一些实施例中，动圈式扬声器内核13包括盆架131、振动组件13a以及磁路组件13b。 振动组件13a及磁路组件13b安装于盆架131。振动组件13a包括第二振膜132和音圈133。第二振膜132的周缘固定于盆架131的一侧，音圈133固定于第二振膜132朝向盆架131的一侧。磁路组件13b包括下极片134、中心磁铁135、多个边磁铁136、中心极片137及边极片138。下极片134固定于盆架131的另一侧，中心磁铁135及多个边磁铁136均固定于下极片134朝向盆架131的一侧，多个边磁铁136分散地排布于中心磁铁135的周边，中心极片137固定于中心磁铁135远离下极片134的一侧，边极片138固定于盆架131、位于多个边磁铁136远离下极片134的一侧并围绕中心极片137设置。其中，多个边磁铁136与中心磁铁135之间形成第一间隙，边极片138与中心极片137之间形成第二间隙，第二间隙连通第一间隙以合并为磁间隙。音圈133远离第二振膜132的端部插入磁路组件13b的磁间隙。磁路组件13b提供驱动音圈133振动的磁场，当音圈133通电时，音圈133带动第二振膜132振动，动圈式扬声器内核13实现发声。
一些实施例中，第二振膜132可以包括振动部1321和球顶部1322，振动部1321的周缘固定于盆架131，球顶部1322固定于振动部1321的中部。其中，球顶部1322可以固定于振动部1321朝向盆架131的一侧或远离盆架131的一侧。球顶部1322大致呈平板状，振动部1321大致呈折环状。
请一并参阅图6和图7，图6是图3所示扬声器1沿A-A处剖开的结构示意图，图7是图3所示扬声器1沿B-B处剖开的结构示意图。
压电扬声器内核12的第一振膜121的周缘固定于支架11。第一振膜121的周缘的两侧分别固定于第一支撑部111与第二支撑部112，第一振膜121的周缘的另外两侧分别固定于第三支撑部113与第四支撑部114。第一压电片122和第二压电片123分别固定于第一振膜121的两侧表面。
动圈式扬声器内核13固定于支架11且与第一振膜121间隔设置。示例性的，动圈式扬声器内核13固定于安装部116，动圈式扬声器内核13部分收容或全部收容于安装部116的安装孔1161。此时，动圈式扬声器内核13大致位于压电扬声器内核12的下方。
动圈式扬声器内核13的第二振膜132面向第一振膜121设置，第二振膜132、支架11及第一振膜121共同包围形成前腔1a。示例性的，第二振膜132、安装部116、安装框部110及第一振膜121共同包括形成前腔1a。支架11的出音孔115连通前腔1a至扬声器1的外部空间。当扬声器1通电工作时，第一振膜121和第二振膜132推动前腔1a的空气发生振动，扬声器1经出音孔115向外部空间发出声音。
在本实施例中，由于扬声器1融合了压电扬声器内核12和动圈式扬声器内核13，压电扬声器内核12的第一振膜121和动圈式扬声器内核13的第二振膜132能够同时推动前腔1a的空气发生振动、以实现发声，因此相较于传统的动圈式扬声器，本申请实施例的扬声器1的整体响度明显提升。相较于传统的动圈式扬声器，本申请实施例的扬声器1能够通过压电扬声器内核12补足中高频频响，使得扬声器1的中高频声压级得到显著提升。
此外，由于压电扬声器内核12的厚度较薄，可以利用动圈式扬声器内核13的第二振膜132的顶部空间进行排布，第一振膜121与第二振膜132相对设置、共用前腔，因此扬声器1能够在实现双振膜结构时节约空间、不明显增加整体体积，扬声器1仍可以具有较小的厚度、整体体积较小。
申请人通过仿真、实验等方式对本申请实施例的扬声器1进行验证，对于中高频频段，相对于传统的动圈式扬声器，本申请实施例的扬声器1能够在1Hz-10kHz的频段增强声压级，在10kHz-20kHz的频段拓展频响宽度、增强声压级。
请参阅图8，图8是图3所示扬声器1在一种可能的实现方式中的声压级示意图。如图8所示，本实施例扬声器1的总的声压级优于传统的压电扬声器和传统的动圈式扬声器，相对于传统的动圈式扬声器，本实施例扬声器1的中高频声压级有显著提升。
可以理解的是，请再次参阅图6，本申请实施例的扬声器1可以通过控制压电扬声器内核12和动圈式扬声器内核13的驱动电压的幅度和相位，调整第一振膜121和第二振膜132的振动方向和振幅，以实现减振。一些实施例中，压电扬声器内核12可以根据第二振膜132与第一振膜121的振动质量的比例、第二振膜132的振动方向和振幅，令其驱动电压匹配合适的幅度和相位，控制第一振膜121的振动方向和振幅，以使第一振膜121的动量变化与第二振膜132的动量变化相等或相近，起到减振的作用。在其他一些实施例中，动圈式扬声器内核13可以根据第一振膜121与第二振膜132的振动质量的比例、第一振膜121的振动方向和振幅，令其驱动电压匹配合适的幅度和相位，控制第二振膜132的振动方向和振幅，以使第二振膜132的动量变化与第一振膜121的动量变化相等或相近，起到减振的作用。本申请不对压电扬声器内核12和动圈式扬声器内核13的驱动电压和相位的调节方式做严格限定，两者最后实现相互匹配即可。
其中，第一振膜121的动量变化与第二振膜132的动量变化相等时满足：M 1V 1＝M 2V 2。M 1为第一振膜121的质量，V 1为第一振膜121的振动速度，M 2为第二振膜132的质量，V 2为第二振膜132的振动速度。
其中，在压电扬声器内核12和动圈式扬声器内核13固定至支架11时，需选择正确的电极连接方式，使得两者的驱动电压能够正确地驱动振膜振动，以满足振动需求。例如，当第二振膜132向靠近第一振膜121的方向振动时，第一振膜121向靠近第二振膜132的方向振动，也即两者向靠近彼此的方向振动，前腔1a内的空气被第一振膜121和第二振膜132挤压，通过出音孔115排出至扬声器1的外部空间；当第二振膜132向远离第一振膜121的方向振动时，第一振膜121向远离第二振膜132的方向振动，也即两者向远离彼此的方向振动，扬声器1的外部空间的空气经出音孔115被吸入前腔1a。
在本申请实施例中，扬声器1可以通过两个功率放大器(power amplifier，PA)分别驱动压电扬声器内核12的压电片(122、123)和动圈式扬声器内核13的音圈133，以更好地满足两个扬声器1内核的驱动电压需求。例如，压电扬声器内核12的驱动电压可以在30V左右，动圈式扬声器内核13的驱动电压可以在12V左右。当然，在其他一些实施例中，也可以通过同一个功率放大器实现驱动。
如图6所示，一些实施例中，在第二支撑部112向第一支撑部111的方向上，第一振膜121与第二振膜132的球顶部1322之间的间距递增。在本实施例中，第一振膜121相对第二振膜132倾斜，两者大致呈喇叭状，且喇叭的张开方向朝向出音孔115，有利于扬声器1和外界的声阻抗匹配，提升发声效率，降低产生气流杂音的风险。
其中，当第一振膜121相对第二振膜132的倾斜程度一定角度时，扬声器1的气流杂音能够降低到很小，扬声器1的音质更佳。而第一振膜121相对第二振膜132的倾斜程度 会影响到扬声器1的整体厚度越大，易导致扬声器1难以适用于内部空间较为紧张的电子设备100中。故而，扬声器1可以平衡降低气流杂音的需求和安装空间的需求，对第一振膜121相对第二振膜132的倾斜程度进行合理设计。在其他一些实施例中，第一振膜121与第二振膜132的球顶部1322也可以相互平行。
示例性的，第一振膜121与第二振膜132之间的最小间距需满足两者的振动空间需求，故而在扬声器1整体体积能够控制在合理范围内时，两者之间的间距越大越好。一些实施例中，第一振膜121与第二振膜132之间的最小间距可以为0.7mm。
如图6和图7所示，一些实施例中，第一振膜121的面积大于或等于第二振膜132的面积。在传统的动圈式扬声器中，由于模组整体体积受到较大的限制，因此其振膜面积难以提升。在本实施例中，扬声器1在第二振膜132的面积有限的情况下，设置面积较大的第一振膜121，以提升声压级。此外，随着第一振膜121面积的增加，扬声器1能够获得更大的前腔1a空间，使得扬声器1的杂音较少，音质较佳。
在本实施例中，支架11的安装框部110围绕安装部116的周侧设置，第一振膜121的周缘固定于安装框部110，而第二振膜132安装于安装部116，故而能够使第一振膜121的面积大于第二振膜132。在其他一些实施例中，支架11也可以有其他结构，以满足第一振膜121与第二振膜132的安装空间需求，例如安装框部110与安装部116上下堆叠设置，安装框部110在远离安装部116的方向上呈喇叭状，安装框部110在远离安装部116的一端具有较大的开口区域，以满足第一振膜121的安装空间需求。
在其他一些实施例中，第一振膜121的面积也可以等于或小于第二振膜132的面积，本申请实施例对此不做严格限定。
一些实施例中，如图6和图7所示，支架11的第一框部117、第一支撑部111、第二支撑部112及第二框部118的远离第一振膜121的表面共面设置。在本实施例中，第一框部117的底面、第一支撑部111的底面、第二支撑部112的底面及第二框部118的底面共同拼接成支架11的底面，扬声器1安装于其他部件时，可以通过支架11的底面与其他部件相固定。此时，安装部116下方的空间形成扬声器1的背腔的一部分，第一框部117与第三支撑部113之间的第一连通空间1171、以及第二框部118与第四支撑部114之间的第二连通空间1181也为扬声器1的背腔的一部分。故而，第一框部117和第二框部118的设计有利于增加扬声器1的背腔空间，提升了扬声器1的低频声压级。此外，压电扬声器内核12可以通过第一连通空间1171及第二连通空间1181与动圈式扬声器内核13共用背腔，使得扬声器1的背腔空间的总和较小，有利于扬声器1的小型化。
在其他一些实施例中，扬声器1通过其安装框部110的底面与其他部件相固定，安装部116下方的空间形成扬声器1的背腔空间的一部分。在扬声器1的背腔空间足够时，支架11也可以省略第一框部117和第二框部118，以减小扬声器1的体积。
请一并参阅图9和图10，图9是图3所示扬声器1作为外放扬声器50应用于图2所示电子设备100时的结构示意图一，图10是图3所示扬声器1作为外放扬声器50应用于图2所示电子设备100时的结构示意图二。
扬声器1收容在电子设备100的壳体10内，扬声器1的支架11固接壳体10。一些实施例中，支架11固定于中框101，例如支架11可以固接中框101的固定部1012。支架11 可以通过粘接的方式与中框101的固定部1012相互固定，也可以通过卡接、焊接等其他方式与中框101的固定部1012相互固定，本申请对此不做严格限定。第一振膜121面向第一盖板102设置，动圈式扬声器内核13位于第一振膜121与第二盖板103之间。扬声器1的前腔1a位于第一振膜121与第二振膜132之间。第一振膜121与第一盖板102之间形成第一背腔106，第二振膜132与第二盖板103之间形成第二背腔107，第二背腔107与第一背腔106相互连通。示例性的，第二背腔107与第一背腔106通过第一连通空间1171及第二连通空间1181连通。第一背腔106、第二背腔107、第一连通空间1171及第二连通空间1181均为扬声器1的背腔1b的一部分。
壳体10设有连通孔104。示例性的，连通孔104设于中框101的边框部1011。连通孔104连通出音孔115至电子设备100的外部空间。此时，扬声器1的前腔1a、扬声器1的出音孔115、壳体10的连通孔104以及电子设备100的外部空间相连通，扬声器1的声音能够顺利传播至电子设备100的外部。
在本实施例中，由于扬声器1的整体响度较高、中高频的声压级较高，因此应用该扬声器1的电子设备100的播放声音的音量较高、音质较佳。此外，扬声器1能够利用电子设备100内部空余的空间作为背腔1b，从而既能够降低扬声器1的体积、有利于扬声器1的轻薄化，并且扬声器1的背腔1b的空间较大，能够有效提高扬声器1的低频声压级。此外，由于扬声器1的第二背腔107与第一背腔106相互连通，故而扬声器1在基本保证其低频声压级要求时，对其背腔1b空间的总需求能够适当降低，从而有利于电子设备100的小型化。
在其他一些实施例中，扬声器1可以通过改变扬声器1的支架11结构，或者改变中框101的固定部1012结构，或者改变支架11与中框101的固定部1012之间的配合结构等，使得第二背腔107与第一背腔106彼此隔断。此时，压电扬声器内核12的第一振膜121的振动与动圈式扬声器内核13的第二振膜132的振动之间的相互干扰较小，有利于提高扬声器1的音质。
一些实施例中，如图9所示，电子设备100的密封件70安装于中框101的边框部1011与支架11之间，密封件70环绕出音孔115及连通孔104设置，以隔断扬声器1的前腔1a与背腔1b，降低声音在电子设备100的内部空间的泄露。此外，压电扬声器内核12的前腔与背腔完全分隔，能够有效避免出现声短路问题，使得压电扬声器内核12的发声效率得以保证，扬声器1的整体发声效率较高。
在本申请实施例中，扬声器1可以通过改变支架11的部分结构，以安装更大面积的第一振膜121，从而提高声压级。例如，扬声器1可以在保持支架11的基本框架的情况下，使第一支撑部111的用于固定第一振膜121的顶部向远离第二支撑部112的方向凸出，使得第一支撑部111的凸出的顶部与第二支撑部112之间的间距较大，以固定更大面积的第一振膜121，并且第一支撑部111的底部与支架11的其他部分的相对位置关系未发生变化或未发生明显变化，使得扬声器1通过支架11底部进行安装时的安装难度较小。以下实施例进行举例说明。
请一并参阅图11和图12，图11是本申请实施例提供的一种扬声器1在另一些实施例中的结构示意图，图12是图11所示扬声器1沿C-C处剖开后的结构示意图。本实施例扬 声器1可以包括前述实施例扬声器1的部分特征或全部特征，后文主要描述本实施例扬声器1的不同之处。
示例性的，第一支撑部111包括第一子支撑部111a和第二子支撑部111b。第二子支撑部111b连接安装部116，第一子支撑部111a连接第二子支撑部111b及第一振膜121。第一子支撑部111a相对第二子支撑部111b向远离第二支撑部112的方向凸出。
在本实施例中，由于扬声器1的第一子支撑部111a相对第二子支撑部111b向远离第二支撑部112的方向凸出，故而，扬声器1能够在支架11的底部结构和尺寸没有发生明显变化时，通过第一支撑部111的用于固定第一振膜121的第一子支撑部111a向远离第二支撑部112的方向凸出，使得扬声器1可以设置更大面积的第一振膜121，从而提高声压级。
一些实施例中，如图12所示，第一子支撑部111a固定于第二子支撑部111b远离第二支撑部112的一侧。其中，第二子支撑部111b面向第一振膜121的表面111c可以倾斜设置，表面111c靠近第一子支撑部111a的一端靠近第一振膜121，以使第一子支撑部111a与第二子支撑部111b的连接面积较大、两者的连接可靠性高，表面111c靠近安装部116的一端远离第一振膜121，以增加扬声器1的前腔1a空间，也为第一振膜121提供充足的振动空间。其他一些实施例中，第一子支撑部111a也可以固定于第二子支撑部111b朝向第一振膜121的一侧，第一子支撑部111a远离第二子支撑部111b的一端向远离第二支撑部112的方向倾斜。
请参阅图13，图13是图11所示扬声器1作为外放扬声器50应用于图2所示电子设备100时的结构示意图。示例性的，扬声器1的支架11的第一支撑部111的第二子支撑部111b以及第二支撑部112、与中框101的固定部1012相固定。电子设备100还包括第一器件80，第一器件80部分位于或全部位于第一振膜121与第二盖板103之间。示例性的，第一器件80可以是电连接器、电路板、麦克风等器件。此时，第一振膜121、第一子支撑部111a以及第一器件80在电子设备100的厚度方向Z上部分重叠，充分地利用了电子设备100的厚度空间，有利于电子设备100的小型化。同时，扬声器1通过充分利用整机中的空余的空间，扩大了第一振膜121的面积，提升了扬声器1的声压级。
在其他一些实施例中，当电子设备100内部的空余的空间位于扬声器1周边的其他位置时，扬声器1的支架11的结构也可以做适应性调整，以使第一振膜121能够充分利用空余的空间以增加面积。例如，在支架11未设置第一框部117和第二框部118的实施例中，第三支撑部113的顶部可以相对第三支撑部113的底部向远离第四支撑部114的方向凸起，以利用第三支撑部113外侧的空余的空间增加第一振膜121的面积；第四支撑部114的顶部可以相对第四支撑部114的底部向远离第三支撑部113的方向凸起，以利用第四支撑部114外侧的空余的空间增加第一振膜121的面积。
需要说明的是，在其他一些实施例中，支架11可以在满足前文描述的对压电扬声器内核12及动圈式扬声器内核13的支撑需求、前腔1a与出音孔115的空间需求等需求的情况下，设计为与前述实施例不同的结构，本申请对此不做严格限定。
需要说明的是，前文中主要以图3所示扬声器1和图11所示扬声器1作为外放扬声器50应用于电子设备100时的实施例进行说明，而图3所示扬声器1和图11所示扬声器1同样可以作为非外放扬声器60应用于电子设备100(参阅图2)，扬声器1的前腔1a与连 通孔105连通，本申请更具化的细节不再赘述。
请一并参阅图14和图15，图14是本申请实施例提供的一种扬声器模组2的结构示意图，图15是图14所示扬声器模组2的部分分解示意图。
扬声器模组2包括模组上盖21、模组下盖22及前文描述的扬声器1。模组上盖21固定于支架11安装有第一振膜121的一侧，模组上盖21固定于支架11的另一侧，也即，模组上盖21及模组下盖22分别固定于支架11的两侧。模组上盖21和模组下盖22可以通过粘接等方式与支架11相互固定。本实施例中，由于扬声器1的整体响度较高，中高频的声压级较高，因此应用该扬声器1的扬声器模组2的播放声音的音量较高、音质较佳。
其中，模组上盖21设有第一泄露孔211，第一泄露孔211连通模组上盖21的两侧的空间。模组下盖22设有第二泄露孔221，第二泄露孔221连通模组下盖22的两侧的空间。
请一并参阅图16和图17，图16是图14所示扬声器模组2沿D-D处剖开后的结构示意图，图17是图14所示扬声器模组2沿E-E处剖开后的结构示意图。
模组上盖21与第一振膜121之间形成第一背腔212，模组下盖22与第二振膜132之间形成第二背腔222，第二背腔222与第一背腔212相互连通。第二背腔222与第一背腔212通过第一连通空间1171及第二连通空间1181相互连通。第一背腔212、第二背腔222、第一连通空间1171及第二连通空间1181均为扬声器模组2的背腔的一部分。在本实施例中，由于第二背腔222与第一背腔212相互连通，因此第一振膜121和第二振膜132共用背腔，能够降低扬声器模组2的背腔的总空间大小的需求，有利于扬声器模组2的小型化。
其中，第一泄露孔211连通第一背腔212，第二泄露孔221连通第二背腔222。在其他一些实施例中，扬声器模组2也可以省略第一泄露孔211或第二泄露孔221中的一者。
在其他一些实施例中，第二背腔222与第一背腔212也可以彼此隔断。例如，可以省略支架11的第一框部117和第二框部118，模组上盖21及模组下盖22连接支架11的安装框部110。
请参阅图18，图18是图14所示扬声器模组2作为外放扬声器50应用于图2所示电子设备100时的结构示意图。本实施例电子设备100可以包括前述实施例电子设备100的部分特征或全部特征，后文主要描述本实施例的电子设备100的不同之处。
扬声器模组2收容在壳体10内，模组下盖22固接壳体10。例如，模组下盖22固接壳体10的中框101的固定部1012。壳体10设有连通孔104，连通孔104连通出音孔115至电子设备100的外部空间。在本实施例中，由于扬声器模组2的扬声器1的整体响度较高，中高频的声压级较高，因此应用该扬声器模组2的电子设备100的播放声音的音量较高、音质较佳。
在其他一些实施例中，扬声器模组2也可以通过模组上盖21固接壳体10，或者模组上盖21和模组下盖22均固接壳体10，本申请不对扬声器模组2在电子设备100中的固定方式做严格限定。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内；在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (13)

  1. 一种扬声器，其特征在于，包括支架、第一振膜、第一压电片以及动圈式扬声器内核；
    所述第一振膜的周缘固定于所述支架，所述第一压电片固定于所述第一振膜的中部；
    所述动圈式扬声器内核固定于所述支架且与所述第一振膜间隔设置，所述动圈式扬声器内核包括第二振膜，所述第二振膜面向所述第一振膜设置，所述第二振膜、所述支架及所述第一振膜共同包围形成前腔，所述支架开设有出音孔，所述出音孔连通所述前腔与所述扬声器的外部空间。
  2. 根据权利要求1所述的扬声器，其特征在于，所述支架包括相对设置的第一支撑部和第二支撑部，所述第一振膜的周缘的两侧分别固定于所述第一支撑部与所述第二支撑部，所述出音孔设于所述第一支撑部；
    所述第二振膜包括振动部和球顶部，所述球顶部固定于所述振动部的中部；
    在所述第二支撑部向所述第一支撑部的方向上，所述第一振膜与所述球顶部之间的间距递增。
  3. 根据权利要求2所述的扬声器，其特征在于，所述第一振膜的面积大于或等于所述第二振膜的面积。
  4. 根据权利要求3所述的扬声器，其特征在于，所述支架还包括安装部，所述安装部连接于所述第一支撑部与所述第二支撑部之间，所述安装部设有安装孔，所述动圈式扬声器内核固定于所述安装部，所述动圈式扬声器内核部分收容或全部收容于所述安装孔。
  5. 根据权利要求4所述的扬声器，其特征在于，所述第一支撑部包括第一子支撑部和第二子支撑部，所述第二子支撑部连接所述安装部，所述第一子支撑部连接所述第二子支撑部及所述第一振膜，所述第一子支撑部相对所述第二子支撑部向远离所述第二支撑部的方向凸出。
  6. 根据权利要求2至5中任一项所述的扬声器，其特征在于，所述支架还包括相对设置的第三支撑部和第四支撑部，所述第三支撑部和所述第四支撑部连接于所述第一支撑部与所述第二支撑部之间，所述第一振膜的周缘的另外两侧分别固定于所述第三支撑部与所述第四支撑部；
    所述支架还包括第一框部和第二框部，所述第一框部位于所述第三支撑部远离所述第四支撑部的一侧，所述第一框部的两端分别连接所述第一支撑部的一端和所述第二支撑部的一端，所述第一框部与所述第三支撑部之间形成第一连通空间，所述第二框部位于所述第四支撑部远离所述第三支撑部的一侧，所述第二框部的两端分别连接所述第一支撑部的另一端和所述第二支撑部的另一端，所述第二框部与所述第四支撑部之间形成第二连通空 间；
    所述第一框部、所述第一支撑部、所述第二支撑部及所述第二框部的远离所述第一振膜的表面共面设置。
  7. 根据权利要求1至5中任一项所述的扬声器，其特征在于，所述扬声器还包括第二压电片，所述第二压电片与所述第一压电片分别固定于所述第一振膜的两侧表面。
  8. 一种电子设备，其特征在于，包括壳体及权利要求1至7中任一项所述的扬声器，所述扬声器收容在所述壳体内，且所述支架固接所述壳体，所述壳体设有连通孔，所述连通孔连通所述出音孔与所述电子设备的外部空间。
  9. 根据权利要求8所述的电子设备，其特征在于，所述壳体包括中框和第一盖板，所述第一盖板固定于所述中框的一侧，所述连通孔设于所述中框的边框部和/或所述第一盖板。
  10. 根据权利要求9所述的电子设备，其特征在于，所述壳体还包括第二盖板，所述第二盖板固定于所述中框远离所述第一盖板的一侧；
    所述支架固定于所述中框，所述第一振膜面向所述第一盖板设置，所述动圈式扬声器内核位于所述第一振膜与所述第二盖板之间；
    所述第一振膜与所述第一盖板之间形成第一背腔，所述第二振膜与所述第二盖板之间形成第二背腔，所述第二背腔与所述第一背腔彼此隔断或者相互连通。
  11. 根据权利要求10所述的电子设备，其特征在于，所述电子设备还包括第一器件，所述第一器件部分位于或全部位于所述第一振膜与所述第二盖板之间。
  12. 一种扬声器模组，其特征在于，包括模组上盖、模组下盖及权利要求1至7中任一项所述的扬声器，所述模组上盖固定于所述支架安装有所述第一振膜的一侧，所述模组上盖固定于所述支架的另一侧；
    所述模组上盖与所述第一振膜之间形成第一背腔，所述模组下盖与所述第二振膜之间形成第二背腔，所述第二背腔与所述第一背腔彼此隔断或者相互连通。
  13. 一种电子设备，其特征在于，包括壳体及权利要求12所述的扬声器模组，所述扬声器模组收容在所述壳体内，所述模组上盖和/或所述模组上盖固接所述壳体，所述壳体设有连通孔，所述连通孔连通所述出音孔与所述电子设备的外部空间。
PCT/CN2021/070212 2020-01-08 2021-01-05 扬声器、扬声器模组及电子设备 WO2021139632A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP21738865.1A EP4068804A4 (en) 2020-01-08 2021-01-05 SPEAKER, SPEAKER MODULE, AND ELECTRONIC DEVICE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010019342.3 2020-01-08
CN202010019342.3A CN113099367A (zh) 2020-01-08 2020-01-08 扬声器、扬声器模组及电子设备

Publications (1)

Publication Number Publication Date
WO2021139632A1 true WO2021139632A1 (zh) 2021-07-15

Family

ID=76663454

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/070212 WO2021139632A1 (zh) 2020-01-08 2021-01-05 扬声器、扬声器模组及电子设备

Country Status (3)

Country Link
EP (1) EP4068804A4 (zh)
CN (1) CN113099367A (zh)
WO (1) WO2021139632A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113840023A (zh) * 2021-09-13 2021-12-24 维沃移动通信有限公司 电子设备、控制方法及控制装置
CN114513729A (zh) * 2022-01-07 2022-05-17 华为技术有限公司 电子设备及声学换能器
CN117041398A (zh) * 2023-08-17 2023-11-10 荣耀终端有限公司 一种电子设备

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113810800B (zh) * 2021-09-16 2024-01-09 维沃移动通信有限公司 扬声器模组及其声音调节方法、装置和电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204425650U (zh) * 2014-10-31 2015-06-24 捷音特科技股份有限公司 压电陶瓷双频耳机结构
CN104869515A (zh) * 2015-06-08 2015-08-26 西安康弘新材料科技有限公司 动圈扬声器配合压电扬声器高保真音箱
CN204697287U (zh) * 2015-06-09 2015-10-07 歌尔声学股份有限公司 压电扬声器
CN206181371U (zh) * 2016-10-31 2017-05-17 常州阿木奇声学科技有限公司 一种具有陶瓷压电单元的动圈扬声器
CN107371077A (zh) * 2016-05-13 2017-11-21 宇音国际有限公司 动圈压电双音频扬声器的耳机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5193119A (en) * 1985-09-02 1993-03-09 Franco Tontini Multiple loudspeaker
US20140044300A1 (en) * 2012-08-08 2014-02-13 Kabushiki Kaisha Toshiba Electronic apparatus, sound quality improvement method, and sound quality improvement member
CN104967958B (zh) * 2015-05-08 2018-08-10 东莞泉声电子有限公司 高音质压电式扬声器
US10897674B2 (en) * 2017-02-27 2021-01-19 Taiyo Yuden Co., Ltd. Electroacoustic transducer
CN208940223U (zh) * 2018-11-15 2019-06-04 歌尔科技有限公司 发声装置和移动终端

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204425650U (zh) * 2014-10-31 2015-06-24 捷音特科技股份有限公司 压电陶瓷双频耳机结构
CN104869515A (zh) * 2015-06-08 2015-08-26 西安康弘新材料科技有限公司 动圈扬声器配合压电扬声器高保真音箱
CN204697287U (zh) * 2015-06-09 2015-10-07 歌尔声学股份有限公司 压电扬声器
CN107371077A (zh) * 2016-05-13 2017-11-21 宇音国际有限公司 动圈压电双音频扬声器的耳机
CN206181371U (zh) * 2016-10-31 2017-05-17 常州阿木奇声学科技有限公司 一种具有陶瓷压电单元的动圈扬声器

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113840023A (zh) * 2021-09-13 2021-12-24 维沃移动通信有限公司 电子设备、控制方法及控制装置
CN113840023B (zh) * 2021-09-13 2024-04-02 维沃移动通信有限公司 电子设备、控制方法及控制装置
CN114513729A (zh) * 2022-01-07 2022-05-17 华为技术有限公司 电子设备及声学换能器
CN114513729B (zh) * 2022-01-07 2023-07-07 华为技术有限公司 电子设备及声学换能器
CN117041398A (zh) * 2023-08-17 2023-11-10 荣耀终端有限公司 一种电子设备

Also Published As

Publication number Publication date
CN113099367A (zh) 2021-07-09
EP4068804A4 (en) 2023-09-13
EP4068804A1 (en) 2022-10-05

Similar Documents

Publication Publication Date Title
WO2021139632A1 (zh) 扬声器、扬声器模组及电子设备
WO2022206047A1 (zh) 电子设备
EP1507438B1 (en) Sound reproduction device and portable terminal apparatus
US20220295187A1 (en) Wireless headset
US8135156B2 (en) Sound reproduction device with enhanced low-frequency sound effect
CN216775010U (zh) 发声装置和电子设备
WO2022089032A1 (zh) 一种扬声器模组和电子设备
WO2019179352A1 (zh) 移动终端
WO2021103070A1 (zh) 扬声器及音频设备
WO2023185412A1 (zh) 发声模组和电子设备
WO2024032384A1 (zh) 一种电子设备
US20100296690A1 (en) Electro-acoustic transducer
WO2022042317A1 (zh) 一种电声换能器、扬声器模组及电子设备
US8301188B2 (en) Electronic devices including substrate mounted acoustic actuators and related methods and mobile radiotelephones
KR20210017278A (ko) 사각 형상의 마이크로 스피커
WO2023185413A1 (zh) 发声模组和终端设备
JP7318095B1 (ja) スピーカ装置及び電子機器
WO2024000686A1 (zh) 同轴扬声器
CN212278462U (zh) 音频模组和终端
WO2022062003A1 (zh) 一种发声单体和扬声器箱
WO2022062047A1 (zh) 发声单体及扬声器
WO2021000104A1 (zh) 扬声器箱
JP3896913B2 (ja) スピーカおよびこれを用いたモジュールおよびこれを用いた電子機器
WO2022143503A1 (zh) 扬声器及电子设备
WO2023160191A9 (zh) 扬声器模组和电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21738865

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021738865

Country of ref document: EP

Effective date: 20220630

NENP Non-entry into the national phase

Ref country code: DE