WO2021135931A1 - Procédé de préparation d'une structure de liaison de structure de surface poreuse et de substrat - Google Patents

Procédé de préparation d'une structure de liaison de structure de surface poreuse et de substrat Download PDF

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Publication number
WO2021135931A1
WO2021135931A1 PCT/CN2020/136532 CN2020136532W WO2021135931A1 WO 2021135931 A1 WO2021135931 A1 WO 2021135931A1 CN 2020136532 W CN2020136532 W CN 2020136532W WO 2021135931 A1 WO2021135931 A1 WO 2021135931A1
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WIPO (PCT)
Prior art keywords
porous
substrate
surface structure
porous surface
electrode
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PCT/CN2020/136532
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English (en)
Chinese (zh)
Inventor
姚建清
史金虎
Original Assignee
骄英医疗器械(上海)有限公司
雅博尼西医疗科技(苏州)有限公司
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Priority claimed from CN201911388633.3A external-priority patent/CN110773854B/zh
Application filed by 骄英医疗器械(上海)有限公司, 雅博尼西医疗科技(苏州)有限公司 filed Critical 骄英医疗器械(上海)有限公司
Publication of WO2021135931A1 publication Critical patent/WO2021135931A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02—Prostheses implantable into the body
    • A61F2/30—Joints
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00—Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02—Prostheses implantable into the body
    • A61F2/30—Joints
    • A61F2/32—Joints for the hip
    • A61F2/36—Femoral heads ; Femoral endoprostheses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/10—Spot welding; Stitch welding
    • B23K11/11—Spot welding

Definitions

  • the present invention relates to the connection technology of mechanical structures, in particular to medical devices, and provides a method for preparing a connection structure between a porous surface structure and a substrate.
  • the overall performance (such as fatigue strength) of the acetabular cup and the femoral stem of the artificial hip joint should meet the dynamic load of the prosthesis during one million to two million walks a year after being implanted in the body.
  • the overall performance (such as fatigue strength) of the acetabular cup and the femoral stem of the artificial hip joint should meet the dynamic load of the prosthesis during one million to two million walks a year after being implanted in the body.
  • the overall performance (such as fatigue strength) of the acetabular cup and the femoral stem of the artificial hip joint should meet the dynamic load of the prosthesis during one million to two million walks a year after being implanted in the body.
  • the prosthesis surface to meet the firm combination of the prosthesis surface and the patient’s bone group to ensure that the prosthesis does not loosen; otherwise the patient will have pain, and the prosthesis must be removed.
  • the patient undergoes another revision operation and a new prosthesis is implanted.
  • Other orthopedic implants (such as the spine) have
  • Artificial materials commonly used in joint prostheses are titanium alloy/cobalt-chromium steel alloy/stainless steel, etc., which cannot form an effective biological or chemical bond with bones.
  • the interface between the prosthesis and the bone is generally mainly through a physical/mechanical combination.
  • the highly polished surface of the prosthesis and bone tissue cannot form an effective bonding force. Therefore, it is necessary to increase bone conduction, osteoinduction, and bone regeneration to accelerate or strengthen the combination of bone tissue and the surface of the prosthesis, and further improve bone growth or growth.
  • the performance of bone ingrowth Sometimes titanium wire or titanium beads can be used to form a porous coating on the surface of the prosthesis (such as the acetabular cup/femoral stem) by sintering or diffusion welding.
  • the welding process has a relatively low impact on the mechanical properties of the substrate.
  • the porosity of the porous structure is high (>50%), the proportion of interconnected scaffolds is relatively low and weak; a large number of pores are formed between the scaffolds.
  • Such a high-porosity structure is realized by metal 3D printing additive manufacturing technology or by sintering.
  • the porous structure and the substrate are directly connected by laser welding, as long as the effective diameter of the laser beam is close to or even larger than the width of the stent , The laser energy may directly break the stent structure, penetrate the porous structure, and cannot achieve an effective welding connection between the porous structure stent and the base stent. Or, when penetration welding is used to connect the porous structure and the substrate, the strength of the substrate structure will be greatly reduced due to the high temperature and high pressure conditions.
  • a method can be used to compress the two workpieces to be welded between the two electrodes and pass the current through the contact surface between the two workpieces and the adjacent area to generate resistance heat. It forms an effective resistance welding method between metal workpieces, and connects the porous structure with the substrate.
  • the bonding efficiency is low at this time, resulting in insufficient welding bonding strength or requiring too high current to achieve sufficient welding strength.
  • the latter causes the contact between the upper electrode and the upper surface of the porous structure to generate heat that is too high to damage the surface of the porous structure too much, including sinking of the pore structure. Therefore, the present invention needs to design an intermediate structure between the porous structure and the substrate.
  • the composite body formed by the porous surface structure and the middle bottom plate is tightly combined with the substrate, so as to improve the combination efficiency of the porous structure and the substrate and ensure sufficient welding strength.
  • the object of the present invention is to provide a method for preparing a porous surface structure and a connection structure of the substrate, which method combines the porous surface structure, the intermediate (solid plate structure or the porous structure with low porosity) and the substrate through resistance welding Method (such as projection welding resistance welding or spot welding resistance welding, etc.) to achieve a fastened connection and maintain the mechanical properties of the substrate; the surface based on the porous structure of the present invention can ensure that the artificial implant prosthesis has excellent bone ingrowth performance , And the strength of the substrate is not substantially affected.
  • resistance welding Method such as projection welding resistance welding or spot welding resistance welding, etc.
  • a method for preparing a connection structure between a porous surface structure and a substrate comprising:
  • porous surface structure is pre-connected with the intermediate to form a complex
  • the intermediate is located between the porous surface structure and the substrate, and the intermediate is in contact with the substrate;
  • the substrate and the composite body are placed between the first polarity electrode and the second polarity electrode; the first polarity electrode is in conductive contact with the porous surface structure and/or the intermediate body, and the substrate is in conductive contact with the porous surface structure and/or the intermediate body.
  • the second polarity electrode is in conductive contact to form a current loop;
  • the intermediate body and the substrate are resistance-welded to realize the connection between the composite body and the substrate.
  • the porous surface structure in the composite is called the first porous structure
  • the intermediate is a solid structure, or the intermediate is a second porous structure and the porosity of the second porous structure is lower than the porosity of the first porous structure.
  • the resistance welding is projection welding resistance welding and/or spot welding resistance welding.
  • the first polarity electrode is a continuous plane electrode or a segmented multiple electrode unit
  • the second polarity electrode is a continuous plane electrode Or segmented multiple electrode monomers
  • the first polarity electrode and/or the second polarity electrode are segmented multiple electrode monomers.
  • the first polarity electrode when spot-welding resistance welding, by moving any one or more of the following components: the first polarity electrode, the second polarity electrode, the intermediate and substrate combination that has been welded at at least one contact position, so that Move from the current welding position to the next welding position.
  • the electrode monomers are inserted into the prefabricated gaps in the porous surface structure, and the electrode monomers are close to the intermediate body, so that the inserted electrode The monomer is in conductive contact with the intermediate or the inserted electrode monomer is in conductive contact with the intermediate through a porous surface structure.
  • the electrode monomer penetrates from the surface of the porous surface structure until it penetrates into the surface of the intermediate body or the interior of the intermediate body, so that the inserted electrode monomer is in conductive contact with the intermediate body.
  • the electrode monomer and the porous surface structure have a lateral clearance fit, so that the electrode monomer does not contact the porous surface structure at all.
  • the plurality of electrode monomers are connected in parallel to another planar electrode and the other planar electrode is connected to the power terminal, or the plurality of electrode monomers are connected in parallel and directly connected to the power terminal.
  • the first polarity electrode is a flexible electrode, and the flexible electrode undergoes flexible deformation under pressure to make it match the porous surface structure surface, increasing the flexibility of the flexible electrode and the The contact area of the porous surface structure.
  • the first polarity electrode is a positive electrode
  • the second polarity electrode is a negative electrode
  • the first polarity electrode is a negative electrode
  • the second polarity electrode is a positive electrode
  • the first polarity electrode and the second polarity electrode are made of conductive material; the substrate is made of conductive material, the porous surface structure is made of conductive material, and the intermediate body is made of conductive material. Made of conductive material.
  • the intermediate body includes an intermediate plate structure.
  • a plurality of protruding structures are provided on the intermediate plate structure, the protruding structures are provided on the side of the intermediate plate structure close to the base, and the protruding points of the protruding structure are in contact with the base .
  • the intermediate is the second porous structure
  • the second porous structure includes a plurality of raised structures
  • the raised structures are formed on the second porous structure close to the substrate.
  • the bumps of the protruding structure are in contact with the substrate.
  • the intermediate body comprises a plurality of convex structures arranged dispersedly, formed on a side of the porous surface structure close to the substrate, and the convex points of the convex structure are in contact with the substrate.
  • the intermediate body comprises several supporting columns, and all or at least part of each supporting column is located in the porous surface structure.
  • the support columns of the intermediate body are arranged correspondingly and contact with the convex structure of the intermediate body, or the support columns of the intermediate body and the convex structure of the intermediate body are distributed in a dislocation and do not contact.
  • the surface of the support column on the side away from the substrate exceeds the surface of the porous surface structure
  • the surface of the support column on the side away from the substrate is lower than the surface of the porous surface structure
  • the surface of the support column on the side away from the substrate is flush with the surface of the porous surface structure.
  • the part of the support column beyond the porous surface structure is cut.
  • the support pillars are located in the prefabricated gaps of the porous surface structure, and the support pillars are provided with grooves for placing the electrode monomers.
  • the inserted electrode monomer is in conductive contact with the support column;
  • the surface of the support column exceeds or is flush with or is lower than the surface of the porous surface structure, and the support column is a porous structure or a solid structure.
  • the support column has a multi-stage structure, including at least the first-stage part that exceeds the porous surface structure and the remaining The second part;
  • the first section has a porous structure
  • the second section part is a porous structure or a solid structure, and the surface of the second section part far from the substrate is flush with the surface of the porous surface structure, so that the first section part is due to the first polarity electrode
  • the contact heat causes the support column to sink to the surface of the second section of the side away from the substrate.
  • the support column is a conductor
  • the support column is connected to the current loop, and the support column is in conductive contact with any one or more of the following components: first polarity electrode, porous surface structure, Intermediate.
  • the support column is an insulator.
  • the protruding structure is located on the intermediate body, close to the contact position of the porous surface structure and the intermediate body.
  • At least part of the pores in the porous surface structure are filled with a conductive material.
  • At least part of the pores in the porous surface structure are filled with a powdered conductive material or a wire-shaped conductive material or a mesh-shaped conductive material.
  • the surface of the porous surface structure is covered with a solid film-like or filament-like or mesh-like deformable conductive medium, and the deformable conductive medium is located between the first polarity electrode and the porous surface structure. And/or, spray solid conductive medium or liquid conductive agent between the surface of at least part of the porous surface structure and the first polarity electrode.
  • At least part of the pores of the porous surface structure is injected with a molten conductive medium, and/or at least part of the pores of the porous surface structure is embedded with a conductive medium and the conductive medium is melted by high temperature; the conductive medium The melting point is lower than the melting point of the substrate and/or the melting point of the porous surface structure.
  • the substrate is a solid structure, or the substrate is a third porous structure and the porosity of the third porous structure is smaller than the porosity of the porous surface structure.
  • the substrate is made by forging or casting or machining.
  • the porous surface structure of the composite body is integrally formed with the intermediate body.
  • the porous surface structure and intermediates of the composite body are realized by a 3D printing additive manufacturing process or a vapor deposition process.
  • the porous surface structure, the intermediate body and the support column are integrally formed.
  • a plurality of grooves are provided on the surface of the porous surface structure, and the surface of the grooves is lower than the surface of the porous surface structure, and the porous surface structure is divided into a plurality of regions;
  • Each divided area is covered by the first polarity electrode corresponding to the area, and the positional relationship between any area of the porous surface structure and the adjacent groove is any one of the following: and the first side of the groove Do not touch, cross the first side of the groove and not exceed the second side of the groove, cross the first side of the groove to the second side of the groove, cross the second side of the groove and contact at least another adjacent area A part, wherein the first side of the groove is the side close to any one of the areas, and the second side of the groove is the side away from the any one of the areas.
  • the resistance welding process between the porous surface structure of the two adjacent regions divided by the groove and the substrate is carried out at the same time by covering two different first polarity electrodes whose positions do not overlap; or, the groove division
  • the resistance welding process between the porous surface structure of the two adjacent regions and the substrate is carried out twice in sequence by using two different first polarity electrodes; or, the porous surface of the two adjacent regions divided by the groove
  • the resistance welding process between the sexual surface structure and the substrate is carried out twice in sequence through the same first polarity electrode.
  • the groove is elongated.
  • the second polarity electrode is a continuous planar electrode
  • the second polarity electrode is divided into a plurality of regions of the second polarity electrode, which are matched with each region respectively.
  • the porous surface structure is divided into a plurality of regions, and any two adjacent regions that are divided are called the porous structure of the first region and the porous structure of the second region;
  • the porous structure of the first area is in contact with a first polarity electrode of the corresponding first area. After the resistance welding of the porous structure of the first area and the substrate is completed, the porous structure of the first area is connected to the first area.
  • the contact edge of the first polarity electrode forms a convex edge;
  • the porous structure of the second region is in contact with a first polarity electrode of the corresponding second region, and a first polarity electrode of the second region at least covers the porous structure of the first region and is close to the porous structure of the second region
  • the convex edge on one side completes the resistance welding between the porous structure of the second area and the substrate.
  • the second-polarity electrode is a continuous planar electrode; or, the second-polarity electrode is divided into a second-polarity electrode in a plurality of regions, which are matched with each region respectively.
  • the substrate includes a surface connection layer, the bottom surface connection layer is pre-connected with the substrate body, and the surface connection layer is between the intermediate body of the composite and the substrate body; the surface connection layer includes A convex structure, the convex points of the convex structure are in contact with the intermediate body of the composite body.
  • the surface connection layer is connected to the base body by welding in advance.
  • the side of the intermediate body close to the substrate is flat; or, the convex structure provided on the side of the intermediate body close to the substrate is staggered from the convex structure of the surface connection layer.
  • the present invention also provides a method for preparing a connection structure, which includes the following process: using the method as described above to provide at least two complexes, a first complex and a second complex, respectively; A first composite body, a substrate, and a second composite body are arranged between the sex electrode and the second polarity electrode; the first composite body is placed between the first polarity electrode and the substrate, and the first composite body The intermediate body in the body is in contact with the substrate, the first polarity electrode is in conductive contact with the porous surface structure and/or the intermediate body in the first composite body, and the second composite body is placed in the first composite body.
  • the intermediate in the second composite body is in contact with the substrate, and the second polarity electrode is in contact with the porous surface structure and/or the second composite body
  • the intermediate body is in conductive contact to form a current loop; the intermediate body of the first composite body and the substrate, and the intermediate body in the second composite body and the substrate are resistance-welded to realize the composite body and the substrate. The connection of the substrate.
  • the method of obtaining the first complex by the method described in any one of the above is called the first method
  • the method of obtaining the second complex by the method described above is called the second method.
  • the first method is the same as or different from the second method.
  • the present invention has the following beneficial effects:
  • the present invention provides a method for preparing a porous surface structure and a connection structure of a substrate.
  • a composite body is manufactured by 3D printing or other processes, including a porous surface structure and a relatively denser intermediate (such as Low porosity porous structure or solid plate), the present invention adopts resistance welding method (such as projection welding resistance welding or spot welding resistance welding, etc.) to effectively combine the composite with the substrate, which can avoid the laser welding method. It may happen that the laser energy directly breaks the support structure and cannot realize the welding connection between the support of the porous structure and the base support.
  • the projection welding method uses contact resistance to generate a local heat source to achieve welding, which greatly reduces or avoids hot pressure Processes (such as penetration welding process) cause the problem of a substantial decrease in the mechanical properties of the substrate;
  • the present invention can also use projection welding resistance welding and spot welding resistance welding together to strengthen the welding strength between the intermediate and the substrate and reduce Surface damage of porous surface structure.
  • the present invention can not only use a large flat electrode to be attached to the porous surface structure, but also divide the electrode into a plurality of positive electrode monomers (or negative electrode monomers) and insert them vertically into the porous surface structure.
  • the electrode does not contact the porous surface structure surface to avoid damage (dentation, blackening, reduction of pore space, etc.) caused by resistance heat between the porous surface structure surface and the positive electrode due to contact resistance;
  • the flexible positive electrode produces a certain deformation, which increases the contact area between it and the top of the porous surface structure, which can not only reduce the difference between the electrode and the porous surface structure.
  • the contact resistance between them reduces the surface damage of the porous surface structure, and can also increase the current conduction to increase the welding strength between the intermediate and the substrate.
  • a solid structure supporting column is arranged in the porous surface structure to ensure that the surface height of the porous surface structure after resistance welding can reach a preset height, and to avoid excessive compression of the porous surface structure;
  • the support column is a good conductive material, most of the current output by the guide electrode preferentially flows through the support column to the substrate, which can not only ensure the welding strength between the intermediate and the substrate, but also reduce the damage generated on the surface of the porous surface structure;
  • the present invention utilizes the above-mentioned support column to be combined with the bump structure below, and the bump structure can directly contact the substrate, which can also meet the requirements of the welding strength of the intermediate and the substrate and reduce the damage generated on the surface of the porous surface structure.
  • a solid (high-density) substrate is manufactured by forging, casting, or machining, or the substrate may have a porous structure, but the density of the porous surface structure is lower than that of the substrate. The density is between the porous surface structure and the substrate.
  • the present invention uses the porous surface structure and the connection structure and method of the base to make various artificial implant prostheses, especially orthopedic prostheses, such as femoral stems, acetabular cups, tibial plateaus, femoral condyles, etc. , So that the prosthesis body is easy to process and has high strength, and at the same time optimizes the performance of bone ingrowth through the porous surface structure effectively combined with it, and can also minimize the cross-section of the prosthesis (such as the femoral stem).
  • orthopedic prostheses such as femoral stems, acetabular cups, tibial plateaus, femoral condyles, etc.
  • Fig. 1 is a schematic diagram of the connection structure between a substrate and a porous surface structure in the prior art
  • FIG. 2 is a schematic diagram of the connection structure between the porous surface structure and the substrate according to the first embodiment of the present invention
  • FIG. 3 is a schematic diagram of the structure of the porous bottom plate according to the first embodiment of the present invention.
  • FIG 4a is a schematic diagram of the connection structure between the porous surface structure and the substrate according to the second embodiment of the present invention (the lower surface of the low-porosity region does not have bumps);
  • FIG 4b is a schematic diagram of the connection structure between the porous surface structure and the substrate according to the second embodiment of the present invention (the lower surface of the low-porosity region has bumps);
  • FIG. 5 is a schematic diagram of the connection structure between the porous surface structure and the substrate in the third embodiment of the present invention.
  • FIG. 6 is a schematic diagram of the connection structure between the porous surface structure and the substrate according to the fourth embodiment of the present invention.
  • 6a-6b are schematic diagrams of related modifications of the connection structure in the fourth embodiment of the present invention.
  • FIG. 7 is a schematic diagram of the connection structure of the porous surface structure and the substrate according to the fifth embodiment of the present invention.
  • FIG. 8a is a schematic diagram of the connection structure of the porous surface structure and the substrate according to the sixth embodiment of the present invention.
  • FIG. 8b is a schematic diagram of the connection structure of the porous surface structure and the substrate according to the seventh embodiment of the present invention.
  • FIG. 8c is a schematic diagram of the connection structure between the porous surface structure and the substrate according to the eighth embodiment of the present invention.
  • Fig. 9a is a schematic diagram of the connection structure between the porous surface structure and the substrate in the ninth embodiment of the present invention.
  • FIG. 9b is a schematic diagram of the connection structure between the porous surface structure and the substrate according to the tenth embodiment of the present invention.
  • 10a is a schematic diagram of the connection structure between the porous surface structure and the substrate in the eleventh embodiment of the present invention.
  • 10b is a schematic diagram of the connection structure between the porous surface structure and the substrate in the twelfth embodiment of the present invention.
  • FIG. 11a is a schematic diagram of the connection structure of the porous surface structure and the substrate according to the thirteenth embodiment of the present invention.
  • 11b-11d are schematic diagrams of the connection structure between the porous surface structure and the substrate according to the fourteenth embodiment of the present invention.
  • FIG. 12 is a schematic diagram of the connection structure of the porous surface structure and the substrate according to the fifteenth embodiment of the present invention.
  • FIG. 13-14 are schematic diagrams of the connection structure of the porous surface structure and the substrate according to the sixteenth embodiment of the present invention.
  • connection structure of the porous surface structure and the substrate according to the eighteenth embodiment of the present invention.
  • 16a-16b are schematic diagrams of the femoral stem of the artificial prosthesis according to Embodiment 20 of the present invention.
  • Fig. 16c is a schematic cross-sectional view of Fig. 16a of the present invention.
  • 17a-17e are schematic diagrams of the handle body of the artificial prosthesis according to the twenty-first embodiment of the present invention.
  • 18a is a schematic diagram of the acetabular cup of the artificial prosthesis according to the twenty-first embodiment of the present invention.
  • Figure 18b is a partial schematic diagram of Figure 18a of the present invention.
  • 19a is a schematic diagram of the tibial platform of the artificial prosthesis according to the twenty-second embodiment of the present invention.
  • Figure 19b is a partial schematic diagram of Figure 19a of the present invention.
  • Fig. 20a is a schematic diagram of the femoral condyle of the artificial prosthesis according to the twenty-third embodiment of the present invention.
  • Fig. 20b is a partial schematic diagram of Fig. 20a of the present invention.
  • 21-22 are schematic diagrams of the porous surface structure and the connection structure of the substrate in the improved scheme of the nineteenth embodiment of the present invention, respectively.
  • the present invention provides a connection structure including a substrate 23, an intermediate 22 and a porous surface structure 21.
  • the porous structure of the porous surface structure 21 includes a large number of staggered scaffolds (or beams), and some multi-directional penetrating, regular or irregular pores are formed between these scaffolds (or beams).
  • the intermediate 22 is located between the porous surface structure 21 and the substrate 23.
  • the intermediate 22 is a non-porous bottom plate, that is, a solid bottom plate.
  • Both the porous surface structure 21 and the intermediate 22 are made of conductive materials (such as metal materials).
  • the porous surface structure 21 and the intermediate 22 are integrally formed structures, for example, realized by a 3D printing additive manufacturing process or a vapor deposition process.
  • the base 23 is solid, which is conducive to the overall strength of the connection structure.
  • the base 23 can be made of conductive materials (for example, metal materials), formed by various methods such as forging and casting, and can be subjected to various machining processes.
  • the porous surface structure 21 and the intermediate body 22 are pre-connected to form a composite body 2A, and the intermediate body 22 and the substrate 23 are effectively combined by resistance welding, so that the composite body 2A and the substrate 23 are connected.
  • the resistance welding method includes spot welding and/or projection welding and the like. The following embodiment focuses on the connection between the intermediate body 22 and the base 23 by the projection welding type resistance welding method for illustration.
  • the top of the porous surface structure 21 is in contact with the positive electrode 24. Since the porous surface structure 21 is connected to the intermediate 22 in advance, that is, at least a part of the bottom of the porous surface structure 21 is in contact with the top of the intermediate 22.
  • a plurality of protruding structures 221 are pre-fabricated on the bottom of the intermediate body 22, and the protruding structures 221 are in contact with the top of the substrate 23, and the bottom of the substrate 23 is in contact with the negative electrode 25.
  • the convex structure 221 is convex toward the side of the base 23.
  • the manufacturing position of the plurality of protruding structures 221 corresponds to the contact position between the bottom of the porous surface structure 21 and the top of the intermediate body 22 and the adjacent area thereof.
  • the positive direction of the X-axis shown in FIG. 2 means right
  • the negative direction of X-axis means left
  • the positive direction of Y-axis means top
  • the negative direction of Y-axis means bottom.
  • the orientation requirements of the subsequent embodiments are the same as those of the first embodiment. In order to describe the technical solution of the present invention more clearly, the above-mentioned orientation regulation is only used for illustration and does not affect the orientation in practical applications.
  • the composite body 2A formed by the porous surface structure 21 and the intermediate 22 and the substrate 23 are compressed between the positive electrode 24 and the negative electrode 25.
  • the current flows through the porous surface structure 21 and the intermediate 22 to the contact surface between the convex structure 221 and the top of the substrate 23 and the adjacent area.
  • the contact resistance generates resistance heat to heat the convex structure 221 and the top of the substrate 23
  • the protruding structure 221 of the intermediate 22 and the top of the substrate 23 form a metal combination, and finally the solid connection between the intermediate 22 and the substrate 23 is realized, so that the porous surface structure 21 and the intermediate 22
  • the formed composite body 2A and the substrate 23 are tightly bonded together.
  • the raised structures 221 are in contact with the top surface of the substrate 23, and there is a contact resistance between the two. Due to the energization, the current flows through and generates resistance heat, so the raised structures 221 These contact points with the substrate 23 form solder joints.
  • the contact resistance refers to the resistance generated by the current between two independent workpieces when they are in contact.
  • the resistance heat Q is proportional to IR 2 , R is the contact resistance, and I is the current passing through the workpiece, that is, the greater the current, the contact resistance The larger the value, the greater the value of resistance heat, and vice versa, the smaller the value of resistance heat.
  • the intermediate 22 of this example increases its contact resistance with the substrate 23 through raised structures (such as bumps) to generate sufficient resistance heat, and the raised structure 221 and the substrate 23 have sufficient welding strength.
  • the base 23 is made of a titanium alloy.
  • the shape of the protruding structure 221 of the intermediate body 22 may be spherical or arc-shaped, circular or elongated, etc. This embodiment does not specifically limit this, nor is it limited to other examples, as shown in FIG. 3 As shown, the intermediate body 22 can be provided with various protrusions or textures to reduce the contact area and increase the contact resistance, thereby correspondingly increasing the bonding efficiency between the intermediate body and the substrate, and improving the welding strength between the intermediate body and the substrate.
  • the positive electrode 24 and the negative electrode 25 are made of conductive materials (such as metal materials); the top of the negative electrode 25 is in close contact with the bottom of the substrate 23, and the bottom of the positive electrode 24 is in close contact with the top of the porous surface structure 21,
  • the contact surfaces that are in contact with each other can be flat, arced, or curved, etc.
  • the present invention does not specifically limit the shape, size, etc. of the contact surfaces, and can be designed according to actual application conditions.
  • an intermediate is added between the porous surface structure and the substrate, and the composite formed by the intermediate and the porous surface structure and the substrate are welded and combined by the resistance welding method (such as projection welding).
  • the resistance welding method such as projection welding.
  • the positive electrode 24 and the negative electrode 25 in this embodiment are also interchangeable, and this expansion method is also applicable to the subsequent embodiments, which will not be described in detail in the present invention.
  • the porous surface structure 21 is a structure with a certain porosity
  • the intermediate 22 is located between the porous surface structure 21 and the substrate 23, and the intermediate 22 is a non-porous bottom plate 22.
  • the intermediate 22 can be the solid plate described in the first embodiment, or the porous structure with low porosity described in the second embodiment.
  • the connecting structure of the second embodiment includes a first porous structure 41 in a high-porosity region, a second porous structure 42 (as an intermediate) in a low-porosity region, and a substrate 43. , As shown in Figure 4a.
  • the second porous structure 42 is located between the first porous structure 41 and the substrate 23.
  • the porous structures of the first porous structure 41 and the second porous structure 42 both include a large number of staggered scaffolds (or beams), and some multi-directional penetrations and regular shapes are formed between these scaffolds (or beams). Or irregular pores.
  • the porosity of the first porous structure 41 is recorded as a%
  • the porosity of the second porous structure 42 is recorded as b%, a%>b%.
  • the second porous structure 42 here is the intermediate of the solid structure described in the first embodiment. Therefore, compared with the first porous structure 41 constituting the porous surface structure, when the second porous structure 42 is used as the intermediate, the second porous structure 42 has a higher density, such as the second porous structure 42.
  • the scaffolds (beams) in are thicker and/or have lower porosity.
  • both the first porous structure 41 and the second porous structure 42 are made of conductive materials (such as metal materials).
  • the first porous structure 41 and the second porous structure 42 are integrally formed structures, for example, realized by a 3D printing additive manufacturing process, or a vapor deposition process.
  • the first porous structure 41 and the second porous structure 42 are formed into a composite body 4A, and the second porous structure 42 and the base 43 are effectively combined by resistance welding, for example, a projection welding method: No. At least part of the support (or beam) at the bottom of the two porous structures 42 is in contact with the top of the substrate 43, and resistance heat is generated due to the contact resistance, thereby heating the contact part of the two to a molten or plastic state, so that the second porous structure 42 is in contact with The top of the base 43 forms a metal combination to connect the composite to the base 43.
  • At least a part of the top of the first porous structure 41 is in contact with the positive electrode 44, at least a part of the bottom of the second porous structure 42 is in contact with the top of the substrate 43, and the bottom of the substrate 43 is in contact with the negative electrode 45.
  • the positive electrode 24 and the negative electrode 25 are made of a metal material.
  • the top of the negative electrode 45 is in close contact with the bottom of the substrate 43, and the bottom of the positive electrode 44 is in close contact with the top of the first porous structure 41.
  • the second embodiment uses the second porous structure 42 in the low porosity region to replace the solid structure intermediate of the first embodiment.
  • the intermediate of the second embodiment has a porous structure, Due to its low porosity and within a certain range, it can ensure that the second porous structure 42 maintains a certain contact area with the substrate 43, thereby ensuring a certain bonding efficiency.
  • the porosity of the second porous structure 42 The smaller the size, the higher the efficiency of the combination between the composite body 4A and the substrate 43, and vice versa; the final combination efficiency is also related to the specific arrangement of the scaffolds (or beams) staggered inside the porous structure, which can be based on actual conditions. Application design.
  • the lower surface of the second porous structure 42 described above may also be provided with bumps 421, as shown in FIG. 4b.
  • the current flows through the first porous structure 41 and the second porous structure 42, and the contact between the bumps 421 of the second porous structure 42 and the top of the substrate 43 generates resistance heat, thereby making the second porous structure
  • the bottom of 42 and the top of the base 23 form a metal combination, so that the composite 4A formed by the first porous structure 41 and the second porous structure 42 and the base 43 are tightly combined.
  • the top of the negative electrode 25 is in close contact with the bottom of the substrate 23, and the bottom of the positive electrode 24 is in close contact with the top of the porous surface structure 21; optionally, the positive electrode 24 and the negative electrode 25 are large
  • the plane electrode and the positive electrode 24 cover the top of the porous surface structure 21, and the negative electrode 25 is pasted under the bottom of the substrate 23. Since the large flat positive electrode 24 of the first embodiment is pressed on the top of the porous surface structure 21, the large flat positive electrode 24 contacts the surface of the porous surface structure 21 and is squeezed, so that the surface of the porous surface structure 21 is damaged, for example, due to Depression caused by pressure, blackening, depression, and reduction of pore space due to temperature rise caused by contact resistance heating.
  • the positive electrode 54 in the third embodiment does not use a large flat electrode to be attached to the porous surface structure 51, but divides the positive electrode into a plurality of positive electrode monomers 541 and the positive electrode
  • the monomer 541 is inserted into the void 5a in the porous surface structure 51 along the vertical direction, and the positive electrode monomer 541 is placed on the top of the non-porous bottom plate 52 (as an intermediate body), as shown in FIG. 5.
  • the porous surface structure 51 and the non-porous bottom plate 52 in this example are an integrally formed structure, for example, realized by a 3D printing additive manufacturing process or a vapor deposition process.
  • the materials and manufacturing process of the substrate 53, the non-porous bottom plate 52, and the porous surface structure 51 in this embodiment can all be referred to in the first embodiment, and will not be repeated here.
  • each positive electrode unit 541 is connected in parallel and all connected to the positive terminal of the power source, and the negative electrode 55 is connected to the negative terminal of the power source.
  • a plurality of protruding structures 521 are pre-fabricated on the bottom of the non-porous bottom plate 52, the protruding structures 521 are in contact with the top of the substrate 53, and the bottom of the substrate 53 is in contact with the negative electrode 55.
  • the void 5a in the porous surface structure 51 is used as an insertion space for the corresponding positive electrode monomer 541.
  • the void 5a is a prefabricated pore portion. The void 5a starts from the surface of the porous surface structure 51 and passes through the porous surface.
  • the structure 51 reaches above the non-porous bottom plate 52 so that the top of the non-porous bottom plate 52 is exposed in the gap 5 a, and the bottom of the positive electrode monomer 541 for insertion is in contact with the top of the non-porous bottom plate 52.
  • the positive electrode 54 of the third embodiment does not make contact with the surface of the porous surface structure 51, which solves the problem of damage caused by resistance heat between the surface of the porous surface structure and the positive electrode due to contact resistance.
  • the gap 5a is laterally matched with the positive electrode cell 541, such as a gap fit, that is, the gap 5a needs to be spaced apart from the porous surface structure of the adjacent part after the positive electrode cell 541 is inserted, so as to avoid the part of the porous surface structure.
  • the surface of the porous surface structure is damaged by resistance heat to protect the surface of the porous surface structure.
  • the positive electrode monomer 541 has a columnar structure or a structure of other shapes, which is not limited in this embodiment, and is not limited to other related examples.
  • the multiple protrusion structures 521 at the bottom of the non-porous bottom plate 52 correspond to the positions of the respective positive electrode cells 541.
  • the contact positions between the positive electrode cells 541 and the top of the non-porous bottom plate 52 are located at different positions.
  • the raised structure 521 is directly above or in the area adjacent to the raised structure 521 to ensure the smooth conduction of current to the non-porous bottom plate 52 until the contact surface between the raised structure 521 and the top of the substrate 53 and the adjacent area, generating resistance heat
  • the protruding structure 521 and the top end of the base 23 form a combined body.
  • the shape of the protruding structure 521 in this embodiment can be referred to the first embodiment, which will not be repeated here.
  • the positive electrode is divided into a plurality of positive electrode monomers and the positive electrode monomers are inserted into the voids in the porous surface structure along the vertical direction.
  • the second embodiment of the pore structure that is, the positive electrode 44 in the second embodiment is replaced with a plurality of positive electrode monomers and each positive electrode monomer is respectively arranged along the vertical direction Inserted into the void in the porous surface structure 41.
  • the prefabricated void starts from the surface of the first porous structure, passes through the first porous structure, and reaches above the second porous structure or inside the second porous structure , So that part of the second porous structure is exposed in the gap 5a, and the bottom of the positive electrode cell for insertion is in contact with part of the second porous structure.
  • the gap is laterally matched with the positive electrode cell, for example, Clearance fit, that is, the gap needs to be separated from the porous surface structure of the adjacent part after inserting the positive electrode monomer, to prevent the surface of the porous surface structure of this part from being damaged by resistance heat to protect the porous surface
  • Clearance fit that is, the gap needs to be separated from the porous surface structure of the adjacent part after inserting the positive electrode monomer, to prevent the surface of the porous surface structure of this part from being damaged by resistance heat to protect the porous surface
  • the positive electrode 24 and the negative electrode 25 can be made of conductive materials (such as metal materials); the top of the negative electrode 25 is in close contact with the bottom of the substrate 23, and the bottom of the positive electrode 24 is close to the porous surface structure 21.
  • the positive electrode 24 and the negative electrode 25 are large planar electrodes, and the positive electrode 24 covers the top of the porous surface structure 21, and the negative electrode 25 is pasted under the bottom of the substrate 23.
  • the positive electrode in the fourth embodiment is a flexible positive electrode 64, as shown in FIG. 6.
  • the flexible positive electrode 64 is a large planar electrode and covers the top of the porous surface structure 61
  • the negative electrode 65 is pasted under the bottom of the substrate 63
  • the non-porous bottom plate 62 is located on the porous surface structure 61 and Between the base 63.
  • the porous surface structure 61 and the non-porous bottom plate 62 are an integrally formed structure, for example, realized by a 3D printing additive manufacturing process, or a vapor deposition process.
  • the materials and manufacturing process of the substrate 63, the non-porous bottom plate 62, and the porous surface structure 61 in this embodiment can all be referred to in the first embodiment, which will not be repeated here.
  • the flexible positive electrode 64 covers the top surface of the porous surface structure 61, a certain pressure is generated on the surface of the porous surface structure 61. At this time, the flexible positive electrode 64 generates a certain flexible deformation under the interaction of the pressure, so that The contact area between it and the top of the porous surface structure 61 is increased (compared to the contact area between the rigid positive electrode and the top of the porous surface structure under the same conditions), which can not only reduce the positive electrode 64 and the porous surface structure
  • the contact resistance between 61 can improve or avoid surface damage (such as depression, blackening, reduction of pore space, etc.) of the porous surface due to resistance heat, protect the surface of the porous surface structure, and can enhance current conduction, non-porous
  • the welding efficiency between the bottom plate 62 and the base 63 is increased, and the welding strength is increased.
  • the flexible material is a conductive material, such as copper foil or tin foil, which is not limited in this embodiment, nor is it limited to other related examples, and can be designed according to actual application conditions.
  • a deformable good conductive medium 606 is added between the bottom of the positive electrode 604 and the top of the porous surface structure 601, and the deformable good conductive medium 606 covers the top surface of the porous surface structure 601.
  • the easily deformable good conductive medium 606 is a continuous solid film, such as copper foil.
  • the intermediate 602 is located between the porous surface structure 601 and the substrate 603, and the top of the negative electrode 605 is in close contact with the bottom of the substrate 603.
  • the positive electrode 604 is a large flat electrode and covers the top surface of the easily deformable and good conductive medium 606.
  • the contact area between it and the porous surface structure 601 increases, not only Reduce the contact resistance between the porous surface structure 601 and the positive electrode 604 above it, reduce the resistance heat, reduce the surface damage of the porous surface structure 601, and increase the current conduction effect, so that the gap between the intermediate 602 and the substrate 603 The welding strength is increased.
  • the pores between the bottom of the positive electrode 6004 and the top of the porous surface structure 6001 are filled with good conductive material powder 6006 (or good conductive wire), which can reduce the positive electrode 6004 and the porous surface structure 6001.
  • the contact resistance between the surfaces reduces the surface damage of the porous surface structure 6001, and at the same time can increase the current conduction effect and increase the welding efficiency between the intermediate 6002 and the substrate 6003.
  • the material of the good conductive material powder 6006 (or the good conductive wire) is the same as the material of the porous surface structure 6001, for example, titanium powder (or titanium wire).
  • the intermediate 6002 is located between the porous surface structure 6001 and the substrate 6003, and the top of the negative electrode 6005 is in close contact with the bottom of the substrate 6003.
  • the contact resistance between the electrode and the porous surface structure can also be reduced, and the surface damage of the porous surface structure can be reduced.
  • the present invention does not Do repeat.
  • good conductive material powder 6006 (or good conductive wire), sprayed conductive material or liquid conductive agent, etc., all of them need to be properly removed after the porous surface structure and the substrate are welded and combined so as to Ensure that the pores of the porous surface structure are open.
  • a layer of hydroxyapatite (HA) coating can be separately sprayed on the surface of the porous surface structure.
  • the HA coating has Good biological activity and biocompatibility, which is conducive to the subsequent bone ingrowth process; alternatively, a coating containing antibacterial silver ions or other cell growth factors can be sprayed separately on the porous surface structure. .
  • the melt of a specific material is penetrated into the porous surface structure, and the melt can almost penetrate the pores in the porous surface structure of the selected part (the upper part of the spacer layer). Filling, not only need to limit the melting point of the molten liquid with better conductive properties to be lower, but also need to set a spacer layer in the porous surface structure.
  • the spacer layer is preferably made of conductive material, so as to avoid the melt direction.
  • the positive electrode 24 and the negative electrode 25 are made of conductive material (metal material), the top of the negative electrode 45 is in close contact with the bottom of the substrate 43, and the bottom of the positive electrode 44 is in contact with the first high-porosity region.
  • the top of the porous structure 41 is tightly attached.
  • the positive electrode of the fifth embodiment is a flexible positive electrode 74 made of a flexible material, not the metal material in the above-mentioned embodiment, as shown in FIG. 7.
  • the flexible positive electrode 74 is a large planar electrode and covers the top of the first porous structure 71 in the high-porosity area, and the negative electrode 75 is pasted under the bottom of the substrate 73.
  • the second porous structure 72 is located between the first porous structure 71 and the substrate 73 in the high porosity region.
  • the first porous structure 71 and the second porous structure 72 are integrally formed structures, for example, implemented by a 3D printing additive manufacturing process, or a vapor deposition process.
  • the materials and manufacturing process of the substrate 73, the second porous structure 72, and the first porous structure 71 in this embodiment can all be referred to in the second embodiment, which will not be repeated here.
  • the flexible positive electrode 74 covers the top surface of the first porous structure 71, and generates a certain pressure on the top surface of the first porous structure 71.
  • the flexible material of the flexible positive electrode 74 will interact under pressure. Produce a certain flexible deformation, so that the contact area between it and the top of the first porous structure 71 is increased (compared to the contact area between the rigid positive electrode and the top of the first porous structure under the same conditions), which can not only reduce
  • the contact resistance between the positive electrode 74 and the porous surface structure 71 improves or avoids surface damage (such as depression, blackening, reduction in pore space, etc.) of the porous surface due to resistance heat, protects the surface of the porous surface structure, and
  • the current conduction can be enhanced, the welding efficiency between the non-porous bottom plate 72 and the base 73 is increased, and the welding strength is increased.
  • the flexible material is a conductive material, such as copper foil or tin foil, which is not limited in this embodiment, nor is it limited to other related examples, and can be designed according to actual application conditions.
  • the lower surface of the low-porosity bottom plate 72 may be provided with bumps to increase the resistance welding efficiency.
  • Embodiment 6 is a diagrammatic representation of Embodiment 6
  • the sixth embodiment not only provides a non-porous bottom plate 812 (or a porous structure with low porosity) between the porous surface structure 811 and the substrate 813, but also prefabricates the bottom surface of the non-porous bottom plate 812.
  • a raised structure the raised structure is in contact with the top of the base 813, and at the same time, a number of supporting pillars 816a are arranged on the surface of the non-porous bottom plate 812 near the porous surface structure, as shown in FIG. 8a, the supporting pillars 816a is interposed between the non-porous bottom plate 812 and the positive electrode 814.
  • the supporting column 816a is located inside the porous surface structure 811, the top of the supporting column 816a is substantially flush with the top of the porous surface structure, and the height of the supporting column 816a is substantially equal to the height of the porous surface structure.
  • the top of the negative electrode 815 in the sixth embodiment is also in close contact with the bottom of the substrate 813.
  • the height direction mentioned here is the azimuth shown in the figure.
  • the above-mentioned azimuth regulation is only used to show the figure and is not necessarily used as the azimuth in actual application.
  • the regulations of the subsequent related embodiments are the same as this.
  • the supporting column 816a is a solid structure with good conductivity.
  • Each supporting column 816a is directly opposite to the corresponding convex structure below, so that the area covered by the supporting column 816a is at least partially overlapped with the contact portion between the convex structure and the base 813, and the size of the supporting column 816a is the same as that of the convex structure. Match.
  • non-porous bottom plate 812, the porous surface structure 811, and the support column 816a are integrally formed structures, for example, implemented by a 3D printing additive manufacturing process or a vapor deposition process.
  • the electrode flows out greatly.
  • Part of the current preferentially passes through the solid structure of the well-conducting support column 816a, which greatly reduces the surface damage of the porous surface structure 811 due to resistance heat, and can also enhance the current conduction, and the welding efficiency between the non-porous bottom plate 812 and the base 813 Increase to ensure sufficient welding strength.
  • the seventh embodiment is modified to completely prevent the porous surface structure from contacting the positive electrode above it to generate resistance heat and cause damage to the porous surface structure, as shown in Figure 8b.
  • the tops of all support pillars 816b are set higher than the top surface of the porous surface structure, and the height of each support pillar 816b is higher than the height of the porous surface structure of its corresponding adjacent part.
  • the positive electrode will be in contact with the porous surface structure.
  • the support pillar 816b at the higher position first contacts, thereby avoiding the positive electrode from contacting the porous surface structure 811 at the lower position.
  • the positive electrode can be not only the continuous large-planar positive electrode shown in FIG. 8a, but also a plurality of segmented positive electrode monomers 814b, and each segment of the positive electrode monomers 814b is pressed against The top end of the corresponding support column 816b, and the positive electrode unit 814b is connected in parallel to a large plane electrode or directly connected to the positive terminal of the power supply.
  • Embodiment 8 is a diagrammatic representation of Embodiment 8
  • the eighth embodiment is further expanded.
  • the idea of the expansion is as follows: as shown in FIG. 8c, the top of each support column 816c is lower than the top surface of the corresponding part of the porous surface structure, The height of the support column 816c is lower than the height of the porous surface structure, and the support column 816a is hidden inside the porous surface structure 811, that is, above the support column 816c is a porous structure.
  • the positive electrode 814 will be in contact with the first surface of the porous surface structure 811 underneath, and the top surface of the porous surface structure 811 will sink slightly due to the heat generated by the contact resistance until it sinks to the top of the support column 816c.
  • the maximum sinking degree can only sink to the top position of the support column, when the sinking degree is not large, the sinking position is higher than the top position of the support column), because the support column 816c is a solid structure, and the support column 816c acts as a limit To ensure that the height of the final porous surface structure reaches the height of the support column, and avoid excessive compression of the porous surface structure.
  • the upper support column 816c may also have a recessed structure, so that the top end of the support column 816c is lower than the top surface of the corresponding part of the porous surface structure, and the support column 816c can also serve as a limiter.
  • the non-porous bottom plate 812, the porous surface structure 811, and the support column 816c may be an integrally formed structure, for example, implemented by a 3D printing additive manufacturing process, or a vapor deposition process.
  • the support pillar 816c is a solid structure with good conductivity, and the porous surface structure 811 has pores, so the current is mostly selectively
  • the flow through the support column 816c to the raised structure and the base 813 not only ensures the welding strength between the non-porous bottom plate 812 and the base 813, but also reduces the damage to the porous surface structure to a certain extent.
  • the surface of the porous surface structure is still damaged to a certain extent in the eighth embodiment, since the top of the support column 816c is always lower than the surface of the porous surface structure 811, it does not affect the basic function of the connection structure in the corresponding field.
  • a set height position is selected on the support column originally higher than the surface of the porous surface structure 811 and the upper part of the position is designed as The pore structure is no longer the flush support column shown in Figure 8b.
  • the positive electrode contacts the top pore structure at a higher position first, the top pore structure of the support column is compressed and a small amount of sinking occurs due to the heat generated by the contact resistance, and the support column sinks to the above-mentioned set position of the support column, making the support
  • the column and the porous structure next to it are basically flush (the maximum sinking degree can only sink to the set position, when the sinking degree is not large, the sinking position is higher than the set position). In this case, it can completely avoid the contact between the porous surface structure and the positive electrode above and cause resistance heat to cause damage to the surface, and there is no need for additional processing techniques to remove the excess part of the support column higher than the porous surface structure.
  • a non-porous bottom plate 812 (or a porous structure with low porosity) is arranged between the porous surface structure 811 and the substrate 813, and a plurality of convex structures are prefabricated on the bottom surface of the non-porous bottom plate 812, The protruding structure is in contact with the top of the base 813, and at the same time, on the non-porous bottom plate 812, a plurality of well-conductive solid support pillars 816a are arranged on the side surface of the porous surface structure. And the positive electrode 814.
  • the main difference from the sixth embodiment is that the bottom surface of the non-porous bottom plate 912a arranged between the porous surface structure 911 and the base 913 in the ninth embodiment does not produce the above-mentioned convex structure (such as bumps), and also A plurality of well-conductive support pillars 916a are also provided on the non-porous base plate 912a near the porous surface structure side surface.
  • the support pillars 916a are interposed between the non-porous base plate 912a and the positive electrode 914, as shown in FIG. 9a.
  • the bottom surface of the porous bottom plate 912a and the base 813 are in almost planar contact.
  • the support column 916a is located inside the porous surface structure 911, the height of the support column 916a is substantially flush with the top surface of the porous surface structure, and the height of the support column 916a is substantially equal to the height of the porous surface structure.
  • the top of the electrode 915 is also in close contact with the bottom of the substrate 913.
  • the non-porous bottom plate 812, the porous surface structure 811, and the support pillars 816a are integrally formed structures, for example, implemented by a 3D printing additive manufacturing process or a vapor deposition process.
  • the support pillar 916a is a solid structure with good electrical conductivity, and the porous surface structure 911 has a large amount of outflow due to the existence of pores.
  • Part of the current preferentially passes through the support pillars 916a of a solid structure with good conductivity and passes through the non-porous bottom plate 912a to the substrate 913.
  • the ninth embodiment has provided a plurality of good conductive columns.
  • the supporting column 916a still has enough current and resistance heat to make the non-porous bottom plate 912a and the base 913 have sufficient welding strength, and can also reduce the damage of the porous surface structure to a certain extent.
  • the modified idea of the tenth embodiment is as follows: as shown in FIG. 9b, in the tenth embodiment, except for the non-porous bottom plate (or low-porosity bottom plate) without protruding structures in the ninth embodiment,
  • the tops of all support pillars 916b are specially set higher than the top surface of the porous surface structure, and each support The heights of the pillars 916b are all higher than the porous surface structure of their corresponding neighboring parts.
  • the positive electrode will first contact the support pillar 916b disposed at a higher position, thereby avoiding the positive electrode from contacting the porous surface structure 911 at a lower position.
  • the part of the support column 916b higher than the porous surface structure 911 can be removed by cutting and other processes to ensure flat surface.
  • the positive electrode can be not only the continuous large-plane positive electrode shown in FIG. 9a, but also a plurality of segmented positive electrode monomers 914b, and each segment of the positive electrode monomers 914b is voltage-balanced.
  • the positive electrode unit 914b is connected in parallel to a large plane electrode or directly connected to the positive terminal of the power supply.
  • Embodiment 11 is a diagrammatic representation of Embodiment 11:
  • the positive electrode 1014a in the eleventh embodiment does not use a large flat electrode to be attached to the porous surface structure 1011, but divides the positive electrode 54 into a plurality of positive electrode monomers 001 and separates the positive electrode.
  • the body 001 is inserted into the void 10a in the porous surface structure 1011 along the vertical direction, as shown in FIG. 10a, and the positive electrode monomer 001 is placed on the top of the non-porous bottom plate 1012a (or porous structure with low porosity).
  • a plurality of the positive electrode monomers 001 are connected in parallel and all connected to a large plane electrode or directly connected to the positive terminal of the power source, and the negative electrode 1015 is connected to the negative terminal of the power source.
  • the porous surface structure 1011 and the non-porous bottom plate 1012a are an integrally formed structure, for example, realized by a 3D printing additive manufacturing process, or a vapor deposition process.
  • the void 10a in the porous surface structure 1011 serves as the insertion space of the corresponding positive electrode monomer 001, and the void 10a is a prefabricated pore.
  • the bottom end of the positive electrode 1014a is not in contact with the top end of the porous surface structure 101 to avoid damage to the surface of the porous surface structure 1011 due to resistance heat.
  • the gap 10a is laterally matched with the positive electrode monomer 001, such as a gap fit, that is, the gap 10a needs to be spaced apart from the porous surface structure of the adjacent part after the positive electrode monomer 001 is inserted, so as to avoid porosity in this part.
  • the surface structure is damaged by resistive heat.
  • the non-porous bottom plate in the first embodiment described above is provided with a convex structure (such as bumps) for generating greater contact resistance and resistance heat.
  • the eleventh embodiment is different from the non-porous bottom plate 1012a in this embodiment.
  • the bottom plate 1012a and the substrate 1013 (without the porous surface structure 1011) can still ensure sufficient current and resistance heat, so that the non-porous bottom plate 1012a and the substrate 1013 have sufficient welding strength.
  • Embodiment 12 is a diagrammatic representation of Embodiment 12
  • the twelfth embodiment of the present embodiment is modified in that: the top surface of the non-porous bottom plate 1012b (or the porous structure with low porosity) is provided with a number of solid support structures 10b with good electrical conductivity to support The structure 10b is placed in the pores reserved inside the porous surface structure 1011, as shown in FIG. 10b.
  • the supporting structure 10b is used to place and support each positive electrode monomer 001 in the positive electrode 1014a.
  • the positive electrode monomer 001 is located in the groove opened in the supporting structure 10b and matched with the groove to ensure that all positive electrodes The monomer 001 is in good contact with the corresponding support structure 10b.
  • the non-porous bottom plate 1012b, the porous surface structure 1011, and the support column support structure 10b are integrally formed structures, for example, implemented by a 3D printing additive manufacturing process or a vapor deposition process.
  • the top of the support structure 10b is substantially flush with the top of the porous surface structure 1011, and the height of the support structure 10b is substantially equal to the height of the porous surface structure 1011; or, the top of the support structure 10b is lower than the porous surface structure 1011 Or, the top of the support structure 10b is higher than the top of the porous surface structure 1011 and the subsequent cutting process makes the top of the final support structure 10b flush with the top of the porous surface structure 1011; which height design to choose In this way, the present invention does not limit this.
  • the positive electrode 1014a is conductively connected to the non-porous bottom plate 1012b through the support structure 10b of a well-conductive solid structure, and each The positive electrode monomer 001 is respectively connected to the power supply, and the current flows directly from the positive electrode monomer 001 and passes through the non-porous bottom plate 1012b and the substrate 1013 (without passing through the porous surface structure 1011), that is, sufficient current and resistance heat can still be ensured , So that the non-porous bottom plate 1012b and the base 1013 have sufficient welding strength.
  • Embodiment 13 is a diagrammatic representation of Embodiment 13:
  • the porous surface structure 1111 is connected to the bottom of at least part of the area with good electrical conductivity.
  • the solid structure of the raised structure 1112a (such as bumps), the raised structure 1112a is in contact with the top of the substrate 1113, as shown in Figure 11a, and at the same time, a solid structure can be provided at any position in the porous surface structure 1111 and is well conductive Support column 1116a.
  • the supporting pillars 1116a and the protruding structures 1112a can be dislocated and distributed, as shown in FIG. 11a.
  • the porous surface structure 1111, the convex structure 1112a, and the support pillar 1116a are integrally formed structures, for example, realized by a 3D printing additive manufacturing process or a vapor deposition process.
  • the support column 1116a is hidden inside the porous surface structure 1111, the top end of the support column 1116a is lower than the top end of the porous surface structure 1111, and the bottom end of the support column 1116a is higher than the bottom end of the porous surface structure 1111.
  • the limiting effect of the support column 1116a can be used to prevent the porous surface structure 1111 from being over-compressed, because the positive electrode 1114 will first contact the top surface of the porous surface structure 1111 below, and the porous surface structure 1111 is caused by the surface of the porous surface structure 1111.
  • the contact resistance heats up and causes damage and a small amount of sinking occurs until it sinks to the top of the support column 1116a (the maximum sinking degree can only sink to the top position, even when the sinking degree is not large, the sinking position is higher than the top Position), because the support column 1116a is a solid structure, the support column 1116a acts as a limiter to ensure that the height of the final porous surface structure reaches the height of the support column; at the same time, the good conductivity of the support column 1116a can also be used
  • the solid structure makes the current preferably go through the support column 1116a, and then through the porous surface structure near the support column 1116a to reach the convex structure 1112a, which can improve the surface damage of the porous surface structure caused by contact resistance heating Problem;
  • the bumps of the protruding structure 1112a are further used to increase the contact resistance with the substrate 1113, so as to generate sufficient resistance heat, so that the protruding structure 1112a and the substrate 1113 have sufficient welding
  • the thirteenth embodiment described above describes that the support column 1116a and the raised structure 1112a are in a misaligned distribution.
  • the fourteenth embodiment designs the raised structure 1112b and the support column 1116b above it to be in a positive fit.
  • the two are at least partially overlapped (such as partially overlapped or completely overlapped), as shown in Figure 11b.
  • the porous surface structure 1111, the convex structure 1112b, and the support column 1116b are integrally formed structures, for example, realized by a 3D printing additive manufacturing process or a vapor deposition process.
  • the support column 1116b is hidden inside the porous surface structure 1111, the top of the support column 1116b is lower than the top of the porous surface structure 1111, and the height of the support column 1116b is lower than the height of the porous surface structure.
  • the protruding structure 1112b is in contact with the top of the substrate 1113.
  • the support column 1116b can also be used to avoid the transitional compression of the porous surface structure 1111, because the positive electrode 1114 will first contact the porous surface structure 1111 below it, and then the surface of the porous surface structure 1111 generates heat due to contact resistance.
  • the pillar 1116b is a solid structure with good conductivity, and the support pillar 1116b acts as a limiter to ensure that the height of the final porous surface structure reaches the height of the support pillar; at the same time, the solid good conductive structure of the support pillar 1116a can also be used Most of the current is preferably selected to pass through the support pillar 1116a, which can improve the problem of damage to the top surface of the porous surface structure due to contact resistance heat; furthermore, in this example, the convex structure 1112b can also be used to increase the contact resistance of the substrate 1113.
  • the protruding structure 1112b and the substrate 1113 have sufficient welding strength. It is worth noting that the welding efficiency of the fourteenth embodiment is better than that of the thirteenth embodiment, because the convex structure 1112b and the supporting column 1116b are directly matched, and the current flows through the supporting column 1116b and directly passes through the convex structure 1112b. In Example 13, after the current flows through the support column 1116a, it needs to pass through the pore structure in the porous surface structure and then flow through the protruding structure 1112a.
  • the idea of the modification is to change the height of the support column above the porous surface structure to: the support column 1116c is located inside the porous surface structure 111 and the top end of the support column 1116c is basically the same as the top of the support column 1116c.
  • the top of the porous surface structure is flush, and the height of the support column 1116c is basically equal to the height of the porous surface structure.
  • the raised structure 1112c is also directly matched with the support column 1116c above, and the two at least partially overlap (such as a part of Coincident or completely coincident), as shown in Figure 11c.
  • porous surface structure 1111, the convex structure 1112c, and the support column 1116c are integrally formed structures, for example, realized by a 3D printing additive manufacturing process or a vapor deposition process.
  • the idea of the modification is to change the height of the support column described above to be lower than the porous surface structure to: set the top surface of all the support columns 1116d to be higher than On the top surface of the porous surface structure, as shown in FIG. 11d, the height of each support column 1116d is higher than the height of the porous surface structure of its corresponding adjacent part.
  • the protruding structure 1112d is also directly matched with the supporting column 1116d above, and the two are at least partially overlapped (such as partially overlapped or completely overlapped), as shown in FIG. 11d.
  • the porous surface structure 1111, the convex structure 1112d, and the support column 1116d are integrally formed structures, for example, realized by a 3D printing additive manufacturing process or a vapor deposition process.
  • a 3D printing additive manufacturing process or a vapor deposition process.
  • Embodiment 15 is a diagrammatic representation of Embodiment 15:
  • the fifteenth embodiment is based on the first embodiment, and further provides a number of limit posts 1216 between the non-porous bottom plate 1212 (or a porous structure with low porosity) and the positive electrode 1214.
  • the column 1216 is placed on the surface of the non-porous bottom plate 1212 close to the side of the porous surface structure 1211.
  • the top surface of the limiting column 1216 is lower than the top surface of the corresponding part of the porous surface structure
  • the height of the limiting column 1216 is lower than the height of the porous surface structure
  • the limiting column 1216 is hidden in the porous surface structure 1211 internal.
  • the bottom end of the non-porous bottom plate 1212 in the fifteenth embodiment is prefabricated with a plurality of protruding structures 12a, and the protruding structures 12a are in contact with the top of the base 1213.
  • the positive electrode 1214 first comes into contact with the surface of the porous surface structure 1211 at a higher position below, and then the surface of the porous surface structure 1211 sinks due to damage caused by the heat generated by the contact resistance. It sinks to the top position of the limit column 1216 (the maximum sinking degree can only sink to the top position, even when the degree of sinking is not large, the sinking position is higher than the top position), because the limit column 1216 is a solid structure, because the limit column 1216 is a solid structure, The limiting column 1216 plays a limiting role to ensure that the height of the final porous surface structure reaches the height position where the limiting column 1216 is located, so as to avoid excessive compression of the porous surface structure.
  • the limiting pillars 1216 may be distributed directly opposite to or staggered with the corresponding convex structures 12a underneath; at the same time, whether the material of the limiting pillars 1216 in this embodiment is a conductive material or a non-conductive material, the present invention relates to this There are no restrictions, as long as the limiting effect of the limiting column 1216 is finally met to avoid excessive compression of the porous surface structure.
  • the limiting column 1216 is a conductive material
  • the current is mostly preferably selected to pass through the limiting column 1216, and then through the porous surface structure near the limiting column 1216 to reach the corresponding convex structure 12a, which can improve the porosity Surface structure surface damage caused by contact resistance heating.
  • the limiting pillar 1216 When the limiting pillar 1216 is made of a non-conductive material, the current flows from the positive electrode 1214 to the porous surface structure 1211 to the convex structure 12a. Although the above situation of this embodiment still causes a certain degree of damage to the surface of the porous surface structure, since the limit post 1216 is always lower than the surface of the porous surface structure 1212, it will not affect the basic function of the entire connection structure when applied to related fields. .
  • the porous surface structure of the present invention and the substrate are combined by resistance welding (for example, projection welding).
  • resistance welding for example, projection welding
  • the area of the workpiece to be welded is too large, a larger number of protrusion structures are required.
  • the convex structure is determined, in order to ensure the welding strength between each convex structure and the substrate, the total current of the electrode needs to be increased, which may lead to an increase in the cost of the power supply device, electrode damage, and surface damage of the porous surface structure.
  • the welded workpiece can be welded in different areas and in batches.
  • the porous surface structure 1311 is divided into regions and resistance welding is performed in batches with the substrate 1313.
  • the porous surface structure 1311-1 corresponding to the first region is connected to the top A positive electrode 1314-1
  • a second positive electrode 1314-2 is connected above the porous surface structure 1311-2 corresponding to the second region.
  • the top of the negative electrode 1315 is in close contact with the bottom of the substrate 1313
  • a non-porous bottom plate 1312 (or a porous structure with low porosity) is arranged between the porous surface structure 1311 and the substrate 1313, and the bottom surface of the non-porous bottom plate 1312 is prefabricated
  • a plurality of raised structures are in contact with the top of the base 1313.
  • the porous surface structure 1311 adopts regional resistance welding, but the positive electrode corresponding to each region may not completely cover the corresponding porous surface structure during the regional welding, such as arbitrarily divided two neighbors.
  • the edge of the area on the side close to the area cannot be completely covered.
  • the edge of each area may be slightly higher than the other parts covered (that is, convex edge), which affects the surface flatness of the porous surface structure 1311. It may even affect the basic functions of the connection structure applied to related fields (such as bone ingrowth).
  • the porous surface structure 1311 of the sixteenth embodiment is provided with grooves 13a to divide the top of the porous surface structure 1311 into multiple regions, such as the porous surface structure 1311-1 in the first region in the figure. And the porous surface structure 1311-2 of the second region.
  • the groove 13a is elongated, and the porous surface structure 1311-1 in the first region and the porous surface structure 1311-2 in the second region are respectively located on both sides of the elongated groove 13a.
  • the top of the groove 13a is lower than the top of the porous surface structure 1311.
  • the height of the groove 13a is smaller than the height of the porous surface structure 1311.
  • the main body of the non-porous bottom plate 1312, the groove 13a, and the porous surface structure 1311 are integrally formed structures, for example, implemented by a 3D printing additive manufacturing process, or a vapor deposition process.
  • the groove 13a can also be formed by machining.
  • Figure 13 shows that there is a gap between the first positive electrode 1314-1 and the second positive electrode 1314-2.
  • the first positive electrode 1314-1 and the second positive electrode 1314-2 can be in sequence. 13 only indicates the position, or the first positive electrode 1314-1 and the second positive electrode 1314-2 are in no particular order, and can be pressed on the porous surface structure of the corresponding area at the same time; and the positive electrode corresponding to each divided area The coverage area of each is larger than the surface area of the porous surface structure 1311-1 in the corresponding region.
  • the side of the groove 13a close to the first positive electrode 1314-1 is marked as the first side
  • the other side of the groove 13a close to the second positive electrode 1314-2 is marked as the second side.
  • the porous surface structure 1311-1 in the first region is first connected to the substrate 1313 by resistance welding: the bottom surface of the first positive electrode 1314-1 covers the porous surface structure 1311-1 in the corresponding region, and the first The portion of the positive electrode 1314-1 beyond the connection area does not exceed the edge of the second side of the groove 13a, and the first positive electrode 1314-1 and the porous surface structure 1311-1 in the first area generate heat due to contact resistance.
  • the porous surface structure 1311-1 of the area has a small amount of sinking but no convex edge will be formed; then continue to start the second area of the porous surface structure 1311-2 and the substrate 1313 to complete resistance welding: the second positive electrode 1314-2
  • the porous surface structure 1311-2 covering the corresponding area is in surface contact, and the portion of the second positive electrode 1314-2 that exceeds the connection area does not exceed the side edge of the first positive electrode 1314-1 close to the second positive electrode 1314-2
  • the second positive electrode 1314-2 and the porous surface structure 1311-2 in the second region generate heat due to the contact resistance, which causes the porous surface structure 1311-2 in the second region to sink a small amount but does not form a convex surface. side.
  • the first positive electrode 1314-1 and the second positive electrode 1314-2 may be the same electrode.
  • the first positive electrode 1314-1 and the second positive electrode 1314-2 are in no particular order, and are pressed on the porous surface structure of the corresponding area at the same time, then the porous surface structure 1311-1 of the first area and the second area
  • the porous surface structure 1311-2 of 1311-2 is resistance-welded to the substrate at the same time, wherein the bottom surface of the first positive electrode 1314-1 covers the porous surface structure 1311-1 of the corresponding area, and the portion of the first positive electrode 1314-1 beyond the connection area Not exceeding the edge of the second side of the groove 13a; and, the second positive electrode 1314-2 covers the porous surface structure 1311-2 of the corresponding area in surface contact, and the portion of the second positive electrode 1314-2 that exceeds the connection area does not exceed the concave The edge of the first side of the groove 13a.
  • This method solves the problem of edge convexity caused by regional welding.
  • the process needs to control the sinking position of the porous surface structure to be higher than the top of the groove 13a.
  • a first positive electrode 1414-1 is connected above the porous surface structure 1411-1 corresponding to the first region, and a second positive electrode is connected above the porous surface structure 1411-2 corresponding to the second region 1414-2.
  • the top of the negative electrode 1415 is in close contact with the bottom of the substrate 1413, a non-porous bottom plate 1412 (or a porous structure with low porosity) is arranged between the porous surface structure 1411 and the substrate 1413, and the bottom surface of the non-porous bottom plate 1412 is prefabricated
  • a plurality of raised structures are in contact with the top of the base 1413.
  • the porous surface structure 1411 is provided with grooves 14a to divide the top of the porous surface structure 1411 into multiple regions, such as the porous surface structure 1411-1 in the first region and the porous surface structure 1411 in the second region in the figure. 2.
  • the groove 14a is elongated, and the porous surface structure 1411-1 in the first region and the porous surface structure 1411-2 in the second region are respectively located on both sides of the elongated groove 14a.
  • the top of the groove 14a is lower than the top of the porous surface structure 1411.
  • the height of the groove 14a is smaller than the height of the porous surface structure 1411. Since the groove 14a is designed in this embodiment, the side of the groove 14a close to the first positive electrode 1414-1 is marked as the first side, and the other side of the groove 14a close to the second positive electrode 1414-2 is marked as the second side.
  • the first positive electrode 1414-1 is in contact with the porous surface structure 1411-1 of the first region, and the first positive electrode 1414-1 exceeds the part of the groove 14a (that is, the first positive electrode 1414-1 straddles the groove 14a The first side but not beyond the second side of the groove 14a), and further contact part of the porous surface structure 1411-2 in the second region.
  • the surface of the porous surface structure 1411-2 in the second region There is a small amount of sinking and the surface of the porous surface structure 1411-2 in the second region will have an indentation convex edge; then the second positive electrode 1414-2 contacts the porous surface structure 1411-2 in the second region, and the second positive electrode 1414-2 is in contact with the porous surface structure 1411-2 in the second region.
  • the two positive electrodes 1414-2 cross over the remaining part of the groove 14a or across the entire groove 14a, and the second positive electrode 1414-2 extends beyond the convex edge of the indentation to ensure that the second positive electrode 1414-2 is pressed to the porous surface.
  • the indentation convex edge that may be generated by the structure 1411-2 makes the indentation convex edge flat.
  • the first positive electrode 1414-1 is in contact with the porous surface structure 1411-1 in the first region, and the first positive electrode 1414-1 does not extend beyond the first side of the groove 14a.
  • the first region The porous surface structure 1411-1 has a small amount of sinking on the surface and the surface has indentation convex edges, and then the second positive electrode 1414-2 contacts the porous surface structure 1411-2 in the second region, and the second positive electrode 1414-2 Across the entire groove 13a, and the second positive electrode 1414-2 exceeds the indentation convex edge generated on the surface of the porous surface structure 1411-1, ensuring that the second positive electrode 1414-2 is pressed to the surface of the porous surface structure 1411-1.
  • the indentation convex edge makes the indentation convex edge flattened. The process needs to control the sinking position of the porous surface structure to be higher than or substantially flush with the top of the groove 14a.
  • the seventeenth embodiment still adopts the resistance welding of sub-regions; but the difference from the sixteenth embodiment is that in order to solve the problem of the indentation convex edge caused by the sub-region welding, this embodiment
  • the porous surface structure of Example 17 does not adopt the groove design.
  • the resistance welding of the first region after the first subregional resistance welding There is a bump on the edge (the bump here is a relative positional relationship of height, which means that the edge part that is not dented is higher than the other part that is dented).
  • Embodiment 18 is a diagrammatic representation of Embodiment 18:
  • the non-porous bottom plate 1512 of the eighteenth embodiment is provided with a limiting structure 15a at the top.
  • the limiting structure 15a is a long strip and can be used as a reference for region division.
  • the limiting structure 15a is set on any two At the edge of the adjacent side of the adjacent area.
  • the top of the limiting structure 15a is lower than the top of the porous surface structure 1511, and the height of the limiting structure 15a is smaller than the height of the porous surface structure 1511.
  • the main body of the non-porous bottom plate 1512, the limiting structure 15a, and the porous surface structure 1511 are integrally formed structures, for example, implemented by a 3D printing additive manufacturing process or a vapor deposition process.
  • the limiting structure 15a in this embodiment is a solid structure or a porous structure with a lower porosity than the porous surface structure 1311-1 and the porous surface structure 1311-2.
  • the positive electrode of the eighteenth embodiment can be a large planar electrode 1514 shown in FIG. 15 and a porous surface structure covering multiple regions, or it can be the first positive electrode 1314-1 and the second positive electrode 1314-1 with gaps in FIG. The positive electrode 1314-2, or the first positive electrode 1414-1 and the second positive electrode 1414-2 at least partially overlapping in FIG. 14.
  • the surface of the porous surface structure 1511 in each area has a small amount of sinking but no convex edges are formed, and
  • the limit structure 15a is used to limit the position to limit the sinking limit. This method not only solves the problem of edge convexity caused by sub-region welding, but also limits the position of the porous surface structure that sinks due to the welding process.
  • the present invention is not limited to the projection welding resistance welding method used alone in any of the above embodiments. It can also use the spot welding resistance welding method alone or the combination of the projection welding resistance welding method and the spot welding resistance welding method.
  • the welding method is used in conjunction to combine the intermediate and the substrate. Specifically: the spot-welding resistance welding method is different from the projection-welding resistance welding method by setting the convex structure. In the spot-welding resistance welding method, the intermediate body is not provided with the convex structure.
  • a single electrode and each movement of the welded workpiece (such as a composite body and a substrate) or a single electrode and each movement of the electrode to complete the welding of a solder joint, until the set number of solder joints is completed, to ensure that the intermediate body and the substrate Have sufficient welding strength.
  • the present invention can also use the projection welding resistance welding method and the spot welding resistance welding method together. For example, after the projection welding resistance welding method in any one of the above embodiments is completed, the spot welding resistance welding method is further adopted. Operation to strengthen the welding strength between the intermediate and the substrate
  • the projection welding type resistance welding method of the present invention can simultaneously weld multiple welding points in one welding cycle, with high production efficiency and no shunting effect; at the same time, since the current density is concentrated on the bumps and the current density is large, it can be used more Welding with a small current can reliably form a smaller nugget, which overcomes the migration of the nugget of spot welding resistance welding; the position of the bumps of the projection welding resistance welding method is accurate, the size is consistent, and the strength of each point It is relatively uniform, so for a given welding strength, the size of a single projection welding spot can be smaller than that of spot welding; in addition, because the large plane electrode is used, and the bumps are arranged on the intermediate body, the exposed surface of the substrate can be minimized. At the same time, the large plane electrode has low current density and good heat dissipation. The wear of the electrode is much smaller than that of the spot welding type, which greatly reduces the maintenance and repair costs of the electrode.
  • the protrusion structure is mainly the middle part of the protrusion subjected to greater pressure from the upper electrode and is combined with the substrate through contact with the substrate to generate resistance heat, and the side of the protrusion structure The edge part is not in full contact with the substrate, which makes it impossible to weld and bond.
  • the intermediate is welded multiple times and welded from multiple directions to ensure the raised structure It is welded to the base in all directions.
  • the porous surface structure 21 of some of the above embodiments is in contact with the large flat positive electrode 24 above, the surface of the porous surface structure may be caused by heat generation due to contact resistance. The surface is damaged (dented, blackened).
  • the porous surface structure is covered with an insulating member, and a plurality of holes are opened in the corresponding position on the insulating member. Put a positive electrode or a well-conducting support column, etc., so that the porous surface structure under the insulator in the unopened position is not damaged in any way.
  • the thickness of the insulating member is moderate, because it is necessary to ensure that a complete current loop is turned on, so that the welding process can be performed sequentially.
  • the present invention combines the non-porous bottom plate (Fig. 2) or the low porosity area (Fig. 4b) in the first embodiment and the second embodiment.
  • Dot removal is transformed into an intermediate plate structure 272 with no raised structure (non-porous or low porosity), and the base 273 is changed to a base main body 273 and another raised point structure 272A on its top surface.
  • the structure 272A is pre-connected with the base body 273 (such as resistance welding/laser welding), and the convex structure of 272A faces the side of the intermediate plate structure 272 without bumps, that is, the convex structure of the structure 272A.
  • the point makes contact with the bottom surface of the intermediate plate structure 272 in the composite.
  • the surface complex formed by the porous surface structure 271 and the intermediate plate structure 272, and the base complex formed by the bump structure 272A and the base body 273 are compressed between the positive electrode 274 and the negative electrode 275.
  • the current flows through the porous surface structure 271 and the middle plate structure 272 to the bumps of the structure 272A.
  • the contact resistance generates resistance heat to heat the 272A bumps and the bottom of the middle plate structure 272 to a molten or plastic state.
  • the anchoring effect between the structures 272 and 272A is achieved, so that the surface composite and the base composite are tightly combined.
  • the surface composite body still uses the structure 272 with bumps in the first and second embodiments, and the convex structure faces the side of the base body 273, and the convex structure of the structure 272 is aligned with the structure 272A above the base.
  • the protruding structures are arranged staggered, and finally the surface composite body and the base composite body can be tightly combined together.
  • Example 1 First, as in implementation 1, a first porous surface structure 281-1 and a first non-porous bottom plate are arranged on the top side of the substrate 283. A first composite body formed by pre-connection with 282-1, the first composite body is placed between the positive electrode 24 and the top surface of the substrate 283, and at least a part of the top of the first porous surface structure 281-1 is in contact with the positive electrode 24; A plurality of first protruding structures are pre-fabricated on the bottom of the first non-porous bottom plate 282-1, and the first protruding structures are in contact with the top of the base 283.
  • the bottom side of the substrate 283 is provided with a second composite body formed by pre-connecting the second porous surface structure 281-2 and the second non-porous bottom plate 282-2, and the second composite body is placed on the bottom surface of the substrate 283 and the negative electrode. 285, and at least a part of the bottom of the second porous surface structure 281-2 is in contact with the negative electrode 285.
  • the second composite body has the same structure as the first composite body, and is axisymmetric with respect to the base 283.
  • the first composite body and the second composite body are respectively resistance-welded to the upper and lower surfaces of the base 283 at the same time to realize the connection of the first composite body, the second composite body, and the base. This modification is also applicable to any of the above-mentioned embodiments, and the present invention will not repeat this description.
  • Embodiment 20 is a diagrammatic representation of Embodiment 20.
  • this embodiment provides an artificial implant prosthesis, preferably an orthopedic prosthesis; any one of the above-mentioned embodiment 1 to embodiment 19 and their respective modification examples can be used.
  • the prosthesis body 1 corresponds to the substrate in the connection structure. At least part of the surface of the prosthesis body 1 is used as the connection area, and is connected to the composite body 2 including the intermediate body and the porous surface structure.
  • connection (convex) between the porous bottom plate 22, the second porous structure 42 in the low-porosity region in the second embodiment, etc.) and the substrate (for example, the substrate 23 in the first embodiment, the substrate 43 in the second embodiment, etc.) Welding resistance welding and/or spot welding resistance welding) to realize the connection between the porous surface structure and the substrate to form the surface coverage of the connection area on the prosthesis.
  • the prosthesis shell is provided, the outer layer is a porous surface structure, and the inner layer is the intermediate contact and is fixed to the connection area of the prosthesis body by resistance welding.
  • the connection between the porous surface structure and the prosthesis body forming a surface covering the connection area on the prosthesis body, so as to be used in other kinds of orthopedic prostheses, artificial joints and other artificial implant prostheses, such as femoral stems,
  • femoral stems for details of the acetabular cup, femoral condyle, tibial plateau, etc., refer to the description of the subsequent embodiments 20 to 23.
  • Artificial hip joints include femoral stem, femoral ball head (not shown in the figure), acetabular cup, and lining body (not shown in the figure), all of which are prostheses and are made of medical materials that can be implanted in the human body, such as titanium alloys. , Cobalt-chromium-molybdenum alloy, stainless steel and other metal materials, ultra-high molecular weight polyethylene and other polymers, ceramics, etc., but not limited to this.
  • the femoral stem 3 ( Figures 16a-16c) includes a head 301, a neck 302, and a stem 303, which can be integrated or assembled.
  • the head 301 of the femoral stem 3 has a truncated cone structure.
  • the first end is connected to the stem body 303 through the neck 302.
  • the head 301 and the neck 302 have a certain deflection angle relative to the stem, so as to be inclined relative to one side of the stem.
  • Form layout The lower part of the handle body 303 is inserted into the femoral medullary cavity. A number of longitudinal grooves can be opened in the lower part of the handle body 303.
  • On the surface of the handle body 303 it is preferable that the upper surface of the handle body 303 has a porous structure; the lower portion of the handle body 303 may have a smooth surface.
  • the second end of the head 301 of the femoral stem 3 is inserted into the inner cone mounting structure of the femoral ball head; the acetabular cup is sleeved on the outside of the femoral ball head, and the femoral ball head contacts the concave surface of the acetabular lining body to make the femoral ball
  • the head can be rotated here.
  • the acetabular cup is partially spherical (such as hemispherical) dome-shaped; the acetabular cup is provided with a matching lining body; the femoral ball head is in contact with the concave surface of the lining body, so that the femoral ball head can be in contact with the inner concave surface of the lining body.
  • the acetabular cup may be provided with a through hole for arranging a connecting piece (screw, etc.) connecting the acetabular cup to the acetabular socket; the lining body may be provided with a corresponding through hole or no through hole.
  • the inner concave surface of the lining body is in contact with the femoral ball head; the lining body can be made of metal materials or non-metallic materials (such as polyethylene or ceramics) to reduce the wear of the artificial joint.
  • the housing is usually made of metal material.
  • the outer peripheral surface of the acetabular cup preferably has a porous structure.
  • the upper surface of the femoral stem body 303 and the outer peripheral surface of the acetabular cup shell use a porous structure. On the one hand, it can increase the roughness; on the other hand, it can induce osteoblasts to grow in, thereby effectively connecting the femoral stem and the femur.
  • the acetabular cup and the acetabular socket are fixedly connected to form a good long-term biological fixation and enhance the stability of the interface between the artificial hip joint and the host bone tissue.
  • any kind of prosthesis (also applicable to the artificial joints in the subsequent embodiments) can be coated with hydroxyapatite (HA) on the surface that contacts the bone tissue.
  • HA hydroxyapatite
  • use materials such as gel/collagen as a carrier for implanted cells, growth factors, etc., attached to the porous surface of the prosthesis; or form an antibacterial coating (such as antibiotics/silver ions, etc.).
  • the femoral stem 3 can use the structures and methods (resistance welding) of the first to nineteenth embodiments described above or their modified examples, which will not be repeated here.
  • the stem body 303 of the femoral stem 3 corresponds to the substrate in the connecting structure; it includes intermediates (such as non-porous bottom plates, or porous structures in low-porosity regions, etc., which need to be determined according to different embodiments) and porous
  • the composite body of the sexual surface structure forms the handle body shell 2, which covers the connection area of the handle body 303a (upper).
  • the connection between the porous surface structure 201 and the substrate is realized by the welding of the intermediate body and the substrate, forming a pair of connection areas , The porous structure on the stem body 303 of the femoral stem is obtained.
  • the handle body 303a is made by forging, casting or machining, etc., preferably a solid structure, which is easy to process and has high strength; or the handle body 303a can also be a highly dense porous structure;
  • the body can be solid or a porous structure that is denser than the porous surface structure; when both the handle body 303a and the intermediate body 202 use a porous structure, the density of the intermediate body 202 is between that of the handle body 303a and the intermediate body 202.
  • the porous surface structure 201 is denser.
  • the intermediate 202 and the porous surface structure 201 of the handle housing 2 are preferably realized by a 3D printing additive manufacturing process, which can well form pores that meet the design requirements.
  • the handle body 303a and the intermediate body 202 of the handle body 2 are effectively connected by resistance welding, which avoids the significant decrease in overall strength when the porous structure is connected to the surface of the femoral stem 3 through a hot pressing process (such as a penetration welding process). problem.
  • FIG. 16c it corresponds to FIG. 2 in the first embodiment.
  • the inner handle body 303 corresponds to the base in the connecting structure
  • the outer porous structure 2201 corresponds to the porous surface structure of the connecting structure
  • an intermediate (non-porous bottom plate 2202) is arranged between the porous structure 2201 and the handle body 303. Due to the composite body formed by the porous structure 2201 and the non-porous bottom plate 2202, and the handle body 303 are compressed between the positive electrode 2204 and the negative electrode 2205.
  • the current flows through the porous structure 2201 and the non-porous bottom plate 2202 to the contact surface with the outside of the handle body 303 and adjacent areas, generating resistance heat to heat it to a molten or plastic state, so that the non-porous bottom plate 2202 and The handle body 303 forms a combined body to realize the fixed connection between the non-porous bottom plate 2202 and the handle body 303, so that the complex formed by the porous structure 2201 and the non-porous bottom plate 2202 and the handle body 303 are tightly combined.
  • the other content about the application of the femoral stem to the first embodiment will not be repeated here.
  • the upper part of the stem body 303a of the femoral stem 3 is provided with a connecting area; for the convenience of description, the side where the head 301 and the neck 302 of the femoral stem 3 are arranged obliquely is the inner side of the femoral stem 3, as shown in Figure 16a
  • the other directions of the handle body 303a are taken as the back side, the outside to the front side, the inside is opposite to the outside, and the back is opposite to the front;
  • Figure 16a shows the front side, and Figure 16b shows the outside.
  • connection area of the femoral stem 3 includes the inner, posterior, outer, and anterior surfaces of the upper part of the stem body 303a.
  • the handle housing 2 includes two housing pieces, one housing piece 2-1 corresponds to a part of the inner surface 01, the rear side surface 02, and the outer side of the upper part of the handle body 303a.
  • a part of the surface 03; the other shell sheet 2-2 corresponds to the remaining part of the upper inner surface 01, the front side surface 04, and the outer surface 03 of the upper part of the handle body 303a.
  • the inner layer of each shell body is an intermediate 202, and all or most of the outer layer is a porous surface structure 201.
  • the two shell pieces can be symmetrical (or staggered and crossed, not shown in the figure).
  • the adjacent sides may be separated from each other without being connected.
  • the adjacent sides of the two shells (such as the outer side 03) can be connected when they are formed, and they can remain connected when there is a certain bend near the adjacent sides (to make the two shells close together).
  • the adjacent sides of the two shell sheets are separated from each other when they are formed, and the adjacent sides of each side are connected after being closed (for example, welding or using connectors or other connection methods).
  • the adjacent edge refers to the adjacent edge after the two shell bodies are closed.
  • the interconnection of the adjacent sides may be the connection of the porous surface structure of the intermediate and/or the outer layer of the inner layer of each shell sheet.
  • Embodiment 21 is a diagrammatic representation of Embodiment 21.
  • porous structure of the outer peripheral surface of the acetabular cup 300a can be similarly implemented using the structures and methods of the first to nineteenth embodiments described above or their modified examples.
  • the inner cup body corresponds to the connecting structure
  • the outer porous structure 2401 corresponds to the porous surface structure of the connecting structure
  • an intermediate (non-porous bottom plate 2402) is arranged between the porous structure 2401 and the base 2403. Due to the composite body formed by the porous structure 2401 and the non-porous bottom plate 2402 (the composite body is formed on the outside of the cup body 3-3 and covers the connection area of the cup body), and the substrate 2403 is pressed against the positive electrode 2404 And the negative electrode 2405.
  • the current flows through the porous structure 2401 and the non-porous bottom plate 2402 to the contact surface with the outside of the substrate 2403 and adjacent areas, generating resistance heat to heat it to a molten or plastic state, so that the non-porous bottom plate 2402 and the substrate 2403 forms a combined body to realize the fixed connection between the non-porous bottom plate 2402 and the substrate 2403, so that the composite body formed by the porous structure 2401 and the non-porous bottom plate 2402 and the substrate 2403 are tightly combined together, thus forming the main body of the cup. Covering the upper connecting area results in a porous structure on the outer peripheral surface of the acetabular cup (shell).
  • the cup body of the acetabular cup of the present invention is matched with the composite body (or the intermediate body contained therein) at the contact and connection parts.
  • the other content about the application of the acetabular cup to the first embodiment is not repeated here, and the specific content about the application of the acetabular cup to other embodiments is not repeated here.
  • the cup body of the acetabular cup is made by forging, casting or machining, etc., preferably a solid structure, which is easy to process and has high strength; or the cup body can also be a highly dense porous structure ;
  • the intermediate can be solid or a porous structure that is denser than the porous surface structure; when both the cup body and the intermediate use a porous structure, the density of the intermediate is between the handle body and the porosity Between the density of the surface structure.
  • the intermediate and porous surface structure are preferably realized by 3D printing additive manufacturing process, which can well control the pores, etc., to meet the design requirements.
  • the main body of the cup body and the intermediate body are effectively connected by the resistance welding method, which avoids the problem of the current hot-pressing process (such as the penetration welding process) that causes the overall strength to drop significantly.
  • the entire outer surface of the main body of the cup body can be used as a connection area, and an integral composite body can be arranged in corresponding contact with it and welded in the connection area through the included intermediate body. It is also possible to divide multiple independent connection areas on the entire outer surface of the cup body; multiple composite bodies (each of which can be sheet-like or other shapes, and fit the dome shell), respectively contact these connection areas and pass through The respective intermediates are welded correspondingly in these connection areas.
  • the inner layer of each composite body is an intermediate, and all or most of the outer layer is a porous surface structure.
  • Embodiment 22 is a diagrammatic representation of Embodiment 22.
  • the proximal end of the tibia and the distal end of the femur form a knee joint
  • the contact surface between the tibia and the distal end of the femur is the tibial plateau, which is an important load-bearing structure of the knee joint.
  • the component used to replace the bone on the femoral side is called the femoral condyle
  • the component used to replace the bone on the tibial side is called the tibial plateau.
  • the tibial platform 300b has a T-shaped structure and includes an upper tibial tray 300-1 and a lower supporting portion 300-2.
  • the lower surface of the tibial plateau 300b uses a porous structure, which on the one hand can increase the roughness; on the other hand, it can induce osteoblasts to grow in, thereby effectively connecting and fixing the tibial plateau prosthesis with the human tibia, replacing damaged lesions
  • the tibial surface forms a good long-term biological fixation to withstand the pressure load of the human body and meet the requirements of sports and anti-wear functions.
  • the porous structure of the lower surface of the tibial platform 300b can be similarly implemented using the structures and methods of the first to nineteenth embodiments described above or their modified examples.
  • the lower surface of the tibial tray 300-1 corresponds to the porous surface structure 2501 of the connecting structure
  • the upper end of the tibial tray 300-1 corresponds to the base 2503 on the inner side of the connecting structure
  • An intermediate (non-porous bottom plate 2502) is provided between the structure 2501 and the base 2503. Due to the composite formed by the porous structure 2501 and the non-porous bottom plate 2502, and the substrate 2503 are compressed between the positive electrode 2504 and the negative electrode 2505.
  • the current flows through the porous structure 2501 and the non-porous bottom plate 2502 to the contact surface with the distal end of the substrate 2503 and the adjacent area, generating resistance heat to heat it to a molten or plastic state, so that the non-porous bottom plate 2502 and The base 2503 forms a combined body to realize the fixed connection between the non-porous base plate 2502 and the base 2503, so that the composite formed by the porous structure 2501 and the non-porous base plate 2502 and the base 2503 are tightly combined.
  • the composite of the porous surface structure and the intermediate body in this example is formed at the lower end of the tibial tray and covers the connection area of the tibial tray.
  • Embodiment 23 is a diagrammatic representation of Embodiment 23.
  • the artificial knee joint prosthesis includes the femoral condyle, the tibial tray, and the pad between the two, and the patella prosthesis.
  • the femoral condyle is connected to the distal end of the femur, and the tibial tray is connected to the proximal end of the tibia.
  • the pad component is connected with the tibial tray component, and the femoral condyle is in contact with the pad.
  • the lower part of the cushion is in contact with the upper surface of the tibial platform, and the convex surface of the femoral condyle is in contact with the upper part of the cushion and the articular surface of the patella prosthesis, which can realize flexion, extension, sliding, rotation and other activities within a specified range.
  • the outer convex surface of the main body of the femoral condyle 300c is usually very smooth to reduce the wear between it and the pad; while the main body of the femoral condyle will be concave on its inner surface, matching and contacting the osteotomy section formed at the distal end of the femur, so
  • a porous structure is formed on the concave surface of the main body of the femoral condyle (such as the medial condyle fixation surface) to help bone ingrowth, achieve tight integration of the prosthesis and bone tissue, and reduce the risk of joint replacement surgery failure caused by loosening of the prosthesis after surgery .
  • the concave surface of the femoral condyle 300c uses a porous structure.
  • the roughness can be increased to enhance the initial stability of the prosthesis; on the other hand, it can promote bone ingrowth, thereby effectively reducing the femoral condyle prosthesis.
  • It is connected and fixed with the human femoral condyle.
  • the tibial pad is located between the femoral condyle prosthesis and the tibial plateau prosthesis, which bears the pressure load of the human body and meets the requirements of joint kinematics and wear resistance.
  • porous structure of the inner surface of the femoral condyle 300c can be similarly implemented using the structures and methods of the first to nineteenth embodiments described above or their modified examples.
  • FIG. 20b it corresponds to FIG. 2 in the first embodiment.
  • the inner surface of the femoral condyle corresponds to the porous structure 2601 of the connecting structure, the intermediate (non-porous bottom plate 2602) and the base 2603 from the outside to the inside.
  • the medial condyle of the femoral condyle 300c corresponds to the base 2603 of the connection structure, and the medial condyle fixation surface of the femoral condyle 300c uses a porous surface structure 2601. Due to the composite formed by the porous structure 2601 and the non-porous bottom plate 2602, and the substrate 2603 are compressed between the positive electrode and the negative electrode.
  • the current flows through the porous structure 2601 and the non-porous bottom plate 2602 to the contact surface with the outside of the substrate 2603 and adjacent areas, generating resistance heat to heat it to a molten or plastic state, so that the non-porous bottom plate 2602 and the substrate 2603 forms a combined body to achieve a fixed connection between the non-porous bottom plate 2602 and the substrate 2603, so that the composite formed by the porous structure 2601 and the non-porous bottom plate 2602 and the substrate 2603 are tightly combined.
  • the composite of the porous surface structure and the intermediate body in this example is formed on the concave surface of the femoral condyle and covers the connection area of the femoral condyle.
  • the patella prosthesis can also use the structure and method of any one of the above-mentioned embodiments or its modified examples to add a porous structure to the surface in contact with the bone.
  • Embodiments 1 to 19 of the present invention are not limited to the above-mentioned prosthesis examples, but can also be applied to spinal prostheses, ankle joints, shoulder joints, elbow joints, finger joints, toe joints, intervertebral facet joints, and mandibular joints. , Wrist joints, etc., the specific structure and principle refer to the above, and the present invention will not be repeated here.

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Abstract

L'invention concerne un procédé de préparation d'une structure de liaison d'une structure de surface poreuse (21) et d'un substrat (23). Le procédé consiste à : prérelier la structure de surface poreuse (21) et un intermédiaire (22) pour former un corps composite (2A), l'intermédiaire (22) étant positionné entre la structure de surface poreuse (21) et le substrat (23), et l'intermédiaire (22) venant en contact avec le substrat (23) ; disposer le substrat (23) et le corps composite (2A) entre une électrode d'une première polarité et une électrode d'une seconde polarité ; amener l'électrode de la première polarité en contact conducteur avec la structure de surface poreuse (21) et/ou avec l'intermédiaire (22), et amener le substrat (23) en contact conducteur avec l'électrode de la seconde polarité pour former une boucle de courant ; et effectuer un soudage par résistance de l'intermédiaire (22) et de la base (23) pour obtenir une liaison entre le corps composite (2A) et le substrat (23).
PCT/CN2020/136532 2019-12-30 2020-12-15 Procédé de préparation d'une structure de liaison de structure de surface poreuse et de substrat WO2021135931A1 (fr)

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CN201911394644.2 2019-12-30
CN201911388633.3A CN110773854B (zh) 2019-12-30 2019-12-30 一种用于制备多孔性表面结构和基底的连接结构的方法
CN201911394644 2019-12-30

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US20170156869A1 (en) * 2014-07-16 2017-06-08 Zimmer, Inc. Resistance welding a porous metal layer to a metal substrate utilizing an intermediate element
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CN112237498A (zh) * 2019-12-30 2021-01-19 雅博尼西医疗科技(苏州)有限公司 多孔性表面结构和基底的连接结构及其制备方法与假体

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Publication number Priority date Publication date Assignee Title
US4660755A (en) * 1985-09-09 1987-04-28 Zimmer, Inc. Method for constructing a surgical implant
US4829152A (en) * 1987-11-16 1989-05-09 Rostoker, Inc. Method of resistance welding a porous body to a substrate
US5942135A (en) * 1996-02-23 1999-08-24 Sinterstahl Gmbh Process for welding a sintered friction-lined foil
JP2004267440A (ja) * 2003-03-07 2004-09-30 Mizuho Co Ltd 表面形状を制御した生体材料の作製方法
CN103221000A (zh) * 2010-11-18 2013-07-24 捷迈有限公司 多孔金属层至金属基体的电阻焊接
US20170156869A1 (en) * 2014-07-16 2017-06-08 Zimmer, Inc. Resistance welding a porous metal layer to a metal substrate utilizing an intermediate element
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